JP2011258814A - Semiconductor device cooler - Google Patents

Semiconductor device cooler Download PDF

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JP2011258814A
JP2011258814A JP2010133092A JP2010133092A JP2011258814A JP 2011258814 A JP2011258814 A JP 2011258814A JP 2010133092 A JP2010133092 A JP 2010133092A JP 2010133092 A JP2010133092 A JP 2010133092A JP 2011258814 A JP2011258814 A JP 2011258814A
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semiconductor device
top plate
sealing resin
device cooler
convex
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JP5593864B2 (en
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Kiyofumi Nakajima
清文 中島
Yoshikazu Suzuki
祥和 鈴木
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Toyota Motor Corp
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Toyota Motor Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device cooler which can enhance moisture resistance of an insulation layer and adhesion of a sealing resin.SOLUTION: The semiconductor device cooler 1 comprises a top plate 12 having a top face 12a on which a semiconductor chip 11 is stacked with an insulation sheet 13 interposed therebetween, and an undersurface 12b which serves as a cooling medium contact surface. Both a protrusion 4 and a recess 5 are formed at an edge 3 touching a sealing resin 18 in a predetermined section D. Consequently, a semiconductor module 10 has both the protrusion 4 and recess 5 on an intrusion route of moisture and humidity intruding into the insulation sheet 13 from the outside, i.e. a route from the boundary B of the top plate 12 and the sealing resin 18 to the insulation sheet 13. Consequently, the intrusion route is elongated suitably and contact area of the top plate 12 and the sealing resin 18 increases.

Description

本発明は、半導体装置を冷却するための半導体装置冷却器に関する。   The present invention relates to a semiconductor device cooler for cooling a semiconductor device.

従来の半導体装置冷却器としては、例えば特許文献１に記載されているように、半導体チップが放熱基板の表面に積層され、封止樹脂が放熱基板の表面及び側面を覆うように設けられているものが知られている。このような半導体装置冷却器では、放熱基板の表面において対向する２辺に沿って突起を設けることで、封止樹脂の剥離を防止することが図られている。   As a conventional semiconductor device cooler, for example, as described in Patent Document 1, a semiconductor chip is stacked on the surface of a heat dissipation substrate, and a sealing resin is provided so as to cover the surface and side surfaces of the heat dissipation substrate. Things are known. In such a semiconductor device cooler, it is intended to prevent peeling of the sealing resin by providing protrusions along two opposing sides on the surface of the heat dissipation substrate.

特開２００２−９２２０号公報Japanese Patent Laid-Open No. 2002-9220

ここで、上述したような半導体装置冷却器では、半導体装置が絶縁層を介して積層される一主面及び冷媒接触面とされる他主面を有する天板に、半導体装置及び絶縁層を封止するよう封止樹脂が設けられている場合がある。この場合、例えば半導体装置の信頼性を高めるべく、絶縁層の耐湿性及び封止樹脂の密着性を向上することが望まれている。   Here, in the semiconductor device cooler as described above, the semiconductor device and the insulating layer are sealed on the top plate having one main surface on which the semiconductor device is stacked via the insulating layer and the other main surface serving as the coolant contact surface. A sealing resin may be provided to stop. In this case, for example, in order to increase the reliability of the semiconductor device, it is desired to improve the moisture resistance of the insulating layer and the adhesion of the sealing resin.

そこで、本発明は、絶縁層の耐湿性及び封止樹脂の密着性を向上することができる半導体装置冷却器を提供することを課題とする。   Then, this invention makes it a subject to provide the semiconductor device cooler which can improve the moisture resistance of an insulating layer, and the adhesiveness of sealing resin.

上記課題を解決するため、本発明に係る半導体装置冷却器は、半導体装置を冷却するための半導体装置冷却器であって、半導体装置が絶縁層を介して積層される一主面、及び冷媒接触面とされる他主面を有する天板を備え、天板には、半導体装置及び絶縁層を封止するように封止樹脂が設けられており、天板は、該天板の厚さ方向に沿う所定断面において封止樹脂と接触する縁部に、凸部及び凹部の双方を有することを特徴とする。   In order to solve the above problems, a semiconductor device cooler according to the present invention is a semiconductor device cooler for cooling a semiconductor device, wherein one main surface on which the semiconductor device is stacked via an insulating layer, and a refrigerant contact A top plate having another main surface as a surface, and the top plate is provided with a sealing resin so as to seal the semiconductor device and the insulating layer, and the top plate has a thickness direction of the top plate. It has both the convex part and the recessed part in the edge part which contacts sealing resin in the predetermined cross section in alignment.

