JP2012028436A - Light emitting device, and method of manufacturing the same - Google Patents

Light emitting device, and method of manufacturing the same Download PDF

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JP2012028436A
JP2012028436A JP2010163851A JP2010163851A JP2012028436A JP 2012028436 A JP2012028436 A JP 2012028436A JP 2010163851 A JP2010163851 A JP 2010163851A JP 2010163851 A JP2010163851 A JP 2010163851A JP 2012028436 A JP2012028436 A JP 2012028436A
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glass
light emitting
package
adhesive
emitting device
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Hiroyuki Fujita
宏之 藤田
Hitoshi Kamamori
均 釜森
Sadao Oku
定夫 奥
Keiichiro Hayashi
恵一郎 林
Koji Tsukagoshi
功二 塚越
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Seiko Instruments Inc
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Seiko Instruments Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PROBLEM TO BE SOLVED: To simply and inexpensively manufacture a light emitting device having excellent hermeticity and high reliability.SOLUTION: An opening 11 is provided on an adhesive agent 8 provided between a glass package 1 and a glass lens 9. After curing the adhesive agent, the opening 11 is blocked by using a sealing agent 12. The opening 11 is provided when curing the adhesive agent 8, so that even if air between the glass package 1 and the glass lens 9 is expanded by heating, crack does not occur on the adhesive agent 8.

Description

本発明は、高耐久性の発光デバイス及びその製造方法に関するものである。   The present invention relates to a highly durable light-emitting device and a method for manufacturing the same.

近年、白熱電球や蛍光灯に代って、半導体発光チップを用いた発光デバイスが開発されている。半導体発光デバイスの一例としてはＩＩＩ−Ｖ族化合物半導体の発光層を含む発光ダイオード（ＬＥＤ）が挙げられ、赤色、青色、または白色で発光するＬＥＤが実用化されている。ＬＥＤを用いた発光デバイスは、白熱電球や蛍光灯に比べて小型、安価で消費電力が少なく、寿命が長い。   In recent years, light emitting devices using semiconductor light emitting chips have been developed in place of incandescent bulbs and fluorescent lamps. An example of a semiconductor light emitting device is a light emitting diode (LED) including a light emitting layer of a III-V compound semiconductor, and LEDs that emit light in red, blue, or white have been put into practical use. Light emitting devices using LEDs are smaller, less expensive, consume less power, and have a longer life than incandescent and fluorescent lamps.

このような半導体発光デバイスでは、ＬＥＤは外気に触れないように封止されている。ＬＥＤが実装されたパッケージを封止部材で封止し、封止部材を整形してレンズ状にする構成が知られている（例えば、特許文献１参照）。また、ガラスのレンズをハーメチックシールによりパッケージに取り付けることで封止する構成が知られている（例えば、特許文献２参照）。   In such a semiconductor light emitting device, the LED is sealed so as not to touch the outside air. A configuration is known in which a package on which an LED is mounted is sealed with a sealing member, and the sealing member is shaped into a lens shape (see, for example, Patent Document 1). Further, a configuration in which a glass lens is sealed by attaching it to a package with a hermetic seal is known (see, for example, Patent Document 2).

特開２００９−２７５１９６号公報（第１図、第２図）JP 2009-275196 A (FIGS. 1 and 2) 特開２００９−２２４３９７号公報（第３図）JP 2009-224397 A (FIG. 3)

特許文献１のように、封止部材を整形してレンズを設ける場合、封止部材の電気的光学的信頼性がガラスレンズよりも劣るという問題があった。また、特許文献２のように、ガラスレンズをハーメチックシールにより取り付ける方法では、信頼性は十分でも構造が複雑になるため安価に製造できないという問題があった。また、発光素子が実装されたパッケージにガラスを直接的に接着して封止すると、接着剤を硬化する際に発光素子上の封止剤や空間の空気の膨張によって接着剤にクラック等による隙間ができ、密閉が不完全となる課題があった。   When the lens is provided by shaping the sealing member as in Patent Document 1, there is a problem that the electro-optical reliability of the sealing member is inferior to that of the glass lens. In addition, as in Patent Document 2, the method of attaching a glass lens with a hermetic seal has a problem in that it cannot be manufactured at low cost because the structure is complicated even if the reliability is sufficient. In addition, when glass is directly bonded and sealed to a package on which the light emitting element is mounted, a gap due to a crack or the like is caused in the adhesive due to expansion of the sealing agent on the light emitting element or air in the space when the adhesive is cured. There was a problem that the sealing was incomplete.

