JP2012044145A - Shield member, component thereof, and substrate mounting stand equipped with shiel member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a shield member capable of preventing abnormal discharge and erosion from being generated in a lower electrode, with no gap generated between the shield member and the lower electrode even when the shield member is thermally expanded.SOLUTION: A ring component part is formed by an insulating long article disposed along one leg of a rectangular mounting face of the lower electrode, and has a fixing screw hole provided at one end in the lengthwise direction thereof and a supporting screw hole provided apart from the other in the lengthwise direction of the long article. Each of the ring component parts is combined with another so that an end face at one end of the each component part in the lengthwise direction abuts on a side face at one end of the adjacent component part in the lengthwise direction, and that the side face on the other end of the each component part abuts on the end face at one end of the ring component part different from the adjacent ring component part. One end of each of the ring component parts in the lengthwise direction is fixed to a base material of a mounting stand by the fixing screw hole, while the other end is supported in a freely displaceable manner by the supporting screw hole. Each of the component parts is arranged so as to be able to thermally expand or thermally shrink in the lengthwise direction of the long article with the fixed end as an origin, each corner portion of the lower electrode is beveled by a plane, and a triangular fitting member having a plane abutting on the beveled plane is disposed.

Description

  The present invention relates to a shield member applied to a substrate mounting table on which a substrate is mounted in a processing chamber of a substrate processing apparatus, a component thereof, and a substrate mounting table including the shield member.

  2. Description of the Related Art A substrate processing apparatus that performs plasma processing on various substrates such as a glass substrate in a manufacturing process of an FPD (Flat Panel Display) including a liquid crystal display (LCD) is known.

  In such a substrate processing apparatus, a substrate mounting table that supports a substrate in a processing chamber (hereinafter referred to as “chamber”), and an upper electrode disposed so as to face the substrate mounting table with a processing space therebetween. And applying a high frequency power (RF) for plasma generation to a substrate mounting table functioning as a lower electrode, introducing a processing gas into a processing space in the chamber to generate plasma, and using the generated plasma Then, a predetermined plasma treatment is performed on the substrate placed on the substrate placement surface of the substrate placement table.

The substrate mounting surface of the substrate mounting table has a rectangular shape, and a shield ring as a shield member is disposed on the outer periphery of the substrate mounting table in order to improve plasma focusing and ensure RF insulation. The shield ring is made of insulating ceramics such as alumina (Al ₂ O ₃ ), and is fixed to the base of the lower electrode with screws, for example. Since the shield ring is a rectangular annular body surrounding the periphery of the substrate mounting surface of the rectangular lower electrode, it is difficult to integrally form it, and the processing substrate has become larger due to recent industry demands. Therefore, it is usually formed by a combination of a plurality of constituent members.

  FIG. 12 is a diagram showing a configuration of a conventional shield ring.

  In FIG. 12, a shield ring 105 is disposed so as to surround the periphery of the rectangular substrate placement surface 106 of the lower electrode 100. The shield ring 105 is a combination of four ring components 101 to 104 that are substantially L-shaped in plan view. Each of the ring components 101 to 104 has screw holes 107 at two locations near the L-shaped corner and near the tip of the elongated portion connected to the corner. 101-104 are being fixed to the flange part which comprises the circumference | surroundings of the board | substrate mounting surface 106 of the lower electrode 100 with the fixing screw with which the screw hole 107 was mounted | worn.

  By the way, the shield ring 105 is heated by heat transfer from the lower electrode 100 heated according to the processing purpose, continuous irradiation of plasma, and the like, and is thermally expanded. At this time, a force that pushes the other is generated by expansion at the contact surface between adjacent ring components, and this causes displacement by, for example, the clearance between the screw hole 107 and the fixing screw (not shown). A gap may be generated between the shield ring 105 and the substrate processing surface 106.

  Further, since there is a difference in thermal expansion between the lower electrode 100 made of a metal such as aluminum and the shield ring 105 made of ceramics, the shield ring 105 and the lower part that have been continuously irradiated with plasma during plasma processing. A gap may be formed between the electrode 100 and the electrode 100.

  Furthermore, when the shield ring 105 is thermally contracted due to cooling after heating, each ring component does not return to the original arrangement state, and the shield ring 105 is deformed to create a gap between the ring components, whereby the shield A gap may also be generated between the ring 105 and the lower electrode 100.

  When a gap is generated between the shield ring 105 and the lower electrode 100, plasma enters the gap, and, for example, ceramic spraying of the lower electrode 100 is scraped to cause abnormal discharge (arcing) or erosion in the lower electrode 100. Cause.

  In order to prevent the occurrence of such a gap between the shield ring 105 and the lower electrode 100, a ring component provided with a biasing member that biases adjacent ring components, and each ring component There has been proposed a shield ring provided with a biasing member that biases the electrode toward the center of the lower electrode (see, for example, Patent Document 1).

JP 2008-311298 A

  However, it is not always easy to incorporate an urging member for applying an acting force acting in a specific direction to the ring component constituting the shield member. On the other hand, in order to prevent deformation due to thermal expansion, if the fastening force of the fixing screw that fixes the ring component to the base of the lower electrode is increased, the ring component will be removed when fastened to the lower electrode base or during thermal expansion. There is a problem of being easily damaged.

  An object of the present invention is to provide a shield member that can prevent the occurrence of abnormal discharge and erosion in the lower electrode without causing a gap between the lower electrode even if it is thermally expanded, and its component parts and shield member. It is to provide a substrate mounting table.

  In order to solve the above-mentioned problem, the component of the shield member according to claim 1 is a rectangular mounting surface of a mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus for performing plasma processing on the rectangular substrate. A component part of a shield member provided so as to surround the periphery, comprising a long insulating material disposed along one side of the rectangular mounting surface, and a length direction of the long material The fixing part is provided at one end of the long object, and the fixing part has at least one guide part that is provided apart from the long object in the length direction.

  The component part of the shield member according to claim 2 is the component part of the shield member according to claim 1, wherein one end is fixed to the base material of the mounting table by a fixing screw hole as the fixing part, An end is supported displaceably by a screw hole for support as the at least one guide portion, and can be thermally expanded or contracted along the length direction of the elongated object with the fixed end as a starting point. It is characterized by being.

  The component part of the shield member according to claim 3 is the component part of the shield member according to claim 2, wherein the fixing screw hole has a perfect circle shape on a plane having the fixing screw hole. The screw hole for support is an ellipse that is long in the length direction of the elongated object or a rectangle that is semicircular at both ends on a plane with the screw hole for support.

  The component part of the shield member according to claim 4 is the component part of the shield member according to any one of claims 1 to 3, wherein each corner of the rectangular mounting surface is chamfered by a rounded surface. And a protrusion having a rounded surface that abuts against a corner of the chamfered mounting surface is provided on a side surface of one end of the long object.

