JP2012018173A - System-in package and socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a system-in package which facilitates a test without increasing a size and costs and to use the system-in package as a test board.SOLUTION: A test facilitating circuit interior SIP1c is configured by bonding a plurality of core substrates, on at least one of which an integrated circuit chip is mounted, via an insulation resin layer and is configured by connecting wiring layers formed on the core substrates via a through-hole. On a test facilitating circuit interior substrate 10c, which is one of the core substrates, a socket 122 with a DUT 121 as a test-target integrated circuit being attached thereto is mounted, and a pogo pin 1220 disposed in the socket 122 comprises passive elements such as an impedance matching chip resistor 1224 and an inductor 1225.

Description

  The present invention relates to a system in package (hereinafter abbreviated as SIP) including a test facilitating circuit and / or an impedance matching circuit on a substrate, and a socket used in the system in package.

  In recent years, integration technology of semiconductor integrated circuits has been remarkably advanced, and a so-called SOC (System On Chip) large-scale integrated circuit in which a plurality of circuit devices are realized as one integrated circuit chip has already been put into practical use. ing. Such an SOC is often configured to include a large capacity memory and a logic circuit such as a processor operating at high speed. In order to manufacture such an SOC, an insulating layer made of a material having a high dielectric constant is formed in order to reduce the size of a memory cell, and a material having a low dielectric constant is used to realize high-speed operation of a logic circuit such as a processor. An insulating layer is formed. Therefore, the manufacturing process of the SOC becomes complicated, and the yield is not improved. Therefore, it is difficult to reduce the manufacturing cost of the SOC beyond a certain cost.

  Therefore, recently, a SIP in which a plurality of circuit devices constituting the SOC are manufactured as one integrated circuit chip and these integrated circuit chips are mounted in one package has attracted attention.

  One of the merits of SIP is that SIP can be manufactured by assembling already produced integrated circuit chips. In this case, since the integrated circuit chip to be used is a product that has already been produced, it can be obtained at low cost.

  Further, when newly developing and manufacturing an integrated circuit chip to be mounted on the SIP, for example, the memory and the logic circuit can be manufactured as separate integrated circuit chips. Therefore, since each integrated circuit chip is manufactured by the minimum necessary steps, it is possible to independently improve the yield. Therefore, even if SIP adds the cost of assembling a plurality of integrated circuit chips into one package, it can be made cheaper than the manufacturing cost of the SOC in which these integrated circuit chips are integrated on the same silicon chip.

  However, in SIP (as well as in SOC), the signal lines that connect the integrated circuit chips mounted on the SIP are not connected to the external connection terminals of the SIP. There is a problem that it becomes difficult. For example, a memory integrated circuit chip can be tested only after all terminal signals of the memory integrated circuit chip can be controlled and observed by an external device such as a test device. Therefore, in the SIP, for example, when the terminal signal of the memory integrated circuit chip is connected only to the other integrated circuit chip inside and is not connected to the external connection terminal of the SIP, the memory integrated circuit chip is tested. I can't do that.

  Therefore, in recent years, an integrated circuit chip may include a test facilitating circuit such as a boundary scan circuit standardized by JTAG (Joint Test Action Group). In such a case, the integrated circuit chip can be easily tested. However, in particular, those that have been distributed in the market as general-purpose products, such as memory integrated circuit chips, often do not include such a test facilitating circuit. In addition, the integrated circuit chip mounted on the SIP is a bare die that has not been fully tested (in this specification, an integrated circuit in which a wafer is diced is a bare die, and a package in which the bare die is packaged is an integrated circuit. Often referred to as chips). Therefore, when designing and manufacturing a SIP, it is necessary to pay attention to such a reality and to take measures to facilitate the test.

  Conventionally, with respect to the problem that SIP testing becomes difficult in this way, for example, Patent Document 1 discloses a circuit for assisting testing of a first integrated circuit chip (for example, a memory integrated circuit) mounted on a SIP. Is formed on a second integrated circuit chip mounted on the same SIP to facilitate the SIP test. In addition to the integrated circuit chip mounted on the SIP, the patent document 2 includes an integrated circuit chip configured with an FPGA (Field Programmable Gate Array), and the FPGA integrated circuit chip constitutes a test facilitating circuit. Thus, a technique for facilitating the SIP test is disclosed.

