JP2011243653A - Ultrasonic mounting tool and electronic components mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool of which a suction hole for adsorbing and holding an electronic component can be easily formed on the ventral portion of a horn for generating ultrasonic vibration.SOLUTION: The ultrasonic mounting tool comprises: an oscillator 23 that is provided at one end of a horn 22 and oscillates the horn in the specified direction; a tool part 25 that is provided in a portion at which maximum amplitude of the vibration of the horn is obtained and of which the tip of a suction hole 31 for adsorbing and holding a semiconductor chip C has an opening at the bottom surface. The suction hole is formed to penetrate straight along the vertical direction intersecting the oscillation direction of the horn.

Description

  The present invention relates to an ultrasonic mounting tool used for crimping an electronic component such as a semiconductor chip to a mounting member such as a tape-shaped member made of polyimide using ultrasonic vibration, and an electronic device using the ultrasonic mounting tool. The present invention relates to a component mounting apparatus.

  For example, when a semiconductor chip with bumps, which is an electronic component, is mounted on a tape-shaped member, which is a member to be mounted, a method for mounting the semiconductor chip on the tape-shaped member by applying a pressing load and ultrasonic vibration is known. Yes. That is, by applying ultrasonic vibration while pressing the semiconductor chip against the surface to be joined of the tape-like member with a predetermined pressure, the bumps of the semiconductor chip are melted and joined to the terminals of the tape-like member.

  A mounting apparatus for mounting a semiconductor chip on a tape-like member using ultrasonic vibration is disclosed in Patent Document 1. The mounting apparatus disclosed in Patent Document 1 has a horn. A vibrator is connected to one end of the horn in the longitudinal direction. An ultrasonic oscillator is connected to this vibrator. This ultrasonic oscillator applies a high frequency voltage of 40 kHz, for example, to the vibrator.

  Accordingly, the vibrator vibrates ultrasonically, and the horn vibrates ultrasonically by the vibration wave. That is, the horn vibrates ultrasonically in the lateral direction, which is the longitudinal direction. This vibration of the horn is referred to as transverse vibration.

  A holding portion for sucking and holding a semiconductor chip as an electronic component protrudes from the lower surface of the belly portion where the amplitude of vibration of the horn is maximum. One end of the suction hole is opened at the lower end surface of the holding portion. The other end of the suction hole opens at a position corresponding to a node where the amplitude of vibration on the upper surface of the horn is minimized. A suction device is connected to the other end of the suction hole via a tube.

  Therefore, when the suction device is operated, a suction force is generated in the suction hole opened in the holding portion, so that the semiconductor chip can be sucked and held in the holding portion by this suction force. In addition, since the other end of the suction hole is opened at a node portion where the amplitude of vibration is minimized, loss of vibration energy can be reduced even if a tube is connected to the suction hole.

Japanese Patent No. 3409683

  According to the configuration of Patent Document 1 described above, the suction hole formed in the horn has one end opened in the holding portion provided on the lower surface of the antinode of the vibration of the horn that vibrates ultrasonically, and the other end is subjected to long-wave vibration. In order to reduce the loss of vibration energy of the horn, an opening is made in the vibration node on the upper surface of the horn. Therefore, the suction hole must be formed by bending the horn in a crank shape.

  However, as the horn, an integrated horn having no connection portion is usually used in order to reduce the loss of vibration energy of the entire horn. For this reason, it is not easy from the viewpoint of workability to form a suction hole with one end opened on the lower surface of the horn and the other end opened on the upper surface by bending it into a crank shape.

  Moreover, recently, it is sometimes required to mount a small semiconductor chip of about 1 mm square on the tape-like member. In this case, the semiconductor chip cannot be sucked and held unless the inner diameter of the suction hole is set to 1 mm or less which is smaller than the outer dimension of the semiconductor chip.

  However, the work of forming a suction hole with a small inner diameter dimension over the entire length in the horn is not easy because, for example, the drill is easily damaged, and the suction hole is bent in a crank shape as described above. In some cases, the processing work becomes more time-consuming and difficult.

  The present invention provides an ultrasonic mounting tool and an electronic component mounting apparatus in which a suction hole can be easily formed by forming a suction hole in a horn straight along the vertical direction of the horn. It is to provide.

