JP2011256391A - Adhesive sheet for connecting circuit and method for fixing circuit connecting material to substrate using the same - Google Patents

Adhesive sheet for connecting circuit and method for fixing circuit connecting material to substrate using the same Download PDF

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Publication number
JP2011256391A
JP2011256391A JP2011148570A JP2011148570A JP2011256391A JP 2011256391 A JP2011256391 A JP 2011256391A JP 2011148570 A JP2011148570 A JP 2011148570A JP 2011148570 A JP2011148570 A JP 2011148570A JP 2011256391 A JP2011256391 A JP 2011256391A
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JP
Japan
Prior art keywords
adhesive
adhesive layer
circuit
film
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011148570A
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Japanese (ja)
Inventor
Kazuya Sato
和也 佐藤
Masanori Fujii
正規 藤井
Tetsuyuki Shirakawa
哲之 白川
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Showa Denko Materials Co Ltd
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Hitachi Chemical Co Ltd
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2011148570A priority Critical patent/JP2011256391A/en
Publication of JP2011256391A publication Critical patent/JP2011256391A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10329—Gallium arsenide [GaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10336—Aluminium gallium arsenide [AlGaAs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
    • H01L2924/10349—Aluminium gallium indium phosphide [AlGaInP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet which is equipped with a support substrate and an adhesive layer provided on the support substrate and comprising an adhesive composition, and with which the adhesive layer is sufficiently temporary fixed on a substrate under wide temperature conditions compared with the prior art.SOLUTION: The adhesive sheet for connecting a circuit comprises a support substrate and an adhesive layer provided on the support substrate and comprising an adhesive composition, wherein the thickness (Ts) of the support substrate and the thickness (Ta) of the adhesive layer satisfy the requirement expressed by formula (1): 0.40≤Ta/Ts≤0.65 and the thickness (Ts) is 42 μm or less. The adhesive composition contains a thermoplastic resin, a radically polymerizable compound and a radical polymerization initiator, or a thermoplastic resin, a thermosetting resin and a latent curing agent.

Description

本発明は、接着シート、これを用いた回路部材の接続構造及び半導体装置に関する。   The present invention relates to an adhesive sheet, a circuit member connection structure using the adhesive sheet, and a semiconductor device.

従来、相対向する回路を加熱、加圧し加圧方向の電極を電気的に接続する接続材料として、異方導電性フィルム（以下、ＡＣＦという）や、絶縁性接着フィルム（以下、ＮＣＦという）などの回路接続材料が使用されている。ＡＣＦは、プリント配線基板、ＬＣＤ用ガラス基板、フレキシブルプリント基板等の基板や、ＩＣ、ＬＳＩ等の半導体素子やパッケージなどを接続する際、相対向する電極間に配置され、加熱加圧によって、電極同士を接続する。すなわち、ＡＣＦ及びＮＣＦは、相対向する電極同士の導電性と、隣接する電極同士の絶縁性とを両立して発現させ、かつ両基板間の電気的接続と機械的接続を行うことができる。   Conventionally, anisotropic conductive films (hereinafter referred to as ACF), insulating adhesive films (hereinafter referred to as NCF), etc. as connection materials for heating and pressurizing opposing circuits and electrically connecting electrodes in the pressure direction The circuit connection material is used. The ACF is disposed between electrodes facing each other when connecting a substrate such as a printed wiring board, a glass substrate for LCD, a flexible printed board, or a semiconductor element or package such as an IC or LSI. Connect each other. That is, the ACF and the NCF can exhibit both the conductivity between the electrodes facing each other and the insulation between the adjacent electrodes, and can perform electrical connection and mechanical connection between the two substrates.

代表的なＡＣＦ及びＮＣＦには、エポキシ樹脂系接着剤又はアクリル系接着剤等の接着剤成分が好適に使用されている。例えばＡＣＦは、上記接着剤成分中に必要により配合される導電性粒子を分散させてなる。これらの回路接続材料は、一般にフィルム状であり、ＰＥＴ（ポリエチレンテレフタレート）フィルム等の支持基材に積層した状態で製品化されている。上記回路接続材料は、基板上に固定後、支持基材を除去して熱圧着し、接着剤成分を硬化させて部材間の機械的接続を行うとともに、対向する電極間を直接又は導電性粒子を介して接触させて電気的接続を行う。なお、上記固定は、支持基材除去後の熱圧着と区別するために、仮固定、仮圧着又は仮接続とも呼ばれている。   In typical ACF and NCF, an adhesive component such as an epoxy resin adhesive or an acrylic adhesive is preferably used. For example, ACF is obtained by dispersing conductive particles blended as necessary in the adhesive component. These circuit connection materials are generally in the form of a film and are commercialized in a state where they are laminated on a support base material such as a PET (polyethylene terephthalate) film. The circuit connection material is fixed on the substrate, and then the support base is removed and thermocompression bonded, the adhesive component is cured to perform mechanical connection between the members, and between the opposing electrodes directly or conductive particles To make electrical connection through contact. In addition, in order to distinguish from the said thermocompression after the support base material removal, the said fixation is also called temporary fixing, temporary crimping, or temporary connection.

ＡＣＦを基板上に固定する温度は室温〜８０℃程度と広範囲である。しかしながら、室温付近の温度でＡＣＦを基板上に固定すると、支持基材を除去する際にＡＣＦごと基板から剥がれてしまう場合がある。一方、高温でＡＣＦを基板上に固定すると、接着剤成分が滲み出して支持基材のＡＣＦが積層されている側とは逆側の表面に回りこみ、支持基材を除去する際に接着剤の縁部分の密着不良が発生する場合がある。さらに接着剤成分が滲み出すと、圧着ヘッドが汚染されるという問題もある。また、ＡＣＦが支持基材と保護フィルムに挟まれた状態にある場合、まず、保護フィルムを剥離してＡＣＦの接着面を露出させてからＡＣＦを基板上に固定する。ところが、保護フィルムをＡＣＦから剥離しようとすると、先に支持基材がＡＣＦから剥離してしまい、ＡＣＦの基板上への固定が困難になる場合がある。そこで、このような問題点を解決する手段として、例えば特許文献１には、支持基材付き接着剤を貼り付ける装置を改良する提案がなされている。   The temperature at which the ACF is fixed on the substrate is in a wide range from room temperature to about 80 ° C. However, if the ACF is fixed on the substrate at a temperature near room temperature, the ACF may be peeled off from the substrate when the supporting base material is removed. On the other hand, when the ACF is fixed on the substrate at a high temperature, the adhesive component oozes out and wraps around the surface of the supporting base opposite to the side where the ACF is laminated, and the adhesive is removed when the supporting base is removed. In some cases, the poor adhesion of the edge portion may occur. Further, when the adhesive component oozes out, there is a problem that the pressure bonding head is contaminated. When the ACF is sandwiched between the support base material and the protective film, first, the protective film is peeled off to expose the adhesive surface of the ACF, and then the ACF is fixed on the substrate. However, if the protective film is to be peeled off from the ACF, the supporting base material is peeled off from the ACF first, and it may be difficult to fix the ACF on the substrate. Therefore, as means for solving such problems, for example, Patent Document 1 proposes to improve an apparatus for attaching an adhesive with a supporting base material.

特開２００１−１７１８９７号公報JP 2001-171897 A

しかしながら、ＡＣＦを始めとする支持基材上に設けられた接着層を広範囲な温度条件で基板上に固定するためには、支持基材付き接着剤を貼り付ける装置の改良のみでは不十分であり、更なる改善が望まれている。そこで、本発明は上記事情に鑑みてなされたものであり、支持基材と支持基材上に設けられた接着剤組成物からなる接着層とを備える接着シートにおいて、従来よりも広範囲な温度条件で接着層を基板上に十分仮固定することが可能となる接着シート、これを用いた回路部材の接続構造及び半導体装置を提供することを目的とする。   However, in order to fix the adhesive layer provided on the supporting base material such as ACF on the substrate under a wide range of temperature conditions, it is not sufficient to improve only the device for attaching the adhesive with the supporting base material. Further improvement is desired. Therefore, the present invention has been made in view of the above circumstances, and in an adhesive sheet comprising a support base and an adhesive layer made of an adhesive composition provided on the support base, a wider range of temperature conditions than before. It is an object of the present invention to provide an adhesive sheet capable of sufficiently temporarily fixing an adhesive layer on a substrate, a circuit member connection structure using the same, and a semiconductor device.

本発明は、支持基材と、当該支持基材上に設けられた接着剤組成物からなる接着層とを備える接着シートであって、支持基材の厚みＴｓ（以下、単に「Ｔｓ」という。）と接着層の厚みＴａ（以下、単に「Ｔａ」という。）とが下記式（１）で表される条件を満たしており、かつ、上記Ｔｓが４２μｍ以下である接着シートを提供する。
０．４０≦Ｔａ／Ｔｓ≦０．６５ （１） The present invention is an adhesive sheet including a support base material and an adhesive layer made of an adhesive composition provided on the support base material, and the thickness Ts (hereinafter simply referred to as “Ts”) of the support base material. ) And the thickness Ta of the adhesive layer (hereinafter simply referred to as “Ta”) satisfy the condition represented by the following formula (1), and the Ts is 42 μm or less.
0.40 ≦ Ta / Ts ≦ 0.65 (1)

この接着シートは、従来よりも広範囲な温度条件で接着層を基板上に仮固定することが十分に可能となる。このような効果が奏される要因は現在のところ詳細には明らかにされていないが、本発明者らは以下のように考えている。ただし、要因はこれに限定されない。   This adhesive sheet can sufficiently fix the adhesive layer on the substrate under a wider range of temperature conditions than before. Although the reason why such an effect is achieved is not clarified in detail at present, the present inventors consider as follows. However, the factor is not limited to this.

一般に、接着剤組成物は液状の状態で支持基材上に塗布後、フィルム状の接着層を形成する。この際、支持基材と接着層とでは機械的又は熱的特性が異なるため、支持基材と接着層との間に応力が生じる。つまり、Ｔａ／Ｔｓが０．４０未満では、接着層の厚みＴａが相対的に薄くなり、接着層を形成する際に支持基材の物性が支配的となり、支持基材の種類により接着層に伸び又は縮み応力が大きく働く傾向がある。一方、Ｔａ／Ｔｓが０．６５を超えると、接着層形成時に接着層の物性が支配的となり、接着剤の種類により接着層に伸び又は縮み応力が大きく働く傾向がある。そのため、このような状態では、接着シートを基板上へ十分に仮固定することが難しくなり、たとえ仮固定できても、支持基材を剥離する際に、接着層までも基材から剥離しやすくなる。そこで、ＴｓとＴａとが上記式（１）で表される条件を満たすことで、接着層を支持基材上に形成するときに支持基材と接着層との間に生じる応力を緩和することができ、接着シートを基板上に十分に仮固定することができる。   Generally, the adhesive composition forms a film-like adhesive layer after being applied on a support substrate in a liquid state. At this time, since the support base material and the adhesive layer have different mechanical or thermal characteristics, a stress is generated between the support base material and the adhesive layer. That is, when Ta / Ts is less than 0.40, the thickness Ta of the adhesive layer is relatively thin, and the physical properties of the support base material are dominant when the adhesive layer is formed. Elongation or shrinkage stress tends to work greatly. On the other hand, when Ta / Ts exceeds 0.65, the physical properties of the adhesive layer become dominant at the time of forming the adhesive layer, and there is a tendency that elongation or shrinkage stress acts largely on the adhesive layer depending on the type of the adhesive. Therefore, in such a state, it becomes difficult to sufficiently fix the adhesive sheet on the substrate sufficiently, and even if it can be temporarily fixed, even when the supporting base material is peeled, even the adhesive layer is easily peeled from the base material. Become. Therefore, when Ts and Ta satisfy the condition represented by the above formula (1), the stress generated between the support base material and the adhesive layer when the adhesive layer is formed on the support base material is relieved. And the adhesive sheet can be sufficiently temporarily fixed on the substrate.

さらに、Ｔｓが４２μｍ以下であると、接着シートを基板に固定後、支持基材を接着層から剥がす際に支持基材と接着層の剥離点の角度を大きくでき、支持基材の除去を容易に行うことができる。そのため、接着層の縁部等の一部又は全部が基板から剥離することを防ぐことができる。したがって、本発明の接着シートは、従来よりも広範囲な温度条件で接着層を基板上に仮固定することが十分に可能となる。   Furthermore, when Ts is 42 μm or less, the angle of the peeling point between the support base and the adhesive layer can be increased when the support base is peeled from the adhesive layer after fixing the adhesive sheet to the substrate, and the support base is easily removed. Can be done. Therefore, it is possible to prevent part or all of the edge portion and the like of the adhesive layer from being peeled off from the substrate. Therefore, the adhesive sheet of the present invention can sufficiently fix the adhesive layer on the substrate under a wider range of temperature conditions than before.

また、Ｔａ／Ｔｓが０．６５を超えると、接着層の厚みＴａが相対的に厚くなるため、接着シートを仮固定する際に接着剤組成物が染み出して支持基材の側面部分や接着層が設けられている側とは逆側の表面に回りこみ易くなる。そのため、支持基材を除去する際に接着層の縁部で密着不良となる傾向や、圧着ヘッドが汚染される傾向がある。   Further, when Ta / Ts exceeds 0.65, the thickness Ta of the adhesive layer becomes relatively thick, so that the adhesive composition oozes out when temporarily fixing the adhesive sheet, and the side surface portion of the support substrate or the adhesive is bonded. It becomes easy to wrap around on the surface opposite to the side where the layer is provided. Therefore, when removing a support base material, there exists a tendency which becomes a contact | adherence defect in the edge part of an adhesive layer, or a crimping head is contaminated.

本発明の接着シートは、接着層上に、更に保護フィルムが設けられ、かつ、この保護フィルムの厚みＴｐ（以下、単に「Ｔｐ」という。）がＴｓ以下であることが好ましい。これにより、保護フィルムを接着層から除去する際に、接着層が支持基材から剥がれてしまうことをより有効に防止できる。   In the adhesive sheet of the present invention, a protective film is further provided on the adhesive layer, and the thickness Tp (hereinafter simply referred to as “Tp”) of the protective film is preferably Ts or less. Thereby, when removing a protective film from an adhesive layer, it can prevent more effectively that an adhesive layer will peel from a support base material.

本発明の接着シートにおいて、支持基材及び接着層間の剥離強度が、保護フィルム及び接着層間の剥離強度以上であることが好ましい。この場合、接着シートから保護フィルムを剥離する際に、接着層が支持基材から剥離してしまうことを防止できるため、従来よりも広範囲な温度条件で接着層を基板上に、一層有効に仮固定することが可能となる。   In the adhesive sheet of the present invention, the peel strength between the support substrate and the adhesive layer is preferably equal to or higher than the peel strength between the protective film and the adhesive layer. In this case, when the protective film is peeled from the adhesive sheet, the adhesive layer can be prevented from being peeled off from the support base material. It can be fixed.

本発明の接着シートは、接着剤組成物が、熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含有することが好ましい。このような接着剤組成物からなる接着層は各種基板との接着性に優れるため、本発明の接着シートは、従来よりも広範囲な温度条件で接着層を基板上に、より一層有効かつ確実に仮固定することができる。   In the adhesive sheet of the present invention, the adhesive composition preferably contains a thermoplastic resin, a radical polymerizable compound, and a radical polymerization initiator. Since the adhesive layer made of such an adhesive composition is excellent in adhesiveness to various substrates, the adhesive sheet of the present invention is more effective and reliable on the substrate under a wider range of temperature conditions than before. Can be temporarily fixed.

また、本発明の接着シートは、接着剤組成物が、熱可塑性樹脂、熱硬化性樹脂及び潜在性硬化剤を含有することが好ましい。このような接着剤組成物からなる接着層は各種基板との接着性に優れるため、本発明の接着シートは、従来よりも広範囲な温度条件で接着層を基板上に、より一層有効かつ確実に仮固定することが可能となる。   In the adhesive sheet of the present invention, the adhesive composition preferably contains a thermoplastic resin, a thermosetting resin, and a latent curing agent. Since the adhesive layer made of such an adhesive composition is excellent in adhesiveness to various substrates, the adhesive sheet of the present invention is more effective and reliable on the substrate under a wider range of temperature conditions than before. It can be temporarily fixed.

