JP2011248937A - Optical pickup device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup device and a manufacturing method thereof; the device having an ensured degree of freedom in moving a bendable wiring board (flexible wiring board) used for connection of optical elements such as a PDIC.SOLUTION: A PDIC 50 of an optical pickup device 10 is electrically connected to a conductive pattern provided for a surface of a circuit board 46 via a flexible wiring board 38. A part of a housing 12 that is in contact with the flexible wiring board 38 is provided with a projection 42. This reduces the area where the flexible wiring board 38 and the housing 12 are in contact with each other, thereby reducing the frictional resistance due to their contact. Accordingly, the degree of freedom in movement for adjusting the position of the PDIC 50 is increased.

Description

  The present invention relates to an optical pickup device and a manufacturing method thereof. In particular, the present invention relates to an optical pickup device to which an optical element is connected via a flexible wiring board and a manufacturing method thereof.

  The optical pickup device has a function of irradiating an optical disc with laser light having a predetermined wavelength emitted from a light emitting element, and detecting the laser light reflected by the information recording layer of the optical disc with a light receiving element (Patent Document 1). Thus, an information reading operation or writing operation can be performed on the optical disc.

  In addition, optical elements such as a light emitting element, a light receiving element, and a half mirror constituting the optical pickup device are incorporated in a housing in which a resin material is integrally molded.

  FIG. 7A is a perspective view partially showing a conventional optical pickup device 100. As shown in this figure, in the optical pickup device 100, an optical element such as a half mirror is fixed to a predetermined location inside the housing 102. Furthermore, a PDIC 104 (photodetector IC) which is a light receiving element is disposed at a predetermined position of the housing 102 via a fixing plate 106 made of a glass epoxy substrate or the like. As described above, the reason why the PDIC 104 is fixed to the housing via the fixing plate 106 without directly fixing the PDIC 104 to the housing 102 is to precisely adjust the position of the PDIC 104 by operating the fixing plate 106. .

  The manufacturing method of the optical pickup device having such a configuration is as follows.

  First, optical elements such as a light emitting element, a light receiving element, various lenses, and a mirror are accommodated in a predetermined position of the housing 102.

  Next, laser light is emitted from the light emitting element, and adjustment is performed so that the emitted laser light is applied to a predetermined light receiving region of the PDIC 104. As this adjustment, the surface of the fixed plate 106 is held by a collet, and laser light emitted from the laser device is irradiated toward the PDIC 104. Then, the fixed plate 106 is moved by the collet so that the predetermined light receiving area of the PDIC 104 is irradiated with the laser light. When the laser beam is applied to a predetermined portion of the PDIC 104, the fixing plate 106 is fixed to the housing 102 with an insulating adhesive at this time. The PDIC 104 is connected via a flexible wiring board having excellent flexibility. Therefore, even after the PDIC 104 is connected to another portion (for example, a circuit board) via the flexible wiring board, the position adjustment as described above can be performed by the flexible wiring board being bent.

  After the above process is completed, other optical elements such as a mirror position are inspected and then shipped as a product.

JP 2005-216436 A

  With reference to FIG. 7B, the problem of the optical pickup device 100 described above will be described. The PDIC 104 fixed to the fixing plate 106 is connected to the circuit board 46 disposed on the lower surface of the housing 102 via the flexible wiring board 106. In addition, a bent portion that is folded 180 degrees above the PDIC 104 is provided in the middle of the flexible wiring board 106 to allow movement when the PDIC 104 is aligned. As a result, an intermediate portion of the flexible wiring board 106 is pressed against the side surface of the housing 102.

  However, since the side surface of the housing 102 and the flexible wiring board 106 are in contact with each other and the frictional resistance is large, there is a problem that the movement of the PDIC 104 is hindered when the PDIC 104 is adjusted.

  Furthermore, there is a possibility that the flexible wiring board 106 may be disconnected due to a bending stress generated by being bent 180 degrees at the bent portion. Furthermore, the connection portion between the flexible wiring board 106 and the fixing plate 106 or the connection portion between the flexible wiring board 106 and the PDIC 104 may be peeled off due to the bending stress.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a degree of freedom of movement of a flexible wiring board (flexible wiring board) used for connecting an optical element such as a PDIC. It is an object of the present invention to provide a secured optical pickup device and a manufacturing method thereof.