  The component part of the shield member according to claim 5 is the component part of the shield member according to any one of claims 1 to 3, and each corner portion of the rectangular mounting surface is chamfered by a flat surface. And a protrusion having a flat surface in contact with a corner portion of the chamfered mounting surface is provided on a side surface of one end of the long object.

  The component part of the shield member according to claim 6 is the component part of the shield member according to any one of claims 1 to 3, and is a side surface of the elongated object that faces the rectangular placement surface. Is a flat surface having no protrusions.

  The component of the shield member according to claim 7 is the component of the shield member according to any one of claims 1 to 6, wherein the long object is combined with another long object to be shielded. It has a projection part for forming the fitting part of a level | step difference structure when forming a member, It is characterized by the above-mentioned.

  In order to solve the above-described problem, the shield member according to claim 8 surrounds a rectangular mounting surface of a mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus that performs plasma processing on the rectangular substrate. A shield member arranged as described above, comprising the combination of component parts according to any one of claims 1 to 3, wherein one end face in the longitudinal direction of each component part is adjacent to another Each of the components is in contact with the side surface of one end in the length direction, and the side surface of the other end is in contact with the end surface of one end in the length direction of another adjacent component that is different from the other adjacent components. Combined, one end in the length direction of each component is fixed to the base material of the mounting table by the fixing portion, the other end is supported displaceably by the at least one guide portion, each component, Starting from the fixed end Characterized in that along the length of the elongated material is thermally expanded or thermally shrinkable arranged.

  The shield member according to claim 9 is the shield member according to claim 8, wherein a tightening torque of a fixing screw mounted in a fixing screw hole as the fixing portion is used as a supporting screw as the guide portion. It is characterized by being larger than the tightening torque of the support screw attached to the hole.

  The shield member according to claim 10 is the shield member according to claim 8 or 9, wherein the end surface of one end in the length direction of each component and one end of the other adjacent component in the length direction are arranged. The contact portion with the side surface is formed with a fitting portion having a step structure for preventing plasma from entering from the vertical direction and the horizontal direction with respect to the substrate mounting surface.

  The shield member according to claim 11 is the shield member according to claim 10, wherein a part of the step structure includes an end surface of one end of each of the component parts and a side surface of the one end of the adjacent other component parts. It is comprised by the nesting member loosely fitted by the recessed part formed in the contact part.

  The shield member according to claim 12 is the shield member according to claim 11, and is caused by thermal expansion or contraction along a length direction of each component between the concave portion and the nesting member. A gap for absorbing the displacement is provided.

  The shield member according to claim 13 is the shield member according to claim 12, wherein the insertion port of the nesting member in the recess is sealed with a side shield member to prevent plasma from entering the recess. It is characterized by being.

  The shield member according to claim 14 is the shield member according to any one of claims 8 to 13, wherein corner portions of the rectangular placement surface are each chamfered by a rounded surface, A protruding portion having a rounded surface that comes into contact with a corner portion of the chamfered mounting surface is provided on one side surface of each component.

  The shield member according to claim 15 is the shield member according to any one of claims 8 to 13, wherein corners of the rectangular mounting surface are each chamfered by a flat surface, A protrusion having a flat surface that comes into contact with a corner portion of the chamfered mounting surface is provided on a side surface of one end of each component.

  The shield member according to claim 16 is the shield member according to any one of claims 8 to 13, wherein corner portions of the rectangular mounting surface are each chamfered by a rounded surface, A gap fitting member having a rounded surface independent of the component parts filling the gap between each chamfered surface and an end face of one end of each component part and a joint portion of the side face of the one end of another adjacent component part. It is characterized by.

  The shield member according to claim 17 is the shield member according to any one of claims 8 to 13, wherein corners of the mounting surface of the rectangle are each chamfered by a flat surface. A triangular prism-shaped gap fitting member having a plane that is independent of the chamfered surface and the component part that fills the gap between the end surface of one end of each of the component parts and the joint portion of the side surface of the one end of another adjacent component part. It is characterized by having.

  The shield member according to claim 18 is the shield member according to claim 17, wherein the triangular prism-shaped gap fitting member is provided at one end of the triangular prism-shaped gap fitting member at each corner of the mounting surface. When the chamfered surface by the formed flat surface is fitted into a gap between the end surface of one end of each component and the joint portion of the side surface of the one end of another adjacent component, each corner portion of the mounting surface described above It is characterized in that a convex part having a rounded surface is formed to make the shape of the above-mentioned shape the same as the shape when the corner of the mounting surface is chamfered by the rounded surface.

  The shield member according to claim 19 is the shield member according to claim 18, wherein an end surface of the convex portion provided with the rounded surface is on the same plane as the previous placement surface or more than the previous placement surface. It is characterized by being retracted.

  In order to solve the above-mentioned problem, a substrate mounting table according to a twentieth aspect includes the shield member according to any one of the eighth to nineteenth aspects.

  According to the present invention, the component part of the shield member is composed of an insulating long material disposed along one side of the rectangular mounting surface, and is provided at one end in the length direction of the long material. Since the fixed portion and the fixed portion have at least one guide portion that is spaced apart in the length direction of the long object, this component is connected to the end face of one end in the length direction of each component. Is in contact with the side surface of one end in the longitudinal direction of another adjacent component, and the side surface of the other end is in contact with the end surface of one end of another adjacent component different from the other adjacent component In each component, one end in the length direction on the side with the end face in contact with each other component is fixed to the base of the mounting table by the fixing portion, and the other end is supported by the guide portion so as to be displaceable. The length of the long object from the fixed end of each component Is thermal expansion or contraction can be arranged along the direction. Therefore, even if the shield member or the mounting surface is heated, it is possible to prevent the occurrence of a gap between the shield member and the lower electrode due to expansion and contraction, and thereby, between the shield member and the lower electrode. Abnormal discharge and erosion of the lower electrode due to the plasma entering can be prevented. In addition, by chamfering the corner of the mounting surface with a flat surface and inserting a triangular prism-shaped fitting member, the glass substrate can be mounted when the orientation flat (orientation flat) is large. It is possible to prevent erosion of the lower electrode caused by the position of the orientation flat of the substrate placed on the electrode, such as when the positional accuracy when placing is poor.

