JP2011258724A - Wiring apparatus and wiring method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring apparatus which can supply wiring faster, and provide a wiring method using the wiring apparatus.SOLUTION: A wiring apparatus 1 comprises a head for supplying a conductive wire 4 on a base material 2 placed on a movable table 3. The head includes a first head part 5 which is provided so that it can be rotated around a predetermined axis by a first rotating mechanism 10, and a second head part 6 which supports the first head part 5 and is provided so that it can be rotated around a predetermined axis by a second rotating mechanism 7.

Description

  The present invention relates to a wiring device and a wiring method using the same.

2. Description of the Related Art Conventionally, a wiring device is used when a linear conductor is wired on a surface of a base material along a predetermined wiring pattern to manufacture a transformer, a coil, or the like, or to perform electrical wiring to a circuit board or the like. (For example, see Patent Document 1).

  As shown in FIG. 6, the wiring device 101 described in Patent Document 1 includes a rotation mechanism 103 provided in a head mounting portion 102 that is movable in the Y-axis direction, a head portion 104 that is rotated by the rotation mechanism 103, and an adhesive. An insulating substrate with an agent can be attached, and an X-axis moving table 105 that moves in parallel in the X-axis direction opposite to the wiring direction is provided.

JP 2002-344112 A

  However, in the wiring device 101 described in Patent Document 1, when the wiring is provided from a straight line to a corner at a high speed, the head portion 104 is heavy, so that the moment of inertia increases and the rotation speed decreases. As a result, it was difficult to provide the wiring at high speed.

  Therefore, an object of the present invention is to provide a wiring device capable of providing wiring at a higher speed and a wiring method using the wiring device.

  In order to achieve the above object, a wiring device of the present invention is a wiring device having a head for providing a conductive wire on a substrate placed on a movable table, wherein the head is a first device. A first head portion rotatably provided about a predetermined axis by a rotation mechanism, and a second head provided to support the first head portion and to be rotatable about a predetermined axis by a second rotation mechanism Part.

  Further, the wiring method of the present invention is a method of providing a wiring pattern in the wiring device according to claim 1, wherein when the linear pattern is provided, the first and second head portions are arranged with respect to the rotating shaft. When the wiring is provided in a fixed state and a curved pattern is provided, the second head portion rotates along the curved pattern, and the first head portion rotates behind the second head portion while rotating. It is characterized by providing a line.

  In this invention, the wiring apparatus which can provide wiring at higher speed, and the wiring method using the same are provided.

Schematic which shows the wiring apparatus which concerns on embodiment of this invention. Sectional drawing of the wiring apparatus which follows the AA line of FIG. The top view which shows the wiring apparatus which concerns on embodiment of this invention. The figure which shows the motion of the head of the wiring apparatus which concerns on embodiment of this invention. The figure which shows the conducting wire on the base material which concerns on embodiment of this invention. The figure which shows the conventional wiring apparatus.

  Hereinafter, a wiring device according to an embodiment of the present invention and a wiring method using the same will be described in detail with reference to the drawings.

  First, the wiring apparatus will be described with reference to FIGS. 1, 2, and 3. The wiring apparatus 1 has a base 2 mounted thereon, a table 3 that can move in the Y-axis direction, a table 3 that can move in the Z-axis direction, and a first rotating mechanism 10 that rotates in the θ direction with respect to a predetermined axis. The first head portion 5 is provided so as to be movable and supported in a X-axis direction by a first head portion 5 for supplying and joining the conductive wire 4 on the substrate 2 and a base (not shown). The second head portion 6 is held so as to be movable in the direction, and is rotatably provided in the θ direction with respect to a predetermined axis. The second rotation is supported by the base and rotates the second head portion 6 in the θ direction. And a mechanism 7. The predetermined axis means an axis that can apply a force in the vertical direction on the substrate 2.

  The first head unit 5 is first provided with an ultrasonic oscillator 8. The ultrasonic transmitter 8 includes a horn 8a that adheres the conductive wire 4 to the substrate 2 while applying ultrasonic vibration to the supplied conductive wire 4, an ultrasonic oscillating unit 8b that applies ultrasonic waves to the horn 8a, and It has a sheath 8c that protects the horn 8a. Note that the horn 8a used here is provided with a V-shaped notch portion in accordance with the angle and thickness at which the lead wire 4 is supplied so that the lead wire 4 is not damaged.

  Further, the first head portion 5 is connected to bearings B1 and B2 that enable the ultrasonic oscillator 8 to rotate in the θ-axis direction and a sheath portion 8c of the ultrasonic oscillator 8, and simultaneously with the ultrasonic oscillator 8 in the θ direction. A first plate 11 that is rotatable, a first guide 12 that is provided on the first plate 11 and guides the supplied conductive wire 4 in the direction of the joint point, and a cylindrical nozzle 13 are provided.

