JP2012049476A - Patterning method and patterning device and composite type head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a patterning method and a patterning device where bleeding of a pattern is prevented when a fine pattern is formed using an ink jet system and high speed processing is ensured, and to provide a head.SOLUTION: An impact position (14) of an object to be processed where dots constituting a pattern (12) that is formed on the patterning surface (10A) of a substrate (10) is irradiated with reforming energy and reformed. While the impact position of a not-yet-processed object is reformed, droplets are ejected by ink jet system to the impact position immediately after reforming (within 0.1 seconds after completion of reforming). Light or plasma is applicable as the reforming energy.

Description

  The present invention relates to a pattern forming method, a pattern forming apparatus, and a composite head, and more particularly to a technique for forming a fine pattern using an ink jet method.

  2. Description of the Related Art In recent years, a technique for forming a fine pattern such as an electric wiring pattern or a mask pattern on a substrate using an ink jet type liquid discharge head has attracted attention. For example, there is a technique in which a liquid in which metal is diffused is ejected from an inkjet head to draw a pattern, and the pattern is cured by heating or the like.

  FIGS. 20A and 20B are diagrams for explaining the problems of the fine pattern forming method using the ink jet method according to the prior art, and the pattern forming surface 1A of the substrate 1 is illustrated. FIG. 20A shows a state in which a plurality of droplets 2 that have landed on the pattern forming surface 1A of the substrate 1 are combined into one large droplet 3 (a state in which a bulge is generated). FIG. 20B shows a state in which the landing position is shifted in the droplet 2 that has landed on the pattern forming surface 1A of the substrate 1 and jaggy has occurred. In FIGS. 20A and 20B, the pattern to be originally formed has a shape denoted by reference numeral 4 and indicated by a broken line.

  That is, problems in drawing a pattern using the ink jet method include bulges (collections) generated when a plurality of droplets are combined on the substrate 1, jaggies generated due to deviations in the flying direction of the droplets, and the like. . Various studies have been made to solve this problem.

  Patent Document 1 discloses a liquid ejection apparatus configured to return a liquid droplet that has deviated from a predetermined activation to a predetermined trajectory when the liquid droplet is ejected onto a region surrounded by a laser beam. . Patent Document 2 discloses that a thin film pattern is formed by spraying a predetermined processing gas onto a substrate on which a bank corresponding to a thin film pattern forming area is formed, and arranging a droplet between the banks to form a fine pattern. A method is disclosed.

Japanese Patent No. 3794406 JP 2004-351397 A

  However, although the liquid ejection device disclosed in Patent Document 1 can avoid the bending of the flying direction of the droplet, it is difficult to avoid the coalescence of the droplet on the substrate. In the thin film pattern forming method disclosed in Patent Document 2, since high energy is required for the surface treatment of the substrate, the surface treatment takes time. In addition, a plasma processing device for surface treatment and an ink jet device for pattern drawing are provided separately, and pattern formation is performed after all surface treatments are completed, so surface treatment of the substrate and pattern drawing are performed in parallel. Therefore, it is difficult to realize high-speed processing.

  The present invention has been made in view of such circumstances, and a pattern forming method, a pattern forming apparatus, and a composite head that prevent high-speed processing by preventing pattern bleeding in forming a fine pattern using an ink jet method. The purpose is to provide.

  In order to achieve the above object, the pattern formation method according to the present invention irradiates the droplet deposition position of the processing target where the dots forming the pattern formed on the pattern formation surface of the substrate are irradiated with the reforming energy. A reforming process for applying a reforming process to the droplet ejection position to be treated, and a reforming process while the droplet ejection position for an untreated treatment target is being performed in the reforming process. And a droplet ejection step in which droplets are ejected by an ink jet method at a droplet ejection position immediately after the treatment.

  According to the present invention, when a droplet is ejected to a droplet ejection position where the surface has been modified, the movement of the droplet on the substrate is suppressed, and a bulge is generated due to the combination of a plurality of droplets. In addition, bleeding of the pattern due to the occurrence of jaggy due to positional deviation of the landing position is prevented. Further, since the droplets are ejected to the droplet ejection position immediately after the modification treatment is performed while the modification treatment is being performed on other untreated droplet ejection positions, all the surface treatments are finished. Compared with the conventional method in which droplets are subsequently ejected, the overall time is expected to be shortened.

The conceptual diagram of the pattern formation method which concerns on this invention The figure explaining the specific example of the pattern formation method shown in FIG. 1 is a schematic configuration diagram of a pattern forming apparatus according to a first embodiment of the present invention. Schematic configuration diagram of the functional head shown in FIG. Explanatory drawing of the MEMS device applied to the functional head shown in FIG. FIG. 5 is a diagram illustrating another configuration example of the functional head illustrated in FIG. 4. FIG. 3 is a plan view for explaining the nozzle arrangement of the functional head shown in FIG. Schematic configuration diagram of the inkjet head shown in FIG. Schematic structure diagram of a composite head in which a functional head and an inkjet head are integrated. The block diagram which shows the structure of the control part of the pattern formation apparatus shown in FIG. Schematic configuration diagram of a pattern forming apparatus according to a second embodiment of the present invention. The schematic block diagram which shows the other structural example of the pattern formation apparatus which concerns on 2nd Embodiment of this invention. The schematic block diagram of the functional head applied to the pattern formation apparatus which concerns on 3rd Embodiment of this invention. The schematic block diagram explaining the modification of the pattern formation apparatus which concerns on this invention Plane see-through | perspective view which shows schematic structure of the line type head which concerns on the modification shown in FIG. The figure explaining the nozzle arrangement of the line type head shown in FIG. Schematic configuration diagram of a functional head according to a modification of the present invention The schematic block diagram of the other structural example of the functional head which concerns on the modification of this invention The figure explaining the manufacturing method of the MEMS device applied to the functional head of this invention The figure explaining the subject of the pattern drawing using the inkjet system which concerns on a prior art

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Description of pattern formation method]
1A and 1B are conceptual diagrams of a pattern forming method according to an embodiment of the present invention. A method of forming a linear pattern 12 (illustrated by a broken line) on a pattern forming surface 10A of a substrate 10 is shown. It is schematically illustrated. FIG. 1A shows a substrate 10 in which a modification process is performed on the pattern forming surface 10A. A modification process is applied to a minute region having substantially the same shape (area) as a dot at a droplet ejection position where a dot constituting the pattern 12 is formed.

  That is, the area indicated by reference numeral 14 in FIG. 1A and indicated by using a dot hatch is an area that has undergone a modification process, and data of the pattern 12 (dot position data, dot size data). The droplet ejection position and the treatment area (size) to be modified are determined based on the above, and are selectively spotted (dotted) immediately before the dot formation, selectively only at the droplet ejection position where the dots are formed. A reforming process is performed.

  FIG. 1B illustrates a substrate 10 on which a droplet is ejected onto the droplet ejection position 14 immediately after the reforming process and a linear pattern 12 is formed. A droplet is ejected immediately after the reforming process at the droplet ejection position where the reforming process has been performed. Here, “immediately after the reforming process” is within 0.1 seconds from the end of the reforming process. Thereafter, the droplets (dots) landed on the pattern forming surface 10 </ b> A of the substrate 10 are subjected to a fixing process by heating or energy irradiation, and a pattern 12 is formed on the pattern forming surface 10 </ b> A of the substrate 10.

  In the pattern forming method shown in this example, the droplet reforming process is sequentially performed on the droplet ejection positions where the dots constituting the pattern 12 are formed. Drops are formed to form dots. At a certain timing, when a droplet is ejected at the droplet ejection position after the modification process, the other untreated droplet ejection positions are subjected to the modification process, so that Dropping is performed simultaneously.

