JP2012014025A - Optical transmitter receiver module - Google Patents

Optical transmitter receiver module Download PDF

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JP2012014025A
JP2012014025A JP2010151575A JP2010151575A JP2012014025A JP 2012014025 A JP2012014025 A JP 2012014025A JP 2010151575 A JP2010151575 A JP 2010151575A JP 2010151575 A JP2010151575 A JP 2010151575A JP 2012014025 A JP2012014025 A JP 2012014025A
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transmission
optical fiber
receiving
light
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JP5234059B2 (en
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Kiyoshi Kato
清 加藤
Mitsuaki Tamura
充章 田村
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Sumitomo Electric Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an optical transmitter receiver module which is compact and has an excellent transmission efficiency.SOLUTION: The above object is achieved by an optical transmitter receiver module 1 including: a transmitting side substrate 2a having an element mounting surface 21a on which is provided with a light emitting element 4a, a transmitting side optical fiber positioning component 3a for containing a transmitting optical fiber 6a for transmitting light from the light emitting element 4a, and a transmitting semiconductor element 5a for electrically controlling the light emission of the light emitting element 4a; and a receiving side substrate 2b having an element mounting surface 21b on which is provided with a light receiving element 4b, a receiving side optical fiber positioning component 3b for containing a receiving optical fiber 6b for transmitting light to the light receiving element 4b, and a receiving semiconductor element 5b for amplifying an electrical signal from the light receiving element 4b. The element mounting surface 21a of the transmitting side substrate 2a and the element mounting surface 21b of the receiving side substrate 2b are disposed facing with each other.

Description

本発明は、複数の伝送路に同時に光信号を送受信する、光並列伝送における光送受信モジュールに関する。   The present invention relates to an optical transmission / reception module in optical parallel transmission that transmits and receives optical signals simultaneously to a plurality of transmission paths.

電子機器間の信号の高速伝送を可能とするために、電子機器に光送受信モジュールを設け、光ファイバを介して電子機器間の信号を伝達することが行われている。このような用途に用いる光送受信モジュールは、一般的に、発光素子としてのVCSEL(Vertical Cavity Surface Emitting Laser)とVCSELを駆動するドライバICと、受光素子としてのフォトダイオードとフォトダイオードからの電気信号を増幅するトランスインピーダンスアンプとを備えている。   In order to enable high-speed transmission of signals between electronic devices, an optical transmission / reception module is provided in the electronic devices, and signals between the electronic devices are transmitted via optical fibers. In general, an optical transceiver module used for such an application receives a VCSEL (Vertical Cavity Surface Emitting Laser) as a light emitting element, a driver IC for driving the VCSEL, a photodiode as a light receiving element, and an electric signal from the photodiode. And a transimpedance amplifier for amplification.

このような光送受信モジュールとして特許文献1は、複数の発光素子からなるLDアレイと、複数の受光素子からなるPDアレイが独立して単一のプリント基板に固定された光送受信モジュールを開示している。   As such an optical transceiver module, Patent Document 1 discloses an optical transceiver module in which an LD array composed of a plurality of light emitting elements and a PD array composed of a plurality of light receiving elements are independently fixed to a single printed circuit board. Yes.

特開平7−209557号公報JP-A-7-209557

ところで、光送受信モジュールにおいて、ドライバICからVCSELを駆動するために比較的高電流(約10mA)の信号が出力され、フォトダイオードからトランスインピーダンスアンプへは比較的低電流(約10μA)の信号が出力されている。このため、特許文献1に記載の光送受信モジュールのように共通のプリント基板上にLDアレイ(VCSEL)とPDアレイ(フォトダイオード)を配置すると、各部材間の距離が近いために互いに干渉して電気的なクロストークが生じ、特にPDアレイ(フォトダイオード)からトランスインピーダンスアンプへの信号に大きなノイズが混入してしまう虞があった。更に、光送受信モジュールを小型化すれば配線間の距離が短くなるため、一層ノイズが増大しやすいという問題があった。   By the way, in the optical transceiver module, a relatively high current (about 10 mA) signal is output from the driver IC to drive the VCSEL, and a relatively low current (about 10 μA) signal is output from the photodiode to the transimpedance amplifier. Has been. For this reason, when an LD array (VCSEL) and a PD array (photodiode) are arranged on a common printed circuit board as in the optical transmission / reception module described in Patent Document 1, they interfere with each other because the distance between the members is short. There is a possibility that electrical crosstalk occurs, and a large noise may be mixed in a signal from the PD array (photodiode) to the transimpedance amplifier. Further, if the optical transceiver module is miniaturized, the distance between the wirings is shortened, so that there is a problem that noise is more likely to increase.

