JP2012035297A - Laser beam machining method and laser beam machining apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining method for improving beam machining speed.SOLUTION: In the laser beam machining method, laser beam is emitted to irradiate a substrate 600 with an image through a pattern formed on a mask 501 and an imaging lens 506. A plurality of images are projected on the substrate 600 with a single pulse irradiation. An interval between the images radiated to the substrate 600 at one time is adjusted and a relative movement amount between the mask 501 and the substrate 600 is adjusted according to the interval and then scan speed is adjusted. Consequently, the scan speed is improved and the productivity is also improved.

Description

  The present invention relates to a laser processing method, and more particularly to a laser processing method and a laser processing apparatus that perform laser processing by irradiating a mask on which a pattern is formed with laser light and projecting an image of the mask pattern onto a workpiece.

  Conventionally, various techniques have been disclosed regarding a method of processing a workpiece with a laser. For example, Patent Document 1 (Japanese Patent Laid-Open No. 8-201813) discloses a method for repairing a liquid crystal display. This method scans a small-diameter pulse laser spot to lower the orientation in the defective pixel. The pulse laser spot is considered in consideration of a rise in the temperature of the alignment film, which is a workpiece, and bubbles that are generated. Defines the relationship between the overlap ratio, pulse laser spot diameter, pulse laser repetition frequency f, and scan speed, and also defines the range of overlap ratio and the movement distance of the workpiece for each pulse. To do.

  In Patent Document 2 (Japanese Patent Laid-Open No. 2006-289388), in order to perform uniform laser processing along a processing line of a workpiece in a laser processing apparatus, a laser beam irradiation means is a spot of a pulse laser beam. Disclosed is a technology that forms the shape of an ellipse into an elliptical shape, sets the range of the minor axis and major axis length of the ellipse, and controls the repetition rate of the pulse laser beam, the feed rate that surrounds it, and the elliptical spot overlap rate Has been.

  In addition, in the conventional laser processing method, a technique using a mask for minute processing or the like is also disclosed. For example, Patent Document 3 (Japanese Patent Application Laid-Open No. 8-66781) discloses a technique relating to a laser processing method for performing laser processing by projecting an image of a mask pattern onto a laser workpiece. In this method, even if the intensity distribution of the multiple reflected excimer laser beam is not uniform, in order to give an appropriate processing energy to the workpiece, the scanning movement direction of the mask and the workpiece and the reflection movement direction of the excimer laser beam are set. Match.

JP-A-8-201813 JP 2006-289388 A Japanese Patent Laid-Open No. 8-66781

  In the conventional laser processing method, studies have been made on uniformly performing laser processing on a workpiece (workpiece), but no study has been made on improving the processing speed. In the conventional laser processing method, particularly in the processing method using a mask as disclosed in Patent Document 3, when the overlap rate is defined, the scan speed is determined by the laser repetition frequency and the size of the pattern formed on the mask. Therefore, the machining speed could not be improved.

  The present invention has been conceived in view of such circumstances, and an object thereof is to improve the processing speed in the laser processing method and the laser processing apparatus.

  In the laser processing method according to the present invention, an image of a mask pattern by laser light is projected onto a workpiece, and the mask and workpiece are placed so that a part of the pattern image is superimposed for each pulse of laser light. A relatively moving laser processing method, wherein a mask and a workpiece are moved relatively so that an image of a pattern moves in a first direction on the workpiece, The images of n patterns arranged in the first direction are projected so that the size of each image in the first direction is a and the interval is p, and the repetition frequency of the laser light pulse is f. The amount of movement of the image for each pulse of the laser beam in the first direction on the workpiece is r, and the relative movement speed of the image and the workpiece in the first direction is s. Satisfy the relationship of s = n × p × f, r = n × p, and r = a / n

  The laser processing apparatus according to the present invention projects an image of a mask pattern by laser light onto a workpiece, and the mask and workpiece are overlapped so that a part of the pattern image is superimposed for each pulse of laser light. A laser processing apparatus for relatively moving, a moving means for relatively moving a mask and a workpiece so that an image of a pattern moves in a first direction on the workpiece, and laser light irradiation A control means for controlling the means and the moving means; and images of n patterns arranged in the first direction on the workpiece; each image dimension in the first direction is a and the interval is p. And the repetition frequency of the pulse of the laser beam is f, and the amount of movement of the image for each pulse of the laser beam in the first direction on the workpiece is r, The relative moving speed of the workpiece in the first direction is s If that, s = n × p × f, r = n × p, and, so as to satisfy the relation r = a / n, and a control means for controlling the laser beam irradiation means and the moving means.