本発明の接着シートは、接着剤組成物が導電性粒子を更に含有することが好ましい。これにより、接着剤組成物はそれ自体導電性を容易に有することができる。そのため、上記接着剤組成物からなる接着層を備える接着シートは、電気的な接続の異方性を一層良好に示すことが可能となる。   In the adhesive sheet of the present invention, the adhesive composition preferably further contains conductive particles. Thereby, the adhesive composition itself can easily have conductivity. Therefore, an adhesive sheet provided with an adhesive layer made of the above adhesive composition can better exhibit electrical connection anisotropy.

本発明の接着シートにおいて、支持基材が、ポリエチレンテレフタレートフィルム、配向ポリプロピレンフィルム、ポリエチレンフィルム及びポリイミドフィルムからなる群より選ばれる１種以上のフィルムを備えることが好ましい。これにより、本発明の接着シートは、従来よりも広範囲な温度条件で接着層を基板上に仮固定するという本発明の効果を一層有効に発揮することができる。   In the adhesive sheet of the present invention, it is preferable that the support substrate includes at least one film selected from the group consisting of a polyethylene terephthalate film, an oriented polypropylene film, a polyethylene film, and a polyimide film. Thereby, the adhesive sheet of this invention can exhibit more effectively the effect of this invention of temporarily fixing an adhesive layer on a board | substrate on temperature range wider than before.

本発明は、第１の回路基板の主面上に第１の回路電極が形成された第１の回路部材と、第２の回路基板の主面上に第２の回路電極が形成された第２の回路部材と、第１の回路基板の主面と第２の回路基板の主面との間に設けられ、第１の回路電極と第２の回路電極とを対向配置させた状態で電気的に接続する回路接続部材とを備え、回路接続部材は、上述の接着シートにおける接着層の硬化物である回路部材の接続構造を提供する。このような回路部材の接続構造は、回路接続部材が本発明の接着シートにおける接着層の硬化物からなるため、従来よりも広範囲な温度条件で接着層を回路基板上に仮固定することが可能となる。また、この接続構造は、対向する電極同士の導電性と、隣接する電極同士の絶縁性とを十分に確保できる。   The present invention provides a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board, and a second circuit electrode in which a second circuit electrode is formed on a main surface of a second circuit board. The second circuit member is provided between the main surface of the first circuit board and the main surface of the second circuit board, and the first circuit electrode and the second circuit electrode are arranged to face each other. The circuit connection member provides a circuit member connection structure that is a cured product of the adhesive layer in the above-described adhesive sheet. In such a circuit member connection structure, since the circuit connection member is made of a cured product of the adhesive layer in the adhesive sheet of the present invention, the adhesive layer can be temporarily fixed on the circuit board under a wider range of temperature conditions than before. It becomes. Moreover, this connection structure can fully ensure the electroconductivity of the electrodes which oppose, and the insulation of adjacent electrodes.

さらに、本発明は、半導体素子と、半導体素子を搭載する基板と、半導体素子及び基板間に設けられ、半導体素子及び基板を電気的に接続する半導体素子接続部材とを備え、半導体素子接続部材は、上述の接着シートにおける接着層の硬化物である半導体装置を提供する。このような半導体装置は、半導体接続部材が本発明の接着シートにおける接着層の硬化物からなるため、従来よりも広範囲な温度条件で接着層を基板上に仮固定することが可能となる。また、この半導体装置は、半導体素子及び基板間で導電性を十分に確保できる。   Furthermore, the present invention includes a semiconductor element, a substrate on which the semiconductor element is mounted, a semiconductor element connection member provided between the semiconductor element and the substrate, and electrically connecting the semiconductor element and the substrate. The semiconductor device which is the hardened | cured material of the contact bonding layer in the above-mentioned adhesive sheet is provided. In such a semiconductor device, since the semiconductor connection member is made of a cured product of the adhesive layer in the adhesive sheet of the present invention, the adhesive layer can be temporarily fixed on the substrate under a wider range of temperature conditions than before. In addition, this semiconductor device can sufficiently secure conductivity between the semiconductor element and the substrate.

本発明によれば、支持基材と支持基材上に設けられた接着剤組成物を含む接着層とを備える接着シートにおいて、従来よりも広範囲な温度条件で接着層を基板上に仮固定することが可能となる接着シートを提供することができる。   According to the present invention, in an adhesive sheet comprising a support base material and an adhesive layer containing an adhesive composition provided on the support base material, the adhesive layer is temporarily fixed on the substrate under a wider range of temperature conditions than before. It is possible to provide an adhesive sheet that can be used.

本発明の回路部材の接続構造の一実施形態を示す部分断面図である。It is a fragmentary sectional view showing one embodiment of a circuit member connection structure of the present invention. 本発明の回路部材の接続構造の一実施形態を示す部分断面図である。It is a fragmentary sectional view showing one embodiment of a circuit member connection structure of the present invention. 回路部材を接続する一連の工程図である。It is a series of process diagrams for connecting circuit members. 本発明の半導体装置の一実施形態を示す部分断面図である。It is a fragmentary sectional view showing one embodiment of a semiconductor device of the present invention.

以下、必要に応じて図面を参照しつつ、本発明の好適な実施形態について詳細に説明する。なお、図面中、同一要素には同一符号を付すこととし、重複する説明は省略する。また、上下左右等の位置関係は、特に断らない限り、図面に示す位置関係に基づくものとする。更に、図面の寸法比率は図示の比率に限られるものではない。また、本明細書における「（メタ）アクリル酸」とは「アクリル酸」及びそれに対応する「メタクリル酸」を意味し、「（メタ）アクリレート」とは「アクリレート」及びそれに対応する「メタクリレート」を意味する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as necessary. In the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. In the present specification, “(meth) acrylic acid” means “acrylic acid” and “methacrylic acid” corresponding thereto, and “(meth) acrylate” means “acrylate” and “methacrylate” corresponding thereto. means.

（接着シート）
本発明の好適な実施形態に係る接着シートは、支持基材と支持基材上に設けられた接着剤組成物からなる接着層とを備えるものである。 (Adhesive sheet)
The adhesive sheet which concerns on suitable embodiment of this invention is equipped with the contact bonding layer which consists of a support base material and the adhesive composition provided on the support base material.

本発明の接着シートおいて、支持基材上に設けられる接着層が、熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含む接着剤組成物からなることが好ましい。   In the adhesive sheet of the present invention, it is preferable that the adhesive layer provided on the support substrate is composed of an adhesive composition containing a thermoplastic resin, a radical polymerizable compound, and a radical polymerization initiator.

本発明に用いられる熱可塑性樹脂としては、特に制限はなく公知のものを使用することができる。具体的には、例えば、フェノキシ樹脂、ポリビニルホルマール樹脂、ポリスチレン樹脂、ポリビニルブチラール樹脂、ポリエステル樹脂、ポリアミド樹脂、キシレン樹脂、ポリウレタン樹脂等を用いることができる。これらは１種を単独で又は２種類以上を混合して用いることができる。更に、これらの樹脂は分子内にシロキサン結合やフッ素置換基が含まれていてもよい。これらは混合する樹脂同士が完全に相溶するか、若しくはミクロ相分離が生じて白濁する状態であれば好適に用いることができる。   There is no restriction | limiting in particular as a thermoplastic resin used for this invention, A well-known thing can be used. Specifically, for example, phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin and the like can be used. These can be used individually by 1 type or in mixture of 2 or more types. Furthermore, these resins may contain a siloxane bond or a fluorine substituent in the molecule. These can be suitably used as long as the resins to be mixed are completely compatible with each other or microphase separation occurs and the liquid becomes cloudy.

熱可塑性樹脂は、接着剤組成物のフィルム形成性を良好にすることができる。フィルム形成性とは、液状の接着剤組成物を固形化し、フィルム状とした場合に、容易に裂けたり、割れたり、べたついたりしない機械特性を示すものである。通常の状態（例えば、常温）でフィルムとしての取扱いが容易であると、フィルム形成性が良好であるといえる。これら熱可塑性樹脂の中でも、接着性、相溶性、耐熱性及び機械強度に優れることからフェノキシ樹脂を使用することが好ましい。   The thermoplastic resin can improve the film-forming property of the adhesive composition. Film-forming property indicates mechanical properties that do not easily tear, break, or stick when a liquid adhesive composition is solidified to form a film. If the film is easy to handle in a normal state (for example, room temperature), it can be said that the film formability is good. Among these thermoplastic resins, it is preferable to use a phenoxy resin because of excellent adhesiveness, compatibility, heat resistance, and mechanical strength.

フェノキシ樹脂は、２官能フェノール類とエピハロヒドリンを高分子量まで反応させることにより、又は２官能エポキシ樹脂と２官能フェノール類を重付加させることにより得ることができる。また、フェノキシ樹脂はラジカル重合性の官能基や、その他の反応性化合物により変性されていてもよい。フェノキシ樹脂は、１種を単独で又は２種類以上を組み合わせて用いることができる。   The phenoxy resin can be obtained by reacting a bifunctional phenol and epihalohydrin to a high molecular weight, or by polyadding a bifunctional epoxy resin and a bifunctional phenol. The phenoxy resin may be modified with a radical polymerizable functional group or other reactive compound. A phenoxy resin can be used individually by 1 type or in combination of 2 or more types.

また、上述した熱可塑性樹脂の分子量は特に制限はないが、熱可塑性樹脂の分子量が大きいほど後述するフィルムを容易に形成することができ、接着剤としての流動性に影響する溶融粘度を広範囲に設定することも可能となる。溶融粘度を広範囲に設定することができれば、半導体素子や液晶素子等の接続に用いた場合、素子間及び配線間ピッチが狭小化したとしても、周辺部材に接着剤が付着することを一層防止することができ、スループットを向上させることが可能となる。一般的な重量平均分子量としては５０００〜１５００００が好ましく、１００００〜８００００が特に好ましい。重量平均分子量が５０００未満では、後述するフィルムとして使用する場合にフィルム形成性が不十分となる傾向があり、重量平均分子量が１５００００を超えると、他の成分との相溶性が劣る傾向がある。   Further, the molecular weight of the thermoplastic resin described above is not particularly limited, but as the thermoplastic resin has a higher molecular weight, a film to be described later can be easily formed, and a wide range of melt viscosities affecting the fluidity as an adhesive. It is also possible to set. If the melt viscosity can be set in a wide range, even when the pitch between the elements and between the wirings is narrowed when used to connect a semiconductor element or a liquid crystal element, the adhesion of the adhesive to the peripheral members is further prevented. And throughput can be improved. As a general weight average molecular weight, 5000-150,000 are preferable, and 10000-80000 are especially preferable. When the weight average molecular weight is less than 5,000, the film formability tends to be insufficient when used as a film described later, and when the weight average molecular weight exceeds 150,000, the compatibility with other components tends to be poor.

なお、本明細書における重量平均分子量は、以下の条件に従ってゲルパーミエイションクロマトグラフィー（ＧＰＣ）分析により下記条件で測定し、標準ポリスチレンの検量線を使用して換算することにより求められる。
（ＧＰＣ条件）
使用機器：日立Ｌ−６０００型（（株）日立製作所製、商品名）
検出器：Ｌ−３３００ＲＩ（（株）日立製作所製、商品名）
カラム：ゲルパックＧＬ−Ｒ４２０＋ゲルパックＧＬ−Ｒ４３０＋ゲルパックＧＬ−Ｒ４４０（計３本）（日立化成工業（株）製、商品名）
溶離液：テトラヒドロフラン
測定温度：４０℃
流量：１．７５ｍＬ／ｍｉｎ In addition, the weight average molecular weight in this specification is calculated | required by measuring on the following conditions by gel permeation chromatography (GPC) analysis according to the following conditions, and calculating | requiring using a standard polystyrene calibration curve.
(GPC conditions)
Equipment used: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name)
Detector: L-3300RI (trade name, manufactured by Hitachi, Ltd.)
Column: Gel pack GL-R420 + Gel pack GL-R430 + Gel pack GL-R440 (3 in total) (trade name, manufactured by Hitachi Chemical Co., Ltd.)
Eluent: Tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 1.75 mL / min

本発明に係るラジカル重合性化合物としては、ラジカルにより重合する官能基を有するものであり、例えば、(メタ)アクリル酸化合物、マレイミド化合物、スチレン誘導体が好適に用いられる。このラジカル重合性化合物は、重合性モノマー及び重合性オリゴマーのいずれであってもよく、重合性モノマーと重合性オリゴマーとを併用することも可能である。重合性オリゴマーは一般に高粘度であるため、重合性オリゴマーを用いる場合、低粘度の重合性多官能（メタ）アクリレート等の重合性モノマーを併用して粘度調整することが好ましい。   The radically polymerizable compound according to the present invention has a functional group that is polymerized by radicals. For example, (meth) acrylic acid compounds, maleimide compounds, and styrene derivatives are preferably used. This radical polymerizable compound may be either a polymerizable monomer or a polymerizable oligomer, and it is also possible to use a polymerizable monomer and a polymerizable oligomer in combination. Since the polymerizable oligomer generally has a high viscosity, when the polymerizable oligomer is used, it is preferable to adjust the viscosity by using a polymerizable monomer such as a polymerizable polyfunctional (meth) acrylate having a low viscosity.

ラジカル重合性化合物として、（メタ）アクリル酸、（メタ）アクリル酸エステル又はアクリロニトリルのうち少なくとも一つをモノマー成分とした重合体又は共重合体を使用することもできる。グリシジルエーテル基を含有するグリシジル（メタ）アクリレートを含む共重合体系アクリルゴムを併用した場合、応力緩和に優れるので好ましい。上記アクリルゴムの重量平均分子量は、接着剤組成物の凝集力を高める点から２０万以上が好ましい。   As the radical polymerizable compound, a polymer or copolymer having at least one of (meth) acrylic acid, (meth) acrylic acid ester or acrylonitrile as a monomer component may be used. When a copolymer acrylic rubber containing glycidyl (meth) acrylate containing a glycidyl ether group is used in combination, stress relaxation is excellent, which is preferable. The weight average molecular weight of the acrylic rubber is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive composition.

ラジカル重合性化合物としては、例えば、エポキシ（メタ）アクリレートオリゴマー、ウレタン（メタ）アクリレートオリゴマー、ポリエーテル（メタ）アクリレートオリゴマー、ポリエステル（メタ）アクリレートオリゴマー等のオリゴマー、トリメチロールプロパントリ（メタ）アクリレート、ポリエチレングリコールジ（メタ）アクリレート、ポリアルキレングリコールジ（メタ）アクリレート、ジシクロペンテニル（メタ）アクリレート、ジシクロペンテニロキシエチル（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、イソシアヌル酸変性２官能（メタ）アクリレート、イソシアヌル酸変性３官能（メタ）アクリレート、２，２’−ジ（メタ）アクリロイロキシジエチルホスフェート、２−（メタ）アクリロイロキシエチルアシッドホスフェート等の多官能（メタ）アクリレート化合物が挙げられる。これらの化合物は、必要に応じて１種を単独で又は２種以上を混合して用いてもよい。   Examples of the radical polymerizable compound include epoxy (meth) acrylate oligomers, urethane (meth) acrylate oligomers, polyether (meth) acrylate oligomers, oligomers such as polyester (meth) acrylate oligomers, trimethylolpropane tri (meth) acrylate, Polyethylene glycol di (meth) acrylate, polyalkylene glycol di (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa ( (Meth) acrylate, isocyanuric acid modified bifunctional (meth) acrylate, isocyanuric acid modified trifunctional (meth) acrylate, 2,2'-di (meth) acryl Acetoxyphenyl diethyl phosphate, a polyfunctional (meth) acrylate compounds such as 2- (meth) acryloyloxyethyl acid phosphate. These compounds may be used alone or in combination of two or more as required.

