JP2012015956A - Transmission/reception system - Google Patents

Transmission/reception system Download PDF

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JP2012015956A
JP2012015956A JP2010153089A JP2010153089A JP2012015956A JP 2012015956 A JP2012015956 A JP 2012015956A JP 2010153089 A JP2010153089 A JP 2010153089A JP 2010153089 A JP2010153089 A JP 2010153089A JP 2012015956 A JP2012015956 A JP 2012015956A
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transmission
reception system
connector
resistor
signal
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Seiichi Ozawa
誠一 小沢
Hironobu Akita
浩伸 秋田
Yoshikatsu Matsugaki
佳克 松垣
Katsuhiko Misawa
勝彦 三沢
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THine Electronics Inc
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THine Electronics Inc
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Priority to JP2010153089A priority Critical patent/JP2012015956A/en
Priority to PCT/JP2011/063729 priority patent/WO2012005095A1/en
Priority to TW100123341A priority patent/TW201244397A/en
Publication of JP2012015956A publication Critical patent/JP2012015956A/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B3/00—Line transmission systems
    • H04B3/02—Details
    • H04B3/32—Reducing cross-talk, e.g. by compensating
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0272—Arrangements for coupling to multiple lines, e.g. for differential transmission
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0038—System on Chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/028—Arrangements specific to the transmitter end
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0292—Arrangements specific to the receiver end

Abstract

PROBLEM TO BE SOLVED: To provide a transmission/reception system which conducts high quality signal transmission.SOLUTION: A transmission/reception system 2 transmits electric signals from a transmission device 20 to a reception device 50A via a wiring member 10 formed by arranging conductive wires 11 to 17 in parallel. In the reception device 50A, the conductive wire 11 is grounded via a connector 52 and a resistor 71, and the conductive wire 14 is grounded via the connector 52 and a resistor 74. Further, the conductive wire 17 is grounded via the connector 52 and a resistor 77.

Description

本発明は、送受信システムに関するものである。   The present invention relates to a transmission / reception system.

送信装置から受信装置へ電気信号を伝送する送受信システムにおいて、その信号を伝送するための配線部材により送信装置と受信装置とが電気的に互いに接続される。配線部材としては様々な形態のものが知られている。代表的な配線部材の一例として挙げられる同軸ケーブルは、中心導線の周囲に絶縁体を介してシールド線が設けられたものであり、その中心導線を介して電気信号を低ノイズで伝送することができる。   In a transmission / reception system for transmitting an electrical signal from a transmission device to a reception device, the transmission device and the reception device are electrically connected to each other by a wiring member for transmitting the signal. Various types of wiring members are known. A coaxial cable, which is an example of a typical wiring member, has a shield wire provided through an insulator around a central conductor, and an electrical signal can be transmitted through the central conductor with low noise. it can.

近年では、送受信システムの小型化や高密度化を図るために、複数本の導線が並列配置されてなる配線部材（例えばフレキシブルフラットケーブル（Ｆｌｅｘｉｂｌｅ Ｆｌａｔ Ｃａｂｌｅ：ＦＦＣ））が用いられている（特許文献１）。一般的に、ＦＦＣは、各々錫メッキされた銅によって形成された矩形断面を有する複数本の導線が並列配置されていて、これらを２枚の絶縁フィルムで挟んだ構成となっている。このようなＦＦＣは、特許文献１にも記載されているように、液晶パネルとシステムマザーボードとの間の電気信号の送受信にも用いられ、液晶表示装置の低コスト化に寄与している。   In recent years, a wiring member (for example, a flexible flat cable (FFC)) in which a plurality of conductive wires are arranged in parallel has been used in order to reduce the size and density of a transmission / reception system (Patent Literature). 1). In general, the FFC has a structure in which a plurality of conductive wires each having a rectangular cross section formed of tin-plated copper are arranged in parallel and sandwiched between two insulating films. As described in Patent Document 1, such FFC is also used for transmission / reception of electric signals between the liquid crystal panel and the system motherboard, and contributes to cost reduction of the liquid crystal display device.