  Further, in these SIPs, it is necessary to consider signal reflection countermeasures at integrated circuit chip terminals. Many integrated circuit chips in recent years operate with a clock frequency in the GHz band. When such a high-speed integrated circuit chip is mounted on a SIP, if signal reflection countermeasures are not implemented, it is difficult to correctly perform high-speed signal transmission due to signal reflection due to impedance mismatch. is there.

JP 2004-158098 A (paragraphs 0009 to 0021, FIGS. 1 to 3) Japanese Patent Laying-Open No. 2005-283205 (paragraphs 0015 to 0021, FIGS. 1 and 2)

  In the technique disclosed in Patent Document 1, an auxiliary circuit for the test is inserted in another integrated circuit chip in order to test a certain integrated circuit chip. Therefore, at least for the other integrated circuit chip, Existing integrated circuit chips cannot be used. In that case, an integrated circuit chip used exclusively for the SIP must be manufactured, and the cost merit of the SIP is impaired. In the technique disclosed in Patent Document 2, since an extra FPGA integrated circuit chip is additionally mounted on the SIP, the size of the SIP is increased, and the cost burden is increased accordingly.

  Further, as a countermeasure for signal reflection at the integrated circuit chip terminal, reflection of the signal can be prevented by adding a resistor and an inductance element for impedance matching in the vicinity of the terminal of the integrated circuit chip. However, if the same technology is implemented in SIP, a space for mounting resistors and inductance elements is required, and there is a demerit that the size of the SIP is increased.

  In view of the above problems of the prior art, the object of the present invention is to increase the manufacturing cost without increasing the size even if an integrated circuit chip not including a testability circuit is mounted. In addition to providing a SIP that can facilitate the test, and further to provide a SIP that allows the SIP to be utilized as a test board for testing another integrated circuit chip. is there.

  In order to achieve the object, the invention according to claim 1 is characterized in that at least one of the integrated circuit chips in a SIP including at least one integrated circuit chip and a substrate on which the integrated circuit chip is mounted. In order to facilitate the testing of the integrated circuit chip, a test facilitating circuit is built in the substrate. It should be noted that the installation of the test facilitating circuit on the substrate means that the test facilitating circuit is embedded and integrated with the substrate in the process of manufacturing the substrate.

  That is, the SIP according to the first aspect of the present invention is formed by bonding a plurality of substrates each having an integrated circuit chip mounted thereon at least one of them via an insulating resin layer, and forming each of the substrates. A system-in-package formed by connecting the wiring layer formed through at least one substrate of the substrate and a through hole penetrating the resin layer, and at least one of the plurality of substrates includes: A test facilitating circuit for facilitating testing of at least one integrated circuit chip among the integrated circuit chips, and an integrated circuit chip other than the integrated circuit chip fixedly mounted on any of the plurality of substrates And a socket to be mounted as possible.

  According to the first aspect of the present invention, when the integrated circuit chip constituting the SIP does not include the test facilitating circuit, the test facilitating circuit of the integrated circuit chip is provided on at least one of the substrates. The interior can facilitate testing of the integrated circuit chip, and thus the entire SIP including the integrated circuit chip, without increasing the size of the SIP itself.

  According to the first aspect of the present invention, when the test target integrated circuit chip is mounted in the socket, a test SIP for testing the test target integrated circuit chip can be realized. it can.

  According to a second aspect of the present invention, in the SIP according to the first aspect, the socket is connected to a pogo pin of the socket that connects a terminal of an integrated circuit chip mounted on the socket and a wiring layer of the system-in-package substrate. A passive element that matches the impedance of the terminal of the integrated circuit chip to be mounted on is incorporated.

  According to the second aspect of the present invention, since the passive element that matches the impedance of the terminal of the integrated circuit chip to be mounted on the socket mounted on the SIP board is built in the pogo pin of the socket, the size of the SIP is increased. Thus, signal reflection at the terminals of the integrated circuit chip to be mounted in the socket can be prevented.

