JP2011253715A - Light source device and display device equipped with this - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source device capable of alleviating temperature-rise differences of light-emitting diodes mounted on light-emitting diode substrates in array, uniformalizing temperature of the light-emitting diodes raised in temperature, and alleviating luminance unevenness of the light-emitting diodes as well as a display device capable of uniformalizing luminance distributions of display faces.SOLUTION: At a high temperature distribution range on an area where a plurality of light-emitting diode substrates 2 having light-emitting diodes 1 mounted are arranged, a light-emitting diode substrate 2a with high heat radiation effects is arranged, and light-emitting diode substrates 2f, 2g with low heat radiation effects are arranged at a low temperature distribution range, so that temperature-rise differences of the light-emitting diodes 1 mounted on the light-emitting diode substrates 2 in array can be alleviated so as to uniformalize temperatures of the light-emitting diodes 1 with temperature raised and alleviate luminance unevenness due to temperature rise of the light-emitting diodes 1.

Description

  The present invention relates to a light source device having a light emitting diode substrate on which a light emitting diode is mounted and used as a light source of a display device, and a display device including the light source device.

  A liquid crystal display device such as a liquid crystal television, which is called a thin liquid crystal display device, has a display surface that displays an image on the front side and has a substantially rectangular parallelepiped shape, and is disposed on the back side of the display portion, and irradiates the display with light And an optical sheet such as a diffuser plate and a prism sheet is disposed between the light source unit and the display unit.

  The display unit includes a liquid crystal display panel having a substantially rectangular parallelepiped shape. Since the liquid crystal display panel itself does not emit light, a light source for displaying an image on the display surface is necessary, and a backlight device is used as the light source.

  The backlight device has an edge light system in which a light guide plate is disposed on the back side of the display unit, and a light source is disposed on the side surface side of the light guide plate, and a diffusion plate is disposed on the back side of the display unit, and the light source is disposed on the back side of the diffusion plate. The direct light system is generally adopted.

  The edge light system of the backlight device emits light incident from the side surface of the light guide plate from one surface of the light guide plate while diffusing the light guide plate. Luminance characteristics can be improved. However, in a display device having a relatively large display area, it is difficult to make the luminance characteristics uniform over the entire surface. It is advantageous to employ a light-type backlight device.

  In the direct light type backlight device, as an illumination light source, a CCFL type having electrodes at both ends and a plurality of cold cathode fluorescent lamps (CCFL) having a straight tube shape juxtaposed on the back side of the diffusion plate, An LED type (for example, see Patent Document 1) in which a plurality of light emitting diodes (LEDs) are juxtaposed on the back side of the diffusion plate is generally employed.

  A CCFL type backlight device includes a plurality of cold cathode fluorescent lamps arranged side by side in a vertical direction along a plane of a diffusion plate, a support case for accommodating and supporting the cold cathode fluorescent lamp, and a cold cathode fluorescent lamp An inverter circuit board for discharging the battery and a cover that covers the inverter circuit board.

  The CCFL type backlight device requires high voltage components such as an inverter circuit board for discharging the cold cathode fluorescent lamp, electrodes at both ends of the cold cathode fluorescent lamp, and relatively long insulation around the high voltage component. Since it is necessary to secure a distance, there is no high-voltage component in shortening the thickness in the front and rear, there is no need to secure a relatively long insulation distance, and the thickness in the front and back is larger than that of a CCFL type backlight device. There is a tendency to adopt an LED type backlight device which is advantageous for shortening.

  In addition, the CCFL type backlight device is disadvantageous in comparison with the LED type in high-speed blink control for suppressing moving image blurring, and consumes power because a plurality of cold cathode fluorescent lamps are lit at a high voltage. LED type backlight that can increase the amount of heat generated when the cold-cathode fluorescent lamp is turned on, and thus can easily control high-speed blinking, and can reduce power consumption and heat generation compared with the CCFL type backlight device. It is advantageous to employ a device.

  The LED-type backlight device of Patent Document 1 includes a plurality of light emitting diode substrates on which a plurality of light emitting diodes are mounted on one surface, a metal support case that accommodates and supports the light emitting diode substrates side by side, and an inner bottom of the support case And a heat radiating plate made of aluminum, and is configured to radiate heat generated by a light emitting diode as a light source from the support case to the outside through each light emitting diode substrate and the heat radiating plate.

Special table 2010-500720 gazette

  However, in the case where a heat sink is provided between the inner bottom of the support case and the light emitting diode substrate as in Patent Document 1, a special heat sink is required, so the number of parts increases. Assembling man-hours will increase, and thinning will be hindered.

