JP2012045926A - Green mold - Google Patents
Green mold Download PDFInfo
- Publication number
- JP2012045926A JP2012045926A JP2011154999A JP2011154999A JP2012045926A JP 2012045926 A JP2012045926 A JP 2012045926A JP 2011154999 A JP2011154999 A JP 2011154999A JP 2011154999 A JP2011154999 A JP 2011154999A JP 2012045926 A JP2012045926 A JP 2012045926A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- aluminum
- holes
- ceramic
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000843 powder Substances 0.000 claims abstract description 84
- 239000003566 sealing material Substances 0.000 claims abstract description 79
- 239000000919 ceramic Substances 0.000 claims abstract description 75
- 239000002994 raw material Substances 0.000 claims abstract description 53
- 229910000505 Al2TiO5 Inorganic materials 0.000 claims abstract description 29
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 claims abstract description 29
- 238000005245 sintering Methods 0.000 claims abstract description 20
- 229910052878 cordierite Inorganic materials 0.000 claims abstract description 7
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 48
- 238000007789 sealing Methods 0.000 abstract description 43
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000000638 solvent extraction Methods 0.000 abstract 2
- 238000010304 firing Methods 0.000 description 37
- 239000000203 mixture Substances 0.000 description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 31
- 239000002245 particle Substances 0.000 description 31
- 229910052782 aluminium Inorganic materials 0.000 description 30
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 25
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 23
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 23
- 239000011777 magnesium Substances 0.000 description 23
- 239000011148 porous material Substances 0.000 description 23
- 239000010703 silicon Substances 0.000 description 23
- 229910052710 silicon Inorganic materials 0.000 description 23
- 239000010936 titanium Substances 0.000 description 23
- 229910052749 magnesium Inorganic materials 0.000 description 22
- 229940091250 magnesium supplement Drugs 0.000 description 22
- 229910052719 titanium Inorganic materials 0.000 description 22
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 19
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 19
- 239000011230 binding agent Substances 0.000 description 19
- 150000002484 inorganic compounds Chemical class 0.000 description 18
- 229910010272 inorganic material Inorganic materials 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 239000011521 glass Substances 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 14
- -1 aluminum alkoxide Chemical class 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000000395 magnesium oxide Substances 0.000 description 10
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 10
- 239000000377 silicon dioxide Substances 0.000 description 10
- 239000000314 lubricant Substances 0.000 description 9
- 235000010215 titanium dioxide Nutrition 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 238000001354 calcination Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002612 dispersion medium Substances 0.000 description 6
- 238000007561 laser diffraction method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000001186 cumulative effect Effects 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000006259 organic additive Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229920002472 Starch Polymers 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000010433 feldspar Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- 239000008107 starch Substances 0.000 description 3
- 235000019698 starch Nutrition 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RCYJPSGNXVLIBO-UHFFFAOYSA-N sulfanylidenetitanium Chemical compound [S].[Ti] RCYJPSGNXVLIBO-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229910020068 MgAl Inorganic materials 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 244000061456 Solanum tuberosum Species 0.000 description 2
- 235000002595 Solanum tuberosum Nutrition 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- 230000002902 bimodal effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 2
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 2
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 2
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 2
- 159000000003 magnesium salts Chemical class 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052596 spinel Inorganic materials 0.000 description 2
- 239000011029 spinel Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 150000003608 titanium Chemical class 0.000 description 2
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KWGRBVOPPLSCSI-WPRPVWTQSA-N (-)-ephedrine Chemical compound CN[C@@H](C)[C@H](O)C1=CC=CC=C1 KWGRBVOPPLSCSI-WPRPVWTQSA-N 0.000 description 1
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- QUVMSYUGOKEMPX-UHFFFAOYSA-N 2-methylpropan-1-olate;titanium(4+) Chemical compound [Ti+4].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-].CC(C)C[O-] QUVMSYUGOKEMPX-UHFFFAOYSA-N 0.000 description 1
- SDTMFDGELKWGFT-UHFFFAOYSA-N 2-methylpropan-2-olate Chemical compound CC(C)(C)[O-] SDTMFDGELKWGFT-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- RVDLHGSZWAELAU-UHFFFAOYSA-N 5-tert-butylthiophene-2-carbonyl chloride Chemical compound CC(C)(C)C1=CC=C(C(Cl)=O)S1 RVDLHGSZWAELAU-UHFFFAOYSA-N 0.000 description 1
- FHVDTGUDJYJELY-UHFFFAOYSA-N 6-{[2-carboxy-4,5-dihydroxy-6-(phosphanyloxy)oxan-3-yl]oxy}-4,5-dihydroxy-3-phosphanyloxane-2-carboxylic acid Chemical compound O1C(C(O)=O)C(P)C(O)C(O)C1OC1C(C(O)=O)OC(OP)C(O)C1O FHVDTGUDJYJELY-UHFFFAOYSA-N 0.000 description 1
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- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
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- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229920001732 Lignosulfonate Polymers 0.000 description 1
- MPCRDALPQLDDFX-UHFFFAOYSA-L Magnesium perchlorate Chemical compound [Mg+2].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O MPCRDALPQLDDFX-UHFFFAOYSA-L 0.000 description 1
- MQHWFIOJQSCFNM-UHFFFAOYSA-L Magnesium salicylate Chemical compound [Mg+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O MQHWFIOJQSCFNM-UHFFFAOYSA-L 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- HDYRYUINDGQKMC-UHFFFAOYSA-M acetyloxyaluminum;dihydrate Chemical compound O.O.CC(=O)O[Al] HDYRYUINDGQKMC-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229940072056 alginate Drugs 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- JLDSOYXADOWAKB-UHFFFAOYSA-N aluminium nitrate Chemical class [Al+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O JLDSOYXADOWAKB-UHFFFAOYSA-N 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940009827 aluminum acetate Drugs 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- KMJRBSYFFVNPPK-UHFFFAOYSA-K aluminum;dodecanoate Chemical compound [Al+3].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O KMJRBSYFFVNPPK-UHFFFAOYSA-K 0.000 description 1
- VXAUWWUXCIMFIM-UHFFFAOYSA-M aluminum;oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Al+3] VXAUWWUXCIMFIM-UHFFFAOYSA-M 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IOGARICUVYSYGI-UHFFFAOYSA-K azanium (4-oxo-1,3,2-dioxalumetan-2-yl) carbonate Chemical compound [NH4+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O IOGARICUVYSYGI-UHFFFAOYSA-K 0.000 description 1
- 229910001680 bayerite Inorganic materials 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- ZCLVNIZJEKLGFA-UHFFFAOYSA-H bis(4,5-dioxo-1,3,2-dioxalumolan-2-yl) oxalate Chemical compound [Al+3].[Al+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O ZCLVNIZJEKLGFA-UHFFFAOYSA-H 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PPQREHKVAOVYBT-UHFFFAOYSA-H dialuminum;tricarbonate Chemical class [Al+3].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O PPQREHKVAOVYBT-UHFFFAOYSA-H 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- XZTWHWHGBBCSMX-UHFFFAOYSA-J dimagnesium;phosphonato phosphate Chemical compound [Mg+2].[Mg+2].[O-]P([O-])(=O)OP([O-])([O-])=O XZTWHWHGBBCSMX-UHFFFAOYSA-J 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910001679 gibbsite Inorganic materials 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- PJJZFXPJNUVBMR-UHFFFAOYSA-L magnesium benzoate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 PJJZFXPJNUVBMR-UHFFFAOYSA-L 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229960001708 magnesium carbonate Drugs 0.000 description 1
- 235000014380 magnesium carbonate Nutrition 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000004337 magnesium citrate Substances 0.000 description 1
- 229960005336 magnesium citrate Drugs 0.000 description 1
- 235000002538 magnesium citrate Nutrition 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000001755 magnesium gluconate Substances 0.000 description 1
- 235000015778 magnesium gluconate Nutrition 0.000 description 1
- 229960003035 magnesium gluconate Drugs 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- OVGXLJDWSLQDRT-UHFFFAOYSA-L magnesium lactate Chemical compound [Mg+2].CC(O)C([O-])=O.CC(O)C([O-])=O OVGXLJDWSLQDRT-UHFFFAOYSA-L 0.000 description 1
- 239000000626 magnesium lactate Substances 0.000 description 1
- 235000015229 magnesium lactate Nutrition 0.000 description 1
- 229960004658 magnesium lactate Drugs 0.000 description 1
- 229940105112 magnesium myristate Drugs 0.000 description 1
- UHNWOJJPXCYKCG-UHFFFAOYSA-L magnesium oxalate Chemical compound [Mg+2].[O-]C(=O)C([O-])=O UHNWOJJPXCYKCG-UHFFFAOYSA-L 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- 229940072082 magnesium salicylate Drugs 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 229940057948 magnesium stearate Drugs 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 229960003390 magnesium sulfate Drugs 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- IAKLPCRFBAZVRW-XRDLMGPZSA-L magnesium;(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoate;hydrate Chemical compound O.[Mg+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O IAKLPCRFBAZVRW-XRDLMGPZSA-L 0.000 description 1
- DZBOAIYHPIPCBP-UHFFFAOYSA-L magnesium;2-methylprop-2-enoate Chemical compound [Mg+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O DZBOAIYHPIPCBP-UHFFFAOYSA-L 0.000 description 1
- CRGZYKWWYNQGEC-UHFFFAOYSA-N magnesium;methanolate Chemical compound [Mg+2].[O-]C.[O-]C CRGZYKWWYNQGEC-UHFFFAOYSA-N 0.000 description 1
- DMRBHZWQMKSQGR-UHFFFAOYSA-L magnesium;tetradecanoate Chemical compound [Mg+2].CCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCC([O-])=O DMRBHZWQMKSQGR-UHFFFAOYSA-L 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- YQXQWFASZYSARF-UHFFFAOYSA-N methanol;titanium Chemical compound [Ti].OC YQXQWFASZYSARF-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- 235000014571 nuts Nutrition 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005504 petroleum refining Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- IKNCGYCHMGNBCP-UHFFFAOYSA-N propan-1-olate Chemical compound CCC[O-] IKNCGYCHMGNBCP-UHFFFAOYSA-N 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- KHDSWONFYIAAPE-UHFFFAOYSA-N silicon sulfide Chemical compound S=[Si]=S KHDSWONFYIAAPE-UHFFFAOYSA-N 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- JXJTWJYTKGINRZ-UHFFFAOYSA-J silicon(4+);tetraacetate Chemical compound [Si+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O JXJTWJYTKGINRZ-UHFFFAOYSA-J 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- LLZRNZOLAXHGLL-UHFFFAOYSA-J titanic acid Chemical compound O[Ti](O)(O)O LLZRNZOLAXHGLL-UHFFFAOYSA-J 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- GQUJEMVIKWQAEH-UHFFFAOYSA-N titanium(III) oxide Chemical compound O=[Ti]O[Ti]=O GQUJEMVIKWQAEH-UHFFFAOYSA-N 0.000 description 1
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 description 1
- PLSARIKBYIPYPF-UHFFFAOYSA-H trimagnesium dicitrate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O PLSARIKBYIPYPF-UHFFFAOYSA-H 0.000 description 1
- VXYADVIJALMOEQ-UHFFFAOYSA-K tris(lactato)aluminium Chemical compound CC(O)C(=O)O[Al](OC(=O)C(C)O)OC(=O)C(C)O VXYADVIJALMOEQ-UHFFFAOYSA-K 0.000 description 1
- MDDPTCUZZASZIQ-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]alumane Chemical compound [Al+3].CC(C)(C)[O-].CC(C)(C)[O-].CC(C)(C)[O-] MDDPTCUZZASZIQ-UHFFFAOYSA-N 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
- F01N3/021—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters
- F01N3/022—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters characterised by specially adapted filtering structure, e.g. honeycomb, mesh or fibrous
- F01N3/0222—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust by means of filters characterised by specially adapted filtering structure, e.g. honeycomb, mesh or fibrous the structure being monolithic, e.g. honeycombs
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
- C04B35/18—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay rich in aluminium oxide
- C04B35/195—Alkaline earth aluminosilicates, e.g. cordierite or anorthite
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/478—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on aluminium titanates
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- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/0006—Honeycomb structures
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- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00793—Uses not provided for elsewhere in C04B2111/00 as filters or diaphragms
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- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/0081—Uses not provided for elsewhere in C04B2111/00 as catalysts or catalyst carriers
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
- C04B2235/3222—Aluminates other than alumino-silicates, e.g. spinel (MgAl2O4)
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- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
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Abstract
Description
本発明は、グリーン(green)成形体に関する。 The present invention relates to a green molded body.
従来、ディーゼルエンジン(diesel engine)などの内燃機関から排出される排ガスに含まれるカーボン粒子等の微細粒子を捕集するためのセラミックスフィルター(DPF:Diesel Particulate Filter)として、多孔質のセラミックスからなるハニカム(honeycomb)構造体が用いられている(下記特許文献1参照)。 2. Description of the Related Art Conventionally, a honeycomb made of porous ceramics is used as a ceramic filter (DPF: Diesel Particulate Filter) for collecting fine particles such as carbon particles contained in exhaust gas discharged from an internal combustion engine such as a diesel engine. A (honeycomb) structure is used (see Patent Document 1 below).