  According to the above configuration, it is possible to irradiate the same place with the appropriate number of times (pulses) while irradiating the workpiece with the pulsed laser light with a plurality of pattern images at a time. Therefore, the processing speed can be improved as compared with the method of irradiating a single pattern image laser beam at a time.

It is a figure which shows typically the structure of the laser apparatus by which one Embodiment of the laser processing method of this invention is implemented. It is a figure which shows the hardware constitutions of the control system of FIG. It is an expansion perspective view of the mask of FIG. It is a figure which shows typically a mode that a laser beam is irradiated on a board | substrate in the laser apparatus of FIG. It is a figure which shows typically the image formed on a board | substrate by one pulse irradiation in the laser apparatus of FIG. It is a figure which shows typically the image formed on a board | substrate by the continuous pulse irradiation in the laser apparatus of FIG. It is a figure which shows typically the image formed on a board | substrate by the pulse irradiation in the comparative example (1) of the laser apparatus of FIG. It is a figure which shows typically the image formed on a board | substrate by one pulse irradiation in the comparative example (2) of the laser apparatus of FIG. It is a figure which shows typically the image formed on a board | substrate by the continuous pulse irradiation in the comparative example (2) of the laser apparatus of FIG. (A) is a figure which shows typically the image formed on a board | substrate by one pulse irradiation in the 1st modification of the laser apparatus of FIG. 1, (B) is the said modification. It is a figure which shows typically the image formed on a board | substrate by continuous pulse irradiation. (A) is a figure which shows typically the image formed on a board | substrate by one pulse irradiation in the 2nd modification of the laser apparatus of FIG. 1, (B) is the said modification. It is a figure which shows typically the image formed on a board | substrate by continuous pulse irradiation.

  Hereinafter, an embodiment of an information processing apparatus according to the present invention will be described with reference to the drawings. In each figure, constituent elements that exhibit the same function are denoted by the same reference numerals, and detailed description thereof will not be repeated.

[1. Schematic configuration of laser apparatus]
FIG. 1 is a diagram schematically showing the configuration of a laser apparatus in which an embodiment of the laser processing method of the present invention is implemented.

  Referring to FIG. 1, the laser apparatus includes a laser oscillator 400, a mirror 504, a beam expander 300, a mirror 503, a mask 501, and an imaging lens 506. The laser apparatus also includes an XY table 200 on which a substrate 600 that is a workpiece is placed.

  The laser beam oscillated from the laser oscillator 400 is reflected by the mirror 504 and sent to the beam expander 300, the divergence angle of which is adjusted by the beam expander 300, and then sent to the mirror 503, which is applied to the mask 501 by the mirror 503. Sent. A pattern to be described later is formed on the mask 501. Then, an image of the pattern of the mask 501 of the laser beam is formed on the substrate 600 at a predetermined magnification by the imaging lens 506.

  Note that a beam homogenizer (intensity equalizing optical system) is added between the beam expander 300 and the mask 501 in order to irradiate laser light with uniform intensity over the entire light irradiation region of the mask 501. May be.

  The XY table 200 includes a mounting table 202 on which the substrate 600 is mounted, and a driving unit 201 that moves the mounting table 202 with respect to the mask 501. The drive unit 201 includes, for example, a drive source such as a motor, and moves the XY table 200 in the X direction (the double arrow AX direction in FIG. 1) and the Y direction (the direction perpendicular to the paper surface in FIG. 1).

  The control system 100 controls the operations of the laser oscillator 400 and the drive unit 201. The hardware configuration of the control system 100 is shown in FIG.

[2. Hardware configuration of control system]
Referring to FIG. 2, the computer constituting control system 100 includes a processing device 102, a storage device 103, a ROM (Reed Only Memory) 104, a RAM (Random Access Memory) 105, a display device 106, an operation panel 107, and A network interface (I / F) 108 is provided. These elements are connected to each other by a bus 101.

