JP2012009447A - Connector - Google Patents

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JP2012009447A
JP2012009447A JP2011184136A JP2011184136A JP2012009447A JP 2012009447 A JP2012009447 A JP 2012009447A JP 2011184136 A JP2011184136 A JP 2011184136A JP 2011184136 A JP2011184136 A JP 2011184136A JP 2012009447 A JP2012009447 A JP 2012009447A
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contact
frame
connector
insulating film
contacts
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JP5360165B2 (en
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Ryo Sasaki
良 佐々木
Mitsuhiro Yoshida
光宏 吉田
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SMK Corp
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SMK Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a connector that secures thickness reduction limited with resin, differently from a conventional frame formed of a resin-like member and rigidity generated accompanying thickness reduction and that is easily made thin and compact by joining a contact made of a metallic member to a frame made of a metallic plate member in an insulation state.SOLUTION: The connector consists of the frame having a junction for insulating and joining a contact to the metallic plate member, and the contact made of the metallic member and having a contact portion and a terminal portion. The junction is provided with an insulation film, a part of the contact except the contact portion and terminal portion is provided with the insulating film, and the part of the contact where the insulation film is provided is joined to the junction provided with the insulating film.

Description

本発明は、コネクタに関し、詳しくは金属性部材で構成されたコンタクトを取り付けるフレームを金属性部材で形成したコネクタに関する。  The present invention relates to a connector, and more particularly to a connector in which a frame for attaching a contact made of a metallic member is formed of a metallic member.

従来技術におけるコネクタとして、金属性部材で構成されるコンタクトを絶縁性のある樹脂製ハウジング(フレーム)に、圧入又はインサート成形することでコンタクトを固定し、コネクタとしての機能、ばね性、導通、絶縁等を持たせていた。
フレームにコンタクトを圧入するためには、図11に示すように、薄く形成された樹脂製フレーム111の端子挿入口112にコンタクト113を並べた状態で一度に挿入することにより圧入固定する。
As a connector in the prior art, a contact made of a metallic member is press-fitted or insert-molded into an insulating resin housing (frame) to fix the contact, so that the function as a connector, springiness, conduction, insulation Etc.
In order to press-fit the contact into the frame, as shown in FIG. 11, the contact 113 is inserted into the terminal insertion port 112 of the thin resin frame 111 in a state of being inserted and fixed at a time.

特開2000−150078号公報  JP 2000-150078 A

しかし、従来技術で説明した、コネクタにおいては薄型、小型化に伴い、フレームも薄型化されるため、コンタクトを圧入すると、フレーム自体が反ってしまい、又、樹脂製ハウジングの薄型・小型化に伴い、剛性、耐熱性が低下してしまい、コネクタ性能が低下するという問題がある。  However, as the connector described in the prior art is thin and small in size, the frame is also thinned. Therefore, when the contact is press-fitted, the frame itself warps, and the resin housing is thin and small. However, there is a problem that the rigidity and heat resistance are lowered, and the connector performance is lowered.

従って、更なる薄型・小型化に伴う樹脂で生成されているハウジング(フレーム)には限界があり、金属性部材で形成されているコンタクトを如何にして薄型に対応したフレームに取り付けるかに解決しなければならない課題を有する。  Therefore, there is a limit to the housing (frame) that is made of resin with further thinning and downsizing, and it solves how to attach the contact made of a metallic member to the thin frame. Has challenges that must be met.

上記課題を解決するために、本願発明のコネクタは、次に示す構成にしたことである。  In order to solve the above problems, the connector of the present invention is configured as follows.

(1)コネクタは、金属性部材で構成されるコンタクトを、金属性部材で構成されるフレームに絶縁接合したことである。
(2)前記絶縁接合したコンタクトの接点部が臨んでいる前記フレームの表面を覆うようにシールドカバーを被せ、該シールドカバーと前記フレームで形成される空間がメモリカードを挿入するカード挿入経路を形成する(1)に記載のコネクタ。
(1) The connector is that a contact made of a metallic member is insulated and joined to a frame made of a metallic member.
(2) A shield cover is covered so as to cover the surface of the frame on which the contact portion of the insulation bonded contact faces, and a space formed by the shield cover and the frame forms a card insertion path for inserting a memory card The connector according to (1).

(3)コネクタは、金属性板部材に、コンタクトを絶縁接合する接合部を備えたフレームと、金属性部材で構成され、接点部と端子部を有するコンタクトと、からなり、前記接合部に絶縁膜を施し、前記コンタクトの接点部と端子部を除いた部位に絶縁膜を施し、前記絶縁膜を施した前記コンタクトの部位を、前記絶縁膜を施した接合部に接合させたことである。
(4)前記絶縁接合したコンタクトの接点部が臨んでいる前記フレームの表面を覆うようにシールドカバーを被せ、該シールドカバーと前記フレームで形成される空間がメモリカードを挿入するカード挿入経路を形成する(3)に記載のコネクタ。
(5)コネクタは、金属性板部材に、コンタクトを絶縁接合するための部位を切り欠いて形成された接合部を備えたフレームと、金属性部材で構成され、接点部と端子部を有するコンタクトと、からなり、前記接合部の裏面に絶縁膜を施し、前記コンタクトの接点部と端子部を除いた部位の表面に絶縁膜を施し、前記絶縁膜を施した前記コンタクトの部位表面を、前記絶縁膜を施した接合部の裏面から前記接点部を臨ませた状態にして接合したことである。
(6)前記絶縁接合したコンタクトの接点部が臨んでいる前記フレームの表面を覆うようにシールドカバーを被せ、該シールドカバーと前記フレームで形成される空間がメモリカードを挿入するカード挿入経路を形成する(5)に記載のコネクタ。
(7)前記接合部の裏面を肉薄に形成したことを特徴とする(5)に記載のコネクタ。
(8)前記フレームの表面に絶縁膜を施したことを特徴とする(5)に記載のコネクタ。
(3) The connector comprises a metal plate member, a frame provided with a joint portion for insulatingly joining the contact, and a contact made of a metallic member and having a contact portion and a terminal portion, and is insulated from the joint portion. A film is applied, an insulating film is applied to a portion excluding the contact portion and the terminal portion of the contact, and the contact portion to which the insulating film is applied is joined to the joint portion to which the insulating film is applied.
(4) A shield cover is covered so as to cover the surface of the frame on which the contact portion of the insulating contact faces, and a space formed by the shield cover and the frame forms a card insertion path for inserting a memory card The connector according to (3).
(5) The connector is composed of a metal plate member, a frame provided with a joint portion formed by cutting out a portion for insulatingly joining the contact, and a contact having a contact portion and a terminal portion. And an insulating film is applied to the back surface of the joint portion, an insulating film is applied to a surface of a portion excluding the contact portion and the terminal portion of the contact, and a surface portion of the contact to which the insulating film is applied, That is, bonding is performed with the contact portion facing the back surface of the bonding portion provided with the insulating film.
(6) A shield cover is covered so as to cover the surface of the frame facing the contact portion of the insulating joint, and a space formed by the shield cover and the frame forms a card insertion path for inserting a memory card. The connector according to (5).
(7) The connector according to (5), wherein the back surface of the joint is formed thin.
(8) The connector according to (5), wherein an insulating film is provided on a surface of the frame.

