JP2012037575A - Electronic imaging system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small, inexpensive electronic imaging system.SOLUTION: The electronic imaging system includes: an imaging optical system having a plurality of lenses and used for imaging an image of an object; an imager having an imaging surface for converting the image, formed by the imaging optical system, into an electric signal; and a self-light-emitting element disposed between a lens group closest to the image side which is arranged closest to the image side of the imaging optical system and the imaging surface or disposed within the imaging surface. The self-light-emitting element emits light and the imaging optical system is used as a projecting optical system, thereby projecting an image. It is preferable that the self-light-emitting element be a transparent EL light-emitting element and adjacent to the imaging surface.

Description

  The present invention relates to an electronic imaging system.

  As a camera incorporating a projector, the cameras described in Patent Document 1 and Patent Document 2 have been proposed. The camera with a built-in projector described in Patent Document 1 attempts to reduce the size of the camera by devising the arrangement of the camera unit and the projector module. The digital camera with a built-in projector described in Patent Document 2 is a digital camera having a projector function, but as a configuration for realizing miniaturization and cost reduction, a first optical including a light source that emits light and a photographing lens. A system, a second optical system that returns light from the light source by a plurality of mirrors, guides the light to the first optical system, and enters the second optical system, and retreats from the second optical system. When the imaging device is located in the second optical system, the imaging device receives the subject light beam via the first optical system.

JP 2008-252478 A JP 2006-135894 A

  The cameras described in Patent Document 1 and Patent Document 2 are aimed at miniaturization of the entire apparatus while mounting a projector function on a digital camera. However, since the imaging optical system and the projection optical system are separately configured, the camera It was not enough for miniaturization.

  The present invention has been made in view of the above, and an object thereof is to provide a small and inexpensive electronic imaging system.

  In order to solve the above-described problems and achieve the object, an electronic imaging system according to the present invention includes a plurality of lenses and forms an image with an imaging optical system that forms an image of an object. Between the imaging element having an imaging surface for converting the captured image into an electrical signal and the most image side lens group disposed on the most image side of the imaging optical system and the imaging surface, or in the imaging surface. A light emitting element, the self light emitting element emits light, and the imaging optical system is a projection optical system to project an image.

  In the electronic imaging system according to the present invention, the self-light emitting element is a transparent EL light emitting element, and is preferably adjacent to the imaging surface.

  In the electronic imaging system according to the present invention, it is preferable that the self-luminous elements are discretely distributed on the imaging surface.

In the electronic imaging system according to the present invention, it is preferable that the abundance ratio of the imaging element and the self-luminous element when the self-luminous element and the imaging element are in the same plane satisfies the following formula (1).
0.012 <number of self-luminous elements / number of effective imaging pixels <0.25 (1)
Here, the number of self-luminous elements / number of effective imaging pixels is the existence ratio,
The imaging effective pixel number is the effective imaging pixel number in the imaging element.

An electronic imaging system according to the present invention includes a display unit including a self-light-emitting element and an imaging unit including an imaging element. The display unit and the imaging unit are spaced apart from each other. ) Is preferably satisfied.
0 <x / L <0.9 (2)
Here, L is the distance from the R surface of the rear lens of the most image side lens group to the imaging surface,
x is the distance from the imaging surface to the self-luminous element,
It is.

  The electronic imaging system according to the present invention produces an effect that a small and inexpensive electronic imaging system can be provided.

It is a figure which shows schematic structure of the electronic imaging system which concerns on 1st Embodiment. 1 is a block diagram conceptually showing an internal configuration of a camera to which an electronic imaging system of a first embodiment is applied. It is a block diagram which shows the control relationship of the camera of FIG. It is sectional drawing which shows the structure of Example 1 of the electronic imaging system which concerns on 1st Embodiment. It is a flowchart which shows the whole flow of the process of an imaging and projection. It is a flowchart which shows the flow of a process of mode setting. It is a flowchart which shows the flow of a process of a projection setting. It is sectional drawing which shows the structure of Example 2 of the electronic imaging system which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the electronic imaging system which concerns on 2nd Embodiment. It is a top view which shows the example of arrangement | positioning of the image pick-up element and self-light-emitting element of the electronic image pick-up system concerning 2nd Embodiment.