  Moreover, the luminance (light output) of the light emitting diode is in a trade-off relationship with heat, and the luminance decreases as the temperature of the light emitting diode increases. On the other hand, a display such as a television with a display surface arranged on the front side When a backlight device is used for the device, the temperature on the upper side is higher than that on the lower side due to natural convection, and the circuit board such as the power supply board that supplies power to the light-emitting diode is opposite to the light-emitting diode board of the support case. When mounted on the side surface, the temperature of the circuit board mounting location is higher than that of the non-mounting location, and the temperature distribution on the region where the light emitting diode substrates are juxtaposed is not uniform. With only heat radiation by the temperature difference between the light emitting diodes mounted on the multiple light emitting diode substrates arranged side by side, the temperature between the plurality of light emitting diodes that have been heated is increased. Increases, luminance unevenness due to Atsushi Nobori of the light emitting diode is increased in a region where the light emitting diode substrates are arranged in parallel.

  In addition, the lifetime of white light emitting diodes is in a trade-off relationship with heat, and the lifetime decreases as the temperature of the light emitting diodes increases, so the temperature distribution on the region where the light emitting diode substrates are arranged side by side is not uniform The life difference between the plurality of light emitting diodes becomes high, and as a result, the luminance unevenness increases in the region where the light emitting diode substrates are arranged side by side.

  The present invention has been made in view of such circumstances, and a main object of the present invention is to reduce a temperature increase difference of light emitting diodes mounted on a plurality of light emitting diode substrates supported side by side on a support, To provide a light source device that can make the temperature uniform without increasing the number of components and can reduce unevenness in luminance of the light-emitting diode, and a display device that can make the luminance distribution on the display surface uniform. It is in.

  The light source device according to the present invention is characterized in that, in a light source device in which a plurality of light emitting diode substrates mounted with light emitting diodes are arranged and supported on a support, the light emitting diode substrates have different heat dissipation effects.

  In the present invention, a light emitting diode substrate having a relatively high heat dissipation effect is arranged in a high temperature distribution region on the region where the light emitting diode substrates are arranged side by side, and a heat dissipation effect is relatively in a low temperature distribution region. By arranging a low light emitting diode substrate, the temperature rise difference of the light emitting diode mounted on the plurality of light emitting diode substrates arranged side by side can be reduced, and the temperature of the heated light emitting diode can be reduced without increasing the number of parts. Uniformity can be achieved, and luminance unevenness due to the temperature rise of the light emitting diode can be reduced. In addition, it is not necessary to provide a heat sink or the like, and the thickness can be further reduced.

Moreover, it is preferable that the light source device according to the present invention includes a light emitting diode substrate having different areas.
In the present invention, a light emitting diode substrate having a relatively large area is arranged in a high temperature distribution region on a region where the light emitting diode substrates are arranged side by side, and light emission having a relatively narrow area is arranged in a low temperature distribution region. By arranging the diode substrate, the temperature rise difference of the light emitting diodes mounted on the plurality of light emitting diode substrates arranged side by side can be reduced, and the temperature of the heated light emitting diode is made uniform without increasing the number of components. Therefore, luminance unevenness due to the temperature rise of the light emitting diode can be reduced.

In the light source device according to the present invention, it is preferable that the light emitting diode substrate has a substantially rectangular shape and has a large area, but a plurality of light emitting diodes are arranged apart from each other in the longitudinal direction and the width direction.
In the present invention, a plurality of light emitting diodes are arranged on the light emitting diode substrate having a large area and a relatively high heat dissipation effect, separated in the longitudinal direction and the width direction, thereby reducing the number of light emitting diode substrates. It is possible to improve the assembling workability of the light emitting diode substrate.

Moreover, it is preferable that the light source device according to the present invention includes a configuration in which the light emitting diode substrate has different heat transfer coefficients.
In the present invention, a light-emitting diode substrate having a relatively high heat transfer coefficient is disposed in a high temperature distribution region on a region where the light-emitting diode substrates are arranged side by side, and a heat transfer coefficient is present in a low temperature distribution region. By arranging a relatively low light emitting diode substrate, the temperature rise difference of the light emitting diodes mounted on the plurality of light emitting diode substrates arranged side by side can be reduced, and the temperature of the light emitting diode thus heated is increased. It is possible to make uniform without any problem, and it is possible to reduce luminance unevenness due to the temperature rise of the light emitting diode.

The light source device according to the present invention preferably includes a wiring pattern in which the light emitting diode is mounted on one surface of the light emitting diode substrate, and the wiring pattern has a different area.
In the present invention, a light emitting diode substrate having a relatively large wiring pattern area is disposed in a high temperature distribution region on a region where the light emitting diode substrates are arranged side by side, and the wiring pattern is disposed in a low temperature distribution region. By arranging the light-emitting diode substrate with a relatively small area, the temperature rise difference of the light-emitting diode mounted on the plurality of light-emitting diode substrates arranged side by side can be reduced, and the temperature of the heated light-emitting diode can be reduced by the number of parts. Uniformity can be achieved without increasing, and luminance unevenness due to temperature rise of the light emitting diode can be reduced.