  An optical pickup device of the present invention is an optical pickup device that emits laser light to an information recording medium and detects the laser light reflected by the information recording medium, and a housing in which a light receiving element is housed at a predetermined position inside A circuit board formed with a conductive pattern disposed on the main surface of the housing and electrically connected to the light receiving element; and a fixing plate having the light receiving element fixed to the main surface facing the housing; A flexible wiring board that connects the light receiving element and the circuit board, and the flexible wiring board is connected to the circuit board and a first connection portion connected to the light receiving element. A second connecting portion; a wiring portion disposed between the first connecting portion and the second connecting portion; a bent portion that folds the wiring portion 180 degrees; and a portion where the light receiving element is provided. Remove the housing A protrusion was protrusions provided, and wherein the contacting said protruding portion to the wiring portion of the flexible wiring board.

  An optical pickup device manufacturing method of the present invention is a method for manufacturing an optical pickup device that emits laser light to an information recording medium and detects the laser light reflected by the information recording medium. A step of housing the light receiving element in a housing having, a step of arranging a circuit board provided with a conductive pattern electrically connected to the light receiving element on a main surface of the housing, a light receiving element fixed to a fixing plate, A step of electrically connecting the circuit board with a flexible wiring board, and irradiating a laser beam from a light emitting element built in the housing while irradiating a predetermined region of the light receiving element with the laser light; Adjusting the position of the fixing plate, and the flexible wiring board includes a first connection portion connected to the light receiving element and a second connection connected to the circuit board. And in the step of adjusting the position of the fixing plate, the wiring portion disposed between the first connecting portion and the second connecting portion, and a bent portion that turns the wiring portion 180 degrees. The fixing plate is moved while the wiring portion of the flexible wiring board is brought into contact with the protruding portion protruding outward.

  In the present invention, a protrusion partly projecting the side surface of the housing is provided, and a flexible wiring board used for connection of the light receiving element is brought into contact with the protrusion part. As a result, the area where the side surface of the housing and the flexible wiring board come into contact with each other is reduced, and the frictional resistance is reduced, so that the movement when adjusting the light receiving element due to the frictional resistance is suppressed. .

  Further, in the present invention, the side surface portion of the housing is partially recessed inside to form a concave portion, and the bent portion of the flexible wiring board is partially accommodated in the concave portion. By doing in this way, the curvature of the bending part of a flexible wiring board becomes small, and the bending stress which acts on a bending part becomes small. Therefore, the breakage of the flexible wiring board due to the bending stress is prevented, and further, the peeling of the connection portion between the flexible wiring board and other parts is prevented.

It is a figure which shows the optical pick-up apparatus of this invention, (A) is a perspective view, (B) is a perspective view which expands and shows it partially. It is a figure which shows the flexible wiring board used for the optical pick-up apparatus of this invention, (A) is a figure which shows the unfolded state, (B) is a figure which shows the shape at the time of incorporating in a housing. It is a figure which shows the optical pick-up apparatus of this invention, (A) is sectional drawing of the location where PDIC is arrange | positioned, (B) is sectional drawing which looked at this location from upper direction. It is a figure which shows the housing which comprises the optical pick-up apparatus of this invention, (A) is a perspective view which shows partially the housing of the location where PDIC is arrange | positioned, (B) is the figure which looked at the said location from upper direction (C) is a perspective view showing another embodiment. It is a figure which shows the optical element integrated in the optical pick-up apparatus of this invention. It is a figure which shows the process of adjusting the position of PDIC in the manufacturing method of the optical pick-up apparatus of this invention. It is a figure which shows the optical pick-up apparatus of background art, (A) is a perspective view which shows a part of optical pick-up apparatus, (B) is sectional drawing of the part by which PDIC is arrange | positioned.

<First Embodiment: Configuration of Optical Pickup Device>
With reference to FIG. 1 to FIG. 5, the configuration of the optical pickup device 10 of the present embodiment will be described.