DPF用のハニカム構造体は通常柱状体である。柱状のハニカム構造体には、その対向する端面間を貫通する複数の貫通孔が形成されている。ハニカム構造体の一方の端面(第一端面)では、開いた貫通孔の端部と封口部で塞がれた貫通孔の端部とが、格子状に交互に配置されている。第一端面において端部が開いている貫通孔は、第一端面と反対側の第二端面において封口部で塞がれている。また、第一端面において端部が封口部で塞がれている貫通孔は、第二端面において開いている。よって、第二端面においても、開いた貫通孔の端部と封口部で塞がれた貫通孔の端部とが、格子状に交互に配置されている。 A honeycomb structure for DPF is usually a columnar body. The columnar honeycomb structure is formed with a plurality of through holes penetrating between the opposing end faces. On one end surface (first end surface) of the honeycomb structure, the end portions of the open through holes and the end portions of the through holes closed by the sealing portions are alternately arranged in a lattice pattern. The through hole whose end is open on the first end surface is closed with a sealing portion on the second end surface opposite to the first end surface. Further, the through hole whose end is closed by the sealing portion on the first end surface is open on the second end surface. Therefore, also on the second end surface, the end portions of the open through holes and the end portions of the through holes closed by the sealing portions are alternately arranged in a lattice pattern.
上記のように貫通孔が封口部で塞がれたハニカム構造体を製造するためには、生の柱状体を焼成する工程と、焼成した柱状体の貫通孔の一端を生の封口材で塞ぐ工程(以下、「封口工程」という。)が必要となる。さらに、封口工程後の柱状体を再び焼成することにより生の封口材を焼結させて封口部を形成する工程も必要となる。このように、封口工程を挟んで2度の焼成工程と必須とする点において、従来のハニカム構造体の製造方法は生産性が低い。また、封口工程後に2回目の焼成工程を実施しても、封口部と貫通孔の隔壁とが十分に焼結しない場合がある。この場合、封口部と隔壁との間に隙間が形成されたり、封口部が貫通孔から脱落したりする。その結果、ハニカム構造体による微細粒子の捕捉率が低下する。 In order to manufacture a honeycomb structure in which the through hole is closed by the sealing portion as described above, the raw columnar body is fired, and one end of the through hole of the fired columnar body is closed with the raw sealing material. A process (hereinafter referred to as “sealing process”) is required. Furthermore, the process of forming a sealing part by sintering a raw sealing material by baking again the columnar body after a sealing process is also needed. As described above, the manufacturing method of the conventional honeycomb structure is low in productivity in that the two firing steps are essential with the sealing step interposed therebetween. Moreover, even if it implements the 2nd baking process after a sealing process, a sealing part and the partition of a through-hole may not fully sinter. In this case, a gap is formed between the sealing portion and the partition wall, or the sealing portion is dropped from the through hole. As a result, the capture rate of fine particles by the honeycomb structure decreases.
本発明は、このような従来技術の有する課題に鑑みてなされたものであり、生産性が高く、封口部と貫通孔の隔壁とが十分に焼結したハニカム構造体の製造に適したグリーン成形体を提供することを目的とする。 The present invention has been made in view of such problems of the prior art, and has high productivity, and is a green molding suitable for manufacturing a honeycomb structure in which a sealing portion and a partition wall of a through hole are sufficiently sintered. The purpose is to provide a body.
上記目的を達成するために、本発明に係るグリーン成形体の一態様は、互いに略平行な複数の貫通孔が形成され、複数の貫通孔を隔てる隔壁を有するハニカム状の柱状体と、貫通孔の一方の端部を塞ぐ封口材と、を備え、複数の貫通孔のうち一部の貫通孔は、貫通孔に略直交する柱状体の第一端面及び第二端面のうち第一端面において封口材で塞がれ、第二端面において開き、他の貫通孔は、第二端面において封口材で塞がれ、第一端面において開いており、封口材がセラミックス(ceramics)を含み、柱状体がセラミックスの原料粉末を含み、セラミックスがチタン酸アルミニウム(aluminum titanate)系セラミックス及び/又はコージェライト(cordierite)系セラミックスであり、封口材の焼結時の収縮率が、隔壁の焼結時の収縮率に対して、80〜100%である。 In order to achieve the above object, one embodiment of the green molded body according to the present invention includes a honeycomb-shaped columnar body having a plurality of through-holes that are substantially parallel to each other and having partition walls separating the plurality of through-holes, and a through-hole. A sealing material that closes one end of each of the plurality of through holes, wherein some of the through holes are sealed at the first end surface of the first end surface and the second end surface of the columnar body substantially orthogonal to the through hole. The other through-hole is closed with a sealing material at the second end surface and open at the first end surface, the sealing material contains ceramics, and the columnar body is closed with a material. A ceramic raw material powder is included, and the ceramic is aluminum titanate ceramic and / or cordierite ceramic, and the sealing material is sintered. Of shrinkage, relative shrinkage during sintering of the partition walls, from 80 to 100%.
なお、グリーン成形体とは、焼成される前の生の成形体を意味する。封口材は、セラミックスだけではなく、その原料粉末を含んでもよい。セラミックスとは、例えば、チタン酸アルミニウム系セラミックス又はコージェライト系セラミックスの粉末又は粒子である。セラミックスの原料粉末とは、焼成によりセラミックスになるものである。 In addition, a green molded object means the raw molded object before baking. The sealing material may include not only ceramics but also its raw material powder. Ceramics are, for example, powders or particles of aluminum titanate ceramics or cordierite ceramics. The ceramic raw material powder is a ceramic that is formed by firing.
上記本発明の一態様では、生(未焼結)の柱状体の貫通孔が既に封口材で塞がれている。よって、上記本発明のグリーン成形体の一態様を1回焼成するたけで、柱状体及び封口材の焼結が略同時に進行し、ハニカム構造体が完成する。したがって、上記本発明のグリーン成形体の一態様を用いたハニカム構造体の製造方法は、2回の焼成工程を必要とする従来の製造方法に比べて生産性が高い。 In one embodiment of the present invention, the through hole of the raw (unsintered) columnar body is already closed with the sealing material. Therefore, only by firing one embodiment of the green molded body of the present invention, the sintering of the columnar body and the sealing material proceeds substantially simultaneously, and the honeycomb structure is completed. Therefore, the method for manufacturing a honeycomb structure using one embodiment of the green molded body of the present invention has higher productivity than a conventional manufacturing method that requires two firing steps.
上記本発明の一態様では、封口材の焼結時の収縮率が、隔壁の焼結時の収縮率に対して、80〜100%であるため、貫通孔が封口材に対して相対的に収縮し、柱状体(貫通孔の隔壁)と封口材との密着性・焼結性が向上する。 In the above aspect of the present invention, since the shrinkage rate during sintering of the sealing material is 80 to 100% with respect to the shrinkage rate during sintering of the partition walls, the through hole is relatively formed with respect to the sealing material. Shrinkage improves the adhesion and sintering properties between the columnar body (the partition wall of the through hole) and the sealing material.
本発明によれば、生産性が高く、封口部と貫通孔の隔壁とが十分に焼結したハニカム構造体の製造に適したグリーン成形体を提供することが可能となる。 ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the green molded object with high productivity and suitable for manufacture of the honeycomb structure in which the sealing part and the partition of the through-hole were fully sintered.
以下、図面を参照しながら、本発明の好適な一実施形態について詳細に説明する。ただし、本発明は以下の実施形態に限定されるものではない。なお、同一又は同等の要素については同一の符号を付す。また、上下左右の位置関係は図面に示す通りであるが、寸法の比率は図面に示すものに限定されない。 Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In addition, the same code | symbol is attached | subjected about the same or equivalent element. In addition, although the positional relationship between the top, bottom, left and right is as shown in the drawing, the ratio of dimensions is not limited to that shown in the drawing.
<グリーン成形体>
図1(a)及び1(b)に示すように、グリーン成形体100は、ハニカム構造を有する円柱体(柱状体70)である。柱状体70は、その中心軸(柱状体70の円形の断面に垂直であり、円形の断面の中心を通る直線)に平行であり、互いに直交する複数の隔壁70cを有する。つまり、柱状体70は、その中心軸方向に垂直な断面において格子構造を有する。換言すれば、柱状体70には、同一方向(中心軸方向)に延びる多数の貫通孔70a(流路)が形成されており、隔壁70cが各貫通孔70aを隔てる。各貫通孔70aは柱状体70の両端面に垂直である。なお、柱状体70が有する複数の隔壁70cが互いになす角は特に限定されず、例えば120°であってもよい。
<Green molded body>
As shown in FIGS. 1 (a) and 1 (b), the green molded body 100 is a cylindrical body (columnar body 70) having a honeycomb structure. The columnar body 70 has a plurality of partition walls 70c that are parallel to a central axis (a straight line that is perpendicular to the circular cross section of the columnar body 70 and passes through the center of the circular cross section) and orthogonal to each other. That is, the columnar body 70 has a lattice structure in a cross section perpendicular to the central axis direction. In other words, the columnar body 70 is formed with a large number of through holes 70a (flow passages) extending in the same direction (center axis direction), and the partition walls 70c separate the through holes 70a. Each through hole 70 a is perpendicular to both end faces of the columnar body 70. In addition, the angle which the some partition 70c which the columnar body 70 has mutually is not specifically limited, For example, 120 degrees may be sufficient.
複数の貫通孔70aのうち一部の貫通孔は、貫通孔に直交する第一端面において封口材70bで塞がれている。第一端面では、封口材70bで塞がれた貫通孔70aの端部と開いた貫通孔70aの端部とが、格子状に交互に配置されている。第一端面において封口材70bで塞がれた貫通孔70aは、第一端面と反対側の第二端面において開いている。第一端面において開いている貫通孔70aは、第二端面において封口材70bで塞がれている(図示省略)。よって、第二端面においても、封口材70bで塞がれた貫通孔70aの端部と開いた貫通孔70aの端部とが、格子状に交互に配置されている。このように、複数の貫通孔70aは、第一端面又は第二端面のいずれか一方の面において封口材70bで塞がれている。 Some of the plurality of through holes 70a are closed with a sealing material 70b on the first end surface orthogonal to the through holes. On the first end surface, the end portions of the through holes 70a closed by the sealing material 70b and the end portions of the open through holes 70a are alternately arranged in a lattice pattern. The through-hole 70a closed with the sealing material 70b on the first end surface is open on the second end surface opposite to the first end surface. The through-hole 70a opened on the first end surface is closed with a sealing material 70b on the second end surface (not shown). Therefore, also on the second end face, the end portions of the through holes 70a closed by the sealing material 70b and the end portions of the open through holes 70a are alternately arranged in a lattice pattern. In this manner, the plurality of through holes 70a are closed with the sealing material 70b on either the first end surface or the second end surface.
(柱状体)
柱状体70は、無機化合物源粉末(原料粉末)、造孔剤、有機バインダ及び溶媒等を混練機等により混合して調製した原料混合物を成形することにより得られる。無機化合物源粉末は、チタン酸アルミニウム系セラミックスの原料粉末として、チタン源粉末及びアルミニウム源粉末を含む。無機化合物源粉末は、更にマグネシウム源粉末及びケイ素源粉末を含んでもよい。原料混合物は、チタン酸アルミニウム系セラミックスそのものを含んでもよい。これにより、焼結に伴うグリーン成形体100の収縮率が低減される。なお、チタン酸アルミニウム系セラミックスとは、例えばチタン酸アルミニウムやチタン酸アルミニウムマグネシウムである。
(Columnar)
The columnar body 70 is obtained by molding a raw material mixture prepared by mixing an inorganic compound source powder (raw material powder), a pore former, an organic binder, a solvent, and the like with a kneader or the like. The inorganic compound source powder includes a titanium source powder and an aluminum source powder as a raw material powder of an aluminum titanate ceramic. The inorganic compound source powder may further include a magnesium source powder and a silicon source powder. The raw material mixture may include the aluminum titanate ceramic itself. Thereby, the shrinkage rate of the green molded object 100 accompanying sintering is reduced. The aluminum titanate ceramic is, for example, aluminum titanate or aluminum magnesium titanate.
[アルミニウム源]
アルミニウム源は、チタン酸アルミニウム焼結体を構成するアルミニウム成分となる化合物である。アルミニウム源としては、例えば、アルミナ(酸化アルミニウム)が挙げられる。アルミナの結晶型としては、γ型、δ型、θ型、α型などが挙げられ、不定形(アモルファス)であってもよい。なかでも、α型のアルミナが好ましく用いられる。
[Aluminum source]
The aluminum source is a compound that becomes an aluminum component constituting the aluminum titanate sintered body. Examples of the aluminum source include alumina (aluminum oxide). Examples of the crystal type of alumina include γ-type, δ-type, θ-type, and α-type, and may be indefinite (amorphous). Of these, α-type alumina is preferably used.