In the light source device according to the present invention, it is preferable that the light emitting diode substrates are juxtaposed in two intersecting directions and have a connector for connecting adjacent light emitting diode substrates on one direction side.
In the present invention, since the plurality of light emitting diode substrates having different heat dissipation effects are juxtaposed in two directions intersecting, a high temperature distribution region on the region where the light emitting diode substrates are juxtaposed is arranged in the direction in which the light emitting diode substrates are juxtaposed. Even if it is a part, a light emitting diode substrate having a relatively high heat dissipation effect can be arranged in a high temperature distribution region of the part, and a temperature rise difference between light emitting diodes mounted on a plurality of light emitting diode substrates juxtaposed is reduced. Thus, the temperature of the light-emitting diode that has been heated can be made uniform.

Further, in the light source device according to the present invention, the support has a plate shape, the light emitting diode substrate is disposed on one surface of the support, and the power supply substrate that supplies power to the light emitting diode is disposed on the other surface. It is preferable that the light emitting diode substrate having a relatively high heat dissipation effect is disposed on the one surface where the power supply substrate is disposed.
In the present invention, since the light emitting diode substrate having a relatively high heat dissipation effect is arranged at the location where the temperature is raised by the heat transmitted from the power supply substrate, the region where the light emitting diode substrates are arranged side by side is arranged. Even if the portion facing the power supply substrate is a part, the temperature rise difference of the light emitting diodes mounted on the plurality of light emitting diode substrates arranged side by side can be reduced, and the temperature of the heated light emitting diodes can be made uniform it can.

Further, the light source device according to the present invention has a configuration in which the support is in the form of a plate and arranged in a vertical position, and a light emitting diode substrate having a relatively high heat dissipation effect is arranged on the upper part of the support. It is preferable to do this.
In this invention, the heat generated by the light emitting diode mounted on the light emitting diode substrate disposed at the lower portion of the support rises by natural convection, and the temperature around the light emitting diode substrate disposed at the upper portion of the support is increased. Even when the temperature rises, the difference in temperature rise of the light emitting diodes mounted on the plurality of light emitting diode substrates arranged apart from each other in the vertical direction can be reduced, and the temperature of the heated light emitting diodes can be made uniform.

Further, the light source device according to the present invention has a substantially rectangular shape, and a plurality of wiring patterns are provided on one surface of the light emitting diode substrate supported by the support so as to be separated in the width direction, and each of the wiring patterns has a plurality of wiring patterns. In the light source device in which the light emitting diode is mounted, the wiring pattern has a different area.
In the present invention, a wiring pattern having a relatively large area is arranged in a high temperature distribution area on an area where a plurality of wiring patterns are arranged, and a wiring having a relatively small area is arranged in a low temperature distribution area. By arranging the patterns, it is possible to reduce the difference in temperature rise of the light emitting diodes bonded to the plurality of wiring patterns arranged side by side, and to make the temperature of the light emitting diodes that have been heated uniform without increasing the number of parts. In addition, luminance unevenness due to the temperature rise of the light emitting diode can be reduced.

The display device according to the present invention includes a display unit having a display surface on one side, and the light source device of the above-described invention in which the light emitting diode is disposed on the other side of the display unit so as to face the display unit. It is characterized by providing.
In this invention, the temperature difference of the plurality of light-emitting diodes mounted on the light-emitting diode substrate provided in the light source device can be reduced, and the temperature of the light-emitting diodes thus heated can be made uniform. Luminance unevenness due to temperature rise can be reduced, and the luminance distribution on the display surface can be made uniform. In addition, it is not necessary to provide a heat sink or the like, and the thickness can be further reduced.

  According to the present invention, it is possible to reduce the temperature rise difference of light emitting diodes mounted on a plurality of light emitting diode substrates arranged side by side, and to uniformize the temperature of the light emitting diodes that have been heated up without increasing the number of components. Therefore, luminance unevenness due to the temperature rise of the light emitting diode can be reduced, and the luminance distribution on the display surface can be made uniform. In addition, it is not necessary to provide a heat sink or the like, and the thickness can be further reduced.

It is a front view which shows the structure of the light source device which concerns on this invention. It is a typical rear view which shows the structure of the light source device which concerns on this invention. It is the expanded sectional view which abbreviate | omitted one part which shows the structure of a display apparatus provided with the light source device which concerns on this invention. It is a front view which shows the other structure of the principal part of the light source device which concerns on this invention. It is a front view which shows the other structure of the principal part of the light source device which concerns on this invention. It is a front view which shows the other structure of the principal part of the light source device which concerns on this invention. It is a front view which shows the other structure of the principal part of the light source device which concerns on this invention. It is a front view which shows the other structure of the principal part of the light source device which concerns on this invention.