そこで本発明者らはノイズを低減するために、図3に示すようにVCSEL104aとドライバIC105aを送信用基板102aの上に設け、フォトダイオード104bとトランスインピーダンスアンプ105bを受信用基板102bの上に設け、これら送信用基板102aと受信用基板102bとを積層することを検討した。このように構成すれば、上述の如く光送信部と光受信部とを同一のプリント基板上に配置した場合と比べて光送受信モジュール101の幅方向寸法(光ファイバの長手方向に直交する方向の寸法)を小さくすることができる。しかしながら、このように構成した場合は光ファイバケーブル106の長手方向寸法に光送受信モジュール101が大きくなってしまうという不具合があった。   In order to reduce noise, the present inventors provide the VCSEL 104a and the driver IC 105a on the transmission substrate 102a as shown in FIG. 3, and the photodiode 104b and the transimpedance amplifier 105b on the reception substrate 102b. Then, it was considered to laminate the transmission substrate 102a and the reception substrate 102b. With this configuration, as compared with the case where the optical transmitter and the optical receiver are arranged on the same printed board as described above, the width dimension of the optical transceiver module 101 (in the direction orthogonal to the longitudinal direction of the optical fiber). (Dimension) can be reduced. However, in the case of such a configuration, there is a problem that the optical transmission / reception module 101 becomes large in the longitudinal dimension of the optical fiber cable 106.

つまり、複数の光ファイバ106a,106bは一つの光ファイバケーブル106として束ねられて光送受信モジュール101の外部に延出するので、送信用基板102aと受信用基板102bとが積層されて光ファイバ106a,106b間の間隔が大きくなると、束ねるために光ファイバ106a,106b相互の間隔を詰めるべく光ファイバ106a,106bを曲げる必要がある。   That is, since the plurality of optical fibers 106a and 106b are bundled as one optical fiber cable 106 and extend to the outside of the optical transceiver module 101, the transmission substrate 102a and the reception substrate 102b are laminated to form the optical fibers 106a, 106b. When the distance between the optical fibers 106b increases, the optical fibers 106a and 106b need to be bent so as to close the distance between the optical fibers 106a and 106b in order to bundle them.

しかしながら、光ファイバ106aが曲率半径の小さい急峻な曲げ部106a1を有する場合は、該曲げ部106a1で光信号の伝送損失が大きくなって伝送効率が低下する。そこで、光ファイバ106aを曲げる場合はその曲率半径が大きくなるようにゆるやかに曲げる必要があり、曲げ部106a1を長く設計する必要がある。したがって、光ファイバ106の曲げ部106a1が長くなる分だけ、光ファイバケーブル106の長手方向に光送受信モジュール101が大きくなってしまう。   However, when the optical fiber 106a has a steep bent portion 106a1 having a small radius of curvature, the transmission loss of the optical signal is increased at the bent portion 106a1 and the transmission efficiency is lowered. Therefore, when bending the optical fiber 106a, it is necessary to bend it gently so that the radius of curvature becomes large, and it is necessary to design the bent portion 106a1 to be long. Therefore, the optical transmission / reception module 101 becomes larger in the longitudinal direction of the optical fiber cable 106 as the bending portion 106a1 of the optical fiber 106 becomes longer.

そこで、本発明はコンパクトでかつ伝送効率の良好な光送受信モジュールを提供することを目的とする。   Accordingly, an object of the present invention is to provide an optical transceiver module that is compact and has good transmission efficiency.

本発明によれば、以下の光送受信モジュールが提供される。
(1) 発光素子と、前記発光素子からの光を送信する送信用光ファイバを収容する送信側光ファイバ位置決め部品と、前記発光素子の発光を電気的に制御する送信用半導体素子とが素子搭載面に設けられた送信側基板と、
受光素子と、前記受光素子へ光を伝達する受信用光ファイバを収容する受信側光ファイバ位置決め部品と、前記受光素子からの電気信号を増幅する受信用半導体素子とが素子搭載面に設けられた受信側基板と、を備えた光送受信モジュールであって、
前記送信側基板の素子搭載面と、前記受信側基板の素子搭載面とが向かい合うように配置されていることを特徴とする。
According to the present invention, the following optical transceiver module is provided.
(1) A light-emitting element, a transmission-side optical fiber positioning component that houses a transmission optical fiber that transmits light from the light-emitting element, and a transmission semiconductor element that electrically controls light emission of the light-emitting element A transmission side substrate provided on the surface;
A light receiving element, a receiving-side optical fiber positioning component that houses a receiving optical fiber that transmits light to the light receiving element, and a receiving semiconductor element that amplifies an electric signal from the light receiving element are provided on the element mounting surface. An optical transceiver module comprising a receiving side substrate,
The element mounting surface of the transmission side substrate and the element mounting surface of the reception side substrate are arranged to face each other.