This invention is an ultrasonic mounting tool for crimping an electronic component to a mounted member by pressing load and vibration,
Horn,
A vibrator provided at one end of the horn to vibrate the horn in a predetermined direction;
Provided in the portion where the amplitude of the vibration of the horn is maximized, the lower surface includes a tool portion having an opening at the tip of a suction hole that holds the electronic component by suction,
In the ultrasonic mounting tool, the suction hole is formed to penetrate straight along a vertical direction intersecting with a vibration direction of the horn.

  It is preferable that a portion of the lower surface of the tool portion where the suction hole is opened is provided with a throttle portion that opens the suction hole with a smaller diameter than other portions.

  A support member that is slidably in contact with the upper surface of the horn is provided on the upper surface of the portion where the amplitude of vibration of the horn is maximum, and one end of the tool portion is provided on the support member. It is preferable that a communication hole is formed which communicates with the suction hole opened on the upper surface and has the other end opened on the side surface of the support member.

The present invention is an electronic component mounting apparatus for crimping an electronic component to a mounted member by pressing load and vibration,
An ultrasonic mounting tool having a tool portion and holding the electronic component by suction on the tool portion;
Support means for supporting the ultrasonic mounting tool so as to be driven in the vertical direction;
Driving means for driving the ultrasonic mounting tool supported by the support means in the downward direction to press-bond the electronic component held by the tool portion to the mounted member;
The ultrasonic mounting tool is in an electronic component mounting apparatus having the structure described in claim 1.

  According to the present invention, the suction hole having one end opened in the tool portion is formed straight in the vertical direction intersecting the vibration direction in the portion where the amplitude of the vibration of the horn is maximized. It can be easily processed into a horn. Moreover, even when the diameter is reduced according to the size of the electronic component, if the suction hole is straight, it is possible to reduce only the end of the suction hole that opens in the tool part. The suction hole can be easily processed according to the size of the electronic component.

The side view which shows schematic structure of the mounting apparatus which shows 1st Embodiment of this invention. The front view of the mounting apparatus shown in FIG. Sectional drawing which shows the attachment structure of the horn with respect to (theta) movable body. Sectional drawing which follows the IV-IV line of FIG.

Embodiments of the present invention will be described below with reference to FIGS.
FIG. 1 is a side view of the mounting apparatus, and FIG. 2 is a front view. As shown in FIG. 1, the mounting apparatus includes an apparatus main body 1. The apparatus main body 1 is provided with a Y guide body 2 along the Y direction. The Y guide body 2 is provided with a Y movable body 3 so as to be driven in the Y direction indicated by an arrow.

  On the front end surface of the Y movable body 3, a pair of X guide bodies 4 spaced apart at a predetermined interval in the vertical direction are provided along the X direction. An X movable body 5 is provided on the X guide body 4 so as to be driven. The X movable body 5 has a side surface formed in an inverted L shape, and a receiving portion 6 movably engaged with the X guide body 4 is provided on the outer surface of the vertical wall 5a.

  As shown in FIG. 2, a pair of Z guide bodies 7 are provided on the inner surface of the vertical wall 5a of the X movable body 5 so as to be spaced apart from each other in the X direction at a predetermined interval. A Z movable body 8 is provided on the Z guide body 7 so as to be driven in the vertical direction indicated by an arrow Z. A plurality of, for example, four springs 11 are stretched between the upper surface of the Z movable body 8 and the lower surface of the horizontal wall 5b of the X movable body 5 to urge the Z movable body 8 in the upward direction. is doing.

  On the upper surface of the horizontal wall 5b of the X movable body 5, a cylinder 12 as a Z drive source as a drive means is provided with the axis line vertical. A pressing member 14 is provided at the tip of the rod 13 of the cylinder 12. The pressing member 14 is in contact with a roller 15 provided on the upper surface of the Z movable body 8 with the rotation axis line horizontal. Therefore, when the rod 13 of the cylinder 12 is biased in the protruding direction, the Z movable body 8 is driven in the downward direction against the restoring force of the spring 11.