  A schematic configuration of the optical pickup device 10 will be described with reference to FIG. FIG. 1A shows the entire optical pickup device 10, and FIG. 1B is an enlarged view of a portion where a PDIC 50 (light receiving element) is provided. Here, FIG. 1B shows a part of the state where the optical pickup device 10 shown in FIG. Here, a circuit board 46 is provided on the lower surface of the bottom surface portion 34 of the housing 12. In the following description, an optical element means an element housed in a housing.

  The optical pickup device 10 focuses a laser beam of BD (Blu-ray Disc), DVD (Digital Versatile Disk) or CD (Compact Disc) standard on an information recording layer of an optical disc (information recording medium), and records the information. It has a function of receiving reflected light from the layer and converting it into an electrical signal. The optical pickup device 10 includes, for example, a light emitting chip for BD, a light emitting chip for DVD and a CD. Here, the optical pickup device 10 does not necessarily correspond to laser beams of three types of standards, and may be a type corresponding to laser beams of one or two standards.

  The optical pickup device 10 includes a housing 12 made of a resin material and various optical elements built in the housing 12. Referring to FIG. 1B, the laser device 58, the diffraction grating 56, and the half mirror 22 are fixed to predetermined locations inside the housing 12.

  Although not shown in FIG. 1A, a circuit board provided on the upper surface of the housing 12 with an actuator that holds the objective lens movably and wirings that are electrically connected to various optical elements. And a connector functioning as an input / output terminal. Details of the optical element built in the housing 12 will be described later with reference to FIG.

  The housing 12 is made of a resin material integrally formed by injection molding, and includes a bottom surface portion 34 and a wall-shaped side surface portion 36 protruding in the thickness direction from the outer peripheral end portion of the bottom surface portion 34. As the resin material constituting the housing 12, polycarbonate, modified PPE (Polyphenylene Ether), ABS resin, or the like is employed. Here, the ABS resin is a thermoplastic resin made of acrylonitrile, butadiene and styrene.

  The structure of the housing is the same as that of the conventional structure shown in FIG. 7, and a concave storage area for storing a large number of optical elements is provided from the bottom surface of the housing 12.

  Guide holes 14 and guide grooves 16 are provided at both ends of the housing 12. Under use conditions, a guide shaft is inserted into the guide hole 14, and another guide shaft is engaged with the guide groove 16. The optical pickup device 10 moves along these guide shafts.

  Openings 24 and 26 are formed by partially opening the bottom surface 34 of the housing 12. The openings 24 and 26 are portions that allow the internal space of the housing 12 to communicate with the outside. The light emitted from the light emitting element built in the housing 12 is irradiated to the information recording layer of the optical disc located outside through the openings 24 and 26. Further, the laser beam, which is the return light reflected by the information recording layer of the optical disc, is applied to the light receiving element built in the housing 12 via the openings 24 and 26.

  Two fixing plates 18 and 20 are disposed on the side surface portion 36 of the housing 12. A PDIC (light receiving element) that receives laser light is fixed to the inner main surface of the fixing plates 18 and 20. The vicinity of the end portions of the fixing plates 18 and 20 is fixed to the side surface portion 36 of the housing 12 via an insulating adhesive.

  Referring to FIG. 1B, a circuit board 46 is fixed to the bottom surface of the housing 12, and a conductive pattern electrically connected to an optical element built in the housing 12 is provided on the circuit board 46. Is formed. The conductive pattern formed on the upper surface of the circuit board 46 and the PDIC 50 fixed to the fixing plate 18 are connected via a flexible wiring board 38 (flexible wiring board) made of a flexible material. ing.

  With reference to FIG. 2, the flexible wiring board 38 used for connection of PDIC50 is demonstrated. FIG. 2A shows a state in which the flexible wiring board 38 is developed, and FIG. 2B shows a state of the flexible wiring board 38 under use.

  Referring to FIG. 2A, the flexible wiring board 38 is provided with a patterned conductive wiring layer on the surface of a base material made of polyimide resin having a thickness of 100 μm. Further, the flexible wiring board 38 includes a first connection part 39 to which the PDIC 50 is fixed, a second connection part 41 to be fixed to the circuit board 46 shown in FIG. 1B, and the first connection part 39 and the second connection. It is comprised from the wiring part 43 between the parts 41. FIG.