  The processing device 102 includes a processor such as a CPU (Central Processing Unit). When the processor (processing device 102) executes the program stored in the storage device 103, the processing device 102 controls the operations of the laser oscillator 400 and the XY table 200 described in this specification. Note that the program executed by the processing device 102 does not necessarily have to be stored in the storage device 103, and may be recorded on a recording medium configured to be detachable from the computer including the processing device 102. You may memorize | store in the memory | storage device which can communicate via a network.

  The RAM 105 serves as a work area for the processing apparatus 102. The operation panel 107 is a known device for inputting information, such as a keyboard, a mouse, and a touch panel.

  The storage device 103 stores various data such as pulse energy intensity used in the present embodiment. The stored contents will be described later.

  The control system 100 transmits a control signal to the drive unit 201 and the laser oscillator 400 of the XY table 200 via the network I / F 108. As a result, the laser oscillator 400 oscillates the laser beam having the instructed intensity at the timing instructed from the control system 100. The drive unit 201 moves the mounting table 202 in a pattern instructed by the control system 100.

[3. Mask configuration]
FIG. 3 is an enlarged perspective view of the mask 501. On the mask 501, four substantially square patterns 511 to 514 are formed.

  FIG. 4 schematically shows a state in which a laser beam is irradiated onto the substrate 600 in this embodiment mode.

  As understood from FIG. 4, the beam BM sent from the mirror 503 to the mask 501 is sent onto the substrate 600 as the beams BM01 to BM04 through the patterns 511 to 514 of the mask 501. On the substrate 600, images of the beams BM01 to BM04 are projected.

  In this embodiment mode, as described above, the laser beam is irradiated over the entire substrate 600 by continuously irradiating the substrate 600 with the laser beam while moving the mounting table 202 with respect to the mask 501. . Note that when the laser beam is irradiated, the mounting table 202 and the mask 501 may be relatively moved, and the irradiation position of the laser beam on the substrate 600 may be moved in the X-axis direction. That is, the mounting table 202 (substrate 600) may be fixed, and the mask 501 (and the optical system (mirrors 503, 504, etc.) for irradiating the mask 501 with a laser beam) may be moved. 600) and the mask 501 (and the optical system) may be moved. Note that in this embodiment mode, the moving direction of the irradiation position of the laser beam on the substrate 600 is referred to as a scanning direction.

  In FIG. 4, the X axis and the Y axis are shown. The direction of the X axis corresponds to the direction of the double arrow AX in FIG.

  The images of the beams BM01 to BM04 are arranged in the X axis direction. Then, by moving the substrate 600 in the X-axis direction with respect to the mask 501, the laser beam is irradiated in a line shape along the X-axis direction. Lines E <b> 1 to E <b> 4 indicate lines irradiated with a laser beam on the substrate 600.

  In this embodiment mode, a laser beam is irradiated line by line. Specifically, a line E1 is formed by performing irradiation along the arrow A11, and after the laser irradiation position is shifted by a distance L in the Y-axis direction, irradiation is performed along the arrow A12 to perform the line E2. Is formed, the laser irradiation position is shifted by the distance L in the Y-axis direction, and irradiation is performed along the arrow A13 to form the line E3. The laser irradiation position is shifted by the distance L in the Y-axis direction. FIG. 4 shows a state in which the laser beam is irradiated so as to form the line E3 along the arrow A13 after the line E2 is formed and the laser irradiation position is shifted by the distance L in the Y-axis direction. Has been.

  In FIG. 4, the dimension in the Y-axis direction of the region where the laser beam is shielded by the mask 501 (the image when the outline image of the mask 501 is projected onto the substrate 600) is indicated by M. In the present embodiment, M is configured to be shorter than L.

[4. Image on workpiece in single pulse irradiation of laser beam]
FIG. 5 schematically shows an image formed on the substrate 600 by one pulse irradiation.

An arrow X in FIG. 5 indicates the scan direction described above.
The images S1 to S4 are images formed on the substrate 600 via the patterns 511 to 514 of the mask 501 respectively. The images S <b> 1 to S <b> 4 have a dimension (a) in the scanning direction, and the images are projected with a distance p (mm) apart in the scanning direction. The dimension a (mm) is set to 0.4 (mm), for example. The distance p (mm) is, for example, 0.1 (mm).

[5. Image on workpiece in continuous laser beam irradiation]
FIG. 6 schematically shows an image formed on the substrate 600 by a plurality of continuous pulse irradiations.

