JP2012028334A - Anisotropic conductive film and method of manufacturing connecting structure - Google Patents
Anisotropic conductive film and method of manufacturing connecting structure Download PDFInfo
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- JP2012028334A JP2012028334A JP2011195290A JP2011195290A JP2012028334A JP 2012028334 A JP2012028334 A JP 2012028334A JP 2011195290 A JP2011195290 A JP 2011195290A JP 2011195290 A JP2011195290 A JP 2011195290A JP 2012028334 A JP2012028334 A JP 2012028334A
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- anisotropic conductive
- conductive film
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- elastomer
- terminal
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
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- 238000000465 moulding Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 44
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- 230000007423 decrease Effects 0.000 description 11
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- 239000004065 semiconductor Substances 0.000 description 4
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- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- 239000005062 Polybutadiene Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
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- 239000002904 solvent Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ZICNIEOYWVIEQJ-UHFFFAOYSA-N (2-methylbenzoyl) 2-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1C ZICNIEOYWVIEQJ-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- VTEYUPDBOLSXCD-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-2-methylcyclohexane Chemical compound CC1CCCCC1(OOC(C)(C)C)OOC(C)(C)C VTEYUPDBOLSXCD-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- CRJIYMRJTJWVLU-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yl 3-(5,5-dimethylhexyl)dioxirane-3-carboxylate Chemical compound CC(C)(C)CCCCC1(C(=O)OC(C)(C)CC(C)(C)C)OO1 CRJIYMRJTJWVLU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
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- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- RTEZVHMDMFEURJ-UHFFFAOYSA-N 2-methylpentan-2-yl 2,2-dimethylpropaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)C(C)(C)C RTEZVHMDMFEURJ-UHFFFAOYSA-N 0.000 description 1
- YMMLZUQDXYPNOG-UHFFFAOYSA-N 2-methylpentan-2-yl 7,7-dimethyloctaneperoxoate Chemical compound CCCC(C)(C)OOC(=O)CCCCCC(C)(C)C YMMLZUQDXYPNOG-UHFFFAOYSA-N 0.000 description 1
- WXDJDZIIPSOZAH-UHFFFAOYSA-N 2-methylpentan-2-yl benzenecarboperoxoate Chemical compound CCCC(C)(C)OOC(=O)C1=CC=CC=C1 WXDJDZIIPSOZAH-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- FYABMGZBIRRBQY-UHFFFAOYSA-N benzene;hydrogen peroxide Chemical compound OO.C1=CC=CC=C1 FYABMGZBIRRBQY-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- NSGQRLUGQNBHLD-UHFFFAOYSA-N butan-2-yl butan-2-yloxycarbonyloxy carbonate Chemical compound CCC(C)OC(=O)OOC(=O)OC(C)CC NSGQRLUGQNBHLD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
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- 239000012933 diacyl peroxide Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- VNJISVYSDHJQFR-UHFFFAOYSA-N tert-butyl 4,4-dimethylpentaneperoxoate Chemical compound CC(C)(C)CCC(=O)OOC(C)(C)C VNJISVYSDHJQFR-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Abstract
Description
本発明は、異方性導電フィルム、この異方性導電フィルムを用いて基板の端子と電子部品の端子とを異方性導電接続して接続構造体を製造する方法に関する。 The present invention relates to an anisotropic conductive film and a method for producing a connection structure by anisotropically connecting a terminal of a substrate and a terminal of an electronic component using the anisotropic conductive film.
種々の基板の電極パッド等の端子と電子部品のバンプ等の端子とを接続する際に、熱硬化性成分に導電粒子を配合してフィルムに成形した異方性導電フィルムが利用されている。 When connecting terminals such as electrode pads of various substrates and terminals such as bumps of electronic components, anisotropic conductive films obtained by blending thermosetting components with conductive particles and forming into films are used.
このような異方性導電フィルムにおいて、異方性導電接続すべき端子の幅や端子間スペースの幅を細狭化するという時代の要請の中で、良好な電気的接続を実現するために端子上に存在させる導電粒子の数を低減させないことが必要となる。しかし、このことは、隣接する端子間に存在する導電粒子数の増加も招き、異方性導電接続の際にショートを生じさせかねないという問題がある。このため、導電粒子の周囲を絶縁樹脂で被覆することが行われているが、完全に被覆することは困難であるという問題があった。 In such an anisotropic conductive film, in order to realize a good electrical connection in the request of the times to narrow the width of the terminal to be anisotropically conductive and the width of the space between the terminals It is necessary not to reduce the number of conductive particles present above. However, this also causes an increase in the number of conductive particles existing between adjacent terminals, and there is a problem that a short circuit may occur during anisotropic conductive connection. For this reason, the periphery of the conductive particles is covered with an insulating resin, but there is a problem that it is difficult to completely cover the conductive particles.
そこで、導電粒子の周囲を絶縁樹脂で被覆しなくても、良好な電気的接続と高い接着強度とを実現するため、異方性導電フィルムの硬化後の貯蔵弾性率を、４０℃で５００〜３０００ＭＰａとすることを前提に、異方性導電フィルムに適用する導電粒子について、導電粒子の直径に応じてその硬度を最適化することが提案されている（特許文献１）。 Therefore, in order to achieve good electrical connection and high adhesive strength without covering the periphery of the conductive particles with an insulating resin, the storage elastic modulus after curing of the anisotropic conductive film is 500 to 500 ° C. at 40 ° C. Assuming that the pressure is 3000 MPa, it has been proposed to optimize the hardness of conductive particles applied to the anisotropic conductive film according to the diameter of the conductive particles (Patent Document 1).
ところで、基板と高価な電子部品とを異方性導電接続する際に位置ズレが生じた場合には、異方性導電フィルムのリペア性が求められることがあるが、特許文献１の技術の場合、異方性導電フィルムの熱硬化性成分としてエポキシ樹脂ではなくアクリル系モノマーを使用し且つ異方性導電フィルムの硬化後の貯蔵弾性率が５００〜１５００ＭＰａ程度であれば、電子部品を硬化した異方性導電フィルムから引き剥がした際に、電子部品の端子上の異方性導電フィルムの硬化物残渣を、綿棒で軽く擦ること等により比較的容易に除去することが可能である。 By the way, in the case of the technique of patent document 1, although the repair property of an anisotropic conductive film may be calculated | required when position shift arises when connecting a board | substrate and an expensive electronic component with anisotropic conductive connection. If an anisotropic monomer is used instead of an epoxy resin as the thermosetting component of the anisotropic conductive film, and the storage elastic modulus after curing of the anisotropic conductive film is about 500 to 1500 MPa, the cured electronic component is different. When peeled from the isotropic conductive film, the cured product residue of the anisotropic conductive film on the terminals of the electronic component can be removed relatively easily by lightly rubbing with a cotton swab.
しかし、貯蔵弾性率が１５００ＭＰａを超えると、電子部品の端子上の異方性導電フィルムの硬化物残渣を綿棒で軽く擦った程度では除去できないため、溶剤を使用せざるを得ず、リペアコストや環境負荷の増大を招くという問題があった。 However, if the storage elastic modulus exceeds 1500 MPa, the cured product residue of the anisotropic conductive film on the terminal of the electronic component cannot be removed by rubbing lightly with a cotton swab, so a solvent must be used, repair cost, There was a problem of increasing the environmental load.