  Embodiments of an electronic imaging system according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment.

Prior to the description of the embodiments and examples, the functions and effects of the present invention will be described.
An electronic imaging system according to the present invention includes an imaging optical system that includes a plurality of lenses and forms an image of an object, and an imaging surface that converts an image formed by the imaging optical system into an electrical signal. And a self-light emitting element disposed between or within the imaging surface of the most image side lens group disposed on the most image side of the imaging optical system, and the self-light emitting element emits light. The image forming optical system is a projection optical system to project an image.

  With this configuration, the imaging optical system and the projection optical system can be shared. Furthermore, by using a transparent self-light-emitting element, even if the self-light-emitting element is disposed on the optical path of the imaging optical system, normal shooting can be performed without removing the self-light-emitting element from the optical path during shooting. Further, since the imaging optical system and the projection optical system are the same optical system, the optical system can be reduced in size. Further, since it is not necessary to move the self-light-emitting element and the drive unit and the storage unit are not required, it is possible to simplify the mechanism, reduce the size of the camera body, and reduce the cost.

In the electronic image pickup system according to the present invention, it is preferable that the abundance ratio of the image pickup element and the self light emitting element when the self light emitting element and the image pickup element are in the same plane satisfies the following expression (1).
0.012 <number of self-luminous elements / number of effective imaging pixels <0.25 (1)
Here, the number of self-luminous elements / number of effective imaging pixels is the existence ratio,
The imaging effective pixel number is the effective imaging pixel number in the imaging element.

If the abundance ratio is below the minimum value of the above formula (1), the ratio of the light emitting elements in the unit is too low, and sufficient light quantity / resolution cannot be obtained during projection.
If the abundance ratio exceeds the maximum value of the above formula (1), the RGB balance of the image sensor is lost, and the resolution and color development during imaging are affected.

An electronic imaging system according to the present invention includes a display unit including a self-light-emitting element and an imaging unit including an imaging element. The display unit and the imaging unit are spaced apart from each other. ) Is preferably satisfied.
0 <x / L <0.9 (2)
Here, L is the distance from the R surface of the rear lens of the most image side lens group to the imaging surface,
x is the distance from the imaging surface to the self-luminous element,
It is.

In the above equation (2), since the imaging unit and the display unit use different units, the minimum value of the above equation (2) is larger than zero.
If x / L exceeds the maximum value of the above equation (2), there is a possibility of collision when the rear lens group is operated.

(First embodiment)
FIG. 1 is a diagram illustrating a schematic configuration of an electronic imaging system according to the first embodiment. The electronic imaging system shown in FIG. 1 includes a plurality of lenses, and has an imaging optical system L0 that forms an image of an object, and an imaging surface I that converts an image formed by the imaging optical system into an electrical signal. An imaging element, and a self-light-emitting element E disposed between the imaging optical system L0 and the imaging surface I. The self-light-emitting element E and the imaging surface I are arranged in order from the imaging optical system L0 side on the optical axis O of the imaging optical system L0. The distance x between the self-light-emitting element E and the imaging surface I is zero or more, and the self-light-emitting element E may be disposed between the imaging optical system L0 and the imaging surface I or disposed on the imaging surface I. May be.

FIG. 1A shows a state (imaging state) in which an image is formed on the imaging surface I of the imaging element by the imaging optical system L0. FIG. 1B shows a state (projection state) in which the self-light-emitting element E emits light and an image is projected by the imaging optical system L0 as a projection optical system.
As shown in FIG. 1A, in the imaging state, the light incident on the imaging optical system L0 passes through the self-light-emitting element E that is in a substantially transparent state and forms an image on the imaging surface I. On the other hand, in the projection state shown in FIG. 1B, the light from the self-light emitting element E is emitted from the imaging optical system L0 as the projection optical system and projects an image to the outside. That is, the imaging optical system L0 is a common optical system in the imaging state and the projection state. The imaging element constitutes a part of the imaging unit, the self-light emitting element E constitutes a part of the display unit, and the imaging optical system L0 is an optical system common to the imaging unit and the display unit.