  In FIG. 6, images S <b> 11 to S <b> 14 are a set of images on the substrate 600 when the first pulse irradiation is performed on the substrate 600 with the image arrangement as illustrated in FIG. 5. An arrow X in FIG. 6 indicates the scan direction.

  In this embodiment, it is assumed that the irradiation position of the laser beam moves by r (mm) in the scanning direction for each pulse. r is represented by r = n × p, and n is the number of images formed on the substrate 600 by one pulse irradiation, and is the number of patterns formed in the direction corresponding to the scanning direction in the mask 501. is there. By adjusting r in this way, the pulse irradiation can be performed four times on the substrate 600 efficiently with no gap on the right side of the position P1.

  Since the irradiation position of the laser beam moves for each pulse as described above, in the present embodiment, the images of the second and subsequent pulse irradiations are projected at positions as indicated by the images S21 to S24 in FIG. Is done. Specifically, the images S21 to S24 are a set of images on the substrate 600 when the second pulse irradiation is performed. Images S31 to S34 are a set of images on the substrate 600 when the third pulse irradiation is performed. Images S41 to S44 are a set of images on the substrate 600 when the fourth pulse irradiation is performed. Images S51 to S54 are a set of images on the substrate 600 when the fifth pulse irradiation is performed.

  In FIG. 6, for ease of explanation, each image is described by being slightly shifted in the Y-axis direction for each number of pulse irradiations. However, in actuality, the Y-axis direction in FIG. Are arranged at the same position. In FIG. 6, the Y-axis direction is a direction intersecting with the X-axis direction, and the X-axis direction is a scanning direction. In addition, in FIG. 6, a plurality of broken lines arranged in the X-axis direction are supplementarily described for ease of explanation, and the distance between images shown in FIG. 5 in the X-axis direction. They are arranged at intervals corresponding to p.

  In this embodiment mode, for ease of explanation, it is assumed that the processing is completed when pulse irradiation is performed four times on the substrate 600.

  In the example shown in FIG. 6, four times of pulse irradiation is performed on the same location on the substrate 600 for the first time when the image S14, the image S23, the image S32, and the image S41 overlap. That is, in FIG. 6, four images are superimposed in a region on the right side of the position P <b> 1 on the substrate 600. In FIG. 6, the area | region of the position P1-P1 'where the laser processing was completed by performing pulse irradiation 4 times is shown as an effective area | region.

[6. Comparison with comparative example]
(6-1. Comparative Example (1))
As a comparative example of the present embodiment, FIG. 7 shows an image formed on the substrate 600 by a plurality of continuous pulse irradiations when only one image is projected on the substrate 600 by one pulse irradiation. Is shown schematically.

  In FIG. 7, the images SA01 to SA36 formed on the substrate 600 by each pulse irradiation are arranged from left to right in the order of projection onto the substrate 600. In FIG. 7, the scanning direction is indicated by the X axis. The images SA01 to SA36 are actually arranged at the same position in the Y-axis direction. However, in FIG. 7, the images are illustrated so as to be shifted every four images in order to facilitate the explanation. In FIG. 7, a plurality of broken lines arranged in the X-axis direction supplementarily indicates an interval corresponding to the distance p between images in FIG. 5.

  In this comparative example, the pulse irradiation is performed four times on the same location on the substrate 600 for the first time when the images SA01 to SA04 overlap. Thereby, the effective area | region in this comparative example becomes position P2-P2 '.

  In this embodiment, in order to perform pulse irradiation four times at the same location in the region to the right of the position P2 without a gap, the movement distance in the scanning direction for each pulse at the laser irradiation position is set to r (r = N × 1 / 4a).

Here, the time required for scanning is compared between the example shown in FIG. 6 and the comparative example of FIG.
In the example shown in FIG. 6 and this comparative example, the dimension (a) in the scanning direction of each image irradiated on the substrate 600 is set to 0.4 (mm), and the repetition frequency of the laser pulse is set to 1000 (Hz). .

In the comparative example of FIG. 7, the relative movement amount of the laser beam (image) for each pulse and the substrate 600 in the scanning direction is 0.1 (mm). In this case, the relative moving speed (scanning speed) of the laser beam (image) and the substrate 600 in the scanning direction is 100 (mm / sec). Scanning is performed by driving the mounting table 202 by the driving unit 201. The acceleration is 1 G (= 9806 mm / sec ² ), and the machining distance excluding the acceleration / deceleration distance (processing in the X-axis direction is performed). When the power dimension (L1 in FIG. 4) is 1000 mm (constant velocity section length), the time required to process the processing distance (scanning time) is expressed by the following equation (1): 10.02 (sec).