この半導体装置冷却器においては、水分や湿気が絶縁層に侵入する侵入経路上、つまり、天板と封止樹脂との境界から絶縁層に至るまでの経路上に、凸部及び凹部の両方を有することとなる。よって、侵入経路が好適に長くなり、絶縁層の耐湿性を向上することができる。また、このような凸部及び凹部によって、天板と封止樹脂との接触面積を増大させることができ、封止樹脂の密着性を向上することが可能となる。   In this semiconductor device cooler, both protrusions and recesses are formed on the intrusion path through which moisture and moisture enter the insulating layer, that is, on the path from the boundary between the top plate and the sealing resin to the insulating layer. Will have. Therefore, the intrusion path is suitably lengthened, and the moisture resistance of the insulating layer can be improved. Moreover, such a convex part and a recessed part can increase the contact area of a top plate and sealing resin, and it becomes possible to improve the adhesiveness of sealing resin.

また、凸部及び凹部の少なくとも一方は、所定断面視で山型形状となるように形成されていることが好ましい。この場合、凸部及び凹部の少なくとも一方の周辺に封止樹脂が回り込み易くなり、封止樹脂にボイド（気泡）が発生するのを抑制することができる。   Moreover, it is preferable that at least one of a convex part and a recessed part is formed so that it may become a mountain shape by predetermined cross-sectional view. In this case, the sealing resin easily goes around at least one of the convex portion and the concave portion, and generation of voids (bubbles) in the sealing resin can be suppressed.

本発明によれば、絶縁層の耐湿性及び封止樹脂の密着性を向上することが可能となる。   According to the present invention, it is possible to improve the moisture resistance of the insulating layer and the adhesion of the sealing resin.

本発明の第１実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。1 is a schematic cross-sectional view showing a semiconductor module including a semiconductor device cooler according to a first embodiment of the present invention. 他の例に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。It is a schematic sectional drawing which shows the semiconductor module containing the semiconductor device cooler which concerns on another example. さらに他の例に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。It is a schematic sectional drawing which shows the semiconductor module containing the semiconductor device cooler which concerns on another example. 本発明の第２実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。It is a schematic sectional drawing which shows the semiconductor module containing the semiconductor device cooler which concerns on 2nd Embodiment of this invention. 本発明の第３実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。It is a schematic sectional drawing which shows the semiconductor module containing the semiconductor device cooler which concerns on 3rd Embodiment of this invention.

以下、添付図面を参照して、本発明の好適な実施形態について詳細に説明する。なお、以下の説明において、同一又は相当要素には同一符号を付し、重複する説明を省略する。また、「上」「下」の語は、図面の上下方向に対応するものであり便宜的なものである。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted. The terms “upper” and “lower” correspond to the vertical direction of the drawing and are for convenience.

まず、本発明の第１実施形態について説明する。図１は、本発明の第１実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。図１に示すように、本実施形態の半導体モジュール１０は、半導体チップ（半導体装置）１１を冷却するための半導体装置冷却器１を具備し、半導体装置冷却器１は、天板１２を備えている。   First, a first embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing a semiconductor module including a semiconductor device cooler according to a first embodiment of the present invention. As shown in FIG. 1, the semiconductor module 10 of the present embodiment includes a semiconductor device cooler 1 for cooling a semiconductor chip (semiconductor device) 11, and the semiconductor device cooler 1 includes a top plate 12. Yes.