  As an example of the modification process, there is a lyophilic process in which the lyophilic property (hydrophilicity) at the droplet ejection position is made higher than the other part by irradiating beam-like LED light or laser light. For example, by irradiating a blue LED (wavelength 450 nm) using InGaN (indium gallium nitride) for 1 to 100 microseconds, the portion irradiated with the LED light is modified to be lyophilic and dots are formed. The applied droplet ejection position can be made more lyophilic than the standard state of the substrate 10, the movement of the landed droplet is suppressed, and the positional deviation of the dots is prevented. When a predetermined droplet ejection position is modified to be lyophilic, a high effect can be exhibited when a liquid using an aqueous solvent is applied. On the other hand, when the liquid repellency is modified, a high effect can be exhibited when a liquid using an organic solvent is applied.

  Examples of liquids applied to this example include wiring ink (metal solution) in which particles such as gold, silver, copper, and alloys thereof are dispersed in a predetermined solvent, or a precursor solution containing the above-described metal, insulation. Examples thereof include an electronic material ink in which a body (resin), a semiconductor, an organic EL light emitting material and the like are dispersed in a predetermined solvent, a resist solution, and the like.

  Examples of the material of the substrate 10 include glass (lead-free glass for LCD such as quartz and heat-resistant glass), a silicon wafer, and a film (PEN, PET, PC, PES, etc.). The substrate 10 may include a barrier layer or a conductive layer.

  2A and 2B are schematic configuration diagrams showing a specific example of the pattern forming method shown in FIGS. 1A and 1B. In the pattern forming method shown in FIGS. 2A and 2B, when the modification process and droplet ejection are performed in the width direction (main scanning direction) of the substrate 10 and dots are formed in the entire region in the same direction, the substrate 10 is moved by a predetermined amount in a direction (sub-scanning direction) perpendicular to the width direction, a modification process and droplet ejection are performed in the next width direction, and this operation is repeated to form a pattern over the entire area of the substrate 10 The method is applied. In such a serial system, a short serial head having a length less than the full width of the substrate is applied.

  FIG. 2A is a view of the substrate 10 as viewed from the upstream side in the movement direction, and the direction penetrating the paper surface is the movement direction (sub-scanning direction) of the substrate 10. FIG. 2B is a view of the pattern forming surface 10A of the substrate 10 as viewed from above. In the figure, the direction with “M” is the main scanning direction, and the direction with “S” is the sub-scanning direction.

  2A and 2B, a functional head (chemical reactor (CR) head) 20 is used to apply a reforming energy 24 to the pattern forming surface 10A of the substrate 10, and an inkjet head (IJ). A droplet 26 is ejected to the droplet ejection position immediately after the reforming process using the head 22. As shown in FIG. 2A, in the main scanning direction M, the functional head 20 precedes the inkjet head 22, and the functional head 20 and the inkjet head 22 are scanned together. At the droplet ejection position 14 modified by applying the reforming energy 24 by the preceding functional head 20, a droplet is ejected by the subsequent inkjet head 22, and a dot (pattern) 12 is formed.

  As shown in FIG. 2B, the functional head 20 shown in this example has a structure in which four nozzles 50 are arranged in the sub-scanning direction S, and the inkjet head 22 has four nozzles in the sub-scanning direction S. Since 80 has a structure arranged in a line, it is possible to simultaneously perform the reforming process for 4 dots along the sub-scanning direction in one scan in the main scanning direction M, along the sub-scanning direction. 4 dots can be formed simultaneously.

In the pattern forming method shown in FIGS. 2A and 2B, the shape (area) subjected to the modification process for each droplet ejection position is the shape (area) of the dot 12 formed at the droplet ejection position. It is almost the same. That is, assuming that the area of the portion subjected to the modification process at each droplet ejection position is S _a , and the area of the dot formed at the droplet ejection position is S _b , in the illustrated example, the dot 12 and one nozzle are modified. The centers of the minute regions to which quality energy is applied coincide with each other, and S _a = S _b . Of course, it is also possible to satisfy S _a <S _b or S _a > S _b by appropriately changing the minute region to which the reforming energy 24 is applied. For example, if S _a <S _b , it is advantageous when dots are stacked at the same droplet deposition position, and if S _a > S _b , it is advantageous when the dots are spread thinly.

  In the pattern forming method shown in FIGS. 2A and 2B, a so-called serial scan method (raster scan method) is exemplified, but a vector scan method may be applied as the scan method. Further, it may be repeated scanning or single scanning. However, in the case of repeated scanning, the functional head 20 and the inkjet head 22 are switched according to the scanning direction so that the positional relationship between the functional head 20 and the inkjet head 22 is interchanged so that the functional head 20 always precedes the inkjet head 22. 22 is configured to rotate 180 °.

  When the pitch in the main scanning direction between the nozzle 50 of the functional head 20 and the nozzle 80 of the corresponding inkjet head 22 is x, and the scanning speed in the main scanning direction of the functional head 20 and the inkjet head 22 is v, The pitch x (arrangement relationship between the functional head 20 and the inkjet head 22) of the nozzles 50 of the functional head 20 and the inkjet head 22 is determined so as to satisfy the relationship of the expression (1), and the functional head 20 and the inkjet head 22 are also determined. V is determined as the scanning speed in the main scanning direction.

x / v ≦ 0.1 (seconds) (1)
When the processing frequency of the functional head 20 is the same as the droplet ejection frequency of the inkjet head 22 and the processing cycle of the functional head 20 and the droplet ejection cycle of the inkjet head 22 are synchronized, the inkjet is started from the modification processing timing by the functional head 20. A mode is possible in which the time interval until the droplet ejection timing of the head 22 is a time corresponding to one cycle of the treatment cycle (droplet ejection cycle). For example, when the treatment frequency and the droplet ejection frequency are 10 kHz, the time for one cycle is 0.1 second, and in this aspect, the time from the reforming treatment to the droplet ejection satisfies the condition of the above formula (1). . The time from the reforming process to droplet ejection may be an integral multiple of the treatment cycle (droplet ejection cycle).

[First Embodiment]
(Overall configuration of pattern forming device)
Next, a pattern forming apparatus to which the pattern forming method described above is applied will be described. FIG. 3 is a schematic configuration diagram of the pattern forming apparatus 30. The pattern forming apparatus 30 shown in the figure includes a scanning mechanism 34 that moves a carriage 32 on which the functional head 20 and the inkjet head 22 are mounted along the main scanning direction M, and a stage 36 that supports the substrate 10 in the sub-scanning direction S. And a transport mechanism 38 that moves along the head. In the scanning mechanism 34 shown in FIG. 3, a ball screw 39 is applied as a feed mechanism of the carriage 32, and a guide member 40 is applied as a support member of the carriage 32. Further, a ball screw 42 is applied to the transport mechanism 38 as a feed mechanism for the stage 36. Instead of the ball screw, a linear actuator such as a linear slider may be applied, or an xy table may be applied.

(Description of functional head)
FIG. 4A is a structural diagram schematically illustrating the internal structure of the functional head 20, and FIG. 4B is a perspective view of the functional head 20 viewed from the top. The direction passing through the paper surface in FIG. 4A and the left-right direction in FIG. 4B are the main scanning direction M shown in FIGS.

  4A and 4B, the functional head 20 includes a nozzle plate 52 in which a plurality of nozzles 50-1, 50-2, 50-3, and 50-4 are formed, and a nozzle 50-1. , 50-2, 50-3, and 50-4, a plurality of movable mirrors 54-1, 54-2, 54-13, and 54-14, and a light source (not shown in FIG. 4 (b), and a fixed mirror group 56 for guiding the light emitted from the movable mirrors 54-1, 54-2, 54-3, and 54-4 to the movable mirrors 54-1, 54-2, 54-3, and 54-4. ing.

  In the following description, the plurality of nozzles 50-1, 50-2, 50-3, and 50-4 may be collectively referred to as the nozzle 50. Further, the plurality of movable mirrors 54-1, 54-2, 54-3, and 54-4 may be collectively referred to as the movable mirror 54.