このＦＦＣのような複数本の導線が並列配置されてなる配線部材により送信装置と受信装置とが電気的に互いに接続された送受信システムにおいて、複数本の導線それぞれは、電気信号を伝送する場合の他、電力を供給する場合もあり、また、接地電位とされる場合もある。   In a transmission / reception system in which a transmitter and a receiver are electrically connected to each other by a wiring member in which a plurality of conductors such as FFC are arranged in parallel, each of the plurality of conductors transmits an electrical signal. In other cases, electric power may be supplied or a ground potential may be set.

特開２００６−３２００３号公報JP 2006-3003 A

ところで、液晶表示装置に表示する映像データの大容量化に伴うデータ伝送速度の高速化（例えば数〜数十Ｇｂ／ｓ以上）を実現するには、送受信システムの更なる小型化や高密度化が要求される。また、送受信システムの更なる小型化や高密度化を実現するには、複数本の導線が並列配置されてなる配線部材の各導線の幅や配列間隔を更に狭くすることが要求される。しかしながら、前述のような配線部材の導線配列間隔を狭くすると、送信装置から送出された信号が受信装置に到達する際に信号の品質が劣化する場合があることを、本発明者は見出した。   By the way, in order to increase the data transmission speed (for example, several to several tens of Gb / s or more) accompanying the increase in the volume of video data displayed on the liquid crystal display device, the transmission / reception system is further reduced in size and density. Is required. Further, in order to realize further miniaturization and higher density of the transmission / reception system, it is required to further reduce the width and the arrangement interval of each conductor of the wiring member in which a plurality of conductors are arranged in parallel. However, the present inventor has found that when the wiring arrangement interval of the wiring members as described above is narrowed, the signal quality may deteriorate when the signal transmitted from the transmission device reaches the reception device.

本発明は、上記問題点を解消する為になされたものであり、複数本の導線が並列配置されてなる配線部材において導線配列間隔を狭くした場合であっても高品質の信号伝送を行うことができる送受信システムを提供することを目的とする。   The present invention has been made to solve the above-described problems, and performs high-quality signal transmission even when a conductor arrangement interval is narrowed in a wiring member in which a plurality of conductors are arranged in parallel. An object of the present invention is to provide a transmission / reception system capable of performing communication.

本発明に係る送受信システムは、複数本の導線が並列配置されてなる配線部材を介して送信装置から受信装置へ電気信号を伝送する送受信システムであって、複数本の導線のうち接地電位とされる導線が送信装置および受信装置の何れかの側において抵抗器を介して接地されることを特徴とする。また、本発明に係る送受信システムは、複数本の導線のうち接地電位とされる導線が少なくとも受信装置の側において抵抗器を介して接地されるのが好ましい。また、抵抗器の抵抗値は導線のインピーダンスと同じであるのが好ましい。   A transmission / reception system according to the present invention is a transmission / reception system that transmits an electrical signal from a transmission device to a reception device via a wiring member in which a plurality of conductors are arranged in parallel, and is set to a ground potential among the plurality of conductors. The conducting wire is grounded via a resistor on either side of the transmitting device and the receiving device. Moreover, in the transmission / reception system according to the present invention, it is preferable that the conductor that is set to the ground potential among the plurality of conductors is grounded via a resistor at least on the receiving device side. The resistance value of the resistor is preferably the same as the impedance of the conductor.

本発明によれば、複数本の導線が並列配置されてなる配線部材において導線配列間隔を狭くした場合であっても、高品質の信号伝送を行うことができる。   ADVANTAGE OF THE INVENTION According to this invention, even if it is a case where a conducting wire arrangement | positioning space | interval is narrowed in the wiring member by which a several conducting wire is arrange | positioned in parallel, high quality signal transmission can be performed.