本発明の目的は、以上の従来の問題点を解決しようとするものであり、基板の端子と電子部品の端子とを異方性導電接続する際に、良好な接続信頼性とリペア性とを両立させた異方性導電フィルムを提供することである。 An object of the present invention is to solve the above-described conventional problems, and when connecting the terminals of the substrate and the terminals of the electronic component by anisotropic conductive connection, good connection reliability and repairability are achieved. It is to provide a compatible anisotropic conductive film.
本発明者らは、硬化後の異方性導電フィルムの貯蔵弾性率を所定範囲となるようにすると共に、異方性導電フィルムに、特定の破断強度と破断伸度とを示すエラストマーを所定量配合し、更に、配合すべき導電粒子として所定の圧縮硬さを有するものを使用することにより、上述の目的を達成できることを見出し、本発明を完成させるに至った。 The inventors set the storage elastic modulus of the anisotropic conductive film after curing to be in a predetermined range, and added a predetermined amount of elastomer showing a specific breaking strength and elongation at break to the anisotropic conductive film. It has been found that the above-mentioned object can be achieved by blending and further using conductive particles to be blended having a predetermined compression hardness, and the present invention has been completed.
即ち、本発明は、膜形成樹脂と、液状硬化性化合物と、導電粒子と、エラストマーと、硬化剤とを含有する樹脂組成物をフィルムに成形した異方性導電フィルムであって、
硬化後の異方性導電フィルムのＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）が、０．５〜１．５ＧＰａであり、
エラストマーが、ＡＳＴＭ Ｄ６３８による５０〜８０ＭＰａの破断強度と１０％以下の破断伸度とを示すものであり、
エラストマーの樹脂組成物中の含有量が、膜形成樹脂、液状硬化性化合物、導電粒子、当該エラストマー及び硬化剤の合計全質量中の２０〜５０質量％であり、そして
導電粒子が、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃの条件における１０％変位時に３００〜５００ｋｇｆ／ｍｍ２の圧縮硬さを示すものである
異方性導電フィルムを提供する。
That is, the present invention is an anisotropic conductive film obtained by molding a resin composition containing a film-forming resin, a liquid curable compound, conductive particles, an elastomer, and a curing agent into a film,
The storage elastic modulus (25 degreeC) in the dynamic viscoelasticity measurement of the tensile vibration mode by JISK7244-4 of the anisotropic conductive film after hardening is 0.5-1.5GPa,
The elastomer exhibits a breaking strength of 50 to 80 MPa according to ASTM D638 and a breaking elongation of 10% or less,
The content of the elastomer in the resin composition is 20 to 50% by mass in the total total mass of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent, and the conductive particles have a load of 49. An anisotropic conductive film having a compression hardness of 300 to 500 kgf / mm 2 at 10% displacement under the conditions of 035 mN and a load speed of 2.226 mN / sec is provided.
また、本発明は、基板の端子と電子部品の端子とを異方性導電接続して接続構造体を得る製造方法であって、
基板の端子に、上述の異方性導電フィルムを仮貼りする工程、
電子部品を、その端子が基板の端子に対向するように異方性導電フィルム上に配置する工程、
基板と電子部品とで挟持された異方性導電フィルムを、電子部品側からボンディングツールで加熱加圧することにより異方性導電接続を行う工程
を有する製造方法、並びにこの製造方法で得られた接続構造体を提供する。
Further, the present invention is a manufacturing method for obtaining a connection structure by anisotropically conductively connecting a terminal of a substrate and a terminal of an electronic component,
A step of temporarily attaching the above anisotropic conductive film to the terminal of the substrate;
Arranging the electronic component on the anisotropic conductive film so that the terminal faces the terminal of the substrate;
A manufacturing method including a step of performing anisotropic conductive connection by heating and pressurizing an anisotropic conductive film sandwiched between a substrate and an electronic component with a bonding tool from the electronic component side, and a connection obtained by this manufacturing method Provide a structure.
本発明の異方性導電フィルムは、その硬化後の貯蔵弾性率が所定範囲となるものであり、特定の破断強度と破断伸度とを示すエラストマーを所定量含有していると共に、配合すべき導電粒子として所定の圧縮硬さを有するものを使用している。このため、本発明の異方性導電フィルムを、基板の端子と電子部品の端子とを異方性導電接続する際に適用すると、良好な接続信頼性とリペア性とを両立させることができる。 The anisotropic conductive film of the present invention has a storage elastic modulus after curing within a predetermined range, contains a predetermined amount of elastomer showing a specific breaking strength and breaking elongation, and should be blended A conductive particle having a predetermined compression hardness is used. For this reason, when the anisotropic conductive film of the present invention is applied in anisotropic conductive connection between the terminal of the substrate and the terminal of the electronic component, both good connection reliability and repairability can be achieved.
本発明の異方性導電フィルムは、膜形成樹脂と、液状硬化性化合物と、導電粒子と、エラストマーと、硬化剤とを含有する樹脂組成物をフィルムに成形したものである。 The anisotropic conductive film of the present invention is obtained by molding a resin composition containing a film-forming resin, a liquid curable compound, conductive particles, an elastomer, and a curing agent into a film.
本発明の異方性導電フィルムを特徴付ける要素の一つは、その硬化後のＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）が、０．５〜１．５ＧＰａ、好ましくは０．８〜１．２ＧＰａに調整されるということである。これは、貯蔵弾性率が０．５ＧＰａを下回ると、電子部品の端子に付着した異方性導電フィルムの硬化物残渣が、綿棒で容易に除去できるためにリペア性には問題が生じないものの、接続信頼性が低下する傾向があり、１．５ＧＰａを超えるとリペア性が低下する傾向が見られるからである。 One of the elements that characterize the anisotropic conductive film of the present invention is that the storage elastic modulus (25 ° C.) in the dynamic viscoelasticity measurement in the tensile vibration mode according to JIS K7244-4 after the curing is 0.5 to 1. It is adjusted to 5 GPa, preferably 0.8 to 1.2 GPa. This is because when the storage elastic modulus is less than 0.5 GPa, the cured product residue of the anisotropic conductive film attached to the terminal of the electronic component can be easily removed with a cotton swab, so there is no problem in repairability. This is because the connection reliability tends to decrease, and when it exceeds 1.5 GPa, the repair property tends to decrease.
なお、異方性導電フィルムの貯蔵弾性率の調整は、例えば、液状硬化性化合物の種類を変更することやその配合量を増減させること等により行うことができる。 In addition, adjustment of the storage elastic modulus of an anisotropic conductive film can be performed by changing the kind of liquid curable compound, increasing / decreasing the compounding quantity, etc., for example.