  As the light source 55, an LED light source or a laser light source is applied. As an application example of the LED light source, a blue LED (wavelength: 450 nm) using InGaN (indium gallium nitride) can be cited. Besides this, a blue LED using AlInM (aluminum indium nitride), AlInGaN (aluminum indium gallium nitride), or the like may be applied. That is, the light applied in this example may be any light having energy necessary for modifying the surface of the substrate 10. Further, it is only necessary to have a straightness and non-diffusibility to such an extent that a minute region having an area substantially the same as the area of the dots constituting the pattern can be irradiated. Furthermore, it is preferable that the modification energy can be varied depending on the light amount, irradiation intensity, and irradiation time.

  As shown in FIG. 4B, the fixed mirrors 56-1 to 56-4 correspond to the arrangement of the nozzles 50-1 to 50-4 in the direction along the optical axis direction of the light source 55. 1 to 56-4 has a structure arranged in a line. The fixed mirrors 56-1 to 56-4 are half mirrors (semi-transmissive mirrors) having reflection characteristics and transmission characteristics, and the optical axis of a part of the light emitted from the light source is adjusted by the fixed mirror 56 and the movable mirror 54. The light is bent and guided to the nozzle 50, and a part of the light is guided to the fixed mirror at the next stage. When the light emitted from the light source 55 reaches the final stage fixed mirror, reaches the nozzle corresponding to the final stage fixed mirror, and further irradiates the substrate 10 from the nozzle, the irradiation area The amount of light emitted from the light source 55 is determined in consideration of the attenuation of the amount of light by each fixed mirror 56 so that the amount of light is sufficient to modify the light.

  As shown in FIG. 4A, the movable mirror 54 is configured to be able to change the angle with respect to the optical axis bent by the fixed mirror 56. In the example shown in FIG. 4A, the movable mirror 54 in the state illustrated by the solid line guides light to the nozzle 50, while the movable mirror 54 in the state illustrated by the broken line does not guide light to the nozzle 50. The light guided to the nozzle 50 is applied to a predetermined droplet ejection position (see FIGS. 2A and 2B) on the pattern forming surface 10 </ b> A of the substrate 10 through the opening of the nozzle 50.

  That is, the functional head 20 shown in FIGS. 4A and 4B switches whether to guide light to the corresponding nozzle 50 by appropriately adjusting (changing) the angle of the built-in movable mirror 54. It is possible to selectively irradiate light onto the droplet ejection position on the substrate 10. The light source 55 may be provided outside the functional head 20, the light emitted from the light source 55 may be guided into the functional head 20, and the substrate 10 may be irradiated with the light via the nozzle 50.

  As the movable mirror 54 shown in FIGS. 4A and 4B, a micro electro mechanical system (MEMS) device is applied. A MEMS device is a fine machine element part produced using a fine processing technique such as a semiconductor manufacturing process or a sacrificial layer etching process. In order to change the angle of the movable mirror 54, a MEMS device (MEMS actuator) is also applied to an actuator that moves (rotates) the movable mirror 54. 5A and 5B show a ribbon-like actuator having a cantilever structure as a configuration example of the MEMS actuator. In the MEMS actuator 60 shown in FIG. 5A, the counter electrode 64 is formed on the counter electrode substrate 62, and the cantilever 66 is formed on the counter electrode 64. The cantilever 66 has a structure in which one end is fixed by a silicon fixing member 68 and the movable mirror 54 is provided at the other end.

  FIG. 5B schematically shows the operation of the MEMS actuator 60. The state indicated by a solid line with reference numeral 66A in the same figure is a cantilever beam 66 in a state in which no voltage is applied to the counter electrode 64, and the movable mirror 54 formed at the tip is raised. Thus, the position is shifted from the optical axis.

  On the other hand, a state indicated by a broken line with reference numeral 66B is a cantilever 66 in a state where a voltage is applied to the counter electrode 64, and the movable mirror 54 formed at the tip is positioned on the optical axis. To do. That is, by applying a predetermined drive voltage to the counter electrode 64 of the MEMS actuator 60, the angle (attitude) of the movable mirror 54 provided at the other end of the cantilever 66 is changed, and light is turned on / off. Is possible.

  The movable mirror 54 applied to the present invention is not limited to the cantilever structure shown in FIGS. 5A and 5B, and a MEMS switch having another form such as a rotary optical switch is applied. be able to.

  4A and 4B exemplify a mode in which the movable mirror 54 that guides light for each nozzle is provided. However, as shown in FIG. 6, the light is scanned for each nozzle 50 by scanning light. It is possible to adopt a mode that leads to. In the configuration shown in the figure, the light emitted from the light source 70 is irradiated to the diffraction unit 74 via the irradiation lens 72. The diffracted light diffracted by the diffracting unit 74 reaches the scanning mirror 78 via the filter 76. Light is guided to a predetermined nozzle 50 by scanning the scanning mirror 78 based on a scanning sequence determined based on dot position information and dot size information.

FIG. 7A is a plan view of the nozzle surface of the functional head 20 showing the nozzle arrangement of the functional head 20. As shown in the figure, the functional head 20 has a structure in which a plurality of nozzles 50 are arranged in a line at an arrangement pitch _Pn in the sub-scanning direction (vertical direction in the figure). In order to increase the arrangement pitch of the nozzles 50, a plurality of nozzles 50 may be arranged in a staggered manner as shown in FIG. 7B, or may be arranged in a matrix (see FIG. 16). . The nozzle substantial arrangement pitch P _n ′ in the staggered arrangement shown in FIG. 7B is ½ of the arrangement pitch P _n of the nozzles 50 shown in FIG.

  The processing area processed by one nozzle of the functional head 20 depends on the opening area of the nozzle 50. In the case of ideal parallel light, the opening area of the nozzle 50 is the same as the area of the reforming treatment region that one nozzle is responsible for. That is, when the opening area of the nozzle is increased, the area of the reforming process region that is responsible for one nozzle is increased, and when the opening area of the nozzle is decreased, the area of the reforming process region that is responsible for one nozzle is decreased. The diameter of the nozzle 50 of the functional head 20 is determined by the diameter of the reforming treatment region that one nozzle serves.

  In addition, it is possible to make the area of the modification process area which one nozzle bears by narrowing the light smaller than the opening area of the nozzle. Further, by providing an enlargement optical system or reduction optical system (for example, a microlens array) in the vicinity of the nozzle 50, it is possible to appropriately reduce or enlarge the area of the modification processing region that one nozzle serves. As described above, by changing the light diameter according to the type of pattern (configuration in which dots are stacked or spread thinly), the area of the area to be modified (area irradiated with light) is quantified. Can be adjusted.

  Changing the light intensity can change the processing time. Note that when the light intensity is increased, heat generation in the functional head 20 increases, so the light intensity is set from the viewpoint of both processing time and energy loss.

  If the light emitted from the light source is not ideal parallel light, an optical system (a condensing lens (group) such as a microlens array) is appropriately provided in the middle of the optical path. Can be regarded as parallel light.

(Description of inkjet head)
Next, the inkjet head 22 will be described. A piezoelectric method is applied to the discharge method of the inkjet head 22 shown in this example. FIG. 8 is a cross-sectional view showing a three-dimensional configuration of one channel of droplet discharge elements (ink chamber units corresponding to one nozzle 80) serving as a recording element unit. As shown in the figure, the inkjet head 22 of this example is formed by laminating a nozzle plate 82 in which nozzles 80 are formed and a flow path plate 88 in which flow paths such as a pressure chamber 84 and a common flow path 86 are formed. It consists of the structure. The nozzle plate 82 constitutes the nozzle surface 82A of the inkjet head 22, and a plurality of nozzles 80 respectively communicating with the pressure chambers 84 are formed in a line along the sub-scanning direction.

  The flow path plate 88 constitutes a side wall portion of the pressure chamber 84 and a flow path that forms a supply port 90 as a throttle portion (most narrowed portion) of an individual supply path that guides ink from the common flow path 86 to the pressure chamber 84. It is a forming member. For convenience of explanation, although shown in FIG. 8 simply, the flow path plate 88 has a structure in which one or a plurality of substrates are laminated. The nozzle plate 82 and the flow path plate 88 can be processed into a required shape by a semiconductor manufacturing process using silicon as a material.