  According to a third aspect of the present invention, there is provided a socket mounted on the system-in-package according to the first aspect, wherein the impedance of the terminal of the integrated circuit chip mounted on the socket is matched with the pogo pin of the socket. It is characterized by having an element inside.

  According to the third aspect of the present invention, signal reflection at the terminals of the integrated circuit chip attached to the socket can be prevented.

  As described above, according to the present invention, even if an existing integrated circuit chip that does not include a test facilitating circuit is mounted, the size of the integrated circuit chip is not increased, and the manufacturing cost is not increased. SIP can be realized. Further, the SIP can be used as a test board for testing another integrated circuit chip, and further, signal reflection at the terminals of the integrated path chip mounted on the socket can be prevented.

It is the figure which showed typically the cross-sectional structure of the test facilitating circuit interior substrate which comprises the test facilitating circuit interior SIP which concerns on the 1st Embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is the figure which showed the 1st example of the testability improvement circuit interior SIP which concerns on the 1st Embodiment of this invention, (a) is the figure which showed the planar shape and circuit diagram typically, (b) is It is the figure which showed the cross-sectional shape typically. It is the figure which showed the 2nd example of the test facilitating circuit interior SIP concerning the 1st Embodiment of this invention, (a) is the figure which showed the planar shape and circuit diagram typically, (b) is It is the figure which showed the cross-sectional shape typically. It is the figure which showed the example of the structure of the BIST circuit generally used. It is the figure which showed typically the cross-section of the test facilitating circuit interior substrate which comprises the test facilitating circuit interior SIP which concerns on the 2nd Embodiment of this invention. It is the figure which showed the example of the structure by which the organic compound semiconductor was formed in the core board | substrate of the test facilitation circuit interior board which concerns on the 2nd Embodiment of this invention. It is the figure which showed the chemical structure of the pentacene molecule. It is the figure which showed typically the structure of the test facilitating circuit interior SIP which concerns on the 3rd Embodiment of this invention. It is the figure which showed the point of the circuit which connects DUT to a test apparatus in the test facilitating circuit internal substrate which concerns on the 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram schematically showing a cross-sectional structure of a test facilitating circuit internal substrate constituting the test facilitating circuit internal SIP according to the first embodiment of the present invention. As shown in FIG. 1, the test facilitating circuit interior SIP 1 according to the first embodiment is usually provided with a plurality of integrated circuit chips 2 (only one in FIG. 1) on a test facilitating circuit interior substrate 10. (Illustrated) is mounted. The testability circuit-incorporated substrate 10 is configured by bonding a plurality of core substrates 3, 4, and 5 on which metal wiring layers 31, 41, and 51 are formed, with an insulating resin layer 7 made of resin or the like.

  In FIG. 1, a so-called buildup layer 32 is formed on the core substrate 3, and a pad 33 made of metal or the like is formed on the uppermost layer (outer layer). The pad 33 is formed at a position for receiving the bump 21 formed as a signal connection terminal of the integrated circuit chip 2, and the integrated circuit chip 2 and the test facilitating circuit internal substrate 10 are connected via the bump 21 and the pad 33. The Further, the connection of the wiring layers 31, 41, 51 between the core substrates 3, 4, 5 is made by the through holes 6 or the like. The core substrate 3 may be one on which the buildup layer 32 is not formed.

  On the core substrate 4, a WLCSP integrated circuit chip 43 having a length of about 1 mm to 2 mm and a width and thickness of about 0.5 mm is mounted. The WLCSP integrated circuit chip 43 is a packaging style integrated circuit chip in which a microbump 45 is simply added to a bare die of an integrated circuit, and is configured to include several logic circuit elements generally called standard logic. Therefore, a plurality of WLCSP integrated circuit chips 43 are appropriately connected by wiring of the wiring layer 41 to separately configure a test facilitating circuit as described later in FIGS.

  Further, a passive element 44 such as a resistor, a capacitor, and an inductor having the same size as that of the WLCSP integrated circuit chip 43 is mounted on the core substrate 4. The passive element 44 is used not only to configure a test facilitating circuit as necessary, but also to configure an impedance matching circuit for the terminals (bumps 21) of the integrated circuit chip 2. Further, the passive element 44 may constitute a so-called pass capacitor or the like for stabilizing the power signal.