ラジカル重合性化合物の配合割合は、熱可塑性樹脂１００質量部に対して、５０〜２５０質量部であることが好ましく、６０〜１５０質量部であることがより好ましい。ラジカル重合性化合物の配合割合が５０質量部未満であると、接着剤組成物の硬化物の耐熱性が低下する傾向にあり、２５０質量部を超えると、接着剤組成物のフィルム形成性が不十分となる傾向にある。   The blending ratio of the radical polymerizable compound is preferably 50 to 250 parts by mass and more preferably 60 to 150 parts by mass with respect to 100 parts by mass of the thermoplastic resin. When the blending ratio of the radically polymerizable compound is less than 50 parts by mass, the heat resistance of the cured product of the adhesive composition tends to be reduced, and when it exceeds 250 parts by mass, the film formability of the adhesive composition is not good. It tends to be sufficient.

本発明に係るラジカル重合開始剤としては、従来知られている過酸化化合物（有機過酸化物）、アゾ化合物又は光開始剤のような、加熱及び光照射のうち少なくともいずれか一方の処理により分解して遊離ラジカルを発生する化合物が用いられる。有機過酸化物及びアゾ化合物は、主として加熱により遊離ラジカルを発生する。これらの化合物をラジカル重合開始剤として用いる場合、有機過酸化物及び／又はアゾ化合物から１種又は２種以上を、目的とする接続温度、接続時間、ポットライフ等により適宜選択する。   The radical polymerization initiator according to the present invention is decomposed by treatment of at least one of heating and light irradiation such as a conventionally known peroxide compound (organic peroxide), azo compound or photoinitiator. Thus, compounds that generate free radicals are used. Organic peroxides and azo compounds generate free radicals mainly by heating. When these compounds are used as radical polymerization initiators, one or more of organic peroxides and / or azo compounds are appropriately selected depending on the intended connection temperature, connection time, pot life, and the like.

有機過酸化物としては、高い反応性と長いポットライフを両立する観点から、１０時間半減期温度が４０℃以上、かつ、１分間半減期温度が１８０℃以下の有機過酸化物が好ましく、１０時間半減期温度が６０℃以上、かつ、１分間半減期温度が１７０℃以下の有機過酸化物がより好ましい。また、有機過酸化物は、回路部材の回路電極（接続端子）の腐食を防止するために、塩素イオンや有機酸の含有量が５０００ｐｐｍ以下であることが好ましい。   The organic peroxide is preferably an organic peroxide having a 10-hour half-life temperature of 40 ° C. or higher and a 1-minute half-life temperature of 180 ° C. or lower from the viewpoint of achieving both high reactivity and a long pot life. An organic peroxide having a time half-life temperature of 60 ° C. or higher and a 1-minute half-life temperature of 170 ° C. or lower is more preferable. The organic peroxide preferably has a chlorine ion or organic acid content of 5000 ppm or less in order to prevent corrosion of the circuit electrode (connection terminal) of the circuit member.

有機過酸化物としては、具体的には、ジアシルパーオキサイド、パーオキシジカーボネート、パーオキシエステル、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド及びシリルパーオキサイドからなる群より選ばれる１種以上が好適に用いられる。これらの中では、保存時の高い保存安定性と使用時の高い反応性を両立する観点から、パーオキシエステル、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド及びシリルパーオキサイドからなる群より選ばれる１種以上の有機過酸化物がより好ましい。さらには、より高い反応性が得られる点で、有機過酸化物が、パーオキシエステル及び／又はパーオキシケタールであることが更に好ましい。これらは、１種を単独で又は２種以上を組み合わせて用いられる。   Specifically, the organic peroxide includes one or more selected from the group consisting of diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide and silyl peroxide. Preferably used. Among these, from the viewpoint of achieving both high storage stability during storage and high reactivity during use, it is selected from the group consisting of peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides and silyl peroxides. One or more organic peroxides are more preferred. Furthermore, the organic peroxide is more preferably a peroxyester and / or a peroxyketal in that higher reactivity can be obtained. These are used singly or in combination of two or more.

ジアシルパーオキサイドとしては、例えば、イソブチルパーオキサイド、２，４−ジクロロベンゾイルパーオキサイド、３，５，５−トリメチルヘキサノイルパーオキサイド、オクタノイルパーオキサイド、ラウロイルパーオキサイド、ステアロイルパーオキサイド、スクシニックパーオキサイド、ベンゾイルパーオキシトルエン及びベンゾイルパーオキサイドが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of the diacyl peroxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, and succinic peroxide. , Benzoylperoxytoluene and benzoyl peroxide. These are used singly or in combination of two or more.

ジアルキルパーオキサイドとしては、例えば、α，α’−ビス（ｔ−ブチルパーオキシ）ジイソプロピルベンゼン、ジクミルパーオキサイド、２，５−ジメチル−２，５−ジ（ｔ−ブチルパーオキシ）ヘキサン及びｔ−ブチルクミルパーオキサイドが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of the dialkyl peroxide include α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, and t. -Butyl cumyl peroxide is mentioned. These are used singly or in combination of two or more.

パーオキシジカーボネートとしては、例えば、ジ−ｎ−プロピルパーオキシジカーボネート、ジイソプロピルパーオキシジカーボネート、ビス（４−ｔ−ブチルシクロヘキシル）パーオキシジカーボネート、ジ−２−エトキシメトキシパーオキシジカーボネート、ビス（２−エチルヘキシルパーオキシ）ジカーボネート、ジメトキシブチルパーオキシジカーボネート及びビス（３−メチル−３−メトキシブチルパーオキシ）ジカーボネートが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of peroxydicarbonate include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, Bis (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate and bis (3-methyl-3-methoxybutylperoxy) dicarbonate are mentioned. These are used singly or in combination of two or more.

パーオキシエステルとしては、例えば、クミルパーオキシネオデカノエート、１，１，３，３−テトラメチルブチルパーオキシネオデカノエート、１−シクロヘキシル−１−メチルエチルパーオキシネオデカノエート、ｔ−ヘキシルパーオキシネオデカノエート、ｔ−ブチルパーオキシピバレート、１，１，３，３−テトラメチルブチルパーオキシ−２−エチルヘキサノネート、２，５−ジメチル−２，５−ビス（２−エチルヘキサノイルパーオキシ）ヘキサン、１−シクロヘキシル−１−メチルエチルパーオキシ−２−エチルヘキサノネート、ｔ−ヘキシルパーオキシ−２−エチルヘキサノネート、ｔ−ブチルパーオキシ−２−エチルヘキサノネート、ｔ−ブチルパーオキシイソブチレート、１，１−ビス（ｔ−ブチルパーオキシ）シクロヘキサン、ｔ−ヘキシルパーオキシイソプロピルモノカーボネート、ｔ−ブチルパーオキシ−３，５，５−トリメチルヘキサノネート、ｔ−ブチルパーオキシラウレート、２，５−ジメチル−２，５−ビス（ｍ−トルオイルパーオキシ）ヘキサン、ｔ−ブチルパーオキシイソプロピルモノカーボネート、ｔ−ブチルパーオキシ−２−エチルヘキシルモノカーボネート、ｔ−ヘキシルパーオキシベンゾエート、ｔ−ブチルパーオキシアセテート及びビス（ｔ−ブチルパーオキシ）ヘキサヒドロテレフタレートが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of peroxyesters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, t -Hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-bis ( 2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethyl Hexanonate, t-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclo Xane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-bis (m- Toluoylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t-butylperoxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate, t-butylperoxyacetate and bis (t-butylperoxy) Hexahydroterephthalate is mentioned. These are used singly or in combination of two or more.

パーオキシケタールとしては、例えば、１，１−ビス（ｔ−ヘキシルパーオキシ）−３，３，５−トリメチルシクロヘキサン、１，１−ビス（ｔ−ヘキシルパーオキシ）シクロヘキサン、１，１−ビス（ｔ−ブチルパーオキシ）−３，３，５−トリメチルシクロヘキサン、１，１−（ｔ−ブチルパーオキシ）シクロドデカン及び２，２−ビス（ｔ−ブチルパーオキシ）デカンが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of peroxyketals include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1-bis ( t-Butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane and 2,2-bis (t-butylperoxy) decane. These are used singly or in combination of two or more.

ハイドロパーオキサイドとしては、例えば、ジイソプロピルベンゼンハイドロパーオキサイド及びクメンハイドロパーオキサイドが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of the hydroperoxide include diisopropylbenzene hydroperoxide and cumene hydroperoxide. These are used singly or in combination of two or more.

シリルパーオキサイドとしては、例えば、ｔ−ブチルトリメチルシリルパーオキサイド、ビス（ｔ−ブチル）ジメチルシリルパーオキサイド、ｔ−ブチルトリビニルシリルパーオキサイド、ビス（ｔ−ブチル）ジビニルシリルパーオキサイド、トリス（ｔ−ブチル）ビニルシリルパーオキサイド、ｔ−ブチルトリアリルシリルパーオキサイド、ビス（ｔ−ブチル）ジアリルシリルパーオキサイド及びトリス（ｔ−ブチル）アリルシリルパーオキサイドが挙げられる。これらは１種を単独で又は２種以上を組み合わせて用いられる。   Examples of the silyl peroxide include t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, bis (t-butyl) divinylsilyl peroxide, tris (t- Butyl) vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, and tris (t-butyl) allylsilyl peroxide. These are used singly or in combination of two or more.

また、ラジカル重合開始剤の配合割合は、目的とする接続温度、接続時間、ポットライフ等により適宜設定できる。例えば、接続時間を１０秒以下とした場合、十分な反応率を得るために、ラジカル重合開始剤の配合割合は、ラジカル重合性化合物及び熱可塑性樹脂の合計１００質量部に対して、０．１〜３０質量部であることが好ましく、１〜２０質量部であることがより好ましい。ラジカル重合開始剤の配合割合が０．１質量部未満であると、反応率が低下するため、接着剤組成物の硬化物が硬化し難くなる傾向にある。ラジカル重合開始剤の配合割合が３０質量部を超えると、接着剤組成物の流動性が低下したり、接続抵抗が上昇したり、接着剤組成物のポットライフが短くなったりする傾向にある。   Further, the blending ratio of the radical polymerization initiator can be appropriately set depending on the intended connection temperature, connection time, pot life and the like. For example, when the connection time is 10 seconds or less, in order to obtain a sufficient reaction rate, the blending ratio of the radical polymerization initiator is 0.1% with respect to a total of 100 parts by mass of the radical polymerizable compound and the thermoplastic resin. It is preferable that it is -30 mass parts, and it is more preferable that it is 1-20 mass parts. When the blending ratio of the radical polymerization initiator is less than 0.1 parts by mass, the reaction rate decreases, so that the cured product of the adhesive composition tends to be difficult to cure. When the blending ratio of the radical polymerization initiator exceeds 30 parts by mass, the fluidity of the adhesive composition tends to decrease, the connection resistance increases, or the pot life of the adhesive composition tends to be shortened.

本発明の接着シートにおいて、支持基材上に設けられる接着層が、熱可塑性樹脂、熱硬化性樹脂及び潜在性硬化剤を含む接着剤組成物からなることも好ましい。   In the adhesive sheet of the present invention, it is also preferable that the adhesive layer provided on the support substrate is made of an adhesive composition containing a thermoplastic resin, a thermosetting resin, and a latent curing agent.

この場合、熱可塑性樹脂は上述した熱可塑性樹脂と同様のものを用いることができる。   In this case, the same thermoplastic resin as that described above can be used as the thermoplastic resin.

熱硬化性樹脂としては、エポキシ樹脂が好ましい。エポキシ樹脂は、１分子内に２個以上のグリシジル基を有する各種のエポキシ化合物等を単独に、あるいは、その２種以上を混合して用いられる。具体的には、エピクロルヒドリンとビスフェノールＡやＦ、ＡＤ等から誘導されるビスフェノール型エポキシ樹脂、エピクロルヒドリンとフェノールノボラックやクレゾールノボラックから誘導されるエポキシノボラック樹脂やナフタレン環を含んだ骨格を有するナフタレン系エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエーテル型エポキシ樹脂、ビフェニル型エポキシ樹脂、脂環式型エポキシ樹脂等が挙げられる。これらは、１種を単独で又は２種以上を組み合わせて用いられる。エポキシ樹脂は、不純物イオン（Ｎａ＋、Ｃｌ−等）及び加水分解性塩素等を３００ｐｐｍ以下に低減した高純度品であることが、エレクトロンマイグレーション防止のために好ましい。 As the thermosetting resin, an epoxy resin is preferable. The epoxy resin is used alone or in combination of two or more of various epoxy compounds having two or more glycidyl groups in one molecule. Specifically, bisphenol type epoxy resins derived from epichlorohydrin and bisphenol A, F, AD, etc., epoxy novolac resins derived from epichlorohydrin and phenol novolac or cresol novolac, and naphthalene type epoxy resins having a skeleton containing a naphthalene ring Glycidylamine type epoxy resin, glycidyl ether type epoxy resin, biphenyl type epoxy resin, alicyclic type epoxy resin and the like. These are used singly or in combination of two or more. The epoxy resin is preferably a high-purity product in which impurity ions (Na + , Cl − and the like), hydrolyzable chlorine and the like are reduced to 300 ppm or less, in order to prevent electron migration.

上記熱硬化性樹脂の硬化剤は、より長いポットライフを得る観点から、潜在性硬化剤が好ましい。熱硬化性樹脂がエポキシ樹脂である場合、潜在性硬化剤として、イミダゾール系、ヒドラジド系、三フッ化ホウ素−アミン錯体、スルホニウム塩、アミンイミド、ポリアミンの塩、ジシアンジアミド等が挙げられる。また、可使時間を延長する観点から、これらの硬化剤をポリウレタン系、ポリエステル系の高分子物質等で被覆してマイクロカプセル化したものを用いると好ましい。これらは、１種を単独で又は２種以上を混合して使用することができ、分解促進剤、抑制剤等を併用して用いてもよい。   The curing agent for the thermosetting resin is preferably a latent curing agent from the viewpoint of obtaining a longer pot life. When the thermosetting resin is an epoxy resin, examples of the latent curing agent include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide and the like. Further, from the viewpoint of extending the pot life, it is preferable to use a microcapsule obtained by coating these curing agents with a polyurethane or polyester polymer substance. These can be used individually by 1 type or in mixture of 2 or more types, and may use together with a decomposition accelerator, an inhibitor, etc.

潜在性硬化剤の配合割合は、十分な反応率を得るために熱可塑性樹脂及び熱硬化性樹脂の合計１００質量部に対して、０．１〜６０質量部であることが好ましく、１〜２０質量部であることがより好ましい。潜在性硬化剤の配合割合が０．１質量部未満では、反応率が低下して接着強度が低下したり、接続抵抗が大きくなったりする傾向がある。潜在性硬化剤の配合割合が６０質量部を超えると、接着剤組成物の流動性が低下したり、接続抵抗が上昇したり、接着剤組成物のポットライフが短くなったりする傾向にある。   The blending ratio of the latent curing agent is preferably 0.1 to 60 parts by mass with respect to 100 parts by mass in total of the thermoplastic resin and the thermosetting resin in order to obtain a sufficient reaction rate. More preferably, it is part by mass. When the blending ratio of the latent curing agent is less than 0.1 parts by mass, the reaction rate tends to decrease, the adhesive strength decreases, and the connection resistance tends to increase. When the blending ratio of the latent curing agent exceeds 60 parts by mass, the fluidity of the adhesive composition tends to decrease, the connection resistance increases, and the pot life of the adhesive composition tends to be shortened.

これら硬化剤は、単独又は混合して使用することができ、分解促進剤、抑制剤等を混合して用いてもよい。また、上記硬化剤をポリウレタン系、ポリエステル系の高分子物質等で被覆してマイクロカプセル化したものは、可使時間が延長されるために好ましい。   These curing agents can be used alone or in combination, and may be used by mixing a decomposition accelerator, an inhibitor and the like. In addition, it is preferable to use a microcapsule which is obtained by coating the curing agent with a polyurethane-based or polyester-based polymer substance, because the pot life is extended.

本発明に係る接着剤組成物は、導電性粒子を含有しなくとも、接続時に相対向する回路電極の直接接触により接続が得られる。一方、導電性粒子を含有した場合、より安定した接続が得られるので好ましい。   Even if the adhesive composition according to the present invention does not contain conductive particles, connection can be obtained by direct contact of circuit electrodes facing each other at the time of connection. On the other hand, it is preferable to contain conductive particles because a more stable connection can be obtained.