Scan time = time to scan the constant velocity section + acceleration and deceleration time of the mounting table
= 1000/100 + 100/9806 × 2
= 10.02 (sec) (1)
On the other hand, in the example of FIG. 6, if the number of images irradiated at once (the number of patterns on the mask 501) is 4, and the other conditions are the same as those of the comparative example of FIG. Since the speed can be made four times that of the comparative example in FIG. 7, the scan time is 2.52 (sec) as represented by the following equation (2).

Scan time = time to scan the constant velocity section + acceleration and deceleration time of the mounting table
= 1000 / (100 × 4) + 100/9806 × 2
= 2.52 (sec) (2)
In the above formula (2), when the speed at which the constant speed section length is scanned is the speed s, the time for scanning the constant speed section length is the product of this and the constant speed section length (1000 mm). It has been calculated. The speed s is expressed by the following equation (3).

s = n × p × f (3)
In Expression (3), n is the number of images projected on the substrate 600 with one pulse irradiation. In the above formula (2), n is 4.

  p is an interval between images projected on the substrate 600 by one pulse irradiation. In the above formula (2), p is set to 0.1 (mm).

  f is the repetition frequency of the laser pulse. In the above formula (2), f is 1000 (Hz).

In the present embodiment, the above-described relative movement amount r is expressed by the following equation (4).
r = n × p (4)
In Expression (4), n is the number of images projected on the substrate 600 by one pulse irradiation as described above. As described above, p is an interval between images projected on the substrate 600 by one pulse irradiation. Further, p is expressed by the following equation (5), where the dimension of each image in the scan direction is a.

p = a / n (5)
As described above, a plurality of images can be projected on the substrate 600 by one-time pulse irradiation by forming a plurality of patterns on the mask 501 as in the present embodiment described mainly with reference to FIG. In addition, the interval between the images irradiated onto the substrate 600 at a time is adjusted as described above, the relative movement amount is adjusted according to the interval, and the scan speed is adjusted as described above. The scanning speed can be improved and the productivity can be improved.

(6-2. Comparative Example (2))
As a second comparative example of the present embodiment, an example will be described in which the interval between images projected on the substrate 600 by one pulse irradiation is longer than p described mainly with reference to FIG. .

  FIG. 8A schematically shows a plurality of images S1 to S4 irradiated on the substrate 600 by one pulse irradiation according to the present embodiment shown in FIG.

  On the other hand, FIG. 8B schematically shows a plurality of images SA1 to SA4 irradiated on the substrate 600 by one pulse irradiation according to the comparative example. 8A and 8B, the downward arrows indicate the scanning direction.

  In FIG. 8B, the dimensions of the images SA1 to SA4 in the scanning direction are set to a as in the images S1 to S4. On the other hand, the distance between the images in the scanning direction of the images SA1 to SA4 is a distance 2p. That is, it is set to twice the interval in the images S1 to S4.

  FIG. 9 schematically shows an image irradiated on the substrate 600 when scanning (continuous laser irradiation) in the mode according to FIG. 8B is performed.

  Referring to FIG. 9, images S <b> 901 to S <b> 904 are displayed on the substrate 600 when the first pulse irradiation is performed on the substrate 600 with the image arrangement as shown in FIG. 8B. A set of statues. The X-axis direction in FIG. 9 indicates the scan direction.

  In this comparative example, the irradiation position of the laser beam moves by r (mm) in the scanning direction for each pulse. r is represented by r = n × p, and n is the number of images formed on the substrate 600 by one pulse irradiation.

  Since the irradiation position of the laser beam moves for each pulse as described above, in this comparative example, an image obtained by the second and subsequent pulse irradiations is projected at a position as shown in the images S911 to S914 and the like. Specifically, the images S911 to S914 are a set of images on the substrate 600 when the second pulse irradiation is performed. Images S921 to S924 are a set of images on the substrate 600 when the third pulse irradiation is performed. Images S931 to S934 are a set of images on the substrate 600 when the fourth pulse irradiation is performed. Images S941 to S944 are a set of images on the substrate 600 when the fifth pulse irradiation is performed. Images S951 to S954 are a set of images on the substrate 600 when the sixth pulse irradiation is performed.