  In addition, since the WLCSP integrated circuit chip 43 and the passive element 44 are mounted on the core substrate 4, unevenness is generated on the surface thereof. An adhesive layer 42 may be formed in order to reduce the unevenness and improve the adhesion to other core substrates.

  In the description of FIG. 1, the test facilitating circuit interior board 10 is composed of three core boards 3, 4, and 5. However, the number of core boards is not limited as long as it is one or more. May be. However, when the number of core substrates is one, the integrated circuit chip 2 or the like is usually mounted on one surface and the WLCSP integrated circuit chip 43 is mounted on the back surface in order to reduce the substrate area. Further, when a plurality of integrated circuit chips 2 are mounted on the test facilitating circuit interior substrate 10, the integrated circuit chips 2 are mounted on both the front and back surfaces of the test facilitating circuit interior substrate 10. The core substrate included in the substrate 10 may have a form in which the WLCSP integrated circuit chip 43 and the like are mounted.

  FIG. 2 is a diagram showing a first example of the testability-enhanced circuit interior SIP according to the first embodiment of the present invention. FIG. 2A is a diagram schematically showing its planar shape and circuit diagram. (B) is the figure which showed the cross-sectional shape typically.

  In FIG. 2, the test facilitating circuit internal SIP 1 is configured by mounting a memory chip 101 and a digital ASIC (Application Specific Integrated Circuits) chip 102 on a test facilitating circuit internal substrate 10. Here, the memory chip 101 includes, for example, an SDRAM (Synchronous Dynamic Random Access Memory) 1010, and the memory chip 101 does not include a test facilitating circuit. On the other hand, the digital ASIC chip 102 includes, for example, an IEEE 1149.1 boundary scan circuit standardized by JTAG as a test facilitating circuit for facilitating the test of the ASIC core 1020.

  Therefore, in the present embodiment, a boundary scan circuit conforming to the IEEE 1149.1 standard is provided in the test-easy circuit internal substrate 10 in order to facilitate the test of the memory chip 101. As shown in FIG. 2, the boundary scan circuit surrounds the memory chip 101 and has a BS shift register 105 provided connected to the terminal, and a TAP (T) that takes in input information from a test terminal and controls a test operation. Test Access Port) The controller 104 is configured.

  Here, the test terminal is a signal terminal for controlling the execution of the test using the boundary scan circuit. In JTAG IEEE1149.1 standard, TDI (Test Data Input) that inputs test data as a test terminal, TDO (Test Data Output) that outputs test data, and TMS (Test Mode Select input) that selects operation in test mode ), TCK (Test Clock input) for executing a test operation including the shift operation of the BS shift register 105, TRSI (Test Reset input) for initializing the internal state of the TAP controller 104, and the like are defined.

  The TAP controller 104 is a control circuit that controls the operation and test operation of the boundary scan circuit. Here, a detailed description of the operation is omitted, but test data is input to the memory chip 101 via the test terminal TDI and the BS shift register 105 under the control of the TAP controller 104. Test data as a result of the operation of the memory chip 101 is output to the outside through the BS shift register 105 and the test terminal TDO. In this way, the memory chip 101 can be tested even if the terminals of the memory chip 101 are not directly connected to the external connection terminals of the test-facility circuit-internal circuit SIP1, that is, the test is easy. It becomes.

  Since the BS shift register 1022 and the TAP controller 1021 are already placed in the digital ASIC chip 102, the test terminals provided in the digital ASIC chip 102 are connected to the test facilitating circuit internal substrate 10 here. Simply connect to the provided test terminals.

  In the present embodiment, the above-described boundary scan circuit, that is, the test facilitating circuit, is appropriately wired with a plurality of WLCSP integrated circuit chips 43 housed in the test facilitating circuit internal substrate 10 (see FIG. 1). The layers 31, 41 and 51 are connected by wiring. As described above, since the size of the WLCSP integrated circuit chip 43 is small, the size of the test facilitating circuit built-in SIP 1 can be hardly increased even if such a test facilitating circuit is housed.