Hereinafter, the present invention will be described in detail with reference to the drawings illustrating embodiments thereof.
Embodiment 1
FIG. 1 is a front view showing the configuration of the light source device according to the present invention, and FIG. 2 is a schematic rear view showing the configuration of the light source device.

  The illustrated light source device has a display surface on the front side and is mounted on the rear side of the display unit in a thin display device having a display unit having a substantially rectangular parallelepiped shape. A plurality of light-emitting diodes 1 and the light-emitting diodes 1 mounted on one surface, juxtaposed vertically, and a plurality of light-emitting diode substrates 2 arranged on the side crossing the juxtaposed direction are juxtaposed. A plurality of connectors 3 that connect adjacent light emitting diode substrates 2 and 2 on a row that intersects the direction, a support 4 that has a case shape and accommodates and supports each of the light emitting diode substrates 2, and light emission A plurality of circuit boards 5 such as a power supply board that is disposed on one surface of the diode substrate 2 and reflects light emitted from the light emitting diode 1 and a power supply substrate that is mounted on the other surface of the support 4 and supplies power to the light emitting diode 1 and the like. And be prepared That.

  The light-emitting diode substrate 2 is formed in a strip shape, and is provided with a linear wiring pattern 21 on one surface. A plurality of light-emitting diodes 1 are joined to the wiring pattern 21, and two pieces are disposed so that one end in the longitudinal direction faces each other. The light emitting diode substrates 2 and 2 are juxtaposed.

  The light emitting diode substrate 2 is formed in a strip shape from a paper material having a relatively low heat dissipation effect, a glass material or synthetic resin material having a relatively high heat dissipation effect, and a metal plate material such as aluminum having a relatively high heat dissipation effect. A copper wiring pattern 21 is arranged on the center side in the width direction of one surface of the substrate 2, and connecting portions 23 and 24 having terminals are provided at both ends in the longitudinal direction of the one surface.

  The adjacent light-emitting diode substrates 2 on the row on the side crossing the juxtaposed direction are connected by the connector 3 between the two adjacent connection portions 23 and 24, and the connection portion 23 of one light-emitting diode substrate 2 is connected to the circuit. The second connector 6 is connected to the substrate 5, and the connection portion 24 of the other light emitting diode substrate 2 is connected to the short connector 7.

  The light-emitting diode substrate 2 shown in FIG. 1 is formed in a strip shape, and the area of the light-emitting diode substrate 2 varies in seven stages (the lengths are equal) due to the different widths of those formed of glass material or synthetic resin material. The LED board 2 is provided with seven different heat dissipation effects in seven stages, the light emitting diode board 2a having the highest heat dissipation effect in the widest area is arranged at the top, and the light emitting diodes having a large area and high heat dissipation effect in sequence. The light emitting diode substrate 2g having the lowest area and the lowest heat dissipation effect is arranged at the lowest position from the substrates 2b-2f, and the heat dissipation effect is increased stepwise from the lowest level to the upper side.

  Five or eight light emitting diodes 1 are mounted apart from each other in the longitudinal direction of the light emitting diode substrate 2.

  The connector 3 has a substantially rectangular parallelepiped shape, and terminals corresponding to the connecting portions 23 and 24 are provided at both longitudinal ends of one surface. When connected to the connecting portions 23 and 24, the connector 3 Polymerize.

  The reflection sheet is made of a single synthetic resin sheet having high reflectivity and having a substantially rectangular shape corresponding to the support 4.

  The support body 4 is formed by molding a metal plate, and includes a flat plate portion 41 having a substantially rectangular shape, a frame portion 42 connected to the periphery of the plate portion 41, and a flange portion 43 connected to the periphery of the frame portion 42. A plurality of attachment holes for attaching the light emitting diode substrate 2 are formed in the plate portion 41, and a plurality of covers for concealing the rear side of the support body 4 are attached to the peripheral side of the plate portion 41. An attachment hole 44 is opened, and a plurality of attachment holes 45 to which a display unit supported by the support body 4 is attached are formed in the collar portion 43. The light emitting diode substrate 2 is accommodated and supported on one surface of the plate portion 41 in the longitudinal direction and the width direction.

  A power supply substrate 5a that is connected to the connection portion 23 of the light emitting diode substrate 2 by the second connector 6 and supplies power to the light emitting diode 1 and a display portion described later is attached to one side in the longitudinal direction of the other surface of the plate portion 41. The control circuit board 5b for processing an image displayed on the display surface of the display section described later is attached to the other side in the longitudinal direction, and the power supply board 5a and the control circuit are provided below the center in the longitudinal direction. A control circuit board 5c for outputting a control command is attached to the board 5b.