本発明において必要に応じて含まれる導電性粒子は、電気的接続を得ることができる導電性を有するものであれば特に制限されない。導電性粒子としては、例えば、Ａｕ、Ａｇ、Ｎｉ、Ｃｕ及びはんだ等の金属粒子やカーボン等が挙げられる。また、導電性粒子は、核となる粒子を１層又は２層以上の層で被覆し、その最外層が導電性を有するものであってもよい。この場合、より優れたポットライフを得る観点から、最外層が、Ｎｉ、Ｃｕなどの遷移金属よりも、Ａｕ、Ａｇ及び／又は白金族金属などの貴金属を主成分とすることが好ましく、これらの貴金属の少なくとも１種以上からなることがより好ましい。これらの貴金属の中では、Ａｕが最も好ましい。   In the present invention, the conductive particles included as necessary are not particularly limited as long as they have electrical conductivity capable of obtaining electrical connection. Examples of the conductive particles include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon. Further, the conductive particles may be one in which the core particles are covered with one layer or two or more layers, and the outermost layer has conductivity. In this case, from the viewpoint of obtaining a better pot life, the outermost layer is preferably composed mainly of a noble metal such as Au, Ag and / or a platinum group metal rather than a transition metal such as Ni or Cu. More preferably, it consists of at least one kind of noble metal. Of these noble metals, Au is most preferable.

導電性粒子は、核としての遷移金属を主成分とする粒子又は核を被覆した遷移金属を主成分とする層の表面を、更に貴金属を主成分とする層で被覆してなるものであってもよい。また、導電性粒子は、非導電性のガラス、セラミック、プラスチック等を主成分とする絶縁性粒子を核とし、この核の表面に上記金属又はカーボンを主成分とする層で被覆したものであってもよい。   The conductive particles are formed by coating the surface of a particle mainly composed of transition metal as a nucleus or a layer mainly composed of transition metal covering the nucleus with a layer mainly composed of noble metal. Also good. In addition, the conductive particles have insulating particles mainly composed of non-conductive glass, ceramics, plastics, etc. as the core, and the surface of the core is coated with a layer mainly composed of the metal or carbon. May be.

導電性粒子が、絶縁性粒子である核を導電層で被覆してなるものである場合、絶縁性粒子がプラスチックを主成分とするものであり、最外層が貴金属を主成分とするものであると好ましい。これにより、接着剤組成物を回路接続材料等の電気的接続材料として用いた場合、導電性粒子が加熱及び加圧に対して良好に変形することができる。しかも、回路等の接続時に、導電性粒子の電極や接続端子との接触面積が増加する。そのため、電気的接続材料の接続信頼性を更に向上させることができる。同様の観点から、導電性粒子が、上記加熱により溶融する金属を主成分として含む粒子であると好ましい。   In the case where the conductive particles are formed by coating nuclei that are insulating particles with a conductive layer, the insulating particles are mainly composed of plastic, and the outermost layer is composed mainly of a noble metal. And preferred. Thereby, when the adhesive composition is used as an electrical connection material such as a circuit connection material, the conductive particles can be satisfactorily deformed by heating and pressurization. In addition, the contact area of the conductive particles with the electrodes and connection terminals increases when connecting a circuit or the like. Therefore, the connection reliability of the electrical connection material can be further improved. From the same point of view, the conductive particles are preferably particles containing as a main component a metal that is melted by the heating.

導電性粒子が、絶縁性粒子である核を導電層で被覆してなるものである場合、一層良好な導電性を得るために、導電層の厚みは１００Å（１０ｎｍ）以上であると好ましい。また、導電性粒子が、核としての遷移金属を主成分とする粒子又は核を被覆した遷移金属を主成分とする層の表面を、更に貴金属を主成分とする層で被覆してなるものである場合、最外層となる上記貴金属を主成分とする層の厚みは３００Å（３０ｎｍ）以上であると好ましい。この厚みが３００Åを下回ると、最外層が破断しやすくなる。その結果、露出した遷移金属が接着剤成分と接触し、遷移金属による酸化還元作用により遊離ラジカルが発生しやすくなるため、ポットライフが容易に低下する傾向にある。一方、上記導電層の厚みが厚くなるとそれらの効果が飽和してくるので、その厚みを１μｍ以下にするのが好ましい。   In the case where the conductive particles are formed by covering nuclei that are insulating particles with a conductive layer, the thickness of the conductive layer is preferably 100 mm (10 nm) or more in order to obtain better conductivity. Further, the conductive particles are formed by coating the surface of a layer mainly composed of a transition metal as a nucleus or a layer mainly composed of a transition metal covering the nucleus with a layer mainly composed of a noble metal. In some cases, the thickness of the outermost layer mainly composed of the noble metal is preferably 300 mm (30 nm) or more. When this thickness is less than 300 mm, the outermost layer is easily broken. As a result, the exposed transition metal comes into contact with the adhesive component, and free radicals are easily generated due to the redox action of the transition metal, so that the pot life tends to be easily reduced. On the other hand, since the effect is saturated when the thickness of the conductive layer is increased, the thickness is preferably 1 μm or less.

導電性粒子を用いる場合の配合割合は、特に制限を受けないが、接着剤組成物１００体積部に対して０．１〜３０体積部であることが好ましく、０．１〜１０体積部であることがより好ましい。この値が、０．１体積部未満であると良好な導電性が得られ難くなる傾向にあり、３０体積部を超えると回路等の短絡が起こりやすくなる傾向がある。なお、導電性粒子の配合割合（体積部）は、２３℃における接着剤組成物を硬化させる前の各成分の体積に基づいて決定される。各成分の体積は、比重を利用して重量から体積に換算する方法や、その成分を溶解したり膨潤させたりせず、その成分をよくぬらす適当な溶媒（水、アルコール等）を入れたメスシリンダー等の容器にその成分を投入し、増加した体積から算出する方法によって求めることができる。   The mixing ratio in the case of using conductive particles is not particularly limited, but is preferably 0.1 to 30 parts by volume, and 0.1 to 10 parts by volume with respect to 100 parts by volume of the adhesive composition. It is more preferable. If this value is less than 0.1 part by volume, good conductivity tends to be difficult to obtain, and if it exceeds 30 parts by volume, short circuits such as circuits tend to occur. In addition, the mixture ratio (volume part) of electroconductive particle is determined based on the volume of each component before hardening the adhesive composition in 23 degreeC. The volume of each component is a method of converting from weight to volume using specific gravity, or a female containing an appropriate solvent (water, alcohol, etc.) that does not dissolve or swell the component but wets the component well The component can be obtained by charging the component into a container such as a cylinder and calculating from the increased volume.

接着剤組成物は、上述のもの以外に、使用目的に応じて別の材料を添加することができる。例えば、この接着剤組成物に、カップリング剤及び密着性向上剤、レベリング剤などの接着助剤を適宜添加してもよい。これにより、更に良好な密着性や取扱い性を付与することができるようになる。また、本発明に係る接着剤組成物は、ゴムを含有してもよい。これにより、応力の緩和及び接着性の向上が可能となる。さらには、この接着剤組成物には、硬化速度の制御や貯蔵安定性を付与するために、安定化剤を添加することできる。更に接着剤組成物には、充填材、軟化剤、促進剤、老化防止剤、着色剤、難燃化剤、チキソトロピック剤、フェノール樹脂、メラミン樹脂、イソシアネート類等を配合してもよい。   In addition to the adhesive composition described above, other materials can be added to the adhesive composition depending on the purpose of use. For example, a bonding aid such as a coupling agent, an adhesion improver, and a leveling agent may be appropriately added to the adhesive composition. As a result, it is possible to impart better adhesion and handleability. Moreover, the adhesive composition according to the present invention may contain rubber. As a result, stress can be relaxed and adhesion can be improved. Furthermore, a stabilizer can be added to the adhesive composition in order to control the curing rate and impart storage stability. Furthermore, a filler, a softener, an accelerator, an anti-aging agent, a colorant, a flame retardant, a thixotropic agent, a phenol resin, a melamine resin, isocyanates, and the like may be blended in the adhesive composition.

接着剤組成物は、充填材（フィラー）を含有した場合、接続信頼性等の向上が得られるので好ましい。充填材としては、絶縁性を有するものであって、その最大径が導電性粒子の平均粒径未満であれば使用できる。充填材の配合割合は、接着剤組成物１００体積部に対して、５〜６０体積部であることが好ましい。充填材の配合割合が６０体積部を超えると、信頼性向上の効果が飽和する傾向にあり、５体積部未満では充填材の添加効果が小さくなる傾向にある。   When the adhesive composition contains a filler (filler), an improvement in connection reliability and the like is obtained, which is preferable. The filler can be used if it has insulating properties and its maximum diameter is less than the average particle diameter of the conductive particles. The blending ratio of the filler is preferably 5 to 60 parts by volume with respect to 100 parts by volume of the adhesive composition. When the blending ratio of the filler exceeds 60 parts by volume, the effect of improving the reliability tends to be saturated, and when it is less than 5 parts by volume, the effect of adding the filler tends to be small.

カップリング剤としては、接着性の向上の点からケチミン、ビニル基、アクリル基、アミノ基、エポキシ基及びイソシアネート基含有物が好ましく使用できる。具体的には、アクリル基を有するシランカップリング剤として、（３−メタクリロキシプロピル）トリメトキシシラン、（３−アクリロキシプロピル）トリメトキシシラン、（３−メタクリロキシプロピル）ジメトキシメチルシラン、（３−アクリロキシプロピル）ジメトキシメチルシラン、アミノ基を有するシランカップリング剤として、Ｎ−β（アミノエチル）γ−アミノプロピルトリメトキシシラン、Ｎ−β（アミノエチル）γ−アミノプロピルメチルジメトキシシラン、γ−アミノプロピルトリエトキシシラン、Ｎ−フェニル−γ−アミノプロピルトリメトキシシラン等が挙げられる。ケチミンを有するシランカップリング剤として、上記のアミノ基を有するシランカップリング剤に、アセトン、メチルエチルケトン、メチルイソブチルケトン等のケトン化合物を反応させて得られたものが挙げられる。また、エポキシ基を有するシランカップリング剤として、γ−グリシジルオキシプロピルトリメトキシシラン、γ−グリシジルオキシプロピルトリエトキシシラン、γ−グリシジルオキシプロピル−メチルジメトキシシラン、γ−グリシジルオキシプロピル−メチルジエトキシシラン等が挙げられる。   As the coupling agent, a ketimine, vinyl group, acrylic group, amino group, epoxy group and isocyanate group-containing material can be preferably used from the viewpoint of improving adhesiveness. Specifically, as a silane coupling agent having an acrylic group, (3-methacryloxypropyl) trimethoxysilane, (3-acryloxypropyl) trimethoxysilane, (3-methacryloxypropyl) dimethoxymethylsilane, (3 -Acryloxypropyl) dimethoxymethylsilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ as a silane coupling agent having an amino group -Aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane and the like. Examples of the silane coupling agent having ketimine include those obtained by reacting the above silane coupling agent having an amino group with a ketone compound such as acetone, methyl ethyl ketone, and methyl isobutyl ketone. Moreover, as a silane coupling agent having an epoxy group, γ-glycidyloxypropyltrimethoxysilane, γ-glycidyloxypropyltriethoxysilane, γ-glycidyloxypropyl-methyldimethoxysilane, γ-glycidyloxypropyl-methyldiethoxysilane Etc.

カップリング剤の配合割合は、接着剤組成物中のその他の配合物の合計１００質量部に対して０．１〜２０質量部が好ましい。カップリング剤の配合割合が０．１質量部未満の場合、実質的な添加効果が得られない傾向がある。またカップリング剤の配合割合が２０質量部を超える場合、支持基材上へ接着剤組成物からなる接着層を形成した際の接着層のフィルム形成性が低下し、膜厚強度が低下する傾向がある。   As for the mixture ratio of a coupling agent, 0.1-20 mass parts is preferable with respect to a total of 100 mass parts of the other compound in an adhesive composition. When the blending ratio of the coupling agent is less than 0.1 parts by mass, there is a tendency that a substantial addition effect cannot be obtained. In addition, when the blending ratio of the coupling agent exceeds 20 parts by mass, the film formability of the adhesive layer when the adhesive layer made of the adhesive composition is formed on the support substrate tends to decrease, and the film thickness strength tends to decrease. There is.

本発明の接着シートにおいて、用いられる支持基材としては、シート状又はフィルム状のものが好ましい。また、支持基材は２層以上を積層した形状のものでもよい。支持基材は、ポリエチレンテレフタレート（ＰＥＴ）フィルム、配向ポリプロピレン（ＯＰＰ）フィルム、ポリエチレン（ＰＥ）フィルム及びポリイミドフィルムからなる群より選ばれる１種以上のフィルムを備えることが好ましい。それらの中でも、寸法精度の向上とコスト低減の点からＰＥＴフィルムが好ましい。また、支持基材は、支持基材を接着層から一層容易に剥離するために、接着層が設けられる側の表面を必要に応じて離型処理剤で処理したものでもよい。離型処理剤としては、例えば、シリコーン、シリコーンアルキッド、アミノアルキッド、アルキルアルキッド及びメラミンが挙げられる。また、支持基材は、その表面をポリマー等でコーティングしたものでもよい。さらに支持基材には帯電防止層が設けられていてもよい。これらの処理は、１種を単独で又は２種以上を組み合わせてもよい。ここで、表面処理を施した場合の支持基材の厚みＴｓは、上記表面処理を施した後の値を示す。   In the adhesive sheet of the present invention, the support substrate used is preferably a sheet or film. Further, the support substrate may have a shape in which two or more layers are laminated. The support substrate preferably includes at least one film selected from the group consisting of a polyethylene terephthalate (PET) film, an oriented polypropylene (OPP) film, a polyethylene (PE) film, and a polyimide film. Among these, PET film is preferable from the viewpoint of improvement in dimensional accuracy and cost reduction. In addition, the support base material may be obtained by treating the surface on the side on which the adhesive layer is provided with a release treatment agent as necessary in order to more easily peel the support base material from the adhesive layer. Examples of the mold release treatment agent include silicone, silicone alkyd, amino alkyd, alkyl alkyd, and melamine. Further, the support substrate may have a surface coated with a polymer or the like. Furthermore, the support base may be provided with an antistatic layer. These treatments may be used alone or in combination of two or more. Here, the thickness Ts of the supporting base material when the surface treatment is performed indicates a value after the surface treatment is performed.

本発明に用いられる支持基材の厚みＴｓは、４２μｍ以下である。Ｔｓが４２μｍを超えると、接着層の縁部等の一部又は全部が基板から剥離する傾向にある。これは、接着シートを基板に仮固定後、支持基材を接着層から剥がす際に支持基材と接着層の剥離点の角度が小さくなり、剥離に要する負荷が大きくなることに起因する。また、支持基材は厚くなるほど使用する原料が増加し、得られる接着シートのコストが上昇する傾向がある。一方、Ｔｓの下限値は、支持基材上に接着層を設ける際の熱履歴や機械的ストレス等により切れたり厚みが容易に変化したりなければ特に制約はないが、１８μｍ以上が好ましい。Ｔｓが１８μｍ未満であると、熱履歴や機械的ストレス等により、切れたり厚みが容易に変化したりする傾向がある。上述の支持基材は市販のものを入手してもよく、常法により作製してもよい。   The thickness Ts of the support substrate used in the present invention is 42 μm or less. When Ts exceeds 42 μm, part or all of the edge or the like of the adhesive layer tends to peel from the substrate. This is because, after temporarily fixing the adhesive sheet to the substrate, when the support base material is peeled from the adhesive layer, the angle of the peeling point between the support base material and the adhesive layer becomes small, and the load required for the peeling becomes large. In addition, the thicker the support base, the more raw materials to use, and the cost of the resulting adhesive sheet tends to increase. On the other hand, the lower limit value of Ts is not particularly limited as long as it is not cut or easily changed due to thermal history, mechanical stress, or the like when the adhesive layer is provided on the support substrate, but is preferably 18 μm or more. When Ts is less than 18 μm, there is a tendency that the thickness is easily changed due to thermal history, mechanical stress, or the like. The above-mentioned support base material may obtain a commercially available thing, and may be produced by a conventional method.