  The first guide portion 12 is provided with a motor (not shown) for sending the lead wire 4 at a desired speed. When the lead wire 4 is sent, the first guide 12 and the opposing surface of the first guide 12 The conducting wire 4 is sandwiched and sent out by a pressing roller (not shown).

  First, the second head unit 6 is provided on the second plate 14, the second plate 14, a guide rail 15 for moving the first head unit 5 in the Z-axis direction, and an ultrasonic transmitter 8. A base plate 9 that is supported via bearings B1 and B2, a guide portion 16 that holds the base plate 9 and is movable on the guide rail 15, and a part of the base plate 9 that is fixed to the ultrasonic oscillator 8 And a first rotation mechanism 10 that rotates in the θ direction with respect to the axis. When providing the conducting wire 4, the base plate 9 is moved in the −Z direction by a driving mechanism (not shown), and the conducting wire 4 is bonded to the base material 2 while being pressed by the horn 8 a.

  The first rotating machine term 10 includes a first motor 10 a fixed to the base plate 9, and a first pulley 10 b provided on the first motor 10 a and a sheath 8 c provided on the ultrasonic oscillator 8. The ultrasonic oscillator 8 is rotated via the first timing belt 10d fitted into the two pulleys 10c.

  As described above, by enabling the ultrasonic transmitter 8 to rotate in the θ direction with respect to a predetermined axis by the first rotating mechanism 10, the moment of inertia in rotation can be reduced. Therefore, the first motor 10a can be reduced in size and weight, and as a result, the first head portion 5 can be reduced in weight.

  The first rotating machine item 10 can rotate the first head unit 5 up to 90 ° ± 10 °, for example, when the rotation angle of the second head unit 6 is 0 degree, and the second rotating machine item 7 It is controlled independently to be different from the rotation.

  The second head portion 6 is connected to a second guide 17 provided on the second plate 14 and sending the lead 4 to the first guide 12, and an end side 14a of the second plate 14. It has a cylindrical connecting portion 18 that is rotated in the θ direction by the two-rotor term 7. In addition, the conducting wire 4 sent to the 2nd guide 17 is supplied through the inside of the connection part 18. As shown in FIG.

  The second rotating machine term 7 includes a second motor 7 a fixed to the base, a third pulley 7 b provided in the second motor 7 a, and a second portion provided in the connection portion 18 of the second head portion 6. The second head unit 6 is swung through the second timing belt 7d fitted into the four pulleys 7c.

  Next, the wiring method using the wiring apparatus 1 is demonstrated with reference to FIG. 4 and FIG.

  First, the base material 2 is provided on the table 3 that is movable in the Y-axis direction, and then the conducting wire 4 provided with the adhesive is fixed by the wiring device 1.

  As shown in FIG. 4, the movement of the wiring apparatus 1 is such that, for example, a substantially annular rectangle having a curve with a corner radius of about 5 mm is wound while being drawn at a speed of about 100 mm / sec on a straight line. Conductive wires 4 are provided. In addition, the figure of the wiring apparatus 1 of FIG. 4 is abbreviate | omitted and it has shown so that the motion of the 1st board 11 and the 2nd board 14 can be understood.

  More specifically, for example, the wiring device 1 is first arranged in a substantially circular rectangular straight portion a having a curved corner, and proceeds in the direction of the arrow.

  At this time, the wiring apparatus 1 does not move in the X direction, and the first plate 11 and the second plate 14 are provided with the conductive wires 4 while having a parallel relationship, and the base material 2 is placed. The table 3 rotates in the Y direction.

  And it reaches the corner part b and proceeds to the straight line part c through the corner part b.

  When the corner part b is reached, the wiring device 1 starts moving in the X direction, and the first plate 11 is rotated together with the ultrasonic oscillator 8 at a rotational speed of about 191 rpm to provide a conductive wire 4, The second plate 14 turns about 90 degrees at a rotational speed of about 8 rpm by the second rotating machine term 7. Further, the table 3 rotates in the Y-axis direction until the conductive wire 4 is provided on the straight line portion c.

  When proceeding to the straight portion c through the corner portion b, the wiring device 1 moves in the X direction, and the second plate 14 turns with a delay, so the first portion on the straight portion c after a predetermined time. The same trajectory as the plate 11, that is, the first and second plates 11 and 14 move while having a relationship of being parallel to each other. The table 3 is stopped without rotating in the Y direction.

  Then, it reaches the corner part d and proceeds to the straight part e through the corner part d.

  When reaching the corner portion d, the wiring device 1 moves in the X direction, and the first plate 11 turns about 90 degrees at the same rotational speed to provide the lead wire 4 as in the corner portion b, The second plate 14 turns about 90 degrees at the same rotational speed by the second rotating machine term 7 in the same manner as the locus. Further, the table 3 starts to rotate in the −Y axis direction.