また、本発明の異方性導電フィルムを特徴付ける他の要素は、配合すべきエラストマーとして、ＡＳＴＭ Ｄ６３８による破断強度が、５０〜８０ＭＰａ、好ましくは６５〜７５ＭＰａであり、且つ破断伸度が１０％以下、好ましくは５〜７％であるものを使用することである。これは、破断強度が５０ＭＰａを下回ると、異方性導電フィルムのタフネスが低下してリペア性も低下する傾向があり、８０ＭＰａを超えると異方性導電フィルムの流動性が低下し、異方性導電接続の際に異方性導電フィルムを十分に押し込むことが難しくなり、接続抵抗が増大して接続信頼性が低下する傾向があり、また、破断伸度が１０％を上回ると、異方性導電フィルムのタフネスが低下してリペア性も低下する傾向が見られるからである。 Another element characterizing the anisotropic conductive film of the present invention is that the elastomer to be blended has a breaking strength according to ASTM D638 of 50 to 80 MPa, preferably 65 to 75 MPa, and a breaking elongation of 10% or less. , Preferably 5-7%. This is because when the breaking strength is less than 50 MPa, the toughness of the anisotropic conductive film tends to be lowered and the repairability tends to be lowered, and when it exceeds 80 MPa, the fluidity of the anisotropic conductive film is lowered, and the anisotropic It becomes difficult to sufficiently push the anisotropic conductive film at the time of conductive connection, the connection resistance tends to increase, and the connection reliability tends to decrease. When the elongation at break exceeds 10%, the anisotropic This is because there is a tendency that the toughness of the conductive film is lowered and the repairability is also lowered.
本発明の異方性導電フィルムにおいて、このようなエラストマーの樹脂組成物中の含有量は、膜形成樹脂、液状硬化性化合物、導電粒子、当該エラストマー及び硬化剤の合計全質量中の２０〜５０質量％、好ましくは３０〜４０質量％である。これは、２０質量％を下回ると、異方性導電フィルムのタフネスが低下してリペア性も低下する傾向があり、５０質量％を超えると、異方性導電フィルムの流動性が低下し、異方性導電接続の際に異方性導電フィルムを十分に押し込むことが難しくなり、接続抵抗が増大して接続信頼性が低下する傾向が見られるからである。 In the anisotropic conductive film of the present invention, the content of the elastomer in the resin composition is 20 to 50 in the total total mass of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent. % By mass, preferably 30 to 40% by mass. If the amount is less than 20% by mass, the toughness of the anisotropic conductive film tends to decrease and the repairability tends to decrease. If the amount exceeds 50% by mass, the fluidity of the anisotropic conductive film decreases, and This is because it becomes difficult to sufficiently push the anisotropic conductive film during the isotropic conductive connection, and the connection resistance increases and the connection reliability tends to decrease.
以上説明したエラストマーとしては、上述した所定の破断強度と破断伸度とを示す種々のエラストマーを使用することができ、例えば、Ｔｇが好ましくは５０℃以下、より好ましくは３０℃以下の、室温でゴム弾性を有する天然または合成ゴムを使用でき、具体的には天然ゴム（ＮＲ）、イソプレンゴム（ＩＲ）、ブタジエンゴム（ＢＲ）、スチレンブタジエンゴム（ＳＢＲ）、スチレン−ブタジエン−スチレンゴム（ＳＢＳ）、スチレン−エチレン−ブチレン−スチレンゴム（ＳＥＢＳ）、スチレン−イソプレン−スチレンゴム（ＳＩＳ）、クロロプレンゴム（ＣＲ）、アクリロニトリルブタジエンゴム（ＮＢＲ）等があげられる。これらのゴムは架橋されていてもよく、Ｔｇが３０℃以下であれば熱可塑性エラストマーも使用することができる。 As the elastomer described above, various elastomers exhibiting the above-mentioned predetermined breaking strength and breaking elongation can be used. For example, Tg is preferably 50 ° C. or less, more preferably 30 ° C. or less, at room temperature. Natural or synthetic rubber having rubber elasticity can be used. Specifically, natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene butadiene rubber (SBR), styrene-butadiene-styrene rubber (SBS). Styrene-ethylene-butylene-styrene rubber (SEBS), styrene-isoprene-styrene rubber (SIS), chloroprene rubber (CR), acrylonitrile butadiene rubber (NBR), and the like. These rubbers may be cross-linked, and thermoplastic elastomers can be used as long as Tg is 30 ° C. or lower.
なお、エラストマーの破断強度と破断伸度の調整は、ハードセグメント及びソフトセグメントのそれぞれの構造やそれらの存在比等を変化させることによって行うことができる。 It should be noted that the breaking strength and breaking elongation of the elastomer can be adjusted by changing the structure of each of the hard segment and the soft segment, their abundance ratio, and the like.
また、本発明の異方性導電フィルムを特徴づける別の要素は、導電粒子として、荷重４９．０３５ｍＮ（５．０ｇｆ）、負荷速度２．２２６ｍＮ／ｓｅｃ（０．２２８ｇｆ／ｓｅｃ）の条件における１０％変位時の圧縮硬さが３００〜５００ｋｇｆ／ｍｍ２、好ましくは３５０〜４５０ｋｇｆ／ｍｍ２であるものを使用することである。これは、圧縮硬さが３００ｋｇｆ／ｍｍ２を下回ると、導電粒子の復元力が小さいため接続信頼性が低下する傾向があり、５００ｋｇｆ／ｍｍ２を超えると、異方性導電接続の際に導電粒子を十分に押し潰すことができず、接続抵抗が増大して接続信頼性が低下する傾向が見られるからである。 Further, another element characterizing the anisotropic conductive film of the present invention is a conductive particle having a load of 49.035 mN (5.0 gf) and a load speed of 2.226 mN / sec (0.228 gf / sec). The compression hardness at the time of% displacement is 300 to 500 kgf / mm 2 , preferably 350 to 450 kgf / mm 2 . This is because if the compressive hardness is below 300 kgf / mm 2, the connection reliability for restoring force of the conductive particles is less tends to decrease, and when it exceeds 500 kgf / mm 2, conductive during anisotropic conductive connection This is because the particles cannot be sufficiently crushed, and the connection resistance increases and the connection reliability tends to decrease.
なお、導電粒子の圧縮硬さの調整は、コアである樹脂粒子の架橋密度を変化させることにより調整することができる。 The compression hardness of the conductive particles can be adjusted by changing the crosslink density of the resin particles that are the core.
このような導電粒子としては、所定の条件下での１０％圧縮硬さが３００〜５００ｋｇｆ／ｍｍ２となる導電粒子、例えばジビニルベンゼン系樹脂、ベンゾグアナミン樹脂等の樹脂粒子の表面を無電解ニッケルメッキ膜等の無電解金属メッキ膜で被覆した金属被覆樹脂粒子等を使用することができる。これらの導電粒子の平均粒径は、通常４〜１５μｍ、好ましくは６〜１０μｍである。 Examples of such conductive particles include electroless nickel plating on the surface of conductive particles having a 10% compression hardness of 300 to 500 kgf / mm 2 under predetermined conditions, for example, resin particles such as divinylbenzene-based resin and benzoguanamine resin. Metal-coated resin particles coated with an electroless metal plating film such as a film can be used. The average particle size of these conductive particles is usually 4 to 15 μm, preferably 6 to 10 μm.