さらに、本発明の接着シートは、支持基材の厚みＴｓと接着層の厚みＴａとが、下記式（１）で表される条件を満たしている。
０．４０≦Ｔａ／Ｔｓ≦０．６５ （１）
Ｔａ／Ｔｓがこの範囲にあることにより、本発明の接着シートは、従来よりも広範囲な温度条件で接着層を基板上に十分に仮固定することが可能となる。Ｔａ／Ｔｓは、好ましくは０．４２以上０．６３以下であり、より好ましくは０．４５以上０．６０以下であり、特に好ましくは０．４７以上０．５８以下である。 Furthermore, in the adhesive sheet of the present invention, the thickness Ts of the supporting substrate and the thickness Ta of the adhesive layer satisfy the condition represented by the following formula (1).
0.40 ≦ Ta / Ts ≦ 0.65 (1)
When Ta / Ts is within this range, the adhesive sheet of the present invention can sufficiently temporarily fix the adhesive layer on the substrate under a wider range of temperature conditions than before. Ta / Ts is preferably 0.42 or more and 0.63 or less, more preferably 0.45 or more and 0.60 or less, and particularly preferably 0.47 or more and 0.58 or less.

Ｔａ／Ｔｓが０．４０未満では、接着層の厚みＴａが相対的に薄くなり、接着層を形成する際に支持基材の物性が支配的となり、支持基材の種類により接着層に伸び又は縮み応力が大きく働く傾向がある。一方、Ｔａ／Ｔｓが０．６５を超えると、接着層形成時に接着層の物性が支配的となり、接着剤の種類により接着層に伸び又は縮み応力が大きく働く傾向がある。そのため、このような状態では、接着シートを基板上へ十分に仮固定することが難しくなり、たとえ仮固定できても、支持基材を剥がす際に接着層が支持基材ごと剥がれる傾向や、接着剤の縁部分の密着不良が発生する傾向がある。そこで、ＴｓとＴａとが上記式（１）で表される条件を満たすことで、接着層を支持基材上に形成するときに支持基材と接着層との間に生じる応力を緩和することができ、接着シートを基板上に十分に仮固定することができる。また、Ｔａ／Ｔｓが０．６５を超えると、接着層の厚みＴａが相対的に厚くなるため、接着シートを仮固定する際に接着剤組成物が染み出して支持基材の側面部分や接着層が設けられている側とは逆側の表面に回りこみ易くなる。そのため、支持基材を除去する際に接着層の縁部が密着不良となる傾向や、圧着ヘッドが汚染される傾向がある。   When Ta / Ts is less than 0.40, the thickness Ta of the adhesive layer is relatively thin, and the physical properties of the support base material are dominant when the adhesive layer is formed. There is a tendency for shrinkage stress to work greatly. On the other hand, when Ta / Ts exceeds 0.65, the physical properties of the adhesive layer become dominant at the time of forming the adhesive layer, and there is a tendency that elongation or shrinkage stress acts largely on the adhesive layer depending on the type of the adhesive. Therefore, in such a state, it becomes difficult to sufficiently temporarily fix the adhesive sheet onto the substrate. Even if it can be temporarily fixed, the adhesive layer tends to be peeled off together with the supporting base material when the supporting base material is peeled off. There is a tendency for poor adhesion at the edge of the agent. Therefore, when Ts and Ta satisfy the condition represented by the above formula (1), the stress generated between the support base material and the adhesive layer when the adhesive layer is formed on the support base material is relieved. And the adhesive sheet can be sufficiently temporarily fixed on the substrate. Further, when Ta / Ts exceeds 0.65, the thickness Ta of the adhesive layer becomes relatively thick, so that the adhesive composition oozes out when temporarily fixing the adhesive sheet, and the side surface portion of the support substrate or the adhesive is bonded. It becomes easy to wrap around on the surface opposite to the side where the layer is provided. Therefore, when removing a support base material, there exists a tendency for the edge part of a contact bonding layer to become a contact | adherence defect, and a pressure bonding head to be contaminated.

本発明の接着シートにおいて、支持基材上に接着層を設ける方法としては、接着剤組成物を溶媒に溶解させ支持基材上に塗布してから溶剤を除去する方法、接着剤組成物を加温して流動性を確保しそのまま支持基材上に塗布して冷却する方法、予め形成されている接着層に支持基材を貼り合わせる方法等が挙げられる。本発明の接着シートは、上記いずれの方法を用いて作製してもよい。本発明による上述の効果をより有効かつ確実に奏するためには、支持基材上に接着層を設ける方法として、接着剤組成物を溶媒に溶解させ支持基材上に塗布してから溶剤を除去する方法、あるいは、接着剤組成物を加温して流動性を確保しそのまま支持基材上に塗布して冷却する方法が好ましい。また、支持基材上に設けられる接着層は単層でもよく、組成の異なる２層以上を重ねて構成してもよい。   In the adhesive sheet of the present invention, as a method of providing an adhesive layer on a supporting substrate, a method of removing the solvent after dissolving the adhesive composition in a solvent and applying it to the supporting substrate, an adhesive composition is added. Examples thereof include a method of heating and securing fluidity, coating the support substrate as it is, and cooling, a method of bonding the support substrate to a previously formed adhesive layer, and the like. The adhesive sheet of the present invention may be produced using any of the above methods. In order to achieve the above-mentioned effects of the present invention more effectively and reliably, as a method of providing an adhesive layer on a support substrate, the adhesive composition is dissolved in a solvent and applied onto the support substrate, and then the solvent is removed. Or a method of heating the adhesive composition to ensure fluidity, applying the composition directly onto a supporting substrate, and cooling it. In addition, the adhesive layer provided on the support substrate may be a single layer or may be formed by stacking two or more layers having different compositions.

上記接着シートには、接着層上にさらに保護フィルムを設けてもよい。保護フィルムとしては特に制限はないが、ポリエチレンテレフタレート（ＰＥＴ）フィルム、配向ポリプロピレン（ＯＰＰ）フィルム、ポリエチレン（ＰＥ）フィルム及ぶポリイミドフィルムからなる群より選ばれる１種以上のフィルムを備えることが好ましい。これらの中では、コストを低減する観点からＰＥ又はＰＥＴフィルムが望ましい。   In the adhesive sheet, a protective film may be further provided on the adhesive layer. Although there is no restriction | limiting in particular as a protective film, It is preferable to provide 1 or more types of films chosen from the group which consists of a polyethylene terephthalate (PET) film, an oriented polypropylene (OPP) film, a polyethylene (PE) film, and a polyimide film. In these, PE or PET film is desirable from a viewpoint of reducing cost.

保護フィルムを配置する方法としては、接着シートの接着層表面にさらに保護フィルムをラミネーター等で積層する方法や、接着シートと、別の接着層を配置した保護フィルムとを接着層同士で貼り合わせる方法等があり、特に制限なく行うことができる。   As a method of arranging the protective film, a method of laminating a protective film on the surface of the adhesive layer of the adhesive sheet with a laminator or the like, and a method of bonding the adhesive sheet and a protective film on which another adhesive layer is arranged between the adhesive layers Etc., and can be carried out without particular limitation.

保護フィルムは、必要に応じて離型処理剤で表面処理してもよい。離型処理剤としてはシリコーン、シリコーンアルキッド、アミノアルキッド、アルキルアルキッド、メラミン等があげられる。また、保護フィルムの表面をポリマー等でコーティングしてもよい。さらに保護フィルムには帯電防止層を設けてもよい。これらは１種を単独で又は２種以上を組み合わせて行うことができる。表面処理を施した場合の保護フィルムの厚みＴｐは、通常、表面処理を施した後の厚みである。   You may surface-treat a protective film with a mold release processing agent as needed. Examples of the mold release treatment agent include silicone, silicone alkyd, amino alkyd, alkyl alkyd, and melamine. Further, the surface of the protective film may be coated with a polymer or the like. Further, an antistatic layer may be provided on the protective film. These can be performed singly or in combination of two or more. The thickness Tp of the protective film when the surface treatment is performed is usually the thickness after the surface treatment.

上記保護フィルムの厚みＴｐは、保護フィルムを除去する際に、接着層が支持基材から剥離してしまうことを防ぐため、支持基材の厚みＴｓ以下であることが好ましい。   The thickness Tp of the protective film is preferably equal to or less than the thickness Ts of the support base material in order to prevent the adhesive layer from peeling off from the support base material when the protective film is removed.

本発明の接着シートにおいて、支持基材及び接着層間の剥離強度が、保護フィルム及び接着層間の剥離強度以上であることが好ましい。支持基材及び接着層間の剥離強度が、保護フィルム及び接着層間の剥離強度未満であると、接着層から保護フィルムを剥離しようとする際に、支持基材及び接着層間で先に剥離する傾向がある。なお上記剥離強度の関係は、例えば、支持基材と接着層とを積層してなる積層体、及び接着層と保護フィルムとを積層してなる積層体のそれぞれについて、市販のレオメータを用いて、引張り速度５０ｍｍ／分で剥離した際の引張り強度値から比較することができる。   In the adhesive sheet of the present invention, the peel strength between the support substrate and the adhesive layer is preferably equal to or higher than the peel strength between the protective film and the adhesive layer. When the peeling strength between the supporting substrate and the adhesive layer is less than the peeling strength between the protective film and the adhesive layer, when the protective film is to be peeled from the adhesive layer, there is a tendency to peel first between the supporting substrate and the adhesive layer. is there. The relationship of the peel strength is, for example, for each of a laminate formed by laminating a support substrate and an adhesive layer, and a laminate obtained by laminating an adhesive layer and a protective film, using a commercially available rheometer, The comparison can be made from the tensile strength value when peeling is performed at a pulling speed of 50 mm / min.

本実施形態の接着シートは、３０〜８０℃の広い温度範囲で被着体に固定することができる。この際の加熱時間には特に制限はないが、０．１〜１０秒間が好ましく、０．３〜８秒間がより好ましく、０．５〜５秒間がさらに好ましい。０．１秒間未満では実質的にほとんど圧力がかからない状態となり、密着不良となる傾向がある。一方、１０秒間を超える場合、生産性が低下する傾向がある。また、接着シートを固定する際の加圧圧力には特に制限はない。ただし、接着層の被着体の面積当たり０．１〜１０ＭＰａが好ましい。その後、支持基材を除去し、加熱及び加圧を併用して被着体を接着させることができる。加熱温度は、特に制限は受けないが、１００〜２５０℃の温度が好ましい。圧力は、被着体に損傷を与えない範囲であれば、特に制限は受けないが、一般的には０．１〜１０ＭＰａが好ましい。これらの加熱及び加圧は、０．５秒〜１２０秒間の範囲で行うことが好ましい。例えば、温度１４０〜２００℃、圧力３ＭＰａの条件下で、１０秒間加熱及び加圧を行うことで接着層と被着体を接着させることが可能である。   The adhesive sheet of this embodiment can be fixed to an adherend in a wide temperature range of 30 to 80 ° C. Although there is no restriction | limiting in particular in the heating time in this case, 0.1 to 10 second is preferable, 0.3 to 8 second is more preferable, 0.5 to 5 second is further more preferable. If the time is less than 0.1 seconds, the pressure is substantially not applied, and there is a tendency to cause poor adhesion. On the other hand, when it exceeds 10 seconds, there exists a tendency for productivity to fall. Moreover, there is no restriction | limiting in particular in the pressurization pressure at the time of fixing an adhesive sheet. However, 0.1-10 MPa is preferable per area of the adherend of the adhesive layer. Then, a support base material is removed and a to-be-adhered body can be adhere | attached using heating and pressurization together. The heating temperature is not particularly limited, but a temperature of 100 to 250 ° C. is preferable. The pressure is not particularly limited as long as it does not damage the adherend, but is generally preferably 0.1 to 10 MPa. These heating and pressurization are preferably performed in the range of 0.5 seconds to 120 seconds. For example, the adhesive layer and the adherend can be bonded by heating and pressing for 10 seconds under conditions of a temperature of 140 to 200 ° C. and a pressure of 3 MPa.

本実施形態の接着シートは、互いに異なる種類の被着体、例えば、半導体チップ、抵抗体チップ、コンデンサチップ等のチップ部品や、プリント基板等のような回路部材同士を接続する回路接続材料として使用することができる。具体的には、異方導電性フィルムに代表される上述及び後に詳述するような回路接続材料の他、ＣＳＰ用エラストマー、ＣＳＰ用アンダーフィルム材、ＬＯＣテープ等に代表される半導体素子接着材料として使用することができる。   The adhesive sheet of the present embodiment is used as a circuit connection material for connecting different kinds of adherends, for example, chip components such as semiconductor chips, resistor chips, capacitor chips, and circuit members such as printed boards. can do. Specifically, as a semiconductor element adhesive material represented by an elastomer for CSP, an under film material for CSP, a LOC tape, etc. in addition to the circuit connection materials detailed above and later represented by an anisotropic conductive film. Can be used.

（回路部材の接続構造）
次に、本発明の回路部材の接続構造の好適な実施形態について説明する。図１は、本発明の回路部材の接続構造の一実施形態を示す概略断面図である。図１に示すように、本実施形態の回路部材の接続構造１は、相互に対向する第１の回路部材２０及び第２の回路部材３０を備えており、第１の回路部材２０と第２の回路部材３０との間には、これらを電気的に接続する回路接続部材１０が設けられている。第１の回路部材２０は、第１の回路基板２１と、回路基板２１の主面２１ａ上に形成される第１の回路電極２２とを備えている。なお、回路基板２１の主面２１ａ上には、場合により絶縁層（図示せず）が形成されていてもよい。 (Circuit member connection structure)
Next, a preferred embodiment of the circuit member connection structure of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure of the present invention. As shown in FIG. 1, the circuit member connection structure 1 of the present embodiment includes a first circuit member 20 and a second circuit member 30 that face each other. Between these circuit members 30, a circuit connection member 10 is provided for electrically connecting them. The first circuit member 20 includes a first circuit board 21 and a first circuit electrode 22 formed on the main surface 21 a of the circuit board 21. Note that an insulating layer (not shown) may be formed on the main surface 21a of the circuit board 21 in some cases.

一方、第２の回路部材３０は、第２の回路基板３１と、第２の回路基板３１の主面３１ａ上に形成される第２の回路電極３２とを備えている。また、回路基板３１の主面３１ａ上にも、場合により絶縁層（図示せず）が形成されていてもよい。   On the other hand, the second circuit member 30 includes a second circuit board 31 and a second circuit electrode 32 formed on the main surface 31 a of the second circuit board 31. In addition, an insulating layer (not shown) may be formed on the main surface 31a of the circuit board 31 according to circumstances.

第１の回路部材２０及び第２の回路部材３０としては、電気的接続を必要とする電極が形成されているものであれば特に制限されない。具体的には、液晶ディスプレイに用いられているＩＴＯ等で電極が形成されているガラス又はプラスチック基板、プリント配線板、セラミック配線板、フレキシブル配線板、半導体シリコンチップ等が挙げられ、これらは必要に応じて組み合わせて用いることができる。このように、本実施形態では、プリント配線板やポリイミド等の有機物からなる材質をはじめ、銅、アルミニウム等の金属やＩＴＯ（indium tin oxide）、窒化ケイ素（ＳｉＮｘ）、二酸化ケイ素（ＳｉＯ２）等の無機材質のように多種多様な表面状態を有する回路部材を用いることができる。 The first circuit member 20 and the second circuit member 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include glass or plastic substrates with electrodes formed of ITO or the like used for liquid crystal displays, printed wiring boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, and the like. They can be used in combination. As described above, in this embodiment, a material made of an organic substance such as a printed wiring board or polyimide, a metal such as copper or aluminum, ITO (indium tin oxide), silicon nitride (SiN x ), silicon dioxide (SiO 2 ). Circuit members having various surface states such as inorganic materials such as the above can be used.

