JP2012033735A - Electronic component supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component supply device capable of finely adjusting the extraction position of an electronic component in the X-direction.SOLUTION: A reference pin 11 is provided on a coupling part 1a of a feeder base 2 coupled to a feeder bank 61. When a tape feeder 1 is mounted on the feeder bank 61, the reference pin 11 is coupled and fixed to the feeder bank 61, and a relative position in the X-direction of the reference pin 11 with respect to the feeder base 2 can be changed by a piezoelectric actuator 16. The piezoelectric actuator 16 is drive-controlled so that an extraction position in the X-direction of an electronic component is located at a desired position.

Description

  The present invention relates to an electronic component supply device that is attached to an electronic component mounting apparatus and supplies the electronic component to the electronic component mounting apparatus.

A conventional electronic component supply device holds a reel wound with a winding tape in which the same electronic components are lined and sealed at a uniform interval, and is mounted on a feeder bank of an electronic component mounting device and enclosed in the winding tape. The manufactured electronic components are sequentially supplied (see, for example, Patent Document 1).
A plurality of electronic component supply devices (electronic component feeders) are mounted on the feeder bank according to the type of electronic components required. The electronic component supplied from the electronic component feeder is sucked by the suction head on the electronic component mounting apparatus side and mounted at a predetermined position on the circuit board installed in the electronic component mounting apparatus.

By the way, in the conventional electronic component supply apparatus, the position adjustment of the component supply unit is mainly performed in the direction in which the electronic component is intermittently fed (Y direction).
As a technique for adjusting the position of the component supply unit in the width direction (X direction orthogonal to the Y direction), for example, there is a technique described in Patent Document 2. In this technology, a reference pin and an eccentric pin are provided at a predetermined distance in the length direction (Y direction) of the base at a joint portion of the base of the component supply unit with the base, and the reference pin is adjusted by rotating the eccentric pin. The base is swiveled as a center. Thereby, the position adjustment of the taking-out position of the electronic component provided in the front end side of the base in the X direction is performed.

JP 2004-134556 A JP-A-5-191084

In the above-described conventional electronic component supply apparatus, the adjustment of the take-out position of the electronic component with respect to the Y-direction electronic component mounting apparatus can be performed by controlling the motor used for tape feeding, and in the case of a stepping motor, in units of pulses. The position can be adjusted. However, the adjustment of the take-out position of the electronic component with respect to the X-direction electronic component mounting apparatus must be performed by a human hand, and it is difficult to adjust the position in minute units, and it takes time to adjust to the desired position. .
Therefore, an object of the present invention is to provide an electronic component supply apparatus that can adjust the take-out position of the electronic component in the X direction in minute units.

In order to solve the above-described problem, an electronic component supply device according to claim 1 is configured to be separable and connectable to a mounting base of an electronic component mounting device, and in the state of being connected to the mounting base, An electronic component supply device that sequentially supplies components to a component take-out position by a suction nozzle of the electronic component mounting device, provided at a joint portion with the mounting base, connected and fixed to the mounting base, and electronic component supply A connecting portion capable of changing a relative position in the width direction of the base with respect to a base of the unit, an actuator for adjusting the relative position of the connecting portion, and a drive control means for driving and controlling the actuator. Yes.
As described above, since the relative position in the X direction of the connecting portion with respect to the base of the electronic component supply unit can be adjusted by the actuator, the adjustment of the take-out position of the electronic component can be performed electrically without using a human hand as in the conventional device. It can be carried out. Therefore, the position adjustment can be performed quickly in minute units.

According to a second aspect of the present invention, in the electronic component supply device according to the first aspect of the present invention, the shift amount in the width direction of the base between the actual electronic component suction position by the suction nozzle and a desired suction position is detected. A deviation amount detection unit is provided, and the drive control unit drives and controls the actuator so that the deviation amount detected by the deviation amount detection unit falls within a predetermined allowable range.
Thereby, the adsorption | suction position of an electronic component can be adjusted to a desired position appropriately.
Furthermore, the electronic component supply apparatus according to a third aspect is characterized in that, in the invention according to the second aspect, the desired suction position is a center position of the electronic component.
In this way, since the suction position of the electronic component is adjusted to the center position of the electronic component, stable component suction by the suction nozzle can be realized.