  The common flow path 86 communicates with an ink tank (not shown) serving as an ink supply source, and ink supplied from the ink tank is supplied to each pressure chamber 84 via the common flow path 86. The diaphragm 92 constituting a part of the pressure chamber 84 (the top surface in FIG. 8) includes an upper electrode (individual electrode) 94 and a lower electrode 96, and a piezoelectric element is interposed between the upper electrode 94 and the lower electrode 96. A piezoelectric actuator (piezoelectric element) 100 having a structure in which a body 98 is sandwiched is joined. When the diaphragm 92 is formed of a metal thin film or a metal oxide film, it functions as a common electrode corresponding to the lower electrode 96 of the piezo actuator 100. In the aspect in which the diaphragm is formed of a non-conductive material such as resin, a lower electrode layer made of a conductive material such as metal is formed on the surface of the diaphragm member.

  By applying a driving voltage to the upper electrode 94, the piezo actuator 100 is deformed to change the volume of the pressure chamber 84, and ink is ejected from the nozzle 80 due to the pressure change accompanying this. When the piezo actuator 100 returns to its original state after ink ejection, new ink is refilled into the pressure chamber 84 from the common channel 86 through the supply port 90.

  Note that a thermal method may be applied as a discharge method of the inkjet head 22 shown in this example. Although a detailed description of the thermal method is omitted, in the thermal method, when a drive signal is applied to a heater provided in the liquid chamber, the liquid in the liquid chamber is heated and the film boiling phenomenon of the liquid in the liquid chamber is used. Then, a predetermined amount of liquid droplets is discharged from the nozzle.

  As described above, the nozzle arrangement of the inkjet head 22 is the same as the nozzle arrangement of the functional head 20. With such a structure, a droplet can be ejected to the droplet ejection position on which the modification process has been performed. For example, as shown in FIG. 9A, the nozzle 50 of the functional head 20 and the nozzle 80 of the inkjet head 22 are formed on a single nozzle plate 120, and the structure of the functional head 20 is formed using micromachining technology. 9 and the structure of the inkjet head 22 are manufactured separately, these structures are combined, and the nozzle plate 120 is joined to the composite structure in which the two structures are combined. ), A composite head (hybrid head) in which the functional head 20 and the ink jet head 22 are integrally formed can be obtained.

  Such a hybrid type head improves the alignment accuracy of the nozzle 50 of the functional head 20 and the nozzle 80 of the functional head 20 rather than separately producing the nozzle plate 52 of the functional head 20 and the nozzle plate 82 of the inkjet head 22. In addition, the productivity of the nozzle plate 120 can be increased.

(Description of control system)
FIG. 10 is a block diagram illustrating a schematic configuration of a control system of the pattern forming apparatus 30. The pattern forming apparatus 30 includes a communication interface 140, a system control unit 142, a conveyance control unit 144, an image processing unit 146, an inkjet head driving unit (IJ head driving unit) 148, and a functional head driving unit (CR head driving unit) 149. In addition, an image memory 150 and a ROM 152 are provided.

  The communication interface 140 is an interface unit that receives image data sent from the host computer 154. The communication interface 140 may be a serial interface such as USB (Universal Serial Bus) or a parallel interface such as Centronics. The communication interface 140 may include a buffer memory (not shown) for speeding up communication.

  The system control unit 142 includes a central processing unit (CPU) and its peripheral circuits, and functions as a control device that controls the entire pattern forming device 30 according to a predetermined program, and also functions as an arithmetic device that performs various calculations. Furthermore, it functions as a memory controller for the image memory 150 and the ROM 152. That is, the system control unit 142 controls each unit such as the communication interface 140 and the conveyance control unit 144, performs communication control with the host computer 154, read / write control of the image memory 150 and the ROM 152, and the above-described units. A control signal to be controlled is generated.

  The image data sent from the host computer 154 is taken into the pattern forming apparatus 30 via the communication interface 140 and subjected to predetermined image processing by the image processing unit 146.

  The image processing unit 146 has a signal (image) processing function for performing various processes and corrections for generating a print control signal from the image data. The generated print data is transferred to the inkjet head driving unit 148, and It is a control unit that supplies the functional head drive unit 149. Necessary signal processing is performed in the image processing unit 146, and the ejection droplet amount (droplet ejection amount) and ejection timing of the inkjet head 22 are controlled via the inkjet head driving unit 148 based on the image data. Thereby, a desired dot size and dot arrangement are realized. Note that the inkjet head driving unit 148 shown in FIG. 10 may include a feedback control system for keeping the driving conditions of the inkjet head 22 constant.

  The functional head drive unit 149 generates a control signal for reforming processing based on the print data generated by the image processing unit 146. The control signal is generated in accordance with dot size information or pattern type information (whether the dots are stacked or spread thinly), and a signal for adjusting the irradiation area of light emitted from the light source; A nozzle selection signal (information on whether or not to form dots for each droplet ejection position) generated based on the image data is included. The light irradiation area is determined by the light source adjustment signal, and the operation of the movable mirror 54 (see FIG. 4) is controlled by the nozzle selection signal.

  As a specific example of the nozzle selection signal of the functional head 20, there is an aspect in which the phase is advanced with respect to the nozzle selection signal of the inkjet head 22. That is, since the nozzle 50 of the functional head 20 and the nozzle 80 of the inkjet head 22 correspond one-to-one, the interval x in the main scanning direction between the nozzle 50 of the functional head 20 and the nozzle of the inkjet head 22 is set as the functional head 20. Further, (x / v) divided by the scanning speed v of the inkjet head 22 is the phase difference between the control signal of the functional head 20 and the control signal of the inkjet head 22. In practice, a nose selection signal for the functional head 20 is generated based on the print data, and an ink jet head in which the delay time obtained by (x / v) is added to the nose selection signal for the functional head 20. 22 nozzle selection signals are generated.

  The conveyance control unit 144 controls the conveyance timing and conveyance speed of the substrate 10 (see FIG. 2) based on the print control signal generated by the image processing unit 146. 10 includes a motor for driving the ball screws 39 and 42 in FIG. That is, the conveyance control unit 144 functions as a driver for the motor.

  An image memory (primary storage memory) 150 functions as a primary storage unit that temporarily stores image data input via the communication interface 140, a development area for various programs stored in the ROM 152, and a calculation work area for the CPU. (For example, a work area of the image processing unit 146). As the image memory 150, a volatile memory (RAM) capable of sequential reading and writing is used.

  The ROM 152 stores a program executed by the CPU of the system control unit 142, various data necessary for control of each unit of the apparatus, control parameters, and the like, and data is read and written through the system control unit 142. The ROM 152 is not limited to a memory made of a semiconductor element, and a magnetic medium such as a hard disk may be used. Alternatively, a removable storage medium that includes an external interface may be used.

  The pattern forming apparatus 30 shown in this example includes a user interface 170, and the user interface 170 includes an input device 172 for an operator (user) to perform various inputs and a display unit (display) 174. The The input device 172 can employ various forms such as a keyboard, a mouse, a touch panel, and buttons. By operating the input device 172, the operator can perform input of printing conditions, selection of image quality mode, input / editing of attached information, search of information, and various information such as input contents and search results. This can be confirmed through the display on the display unit 174. The display unit 174 also functions as means for displaying a warning such as an error message. Note that the display unit 174 in FIG. 10 can be applied to a display as a notification unit that notifies abnormality.

  The parameter storage unit 180 stores various control parameters necessary for the operation of the pattern forming apparatus 30. The system control unit 142 appropriately reads out parameters necessary for control and updates (rewrites) various parameters as necessary.

  The program storage unit 184 is a storage unit that stores a control program for operating the pattern forming apparatus 30.