  In the first connection portion 39, the PDIC 50 is fixed to the front main surface on the paper surface. The PDIC 50 is a package of light receiving elements each including a photodiode, and a conductive wiring layer provided on the surface of the first connection portion 39 via a solder bump provided on the lower surface of the mounting substrate of the PDIC 50. Surface mounted. Further, a fixing plate 18 made of an aluminum substrate or a resin substrate having a thickness of about 1 mm is bonded and fixed to the back surface of the first connection portion 39. An insulating adhesive such as an epoxy resin is used for this adhesive fixing.

  The second connection portion 41 is provided with a plurality of pads made of a part of the conductive pattern. These pads are connected to the conductive pattern of the circuit board 46 shown in FIG. 1B through a conductive adhesive such as solder. Furthermore, the shape of the second connection portion 41 is in accordance with the shape of the end portion of the circuit board 46.

  The wiring part 43 provided between the first connection part 39 and the second connection part 41 includes a wiring part 43A (first wiring part) at the left end on the paper and a wiring at the right end on the paper. Part 43B (second wiring part). Conductive wiring layers for connecting the PDIC 50 are provided on the surfaces of the wiring portions 43A and 43B. Further, the vicinity of the central portion of the wiring portion 43 is partially removed to form an opening 48. Under use conditions, the PDIC 50 is irradiated with laser light through the opening 48.

  Referring to FIG. 2B, when the PDIC 50 is incorporated in the housing of the optical pickup device, the bent portion 45 is provided by folding the middle portion of the wiring portion 43 180 degrees. By doing in this way, the wiring part 43 between the 1st connection part 39 and the 2nd connection part 41 becomes long, and the freedom degree at the time of adjusting PDIC50 becomes large. Details of this matter will be described later with reference to FIG.

  Here, the structure shown in FIG. 2 is the same for the fixing plate 20 shown in FIG. That is, referring to FIG. 1A, a PDIC is fixed to the inner surface of the fixed plate 20, and the PDIC and the circuit board 46 are electrically connected via a flexible wiring board. .

  With reference to FIG. 3, the structure in which the PDIC 50 is connected via the flexible wiring board 38 will be further described. 3A is a cross-sectional view of a portion where the PDIC 50 is fixed as viewed from the side, and FIG. 3B is a view of the portion as viewed from above.

  With reference to FIG. 3A, the PDIC 50 connected to the first connection portion 39 of the flexible wiring board 38 is fixed to the surface of the fixing plate 18. Then, the end portion of the fixing plate 18 is fixed to the support portion 54 which is a part of the housing 12 with an adhesive, so that the PDIC 50 is disposed at a predetermined position of the housing 12.

  On the other hand, the pad provided on the back surface of the second connection part 41, which is the other end of the flexible wiring board, is connected to the conductive pattern provided on the upper surface of the circuit board 46. Further, the wiring portion 43 between the first connection portion 39 and the second connection portion 41 includes a bent portion 45 that is turned back by 180 degrees. Accordingly, the flexible wiring board 38 as a whole becomes longer, and the degree of freedom in adjusting the position of the PDIC 50 is improved.

  As a structure for connecting the PDIC 50 and the circuit board 46, there is a structure in which the flexible wiring board 38 connected to the PDIC 50 is pulled out as it is. However, with this structure, the deformable wiring part 43 between the first connection part 39 and the second connection part 41 of the flexible wiring board 38 is shortened, and the degree of freedom in adjusting the position of the PDIC 50 is obstructed. It will be.

  At the part where the wiring part 43 comes into contact with the housing 12, a protruding part 42 is provided in which the side part 36 protrudes partially outward. The protruding portion 42 is in contact with the intermediate portion of the wiring portion 43. Referring to FIG. 3B, two projecting portions 42 are provided corresponding to the two wiring portions 43A and 43B provided in the flexible wiring board 38.