そこで、本発明の発光デバイスは、発光素子が実装されたパッケージの上部にガラスレンズまたはガラス板を接着剤で接着する際に、発光素子上の空間と外部をつなぐ開口を設けることとした。さらに、接着剤が硬化した後、開口を封口剤により塞ぐ。この開口を、接着剤に形成してもよいし、ガラス板の一部に形成してもよい。   Therefore, in the light emitting device of the present invention, when the glass lens or the glass plate is bonded to the upper part of the package on which the light emitting element is mounted with an adhesive, an opening that connects the space on the light emitting element and the outside is provided. Further, after the adhesive is cured, the opening is closed with a sealing agent. This opening may be formed in the adhesive or may be formed in a part of the glass plate.

本発明の製造方法によれば、パッケージとガラス部材を接着する接着剤にクラック等を発生させることがなく、密閉性に優れた高信頼の発光デバイスを簡単に安価に作ることができる。   According to the manufacturing method of the present invention, it is possible to easily and inexpensively produce a highly reliable light-emitting device excellent in hermeticity without causing cracks or the like in the adhesive that bonds the package and the glass member.

本発明の実施例にかかる発光デバイスの構成を示す模式図である。It is a schematic diagram which shows the structure of the light-emitting device concerning the Example of this invention. 本発明の実施例にかかる発光デバイスの製造工程を示す模式図である。It is a schematic diagram which shows the manufacturing process of the light-emitting device concerning the Example of this invention. 本発明の実施例にかかる発光デバイスの製造工程の一部を説明する上視図である。It is a top view explaining a part of manufacturing process of the light-emitting device concerning the Example of this invention. 本発明の実施例にかかる発光デバイスの構成を示す模式図である。It is a schematic diagram which shows the structure of the light-emitting device concerning the Example of this invention. 本発明の実施例にかかる発光デバイスの構成を示す模式図である。It is a schematic diagram which shows the structure of the light-emitting device concerning the Example of this invention.

本発明の発光デバイスの構成を以下に説明する。本発明の発光デバイスは、発光素子が実装されたパッケージの上部にガラス部材が接着剤により接着された構成である。パッケージの表面には凸部が設けられており、凸部に囲まれた窪みが形成されている。この窪みに発光素子が実装されている。そして、凸部の上面に設けられた接着剤によりガラス部材とパッケージが接着されている。このとき、ガラス部材とパッケージとの間の空間が外部と連通するように開口が設けられている。この開口は接着剤に設けてもよいし、ガラス部材に設けてもよい。さらに、開口を塞ぐ封口剤が設けられている。   The structure of the light emitting device of the present invention will be described below. The light emitting device of the present invention has a configuration in which a glass member is bonded to an upper portion of a package on which a light emitting element is mounted with an adhesive. A convex portion is provided on the surface of the package, and a recess surrounded by the convex portion is formed. A light emitting element is mounted in this recess. And the glass member and the package are adhere | attached with the adhesive agent provided in the upper surface of the convex part. At this time, the opening is provided so that the space between the glass member and the package communicates with the outside. This opening may be provided in the adhesive or in the glass member. Further, a sealing agent for closing the opening is provided.

このような構成によれば、例えば接着剤を硬化させる際に加熱を行ったとき、パッケージとガラス部材の隙間（空間）にある空気が膨張しても開口から外部に逃げることができる。そのため、隙間の圧力が高くなって接着剤にクラックを発生させることがない。   According to such a configuration, for example, when heating is performed when the adhesive is cured, even if air in a gap (space) between the package and the glass member expands, it can escape to the outside from the opening. Therefore, the pressure in the gap does not increase and cracks do not occur in the adhesive.

また、ガラス部材として、単に窪みを覆うためのガラス板を用いてもよいし、発光デバイスのレンズとしての機能を持つガラスレンズを用いてもよい。発光デバイスの用途に応じて適宜選択すればよい。さらに、ガラス材料で形成されたパッケージを用いれば、ガラス材同士を接着することになるため、熱膨張係数の差がなく接続信頼性が高い。   Further, as the glass member, a glass plate for simply covering the depression may be used, or a glass lens having a function as a lens of the light emitting device may be used. What is necessary is just to select suitably according to the use of a light-emitting device. Further, if a package formed of a glass material is used, the glass materials are bonded to each other. Therefore, there is no difference in thermal expansion coefficient and connection reliability is high.