アルミニウム源は、単独で空気中で焼成することによりアルミナに導かれる化合物であってもよい。かかる化合物としては、例えばアルミニウム塩、アルミニウムアルコキシド、水酸化アルミニウム、金属アルミニウムなどが挙げられる。 The aluminum source may be a compound that is led to alumina by firing alone in air. Examples of such a compound include an aluminum salt, aluminum alkoxide, aluminum hydroxide, and metal aluminum.
アルミニウム塩は、無機酸との無機塩であってもよいし、有機酸との有機塩であってもよい。具体的なアルミニウム無機塩としては、例えば、硝酸アルミニウム、硝酸アンモニウムアルミニウムなどのアルミニウム硝酸塩、炭酸アンモニウムアルミニウムなどのアルミニウム炭酸塩などが挙げられる。アルミニウム有機塩としては、例えば、蓚酸アルミニウム、酢酸アルミニウム、ステアリン酸アルミニウム、乳酸アルミニウム、ラウリン酸アルミニウムなどが挙げられる。 The aluminum salt may be an inorganic salt with an inorganic acid or an organic salt with an organic acid. Specific examples of the aluminum inorganic salt include aluminum nitrates such as aluminum nitrate and ammonium aluminum nitrate, and aluminum carbonates such as ammonium aluminum carbonate. Examples of the aluminum organic salt include aluminum oxalate, aluminum acetate, aluminum stearate, aluminum lactate, and aluminum laurate.
アルミニウムアルコキシドとして具体的には、例えば、アルミニウムイソプロポキシド、アルミニウムエトキシド、アルミニウムsec−ブトキシド、アルミニウムtert−ブトキシドなどが挙げられる。 Specific examples of the aluminum alkoxide include aluminum isopropoxide, aluminum ethoxide, aluminum sec-butoxide, aluminum tert-butoxide, and the like.
水酸化アルミニウムの結晶型としては、例えば、ギブサイト型、バイヤライト型、ノロソトランダイト型、ベーマイト型、擬ベーマイト型などが挙げられ、不定形(アモルファス)であってもよい。アモルファスの水酸化アルミニウムとしては、例えば、アルミニウム塩、アルミニウムアルコキシドなどのような水溶性アルミニウム化合物の水溶液を加水分解して得られるアルミニウム加水分解物も挙げられる。 Examples of the crystal type of aluminum hydroxide include gibbsite type, bayerite type, norosotrandite type, boehmite type, and pseudoboehmite type, and may be amorphous (amorphous). Examples of the amorphous aluminum hydroxide include an aluminum hydrolyzate obtained by hydrolyzing an aqueous solution of a water-soluble aluminum compound such as an aluminum salt or an aluminum alkoxide.
アルミニウム源としては、1種のみを用いてもよいし、2種以上を併用してもよい。 As an aluminum source, only 1 type may be used and 2 or more types may be used together.
上記のなかでも、アルミニウム源としては、アルミナが好ましく用いられ、より好ましくは、α型のアルミナである。なお、アルミニウム源は、その原料由来あるいは製造工程において不可避的に含まれる微量成分を含有し得る。 Of the above, alumina is preferably used as the aluminum source, and more preferably α-type alumina. The aluminum source may contain trace components derived from the raw materials or inevitably contained in the production process.
アルミニウム源粉末の粒径は、特に限定されない。例えば、レーザー回折法により測定される体積基準の累積百分率50%に相当するアルミニウム源粉末の粒子径は20〜60μmの範囲内であればよい。なお、この粒子径は、D50又は平均粒子径とも呼ばれる。焼成時の収縮率低減の観点からは、D50が30〜60μmの範囲内であるアルミニウム源粉末を用いることが好ましい。 The particle size of the aluminum source powder is not particularly limited. For example, the particle diameter of the aluminum source powder corresponding to a volume-based cumulative percentage of 50% measured by a laser diffraction method may be in the range of 20 to 60 μm. This particle diameter is also called D50 or average particle diameter. From the viewpoint of reducing shrinkage during firing, it is preferable to use an aluminum source powder having a D50 in the range of 30 to 60 μm.
原料混合物にはアルミナゾルや後述のシリカゾルを添加することができる。このように、アルミナゾル、シリカゾル等を添加することにより、原料混合物中の微小な粒子同士を吸着させ、グリーン成形体中の粒子径0.1μm以下の粒子の量を、無機化合物源粉末(固形分)の100重量部に対して1〜5重量部とすることができ、これにより500℃における脱脂後の成形体の強度を例えば0.2kgf以上とすることができる。 An alumina sol or a silica sol described later can be added to the raw material mixture. Thus, by adding alumina sol, silica sol, etc., fine particles in the raw material mixture are adsorbed to each other, and the amount of particles having a particle diameter of 0.1 μm or less in the green molded body is reduced to the inorganic compound source powder (solid content ) Of 1 to 5 parts by weight, whereby the strength of the molded body after degreasing at 500 ° C. can be made 0.2 kgf or more, for example.
アルミナゾルとは、微粒子状のアルミナを分散質とし、液体を分散媒とするコロイドである。アルミナゾルは、単独でアルミニウム源とすることもできるが、他のアルミニウム源と共に併用されることが好ましい。アルミナゾルの分散媒は、例えば、混合時や仮焼時に蒸発等により除去される。 The alumina sol is a colloid using fine particle alumina as a dispersoid and a liquid as a dispersion medium. Alumina sol can be used alone as an aluminum source, but is preferably used in combination with other aluminum sources. The dispersion medium of alumina sol is removed by evaporation or the like at the time of mixing or calcination, for example.
アルミナゾルの分散媒としては、水溶液や各種有機溶媒、例えば、塩酸水溶液、酢酸水溶液、硝酸水溶液、アルコール、キシレン、トルエン、メチルイソブチルケトンなどが挙げられる。アルミナゾルとしては、平均粒子径が1〜100nmのコロイド状アルミナゾルが好適に用いられる。このような平均粒子径を有するアルミナゾルを用いることにより、原料混合物中の粒子同士を吸着させられるといった利点がある。また、アルミナゾルの市販品としては、例えば、日産化学工業社製「アルミナゾル100」、「アルミナゾル200」、「アルミナゾル520」、シーアイ化成製「NanoTekAl2O3」等が挙げられる。このうち、日産化学工業社製「アルミナゾル200」を用いることが好ましい。 Examples of the dispersion medium for the alumina sol include aqueous solutions and various organic solvents such as aqueous hydrochloric acid, aqueous acetic acid, aqueous nitric acid, alcohol, xylene, toluene, and methyl isobutyl ketone. As the alumina sol, a colloidal alumina sol having an average particle diameter of 1 to 100 nm is preferably used. By using an alumina sol having such an average particle size, there is an advantage that particles in the raw material mixture can be adsorbed. Examples of commercially available products of alumina sol include “Alumina sol 100”, “Alumina sol 200”, “Alumina sol 520” manufactured by Nissan Chemical Industries, Ltd., “NanoTekAl 2 O 3 ” manufactured by CI Kasei. Among these, it is preferable to use "Alumina sol 200" manufactured by Nissan Chemical Industries.
アルミナゾルは、無機化合物源粉末(固形分)の100重量部に対して固形分で0〜10重量部、好ましくは0〜5重量部用いることができる。アルミナゾルは、2種以上混合して用いてもよい。 The alumina sol can be used in an amount of 0 to 10 parts by weight, preferably 0 to 5 parts by weight, based on 100 parts by weight of the inorganic compound source powder (solid content). Two or more kinds of alumina sols may be mixed and used.
[チタン源]
チタン源は、チタン酸アルミニウム焼結体を構成するチタン成分となる化合物であり、かかる化合物としては、例えば酸化チタンが挙げられる。酸化チタンとしては、例えば、酸化チタン(IV)、酸化チタン(III)、酸化チタン(II)などが挙げられ、なかでも酸化チタン(IV)が好ましく用いられる。酸化チタン(IV)の結晶型としては、アナターゼ型、ルチル型、ブルッカイト型などが挙げられ、不定形(アモルファス)であってもよい。より好ましくは、アナターゼ型、ルチル型の酸化チタン(IV)である。
[Titanium source]
The titanium source is a compound that becomes a titanium component constituting the aluminum titanate sintered body, and examples of such a compound include titanium oxide. Examples of titanium oxide include titanium (IV) oxide, titanium (III) oxide, and titanium (II) oxide. Among these, titanium (IV) oxide is preferably used. Examples of the crystal form of titanium (IV) oxide include anatase type, rutile type, brookite type and the like, and may be indefinite (amorphous). More preferred is anatase type or rutile type titanium (IV) oxide.
チタン源は、単独で空気中で焼成することによりチタニア(酸化チタン)に導かれる化合物であってもよい。かかる化合物としては、例えば、チタン塩、チタンアルコキシド、水酸化チタン、窒化チタン、硫化チタン、チタン金属などが挙げられる。 The titanium source may be a compound that is led to titania (titanium oxide) by firing alone in air. Examples of such compounds include titanium salts, titanium alkoxides, titanium hydroxide, titanium nitride, titanium sulfide, titanium metal and the like.
チタン塩として具体的には、三塩化チタン、四塩化チタン、硫化チタン(IV)、硫化チタン(VI)、硫酸チタン(IV)などが挙げられる。チタンアルコキシドとして具体的には、チタン(IV)エトキシド、チタン(IV)メトキシド、チタン(IV)t−ブトキシド、チタン(IV)イソブトキシド、チタン(IV)n−プロポキシド、チタン(IV)テトライソプロポキシド、および、これらのキレート化物などが挙げられる。 Specific examples of the titanium salt include titanium trichloride, titanium tetrachloride, titanium sulfide (IV), titanium sulfide (VI), titanium sulfate (IV), and the like. Specific examples of titanium alkoxide include titanium (IV) ethoxide, titanium (IV) methoxide, titanium (IV) t-butoxide, titanium (IV) isobutoxide, titanium (IV) n-propoxide, titanium (IV) tetraiso Examples thereof include propoxide and chelates thereof.
チタン源としては、1種のみを用いてもよいし、2種以上を併用してもよい。 As a titanium source, only 1 type may be used and 2 or more types may be used together.
上記のなかでも、チタン源としては、酸化チタンが好ましく用いられ、より好ましくは、酸化チタン(IV)である。なお、チタン源は、その原料由来あるいは製造工程において不可避的に含まれる微量成分を含有し得る。 Among the above, as the titanium source, titanium oxide is preferably used, and titanium (IV) oxide is more preferable. In addition, a titanium source can contain the trace component contained unavoidable in the raw material origin or manufacturing process.
チタン源粉末の粒径は、特に限定されない。例えば、レーザー回折法により測定される、体積基準の累積百分率50%に相当するチタン源粉末の粒子径(D50)は0.5〜25μmの範囲内であればよい。十分に低い焼成収縮率の達成のためには、チタン源粉末のD50が1〜20μmの範囲内であることが好ましい。なお、チタン源粉末は、バイモーダルな粒径分布を示すことがあるが、このようなバイモーダルな粒径分布を示すチタン源粉末を用いる場合においては、レーザー回折法により測定される粒径分布における、粒径が大きい方のピークの粒径が20〜50μmの範囲内であることが好ましい。 The particle size of the titanium source powder is not particularly limited. For example, the particle diameter (D50) of the titanium source powder corresponding to a volume-based cumulative percentage of 50% as measured by a laser diffraction method may be in the range of 0.5 to 25 μm. In order to achieve a sufficiently low firing shrinkage ratio, the D50 of the titanium source powder is preferably in the range of 1 to 20 μm. The titanium source powder may show a bimodal particle size distribution. When using a titanium source powder showing such a bimodal particle size distribution, the particle size distribution measured by the laser diffraction method is used. It is preferable that the particle diameter of the peak with a larger particle diameter is in the range of 20 to 50 μm.
レーザー回折法により測定されるチタン源粉末のモード径は、特に限定されないが、0.3〜60μmの範囲内であればよい。 The mode diameter of the titanium source powder measured by the laser diffraction method is not particularly limited as long as it is in the range of 0.3 to 60 μm.
[マグネシウム源]
原料混合物は、マグネシウム源を含有していてもよい。マグネシウム源を含むグリーン成形体100から製造されたハニカム構造体170は、チタン酸アルミニウムマグネシウム結晶の焼結体である。
[Magnesium source]
The raw material mixture may contain a magnesium source. The honeycomb structure 170 manufactured from the green molded body 100 containing a magnesium source is a sintered body of aluminum magnesium titanate crystals.