比較例の送受信システム１の構成を示す図である。It is a figure which shows the structure of the transmission / reception system 1 of a comparative example. 比較例の送受信システム１におけるクロストーク発生を説明する図である。It is a figure explaining the crosstalk generation | occurrence | production in the transmission / reception system 1 of a comparative example. 第１実施形態の送受信システム２の構成を示す図である。It is a figure which shows the structure of the transmission / reception system 2 of 1st Embodiment. 第１実施形態の送受信システム２におけるクロストーク抑制を説明する図である。It is a figure explaining the crosstalk suppression in the transmission / reception system 2 of 1st Embodiment. 第２実施形態の送受信システム３の構成を示す図である。It is a figure which shows the structure of the transmission / reception system 3 of 2nd Embodiment.

以下、添付図面を参照して、本発明を実施するための形態を詳細に説明する。なお、図面の説明において同一の要素には同一の符号を付し、重複する説明を省略する。また、初めに比較例について説明し、その後に本実施形態について説明する。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. A comparative example will be described first, and then the present embodiment will be described.

図１は、比較例の送受信システム１の構成を示す図である。この図に示される送受信システム１は、配線部材１０を介して送信装置２０から受信装置５０へ電気信号を伝送する。配線部材１０は、導線１１〜１７が並列配置されてなり、例えばＦＦＣである。   FIG. 1 is a diagram illustrating a configuration of a transmission / reception system 1 of a comparative example. The transmission / reception system 1 shown in this figure transmits an electrical signal from the transmission device 20 to the reception device 50 via the wiring member 10. The wiring member 10 includes conductive wires 11 to 17 arranged in parallel, and is, for example, an FFC.

送信装置２０は、送信回路２１およびコネクタ２２を含む。送信回路２１とコネクタ２２とは、導線３２，３３，３５，３６により互いに電気的に接続されている。コネクタ２２は、導線１２と導線３２とを電気的に接続し、導線１３と導線３３とを電気的に接続し、導線１５と導線３５とを電気的に接続し、また、導線１６と導線３６とを電気的に接続する。送信回路２１、コネクタ２２および導線３２，３３，３５，３６は基板上に設けられていてもよく、この場合、導線３２，３３，３５，３６は基板上の配線である。   The transmission device 20 includes a transmission circuit 21 and a connector 22. The transmission circuit 21 and the connector 22 are electrically connected to each other by conducting wires 32, 33, 35, and 36. The connector 22 electrically connects the conducting wire 12 and the conducting wire 32, electrically connects the conducting wire 13 and the conducting wire 33, electrically connects the conducting wire 15 and the conducting wire 35, and conducts the conducting wire 16 and the conducting wire 36. And electrically connect. The transmission circuit 21, the connector 22, and the conducting wires 32, 33, 35, and 36 may be provided on a substrate. In this case, the conducting wires 32, 33, 35, and 36 are wirings on the substrate.

受信装置５０は、受信回路５１およびコネクタ５２を含む。受信回路５１とコネクタ５２とは、導線６２，６３，６５，６６により互いに電気的に接続されている。コネクタ５２は、導線１２と導線６２とを電気的に接続し、導線１３と導線６３とを電気的に接続し、導線１５と導線６５とを電気的に接続し、また、導線１６と導線６６とを電気的に接続する。受信回路５１、コネクタ５２および導線６２，６３，６５，６６は基板上に設けられていてもよく、この場合、導線６２，６３，６５，６６は基板上の配線である。   The receiving device 50 includes a receiving circuit 51 and a connector 52. The receiving circuit 51 and the connector 52 are electrically connected to each other by conducting wires 62, 63, 65 and 66. The connector 52 electrically connects the conducting wire 12 and the conducting wire 62, electrically connects the conducting wire 13 and the conducting wire 63, electrically connects the conducting wire 15 and the conducting wire 65, and conducts the conducting wire 16 and the conducting wire 66. And electrically connect. The receiving circuit 51, the connector 52, and the conducting wires 62, 63, 65, 66 may be provided on the substrate. In this case, the conducting wires 62, 63, 65, 66 are wirings on the substrate.