  FIG. 3 is a diagram showing a second example of the testability-enhanced circuit interior SIP according to the first embodiment of the present invention, and (a) is a diagram schematically showing its planar shape and circuit diagram; (B) is the figure which showed the cross-sectional shape typically.

  In the example of FIG. 3, the test facilitating circuit interior SIP <b> 1 is obtained by replacing the memory chip 101 in the test facilitating circuit interior SIP <b> 1 of the example of FIG. 2 with an analog integrated circuit chip 111. Here, for example, a modem circuit 1110 is formed in the analog integrated circuit chip 111. One input terminal and output terminal of the modem circuit 1110 are connected to a signal from an external antenna via a signal mixing / separation circuit 113. The other input terminal and output terminal are connected to a signal external to the analog integrated circuit chip 111 via a D / A (Digital to Analog) converter 1111 or an A / D (Analog to Digital) converter 1112. The

  In this way, in the case where the test facilitating circuit built-in SIP 1 includes the analog integrated circuit chip 111, in order to facilitate the test of the analog integrated circuit chip 111, the analog consideration boundary scan of the IEEE 1149.4 standard standardized by JTAG is adopted. The circuit is mounted on the circuit board 10 that facilitates testing.

  The analog consideration boundary scan circuit includes a normal TAP controller 104, a BS shift register 105 (not shown in FIG. 3), a TBIC (Test Bus Interface Circuit) 106, and an ABM (Analog Boundary Module) 107. Is done. Here, the details of the TBIC 106 and the ABM 107 are omitted, but the ABM 107 is connected to the analog input terminal or the analog output terminal of the analog integrated circuit chip 111, and the signal of the analog input terminal or the analog output terminal is connected to the TBIC 106. Under control, the circuit operates to connect to the analog test terminals AT1 and AT2 of the circuit board 10 for easy testing.

  That is, an analog test signal can be supplied to the analog integrated circuit chip 111 via the analog test terminals AT1 and AT2, and an analog signal output from the analog integrated circuit chip 111 can be observed. The test of the circuit chip 111, that is, the test facilitating circuit interior SIP1, is facilitated. The analog-considerable boundary scan circuit as described above includes a plurality of WLCSP integrated circuit chips 43 and passive elements 44 housed in the test facilitating circuit interior substrate 10 (see FIG. 1) as appropriate in the wiring layers 31, 41, It is configured by connecting with 51 wires.

  As described above, in the first embodiment of the present invention, the example in which the test facilitating circuit is configured by the JTAG standard boundary scan circuit (IEEE 1149.1) or the analog consideration boundary scan circuit (IEEE 1149.4) is shown. A test facilitating circuit based on the method may be used. For example, instead of the boundary scan circuit, a BIST (Built In Self Test) circuit may be used.

  FIG. 4 is a diagram showing an example of the configuration of a BIST circuit that is generally used. As shown in FIG. 4, the BIST circuit 20 includes an LFSR (Linear Feedback Shift Register) 202 and a MISR (Multi Input Signature Register) 203. In the test by the BIST circuit 20, a pseudo random number sequence generated by the LFSR 202 is input to a CUT (Circuit Under Test) 201, and a signal sequence output from the CUT 201 is compressed by the MISR 203 in response to the input. Then, it is determined whether or not the CUT 201 operates correctly depending on whether or not the compressed information (called Signature) is the same as expected.

  When such a BIST circuit 20 is applied to the test facilitating circuit interior SIP 1 of FIG. 2, assuming that the memory chip 101 corresponds to the CUT 201, the BS shift register 105 may be replaced with the LFSR 202 and the MISR 203. Then, the LFSR 202 and the MISR 203 may be configured by appropriately connecting a plurality of WLCSP integrated circuit chips 43 housed in the test facilitating circuit interior substrate 10 with wirings of the wiring layers 31, 41, 51.