(9)コネクタは、金属性板部材に、コンタクトを絶縁接合するための部位を切り欠いて形成された接合部を備えたフレームと、金属性部材で構成され、接点部と端子部を有するコンタクトと、からなり、前記接合部の表面に絶縁膜を施し、前記コンタクトの接点部と端子部を除いた部位の裏面に絶縁膜を施し、前記絶縁膜を施した前記コンタクトの部位裏面を、前記絶縁膜を施した接合部の表面に接合したことである。
(10)前記絶縁接合したコンタクトの接点部が臨んでいる前記フレームの表面を覆うようにシールドカバーを被せ、該シールドカバーと前記フレームで形成される空間がメモリカードを挿入するカード挿入経路を形成する(9)に記載のコネクタ。
(11)前記接合された前記コンタクトの接点部と端子部を除く部位の表面に絶縁膜を施したことを特徴とする(9)に記載のコネクタ。
(9) The connector is composed of a metal plate member, a frame provided with a joint portion formed by cutting out a portion for insulating and joining the contact, and a contact having a contact portion and a terminal portion. And an insulating film is applied to the surface of the joint portion, an insulating film is applied to the back surface of the contact portion excluding the contact portion and the terminal portion, and the contact portion back surface of the contact to which the insulating film is applied, It is joining to the surface of the junction part which gave the insulating film.
(10) A shield cover is covered so as to cover the surface of the frame on which the contact portion of the insulation-bonded contact faces, and a space formed by the shield cover and the frame forms a card insertion path for inserting a memory card The connector according to (9).
(11) The connector according to (9), wherein an insulating film is provided on a surface of a portion excluding the contact portion and the terminal portion of the joined contact.

(12)コネクタは、金属性板部材に、コンタクトを絶縁接合するための部位を切り欠いて形成された接合部を備えたフレームと、金属性部材で構成され、接点部と端子部を有するコンタクトと、からなり、前記接合部の破断面と前記コンタクトの側面との間に絶縁接着剤を充填して前記接合部に前記コンタクトを絶縁接合したことである。
(13)前記絶縁接合したコンタクトの接点部が臨んでいる前記フレームの表面を覆うようにシールドカバーを被せ、該シールドカバーと前記フレームで形成される空間がメモリカードを挿入するカード挿入経路を形成する(12)に記載のコネクタ。
(14)前記接合された前記コンタクトの接点部と端子部を除く部位の表面に絶縁膜を施し、前記フレームの表面に絶縁膜を施したことを特徴とする(12)に記載のコネクタ。
(12) The connector is composed of a metal plate member, a frame provided with a joint portion formed by cutting out a portion for insulating and joining the contact, and a contact having a contact portion and a terminal portion. And an insulating adhesive is filled between the fracture surface of the joint and the side surface of the contact, and the contact is insulated and joined to the joint.
(13) A shield cover is placed so as to cover the surface of the frame facing the contact portion of the insulation bonded contact, and a space formed by the shield cover and the frame forms a card insertion path for inserting a memory card The connector according to (12).
(14) The connector according to (12), wherein an insulating film is provided on a surface of the joined portion excluding a contact portion and a terminal portion, and an insulating film is provided on a surface of the frame.

本提案によれば、金属性部材で構成されるコンタクトをやはり金属性部材で構成されたフレームに絶縁接合することで、従来の如く樹脂性部材で形成されたフレームと異なり樹脂では限界であった薄型及び薄型に伴い発生する剛性等が確保され、薄型・小型化が容易に達成できる。
又、記述したようにフレームを金属性部材で構成することによりコネクタに必要とされる剛性(反り低減を含む)、耐熱性(特に実装時の耐熱性)、絶縁性を確保できる。
According to the present proposal, a contact made of a metallic member is insulated and joined to a frame made of a metallic member, so that unlike a frame made of a resinous member as in the past, the resin is the limit. The rigidity generated with the thinness and thinness is ensured, and the thinning and miniaturization can be easily achieved.
Further, as described, the frame is made of a metallic member, so that the rigidity (including warpage reduction), heat resistance (particularly heat resistance during mounting), and insulation required for the connector can be ensured.

本願発明に係る第1実施形態のコネクタの表面側を略示的に示した斜視図である。It is the perspective view which showed schematically the surface side of the connector of 1st Embodiment which concerns on this invention. 同、コネクタの裏面側を略示的に示した斜視図である。FIG. 3 is a perspective view schematically showing the back side of the connector. 同、フレームとコンタクトの絶縁膜を施す領域を斜線で示した説明図である。FIG. 6 is an explanatory diagram showing the region where the insulating film for the frame and the contact is applied by hatching. 同、フレームの表面側の絶縁膜を施す領域を斜線で示した説明図である。FIG. 6 is an explanatory diagram showing a region where an insulating film on the surface side of the frame is applied by hatching. 本願発明に係る第2実施形態のコネクタの表面側を略示的に示した斜視図である。It is the perspective view which showed schematically the surface side of the connector of 2nd Embodiment which concerns on this invention. 同、コネクタの裏面側を略示的に示した斜視図である。FIG. 3 is a perspective view schematically showing the back side of the connector. 同、フレームとコンタクトの絶縁膜を施す領域を斜線で示した説明図である。FIG. 6 is an explanatory diagram showing the region where the insulating film for the frame and the contact is applied by hatching. 本願発明に係る第3実施形態のコネクタの表面側を略示的に示した斜視図である。It is the perspective view which showed schematically the surface side of the connector of 3rd Embodiment which concerns on this invention. 同、コネクタの裏面側を略示的に示した斜視図である。FIG. 3 is a perspective view schematically showing the back side of the connector. 同、フレームとコンタクトの接合状態を示した説明図である。It is explanatory drawing which showed the joining state of the flame | frame and a contact similarly. 従来技術におけるフレームとコンタクトの様子を示した説明図である。It is explanatory drawing which showed the mode of the flame | frame and contact in a prior art.