  In FIG. 9, as in FIG. 6 and the like, each image is described by being slightly shifted in the Y-axis direction for each number of pulse irradiations for ease of explanation. It arrange | positions in the same position about the inside Y-axis direction. In FIG. 9, a plurality of broken lines are arranged in an auxiliary manner in the X-axis direction at intervals corresponding to the distance p between images shown in FIG.

  In this comparative example, when the image 904, the image 913, the image 922, and the image 934 overlap, the pulse irradiation is performed four times on the same portion on the substrate 600 for the first time.

  However, in this comparative example, in this comparative example, four pulses are irradiated to the same location, but the overlap rate is 50%. On the other hand, in the laser irradiation according to the embodiment of the present invention shown in FIG. 6, four pulses are irradiated to the same location, and the overlap rate is 25%. Processing that requires the overlap rate to be defined in terms of processing characteristics (for example, as described in Patent Document 1 and Patent Document 2, the predetermined overlap rate is set, that is, the irradiation position is slightly changed for each pulse. In some cases, the workability may be improved by performing the processing while shifting the position of the head), and the method according to the embodiment of the present invention is effective.

[7. Modified example]
In the present embodiment described above, the number of images irradiated on the substrate 600 by one pulse irradiation is four, but the number in the laser processing method according to the present invention is not limited to this.

  10 (A), FIG. 10 (B), FIG. 11 (A), and FIG. 11 (B), a modification when the number is 2 and a modification when the number is 3, respectively. Show.

(7-1. When n = 2)
FIG. 10A shows an image S1 and an image S2 when the number of images projected on the substrate 600 by one pulse irradiation is two. The dimensions of the image S1 and the image S2 in the scanning direction (arrow X direction) are a and the interval is p.

  In the scan of the modification example shown in FIG. 10A, as shown in FIG. 10B, images on the substrate 600 by each pulse irradiation are shown as images S11 to S82. Specifically, the images S11 to S12 are a set of images on the substrate 600 when the first pulse irradiation is performed. The images S21 to S22 are the second time, the images S31 to S32 are the third time, the images S41 to S42 are the fourth time, the images S51 to S52 are the fifth time, the images S61 to S62 are the sixth time, and the images S71 to S22. S72 is the seventh set, and images S81 to S82 are the set of images on the substrate 600 when the respective pulse irradiations are performed.

  Also in the modified example described with reference to FIG. 10A, the scan speed s and the relative movement amount r of the constant speed section length are the same as in the embodiment described mainly with reference to FIGS. Further, the distance (interval) p between images projected on the substrate 600 by one pulse irradiation can be determined using Expression (3), Expression (4), and Expression (5). As a result, an image when continuously pulsed is projected as shown in FIG. Since n is 2 in this modification, in FIG. 10B, the relative movement amount r is changed from 4p to 2p as compared with the example in which n described with reference to FIGS. 5 and 6 is 4. has been edited. That is, for example, the distance between corresponding portions of the image S11 and the image S21 and the distance between corresponding portions of the image S21 and the image S31 are set to 2p.

  In this modification, four times of pulse irradiation is performed on the same location on the substrate 600 for the first time when the image S12, the image S22, the image S31, and the image S41 overlap. As a result, the effective area in this modification is an area on the right side of the position P3.

  Consider the scan time described in equation (1). In the modification described with reference to FIGS. 10A and 10B, assuming that the number of images irradiated at one time is 2, and other conditions are the same as those in the comparative example in FIG. The speed during the fast scan can be double that of the comparative example of FIG. As a result, the scan time is 5.02 (sec) as represented by the following equation (6).

Scan time = time to scan the constant velocity section + acceleration and deceleration time of the mounting table
= 1000 / (100 × 2) + 100/9806 × 2
= 5.02 (sec) (6)
That is, the scan time (10.02 (sec)) of the comparative example calculated by the equation (1) can be shortened.

(7-2. When n = 3)
In the scan of the modification example shown in FIG. 11A, as shown in FIG. 11B, images on the substrate 600 by each pulse irradiation are shown as images S11 to S63. Specifically, the images S11 to S13 are a set of images on the substrate 600 when the first pulse irradiation is performed. The images S21 to S23 are the second time, the images S31 to S33 are the third time, the images S41 to S43 are the fourth time, the images S51 to S53 are the fifth time, and the images S61 to S63 are the sixth time. This is a set of images on the substrate 600 when the pulse irradiation is performed.