天板１２は、その上面（一主面）１２ａの中央部に、絶縁シート１３が貼り付けられて積層される積層領域Ｒを有している。天板１２の積層領域Ｒを含む積層部１２ｘ（積層領域Ｒの直下部分）の厚さＬは、所定厚さ（例えば、２ｍｍ）以上とされている。これは、天板１２が絶縁シート１３の貼付け応力に耐久でき、且つ天板１２の過渡熱抵抗を低減させるためである。また、天板１２の下面（他主面）１２ｂは、複数のフィンＦを有している。つまり、下面１２ｂは、冷媒接触面となっており、例えば冷媒としての空気が下面１２ｂに接触する。   The top plate 12 has a laminated region R in which the insulating sheet 13 is attached and laminated at the center of the upper surface (one main surface) 12a. A thickness L of the laminated portion 12x (a portion immediately below the laminated region R) including the laminated region R of the top plate 12 is set to a predetermined thickness (for example, 2 mm) or more. This is because the top plate 12 can endure the application stress of the insulating sheet 13 and reduce the transient thermal resistance of the top plate 12. Further, the lower surface (other main surface) 12 b of the top plate 12 has a plurality of fins F. That is, the lower surface 12b is a refrigerant contact surface, for example, air as a refrigerant contacts the lower surface 12b.

絶縁シート（絶縁層）１３は、例えばエポキシ樹脂で形成された矩形状のシート体であって、絶縁性を有している。この絶縁シート１３の上面１３ａの一部には、金属板１４が積層されて固定されている。金属板１４は、例えば銅で形成され、半導体チップ１１の熱を拡散させると共に熱抵抗の低下を図るヒートスプレッダとして機能する。この金属板１４の上面１４ａの一部には、はんだ１５を介して上記半導体チップ１１が積層されて固定されている。半導体チップ１１は、ボンディングワイヤ１６によってリード１７に電気的に接続されている。   The insulating sheet (insulating layer) 13 is a rectangular sheet formed of, for example, an epoxy resin, and has an insulating property. A metal plate 14 is laminated and fixed on a part of the upper surface 13 a of the insulating sheet 13. The metal plate 14 is formed of copper, for example, and functions as a heat spreader that diffuses the heat of the semiconductor chip 11 and reduces the thermal resistance. The semiconductor chip 11 is laminated and fixed to a part of the upper surface 14 a of the metal plate 14 with solder 15 interposed therebetween. The semiconductor chip 11 is electrically connected to the leads 17 by bonding wires 16.

また、天板１２の上面１２ａ側には、半導体チップ１１、絶縁シート１３、金属板１４、ボンディングワイヤ１６及びリード１７を封止するように封止樹脂１８が設けられている。ここでの封止樹脂１８としては、モールド樹脂が用いられている。なお、封止樹脂１８として、例えばポッティング樹脂等を用いることもできる。   A sealing resin 18 is provided on the top surface 12 a side of the top plate 12 so as to seal the semiconductor chip 11, the insulating sheet 13, the metal plate 14, the bonding wires 16, and the leads 17. As the sealing resin 18 here, a mold resin is used. As the sealing resin 18, for example, a potting resin can be used.

ここで、本実施形態の天板１２は、その厚さ方向に沿う所定断面Ｄにおいて封止樹脂１８と接触する縁部３の上面１２ａ側に、凸部４と、該凸部４に対し面方向（上面１２ａに沿う方向）内側に隣接する凹部５との双方を有している。換言すると、上面１２ａは、その最外周位置から積層領域Ｒを結ぶ直線分中に、凸部４及び凹部５の両方をこの順に備えている。   Here, the top plate 12 of the present embodiment has a convex portion 4 on the side of the upper surface 12a of the edge portion 3 that contacts the sealing resin 18 in a predetermined cross section D along the thickness direction, and a surface with respect to the convex portion 4 It has both the recessed part 5 adjacent to a direction (direction along the upper surface 12a) inner side. In other words, the upper surface 12a includes both the convex portion 4 and the concave portion 5 in this order in a straight line connecting the laminated region R from the outermost peripheral position.