According to a fourth aspect of the present invention, in the electronic component supply device according to any one of the first to third aspects, the connection portion includes a reference pin that fits into a connection hole formed in the mounting base, and the reference pin. And an elastic body that urges the base in a width direction of the base, and the actuator is configured to press the connecting portion in a direction against the urging force of the elastic body in an operating state. It is characterized by being.
Thus, the electronic component take-out position adjusting mechanism can be realized with a relatively simple configuration.

  According to the present invention, since the relative position in the X direction of the base of the electronic component supply unit with respect to the mounting base of the electronic component mounting apparatus can be electrically adjusted, the component suction position in the X direction can be quickly adjusted in minute units. be able to. Therefore, the component suction position can be adjusted to a desired position, and the suction rate of the electronic component can be improved.

It is a side view which shows the structure of the electronic component supply apparatus in this invention. It is a perspective view which shows the specific structure of a reference | standard pin periphery part. It is a figure for demonstrating operation | movement of a reference | standard pin. It is a figure for demonstrating a locking mechanism. It is a top view which shows the structure of an electronic component mounting apparatus. It is a fragmentary perspective view which shows the structure of a feeder bank. It is a top view which shows a reference | standard pin guide. It is a figure which shows the bank mounting | wearing operation | movement of a feeder. It is a figure which shows the state of the reference | standard pin at the time of bank mounting | wearing of a feeder. It is a figure which shows the locked state of a feeder. It is a circuit block diagram of a feeder substrate. It is a flowchart which shows a suction position adjustment processing procedure. It is a figure which shows the relationship between a reference | standard pin position and an adsorption | suction position. It is a figure which shows the state before and after adsorption | suction position adjustment. It is a figure which shows the relationship between an actuator drive voltage and an actuator displacement amount.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
(Constitution)
FIG. 1 is a side view showing a configuration of an electronic component supply apparatus according to the present invention.
As shown in FIG. 1, an electronic component supply apparatus 1 is a tape feeder that supplies electronic components using a tape reel. A plurality of tape feeders 1 are mounted in parallel in a feeder bank (mounting base) of an electronic component mounting apparatus to be described later.
A sprocket 3 is disposed at the front end of the feeder base 2 (the right end in FIG. 1). The teeth of the sprocket 3 are engaged with holes provided in the carrier tape 20 at a constant pitch. The sprocket 3 is rotated by the feed motor 4 as a power source so that the carrier tape 20 is moved in the transport direction H. Sent out.

The carrier tape 20 is composed of two layers of a base tape 21 that accommodates a plurality of electronic components and a cover tape 22 that covers the electronic components so as not to fall. The cover tape 22 is peeled off from the base tape 21 by the upper cover 5 before the nozzle suction position (component extraction position) P for picking up electronic components.
The cover tape 22 peeled off from the base tape 21 is pulled in a collecting direction K opposite to the conveying direction H by a pair of opposing collecting rollers 6, and is accommodated in the cover tape accommodating portion 8 from the introduction port 8a. The collection roller 6 rotates using the pull motor 7 as a power source.

A reference pin 11 is provided on the lower surface of the front end portion of the feeder base 2. The reference pin 11 is provided at a joint portion 1a with a feeder bank, which is a mounting base for the tape feeder 1 in the electronic component mounting apparatus, and is connected and fixed to the feeder bank when the electronic component mounting apparatus is mounted. .
Further, on the lower surface of the feeder base 2, a slide rail 31, a reference pin 32, and a Y-direction stop plate 33 that are respectively engaged with each member of a feeder bank to be described later are provided.
In the examples of the present specification, the Y direction means the transport direction H of the carrier tape 20 (left and right direction in FIG. 1), and the X direction means the width direction of the feeder base 2 (perpendicular direction in FIG. 1). means.

First, a specific configuration around the reference pin 11 will be described with reference to FIGS.
As shown in FIG. 2, the reference pin 11 is fixed to the central portion of the reference pin block 12 in a state where a part thereof protrudes below the feeder base 2.
The reference pin block 12 is formed with an elongate fixing hole 12a for fixing the reference pin block 12 to the feeder base 2. The reference pin block 12 is attached to the lower surface of the feeder base 2 by a step screw 13. ing.
At this time, the reference pin block 12 is attached to the feeder base 2 so that the longitudinal direction of the long hole of the fixing hole 12a coincides with the width direction (X direction) of the feeder base 2. That is, the reference pin block 12 is configured to freely move within the range of the long hole longitudinal dimension of the fixing hole 12a.