本発明に係る光送受信モジュールによれば、送信側基板の素子搭載面と受信側基板の素子搭載面とが向かい合うように配置されているので、単一の基板上に発光素子や受光素子が配置された場合と比べて光送受信モジュールの寸法を小さくしてコンパクトな光送受信モジュールを提供することができる。
また、送信側基板の素子搭載面と受信側基板の素子搭載面とが向かい合うように設けられているので、送信側基板と受信側基板との間に送信側光ファイバ位置決め部品と受信側光ファイバ位置決め部品とが配置され、送信側光ファイバと受信側光ファイバとの間隔が小さくなる。したがって、これらの光ファイバの曲げ部を大きく設定することなくひとつの光ファイバケーブルとしてまとめることができるので、光ファイバの曲げ部によって伝送損失が発生することを抑えることができる。よってコンパクトで光伝送効率に優れた光送受信モジュールを提供することができる。
According to the optical transceiver module of the present invention, the light emitting element and the light receiving element are arranged on a single substrate because the element mounting surface of the transmission side substrate and the element mounting surface of the reception side substrate face each other. The size of the optical transceiver module can be reduced compared to the case where the optical transceiver module is made, and a compact optical transceiver module can be provided.
In addition, since the element mounting surface of the transmission side substrate and the element mounting surface of the reception side substrate are provided to face each other, the transmission side optical fiber positioning component and the reception side optical fiber are disposed between the transmission side substrate and the reception side substrate. Positioning components are arranged, and the distance between the transmission side optical fiber and the reception side optical fiber is reduced. Therefore, since these optical fiber bends can be combined into a single optical fiber cable without setting them large, it is possible to suppress transmission loss from occurring due to the bends of the optical fiber. Therefore, it is possible to provide an optical transceiver module that is compact and excellent in optical transmission efficiency.

本発明の実施形態に係る光送受信モジュールを用いた電子機器間の構成例を示す模式図である。It is a schematic diagram which shows the structural example between the electronic devices using the optical transmission / reception module which concerns on embodiment of this invention. 本発明の実施形態に係る光送受信モジュールの縦断面図である。It is a longitudinal cross-sectional view of the optical transmission / reception module which concerns on embodiment of this invention. 本発明の比較例に係る光送受信モジュールの縦断面図である。It is a longitudinal cross-sectional view of the optical transmission / reception module which concerns on the comparative example of this invention.

以下、本発明の実施形態に係る光送受信モジュールを、図面を参照しつつ説明する。   Hereinafter, an optical transceiver module according to an embodiment of the present invention will be described with reference to the drawings.

本実施形態に係る光送受信モジュール1は、図1に示すように、光ファイバケーブル6を計算機等の第1電子機器20及び第2電子機器30に接続するための装置である。例えば、第1電子機器20の電気信号は、第1電子機器20に取り付けられた光送受信モジュール1で光信号に変換されて光ファイバケーブル6中に伝送され、光ファイバケーブル6中を伝送された光信号は第2電子機器30に取り付けられた光送受信モジュール1で電気信号に変換されて、第2電子機器30に取り込まれる。同様に、第2電子機器30の電気信号も、第2電子機器30に取り付けられた光送受信モジュール1、光ファイバケーブル6、第1電子機器20に取り付けられた光送受信モジュール1を介して第1電子機器20に伝送される。   As shown in FIG. 1, the optical transceiver module 1 according to the present embodiment is a device for connecting the optical fiber cable 6 to a first electronic device 20 and a second electronic device 30 such as a computer. For example, the electrical signal of the first electronic device 20 is converted into an optical signal by the optical transmission / reception module 1 attached to the first electronic device 20, transmitted into the optical fiber cable 6, and transmitted through the optical fiber cable 6. The optical signal is converted into an electric signal by the optical transmission / reception module 1 attached to the second electronic device 30, and is taken into the second electronic device 30. Similarly, the electrical signal of the second electronic device 30 is also transmitted through the optical transmission / reception module 1 attached to the second electronic device 30, the optical fiber cable 6, and the optical transmission / reception module 1 attached to the first electronic device 20. It is transmitted to the electronic device 20.