  According to the pattern forming method configured as described above, the reforming process is performed on the droplet ejection position where the dots are actually formed on the substrate 10, and the liquid is applied to the droplet ejection position immediately after the reforming process is performed. Since the droplets are hit, the occurrence of jaggies and bulges can be prevented and the pattern can be prevented from bleeding. In addition, since an on-demand reforming process is performed on a minute region that has the same area as the dot coverage area around the droplet ejection position, an efficient reforming process using less energy and Become. Furthermore, since the reforming process and the droplet ejection are continuously performed, the pattern formation as a whole is accelerated.

  When the lyophilic process is applied as the modification process, the adhesion (bonding force) between the substrate 10 and the droplet is improved. In particular, when a liquid using an aqueous solvent is applied, or when a flexible substrate such as a flexible substrate is used, it is possible to form a preferable pattern in which pattern peeling is prevented. Further, the on-demand process using the functional head 20 enables the masking of the reforming process.

  In this example, the mode in which the functional head 20 has the same nozzle arrangement as that of the inkjet head 22 is exemplified. However, if the modification process can be selectively performed on each droplet ejection position on the substrate (function The nozzle arrangement of the functional head 20 may be different from the nozzle arrangement of the inkjet head 22 (if the nozzle 20 corresponding to each droplet ejection position exists in the head 20).

  In this example, the functional head 20 and the inkjet head 22 are mounted on the same carriage 32 and are integrally scanned. However, the functional head 20 and the inkjet head 22 may be scanned independently. Good. In such an aspect, the functional head 20 and the inkjet head 22 are arranged so that the droplets are ejected to the droplet ejection position immediately after the reforming process is performed, and the respective scans are controlled.

[Second Embodiment]
Next, a pattern forming apparatus according to a second embodiment of the present invention will be described. In the second embodiment described below, the same or similar parts as those in the first embodiment described above are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 11 is a schematic configuration diagram of a pattern forming apparatus 200 according to the second embodiment. In the pattern forming apparatus 200 shown in the figure, a modification process is performed on the substrate 10 in a reactive gas atmosphere 202. For example, in a reaction gas atmosphere 202 containing oxygen, light reacts with the reaction gas to generate active oxygen, and the droplet ejection position irradiated with light by this active oxygen is modified to be lyophilic. The functional head 20 can apply the same configuration as in the first embodiment described above. On the other hand, when a fluorine-based gas is used as the reactive gas, the modified region can be made liquid repellent (water repellent). When the liquid used for pattern formation uses an organic solvent, the fixability of the ejected droplets is improved by making the surface of the substrate 10 liquid repellent.

  Although detailed illustration is omitted, as an example of a configuration in which the reaction gas is filled in the space between the functional head 20 and the substrate 10, a discharge port for discharging the reaction gas between the functional head 20 and the substrate 10, The aspect which comprises the reactive gas flow path connected with the discharge port and the reactive gas tank connected with the discharge port via the reactive gas flow path is mentioned.

  Further, as shown in FIG. 12, a functional head 20, an ink jet head 22, a scanning mechanism (not shown) of the functional head 20 and the ink jet head 22, and a chamber 204 containing a transport mechanism 38 for the substrate 10 are provided. It is also possible to perform the reforming treatment and droplet ejection using the reaction gas atmosphere. Although not shown in FIG. 12, a conveyance unit that delivers the substrate 10 between a pretreatment process such as a heating process and a post-treatment process such as a fixing process is provided at the substrate carry-in port and the substrate discharge port of the chamber 204. It is arranged.

Examples of the reaction gas applied to this example include oxygen, nitrogen, fluorinated methane (CF ₄ ), and the like. In the embodiment shown in FIG. 12, a supply port for filling the reaction gas into the chamber 204 and a discharge port for discharging the reaction gas in the chamber 204 are provided. With this configuration, the reaction gas in the chamber 204 can be appropriately switched according to the type of the substrate 10, the content of the modification process, and the type of light emitted from the functional head 20.

  According to the pattern forming apparatus configured as described above, the reaction gas reacts with light to become active oxygen, and the substrate is subjected to the modification process by the combination thereof. Therefore, in the atmosphere according to the first embodiment Compared with the reforming process in, the reforming process can be performed efficiently.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. In this example, the substrate is irradiated with plasma (radicals) generated from the functional head so that the modification process is performed.

  FIG. 13 is a schematic configuration diagram of a functional head 320 applied to this example. The functional head 320 shown in the figure has a built-in plasma source 321 and a shutter (nozzle opening / closing mechanism) 354 provided therein corresponding to each of the plurality of nozzles 350. The MEMS device described above is applied to the shutter.

  That is, the functional head 320 shown in this example includes a plasma source (high voltage plasma source) 321 instead of the light source 55 of the functional head 20 shown in FIGS. 4A and 4B, and a shutter instead of the movable mirror 54. 354, and a modification control signal is generated based on position data and size data of dots forming the pattern, and the operation of each shutter 354 (opening and closing of the nozzle 350) is controlled by the control signal. The plasma is irradiated to the droplet ejection position where the dots constituting the are formed.

  In the reforming process applied to this example, plasma discharge is generated in the functional head 320 using the plasma source 321 and the reactive gas 302 filled in the functional head 320, and plasma discharge electrons are generated through the nozzle 350. By irradiating the pattern forming surface 10A of the substrate 10, hydrophilic polar groups are generated on the pattern forming surface 10A, and functions such as wetting correctness, adhesiveness, printability, and coating characteristics are imparted. Note that plasma discharge may be generated in the atmosphere using air.

  According to the third embodiment configured as described above, dots are actually formed by performing a modification process using plasma on the droplet ejection position on the pattern forming surface 10A of the substrate 10. The predetermined area centered on the droplet ejection position becomes lyophilic, and is less bleed by preventing jaggies and bulges, efficient reforming using less energy, and speeding up the overall pattern formation. Similar effects can be obtained.

[Modification]
Next, modified examples of the above-described first to third embodiments will be described.

(overall structure)
FIG. 14 is a schematic configuration diagram of a pattern forming apparatus 30 ′ according to a modification of the present invention. The pattern forming apparatus 30 ′ shown in the figure includes a full line type functional head 20 ′ and a full line type ink jet head 22 ′. The full-line type functional head 20 ′ has a structure in which nozzles 50 are arranged over a length corresponding to the entire length of the substrate 10 in the main scanning direction M, and the functional head 20 ′ and the substrate 10 are arranged in the sub-scanning direction. By performing the relative movement of S only once, the modification process can be performed over the entire area of the substrate 10.

  In the pattern forming apparatus 30 ′ shown in FIG. 14, the functional head 20 ′ is arranged at the front stage in the sub-scanning direction (upstream side in the transport direction of the substrate 10), and the rear stage (downstream in the transport direction of the substrate 10). ) Is provided with an inkjet head 22 '. Further, the functional head 20 'and the ink jet head 22' are arranged close to each other. The distance y (function) in the sub-scanning direction between the nozzle 50 (not shown in FIG. 14) of the functional head 20 ′ and the nozzle 80 (not shown in FIG. 14) of the inkjet head 22 ′ corresponding to the nozzle 50 of the functional head 20 ′. The arrangement interval between the head 20 ′ and the inkjet head 22 ′ is y ≦ 0.1 × v, where v is the transport speed of the substrate 10. That is, droplets are ejected within 0.1 seconds from the reforming process at the droplet ejection position where the reforming process has been performed.

  When proceeding sequentially from the head side of the substrate 10 to the processing area of the functional head 20 ′, the reforming process is performed on the droplet ejection position where dots are actually formed, and the droplet ejection position immediately after the reforming process is performed. Then, droplets are ejected from the inkjet head 22 ′ located at the subsequent stage of the functional head 20 ′.

(Description of nozzle arrangement)
FIG. 15 is a plan perspective view (a view of the substrate 10 viewed from the inkjet head 22 ′) showing a configuration example of the full-line inkjet head 22 ′, and FIG. 16 is a nozzle arrangement of the inkjet head 22 ′ shown in FIG. FIG. As described above, since the nozzle arrangement of the functional head 20 ′ and the inkjet head 22 ′ is the same, the inkjet head 22 ′ will be described here.