次に、本願発明に係るコネクタの第1実施形態について、図面を参照して以下説明する。  Next, a first embodiment of a connector according to the present invention will be described below with reference to the drawings.

本願発明の第1実施形態のコネクタは、図1乃至図4に示すように、金属性部材で構成されるコンタクトを金属性部材で構成されるフレーム12に絶縁接合した構成となっている。  As shown in FIGS. 1 to 4, the connector according to the first embodiment of the present invention has a configuration in which a contact made of a metallic member is insulated and joined to a frame 12 made of a metallic member.

フレーム12は、金属性板部材で形成され、略四角形状に形成された左右両端部を折り曲げて左壁13及び右壁14を形成し、その後端部も折り曲げて後端壁15を形成し、この左壁13、右壁14、後端壁15で挟まれた表面17領域がメモリカード51を挿入するカード挿入経路16を形成し、且つメモリカード51の接点52と接触するコンタクト(第1のコンタクト31、第2のコンタクト41)を絶縁接合した構成となっている。
そして、左壁13及び右壁14の頂端部に亘らせるようにシールドカバー38を被せることで、シールドカバー38の裏面とカード挿入経路16との間にメモリカード51を挿入させる空間を形成する。
The frame 12 is formed of a metal plate member, and the left and right ends formed in a substantially square shape are bent to form the left wall 13 and the right wall 14, and the rear end is also bent to form the rear end wall 15. The surface 17 region sandwiched between the left wall 13, the right wall 14, and the rear end wall 15 forms a card insertion path 16 into which the memory card 51 is inserted, and contacts that contact the contact 52 of the memory card 51 (first The contact 31 and the second contact 41) are insulatively joined.
A space for inserting the memory card 51 is formed between the back surface of the shield cover 38 and the card insertion path 16 by covering the shield cover 38 so as to extend over the top ends of the left wall 13 and the right wall 14. .

このカード挿入経路16には、フレーム12の裏面18手前側に第1のコンタクト31を絶縁接合する刳り貫いて形成されたコンタクト貫通孔25を有する第1の接合部21を備え、裏面18奥側に第2のコンタクト41を絶縁接合する切り欠いて形成されたコンタクト貫通孔26を有する第2の接合部22を備えた構成になっている。  The card insertion path 16 is provided with a first joint portion 21 having a contact through hole 25 formed so as to penetrate the first contact 31 on the front side of the back surface 18 of the frame 12. The second contact portion 22 having a contact through hole 26 formed by cutting out the second contact 41 is provided.

第1の接合部21は、長方形状に刳り貫いたコンタクト貫通孔25を備え、そのコンタクト貫通孔25の周囲は板厚を薄くした第1の接合凹部23を形成する。この第1の接点凹部23には、絶縁性接着剤や絶縁テープを貼付ける(図3における斜線の部分)構成となっている。  The first joint portion 21 includes a contact through hole 25 penetrating in a rectangular shape, and a first joint recess 23 having a reduced plate thickness is formed around the contact through hole 25. The first contact recess 23 is configured to affix an insulating adhesive or insulating tape (shaded portion in FIG. 3).

第1のコンタクト31は、金属性板部材を長方形のフレーム状に形成した枠体32と、枠体32の一辺から外方向に導き出された端子部33と、端子部33の反対側から枠体32に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部34を形成する。
この枠体32の部分がコンタクト貫通孔25の縁部、即ち、第1の接合凹部23に載せることで第1のコンタクト31を装着する。
又、この枠体32の反り返る接点部34側の全面、即ち、接点部34と端子部33以外の表面35部位は、絶縁塗膜工程により絶縁膜が施される(図3における斜線の部分)。
絶縁塗膜工程は、即ち絶縁膜被膜工程で、先ず、脱脂、マスキングをして、液温30℃前後で数分間の被膜を行う。次に、被膜した部材を洗浄して、温度が約200℃で時間が約20分程度加熱して硬化させる。硬化させた部材は冷却して絶縁膜が施される。
The first contact 31 includes a frame body 32 in which a metal plate member is formed in a rectangular frame shape, a terminal portion 33 led outward from one side of the frame body 32, and a frame body from the opposite side of the terminal portion 33. A contact portion 34 is formed which is provided with a spring property and is bent back toward a central position formed continuously with the frame 32.
The first contact 31 is mounted by placing the frame body 32 on the edge of the contact through hole 25, that is, on the first bonding recess 23.
Further, the entire surface of the frame 32 on the side of the contact portion 34 where the warp is repeated, that is, the surface 35 portion other than the contact portion 34 and the terminal portion 33 is coated with an insulating film (shaded portion in FIG. 3). .
The insulating coating film process is an insulating film coating process. First, degreasing and masking are performed, and coating is performed at a liquid temperature of about 30 ° C. for several minutes. Next, the coated member is washed and cured by heating at a temperature of about 200 ° C. for about 20 minutes. The cured member is cooled and an insulating film is applied.

第2の接合部22は、長方形状に切り欠いたコンタクト貫通孔26を備え、そのコンタクト貫通孔26の周囲は板厚を薄くした第2の接合凹部24を形成する。この第2の接点凹部24には、絶縁性接着剤や絶縁テープを貼付ける(図3における斜線の部分)構成となっている。  The second joint 22 includes a contact through hole 26 cut out in a rectangular shape, and a second joint recess 24 having a reduced plate thickness is formed around the contact through hole 26. The second contact recess 24 is configured to affix an insulating adhesive or insulating tape (shaded portion in FIG. 3).