凸部４は、所定断面Ｄ視にて上方に山型に突出するように形成されており、平坦な頂部４ｘと、該頂部４ｘの両端に連続し裾広がりになるよう傾斜する側部４ｙと、を含んで構成されている。また、凹部５は、所定断面Ｄ視にて下方に山型に窪むように形成されており、平坦な底部５ｘと、該底部５ｘの両端に連続し裾広がりになるよう傾斜する側部５ｙと、を含んで構成されている。また、これら凸部４及び凹部５は、側部４ｙ，５ｙが互いに連続するように形成されている。   The convex portion 4 is formed so as to protrude in a mountain shape upward as viewed in the predetermined cross section D, and has a flat top portion 4x and side portions 4y that are continuous to both ends of the top portion 4x and incline so as to widen the bottom. , Including. The concave portion 5 is formed so as to be depressed in a mountain shape downward as viewed in the predetermined cross section D, and has a flat bottom portion 5x, and side portions 5y that are inclined so as to be continuous and spread at both ends of the bottom portion 5x, It is comprised including. Moreover, these convex part 4 and the recessed part 5 are formed so that the side parts 4y and 5y may mutually continue.

この凸部４は、好ましいとして、積層部１２ｘの上面１２ａよりも厚さＬの略１／４以上の突出高さを有しており、ここでは、略１／３以上の突出高さを有している。さらにまた、凹部５は、好ましいとして、積層部１２ｘの上面１２ａよりも厚さＬの略１／４以上の深さを有しており、ここでは、略１／３以上の深さを有している。なお、上面１２ａ視では、凸部４は、積層領域Ｒを囲むよう枠状に延びる凸条を構成し、凹部５は、凸条の内側で積層領域Ｒを囲むよう枠状に延びる溝を構成している。   The protrusion 4 preferably has a protruding height of about 1/4 or more of the thickness L of the upper surface 12a of the laminated portion 12x, and here has a protruding height of about 1/3 or more. is doing. Furthermore, the concave portion 5 preferably has a depth of about 1/4 or more of the thickness L than the upper surface 12a of the laminated portion 12x, and here has a depth of about 1/3 or more. ing. When viewed from the top surface 12a, the convex portion 4 constitutes a ridge extending in a frame shape so as to surround the laminated region R, and the concave portion 5 constitutes a groove extending in a frame shape so as to surround the laminated region R inside the ridge. is doing.

以上、本実施形態の天板１２では、上面１２ａに半導体チップ１１が絶縁シート１３を介して積層されると共に、下面１２ｂが冷媒接触面とされ、そして、所定断面Ｄにおいて封止樹脂１８と接触する縁部３に凸部４及び凹部５の双方が形成される。よって、本実施形態の半導体モジュール１０にあっては、水分や湿気が外部から絶縁シート１３に侵入する侵入経路上、つまり、天板１２と封止樹脂１８との境界Ｂから絶縁シート１３に至るまでの経路上に、凸部４及び凹部５の両方を有することとなる。その結果、侵入経路が好適に長くなり、絶縁シート１３の耐湿性を向上することができる。   As described above, in the top plate 12 of the present embodiment, the semiconductor chip 11 is laminated on the upper surface 12a via the insulating sheet 13, the lower surface 12b is a coolant contact surface, and is in contact with the sealing resin 18 in the predetermined cross section D. Both the convex part 4 and the recessed part 5 are formed in the edge part 3 to perform. Therefore, in the semiconductor module 10 of the present embodiment, the moisture and moisture enter the insulating sheet 13 from the outside, that is, from the boundary B between the top plate 12 and the sealing resin 18 to the insulating sheet 13. It will have both the convex part 4 and the recessed part 5 on the path | route to. As a result, the intrusion path is suitably lengthened, and the moisture resistance of the insulating sheet 13 can be improved.

また、このような凸部４及び凹部５によって、天板１２と封止樹脂１８との接触面積が増大するため、封止樹脂１８の密着性を向上することが可能となり、ひいては、アンカー効果を高めることができる。加えて、例えば温度変化等に起因して絶縁シート１３に発生するせん断方向応力を、凸部４及び凹部５によって分散させて低減させることが可能となる。   Moreover, since the contact area of the top plate 12 and the sealing resin 18 is increased by the convex portions 4 and the concave portions 5 as described above, the adhesion of the sealing resin 18 can be improved. Can be increased. In addition, for example, the shear direction stress generated in the insulating sheet 13 due to a temperature change or the like can be dispersed by the convex portions 4 and the concave portions 5 to be reduced.