  The self-light-emitting element E is preferably transparent in the imaging state, and for example, an EL element (electroluminescent element) can be used. For example, a CCD (charge coupled device) or a CMOS (complementary metal oxide semiconductor) is used as the imaging device.

The electronic imaging system of the first embodiment can be realized, for example, by assembling an EL element in a CCD unit including the imaging optical system L0.
FIG. 2 is a block diagram conceptually showing the internal structure of the camera to which the electronic imaging system of the first embodiment is applied. FIG. 3 is a block diagram showing the control relationship of the camera of FIG.

  As shown in FIG. 2, a CCD 111 as an imaging element and an EL element 112 (EL light emitting element) as a self light emitting element are connected to the SW 121 and the CPU 122, respectively. A memory 123 and a liquid crystal panel 124 are connected to a CPU 122 (Central Processing Unit). As shown in FIG. 3, the CCD 111 is connected to the CPU 122 via a DRV 131 as a drive circuit, and the EL element 112 is connected to the CPU 122 via a DRV 132 as a drive circuit. The CPU 122 receives a signal related to the operation mode when the user operates the SW 121. The SW 121 in FIG. 2 is a switch that also serves as a switch for setting the operation mode and a switch for selecting the operation mode. The memory 123 stores information on an image projected in the projection mode and information displayed on the liquid crystal panel 124.

  The CPU 122 outputs a control signal for operating the CCD 111 and the EL element 112 to the DRVs 131 and 132 based on the signal regarding the operation mode. The CCD 111 is driven by a DRV 131 that operates according to a control signal, and the EL element 112 is driven by a DRV 132 that operates according to a control signal.

FIG. 4 is a cross-sectional view illustrating a configuration of Example 1 of the electronic imaging system according to the first embodiment.
The imaging optical system L0 shown in FIG. 4 includes, in order from the object side, a biconcave negative lens L1, a positive meniscus lens L2 having a convex surface facing the object side, an aperture stop S, and a positive surface having a convex surface facing the object side. A combined lens of a meniscus lens L3, a negative meniscus lens L4 having a convex surface facing the object side, and a positive meniscus lens L5 having a convex surface facing the object side, a positive meniscus lens L6 having a convex surface facing the image side, and a convex surface facing the image side Negative meniscus lens L7 facing

The negative meniscus lens L7 constitutes the most image side lens group Ga arranged on the most image side of the imaging optical system L0. The distance L between the image-side surface Ra of the negative meniscus lens L7 and the imaging surface I (image surface) and the distance x between the self-light-emitting element E and the imaging surface I satisfy the following expression (2).
0 <x / L <0.9 (2)
When the most image side lens group Ga includes a plurality of lenses, the distance L is the distance from the imaging surface I side surface of the rear lens closest to the imaging surface I to the imaging surface.

  Next, the flow of imaging and projection processing in the case of the camera shown in FIGS. 2 and 3 will be described with reference to the drawings. Here, FIG. 5 is a flowchart showing the overall flow of the imaging and projection processing. FIG. 6 is a flowchart showing the flow of mode setting processing. FIG. 7 is a flowchart showing a flow of projection setting processing.

  As shown in FIG. 5, when the power is turned on to start the camera (step S100), the CPU 122 extends the imaging optical system L0 (zoom lens) from the body and places each lens at the initial position (step S101). ).

  Subsequently, the CPU 122 performs imaging setting (step S102). The imaging setting is a parameter setting necessary for imaging. Examples of parameters include shutter speed, exposure conditions, and white balance.