第2のコンタクト41は、金属性板部材を長方形のフレーム状に形成した枠体42と、枠体42の一辺から外方向に導き出された端子部43と、端子部43を設けた枠体42の対向する枠体に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部44を形成する。
この枠体42の部分、即ち、接点部44と端子部43以外の部分がコンタクト貫通孔26の縁部、即ち、第2の接合凹部24に載せることで第2のコンタクト41を装着する。
又、この枠体42の反り返る接点部44側の全面、即ち、接点部44と端子部43以外の表面45部位は、絶縁塗膜工程により絶縁膜が施されている(図3における斜線の部分)。
The second contact 41 includes a frame body 42 in which a metal plate member is formed in a rectangular frame shape, a terminal portion 43 led out from one side of the frame body 42, and a frame body 42 provided with the terminal portion 43. The contact portion 44 is formed in a frame shape by being connected to the opposing frame bodies and springing back toward the center position.
The second contact 41 is mounted by placing a part of the frame body 42, that is, a part other than the contact part 44 and the terminal part 43 on the edge part of the contact through hole 26, that is, the second joint recess 24.
In addition, the entire surface of the frame body 42 on the side of the contact portion 44 that is warped, that is, the surface 45 portion other than the contact portion 44 and the terminal portion 43 is provided with an insulating film by an insulating coating process (the hatched portion in FIG. 3). ).

このような構成からなるフレーム12に第1及び第2のコンタクト31、41を絶縁接合して組み立て、シールドカバー38を被せることでコネクタが完成する。
先ず、図4に示すように、フレーム12の表面17には、絶縁膜が施されている(斜線の部分)。
そして、第1のコンタクト31を形成する枠体32の表面35全面に絶縁膜を施す(図3に示す斜線の部分)。同様に第2のコンタクト41を形成する枠体42の表面45全面にも絶縁膜を施す(図3に示す斜線の部分)。
次に、図3に示すように、フレーム12の裏面18側のコンタクト貫通孔26の周囲の第1の接合凹部23に絶縁テープを貼り付ける(図3の斜線の部分)。同様に、コンタクト貫通孔25の周囲の第2の接合凹部24に絶縁テープを貼り付ける(図3の斜線の部分)。
この状態で絶縁テープを貼り付けた第1の接合凹部23に絶縁膜を施した第1のコンタクト31の枠体32を装着させ、且つ絶縁テープを貼り付けた第2の接合凹部24に絶縁膜を施した第2のコンタクト41の枠体42を装着させる。
これで、金属性部材で形成されたフレーム12にやはり金属性部材で形成された第1及び第2のコンタクト31、41が電気的に絶縁された状態で取り付けることができる。そして、フレーム12の表面17側であるコネクタ貫通孔25、26から第1及び第2のコンタクト31、41の接点部34、44が臨ませて配列されている上部位置を覆うようにシールドカバー38を被せることでコネクタが完成する。
尚、第1実施形態におけるコンタクト(第1及び第2のコンタクト)を接合させるフレームにシールドカバーを被せる構造となっているが、これに限定されることなく、フレーム自体をシールドカバーも兼ねた構造のケースに形成してもよい。このケースはメモリカードの挿入口側(図1において手前側)が開口した箱状に曲げ加工又は絞り加工にて形成するようにして、メモリカードが挿入できる構造にすればよい。この場合、カバーの部分は箱状に全てを覆うような形状でなくともよく、メモリカードの両側を挿入方向に正常な接続位置まで案内できてメモリカードを挿入してコンタクトに電気的な接触が確保できる様にカード挿入経路16の両端がコ字状に折曲された構造であってもよい。
又、フレームに接合するコンタクトの接合面やコンタクトが接合されるフレーム表面は粗面にして接合面積を増加させるようにしてもよい。
更に、コンタクト(第1及び第2のコンタクト)の構造は、実施例においては長方形状のフレーム形状の枠体32を有する形状になっているがこれに限定されることなく、例えば、細長い板状部材を屈曲させて、先端側に接点部を設けた弾性片を、他端側に端子部を直線状に形成するようにしてもよい。この場合、接合面は、弾性片と端子部の間に設けた水平形状に設ければ良い。
The first and second contacts 31 and 41 are assembled and assembled to the frame 12 having such a configuration, and the shield cover 38 is put on to complete the connector.
First, as shown in FIG. 4, the surface 17 of the frame 12 is provided with an insulating film (shaded portion).
Then, an insulating film is applied to the entire surface 35 of the frame body 32 forming the first contact 31 (shaded portion shown in FIG. 3). Similarly, an insulating film is also applied to the entire surface 45 of the frame body 42 forming the second contact 41 (shaded area shown in FIG. 3).
Next, as shown in FIG. 3, an insulating tape is applied to the first joint recess 23 around the contact through hole 26 on the back surface 18 side of the frame 12 (shaded portion in FIG. 3). Similarly, an insulating tape is affixed to the 2nd junction recessed part 24 around the contact through-hole 25 (shaded part of FIG. 3).
In this state, the frame 32 of the first contact 31 provided with the insulating film is attached to the first bonding recess 23 to which the insulating tape is applied, and the insulating film is applied to the second bonding recess 24 to which the insulating tape is applied. The frame body 42 of the second contact 41 subjected to is attached.
As a result, the first and second contacts 31 and 41, which are also formed of a metallic member, can be attached to the frame 12 formed of the metallic member in an electrically insulated state. The shield cover 38 covers the upper position where the contact portions 34, 44 of the first and second contacts 31, 41 face the connector through holes 25, 26 on the surface 17 side of the frame 12. The connector is completed.
In addition, although it has the structure which covers a frame which joins the contact (1st and 2nd contact) in 1st Embodiment with a shield cover, it is not limited to this, The structure which doubles as the shield itself You may form in the case. This case may be formed by bending or drawing into a box shape having an opening on the memory card insertion slot side (front side in FIG. 1) so that the memory card can be inserted. In this case, the cover portion does not have to be in a box-like shape so that both sides of the memory card can be guided to the normal connection position in the insertion direction, and the memory card is inserted to make electrical contact with the contact. A structure in which both ends of the card insertion path 16 are bent in a U shape may be used so as to be secured.
Further, the contact surface of the contact bonded to the frame or the surface of the frame to which the contact is bonded may be roughened to increase the bonding area.
Further, the structure of the contacts (first and second contacts) is a shape having a rectangular frame-shaped frame body 32 in the embodiment, but is not limited to this, for example, an elongated plate shape. The member may be bent so that the elastic piece provided with the contact portion on the front end side and the terminal portion on the other end side may be formed in a straight line. In this case, the joining surface may be provided in a horizontal shape provided between the elastic piece and the terminal portion.

次に、本願発明に係るコネクタの第2実施形態について、図面を参照して以下説明する。  Next, a second embodiment of the connector according to the present invention will be described below with reference to the drawings.