本発明の異方性導電フィルムにおいて、このような導電粒子の樹脂組成物中の含有量は、少なすぎると接続抵抗が高く、接続信頼性が低下する傾向があり、多すぎると隣接端子間でショートが発生することが懸念されるので、膜形成樹脂、液状硬化性化合物、導電粒子、エラストマー及び硬化剤の合計全質量中の好ましくは０．５〜１０質量％、より好ましくは２〜５質量％である。 In the anisotropic conductive film of the present invention, if the content of such conductive particles in the resin composition is too small, the connection resistance tends to be high, and the connection reliability tends to decrease. Since it is feared that a short circuit occurs, it is preferably 0.5 to 10% by mass, more preferably 2 to 5% by mass in the total total mass of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent. %.
本発明の異方性導電フィルムは、前述したように、樹脂組成物をフィルムにしたものであるが、このような樹脂組成物は、既に説明したエラストマーと導電粒子とに加えて、膜形成樹脂と、液状硬化性化合物と、硬化剤とを含有する。 As described above, the anisotropic conductive film of the present invention is obtained by forming a resin composition into a film. Such a resin composition includes a film-forming resin in addition to the elastomer and conductive particles already described. And a liquid curable compound and a curing agent.
膜形成樹脂は、樹脂組成物に成膜性を付与するものであり、フェノキシ樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、飽和ポリエステル樹脂、ウレタン樹脂、ブタジエン樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリオレフィン樹脂等を挙げることができ、これらの２種以上を併用することができる。これらの中でも、製膜性、加工性、接続信頼性の観点から、フェノキシ樹脂を好ましく使用することができる。 The film-forming resin imparts film formability to the resin composition, and includes phenoxy resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin, etc. These can be used, and two or more of these can be used in combination. Among these, a phenoxy resin can be preferably used from the viewpoint of film forming property, workability, and connection reliability.
膜形成樹脂の樹脂組成物中の含有量は、少なすぎると樹脂組成物の成膜性が低下する傾向がり、多すぎると相対的に他の成分が少なくなり意図した性能の異方性導電フィルムを得られなくなる傾向があるので、膜形成樹脂、液状硬化性化合物、導電粒子、エラストマー及び硬化剤の合計全質量中に好ましくは５〜５０質量％、より好ましくは２０〜３０質量％である。 If the content of the film-forming resin in the resin composition is too small, the film-forming property of the resin composition tends to decrease, and if it is too large, the other components are relatively less and the anisotropic conductive film having the intended performance. The total content of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent is preferably 5 to 50% by mass, more preferably 20 to 30% by mass.
液状硬化性化合物は、異方性導電フィルムに熱硬化性を付与するための成分であり、室温で液状のアクリル系モノマーを使用することが好ましい。ここで、室温で液状のものを使用する理由は、異方性導電フィルムにタック性を付与させるためである。また、アクリル系モノマーを使用する理由は、エポキシ樹脂などに比べ、リペア性に優れているからである。このようなアクリル系モノマーとしては、単官能（メタ）アクリレート（ここで、（メタ）アクリレートにはアクリレートとメタクリレートとが包含される）、二官能以上の多官能（メタ）アクリレートを使用することができる。本発明においては、接着剤を熱硬化性とするために、アクリル系モノマーの少なくとも一部に多官能（メタ）アクリレートを使用することが好ましい。 The liquid curable compound is a component for imparting thermosetting properties to the anisotropic conductive film, and it is preferable to use an acrylic monomer that is liquid at room temperature. Here, the reason for using a liquid thing at room temperature is for giving an anisotropic conductive film tackiness. Moreover, the reason for using an acrylic monomer is that it is excellent in repairability compared with an epoxy resin or the like. As such an acrylic monomer, a monofunctional (meth) acrylate (here, (meth) acrylate includes acrylate and methacrylate), and a bifunctional or higher polyfunctional (meth) acrylate may be used. it can. In the present invention, it is preferable to use a polyfunctional (meth) acrylate for at least a part of the acrylic monomer in order to make the adhesive thermosetting.
単官能（メタ）アクリレートとしては、メチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−プロピル（メタ）アクリレート、ｉ−プロピル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、ｉ−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、２−メチルブチル（メタ）アクリレート、ｎ−ペンチル（メタ）アクリレート、ｎ−ヘキシル（メタ）アクリレート、ｎ−ヘプチル（メタ）アクリレート、２−メチルヘキシル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、２−ブチルヘキシル（メタ）アクリレート、イソオクチル（メタ）アクリレート、イソペンチル（メタ）アクリレート、イソノニル（メタ）アクリレート、イソデシル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、ベンジル（メタ）アクリレート、フェノキシ（メタ）アクリレート、ｎ−ノニル（メタ）アクリレート、ｎ−デシル（メタ）アクリレート、ラウリル（メタ）アクリレート、ヘキサデシル（メタ）アクリレート、ステアリル（メタ）アクリレート等が挙げられる。二官能（メタ）アクリレートとしては、ビスフェノールＦ―ＥＯ変性ジ（メタ）アクリレート、ビスフェノールＡ―ＥＯ変性ジ（メタ）アクリレート、ポリプロピレングリコールジ（メタ）アクリレート、ポリエチレングリコール（メタ）アクリレート、トリシクロデカンジメチロールジ（メタ）アクリレート、ジシクロペンタジエン（メタ）アクリレート等が挙げられる。三官能（メタ）アクリレートとしては、トリメチロールプロパントリ（メタ）アクリレート、トリメチロールプロパンＰＯ変性（メタ）アクリレート、イソシアヌル酸ＥＯ変性トリ（メタ）アクリレート等が挙げられる。四官能以上の（メタ）アクリレートとしては、ジペンタエリスリトールペンタ（メタ）アクリレート、ペンタエリスリトールヘキサ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジトリメチロールプロパンテトラアクリレート等が挙げられる。その他に、多官能ウレタン（メタ）アクリレートも使用することができる。具体的には、Ｍ１１００、Ｍ１２００、Ｍ１２１０、Ｍ１６００（以上、東亜合成工業（株））、ＡＨ−６００、ＡＴ−６００（以上、共栄社化学（株））等が挙げられる。 Monofunctional (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) ) Acrylate, t-butyl (meth) acrylate, 2-methylbutyl (meth) acrylate, n-pentyl (meth) acrylate, n-hexyl (meth) acrylate, n-heptyl (meth) acrylate, 2-methylhexyl (meth) Acrylate, 2-ethylhexyl (meth) acrylate, 2-butylhexyl (meth) acrylate, isooctyl (meth) acrylate, isopentyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, cyclohexyl (meth) ) Acrylate, benzyl (meth) acrylate, phenoxy (meth) acrylate, n-nonyl (meth) acrylate, n-decyl (meth) acrylate, lauryl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, etc. Can be mentioned. Bifunctional (meth) acrylates include bisphenol F-EO-modified di (meth) acrylate, bisphenol A-EO-modified di (meth) acrylate, polypropylene glycol di (meth) acrylate, polyethylene glycol (meth) acrylate, and tricyclodecanedi. Examples include methylol di (meth) acrylate and dicyclopentadiene (meth) acrylate. Examples of the trifunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, trimethylolpropane PO-modified (meth) acrylate, and isocyanuric acid EO-modified tri (meth) acrylate. Examples of tetrafunctional or higher functional (meth) acrylates include dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, and ditrimethylolpropane tetraacrylate. In addition, polyfunctional urethane (meth) acrylates can also be used. Specific examples include M1100, M1200, M1210, M1600 (above, Toa Gosei Kogyo Co., Ltd.), AH-600, AT-600 (above, Kyoeisha Chemical Co., Ltd.), and the like.