  In the light source device configured as described above, the seven light emitting diode substrates 2a-2g having different heat dissipation effects are spaced apart from the top in the descending order of the heat dissipation effect in the support 4 with the open side facing forward. In other words, since the light emitting diode substrate 2 is juxtaposed so that the heat dissipation effect increases stepwise from the lowest to the upper side, the heat generated by the light emitting diode 1 mounted on the lower light emitting diode substrate 2 When the temperature rises due to natural convection, the amount of heat dissipated by the upper light emitting diode substrate 2 sequentially increases, and the temperature rise of the light emitting diode 1 mounted on the upper light emitting diode substrate 2 can be suppressed. Therefore, the temperature difference between the light emitting diodes 1 mounted on the plurality of light emitting diode substrates 2 juxtaposed can be reduced, the temperature of the light emitting diodes 1 can be made uniform, and the temperature of the light emitting diodes 1 can be increased. The luminance unevenness due to can be reduced.

  FIG. 3 is an enlarged cross-sectional view in which a part of the configuration of the display device including the light source device according to the present invention is omitted. This display device includes a display unit 80 having a display surface for displaying a television image on the front side, a light source device A disposed on the rear side of the display unit 80, and an exterior frame for decorating the peripheral portion of the display unit 80. 81 and a pan-shaped cover 82 that conceals the rear side of the light source device A.

  The display unit 80 includes a display panel 83 having a display surface and an optical sheet 84 arranged on the rear side of the display panel 83. The peripheral edge portion of the display panel 83 is held back and forth by a front holding frame body 85 and a rear holding frame body 86 to form a panel module, and the rear holding frame body 86 is a flange portion 43 in the support body 4. Are attached to the mounting holes 45 by male screws.

  The optical sheet 84 is a laminate in which a relatively thick diffuser plate that diffuses light emitted from the light emitting diode 1 as a light source and a relatively thin synthetic resin sheet such as a reflective polarizing plate, a prism sheet, and a diffuser sheet are laminated. Is the body.

  The support body 4 has a plate portion 41, a frame portion 42 that continues to the periphery of the plate portion 41, and a flange portion 43 that continues to the periphery of the frame portion 42, and the periphery of the diffusion plate is supported by the flange portion 43. Yes.

  A plurality of cylindrical bosses projecting inward are provided on the peripheral side of the cover 82, and are attached to the attachment holes 44 of the plate portion 41 by male screws inserted into the cylindrical bosses.

  In the light source device A, seven light-emitting diode substrates 2a-2g having different heat dissipation effects of the plate portion 22 are separated from the top in the descending order of the heat dissipation effect in the support body 4 with the open side facing forward. It is arranged.

Embodiment 2
FIG. 4 is a front view showing another configuration of the main part of the light source device. In this light source device, instead of making the widths of the light emitting diode substrates 2 arranged in a plurality of rows different in each row, the width of the light emitting diode substrates 2h arranged in the upper row is made to be a rectangular shape. The width of the light emitting diode substrate 2i is set to three times or more, and the light emitting diode substrates 2i arranged in the lower four rows are set to the normal width, so that the heat radiation effect of the light emitting diode substrates 2 in the upper row is enhanced. Is.

  The wide light-emitting diode substrates 2h arranged in the upper row are integrally formed of three rows corresponding to each other, and three rows of wiring patterns 21 are arranged apart from each other in the width direction. 4 or 8 light emitting diodes 1 are joined to each other. The wide light-emitting diode substrates 2h are juxtaposed in the column direction, adjacent light-emitting diode substrates 2h and 2h are connected by three connectors 3, and the connection portion 23 of one light-emitting diode substrate 2h is connected to the circuit board 5 in the second direction. Connected by the connector 6, the connecting portion 24 of the other light emitting diode substrate 2 h is connected by the short connector 7.

  The light-emitting diode substrates 2i having a normal width disposed on the lower side have a strip shape and the like, and are arranged in four rows apart vertically.

In this embodiment, since the wide light emitting diode substrates 2h formed integrally with a plurality of rows are arranged in the upper row, the heat radiation area of the light emitting diode substrates 2h in the upper row is further increased. And the heat dissipation effect can be further enhanced. Therefore, when the heat generated by the light-emitting diodes 1 mounted on the light-emitting diode substrates 2i in the lower row rises due to natural convection, the amount of heat released from the light-emitting diode substrates 2h in the upper row is large, and the light-emitting diodes in the upper row Since the temperature rise of the light-emitting diodes 1 mounted on the substrate 2h can be suppressed, the temperature difference between the light-emitting diodes 1 mounted on the light-emitting diode substrates 2h and 2i in each row can be reduced, and the light-emission temperature is increased. The temperature of the diode 1 can be made uniform, and luminance unevenness due to the temperature rise of the light emitting diode 1 can be reduced.
Since other configurations and operations are the same as those of the first embodiment, the same components are denoted by the same reference numerals, and detailed description thereof and description of operations and effects are omitted.