本願発明の第2実施形態のコネクタは、図5乃至図7に示すように、金属性部材で構成されるコンタクトを金属性部材で構成されるフレーム12の表面にコンタクト(第1及び第2のコンタクト31、41)の裏面を絶縁接合した構成となっている。  As shown in FIGS. 5 to 7, the connector according to the second embodiment of the present invention is configured such that a contact made of a metallic member contacts a surface of the frame 12 made of a metallic member (first and second contacts) The back surfaces of the contacts 31, 41) are insulatively joined.

フレーム12は、第1実施形態で説明したフレームと同様に、金属性板部材で形成され、略四角形状に形成された左右両端部を折り曲げて左壁13及び右壁14を形成し、その後端部も折り曲げて後端壁15を形成し、この左壁13、右壁14、後端壁15で挟まれた領域がメモリカード51を挿入するカード挿入経路16を形成し、且つメモリカード51の接点52と接触するコンタクト(第1及び第2のコンタクト31、41)を絶縁接合した構成となっている。
そして、左壁13及び右壁14の頂端部を亘らせるようにシールドカバー38を被せることで、シールドカバー38の裏面とカード挿入経路16との間にメモリカード51を挿入させる空間を形成する。
Similarly to the frame described in the first embodiment, the frame 12 is formed of a metal plate member, and bends the left and right ends formed in a substantially square shape to form the left wall 13 and the right wall 14, and the rear end The rear end wall 15 is also bent to form a card insertion path 16 into which the memory card 51 is inserted, and the area between the left wall 13, the right wall 14, and the rear end wall 15 forms the memory card 51. The contacts (first and second contacts 31, 41) that come into contact with the contact 52 are insulatively joined.
A space for inserting the memory card 51 is formed between the back surface of the shield cover 38 and the card insertion path 16 by covering the shield cover 38 so as to extend over the top ends of the left wall 13 and the right wall 14. .

このカード挿入経路16には、表面17手前側に第1のコンタクト31の裏面に絶縁接合する刳り貫いて形成されたコンタクト貫通孔25を有する第1の接合部21を備え、表面17奥側に第2のコンタクト41を絶縁接合する切り欠いて形成されたコンタクト貫通孔26を有する第2の接合部24を備えた構成になっている。  The card insertion path 16 is provided with a first joint portion 21 having a contact through hole 25 formed so as to penetrate the back surface of the first contact 31 on the front side of the front surface 17. The second contact portion 24 having the contact through hole 26 formed by cutting out the second contact 41 for insulation bonding is provided.

第1の接合部21は、長方形状に刳り貫いたコンタクト貫通孔25を備え、そのコンタクト貫通孔25の表面17周囲は、絶縁性接着剤や絶縁テープを貼付ける(図7に示す点線で囲った部分)構成となっている。  The first joint portion 21 includes a contact through hole 25 penetrating in a rectangular shape, and the periphery of the surface 17 of the contact through hole 25 is pasted with an insulating adhesive or insulating tape (enclosed by a dotted line shown in FIG. 7). Part) composition.

第1のコンタクト31は、金属性板部材を長方形のフレーム状に形成した枠体32と、枠体32の一辺から外方向に導き出された端子部33と、端子部33の反対側から枠体32に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部34を形成する。同様に、接点部34と端子部33を除いた枠体32の表面35にも絶縁塗膜工程により絶縁膜が施されている(図7の斜線の部分)。
この枠体32の裏面を第1の接合部21のコンタクト貫通孔25の縁部に載せることで第1のコンタクト31を装着する。
又、この枠体32の反り返る接点部34の反対側の裏面36は、絶縁塗膜工程により絶縁膜が施されている(図7の斜線の部分)。
The first contact 31 includes a frame body 32 in which a metal plate member is formed in a rectangular frame shape, a terminal portion 33 led outward from one side of the frame body 32, and a frame body from the opposite side of the terminal portion 33. A contact portion 34 is formed which is provided with a spring property and is bent back toward a central position formed continuously with the frame 32. Similarly, an insulating film is applied to the surface 35 of the frame 32 excluding the contact portion 34 and the terminal portion 33 by an insulating coating process (shaded portion in FIG. 7).
The first contact 31 is mounted by placing the back surface of the frame 32 on the edge of the contact through hole 25 of the first joint portion 21.
In addition, an insulating film is applied to the back surface 36 on the opposite side of the contact portion 34 where the frame body 32 warps (shaded portion in FIG. 7).

第2の接合部24は、長方形状に切り欠いたコンタクト貫通孔26を備え、そのコンタクト貫通孔26の表面17周囲は、絶縁性接着剤や絶縁テープを貼付ける構成となっている(図7に示す点線で囲った部分)。  The second joint portion 24 includes a contact through hole 26 cut out in a rectangular shape, and the periphery of the surface 17 of the contact through hole 26 is configured to affix an insulating adhesive or insulating tape (FIG. 7). (The part enclosed by the dotted line shown in the).

第2のコンタクト41は、金属性板部材を長方形のフレーム状に形成した枠体46と、枠体46の一辺から外方向に導き出された端子部と、端子を設けた枠体の対向する枠体に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部を形成する。
この枠体の裏面を第2のコンタクト貫通孔の縁部に載せることで第2のコンタクトを装着する。
又、この枠体46の反り返る接点部44の反対側の裏面46は、絶縁塗膜工程により絶縁膜が施されている(図7の斜線の部分)。同様に、接点部44と端子部43を除いた枠体42の表面45にも絶縁塗膜工程により絶縁膜が施されている(図7の斜線の部分)。
The second contact 41 includes a frame body 46 in which a metal plate member is formed in a rectangular frame shape, a terminal portion led outward from one side of the frame body 46, and a frame opposed to the frame body provided with terminals. A contact portion is formed which is bent back toward the center position formed continuously with the body and formed into a frame shape.
The second contact is mounted by placing the back surface of the frame on the edge of the second contact through hole.
In addition, an insulating film is applied to the back surface 46 on the opposite side of the contact portion 44 where the frame 46 warps (shaded portion in FIG. 7). Similarly, an insulating film is also applied to the surface 45 of the frame body 42 excluding the contact portion 44 and the terminal portion 43 by an insulating coating process (shaded portion in FIG. 7).