It is sectional drawing which shows schematic structure of the substrate processing apparatus provided with the substrate mounting base to which the shield member of this invention is applied. It is a figure which shows the structure of the shield ring which concerns on the 1st Embodiment of this invention, Comprising: FIG. 2 (A) is a top view, FIG.2 (B) is sectional drawing along the II-II line of FIG. 2A. It is. It is a schematic diagram which shows the state which the shield ring of FIG. 2 expanded thermally. It is a schematic diagram which shows the state which the lower electrode of FIG. 2 expanded thermally. It is a top view which shows the structure of the shield ring as a modification of the 1st Embodiment of this invention. It is a figure which shows the structure of the principal part of the shield ring which concerns on the 2nd Embodiment of this invention, Comprising: FIG. 6 (A) is a principal part top view, FIG.6 (B) is a principal part perspective view, FIG. FIG. 6C is a perspective view showing the nesting member and the round member placed on the nesting member, and FIG. 6D is a perspective view for explaining the side shield member. It is a figure which shows the structure of the principal part of the shield ring which concerns on the 3rd Embodiment of this invention, Comprising: FIG. 7 (A) is a principal part top view, FIG.7 (B) is a principal part front view, FIG. C) is an assembly drawing of ring components. It is a top view which shows the structure of the shield ring which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the clearance gap fitting member applied to 4th Embodiment. It is a perspective view which shows the clearance gap fitting member applied to the 1st modification of 4th Embodiment. It is a top view which shows the component of the shield member applied to the 2nd modification of 4th Embodiment. It is a figure which shows the structure of the conventional shield ring.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing a schematic configuration of a substrate processing apparatus including a substrate mounting table to which a shield member according to a first embodiment of the present invention is applied. This substrate processing apparatus performs, for example, a predetermined plasma process on a glass substrate for manufacturing a liquid crystal display device (LCD).

  In FIG. 1, a substrate processing apparatus 10 includes a processing chamber (chamber) 11 that accommodates a rectangular glass substrate G (hereinafter simply referred to as “substrate”) with a side of several meters, for example. A mounting table (susceptor) 12 on which the substrate G is mounted is disposed below the figure. The susceptor 12 is composed of a base material 13 made of, for example, aluminum or stainless steel whose surface is anodized, and the base material 13 is supported on the bottom of the chamber 11 via an insulating member 14. The base material 13 has a convex cross section, and the upper plane is a substrate placement surface 13a on which the substrate G is placed.

  A shield ring 15 as a shield member is provided so as to surround the periphery of the substrate mounting surface 13a. The shield ring 15 is a long component made of an insulating ceramic such as alumina, for example. It consists of a combination.

  The upper part of the base material 13 incorporates an electrostatic electrode plate 16 and functions as an electrostatic chuck. A DC power source 17 is connected to the electrostatic electrode plate 16, and when a positive DC voltage is applied to the electrostatic electrode plate 16, the electrostatic electrode plate 16 on the substrate G placed on the substrate placement surface 13a. A negative potential is generated on the side surface (hereinafter referred to as “rear surface”), thereby generating a potential difference between the electrostatic electrode plate 16 and the rear surface of the substrate G, and Coulomb force or Johnson Rabeck resulting from the potential difference. The substrate G is attracted and held on the substrate placement surface 13a by the force.

  Inside the base material 13, a temperature adjustment mechanism (not shown) for adjusting the temperature of the base material 13 and the substrate G placed on the substrate placement surface 13a is provided. For example, coolant such as cooling water or Galden (registered trademark) is circulated and supplied to the temperature adjusting mechanism, and the base material 13 cooled by the coolant cools the substrate G.

  Around the base material 13, an insulating ring 18 is disposed as a side shield member that covers a side surface including a contact portion between the shield ring 15 and the base material 13. The insulating ring 18 is made of an insulating ceramic such as alumina.

  An elevating pin 21 is inserted in a through-hole penetrating the bottom wall of the chamber 11, the insulating member 14 and the base material 13 so as to be movable up and down. The elevating pins 21 operate when the substrate G placed on the substrate placement surface 13a is carried in and out, and when the substrate G is carried into or out of the chamber 11, the susceptor 12 is moved. The substrate moves up to the upper transfer position, and is otherwise housed in the substrate placement surface 13a.

  A plurality of heat transfer gas supply holes (not shown) are opened in the substrate mounting surface 13a. The plurality of heat transfer gas supply holes are connected to the heat transfer gas supply unit, and for example, helium (He) gas is supplied from the heat transfer gas supply unit to the gap between the substrate mounting surface 13a and the back surface of the substrate G. The The helium gas supplied to the gap between the substrate placement surface 13 a and the back surface of the substrate G effectively transfers the heat of the substrate G to the susceptor 12.

  A high frequency power source 23 for supplying high frequency power is connected to the base material 13 of the susceptor 12 via a matching unit 24. A high frequency power (RF) of 13.56 MHz, for example, is applied from the high frequency power supply 23, and the susceptor 12 functions as a lower electrode. The matching unit 24 reduces the reflection of the high frequency power from the susceptor 12 to maximize the application efficiency of the high frequency power to the susceptor 12.

  In the substrate processing apparatus 10, a side exhaust path 26 is formed by the inner wall of the chamber 11 and the side surface of the susceptor 12. The side exhaust path 26 is connected to an exhaust device 28 via an exhaust pipe 27. TMP (Turbo Molecular Pump), DP (Dry Pump) and MBP (Mechanical Booster Pump) (both not shown) as the exhaust device 28 are evacuated to reduce the pressure inside the chamber 11. Specifically, DP or MBP depressurizes the inside of the chamber 11 from atmospheric pressure to a medium vacuum state (for example, 1.3 × 10 Pa (0.1 Torr or less)), and TMP cooperates with DP or MBP to chamber 11. The inside is depressurized to a high vacuum state (for example, 1.3 × 10 −3 Pa (1.0 × 10 −5 Torr) or less), which is a lower pressure than the medium vacuum state. The pressure in the chamber 11 is controlled by an APC valve (not shown).

  A shower head 30 is disposed on the ceiling portion of the chamber 11 so as to face the susceptor 12. The shower head 30 has an internal space 31 and a plurality of gas holes 32 for discharging a processing gas into the processing space S between the shower head 30 and the susceptor 12. The shower head 30 is grounded and constitutes a pair of parallel plate electrodes together with the susceptor 12 functioning as a lower electrode.

  The shower head 30 is connected to a processing gas supply source 39 via a gas supply pipe 36. The gas supply pipe 36 is provided with an open / close valve 37 and a mass flow controller 38. A substrate loading / unloading port 34 is provided on the side wall of the processing chamber 11, and the substrate loading / unloading port 34 can be opened and closed by a gate valve 35. Then, the substrate G to be processed is carried in / out through the gate valve 35.

  In the substrate processing apparatus 10, the processing gas is supplied from the processing gas supply source 39 through the processing gas introduction pipe 36. The supplied processing gas is introduced into the processing space S of the chamber 11 through the internal space 31 and the gas hole 32 of the shower head 30. The introduced processing gas is excited by high-frequency power (RF) for plasma generation applied to the processing space S from the high-frequency power source 23 via the susceptor 12 and becomes plasma. Ions in the plasma are attracted toward the substrate G, and the substrate G is subjected to a predetermined plasma etching process.

  The operation of each component of the substrate processing apparatus 10 is controlled by a CPU of a control unit (not shown) provided in the substrate processing apparatus 10 according to a program corresponding to the plasma etching process.