  When proceeding to the straight part e through the corner part d, the wiring device 1 does not move, and the second plate 14 is moved to the first and second parts on the straight part e after a predetermined time, as in the case of the straight part c. The conducting wires 4 are provided while the second plates 11 and 14 have a relationship of being parallel to each other. The table 3 rotates in the −Y direction.

  Then, it reaches the corner part f, proceeds to the straight line part g through the corner part f, and further proceeds in order through the corner part h and the straight line part a ′.

  When the corner portion f is reached, the wiring device 1 starts to move in the −X direction, and the first plate 11 turns about 90 degrees at the same rotational speed as in the corner portion b, and is the same as the locus. The second plate 14 turns about 90 degrees at the same rotational speed according to the second rotating machine term 7. Further, the table 3 rotates in the −Y-axis direction until the conductive wire 4 starts to be provided on the straight part g.

  When the straight line portion g is provided, the wiring device 1 moves in the −X direction, and the second plate 14 moves on the straight line portion g after a predetermined time in the same manner as in the straight line portion c. The conducting wires 4 are provided while the relationships 11 and 14 are parallel to each other. Further, the table 3 is stopped without rotating.

  When the corner part h is reached, the wiring device 1 moves in the −X direction, and the first plate 11 turns about 90 degrees at the same rotational speed as in the case of the corner part b. Moving in the same way, the second plate 14 turns about 90 degrees at the same rotational speed according to the second rotating machine term 7. Further, the table 3 starts to rotate in the Y axis direction.

  When the straight portion a ′ is provided, the wiring device 1 does not move, and the second plate 14 is moved on the straight portion a ′ after a predetermined time in the same manner as in the straight portion c. Conductive wires 4 are provided while the plates 11 and 14 have a relationship of being parallel to each other. The table 3 rotates in the Y direction.

  By repeating such a process, the conductor 4 can be provided as shown in FIG.

  As described above, according to the present embodiment, the ultrasonic oscillator 8 of the first head unit 5 provided with the first plate 11 rotated by the first rotation mechanism 10 and the second rotation mechanism 7 rotate the first head. By providing the second head unit 6 holding the unit 5 independently and controllable, the first head unit 5 can be reduced in weight, and the load applied to the first motor 10a of the first rotating mechanism 10 can be reduced. It can be reduced. Therefore, when the conducting wire 4 is provided at the corner portion, the moment of inertia of the first head portion 5 can be reduced, so that high-speed rotation is possible and the conducting wire can be provided without reducing the speed. As a result, the wiring can be provided at a higher speed.

  In addition, although the specific numerical value was described in the said embodiment, it is not restricted to this, The 1st head part 5 of the wiring apparatus 1 rotates, maintaining a constant speed, and can provide the conducting wire 4. FIG. That's fine. Further, although the rotation axes of the first and second head portions 5 and 6 are not coaxial, they may be provided so that the rotation axes are coaxial, and the same effect can be obtained.

DESCRIPTION OF SYMBOLS 1,101 ... Wiring apparatus 2 ... Base material 3 ... Table 4 ... Conductor 5 ... 1st head part 6 ... 2nd head part 7 ... 2nd rotation mechanism 7a ... 2nd motor 7b ... 3rd pulley 7c ... 4th pulley 7d ... second timing belt 8 ... ultrasonic oscillator 8a ... horn 8b ... ultrasonic oscillator 8c ... sheath 9 ... base plate 10 ... first rotating mechanism 10a ... first motor 10b ... first pulley 10c ... second pulley 10d ... 1st timing belt 11 ... 1st board 12 ... 1st guide 13 ... Nozzle 14 ... 2nd board 14a ... End 15 ... Guide rail 16 ... Guide part 17 ... 2nd guide 18 ... Connection part B1, B2 ... Bearing 102 ... head mounting portion 103 ... rotating mechanism 104 ... head portion 105 ... X-axis moving table

Claims (5)

A movable table on which the substrate is placed;
A first head portion provided above the table and controlled to rotate by a first rotation mechanism about a predetermined axis;
A second head unit that supports the first head unit, is rotated by a second rotation mechanism about an axis that is in the same direction as the axis of the first head unit, and supplies a conductive wire on the substrate;
A wiring apparatus comprising:   The wiring device according to claim 1, wherein the first head portion is lighter than the second head portion.   The first head unit includes an ultrasonic oscillator that can rotate around a predetermined axis, and the ultrasonic transmitter applies ultrasonic waves to bond the conductive wire on the base material. Item 2. The wiring device according to Item 1. The wiring apparatus according to claim 1, wherein the wiring pattern is provided by a method.
When providing a linear pattern, the first and second head parts are arranged in a fixed state with respect to the rotation axis,
When providing a curved pattern, the second head portion rotates along the curved pattern, and the first head portion provides a wiring while rotating behind the second head portion,
The wiring method characterized by this.   When the linear pattern is provided after the curved pattern is provided, the first head portion that is rotated later than the second head portion provides a wiring along the movement of the second head portion after a predetermined time. The wiring method according to claim 3.

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