このような構成からなるフレーム12に第1及び第2のコンタクト31、41を絶縁接合して組み立て、シールドカバー38を被せることでコネクタが完成する。
先ず、図7に示すように、フレーム12の表面17には、絶縁膜が施されている(斜線の部分)。
そして、第1のコンタクト31を形成する枠体32の裏面36全面に絶縁膜を施す(図7の斜線部分)。同様に、第2のコンタクト41を形成する枠体42の裏面46全面にも絶縁膜を施す(図7の斜線部分)。
次に、フレーム12の表面17側の第1の接合部21のコンタクト貫通孔25の周囲に絶縁テープを貼り付ける(図7の点線で囲った部分)。同様に,コンタクト貫通孔26の周囲に絶縁テープを貼り付ける(図7の点線で囲った部分)。
この状態で絶縁テープを貼り付けたコンタクト貫通孔25の周囲に絶縁膜を施した第1のコンタクト31の枠体32の裏面36側を装着させ、且つ絶縁テープを貼り付けた第2の接合部22のコンタクト貫通孔26の周囲に絶縁膜を施した第2のコンタクト41の枠体42の裏面46側を装着させる。
これで、金属性部材で形成されたフレーム12にやはり金属性部材で形成された第1及び第2のコンタクト31、41が電気的に絶縁された状態で取り付けることができる。そして、フレーム12の表面17側にシールドカバー38を被せることでコネクタが完成する。
The first and second contacts 31 and 41 are assembled and assembled to the frame 12 having such a configuration, and the shield cover 38 is put on to complete the connector.
First, as shown in FIG. 7, the surface 17 of the frame 12 is provided with an insulating film (shaded portion).
Then, an insulating film is applied to the entire back surface 36 of the frame 32 forming the first contact 31 (shaded area in FIG. 7). Similarly, an insulating film is also applied to the entire back surface 46 of the frame 42 forming the second contact 41 (shaded area in FIG. 7).
Next, an insulating tape is affixed around the contact through hole 25 of the first joint 21 on the surface 17 side of the frame 12 (portion surrounded by a dotted line in FIG. 7). Similarly, an insulating tape is affixed around the contact through hole 26 (portion surrounded by a dotted line in FIG. 7).
In this state, the second joint portion in which the back surface 36 side of the frame 32 of the first contact 31 provided with an insulating film is attached around the contact through hole 25 to which the insulating tape is attached and the insulating tape is attached. The back surface 46 side of the frame body 42 of the second contact 41 having an insulating film applied around the 22 contact through holes 26 is attached.
As a result, the first and second contacts 31 and 41, which are also formed of a metallic member, can be attached to the frame 12 formed of the metallic member in an electrically insulated state. Then, the connector is completed by covering the surface 17 side of the frame 12 with the shield cover 38.

次に、本願発明に係るコネクタの第3実施形態について、図面を参照して以下説明する。  Next, a third embodiment of the connector according to the present invention will be described below with reference to the drawings.

本願発明の第3実施形態のコネクタは、図8乃至図10に示すように、金属性部材で構成されるコンタクトを金属性部材で構成されるフレームに設けたコンタクト貫通孔の破断面にコンタクトの側面(破断面)を絶縁接合した構成となっている。  As shown in FIGS. 8 to 10, the connector according to the third embodiment of the present invention has a contact formed on a fracture surface of a contact through hole provided in a frame formed of a metallic member. The side surface (fracture surface) is insulatively joined.

フレーム12は、第1実施形態で説明したフレームと同様に金属性板部材で形成され、略四角形状に形成された左右両端部を折り曲げて左壁13及び右壁14を形成し、その後端部も折り曲げて後端壁15を形成し、この左壁13、右壁14、後端壁15で挟まれた領域がメモリカード51を挿入するカード挿入経路16を形成し、且つメモリカード51の接点52と接触するコンタクト(第1及び第2のコンタクト31、41)を絶縁接合した構成となっている。
そして、左壁13及び右壁14の頂端部に亘らせるようにシールドカバー38を被せることで、シールドカバー12の裏面とカード挿入経路16との間にメモリカード51を挿入させる空間を形成する。
The frame 12 is formed of a metal plate member in the same manner as the frame described in the first embodiment, and the left and right end portions formed in a substantially square shape are bent to form the left wall 13 and the right wall 14, and the rear end portion thereof. Is also bent to form the rear end wall 15, and the region sandwiched between the left wall 13, the right wall 14, and the rear end wall 15 forms a card insertion path 16 into which the memory card 51 is inserted, and contacts of the memory card 51. The contacts (first and second contacts 31, 41) that come into contact with 52 are insulatively joined.
A space for inserting the memory card 51 is formed between the back surface of the shield cover 12 and the card insertion path 16 by covering the shield cover 38 so as to extend over the top ends of the left wall 13 and the right wall 14. .

このカード挿入経路51には、手前側に第1のコンタクト31が収納できる大きさに切り欠いて形成されたコンタクト貫通孔25を有する第1の接合部21を備え、奥側に第2のコンタクト41が収納できる大きさに刳り貫いて形成されたコンタクト貫通孔26を有する第2の接合部22を備えた構成になっている。  The card insertion path 51 is provided with a first joint portion 21 having a contact through hole 25 formed in the front side so as to be able to accommodate the first contact 31 and the second contact on the back side. 41 is configured to include a second joint portion 22 having a contact through hole 26 formed so as to penetrate through a size that can accommodate 41.

第1の接合部21は、端部から長方形状に切り欠いたコンタクト貫通孔25を備え、このコンタクト貫通孔25には第1のコンタクト31が収納できる大きさに形成されている。  The first joint portion 21 includes a contact through hole 25 cut out in a rectangular shape from an end portion, and the contact through hole 25 is formed in a size that can accommodate the first contact 31.

第1のコンタクト31は、金属性板部材を長方形のフレーム状に形成した枠体32と、枠体32の一辺から外方向に導き出された端子部33と、端子部33の反対側から枠体32に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部34を形成する。
図10に示すように、この枠体32の側面37をコンタクト貫通孔25の破断面27に合わせ、その合わせた隙間に絶縁接着剤を充填して接着させることで第1のコンタクト31を絶縁接合する。
又、この枠体32の反り返る接点部34側の表面35は、絶縁塗膜工程により絶縁膜が施されている。
ここで、絶縁接着剤で接着する枠体32の側面37とコンタクト貫通孔25の破断面27とは略並行状態に形成されているが、これに限定されることなく、例えば、コンタクト貫通孔25の破断面27の形状を下方拡がりの形状にすることにより、下端部分への絶縁接着剤の量を多くすることができ、第1のコンタクト31の上方向への抜けを防止できる。
The first contact 31 includes a frame body 32 in which a metal plate member is formed in a rectangular frame shape, a terminal portion 33 led outward from one side of the frame body 32, and a frame body from the opposite side of the terminal portion 33. A contact portion 34 is formed which is provided with a spring property and is bent back toward a central position formed continuously with the frame 32.
As shown in FIG. 10, the side surface 37 of the frame body 32 is aligned with the fracture surface 27 of the contact through hole 25, and the first contact 31 is insulatively bonded by filling the bonded gap with an insulating adhesive. To do.
Further, the surface 35 on the side of the contact portion 34 where the frame 32 is warped is provided with an insulating film by an insulating coating process.
Here, the side surface 37 of the frame 32 bonded with the insulating adhesive and the fracture surface 27 of the contact through-hole 25 are formed in a substantially parallel state, but the present invention is not limited to this. By making the shape of the fractured surface 27 of the lower portion into a shape that expands downward, the amount of the insulating adhesive to the lower end portion can be increased, and the first contact 31 can be prevented from coming off upward.