このように、本実施形態に係る光送受信モジュール1は電気信号を光信号として送信する機能と、光信号を電気信号として受信する機能を併せ持っている。この光送受信モジュール1の詳細を図2を用いて説明する。   Thus, the optical transceiver module 1 according to the present embodiment has both a function of transmitting an electrical signal as an optical signal and a function of receiving an optical signal as an electrical signal. Details of the optical transceiver module 1 will be described with reference to FIG.

図2は本発明の実施形態に係る光送受信モジュール1の縦断面図である。光送受信モジュール1は、送信側基板2aと、送信側基板2aと対向するように配置された受信側基板2bと、これらの送信側基板2a及び受信側基板2bを覆う金属製のハウジング10とを有する。なお、以下の説明では、送信側の部材には符号の末尾にaを、受信側の部材には符号の末尾にbを付している。   FIG. 2 is a longitudinal sectional view of the optical transceiver module 1 according to the embodiment of the present invention. The optical transceiver module 1 includes a transmission side substrate 2a, a reception side substrate 2b disposed so as to face the transmission side substrate 2a, and a metal housing 10 that covers the transmission side substrate 2a and the reception side substrate 2b. Have. In the following description, a member at the transmission side is given a suffix, and a member at the receiving side is given a suffix b.

送信側基板2aの上には、送信側光ファイバ6aを精度良く発光素子4aに対して位置決めする送信側フェルール(送信側光ファイバ位置決め部品)3aが接着剤等の固定手段により固定されている。この送信側フェルール3aの一端側にはVCSEL等の発光素子4aが、発光面を送信側フェルール3aの端面に対向するように取り付けられている。   On the transmission side substrate 2a, a transmission side ferrule (transmission side optical fiber positioning component) 3a for accurately positioning the transmission side optical fiber 6a with respect to the light emitting element 4a is fixed by a fixing means such as an adhesive. A light emitting element 4a such as a VCSEL is attached to one end of the transmitting ferrule 3a so that the light emitting surface faces the end surface of the transmitting ferrule 3a.

なお、ここでいう送信側光ファイバ6aとは便宜上の名称である。例えば、図1の第1電子機器20から第2電子機器30へ光信号を伝送する際は、光信号を送信する第1電子機器20に取り付けられた光送受信モジュール1の送信側光ファイバ6aは、光信号を受信する第2電子機器30に取り付けられた光送受信モジュール1にとっては受信側光ファイバ6bになる。なお、送信側光ファイバ6a、受信側光ファイバ6bとして機能する複数の光ファイバ6a,6bは単一の光ファイバケーブル6としてまとめられている。   In addition, the transmission side optical fiber 6a here is a name for convenience. For example, when transmitting an optical signal from the first electronic device 20 of FIG. 1 to the second electronic device 30, the transmission-side optical fiber 6a of the optical transceiver module 1 attached to the first electronic device 20 that transmits the optical signal is For the optical transmission / reception module 1 attached to the second electronic device 30 that receives an optical signal, the optical fiber 6b is a reception side optical fiber. A plurality of optical fibers 6 a and 6 b that function as the transmission side optical fiber 6 a and the reception side optical fiber 6 b are combined as a single optical fiber cable 6.

送信側フェルール3aの内部には送信側光ファイバ6aが発光素子4aの発光面に対向するように挿入される挿通孔が貫通するように設けられており、送信側光ファイバ6aを挿通孔に挿通すれば発光素子4aに対して精度良く位置決めすることができる。送信側光ファイバ6aはこの挿通孔に挿通されて一端が発光素子4aの発光面に対向され、中間部(図2の右側端部)は光ファイバケーブル6としてまとめられハウジング10の外部に延出されている。このように、送信側フェルール3aを用いて発光素子4aと送信側光ファイバ6aとを位置決め精度良く配置すると、発光素子4aからの光を効率よく送信側光ファイバ6aへ入力することができる。   An insertion hole through which the transmission side optical fiber 6a is inserted so as to face the light emitting surface of the light emitting element 4a passes through the transmission side ferrule 3a, and the transmission side optical fiber 6a is inserted into the insertion hole. Then, it can position with sufficient precision with respect to the light emitting element 4a. The transmission side optical fiber 6a is inserted into the insertion hole, and one end thereof is opposed to the light emitting surface of the light emitting element 4a, and the intermediate portion (right end portion in FIG. 2) is gathered as the optical fiber cable 6 and extends to the outside of the housing 10. Has been. Thus, if the light emitting element 4a and the transmission side optical fiber 6a are arranged with high positioning accuracy using the transmission side ferrule 3a, the light from the light emitting element 4a can be efficiently input to the transmission side optical fiber 6a.