  Thereafter, the CPU 122 continuously determines whether or not the SW 121 as the mode setting button has been pressed (step S103) and whether or not the power has been turned off (step S104). When the mode setting button is pressed (Y in step S103), the CPU 122 executes the mode setting (step S200) shown in FIG. When the power is turned off (Y in step S104), the CPU 122 stores the lens barrel in the body (step S105).

  Here, after the imaging setting (step S102), the camera is not in the mode setting state (N in step S103) and is ready for imaging in a state where the power is not off (N in step S104).

  In the mode setting shown in FIG. 6 (step S200), first, the CPU 122 causes the liquid crystal panel 124 to display an imaging mode and a projection mode as selectable modes (step S201). The user of the camera inputs (selects) a desired mode by operating the SW 121 (step S202).

When the input mode is the imaging mode (Y in step S203), the CPU 122 executes the imaging setting (step S102) in FIG. 5 again.
On the other hand, when the input mode is the projection mode (N in step S203), the CPU 122 executes the projection setting (step S300) shown in FIG.

  In the projection setting (step S300), first, the CPU 122 reads image data stored in advance in the memory 123 (step S301), and displays a list of the read image data on the liquid crystal panel 124 as a thumbnail (step S302).

  The user of the camera selects an image desired to be projected from the list of images displayed on the liquid crystal panel 124 by operating a switch (not shown) (step S303). In response to the user's operation, the CPU 122 transfers the selected image data to the DRV 132 (step S304), and causes the EL element 112 (self-emitting element) to emit light (step S305). Further, the CPU 122 adjusts the focus lens of the imaging optical system L0 (step S306).

Next, the CPU 122 continuously determines whether or not the SW 121 as the mode setting button has been pressed (step S307) and whether or not the power has been turned off (step S308).
When the mode setting button is pressed (Y in step S307), the CPU 122 turns off the EL element (step S309). When the power is turned off (Y in step S308), the CPU 122 stores the lens barrel in the body (step S310).

  On the other hand, after the adjustment of the focus lens (step S306), the projection state continues not in the mode setting state (N in step S307) but in a state where the power is not off (N in step S308).

FIG. 8 is a cross-sectional view illustrating a configuration of a second example of the electronic imaging system according to the first embodiment.
An imaging optical system L0 shown in FIG. 8 includes, in order from the object side, a negative meniscus lens L1, a prism L2, a biconvex positive lens L3, a biconcave negative lens L4, and an image side facing the object side. A cemented lens of a positive meniscus lens L5 and a plano-concave positive lens L6 having a convex surface, a brightness stop S, a biconvex positive lens L7, a cemented lens of a biconvex positive lens L8 and a plano-concave positive lens L9; It consists of a cemented lens of a negative meniscus lens L10 having a convex surface facing the object side and a positive meniscus lens L11 having a convex surface facing the object side, and a biconvex positive lens L12.

The biconvex positive lens L12 constitutes the most image side lens group Ga arranged on the most image side of the imaging optical system L0. The distance L between the image-side surface Ra of the biconvex positive lens L12 and the imaging surface I (image surface) and the distance x between the self-light-emitting element E and the imaging surface I satisfy the following expression (2).
0 <x / L <0.9 (2)
When the most image side lens group Ga includes a plurality of lenses, the distance L is the distance from the imaging surface I side surface of the rear lens closest to the imaging surface I to the imaging surface.

(Second Embodiment)
FIG. 9 is a cross-sectional view illustrating a configuration of an electronic imaging system according to the second embodiment.
The imaging optical system L0 shown in FIG. 9 includes, in order from the object side, a negative meniscus lens L1, a prism L2, a biconvex positive lens L3, a biconcave negative lens L4, and an image side facing the image side. A cemented lens of a positive meniscus lens L5 and a plano-concave positive lens L6 having a convex surface, a brightness stop S, a biconvex positive lens L7, a cemented lens of a biconvex positive lens L8 and a plano-concave positive lens L9; It consists of a cemented lens of a negative meniscus lens L10 having a convex surface facing the object side and a positive meniscus lens L11 having a convex surface facing the object side, and a biconvex positive lens L12.
The biconvex positive lens L12 constitutes the most image side lens group Ga arranged on the most image side of the imaging optical system L0. The distance between the image-side surface Ra of the biconvex positive lens L12 and the imaging surface I (image surface) is L.