  Also in the modified example described with reference to FIG. 11A, the scanning speed s and the relative movement amount r of the constant velocity section length are the same as in the embodiment described mainly with reference to FIGS. The distance p between images projected on the substrate 600 by one pulse irradiation can be determined using the equations (3), (4), and (5). Thereby, an image when continuously irradiated with pulses is projected as shown in FIG. Since n is 3 in the present modification, the relative movement amount r is changed from 4p to 3p in FIG. 11B as compared to the example where n is 4 described with reference to FIGS. has been edited. That is, for example, the distance between the corresponding portions of the image S11 and the image S21 and the distance between the corresponding portions of the image S21 and the image S31 are 3p.

  In this modification, four times of pulse irradiation is performed on the same location on the substrate 600 for the first time when the image S13, the image S22, the image S32, and the image S41 overlap. Thereby, the effective area in this modification is an area on the right side of the position P4.

  Consider the scan time described in equation (1). In the modification described with reference to FIGS. 11A and 11B, assuming that the number of images irradiated at one time is 3, and other conditions are the same as those in the comparative example in FIG. The speed during the fast scan can be three times that of the comparative example of FIG. As a result, the scan time is 3.35 (sec) as represented by the following equation (7).

Scan time = time to scan the constant velocity section + acceleration and deceleration time of the mounting table
= 1000 / (100 × 3) + 100/9806 × 2
= 3.35 (sec) (7)
That is, the scan time (10.02 (sec)) of the comparative example calculated by the equation (1) can be shortened.

[8. Other modifications]
In the above-described embodiment and its modifications, the shape of each image projected onto the substrate 600 through the mask 501 by irradiation with laser light is rectangular, but the present invention is not limited to this. Not. In addition, the scan is linear, but it may be curved. Further, the above values for the repetition frequency and the constant velocity section length of the laser pulse are merely examples, and are not limited thereto. It may be changed as appropriate for each system to which the present invention is applied.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 100 Control system, 102 Processing apparatus, 103 Memory | storage device, 200 Table, 201 Drive part, 202 Mounting stand, 300 Beam expander, 400 Laser oscillator, 501 Mask, 511-514 pattern, 600 board | substrate.

Claims (3)

Laser processing for projecting an image of a mask pattern by a laser beam onto a workpiece and relatively moving the mask and the workpiece so that a part of the pattern image overlaps for each pulse of the laser beam A method,
Moving the mask and workpiece relatively such that the image of the pattern moves in a first direction on the workpiece;
Projecting images of the n patterns arranged in the first direction on the workpiece so that the size of each image in the first direction is a and the interval is p,
The repetition frequency of the pulse of the laser beam is f, the amount of movement of the image in the first direction on the workpiece for each pulse of the laser beam is r, and the image and the workpiece If the relative speed of movement of the object in the first direction is s,
A laser processing method that satisfies a relationship of s = n × p × f, r = n × p, and r = a / n. The workpiece is irradiated with the laser light in a line shape along the first direction and in a plurality of lines arranged in a second direction intersecting the first direction,
The lines are arranged for each dimension L in the second direction;
2. The laser processing method according to claim 1, wherein a dimension M in the second direction in which an image of the entire mask by the laser light is projected onto a workpiece is smaller than the dimension L. 3. Laser processing for projecting an image of a mask pattern by a laser beam onto a workpiece and relatively moving the mask and the workpiece so that a part of the pattern image overlaps for each pulse of the laser beam A device,
Moving means for relatively moving the mask and the workpiece so that an image of the pattern moves in a first direction on the workpiece;
Control means for controlling the laser light irradiation means and the moving means;
Projecting n images of the pattern arranged in the first direction on the workpiece so that the size of each image in the first direction is a and the interval is p, and The repetition frequency of the pulse of the laser beam is f, the amount of movement of the image in the first direction on the workpiece for each pulse of the laser beam is r, and the image and the workpiece When the relative moving speed of the object with respect to the first direction is s, the relationship of s = n × p × f, r = n × p, and r = a / n is satisfied. A laser processing apparatus comprising a laser beam irradiation unit and a control unit that controls the moving unit.

Images