上述した構成の発光デバイスは以下のような製造方法で特徴づけられる。すなわち、本発明の発光デバイスの製造方法は、表面に凸部が形成され、凸部に囲まれた窪みが設けられたパッケージを作製する第一工程と、パッケージの窪みに発光素子を実装する第二工程と、凸部の上面に接着剤を設け、凸部の上面にガラス部材を設置する第三工程と、接着剤を硬化させてパッケージとガラス部材を接着する第四工程を含むとともに、第三工程において、パッケージとガラス部材の間の空間と外部を連通する開口が形成されるとともに、第四工程の後で、開口を封口剤で塞ぐ工程を備えている。   The light emitting device having the above-described configuration is characterized by the following manufacturing method. That is, the method for manufacturing a light emitting device according to the present invention includes a first step of manufacturing a package having a convex portion formed on the surface and a recess surrounded by the convex portion, and a first step of mounting the light emitting element in the recess of the package. Including a second step, a third step of providing an adhesive on the upper surface of the convex portion, and installing a glass member on the upper surface of the convex portion, and a fourth step of curing the adhesive to bond the package and the glass member. In the three steps, an opening communicating the space between the package and the glass member and the outside is formed, and a step of closing the opening with a sealing agent is provided after the fourth step.

このような製造方法によれば、例えば接着剤を硬化させる際に加熱を行ったとき、パッケージとガラス部材との隙間の空気が膨張しても開口から外部に逃げることができる。そのため、隙間の圧力が高まり接着剤にクラックを発生させることがない。   According to such a manufacturing method, for example, when heating is performed when the adhesive is cured, even if the air in the gap between the package and the glass member expands, it can escape to the outside from the opening. For this reason, the pressure in the gap is increased and cracks are not generated in the adhesive.

また、開口を複数設けてもよい。一般的に、発光素子を覆うように封止樹脂が設けられる。この封止樹脂を、パッケージとガラス部材を接着した後で供給できる。すなわち、一方の開口から封止樹脂を供給し、他方の開口に吸引作用が働くようにする。このように、２つの開口を用いて、パッケージとガラス部材の間に封止樹脂を充填することが容易に実現できる。複数の開口は、封止樹脂の硬化後に封口してもよいし、封止樹脂自体で封口することができる。このような場合には、接着剤に光硬化型接着剤を用いたとしても効果が得られる。   A plurality of openings may be provided. Generally, a sealing resin is provided so as to cover the light emitting element. This sealing resin can be supplied after bonding the package and the glass member. That is, the sealing resin is supplied from one opening so that the suction action works on the other opening. Thus, it is possible to easily fill the sealing resin between the package and the glass member using the two openings. The plurality of openings may be sealed after the sealing resin is cured, or may be sealed with the sealing resin itself. In such a case, the effect can be obtained even if a photocurable adhesive is used as the adhesive.

以下、本発明の発光デバイスのうち、ガラスパッケージを用いた実施例を図面に基づいて説明する。   Hereinafter, among the light emitting devices of the present invention, an embodiment using a glass package will be described with reference to the drawings.