発光素子4aは送信側フェルール3aの一端面に取り付けられたリードフレーム31aにはんだ付け等によって電気的に接続した状態で固定され、リードフレーム31aは送信側基板2a上に設けられた素子間配線7aを介して送信側基板2aに設けられたドライバIC等の送信側半導体素子5aと電気的に接続されている。   The light emitting element 4a is fixed in a state where it is electrically connected to a lead frame 31a attached to one end face of the transmission side ferrule 3a by soldering or the like, and the lead frame 31a is an inter-element wiring 7a provided on the transmission side substrate 2a. And is electrically connected to a transmission-side semiconductor element 5a such as a driver IC provided on the transmission-side substrate 2a.

送信側光ファイバ6aの長手方向に関して送信側基板2aの送信側フェルール3aの反対側には、送信側半導体素子5aを第1又は第2電子機器20,30と電気的に接続する送信側外部用配線8aが素子搭載面21aに設けられており、第1又は第2電子機器20,30と送信側半導体素子5aとを電気的に接続している。   On the opposite side of the transmission-side substrate 2a to the transmission-side ferrule 3a with respect to the longitudinal direction of the transmission-side optical fiber 6a, the transmission-side semiconductor element 5a is electrically connected to the first or second electronic device 20, 30 for external use on the transmission side. The wiring 8a is provided on the element mounting surface 21a, and electrically connects the first or second electronic device 20, 30 and the transmission-side semiconductor element 5a.

以上の送信側フェルール3a、送信側半導体素子5aはいずれも送信側基板2aの素子搭載面21aに設けられ、送信側基板2aは、その素子搭載面21aが後述する受信側基板2bの素子搭載面21bと向かい合うように配置されている。   The transmission side ferrule 3a and the transmission side semiconductor element 5a are both provided on the element mounting surface 21a of the transmission side substrate 2a. The transmission side substrate 2a is an element mounting surface of the reception side substrate 2b, which will be described later. It is arranged to face 21b.

受信側基板2bの上には、受信側フェルール(受信側光ファイバ位置決め部品)3bが接着剤等の固定手段により固定されている。この受信側フェルール3bの一端側には受光素子としてのフォトダイオード等の受光素子4bが、その受光面が受信側フェルール3bの端面に対向するように取り付けられている。   On the reception side substrate 2b, a reception side ferrule (reception side optical fiber positioning component) 3b is fixed by a fixing means such as an adhesive. A light receiving element 4b such as a photodiode as a light receiving element is attached to one end side of the receiving ferrule 3b so that the light receiving surface thereof faces the end face of the receiving ferrule 3b.

また、受信側フェルール3bの内部には、受信側光ファイバ6bが受光素子4bの受光面に対向するように挿入される挿通孔が貫通するように設けられており、受信側光ファイバ6bはこの挿通孔に挿通されて一端が受光素子4bの発光面に対向され、中間部(図2の右側端部)は光ファイバケーブル6としてまとめられてハウジング10の外部に延出されている。   In addition, an insertion hole through which the reception side optical fiber 6b is inserted so as to face the light receiving surface of the light receiving element 4b passes through the reception side ferrule 3b. One end of the light-receiving element 4 b is opposed to the light-emitting surface of the light-receiving element 4 b, and an intermediate portion (right end portion in FIG. 2) is gathered as an optical fiber cable 6 and extends to the outside of the housing 10.

受光素子4bは受信側フェルール3bに取り付けられたリードフレーム31bにはんだ付けされ、リードフレーム31bは受信側基板2b上に設けられた受信側素子間配線7bを介して同じく受信側基板2bに設けられたトランスインピーダンスアンプ等の受信側半導体素子5bと電気的に接続されている。   The light receiving element 4b is soldered to a lead frame 31b attached to the receiving side ferrule 3b, and the lead frame 31b is also provided on the receiving side substrate 2b via a receiving side inter-element wiring 7b provided on the receiving side substrate 2b. The receiving side semiconductor element 5b such as a transimpedance amplifier is electrically connected.

