JP2011243627A - Liquid processing method, recording medium with recorded program for executing the liquid processing method, and liquid processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid processing method that eliminates an unprocessed part of a substrate as a result of supporting the substrate by a support portion, and prevents mist of processing liquid from being generated.SOLUTION: The liquid processing method of processing a lower surface of the substrate with the processing liquid comprises: a first processing process S11 of rotating the substrate, provided in a rotatable state and supported by the support portion supporting the substrate from below, so that the substrate does not change in relative angular position with respect to the support portion, and then supplying the processing liquid to the lower surface of the substrate in rotating motion so as to process the lower surface of the substrate with the supplied processing liquid; a position changing process S14 of changing the rotational frequency of a rotation portion rotating the support portion after the first processing process S11 so as to change the relative angular position; and a second processing process S15 of rotating the substrate supported by the support portion after the position changing process S14 and then supplying the processing liquid to the lower surface of the substrate in rotating motion so as to process the lower surface of the substrate with the supplied processing liquid.

Description

  The present invention relates to a liquid processing method for processing using a processing liquid, a recording medium on which a program for executing the liquid processing method is recorded, and a liquid processing apparatus.

  In a semiconductor device manufacturing process or a flat panel display (FPD) manufacturing process, a processing liquid is supplied to a semiconductor wafer or glass substrate, which is a substrate to be processed (hereinafter referred to as “substrate” or “wafer”), to perform liquid processing. Many liquid processing processes are performed.

  As one of such liquid processing processes, there is a liquid processing process in which a processing liquid is supplied to the back surface or the peripheral portion of the substrate, and the liquid processing is performed on the back surface or the peripheral portion of the substrate with the supplied processing liquid.

  For example, in a manufacturing process of a semiconductor device or the like, a film forming process may be performed to form various thin films on the surface of the substrate. In the film forming process, a thin film may be formed not only on the surface of the substrate but also on the back surface or the peripheral edge of the substrate. It is preferable to remove the thin film formed on the back surface or the peripheral portion of the substrate because it may cause warpage of the substrate in the subsequent manufacturing process, for example, during heat treatment. Therefore, a liquid processing process may be performed in which the processing liquid is supplied to the back surface or the peripheral portion of the substrate, and the back surface or the peripheral portion of the substrate is etched by the supplied processing liquid.

  As a liquid processing apparatus that performs such a liquid processing process, a liquid processing apparatus that performs liquid processing on a lower surface of a substrate by supplying a processing liquid to the lower surface of the substrate is known (see, for example, Patent Document 1). .) In the example shown in Patent Document 1, the liquid processing apparatus includes a substrate holding unit (mounting member), a substrate rotating unit, and a processing liquid supply unit. The substrate holding means holds the substrate in a state where it is supported in a horizontal posture. The substrate rotating unit rotates the substrate held by the substrate holding unit around the axis in the vertical direction. The processing liquid supply unit supplies the processing liquid to the lower surface of the substrate held by the substrate holding unit and rotated by the substrate rotating unit via the processing liquid supply pipe.

JP 2002-93691 A

  However, the above-described liquid processing method for performing processing with the processing liquid on the lower surface of the substrate has the following problems.

  In order to perform processing on the lower surface of the substrate with the processing liquid, the substrate may be mounted on a mounting member provided on the substrate holding means, for example, at several locations on the outer peripheral edge of the lower surface. Then, the processing liquid is not supplied to the portion of the lower surface of the substrate that is placed on the placement member. Therefore, the part mounted on the mounting member becomes an unprocessed part. In order to eliminate the unprocessed portion, it is necessary to lift the substrate from the mounting member by another delivery means, change the relative angular position of the substrate with respect to the mounting member, and then mount the substrate on the mounting member again. Therefore, it is difficult to eliminate the unprocessed portion while being placed on the placement member.

  In the example shown in Patent Document 1, the mounting member holds the substrate in a slidable manner, and the substrate can be slid with respect to the mounting member by supplying a processing liquid or the like. However, in the example shown in Patent Document 1, it is not disclosed how to specifically remove the unprocessed portion by sliding the substrate with the processing liquid. In particular, when the substrate is slid while supplying the processing liquid, a mist of the processing liquid is generated, and the generated mist wraps around the upper surface side of the substrate or reattaches to the substrate as particles. .

  Further, not only when the substrate holding means is a mounting member on which the substrate is mounted, but also when the substrate holding means is a support portion that supports the substrate by various methods such as clamping the substrate from above and below, there is a similar problem. .

  The present invention has been made in view of the above points, and when the processing liquid is supplied to the lower surface of the substrate and the lower surface of the substrate is processed by the supplied processing liquid, the substrate is supported by the support portion. Provided are a liquid processing method and a liquid processing apparatus capable of eliminating the unprocessed portion of a substrate resulting from the generation of a mist of a processing liquid.

  In order to solve the above-described problems, the present invention is characterized by the following measures.

  According to an embodiment of the present invention, in the liquid processing method for processing the lower surface of the substrate with a processing liquid, the substrate supported by a support portion that is rotatably provided and supports the substrate from below is provided. First rotating the substrate together with the support so that the relative angular position of the substrate relative to the support does not change, supplying a processing liquid to the lower surface of the rotating substrate, and processing the lower surface of the substrate with the supplied processing liquid After the first processing step, after the first processing step, the position changing step for changing the relative angular position by changing the rotational speed of the rotating portion that rotates the support portion, and after the position changing step, The substrate supported by the support unit is rotated together with the support unit so that the relative angular position does not change, and a processing liquid is supplied to the lower surface of the rotating substrate, and the substrate is rotated by the supplied processing liquid. And a second processing step of processing a bottom surface of the substrate, the liquid processing method is provided.

  According to one embodiment of the present invention, in the liquid processing apparatus for processing the lower surface of the substrate with the processing liquid, the support unit is rotatably provided and supports the substrate from below, and the rotation rotates the support unit. A substrate, a processing liquid supply unit for supplying a processing liquid to a lower surface of the substrate supported by the support unit, and the substrate supported by the support unit by the rotating unit, the substrate with respect to the support unit The relative angular position of the substrate is rotated together with the support unit, the processing liquid is supplied to the lower surface of the rotating substrate by the processing liquid supply unit, and the lower surface of the substrate is processed by the supplied processing liquid, After the lower surface is processed, the relative angle position is changed by changing the number of rotations that rotate the support part by the rotating part, and after the relative angle position is changed, the support part is supported by the support part. The substrate is rotated by the rotating unit together with the support unit so that the relative angular position does not change, and the processing liquid is supplied to the lower surface of the rotating substrate by the processing liquid supply unit, and the supplied processing is performed. There is provided a liquid processing apparatus having a control unit for processing the lower surface of the substrate with the liquid.