In FIG. 4, the LFSR 202 and the MISR 203 are each composed of a shift register (SR) 204 and an exclusive OR circuit 205. Here, the LFSR 202 is a circuit that generates a so-called cyclic code, and the generation polynomial of the cyclic code is that the most significant bit signal of the LFSR 202 is fed back to the shift register 204, that is, the position is fed back to. The exclusive OR circuit 205 is provided. For example, in the LFSR 202 of FIG. 4, the exclusive OR circuit 205 for feedback is arranged between the first bit shift register 204 and the second bit shift register 204. In this case, the generator polynomial is a G (x) = 1 + x + x 4. The MISR 203 functions as a circuit that compresses the signal sequence output from the CUT 201, but a generator polynomial similar to the LFSR 202 is defined in the MISR 203. In the case of MISR 203 in FIG. 4, the generator polynomial is G (x) = 1 + x ³ + x ⁴ .

(Second Embodiment)
FIG. 5 is a diagram schematically showing a cross-sectional structure of the test facilitating circuit internal substrate constituting the test facilitating circuit internal SIP according to the second embodiment of the present invention. 5, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  The test facilitating circuit internal substrate 10b of the test facilitating circuit internal SIP 1b according to the second embodiment has three core substrates 3, 4b, 5 similar to the test facilitating circuit internal substrate 10 according to the first embodiment. Are configured by bonding. At this time, the configurations of the core substrates 3 and 5 are the same as those in the first embodiment, but in the present embodiment, the core substrate 4b is formed with a base portion made of a silicon semiconductor. Then, a transistor element such as a MOS (Metal Oxide Semiconductor) is formed on the silicon semiconductor of the base, and a plurality of wiring layers are formed thereon via an insulating layer. Since the detailed cross-sectional structure of the core substrate 4b is the same as that of a normal silicon semiconductor integrated circuit, the illustration thereof is omitted here.

  The boundary scan circuit and the BIST circuit described with reference to FIGS. 2 to 4 are obtained by appropriately connecting the transistor elements formed using the silicon semiconductor as a base as described above with the wiring of the wiring layer formed thereon. Configure a test facilitating circuit. Then, micro bumps 45 are appropriately formed on the core substrate 4b based on the silicon semiconductor, and connected to the core substrate 3 through the micro bumps 45, and the test facilitating circuit is connected to the integrated circuit chip 2. . In this way, the test facilitating circuit internal SIP 1b that facilitates the test of the integrated circuit chip 2 is configured.

  In FIG. 5, the test facilitating circuit interior substrate 10b may have a configuration without both or one of the core substrates 3 and 5. Moreover, you may be the structure to which the other extra core board | substrate was added. Further, the core substrate 3 may have a configuration in which the buildup layer 32 is not formed. However, when the core substrate 3 is not provided, the integrated circuit chip 2 is mounted on the core substrate 4b. Therefore, the bumps 21 of the integrated circuit chip 2 are connected to the core substrate 4b instead of the micro bumps 45. A pad for forming is formed.

  Moreover, since the above core substrate 4b is manufactured using a normal silicon semiconductor manufacturing process, not only transistor elements such as MOS but also passive elements such as resistors, capacitors and inductors can be embedded. Moreover, if a process similar to that for manufacturing a nonvolatile memory is added, a programmable circuit element such as a so-called PLD (Programmable Logic Device) can be built.

  Therefore, PLD may be applied to the BIST circuit 20 (see FIG. 4), and the BIST circuit 20 may be configured so that, for example, the generator polynomials of the LFSR 202 and the MISR 203 are variable. In order to variably configure the generator polynomial, the entire BIST circuit including the shift register 24 may be configured by PLD, or the shift register 24 may be configured by a normal transistor element, and the connection portion of the shift register 24 and The exclusive OR circuit 205 may be configured by a PLD.

  When the LFSR 202 and MISR 203 are configured so that their generator polynomials are variable in this way, the bits of the LFSR 202 and MISR 203 depend on the logical structure of the integrated circuit chip 2 to be tested, the number of input terminals, the number of output terminals, and the like. The length, the sequence length of the signal generated by the LFSR 202, and the like can be adjusted. That is, by configuring all or part of the BIST circuit 20 with a PLD, the BIST circuit 20 can be optimized according to the integrated circuit chip 2 to be tested.