すなわち、本実施形態においては、天板１２に積極的に凹凸をつけることで絶縁シート１３の吸湿を防ぐと共に該絶縁シート１３の封止樹脂１８に対する密着性を高めることができ、これと同時に、絶縁シート１３に加わる応力の低減が可能となる。その結果、信頼性の高い半導体モジュールを提供することが可能となる。   That is, in the present embodiment, the top plate 12 can be positively uneven to prevent moisture absorption of the insulating sheet 13 and to improve the adhesion of the insulating sheet 13 to the sealing resin 18. The stress applied to the insulating sheet 13 can be reduced. As a result, a highly reliable semiconductor module can be provided.

また、本実施形態では、上述したように、凸部４及び凹部５が所定断面Ｄ視で山型形状となるよう形成されているため、これら凸部４及び凹部５の周辺に封止樹脂１８が回り込み易くなり、封止樹脂１８にボイド（気泡）が発生するのを抑制することができる。   In the present embodiment, as described above, since the convex portion 4 and the concave portion 5 are formed to have a mountain shape in the predetermined cross section D, the sealing resin 18 is formed around the convex portion 4 and the concave portion 5. It becomes easy to wrap around and it is possible to suppress the generation of voids (bubbles) in the sealing resin 18.

また、一般的に、絶縁シート１３を用いた構造では、絶縁シート１３への応力増加及び絶縁シート１３の吸湿増加によって、絶縁シート１３の破壊及び絶縁信頼性（イオンマイグレーション等）の低下が懸念され、また、近年のモジュールの小型化要求のために絶縁に必要な面積割合が大きくなっていることから、信頼性の低下が問題とされている。よって、信頼性の高い半導体モジュールを提供できる本実施形態は、特に有効なものであるといえる。   In general, in the structure using the insulating sheet 13, there is a concern that the insulating sheet 13 is broken and the insulation reliability (such as ion migration) is reduced due to an increase in stress on the insulating sheet 13 and an increase in moisture absorption of the insulating sheet 13. In addition, since the area ratio necessary for insulation is increasing due to the recent demand for miniaturization of modules, reduction in reliability is a problem. Therefore, it can be said that this embodiment that can provide a highly reliable semiconductor module is particularly effective.

なお、本発明の凸部及び凹部の形状は、上述した本実施形態の凸部４及び凹部５の形状に限定されるものではなく、種々の形状としてもよい。例えば、図２に示すように、所定断面Ｄ視において、凸部４が、上方に矩形状の突出するように形成され、その頂部４ｘ及び側部４ｙが直交するようになっていてもよく、また、凹部５が、下方に矩形状に窪むように形成され、その底部５ｘ及び側部５ｙが直交するようになっていてもよい。   In addition, the shape of the convex part and recessed part of this invention is not limited to the shape of the convex part 4 and recessed part 5 of this embodiment mentioned above, It is good also as various shapes. For example, as shown in FIG. 2, in the predetermined section D view, the convex portion 4 may be formed so as to protrude upward in a rectangular shape, and the top portion 4x and the side portion 4y may be orthogonal to each other, Moreover, the recessed part 5 may be formed so that it may dent in the rectangular shape below, and the bottom part 5x and the side part 5y may be orthogonally crossed.

また、本発明では、図３に示すように、天板１２の下面１２ｂにハウジング１９が設けられ、冷媒としての冷却水Ｗが下面１２ｂに接触するよう構成されていてもよい。この場合、冷却水Ｗの水圧等で絶縁シート１３に加わる上下方向の応力をも、凸部４及び凹部５によって低減することができる。   Moreover, in this invention, as shown in FIG. 3, the housing 19 is provided in the lower surface 12b of the top plate 12, and the cooling water W as a refrigerant | coolant may be comprised so that the lower surface 12b may contact. In this case, the stress in the vertical direction applied to the insulating sheet 13 by the water pressure of the cooling water W can also be reduced by the convex portions 4 and the concave portions 5.