  According to the present invention, when the processing liquid is supplied to the lower surface of the substrate and the lower surface of the substrate is processed by the supplied processing liquid, the unprocessed portion of the substrate due to the substrate being supported by the support portion is eliminated. And generation of mist of the processing liquid can be prevented.

It is a top view which shows schematic structure of the liquid processing system which concerns on embodiment. It is a schematic sectional drawing which shows the structure of the liquid processing unit which concerns on embodiment. It is a perspective view of the rotation cup of the liquid processing unit which concerns on embodiment. It is a perspective view containing the partial cross section which expands and shows the periphery of the support pin of an enclosure member. It is a graph which shows the rotation speed of the enclosure member in each process of the liquid processing method which concerns on embodiment. It is a graph which shows the rotation speed of the enclosure member in each process of the liquid processing method which concerns on the 1st modification of embodiment. It is a graph which shows the rotation speed of the enclosure member in each process of the liquid processing method which concerns on the 2nd modification of embodiment. It is a graph which shows the rotation speed of the enclosure member 70 in each process of the liquid processing method which concerns on the 3rd modification of embodiment.

Next, a mode for carrying out the present invention will be described with reference to the drawings. Here, the case where the present invention is applied to a liquid processing apparatus for performing back surface cleaning of a semiconductor wafer (hereinafter simply referred to as “wafer”) will be described.
(Embodiment)
First, a schematic configuration of a liquid processing system including a liquid processing unit according to an embodiment will be described with reference to FIG.

  The liquid processing unit corresponds to the liquid processing apparatus in the present invention.

  FIG. 1 is a plan view showing a schematic configuration of a liquid processing system 10 according to an embodiment of the present invention.

  In this liquid processing system 10, a wafer carrier C that houses a plurality of wafers W is placed, and a loading / unloading station (substrate loading / unloading unit) 1 for loading / unloading the wafers W and a cleaning process for the wafers W are performed. The processing station (liquid processing unit) 2 is provided. A loading / unloading station (substrate loading / unloading section) 1 and a processing station (liquid processing section) 2 are provided adjacent to each other.

  The carry-in / out station 1 includes a carrier placement unit 11, a transport unit 12, a delivery unit 13, and a housing 14. The carrier mounting unit 11 mounts a wafer carrier C that stores a plurality of wafers W in a horizontal state. The transfer unit 12 transfers the wafer W. The delivery unit 13 delivers the wafer W. The housing 14 accommodates the transport unit 12 and the transfer unit 13.

  The carrier mounting unit 11 can mount four wafer carriers C. The mounted wafer carrier C is brought into close contact with the casing 14, and the wafer W therein can be carried into the transfer unit 12 without being exposed to the atmosphere.

  The housing 14 includes a partition member 14 a that partitions the transport unit 12 and the transfer unit 13 vertically. The transport unit 12 has a transport mechanism 15. The transfer mechanism 15 includes a wafer holding arm 15a that holds the wafer W and a mechanism that moves the wafer holding arm 15a back and forth. The transport mechanism 15 has a mechanism for moving along the horizontal guide 17 extending in the X direction, which is the arrangement direction of the wafer carriers C, a mechanism for moving along the vertical direction, and a mechanism for rotating within the horizontal plane. . The wafer W is transferred between the wafer carrier C and the delivery unit 13 by the transfer mechanism 15.

  The delivery unit 13 includes a delivery stage 19 and a delivery shelf 20 including a plurality of placement units on which wafers W provided thereon can be placed. The delivery unit 13 delivers the wafer W to and from the processing station 2 via the delivery shelf 20.

  The processing station 2 has a casing 21 having a rectangular parallelepiped shape. The processing station 2 includes a transfer chamber 21a that forms a transfer path extending in the Y direction perpendicular to the X direction, which is the arrangement direction of the wafer carriers C, in the upper portion of the casing 21, and both sides of the transfer chamber 21a. Have two unit chambers 21b and 21c. In the unit chambers 21b and 21c, a total of twelve liquid processing units 22 are arranged horizontally along the transfer chamber 21a.

  A transfer mechanism 24 is provided inside the transfer chamber 21a. The transport mechanism 24 includes a wafer holding arm 24a that holds the wafer W and a mechanism that moves the wafer holding arm 24a back and forth. The transport mechanism 24 has a mechanism that moves in the Y direction along the horizontal guide 25 provided in the transport chamber 21a, a mechanism that moves along the vertical direction, and a mechanism that rotates in the horizontal plane. The transport mechanism 24 carries the wafer W in and out of each liquid processing unit 22.

  Next, with reference to FIG. 2 to FIG. 4, a liquid processing apparatus that is the liquid processing unit 22 mounted in the liquid processing system 10 according to the present embodiment will be described. FIG. 2 is a schematic cross-sectional view showing the configuration of the liquid processing unit 22 according to the present embodiment. FIG. 3 is a perspective view of the rotating cup 71 of the liquid processing unit 22 according to the present embodiment. FIG. 4 is a perspective view including a partial cross-section showing the periphery of the support pin 72 of the surrounding member 70 in an enlarged manner.

  As shown in FIG. 2, the liquid processing unit 22 includes a rotating plate 60, an enclosure member 70, a rotating cup 71, a rotation driving unit 80, a substrate lifting / lowering member 90, a processing liquid supply mechanism 93, and an exhaust / drainage unit (cup) 100. , A top plate 110, a lifting mechanism 120, and an inert gas supply mechanism 123.

  The rotation drive unit 80 corresponds to the rotation unit in the present invention. The processing liquid supply mechanism 93 corresponds to the processing liquid supply unit in the present invention.

  As shown in FIGS. 2 and 3, the rotating plate 60 includes a base plate 61 and a rotating shaft 62. The base plate 61 is provided horizontally and has a circular hole 61a in the center. The rotating shaft 62 is provided so as to extend downward from the base plate 61, and has a cylindrical shape with a hole 62a provided at the center.

  As shown in FIGS. 2 to 4, the enclosing member 70 is provided outside the periphery of the wafer W so as to surround the periphery of the wafer W over the entire periphery. Further, the surrounding member 70 is rotatably provided and supports the wafer W from below. As shown in FIG. 2, the surrounding member 70 guides the processing liquid that has processed the wafer W to the draining cup 101. Further, the surrounding member 70 has a support pin 72. The support pin 72 is provided so as to protrude inward from the lower end of the surrounding member 70. The support pins 72 are for mounting the peripheral edge of the wafer W. The support pins 72 support the peripheral edge of the wafer W from below by placing the peripheral edge of the wafer W on the support pins 72. As shown in FIG. 3, a plurality of support pins 72 are provided at substantially equal intervals along the circumferential direction of the wafer W.