An actuator fixing block 15 is fixed by screws near the attachment position of the reference pin block 12 on the feeder base 2. The actuator fixing block 15 holds a piezoelectric actuator 16.
The piezoelectric actuator 16 is controlled in driving voltage by a command from a control board described later, and is displaced in the X direction according to the driving voltage.

  When the piezoelectric actuator 16 is not in operation, the reference pin block 12 is urged toward the piezoelectric actuator 15 by an elastic body 14 such as a spring, as shown in FIG. 16 is pressed with a constant force. That is, when the piezoelectric actuator 16 is not operated, the reference pin block 12 is positioned on the maximum side in the X direction by the urging force of the elastic body 14.

  On the other hand, when the piezoelectric actuator 16 is actuated, a force is generated in the piezoelectric actuator 16 to be displaced in the right direction in the figure, and this force overcomes the urging force of the elastic body 14, as shown in FIG. The piezoelectric actuator 16 is displaced rightward in the drawing (X direction minus side). At this time, the reference pin block 12 is also displaced to the X direction minus side in accordance with the displacement of the piezoelectric actuator 16.

  Returning to FIG. 1, the tape feeder 1 includes a lock release lever 35 and a lock spring 36. These are for fixing the tape feeder 1 to the feeder bank, and by moving the lock release lever 35 up and down as shown in FIGS. The lock mechanism operates. Here, the lock release lever 35 is lowered to enter the unlocked state, and the lock release lever 35 is raised to enter the locked state.

Next, the configuration of the electronic component mounting apparatus will be described.
FIG. 5 is a plan view showing the electronic component mounting apparatus.
In the figure, reference numeral 50 denotes an electronic component mounting apparatus. The electronic component mounting apparatus 50 includes a pair of transport rails 52 that extend in the X direction on the upper surface of the base 51. The transport rail 52 supports both sides of the circuit board C and is driven by a transport motor (not shown) to transport the circuit board C in the X direction.

In addition, the electronic component mounting apparatus 50 includes a mounting head 53. The mounting head 53 includes a plurality of suction nozzles that suck electronic components at the bottom, and is configured to be horizontally movable on the base 51 in the XY directions by an X-axis gantry 54 and a Y-axis gantry 55.
In this electronic component mounting apparatus 50, a plurality of tape feeders 1 are mounted on both sides of the transport rail 52 in the Y direction. The electronic components supplied from the tape feeder 1 are vacuum-sucked by the suction nozzle of the mounting head 53 and mounted on the circuit board C.
A recognition camera 56 made up of a CCD camera is disposed between the tape feeder 1 and the circuit board C. The recognition camera 56 detects the electronic component suction position deviation (deviation between the center position of the suction nozzle and the center position of the sucked part) and the suction angle deviation (tilt) of the electronic component. Is taken.

Next, the configuration of the feeder bank of the electronic component mounting apparatus 50 will be described.
FIG. 6 is a partial perspective view showing the configuration of the feeder bank, and shows the α part of FIG.
In the figure, reference numeral 61 denotes a feeder bank. The feeder bank 61 detachably holds a plurality of tape feeders 1 in a parallel state, and includes a plurality of guide rails 62 extending in a mounting direction (Y direction) of the tape feeder 1. A reference pin guide 63 into which the reference pin 11 provided at the front end of the tape feeder 1 is inserted is provided in front of the tape feeder 1 in the mounting direction.

As shown in the plan view of FIG. 7, the reference pin guide 63 is formed in a substantially U shape having an opening on the guide rail 62 side.
With this configuration, when the tape feeder 1 is mounted on the feeder bank 61, first, the tape feeder 1 is placed between the guide rails 62 of the feeder bank 61, and the slide rail 31 of the tape feeder 1 is below the guide rails 62. Insert to place. Then, as shown in FIG. 8, the tape feeder 1 is slid in the mounting direction.

  As shown in FIG. 9A, the reference pin guide 63 is provided at a position where it can contact the reference pin 11 provided at the front end of the tape feeder 1. Therefore, when the tape feeder 1 is slid in the mounting direction, the reference pin 11 is fitted with the reference pin guide 63 as shown in FIG. At this time, the tape feeder 1 stops at a position where the Y-direction stop plate 33 comes into contact with a predetermined contact surface of the feeder bank 61.