  2A and 2B are diagrams showing the configuration of the shield ring according to the first embodiment of the present invention. FIG. 2A is a plan view, and FIG. 2B is a line II-II in FIG. FIG.

  In FIG. 2A, the shield ring 15 is disposed so as to surround the periphery of the rectangular substrate mounting surface 13a of the susceptor 12 (hereinafter referred to as “lower electrode”) that functions as a lower electrode. Long ring components 41 and 42 arranged along two opposing short sides of the substrate mounting surface 13a, and a long ring configuration arranged along two opposing long sides, respectively. It consists of a combination with parts 43 and 44.

  The ring components 41 to 44 include a fixing screw hole 45 provided at a fixed end which is one end in the length direction of the long object, and the fixing screw hole 45 is the length of the long object. It has the screw hole 46 for support provided in the direction away. At least one screw hole 46 for support is provided, but two or more may be provided according to the length of the long object. At this time, the screw holes 46 for support can be provided, for example, at equal intervals.

  Here, the fixing screw hole 45 functions as a fixing portion for fixing the fixed end of the ring component to the base member 13, and there is little play in the cross section perpendicular to the screw hole, and the shape on the plane is small. It is formed in a perfect circle. On the other hand, the supporting screw hole 46 functions as a guide portion that guides and supports the free end, which is the other end opposite to the fixed end, so as to be displaceable in the length direction of the long object. There is play in the vertical cross section, and the shape on the plane is an ellipse or a rectangle whose both ends are semicircles. The major axis of the cross section of the supporting screw hole 46 is long enough to prevent the supporting screw mounted in the supporting screw hole 46 from restricting the thermal expansion of the constituent members even if the constituent members 41 to 44 are thermally expanded. For example, when processing a glass substrate for FPD called 5.5th generation, the length of the major axis is preferably 7 mm to 10.5 mm, and the size of the glass substrate to be processed is large. As it becomes, it is preferable to make it longer.

  It is preferable that the tightening torque of the fixing screw attached to the fixing screw hole is larger than the tightening torque of the support screw attached to the supporting screw hole. As a result, the fixed ends 41a to 44a of the ring components 41 to 44 can be securely fixed, and the free ends 41b to 44b can be loosely supported to ensure their movement during thermal expansion or thermal contraction. .

  The tightening torque of the fixing screw is, for example, about 8 × (1 ± 0.05) kgf · cm (0.75 to 0.8 N · m), and the tightening torque of the support screw is, for example, higher than the tightening torque of the fixing screw. It is slightly small, for example, about 6 to 8 kgf · cm (0.6 to 0.8 N · m). However, when it is necessary to limit the amount of extension due to expansion, it is possible to restrict the movement of the shield ring by tightening these torques more strongly within a range that does not damage the ceramics.

  The end surface of the fixed end 41a of the ring component 41 abuts on the side surface of the end portion 43b (free end) in the length direction of the other adjacent ring component 43, and the side surface of the moving end 41b, which is the other end, is adjacent. It arrange | positions so that it may contact | abut to the end surface of the edge part 44a (fixed end) of another adjacent ring component 44 which differs from the other ring component 43 to perform. The ring components 42 and 44 are arranged so as to be point targets with the ring components 41 and 43 with respect to the center point C of the substrate placement surface 13a, respectively.

  In FIG. 2B, the base material 13 of the lower electrode 12 has a convex section, and the upper flat surface of the convex section has a substrate placement surface 13a, and the surface of the step portion becomes a flange portion 13b.

  The fixed ends 41 a to 44 a of the ring components 41 to 44 are fixed to the flange portion 13 b of the base material 13 by fixing screws (not shown) mounted in the fixing screw holes 45, respectively. Each of the ring components 41 to 44 is supported by a support screw (not shown) penetrating the support screw hole 46 so that the free ends 41b to 44b are displaceable with respect to the flange portion of the base member 13, Thus, each of the ring components 41 to 44 is supported so as to be capable of thermal expansion or contraction along the length direction of the long object starting from the fixed ends 41a to 44a.

  Here, since there is no adjacent ring component in the moving direction of the free ends 41b to 44b when the ring components 41 to 44 are in thermal expansion or thermal contraction, the movement of the free ends is not hindered. This prevents the adjacent ring components from pushing against each other during thermal expansion, and prevents the shield ring 15 from being deformed and the gap between the shield ring 15 and the substrate mounting surface 13a from being thermally contracted. be able to.

  The corners of the substrate placement surface 13a of the lower electrode 12 are each chamfered in a round shape. Therefore, in order to fill the gap between the chamfered surface and the shield ring 15, protrusions having rounded surfaces are provided on the side surfaces of the fixed ends 41 a to 44 a of the component parts 41 to 44. As a result, it is possible to prevent plasma from entering from the gap between the chamfered surface and the shield ring 15. Moreover, since the protrusion having the rounded surface is provided on the fixed end side, it is possible to suitably prevent the generation of a gap during thermal expansion or thermal contraction. In addition, the corner | angular part of the board | substrate mounting surface 13a may be not only a round shape but a flat C surface shape, and, in this case, the said protrusion part becomes a flat shape according to this.

  FIG. 3 is a schematic diagram showing a state in which the shield ring 15 of FIG. 2 is thermally expanded.

  In FIG. 3, each of the constituent members 41 to 44 of the shield ring 15 is expanded in the direction of the free ends 41b to 44b starting from a fixing screw that fixes the fixed ends 41a to 44a. The free ends 41b to 44b are thermally expanded. Is displaced by a dimension corresponding to the length extended by.

  FIG. 4 is a schematic diagram showing a state where the lower electrode 12 of FIG. 2 is thermally expanded.

  In FIG. 4, the constituent members 41 to 44 of the shield ring 15 are arranged so as to contact each side of the substrate placement surface 13 a on a one-to-one basis, so that the lower electrode 12 is a constituent member of the shield ring 15. Do not create a gap between them. Accordingly, no gap is generated between the lower electrode 12 and the shield ring 15.

  According to the present embodiment, the fixed ends 41a to 44a that are one end of the shield ring 15 are securely fixed by the fixing screw that is mounted in the fixing screw hole 45, and the free ends 41b to 44b that are the other ends are supported. Since it is supported so as to be displaceable in the direction of thermal expansion or contraction by a support screw attached to the screw hole 46 for use, and is combined so that there are no other ring components in the direction of movement of the free ends 41b to 44b. Even if the ring 15 is heated by continuous irradiation of plasma and thermally expands, no internal stress is generated. Therefore, the deformation of the shield ring 15 and the gap between the shield ring 15 and the lower electrode 12 are not generated, and the occurrence of abnormal discharge, erosion, etc. in the lower electrode 12 due to the plasma entering the gap is prevented. it can.