回路接続部材１０は、絶縁性物質１１及び導電性粒子７を含有している。導電性粒子７は、対向する第１の回路電極２２と第２の回路電極３２との間のみならず、主面２１ａと３１ａとの間にも配置されている。本実施形態の回路部材の接続構造１においては、第１の回路電極２２と第２の回路電極３２とが、導電性粒子７を介して電気的に接続されている。このため、第１の回路電極２２及び第２の回路電極３２の間の接続抵抗が十分に低減される。したがって、第１の回路電極２２及び第２の回路電極３２の間の電流の流れを円滑にすることができ、回路の持つ機能を十分に発揮することができる。また、この導電性粒子７を上述した配合割合とすることによって電気的な接続の異方性を示すことも可能である。   The circuit connecting member 10 contains an insulating material 11 and conductive particles 7. The conductive particles 7 are disposed not only between the first circuit electrode 22 and the second circuit electrode 32 facing each other but also between the main surfaces 21a and 31a. In the circuit member connection structure 1 of the present embodiment, the first circuit electrode 22 and the second circuit electrode 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the first circuit electrode 22 and the second circuit electrode 32 is sufficiently reduced. Therefore, the flow of current between the first circuit electrode 22 and the second circuit electrode 32 can be made smooth, and the functions of the circuit can be sufficiently exhibited. Moreover, it is also possible to show the anisotropy of electrical connection by setting the conductive particles 7 to the above-described mixing ratio.

次に、回路接続部材が導電性粒子を含有しない場合の本発明に係る回路部材の接続構造の好適な実施形態について説明する。図２は、本発明に係る回路部材の接続構造の一実施形態を示す概略断面図である。図２に示すように、本実施形態の回路部材の接続構造２は、相互に対向する第１の回路部材２０及び第２の回路部材３０を備えており、第１の回路部材２０と第２の回路部材３０との間には、これらを接続する回路接続部材１５が設けられている。第１の回路部材２０は、第１の回路基板２１と、回路基板２１の主面２１ａ上に形成される第１の回路電極２２とを備えている。なお、回路基板２１の主面２１ａ上には、場合により絶縁層（図示せず）が形成されていてもよい。   Next, a preferred embodiment of a circuit member connection structure according to the present invention when the circuit connection member does not contain conductive particles will be described. FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit member connection structure according to the present invention. As shown in FIG. 2, the circuit member connection structure 2 of the present embodiment includes a first circuit member 20 and a second circuit member 30 that face each other. Between these circuit members 30, a circuit connection member 15 for connecting them is provided. The first circuit member 20 includes a first circuit board 21 and a first circuit electrode 22 formed on the main surface 21 a of the circuit board 21. Note that an insulating layer (not shown) may be formed on the main surface 21a of the circuit board 21 in some cases.

一方、第２の回路部材３０は、第２の回路基板３１と、第２の回路基板３１の主面３１ａ上に形成される第２の回路電極３２とを備えている。また、回路基板３１の主面３１ａ上にも、場合により絶縁層（図示せず）が形成されていてもよい。   On the other hand, the second circuit member 30 includes a second circuit board 31 and a second circuit electrode 32 formed on the main surface 31 a of the second circuit board 31. In addition, an insulating layer (not shown) may be formed on the main surface 31a of the circuit board 31 according to circumstances.

回路接続部材１５は、絶縁性物質１１を含有しているが導電性粒子７を含有していない。そのため、第１の回路電極２２及び第２の回路電極３２の間に所望の量の電流が流れるように、それらを直接接触させるか若しくは十分に近づけることで電気的に接続される。この際、第１の回路電極２２及び第２の回路電極３２間の位置を調節することで、電気的な接続の異方性を示すことも可能である。   The circuit connecting member 15 contains the insulating substance 11 but does not contain the conductive particles 7. For this reason, the first circuit electrode 22 and the second circuit electrode 32 are electrically connected by bringing them into direct contact or sufficiently close so that a desired amount of current flows. At this time, by adjusting the position between the first circuit electrode 22 and the second circuit electrode 32, it is possible to show anisotropy of electrical connection.

回路接続部材１０及び１５は本発明の接着シートにおける接着層の硬化物を備えている。そのため、回路接続部材１０及び１５の一部が剥離除去されていたり、支持基材４５の一部が残存していたりすることが十分に防止されている。これにより、第１の回路部材２０又は第２の回路部材３０に対する回路接続部材１０及び１５の接着強度を十分に高くできる。したがって、第１の回路電極２２及び第２の回路電極３２間の電気的接続が可能となる。   The circuit connection members 10 and 15 include a cured product of the adhesive layer in the adhesive sheet of the present invention. For this reason, part of the circuit connecting members 10 and 15 is peeled and removed, and part of the support base material 45 is sufficiently prevented from remaining. Thereby, the adhesive strength of the circuit connection members 10 and 15 to the first circuit member 20 or the second circuit member 30 can be sufficiently increased. Therefore, electrical connection between the first circuit electrode 22 and the second circuit electrode 32 is possible.

（回路部材の接続構造の製造方法）
次に、上述した回路部材の接続構造の製造方法について、その工程図である図３を参照にしつつ、説明する。なお、ここでは接着剤組成物が熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含有する場合について説明する。 (Method for manufacturing circuit member connection structure)
Next, a method for manufacturing the circuit member connection structure described above will be described with reference to FIG. Here, the case where the adhesive composition contains a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator will be described.

先ず、上述した第一の回路部材２０と、フィルム状回路接続材料４０を支持基材４５上に設けた接着シートを用意する（図３（ａ）参照）。フィルム状回路接続材料４０は、回路接続材料をフィルム状に成形してなるものである。回路接続材料は、接着剤組成物５と、必要に応じて導電性粒子７とを含有する。ここで、接着剤組成物５には上述した本発明に係る接着剤組成物が用いられる。   First, an adhesive sheet in which the first circuit member 20 and the film-like circuit connecting material 40 described above are provided on a support base 45 is prepared (see FIG. 3A). The film-like circuit connection material 40 is formed by forming a circuit connection material into a film shape. The circuit connecting material contains an adhesive composition 5 and, if necessary, conductive particles 7. Here, the adhesive composition according to the present invention described above is used for the adhesive composition 5.

フィルム状回路接続材料４０の厚さは、７〜２８μｍであることが好ましい。フィルム状回路接続材料４０の厚さが７μｍ未満では、回路電極２２、３２間に回路接続材料が充填不足となる傾向がある。他方、２８μｍを超えると、回路電極２２、３２間の接着剤組成物を十分に排除しきれなくなり、回路電極２２、３２間の導通の確保が困難となる傾向がある。   The thickness of the film-like circuit connecting material 40 is preferably 7 to 28 μm. If the thickness of the film-like circuit connecting material 40 is less than 7 μm, the circuit connecting material tends to be insufficiently filled between the circuit electrodes 22 and 32. On the other hand, when it exceeds 28 μm, the adhesive composition between the circuit electrodes 22 and 32 cannot be sufficiently removed, and it is difficult to ensure conduction between the circuit electrodes 22 and 32.

次に、上記接着シートをフィルム状回路接続材料４０側を第一の回路部材２０に向けるようにして、第一の回路部材２０の回路電極２２が形成されている面上に載せる。このとき、フィルム状回路接続材料４０はフィルム状であり、取り扱いが容易である。このため、第一の回路部材２０と第二の回路部材３０との間にフィルム状回路接続材料４０を容易に介在させることができ、第一の回路部材２０と第二の回路部材３０との接続作業を容易に行うことができる。   Next, the adhesive sheet is placed on the surface of the first circuit member 20 on which the circuit electrodes 22 are formed so that the film-like circuit connecting material 40 side faces the first circuit member 20. At this time, the film-like circuit connecting material 40 is film-like and easy to handle. For this reason, the film-like circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the first circuit member 20 and the second circuit member 30 Connection work can be performed easily.

そして、接着シートを、図３（ａ）の矢印Ａ及びＢ方向に加圧し、フィルム状回路接続材料４０を第一の回路部材２０に仮固定する。このとき、加熱しながら加圧してもよい。但し、加熱温度はフィルム状回路接続材料４０中の接着剤組成物が硬化しない温度、すなわちラジカル重合開始剤がラジカルを発生する温度よりも低い温度とする。次に、支持基材４５をフィルム状回路接続材料４０から剥離する（図３（ｂ）参照）。支持基材４５を剥がす際に、フィルム状回路接続材料４０の一部又は全部が基板から剥離したり、支持基材４５の一部が残存したりすることなく、支持基材４５を剥離することができる。   Then, the adhesive sheet is pressurized in the directions of arrows A and B in FIG. 3A to temporarily fix the film-like circuit connecting material 40 to the first circuit member 20. At this time, you may pressurize, heating. However, the heating temperature is a temperature at which the adhesive composition in the film-like circuit connecting material 40 is not cured, that is, a temperature lower than the temperature at which the radical polymerization initiator generates radicals. Next, the support base material 45 is peeled from the film-like circuit connection material 40 (see FIG. 3B). When peeling off the support base material 45, the support base material 45 is peeled off without part or all of the film-like circuit connection material 40 being peeled off from the substrate or part of the support base material 45 remaining. Can do.

続いて、図３（ｃ）に示すように、第二の回路部材３０を、第二の回路電極を第一の回路部材２０に向けるようにしてフィルム状回路接続材料４０上に載せる。   Subsequently, as shown in FIG. 3C, the second circuit member 30 is placed on the film-like circuit connection material 40 so that the second circuit electrode faces the first circuit member 20.

そして、フィルム状回路接続材料４０を加熱しながら、図３（ｃ）の矢印Ａ及びＢ方向に第一及び第二の回路部材２０、３０を介して加圧する。このときの加熱温度は、ラジカル重合開始剤がラジカルを発生可能な温度とする。これにより、ラジカル重合開始剤においてラジカルが発生し、ラジカル重合性化合物の重合が開始される。こうして、フィルム状回路接続材料４０が硬化処理され、本接続が行われ、図１に示すような回路部材の接続構造が得られる。   And it heats through the 1st and 2nd circuit members 20 and 30 to the arrow A and B direction of FIG.3 (c), heating the film-form circuit connection material 40. FIG. The heating temperature at this time is a temperature at which the radical polymerization initiator can generate radicals. As a result, radicals are generated in the radical polymerization initiator, and polymerization of the radical polymerizable compound is started. In this way, the film-like circuit connection material 40 is cured and the main connection is performed, and a circuit member connection structure as shown in FIG. 1 is obtained.

加熱温度は、例えば、９０〜２００℃とし、接続時間は例えば１秒〜１０分とする。これらの条件は、使用する用途、接着剤組成物、回路部材によって適宜選択され、必要に応じて、後硬化を行ってもよい。   The heating temperature is, for example, 90 to 200 ° C., and the connection time is, for example, 1 second to 10 minutes. These conditions are appropriately selected depending on the application to be used, the adhesive composition, and the circuit member, and may be post-cured as necessary.

上記のようにして、回路部材の接続構造を製造すると、得られる回路部材の接続構造において、導電性粒子７を対向する回路電極２２、３２の双方に接触させることが可能となり、回路電極２２、３２間の接続抵抗を十分に低減することができる。   When the circuit member connection structure is manufactured as described above, in the circuit member connection structure obtained, the conductive particles 7 can be brought into contact with both of the circuit electrodes 22 and 32 facing each other. The connection resistance between 32 can be sufficiently reduced.

また、フィルム状回路接続材料４０の加熱により、回路電極２２と回路電極３２との間の距離を十分に小さくした状態で接着剤組成物５が硬化して絶縁性物質１１となり、第一の回路部材２０と第二の回路部材３０とが回路接続部材１０を介して強固に接続される。即ち、得られる回路部材の接続構造においては、回路接続部材１０は、上記接着剤組成物を含む回路接続材料の硬化物により構成されている。したがって、回路接続部材１０の一部が剥離除去されていたり、支持基材４５の一部が残存していたりすることが十分に防止されている。これにより、回路部材２０又は３０に対する回路接続部材１０の接着強度が十分に高くなり、かつ、回路電極２２、３２間の接続抵抗を十分に低減することができる。   In addition, the adhesive composition 5 is cured by the heating of the film-like circuit connecting material 40 in a state where the distance between the circuit electrode 22 and the circuit electrode 32 is sufficiently small, so that the insulating circuit 11 is obtained. The member 20 and the second circuit member 30 are firmly connected via the circuit connection member 10. That is, in the circuit member connection structure obtained, the circuit connection member 10 is made of a cured product of the circuit connection material containing the adhesive composition. Therefore, part of the circuit connection member 10 is peeled and removed, and part of the support base material 45 is sufficiently prevented from remaining. Thereby, the adhesive strength of the circuit connection member 10 to the circuit member 20 or 30 is sufficiently high, and the connection resistance between the circuit electrodes 22 and 32 can be sufficiently reduced.

なお、接着剤組成物５は、少なくとも加熱によりラジカルを発生するラジカル重合開始剤を含むものでもよく、このラジカル重合開始剤に代えて、光照射のみでラジカルを発生するラジカル重合開始剤を用いてもよい。この場合、フィルム状回路接続材料４０の硬化処理に際して、加熱に代えて光照射を行えばよい。この他にも、必要に応じて、超音波、電磁波等によりラジカルを発生するラジカル重合開始剤を用いてもよい。また、接着剤組成物５における硬化性成分としてエポキシ樹脂及び潜在性硬化剤を用いてもよい。   The adhesive composition 5 may include at least a radical polymerization initiator that generates radicals by heating. Instead of the radical polymerization initiator, a radical polymerization initiator that generates radicals only by light irradiation is used. Also good. In this case, when the film-like circuit connecting material 40 is cured, light irradiation may be performed instead of heating. In addition, a radical polymerization initiator that generates radicals by ultrasonic waves, electromagnetic waves, or the like may be used as necessary. Moreover, you may use an epoxy resin and a latent hardener as a sclerosing | hardenable component in the adhesive composition 5. FIG.

また、導電性粒子７の代わりに、他の導電材料を用いてもよい。他の導電材料としては、粒子状、又は短繊維状のカーボン、ＡｕめっきＮｉ線などの金属線条等が挙げられる。   Further, instead of the conductive particles 7, other conductive materials may be used. Examples of other conductive materials include particulate or short fiber carbon, metal wires such as Au-plated Ni wire, and the like.

フィルム状回路接続材料４０は、本発明の接着シートにおける接着層からなることから、従来よりも広範囲な温度条件でフィルム状回路接続材料４０を基板上に仮固定することが可能となる。したがって、仮固定後、支持基材４５を剥離する際に、支持基材４５と共にフィルム状回路接続材料４０が基板から剥離したり、フィルム状回路接続材料４０の一部が剥離除去されていたり、支持基材４５の一部が残存していたりすることが十分に防止されている。これにより、フィルム状回路接続材料４０を用いて回路接続部材の接続構造を製造する際のプロセスマージンが広くなり、生産歩留まりを向上することが可能となる。また、回路接続材料が導電性粒子７を含有しない場合、この製造方法により得られる接続構造は図２に示すようなものとなる。   Since the film-like circuit connecting material 40 is made of the adhesive layer in the adhesive sheet of the present invention, the film-like circuit connecting material 40 can be temporarily fixed on the substrate under a wider range of temperature conditions than before. Therefore, after temporarily fixing, when peeling the support base material 45, the film-like circuit connection material 40 is peeled from the substrate together with the support base material 45, or a part of the film-like circuit connection material 40 is peeled off, It is sufficiently prevented that a part of the support base material 45 remains. Thereby, the process margin when manufacturing the connection structure of a circuit connection member using the film-form circuit connection material 40 becomes wide, and it becomes possible to improve a production yield. When the circuit connection material does not contain the conductive particles 7, the connection structure obtained by this manufacturing method is as shown in FIG.

（半導体装置）
次に、本発明の半導体装置の実施形態について説明する。図４は、本発明の半導体装置の一実施形態を示す概略断面図である。図４に示すように、本実施形態の半導体装置３は、半導体素子５０と、半導体の支持部材となる基板６０とを備えており、半導体素子５０及び基板６０の間には、これらを電気的に接続する半導体素子接続部材８０が設けられている。また、半導体素子接続部材８０は基板６０の主面６０ａ上に積層され、半導体素子５０は更にその半導体素子接続部材８０上に積層されている。 (Semiconductor device)
Next, embodiments of the semiconductor device of the present invention will be described. FIG. 4 is a schematic cross-sectional view showing an embodiment of the semiconductor device of the present invention. As shown in FIG. 4, the semiconductor device 3 of the present embodiment includes a semiconductor element 50 and a substrate 60 serving as a semiconductor support member, and these are electrically connected between the semiconductor element 50 and the substrate 60. A semiconductor element connection member 80 is provided to connect to the semiconductor device. The semiconductor element connection member 80 is stacked on the main surface 60 a of the substrate 60, and the semiconductor element 50 is further stacked on the semiconductor element connection member 80.