受信側光ファイバ6bの長手方向に関して受信側基板2bの受信側フェルール3bの反対側には、受光側半導体素子5bを第1又は第2電子機器20,30と電気的に接続する受信側外部用配線8bが素子搭載面21bに設けられており、第1又は第2電子機器20,30と受信側半導体素子5bとが電気的に接続されている。   The receiving side semiconductor element 5b is electrically connected to the first or second electronic device 20, 30 on the opposite side of the receiving side ferrule 3b of the receiving side substrate 2b with respect to the longitudinal direction of the receiving side optical fiber 6b. The wiring 8b is provided on the element mounting surface 21b, and the first or second electronic device 20, 30 and the receiving-side semiconductor element 5b are electrically connected.

以上の受信側フェルール3b及び受光側半導体素子5bはいずれも受信側基板2bの素子搭載面21bに設けられ、受信側基板2bはその素子搭載面21bが送信側基板2aの素子搭載面21aと向かい合うように配置されている。   Both the receiving ferrule 3b and the light receiving semiconductor element 5b are provided on the element mounting surface 21b of the receiving substrate 2b, and the receiving substrate 2b faces the element mounting surface 21a of the transmitting substrate 2a. Are arranged as follows.

以上のように構成される光送受信モジュール1の動作について、図1の第1電子機器20から第2電子機器30へ信号が伝達される場合を例に挙げて説明する。   The operation of the optical transceiver module 1 configured as described above will be described by taking as an example a case where a signal is transmitted from the first electronic device 20 to the second electronic device 30 in FIG.

まず、第1電子機器20の電気信号は、第1電子機器20に取り付けられた光送受信モジュール1の送信側外部用配線8aを介して送信側半導体素子5aに入力される。送信側半導体素子5aは入力された電気信号に応じた電流信号を送信側素子間配線7a,リードフレーム31aを介して発光素子4aに出力する。発光素子4aは入力された電流信号に応じて光信号を発し、光信号は送信用光ファイバ6a(光ファイバケーブル6)中を伝送される。   First, the electrical signal of the first electronic device 20 is input to the transmission-side semiconductor element 5 a via the transmission-side external wiring 8 a of the optical transmission / reception module 1 attached to the first electronic device 20. The transmission-side semiconductor element 5a outputs a current signal corresponding to the input electric signal to the light-emitting element 4a via the transmission-side inter-element wiring 7a and the lead frame 31a. The light emitting element 4a emits an optical signal according to the input current signal, and the optical signal is transmitted through the transmission optical fiber 6a (optical fiber cable 6).

光ファイバ6中を伝送された光信号は、第2電子機器30に取り付けられた光送受信モジュール1の受信用光ファイバ6bから受光素子4bに入射する。受光素子4bは受光した光信号に応じて電流信号を出力し、この電流信号はリードフレーム31b、受信側素子間配線7bを通じて受光側半導体素子5bに入力される。受光側半導体素子5bは入力された電流信号を電圧信号に変換し、増幅して受信側外部用配線8bを介して第2外部機器30へ出力し、第1電子機器20から第2電子機器30へ信号が伝達される。   The optical signal transmitted through the optical fiber 6 enters the light receiving element 4b from the receiving optical fiber 6b of the optical transceiver module 1 attached to the second electronic device 30. The light receiving element 4b outputs a current signal according to the received optical signal, and this current signal is input to the light receiving side semiconductor element 5b through the lead frame 31b and the receiving side inter-element wiring 7b. The light-receiving-side semiconductor element 5b converts the input current signal into a voltage signal, amplifies it, and outputs it to the second external device 30 via the receiving-side external wiring 8b, from the first electronic device 20 to the second electronic device 30. A signal is transmitted to.

以上のように構成される送信側基板2aと受信側基板2bは、その素子搭載面21a,21bが向かい合うように、ハウジング10の内部に設けられている。したがって、送信用フェルール3a及び受信用フェルール3bは互いに対向するように設けられ、またこれら送信用フェルール3a及び受信用フェルール3bから延びる送信用光ファイバ6a及び受信用光ファイバ6bも対向した状態でハウジング10の外部に延出する。   The transmission side substrate 2a and the reception side substrate 2b configured as described above are provided inside the housing 10 so that the element mounting surfaces 21a and 21b face each other. Accordingly, the transmission ferrule 3a and the reception ferrule 3b are provided so as to face each other, and the transmission optical fiber 6a and the reception optical fiber 6b extending from the transmission ferrule 3a and the reception ferrule 3b are also opposed to each other. 10 to the outside.