本実施例の発光デバイスを図１に模式的に示す。図１（ａ）は発光デバイスの断面図であり、図１（ｂ）は上視図である。図１（ａ）に示すように、ガラスパッケージ１は表面に凸部１０が形成されており、この凸部１０に囲まれて窪みが形成される。この窪みの表面に発光素子３が実装されている。凸部１０の上面にガラスレンズ９が設置されている。発光素子３はダイボンディング剤２によりガラスパッケージ１に固定される。発光素子３の直下には、ガラスパッケージ１を貫通するビア１３が設けられている。ビア１３はガラスパッケージ１の下面に設けられた電極１５と電気的に接続されている。発光素子３から発生した熱は、ダイボンディング剤２とビア１３を介して電極１５へ伝えられる。また、発光素子３の下面には下電極（図示しない）が設けられ、ダイボンディング剤２は、発光素子の下電極とビア１３を電気的に接続する機能も備えている。発光素子３の上面には上電極（図示しない）が設けられ、上電極は、金ワイヤ５、ワイヤボンド電極４及びビア１４を介してガラスパッケージ１の下面に設けられた電極１６と電気的に接続される。発光素子には電極１５と電極１６を用いて駆動電力が供給される。   The light-emitting device of this example is schematically shown in FIG. FIG. 1A is a cross-sectional view of the light emitting device, and FIG. 1B is a top view. As shown in FIG. 1A, the glass package 1 has a convex portion 10 formed on the surface, and a recess is formed surrounded by the convex portion 10. The light emitting element 3 is mounted on the surface of this recess. A glass lens 9 is installed on the upper surface of the convex portion 10. The light emitting element 3 is fixed to the glass package 1 by the die bonding agent 2. A via 13 penetrating the glass package 1 is provided immediately below the light emitting element 3. The via 13 is electrically connected to an electrode 15 provided on the lower surface of the glass package 1. Heat generated from the light emitting element 3 is transmitted to the electrode 15 through the die bonding agent 2 and the via 13. Further, a lower electrode (not shown) is provided on the lower surface of the light emitting element 3, and the die bonding agent 2 also has a function of electrically connecting the lower electrode of the light emitting element and the via 13. An upper electrode (not shown) is provided on the upper surface of the light emitting element 3, and the upper electrode is electrically connected to the electrode 16 provided on the lower surface of the glass package 1 through the gold wire 5, the wire bond electrode 4 and the via 14. Connected. Driving power is supplied to the light emitting element using the electrode 15 and the electrode 16.

ガラスパッケージ１の窪みに封止樹脂７が供給され、発光素子３は封止樹脂７で覆われる。ガラスパッケージ１の上部、すなわち、凸部１０の上面にはガラスレンズ９が接着剤８によって接着される。本実施例では、封止樹脂７とガラスレンズ９の間には空間１７が存在している。図１（ｂ）に示すように、接着剤８には開口１１が設けられており、接着剤８は閉ざされた環状の形状ではない。すなわち、接着剤８は開口１１を除いて凸部１０の上面に塗布される。このような構成によれば、空間１７は開口１１により外部に繋がることとなる。この開口１１は、接着剤８を硬化させた後で、封口剤１２により塞がれる。このように、開口１１がある状態でレンズ９とガラスパッケージ１が接着剤８により接着されることとなる。そのため、接着剤８を硬化させる際に封止樹脂７の上部にある空間１７の気体が膨張収縮しても、その膨張収縮による圧力変化を開口１１から逃がすことができ、接着剤８にクラック等の隙間が発生することを防ぐことが出来る。   The sealing resin 7 is supplied to the recess of the glass package 1, and the light emitting element 3 is covered with the sealing resin 7. A glass lens 9 is bonded to the upper portion of the glass package 1, that is, the upper surface of the convex portion 10 with an adhesive 8. In this embodiment, a space 17 exists between the sealing resin 7 and the glass lens 9. As shown in FIG.1 (b), the adhesive agent 8 is provided with the opening 11, and the adhesive agent 8 is not the closed cyclic | annular shape. That is, the adhesive 8 is applied to the upper surface of the convex portion 10 except for the opening 11. According to such a configuration, the space 17 is connected to the outside through the opening 11. The opening 11 is closed by the sealing agent 12 after the adhesive 8 is cured. Thus, the lens 9 and the glass package 1 are bonded by the adhesive 8 in the state where the opening 11 is present. Therefore, even when the gas in the space 17 above the sealing resin 7 expands and contracts when the adhesive 8 is cured, the pressure change due to the expansion and contraction can be released from the opening 11, and the adhesive 8 is cracked. Can be prevented from occurring.