送信回路２１から導線３２へ送出された信号は、コネクタ２２、導線１２、コネクタ５２および導線６２を経て受信回路５１に到達する。送信回路２１から導線３３へ送出された信号は、コネクタ２２、導線１３、コネクタ５２および導線６３を経て受信回路５１に到達する。送信回路２１から導線３５へ送出された信号は、コネクタ２２、導線１５、コネクタ５２および導線６５を経て受信回路５１に到達する。また、送信回路２１から導線３６へ送出された信号は、コネクタ２２、導線１６、コネクタ５２および導線６２を経て受信回路５１に到達する。   A signal sent from the transmission circuit 21 to the lead wire 32 reaches the reception circuit 51 through the connector 22, the lead wire 12, the connector 52, and the lead wire 62. A signal transmitted from the transmission circuit 21 to the conductive wire 33 reaches the reception circuit 51 through the connector 22, the conductive wire 13, the connector 52, and the conductive wire 63. A signal transmitted from the transmission circuit 21 to the conductive wire 35 reaches the reception circuit 51 through the connector 22, the conductive wire 15, the connector 52, and the conductive wire 65. The signal sent from the transmission circuit 21 to the conductor 36 reaches the receiver circuit 51 via the connector 22, the conductor 16, the connector 52, and the conductor 62.

この比較例では、配線部材１０の並列配置された導線１１〜１７のうち、隣り合う２本の導線１２，１３により差動信号Signal0が伝送され、また、隣り合う２本の導線１５，１６により他の差動信号Signal1が伝送される。一方、その他の導線１１，１４，１７それぞれの両端は接地電位とされる。差動信号Signal0を伝送する導線１２，１３と、他の差動信号Signal1を伝送する導線１５，１６とが、接地電位に接続される導線１４を挟んでいることにより、これら２つの差動信号Signal0，Signal1の間のクロストークが抑制される。   In this comparative example, the differential signal Signal0 is transmitted by the two adjacent conductors 12 and 13 among the conductors 11 to 17 arranged in parallel in the wiring member 10, and is also transmitted by the two adjacent conductors 15 and 16. Another differential signal Signal1 is transmitted. On the other hand, both ends of the other conductors 11, 14, and 17 are set to the ground potential. Conductive wires 12 and 13 that transmit the differential signal Signal0 and conductive wires 15 and 16 that transmit the other differential signal Signal1 sandwich the conductive wire 14 connected to the ground potential, so that these two differential signals Crosstalk between Signal0 and Signal1 is suppressed.

しかし、この比較例の送受信システム１において、配線部材１０における導線配列間隔が狭くなると、或いは、信号のビットレートが高くなると、送信装置２０から送出された信号が受信装置５０に到達する際に信号の品質が劣化する場合がある。この信号品質劣化は、両端が接地電位に接続された導線１４で生じる共振現象によって一方の信号から他方の信号へのクロストークが大きくなることに因って生じる。   However, in the transmission / reception system 1 of this comparative example, when the conductor arrangement interval in the wiring member 10 is narrowed or the bit rate of the signal is increased, the signal transmitted from the transmission device 20 reaches the reception device 50. The quality of the product may deteriorate. This signal quality degradation is caused by an increase in crosstalk from one signal to the other due to a resonance phenomenon that occurs in the conducting wire 14 whose both ends are connected to the ground potential.

図２は、比較例の送受信システム１におけるクロストーク発生を説明する図である。この図には、導線１３〜１５、コネクタ２２およびコネクタ５２が示されている。また、この図には、各導線の信号の波形が模式的に表されている。差動信号Signal0の一方の信号Signal0(-)が導線１３により伝送されると、クロストークにより、同じ信号が隣の導線１４に誘起される。   FIG. 2 is a diagram for explaining the occurrence of crosstalk in the transmission / reception system 1 of the comparative example. In this figure, the conducting wires 13 to 15, the connector 22, and the connector 52 are shown. Moreover, in this figure, the waveform of the signal of each conducting wire is schematically represented. When one signal Signal0 (−) of the differential signal Signal0 is transmitted through the conductor 13, the same signal is induced in the adjacent conductor 14 by crosstalk.