  Further, as shown in FIG. 8, the feeder bank 61 is provided with a reference pin guide 65 into which the reference pin 32 provided in the tape feeder 1 is inserted. 9B, the reference pin 32 is inserted into the reference pin guide 65 in a state where the tape feeder 1 is inserted until the Y-direction stop plate 33 contacts the predetermined contact surface of the feeder bank 61. It becomes a state.

  Further, as shown in FIG. 10, a lock shaft 64 that can be engaged with the lock spring 36 of the tape feeder 1 extends in the X direction near the lower side of the reference pin guide 65. When the operator lifts the lock release lever 35 upward in the state shown in FIG. 9B, the lock spring 36 is activated, and the lock spring 36 is engaged with the lock shaft 64 as shown in FIG. To do. Thereby, the tape feeder 1 is fixed to the feeder bank 61.

When the tape feeder 1 is fixed to the feeder bank 61 and the operator operates a predetermined work switch, the tape feeder 1 repeatedly instructs the feed motor 4 to drive and stop, thereby feeding the carrier tape 20 by a certain amount. It is fed out in the transport direction H. Further, the electronic component mounting apparatus 50 controls the component suction nozzle to suck the electronic component from the base tape 21 at the nozzle suction position P and mount it on a predetermined position on the substrate.
At this time, on the electronic component mounting apparatus 50 side, the recognition camera 56 recognizes the shape of the electronic component and detects the amount of deviation in the X direction between the desired suction position of the electronic component and the actual suction position. Here, the desired suction position is set at the center position of the electronic component.

Next, a feeder substrate that is a control substrate of the tape feeder 1 will be described.
FIG. 11 is a circuit block diagram of the feeder substrate.
As shown in FIG. 11, the feeder substrate 70 includes a DC converter 71, a communication circuit 72, a CPU 73, a memory 74, a motor drive circuit 75, and an actuator drive circuit 76.
The DC converter 71 converts the power supplied from the power supply 41.
The communication circuit 72 is a circuit that communicates with the mounter I / F 45 included in the control board 44 of the electronic component mounting apparatus 50, and outputs information input from the electronic component mounting apparatus 50 side to the CPU 73. Here, the deviation amount in the X direction of the component suction position calculated by the recognition device 46 based on the image data taken by the recognition camera 56 is input via the mounter I / F 45.

In addition to the above, the CPU 73 also receives signals from an operation switch (SW) 42 operated by the operator and a sensor 43 that detects the tape feed amount. Based on these signals, a command signal for driving and controlling the electric motors 4 and 7 and the piezoelectric actuator 16 is output to the motor drive circuit 75 and the actuator drive circuit 76.
The memory 74 stores the drive voltage value of the piezoelectric actuator 16. The drive voltage value of the piezoelectric actuator 16 stored in the memory 74 can be read and rewritten by the CPU 73.

The motor drive circuit 75 controls the drive of the electric motor (feed motor 4 and pull motor 7) based on a command signal from the CPU 73. The actuator drive circuit 76 drives and controls the piezoelectric actuator 16 based on a command signal from the CPU 73.
FIG. 12 is a flowchart showing a suction position adjustment processing procedure executed by the CPU 73.
The suction position adjustment process starts when the power is turned on. First, in step S1, the CPU 73 reads the drive voltage value of the piezoelectric actuator 16 stored in the memory 74, and proceeds to step S2.
In step S <b> 2, the CPU 73 outputs a command signal for driving and controlling the piezoelectric actuator 16 with the drive voltage value read in step S <b> 1 to the actuator drive circuit 76.

  Next, in step S <b> 3, the CPU 73 determines that the amount of deviation in the X direction between the actual component suction position input from the electronic component mounting apparatus 50 side via the communication circuit 72 and the desired component suction position is a predetermined constant value. It is determined whether it is within the range. Here, the fixed value is set to a value within an allowable range of the deviation amount in the X direction between the actual component suction position and the desired component suction position. If the amount of deviation is within a certain value, the process proceeds to step S4. If the amount of deviation exceeds the certain value, the process proceeds to step S7 described later.

In step S4, the CPU 73 stores the current drive voltage value of the piezoelectric actuator 16 in the memory 74, and proceeds to step S5.
In step S5, the CPU 73 outputs a command signal for maintaining the current drive voltage value of the piezoelectric actuator 16 to the actuator drive circuit 76, and proceeds to step S6.
In step S <b> 6, the CPU 73 determines whether or not a predetermined time has elapsed since starting to hold the drive voltage value of the piezoelectric actuator 16. If the fixed time has not elapsed, the process waits until the fixed time elapses. When the fixed time elapses, the process proceeds to step S3.