  The enclosure member 70 and the support pin 72 correspond to a support portion in the present invention.

  The rotating cup 71 is for preventing the processing liquid supplied to the lower surface side of the wafer W and splashing from the rotating wafer W to the outer peripheral side from being bounced back to the wafer W again. Further, the processing liquid that scatters from the rotating wafer W to the outer peripheral side does not enter the upper surface side of the wafer W.

  As shown in FIG. 4, the base plate 61, the enclosure member 70, and the rotary cup 71 are fastened by fitting a fastening member 74 into a hole 73 formed so as to penetrate each of them. Thereby, the base plate 61, the surrounding member 70, and the rotation cup 71 are rotatably provided as a unit.

  The rotation drive unit 80 includes a pulley 81, a drive belt 82, and a motor 83. The pulley 81 is disposed outside the peripheral edge on the lower side of the rotation shaft 62. The drive belt 82 is wound around the pulley 81. The motor 83 is connected to the drive belt 82, and rotates the rotary shaft 62 via the pulley 81 by transmitting a rotational driving force to the drive belt 82. That is, the rotation drive unit 80 rotates the base plate 61, the enclosure member 70, and the rotation cup 71 by rotating the rotation shaft 62. A bearing 63 is disposed on the outer periphery of the rotating shaft 62.

  The substrate elevating member 90 is provided in a hole 61 a of the base plate 61 and a hole 62 a of the rotating shaft 62 so as to be able to move up and down, and includes a lift pin plate 91 and a lift shaft 92. The lift pin plate 91 has a plurality of, for example, three lift pins 91a on the periphery. The lift shaft 92 extends downward from the lift pin plate 91. A processing liquid supply pipe 94 is provided at the center of the lift pin plate 91 and the lift shaft 92. A cylinder mechanism 92a is connected to the lower end of the lift shaft 92, and the wafer elevating member 90 is moved up and down by the cylinder mechanism 92a, so that the wafer W is loaded and unloaded.

  The processing liquid supply mechanism 93 has a processing liquid supply pipe 94. As described above, the processing liquid supply pipe 94 is provided in the lift pin plate 91 and the lift shaft 92 (in the hollow space) so as to extend in the vertical direction. The processing liquid supply pipe 94 guides the processing liquid supplied from each pipe of the processing liquid pipe group 97 to the lower surface side of the wafer W. That is, the processing liquid supply mechanism 93 supplies the processing liquid to the lower surface of the wafer W. The processing liquid supply pipe 94 communicates with a processing liquid supply port 94 a formed on the upper surface of the lift pin plate 91.

  The exhaust / drainage unit (cup) 100 includes a drainage cup 101, a drainage pipe 102, an exhaust cup 103, and an exhaust pipe 104. The exhaust / drainage part (cup) 100 has an opening 105 on the upper surface. The exhaust / drainage part (cup) 100 is mainly for recovering the gas and liquid discharged from the space surrounded by the rotary plate 60 and the rotary cup 71.

  The drainage cup 101 receives the processing liquid guided by the rotating cup 71. The drainage pipe 102 is connected to the outermost part of the bottom of the drainage cup 101 and discharges the processing liquid received by the drainage cup 101 through any pipe of a drainage pipe group (not shown). The exhaust cup 103 is provided outside or below the drain cup 101 so as to communicate with the drain cup 101. FIG. 2 shows an example in which the exhaust cup 103 is provided so as to communicate with the drain cup 101 at the inner periphery and below the drain cup 101. The exhaust pipe 104 is connected to the outermost part of the bottom of the exhaust cup 103, and exhausts a gas such as nitrogen gas in the exhaust cup 103 through any pipe of an exhaust pipe group (not shown).

  The top plate 110 can be moved up and down, and is provided so as to block the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 in the lowered state. The top plate 110 is provided so as to cover the wafer W supported by the support pins 72 from above when the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100 is closed.

  The top plate 110 has a gap forming member 113 provided so as to protrude downward from the lower surface 112 of the top plate 110 in a region 111 facing the peripheral edge of the wafer W supported by the support pins 72 of the enclosure member 70. The gap forming member 113 forms a gap D1 with the peripheral edge of the wafer W.

  When the gap forming member 113 is formed on the top plate 110, the gap D1 between the peripheral edge of the wafer W supported by the support pins 72 of the surrounding member 70 and the top plate 110 is the center of the wafer W and the top plate. It becomes smaller than the distance D0 with 110.

  The elevating mechanism 120 includes an arm 121 and an elevating drive unit 122. The raising / lowering drive part 122 is provided outside the exhaust / drainage part (cup) 100 and can move up and down. The arm 121 is provided so as to connect the top plate 110 and the elevation drive unit 122. That is, the elevating mechanism 120 moves the top plate 110 up and down by the elevating drive unit 122 via the arm 121.

  The inert gas supply mechanism 123 includes an inert gas supply pipe 124 and an inert gas supply source 125. The inert gas supply mechanism 123 is for supplying an inert gas such as nitrogen gas or argon gas to the upper surface side of the wafer W. The inert gas supply pipe 124 is provided so as to extend inside the top plate 110 and the arm 121. One end of the inert gas supply pipe 124 is connected to an inert gas supply source 125 that supplies an inert gas. The inert gas supply pipe 124 forms an inert gas supply port 124 a at the center of the lower surface 112 of the top plate 110.

  As shown in FIG. 2, the arm 121 may be connected at substantially the center of the upper surface of the top plate 110. As a result, the inert gas supply port 124a is formed at the center of the lower surface 112 of the top plate 110, so that the inert gas can be supplied downward from the center of the top plate 110 and supplied to the wafer W. The flow rate of the inert gas can be made uniform along the circumferential direction.

  Moreover, the liquid processing system 10 has the control part 200, as shown in FIG. The control unit 200 includes a process controller 201 composed of a microprocessor (computer), and each component of the liquid processing system 10 is connected to the process controller 201 to be controlled. In addition, the process controller 201 visualizes the operation status of each component of the liquid processing system 10 and a keyboard on which a process manager inputs commands to manage each component of the liquid processing system 10. A user interface 202 including a display for displaying is connected. Further, the process controller 201 has a control program for realizing various processes executed by the liquid processing system 10 under the control of the process controller 201 and predetermined components in the liquid processing system 10 according to processing conditions. A storage unit 203 in which a control program for executing processing, that is, a recipe is stored, is connected. The recipe is stored in a storage medium (recording medium) in the storage unit 203. The storage medium (recording medium) may be a hard disk or a semiconductor memory. Moreover, you may make it transmit a recipe suitably from another apparatus via a dedicated line, for example.