  A θ drive source 16 is built in the lower part of the Z movable body 8. At the lower end of the Z movable body 8, there is provided a θ movable body 17 that is rotationally driven around the vertical line by the θ drive source 16. An ultrasonic mounting tool 21 is attached to the θ movable body 17. The ultrasonic mounting tool 21 has a prismatic horn 22 as shown in FIGS.

  A vibrator 23 is connected and fixed to one end of the horn 22 in the longitudinal direction. An oscillator (not shown) is connected to the vibrator 23, and a high frequency voltage of 40 kHz, for example, is applied from this oscillator. Thereby, the horn 22 is ultrasonically vibrated together with the vibrator 23.

  A rectangular base portion 24 is provided on the lower surface of the central portion in the longitudinal direction of the horn 22, that is, the portion where the amplitude of vibration caused by the vibration wave propagating to the horn 22 is maximum, that is, the antinode portion of the vibration. On the lower surface of the portion 24, a tool portion 25 is formed to protrude with a predetermined width dimension in the width direction of the horn 22.

  A suction hole 31, which will be described later, is formed in the lower end surface of the tool portion 25, and a semiconductor chip C (shown in FIG. 2) as an electronic component is sucked and held on the lower end surface. In this embodiment, the semiconductor chip C is slightly smaller than the lower end surface of the tool portion 25, for example, a minute size of about 1 mm square.

  On the upper surface of the horn 22, a load receiving portion 26 having substantially the same planar shape as that of the base 24 is formed to project at the antinode portion of the vibration wave, which is the central portion in the longitudinal direction corresponding to the tool portion 25. The tool portion 25 and the load receiving portion 26 are integrally formed with the horn 22.

  On the upper surface of the load receiving portion 26, a strip-shaped bracket 27 whose width dimension is slightly smaller than the width dimension of the horn 22 and whose length dimension is shorter than the horn 22 contacts the lower surface of the central portion in the longitudinal direction. Is provided. As shown in FIG. 1, both ends of the bracket 27 are connected and fixed to the nodes of the vibration wave where the lateral vibration of the horn 22 is minimized by screws 28, respectively.

  A portion between both end portions of the bracket 27 and a portion in contact with the load receiving portion 26 is formed as a low-rigidity portion 27 a that makes the rigidity of this portion lower than that of other portions of the bracket 27. The low-rigidity portion 27 a is formed by a cavity portion 29 that penetrates in the width direction of the bracket 27. The corner portion on the inner surface of the hollow portion 29 is formed in an R shape so as to avoid stress concentration.

  Accordingly, in order to fix the bracket 27 to the horn 22 via the load receiving portion 26, when the screws 28 at both ends of the bracket 27 are tightened into the horn 22, a cavity 29 of the bracket 27 is formed. The low rigidity portion 27a is elastically deformed and curved.

  Therefore, even if both end portions of the bracket 27 are connected and fixed to the horn 22 with the screws 28, the lower surface of the central portion in the longitudinal direction of the bracket 27 and the upper surface of the load receiving portion 26 are maintained in surface contact.

  The bracket 27 has an upper surface corresponding to a portion where the lower surface of the bracket 27 is slidably contacted with the load receiving portion 26 fixed to the lower surface of the θ movable body 17. Therefore, the ultrasonic mounting tool 21 can be driven in the X, Y, Z, and θ directions.

  3 and 4 are sectional views showing a connecting structure of the θ movable body 17 and the bracket 27. FIG. That is, the heat insulating member 30 is attached and fixed to the lower surface of the θ movable body 17 by a plurality of first screws 30a, and the bracket 27 is attached to the lower surface of the heat insulating member 30 by a plurality of second screws 30b. It is fixed.

  The bracket 27, the θ movable body 17 and the heat insulating member 30 constitute a support member of this embodiment.

  In the portion of the antinode of the vibration of the horn 22, that is, in the portion where the tool portion 25 is provided on the lower surface and the load receiving portion 26 is provided on the upper surface, the lower end is opened on the lower surface of the tool portion 25 and the upper end is the load receiving portion. The suction hole 31 opened in the upper surface of the portion 26 is formed. That is, the suction hole 31 is formed so as to penetrate straight in the vertical direction of the horn 22.