マグネシウム源としては、マグネシア(酸化マグネシウム)のほか、単独で空気中で焼成することによりマグネシアに導かれる化合物が挙げられる。後者の例としては、例えば、マグネシウム塩、マグネシウムアルコキシド、水酸化マグネシウム、窒化マグネシウム、金属マグネシウムなどが挙げられる。 Examples of the magnesium source include magnesia (magnesium oxide) and a compound that is led to magnesia by firing alone in air. Examples of the latter include magnesium salt, magnesium alkoxide, magnesium hydroxide, magnesium nitride, metal magnesium and the like.
マグネシウム塩として具体的には、塩化マグネシウム、過塩素酸マグネシウム、リン酸マグネシウム、ピロリン酸マグネシウム、蓚酸マグネシウム、硝酸マグネシウム、炭酸マグネシウム、酢酸マグネシウム、硫酸マグネシウム、クエン酸マグネシウム、乳酸マグネシウム、ステアリン酸マグネシウム、サリチル酸マグネシウム、ミリスチン酸マグネシウム、グルコン酸マグネシウム、ジメタクリル酸マグネシウム、安息香酸マグネシウムなどが挙げられる。 Specific examples of magnesium salts include magnesium chloride, magnesium perchlorate, magnesium phosphate, magnesium pyrophosphate, magnesium oxalate, magnesium nitrate, magnesium carbonate, magnesium acetate, magnesium sulfate, magnesium citrate, magnesium lactate, magnesium stearate, Examples include magnesium salicylate, magnesium myristate, magnesium gluconate, magnesium dimethacrylate, and magnesium benzoate.
マグネシウムアルコキシドとして具体的には、マグネシウムメトキシド、マグネシウムエトキシドなどが挙げられる。なお、マグネシウム源は、その原料由来あるいは製造工程において不可避的に含まれる微量成分を含有し得る。 Specific examples of the magnesium alkoxide include magnesium methoxide and magnesium ethoxide. In addition, a magnesium source can contain the trace component contained unavoidable in the raw material origin or manufacturing process.
マグネシウム源として、マグネシウム源とアルミニウム源とを兼ねた化合物を用いることもできる。このような化合物としては、例えば、マグネシアスピネル(MgAl2O4)が挙げられる。 As the magnesium source, a compound serving both as a magnesium source and an aluminum source can also be used. An example of such a compound is magnesia spinel (MgAl 2 O 4 ).
マグネシウム源として、1種のみを用いてもよいし、2種以上を併用してもよい。 As a magnesium source, only 1 type may be used and 2 or more types may be used together.
マグネシウム源粉末の粒径は、特に限定されない。例えば、レーザー回折法により測定される体積基準の累積百分率50%に相当するマグネシウム源粉末の粒子径(D50)は0.5〜30μmの範囲内であればよい。焼成時の収縮率低減の観点からは、D50が3〜20μmの範囲内であるマグネシウム源粉末を用いることが好ましい。 The particle size of the magnesium source powder is not particularly limited. For example, the particle diameter (D50) of the magnesium source powder corresponding to a volume-based cumulative percentage of 50% measured by a laser diffraction method may be in the range of 0.5 to 30 μm. From the viewpoint of reducing shrinkage during firing, it is preferable to use a magnesium source powder having a D50 in the range of 3 to 20 μm.
グリーン成形体中におけるMgO(マグネシア)換算でのマグネシウム源のモル量は、Al2O3(アルミナ)換算でのアルミニウム源とTiO2(チタニア)換算でのチタン源との合計モル量に対して、0.03〜0.15であることが好ましく、より好ましくは0.03〜0.12である。マグネシウム源の含有量をこの範囲内に調整することにより、耐熱性がより向上された、大きい細孔径および開気孔率を有するチタン酸アルミニウム焼結体を比較的容易に得ることができる。 The molar amount of the magnesium source in terms of MgO (magnesia) in the green molded body is based on the total molar amount of the aluminum source in terms of Al 2 O 3 (alumina) and the titanium source in terms of TiO 2 (titania). 0.03 to 0.15, and more preferably 0.03 to 0.12. By adjusting the content of the magnesium source within this range, an aluminum titanate sintered body having a large pore diameter and an open porosity with improved heat resistance can be obtained relatively easily.
[ケイ素源]
原料混合物は、ケイ素源をさらに含有していてもよい。ケイ素源は、シリコン成分となってチタン酸アルミニウム焼結体に含まれる化合物である。ケイ素源の併用により、耐熱性がより向上されたチタン酸アルミニウム焼結体を得ることが可能となる。ケイ素源としては、例えば、二酸化ケイ素、一酸化ケイ素などの酸化ケイ素(シリカ)が挙げられる。
[Silicon source]
The raw material mixture may further contain a silicon source. The silicon source is a compound that becomes a silicon component and is contained in the aluminum titanate sintered body. By using the silicon source in combination, it becomes possible to obtain an aluminum titanate sintered body with improved heat resistance. Examples of the silicon source include silicon oxides (silica) such as silicon dioxide and silicon monoxide.
ケイ素源は、単独で空気中で焼成することによりシリカに導かれる化合物であってもよい。かかる化合物としては、例えば、ケイ酸、炭化ケイ素、窒化ケイ素、硫化ケイ素、四塩化ケイ素、酢酸ケイ素、ケイ酸ナトリウム、オルトケイ酸ナトリウム、長石、ガラスフリットなどが挙げられる。なかでも、長石、ガラスフリットなどが好ましく用いられ、工業的に入手が容易であり、組成が安定している点で、ガラスフリットなどがより好ましく用いられる。なお、ガラスフリットとは、ガラスを粉砕して得られるフレークまたは粉末状のガラスをいう。ケイ素源として、長石とガラスフリットとの混合物からなる粉末を用いることもできる。 The silicon source may be a compound that is led to silica by firing alone in air. Examples of such compounds include silicic acid, silicon carbide, silicon nitride, silicon sulfide, silicon tetrachloride, silicon acetate, sodium silicate, sodium orthosilicate, feldspar, and glass frit. Among them, feldspar, glass frit and the like are preferably used, and glass frit and the like are more preferably used in terms of industrial availability and stable composition. Glass frit means flakes or powdery glass obtained by pulverizing glass. As the silicon source, a powder made of a mixture of feldspar and glass frit can also be used.
ケイ素源がガラスフリットである場合、得られるチタン酸アルミニウム焼結体の耐熱分解性をより向上させるという観点から、屈伏点が700℃以上のものを用いることが好ましい。ガラスフリットの屈伏点は、熱機械分析装置(TMA:Thermo Mechanical Analysis)を用いて、低温からガラスフリットの膨張を測定し、膨張が止まり、次に収縮が始まる温度(℃)と定義される。 When the silicon source is a glass frit, it is preferable to use one having a yield point of 700 ° C. or higher from the viewpoint of further improving the thermal decomposition resistance of the obtained aluminum titanate sintered body. The yield point of the glass frit is defined as a temperature (° C.) at which the expansion of the glass frit is measured from a low temperature by using a thermo mechanical analyzer (TMA), and the expansion stops and then the contraction starts.
ガラスフリットを構成するガラスには、ケイ酸(SiO2)を主成分(全成分中50重量%以上)とする一般的なケイ酸ガラスを用いることができる。ガラスフリットを構成するガラスは、その他の含有成分として、一般的なケイ酸ガラスと同様、アルミナ(Al2O3)、酸化ナトリウム(Na2O)、酸化カリウム(K2O)、酸化カルシウム(CaO)、マグネシア(MgO)等を含んでいてもよい。また、ガラスフリットを構成するガラスは、ガラス自体の耐熱水性を向上させるために、ZrO2を含有していてもよい。 As the glass constituting the glass frit, a general silicate glass containing silicate (SiO 2 ) as a main component (50% by weight or more in all components) can be used. The glass constituting the glass frit includes other components such as alumina (Al 2 O 3 ), sodium oxide (Na 2 O), potassium oxide (K 2 O), calcium oxide ( CaO), magnesia (MgO) and the like may be included. The glass constituting the glass frit may contain ZrO 2 in order to improve the hot water resistance of the glass itself.
ケイ素源として、1種のみを用いてもよいし、2種以上を併用してもよい。 As a silicon source, only 1 type may be used and 2 or more types may be used together.
ケイ素源粉末の粒径は、特に限定されない。例えば、レーザー回折法により測定される体積基準の累積百分率50%に相当するケイ素源の粒子径(D50)は0.5〜30μmの範囲内であればよい。グリーン成形体の比重をより向上させ、機械的強度のより高い焼成体を得るためには、ケイ素源のD50が1〜20μmの範囲内であることが好ましい。 The particle size of the silicon source powder is not particularly limited. For example, the particle diameter (D50) of the silicon source corresponding to a volume-based cumulative percentage of 50% measured by laser diffraction method may be in the range of 0.5 to 30 μm. In order to further improve the specific gravity of the green molded body and obtain a fired body having higher mechanical strength, it is preferable that D50 of the silicon source is in the range of 1 to 20 μm.
原料混合物がケイ素源を含む場合、原料混合物中におけるケイ素源の含有量は、Al2O3(アルミナ)換算でのアルミニウム源とTiO2(チタニア)換算でのチタン源との合計量100重量部に対して、SiO2(シリカ)換算で、通常0.1重量部〜10重量部であり、好ましくは5重量部以下である。また、原料混合物中におけるケイ素源の含有量は、原料混合物中に含まれる無機化合物源中、2重量%以上5重量%以下とすることがより好ましい。ケイ素源は、その原料由来あるいは製造工程において不可避的に含まれる微量成分を含有し得る。 When the raw material mixture contains a silicon source, the content of the silicon source in the raw material mixture is 100 parts by weight of the total amount of the aluminum source in terms of Al 2 O 3 (alumina) and the titanium source in terms of TiO 2 (titania). On the other hand, it is usually 0.1 to 10 parts by weight, preferably 5 parts by weight or less in terms of SiO 2 (silica). Further, the content of the silicon source in the raw material mixture is more preferably 2% by weight or more and 5% by weight or less in the inorganic compound source contained in the raw material mixture. The silicon source may contain trace components that are derived from the raw materials or inevitably contained in the production process.
マグネシアスピネル(MgAl2O4)などの複合酸化物のように、チタン、アルミニウム、ケイ素およびマグネシウムのうち、2つ以上の金属元素を成分とする化合物を原料として用いることができる。 As a composite oxide such as magnesia spinel (MgAl 2 O 4 ), a compound containing two or more metal elements among titanium, aluminum, silicon, and magnesium can be used as a raw material.
原料混合物中の無機化合物源粉末100重量部における粒子径0.1μm以下の粒子の含有量を1〜5重量部とする場合、上述のように、原料混合物にアルミナゾルおよび/またはシリカゾルを添加して混合することが好ましい。シリカゾルとは、微粒子状のシリカを分散質とし、液体を分散媒とするコロイドである。シリカゾルは、単独でケイ素源とすることもできるが、他のシリカ源と共に併用されることが好ましい。シリカナゾルの分散媒は、例えば、混合時や仮焼時に蒸発等により除去される。 When the content of particles having a particle size of 0.1 μm or less in 100 parts by weight of the inorganic compound source powder in the raw material mixture is 1 to 5 parts by weight, as described above, alumina sol and / or silica sol is added to the raw material mixture. It is preferable to mix. Silica sol is a colloid using fine particle silica as a dispersoid and liquid as a dispersion medium. The silica sol can be used alone as a silicon source, but is preferably used in combination with other silica sources. The dispersion medium of silica nasol is removed by evaporation or the like at the time of mixing or calcination, for example.
シリカゾルの分散媒としては、水溶液や各種有機溶媒、例えば、アンモニア水溶液、アルコール、キシレン、トルエン、トリグリセリドなどが挙げられる。シリカゾルとしては、平均粒子径が1〜100nmのコロイド状シリカゾルが好適に用いられる。このような平均粒子径を有するシリカゾルを用いることにより、原料混合物中の粒子同士を吸着させ、焼成時に融解し結合させることができるといった利点がある。 Examples of the dispersion medium for silica sol include aqueous solutions and various organic solvents such as an aqueous ammonia solution, alcohol, xylene, toluene, and triglyceride. As the silica sol, a colloidal silica sol having an average particle diameter of 1 to 100 nm is preferably used. By using a silica sol having such an average particle size, there is an advantage that particles in the raw material mixture can be adsorbed and melted and bonded during firing.