  In step S7, the CPU 73 determines whether the amount of deviation in the X direction of the component suction position is on the plus side, that is, whether the actual component suction position is on the plus side with respect to the desired component suction position. judge. If the amount of deviation is on the plus side, the process proceeds to step S8, and the drive voltage obtained by increasing the drive voltage value of the piezoelectric actuator 16 from the current drive voltage value by a predetermined value with respect to the actuator drive circuit 76. A command signal for setting the value is output, and the process proceeds to step S3.

On the other hand, if it is determined in step S7 that the amount of deviation is negative, the process proceeds to step S9, where the drive voltage value of the piezoelectric actuator 16 is preset from the current drive voltage value to the actuator drive circuit 76. A command signal for setting the drive voltage value lowered by the predetermined value is output, and the process proceeds to step S3.
The reference pin 11, the reference pin block 12, and the elastic body 14 correspond to the connecting portion, the reference pin guide 63 corresponds to the connecting hole, the piezoelectric actuator 16 corresponds to the actuator, the actuator drive circuit 76, and the steps of FIG. S3, S7 to S9 correspond to drive control means, and the recognition camera 56 and the recognition device 46 correspond to deviation amount detection means.

(Operation)
Next, the operation of this embodiment will be described.
When the tape feeder 1 is mounted on the feeder bank 61 of the electronic component mounting apparatus 50 and the electronic component supply operation is performed in the electronic component mounting apparatus 50, the tape feeder 1 drives and controls the feeder motor 4 to convey the carrier tape 20. Send in direction H. At this time, the cover tape 22 is peeled off from the base tape 21 before the suction position P, and the base tape 21 is sent in the transport direction H as it is. The electronic component is sucked by the suction nozzle of the mounting head 53 at the suction position P. The sucked electronic component is mounted at a predetermined position on the circuit board C fixed to the electronic component mounting apparatus 50.

At this time, the recognition camera 56 confirms the suction position shift of the electronic component in the X direction. The amount of deviation in the X direction is the amount of deviation in the X direction of the actual component suction position with respect to the desired component suction position (the center position of the electronic component), and the communication circuit 72 of the feeder substrate 70 is connected from the electronic component mounting apparatus 50 side. Input to the CPU 73. Then, the CPU 73 determines whether or not the input shift amount is within a certain value, and drives and controls the piezoelectric actuator 16 so that the actual component suction position becomes a desired component suction position according to the determination result. To do.
FIG. 13 is a diagram showing the relationship between the reference pin position P1 and the desired suction position P2, and is a view of the feeder base 2 as viewed from the component suction side.

Here, the reference pin position P1 is the position of the reference pin guide 63 formed in the electronic component mounting apparatus 50, and the X-direction position of the actual component suction position is equal to the X-direction position of the reference pin position P1.
In FIG. 13, for the tape feeder 1 shown in (1), the X-direction position of the reference pin position P1 and the X-direction position of the desired suction position P2 are equal. That is, the deviation amount of the component suction position is zero (Yes in step S3). Therefore, the CPU 73 of the feeder board 70 stores the current drive voltage value of the piezoelectric actuator 16 corresponding to the reference pin 11 of (1) in the memory 74 (step S4), and the current piezoelectric voltage is stored in the actuator drive circuit 76. A command signal for maintaining the drive voltage value of the actuator 16 as it is is output (step S5). Thereby, the reference pin position P1 maintains the state shown in (1) of FIG. Therefore, in the component mounting process by the electronic component mounting apparatus 50, the central part of the electronic component is sucked by the suction nozzle of the mounting head 53, and the component mounting on the circuit board C can be performed stably.

  In addition, for the tape feeder 1 shown in (2), the X-direction position of the reference pin position P1 is shifted to the minus side by a certain value A or less with respect to the desired suction position P2 (Yes in step S3). Accordingly, in this case as well, the current drive voltage value of the piezoelectric actuator 16 corresponding to the reference pin 11 in (2) is held as it is, as in the tape feeder 1 shown in (1) described above (step S5), and the reference The pin position P1 is maintained in the state shown in (2) of FIG.