液状硬化性化合物の樹脂組成物中の含有量は、少なすぎると硬化後の異方性導電フィルムに好ましい膜物性を付与することができず、多すぎると相対的に他の成分が少なくなり意図した性能の異方性導電フィルムを得られなくなる傾向があるので、膜形成樹脂１００質量部に対し、好ましくは５〜３５質量部、より好ましくは１０〜３０質量部である。 If the content of the liquid curable compound in the resin composition is too small, it is not possible to impart desirable film properties to the anisotropic conductive film after curing, and if it is too large, other components are relatively less intended. Since there is a tendency that an anisotropic conductive film having the above performance cannot be obtained, the amount is preferably 5 to 35 parts by mass, more preferably 10 to 30 parts by mass with respect to 100 parts by mass of the film-forming resin.
硬化剤は、液状硬化性化合物を重合させるための成分であり、液状硬化性化合物の種類等に応じて適宜選択することができる。液状硬化性化合物が、アクリル系モノマーである場合、硬化剤として、有機過酸化物やアゾ化合物等を使用することができるが、安定性の点から有機過酸化物を好ましく使用することができる。 A hardening | curing agent is a component for polymerizing a liquid curable compound, and can be suitably selected according to the kind etc. of a liquid curable compound. When the liquid curable compound is an acrylic monomer, an organic peroxide, an azo compound, or the like can be used as a curing agent, but an organic peroxide can be preferably used from the viewpoint of stability.
このような有機過酸化物としては、ジアシルパーオキサイド、パーオキシジカーボネート、パーオキシエステル、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド等が挙げられる。具体的には、ジイソブチリル、１，１，３，３−テトラメチルブチルパーオキシ−２−エチルヘキサノエート、ジラウロイルパーオキサイド、ジ（３，５，５−トリメチルヘキサイノイル）パーオキサイド、ｔ−ブチルパーオキシピバレート、ｔ−ヘキシルパーオキシピバレート、ｔ−ブチルパーオキシネオヘプタノエート、ｔ−ブチルパーオキシネオデカノエート、ｔ−ヘキシルパーオキシネオデカノエート、ジ（２−エチルヘキシル）パーオキシジカーボネート、ジ（４−ｔ−ブチルシクロヘキシル）パーオキシジカーボネート、１，１，３，３−テトラメチルブチルパーオキシネオデカノエート、ジ−ｓｅｃ−ブチルパーオキシジカーボネート、ジ−ｎ−プロピルパーオキシジカーボネート、クミルパーオキシネオデカノエート、ジ（４−メチルベンゾイル）パーオキサイド、ジ（３−メチルベンゾイル）パーオキサイド、ジベンゾイルパーオキサイド、１，１−ジ（ｔ−ブチルパーオキシ）−２−メチルシクロヘキサン、１，１−ジ（ｔ−ヘキシルパーオキシ）シクロヘキサン、１，１−ジ（ｔ−ブチルパーオキシ）シクロヘキサン、ｔ−ヘキシルパーオキシベンゾエート、ｔ−ブチルパーオキシベンゾエート、メチルエチルケトンパーオキサイド、シクロヘキサノンパーオキサイド、メチルシクロヘキサノンパーオキサイド、ｔ−ブチルヒドロパーオキサイド、ｔ−アミルヒドロパーオキサイド、ｔ−ヘキシルヒドロパーオキサイド、ｔ−オクチルヒドロパーオキサイド、２，５−ジメチル−２，５−ジヒドロパーオキシヘキサン、クメンヒドロパーオキサイド、ジイソプロピルベンゼンモノヒドロパーオキサイド、ジイソプロピルベンゼンジヒドロパーオキサイド、パラメンタンヒドロパーオキサイド等を挙げることができる。これらは、２種以上を併用することができる。また、フェニル環を有するこれらの高温分解過酸化物を使用することにより、異方性導電フィルムの凝集力を向上させることができるので接着強度を更に向上させることができる。 Examples of such organic peroxides include diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide and the like. Specifically, diisobutyryl, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, dilauroyl peroxide, di (3,5,5-trimethylhexinoyl) peroxide, t -Butylperoxypivalate, t-hexylperoxypivalate, t-butylperoxyneoheptanoate, t-butylperoxyneodecanoate, t-hexylperoxyneodecanoate, di (2-ethylhexyl) ) Peroxydicarbonate, di (4-t-butylcyclohexyl) peroxydicarbonate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, di-sec-butylperoxydicarbonate, di- n-propyl peroxydicarbonate, cumyl peroxyneodecanoate, di ( -Methylbenzoyl) peroxide, di (3-methylbenzoyl) peroxide, dibenzoyl peroxide, 1,1-di (t-butylperoxy) -2-methylcyclohexane, 1,1-di (t-hexylper) Oxy) cyclohexane, 1,1-di (t-butylperoxy) cyclohexane, t-hexylperoxybenzoate, t-butylperoxybenzoate, methyl ethyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, t-butyl hydroper Oxide, t-amyl hydroperoxide, t-hexyl hydroperoxide, t-octyl hydroperoxide, 2,5-dimethyl-2,5-dihydroperoxyhexane, cumene hydroperoxide, diiso B pills benzene mono hydroperoxide, diisopropylbenzene-dihydro peroxide, may be mentioned p-menthane hydroperoxide and the like. Two or more of these can be used in combination. Moreover, since the cohesive force of an anisotropic conductive film can be improved by using these high-temperature decomposition peroxides having a phenyl ring, the adhesive strength can be further improved.
有機過酸化物の樹脂組成物中の配合量は、少なすぎると異方性導電フィルムの硬化が不十分となる傾向があり、多すぎると重合度が低くなりフィルム特性が悪化する傾向があるので、アクリル系モノマー１００質量部に対し、好ましくは１〜４０質量部、より好ましくは２〜２０質量部である。 If the amount of the organic peroxide in the resin composition is too small, the anisotropic conductive film tends to be insufficiently cured, and if it is too large, the degree of polymerization tends to be low and the film characteristics tend to deteriorate. The amount is preferably 1 to 40 parts by mass, more preferably 2 to 20 parts by mass with respect to 100 parts by mass of the acrylic monomer.