  The inkjet head 22 ′ shown in FIG. 15 forms a multi-head by connecting n head modules 22A-i (i is an integer from 1 to n) in a line along the longitudinal direction of the inkjet head 22 ′. . Each head module 22A-i is supported by head covers 22B and 22C from both sides of the inkjet head 22 'in the short direction. It is also possible to configure a multi-head by arranging the head modules 22A in a staggered manner. The pattern can be formed over the entire surface of the substrate 10 by a so-called single pass method in which the inkjet head 22 ′ having such a structure and the recording medium are scanned only once relatively to perform pattern formation.

  The head module 22A-i constituting the ink jet head 22 'has a substantially parallelogram-shaped planar shape, and an overlap portion is provided between adjacent sub heads. The overlap portion is a connecting portion of the sub heads, and is formed by nozzles in which adjacent dots belong to different sub heads in the arrangement direction of the head modules 22A-i.

  As shown in FIG. 16, each head module 22A-i has a structure in which nozzles 80 are arranged two-dimensionally, and a head provided with such a head module 22A-i is a so-called matrix head. . The head module 22A-i illustrated in FIG. 16 includes a number of nozzles 80 along a column direction W that forms an angle α with respect to the sub-scanning direction S and a row direction V that forms an angle β with respect to the main scanning direction M. It has an aligned structure, and the substantial nozzle arrangement density in the main scanning direction M is increased. In FIG. 3, a nozzle group (nozzle row) arranged along the row direction V is denoted by reference numeral 80A, and a nozzle group (nozzle row) arranged along the column direction W is denoted by reference numeral 80B. ing.

  Another example of the matrix arrangement of the nozzles 80 is a configuration in which a plurality of nozzles 80 are arranged along the row direction along the main scanning direction M and the column direction oblique to the main scanning direction M.

  As the internal structure of the functional head 20 ′, the light irradiation type structure shown in FIGS. 4A and 4B may be applied, or the plasma irradiation type structure shown in FIG. 13 may be applied. Further, as the internal structure of the inkjet head 22 ′, the piezoelectric actuator type illustrated in FIG. 8 may be applied, or a thermal type (not illustrated) may be applied.

  Further, as shown in FIG. 9B, the functional head 20 ′ and the inkjet head 22 ′ are integrated, and the nozzle of the functional head 20 ′ and the nozzle of the inkjet head 22 ′ are formed on one nozzle plate. May be.

  FIGS. 17A and 17B are diagrams showing a structure example when the structure of the light irradiation type head shown in FIGS. 4A and 4B is applied to a matrix head. In FIGS. 17A and 17B, the same or similar parts as those in FIGS. 4A and 4B are denoted by the same reference numerals, and the description thereof is omitted.

  The nozzle arrangement of the matrix head described below includes a plurality of nozzles 50 (50-11, 50-12,..., 50 along the row direction along the main scanning direction and the column direction oblique to the main scanning direction. -32,...) Are arranged.

  FIG. 17A is a diagram showing a three-dimensional structure of the functional head 20 ′, and FIG. 17B is a diagram of the functional head 20 ′ as viewed from above. In FIG. 17A, the left-right direction is the longitudinal direction (main scanning direction M) of the functional head 20 ', and the direction penetrating the paper surface is the transport direction (sub-scanning direction S) of the substrate 10. FIG. 17A shows only three nozzles 50-11, 50-12, and 50-13 among a large number of nozzles arranged along the main scanning direction M. Of the three nozzles 50-11, 50-12, and 50-13 illustrated in FIG. 17A, the nozzles 50-11 and 50-13 are on-state nozzles that emit light to the substrate 10, and the nozzles Reference numeral 50-12 denotes an off-state nozzle that does not irradiate the substrate 10 with light.

  As shown in FIG. 17B, the fixed mirror group 56 includes a plurality of fixed mirrors 56-1, 56-2, 56-3,... Arranged in a line along the sub-scanning direction S. The arrangement pitch of the mirrors 56 corresponds to a substantial arrangement pitch of the nozzles 50 in the sub-scanning direction S. That is, one fixed mirror 56 is provided for a group of a plurality of nozzles arranged in the main scanning direction.

  As the fixed mirror 56, a half mirror (semi-transmissive mirror) having reflection characteristics and transmission characteristics is applied. That is, the light emitted from the light source 55 is partially reflected by the first fixed mirror 56-3, and the movable mirrors 54-31, 54-32 provided for the nozzles 50-31, 50-32,. ,..., Part of which is transmitted and guided to the fixed mirror 56-2 at the next stage. The light guided to the next-stage fixed mirror 56-2 is partially reflected and irradiated to the movable mirrors 54-21, 54-22,..., And part of the light is transmitted and transmitted to the next-stage fixed mirror 56-1. To reach.

  Note that a group of movable mirrors 54 (for example, movable mirrors 54-11, -12, 54-13,...) Arranged along the main scanning direction M operate so as to turn on sequentially from the fixed mirror 56 side. Is controlled. For example, when the nozzles 50-11 and 50-13 are turned on and the nozzle 50-12 is turned off, the nozzle 50-11 is first turned on, and after the light is irradiated from the nozzle 50-11 for a predetermined time and turned off. The nozzle 50-13 is turned on. In this way, a group of nozzles 50 arranged in the main scanning direction are sequentially turned on at different timings.

  For example, if the ON time of one nozzle 50 (movable mirror 54) is 1 microsecond, the movable mirror 54 is turned on in order from the side closer to the fixed mirror 56 at intervals of 1 microsecond, and the final stage is fixed in the main scanning direction. When the mirror 56 is turned on, one scan in the main scanning direction is completed. The conveyance speed of the substrate 10 is determined according to the time required for one scan in the main scanning direction.

  It should be noted that as the number of fixed mirrors 56 that pass through increases (away from the light source 55), the on-time is lengthened to compensate for the loss of light quantity due to the fixed mirror. For example, the group including the nozzles 50-21 (the number of fixed mirrors 1 transmitting) is turned on according to the transmittance of the fixed mirror 56 rather than the group including the nozzles 50-31 (the number of fixed mirrors transmitting is zero). You should lengthen the time.

  Further, a mode in which the light source 55 is provided for each group of nozzles 50 in the main scanning direction and the fixed mirror group 56 is omitted, or a mode in which a point light source is provided for each nozzle using an optical fiber or the like is possible.

  FIG. 18 is a diagram showing a structure example when the structure of the plasma irradiation type functional head shown in FIG. 13 is applied to a matrix head. In FIG. 18, parts that are the same as or similar to those in FIG. 13 are given the same reference numerals, and descriptions thereof are omitted. The functional head 320 ′ shown in FIG. 18 is in a state where the shutters 354-1 and 354-3 corresponding to the nozzle 350-1 and the nozzle 350-3 are opened, and the nozzles 350-1 and 350-3 are turned on. ing. On the other hand, the shutter 354-2 corresponding to the nozzle 350-2 is closed, and the nozzle 350-2 is off. In this way, by appropriately turning on / off the shutter 354 corresponding to each nozzle 350, it is possible to selectively irradiate plasma from each nozzle 350. In such an embodiment, it is possible to irradiate plasma from a plurality of nozzles 350 at the same time, and there is no problem that the amount of energy irradiated differs from nozzle to nozzle.

[Method of manufacturing movable mirror (MEMS device)]
Next, a method for manufacturing the movable mirror 54 (MEMS device) applied to the functional head 20 (20 ′, 320) will be described in the order of steps. FIGS. 19A to 19E are diagrams for explaining a manufacturing process of the MEMS device. First, the silicon substrate 300 is heated at 1050 ° C. to form silicon oxide films (SiO ₂ ) 302 and 304 on the surface of the silicon substrate 300 (FIG. 19A: oxide film generation step). The plane orientation of the silicon substrate 300 is (100), and an intermediate layer (SiO ₂ ) 306 having a thickness of about 0.5 μm to 4 μm is provided.