  As shown in FIG. 3, the inner diameter of the suction hole 31 is set to D except for the lower end. The suction hole 31 has a lower end opened at the lower surface of the tool portion 25 with an inner diameter dimension d smaller than the inner diameter dimension D through the throttle portion 32 and an upper end at the upper surface of the load receiving section 26 with the inner diameter dimension D. Open.

  The inner diameter dimension D of the portion excluding the tip of the suction hole 31 is set to be equal to or larger than the length dimension of one side of the semiconductor chip C, and is opened to the lower surface of the tool portion 25 through the throttle portion 32. The inner diameter d of the tip of the suction hole 31 is set slightly smaller than the length of one side of the semiconductor chip C held by suction on the lower surface of the tool portion 25.

  When the semiconductor chip C is 1 mm square, the suction hole 31 cannot be sucked and held unless the suction hole 31 is opened to the lower surface of the tool portion 25 with an inner diameter of 1 mm or less. In that case, it is not easy to work by penetrating the narrow suction hole 31 having an inner diameter of 1 mm or less in the vertical direction of the horn 22.

  However, the suction hole 31 has a tip portion opened to the lower surface of the tool portion 25 with an inner diameter size d smaller than one side of the semiconductor chip C through the throttle portion 32, and other portions other than the tip portion are formed. The inner diameter dimension D is larger than one side of the semiconductor chip C.

  Therefore, in order to process the suction hole 31, first, the suction hole 31 having the inner diameter D is processed from the upper surface side of the horn 22 by a drill (not shown) having an outer dimension D. At that time, the processing of the suction hole 31 having the inner diameter D is stopped immediately before penetrating the lower surface of the horn 22. That is, the processing of the suction hole 31 having the inner diameter D is stopped in a state where the lower end of the suction hole 31 is left at the lower end of the suction hole 31.

  Next, a portion where the lower end of the suction hole 31 is closed is drilled with a drill having an outer diameter d. As a result, the throttle portion 32 is formed in which the tip of the suction hole 31 is opened with an inner diameter d smaller than the inner diameter D of the portion other than the tip.

  In this way, if only the tip end portion of the suction hole 31 is formed to have a small inner diameter dimension d through the throttle portion 32, the portion of the small inner diameter dimension d occupying the entire length of the suction hole 32 can be made slightly. The entire suction hole 32 can be processed and formed as compared with the case of forming the entire inner diameter d with a small diameter.

  The upper ends of the suction holes 32 opened to the load receiving portion 26 are first and second communication holes 33a and 33b formed through the bracket 27 and the heat insulating member 30 in the thickness direction with an inner diameter dimension D. It communicates with the lower end of. The upper ends of the first and second communication holes 33a and 33b are in communication with a third communication hole 33c having an inner diameter dimension D with the lower end opened on the lower surface of the θ movable body 17.

  As shown in FIG. 4, the third communication hole 33 c is bent in an L shape, and the other end is opened on the side surface of the θ movable body 17. A suction pipe 33 (shown in FIG. 1) connected to a suction pump (not shown) is connected to the other end of the third communication hole 33c.

  Therefore, when the suction pump is activated, a suction force is generated in the suction hole 32 opened through the throttle portion 32 in the tool portion 25 on the lower surface of the horn 22, and the semiconductor is formed on the lower surface of the tool portion 25 by the suction force. The chip C can be adsorbed and held.

  Here, the first communication hole 33 a formed in the bracket 27 has a larger diameter than the suction hole 31 formed in the horn 22. Further, the second communication hole 33b formed in the heat insulating member 30 is larger in diameter than the first communication hole 33a, and the third communication hole 33c formed in the θ movable body 17 is the second communication hole. It has a larger diameter than 33b.

  In this manner, the suction holes 31, the first communication holes 33a, the second communication holes 33b, and the second communication holes 33c are sequentially increased in diameter in this order, so that the bracket 27 can be attached to the horn 22 and the bracket. Even if there is a slight deviation in the attachment of the heat insulating member 30 to the heat insulating member 27 and the attachment of the θ movable body 17 to the heat insulating member 30, the cross sectional area of the entire suction path causes the suction hole 31 for sucking the semiconductor chip C due to the deviation. It is almost never less than the cross-sectional area.