本発明の異方性導電フィルムを構成する樹脂組成物は、本発明の効果を損なわない範囲で、異方性導電フィルムに従来より添加されている各種添加剤、例えば、無機フィラー、シランカップリング剤、顔料、酸化防止剤、希釈剤、溶剤、帯電防止剤等を配合することができる。 The resin composition constituting the anisotropic conductive film of the present invention is various additives conventionally added to the anisotropic conductive film within a range not impairing the effects of the present invention, for example, inorganic filler, silane coupling. An agent, a pigment, an antioxidant, a diluent, a solvent, an antistatic agent and the like can be blended.
本発明の異方性導電フィルムは、常法により製造することができる。例えば、膜形成樹脂と、液状硬化性化合物と、導電粒子と、エラストマーと、硬化剤と、必要に応じて添加される各種添加剤とを、攪拌機を用いて均一に混合してフィルム形成用の樹脂組成物を調製し、その樹脂組成物を用いて、公知のフィルム形成法を利用してフィルムに成形することにより製造することができる。このようにして得られた異方性導電フィルムの厚みは、使用目的に応じて適宜設定することができる。 The anisotropic conductive film of this invention can be manufactured by a conventional method. For example, a film-forming resin, a liquid curable compound, conductive particles, an elastomer, a curing agent, and various additives added as necessary are uniformly mixed using a stirrer for film formation. It can manufacture by preparing a resin composition and shape | molding it into a film using the resin composition using a well-known film formation method. Thus, the thickness of the anisotropic conductive film obtained can be suitably set according to the intended purpose.
以上説明した本発明の異方性導電フィルムは、基板の端子と電子部品の端子とを異方性導電接続して接続構造体を得る製造方法に好ましく適用することができる。この製造方法について、以下に、工程毎に説明する。 The anisotropic conductive film of the present invention described above can be preferably applied to a manufacturing method for obtaining a connection structure by anisotropically connecting a terminal of a substrate and a terminal of an electronic component. This manufacturing method will be described below for each process.
＜フィルム仮貼り工程＞
先ず、基板の端子に、本発明の異方性導電フィルムを仮貼りする。仮貼りは、半導体装置を製造する際に用いられる加熱加圧が可能なボンディングツールを使用することできる。仮貼り条件は、異方性導電フィルムの組成等に応じて適宜設定することができる。
<Temporary film sticking process>
First, the anisotropic conductive film of the present invention is temporarily attached to the terminal of the substrate. Temporary sticking can use the bonding tool in which the heating and pressurization used when manufacturing a semiconductor device is possible. Temporary sticking conditions can be appropriately set according to the composition of the anisotropic conductive film.
基板としては、ガラス基板、ガラスエポキシ基板、ポリイミドフレキシブル基板等を挙げることができる。基板の端子としては、基板ベース上に形成された銅箔をフォトリソグラフ法により形成した電極パッドを例示することができる。 Examples of the substrate include a glass substrate, a glass epoxy substrate, and a polyimide flexible substrate. Examples of the terminal of the substrate include an electrode pad formed by photolithography using a copper foil formed on the substrate base.
＜電子部品配置工程＞
次に、電子部品を、その端子が基板の端子に対向するように異方性導電フィルム上に配置する。この配置する方法としては、特に制限はなく、公知の手法を使用することができ、半導体装置を製造する際に用いられる加熱加圧が可能なボンディングツールを適用することができる。配置条件は、異方性導電フィルムの組成等に応じて適宜設定することができる。
<Electronic component placement process>
Next, an electronic component is arrange | positioned on an anisotropic conductive film so that the terminal may oppose the terminal of a board | substrate. The arrangement method is not particularly limited, and a known method can be used. A bonding tool capable of heating and pressing used in manufacturing a semiconductor device can be applied. The arrangement conditions can be appropriately set according to the composition of the anisotropic conductive film.
電子部品としては、半導体チップ、コンデンサ、ＬＥＤチップ、半導体モジュール、また、先に挙げた各種基板等を例示することができる。電子部品の端子としては、バンプ、電極バッドなどを挙げることができる。 Examples of the electronic component include a semiconductor chip, a capacitor, an LED chip, a semiconductor module, and various substrates mentioned above. Examples of terminals of electronic components include bumps and electrode pads.
＜異方性導電接続工程＞
次に、基板と電子部品とで挟持された異方性導電フィルムを、電子部品側から加熱加圧が可能なボンディングツールで加熱加圧することにより異方性導電接続を行う。これにより、基板の端子と電子部品の端子とが本発明の異方性導電フィルムを介して異方性導電接続された接続構造体が得られる。
<Anisotropic conductive connection process>
Next, anisotropic conductive connection is performed by heating and pressurizing the anisotropic conductive film sandwiched between the substrate and the electronic component with a bonding tool capable of heating and pressing from the electronic component side. Thereby, the connection structure by which the terminal of the board | substrate and the terminal of the electronic component were anisotropically conductive-connected through the anisotropic conductive film of this invention is obtained.
このようにして得られる接続構造体は、本発明の異方性導電フィルムを用いているので、良好な接続信頼性とリペア性とが両立したものとなる。 Since the connection structure obtained in this way uses the anisotropic conductive film of the present invention, both good connection reliability and repairability are achieved.
以下、本発明を実施例により具体的に説明する。 Hereinafter, the present invention will be specifically described by way of examples.
実施例１〜１１、比較例１〜１０
表１に示す異方性導電フィルム成分の合計１００質量部に、トルエン５０質量部とを、攪拌機を用いて均一に混合してフィルム形成用の樹脂組成物を調製し、得られた樹脂組成物を、剥離フィルム上に乾燥後の厚みが３５μｍとなるように塗布し、８０℃で５分間乾燥することにより異方性導電フィルムを得た。
Examples 1-11, Comparative Examples 1-10
A resin composition for film formation was prepared by uniformly mixing 50 parts by mass of toluene with a total of 100 parts by mass of the anisotropic conductive film components shown in Table 1 using a stirrer, and the resulting resin composition Was applied on the release film so that the thickness after drying was 35 μm, and dried at 80 ° C. for 5 minutes to obtain an anisotropic conductive film.
なお、表１中のエラストマーＡ〜Ｉとしては、それぞれ表中に示された、ＡＳＴＭ Ｄ６３８に基づく破断強度及び破断伸度を示すものを使用した。また、導電粒子Ａ〜Ｅとしては、それぞれ表中に示された、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃの条件における１０％変位時の圧縮硬さを示すものを使用した。 As the elastomers A to I in Table 1, those showing the breaking strength and breaking elongation based on ASTM D638 shown in the table were used. In addition, as the conductive particles A to E, those showing the compression hardness at the time of 10% displacement under the conditions of a load of 49.035 mN and a load speed of 2.226 mN / sec shown in the table, respectively, were used.
得られた異方性導電フィルムの硬化後の貯蔵弾性率、使用したエラストマーの破産強度及び破断伸度、使用した導電粒子の１０％変位時の圧縮強度について、以下説明するように測定した。得られた結果を表１に示す。 The storage elastic modulus after curing of the obtained anisotropic conductive film, the bankrupt strength and breaking elongation of the used elastomer, and the compressive strength at 10% displacement of the used conductive particles were measured as described below. The obtained results are shown in Table 1.