第2の接合部22は、端部から長方形状に切り欠いたコンタクト貫通孔26を備え、このコンタクト貫通孔25には第2のコンタクト41が収納できる大きさに形成されている。  The second joint portion 22 includes a contact through hole 26 cut out in a rectangular shape from the end portion, and the contact through hole 25 is formed in a size that can accommodate the second contact 41.

第2のコンタクト41は、金属性板部材を長方形のフレーム状に形成した枠体42と、枠体42の一辺から外方向に導き出された端子部43と、端子部43を設けた枠体42の対向する枠体に連設してフレーム状に形成した中央位置に向かってバネ性を持たせて反り返えさせた接点部44を形成する。
図10に示すように、この枠体42の側面37をコンタクト貫通孔26の破断面27に合わせ、その合わせた隙間に絶縁接着剤を充填して接着させることで第2のコンタクト41を絶縁接合する。
又、この枠体42の反り返る接点部44側の表面45は、絶縁塗膜工程により絶縁膜が施されている。
ここで、絶縁接着剤で接着する枠体42の側面47とコンタクト貫通孔26の破断面28とは略並行状態に形成されているが、これに限定されることなく、例えば、コンタクト貫通孔26の破断面28の形状を下方拡がりの形状にすることにより、下端部分への絶縁接着剤の量を多くすることができ、第2のコンタクト41の上方向への抜けを防止できる。
The second contact 41 includes a frame body 42 in which a metal plate member is formed in a rectangular frame shape, a terminal portion 43 led out from one side of the frame body 42, and a frame body 42 provided with the terminal portion 43. The contact portion 44 is formed in a frame shape by being connected to the opposing frame bodies and springing back toward the center position.
As shown in FIG. 10, the side surface 37 of the frame 42 is aligned with the fracture surface 27 of the contact through hole 26, and the second contact 41 is insulatively bonded by filling the bonded gap with an insulating adhesive. To do.
Further, the surface 45 on the side of the contact portion 44 where the frame body 42 warps is provided with an insulating film by an insulating coating process.
Here, the side surface 47 of the frame body 42 to be bonded with the insulating adhesive and the fractured surface 28 of the contact through hole 26 are formed in a substantially parallel state, but the present invention is not limited to this. By making the shape of the fracture surface 28 into a shape that expands downward, the amount of the insulating adhesive to the lower end portion can be increased, and the second contact 41 can be prevented from coming off upward.

このような構成からなるフレーム12に第1及び第2のコンタクト31、41を絶縁接合して組み立て、シールドカバー38を被せることでコネクタが完成する。
先ず、第1のコンタクト31を形成する枠体32の表面35全面に絶縁膜を施す。同様に、第2のコンタクト41を形成する枠体42の表面45全面にも絶縁膜を施す。
次に、フレーム12の表面17全面に絶縁膜を施す。
この状態で第1の接合部21のコンタクト貫通孔25の破断面27と第1のコンタクト31の枠体32の側面37との間に絶縁接着剤を充填して接着させ、第2の接合部22のコンタクト貫通孔26の破断面28と第2のコンタクト41の枠体42の側面47との間に絶縁接着剤を充填して接着させる。
これで、金属性部材で形成されたフレーム12にやはり金属性部材で形成された第1及び第2のコンタクト31、41が電気的に絶縁された状態で取り付けることができる。そして、フレーム12の表面17側にシールドカバー38を被せることでコネクタが完成する。
このように、第3実施形態のフレームには、コンタクトをコンタクト貫通孔の破断面に合わせて絶縁接着剤を充填する、所謂、化学的な接続形態となっているが、これに限定されることなく、コンタクトとフレームを付き合わせる破断面に絶縁を施して、その付き合わせた面にプレス等をかけることで機械的に固定するようにしてもよく、付き合わせる破断面にシリコン樹脂を入れて絶縁性を担保してシリコン樹脂の弾性によって固定しても良い。
The first and second contacts 31 and 41 are assembled and assembled to the frame 12 having such a configuration, and the shield cover 38 is put on to complete the connector.
First, an insulating film is applied to the entire surface 35 of the frame 32 that forms the first contact 31. Similarly, an insulating film is also applied to the entire surface 45 of the frame body 42 forming the second contact 41.
Next, an insulating film is applied to the entire surface 17 of the frame 12.
In this state, an insulating adhesive is filled between the fracture surface 27 of the contact through hole 25 of the first joint portion 21 and the side surface 37 of the frame body 32 of the first contact 31, and the second joint portion is bonded. An insulating adhesive is filled between the fracture surface 28 of the contact through hole 26 of the 22 and the side surface 47 of the frame 42 of the second contact 41 and bonded.
As a result, the first and second contacts 31 and 41, which are also formed of a metallic member, can be attached to the frame 12 formed of the metallic member in an electrically insulated state. Then, the connector is completed by covering the surface 17 side of the frame 12 with the shield cover 38.
As described above, the frame according to the third embodiment has a so-called chemical connection form in which the contact is filled with the insulating adhesive in accordance with the fracture surface of the contact through hole. Alternatively, insulation may be applied to the fractured surface where the contact and frame are attached, and the attached surface may be mechanically fixed by applying a press or the like. It may be secured by the elasticity of silicon resin while ensuring the properties.

金属性部材で構成されるコンタクトをやはり金属性板部材で構成されたフレームに絶縁接合することで、従来の如く樹脂性部材で形成されたフレームと異なり樹脂では限界であった薄型及び薄型に伴い発生する剛性等が確保され、薄型・小型化が容易に達成できるコネクタを提供する。  By connecting the contact made of a metallic member to the frame made of a metal plate member, the resin is different from the conventional frame made of a resinous material. Provided is a connector that can ensure rigidity and the like, and can be easily reduced in thickness and size.