シリカゾルの市販品としては、例えば、日産化学工業社製「スノーテックス20、30、40、50、N、O、S、C、20L、OL、XS、XL、YL、ZL、QAS−40、LSS−35、LSS−45」、旭電化社製「アデライトAT−20、AT−30、AT−40、AT−50、AT−20N、AT−20A、AT−30A、AT−20Q、AT−300、AT−300Q」、触媒化成工業社製「Cataloid S−20L、S−20H、S−30L、S−30H、SI−30、SI−40、SI−50、SI−350、SI−500、SI−45P、SI−80P、SN、SA、SC−30」、デュポン社製「ルドックスHS−40、HS−30、LS、SM−30、TM、AS、AM」等が挙げられる。このうち、中性域でコロイド状態が安定な「スノーテックスC」を用いることが好ましい。 Examples of commercially available silica sols include “Snowtex 20, 30, 40, 50, N, O, S, C, 20L, OL, XS, XL, YL, ZL, QAS-40, LSS manufactured by Nissan Chemical Industries, Ltd. -35, LSS-45 "," Adelite AT-20, AT-30, AT-40, AT-50, AT-20N, AT-20A, AT-30A, AT-20Q, AT-300, manufactured by Asahi Denka Co., Ltd. "AT-300Q", "Cataloid S-20L, S-20H, S-30L, S-30H, SI-30, SI-40, SI-50, SI-350, SI-500, SI-" manufactured by Catalyst Kasei Kogyo Co., Ltd. 45P, SI-80P, SN, SA, SC-30 "," Ludox HS-40, HS-30, LS, SM-30, TM, AS, AM "manufactured by DuPont. Among these, it is preferable to use “Snowtex C” that is stable in a colloidal state in a neutral region.
原料混合物におけるシリカゾルの含有量は、無機化合物源粉末(固形分)の100重量部に対して固形分で0〜10重量部、好ましくは0〜5重量部であればよい。2種以上のシリカゾルを混合して用いてもよい。 Content of the silica sol in a raw material mixture should just be 0-10 weight part by solid content with respect to 100 weight part of inorganic compound source powder (solid content), Preferably it may be 0-5 weight part. Two or more kinds of silica sols may be mixed and used.
[有機バインダ]
有機バインダとしては、水溶性の有機バインダが好ましい。水溶性の有機バインダとしては、メチルセルロース、ヒドロキシプロピルメチルセルロース、ヒドロキシエチルメチルセルロースなどのセルロース類;ポリビニルアルコールなどのアルコール類;リグニンスルホン酸塩などの塩などが挙げられる。
[Organic binder]
As the organic binder, a water-soluble organic binder is preferable. Examples of the water-soluble organic binder include celluloses such as methylcellulose, hydroxypropylmethylcellulose, and hydroxyethylmethylcellulose; alcohols such as polyvinyl alcohol; salts such as lignin sulfonate.
有機バインダの量は、無機化合物源粉末の100重量部に対して、通常20重量部以下であり、好ましくは15重量部以下、さらに好ましくは6重量部である。また、有機バインダの下限量は、通常0.1重量部、好ましくは3重量部である。 The amount of the organic binder is usually 20 parts by weight or less, preferably 15 parts by weight or less, more preferably 6 parts by weight with respect to 100 parts by weight of the inorganic compound source powder. The lower limit amount of the organic binder is usually 0.1 parts by weight, preferably 3 parts by weight.
[溶媒]
溶媒としては、例えば、メタノール、エタノール、ブタノール、プロパノールなどのアルコール類、プロピレングリコール、ポリプロピレングリコール、エチレングリコールなどのグリコール類、および水などの極性溶媒を用いることができる。なかでも、水が好ましく、不純物が少ない点で、より好ましくはイオン交換水が用いられる。溶媒の使用量は、無機化合物源粉末の100重量部に対して、通常、10重量部〜100重量部、好ましくは20重量部〜80重量部である。なお、溶媒として非極性溶媒を用いてもよい。
[solvent]
As the solvent, for example, alcohols such as methanol, ethanol, butanol and propanol, glycols such as propylene glycol, polypropylene glycol and ethylene glycol, and polar solvents such as water can be used. Of these, water is preferable, and ion-exchanged water is more preferably used from the viewpoint of few impurities. The amount of the solvent used is usually 10 to 100 parts by weight, preferably 20 to 80 parts by weight, based on 100 parts by weight of the inorganic compound source powder. A nonpolar solvent may be used as the solvent.
[その他の添加物]
原料混合物は、有機バインダ以外の有機添加物を含むことができる。その他の有機添加物とは、例えば、造孔剤、潤滑剤および可塑剤、分散剤である。
[Other additives]
The raw material mixture can contain an organic additive other than the organic binder. Other organic additives are, for example, pore formers, lubricants and plasticizers, and dispersants.
造孔剤としては、グラファイト等の炭素材、ポリエチレン、ポリプロピレン、ポリメタクリル酸メチル等の樹脂類、でんぷん、ナッツ殻、クルミ殻、コーンなどの植物材料、氷、及びドライアイス等などが挙げられる。造孔剤の添加量は、無機化合物源粉末の100重量部に対して、通常、0〜40重量部であり、好ましくは0〜25重量部である。造孔剤はグリーン成形体の焼成時に消失する。したがって、チタン酸アルミニウム焼結体では、造孔剤が存在していた箇所に微細孔が形成される。 Examples of the pore-forming agent include carbon materials such as graphite, resins such as polyethylene, polypropylene, and polymethyl methacrylate, plant materials such as starch, nut shells, walnut shells, and corn, ice, and dry ice. The addition amount of the pore-forming agent is usually 0 to 40 parts by weight, preferably 0 to 25 parts by weight with respect to 100 parts by weight of the inorganic compound source powder. The pore former disappears when the green molded body is fired. Therefore, in the aluminum titanate sintered body, micropores are formed at locations where the pore-forming agent was present.
潤滑剤及び可塑剤としては、グリセリンなどのアルコール類、カプリル酸、ラウリン酸、パルミチン酸、アラギン酸、オレイン酸、ステアリン酸などの高級脂肪酸、ステアリン酸Al等のステアリン酸金属塩などが挙げられる。潤滑剤及び可塑剤の添加量は、無機化合物源粉末の100重量部に対して、通常、0〜10重量部であり、好ましくは1〜5重量部である。 Examples of the lubricant and plasticizer include alcohols such as glycerin, caprylic acid, lauric acid, palmitic acid, higher fatty acids such as alginate, oleic acid and stearic acid, and stearic acid metal salts such as Al stearate. The addition amount of the lubricant and the plasticizer is usually 0 to 10 parts by weight, preferably 1 to 5 parts by weight with respect to 100 parts by weight of the inorganic compound source powder.
分散剤としては、例えば、硝酸、塩酸、硫酸などの無機酸、シュウ酸、クエン酸、酢酸、リンゴ酸、乳酸等の有機酸、メタノール、エタノール、プロパノール等のアルコール類、ポリカルボン酸アンモニウム、ポリオキシアルキレンアルキルエーテル等の界面活性剤などが挙げられる。分散剤の添加量は、無機化合物源粉末の100重量部に対して、通常、0〜20重量部であり、好ましくは2〜8重量部である。 Examples of the dispersant include inorganic acids such as nitric acid, hydrochloric acid and sulfuric acid, organic acids such as oxalic acid, citric acid, acetic acid, malic acid and lactic acid, alcohols such as methanol, ethanol and propanol, ammonium polycarboxylate, Surfactants such as oxyalkylene alkyl ethers are listed. The addition amount of the dispersing agent is usually 0 to 20 parts by weight, preferably 2 to 8 parts by weight with respect to 100 parts by weight of the inorganic compound source powder.
(封口材)
図1bに示される封口材70bは、チタン酸アルミニウム系セラミックスの粉末を含む。また、封口材70bは、柱状体70と同様に、上記の造孔剤、有機バインダ及び溶媒等を含有してもよい。これらの成分を所定の比率で混合することにより、ペースト状の封口材70bが得られる。なお、ハニカム構造体の製造過程で得られるセラミックスの屑やハニカム構造体の破損品等を粉砕して得たセラミックス粉末を、封口材70b用のセラミックス粉末として再利用しても良い。これにより、ハニカム構造体の原料コストが削減される。封口材70bは、柱状体70と同様にチタン酸アルミニウム系セラミックスの原料粉末(無機化合物源粉末)を含んでもよく、含まなくてもよい。焼結に伴う封口材70bの収縮率を低減するためには、封口材70bがセラミックス粉末を含有し、セラミックスの原料粉末を含有しないことが好ましい。セラミックス粉末の平均粒径は、特に限定されないが、5〜50μm程度であればよい。なお、封口材70bの固液分離を防止するためには、封口材70bを粘調な液状とすることが好ましい。そのためには、封口材70bが含有するセラミックス粉末の質量と造孔剤の質量との合計を100質量部とするとき、封口材70b中のバインダの質量を0.3〜3質量部、潤滑剤の質量を3〜20質量部とし、封口材70bの粘度を20〜200Pa・sとすることが好ましい。
(Sealing material)
The sealing material 70b shown in FIG. 1b includes an aluminum titanate ceramic powder. Moreover, the sealing material 70b may contain the pore forming agent, the organic binder, the solvent, and the like, like the columnar body 70. By mixing these components at a predetermined ratio, a pasty sealing material 70b is obtained. It should be noted that ceramic powder obtained by pulverizing ceramic scraps or damaged honeycomb structure obtained in the manufacturing process of the honeycomb structure may be reused as ceramic powder for the sealing material 70b. Thereby, the raw material cost of the honeycomb structure is reduced. The sealing material 70 b may or may not contain the aluminum titanate ceramic raw material powder (inorganic compound source powder), like the columnar body 70. In order to reduce the shrinkage rate of the sealing material 70b that accompanies the sintering, it is preferable that the sealing material 70b contains ceramic powder and does not contain ceramic raw material powder. The average particle size of the ceramic powder is not particularly limited, but may be about 5 to 50 μm. In order to prevent solid-liquid separation of the sealing material 70b, it is preferable that the sealing material 70b is a viscous liquid. Therefore, when the total of the mass of the ceramic powder contained in the sealing material 70b and the mass of the pore-forming agent is 100 parts by mass, the mass of the binder in the sealing material 70b is 0.3 to 3 parts by mass, and the lubricant. Is preferably 3 to 20 parts by mass, and the viscosity of the sealing material 70b is preferably 20 to 200 Pa · s.
封口材70bの焼結時の収縮率Rc1は、隔壁70cの焼結時の収縮率Rc2に対して、80〜100%である。なお、Rc1は、例えば下記式(1)から算出すればよい。Rc2は、例えば下記式(2)から算出すればよい。Rc1,Rc2の算出では、グリーン成形体100のセル数に応じて複数の箇所で封口材70b及び隔壁70cそれぞれの収縮率を測定し、その測定値を平均化してもよい。
Rc1=(S1−S2)/S1 (1)
Rc2=(T1−T2)/T1 (2)
The shrinkage rate Rc1 during sintering of the sealing material 70b is 80 to 100% with respect to the shrinkage rate Rc2 during sintering of the partition wall 70c. In addition, Rc1 may be calculated from the following formula (1), for example. Rc2 may be calculated from the following formula (2), for example. In the calculation of Rc1 and Rc2, the shrinkage rates of the sealing material 70b and the partition wall 70c may be measured at a plurality of locations according to the number of cells of the green molded body 100, and the measured values may be averaged.
Rc1 = (S1-S2) / S1 (1)
Rc2 = (T1-T2) / T1 (2)
式(1)中、S1は、柱状体70の貫通孔70aの端部に充填された封口材70bの大きさである。換言すれば、S1は隔壁70cの壁面に垂直な方向における封口材70bの寸法である。よってS1は焼成工程前の貫通孔70aの内径に略等しい。S2は、焼成工程後に得られるハニカム構造体170の貫通孔70aを塞ぐ封口部170b(焼成工程後の封口材70b)の大きさである。換言すれば、S2は焼成後の隔壁70cの壁面に垂直な方向における封口部170bの寸法である。式(2)中、T1は、焼成工程前のグリーン成形体100の隔壁70cの厚さである。式(2)中、T2は、焼成工程後に得られるハニカム構造体170の隔壁の厚さである。S1,S2,T1,T2は、例えば以下の方法で測定すればよい。まず、焼成工程前のグリーン成形体100の端面側から任意に測定用のサンプルを切り出す。このサンプルは、セル(貫通孔70a)及びセルを囲う隔壁70c、及びセルを塞ぐ封口部170bを備えるものである。このサンプルにおいてセルを囲う隔壁70aのうち対向する2箇所を剥ぎ落とす。次に、サンプルに残存する隔壁70cの厚みをT1として測定する。また、当該隔壁70cの壁面に対して垂直な方向における封口部170bの最大径をS1として測定する。S1,T1の測定後、サンプルを焼成する。焼成後の隔壁70cの厚みをT2として測定する。当該隔壁70cの壁面に対して垂直な方向における封口部170b(焼成後の封口材70b)の最大径をS2として測定する。S1,S2,T1,T2の測定には、例えば、光学顕微鏡(キーエンス社製、VHX-1000デジタルマイクロスコープ)を使用すればよい。 In Formula (1), S1 is the magnitude | size of the sealing material 70b with which the edge part of the through-hole 70a of the columnar body 70 was filled. In other words, S1 is the dimension of the sealing material 70b in the direction perpendicular to the wall surface of the partition wall 70c. Therefore, S1 is substantially equal to the inner diameter of the through hole 70a before the firing step. S2 is the size of the sealing portion 170b (sealing material 70b after the firing step) that closes the through hole 70a of the honeycomb structure 170 obtained after the firing step. In other words, S2 is the dimension of the sealing portion 170b in the direction perpendicular to the wall surface of the partition wall 70c after firing. In Formula (2), T1 is the thickness of the partition 70c of the green molded object 100 before a baking process. In formula (2), T2 is the thickness of the partition walls of the honeycomb structure 170 obtained after the firing step. S1, S2, T1, and T2 may be measured by the following method, for example. First, a sample for measurement is arbitrarily cut out from the end face side of the green molded body 100 before the firing step. This sample includes a cell (through hole 70a), a partition wall 70c surrounding the cell, and a sealing portion 170b for closing the cell. In this sample, two opposing portions of the partition wall 70a surrounding the cell are peeled off. Next, the thickness of the partition wall 70c remaining in the sample is measured as T1. Further, the maximum diameter of the sealing portion 170b in the direction perpendicular to the wall surface of the partition wall 70c is measured as S1. After the measurement of S1 and T1, the sample is baked. The thickness of the partition wall 70c after firing is measured as T2. The maximum diameter of the sealing portion 170b (sealing material 70b after firing) in the direction perpendicular to the wall surface of the partition wall 70c is measured as S2. For the measurement of S1, S2, T1, and T2, for example, an optical microscope (manufactured by Keyence Corporation, VHX-1000 digital microscope) may be used.