次に、本実施例の発光デバイスの製造方法を図２に基づいて説明する。図２（ａ）〜図２（ｄ）は本実施例の発光デバイスの製造工程を示す模式図である。まず、ガラスパッケージに発光素子を実装する工程を図２（ａ）に示す。ガラスパッケージ１にはビア１３及びビア１４が設けられ、底面に電極１５、電極１６が形成されている。発光素子３はダイボンディング剤２によってガラスパッケージ１のビア１３上に固定される。ガラスパッケージ１のビア１４上にはワイヤボンド電極４が設けられ、発光素子３の上電極（図示しない）と金ワイヤ５により接続される。   Next, the manufacturing method of the light-emitting device of a present Example is demonstrated based on FIG. FIG. 2A to FIG. 2D are schematic views showing manufacturing steps of the light emitting device of this example. First, a process of mounting a light emitting element on a glass package is shown in FIG. The glass package 1 is provided with vias 13 and 14, and electrodes 15 and 16 are formed on the bottom surface. The light emitting element 3 is fixed on the via 13 of the glass package 1 by the die bonding agent 2. A wire bond electrode 4 is provided on the via 14 of the glass package 1 and is connected to the upper electrode (not shown) of the light emitting element 3 by a gold wire 5.

ここで、ビア１３、ビア１４には、銀や銅のような電気伝導度、熱伝導度の良好な材料を用いることが望ましい。具体的には、銀ペーストや銅ペーストを充填して焼成することにより、または銀や銅のワイヤやブロックを埋め込むことにより形成できる。   Here, it is desirable to use a material with good electrical conductivity and thermal conductivity such as silver or copper for the via 13 and the via 14. Specifically, it can be formed by filling and baking a silver paste or copper paste, or by embedding silver or copper wires or blocks.

次に、図２（ｂ）に示すように、発光素子３上にディスペンサ６を用いて封止樹脂７を供給する。封止樹脂７には、シリコーン樹脂、エポキシ樹脂のような有機系樹脂やシランのゾルゲル法で作る無機ガラスを用いてもよい。また、封止樹脂７に蛍光体を混合させてもよい。   Next, as shown in FIG. 2B, the sealing resin 7 is supplied onto the light emitting element 3 using the dispenser 6. The sealing resin 7 may be an organic resin such as a silicone resin or an epoxy resin, or an inorganic glass made by a silane sol-gel method. Further, a phosphor may be mixed in the sealing resin 7.

次に、図２（ｃ）に示すように、ガラスパッケージ１の凸部１０の上面に接着剤８をスクリーン印刷やディスペンサ供給等の方法で塗布する。そして、ガラスレンズ９をガラスパッケージ１の凸部１０上に載置する。この状態の上視図を図３に模式的に示す。図示するように、ガラスパッケージ１の凸部１０上面に設けられた接着剤８には、開口１１が設けられている。すなわち、接着剤８は開いた環状の形状で塗布される。したがって、ガラスパッケージ１とガラスレンズ９の間にたとえ空間があっても、この空間は開口１１を介して外界と繋がることとなる。そのため、接着剤８を加熱により硬化させる際に、加熱時の気体膨脹による圧力を外界に逃がすことが可能になり、接着剤８にクラック等の隙間が発生することを防げる。接着剤８の具体的な材料として、エポキシ系樹脂やシランからゾルゲル法で作る無機ガラス、比較的低温で融解するガラスフリット等が例示できる。このようにして、ガラスレンズ９とガラスパッケージ１を密着させることができる。   Next, as shown in FIG. 2C, the adhesive 8 is applied to the upper surface of the convex portion 10 of the glass package 1 by a method such as screen printing or dispenser supply. Then, the glass lens 9 is placed on the convex portion 10 of the glass package 1. A top view of this state is schematically shown in FIG. As illustrated, an opening 11 is provided in the adhesive 8 provided on the upper surface of the convex portion 10 of the glass package 1. That is, the adhesive 8 is applied in an open annular shape. Therefore, even if there is a space between the glass package 1 and the glass lens 9, this space is connected to the outside through the opening 11. For this reason, when the adhesive 8 is cured by heating, the pressure due to gas expansion during heating can be released to the outside, and a gap such as a crack can be prevented from being generated in the adhesive 8. Specific examples of the adhesive 8 include inorganic glass made from an epoxy resin or silane by a sol-gel method, glass frit that melts at a relatively low temperature, and the like. In this way, the glass lens 9 and the glass package 1 can be brought into close contact with each other.

