JP2011243823A - Substrate attachment structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate attachment structure which facilitates attachment of a substrate even when a housing has peripheral walls, minimizes the contour size of a module, and securing workability.SOLUTION: A microphone module 10 includes an oscillating microphone 12 mounted to a housing 11, a substrate 21 which amplifies a signal from the oscillating microphone 12, a microphone wire 15 connecting the oscillating microphone 12 with the substrate 21, and a press-fit terminal 20 which outputs the signal amplified by the substrate 21 to an external connector 16. The housing 11 is opened at front, and includes guides 17a and 17b which are arranged inside the housing at the back face and guide the substrate, a slide 18a guiding the substrate 21 with its sloped surface, a flange 19a supporting the substrate 21, a slide 18b guiding the substrate 21 with its sloped surface, and a flange 19b supporting the substrate 21. Both the slide 18a and the flange 19a are arranged inside the housing 11 on the left face, and both the slide 18b and the flange 19b are arranged inside the housing 11 on the right face.

Description

  More particularly, the present invention relates to a substrate assembly structure in which a substrate is assembled to a housing by fitting a conductive through hole of the substrate to a plurality of protruding terminals provided inside the housing.

  Conventionally, a circuit board (parent board) called a motherboard is provided with a plurality of electrical connectors, and a circuit board (child board) called a daughter board is electrically connected to the electrical connector to assemble the board. As a contact portion, a method of assembling a substrate using an electrical connector of a type in which a male contact portion of the substrate is connected to a female terminal of a mating connector is known.

  However, in such an assembling method, it is necessary to accurately guide from the initial stage when the terminals of the connector are fitted, and if the fitting is started without the guides being aligned, the terminal of any electrical connector is destroyed. There was a fear.

  Therefore, in Patent Document 1, a first connector having a press-fit portion to be inserted into a through hole provided in a parent board corresponding to the above motherboard, a land pattern connected to these first connectors, and the above-mentioned A plurality of sub-boards (chiclets) having contact portions with a second connector installed on a circuit board corresponding to the mother board, and the first connector and the second connector are relatively fitted to each other at the stage where the fitting has advanced. An electrical connector having a precision guide mechanism for precisely guiding and a housing for fixing these substrates side by side is disclosed. With such a configuration, the fitting can be started even with fairly rough alignment, and a highly accurate fitting is realized.

JP 2004-288453 A

  In recent years, in-vehicle electronic devices have adopted a module format in order to improve the mounting property to a vehicle. For example, a microphone module installed in a vehicle interior has a microphone and a microphone amplifier, and the microphone amplifier is attached in the microphone module. In such a microphone module, the terminal is provided on the bottom surface of the housing that is open on one side, and the substrate is assembled to the bottom of the housing, so that the substrate is assembled to the housing surrounded by the wall and the bottom surface. It is structured to be electrically connected to the terminal. When the board is connected to this terminal, an electrical connector (press-fit connection) as in Patent Document 1 or a connection by soldering is performed.

  In Patent Document 1, when the fitting of the first connector and the second connector has progressed, fitting is started even with rough alignment by providing a precision guide mechanism that relatively accurately guides the fitting. It is possible to do this, however, when the board is held in a horizontal state with a gap preventing the interference between the wall of the casing and the board outline, and assembled to a casing having a wall around it. However, the precision guide mechanism cannot be used, and a positioning operation for aligning the through hole of the board with the position of the terminal is required.

  In Patent Document 1, the substrate is guided by a precision guide until the end of insertion, and when inserted using a jig, if the insertion load is not stable due to variations in the guide member or the difference due to thermal expansion between the substrate and the housing after insertion, Stress on the substrate by the housing may be created. Also, in the case of terminal connection by soldering, there is a concern that the high-temperature soldering iron may approach the surrounding wall and the resin casing may be deformed by heat. It is necessary to provide a space for entering the housing in advance and work with great care.

  Therefore, the present invention provides a substrate assembly structure that can easily assemble a substrate even if there are walls around it, can keep the outer size of the module to a minimum, and can ensure workability. For the purpose.

  In order to achieve the above object, a board assembly structure according to the present invention includes a housing in which a plurality of protruding terminals are provided, a board having conductive through holes into which the protruding terminals are fitted, and A guide means having an inclined surface provided on the inner surface of the housing for receiving the substrate into the housing from the open surface and guiding the substrate so that the conductive through hole is fitted into the protruding terminal; Supporting means for supporting the substrate with a jaw provided on the bottom surface of the body, and the guide means guides the conductive through hole to the protruding terminal, and then the substrate is supported by the supporting means. It is characterized by ending the guide before. With such a structure, it is possible to realize a board assembly mechanism that does not require precise guidance.

  Further, in the board assembly structure according to the present invention, the plurality of protruding terminals are press-fit terminals, and the protruding terminals of the casing and the board are electrically connected by fitting the through holes of the board to the press-fit terminals of the casing. It is connected to. In addition, since the substrate assembled in the housing is supported with a predetermined clearance from the housing, there is an effect that it is difficult to receive stress distortion due to thermal expansion.