このように送信用光ファイバ6a及び受信用光ファイバ6bの間隔が狭いので、これらの光ファイバ6a,6bをまとめて光ファイバケーブル6とするときに、光ファイバ6a,6bの間隔を更に狭めるべく光ファイバ6a,6bを曲げて曲げ部を形成しても、その曲げ部を小さくすることができる。また、曲げ部を小さくした分だけ光送受信モジュール1の光ファイバケーブル6の長手方向寸法を小さくすることができる。   As described above, since the distance between the transmission optical fiber 6a and the reception optical fiber 6b is narrow, when these optical fibers 6a and 6b are combined into an optical fiber cable 6, the distance between the optical fibers 6a and 6b should be further reduced. Even if the optical fibers 6a and 6b are bent to form a bent portion, the bent portion can be reduced. Further, the longitudinal dimension of the optical fiber cable 6 of the optical transmission / reception module 1 can be reduced by the amount by which the bent portion is reduced.

なお、本実施形態においては、光ファイバケーブル6中の各光ファイバ相互の間隔と、光送受信モジュール1内部の光ファイバ6a,6bとの間隔が等しくなるように、送信側基板2aと受信側基板2bとの間隔、送信側フェルール3a及び受信側フェルール3bの挿通孔の設ける位置を調整している。したがって、送信側光ファイバ6a或いは受信側光ファイバ6bを曲げて曲げ部を形成する必要がないので、高い伝送効率を有する光送受信モジュール1を提供することができる。また、本実施形態に係る光送受信モジュール1によれば、図3のように素子搭載面が上面を向いた状態で複数の基板を積層させた場合と比べて、曲げ部106a1の占める領域Aの分だけ光ファイバケーブル6の長手方向寸法を小さくすることができる。   In the present embodiment, the transmission side substrate 2a and the reception side substrate are set so that the distance between the optical fibers in the optical fiber cable 6 is equal to the distance between the optical fibers 6a and 6b in the optical transmission / reception module 1. 2b and the positions where the insertion holes of the transmitting ferrule 3a and the receiving ferrule 3b are provided are adjusted. Therefore, since it is not necessary to bend the transmission side optical fiber 6a or the reception side optical fiber 6b to form a bent portion, the optical transmission / reception module 1 having high transmission efficiency can be provided. Further, according to the optical transceiver module 1 according to the present embodiment, the region A occupied by the bent portion 106a1 is compared with the case where a plurality of substrates are stacked with the element mounting surface facing the upper surface as shown in FIG. The longitudinal dimension of the optical fiber cable 6 can be reduced by that amount.

また、この光送受信モジュール1は、送信側基板2aの素子搭載面21a及び受信側基板2bの素子搭載面21bが対向するように配置されている。したがって、発光素子4a等の送信側の部材と、受光素子4b等の受信側の部材とを単一の基板に横並びに配列させた(光ファイバ6a,6bの長手方向と直交する方向に並べた)場合と比べて、光送受信モジュール1の幅寸法を小さくし、全体をコンパクトに構成することができる。光送受信モジュール1が多チャンネルを備えて複数の信号を並列的に送受信する場合には、特に光送受信モジュール1全体をコンパクトに構成することができる。   The optical transceiver module 1 is arranged so that the element mounting surface 21a of the transmission side substrate 2a and the element mounting surface 21b of the reception side substrate 2b face each other. Therefore, the transmitting side member such as the light emitting element 4a and the receiving side member such as the light receiving element 4b are arranged side by side on a single substrate (arranged in a direction orthogonal to the longitudinal direction of the optical fibers 6a and 6b). ) Compared to the case, the width of the optical transceiver module 1 can be reduced, and the whole can be made compact. When the optical transceiver module 1 has multiple channels and transmits and receives a plurality of signals in parallel, the entire optical transceiver module 1 can be particularly compactly configured.