  Then, if necessary, an arbitrary recipe is called from the storage unit 203 by an instruction from the user interface 202 and is executed by the process controller 201, so that a desired process in the liquid processing system 10 can be performed under the control of the process controller 201. Is performed.

  Next, with reference to FIG. 5, the liquid processing method performed using the liquid processing unit 22 by the control unit 200 and the operation thereof will be described. FIG. 5 is a graph showing the number of rotations of the enclosure member 70 in each step of the liquid processing method according to the present embodiment.

  As shown in FIG. 5, the liquid processing method according to the present embodiment includes a first processing step (step S11), a removal step (step S12), a deceleration step (step S13), a position changing step (step S14), It has a 2nd process process (step S15) and a rotation stop process (step S16).

  Before performing the first processing step (step S11), first, one wafer W is removed from the wafer carrier C mounted on the carrier mounting portion 11 of the loading / unloading station 1 by the wafer holding arm 15a of the transport mechanism 15. It is taken out and placed on the placement section of the delivery shelf 20 on the delivery stage 19. This operation is continuously performed. The wafers W placed on the placement unit of the delivery shelf 20 are sequentially carried by the wafer holding arm 24a of the carrying mechanism 24 of the processing station 2 and are carried into one of the liquid processing units 22.

  When the wafer W is carried into the liquid processing unit 22, the top plate 110 is raised by the elevating mechanism 120. Then, the wafer W carried into the liquid processing unit 22 is placed on the lift pins 91a of the lift pin plate 91 positioned at the delivery position (upper position) by the cylinder mechanism 92a.

  Next, the lift pin plate 91 is moved downward by the cylinder mechanism 92a and positioned at the wafer processing position. While the lift pin plate 91 is moved downward, the lower surface of the wafer W is supported by the support pins 72 provided on the enclosure member 70. That is, the wafer W is transferred from the lift pins 91a to the support pins 72. The support pins 72 support the wafer W from below.

  Thereafter, the top plate 110 is lowered by the elevating mechanism 120 so as to block the opening 105 provided on the upper surface of the exhaust / drainage part (cup) 100.

  Next, a 1st process process (step S11) is performed. In the first processing step (step S11), the rotational speed for rotating the enclosure member 70 is accelerated to the first rotational speed V1 with the first rotational acceleration A1. Then, the wafer W is rotated at the first rotation speed V1 together with the enclosure member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 does not change, and the processing liquid is applied to the lower surface of the rotating wafer W. Supply. Then, the lower surface of the wafer W is processed with the supplied processing liquid.

  When the rotation shaft 62 is driven to rotate by the rotation driving unit 80, the base plate 61, the enclosure member 70, and the rotation cup 71 rotate. Specifically, the rotating shaft 62 is rotationally driven by applying a driving force from the motor 83 to the pulley 81 via the driving belt 82. As a result, the wafer W supported by the support pins 72 provided on the enclosure member 70 rotates.

  The rotational acceleration when the wafer W slides in the circumferential direction with respect to the support pins 72 of the enclosure member 70, that is, when the wafer W starts to rotate relative to the support pins 72, is defined as a rotational acceleration A0. In the first processing step (step S11), the wafer W is not slid in the circumferential direction with respect to the support pins 72 of the enclosure member 70, that is, the relative angular position of the enclosure member 70 with respect to the support pins 72 is not changed. Then, the process is performed while rotating together with the surrounding member 70. Therefore, the first rotational acceleration A1 is smaller than the rotational acceleration A0.

  By adjusting the material and shape of the support pins 72 of the enclosing member 70, the value of the rotational acceleration A0 can be freely adjusted, and the rotational acceleration A0 can be set to 400 rpm / s, for example. The first rotational acceleration A1 can be set to, for example, 300 rpm / s. Further, the first rotation speed V1 can be set to 1000 rpm, for example.

  In the present embodiment and the following modifications, the rotational acceleration means an absolute value while ignoring the sign of the sign. That is, for example, the first rotational acceleration A1 being equal to or greater than the rotational acceleration A0 means that the absolute value of the first rotational acceleration A1 is equal to or greater than the absolute value of the rotational acceleration A0.

  At this time, the processing liquid is supplied to the lower surface of the wafer W through the processing liquid supply pipe 94 of the processing liquid supply mechanism 93. Then, as shown in FIG. 2, the processing liquid supplied to the lower surface of the wafer W is moved outward from the peripheral edge by a centrifugal force generated by the rotation of the wafer W. As the treatment liquid at this time, for example, either or both of ammonia-hydrogen peroxide SC1 and dilute hydrofluoric acid (DHF) are used.

  As shown in FIG. 2, an inert gas such as nitrogen gas is supplied to the upper surface of the wafer W from an inert gas supply port 124 a provided at the center of the lower surface 112 of the top plate 110. The supplied inert gas passes through the upper surface of the wafer W, then passes through the gap D1 between the wafer W and the gap forming member 113 of the top plate 110, and from the upper side of the surrounding member 70 to the outer peripheral edge and further downward. And flows from the exhaust cup 103 of the exhaust / drainage part (cup) 100 to the exhaust pipe 104. Due to the flow of the inert gas, the processing liquid that has reached the peripheral edge of the wafer W wraps around the upper surface of the wafer W from between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotating cup 71. Can be prevented.

  In the present embodiment, the gap forming member 113 is provided so that the gap D1 between the gap forming member 113 and the peripheral edge of the wafer W is constant along the circumferential direction of the wafer W. Therefore, the flow of the inert gas flowing on the upper surface side of the wafer W can be made uniform along the circumferential direction of the wafer W. Therefore, the processing liquid that has reached the lower surface of the peripheral edge of the wafer W more reliably flows around between the wafer W and the enclosure member 70 or between the enclosure member 70 and the rotary cup 71 toward the upper surface side of the wafer W. Can be prevented.

  Next, a removal process (step S12) is performed. In the removing step (step S12), the wafer W is rotated together with the enclosure member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 is not changed in a state where supply of the treatment liquid is stopped, The processing liquid is removed from the lower surface of the wafer W by shaking and drying.

  Note that in this embodiment, an example in which the removing process is performed after the first processing process and before the position changing process will be described. However, as will be described later in the second modification of the embodiment, the removing step is after the first processing step, after the position changing step, and before the second processing step. You may do it. Therefore, the removing step may be performed between the first processing step and the second processing step.