  By using the substrate assembling mechanism according to the present invention, it is possible to assemble the substrate inside the housing having a wall around it while keeping the substrate horizontal, and the outer size of the module can be minimized. This has the effect of ensuring workability.

It is a perspective view of the microphone module which has the board | substrate assembly mechanism which concerns on embodiment of this invention. It is explanatory drawing which shows the state which removed the board | substrate from the microphone module shown in FIG. It is a perspective view of the cover which covers the front surface of the microphone module shown in FIG. FIG. 4 is a perspective view showing a state where the cover of FIG. 3 is attached to the microphone module shown in FIG. 1. It is explanatory drawing explaining the assembly method by the guide means and support means of the board | substrate assembly mechanism which concerns on embodiment of this invention. It is explanatory drawing explaining the contact location of the guide means and support means of the board | substrate assembly mechanism which concerns on embodiment of this invention.

  Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to the drawings.

  FIG. 1 shows a microphone module 10 having a board assembly mechanism. The microphone module 10 includes a swing microphone 12 attached to a housing 11 around a rotation shaft 13, a substrate 21 having a microphone amplifier circuit that amplifies the signal of the swing microphone 12, the swing microphone 12, and the substrate 21 and a press-fit terminal 20 which is a protruding electrode connected to the external connector 16 in order to output the signal amplified by the substrate 21 to the external connector 16. The conductive through-holes of the substrate 21 are fitted together to achieve both electrical connection and substrate fixation.

  The housing 11 in FIG. 1 has a front surface open, guides 17a and 17b for guiding the substrate are provided on the inner back surface of the housing, and a slide 18a for guiding the substrate 21 on an inclined surface on the left surface inside the housing. Further, a jaw portion 19a for supporting the substrate 21, and a slide 18b for guiding the substrate 21 with an inclined surface and a jaw portion 19b for supporting the substrate 21 are provided on the right side inside the housing. Further, a case fixing claw 22 for fixing the case 11 to the vehicle is provided on the outside of the case 11.

  The microphone module 10 shown in FIG. 1 secures a swing amount of the swing microphone 12 by providing a margin for the microphone wiring 15 that connects the swing microphone 12 and the substrate 21, and connects the substrate 21 to the housing 11. At this time, it is assembled so as not to interfere with the microphone wiring. For this reason, the distance between the swing microphone 12 and the substrate 21 is set apart. Next, the arrangement of the press-fit terminals 20 provided in the housing 11 will be described.

  FIG. 2 shows a state where the substrate is removed from the microphone module 10 shown in FIG. The press-fit terminals 20 are arranged in a vertical line from the front surface to the back surface on the left side of the housing 11, and through-holes are inserted by the front end portions thereof, and the press-fit connection portions having a width larger than the diameter of the through-holes. By being press-fitted into the through hole, a contact load is generated, and an electrical and mechanical connection is obtained. In this embodiment, a so-called needle eye-shaped press-fit terminal is arranged to bend in the width direction so that the tip of the press-fit terminal can easily enter the through hole of the substrate. Press-fit terminals such as M-type and W-type may be used, and they may be arranged at the center of the casing and on the right side of the casing in consideration of microphone wiring.

  FIG. 3 shows a cover 30 that covers the front surface of the microphone module shown in FIG. Since the microphone module has an opening and is a device having a width of about several centimeters, the strength can be increased by providing a spacer 31 having a depth length of the casing for the purpose of preventing the casing from being deformed at the time of mounting. Raised. In addition, the back surface of the spacer 31 has an attachment claw 32 and a substrate holder 33 for attachment to the housing. The substrate holder 33 for the cover supports the substrate from the upper surface of the substrate when the substrate is normally attached to the housing. Here, when the board is not normally attached, the board holder 33 and the board interfere with each other and the cover 30 cannot be attached to the housing, so that the operator can easily recognize the assembly failure. Is possible.

  FIG. 4 shows a state where the cover of FIG. 3 is attached to the microphone module shown in FIG. 1, and the cover 30 covers the opening of the housing 11 after the substrate is normally assembled. Further, the stopper protrusions of the cover 30 and the housing 11 regulate the amount of swing of the swing microphone 12 by limiting the amount of movement of the arm 14 provided on the swing microphone 12, and with respect to the microphone wiring 15. Care is taken not to apply excessive tension. In addition, the swing microphone 12 has the arm 14 abutting against a projection of an attachment portion (not shown) when the vehicle is attached, and the housing fixing claw 22 fits into the groove of the attachment portion, so that the microphone module can be fixed and swung. The microphone is directed in a desired direction. Next, the board assembly mechanism will be described.