  As described above, in the second embodiment of the present invention, the core substrate 4b of the circuit board 10b for easy testability is formed of a silicon semiconductor, but the substrate is an insulator such as glass or plastic. The silicon semiconductor layer may be formed on the insulator. In this case, a transistor element such as a MOS is formed using a silicon semiconductor layer formed on the insulator. The transistor element formed in this way is often called a TFT (Thin Film Transistor).

  Further, when a TFT is formed by forming a silicon semiconductor layer on a substrate such as an insulator, the semiconductor layer may be an organic compound semiconductor layer instead of the silicon semiconductor layer. FIG. 6 is a diagram showing an example of a structure in which an organic compound semiconductor is formed on the core substrate of the testability-enhancing circuit interior substrate according to the second embodiment of the present invention. The organic compound semiconductor shown in FIG. 6 is an example of a MOS transistor using a pentacene semiconductor.

  As shown in FIG. 6, in order to form a MOS transistor using a pentacene semiconductor, first, a silicon oxide film 502 is formed on a silicon substrate 501 used as a base of the core substrate 4b by thermal oxidation or the like. Then, a gate electrode 503 having a predetermined shape is formed on the silicon oxide film 502 by using polysilicon or the like. The gate electrode 503 is covered with an insulating film 504 such as silicon nitride, and further, a source electrode 505 and a drain electrode 506 for the gate electrode 503 are formed on a metal layer such as gold in a predetermined shape. Then, a pentacene semiconductor layer 507 is applied and formed thereon by spin coating or the like.

  Note that although the illustration of the structure above the pentacene semiconductor layer 507 is omitted, a wiring layer or the like is formed on the upper portion through an insulating layer or the like. In this example, the base of the core substrate 4b is silicon (silicon substrate 501). However, glass or plastic may be used instead of silicon.

  FIG. 7 shows the chemical structure of the pentacene molecule. As shown in FIG. 7, the pentacene molecule has a structure in which five so-called benzene rings are bonded.

  The organic compound semiconductors as described above are currently considered to have low reliability with respect to changes over time, that is, they do not have a long lifetime. Since the test facilitating circuit is generally used in the test until the SIP is shipped in the SIP manufacturing process, when the test facilitating circuit is composed of an organic compound semiconductor, the life of the test facilitating circuit is: It may be longer than the period from the manufacture of SIP until the final test of shipping is completed. Since the period is several weeks at the longest, the current organic compound semiconductor can withstand use.

(Third embodiment)
FIG. 8 is a diagram schematically showing a configuration of the testability-enhanced circuit interior SIP according to the third embodiment of the present invention. 8 is an example in which the SIP is applied to a test board for testing an integrated circuit chip on which the SIP is manufactured. In the test facilitating circuit interior SIP 1c as such a test board, an analog integrated circuit chip 111, a digital ASIC chip 102 and the like for controlling or assisting the test are mounted on the test facilitating circuit interior substrate 10c. A socket 122 for mounting a DUT (Device Under Test) 121, which is an integrated circuit chip to be tested, is mounted.

  Also in the test facilitating circuit internal SIP 1c, the test facilitating circuit for facilitating the testing of the integrated circuit chip 2 such as the analog integrated circuit chip 111 and the digital ASIC chip 102 mounted on the test facilitating circuit internal substrate 10c. As in the case of the first and second embodiments, the test facilitating circuit interior substrate 10c itself is embedded.

  Further, since the test facilitating circuit interior SIP1c is used as a test board, the signal terminal of the DUT 121 attached to the socket 122 is connected to a test device (not shown) disposed outside the test facilitating circuit interior SIP1c. Is done.

  FIG. 9 is a diagram showing points of a circuit for connecting the DUT to the test apparatus in the test facilitating circuit internal substrate according to the third embodiment of the present invention. As shown in FIG. 9, an impedance matching circuit 123 is added to the signal terminal of the DUT 121, and the DUT 121 is connected to the test apparatus via the impedance matching circuit 123. When the DUT 121 and the test apparatus are connected, the impedance of the impedance matching circuit 123 is adjusted to be 50Ω, for example. Note that the impedance matching circuit 123 is usually configured by a resistor and an inductor.