封口材70bの焼結時の収縮率Rc1が、隔壁70cの焼結時の収縮率Rc2に対して、80%未満である場合、隔壁70cが封口部170bに押されるように変形することが問題となる。またRc1がRc2に対して80%未満である場合、封口部170bの周囲の隔壁70cの一部に亀裂が生じることが問題となる。Rc1がRc2に対して100%を超える場合、封口材70bの焼結時の収縮率が柱状体70の収縮率よりも大きくなり、焼結後の封口部170と隔壁との間に隙間が生じる。 When the shrinkage ratio Rc1 during sintering of the sealing material 70b is less than 80% with respect to the shrinkage ratio Rc2 during sintering of the partition wall 70c, the partition wall 70c is deformed so as to be pushed by the sealing portion 170b. It becomes. Further, when Rc1 is less than 80% with respect to Rc2, there is a problem that a part of the partition wall 70c around the sealing portion 170b is cracked. When Rc1 exceeds 100% with respect to Rc2, the shrinkage rate during sintering of the sealing material 70b becomes larger than the shrinkage rate of the columnar body 70, and a gap is generated between the sealed sealing portion 170 and the partition wall. .
Rc1をRc2に対して80〜100%とするためには、封口材70b中のセラミックスの含有率を柱状体70(隔壁70c)よりも高くすれば良い。具体的には、封口材70b中のセラミックスの含有率は、封口材70b全体を100質量部としたとき、60〜100質量部程度であることが好ましく、75〜95質量部程度であることがより好ましい。柱状体70(隔壁70c)中のセラミックスの含有率は、所望のRc2に応じて適宜この数値範囲よりも小さい値に調整すればよい。封口材70b中のセラミックスの含有量が小さ過ぎる場合、Rc1が大きくなり過ぎて、封口部170と隔壁との密着性・焼結性が低下する傾向がある。 In order to set Rc1 to 80 to 100% with respect to Rc2, the ceramic content in the sealing material 70b may be higher than that of the columnar body 70 (partition wall 70c). Specifically, the content of the ceramic in the sealing material 70b is preferably about 60 to 100 parts by mass and about 75 to 95 parts by mass when the entire sealing material 70b is 100 parts by mass. More preferred. What is necessary is just to adjust the content rate of the ceramic in the columnar body 70 (partition 70c) to a value smaller than this numerical range suitably according to desired Rc2. When the content of ceramics in the sealing material 70b is too small, Rc1 becomes too large, and the adhesion / sinterability between the sealing portion 170 and the partition walls tends to decrease.
また、Rc1をRc2に対して80〜100%とするためには、封口材70b中のセラミックスの原料粉末の含有率を柱状体70(隔壁70c)よりも低くすれば良い。具体的には、封口材70b中のセラミックスの原料粉末の含有率は、セラミックスの原料粉末とセラミックス粉末と造孔剤との合計100質量部に対して0〜40質量部であることが好ましい。柱状体70(隔壁70c)中のセラミックスの原料粉末の含有率は、所望のRc2に応じて適宜この数値範囲よりも大きい値に調整すればよい。封口材70b中のセラミックスの原料粉末の含有量が大き過ぎる場合、Rc1が大きくなり過ぎて、封口部170と隔壁との密着性が低下する傾向がある。 Further, in order to set Rc1 to 80 to 100% with respect to Rc2, the content of the ceramic raw material powder in the sealing material 70b may be lower than that of the columnar body 70 (partition wall 70c). Specifically, the content of the ceramic raw material powder in the sealing material 70b is preferably 0 to 40 parts by mass with respect to 100 parts by mass in total of the ceramic raw material powder, the ceramic powder, and the pore former. What is necessary is just to adjust the content rate of the raw material powder of the ceramic in the columnar body 70 (partition 70c) to a value larger than this numerical range suitably according to desired Rc2. When the content of the ceramic raw material powder in the sealing material 70b is too large, Rc1 becomes too large, and the adhesion between the sealing portion 170 and the partition walls tends to decrease.
Rc1をRc2に対して80〜100%とするためには、封口材70b中の造孔剤の含有率を柱状体70(隔壁70c)よりも小さくすれば良い。具体的には、封口材70b中の造孔剤の含有率は、セラミックスの原料粉末とセラミックス粉末と造孔剤との合計100質量部に対して0〜6質量部であることが好ましい。柱状体70(隔壁70c)中の造孔剤の含有率は、所望のRc2に応じて適宜この数値範囲よりも大きい値に調整すればよい。封口材70b中の造孔剤の含有量が小さ過ぎる場合、Rc2がRc1よりも大きくなり過ぎて隔壁70cが封口部70bを圧縮し、隔壁70が変形する傾向がある。封口材70b中の造孔剤の含有量が大き過ぎる場合、Rc1が大きくなり過ぎて、封口部170と隔壁との密着性・焼結性が低下する傾向がある。このように、造孔剤は、気孔を形成し、封口材70bと隔壁70cの収縮率を合わせるための緩衝材として機能する。 In order to make Rc1 80 to 100% with respect to Rc2, the content of the pore former in the sealing material 70b may be made smaller than that of the columnar body 70 (partition wall 70c). Specifically, the content of the pore former in the sealing material 70b is preferably 0 to 6 parts by mass with respect to a total of 100 parts by mass of the ceramic raw material powder, the ceramic powder, and the pore former. What is necessary is just to adjust the content rate of the pore making material in the columnar body 70 (partition 70c) to a value larger than this numerical range suitably according to desired Rc2. When the content of the pore-forming agent in the sealing material 70b is too small, Rc2 becomes too larger than Rc1, and the partition wall 70c compresses the sealing portion 70b, and the partition wall 70 tends to be deformed. When the content of the pore-forming agent in the sealing material 70b is too large, Rc1 becomes too large, and the adhesion / sinterability between the sealing portion 170 and the partition walls tends to decrease. Thus, the pore-forming agent functions as a cushioning material for forming pores and matching the shrinkage rates of the sealing material 70b and the partition wall 70c.
<ハニカム構造体>
上記のグリーン成形体100を焼成することにより、柱状体70及び封口部70bが含むセラミックス粉末やセラミックスの原料粉末が焼結する。封口材70bは隔壁70aと焼結し、一体化して、封口部170bを形成する。その結果、図2(a)及び2(b)に示すように、多孔質のチタン酸アルミニウム系セラミックスからなるハニカム構造体170(多セル型セラミックモノリス)が得られる。ハニカム構造体170は、X線回折スペクトルにおいて、チタン酸アルミニウム(Al2TiO5)又はチタン酸アルミニウムマグネシウム(Al2(1−x)MgxTi(1+x)O5)の結晶パターンのほか、アルミナ、チタニアなどの結晶パターンを含んでいてもよい。ハニカム構造体170はケイ素を含有してもよい。ハニカム構造体170はグリーン成形体100と同様の構造を有し、DPFに好適である。
<Honeycomb structure>
By firing the green molded body 100, the ceramic powder and the ceramic raw material powder included in the columnar body 70 and the sealing portion 70b are sintered. The sealing material 70b is sintered and integrated with the partition wall 70a to form the sealing portion 170b. As a result, as shown in FIGS. 2A and 2B, a honeycomb structure 170 (multi-cell ceramic monolith) made of porous aluminum titanate-based ceramics is obtained. In addition to the crystal pattern of aluminum titanate (Al 2 TiO 5 ) or aluminum magnesium titanate (Al 2 (1-x) Mg x Ti (1 + x) O 5 ), the honeycomb structure 170 has alumina in the X-ray diffraction spectrum. In addition, a crystal pattern such as titania may be included. The honeycomb structure 170 may contain silicon. The honeycomb structure 170 has the same structure as the green molded body 100 and is suitable for the DPF.
特に、チタン酸アルミニウムマグネシウム焼結体からなるDPFは、SiC、コージェライト又はチタン酸アルミニウム単体からなるDPFに比べて、熱膨張係数が極めて小さく、融点が高く、再生時の耐熱衝撃性に優れ、煤の限界堆積量が大きい点において優れている。DPF用のハニカム構造体170の隔壁表面に、アルミナ等の担体に担持された白金系金属触媒や、セリア又はジルコニア等の助触媒を付着させてもよい。 In particular, DPF made of aluminum magnesium titanate sintered body has an extremely small coefficient of thermal expansion, a high melting point, and excellent thermal shock resistance during reproduction, compared to DPF made of SiC, cordierite or aluminum titanate alone. It is excellent in that the limit accumulation amount of soot is large. A platinum-based metal catalyst supported on a carrier such as alumina or a promoter such as ceria or zirconia may be attached to the partition wall surface of the honeycomb structure 170 for DPF.
チタン酸アルミニウム系セラミックスにおけるアルミニウムの含有率は、特に限定されないが、例えば、酸化アルミニウム換算で40〜60モル%である。チタン酸アルミニウム系セラミックスにおけるチタンの含有率は、特に限定されないが、例えば、酸化チタン換算で35〜55モル%である。チタン酸アルミニウム系セラミックスにおけるマグネシウムの含有率は酸化マグネシウム換算で1〜5質量%であることが好ましい。チタン酸アルミニウム系セラミックスにおけるケイ素の含有率は酸化ケイ素換算で2〜5質量%であることが好ましい。なお、チタン酸アルミニウム系セラミックスの組成は、原料混合物の組成により適宜調整すればよい。チタン酸アルミニウム系セラミックスは、上記の成分以外に、原料に由来する成分又は製造工程において不可避的に仕掛品に混入する微量の成分を含有し得る。 Although the aluminum content rate in an aluminum titanate ceramic is not specifically limited, For example, it is 40-60 mol% in conversion of aluminum oxide. The titanium content in the aluminum titanate-based ceramics is not particularly limited, but is, for example, 35 to 55 mol% in terms of titanium oxide. The magnesium content in the aluminum titanate-based ceramics is preferably 1 to 5% by mass in terms of magnesium oxide. The silicon content in the aluminum titanate-based ceramics is preferably 2 to 5% by mass in terms of silicon oxide. In addition, what is necessary is just to adjust suitably the composition of aluminum titanate ceramics with the composition of a raw material mixture. In addition to the above components, the aluminum titanate-based ceramics can contain components derived from raw materials or trace components that are inevitably mixed into work-in-process in the manufacturing process.
貫通孔70aの長手方向に垂直な断面の内径(正方形の一辺の長さ)は特に限定されないが、例えば0.8〜2.5mmである。貫通孔70aが延びる方向におけるハニカム構造体170の長さは特に限定されないが、例えば40〜350mmである。また、ハニカム構造体170の外径も特に限定されないが、例えば10〜320mmである。貫通孔70aが延びる方向における封口部170bの長さは特に限定されないが、例えば1〜20mmである。ハニカム構造体170の端面に開いている貫通孔70aの数(セル密度)は特に限定されないが、例えば150〜450cpsiである。cpsiとの単位は「/inch2」を意味し、「/(0.0254m)2」に等しい。貫通孔70aの隔壁の厚さは特に限定されないが、例えば0.15〜0.76mmである。ハニカム構造体170の有効気孔率は30〜60体積%程度である。ハニカム構造体170に形成された細孔の平均直径は1〜20μm程度である。細孔径分布(D90−D10)/D50は0.5未満程度である。なお、D10、D50、D90は、全細孔容積のうち累積細孔容積が各々10%、50%、90%になるときの細孔直径である。 The inner diameter (the length of one side of the square) of the cross section perpendicular to the longitudinal direction of the through hole 70a is not particularly limited, and is, for example, 0.8 to 2.5 mm. The length of the honeycomb structure 170 in the direction in which the through hole 70a extends is not particularly limited, and is, for example, 40 to 350 mm. Further, the outer diameter of the honeycomb structure 170 is not particularly limited, but is, for example, 10 to 320 mm. Although the length of the sealing part 170b in the direction where the through-hole 70a is extended is not specifically limited, For example, it is 1-20 mm. The number (cell density) of the through holes 70a opened in the end face of the honeycomb structure 170 is not particularly limited, and is, for example, 150 to 450 cpsi. The unit of cpsi means “/ inch 2 ” and is equal to “/(0.0254m) 2 ”. Although the thickness of the partition of the through-hole 70a is not specifically limited, For example, it is 0.15-0.76 mm. The effective porosity of the honeycomb structure 170 is about 30 to 60% by volume. The average diameter of the pores formed in the honeycomb structure 170 is about 1 to 20 μm. The pore size distribution (D 90 -D 10 ) / D 50 is about less than 0.5. D 10 , D 50 , and D 90 are pore diameters when the cumulative pore volume is 10%, 50%, and 90% of the total pore volume, respectively.