また、ボンディングツールを使用し、得られた異方性導電フィルムを用いて接続構造体を作成し、接続抵抗値、並びに本圧着後の異方性導電フィルムのリペア性を以下に説明するように試験評価した。得られた結果を表１に示す。 Also, using a bonding tool, create a connection structure using the obtained anisotropic conductive film, and explain the connection resistance value and the repair property of the anisotropic conductive film after the main pressure bonding as described below. Test evaluation. The obtained results are shown in Table 1.
なお、接続構造体は、プリント配線基板（ＦＲ４グレード、パナソニック（株）：銅配線ピッチ２００μｍ、配線高さ３５μｍ）の端子上に、異方性導電フィルムを仮貼りし、その仮貼りした異方性導電フィルム上に、ポリイミドフレキシブル基板（ポリイミド厚３８μｍ、銅配線ピッチ２００μｍ、配線高さ８μｍ）を、その端子がプリント配線基板の端子と対向するように配置し、プリント配線基板側から、１７０℃、４ＭＰａ、５ｓｅｃという条件でボンディングツールを用いて本圧着して異方性導電接続することで製造した。 The connection structure is an anisotropic conductive film that is temporarily bonded to an anisotropic conductive film on terminals of a printed wiring board (FR4 grade, Panasonic Corporation: copper wiring pitch 200 μm, wiring height 35 μm). A polyimide flexible substrate (polyimide thickness 38 μm, copper wiring pitch 200 μm, wiring height 8 μm) is placed on the conductive conductive film so that the terminals face the terminals of the printed wiring board, and 170 ° C. from the printed wiring board side. It manufactured by carrying out this pressure bonding using the bonding tool on the conditions of 4 Mpa and 5 sec, and carrying out anisotropic conductive connection.
＜硬化後の異方性導電フィルムの貯蔵弾性率の測定＞
異方性導電フィルムを、２００℃、３時間という条件で硬化させ、得られた異方性導電フィルムの硬化物について、導電粘弾性試験器（ＲＨＥＯＶＩＢＲＯＮ ＤＤＶ−０１ＦＰ，ＯＲＩＥＮＴＥＣ社）を用いて、ＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）を測定した。
<Measurement of storage elastic modulus of anisotropic conductive film after curing>
The anisotropic conductive film was cured at 200 ° C. for 3 hours, and the cured product of the obtained anisotropic conductive film was subjected to JIS using a conductive viscoelasticity tester (RHEOVIBRON DDV-01FP, ORIENTEC). The storage elastic modulus (25 ° C.) in the dynamic viscoelasticity measurement of the tensile vibration mode by K7244-4 was measured.
＜エラストマーの破断強度と破断伸度の測定＞
エラストマーＡ〜Ｉのそれぞれを８０ｍｍ（長さ）×１５ｍｍ（幅）×０．０２０〜０．０５０ｍｍ（厚さ）の短冊状にカットして得た試験片について、引張り試験器（テンシロン、オリエンテック社）を用い、ＡＳＴＭ Ｄ６３８に従って破断強度と破断伸度とを測定した。
<Measurement of breaking strength and breaking elongation of elastomer>
Tensile testers (Tensilon, Orientec) were used for test pieces obtained by cutting each of the elastomers A to I into strips of 80 mm (length) x 15 mm (width) x 0.020 to 0.050 mm (thickness). The breaking strength and breaking elongation were measured according to ASTM D638.
＜導電粒子の圧縮硬さの測定＞
導電粒子の１０％圧縮変位時の圧縮硬さを、微小圧縮試験器（ＭＣＴ−２００、島津製作所製）を用いて、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃという条件で測定した。
<Measurement of compression hardness of conductive particles>
The compression hardness at the time of 10% compression displacement of the conductive particles was measured using a micro-compression tester (MCT-200, manufactured by Shimadzu Corporation) under the conditions of a load of 49.035 mN and a load speed of 2.226 mN / sec.
＜接続抵抗値の測定＞
接続構造体について、温度８５℃、湿度８５％の高温高湿環境下に５００時間保存した場合の接続抵抗を測定し、以下の基準で接続信頼性を評価した。実用上、評価結果がＡ又はＢであることが望まれる。
<Measurement of connection resistance>
About the connection structure, the connection resistance at the time of storing for 500 hours in a high-temperature and high-humidity environment at a temperature of 85 ° C. and a humidity of 85% was measured, and connection reliability was evaluated according to the following criteria. In practice, the evaluation result is desirably A or B.
ランク 評価基準
Ａ： 接続抵抗値が２．０Ω未満の場合
Ｂ： 接続抵抗値が２．０Ω以上４．０Ω未満の場合
Ｃ： 接続抵抗値が４．０Ω以上の場合
Rank Evaluation Criteria A: When the connection resistance value is less than 2.0Ω B: When the connection resistance value is 2.0Ω or more and less than 4.0Ω C: When the connection resistance value is 4.0Ω or more
＜異方性導電フィルムのリペア性＞
接続構造体のプリント配線基板を保持固定し、ポリイミドフレキシブル基板を引きはがし、ポリイミドフレキシブル基板の端子上に残存付着した異方性導電フィルム（ＡＣＦ）の硬化物を、端子と一定平行方向に綿棒で擦り、除去できるまでの擦り回数をカウントし、以下の基準でリペア性を評価した。実用上、評価結果がＡ又はＢであることが望まれる。
<Repairability of anisotropic conductive film>
Holding and fixing the printed circuit board of the connection structure, peeling off the polyimide flexible board, and using a cotton swab in a fixed parallel direction to the terminals, the cured anisotropic conductive film (ACF) remaining on the terminals of the polyimide flexible board The number of rubs until rubbing and removal was counted, and the repairability was evaluated according to the following criteria. In practice, the evaluation result is desirably A or B.
ランク 評価基準
Ａ： 残存付着した異方性導電フィルムの硬化物が除去できるまで綿棒で擦った回数が５回未満である場合
Ｂ： 残存付着した異方性導電フィルムの硬化物が除去できるまで綿棒で擦った回数が６回以上である場合
Ｃ： 綿棒で擦ったぐらいでは、異方性導電フィルムの硬化物が除去できない場合
Rank Evaluation Criteria A: When the number of rubbing with the cotton swab is less than 5 times until the cured product of the remaining attached anisotropic conductive film can be removed B: Cotton swab until the cured product of the remaining attached anisotropic conductive film can be removed When the number of times of rubbing is 6 times or more C: When the cured product of the anisotropic conductive film cannot be removed by rubbing with a cotton swab
実施例１〜１１の異方性導電フィルムは、いずれも、硬化後のＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）が、０．５〜１．５ＧＰａであり、使用したエラストマーのＡＳＴＭ Ｄ６３８による破断強度が５０〜８０ＭＰａであり且つ破断伸度が１０％以下であり、エラストマーの樹脂組成物中の含有量が、膜形成樹脂、液状硬化性化合物、導電粒子、当該エラストマー及び硬化剤の合計全質量中の２０〜５０質量％であり、そして導電粒子が、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃの条件における１０％変位時の圧縮硬さが３００〜５００ｋｇｆ／ｍｍ２であった。従って、異方性導電フィルムのリペア性及び接続構造体の接続抵抗値の評価結果が、実用上問題ないレベルであるＡ又はＢであった。 The anisotropic conductive films of Examples 1 to 11 each have a storage elastic modulus (25 ° C.) of 0.5 to 1.5 GPa in the dynamic viscoelasticity measurement in the tensile vibration mode according to JIS K7244-4 after curing. The fracture strength according to ASTM D638 of the used elastomer is 50 to 80 MPa and the elongation at break is 10% or less, and the content of the elastomer in the resin composition is a film-forming resin, a liquid curable compound, a conductive material. 20-50% by mass of the total mass of the particles, the elastomer and the curing agent, and the conductive particles have a compressive hardness at 10% displacement under conditions of a load of 49.035 mN and a load speed of 2.226 mN / sec. It was 300 to 500 kgf / mm 2 . Therefore, the evaluation result of the repair property of the anisotropic conductive film and the connection resistance value of the connection structure was A or B which is a level with no practical problem.