  Therefore, it is possible to prevent the suction force generated in the suction hole 31 from being reduced and the semiconductor chip C from being reliably sucked.

  In particular, when the semiconductor chip C is as small as 1 mm or less, the inner diameter of the suction hole 31 is further smaller than the size of the semiconductor chip C. Therefore, if the first communication hole 33a is displaced from the suction hole 31, the suction hole 31 is sucked. Although the suction force set in the hole 31 may not be generated, as described above, the first communication hole 33a has a larger diameter than the suction hole 31, and the second communication hole than the first communication hole 33a. 33b has a larger diameter, and the third communication hole 33c has a larger diameter than the second communication hole 33b, so that the suction force generated in the suction hole 33 can be increased even if there is a slight shift in the mutual connection portion. It is possible to prevent the decrease.

  As shown in FIGS. 1 and 2, a stage 35 is disposed below the ultrasonic mounting tool 21. Although not shown in detail, the stage 35 can be driven in the X, Y, and Z directions. On the upper surface of the stage 35, a substrate 36 such as a tape-shaped member made of polyimide is supplied and mounted as a member to be mounted.

  The ultrasonic mounting tool 21 is positioned so that the tool portion 25 faces the position where the semiconductor chip C is mounted on the positioned substrate 36. Next, the ultrasonic mounting tool 21 is driven in the downward direction. At this time, a high frequency voltage is applied to the vibrator 23.

  As a result, the semiconductor chip C sucked and held by the tool portion 25 is pressed against the substrate 36 by the pressure applied by the Z movable body 8 and the lateral vibration of the horn 22. That is, since the horn 22 is ultrasonically vibrated with the vibrator 23, the bumps provided on the semiconductor chip C are melted by the applied pressure and the ultrasonic vibration, and the semiconductor chip C is mounted on the substrate 36.

  When the semiconductor chip C is mounted on the substrate 32, the semiconductor chip C can be mounted effectively by providing a heater (not shown) on the stage 35 and heating the substrate 32. At this time, the heat of the heater is conducted to the horn 22, but since the heat insulating member 30 is provided between the horn 22 and the bracket 27, the θ movable body 17 connected to the horn 22 by the heat insulating member 30. In addition, the transmission of heat from the heater is reduced.

  As described above, according to the ultrasonic mounting tool 21 having the above-described configuration, the lower end opens at the lower surface of the tool portion 25 at the antinode portion where the amplitude of the ultrasonic vibration of the horn 22 is maximized, and the upper end is at the load receiving portion. A suction hole 31 opened at 26 is formed by penetrating straight in the vertical direction of the horn 22.

  The upper end of the suction hole 31 is connected to the third communication hole 33 c formed in the θ movable body 17, the first communication hole 33 a formed in the bracket 27 and the second communication hole formed in the heat insulating member 30. It was made to communicate through the hole 33b.

  Therefore, since the suction hole 31 penetrates straight in the vertical direction of the horn 22, it is possible to easily and precisely perform the processing work as compared with the conventional case where the suction hole 31 is bent in a crank shape.

  When the suction pipe 33 connected to the suction pump 31 is connected to the suction hole 31, the suction pipe 33 may increase the loss of vibration energy of the horn 22.

  However, the suction hole 31 is formed in the belly portion where the amplitude of the horn 22 is maximum. In addition, a bracket 27 is slidably pressed against the load receiving portion 26 provided on the upper surface of the horn 22 and formed on the bracket 27, the heat insulating member 30 and the θ movable body 17. The suction pipe 33 communicating with the suction hole 31 is connected via the first to third communication holes 33a to 33c.

  Therefore, even if the suction hole 31 is formed in the belly portion where the amplitude of the horn 22 is maximum, and the suction pipe 33 is communicated with the suction hole 31, the horn 22 vibrates in sliding contact with the bracket 27. That is, since the suction tube 33 does not vibrate with the horn 22, it is possible to prevent the vibration energy of the horn 22 from being lost by the suction tube 33.