<グリーン成形体の製造方法>
(原料混合物の調製工程及び成形工程)
柱状体70を形成するために、無機化合物源粉末、造孔剤、有機バインダ及び溶媒等を混練機等により混合して原料混合物を調製する。格子状の開口を有するダイを備える押出成形機を用いて、原料混合物を成形することにより、柱状体70を形成する。なお、押出成形前の原料混合物を混練してもよい。
<Method for producing green molded body>
(Raw material mixture preparation process and molding process)
In order to form the columnar body 70, a raw material mixture is prepared by mixing an inorganic compound source powder, a pore former, an organic binder, a solvent, and the like with a kneader or the like. The columnar body 70 is formed by molding the raw material mixture using an extruder having a die having a grid-like opening. In addition, you may knead | mix the raw material mixture before extrusion molding.
(封口材の調製工程)
柱状体70用の原料混合物と同様の方法で、封口材を調製する。ただし、封口材中のセチタン酸アルミニウム系セラミックス、原料粉末及び造孔剤の含有率は、上記のように、Rc1をRc2に対して80〜100%とするために適した値に調整する。
(Sealing material preparation process)
A sealing material is prepared in the same manner as the raw material mixture for the columnar body 70. However, the content rates of the aluminum cetitanate ceramics, the raw material powder, and the pore former in the sealing material are adjusted to values suitable for setting Rc1 to 80 to 100% with respect to Rc2, as described above.
(封口工程)
封口工程では、柱状体70において複数の貫通孔70aが開いている第一端面に第一マスクを貼り付ける。第一マスクでは、貫通孔70aと略同様の寸法を有するマスク部と複数の開口部とが千鳥状に配置されている。各貫通孔70aと各マスク部及び開口部とが重なるように、柱状体70の第一端面に第一マスクを貼り付ける。また、柱状体70において第一端面とは反対側の第二端面に、第二マスクを貼り付ける。第二マスクが有する開口部とマスク部の配置関係は第一マスクとは真逆である。したがって、第一端面側で第一マスクのマスク部に塞がれた貫通孔70aは、第二端面側で第二マスクの開口部と重なる。第二端面側で第二マスクのマスク部に塞がれた貫通孔70aは、第一端面側で第一マスクの開口部と重なる。したがって、柱状体70に形成された複数の貫通孔70aのいずれも、第一端面又は第二端面のいずれか一方において開き、他方においてマスク部で塞がれる。
(Sealing process)
In the sealing step, the first mask is attached to the first end surface of the columnar body 70 where the plurality of through holes 70a are open. In the first mask, a mask portion having substantially the same dimensions as the through hole 70a and a plurality of openings are arranged in a staggered manner. A first mask is affixed to the first end surface of the columnar body 70 so that each through-hole 70a overlaps each mask portion and opening. A second mask is attached to the second end surface of the columnar body 70 opposite to the first end surface. The arrangement relationship between the opening and the mask portion of the second mask is opposite to that of the first mask. Therefore, the through hole 70a closed by the mask portion of the first mask on the first end surface side overlaps the opening portion of the second mask on the second end surface side. The through hole 70a closed by the mask portion of the second mask on the second end surface side overlaps with the opening portion of the first mask on the first end surface side. Therefore, all of the plurality of through holes 70a formed in the columnar body 70 are opened at one of the first end surface and the second end surface, and are closed by the mask portion at the other.
第一端面に対する封口工程では、第一マスクの開口部と重なる各貫通孔70aの端部内に上記の封口材を導入する。なお、貫通孔70aに封口材を導入した後、柱状体70全体を振動器により振動させてもよい。これにより、貫通孔70aの端部の隙間に隈なく封口材が充填され易くなる。 In the sealing step for the first end surface, the sealing material is introduced into the end portion of each through-hole 70a that overlaps the opening of the first mask. In addition, after introducing the sealing material into the through hole 70a, the entire columnar body 70 may be vibrated by a vibrator. As a result, the sealing material is easily filled in the gaps at the end portions of the through holes 70a.
以上の第一端面に対する封口工程後、第一端面に対する封口工程と同様に、第二マスクが貼られた第二端面に対する封口工程を実施する。両端面に封口工程を施した後に、各端面から各マスクを剥がす。これにより、図1(a),1(b)に示すグリーン成形体100が完成する。 After the above sealing step for the first end surface, the sealing step for the second end surface to which the second mask is attached is performed in the same manner as the sealing step for the first end surface. After performing the sealing step on both end faces, each mask is peeled off from each end face. Thereby, the green molded object 100 shown to FIG. 1 (a), 1 (b) is completed.
<ハニカム構造体の製造方法>
上記の方法により作製したグリーン成形体100を仮焼(脱脂)し、且つ焼成することにより、図2(a),2(b)に示すハニカム構造体170を得ることができる。ハニカム構造体170は、押出成形直後のグリーン成形体100の形状をほぼ維持する。
<Manufacturing method of honeycomb structure>
The green molded body 100 produced by the above method is calcined (degreasing) and fired, whereby a honeycomb structure 170 shown in FIGS. 2A and 2B can be obtained. The honeycomb structure 170 substantially maintains the shape of the green molded body 100 immediately after extrusion molding.
仮焼(脱脂)は、グリーン成形体100中の有機バインダや、必要に応じて配合される有機添加物を、焼失、分解等により除去するための工程である。典型的な仮焼工程は、焼成工程の初期段階、すなわちグリーン成形体100が焼成温度に至るまでの昇温段階(例えば、300〜900℃の温度範囲)に相当する。仮焼(脱脂)工程おいては、昇温速度を極力おさえることが好ましい。 The calcination (degreasing) is a process for removing the organic binder in the green molded body 100 and the organic additive blended as necessary by burning or decomposing. A typical calcination process corresponds to an initial stage of the firing process, that is, a temperature raising stage (for example, a temperature range of 300 to 900 ° C.) until the green molded body 100 reaches the firing temperature. In the calcination (degreasing) step, it is preferable to suppress the temperature increase rate as much as possible.
グリーン成形体100の焼成温度は、通常、1300℃以上、好ましくは1400℃以上である。また、焼成温度は、通常、1650℃以下、好ましくは1550℃以下である。この温度範囲でグリーン成形体100を加熱することにより、グリーン成形体100中の無機化合物源粉末やセラミックス粉末が確実に焼結する。焼成温度までの昇温速度は特に限定されるものではないが、通常、1℃/時間〜500℃/時間である。 The firing temperature of the green molded body 100 is usually 1300 ° C. or higher, preferably 1400 ° C. or higher. The firing temperature is usually 1650 ° C. or lower, preferably 1550 ° C. or lower. By heating the green molded body 100 in this temperature range, the inorganic compound source powder and the ceramic powder in the green molded body 100 are surely sintered. The rate of temperature increase up to the firing temperature is not particularly limited, but is usually 1 ° C./hour to 500 ° C./hour.
焼成は通常、大気中で行なわれるが、用いる原料粉末、すなわちアルミニウム源粉末、チタニウム源粉末、マグネシウム源粉末およびケイ素源粉末の種類や使用量比によっては、窒素ガス、アルゴンガスなどの不活性ガス中で焼成してもよいし、一酸化炭素ガス、水素ガスなどのような還元性ガス中で焼成してもよい。また、水蒸気分圧を低くした雰囲気中で焼成を行なってもよい。 Firing is usually performed in the atmosphere, but depending on the type and usage ratio of the raw material powder used, that is, aluminum source powder, titanium source powder, magnesium source powder and silicon source powder, an inert gas such as nitrogen gas or argon gas. The firing may be performed in a reducing gas such as carbon monoxide gas or hydrogen gas. Further, the firing may be performed in an atmosphere in which the water vapor partial pressure is lowered.
焼成は、通常、管状電気炉、箱型電気炉、トンネル炉、遠赤外線炉、マイクロ波加熱炉、シャフト炉、反射炉、ロータリー炉、ローラーハース炉などの通常の焼成炉を用いて行なわれる。焼成は回分式で行なってもよいし、連続式で行なってもよい。また、静置式で行なってもよいし、流動式で行なってもよい。 Firing is usually performed using a conventional firing furnace such as a tubular electric furnace, a box-type electric furnace, a tunnel furnace, a far-infrared furnace, a microwave heating furnace, a shaft furnace, a reflection furnace, a rotary furnace, or a roller hearth furnace. Firing may be performed batchwise or continuously. Moreover, you may carry out by a stationary type and may carry out by a fluid type.
焼成に要する時間は、グリーン成形体100がチタン酸アルミニウム系結晶に遷移するのに十分な時間であればよく、グリーン成形体100の量、焼成炉の形式、焼成温度、焼成雰囲気などにより異なるが、通常は10分〜24時間である。 The time required for firing is sufficient as long as the green molded body 100 transitions to the aluminum titanate-based crystal, and varies depending on the amount of the green molded body 100, the type of firing furnace, the firing temperature, the firing atmosphere, and the like. Usually, it is 10 minutes to 24 hours.
なお、グリーン成形体100の仮焼と焼成を個別に行ってもよく、連続して行ってもよい。仮焼工程では、有機バインダその他の有機添加物の熱分解温度以上であり無機化合物源粉末の焼結温度よりも低い温度でグリーン成形体100を加熱すればよい。焼成工程では、仮焼工程後のグリーン成形体100を無機化合物源粉末の焼結温度以上の温度で加熱すればよい。 Note that the green molded body 100 may be calcined and fired individually or continuously. In the calcination step, the green molded body 100 may be heated at a temperature equal to or higher than the thermal decomposition temperature of the organic binder and other organic additives and lower than the sintering temperature of the inorganic compound source powder. In the firing step, the green molded body 100 after the calcination step may be heated at a temperature equal to or higher than the sintering temperature of the inorganic compound source powder.
以上、本発明の好適な一実施形態について詳細に説明したが、本発明は上記実施形態に限定されるものではない。 As mentioned above, although one suitable embodiment of the present invention was described in detail, the present invention is not limited to the above-mentioned embodiment.
例えば、柱状体70や封口材70bは、チタン酸アルミニウム系セラミックスの代わりにコージェライト系セラミックスやシリコンカーバイド等のセラミックスを含んでもよい。また柱状体70や封口材70bは、これらセラミックスの原料粉末を含んでもよい。コージェライト系セラミックスの原料粉末としては、上述したアルミニウム源粉末、シリカ源粉末及びマグネシウム源粉末を用いればよい。ハニカム構造体170の形状は円柱に限定されず、用途に応じて任意の形状をとることができる。例えば、ハニカム構造体170の形状が、多角柱や楕円柱等であってもよい。 For example, the columnar body 70 and the sealing material 70b may include ceramics such as cordierite ceramics and silicon carbide instead of aluminum titanate ceramics. Further, the columnar body 70 and the sealing material 70b may include these ceramic raw material powders. As the raw material powder for cordierite-based ceramics, the above-described aluminum source powder, silica source powder and magnesium source powder may be used. The shape of the honeycomb structure 170 is not limited to a cylinder, and can take any shape depending on the application. For example, the shape of the honeycomb structure 170 may be a polygonal column, an elliptical column, or the like.
ハニカム構造体の用途はDPFに限定されない。ハニカム構造体は、ガソリンエンジンなどの内燃機関の排気ガス浄化に用いられる排ガスフィルター又は触媒担体、ビールなどの飲食物の濾過に用いる濾過フィルター、石油精製時に生じるガス成分(例えば一酸化炭素、二酸化炭素、窒素、酸素等)を選択的に透過させるための選択透過フィルターなどのセラミックスフィルターなどに好適に適用することができる。なかでも、セラミックスフィルターなどとして用いる場合、チタン酸アルミニウム系セラミックスは、高い細孔容積および開気孔率を有することから、良好なフィルター性能を長期にわたって維持することができる。 The use of the honeycomb structure is not limited to DPF. The honeycomb structure includes an exhaust gas filter or catalyst carrier used for exhaust gas purification of an internal combustion engine such as a gasoline engine, a filter used for filtering food and drink such as beer, and gas components (for example, carbon monoxide, carbon dioxide, etc.) generated during petroleum refining. , Nitrogen, oxygen, etc.) can be suitably applied to ceramic filters such as a selective permeation filter. In particular, when used as a ceramic filter or the like, aluminum titanate-based ceramics have a high pore volume and an open porosity, so that good filter performance can be maintained over a long period of time.