特に、比較例１〜２並びに実施例１〜３の対比の結果から、硬化後の異方性導電フィルムのＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）の範囲が、発明の効果を得るという観点から０．５〜１．５ＧＰａであることがわかる。 In particular, from the comparison results of Comparative Examples 1-2 and Examples 1-3, the storage elastic modulus (25 ° C.) in the dynamic viscoelasticity measurement of the tensile vibration mode according to JIS K7244-4 of the anisotropic conductive film after curing. From the viewpoint of obtaining the effects of the invention, it is understood that the range is 0.5 to 1.5 GPa.
比較例３〜４並びに実施例４〜５の対比結果から、使用すべきエラストマーのＡＳＴＭ Ｄ６３８による破断強度の範囲が、発明の効果を得るという観点から５０〜８０ＭＰａであること、また、比較例５〜６並びに実施例６〜７の結果から、使用するエラストマーのＡＳＴＭ Ｄ６３８による破断伸度の範囲が、発明の効果を得るという観点から１０％以下であることがわかる。 From the comparison results of Comparative Examples 3 to 4 and Examples 4 to 5, the range of the breaking strength according to ASTM D638 of the elastomer to be used is 50 to 80 MPa from the viewpoint of obtaining the effects of the invention, and Comparative Example 5 From the results of -6 and Examples 6-7, it can be seen that the range of elongation at break according to ASTM D638 of the elastomer used is 10% or less from the viewpoint of obtaining the effects of the invention.
比較例７〜８並びに実施例８〜９の対比結果から、使用すべきエラストマーの配合量の範囲が、膜形成樹脂、液状硬化性化合物、導電粒子、当該エラストマー及び硬化剤の合計全質量中、発明の効果を得るという観点から２０〜５０質量％であることがわかる。 From the comparison results of Comparative Examples 7 to 8 and Examples 8 to 9, the range of the amount of elastomer to be used is in the total total mass of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent. It turns out that it is 20-50 mass% from a viewpoint of acquiring the effect of invention.
比較例９〜１０並びに実施例１０〜１１の対比結果から、使用すべき導電粒子の圧縮硬さの範囲が、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃの条件における１０％変位時に、発明の効果を得るという観点から３００〜５００ｋｇｆ／ｍｍ２であることがわかる。 From the comparison results of Comparative Examples 9 to 10 and Examples 10 to 11, when the compression hardness range of the conductive particles to be used is 10% displacement under the conditions of a load of 49.035 mN and a load speed of 2.226 mN / sec, the invention it can be seen from the viewpoint of obtaining the effect which is 300~500kgf / mm 2.
本発明の異方性導電フィルムは、その硬化後の貯蔵弾性率が所定範囲となるものであり、特定の破断強度と破断伸度とを示すエラストマーを所定量含有していると共に、配合すべき導電粒子として所定の圧縮硬さを有するものを使用している。このため、本発明の異方性導電フィルムは、良好な接続信頼性とリペア性とを両立させることができ、よって、基板の端子と電子部品の端子とを異方性導電接続する際に有用である。 The anisotropic conductive film of the present invention has a storage elastic modulus after curing within a predetermined range, contains a predetermined amount of elastomer showing a specific breaking strength and breaking elongation, and should be blended A conductive particle having a predetermined compression hardness is used. For this reason, the anisotropic conductive film of the present invention can achieve both good connection reliability and repairability, and is therefore useful for anisotropic conductive connection between the terminal of the substrate and the terminal of the electronic component. It is.
Claims (4)
硬化後の異方性導電フィルムのＪＩＳ Ｋ７２４４−４による引張り振動モードの動的粘弾性測定における貯蔵弾性率（２５℃）が、０．５〜１．５ＧＰａであり、
エラストマーが、ＡＳＴＭ Ｄ６３８による５０〜８０ＭＰａの破断強度と１０％以下の破断伸度とを示すものであり、
エラストマーの樹脂組成物中の含有量が、膜形成樹脂、液状硬化性化合物、導電粒子、当該エラストマー及び硬化剤の合計全質量中の２０〜５０質量％であり、そして
導電粒子が、荷重４９．０３５ｍＮ、負荷速度２．２２６ｍＮ／ｓｅｃの条件における１０％変位時に３００〜５００ｋｇｆ／ｍｍ２の圧縮硬さを示すものである
異方性導電フィルム。 An anisotropic conductive film obtained by molding a resin composition containing a film-forming resin, a liquid curable compound, conductive particles, an elastomer, and a curing agent into a film,
The storage elastic modulus (25 degreeC) in the dynamic viscoelasticity measurement of the tensile vibration mode by JISK7244-4 of the anisotropic conductive film after hardening is 0.5-1.5GPa,
The elastomer exhibits a breaking strength of 50 to 80 MPa according to ASTM D638 and a breaking elongation of 10% or less,
The content of the elastomer in the resin composition is 20 to 50% by mass in the total total mass of the film-forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent, and the conductive particles have a load of 49. An anisotropic conductive film that exhibits a compression hardness of 300 to 500 kgf / mm 2 at 10% displacement under conditions of 035 mN and a load speed of 2.226 mN / sec.
基板の端子に、請求項１又は２記載の異方性導電フィルムを仮貼りする工程、
電子部品を、その端子が基板の端子に対向するように異方性導電フィルム上に配置する工程、
基板と電子部品とで挟持された異方性導電フィルムを、電子部品側からボンディングツールで加熱加圧することにより異方性導電接続を行う工程
を有する製造方法。 A manufacturing method for obtaining a connection structure by anisotropically conductively connecting a terminal of a substrate and a terminal of an electronic component,
Temporarily attaching the anisotropic conductive film according to claim 1 or 2 to a terminal of the substrate;
Arranging the electronic component on the anisotropic conductive film so that the terminal faces the terminal of the substrate;
The manufacturing method which has the process of performing anisotropic conductive connection by heat-pressing the anisotropic conductive film clamped with the board | substrate and the electronic component with the bonding tool from the electronic component side.
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