  On the other hand, with respect to the tape feeder 1 shown in (3), the X-direction position of the reference pin position P1 is shifted by A ′ exceeding a certain value to the minus side with respect to the desired suction position P2 (No in step S3, step S7). No). Therefore, the CPU 73 of the feeder board 70 outputs a command signal to the actuator drive circuit 76 in order to lower the drive voltage value of the piezoelectric actuator 16 corresponding to the reference pin 11 of (3) by a predetermined value (step). S9).

  As a result, the piezoelectric actuator 16 corresponding to the reference pin 11 in (3) is displaced to the plus side in the X direction as the drive voltage value decreases, and the X direction position of the reference pin 11 is relative to the feeder base 2. Move to the plus side. Since the reference pin 11 is connected and fixed to the reference pin guide 63 so as not to be relatively displaced, when the position of the reference pin 11 in the X direction moves to the plus side relative to the feeder base 2, a desired suction position is obtained. P2 moves to the minus side relative to the feeder bank 61. That is, the deviation amount A ′ of the component suction position is reduced.

Then, the drive voltage value of the piezoelectric actuator 16 is gradually decreased until the deviation A ′ falls within a certain value, and when the deviation A ′ falls within the certain value (Yes in Step S3), The drive voltage value of the piezoelectric actuator 16 is stored in the memory 74 (step S4), and a command signal for holding the current drive voltage value of the piezoelectric actuator 16 as it is is output to the actuator drive circuit 76 (step S5). . Thereby, the state in which the amount of deviation between the reference pin position P1 and the suction position P2 is within a certain value is maintained.
As described above, since the component suction position in the X direction can be adjusted so as to be a desired position, if the desired position is set as the center position of the electronic component, the actual component suction position becomes the center of the electronic component. The position can be adjusted. Therefore, the component adsorption rate by the adsorption nozzle can be improved.

At this time, since the adjustment of the component suction position is electrically performed using the piezoelectric actuator 16, the position adjustment in a minute unit can be quickly performed.
Incidentally, a plurality of suction nozzles are mounted on the mounting head 53 of the electronic component mounting apparatus 50, and a plurality of electronic components are simultaneously suctioned by the plurality of suction heads to perform component mounting processing. In general, the distance between the suction nozzles is constant.

  However, as shown in FIG. 14A, if the distances between the tape feeders (1) to (4) are different from each other, the simultaneous suction of electronic components cannot be performed appropriately. That is, if the distance between the suction nozzles is A, the distance between the suction position P2 of (1) and the suction position P2 of (2) is A, and the suction positions P2 and (3) of (2) are suctioned. When the distance from the position P2 is B, and the distance between the suction position P2 in (3) and the suction position P2 in (4) is C (A <B <C), the approximate center position in (1) and (2) However, in (3) and (4), the suction position of the electronic component is greatly deviated from the center position.

However, in this embodiment, in each tape feeder 1, adjustment is made so that the amount of deviation in the X direction between the reference pin position P1 and the desired suction position P2 is within a certain value, as shown in FIG. In addition, the distance between the suction positions P2 of (1) to (4) can be made constant. Thereby, the simultaneous adsorption | suction of several electronic components can be performed appropriately.
FIG. 15 is a diagram showing the relationship between the drive voltage value of the piezoelectric actuator 16 and the displacement amount of the piezoelectric actuator.

  The drive voltage value of the piezoelectric actuator 16 and the amount of displacement thereof have hysteresis as shown in FIG. 15, and do not have a one-to-one correspondence. Therefore, in this embodiment, when the power is turned on, the previous drive voltage value is read from the memory 74 (step S1), the piezoelectric actuator 16 is operated with the drive voltage value (step S2), and the deviation amount is within a certain value. The drive voltage value is adjusted as described above (steps S3 and S7 to S9), and when the deviation amount is within a certain value, the drive voltage value stored in the memory 74 is updated with the drive voltage value at that time (step S4). ). After that, the drive voltage value is held (step S5), and the deviation amount is confirmed again after a predetermined time (step S6 → step S3). Thereby, more appropriate position adjustment becomes possible.

(effect)
As described above, in the above-described embodiment, the reference pin is provided at the joint portion of the feeder base with the feeder bank, and the reference pin is connected and fixed to the reference pin guide formed in the feeder bank. The configuration is such that the relative direction position can be changed. Then, the relative position of the reference pin with respect to the feeder base in the X direction is adjusted by driving and controlling the piezoelectric actuator. Therefore, it is possible to quickly adjust the take-out position of the electronic component with respect to the electronic component mounting apparatus in the X direction in a minute unit (tens of μm unit).