  The supply of the processing liquid supplied via the processing liquid supply pipe 94 of the processing liquid supply mechanism 93 is stopped. Further, when the rotation shaft 62 is continuously driven to rotate by the rotation drive unit 80, the base plate 61, the enclosure member 70, and the rotation cup 71 are rotated. Then, since the processing liquid remaining on the lower surface of the wafer W is moved outward by the centrifugal force generated by the rotation of the wafer W, it is shaken off and dried.

  Moreover, the rotation speed in the removal process (step S12) is not limited as long as it is a rotation speed necessary to shake off and dry the processing liquid. For example, the same first rotation as in the first processing process (step S11). It can be several V1.

  Next, a deceleration process (step S13) is performed. In the deceleration step (step S13), the number of rotations for rotating the enclosure member 70 is decelerated at the first rotational acceleration A1.

  In the deceleration process (step S13), in order to perform the position changing process (step S14) and the second processing process (step S15) thereafter, the number of rotations for rotating the enclosure member 70 is once decelerated. Even in the deceleration process (step S13), the wafer W is not slid in the circumferential direction with respect to the support pins 72 of the enclosure member 70, that is, the relative angular position of the enclosure member 70 with respect to the support pins 72 is not changed. The process is performed while rotating together with the member 70. Therefore, the rotational acceleration when decelerating in the deceleration step (step S13) can be set to, for example, the first rotational acceleration A1 that is smaller than the rotational acceleration A0. Further, the rotational acceleration at the time of deceleration in the deceleration step (step S13) only needs to be smaller than the rotational acceleration A0, and may be a value different from the first rotational acceleration A1. Furthermore, the rotation speed of the surrounding member 70 may be reduced to 0 rpm to stop the rotation, or may only be reduced to a finite low rotation speed without stopping the rotation.

  Next, a position change process (step S14) is performed. In the position changing step (step S14), the second rotation necessary to slide the wafer W in the circumferential direction with respect to the surrounding member 70, that is, to rotate it relative to the surrounding member 70 by changing the number of rotations that rotate the surrounding member 70. By accelerating at the acceleration A2, the relative angular position is changed.

  The second rotational acceleration A2 corresponds to the predetermined rotational acceleration in the present invention. Further, changing the number of rotations that rotate the surrounding member 70 means changing the number of rotations of the rotation driving unit 80 that rotates the surrounding member 70.

  In the position changing step (step S14), the rotational speed of the surrounding member 70 is the rotational speed at which the second processing step (step S15) is performed at the second rotational acceleration A2 equal to or higher than the rotational acceleration A0 described above. Accelerate to a rotational speed 2 of 2. Since the second rotational acceleration A2 is equal to or higher than the rotational acceleration A0, the wafer W starts to slide with respect to the support pins 72 of the enclosure member 70, that is, starts to rotate relative to each other. Specifically, the relative angular position of the wafer W with respect to the surrounding member 70 starts to slide so as to deviate in the direction opposite to the rotation direction. Then, since the relative angular position of the wafer W with respect to the support pins 72 is in contact with the support pins 72 in the first processing step (step S <b> 11), an unprocessed portion that is not in contact with the processing liquid is separated from the support pins 72. It is shifted to the relative angular position where it does not contact.

  When the wafer W slides on the support pins 72 in the position changing step (step S14), that is, when the wafer W is relatively rotated, if the processing liquid remains on the wafer W, the remaining processing liquid is transferred to the support pins 72 and the wafer W. Mist is easily generated by sliding between the two. Further, when the wafer W slides on the support pins 72, that is, relatively rotates, the mist generated on the lower surface side of the wafer W easily goes around the upper surface side of the wafer W.

  However, in the present embodiment, the position changing step (step S14) is performed after removing the processing liquid from the lower surface of the wafer W by performing the removing step (step S12). Therefore, when the wafer W slides on the support pins 72, generation of mist of the processing liquid can be prevented.

  As described above, when the rotational acceleration A0 is set to 400 rpm / s, for example, the second rotational acceleration A2 can be set to 400 rpm / s, for example. When the second rotational acceleration A2 is set to 400 rpm / s, the relative angular position shift can be set to 5 °, for example. The angular width in the circumferential direction of one support pin 72 can be set to 1 °, for example. Accordingly, when the relative angular position shift is 5 °, the relative angle at which the unprocessed portion of the wafer W in the first processing step (step S11) does not contact the support pins 72 by the position changing step (step S11). The wafer W can be slid to the position, that is, can be relatively rotated. Further, the second rotational speed V2 can be set to 1000 rpm, which is the same as the first rotational speed V1, for example.

  Next, a second processing step (Step S15) is performed. In the second processing step (step S15), processing is performed on the lower surface of the wafer W that rotates at the second rotation speed V2 together with the surrounding member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the surrounding member 70 does not change. Supply liquid.

  Similar to the first processing step (step S <b> 11), when the rotation shaft 62 is rotationally driven by the rotation driving unit 80, the enclosure member 70 that supports the wafer W from below is rotated and provided on the enclosure member 70. The wafer W supported by the support pins 72 rotates so that the relative angular position of the wafer W with respect to the support pins 72 does not change. Similarly to the first processing step (step S11), the processing liquid is supplied to the lower surface of the wafer W via the processing liquid supply pipe 94. Similarly to the first processing step (step S11), an inert gas such as nitrogen gas is supplied to the upper surface of the wafer W from an inert gas supply port 124a provided at the center of the lower surface 112 of the top plate 110. Supplied. Similarly to the first processing step (step S <b> 11), the processing liquid that has reached the lower surface of the peripheral edge of the wafer W is rotated between the wafer W and the surrounding member 70 or rotated with the surrounding member 70 by the gap forming member 113. It is possible to more reliably prevent the wafer W from going around to the upper surface side of the wafer W.

  On the other hand, in the second processing step (step S15), an unprocessed portion that has not been in contact with the processing liquid because it was in contact with the support pin 72 in the first processing step (step S11) is in contact with the support pin 72. It is shifted to the relative angle position where it disappears. Then, the untreated portion is treated with the treatment liquid in order to come into contact with the treatment liquid in the second treatment step (step S15). Therefore, an unprocessed portion of the wafer W caused by the support pins 72 can be eliminated.

  Next, a rotation stop process (step S16) is performed. In the rotation stopping step (step S16), the rotation of the surrounding member 70 is stopped.

  By stopping the rotation drive of the rotation shaft 62 by the rotation drive unit 80, the rotation of the enclosing member 70 is stopped and the rotation of the wafer W is stopped. Further, the supply of the processing liquid to the wafer W via the processing liquid supply pipe 94 of the processing liquid supply mechanism 93 is also stopped.

  As in the first processing step (step S11), the enclosing member is removed after the second processing step (step S15) and before the rotation stopping step (step S16) as in the removing step (step S12). The process of removing the processing liquid from the lower surface of the wafer W may be performed by rotating the wafer W together with 70 and shaking off the processing liquid and drying.