Next, the silicon oxide films 302 and 304 serving as masks are patterned by dry etching (reactive ion etching (RIE)) (FIG. 19B: mask patterning step). In such a process, CF ₄ or H ₂ is used as a reaction gas. Further, using the patterned silicon oxide films 302 and 304 as a mask and the intermediate layer 306 as a stop layer, a region not covered with the silicon oxide film 302 is patterned by dry etching (FIG. 19C: pattern Ning process). In this step, SF ₆ or C ₄ F ₈ is used as a reaction gas.

  Thereafter, the intermediate layer 306 is removed (FIG. 19 (d): intermediate layer removing step), and the portion that becomes the mirror is plated to form a metal thin film 308 that becomes a mirror such as gold or platinum (FIG. 19). (E): Plating process).

  A MEMS actuator (see FIG. 5) that operates the movable mirror 54 is manufactured by the same process. When producing a MEMS actuator, the process of forming a counter electrode (refer FIG. 5) (The process of forming the metal thin film used as a counter electrode, the process of patterning this metal thin film) is included.

  Such a MEMS device is a micro device obtained by fusing a mechanical element and a mechanical element and an electrical element that are micro-machined with high accuracy, and is a micro device that constitutes a functional head 20 that requires micron-order or nano-order accuracy. Suitable for production.

  When the internal structure of the functional head 20 is manufactured through the steps shown in FIGS. 19A to 19E, the internal structure, the light source, and the like are installed in the frame of the functional head 20, and the nozzle plate 52. (See FIG. 4) is aligned and joined with the movable mirror 54, and the functional head 20 is completed.

  In this example, a method and an apparatus for drawing a pattern such as a wiring pattern or a mask pattern on a substrate are illustrated. However, the present invention is applicable to graphic printing for forming an image on a recording medium such as paper, an organic EL panel, or the like. The present invention can be applied to the production of a thin panel, and the same effect can be obtained.

  The pattern forming method, the pattern forming apparatus, and the composite head according to the present invention have been described in detail above. However, the present invention is not limited to the above examples, and various improvements can be made without departing from the gist of the present invention. Or may be modified.

<Appendix>
As can be understood from the description of the embodiment described in detail above, the present specification includes disclosure of various technical ideas including the invention described below.

  (Invention 1): Reforming energy is applied to the droplet ejection position to be processed on which dots forming the pattern formed on the pattern forming surface of the substrate are formed, and the droplet is reformed to the target droplet ejection position. A reforming process step for performing the treatment, and a droplet ejection position immediately after the reforming process is performed while the reforming process is being performed on the unprocessed droplet ejection position in the modification process step. And a droplet ejection step in which droplets are ejected by an ink jet method.

  According to the present invention, when a droplet is ejected to a droplet ejection position where the surface has been modified, the movement of the droplet on the substrate is suppressed, and a bulge is generated due to the combination of a plurality of droplets. In addition, bleeding of the pattern due to the occurrence of jaggy due to positional deviation of the landing position is prevented. Further, since the droplets are ejected to the droplet ejection position immediately after the modification treatment is performed while the modification treatment is being performed on other untreated droplet ejection positions, all the surface treatments are finished. Compared with the conventional method in which droplets are subsequently ejected, the overall time is expected to be reduced.

  Examples of the modification treatment of the present invention include lyophilic treatment in which hydrophilic polar groups are generated on the pattern forming surface of a substrate to modify the substrate to be lyophilic.

  (Invention 2): In the pattern forming method according to Invention 1, the droplet ejection step is performed within 0.1 seconds after the modification treatment is completed with respect to the droplet deposition position on which the modification treatment has been performed. A drop is hit.

  According to this aspect, the entire processing time for pattern formation is shortened.

  (Invention 3): In the pattern forming method according to Invention 1 or 2, the modification treatment step performs a modification treatment based on a predetermined modification treatment cycle, and the droplet ejection step includes the droplet ejection cycle described above. When the reforming process period is the same and the droplet ejection period and the reforming process period are synchronized, the droplet ejection position subjected to the reforming process is modified after the reforming process is completed. It is characterized in that the droplets are ejected after the passage of an integral multiple of the quality treatment cycle.

  In this embodiment, the reforming treatment frequency (reciprocal of the reforming treatment cycle) and the droplet ejection frequency (reciprocal of the droplet ejection cycle) are set to 10 kHz, and the droplet ejection is performed one cycle after the reforming processing is completed. When the droplet ejection control is performed so that the droplet is ejected at the position, the droplet is ejected after 0.1 seconds with respect to the droplet ejection position subjected to the modification process.

(Invention 4): In the pattern forming method according to any one of Inventions 1 to 3, the reforming treatment step includes a liquid to be ejected at each droplet ejection position with S _a as the modification treatment area at each droplet ejection position. the area of dots formed by the droplets is taken as S _b, modification treatment so as to satisfy the S a _{<S b} is performed, the ejection step, a plurality of droplets at the same droplet ejection position is laminated It is characterized by ejecting a droplet as described above.

  According to this aspect, a preferable pattern in which a plurality of dots are stacked is formed.

(Invention 5): In the pattern forming method according to any one of Inventions 1 to 3, the reforming treatment step includes a liquid to be ejected at each droplet ejection position with S _a as the modification treatment area at each droplet ejection position. When the area of the droplet on the substrate is S _b , the modification process is performed so that S _a > S _b is satisfied, and the droplet ejection step deposits one droplet at the same droplet ejection position. It is characterized by that.

  According to this aspect, a preferable pattern composed of thinly spread dots is formed.

  (Invention 6): The pattern formation method according to any one of Inventions 1 to 5, wherein the modification treatment step includes a reaction gas supply step of supplying a reaction gas to the pattern formation surface of the substrate. .

  According to this aspect, an efficient reforming process is executed.

  Examples of the reaction gas in such an embodiment include oxygen (atmosphere), nitrogen gas, and fluoride gas.

  (Invention 7): The pattern forming method according to any one of Inventions 1 to 6, wherein the modification treatment step irradiates the pattern forming surface of the substrate with light or plasma.

  Examples of light in such an embodiment include LED light and laser light.

  (Invention 8): Reforming energy is applied to the droplet ejection position to be processed on which dots forming the pattern formed on the pattern formation surface of the substrate are formed, and the droplet is reformed to the target droplet ejection position. A functional head that performs the treatment, an inkjet head that ejects droplets onto the droplet ejection position that has been subjected to the modification treatment by the functional head, and a modification treatment that is performed on the untreated droplet ejection position by the functional head. A droplet ejection control means for controlling droplet ejection by the inkjet head so that droplets are ejected to the droplet ejection position immediately after the reforming process is performed. A pattern forming apparatus.

  As an aspect of the functional head in the present invention, an aspect including a nozzle (opening) that irradiates the reforming energy may be mentioned. The nozzles of the functional head are arranged so as to irradiate the reforming energy with respect to the droplet ejection position of the ink jet head corresponding to the nozzle arrangement of the ink jet head.

  The functional head and the inkjet head applied to the present invention may be a serial type head or a full line type head.

  (Invention 9): The pattern forming apparatus according to Invention 8, further comprising relative movement means for relatively moving the substrate, the functional head, and the inkjet head so that the inkjet head follows the functional head. It is characterized by that.

  In such an embodiment, a serial method may be applied, or a single pass method using a full line type head may be applied.

  (Invention 10): In the pattern forming apparatus according to Invention 8 or 9, a functional head control signal for controlling irradiation of the modified energy by the functional head based on drawing data of a pattern formed on the pattern forming surface. And a functional head control means for generating and supplying the functional head control signal to the functional head, wherein the droplet ejection control means outputs an inkjet head control signal in which a predetermined delay time is added to the functional head control signal. It supplies to an inkjet head, It is characterized by the above-mentioned.

  According to this aspect, the functional head and the inkjet head can be operated in synchronization without performing complicated control.