両端が接地電位に接続された導線１４において信号が誘起されると、信号の周波数によっては、両端を固定端とする共振現象が起きて、導線１４に誘起された信号は、導線１３により伝送される信号Signal0(-)と同程度の振幅を有する場合がある。そして、導電１４において誘起された信号の振幅が共振により大きくなると、クロストークにより、同じ信号が隣の導線１５に誘起される。その結果、送信装置２０から送出された信号が受信装置５０に到達する際に信号の品質が劣化する場合がある。   When a signal is induced in the lead wire 14 whose both ends are connected to the ground potential, a resonance phenomenon occurs in which both ends are fixed ends depending on the frequency of the signal, and the signal induced in the lead wire 14 is transmitted by the lead wire 13. May have the same amplitude as the signal Signal0 (−). When the amplitude of the signal induced in the conductive layer 14 increases due to resonance, the same signal is induced in the adjacent conductor 15 due to crosstalk. As a result, when the signal transmitted from the transmission device 20 reaches the reception device 50, the signal quality may deteriorate.

図３は、第１実施形態の送受信システム２の構成を示す図である。図１に示された比較例の送受信システム１の構成と比較すると、この図３に示される第１実施形態の送受信システム２は、受信装置５０に替えて受信装置５０Ａを備える点で相違し、接地電位とされる導線１１，１４，１７が受信装置５０Ａの側において抵抗器を介して接地されている点で相違している。   FIG. 3 is a diagram illustrating a configuration of the transmission / reception system 2 of the first embodiment. Compared with the configuration of the transmission / reception system 1 of the comparative example shown in FIG. 1, the transmission / reception system 2 of the first embodiment shown in FIG. 3 is different in that it includes a reception device 50 </ b> A instead of the reception device 50. The difference is that the conducting wires 11, 14, and 17 to be grounded are grounded via a resistor on the receiving device 50A side.

すなわち、第１実施形態の送受信システム２では、受信装置５０Ａにおいて、導線１１はコネクタ５２および抵抗器７１を介して接地され、導線１４はコネクタ５２および抵抗器７４を介して接地され、また、導線１７はコネクタ５２および抵抗器７７を介して接地されている。また、抵抗器７１，７４，７７の抵抗値は、導線１１，１４，１７のインピーダンスと同程度でインピーダンス整合されているのが好ましい。   That is, in the transmission / reception system 2 of the first embodiment, in the receiving device 50A, the conducting wire 11 is grounded via the connector 52 and the resistor 71, the conducting wire 14 is grounded via the connector 52 and the resistor 74, and the conducting wire 17 is grounded via a connector 52 and a resistor 77. The resistance values of the resistors 71, 74, and 77 are preferably impedance-matched to the same extent as the impedances of the conductors 11, 14, and 17.

この第１実施形態では、接地電位とされる導線１１，１４，１７が受信装置５０Ａの側において抵抗器７１，７４，７７を介して接地されていることにより、これらの導線における共振が抑制され、信号間のクロストークが抑制されて、高品質の信号伝送が可能となる。   In the first embodiment, since the conducting wires 11, 14, and 17 that are set to the ground potential are grounded via the resistors 71, 74, and 77 on the receiving device 50A side, resonance in these conducting wires is suppressed. , Crosstalk between signals is suppressed, and high-quality signal transmission becomes possible.

図４は、第１実施形態の送受信システム２におけるクロストーク抑制を説明する図である。この図には、導線１３〜１５、抵抗器７４、コネクタ２２およびコネクタ５２が示されている。また、この図にも、各導線の信号の波形が模式的に表されている。差動信号Signal0の一方の信号Signal0(-)が導線１３により伝送されると、クロストークにより、同じ信号が隣の導線１４に誘起される。   FIG. 4 is a diagram illustrating crosstalk suppression in the transmission / reception system 2 of the first embodiment. In this figure, the conductive wires 13 to 15, the resistor 74, the connector 22, and the connector 52 are shown. Also in this figure, the waveform of the signal of each conductor is schematically represented. When one signal Signal0 (−) of the differential signal Signal0 is transmitted through the conductor 13, the same signal is induced in the adjacent conductor 14 by crosstalk.