  Next, pure water is supplied to the wafer W from a pure water pipe (not shown) through the processing liquid supply pipe 94 of the processing liquid supply mechanism 93 to perform pure water rinsing.

  Note that pure water rinsing may be continuously performed while the wafer W is rotated without performing the rotation stopping step (step S16).

  Next, the rotating shaft 62 is rotated at a high speed by the rotation driving unit 80. As a result, the wafer W on the support pins 72 is rotated at high speed, and the processing liquid is shaken off and dried. Thereafter, the motor 83 of the rotation driving unit 80 is stopped, and the rotation of the wafer W on the support pins 72 is also stopped.

  Next, the elevating mechanism 120 positions the top plate 110 at a position above the wafer W delivery position. Thereafter, the lift pin plate 91 is moved to the upper position by the cylinder mechanism 92a, and the wafer W is raised to the delivery position (upper position).

  Next, the wafer W is unloaded from the lift pin plate 91 by the wafer holding arm 24 a of the transfer mechanism 24. In this way, processing of one wafer W is completed.

  The wafer W unloaded in this manner is unloaded from the liquid processing unit 22 by the wafer holding arm 24a of the transfer mechanism 24, placed on the transfer shelf 20 of the transfer stage 19, and held by the transfer mechanism 15 from the transfer shelf 20. It is returned to the wafer carrier C by the arm 15a.

  In the present embodiment, the example in which the treatment liquid is shaken and dried in the removing step (step S12) has been described. However, without being limited thereto, for example, the processing liquid supplied to the lower surface of the wafer W may be removed by supplying a dry gas from the lower surface side of the wafer W without rotating the wafer W.

Further, in the present embodiment, the example in which the wafer W is supported by placing the peripheral portion of the wafer W on the support pins 72 provided in the enclosure member 70 has been described. However, the present invention is not limited to this, and for example, the lower surface of an arbitrary portion on the center side of the peripheral portion of the wafer W is placed on the support pins 72 provided so as to protrude inward from the lower end of the surrounding member 70. Thus, the wafer W may be supported.
(First Modification of Embodiment)
Next, a liquid processing method according to a first modification of the embodiment of the present invention will be described with reference to FIG. FIG. 6 is a graph showing the number of rotations of the enclosure member 70 in each step of the liquid processing method according to this modification.

  The liquid processing method according to the present modification is different from the liquid processing method according to the embodiment in that the relative angular position of the wafer W with respect to the surrounding member 70 of the wafer W is changed when decelerating after the first processing step. Is different.

  Also in this modification, the liquid processing system 10 according to the embodiment described with reference to FIG. 1 can be used. Also in this modification, the liquid processing unit 22 according to the embodiment described with reference to FIGS. 2 to 4 can be used.

  Moreover, as shown in FIG. 6, the liquid processing method according to the present modification includes a first processing step (Step S21), a removal step (Step S22), a position changing step (Step S23), and a second processing step ( Step S24) and a rotation stopping step (Step S25).

  The first processing step (step S21) and the removal step (step S22) are the same as the first processing step (step S11) and the removal step (step S12) in the embodiment, respectively.

  On the other hand, in this modified example, the position changing step (step S23) is performed after the removing step (step S22). In the position changing step (step S23), the enclosure member 70 is rotated at the second rotational acceleration A2 necessary for sliding the wafer W in the circumferential direction with respect to the support pins 72 of the enclosure member 70, that is, relative rotation. Reduce the speed. Then, the wafer W starts to slide with respect to the support pins 72 of the enclosing member 70. Specifically, the wafer W starts to slide, that is, relatively rotates so that the relative angular position of the wafer W with respect to the surrounding member 70 is shifted in the same direction as the rotation direction. Then, since the relative angular position of the wafer W with respect to the support pins 72 is in contact with the support pins 72 in the first processing step (step S21), an unprocessed portion that is not in contact with the processing liquid is separated from the support pins 72. It is shifted to the relative angular position where it does not contact.

  The second rotational acceleration A2 corresponds to the predetermined rotational acceleration in the present invention.

  When the wafer W slides on the support pins 72 in the position changing step (step S23), that is, when the wafer W is relatively rotated, if the processing liquid remains on the wafer W, the remaining processing liquid is transferred to the support pins 72 and the wafer W. Mist is easily generated by sliding between the two. Further, when the wafer W slides on the support pins 72, that is, relatively rotates, the mist generated on the lower surface side of the wafer W easily goes around the upper surface side of the wafer W. However, in this modification, the position changing step (step S23) is performed after the processing liquid is removed from the lower surface of the wafer W by performing the removing step (step S22). Therefore, when the wafer W slides on the support pins 72, that is, relatively rotates, it is possible to prevent generation of mist of the processing liquid.

  Also in the present modification, as in the embodiment, the second rotational acceleration A2 can be set to 400 rpm / s, for example, and the relative angular position shift can be set to 5 °, for example. The rotation speed of the surrounding member 70 may be reduced to 0 rpm to stop the rotation, or may only be reduced to a finite low rotation speed without stopping the rotation.

  Next, a second processing step (step S24) is performed. In the second processing step (step S24), the rotational speed for rotating the enclosure member 70 is accelerated to the second rotational speed V2 with the first rotational acceleration A1. Then, the wafer W is rotated at the second rotational speed V2 together with the enclosure member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 does not change, and the processing liquid is applied to the lower surface of the rotating wafer W. Supply.

  When accelerating the wafer W in the second processing step (step S24), the process is performed so that the wafer W is not slid in the circumferential direction with respect to the support pins 72 of the surrounding member 70, that is, is not relatively rotated. Therefore, the rotational acceleration when accelerating in the second processing step (step S24) is a rotational acceleration necessary for sliding the wafer W in the circumferential direction with respect to the support pins 72 of the surrounding member 70, that is, relative rotation. Yes, for example, the first rotational acceleration A1 is smaller than the rotational acceleration A0 described in the embodiment. Further, the rotational acceleration at the time of acceleration in the second processing step (step S24) only needs to be smaller than the rotational acceleration A0, and may be a value different from the first rotational acceleration A1.

  When supplying the processing liquid to the lower surface of the wafer W rotating at the second rotation speed V2 together with the surrounding member 70 in the second processing step (step S24), the second processing step in the embodiment (step S15). ).

  Next, a rotation stop process (step S25) is performed. The rotation stop process (step S25) is the same as the rotation stop process (step S16) in the embodiment.