次に、ディスペンサ６を用いて開口１１に封口剤１２を供給する。図２（ｄ）にこの工程を模式的に示す。ここで、ガラスパッケージ１とガラスレンズ９の間の空間１７は開口１１を介して外界と繋がっている。最後に、封口剤１２によって開口１１が塞がれる。   Next, the sealing agent 12 is supplied to the opening 11 using the dispenser 6. FIG. 2D schematically shows this process. Here, the space 17 between the glass package 1 and the glass lens 9 is connected to the outside world through the opening 11. Finally, the opening 11 is blocked by the sealing agent 12.

このような製造方法によれば、発光デバイスの密閉性が向上でき、信頼性をあげることができる。また、接着という単純な手段を用いているため、発光デバイスを簡単かつ安価に製造することが可能となる。   According to such a manufacturing method, the sealing property of the light emitting device can be improved, and the reliability can be increased. Further, since a simple means of bonding is used, the light emitting device can be manufactured easily and inexpensively.

本実施例は、ガラスレンズのかわりにガラス板１８をガラスパッケージに接着している点で実施例１と異なっている。そこで、実施例１と重複する説明は適宜省略する。本実施例の発光デバイスの構成を図４に模式的に示す。図４（ａ）は断面図であり、図４（ｂ）は上視図である。図示するように、接着剤８を用いてガラス板１８がガラスパッケージ１に接着されている。接着剤８には、空間１７と連通する開口１１が設けられている。実施例１で説明したように、このような構成により非常に信頼性の高い発光デバイスが実現できる。   The present embodiment is different from the first embodiment in that the glass plate 18 is bonded to the glass package instead of the glass lens. Therefore, the description overlapping with the first embodiment is omitted as appropriate. The structure of the light emitting device of this example is schematically shown in FIG. 4A is a cross-sectional view, and FIG. 4B is a top view. As illustrated, a glass plate 18 is bonded to the glass package 1 using an adhesive 8. An opening 11 communicating with the space 17 is provided in the adhesive 8. As described in Embodiment 1, such a configuration can realize a highly reliable light-emitting device.

図５に、本実施例の別の形態の発光デバイスを模式的に示す。図５（ａ）は断面図であり、図５（ｂ）は上視図である。ここでは、接着剤８に開口１１を設けるかわりに、ガラス板１８に穴１９が開けられている。そして、接着剤８はガラスパッケージ１の凸部１０上に環状に塗布される。すなわち、ガラスパッケージ１とガラスレンズ９の間の空間１７は穴１１を介して外界と繋がっている。接着剤８を加熱して硬化する際に、空間１７の空気は穴１９から外部へと抜けることになる。接着剤８を硬化させた後に封止穴１９は、封口剤により塞がれる。   FIG. 5 schematically shows a light-emitting device according to another embodiment of the present example. FIG. 5A is a cross-sectional view, and FIG. 5B is a top view. Here, instead of providing the opening 11 in the adhesive 8, a hole 19 is formed in the glass plate 18. Then, the adhesive 8 is applied in a ring shape on the convex portion 10 of the glass package 1. That is, the space 17 between the glass package 1 and the glass lens 9 is connected to the outside through the hole 11. When the adhesive 8 is heated and cured, the air in the space 17 escapes from the hole 19 to the outside. After the adhesive 8 is cured, the sealing hole 19 is closed with a sealing agent.

上述の各実施例では、ガラスパッケージを用いて例示したが、セラミックのような絶縁物のパッケージを用いてもよい。無機材料から形成されたパッケージが好ましい。また、ガラスレンズが載置される側のガラスパッケージの表面に誘電体ミラーや銀、アルミ等の金属薄膜を設けてミラーを形成してもよい。また、パッケージに白色ガラスを用いることにより、白色ガラス自体の反射効果を利用してもよい。   In each of the above-described embodiments, the glass package is used as an example, but an insulating package such as ceramic may be used. A package formed from an inorganic material is preferred. Alternatively, the mirror may be formed by providing a dielectric mirror or a metal thin film such as silver or aluminum on the surface of the glass package on the side where the glass lens is placed. Moreover, you may utilize the reflective effect of white glass itself by using white glass for a package.

無機系の材料で周囲を囲った非常に信頼性の高い発光デバイスを簡単かつ安価に製造することができるので、交換の必要のない照明器具や高温多湿等の過酷な環境下で使用する照明器具が実現できる。   Because it is possible to easily and inexpensively manufacture highly reliable light-emitting devices that are surrounded by inorganic materials, lighting fixtures that do not require replacement or that are used in harsh environments such as hot and humid environments Can be realized.