次に、本発明の第２実施形態について説明する。図４は、本発明の第２実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。図４に示すように、本実施形態の半導体モジュール２０にあっては、天板２５を備える半導体装置冷却器２１を具備する点で、上記第１実施形態と異なっている。天板２５では、所定断面Ｄ視で下面２５ｂ側に凸部２２及び凹部２３，２４がさらに形成されている。   Next, a second embodiment of the present invention will be described. FIG. 4 is a schematic sectional view showing a semiconductor module including a semiconductor device cooler according to the second embodiment of the present invention. As shown in FIG. 4, the semiconductor module 20 of the present embodiment is different from the first embodiment in that it includes a semiconductor device cooler 21 including a top plate 25. In the top plate 25, a convex portion 22 and concave portions 23, 24 are further formed on the lower surface 25b side in the predetermined section D view.

具体的には、この天板２５は、その厚さ方向に沿う所定断面Ｄにおいて封止樹脂１８と接触する縁部３の下面２５ｂ側に、凸部２２及び凹部２３，２４をさらに有している。凹部２３は、凸部２２に対し面方向内側に隣接し、凹部２３は、凸部２２に対し面方向外側に隣接している。   Specifically, the top plate 25 further includes a convex portion 22 and concave portions 23 and 24 on the lower surface 25b side of the edge portion 3 that contacts the sealing resin 18 in a predetermined cross section D along the thickness direction thereof. Yes. The concave portion 23 is adjacent to the convex portion 22 on the inner side in the plane direction, and the concave portion 23 is adjacent to the convex portion 22 on the outer side in the plane direction.

以上、本実施形態においても、絶縁シート１３の耐湿性及び封止樹脂１８の密着性を向上するという上記効果と同様な効果を奏する。さらに、本実施形態は、所定断面Ｄ視で天板２５の下面２５ｂ側に凸部２２及び凹部２３，２４をさらに有するため、かかる効果は顕著となる。   As mentioned above, also in this embodiment, there exists an effect similar to the said effect of improving the moisture resistance of the insulating sheet 13, and the adhesiveness of the sealing resin 18. FIG. Furthermore, since this embodiment further has the convex part 22 and the recessed parts 23 and 24 in the lower surface 25b side of the top plate 25 by the predetermined cross section D view, this effect becomes remarkable.

次に、本発明の第３実施形態について説明する。図５は、本発明の第３実施形態に係る半導体装置冷却器を含む半導体モジュール示す概略断面図である。図５に示すように、本実施形態の半導体モジュール３０にあっては、天板３４を備える半導体装置冷却器３１を具備する点で、上記第１実施形態と異なっている。天板３４では、所定断面Ｄ視で側面３４ｃ側に凸部３２及び凹部３３がさらに形成されている。   Next, a third embodiment of the present invention will be described. FIG. 5 is a schematic cross-sectional view showing a semiconductor module including a semiconductor device cooler according to a third embodiment of the present invention. As shown in FIG. 5, the semiconductor module 30 of the present embodiment is different from the first embodiment in that it includes a semiconductor device cooler 31 including a top plate 34. In the top plate 34, a convex portion 32 and a concave portion 33 are further formed on the side surface 34c side in the predetermined section D view.

具体的には、この天板３４は、その厚さ方向に沿う所定断面Ｄにおいて封止樹脂１８と接触する縁部３の側面３４ｃ側に、凸部３２と凹部３３とをさらに有している。凸部３２は凹部３３に対し上方（凹部３３は凸部３２に対し下方）に位置している。   Specifically, the top plate 34 further includes a convex portion 32 and a concave portion 33 on the side surface 34c side of the edge portion 3 that contacts the sealing resin 18 in a predetermined cross section D along the thickness direction thereof. . The convex portion 32 is located above the concave portion 33 (the concave portion 33 is below the convex portion 32).

以上、本実施形態においても、絶縁シート１３の耐湿性及び封止樹脂１８の密着性を向上するという上記効果と同様な効果を奏する。さらに、本実施形態は、所定断面Ｄ視で天板３４の側面３４ｃ側に凸部３２及び凹部３３をさらに有するため、かかる効果は顕著となる。   As mentioned above, also in this embodiment, there exists an effect similar to the said effect of improving the moisture resistance of the insulating sheet 13, and the adhesiveness of the sealing resin 18. FIG. Furthermore, since the present embodiment further includes the convex portion 32 and the concave portion 33 on the side surface 34c side of the top plate 34 in the predetermined cross section D, such an effect becomes remarkable.