以下、本発明を実施例により更に詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention still in detail, this invention is not limited to these Examples.
(実施例1)
柱状体を形成するために、チタン酸アルミニウムマグネシウムの原料粉末(Al2O3,TiO2,MgO)、SiO2、チタン酸アルミニウムマグネシウムとアルミナとアルミノシリケートガラスとの複合相をもつセラミックス粉末(仕込み時の組成式:41.4Al2O3−49.9TiO2−5.4MgO−3.3SiO2、式中の数値はモル比を表す。)、有機バインダ、潤滑剤、造孔剤、可塑剤、分散剤及び水(溶媒)を含む原料混合物を調製した。原料混合物中の各成分の含有量は下記の値に調整した。
Al2O3:37.3質量部。
TiO2:37.0質量部。
MgO:1.9質量部。
SiO2:3.0質量部。
セラミックス粉末:8.8質量部。
造孔剤:馬鈴薯から得た平均粒径25μmの澱粉12.0質量部。
有機バインダ:7.8質量部。
可塑剤:0.4質量部。
分散剤:4.6質量部。
水:28.3質量部。
Example 1
In order to form a columnar body, a raw material powder of aluminum magnesium titanate (Al 2 O 3 , TiO 2 , MgO), a ceramic powder having a composite phase of SiO 2 , aluminum magnesium titanate, alumina and aluminosilicate glass (preparation) Composition formula at the time: 41.4 Al 2 O 3 -49.9 TiO 2 -5.4 MgO-3.3SiO 2 , the numerical values in the formula represent molar ratios.), Organic binder, lubricant, pore former, plasticizer A raw material mixture containing a dispersant and water (solvent) was prepared. The content of each component in the raw material mixture was adjusted to the following values.
Al 2 O 3: 37.3 parts by weight.
TiO 2 : 37.0 parts by mass.
MgO: 1.9 parts by mass.
SiO 2 : 3.0 parts by mass.
Ceramic powder: 8.8 parts by mass.
Pore-forming agent: 12.0 parts by mass of starch having an average particle size of 25 μm obtained from potato.
Organic binder: 7.8 parts by mass.
Plasticizer: 0.4 parts by mass.
Dispersant: 4.6 parts by mass.
Water: 28.3 parts by mass.
上記の原料混合物を混練して、正六角形を囲むように変形した六つの六角形を単位とする格子状の開口を作製するためのダイを用いて押出成形することにより、互いに略平行な複数の貫通孔が形成された円柱(柱状体)を作製した。柱状体に形成された正六角形状の貫通孔の一辺の長さは0.8mmであった。柱状体の端面に開いている貫通孔の数(セル密度)は、0.4/mm2であった。貫通孔が延びる方向における柱状体の長さは171mmであった。また、柱状体の端面の外径は162mmであった。 The raw material mixture is kneaded and extruded using a die for producing a lattice-shaped opening having six hexagons deformed so as to surround a regular hexagon. A cylinder (columnar body) in which a through hole was formed was produced. The length of one side of the regular hexagonal through-hole formed in the columnar body was 0.8 mm. The number of through holes (cell density) opened in the end face of the columnar body was 0.4 / mm 2 . The length of the columnar body in the direction in which the through hole extends was 171 mm. Moreover, the outer diameter of the end surface of the columnar body was 162 mm.
セラミックス粉末、造孔剤、有機バインダ、潤滑剤及び溶媒を混合して、実施例1の封口材70bを調製した。セラミックス粉末としては、ハニカム構造体の製造過程で得られた屑や不良品を粉砕することにより調整した粉末を再利用した。このセラミックス粉末は、チタン酸アルミニウムマグネシウムとアルミナとアルミノシリケートガラスとの複合相をもつ粉末(仕込み時の組成式:41.4Al2O3−49.9TiO2−5.4MgO−3.3SiO2、式中の数値はモル比を表す。)であった。セラミックス粉末の平均粒径は22μmに調整した。造孔剤としては、馬鈴薯から得た平均粒径44μmの澱粉を用いた。有機バインダとしては、ヒドロキシプロピルメチルセルロース(三星精密化学社製:PMB−15UFF)を用いた。潤滑剤としてはグリセリンを用いた。溶媒としては水を用いた。封口材中のセラミックス粉末、造孔剤、有機バインダ、潤滑剤及び溶媒の配合比は、表1に示す値に調整した。 The sealing material 70b of Example 1 was prepared by mixing ceramic powder, a pore former, an organic binder, a lubricant, and a solvent. As the ceramic powder, powder prepared by pulverizing scraps and defective products obtained in the manufacturing process of the honeycomb structure was reused. This ceramic powder is a powder having a composite phase of aluminum magnesium titanate, alumina, and aluminosilicate glass (composition formula at the time of preparation: 41.4 Al 2 O 3 -49.9 TiO 2 -5.4 MgO-3.3SiO 2 , The numerical value in the formula represents the molar ratio.). The average particle size of the ceramic powder was adjusted to 22 μm. As the pore-forming agent, starch having an average particle size of 44 μm obtained from potato was used. As the organic binder, hydroxypropylmethylcellulose (manufactured by Samsung Precision Chemical Co., Ltd .: PMB-15UFF) was used. Glycerin was used as the lubricant. Water was used as the solvent. The compounding ratio of the ceramic powder, pore former, organic binder, lubricant and solvent in the sealing material was adjusted to the values shown in Table 1.
封口材を用いて柱状体の第一端面の封口工程を実施した後、第二端面に対する封口工程を実施した。これにより、複数の貫通孔のうち一部の貫通孔が柱状体の第一端面において封口材で塞がれ、第二端面において開き、他の貫通孔は、第二端面において封口材で塞がれ、第一端面において開いており、封口材で塞がれた貫通孔の端部と開いた貫通孔の端部とが各端面において格子状に交互に配置されている実施例1のグリーン成形体を得た。 After performing the sealing process of the 1st end surface of a columnar body using the sealing material, the sealing process with respect to the 2nd end surface was implemented. Thereby, some through-holes of the plurality of through-holes are blocked by the sealing material at the first end surface of the columnar body, open at the second end surface, and the other through-holes are blocked by the sealing material at the second end surface. The green molding of Example 1 is open at the first end face, and the end portions of the through holes closed by the sealing material and the end portions of the open through holes are alternately arranged in a lattice pattern on each end face Got the body.
グリーン成形体を乾燥させ、1530℃で5時間焼成することにより、多孔質のチタン酸アルミニウムマグネシウムの焼結体からなる実施例1のハニカム構造体を得た。 The green molded body was dried and fired at 1530 ° C. for 5 hours to obtain a honeycomb structure of Example 1 made of a sintered body of porous aluminum magnesium titanate.
(実施例2〜6)
封口材中のセラミックス粉末、造孔剤、有機バインダ、潤滑剤及び溶媒の配合比を表1に示す値に調整したこと以外は、実施例1と同様に、実施例2〜6のハニカム構造体をそれぞれ作製した。
(Examples 2 to 6)
The honeycomb structures of Examples 2 to 6 are the same as Example 1 except that the compounding ratio of the ceramic powder, pore former, organic binder, lubricant and solvent in the sealing material was adjusted to the values shown in Table 1. Were prepared.
実施例1〜6の封口材の焼結時の収縮率Rc1及び隔壁の焼結時の収縮率Rc2を求めた。各収縮率を表1に示す。なお、Rc1,Rc2の算出では、5箇所で測定した値を平均化した。 The shrinkage rate Rc1 during sintering of the sealing materials of Examples 1 to 6 and the shrinkage rate Rc2 during sintering of the partition walls were determined. Each shrinkage rate is shown in Table 1. In the calculation of Rc1 and Rc2, values measured at five locations were averaged.
実施例1,3,5の各ハニカム構造体の第一端面の写真を図3に示す。なお、図3(a)のU0918−Rは実施例1に対応する。図3(b)のU0920−Tは実施例3に対応する。図3(c)のU0922−Wは実施例5に対応する。 The photograph of the 1st end surface of each honeycomb structure of Example 1, 3, 5 is shown in FIG. U0918-R in FIG. 3A corresponds to the first embodiment. U0920-T in FIG. 3B corresponds to the third embodiment. U0922-W in FIG. 3C corresponds to the fifth embodiment.
実施例1〜6のハニカム構造体いずれにおいても、封口部と貫通孔の隔壁とが十分に焼結して、両者間に隙間がないことが確認された。 In any of the honeycomb structures of Examples 1 to 6, it was confirmed that the sealing portion and the partition wall of the through hole were sufficiently sintered and there was no gap between them.
本発明のグリーン成形体の一態様によれば、封口部と貫通孔の隔壁とが十分に焼結したハニカム構造体(例えばDPF)を高い生産性で製造することが可能となる。 According to one aspect of the green molded body of the present invention, a honeycomb structure (for example, DPF) in which the sealing portion and the partition wall of the through hole are sufficiently sintered can be manufactured with high productivity.
70・・・柱状体、70a・・・貫通孔、70b・・・封口材、70c・・・隔壁、100・・・グリーン成形体、170b・・・封口部、170・・・ハニカム構造体。 70 ... Columnar body, 70a ... Through hole, 70b ... Sealing material, 70c ... Partition, 100 ... Green molded body, 170b ... Sealing part, 170 ... Honeycomb structure.
Claims (1)
前記貫通孔の一方の端部を塞ぐ封口材と、
を備え、
前記複数の貫通孔のうち一部の前記貫通孔は、前記貫通孔に略直交する前記柱状体の第一端面及び第二端面のうち前記第一端面において前記封口材で塞がれ、前記第二端面において開き、
他の前記貫通孔は、前記第二端面において前記封口材で塞がれ、前記第一端面において開いており、
前記封口材がセラミックスを含み、
前記柱状体が前記セラミックスの原料粉末を含み、
前記セラミックスがチタン酸アルミニウム系セラミックス及び/又はコージェライト系セラミックスであり、
前記封口材の焼結時の収縮率が、前記隔壁の焼結時の収縮率に対して、80〜100%である、
グリーン成形体。 A plurality of through-holes substantially parallel to each other, and a honeycomb-like columnar body having partition walls separating the plurality of through-holes;
A sealing material for closing one end of the through hole;
With
Among the plurality of through-holes, some of the through-holes are blocked by the sealing material at the first end surface of the first end surface and the second end surface of the columnar body substantially orthogonal to the through-hole, Open at the two ends,
The other through hole is closed with the sealing material at the second end surface, and is open at the first end surface,
The sealing material includes ceramics;
The columnar body includes the ceramic raw material powder,
The ceramic is an aluminum titanate ceramic and / or cordierite ceramic,
The shrinkage rate during sintering of the sealing material is 80 to 100% with respect to the shrinkage rate during sintering of the partition walls.
Green molded body.
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JP2016500043A (en) * | 2012-08-30 | 2016-01-07 | コーニング インコーポレイテッド | Compositions and methods for filling honeycomb bodies with reduced plug depth variation |
US9981877B2 (en) | 2012-08-30 | 2018-05-29 | Corning Incorporated | Compositions and methods for plugging honeycomb bodies with reduced plug depth variability |
JP2021155236A (en) * | 2020-03-25 | 2021-10-07 | 日本碍子株式会社 | Manufacturing method of honeycomb structure containing silicon carbide |
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JP4019732B2 (en) * | 2001-03-26 | 2007-12-12 | 株式会社デンソー | Method for plugging ceramic honeycomb molded body |
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WO2008087783A1 (en) * | 2007-01-18 | 2008-07-24 | Ngk Insulators, Ltd. | Method for manufacturing sealed honeycomb structure |
JPWO2009122535A1 (en) * | 2008-03-31 | 2011-07-28 | イビデン株式会社 | Manufacturing method of honeycomb structure |
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JP2016500043A (en) * | 2012-08-30 | 2016-01-07 | コーニング インコーポレイテッド | Compositions and methods for filling honeycomb bodies with reduced plug depth variation |
US9981877B2 (en) | 2012-08-30 | 2018-05-29 | Corning Incorporated | Compositions and methods for plugging honeycomb bodies with reduced plug depth variability |
US10301220B2 (en) | 2012-08-30 | 2019-05-28 | Corning Incorporated | Compositions and methods for plugging honeycomb bodies with reduced plug depth variability |
US10730800B2 (en) | 2012-08-30 | 2020-08-04 | Corning Incorporated | Compositions and methods for plugging honeycomb bodies with reduced plug depth variability |
JP2021155236A (en) * | 2020-03-25 | 2021-10-07 | 日本碍子株式会社 | Manufacturing method of honeycomb structure containing silicon carbide |
JP7153684B2 (en) | 2020-03-25 | 2022-10-14 | 日本碍子株式会社 | Manufacturing method of honeycomb structure containing silicon carbide |
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