なお、この光送受信モジュール1において、送信側半導体素子5aから発光素子4aへ送信側素子間配線7aを流れる電流が比較的大きく(約10mA)、一方、受光素子4bから受光側半導体素子5bへ受信側素子間配線7bを流れる電流は比較的小さい(約10μA)ので、受信側素子間配線7bはクロストークの影響を受けやすい。   In this optical transceiver module 1, the current flowing through the transmission-side inter-element wiring 7a from the transmission-side semiconductor element 5a to the light-emitting element 4a is relatively large (about 10 mA), while the light-receiving element 4b receives from the light-receiving-side semiconductor element 5b. Since the current flowing through the side element wiring 7b is relatively small (about 10 μA), the reception side element wiring 7b is susceptible to crosstalk.

しかしながら、上述の如く光送受信モジュール1をコンパクトに構成しても、クロストークの影響を受けやすい受信側素子間配線7bが、送信側フェルール3aと受信側フェルール3bの占める空間を挟んで比較的大きな電流の流れる送信側素子間配線7aの反対側に位置することになり、送信側素子間配線7aと受信側素子間配線7bとの間隔を大きく設定することができる。したがって、受信側素子間配線7bの送信側素子間配線7aによるクロストークの影響を低減することができる。なお、送信側フェルール3a及び受信側フェルール3bの高さ(図2の上下方向寸法)を大きくして送信側素子間配線7aと受信側素子間配線7bとの間隔を広げることによって、更にクロストークを低減させることができる。   However, even if the optical transceiver module 1 is configured compactly as described above, the receiving-side inter-element wiring 7b that is easily affected by crosstalk is relatively large across the space occupied by the transmitting-side ferrule 3a and the receiving-side ferrule 3b. It is located on the opposite side of the transmission-side inter-element wiring 7a through which current flows, and the interval between the transmission-side inter-element wiring 7a and the reception-side inter-element wiring 7b can be set large. Therefore, it is possible to reduce the influence of crosstalk caused by the transmission-side inter-element wiring 7a of the reception-side inter-element wiring 7b. The crosstalk is further increased by increasing the height (the vertical dimension in FIG. 2) of the transmission-side ferrule 3a and the reception-side ferrule 3b to widen the distance between the transmission-side element wiring 7a and the reception-side element wiring 7b. Can be reduced.

1:光送受信モジュール、2a:送信側基板、2b:受信側基板、21a,21b:素子搭載面、3a:送信側光ファイバ位置決め部品、3b:受信側光ファイバ位置決め部品、4a:発光素子、4b:受光素子、5a:送信側半導体素子、5b:受信側半導体素子、6a:送信側光ファイバ、6b:受信側光ファイバ、10:ハウジング 1: optical transceiver module, 2a: transmission side substrate, 2b: reception side substrate, 21a, 21b: element mounting surface, 3a: transmission side optical fiber positioning component, 3b: reception side optical fiber positioning component, 4a: light emitting element, 4b : Light receiving element, 5a: transmission side semiconductor element, 5b: reception side semiconductor element, 6a: transmission side optical fiber, 6b: reception side optical fiber, 10: housing

Claims (1)

発光素子と、前記発光素子からの光を送信する送信用光ファイバを収容する送信側光ファイバ位置決め部品と、前記発光素子の発光を電気的に制御する送信用半導体素子とが素子搭載面に設けられた送信側基板と、
受光素子と、前記受光素子へ光を伝達する受信用光ファイバを収容する受信側光ファイバ位置決め部品と、前記受光素子からの電気信号を増幅する受信用半導体素子とが素子搭載面に設けられた受信側基板と、を備えた光送受信モジュールであって、
前記送信側基板の素子搭載面と、前記受信側基板の素子搭載面とが向かい合うように配置されていることを特徴とする。
A light-emitting element, a transmission-side optical fiber positioning component that accommodates a transmission optical fiber that transmits light from the light-emitting element, and a transmission semiconductor element that electrically controls light emission of the light-emitting element are provided on the element mounting surface. A transmitter board,
A light receiving element, a receiving-side optical fiber positioning component that houses a receiving optical fiber that transmits light to the light receiving element, and a receiving semiconductor element that amplifies an electric signal from the light receiving element are provided on the element mounting surface. An optical transceiver module comprising a receiving side substrate,
The element mounting surface of the transmission side substrate and the element mounting surface of the reception side substrate are arranged to face each other.
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WO2015002188A1 (en) * 2013-07-02 2015-01-08 住友ベークライト株式会社 Optical-module member, optical module, and electronic device
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JPWO2015002188A1 (en) * 2013-07-02 2017-02-23 住友ベークライト株式会社 Optical module member, optical module and electronic device
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