  Also in this modified example, in the second processing step (step S24), the unprocessed portion that was not in contact with the processing liquid because it was in contact with the support pin 72 in the first processing step (step S21) is the support pin 72. It is shifted to the relative angular position where it does not come into contact. Therefore, an unprocessed portion of the wafer W caused by the support pins 72 can be eliminated.

Also in this modified example, the lower surface of an arbitrary portion on the center side of the peripheral portion of the wafer W is placed on the support pins 72 provided so as to protrude inward from the lower end of the enclosing member 70, so that the wafer W is mounted. It may be supported.
(Second modification of the embodiment)
Next, a liquid processing method according to a second modification of the embodiment of the present invention will be described with reference to FIG. FIG. 7 is a graph showing the number of rotations of the enclosure member 70 in each step of the liquid processing method according to this modification.

  The liquid treatment method according to this modification is different from the liquid treatment method according to the embodiment in that the position changing step is performed before the removal step is completed.

  Also in this modification, the liquid processing system 10 according to the embodiment described with reference to FIG. 1 can be used. Also in this modification, the liquid processing unit 22 according to the embodiment described with reference to FIGS. 2 to 4 can be used.

  Moreover, as shown in FIG. 7, the liquid processing method according to the present modification includes a first processing step (step S31), a position changing step (step S32), a removing step (step S33), and a second processing step ( Step S34) and a rotation stopping step (Step S35).

  The first processing step (step S31) is the same as the first processing step (step S11) in the embodiment.

  On the other hand, in the present modification, after the first processing step (step S31), the position changing step (step S32) is performed in a state where supply of the processing liquid is stopped. In the position changing step (step S32), the enclosure member 70 is rotated at the second rotational acceleration A2 necessary for sliding the wafer W in the circumferential direction with respect to the support pins 72 of the enclosure member 70, that is, relative rotation. The rotational speed is accelerated to a predetermined swing-off rotational speed VR. Then, the wafer W starts to slide with respect to the support pins 72 of the enclosing member 70, that is, starts to rotate relative to each other. Specifically, the relative angular position of the wafer W with respect to the surrounding member 70 starts to slide so as to deviate in the direction opposite to the rotation direction. Then, since the relative angular position of the wafer W with respect to the support pins 72 is in contact with the support pins 72 in the first processing step (step S31), the unprocessed portion that is not in contact with the processing liquid is separated from the support pins 72. It is shifted to the relative angular position where it does not contact.

  The second rotational acceleration A2 corresponds to the predetermined rotational acceleration in the present invention.

  Subsequently, a removal process (step S33) is performed. In the removal step (step S33), the wafer W is rotated together with the enclosure member 70 at a predetermined rotation speed VR so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 is not changed, and the processing liquid is shaken and dried. By doing so, the processing liquid is removed from the lower surface of the wafer W.

  In the present modification, the position changing step (step S32) and the removing step (step S33) are continuously performed while rotating the wafer W while the supply of the processing liquid is stopped. Then, at the same time as the position changing step (step S32) is started, the treatment liquid is shaken and dried from the wafer W. Therefore, after the first processing step (step S31), the removal step (step S33) is started, and when the removal step (step S33) is started, the position changing step (step S32) is performed together with the removal step (step S33). ) Can be considered.

  When the wafer W slides on the support pins 72 in the position changing step (step S32), that is, when the wafer W relatively rotates, if the processing liquid remains on the wafer W, the remaining processing liquid is transferred to the support pins 72 and the wafer W. Mist is easily generated by sliding between the two. Further, when the wafer W slides on the support pins 72, that is, relatively rotates, the mist generated on the lower surface side of the wafer W easily goes around the upper surface side of the wafer W. However, in this modification, the removal of the processing liquid from the lower surface of the wafer W is started by starting the removal process (step S33), and the position changing process (step S32) is performed when the removal of the processing liquid is started. . Therefore, as compared with the conventional liquid processing method, when the wafer W slides on the support pins 72, that is, when the wafer W relatively rotates, the generation of mist of the processing liquid can be prevented.

  Next, a second processing step (step S34) is performed. In the second processing step (step S34), the rotational speed at which the surrounding member 70 is rotated is decelerated to the second rotational speed V2 with the first rotational acceleration A1. Then, the wafer W is rotated at the second rotational speed V2 together with the enclosure member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 does not change, and the processing liquid is applied to the lower surface of the rotating wafer W. Supply.

  When the wafer W is decelerated in the second processing step (step S34), the process is performed so that the wafer W is not slid in the circumferential direction with respect to the support pins 72 of the surrounding member 70, that is, is not relatively rotated. Therefore, the rotational acceleration when decelerating in the second processing step (step S34) is a rotational acceleration necessary for sliding the wafer W in the circumferential direction with respect to the support pins 72 of the surrounding member 70, that is, for relative rotation. Yes, for example, the first rotational acceleration A1 is smaller than the rotational acceleration A0 described in the embodiment. Further, the rotational acceleration when decelerating in the second processing step (step S34) only needs to be smaller than the rotational acceleration A0, and may be a value different from the first rotational acceleration A1.

  When the processing liquid is supplied to the lower surface of the wafer W that rotates at the second rotation speed V2 together with the surrounding member 70 in the second processing step (step S34), the second processing step in the embodiment (step S15). ).

  In this modification, the example in which the swing-off rotation speed VR is larger than the first rotation speed V1 has been described. However, without being limited to this, for example, the swing-off rotation speed VR may be smaller than the first rotation speed V1. At this time, in the position changing step (step S32), the rotational speed at which the surrounding member 70 is rotated is decelerated to a predetermined swing-off rotational speed VR at a second rotational acceleration A2 that is greater than or equal to the rotational acceleration A0. Then, in the second processing step (step S34), the rotation speed for rotating the enclosure member 70 is accelerated to the second rotation speed V2 with the first rotation acceleration A1. Then, the wafer W is rotated at the second rotational speed V2 together with the enclosure member 70 so that the relative angular position of the wafer W with respect to the support pins 72 of the enclosure member 70 does not change, and the processing liquid is applied to the lower surface of the rotating wafer W. Supply.

  Next, a rotation stop process (step S35) is performed. The rotation stopping step (step S35) is the same as the rotation stopping step (step S16) in the embodiment.

  Also in this modified example, in the second processing step (step S34), the unprocessed portion that was not in contact with the processing liquid because it was in contact with the support pin 72 in the first processing step (step S31) is the support pin 72. It is shifted to the relative angular position where it does not come into contact. Therefore, an unprocessed portion of the wafer W caused by the support pins 72 can be eliminated.