Embodiment 3
FIG. 5 is a front view showing another configuration of the main part of the light source device. In this light source device, instead of varying the widths of the light emitting diode substrates 2 arranged in a plurality of rows, the materials of the light emitting diode substrates 2 arranged in a plurality of rows are made different so that the light emitting diode substrate 2j having a high heat dissipation effect can be obtained. By arranging the light emitting diode substrates 2k made of a material having an intermediate heat dissipation effect in the upper row and the light emitting diode substrates 2m made of a material having a lower heat release effect in the lower row, the light emitting diode substrates in the upper row are arranged. The heat dissipation effect of 2j is increased.

  The light emitting diode substrate 2 having a strip shape includes a first light emitting diode substrate 2j formed of a metal plate having a relatively high thermal conductivity such as aluminum (for example, a thermal conductivity of 1 W / mk), and a synthetic resin material. A second light emitting diode substrate 2k formed of a plate material having a relatively intermediate thermal conductivity (for example, a thermal conductivity of 0.4 W / mk), and a plate material having a relatively low thermal conductivity such as paper ( For example, the third light emitting diode substrate 2m having a thermal conductivity of 0.2 W / mk) is formed in three types.

  The first light emitting diode substrates 2j are arranged in the upper three rows, the second light emitting diode substrates 2k are arranged in the middle two rows, and the third light emitting diode substrates 2m are arranged in the lower two rows.

In this embodiment, three types of light emitting diode substrates 2j, 2k, and 2m having different thermal conductivities are arranged in a plurality of rows apart from the upper row in the descending order of the thermal conductivity. Since the first to third light emitting diode substrates 2j, 2k, and 2m are arranged so that the heat dissipation effect is gradually increased from the lower row to the upper portion, they are mounted on the third light emitting diode substrate 2m in the lower row. When the heat generated by the light emitting diode 1 is increased by natural convection, the amount of heat dissipated by the second light emitting diode substrate 2k in the middle row and the amount of heat dissipated by the first light emitting diode substrate 2j in the upper row are sequentially increased. Thus, the temperature rise of the light-emitting diodes 1 mounted on the light-emitting diode substrates 2k and 2j in the middle row and the upper row can be suppressed in stages. Therefore, the temperature difference between the light-emitting diodes 1 mounted on the light-emitting diode substrates 2j, 2k, and 2m in each column can be reduced, the temperature of the light-emitting diodes 1 can be made uniform, and the temperature of the light-emitting diodes 1 can be increased. Luminance unevenness due to temperature can be reduced.
Since other configurations and operations are the same as those of the first embodiment, the same components are denoted by the same reference numerals, and detailed description thereof and description of operations and effects are omitted.

Embodiment 4
FIG. 6 is a front view showing another configuration of the main part of the light source device. In this light source device, instead of the widths and thermal conductivities of the light emitting diode substrates 2 arranged in a plurality of rows, the widths of the wiring patterns 21 arranged in a plurality of rows separated from each other in the vertical direction are made different so as to widen the wiring patterns. 21a is arranged in the upper row, the intermediate width wiring patterns 21b and 21c are arranged in the intermediate row, and the narrow wiring pattern 21d is arranged in the lower row, so that the heat radiation effect of the upper row wiring pattern 21 is enhanced. It is a thing.

  The light-emitting diode substrate 2 has copper wiring patterns 21 arranged in four rows on one substantially rectangular surface, and five or eight light-emitting diodes 1 are joined to the wiring patterns 21. The light-emitting diode substrate 2 has a plurality of wiring patterns 21 having different widths in four stages, a plurality of wiring patterns 21 having different heat dissipation effects in four stages, juxtaposed in the column direction, and adjacent light-emitting diode substrates 2. , 2 are connected to each other by the connector 3, the connecting portion 23 of one light emitting diode substrate 2 is connected to the circuit board 5 by the second connector 6, and the connecting portion 24 of the other light emitting diode substrate 2 is connected to the short connector 7. Connected.