  Further, as shown in FIG. 3B, the shape of the protrusion 42 viewed from above has a semicircular cross section, for example, and only the tip of the protrusion 42 contacts the wiring portions 43A and 43B. As a result, the contact area between the two is reduced, and the frictional resistance is reduced. Therefore, when the position of the PDIC 50 is adjusted during the manufacturing process, even if the wiring portion 43 moves, the movement is not hindered by the frictional resistance generated between the projection portion 42 and the wiring portion 43. . Furthermore, the frictional resistance does not cause the connection portion between the PDIC 50 and the flexible wiring board 38 or the connection portion between the flexible wiring board 38 and the circuit board 46 to be broken.

  Further, referring to FIG. 3A, a concave portion 40 is formed by recessing the vicinity of the upper end of the side surface portion 36 inward. The concave portion 40 is formed so as to be recessed inward from the other side surface portion 36 of the housing 12.

  A part of the bent portion 45 of the flexible wiring board 38 is accommodated in the concave portion 40. By doing so, the degree to which the flexible wiring board 38 is bent at the bent portion 45 is reduced (that is, the radius of curvature is increased). As a result, first, bending stress acting on the flexible wiring board 38 at the bent portion 45 is reduced, so that disconnection of the conductive pattern formed on the surface of the flexible wiring board 38 is prevented. Further, the stress acting on the connection portion between the first connection portion 39 of the flexible wiring board 38 and the PDIC 50 is also reduced. Furthermore, since the repulsive force generated in the bent portion 45 is reduced, the stress applied to the connection portion between the fixing plate 18 and the support portion 54 is also reduced, and the separation of the fixing plate 18 from the support portion 54 is also suppressed. .

  Further, referring to FIG. 3B, an opening 44 is provided in the side surface 36 of the housing 12 facing the PDIC 50, and laser light is irradiated to the PDIC 50 through the opening 44.

  With reference to FIG. 4, the shape of the housing 12 where the PDIC is disposed will be further described. FIG. 4A is a perspective view partially showing the housing 12 at the corresponding part, FIG. 4B is a view of the housing 12 of this part as viewed from above, and FIG. It is a perspective view which shows the other form.

  Referring to FIGS. 4A and 4B, an opening 44 for allowing the laser beam received by the PDIC to pass is provided in the side surface portion 36 of the housing 12. Projections 42 are provided on both sides of the opening 44. Referring to FIG. 4B, the cross section of the protrusion 42 has a semicircular shape. Specifically, this shape is a structure in which a cylinder cut in half is attached to the side surface 36.

  By doing in this way, a flexible wiring board and the projection part 42 come in contact with a line, and the frictional resistance which generate | occur | produces between both is reduced. In addition, as the cross-sectional shape of the protrusion 42, a triangular polygonal shape or an elliptical shape may be employed.

  Here, as shown in FIG. 4B, since the top of the protrusion 34 is lower than the surface of the housing having the opening, this frictional resistance is low. By adjusting the length of the top, the frictional resistance can be controlled.

  Referring to FIG. 4C, a plurality of protrusions 42 are provided along the longitudinal direction of the side surface portion 36. Here, two protrusions 42 having a hemispherical shape are provided in the vertical direction. By doing in this way, since each projection part 42 contacts a flexible wiring board in a point, the frictional resistance which generate | occur | produces between both becomes still smaller. Here, the shape of the protrusion 42 may be other than a semicircular shape, for example, a pyramid shape such as a quadrangular pyramid.

  Next, with reference to FIG. 5, the optical element housed in the housing of the optical pickup device 10 will be described. First, the optical pickup device 10 includes a first optical system 80 that is an optical path of a laser beam of the BD standard and a second optical system 82 that is an optical path of a laser beam of the DVD standard and the CD standard. Note that the optical pickup device 10 is not necessarily provided with two optical systems, and one optical system may be shared by these three standards.

  The BD standard first optical system 80 includes a laser device 58, a diffraction grating 56, a half mirror 22, a collimating lens 60, a rising mirror 62, an objective lens 52, an AS plate 73, and a PDIC 50. It is out.

  The laser device 58 is a package of a light emitting element that emits a laser beam applied to a BD standard disc 64. Here, the laser device 58 may be a so-called CAN type package or a lead frame type package.