As shown in FIG. 9, in the electronic imaging system according to the second embodiment, a self-luminous element E is arranged on the imaging surface I. A specific example will be described with reference to FIG.
FIG. 10 is a plan view illustrating an arrangement example of the image pickup device and the self-light emitting device of the electronic image pickup system according to the second embodiment.
In the electronic imaging system according to the second embodiment, each pixel 301 of the imaging element is replaced by replacing a part of the pixel 301 (◯ mark in FIG. 10, imaging element) with a self-light-emitting element 302 (□ in FIG. 10). A plurality of self-light-emitting elements 302 are discretely distributed and arranged on the same surface as the surface on which is arranged. In FIG. 10, a pixel 301 or a self-luminous element 302 that detects primary colors of R for red, G for green, and B for blue is shown.

  In the arrangement example shown in FIG. 10, the ratio of the self-light emitting elements to the pixels 301 is 1/16. Therefore, a VGA level image can be secured for the projection optical system.

In the imaging of the electronic imaging system according to the second embodiment, for the image information of the position of each pixel 301 replaced with the self-light emitting element 302, the detection result by the same color pixel in the horizontal and vertical directions of the position Interpolate using.
On the other hand, in projection, a projected image is formed by light emission and extinction of each self-light emitting element.

As shown in FIG. 10, when each pixel 301 as the image sensor and the self-light-emitting element 302 are in the same plane, the existence ratio of the pixel 301 and the self-light-emitting element 302 preferably satisfies the following expression (1).
0.012 <number of self-luminous elements / number of effective imaging pixels <0.25 (1)
Here, the number of self-luminous elements / number of effective imaging pixels is the existence ratio,
The imaging effective pixel number is the effective imaging pixel number in the imaging element.
In addition, about another structure, an effect | action, and an effect, it is the same as that of 1st Embodiment.

  As described above, the electronic imaging system according to the present invention is useful for realizing a small and inexpensive electronic imaging system by using the imaging optical system in common with the imaging unit and the display unit.

111 CCD
112 EL element 122 CPU
123 Memory 124 Liquid crystal panel 131, 132 DRV (Drive circuit)
301 Pixel 302 Self-emitting element E Self-emitting element Ga Most image side lens group I Imaging surface (image surface)
L0 imaging optical system L1-L12 each lens

Claims (5)

An imaging optical system that includes a plurality of lenses and forms an image of an object;
An imaging device having an imaging surface for converting an image formed by the imaging optical system into an electrical signal;
A self-light-emitting element disposed between the most image side lens group disposed on the most image side of the imaging optical system and the image capturing surface, or within the image capturing surface;
An electronic imaging system, wherein the self-luminous element emits light, and an image is projected by using the imaging optical system as a projection optical system.   The electronic imaging system according to claim 1, wherein the self-light emitting element is a transparent EL light emitting element and is adjacent to the imaging surface.   The electronic imaging system according to claim 1, wherein the self-light-emitting elements are discretely distributed on the imaging surface. The existence ratio of the image pickup element and the self-light-emitting element when the self-light-emitting element and the image pickup element are in the same plane satisfies the following expression (1). Electronic imaging system.
0.012 <number of self-luminous elements / number of effective imaging pixels <0.25 (1)
Here, the number of self-luminous elements / number of effective imaging pixels is the existence ratio,
The imaging effective pixel number is the effective imaging pixel number in the imaging element. A display unit including the self-luminous element, and an imaging unit including the imaging element,
The electronic imaging system according to claim 1, wherein the display unit and the imaging unit are spaced apart from each other, and the display unit satisfies the following expression (2).
0 <x / L <0.9 (2)
Here, L is the distance from the R surface of the rear lens of the most image side lens group to the imaging surface,
x is the distance from the imaging surface to the self-luminous element,
It is.