  The wiring patterns 21a-21d are formed to have a width having a heat radiating plate portion 21e for radiating heat generated by each light emitting diode 1 in addition to a width for supplying power to each light emitting diode 1. The wiring pattern 21a having the highest heat radiation effect is arranged in the uppermost row, sequentially arranged from the wide wiring patterns 21b and 21c to the lower row, and the wiring pattern 21d having the narrowest width and the lowest heat radiation effect is arranged in the lowermost row. The heat radiation effect is increased stepwise from the bottom row to the upper side. Further, the wiring patterns 21a-21d are arranged on one surface of the light emitting diode substrate 2, a linear conductor portion is provided on the other surface side of the light emitting diode substrate 2, and one ends of the wiring patterns 21a-21d and the conductor portion are connected portions. 23, the wiring patterns 21 a to 21 d and the other end of the conductor portion are connected by the short connector 7.

  The radiator plate 21e has slits 21f in the width direction between the adjacent light emitting diodes 1, and is alternately deviated in the width direction with respect to the adjacent light emitting diodes 1 and arranged in a staggered manner. It is configured to be able to dissipate heat.

  In this embodiment, the four wiring patterns 21a-21d having different heat dissipation effects are arranged in a plurality of rows spaced apart from the top row in the descending order of the heat dissipation effect, in other words, stepped from the bottom row to the top. Since the wiring patterns 21a-21d are arranged in a plurality of rows so as to increase the heat dissipation effect, when the heat generated by the light emitting diodes 1 joined to the wiring patterns 21d in the lower row rises due to natural convection The amount of heat released by the upper row wiring patterns 21a-21c sequentially increases, and the temperature rise of the light emitting diodes 1 joined to the upper row wiring patterns 21a-21c can be suppressed. Therefore, the temperature difference between the light emitting diodes 1 joined to the wiring patterns 21a to 21d in each column can be reduced, the temperature of the light emitting diodes 1 that have been heated can be made uniform, and the luminance due to the temperature rising of the light emitting diodes 1 can be reduced. Unevenness can be reduced.

Embodiment 5
FIG. 7 is a front view showing another configuration of the main part of the light source device. In this light source device, instead of wiring patterns 21 being arranged in a plurality of rows on a single light emitting diode substrate 2, the linear wiring patterns 21 of the light emitting diode substrates 2 arranged in a plurality of rows apart from each other in the vertical direction. By varying the width, the wide wiring pattern 21a is arranged in the upper row, the intermediate wiring patterns 21b and 2c are arranged in the middle row, and the narrow wiring pattern 21d is arranged in the lower row. The heat radiation effect of the light emitting diode substrate 2 is increased.

  The light-emitting diode substrate 2 having a strip shape includes a plurality of pieces in which the width of the wiring pattern 21 is different in four stages, the heat radiation effect of the wiring pattern 21 is changed in four stages, and is juxtaposed in the column direction. The light emitting diode substrate 2n having the wiring pattern 21a having the highest heat radiation effect is arranged in the uppermost row, and the wiring pattern 21 is sequentially arranged from the light emitting diode substrate 2p, 2q having the wide and high heat radiation effect to the lower row to the narrowest. The light emitting diode substrate 2r having the wiring pattern 21d having the lowest heat dissipation effect in the width is arranged in the lowermost row, and the heat dissipation effect is increased stepwise from the lowermost row to the upper side. Adjacent light emitting diode substrates 2 and 2 are connected to each other by a connector 3, a connection portion 23 of one light emitting diode substrate 2 is connected to a circuit substrate 5 by a second connector 6, and the other light emitting diode substrate 2 The connecting portion 24 is connected by the short connector 7.

  The wiring patterns 21 a to 21 d are formed to have a width having a heat radiating plate portion 21 e for radiating heat generated by each light emitting diode 1 in addition to a width for supplying power to each light emitting diode 1. Further, the wiring patterns 21a-21d are arranged on one surface of the light emitting diode substrate 2, a linear conductor portion is provided on the other surface side of the light emitting diode substrate 2, and one ends of the wiring patterns 21a-21d and the conductor portion are connected portions. 23, the wiring patterns 21 a to 21 d and the other end of the conductor portion are connected by the short connector 7.

  The radiator plate 21e has slits 21f in the width direction between the adjacent light emitting diodes 1, and is alternately deviated in the width direction with respect to the adjacent light emitting diodes 1 and arranged in a staggered manner. It is configured to be able to dissipate heat.

  In this embodiment, four light-emitting diode substrates 2n-2r having wiring patterns 21a-21d having different heat dissipation effects are arranged in a plurality of rows spaced apart from the top row in the descending order of the heat dissipation effect. In other words, since the light emitting diode substrates 2n-2r are arranged in a plurality of rows so that the heat dissipation effect is gradually increased from the lowermost row to the upper side, the light emitting diodes 1 mounted on the lower light emitting diode substrate 2r. When the heat generated by natural convection rises, the amount of heat dissipated by the upper row of light emitting diode substrates 2n-2q sequentially increases, and the rise of the light emitting diodes 1 mounted on the upper row of light emitting diode substrates 2n-2q increases. Temperature can be suppressed. Therefore, the temperature difference of the light emitting diodes 1 mounted on the light emitting diode substrates 2n-2r in each column can be reduced, the temperature of the light emitting diodes 1 raised in temperature can be made uniform, and the temperature rise of the light emitting diodes 1 can be increased. Luminance unevenness can be reduced.