  The diffraction grating 56 has a function of separating the laser light emitted from the laser device 58 into 0th-order diffracted light, + 1st-order diffracted light, and −1st-order diffracted light.

  The half mirror 22 reflects the laser light emitted from the laser device 58 and passing through the diffraction grating 56, while transmitting the laser light (returned light) reflected by the disk 64.

  The collimating lens 60 turns the laser light reflected by the half mirror 22 into parallel light. Further, the collimating lens 60 is provided so as to be able to be displaced along the optical axis. By doing so, it is possible to correct the deterioration of the optical characteristics of the objective lens 52 based on the temperature change.

  The raising mirror 62 has a function of reflecting the laser beam that has passed through the collimator lens 60 so that the incident laser beam travels at right angles to the information recording layer of the disk 64.

  The objective lens 52 is disposed immediately above the raising mirror 33 and has a function of focusing the laser beam raised by the raising mirror 62 onto the signal recording layer of the disk 64.

  The AS plate 73 gives aberration for the servo mechanism to the laser light reflected by the disk 64 and passed through each optical element.

  The PDIC 50 has a built-in photodiode integrated circuit element for signal detection that functions as a photodetector. The PDIC 50 receives a BD laser beam to generate a light receiving output including an information signal component, and a focus servo and tracking servo. Servo signal components used in the above are generated.

  The read operation and write operation of the first optical system 80 are as follows. First, the laser light emitted from the laser device 58 is separated into 0th-order diffracted light, + 1st-order diffracted light, and −1st-order diffracted light by passing through the diffraction grating 56. This is for obtaining a servo signal for performing focus servo and tracking servo in the PDIC 50.

  Thereafter, the laser light is reflected by the half mirror 22, converted into parallel light by the collimator lens 60, and reflected by the rising mirror 62, thereby proceeding in a direction perpendicular to the disk 64. Then, the signal recording layer of the disk 64 is focused by the refractive action and diffraction action of the objective lens 52.

  The laser light (return light) reflected by the signal recording layer of the disk 64 passes through the objective lens 52, the rising mirror 62, and the collimating lens 60 and reaches the half mirror 22.

  The laser light that has passed through the half mirror 22 is given aberration by the AS plate 73 and reaches the PDIC 50. Further, information is read by the PDIC 50, and focus servo and tracking servo are performed based on the read information.

  Next, the second optical system 82 applied to the DVD standard and CD standard discs will be described. The description of the portion of the second optical system 82 that is common to the first optical system 80 is omitted.

  The second optical system 82 includes a laser device 78, a half mirror 70, a collimating lens 72, a rising mirror 33, an objective lens 66, and a PDIC 74.

  The difference between the second optical system 82 and the first optical system 80 is that the second optical system 82 does not include a diffraction grating and an AS plate. Accordingly, in the first optical system 80, the servo mechanism is driven using the three laser beams diffracted by the diffraction grating 56, while in the second optical system 82, only one main beam emitted from the laser device 78 is used. The servo mechanism is driven. Further, the aberration required for the servo mechanism is given by the AS plate 73 in the first optical system 80, and given by the half mirror 70 arranged to be inclined with respect to the optical path in the second optical system 82. .

  The reading operation and writing operation of the disk 64 in the second optical system 82 are as follows. First, a laser beam of CD standard or DVD standard is emitted from the laser device 78. The laser light emitted from the laser device 78 is reflected by the half mirror 70 and then converted into parallel light by the collimator lens 72. Thereafter, the light is reflected by the rising mirror 33 in a direction perpendicular to the information recording layer of the disk 64, and is focused on the information recording layer of the disk 64 by the objective lens 66.

  Laser light, which is return light reflected by the information recording layer of the disk 64, passes through the objective lens 66, is reflected by the rising mirror 33, passes through the collimator lens 72 and the half mirror 70, and irradiates the light receiving surface of the PDIC 74. Is done. Information is read by the PDIC 74, and focus servo and tracking servo are performed based on the read information.