  In other words, the suction hole 31 to which the suction pipe 33 is connected is straightened in the vertical direction of the horn 22 without causing a large loss in the vibration energy of the horn 22 in the antinode portion where the amplitude of the horn 22 is maximum. Since it can be formed by penetrating, it can be easily processed as compared with the conventional case where the suction hole 31 is bent in a crank shape.

  Further, the horn 22 and the bracket 27 are slidably connected so that the low-rigidity portion 27a provided on the bracket 27 is deformable and the vibration energy of the horn 22 is not lost. Therefore, the suction hole 31 of the horn 22 and the first communication hole 33a of the bracket 27 can be connected in an airtight manner so that the suction force for sucking the semiconductor chip C acting on the inside does not leak. That is, the above-described connection structure between the horn 22 and the bracket 27 can increase the suction force for sucking the semiconductor chip C.

  The suction hole 31 is opened on the lower surface of the tool portion 25 via a throttle portion 32. That is, since the suction hole 31 is made to penetrate straight in the vertical direction of the horn 22, the throttle portion 32 is formed at the lower end of the suction hole 31, and the lower surface of the tool portion 25 is formed through the throttle portion 32. The tip of the suction hole 31 can be opened with a smaller diameter than other portions.

  That is, the portion of the suction hole 31 excluding the lower end opening is made to have an inner diameter D that is sufficiently larger than the outer dimension of the fine semiconductor chip C by relatively simple processing, and only the distal end portion, which is the opening end, is the throttle portion 32. Thus, a fine inner diameter d capable of attracting and holding the fine semiconductor chip C can be obtained.

  Therefore, as compared with the case where the suction hole 31 has a fine inner diameter dimension over the entire length, the suction hole 31 can be easily and precisely formed, and the semiconductor chip C is held by suction. There is no reduction in suction power.

  In the above embodiment, the case where the wavelength of the ultrasonic vibration is one wavelength has been described. However, the present invention can also be applied when the wavelength is (1/2) N · λ. Note that λ is a wavelength and N is an integer.

  That is, the tool portion 25 is provided at a position corresponding to the position of the maximum amplitude of ultrasonic vibration. In this way, the tool portion 25, the suction hole 31, and the first to third communication holes 33a to 33c are provided at the plurality of maximum amplitude positions, respectively, so that the plurality of semiconductor chips C are attracted by each tool portion 25. At the same time, it can be mounted on the substrate 36.

  17 ... θ movable body (support member), 21 ... ultrasonic mounting tool, 22 ... horn, 23 ... vibrator, 25 ... tool portion, 27 ... bracket (support member), 29 ... heat insulation member (support member), 31 ... Suction hole, 32.

Claims (4)

An ultrasonic mounting tool for crimping an electronic component to a mounted member by pressing load and vibration,
Horn,
A vibrator provided at one end of the horn to vibrate the horn in a predetermined direction;
Provided in the portion where the amplitude of the vibration of the horn is maximized, the lower surface includes a tool portion having an opening at the tip of a suction hole that holds the electronic component by suction,
The ultrasonic mounting tool, wherein the suction hole is formed to penetrate straight along a vertical direction intersecting with a vibration direction of the horn.   2. The ultrasonic mounting tool according to claim 1, wherein a portion of the lower surface of the tool portion where the suction hole is opened is provided with a narrowing portion that opens the suction hole with a smaller diameter than other portions. .   A support member that is slidably in contact with the upper surface of the horn is provided on the upper surface of the portion where the amplitude of vibration of the horn is maximum, and one end of the tool portion is provided on the support member. The ultrasonic mounting tool according to claim 1, wherein a communication hole is formed which communicates with the suction hole opened on an upper surface and has the other end opened on a side surface of the support member. An electronic component mounting apparatus for crimping an electronic component to a mounted member by pressing load and vibration,
An ultrasonic mounting tool having a tool portion and holding the electronic component by suction on the tool portion;
Support means for supporting the ultrasonic mounting tool so as to be driven in the vertical direction;
A driving means for driving the ultrasonic mounting tool supported by the supporting means in a downward direction to press the electronic component held by the tool portion against the mounted member;
An apparatus for mounting an electronic component, wherein the ultrasonic mounting tool has the configuration described in claim 1.

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