JP2011251447A - Mold releasing film - Google Patents
Mold releasing film Download PDFInfo
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- JP2011251447A JP2011251447A JP2010125878A JP2010125878A JP2011251447A JP 2011251447 A JP2011251447 A JP 2011251447A JP 2010125878 A JP2010125878 A JP 2010125878A JP 2010125878 A JP2010125878 A JP 2010125878A JP 2011251447 A JP2011251447 A JP 2011251447A
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- resin
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Abstract
Description
この発明は、離型フィルム、特に、フレキシブルプリント配線板製造用又は樹脂モールド成形用の離型フィルムに関するものである。 The present invention relates to a release film, particularly to a release film for manufacturing a flexible printed wiring board or resin molding.
フレキシブルプリント配線板は、ポリイミドフィルムなど絶縁基材の表面に所定の回路を設けたフレキシブル回路部材より構成されている。このようなフレキシブルプリント配線板は、通常、フレキシブル回路部材を、接着剤付きの耐熱樹脂フィルムであるカバーレイで被覆して絶縁及び回路保護を行い、離型フィルムを介在させてプレス機を用いプレスラミネートして製造される。 The flexible printed wiring board is composed of a flexible circuit member in which a predetermined circuit is provided on the surface of an insulating substrate such as a polyimide film. Such a flexible printed circuit board is usually covered with a cover lay which is a heat-resistant resin film with an adhesive to insulate and protect the flexible circuit member, and is pressed using a press machine with a release film interposed. Manufactured by laminating.
一方、樹脂モールド成形用の離型フィルムは、モールド成形装置を用いた樹脂の成形加工において、モールド成形後に金型から樹脂（封止材料）を脱型するために、金型と樹脂の間に挟み込み、モールド成形された樹脂と金型を離型するために使用されるものである。 On the other hand, a release film for resin molding is used between a mold and a resin in order to release the resin (sealing material) from the mold after molding in the molding process of the resin using a molding apparatus. It is used to release the resin that has been sandwiched and molded from the mold.
従来、離型フィルムのガスバリア性を向上させるために、離型性を有する樹脂からなる離型層と、ガスバリア性を有する樹脂からなるバリア層とを組み合わせることが提案されている（特許文献１）。 Conventionally, in order to improve the gas barrier property of a release film, it has been proposed to combine a release layer made of a resin having a release property and a barrier layer made of a resin having a gas barrier property (Patent Document 1). .
上記特許文献１に開示された離型フィルムのバリア層には、結晶性の樹脂が使用されている。 For the barrier layer of the release film disclosed in Patent Document 1, a crystalline resin is used.
ところが、結晶性の樹脂で構成されるフィルムは、伸度が小さく、成形性が不十分で、シワ等が発生し、製品の歩留まりが低下するという問題があった。 However, a film composed of a crystalline resin has a problem that the elongation is small, the moldability is insufficient, wrinkles and the like occur, and the yield of the product decreases.
そこで、この発明は、ガスバリア性を維持しつつ、従来の離型フィルムよりもさらに対形状追従性、即ち成形性をより優れたものを提供することを課題とするものである。 Accordingly, an object of the present invention is to provide a film having excellent shape followability, that is, moldability, as compared with a conventional release film while maintaining gas barrier properties.
この発明の離型フィルムは、離型性を有する樹脂からなる離型層と、ガスバリア性を有する樹脂からなるバリア層の少なくとも２層構造からなり、バリア層を構成する樹脂に、非晶性のポリアミド樹脂を１重量％以上含有させたことを特徴とする。 The release film of the present invention has at least a two-layer structure of a release layer made of a resin having a release property and a barrier layer made of a resin having a gas barrier property. The resin constituting the barrier layer has an amorphous property. It is characterized by containing 1% by weight or more of polyamide resin.
上記バリア層は、２層以上で構成することができる。 The barrier layer can be composed of two or more layers.
上記バリア層における非晶性のポリアミド樹脂の含有比率は、２５〜７５重量％であることが好ましい。 The content ratio of the amorphous polyamide resin in the barrier layer is preferably 25 to 75% by weight.
上記バリア層は、結晶性のポリアミド樹脂と、非晶性のポリアミド樹脂の組みあわせによって構成することができる。 The barrier layer can be composed of a combination of a crystalline polyamide resin and an amorphous polyamide resin.
離型層は、含フッ素樹脂、４−メチル１−ペンテンポリメチルペンテン樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンテレフタレート樹脂の群より選択される少なくとも１種の樹脂からなる。 The release layer is made of at least one resin selected from the group consisting of a fluorine-containing resin, 4-methyl 1-pentene polymethylpentene resin, polybutylene terephthalate resin, and polyethylene terephthalate resin.
上記含フッ素樹脂は、炭素−炭素二重結合、カルボニル基、ヒドロキシル基、シアノ基、スルホン酸基、及びエポキシ基からなる群より選択される少なくとも１つの接着性官能基を有する。 The fluororesin has at least one adhesive functional group selected from the group consisting of a carbon-carbon double bond, a carbonyl group, a hydroxyl group, a cyano group, a sulfonic acid group, and an epoxy group.
この発明の離型フィルムは、バリア層に、非晶性のポリアミド樹脂を１重量％以上含有しているため、フィルムの伸度が大きい。このため、成形性が良好であり、フレキシブルプリント配線板製造用又は樹脂モールド成形用離型フィルムとして好適に使用することができる。 Since the release film of this invention contains 1% by weight or more of an amorphous polyamide resin in the barrier layer, the elongation of the film is large. For this reason, the moldability is good, and it can be suitably used as a release film for manufacturing a flexible printed wiring board or resin molding.