Further, since the relative position of the reference pin with respect to the feeder base in the X direction is adjusted by a piezoelectric actuator using a piezoelectric element capable of minute displacement according to the drive voltage, highly accurate position adjustment is possible.
Further, the amount of deviation in the X direction between the suction position of the actual electronic component by the suction nozzle and the desired suction position is detected by the recognition camera provided on the electronic component mounting apparatus side, and this deviation amount falls within the allowable range. Since the piezoelectric actuator is driven and controlled as described above, the actual component suction position can be reliably adjusted to a desired position. At this time, if the desired position is set to the center position of the electronic component, the actual component suction position can be reliably adjusted to the center position of the electronic component, and the suction rate of the electronic component can be improved.

(Modification)
In the above embodiment, the case where the piezoelectric actuator 16 is used as the means for pressing the reference pin block 12 has been described, but a motor, an air cylinder, or the like may be used instead.
In the above embodiment, the case where the reference pin block 12 is arranged on the lower surface of the feeder base 2 and the reference pin 11 protrudes below the feeder base 2 has been described. As long as the configuration is movable relative to the feeder base 2, any configuration may be used. For example, the reference pin block 12 may be disposed on the front surface of the feeder base 2, and the reference pin 11 may protrude forward of the feeder base 2.

Furthermore, in the above-described embodiment, the case where the elastic body 14 and the piezoelectric actuator 16 are disposed to face each other with the reference pin block 12 interposed therebetween has been described. However, the biasing force of the elastic body 14 and the pressing force of the piezoelectric actuator 16 are in the X direction. The elastic body 14 and the piezoelectric actuator 16 can also be arranged on one side of the reference pin block 12.
In the above-described embodiment, the case where the recognition camera 56 provided in the electronic component mounting apparatus 50 detects the deviation amount of the component suction position has been described. However, a means for detecting the deviation amount is provided on the tape feeder 1 side. You can also.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component supply apparatus (tape feeder), 1a ... Joint part, 2 ... Feeder base, 3 ... Sprocket, 4 ... Feed motor, 5 ... Upper cover, 6 ... Collection roller, 7 ... Pull motor, 8 ... Cover tape accommodating part 8a ... inlet, 11 ... reference pin (connection part), 12 ... reference pin block (connection part), 12a ... fixing hole, 13 ... step screw, 14 ... elastic body (connection part), 15 ... actuator fixing block, DESCRIPTION OF SYMBOLS 16 ... Piezoelectric actuator (actuator), 20 ... Carrier tape, 21 ... Base tape, 22 ... Cover tape, 31 ... Slide rail, 32 ... Reference pin, 35 ... Lock release lever, 36 ... Lock spring, 50 ... Electronic component mounting apparatus 51 ... Base, 52 ... Conveying rail, 53 ... Mounting head, 54 ... X-axis gantry, 55 ... Y-axis gantry, 56 ... Approved Sensor (displacement amount detecting means), 61 ... feeder bank (mount), 62 ... guide rail, 63 ... reference pin guide (connecting hole), 64 ... lock shaft, 65 ... reference pin guide

Claims (4)

An electronic device that is configured to be separable and connectable to a mounting base of an electronic component mounting apparatus, and that sequentially supplies electronic components to a component pick-up position by a suction nozzle of the electronic component mounting apparatus in a state of being connected to the mounting base. A component supply device,
A connecting portion that is provided at a joint portion with the mounting base, is connected and fixed to the mounting base, and is capable of changing a relative position in the width direction of the base with respect to a base of the electronic component supply unit;
An actuator for adjusting the relative position of the connecting portion;
An electronic component supply apparatus comprising: drive control means for driving and controlling the actuator. A displacement amount detecting means for detecting a displacement amount in the width direction of the base between a suction position of an actual electronic component by the suction nozzle and a desired suction position;
The electronic component supply apparatus according to claim 1, wherein the drive control unit drives and controls the actuator so that a deviation amount detected by the deviation amount detection unit falls within a predetermined allowable range.   The electronic component supply apparatus according to claim 2, wherein the desired suction position is a center position of the electronic component. The connecting portion includes a reference pin that fits into a connecting hole formed in the mounting base, and an elastic body that biases the reference pin in one direction in the width direction of the base,
4. The electron according to claim 1, wherein the actuator is configured to press the connecting portion in a direction against an urging force of the elastic body in an operating state. 5. Parts supply device.

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