  Moreover, according to this Embodiment, since the shield ring 15 was comprised with the combination body of the ring component parts 41-44, the shape of each ring component parts 41-44 can be made into a substantially strip-shaped simple shape, for example. it can. Therefore, the manufacturing cost of each ring component and shield ring can be reduced.

In the present embodiment, the ring component is made of an insulating ceramic such as alumina (Al ₂ O ₃ ), yttria, silicon nitride, quartz, or the like. The screw holes 45 for fixing in the ring components 41 to 44 are preferably located as close as possible to the fixed ends of the ring components, and are preferably provided at 30 to 40 mm or less, for example. If the distance between the fixing screw hole 45 and the fixed end face is 300 mm or more, thermal expansion of that portion cannot be ignored, and the fixed end of each ring component and other ring components that come into contact with the fixed end Distortion occurs in the joint surface. Moreover, as a screw, a stainless steel screw, a ceramic screw, an aluminum screw, etc. are used.

  In the present embodiment, a screw is applied as a fastening member that supports each ring component 41 to 44 fixedly or displaceably on the flange portion 13 b of the base member 13, but each ring component 41 to 44 is attached to the base member 13. As a fastening member to be fixed to or supported on the flange portion 13b of the screw, for a variable portion such as a fixed portion, such as pressure contact by a clamp or a fitting structure between each ring component member and the flange, etc. You may use the guide member etc. which can restrict | limit displacement to one direction by the partition or groove | channel of each ring structural member side, the fitting type rail of each ring structural member, and a flange.

  Next, a modification of the first embodiment will be described.

  FIG. 5 is a diagram illustrating a configuration of a shield ring as a modification of the first embodiment.

  In FIG. 5, this modified example is different from the first embodiment in that the ring-shaped protrusions 41 to 44 constituting the shield link 15 are eliminated, and the strip-shaped ring components 51 to 51 are removed. 54, and a gap fitting member 55 having a rounded surface filling the gap between the four corners of the rectangular substrate mounting surface 13a of the lower electrode 12 and the contact portions between the constituent members of the shield ring 15. It is provided as a separate body.

  In such a shield ring 15 as well, similar to the first embodiment, the gap between the shield ring 15 and the substrate mounting surface 13a of the lower electrode 12 is eliminated, and abnormal discharge and erosion occur in the lower electrode 12. Can be prevented.

  In addition, according to this modification, the ring components 51 to 54 can be formed into a simple strip shape, so that the material removal can be reduced, and there is little risk of damage to the round-shaped projections. Is easy. In addition, the gap fitting member 55 having a rounded surface is worn out by continuous irradiation of plasma, but is easy to manufacture and replace, and is advantageous in terms of cost.

  6A and 6B are explanatory views showing the configuration of the main part of the shield ring according to the second embodiment of the present invention. FIG. 6A is a plan view of the main part and FIG. 6B is a perspective view of the main part. FIG. 6 (C) is a perspective view showing a nesting member and a round member placed on the nesting member, and FIG. 6 (D) is a perspective view for explaining the side shield member.

  In FIG. 6, this shield ring 60 includes ring components 61 and 62 and two ring components (not shown) arranged symmetrically with respect to the center point of the substrate mounting surface on the ring components 61 and 62, respectively. It is mainly composed of parts.

  The shield ring 60 is provided at a contact portion between the end face of the fixed end, which is one end in the length direction of each ring component, and the side face of one end in the length direction of another ring component adjacent to the ring component. In addition, a stepped structure fitting portion that prevents the plasma from entering from the vertical direction and the horizontal direction with respect to the substrate mounting surface 13a is formed.

  That is, stepped portions 62c and 61c are formed on the end surface of the fixed end 62a of the ring component 62 and the side surface of the free end 61b of the ring component 61, with the lower portion in the drawing being scraped off into a square column shape. As a result, a recess 64 formed by the stepped portion 62c and the stepped portion 61c is formed at the contact portion between the end surface of the fixed end 62a of the ring component 62 and the side surface of the free end 61b of the ring component 61. .

  A nesting member 65 as shown in FIG. 6C is inserted into the recess 64 in a loose fit. The rounded surface 65a of the nesting member 65 inserted into the recess 64 protrudes from the contact portion between the ring components 62 and 61 to the inside of the shield ring 60, and the lower electrode 12 (not shown) is chamfered with a rectangular substrate placed thereon. It contacts the chamfered surface of the surface 13a. A gap fitting member 66 having a rounded surface similar to the rounded surface 65a is placed on the upper portion of the portion of the nesting member 65 having the rounded surface 65a, whereby the substrate placement surface 13a of the lower electrode 12 is placed. Then, the upper surface of the gap fitting member 66 and the upper surfaces of the ring components 62 and 61 form the same plane. At this time, a gap 67 for absorbing displacement due to thermal expansion or contraction of the ring component 61 is formed between the nesting member 65 and the recess 64.

  As shown in FIG. 6D, an insulating ring 68 as a side shield member is disposed on the side surface of the susceptor 12 where the entrance of the concave portion 64 into which the nesting member 65 is inserted in a loose fit is opened. Accordingly, the lower electrode 12 does not receive plasma irradiation not only in the vertical direction but also in the horizontal direction with respect to the substrate mounting surface 13a.

  According to the present embodiment, the contact portion between the end surface of the fixed end 62a of the ring component 62 and the side surface of the free end 61b of the ring component 61 has a step structure that prevents plasma from entering. Therefore, the lower electrode 12 is not directly irradiated with plasma. Therefore, abnormal discharge and erosion due to plasma irradiation can be prevented.

  Further, according to the present embodiment, since the gap fitting member 66 is placed on the rounded portion of the nesting member 65, the gap fitting member 66 and the nesting member 65 have a labyrinth structure, and the portion It is possible to prevent plasma from entering.

  In addition, according to the present embodiment, the structure of the contact portion between the ring members becomes relatively simple by configuring a part of the step structure with the nesting member. Therefore, manufacture is easy and the possibility of damage during handling is reduced.

  In the present embodiment, the nesting member 65 is not fixed to the base members 13 of the ring components 61 and 62 and the lower electrode 12, but is loosely fitted in the recess 64 formed between the members. It is mounted on 13 flange portions. Therefore, a predetermined gap is formed between the nesting member 65 and the ring component 61, and the displacement due to the thermal expansion of the ring component 61 can be absorbed by this gap, so that deformation of the shield ring can be prevented. This can also prevent the lower electrode 12 from being irradiated with plasma, thereby preventing abnormal discharge and erosion from occurring in the lower electrode 12.

  FIG. 7 is a diagram showing a configuration of a main part of a shield ring according to a third embodiment of the present invention, FIG. 7 (A) is a main part plan view, FIG. 7 (B) is a main part front view, FIG. 7C is an assembly view of ring components.