<Second Embodiment: Manufacturing Method of Optical Pickup Device>
Next, a method for manufacturing the optical pickup device 10 of this embodiment will be described. In the optical pickup device 10 of the present invention, first, a plurality of optical elements are fixed inside a housing 12 (see FIG. 1) integrally molded with a resin material. Further, the circuit board 46 on which a predetermined pattern is formed is fixed to the main surface of the housing 12, and then the light emitting element and the light receiving element are connected to the circuit board 46 via the flexible wiring board. Furthermore, an actuator that supports the objective lens in a movable state is fixed to the upper surface of the housing 12.

  Here, when various optical elements are fixed to the housing using an insulating adhesive, a mounting error of about several tens of μm is generated by this fixing process. If this mounting error is left as it is, the laser beam is not irradiated to a predetermined portion of the PDIC (light receiving element), and the reading operation and writing operation by the optical pickup device become unstable.

  In order to prevent this, the position of the PDIC 50 is corrected to a predetermined position after the various optical elements are fixed. Specifically, referring to FIG. 1, after incorporating various optical elements such as a laser device into the housing 12, the fixing plates 18 and 20 having the PDIC fixed to the inner surface are emitted while radiating laser light from the laser device. Move to a predetermined location. Thereafter, the fixing plates 18 and 20 are fixed to the housing 12 via an adhesive. In this way, mounting errors that occur when various optical elements are fixed to the housing 12 are absorbed by the position adjustment of the fixing plates 18 and 20, and are applied to a predetermined region of the PDIC fixed to the fixing plates 18 and 20. Laser light is irradiated.

  The process of adjusting the position of the PDIC 50 will be described in detail with reference to FIG. In this step, first, the main surface of the fixing plate 18 to which the PDIC 50 is fixed is adsorbed by a collet 47 having a suction force. Next, laser light is emitted from the laser device 58 (FIG. 5) built in the housing 12, and the position of the collet 47 is adjusted so that this laser light is irradiated to a predetermined region of the PDIC 50. This position adjustment is performed in the X direction, the Y direction, and the Z direction.

  The position adjustment of the PDIC 50 is performed after the PDIC 50 is electrically connected to the circuit board 46 via the flexible wiring board 38. Further, in order to make the PDIC 50 move smoothly in this adjustment step, a bent portion 45 bent 180 degrees is included in the middle of the flexible wiring board 38. Therefore, in this step, the above adjustment is performed in a state where the wiring portion 43 that is an intermediate portion of the flexible wiring board 38 is pressed against the side surface portion 36 of the housing 12. For this reason, the frictional resistance and the repulsive force generated when the wiring portion 43 is pressed against the side surface portion 36 may adversely affect the adjustment of this process.

  In this embodiment, the protruding portion 42 is provided on the side surface portion 36 in contact with the wiring portion 43 of the flexible wiring board 38. By doing in this way, only the front-end | tip of the projection part 42 comes in contact with the surface of the wiring part 43, the area which both contact becomes small, and frictional resistance becomes small as a result. Therefore, even if the fixing plate 18 is moved by the collet 47 in order to adjust the position of the PDIC 50, the wiring portion 43 of the flexible wiring board 38 can be moved smoothly along with this movement.

  Furthermore, the vicinity of the upper end portion of the side surface portion 36 of the housing 12 is a concave portion 40, which has a shape that is recessed inwardly (on the left side on the paper surface) from other regions. Accordingly, a part of the bent portion 45 of the flexible wiring board 38 is accommodated in the concave portion 40, and the degree of bending of the flexible wiring board 38 at the bent portion 45 is reduced. Therefore, the repulsive force generated by bending the flexible wiring board 38 is reduced, and the position adjustment of the fixing plate 18 (PDIC 50) by the collet 47 is performed reliably.

  By adjusting the position of the fixing plate 18 with the collet 47, when the laser beam is irradiated to a predetermined position of the PDIC 50, the fixing plate 18 is fixed to the housing support portion 54 (see FIG. 3A) with an insulating adhesive. To do.

  Referring to FIG. 1A, the adjustment process described above is also performed on the PDIC that is fixed to the fixing plate 20.

  When the above steps are completed, the optical pickup device 10 shown in FIG. 1 is manufactured through a step of confirming the position of an optical element such as a half mirror built in the housing.