Also in this modified example, the lower surface of an arbitrary portion on the center side of the peripheral portion of the wafer W is placed on the support pins 72 provided so as to protrude inward from the lower end of the enclosing member 70, so that the wafer W is mounted. It may be supported.
(Third Modification of Embodiment)
Next, a liquid processing method according to a third modification of the embodiment of the present invention will be described with reference to FIG. FIG. 8 is a graph showing the number of rotations of the enclosure member 70 in each step of the liquid processing method according to this modification.

  The liquid treatment method according to this modification is different from the liquid treatment method according to the embodiment in that the removal process is not performed.

  Also in this modification, the liquid processing system 10 according to the embodiment described with reference to FIG. 1 can be used. Also in this modification, the liquid processing unit 22 according to the embodiment described with reference to FIGS. 2 to 4 can be used.

  Moreover, as shown in FIG. 8, the liquid processing method according to this modification includes a first processing step (step S41), a deceleration step (step S42), a position changing step (step S43), and a second processing step ( Step S44) and a rotation stopping step (Step S45).

  The first processing step (step S41) is the same as the first processing step (step S11) in the embodiment.

  On the other hand, in this modification, after the first processing step (step S41), the removal step is not performed, and the rotation stopping step (step S45) is performed from the deceleration step (step S42). Each of the deceleration process (step S42) to the rotation stop process (step S45) is the same as the deceleration process (step S13) to the rotation stop process (step S16) in the embodiment. Further, the deceleration process (step S42) is performed in a state where supply of the processing liquid is stopped.

  In this modification, there is time for the wafer W to rotate in the deceleration process (step S42) and the position change process (step S43), and during that time, the processing liquid from the wafer W is shaken and dried.

  When the wafer W slides on the support pins 72 in the position changing step (step S43), that is, when the wafer W is relatively rotated, if the processing liquid remains on the wafer W, the remaining processing liquid is transferred to the support pins 72 and the wafer W. Mist is easily generated by sliding between the two. Further, when the wafer W slides on the support pins 72, that is, relatively rotates, the mist generated on the lower surface side of the wafer W easily goes around the upper surface side of the wafer W. However, in this modification, the processing liquid is shaken and dried together with the deceleration process (step S42) and the position change process (step S43). Therefore, when starting the position changing step (step S43), compared with the conventional liquid processing method, when the wafer W slides on the support pins 72, that is, when it relatively rotates, generation of mist of the processing liquid is prevented. can do.

  Also in this modified example, in the second processing step (step S44), the unprocessed portion that was not in contact with the processing liquid because it was in contact with the support pin 72 in the first processing step (step S41) is the support pin 72. It is shifted to the relative angular position where it does not come into contact. Therefore, an unprocessed portion of the wafer W caused by the support pins 72 can be eliminated.

  Also in this modified example, the lower surface of an arbitrary portion on the center side of the peripheral portion of the wafer W is placed on the support pins 72 provided so as to protrude inward from the lower end of the enclosing member 70, so that the wafer W is mounted. It may be supported.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

DESCRIPTION OF SYMBOLS 10 Liquid processing system 22 Liquid processing unit 70 Enclosure member 72 Support pin 80 Rotation drive part 93 Processing liquid supply mechanism 200 Control part

Claims (11)

In the liquid processing method of processing the lower surface of the substrate with the processing liquid,
The substrate that is rotatably supported and supported by a support unit that supports the substrate from below is rotated and rotated together with the support unit so that the relative angular position of the substrate with respect to the support unit does not change. A first processing step of supplying a processing liquid to the lower surface of the substrate, and processing the lower surface of the substrate with the supplied processing liquid;
After the first processing step, a position changing step for changing the relative angular position by changing the number of rotations of the rotating unit that rotates the support unit;
After the position changing step, the substrate supported by the support portion is rotated together with the support portion so that the relative angular position does not change, and a processing liquid is supplied to the lower surface of the rotating substrate, and supplied And a second processing step of processing the lower surface of the substrate with the processed processing liquid.   In the position changing step, the relative angular position is changed by accelerating the rotational speed at a predetermined rotational acceleration necessary for rotating the substrate relative to the support portion in the circumferential direction. The liquid processing method according to claim 1.   In the position changing step, the relative angular position is changed by decelerating the rotational speed at a predetermined rotational acceleration necessary for rotating the substrate relative to the support portion in the circumferential direction. The liquid processing method according to claim 1.   4. The method according to claim 1, further comprising a removing step of removing the processing liquid from the lower surface in a state where supply of the processing liquid is stopped between the first processing step and the second processing step. 5. The liquid processing method of crab.   In the removing step, before the position changing step, the substrate is rotated together with the support portion so that the relative angular position does not change, so that the processing liquid supplied to the lower surface is shaken off and dried. The liquid processing method of Claim 4 which exists.   A computer-readable recording medium having recorded thereon a program for causing a computer to execute the liquid processing method according to any one of claims 1 to 5. In the liquid processing apparatus that processes the lower surface of the substrate with the processing liquid,
A support portion that is rotatably provided and supports the substrate from below;
A rotating part for rotating the support part;
A treatment liquid supply part for supplying a treatment liquid to the lower surface of the substrate supported by the support part;
The substrate supported by the support unit is rotated together with the support unit so that the relative angular position of the substrate with respect to the support unit is not changed by the rotating unit, and the processing liquid is placed on the lower surface of the rotating substrate. The processing liquid is supplied by the supply unit, the lower surface of the substrate is processed by the supplied processing liquid, and the lower surface is processed. After changing the angular position and changing the relative angular position, the substrate supported by the support unit is rotated by the rotating unit together with the support unit so that the relative angular position does not change. A liquid processing apparatus comprising: a control unit configured to supply a processing liquid to the lower surface of the substrate by the processing liquid supply unit and process the lower surface of the substrate with the supplied processing liquid.   The controller is configured to change the relative angular position by accelerating the rotational speed at a predetermined rotational acceleration necessary to rotate the substrate relative to the support in the circumferential direction. The liquid processing apparatus according to claim 7.   The control unit changes the relative angular position by decelerating the rotation speed at a predetermined rotational acceleration necessary for rotating the substrate relative to the support unit in the circumferential direction. The liquid processing apparatus according to claim 7.   After the processing of the lower surface of the substrate before changing the relative angular position, the control unit performs processing liquid by the processing liquid supply unit before processing the lower surface of the substrate after changing the relative angular position. The liquid processing apparatus in any one of Claims 7-9 which removes a processing liquid from the said lower surface in the state which stopped supply.   The control unit removes the processing liquid from the lower surface before changing the relative angular position. When the processing liquid is removed, the relative angular position of the substrate is changed by the rotating unit. The liquid processing apparatus according to claim 10, wherein the processing liquid supplied to the lower surface is shaken off and dried by rotating together with the support portion.

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