  In FIG. 7, this shield ring 70 has a substrate mounting surface at a contact portion between an end surface of one end of the ring component and one side surface in the length direction of another ring component adjacent to the ring component. A fitting portion having a step structure that prevents the plasma from entering from the vertical direction and the horizontal direction with respect to 13a is provided.

  Usually, in a shield ring that combines four simple strip-shaped ring components into a rectangular shape, a slight gap is created between the ring components that come into contact with each other, and plasma enters the lower electrode and reaches the lower electrode. This may cause abnormal discharge or erosion in the electrode. Therefore, the shield ring 70 according to the present embodiment has a fitting portion having a step structure that prevents the plasma from entering from the vertical direction and the horizontal direction at the contact portion of each ring component.

  As shown in FIG. 7C, the end surface of the fixed end 72a of the ring component 72 is provided with two steps so as to form a bowl shape in the vertical and horizontal directions with respect to the substrate mounting surface 13a. In addition, the free end 71b of the ring component 71 is provided with a protruding portion having a bowl-shaped step portion that meshes with the step portion. A labyrinth structure is formed by the combination of such stepped portions.

  According to the present embodiment, since the fitting portion of the step structure is formed in the contact portion between the ring components, the entrance of the plasma from the vertical direction and the horizontal direction to the lower electrode 12 is prevented, thereby The occurrence of troubles such as abnormal discharge and erosion in the lower electrode 12 can be avoided.

  In the present embodiment, the contact portions between the ring components 71 and 72, that is, the gaps d1 and d2 (see FIG. 7A) in the thermal expansion direction of the ring components 71 at the fitting portions of the stepped portions become equal. The width of the ring component 71 is preferably a width sufficient to absorb the displacement caused by thermal expansion or contraction of the ring component 71, for example, about 1 to 2 mm. As a result, the thermal expansion of the ring components 71 and 72 is not hindered, so that the formation of a gap between the shield ring 70 and the lower electrode 12 is prevented, and the lower electrode 12 is subjected to plasma irradiation. Troubles can be avoided.

  In the present embodiment, the gaps e1 and e2 (see FIG. 7A) in the direction perpendicular to the thermal expansion direction of the ring components at the contact portion between the ring components 71 and 72 are assembling the ring components. It is sufficient if it is a gap that does not cause any trouble.

  Next, a fourth embodiment of the present invention will be described.

  FIG. 8 is a diagram showing a configuration of a shield ring according to the fourth embodiment of the present invention. In order to improve the manufacturing accuracy of the substrate mounting table and to easily prevent erosion of the sprayed surface at the four corners of the lower electrode, this shield ring is not a round surface but a flat surface for each of the four corners. It is arranged so as to surround the periphery of the substrate mounting surface 13a that has been chamfered.

  In FIG. 8, the shield ring 15 includes long ring components 81 and 82 arranged along two opposing short sides of the rectangular substrate placement surface 13a, and two opposing long sides. Are combined with long ring components 83 and 84 arranged respectively.

  The ring components 81 to 84 include a fixing screw hole 85 provided at a fixed end which is one end in the length direction of the long object, and the fixing screw hole 85 is the length of the long object. It has a screw hole 86 for support provided so as to be spaced apart in the direction. At least one screw hole 86 for support is provided, but two or more may be provided depending on the length of the long object. At this time, it is preferable that the screw holes 86 for support are provided at regular intervals, for example.

  The fixing screw hole 85 is used to fix the fixed end of the ring component to the base member 13, and there is little play in the cross section perpendicular to the screw hole, and the shape on the plane is formed into a perfect circle. On the other hand, the screw hole 86 for support supports the free end, which is the other end opposite to the fixed end, in a displaceable manner, and has an elliptical shape that is long in the length direction of the long object in a cross section perpendicular to the screw hole. Or it forms in the rectangle which becomes a semicircle at both ends. The major axis of the cross section of the supporting screw hole 86 is such a length that the supporting screw attached to the supporting screw hole 86 does not restrict the thermal expansion of the constituent member even when the constituent members 81 to 84 are thermally expanded. The length of the major axis is preferably 7 mm to 10.5 mm, for example, and it is preferable to increase the length of the glass substrate to be processed.

  The end surface of the fixed end 81a of the ring component 81 abuts on the side surface of the end portion 83b (free end) in the length direction of another adjacent ring component 83, and the side surface of the moving end 81b, which is the other end, is adjacent. It arrange | positions so that it may contact | abut to the end surface of the edge part 84a (fixed end) of another adjacent ring component 84 different from the other ring component 83 to perform. The ring components 82 and 84 are arranged so as to be point targets with the ring components 81 and 83 with respect to the center point C of the substrate placement surface 13a, respectively.

  The fixed ends 81a to 84a of the ring component parts 81 to 84 are respectively fixed to lower screw bases (shown in FIG. 8) by fixing screws (not shown) mounted in fixing screw holes 85. (Not shown). Further, each ring component 81 to 84 has a base of a lower electrode in which free ends 81b to 84b are arranged on the back side of the paper surface in FIG. 8 by a support screw (not shown) penetrating the screw hole 86 for support. The ring components 81 to 84 are supported so as to be displaceable with respect to the flange portion of the material (not shown), whereby the ring components 81 to 84 are thermally expanded along the length direction of the long object starting from the fixed ends 81a to 84a. Or it is supported so that heat shrink is possible.

  It is preferable that the tightening torque of the fixing screw attached to the fixing screw hole is larger than the tightening torque of the support screw attached to the supporting screw hole. As a result, the fixed ends 81a to 84a of the ring components 81 to 84 can be securely fixed, and the free ends 81b to 84b can be loosely supported to ensure their movement during thermal expansion or thermal contraction. .

  The fastening torque of the fixing screw is, for example, about 8 × (1 ± 0.05) kgf · cm (0.75 to 0.8 N · m), as in the first embodiment. The torque is, for example, slightly smaller than the tightening torque of the fixing screw, and is, for example, about 6 to 8 kgf · cm (0.6 to 0.8 N · m). However, when it is necessary to limit the amount of extension due to expansion, it is possible to restrict the movement of the shield ring by tightening these torques more strongly within a range that does not damage the ceramics.

  By disposing the ring components 81 to 84 as shown in FIG. 8, the ring components adjacent to each other in the moving direction of the free ends 81b to 84b when the ring components 81 to 84 are thermally expanded or contracted. Does not prevent the free end from moving. This prevents the adjacent ring components from pushing against each other during thermal expansion, and prevents the shield ring 15 from being deformed and the gap between the shield ring 15 and the substrate mounting surface 13a from being thermally contracted. be able to.

  In the present embodiment, from the viewpoint of preventing the plasma from entering the substrate mounting surface by minimizing the gap between the contact portions of the substrate mounting surface and the ring component, the round surface that is difficult to obtain the manufacturing accuracy. Avoiding the contact portion with the rounded surface, the chamfered surface of the substrate mounting surface and the constituent member surfaces that contact the chamfered surface are each flat.