  Here, the guide shaft is inserted into or engaged with the guide hole 14 and the guide groove 16 of the housing 12 shown in FIG. 1A, and both ends of the guide shaft are supported by a frame-shaped chassis, whereby an optical pickup is obtained. A support device is configured. Furthermore, the optical pickup device is configured by incorporating the optical pickup supporting device having such a configuration in a housing.

DESCRIPTION OF SYMBOLS 10 Optical pick-up apparatus 12 Housing 14 Guide hole 16 Guide groove 18 Fixing plate 20 Fixing plate 22 Half mirror 24 Opening part 26 Opening part 33 Raising mirror 34 Bottom face part 36 Side part 38 Flexible wiring board 39 First connection part 40 Concave part 41 2nd connection part 42 Protrusion part 43, 43A, 43B Wiring part 44 Opening part 45 Bending part 46 Circuit board 47 Collet 48 Opening part 50 PDIC
52 Objective Lens 54 Supporting Unit 56 Diffraction Grating 58 Laser Device 60 Collimating Lens 62 Rising Mirror 64 Disc 66 Objective Lens 70 Half Mirror 72 Collimating Lens 73 AS Plate 74 PDIC
78 Laser device 80 First optical system 82 Second optical system

Claims (7)

An optical pickup device that emits laser light to an information recording medium and detects the laser light reflected by the information recording medium,
A housing in which the light receiving element is stored at a predetermined position inside,
A circuit board formed with a conductive pattern disposed on the main surface of the housing and electrically connected to the light receiving element;
A fixing plate to which the light receiving element is fixed to the main surface facing the housing;
A flexible wiring board for connecting the light receiving element and the circuit board;
The flexible wiring board is disposed between a first connection portion connected to the light receiving element, a second connection portion connected to the circuit board, and the first connection portion and the second connection portion. And a bent portion that folds the wiring portion 180 degrees,
An optical pick-up apparatus comprising: a protruding portion that protrudes outwardly from the housing where the light receiving element is provided; and the protruding portion is brought into contact with the wiring portion of the flexible wiring board.   2. The light according to claim 1, wherein a part of the housing facing the bent part of the flexible wiring board is recessed to form a concave part, and a part of the bent part is accommodated in the concave part. Pickup device. The wiring part of the flexible wiring board is arranged at a first wiring part arranged at one end of the flexible wiring board in the short direction and at the other end of the flexible wiring board in the short direction. A second wiring portion,
2. The projecting portion provided on a side surface of the housing includes a first projecting portion that contacts the first wiring portion and a second projecting portion that contacts the second wiring portion. The optical pickup device according to claim 2.   4. The optical pickup device according to claim 1, wherein the protrusion is continuously provided on a side surface of the housing along the flexible wiring board. 5.   The optical pickup device according to any one of claims 1 to 3, wherein the protrusions are discretely provided on a side surface of the housing. A method of manufacturing an optical pickup device that emits laser light to an information recording medium and detects the laser light reflected by the information recording medium,
Storing the light receiving element in a housing having a bottom surface portion and a side surface portion;
Arranging a circuit board provided with a conductive pattern electrically connected to the light receiving element on a main surface of the housing;
Electrically connecting the light receiving element fixed to the fixing plate and the circuit board with a flexible wiring board;
Adjusting the position of the fixing plate so that the laser beam is irradiated to a predetermined region of the light receiving element while irradiating the laser beam from the light emitting element built in the housing, and
The flexible wiring board is disposed between a first connection portion connected to the light receiving element, a second connection portion connected to the circuit board, and the first connection portion and the second connection portion. And a bent portion that folds the wiring portion 180 degrees,
In the step of adjusting the position of the fixing plate, the fixing plate is moved while the wiring portion of the flexible wiring board is brought into contact with the protruding portion that protrudes the housing outward. A method for manufacturing a pickup device. A concave portion is provided by recessing a part of the housing facing the bent portion of the flexible wiring board;
The optical pickup according to claim 6, wherein, in the step of adjusting the position of the fixing plate, the adjustment is performed while storing the part of the bent portion of the flexible wiring board in the concave portion. Device manufacturing method.

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