  5A to 5C show the positional relationship among the substrate 21, guide means, and support means when the substrate 21 is assembled to the housing 11. First, the substrate 21 is pinched with an index finger and a thumb and inserted through the opening on the front surface of the housing 11 and pressed against the back surface of the housing. Next, when the substrate is pressed against the back surface and slid downward, the substrate 21 moves forward along the inclined portions of the guides 17a and 17b disposed on the back surface, and the vertical surfaces of the guides 17a and 17b. The press-fit terminal 20 can be positioned in the depth direction. Further, when the substrate slides downward, the substrate moves to the center along the slides 18a and 18b arranged on the side surface of the housing as shown in FIG. 5A, and the press-fit terminal 20 can be positioned in the lateral direction. As a result, the tip of the press-fit terminal 20 enters the through hole of the substrate. At this time, the substrate 21 comes into contact with the guide 17a and the slide base 18a in the portion a surrounded by a circle in the figure, and the substrate 21 comes into contact with the guide 17b and the slide table 18b in a portion b surrounded by a circle in the figure. Will be guided in at least four places.

  Further, when the substrate is slid downward, as shown in FIG. 5B, the substrate moves so as to slide on the guides 17a and 17b and the slides 18a and 18b, and the swelled portion of the press-fit terminal (press-fit) Connection part) is led to the through hole. Thereafter, the substrate is detached from the guides 17a and 17b and the slides 18a and 18b, and the tip of the press-fit terminal is fitted into the through hole. At this time, the guides 17a and 17b and the slides 18a and 18b are not functioning anymore, and are not in contact with the substrate, and maintain a certain clearance.

  Further, when the substrate is slid downward using the jig to the bottom of the housing while being kept horizontal, the swelled portion (press-fit connecting portion) of the press-fit terminal fits into the through hole, and FIG. As shown in (C), the jaws 19a and 19b of the housing support the substrate 21 to complete the connection between the press-fit terminal and the through hole. At that time, since the inner surface and side surfaces of the housing are not in contact with the substrate, no force is applied to the substrate, and the insertion load is stabilized. Further, the slides 18 a and 18 b at the position of FIG. 5C serve as stoppers for preventing the substrate 21 from coming off. The guides 17a and 17b and the slides 18a and 18b are guides for guiding the press-fit terminals into the through holes of the board 21. The dimensions of the guide 17 and the slide 18 are manufacturing tolerances such as housing tolerances and board outer tolerances. This is set taking into account the variation of the above.

  Next, the case where the substrate 21 is mistakenly tilted and assembled to the housing 11 will be described with reference to FIG. FIG. 6 shows contact points between the guide means and the support means of the board assembly mechanism. As shown in FIG. 6A, when the substrate 21 is moved downward with the finger sandwiched between the fingers, the substrate 21 is shown in FIG. The parts a, b, and c enclosed in the circle are in contact with the casing. Here, as shown in FIG. 6B, which is a top view, the portion c is in contact with the side surface of the guide 17b so that a clearance with the inner surface is secured. Even in such a state where the substrate is inclined, the substrate 21 comes into contact with the substrate 21 at three positions (a portion, b portion, and c portion) of the guide 17b and the slides 18a and 18b, so that the press-fit terminal 20 and the through hole 23 are contacted. Can be aligned.

  Similarly, when the substrate 21 is tilted to the right as shown by the broken line in FIG. 6A, the alignment is similarly performed by contacting the substrate 21 at three places, the guide 17a, the slide 18a, and the slide 18b. Is possible. Furthermore, in this embodiment, even when the through-hole 23 of the board is displaced from the tip of the press-fit terminal 20, the position shift is eliminated by elastically displacing the tip of the press-fit terminal 20, and the tip of the press-fit terminal 20 is Consideration is given to fit into the through hole 23.

  As described above, when the substrate assembly mechanism according to the present embodiment is used, when the substrate is assembled to the housing, the substrate through-hole and the housing press can be performed simply by moving the substrate against the back surface. Positioning of the fit terminal in the depth direction and the left-right direction is possible, and assembly can be realized without using a precise positioning mechanism. Furthermore, the substrate can be held without applying excessive stress to the substrate.

  In the present embodiment, the embodiment of the microphone module has been described. However, the present invention is not limited to this, and it is only necessary to be able to guide the board to the press-fit terminal position. It is desirable to choose.

  10 microphone module, 11 housing, 12 swinging microphone, 13 rotating shaft, 14 arm, 15 microphone wiring, 16 external connector, 17a, 17b guide, 18a, 18b slide, 19a, 19b jaw, 20 press-fit terminal, 21 Substrate, 22 Housing fixing claw, 23 Through hole, 30 Cover, 31 Spacer, 32 Mounting claw, 33 Substrate holder.

Claims (2)

A housing having a plurality of protruding terminals provided therein;
A substrate having a conductive through hole into which the protruding terminal fits;
A guide means having an inclined surface provided on the inner surface of the housing for receiving the substrate from the opened surface into the housing and guiding the substrate so that the conductive through hole is fitted into the protruding terminal;
A support means for supporting the substrate with a jaw provided on the bottom surface of the housing;
Have
The substrate assembly structure according to claim 1, wherein after the guide means guides the conductive through hole to the projecting terminal, the guide is terminated before the substrate is supported by the support means. In the board | substrate assembly structure of Claim 1,
The plurality of projecting terminals are press-fit terminals, and the board assembling is characterized in that the projecting terminals of the housing and the board are electrically connected by fitting the through holes of the board to the press-fit terminals of the housing. Construction.

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