１ ガラスパッケージ
２ ダイボンディング剤
３ 発光素子
４ ワイヤボンド電極
５ 金ワイヤ
６ ディスペンサ
７ 封止樹脂
８ 接着剤
９ ガラスレンズ
１０ 凸部
１１ 開口
１２ 封口剤
１３ ビア
１４ ビア
１５ 電極
１６ 電極
１７ 空間
１８ ガラス板
１９ 穴 DESCRIPTION OF SYMBOLS 1 Glass package 2 Die bonding agent 3 Light emitting element 4 Wire bond electrode 5 Gold wire 6 Dispenser 7 Sealing resin 8 Adhesive 9 Glass lens 10 Convex part 11 Opening 12 Sealing agent 13 Via 14 Via 15 Electrode 16 Electrode 17 Space 18 Glass plate 19 holes

Claims (6)

表面に凸部が形成されたパッケージと、
前記凸部に囲まれた窪みに実装された発光素子と、
前記凸部に接着剤により接着されたガラス部材と、
前記パッケージと前記ガラス部材の間の空間と外部を連通する開口と、
前記開口を塞ぐ封口剤と、を備えることを特徴とする発光デバイス。 A package having convex portions formed on the surface;
A light emitting device mounted in a recess surrounded by the convex part,
A glass member bonded to the convex portion with an adhesive;
An opening communicating the space between the package and the glass member and the outside;
And a sealing agent that closes the opening. 前記ガラス部材がガラスレンズまたはガラス板であることを特徴とする請求項１に記載の発光デバイス。   The light emitting device according to claim 1, wherein the glass member is a glass lens or a glass plate. 前記開口が前記接着剤に形成されたことを特徴とする請求項１または２に記載の発光デバイス。   The light emitting device according to claim 1, wherein the opening is formed in the adhesive. 前記ガラス部材はガラス板であって、前記開口は前記ガラス板に形成された穴であることを特徴とする請求項１に記載の発光デバイス。   The light emitting device according to claim 1, wherein the glass member is a glass plate, and the opening is a hole formed in the glass plate. 前記パッケージがガラス材料で形成されたことを特徴とする請求項１〜４のいずれか一項に記載の発光デバイス。   The light emitting device according to claim 1, wherein the package is made of a glass material. 表面に凸部が形成され、前記凸部に囲まれた窪みが設けられたパッケージを作製する第一工程と、
前記パッケージの窪みに発光素子を実装する第二工程と、
前記凸部の上面に接着剤を設け、前記凸部の上面にガラス部材を設置する第三工程と、
前記接着剤を硬化させて前記パッケージと前記ガラス部材を接着する第四工程を含むとともに、
前記第三工程において、前記パッケージと前記ガラス部材の間の空間と外部を連通する開口が形成されるとともに、
前記第四工程の後で、前記開口を封口剤で塞ぐ工程を備えることを特徴とする発光デバイスの製造方法。 A first step of producing a package having a convex portion formed on the surface and provided with a depression surrounded by the convex portion;
A second step of mounting the light emitting element in the recess of the package;
A third step of providing an adhesive on the upper surface of the convex portion and installing a glass member on the upper surface of the convex portion;
Including a fourth step of curing the adhesive to bond the package and the glass member;
In the third step, an opening communicating the space between the package and the glass member and the outside is formed,
A method for manufacturing a light emitting device, comprising a step of closing the opening with a sealing agent after the fourth step.
JP2010163851A 2010-07-21 2010-07-21 Light emitting device, and method of manufacturing the same Withdrawn JP2012028436A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017059716A (en) * 2015-09-17 2017-03-23 日機装株式会社 Light emitting module and manufacturing method of the same
US9768362B2 (en) 2012-03-05 2017-09-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR101812741B1 (en) * 2012-03-09 2018-01-30 서울바이오시스 주식회사 Light Emitting Diode Package and Method of manufacturing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768362B2 (en) 2012-03-05 2017-09-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
KR101812741B1 (en) * 2012-03-09 2018-01-30 서울바이오시스 주식회사 Light Emitting Diode Package and Method of manufacturing the same
JP2017059716A (en) * 2015-09-17 2017-03-23 日機装株式会社 Light emitting module and manufacturing method of the same

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