12 フレーム
13 左壁
14 右壁
15 後端壁
16 カード挿入経路
17 表面
18 裏面
21 第1の接合部
22 第2の接合部
23 第1の接合凹部
24 第2の接合凹部
25 コンタクト貫通孔
26 コンタクト貫通孔
27 破断面
28 破断面
31 第1のコンタクト
32 枠体
33 端子部
34 接点部
35 表面
36 裏面
37 側面
38 シールドカバー
41 第2のコンタクト
42 枠体
43 端子部
44 接点部
45 表面
46 裏面
47 側面
51 メモリカード
52 接点
12 Frame 13 Left wall 14 Right wall 15 Rear end wall 16 Card insertion path 17 Front surface 18 Back surface 21 First joint 22 Second joint 23 First joint recess 24 Second joint recess 25 Contact through hole 26 Contact Through hole 27 Fracture surface 28 Fracture surface 31 First contact 32 Frame body 33 Terminal portion 34 Contact portion 35 Front surface 36 Rear surface 37 Side surface 38 Shield cover 41 Second contact 42 Frame body 43 Terminal portion 44 Contact portion 45 Front surface 46 Rear surface 47 Side 51 Memory card 52 Contact

Claims (7)

接点部(34,44)と端子部(33,43)を有する金属性部材で構成されるコンタクト(31,41)と、
コンタクト(31,41)が装着される接合部(21,22)を有する金属性部材で構成されるフレーム(12)とから成るコネクタであって、
接合部(21,22)に装着する部位に塗膜工程により絶縁膜を施したコンタクト(31,41)を絶縁性接着剤によって接合部(21,22)に装着することで、
コンタクト(31,41)をフレーム(12)に電気的に絶縁された状態で取り付ける絶縁接合をしたことを特徴とするコネクタ。
Contacts (31, 41) made of a metallic member having contact portions (34, 44) and terminal portions (33, 43);
A connector comprising a frame (12) made of a metallic member having joints (21, 22) to which contacts (31, 41) are attached,
By attaching the contact (31, 41) with the insulating film applied to the part to be attached to the joint part (21, 22) to the joint part (21, 22) with an insulating adhesive,
A connector characterized in that the contacts (31, 41) are insulated and attached to the frame (12) in an electrically insulated state.
接合部(21,22)に絶縁膜を施したことを特徴とする請求項1記載のコネクタ。The connector according to claim 1, wherein an insulating film is applied to the joint portions (21, 22). 板厚を薄くした接合凹部(23,24)を接合部(21,22)に形成したことを特徴とする請求項1記載のコネクタ。The connector according to claim 1, wherein the joint recesses (23, 24) having a reduced plate thickness are formed in the joints (21, 22). 接合部(21,22)には、コンタクト貫通孔(25,26)を有し、
コンタクト貫通孔(25,26)から接点部(34,44)を臨ませた状態にして、コンタクト(31,41)を、フレーム(12)の裏面(18)に設けられた接合部(21,22)に絶縁接合したことを特徴とする請求項1記載のコネクタ。
The joints (21, 22) have contact through holes (25, 26),
With the contact portions (34, 44) facing the contact through holes (25, 26), the contacts (31, 41) are connected to the joint portions (21, 21) provided on the back surface (18) of the frame (12). The connector according to claim 1, wherein the connector is insulated and joined to 22).
コンタクト(31,41)を、フレーム(12)の表面(17)に設けられた接合部(21,22)に絶縁結合したことを特徴とする請求項1記載のコネクタ。The connector according to claim 1, characterized in that the contacts (31, 41) are insulatively coupled to joints (21, 22) provided on the surface (17) of the frame (12). 接合部(21,22)には、コンタクト(31,41)を収納できる大きさに切り欠いて形成されたコンタクト貫通孔(25,26)を有し、
コンタクト貫通孔(25,26)の破断面と前記コンタクト(31,41)の側面との間に絶縁性接着剤を充填して、
コンタクト(31,41)をフレーム(12)に絶縁接合をしたことを特徴とする請求項1記載のコネクタ。
The joint portions (21, 22) have contact through holes (25, 26) formed by cutting out to a size that can accommodate the contacts (31, 41).
An insulating adhesive is filled between the fracture surface of the contact through hole (25, 26) and the side surface of the contact (31, 41),
2. A connector according to claim 1, wherein the contacts (31, 41) are insulation joined to the frame (12).
接点部(34,44)が臨むフレーム(12)の表面を覆うようにシールドカバー(38)を被せ、シールドカバー(38)とフレーム(12)で形成される空間にメモリカード(51)を挿入するカード挿入経路を形成する請求項1記載のコネクタ。Cover the surface of the frame (12) where the contact portions (34, 44) face to cover the shield cover (38), and insert the memory card (51) into the space formed by the shield cover (38) and the frame (12). The connector according to claim 1, wherein a card insertion path is formed.
JP2011184136A 2011-08-09 2011-08-09 connector Expired - Fee Related JP5360165B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0473872A (en) * 1990-07-16 1992-03-09 Japan Aviation Electron Ind Ltd Tuning fork type contact and manufacture thereof
JPH0590834U (en) * 1992-05-22 1993-12-10 日本航空電子工業株式会社 contact
JP2004221052A (en) * 2002-12-27 2004-08-05 Ngk Insulators Ltd Contact sheet, manufacturing method therefor, and socket
JP2006244841A (en) * 2005-03-03 2006-09-14 Hosiden Corp Jointing method for components of electronic component and electronic component using it
JP2007080693A (en) * 2005-09-14 2007-03-29 Matsushita Electric Works Ltd Memory card holding structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0473872A (en) * 1990-07-16 1992-03-09 Japan Aviation Electron Ind Ltd Tuning fork type contact and manufacture thereof
JPH0590834U (en) * 1992-05-22 1993-12-10 日本航空電子工業株式会社 contact
JP2004221052A (en) * 2002-12-27 2004-08-05 Ngk Insulators Ltd Contact sheet, manufacturing method therefor, and socket
JP2006244841A (en) * 2005-03-03 2006-09-14 Hosiden Corp Jointing method for components of electronic component and electronic component using it
JP2007080693A (en) * 2005-09-14 2007-03-29 Matsushita Electric Works Ltd Memory card holding structure

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