第１実施形態では、受信装置５０Ａにおいて導線１４が抵抗器７４を介して接地されているので、導線１４において信号が誘起されても、抵抗器７４接続側において反射が起こらず、導線１４に誘起された信号の振幅が大きくなることはない。導電１４に誘起された信号がクロストークにより隣の導線１５に誘起されても、導線１５に誘起される信号の振幅は小さい。その結果、信号間のクロストークが抑制されて、高品質の信号伝送が可能となる。   In the first embodiment, since the conducting wire 14 is grounded via the resistor 74 in the receiving device 50A, even if a signal is induced in the conducting wire 14, no reflection occurs on the connecting side of the resistor 74, and the conducting wire 14 is induced. The amplitude of the generated signal does not increase. Even if the signal induced in the conductive 14 is induced in the adjacent conductor 15 by crosstalk, the amplitude of the signal induced in the conductor 15 is small. As a result, crosstalk between signals is suppressed, and high-quality signal transmission is possible.

図５は、第２実施形態の送受信システム３の構成を示す図である。図３に示された第１実施形態の送受信システム２の構成と比較すると、この図５に示される第２実施形態の送受信システム３は、送信装置２０に替えて送信装置２０Ａを備える点で相違し、接地電位とされる導線１１，１４，１７が受信装置５０Ａの側だけでなく送信装置２０Ａの側においても抵抗器を介して接地されている点で相違している。   FIG. 5 is a diagram illustrating a configuration of the transmission / reception system 3 of the second embodiment. Compared with the configuration of the transmission / reception system 2 of the first embodiment shown in FIG. 3, the transmission / reception system 3 of the second embodiment shown in FIG. 5 differs in that a transmission device 20 </ b> A is provided instead of the transmission device 20. However, it is different in that the conductive wires 11, 14, and 17 to be grounded are grounded not only on the receiving device 50A side but also on the transmitting device 20A side via a resistor.

すなわち、第２実施形態の送受信システム３では、導線１１は、受信装置５０Ａにおいてコネクタ５２および抵抗器７１を介して接地されているだけでなく、送信装置２０Ａにおいてコネクタ２２および抵抗器４１を介して接地されている。導線１４は、受信装置５０Ａにおいてコネクタ５２および抵抗器７４を介して接地されているだけでなく、送信装置２０Ａにおいてコネクタ２２および抵抗器４４を介して接地されている。また、導線１７は、受信装置５０Ａにおいてコネクタ５２および抵抗器７７を介して接地されているだけでなく、送信装置２０Ａにおいてコネクタ２２および抵抗器４７を介して接地されている。抵抗器４１，４４，４７，７１，７４，７７の抵抗値は、導線１１，１４，１７のインピーダンスと同程度であるのが好ましい。   That is, in the transmission / reception system 3 of the second embodiment, the conductor 11 is not only grounded via the connector 52 and the resistor 71 in the reception device 50A, but also via the connector 22 and the resistor 41 in the transmission device 20A. Grounded. The conducting wire 14 is grounded not only through the connector 52 and the resistor 74 in the receiving device 50A but also through the connector 22 and the resistor 44 in the transmitting device 20A. The conducting wire 17 is not only grounded via the connector 52 and the resistor 77 in the receiving device 50A, but also grounded via the connector 22 and the resistor 47 in the transmitting device 20A. The resistance values of the resistors 41, 44, 47, 71, 74, 77 are preferably approximately the same as the impedance of the conductors 11, 14, 17.