  (Invention 11): In the pattern forming apparatus according to any one of Inventions 8 to 10, the inkjet head has a structure in which a plurality of nozzles are arranged at a predetermined arrangement pitch, and the functional head is the inkjet head. And a structure in which a plurality of nozzles are arranged at the same arrangement pitch, and the substrate is irradiated with reforming energy through the plurality of nozzles.

  According to this aspect, the reforming process can be performed on the droplet ejection position of the inkjet head by making the arrangement pitch of the nozzles of the functional head the same as the arrangement pitch of the nozzle arrangement of the inkjet head.

  (Invention 12): In the pattern forming apparatus according to Invention 11, the functional head includes a light source that emits light emitted to the substrate, a MEMS mirror that guides light emitted from the light source to the nozzle, and the MEMS mirror. And a MEMS actuator for operating the actuator.

  The “MEMS mirror” in this embodiment is a mirror formed by a microfabrication process. A “MEMS actuator” is an actuator formed by a microfabrication process.

  (Invention 13): In the pattern forming apparatus according to Invention 11, the functional head includes a plasma source that generates plasma irradiated on the substrate, and a MEMS element that guides the plasma generated from the plasma source to the nozzle. And a MEMS actuator that operates the MEMS element.

  A shutter is mentioned as a MEMS element in this aspect.

  (Invention 14): The pattern forming apparatus according to any one of Inventions 8 to 13, wherein the functional head and the inkjet head have a structure configured integrally.

  According to this aspect, it is possible to reduce the size and simplify the apparatus by integrating the functional head and the inkjet head.

  In such an embodiment, an embodiment in which the nozzle of the functional head and the nozzle of the inkjet head are formed on a single nozzle plate is preferable.

  (Invention 15): a functional head unit that irradiates reforming energy to a droplet ejection position where dots constituting a pattern formed on a substrate are formed; and a structure integrated with the functional head unit, An inkjet head unit that ejects droplets at a droplet ejection position on the substrate irradiated with the reforming energy by the functional head, and a nozzle opening of the inkjet head are formed, and is the same as the nozzle opening of the inkjet head A composite type head comprising: a nozzle plate that has an arrangement and is provided with a modified energy irradiation opening of the functional head and joined to a structure in which the functional head unit and the inkjet head unit are combined. .

  As a method for manufacturing a composite head according to the present invention, a step of producing a functional head portion using micromachining technology, a step of producing an inkjet head portion using micromachining technology, and a nozzle opening corresponding to the functional head portion And a step of producing a nozzle plate in which nozzle openings corresponding to the ink jet head portion are formed, a step of combining the functional head portion and the ink jet head portion, and a structure in which the functional head portion and the ink jet head portion are combined. And a step of joining the nozzle plate.

  DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 20, 20 ', 320 ... Functional head, 22, 22' ... Inkjet head, 30, 30 ', 200 ... Pattern formation apparatus, 34 ... Scanning mechanism, 36 ... Stage, 38 ... Conveyance mechanism, 50, 80 , 350 ... Nozzle, 52, 82, 120, 352 ... Nozzle plate, 54 ... Movable mirror, 142 ... System control unit, 144 ... Conveyance control unit, 146 ... Image processing unit, 148 ... Inkjet head drive unit, 149 ... Functional head Drive unit, shutter ... 354

Claims (15)

The modification is performed by irradiating the droplet ejection position of the treatment target on which the dots forming the pattern formed on the pattern forming surface of the substrate are formed with the modification energy to the droplet ejection position of the treatment target. Processing steps;
While the reforming process is performed on the unprocessed droplet ejection position in the reforming process, droplets are ejected to the droplet ejection position immediately after the reforming process by the inkjet method. A droplet ejection process,
A pattern forming method comprising: In the pattern formation method of Claim 1,
In the droplet ejection step, the droplet is ejected within 0.1 seconds after the modification process is completed on the droplet ejection position on which the modification process has been performed. In the pattern formation method of Claim 1 or 2,
The reforming process step performs a reforming process based on a predetermined reforming process cycle,
In the droplet ejection step, the droplet ejection cycle is the same as the modification treatment cycle, and when the droplet ejection cycle and the modification treatment cycle are synchronized, the droplet ejection position subjected to the reforming process is A pattern forming method characterized in that droplets are ejected after an integral multiple of the modification treatment period has elapsed since the modification treatment was completed. In the pattern formation method in any one of Claims 1 thru | or 3,
In the modification processing step, when the modified treatment area at each droplet ejection position is S _a and the area of a dot formed by a droplet ejected at each droplet ejection position is S _b , S _a <S reforming process is executed to satisfy _b ,
In the patterning method, the droplet ejecting step deposits droplets such that a plurality of droplets are stacked at the same droplet deposition position. In the pattern formation method in any one of Claims 1 thru | or 3,
In the modification treatment step, S _a > S _b is satisfied, where S _a is the modification treatment area at each droplet ejection position, and S _b is the area on the substrate of droplets deposited at each droplet ejection position. The reforming process is executed to satisfy
In the patterning method, the droplet deposition step deposits one droplet at the same droplet deposition position. In the pattern formation method in any one of Claims 1 thru | or 5,
The method for forming a pattern according to claim 1, wherein the reforming step includes a reaction gas supply step of supplying a reaction gas to the pattern formation surface of the substrate. In the pattern formation method in any one of Claims 1 thru | or 6,
In the patterning method, the modification treatment step irradiates light or plasma to a pattern forming surface of the substrate. A functional head that irradiates reforming energy to a droplet ejection position to be processed on which dots forming a pattern formed on a pattern forming surface of a substrate are formed, and performs a modification process on the droplet ejection position to be processed When,
An inkjet head that ejects droplets to the droplet ejection position that has been subjected to the modification treatment by the functional head;
While the reforming process is performed on the unprocessed droplet ejection position by the functional head, the ink jet head performs the droplet ejection so that a droplet is ejected to the droplet ejection position immediately after the modification process is performed. Droplet ejection control means for controlling droplets;
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 8, wherein
A pattern forming apparatus, comprising: a relative movement unit that relatively moves the substrate, the functional head, and the inkjet head so that the inkjet head follows the functional head. In the pattern formation apparatus of Claim 8 or 9,
A function of generating a functional head control signal for controlling irradiation of the modified energy by the functional head based on drawing data of a pattern formed on the pattern forming surface and supplying the functional head control signal to the functional head A head control means;
The pattern forming apparatus, wherein the droplet ejection control means supplies an inkjet head control signal in which a predetermined delay time is added to the functional head control signal to the inkjet head. In the pattern formation apparatus in any one of Claims 8 thru | or 10,
The inkjet head has a structure in which a plurality of nozzles are arranged at a predetermined arrangement pitch.
The functional head has a structure in which a plurality of nozzles are arranged at the same arrangement pitch as the ink-jet head, and has a structure in which reforming energy is irradiated to the substrate through the plurality of nozzles. A pattern forming apparatus. The pattern forming apparatus according to claim 11,
The functional head includes a light source that emits light applied to the substrate;
A MEMS mirror for guiding light emitted from the light source to the nozzle;
A MEMS actuator for operating the MEMS mirror;
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 11,
The functional head includes a plasma source that generates plasma irradiated on the substrate;
A MEMS element for guiding plasma generated from the plasma source to the nozzle;
A MEMS actuator for operating the MEMS element;
A pattern forming apparatus comprising: The pattern forming apparatus according to any one of claims 8 to 13,
The pattern forming apparatus, wherein the functional head and the inkjet head have a structure configured integrally. A functional head unit that irradiates reforming energy with respect to a droplet ejection position where dots forming a pattern formed on a substrate are formed;
An inkjet head unit that has a structure integral with the functional head unit, and that ejects droplets onto a droplet ejection position on the substrate irradiated with reforming energy by the functional head;
A nozzle opening of the ink jet head is formed, and an irradiation opening for reforming energy of the functional head having the same arrangement as the nozzle opening of the ink jet head is formed, and the functional head portion and the ink jet head portion are combined. A nozzle plate joined to the structure;
A composite head characterized by comprising:

Images