  That is, as shown in FIG. 8, the corners of the rectangular substrate mounting surface 13a are each chamfered by a flat surface, and each chamfered surface is adjacent to the end surface of one end of each of the components 81 to 84. A triangular prism-shaped gap fitting member 87 having a flat surface that comes into contact with the chamfered surface of the substrate mounting surface is fitted into a gap with a corner portion of the shield ring 15 which is a joint portion on one side surface of another component. Yes.

  In the present embodiment as well, it is needless to say that the attachment method for supporting each ring component 81 to 84 fixedly or displaceably on the base member 13 is not limited to the screw. Various methods described in the description of the form can be used.

  FIG. 9 is a perspective view showing a gap fitting member 87 applied to the fourth embodiment.

  In FIG. 9, the gap fitting member 87 is formed independently of each of the component parts 81 to 84. The gap fitting member 87 is fitted into a gap surrounded by the chamfered surface of each corner of the substrate mounting surface 13a that has been chamfered and the corner of the shield ring 15, thereby eliminating the gap. The height is, for example, a height corresponding to the height (see FIG. 2) of the convex portion constituting the substrate mounting surface 13a, or a slightly lower height.

  The shield member provided with such a gap fitting member 87 is disposed so as to surround the periphery of the rectangular substrate mounting surface 13a to form a substrate mounting table.

  According to the present embodiment, the four corners of the rectangular substrate placement surface 13a of the base material 13 are each chamfered by a flat surface, and gaps between the respective chamfered surfaces and the corners of the shield ring 15 are formed. Since the triangular prism-shaped gap fitting member 87 to be filled is provided, the contact surfaces between the round surfaces can be eliminated, and the shape of the constituent members can be simplified, thereby improving the manufacturing accuracy. In addition, since the joints between the rounded surfaces can be eliminated and the joints between the flat surfaces can be formed, the gaps generated due to the mutual displacement between members can be eliminated as much as possible to more effectively damage the electrode surface due to the entrance of plasma. Can be prevented.

  In the present embodiment, for example, a rectangular substrate having one corner portion chamfered as an orientation flat for alignment is preferably used as the substrate to be processed. In this case, on the substrate mounting surface 13a, When a substrate is placed on the substrate mounting surface 13a and the substrate is displaced, the upper flat surface of the gap fitting member 87 is usually exposed before the substrate placing surface 13a. Therefore, even if a positional deviation occurs between the substrate placement surface 13a and the substrate, it is possible to avoid the damage by preventing only the plasma from entering the sprayed surface of the substrate placement surface 13a. In addition, the reason why all the four corners are chamfered is that the orientation flat can be applied even when the position of the orientation flat is changed due to the processing content of the substrate. When the gap fitting member 87 is damaged, it can be easily dealt with by replacing only the gap fitting member 87. In the present embodiment, a fitting portion having a step structure can be formed at the contact portion of each of the component parts 81 to 84. When the fitting portion is formed, the fitting portion has a second structure. 6 and under the gap fitting member 87, a member similar to the nesting member 65 of FIG. 6 is provided, and the gap fitting member 87 is placed on the base material 13. And

  Further, according to the present embodiment, since the gap fitting member 87 is formed in a vertically symmetrical triangular prism shape, the gap fitting member 87 is formed of a planar chamfered surface of the substrate placement surface 13a and a corner portion of the shield ring 15. It is not necessary to consider the direction of the vertical direction when fitting in the gap between the two. Therefore, it becomes relatively easy to manufacture the substrate mounting table having the shield ring 15.

In the present embodiment, the ring components 81 to 84 are made of insulating ceramics such as alumina (Al ₂ O ₃ ), yttria, silicon nitride, quartz, and the like. The screw holes 85 for fixing in the ring components 81 to 84 are preferably located as close as possible to the fixing ends of the ring components, and are preferably provided at 30 to 40 mm or less, for example. If the space between the fixing screw hole 85 and the fixed end surface is too wide, the thermal expansion of that portion cannot be ignored, and the fixed end of each ring component and the other ring components that are in contact with the fixed end. There is a risk of distortion on the joint surface.

  Next, a first modification of the fourth embodiment will be described.

  FIG. 10 is a perspective view showing a gap fitting member in a first modification of the fourth embodiment.

  In FIG. 10, the gap fitting member 88 is different from the gap fitting member 87 of FIG. 9 at one end of the gap fitting member 88, and the gap fitting member 88 is formed at each corner of the substrate mounting surface 13a. When fitted into the gap between the chamfered surface by the flat surface and the corner portion of the shield ring 15, the shape of each corner portion of the substrate placement surface 13a is apparently the corner portion of the substrate placement surface 13a by the rounded surface. It is the point which formed the convex part provided with the rounded surface 88a for making it the shape similar to the shape at the time of chamfering. That is, on one end surface of the gap fitting member 88, a convex portion is formed in which a surface surrounded by the straight line 88b and the arc 88c protrudes at a predetermined height, and a surface that defines the height of the convex portion. Is the rounded surface 88a.

  The gap fitting member 88 having such a configuration is fitted into a gap between a chamfered surface by a plane formed at each corner of the substrate placement surface 13a and a corner of the shield ring 15 to form a substrate placement table. .

  Also in the modified example of the present embodiment, since the joint portions between the rounded surfaces can be eliminated and the joint surfaces can be made flat surfaces as in the above-described embodiment, the gap generated due to the mutual displacement between the members can be eliminated. It is possible to effectively prevent the electrode surface from being damaged due to the plasma entering from the gap without being maximized.

  Moreover, according to the modification of this Embodiment, it combines so that the chamfering surface in four corner | angular parts of the board | substrate mounting surface 13a and the rectangular plane which includes the straight line 88a in the clearance gap fitting member 88 may contact | abut. Therefore, the shape of the corner portion of the substrate mounting surface 13a is apparently the same shape as that when the chamfering process is performed with the rounded surface. By making the corner portion of the gap fitting member 88 an R surface, the corner portion can be prevented from being damaged. In addition, when the gap fitting member 88 is installed, it is apparently the same as the shape of the conventional substrate mounting surface, so various processing conditions that have been adjusted by conventional devices for substrate temperature control and the like are applied as they are. There is also an advantage that it is possible.

  In the modification of the present embodiment, it is preferable that the end surface of the convex portion provided with the rounded surface 88a is on the same plane as the substrate placement surface 13a or is recessed more than the substrate placement surface 13a. Thus, the substrate placed on the substrate placement surface 13a can be stably supported.

  Next, a second modification of the fourth embodiment will be described.

  FIG. 11 is a plan view showing a ring component applied to the second modification example of the present embodiment.