Embodiment 6
FIG. 8 is a front view showing another configuration of the main part of the light source device. In this light source device, the light emitting diode substrate 2 having a high heat dissipation effect is arranged in a high temperature distribution region on the region where the light emitting diode substrates 2 are juxtaposed instead of arranging the light emitting diode substrates 2 having different heat dissipation effects in units of columns. The light emitting diode substrate 2 having a low heat dissipation effect is disposed in a low temperature distribution region on the region.

  In the region where the light emitting diode substrate 2 is juxtaposed, the upper region and the region facing the circuit substrate 5 mounted on the other surface of the support 4 have a high temperature distribution. A light emitting diode substrate 2s having a high heat dissipation effect is disposed in a region facing 5 and a light emitting diode substrate 2t having a low heat dissipation effect or an intermediate heat dissipation effect is disposed in another region corresponding to the temperature distribution. .

  In this embodiment, since the light emitting diode substrate 2s having a different heat dissipation effect is arranged corresponding to the temperature distribution on the region where the light emitting diode substrate 2 is juxtaposed, it is mounted on each of the light emitting diode substrates 2s and 2t. The temperature difference between the light-emitting diodes 1 can be further reduced, the temperature of the light-emitting diodes 1 can be made more uniform, and the luminance unevenness due to the temperature rise of the light-emitting diodes 1 can be further reduced. it can.

  The second to sixth embodiments described above may be combined with any one of the first to sixth embodiments.

  Moreover, in embodiment described above, the light emitting diode board | substrate 2 from which each heat dissipation effect differs is distribute | arranged from an upper side in order with a high heat dissipation effect, or among several types of light emitting diode substrate 2 from which a heat dissipation effect differs, a heat dissipation effect is effective. Although a plurality of equal plural units are arranged from the top in order of high heat dissipation effect, the arrangement order is not particularly limited as shown in the sixth embodiment, and the temperature distribution on the region where the light emitting diode substrates 2 are juxtaposed Arrange corresponding to the area.

  In addition, the light source device according to the present invention is used in a display device such as a television that is mounted on the rear side of the display unit in which the light emitting diode substrates 2 are vertically spaced apart and arranged in a plurality of rows and has a display surface on the front side. In addition, it may be used for a display device such as a personal computer.

DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Light emitting diode board | substrate 2a-2r Light emitting diode board | substrate 21 Wiring pattern 21a-21d Wiring pattern 21e Heat sink 3 Connector 4 Support body 5 Circuit board (power supply board)
80 Display part A Light source device

Claims (10)

  A light source device in which a plurality of light emitting diode substrates on which light emitting diodes are mounted is supported on a support, wherein the light emitting diode substrates have different heat dissipation effects.   The light source device according to claim 1, wherein the light emitting diode substrates have different areas.   The light source device according to claim 2, wherein the light emitting diode substrate has a substantially rectangular shape and a large area, but a plurality of light emitting diodes are arranged separately in a longitudinal direction and a width direction.   The light source device according to claim 1, wherein the light emitting diode substrates have different heat transfer coefficients.   The light source device according to claim 1, wherein a wiring pattern on which the light emitting diode is mounted is provided on one surface of the light emitting diode substrate, and the wiring pattern has a different area.   6. The light source device according to claim 1, wherein the light emitting diode substrates are juxtaposed in two intersecting directions, and include a connector that connects adjacent light emitting diode substrates on one side.   The support has a plate shape, the light-emitting diode substrate is disposed on one surface of the support, and a power-supply substrate that supplies power to the light-emitting diode is disposed on the other surface, where the power-supply substrate is disposed. The light source device according to claim 1, wherein the light emitting diode substrate having a relatively high heat dissipation effect is disposed on the one surface.   7. The support according to claim 1, wherein the support has a plate shape and is arranged in a vertical position, and a light emitting diode substrate having a relatively high heat dissipation effect is provided on the upper part of the support. Light source device.   In a light source device in which a plurality of wiring patterns are provided on one surface of a light-emitting diode substrate supported by a support and spaced apart in the width direction, and a plurality of light-emitting diodes are mounted on each of the wiring patterns. The light source device is characterized in that the wiring patterns have different areas.   A light source device according to any one of claims 1 to 9, wherein a display unit having a display surface on one side and the light emitting diodes arranged on the other side of the display unit so as to face the display unit. A display device comprising:

Images