この第２実施形態では、接地電位とされる導線１１，１４，１７が受信装置５０Ａの側において抵抗器７１，７４，７７を介して接地されて、さらに、これらの導線が送信装置２０Ａの側においても抵抗器４１，４４，４７を介して接地されていることにより、これらの導線における共振が抑制され、信号間のクロストークが抑制されて、更に高品質の信号伝送が可能となる。   In the second embodiment, the conducting wires 11, 14, and 17 that are set to the ground potential are grounded via the resistors 71, 74, and 77 on the receiving device 50A side, and further, these conducting wires are connected to the transmitting device 20A side. In FIG. 5, the grounding via the resistors 41, 44 and 47 suppresses resonance in these conductors, suppresses crosstalk between signals, and enables higher-quality signal transmission.

なお、上記の第１実施形態および第２実施形態とは別に、接地電位とされる導線１１，１４，１７が送信装置２０Ａの側においてのみ抵抗器を介して接地されている場合にも、これらの導線における共振が抑制される。ただし、接地電位とされる導線１１，１４，１７が少なくとも受信装置５０Ａの側において抵抗器を介して接地されているのが好ましく、これにより、これらの導線における共振が効果的に抑制される。   In addition to the first and second embodiments described above, even when the conductors 11, 14, and 17 that are set to the ground potential are grounded via a resistor only on the transmitting device 20A side, these are also possible. Resonance in the lead wire is suppressed. However, it is preferable that the conductors 11, 14, and 17 to be grounded are grounded through resistors at least on the receiving device 50A side, and thereby resonance in these conductors is effectively suppressed.

１〜３…送受信システム、１０…配線部材、１１〜１７…導線、２０，２０Ａ…送信装置、２１…送信回路、２２…コネクタ、３２，３３，３５，３６…導線、４１，４４，４７…抵抗器、５０，５０Ａ…受信装置、５１…受信回路、５２…コネクタ、６２，６３，６５，６６…導線、７１，７４，７７…抵抗器。
DESCRIPTION OF SYMBOLS 1-3 ... Transmission / reception system, 10 ... Wiring member, 11-17 ... Conductor, 20, 20A ... Transmitter, 21 ... Transmission circuit, 22 ... Connector, 32, 33, 35, 36 ... Conductor, 41, 44, 47 ... Resistor, 50, 50A ... receiving device, 51 ... receiving circuit, 52 ... connector, 62, 63, 65, 66 ... conducting wire, 71, 74, 77 ... resistor.

Claims (3)

複数本の導線が並列配置されてなる配線部材を介して送信装置から受信装置へ電気信号を伝送する送受信システムであって、
前記複数本の導線のうち接地電位とされる導線が前記送信装置および前記受信装置の何れかの側において抵抗器を介して接地される、
ことを特徴とする送受信システム。 A transmission / reception system for transmitting an electrical signal from a transmission device to a reception device via a wiring member in which a plurality of conductive wires are arranged in parallel,
Of the plurality of conducting wires, a conducting wire that is grounded is grounded via a resistor on either side of the transmitting device and the receiving device.
A transmission / reception system characterized by that. 前記複数本の導線のうち接地電位とされる導線が少なくとも前記受信装置の側において抵抗器を介して接地されることを特徴とする請求項１に記載の送受信システム。   2. The transmission / reception system according to claim 1, wherein a conductive wire having a ground potential among the plurality of conductive wires is grounded through a resistor at least on the receiving device side. 前記抵抗器の抵抗値は前記導線のインピーダンスと同じであることを特徴とする請求項１又は２に記載の送受信システム。
The transmission / reception system according to claim 1 or 2, wherein a resistance value of the resistor is the same as an impedance of the conducting wire.
JP2010153089A 2010-07-05 2010-07-05 Transmission/reception system Pending JP2012015956A (en)

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PCT/JP2011/063729 WO2012005095A1 (en) 2010-07-05 2011-06-15 Transmitting and receiving system
TW100123341A TW201244397A (en) 2010-07-05 2011-07-01 Transmission/reception system

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JPH0420019A (en) * 1990-05-14 1992-01-23 Meidensha Corp Crosstalk cancel system resulting from pattern wiring
JPH07249906A (en) * 1994-03-08 1995-09-26 Fujitsu Ltd High frequency device

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