この発明の離型フィルムは、バリア層に、非晶性のポリアミド樹脂を１重量％以上含有するので、フィルムの伸度が大きく、対形状追従性、即ち成形性に優れ、成形の際に、シワ等が発生し難く、製品の歩留まりが向上する。 Since the release film of the present invention contains 1% by weight or more of an amorphous polyamide resin in the barrier layer, the elongation of the film is large and the shape conformability, that is, the moldability is excellent. Wrinkles are less likely to occur and the product yield improves.
また、上記バリア層を２層以上で構成することにより、成形性がさらに向上する。 Further, by forming the barrier layer with two or more layers, the moldability is further improved.
以下、この発明の実施例について説明する。
この発明のバリア層をとしては、例えば、結晶性のポリアミド樹脂に、非晶性のポリアミド樹脂を１重量％以上ブレンドしたものを使用することができる。
Examples of the present invention will be described below.
As the barrier layer of the present invention, for example, a crystalline polyamide resin blended with 1% by weight or more of an amorphous polyamide resin can be used.
結晶性のポリアミド樹脂としては、ナイロン６、ナイロン６６、ナイロン１１、ナイロン１２、ナイロン６１０、ナイロン６１２、６−６６ナイロン、ナイロン４６、メタキシレンジアミン／アジピン酸の重合体などが挙げられる。 Examples of the crystalline polyamide resin include nylon 6, nylon 66, nylon 11, nylon 12, nylon 610, nylon 612, 6-66 nylon, nylon 46, metaxylenediamine / adipic acid polymer, and the like.
離型層を構成する樹脂としては、含フッ素樹脂、４−メチル１−ペンテンポリメチルペンテン樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンテレフタレート樹脂の群より選択される少なくとも１種からなる。 The resin constituting the release layer is at least one selected from the group consisting of a fluorine-containing resin, 4-methyl 1-pentene polymethylpentene resin, polybutylene terephthalate resin, and polyethylene terephthalate resin.
表１に示す樹脂を使用して、表２、表３、表４に示す層構成の離型フィルムを作製し、それぞれのフィルムの成形性の評価を行った。 Using the resins shown in Table 1, release films having the layer structures shown in Table 2, Table 3, and Table 4 were prepared, and the moldability of each film was evaluated.
多層のフィルムを製造するには、水冷式又は空冷式の共押出インフレーション法、共押出Ｔダイ法等を使用することができる。 In order to produce a multilayer film, a water-cooled or air-cooled coextrusion inflation method, a coextrusion T-die method, or the like can be used.
成形性の評価は、「ＪＰＣＡ規格の７．５．３．３項の気泡」に準じて評価した。 The moldability was evaluated in accordance with “the air bubbles in 7.5.3.3 of the JPCA standard”.
各符号は、以下の通りである。
ボイド発生率２％未満を合格とした。
Each code is as follows.
A void generation rate of less than 2% was considered acceptable.
評価サンプル数を各ｎ＝１００として評価を行い、サンプル表面にボイドが確認されたものの数が評価サンプル数の２％未満のものを合格とした。
○：ボイド発生率２％未満
×：ボイド発生率２％以上
Evaluation was performed with n = 100 as the number of evaluation samples, and the number of voids confirmed on the sample surface was less than 2% of the number of evaluation samples.
○: Void generation rate of less than 2% ×: Void generation rate of 2% or more
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010125878A JP5385857B2 (en) | 2010-06-01 | 2010-06-01 | Release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010125878A JP5385857B2 (en) | 2010-06-01 | 2010-06-01 | Release film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011251447A true JP2011251447A (en) | 2011-12-15 |
| JP5385857B2 JP5385857B2 (en) | 2014-01-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010125878A Active JP5385857B2 (en) | 2010-06-01 | 2010-06-01 | Release film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014113730A (en) * | 2012-12-07 | 2014-06-26 | Daikin Ind Ltd | Release film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459244A (en) * | 1990-06-27 | 1992-02-26 | Gunze Ltd | Multilayer film and manufacture thereof |
| JPH081884A (en) * | 1994-06-24 | 1996-01-09 | Sumitomo Bakelite Co Ltd | Multilayered film |
| JP2000062119A (en) * | 1998-08-24 | 2000-02-29 | Sumitomo Bakelite Co Ltd | Multilayer film |
| WO2009148096A1 (en) * | 2008-06-06 | 2009-12-10 | グンゼ株式会社 | Multilayered film with excellent antifogging property |
| JP2009285990A (en) * | 2008-05-29 | 2009-12-10 | Daikin Ind Ltd | Mold release film |
-
2010
- 2010-06-01 JP JP2010125878A patent/JP5385857B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459244A (en) * | 1990-06-27 | 1992-02-26 | Gunze Ltd | Multilayer film and manufacture thereof |
| JPH081884A (en) * | 1994-06-24 | 1996-01-09 | Sumitomo Bakelite Co Ltd | Multilayered film |
| JP2000062119A (en) * | 1998-08-24 | 2000-02-29 | Sumitomo Bakelite Co Ltd | Multilayer film |
| JP2009285990A (en) * | 2008-05-29 | 2009-12-10 | Daikin Ind Ltd | Mold release film |
| WO2009148096A1 (en) * | 2008-06-06 | 2009-12-10 | グンゼ株式会社 | Multilayered film with excellent antifogging property |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014113730A (en) * | 2012-12-07 | 2014-06-26 | Daikin Ind Ltd | Release film |
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| JP5385857B2 (en) | 2014-01-08 |
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