以上、本発明の好適な実施形態について説明したが、本発明に係る半導体装置冷却器は、実施形態に係る上記半導体装置冷却器１，２１，３１に限られるものではなく、各請求項に記載した要旨を変更しない範囲で変形し、又は他のものに適用したものであってもよい。   Although the preferred embodiments of the present invention have been described above, the semiconductor device cooler according to the present invention is not limited to the semiconductor device coolers 1, 21, and 31 according to the embodiments, and is described in each claim. It may be modified without changing the gist, or applied to other things.

例えば、上記第２実施形態は、所定断面Ｄ視で天板２５の上面２５ａ側に凸部４及び凹部５を有すると共に、下面２５ｂ側に凸部２２及び凹部２３，２４を有しているが、上面側のみ又は下面側のみに凸部及び凹部を有していてもよい。また、上記第３実施形態は、所定断面Ｄ視で天板３４の上面３４ａ側に凸部４及び凹部５を有すると共に、側面３４ｃ側に凸部３２及び凹部３３を有しているが、上面側のみ又は側面側のみに凸部及び凹部を有していてもよい。さらに、天板の上面側、下面側及び側面側の全てに凸部及び凹部を有していてもよい。   For example, the second embodiment has the convex portion 4 and the concave portion 5 on the upper surface 25a side of the top plate 25 and the convex portion 22 and the concave portions 23 and 24 on the lower surface 25b side in the predetermined section D view. The convex portion and the concave portion may be provided only on the upper surface side or only on the lower surface side. In addition, the third embodiment has the convex portion 4 and the concave portion 5 on the upper surface 34a side of the top plate 34 and the convex portion 32 and the concave portion 33 on the side surface 34c side in the predetermined section D, but the upper surface 34 You may have a convex part and a recessed part only in the side or the side surface side. Furthermore, you may have a convex part and a recessed part in all the upper surface side of a top plate, a lower surface side, and a side surface side.

１，２１，３１…半導体装置冷却器、３…縁部、４…凸部、５…凹部、１１…半導体チップ（半導体装置）、１２…天板、１２ａ…上面（一主面）、１２ｂ…下面（他主面）、１３…絶縁シート（絶縁層）、１８…封止樹脂、Ｄ…所定断面。   DESCRIPTION OF SYMBOLS 1, 21, 31 ... Semiconductor device cooler, 3 ... Edge part, 4 ... Convex part, 5 ... Concave part, 11 ... Semiconductor chip (semiconductor device), 12 ... Top plate, 12a ... Upper surface (one main surface), 12b ... Lower surface (other main surface), 13 ... insulating sheet (insulating layer), 18 ... sealing resin, D ... predetermined cross section.

Claims (2)

半導体装置を冷却するための半導体装置冷却器であって、
前記半導体装置が絶縁層を介して積層される一主面、及び冷媒接触面とされる他主面を有する天板を備え、
前記天板には、前記半導体装置及び前記絶縁層を封止するように封止樹脂が設けられており、
前記天板は、該天板の厚さ方向に沿う所定断面において前記封止樹脂と接触する縁部に、凸部及び凹部の双方を有することを特徴とする半導体装置冷却器。 A semiconductor device cooler for cooling a semiconductor device,
A top plate having one main surface on which the semiconductor device is laminated via an insulating layer and another main surface which is a refrigerant contact surface;
The top plate is provided with a sealing resin so as to seal the semiconductor device and the insulating layer,
The said top plate has both a convex part and a recessed part in the edge part which contacts the said sealing resin in the predetermined cross section along the thickness direction of this top plate, The semiconductor device cooler characterized by the above-mentioned. 前記凸部及び前記凹部の少なくとも一方は、前記所定断面視で山型形状となるように形成されていることを特徴とする請求項１記載の半導体装置冷却器。   The semiconductor device cooler according to claim 1, wherein at least one of the convex portion and the concave portion is formed to have a mountain shape in the predetermined cross-sectional view.
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