  Therefore, in this embodiment, the impedance matching circuit 123 is built in the pogo pin 1220 of the socket 122. As shown in FIG. 8, the pogo pin 1220 of the socket 122 is provided so that the lead 1222 and the fixing pin 1226 are fixed to the socket 122, and the contactor 1221 that contacts the signal terminal of the DUT 121 is accommodated in the lead 1222. Provided. At this time, the lower surface of the contactor 1221 is supported by the spring 1223, and when the contactor 1221 comes into contact with the signal terminal of the DUT 121, the contactor 1221 is pressed toward the signal terminal side of the DUT 121.

  Further, the lead 1222 and the fixed pin 1226 are configured to be connected to each other via a chip resistor 1224 and an inductor 1225. These chip resistor 1224 and inductor 1225 constitute an impedance matching circuit 123 for the terminal signal of the DUT 121. At this time, as the inductor 1225, a coil may be wound around the chip resistor 1224 to form an inductor, or a chip inductor having the same shape as the chip resistor 1224 may be used. As the chip resistor 1224 and the chip inductor, those having the same size as the WLCSP integrated circuit chip 43 (see FIG. 1) are commercially available.

  As described above, in this embodiment, since the impedance matching circuit 123 for the signal terminal of the DUT 121 is built in the pogo pin 1220 of the socket 122, the size of the testability circuit built-in SIP 1c is not increased, and the signal terminal of the DUT 121 Signal reflection can be prevented.

  Note that the impedance matching circuit 123 for the signal terminal of the DUT 121 may not be built in the pogo pin 1220 of the socket 122, but may be built in the testability-enhanced circuit board 10c as in the first and second embodiments. Further, the same impedance matching circuit 123 may be provided for the signal terminals of the analog integrated circuit chip 111 and the digital ASIC chip 102 mounted on the test facilitating circuit internal substrate 10c. When the impedance matching circuit 123 is provided, the impedance matching circuit 123 is provided on the test facilitating circuit internal substrate 10c itself.

1,1b, 1c SIP circuit for easy testability
2 Integrated circuit chips 3, 4, 4 b, 5 Core substrate 6 Through hole 7 Insulating layer 10, 10 b, 10 c Test ease circuit internal substrate 20 BIST circuit 21 Bump 24 Shift register 31, 41, 51 Wiring layer 32 Buildup layer 33 Pad 42 Adhesive layer 43 WLCSP integrated circuit chip 44 Passive element 101 Memory chip 102 Digital ASIC chip 104,1021 TAP controller 105,1022 BS shift register 106 TBIC
107 ABM
111 Analog Integrated Circuit Chip 113 Signal Mixing / Separating Circuit 121 DUT
122 socket 123 impedance matching circuit 201 CUT
202 LFSR
203 MISR
204 shift register 205 exclusive OR circuit 501 silicon substrate 502 silicon oxide film 503 gate electrode 504 insulating film 505 source electrode 506 drain electrode 507 pentacene semiconductor layer 1020 ASIC core 1110 modulation / demodulation circuit 1111 D / A converter 1112 A / D converter 1220 Pogo pin 1221 Contactor 1222 Lead 1223 Spring 1224 Chip resistor 1225 Inductor 1226 Fixed pin

Claims (3)

A plurality of substrates each having an integrated circuit chip mounted on at least one of them are bonded to each other through an insulating resin layer, and a wiring layer formed on each of the substrates includes at least one of the substrates and It is a system in package configured by connecting through a through hole penetrating the resin layer,
A test facilitating circuit for facilitating a test of at least one integrated circuit chip among the integrated circuit chips and at least one of the plurality of substrates is fixed to one of the plurality of substrates. A system-in-package comprising a socket for detachably mounting an integrated circuit chip other than the mounted integrated circuit chip. A passive element that matches the impedance of the terminal of the integrated circuit chip mounted in the socket is incorporated in the pogo pin of the socket that connects the terminal of the integrated circuit chip mounted in the socket and the wiring layer of the system-in-package substrate. The system-in-package according to claim 1, wherein: A socket mounted on the system-in-package according to claim 1,
A socket characterized in that a passive element that matches the impedance of a terminal of an integrated circuit chip attached to the socket is built in the pogo pin of the socket.

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