基板６０は回路パターン６１を備えており、回路パターン６１は、基板６０の主面６０ａ上で半導体接続部材８０を介して又は直接に半導体素子５０と電気的に接続されている。そして、これらが封止材７０により封止され、半導体装置３が形成される。   The substrate 60 includes a circuit pattern 61, and the circuit pattern 61 is electrically connected to the semiconductor element 50 via the semiconductor connection member 80 on the main surface 60 a of the substrate 60 or directly. And these are sealed with the sealing material 70, and the semiconductor device 3 is formed.

半導体素子５０の材料としては特に制限されないが、シリコン、ゲルマニウムの１４族の半導体素子、ＧａＡｓ、ＩｎＰ、ＧａＰ、ＩｎＧａＡｓ、ＩｎＧａＡｓＰ、ＡｌＧａＡｓ、ＩｎＡｓ、ＧａＩｎＰ、ＡｌＩｎＰ、ＡｌＧａＩｎＰ、ＧａＮＡｓ、ＧａＮＰ、ＧａＩｎＮＡｓ、ＧａＩｎＮＰ、ＧａＳｂ、ＩｎＳｂ、ＧａＮ、ＡｌＮ、ＩｎＧａＮ、ＩｎＮＡｓＰなどの１３−１５族化合物半導体素子、ＨｇＴｅ、ＨｇＣｄＴｅ、ＣｄＭｎＴｅ、ＣｄＳ、ＣｄＳｅ、ＭｇＳｅ、ＭｇＳ、ＺｎＳｅ、ＺｅＴｅなどの１２−１６族化合物半導体素子、そして、ＣｕＩｎＳｅ（ＣｌＳ）などの種々のものを用いることができる。   The material of the semiconductor element 50 is not particularly limited, but silicon, germanium group 14 semiconductor element, GaAs, InP, GaP, InGaAs, InGaAsP, AlGaAs, InAs, GaInP, AlInP, AlGaInP, GaNAs, GaNP, GaInNAs, GaInNP, Group 13-15 compound semiconductor elements such as GaSb, InSb, GaN, AlN, InGaN, InNAsP, Group 12-16 compound semiconductor elements such as HgTe, HgCdTe, CdMnTe, CdS, CdSe, MgSe, MgS, ZnSe, ZeTe, and Various materials such as CuInSe (ClS) can be used.

半導体素子接続部材８０は、絶縁性物質１１及び導電性粒子７を含有している。導電性粒子７は、半導体素子５０と回路パターン６１との間のみならず、半導体素子５０と主面６０ａとの間にも配置されている。本実施形態の半導体装置３においては、半導体素子５０と回路パターン６１とが、導電性粒子７を介して電気的に接続されている。このため、半導体素子５０及び回路パターン６１間の接続抵抗が十分に低減される。したがって、半導体素子５０及び回路パターン６１間の電流の流れを円滑にすることができ、半導体の有する機能を十分に発揮することができる。また、この導電性粒子７を上述した配合割合とすることによって電気的な接続の異方性を示すことも可能である。   The semiconductor element connection member 80 contains the insulating substance 11 and the conductive particles 7. The conductive particles 7 are disposed not only between the semiconductor element 50 and the circuit pattern 61 but also between the semiconductor element 50 and the main surface 60a. In the semiconductor device 3 of the present embodiment, the semiconductor element 50 and the circuit pattern 61 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the semiconductor element 50 and the circuit pattern 61 is sufficiently reduced. Therefore, the current flow between the semiconductor element 50 and the circuit pattern 61 can be made smooth, and the functions of the semiconductor can be fully exhibited. Moreover, it is also possible to show the anisotropy of electrical connection by setting the conductive particles 7 to the above-described mixing ratio.

なお、半導体素子接続部材８０が導電性粒子７を含有していない場合（図示せず）には、半導体素子５０と回路パターン６１とを所望の量の電流が流れるように直接接触させるか若しくは十分に近づけることで電気的に接続される。   When the semiconductor element connecting member 80 does not contain the conductive particles 7 (not shown), the semiconductor element 50 and the circuit pattern 61 are brought into direct contact with each other so that a desired amount of current flows or sufficient. It is electrically connected by approaching.

半導体素子接続部材８０は本発明の接着シートにおける接着層の硬化物により構成されている。そのため、半導体素子接続部材８０の一部が剥離除去されていたり、支持基材４５の一部が残存していたりすることが十分に防止されている。これにより、半導体素子５０及び基板６０に対する半導体素子接続部材８０の接着強度が十分に高くなる。したがって、半導体素子５０及び回路パターン６１間の電気的接続が可能となる。   The semiconductor element connecting member 80 is constituted by a cured product of the adhesive layer in the adhesive sheet of the present invention. Therefore, part of the semiconductor element connection member 80 is peeled and removed, and part of the support base material 45 is sufficiently prevented from remaining. Thereby, the adhesive strength of the semiconductor element connection member 80 to the semiconductor element 50 and the substrate 60 is sufficiently increased. Therefore, electrical connection between the semiconductor element 50 and the circuit pattern 61 is possible.

以上、本発明の好適な実施形態について説明したが、本発明はこれに制限されるものではない。   As mentioned above, although preferred embodiment of this invention was described, this invention is not restrict | limited to this.

以下、実施例によって、本発明を更に詳細に説明するが、本発明はこれら実施例に限定されるものではない。   EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples.

＜接着剤組成物の調製＞
（導電性粒子の作製）
ポリスチレン粒子の表面上に、厚み０．２μｍのニッケルからなる層を設け、更にこのニッケルからなる層の表面上に、厚み０．０２μｍの金からなる層を設けた。こうして平均粒径４μｍ、比重２．５の導電性粒子を得た。 <Preparation of adhesive composition>
(Preparation of conductive particles)
A layer made of nickel having a thickness of 0.2 μm was provided on the surface of the polystyrene particles, and a layer made of gold having a thickness of 0.02 μm was further provided on the surface of the layer made of nickel. Thus, conductive particles having an average particle diameter of 4 μm and a specific gravity of 2.5 were obtained.

（接着剤組成物（Ｉ）の調製）
フェノキシ樹脂（重量平均分子量４５０００、ユニオンカーバイト社製、商品名「ＰＫＨＣ」）３０質量部に、２官能エポキシ樹脂（大日本インキ社製、商品名「ＨＰ−４０４３Ｄ」）２０質量部、シランカップリング剤（信越シリコーン社製、商品名「ＳＨ６０４０」）１質量部、シリカフィラー（アドマティックス社製、商品名「ＳＥ２０５０、平均粒径０．４〜０．６μｍ）５質量部及びイミダゾールエポキシアダクト体マイクロカプセル（旭化成社製、商品名「ノバキュア３９４１ＨＰ」）３５質量部、さらにトルエン２５質量部及び酢酸エチル２５質量部を加え、攪拌混合して、接着剤組成物（Ｉ）を得た。 (Preparation of adhesive composition (I))
30 parts by mass of a phenoxy resin (weight average molecular weight 45,000, manufactured by Union Carbide, trade name “PKHC”), 20 parts by weight of a bifunctional epoxy resin (produced by Dainippon Ink, trade name “HP-4043D”), a silane cup 1 part by weight of a ring agent (manufactured by Shin-Etsu Silicone, trade name “SH6040”), 5 parts by weight of silica filler (manufactured by Admatics, trade name “SE2050, average particle size 0.4 to 0.6 μm) and imidazole epoxy adduct 35 parts by mass of body microcapsules (trade name “Novacure 3941HP” manufactured by Asahi Kasei Co., Ltd.), 25 parts by mass of toluene and 25 parts by mass of ethyl acetate were added and mixed by stirring to obtain an adhesive composition (I).

（接着剤組成物（ＩＩ）の調製）
接着剤組成物（Ｉ）１００体積部に上記導電性粒子１０体積部を加え、攪拌混合して、接着剤組成物（ＩＩ）を得た。 (Preparation of adhesive composition (II))
10 parts by volume of the conductive particles were added to 100 parts by volume of the adhesive composition (I), and the mixture was stirred and mixed to obtain an adhesive composition (II).

（接着剤組成物（ＩＩＩ）の調製）
フェノキシ樹脂（重量平均分子量４５０００、ユニオンカーバイト社製、商品名「ＰＫＨＣ」）６５質量部に、２官能エポキシ樹脂（油化シェルエポキシ社製、商品名「ＥＰ８２８」）３５質量部、シランカップリング剤（信越シリコーン社製、商品名「ＳＨ６０４０」）４質量部、充填材として水酸化アルミニウム５質量部、ベンジルスルホニウム塩（三新化学工業社製、商品名「ＳＩ−６０Ｌ」）５質量部、さらにトルエン２５質量部及び酢酸エチル２５質量部を加え、攪拌混合して、接着剤組成物（ＩＩＩ）を得た。 (Preparation of adhesive composition (III))
65 parts by mass of phenoxy resin (weight average molecular weight 45000, manufactured by Union Carbide, trade name “PKHC”), 35 parts by weight of bifunctional epoxy resin (trade name “EP828”, manufactured by Yuka Shell Epoxy), silane coupling 4 parts by mass of an agent (trade name “SH6040” manufactured by Shin-Etsu Silicone Co., Ltd.), 5 parts by mass of aluminum hydroxide as a filler, 5 parts by mass of benzylsulfonium salt (trade name “SI-60L” manufactured by Sanshin Chemical Industry Co., Ltd.), Furthermore, 25 parts by mass of toluene and 25 parts by mass of ethyl acetate were added and mixed by stirring to obtain an adhesive composition (III).

（接着剤組成物（ＩＶ）の調製）
接着剤組成物（ＩＩＩ）１００体積部に上記導電性粒子１０体積部を加え、攪拌混合して、接着剤組成物（ＩＶ）を得た。 (Preparation of adhesive composition (IV))
10 parts by volume of the conductive particles were added to 100 parts by volume of the adhesive composition (III) and mixed by stirring to obtain an adhesive composition (IV).

（接着剤組成物（Ｖ）の調製）
フェノキシ樹脂（東都化成株式会社製、商品名「ＺＸ１３５６−２」）５０質量部に、多官能アクリルレート（東亞合成化学社製、商品名「アロニックスＭ３１５」）１５質量部、ウレタンアクリレート（共栄社化学社製、商品名「ＡＴ−６００」）３５質量部、シランカップリング剤（信越シリコーン社製、商品名「ＳＺ６０３０」）５質量部、ラジカル重合開始剤として２，５−ジメチル−２，５−（２−エチルヘキサノイルパーオキシ）ヘキサン（日本油脂社製）３質量部、さらにトルエン２５質量部及び酢酸エチル２５質量部を加え、撹拌混合して、接着剤組成物（Ｖ）を得た。 (Preparation of adhesive composition (V))
50 parts by mass of phenoxy resin (product name “ZX1356-2”, manufactured by Toto Kasei Co., Ltd.), 15 parts by mass of polyfunctional acrylate (product name “Aronix M315”, manufactured by Toagosei Chemical Co., Ltd.), urethane acrylate (Kyoeisha Chemical Co., Ltd.) Manufactured, trade name “AT-600”) 35 parts by mass, silane coupling agent (manufactured by Shin-Etsu Silicone, trade name “SZ6030”) 5 parts by mass, 2,5-dimethyl-2,5- ( 2-Ethylhexanoylperoxy) hexane (manufactured by NOF Corporation), 3 parts by mass, further 25 parts by mass of toluene and 25 parts by mass of ethyl acetate were added and mixed by stirring to obtain an adhesive composition (V).

（接着剤組成物（ＶＩ）の調製）
接着剤組成物（Ｖ）１００体積部に上記導電性粒子１０体積部を加え、攪拌混合して、接着剤組成物（ＶＩ）を得た。 (Preparation of adhesive composition (VI))
10 parts by volume of the conductive particles were added to 100 parts by volume of the adhesive composition (V), and the mixture was stirred and mixed to obtain an adhesive composition (VI).

（実施例１）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるポリエチレンテレフタレート（ＰＥＴ）フィルム（膜厚２５μｍ、シリコーンで表面処理、帝人デュポンフィルム社製、商品名「ピューレックスＡ７０」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚１０μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚１９μｍ、シリコーンで表面処理、帝人デュポンフィルム社製、商品名「ピューレックスＡ３１」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 Example 1
Adhesive compositions (I) to (VI) are each supported on a polyethylene terephthalate (PET) film (film thickness 25 μm, surface treatment with silicone, manufactured by Teijin DuPont Films, trade name “Purex A70”) as a supporting substrate. Then, it was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 10 μm was formed on the PET film. Further, a PET film (film thickness: 19 μm, surface treatment with silicone, manufactured by Teijin DuPont Films, trade name “Purex A31”) is disposed as a protective film on the adhesive layer, roll temperature is 40 ° C., linear pressure is 1 × 10. Lamination was performed at 4 N / m and a speed of 1 m / min to prepare adhesive sheets.

（実施例２）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、帝人デュポンフィルム社製、商品名「ピューレックスＡ７０」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚１２μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ポリエチレン（ＰＥ）フィルム（膜厚２０μｍ、タマポリ社製、商品名「ＮＦ−１３」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Example 2)
Each of the adhesive compositions (I) to (VI) was applied onto a PET film (film thickness: 25 μm, surface treatment with silicone, manufactured by Teijin DuPont Films, trade name “Purex A70”) as a support substrate, The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 12 μm was formed on the PET film. Furthermore, a polyethylene (PE) film (film thickness: 20 μm, manufactured by Tamapoly Co., Ltd., trade name “NF-13”) is disposed on the adhesive layer as a protective film, roll temperature is 40 ° C., and linear pressure is 1 × 10 4 N / m. Then, lamination was performed at a speed of 1 m / min to prepare adhesive sheets.

（実施例３）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚３８μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＣＴＲ−４」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚２０μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Example 3)
Each of the adhesive compositions (I) to (VI) was applied onto a PET film (film thickness 38 μm, surface treatment with silicone, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina CTR-4”) as a supporting substrate. The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 20 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（実施例４）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚３８μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＣＴＲ−４」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚２３μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 Example 4
Each of the adhesive compositions (I) to (VI) was applied onto a PET film (film thickness 38 μm, surface treatment with silicone, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina CTR-4”) as a supporting substrate. The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 23 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（実施例５）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚４０μｍ、アルキルアルキッドで表面処理、藤森工業社製、商品名「フィルムバイナＮＳＣ」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚２０μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Example 5)
Each of the adhesive compositions (I) to (VI) was applied on a PET film (film thickness: 40 μm, surface treatment with alkyl alkyd, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina NSC”) as a support substrate, The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 20 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（実施例６）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材である配向ポリプロピレン（ＯＰＰ）フィルム（膜厚４０μｍ、東洋紡績社製、商品名「パイレンフィルムＰ２００２」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚２３μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Example 6)
Each of the adhesive compositions (I) to (VI) was applied on an oriented polypropylene (OPP) film (film thickness: 40 μm, manufactured by Toyobo Co., Ltd., trade name “Pyrene Film P2002”) as a supporting substrate, and 70 ° C. The mixture was heated for 10 minutes to evaporate and remove the solvent, and an adhesive layer having a thickness of 23 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（実施例７）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるポリエチレン（ＰＥ）フィルム（膜厚４０μｍ、タマポリ社製、商品名「ＮＦ−１３」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚２３μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Example 7)
Each of the adhesive compositions (I) to (VI) was applied on a polyethylene (PE) film (film thickness: 40 μm, manufactured by Tamapoly Co., Ltd., trade name “NF-13”) as a supporting substrate, and the adhesive composition (I) to (VI) was applied at 70 ° C. The mixture was heated for minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 23 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（比較例１）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、帝人デュポンフィルム社製、商品名「ピューレックスＡ７０」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚１７μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚１９μｍ、シリコーンで表面処理、帝人デュポンフィルム社製、商品名「ピューレックスＡ３１」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Comparative Example 1)
Each of the adhesive compositions (I) to (VI) was applied onto a PET film (film thickness: 25 μm, surface treatment with silicone, manufactured by Teijin DuPont Films, trade name “Purex A70”) as a support substrate, The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 17 μm was formed on the PET film. Further, a PET film (film thickness: 19 μm, surface treatment with silicone, manufactured by Teijin DuPont Films, trade name “Purex A31”) is disposed as a protective film on the adhesive layer, roll temperature is 40 ° C., linear pressure is 1 × 10. Lamination was performed at 4 N / m and a speed of 1 m / min to prepare adhesive sheets.