  In FIG. 11, the side surface of the fixed end 91 a of the ring component 91 is filled with a gap between the chamfered surface at the corner of the substrate mounting surface 13 a that has been chamfered by a flat surface and the corner of the shield ring 15. The protrusion 91c is provided.

  The ring component 91 having such a configuration is combined as shown in FIG. 8 to form the shield ring 15.

  According to the modification of the present embodiment, the gap between the chamfered surface and the shield ring 15 can be filled with the protrusion 91c of the ring component 91, so that the lower electrode due to the plasma entering from the gap. 12 can be effectively prevented from occurring.

  In each of the embodiments described above, the substrate on which the plasma treatment is performed is not only a glass substrate for a liquid crystal display (LCD) but also an electroluminescence (EL) display, a plasma display panel (PDP), and the like. Various substrates used for FPD (Flat Panel Display) may be used.

  In the above-described embodiment, the apparatus using the capacitively coupled plasma generation method using the parallel plate electrodes has been described. However, even if an apparatus using another plasma generation method such as an inductively coupled plasma generation method is used, the substrate is not mounted. Needless to say, the present invention can be applied to any apparatus having a table and a shield ring or a member corresponding thereto.

10 Substrate processing device 12 Mounting table (susceptor)
13 Base material 13a Substrate mounting surface 15 Shield ring 18 Insulating rings 41 to 44 Ring components 51 to 54 Ring components 61 and 62 Ring components 71 and 72 Ring components 81 to 84 Ring components 87 and 88 Gap fitting Element

Claims (20)

A component part of a shield member provided so as to surround a rectangular mounting surface of a mounting table for mounting the substrate in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate,
It consists of an insulating long object arranged along one side of the rectangular mounting surface,
A fixing portion provided at one end in the length direction of the long object, and the fixing portion includes at least one guide portion provided to be spaced apart in the length direction of the long object; A component part of the shield member.   One end is fixed to the base material of the mounting table by the fixing screw hole as the fixing portion, and the other end is movably supported by the supporting screw hole as the at least one guide portion and fixed. 2. The component part of a shield member according to claim 1, wherein the component part is capable of thermal expansion or thermal contraction along a length direction of the long object starting from one end.   The fixing screw hole is perfectly circular on the plane having the fixing screw hole, and the supporting screw hole is formed on the plane having the supporting screw hole. The component part of the shield member according to claim 2, wherein the component part is a long oval shape in the length direction or a rectangle whose both ends are semicircles.   Each corner of the rectangular mounting surface is chamfered by a rounded surface, and has a rounded surface that contacts the corner of the mounting surface chamfered on the side surface of one end of the elongated object. 4. The component part of the shield member according to claim 1, wherein a projection is provided.   The corner portions of the rectangular mounting surface are each chamfered by a flat surface, and a protrusion having a flat surface that contacts the corner portion of the mounting surface chamfered on the side surface of one end of the elongated object. The component part of the shield member of any one of Claim 1 thru | or 3 characterized by the above-mentioned.   The component part of the shield member according to any one of claims 1 to 3, wherein a side surface of the long object facing the rectangular mounting surface is a flat surface having no protrusion. .   The said long object has a protrusion part for forming the fitting part of a level | step difference structure, when forming a shield member in combination with another elongate object, The any one of Claim 1 thru | or 6 characterized by the above-mentioned. 2. A component part of the shield member according to item 1. A shielding member disposed so as to surround a rectangular mounting surface of a mounting table on which the substrate is mounted in a processing chamber of a substrate processing apparatus that performs plasma processing on a rectangular substrate;
It comprises a combination of component parts according to any one of claims 1 to 3,
The end surface of one end in the length direction of each component is in contact with the side surface of one end in the length direction of another adjacent component, and the side surface of the other end is adjacent to different from the other adjacent component. Each is combined so as to abut against the end face of one end in the length direction of another component,
One end in the length direction of each component is fixed to the base material of the mounting table by the fixing portion, the other end is supported movably by the at least one guide portion, and each component is fixed. The shield member is arranged so as to be capable of thermal expansion or contraction along the length direction of the long object starting from one end.   The tightening torque of a fixing screw attached to a fixing screw hole as the fixing portion is larger than a tightening torque of a supporting screw attached to a supporting screw hole as the guide portion. Item 9. The shield member according to Item 8.   From the vertical direction and the horizontal direction with respect to the substrate mounting surface, the contact portion between the end surface of one end in the length direction of each component and the side surface of one end in the length direction of the other adjacent component The shield member according to claim 8 or 9, wherein a fitting portion having a step structure for preventing the plasma from entering is formed.   A part of the step structure is configured by a nesting member loosely fitted in a recess formed in an abutting portion between an end surface of one end of each component and a side surface of the one end of the other adjacent component. The shield member according to claim 10, wherein the shield member is provided.   The clearance gap which absorbs the displacement resulting from the thermal expansion or thermal contraction along the length direction of each said component is provided between the said recessed part and the said nesting member of Claim 11 characterized by the above-mentioned. Shield member.   The shield member according to claim 12, wherein the insertion port of the nesting member in the recess is sealed with a side shield member to prevent plasma from entering the recess.   Each corner of the rectangular mounting surface is chamfered by a rounded surface, and a protrusion having a rounded surface that contacts the corner of the mounting surface chamfered on the side surface of one end of each component. The shield member according to any one of claims 8 to 13, wherein a portion is provided.   Each corner of the rectangular mounting surface is chamfered by a flat surface, and a protrusion having a flat surface abutting on the corner of the mounting surface is chamfered on a side surface of one end of each component. The shield member according to claim 8, wherein the shield member is provided.   Each corner of the rectangular mounting surface is chamfered by a rounded surface, and each chamfered surface is joined to an end surface of one end of each component and a side surface of the one end of another adjacent component. The shield member according to any one of claims 8 to 13, further comprising a gap fitting member having a rounded surface independent of the component that fills the gap.   Each corner of the rectangular mounting surface is chamfered by a flat surface, and each chamfered surface is joined to an end surface of one end of each of the component parts and a joint portion of the side surface of the one end of another adjacent component part. The shield member according to any one of claims 8 to 13, further comprising a triangular prism-shaped gap fitting member having a plane independent of the component parts filling the gap.   At one end of the triangular prism-shaped gap fitting member, the triangular prism-shaped gap fitting member is adjacent to the chamfered surface formed by the flat surface formed at each corner of the mounting surface, and the end face of one end of each of the components. When fitted into a gap with the joint on the side surface of the one end of the other component, the shape of each corner of the mounting surface is apparently chamfered by the rounded surface of the corner of the mounting surface. The shield member according to claim 17, wherein a convex portion having a rounded surface for forming a shape similar to the shape is formed.   The shield member according to claim 18, wherein an end surface of the convex portion provided with the rounded surface is on the same plane as the placement surface described above or is retracted from the placement surface.   A substrate mounting table comprising the shield member according to any one of claims 8 to 19.

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