（比較例２）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚４０μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＣＴＲ−２」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚４０μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Comparative Example 2)
Each of the adhesive compositions (I) to (VI) was applied onto a PET film (film thickness 40 μm, surface treatment with silicone, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina CTR-2”) as a supporting substrate. The mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 40 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（比較例３）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚１００μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＣＴＲ−２」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚４５μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Comparative Example 3)
Each of the adhesive compositions (I) to (VI) was applied on a PET film (film thickness 100 μm, surface treatment with silicone, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina CTR-2”) as a supporting substrate. Then, the mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 45 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

（比較例４）
接着剤組成物（Ｉ）〜（ＶＩ）をそれぞれ、支持基材であるＰＥＴフィルム（膜厚１００μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＣＴＲ−２」）上に塗布し、７０℃で１０分間加熱し溶媒等を揮発除去して、膜厚６５μｍの接着層をＰＥＴフィルム上に形成した。さらに、接着層上に保護フィルムとして、ＰＥＴフィルム（膜厚２５μｍ、シリコーンで表面処理、藤森工業社製、商品名「フィルムバイナＢＤ」）を配置し、ロール温度４０℃、線圧１×１０４Ｎ／ｍ、速度１ｍ／分でラミネートし、接着シートをそれぞれ作製した。 (Comparative Example 4)
Each of the adhesive compositions (I) to (VI) was applied on a PET film (film thickness 100 μm, surface treatment with silicone, manufactured by Fujimori Kogyo Co., Ltd., trade name “Film Vina CTR-2”) as a supporting substrate. Then, the mixture was heated at 70 ° C. for 10 minutes to volatilize and remove the solvent, and an adhesive layer having a thickness of 65 μm was formed on the PET film. Furthermore, a PET film (film thickness 25 μm, surface treatment with silicone, product name “Film Vina BD”) as a protective film is disposed on the adhesive layer, roll temperature 40 ° C., linear pressure 1 × 10 4. Lamination was performed at N / m and a speed of 1 m / min to prepare adhesive sheets.

上記実施例及び比較例で作製した接着シートにおける支持基材の厚みＴｓ、接着層の厚みＴａ及び保護フィルムの厚みＴｐ、支持基材及び保護フィルムの材質、並びに表面処理の種類を表１に示す。   Table 1 shows the thickness Ts of the support base, the thickness Ta of the adhesive layer, the thickness Tp of the protective film, the material of the support base and the protective film, and the type of surface treatment in the adhesive sheets prepared in the above examples and comparative examples. .

＜接着シートの仮圧着＞
まず、ＩＴＯ（酸化インジウム錫）配線パターンを有するガラス基板（コーニング♯７０５９、外形３８ｍｍ×２８ｍｍの矩形、厚さ０．７ｍｍ）を準備した。また、実施例１〜６及び比較例１〜３で作製した接着シートから予め保護フィルムを剥離除去した。次いで、接着シートを幅２．５ｍｍ、長さ２０ｍｍに切り出し、接着層がＩＴＯ配線面と当接するようにして、接着シートをガラス基板上に配置して積層体を得た。次に、金属からなるステージとヒーターを内蔵した金属圧着ヘッド（５ｍｍ×３０ｍｍ）を用いて、上記積層体をその積層方向に加熱及び加圧して仮固定を行った。この際の加熱温度は接着層における温度として８０℃又は３０℃、加圧時間は２秒間、加圧圧力は１ＭＰａとした。 <Temporary pressure bonding of adhesive sheet>
First, a glass substrate having an ITO (indium tin oxide) wiring pattern (Corning # 7059, a rectangle with an outer shape of 38 mm × 28 mm, a thickness of 0.7 mm) was prepared. Moreover, the protective film was peeled off in advance from the adhesive sheets prepared in Examples 1 to 6 and Comparative Examples 1 to 3. Next, the adhesive sheet was cut into a width of 2.5 mm and a length of 20 mm, and the adhesive sheet was placed on the glass substrate so that the adhesive layer was in contact with the ITO wiring surface, thereby obtaining a laminate. Next, using a metal crimping head (5 mm × 30 mm) containing a metal stage and a heater, the laminate was heated and pressed in the laminating direction for temporary fixing. The heating temperature at this time was 80 ° C. or 30 ° C. as the temperature in the adhesive layer, the pressing time was 2 seconds, and the pressing pressure was 1 MPa.

＜仮固定後接着シートの評価＞
仮固定した接着シートから、支持基材を剥離して接着層の仮固定の状態を以下の基準で評価した。なお、支持基材の剥離は剥離角度９０°、剥離速度１００ｍｍ／分の条件で行った。仮固定の際の加熱温度が８０℃である場合の結果を表２に、３０℃である場合の結果を表３に示す。 <Evaluation of adhesive sheet after temporary fixing>
The support base material was peeled off from the temporarily fixed adhesive sheet, and the temporarily fixed state of the adhesive layer was evaluated according to the following criteria. The supporting substrate was peeled off under the conditions of a peeling angle of 90 ° and a peeling speed of 100 mm / min. The results when the heating temperature at the time of temporary fixing is 80 ° C. are shown in Table 2, and the results when the heating temperature is 30 ° C. are shown in Table 3.

［評価１］
Ａ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれを用いた場合も、支持基材のみを剥離除去できた。
Ｂ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれかを用いた場合で、支持基材を剥離除去する際に接着層も基板から剥離除去された。 [Evaluation 1]
A: When any of the adhesive compositions (I) to (VI) was used, only the supporting substrate could be peeled and removed.
B: When any one of the adhesive compositions (I) to (VI) was used, the adhesive layer was also peeled off from the substrate when the support base material was peeled off.

［評価２］
Ａ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれを用いた場合も、支持基材のみを除去でき、接着層は、その縁部もガラス基板に密着していた。
Ｂ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれかを用いた場合で、支持基材を剥離した後に接着層の縁部に密着不良が認められた。
なお、評価１において接着層が基板から剥離除去されたため、評価２において接着層縁部の密着不良が確認できなかった場合は「−」で示した。 [Evaluation 2]
A: When any of the adhesive compositions (I) to (VI) was used, only the supporting base material could be removed, and the edge of the adhesive layer was also in close contact with the glass substrate.
B: When any one of the adhesive compositions (I) to (VI) was used, poor adhesion was observed at the edge of the adhesive layer after the support substrate was peeled off.
In addition, since the adhesive layer was peeled and removed from the substrate in Evaluation 1, when the adhesion failure at the edge of the adhesive layer could not be confirmed in Evaluation 2, it was indicated by “−”.

［評価３］
Ａ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれを用いた場合も、仮固定後の圧着ヘッドに接着剤組成物の付着が認められなかった。
Ｂ：接着剤組成物（Ｉ）〜（ＶＩ）のいずれかを用いた場合で、仮固定後の圧着ヘッドに接着剤組成物の付着が認められた。 [Evaluation 3]
A: In any of the adhesive compositions (I) to (VI), no adhesion of the adhesive composition was observed on the pressure-bonding head after temporary fixing.
B: When any one of the adhesive compositions (I) to (VI) was used, adhesion of the adhesive composition to the pressure-bonding head after temporary fixing was observed.

［総合評価］
評価１及び２の両方がＡの場合：合格（Ａ）
評価１及び２の少なくとも一方がＢの場合：不合格（Ｂ） [Comprehensive evaluation]
If both Evaluation 1 and 2 are A: Pass (A)
When at least one of Evaluations 1 and 2 is B: Fail (B)

Figure 2011256391
Figure 2011256391

Figure 2011256391
Figure 2011256391

Figure 2011256391
Figure 2011256391

仮固定の際の加熱温度が８０℃である場合、Ｔａ／Ｔｓが０．４０以上０．６５以下で、かつ、支持基材の厚みが４２μｍ以下である実施例１〜６は、６種類の接着シート全てで、支持基材の剥離除去に伴う接着層の剥離除去は十分抑制されていた。また、接着層縁部の剥がれも認められなかった。さらに、これらの実施例では、圧着ヘッドの汚染もない良好な状態で仮固定できることがわかった。実施例１〜６は、加熱温度を８０℃から３０℃に変更しても、良好な状態で仮固定できることがわかった。これに対して、Ｔａ／Ｔｓが０．４０以上０．６５以下の範囲外となる比較例１、２や、支持基材の厚みが４２μｍよりも厚い比較例３、４では、支持基材の剥離除去に伴う接着層の剥離除去、あるいは、接着層の縁部の剥がれが認められた。   When the heating temperature at the time of temporary fixing is 80 ° C., Examples 1 to 6 in which Ta / Ts is 0.40 or more and 0.65 or less and the thickness of the support base is 42 μm or less include six types. In all the adhesive sheets, the peeling and removal of the adhesive layer accompanying the peeling and removal of the supporting base material was sufficiently suppressed. Also, no peeling of the edge of the adhesive layer was observed. Further, in these examples, it was found that the crimping head could be temporarily fixed in a good state without contamination. It turned out that Examples 1-6 can be temporarily fixed in a favorable state even if the heating temperature is changed from 80 ° C to 30 ° C. On the other hand, in Comparative Examples 1 and 2 in which Ta / Ts is outside the range of 0.40 or more and 0.65 or less, or in Comparative Examples 3 and 4 in which the thickness of the support base is thicker than 42 μm, Peeling and removal of the adhesive layer accompanying peeling and removal, or peeling of the edge of the adhesive layer was observed.

本発明によれば、支持基材と支持基材上に設けられた接着剤組成物を含む接着層とを備える接着シートにおいて、従来よりも広範囲な温度条件で接着層を基板上に仮固定することが可能となる接着シートを提供することができる。   According to the present invention, in an adhesive sheet comprising a support base material and an adhesive layer containing an adhesive composition provided on the support base material, the adhesive layer is temporarily fixed on the substrate under a wider range of temperature conditions than before. It is possible to provide an adhesive sheet that can be used.

１…回路部材の接続構造、２…回路部材の接続構造、３…半導体装置、５…接着剤組成物、７…導電性粒子、１０…回路接続部材、１１…絶縁性物質、１５…回路接続部材、２０…第１の回路部材、２１…第１の回路基板、２２…第１の回路電極、３０…第２の回路部材、３１…第２の回路基板、３２…第２の回路電極、４０…フィルム状回路接続部材、４５…支持基材、５０…半導体素子、６０…基板、６１…回路パターン、７０…封止材、８０…半導体素子接続部材。 DESCRIPTION OF SYMBOLS 1 ... Circuit member connection structure, 2 ... Circuit member connection structure, 3 ... Semiconductor device, 5 ... Adhesive composition, 7 ... Conductive particle, 10 ... Circuit connection member, 11 ... Insulating substance, 15 ... Circuit connection Member, 20 ... first circuit member, 21 ... first circuit board, 22 ... first circuit electrode, 30 ... second circuit member, 31 ... second circuit board, 32 ... second circuit electrode, DESCRIPTION OF SYMBOLS 40 ... Film-shaped circuit connection member, 45 ... Support base material, 50 ... Semiconductor element, 60 ... Board | substrate, 61 ... Circuit pattern, 70 ... Sealing material, 80 ... Semiconductor element connection member.

Claims (7)

支持基材と、当該支持基材上に設けられた接着剤組成物を含む接着層と、を備える回路接続用接着シートであって、
前記接着剤組成物が、熱可塑性樹脂、ラジカル重合性化合物及びラジカル重合開始剤を含有し、
前記支持基材の厚みＴｓと前記接着層の厚みＴａとが下記式（１）で表される条件を満たしており、かつ、前記厚みＴｓが４２μｍ以下である回路接続用接着シート。
０．４０≦Ｔａ／Ｔｓ≦０．６５ （１） An adhesive sheet for circuit connection comprising: a support substrate; and an adhesive layer containing an adhesive composition provided on the support substrate,
The adhesive composition contains a thermoplastic resin, a radical polymerizable compound and a radical polymerization initiator,
An adhesive sheet for circuit connection, wherein the thickness Ts of the supporting base material and the thickness Ta of the adhesive layer satisfy a condition represented by the following formula (1), and the thickness Ts is 42 μm or less.
0.40 ≦ Ta / Ts ≦ 0.65 (1) 支持基材と、当該支持基材上に設けられた接着剤組成物を含む接着層と、を備える回路接続用接着シートであって、
前記接着剤組成物が、熱可塑性樹脂、熱硬化性樹脂及び潜在性硬化剤を含有し、
前記支持基材の厚みＴｓと前記接着層の厚みＴａとが下記式（１）で表される条件を満たしており、かつ、前記厚みＴｓが４２μｍ以下である回路接続用接着シート。
０．４０≦Ｔａ／Ｔｓ≦０．６５ （１） An adhesive sheet for circuit connection comprising: a support substrate; and an adhesive layer containing an adhesive composition provided on the support substrate,
The adhesive composition contains a thermoplastic resin, a thermosetting resin, and a latent curing agent,
An adhesive sheet for circuit connection, wherein the thickness Ts of the supporting base material and the thickness Ta of the adhesive layer satisfy a condition represented by the following formula (1), and the thickness Ts is 42 μm or less.
0.40 ≦ Ta / Ts ≦ 0.65 (1) 前記接着層上に、更に保護フィルムが設けられ、かつ、前記保護フィルムの厚みＴｐが前記厚みＴｓ以下である、請求項１又は２に記載の回路接続用接着シート。   The adhesive sheet for circuit connection according to claim 1 or 2, wherein a protective film is further provided on the adhesive layer, and the thickness Tp of the protective film is equal to or less than the thickness Ts. 前記支持基材及び前記接着層間の剥離強度が、前記保護フィルム及び前記接着層間の剥離強度以上である、請求項３に記載の回路接続用接着シート。   The adhesive sheet for circuit connection of Claim 3 whose peeling strength between the said support base material and the said adhesive layer is more than the peeling strength between the said protective film and the said adhesive layer. 前記接着剤組成物が、導電性粒子を更に含有する、請求項１〜４のいずれか一項に記載の回路接続用接着シート。   The adhesive sheet for circuit connection as described in any one of Claims 1-4 in which the said adhesive composition further contains electroconductive particle. 前記支持基材が、ポリエチレンテレフタレートフィルム、配向ポリプロピレンフィルム、ポリエチレンフィルム及びポリイミドフィルムからなる群より選ばれる１種以上のフィルムを備える、請求項１〜５のいずれか一項に記載の回路接続用接着シート。   The adhesion for circuit connection as described in any one of Claims 1-5 with which the said support base material is provided with 1 or more types of films chosen from the group which consists of a polyethylene terephthalate film, an oriented polypropylene film, a polyethylene film, and a polyimide film. Sheet. 請求項１又は２に記載の回路接続用接着シートにおける前記接着層を、回路基板の主面上に回路電極が形成された回路部材に仮固定する工程と、
前記仮固定後、前記支持基材を前記接着層から剥離して前記接着層を前記基板の主面に転写する工程と、
を備える、回路接続材料の基板への固定方法。 Temporarily fixing the adhesive layer in the adhesive sheet for circuit connection according to claim 1 or 2 to a circuit member having a circuit electrode formed on a main surface of the circuit board;
After the temporary fixing, peeling the support substrate from the adhesive layer and transferring the adhesive layer to the main surface of the substrate;
A method for fixing a circuit connecting material to a substrate.
JP2011148570A 2006-05-09 2011-07-04 Adhesive sheet for connecting circuit and method for fixing circuit connecting material to substrate using the same Pending JP2011256391A (en)

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