JP2011243347A - Contact member, and connector using the same - Google Patents

Contact member, and connector using the same Download PDF

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JP2011243347A
JP2011243347A JP2010112940A JP2010112940A JP2011243347A JP 2011243347 A JP2011243347 A JP 2011243347A JP 2010112940 A JP2010112940 A JP 2010112940A JP 2010112940 A JP2010112940 A JP 2010112940A JP 2011243347 A JP2011243347 A JP 2011243347A
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spring
contact
pad
conductor film
connector
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JP5634120B2 (en
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Ryuzo Shino
竜三 示野
Takuya Takahashi
拓也 高橋
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a contact member which allows a contaminant attaching to a connected member to be removed without damaging the connected member.SOLUTION: A contact member 5 is used in a connector which a connected member is inserted in and connected to. The contact member has a spring member 15 and a conductor film 16. The spring member has first and second spring portions 7 and 8 laid out along an insertion direction of the connected member. The conductor film 16 has an insulating film 16a surrounding the first and second spring portions and a conducting path 16b formed on a surface of the insulating film. The conducting path has a first contact portion 16c for making an electrical connection in contact with a pad 1a of the connected member in a position corresponding to the second spring portion. A surface portion of the conductor film corresponding to the first spring portion forms a cleaning portion 16e. The cleaning portion removes a contaminant on the pad of the connected member when the pad comes into slide-contact therewith.

Description

本発明は、被接続部材を挿入接続するコネクタ、およびそれに使用されるコンタクト部材に関する。   The present invention relates to a connector for inserting and connecting a member to be connected, and a contact member used therefor.

この種のコネクタの一例は特許文献1に開示されている。そのコネクタは、被接続部材と接触する際に、被接続部材に付着している異物を除去する機能を有するコンタクト部材を備えている。   An example of this type of connector is disclosed in Patent Document 1. The connector is provided with a contact member having a function of removing foreign matters adhering to the connected member when contacting the connected member.

図6を用いて簡単に説明すると、特許文献1に開示されたコンタクト部材30は、第1のコンタクト部31aを有する第1のコンタクト腕部31と第2のコンタクト部32aを有する第2のコンタクト腕部32とを備えている。第1のコンタクト部31aは第2のコンタクト部32aよりも被接続部材であるFPCの挿入方向手前に配置されている。FPCを挿入する際に、FPCに付着している異物が第1のコンタクト部31aにより除去され、その後に、FPCが第2のコンタクト部32aに接触する。   Briefly described with reference to FIG. 6, the contact member 30 disclosed in Patent Document 1 includes a first contact arm portion 31 having a first contact portion 31a and a second contact having a second contact portion 32a. Arm portion 32. The first contact portion 31a is disposed in front of the second contact portion 32a in the insertion direction of the FPC which is a connected member. When inserting the FPC, the foreign matter adhering to the FPC is removed by the first contact portion 31a, and then the FPC contacts the second contact portion 32a.

特開2009−199766号公報JP 2009-199766 A

しかし、異物を確実に除去するにはコンタクト部材をある程度強い力で被接続部材に接触させる必要があるため、コンタクト部材が金属製であることも加わり、被接続部材が挿入時にコンタクト部材によって傷付けられる虞がある。   However, since the contact member needs to be brought into contact with the connected member with a certain strong force in order to reliably remove the foreign matter, the contact member is made of metal, and the connected member is damaged by the contact member when inserted. There is a fear.

それ故に本発明の課題は、被接続部材に付着している異物を、被接続部材を傷付けることなく除去できるコンタクト部材を提供することにある。   Therefore, the subject of this invention is providing the contact member which can remove the foreign material adhering to a to-be-connected member, without damaging a to-be-connected member.

本発明の他の課題は、上記コンタクト部材を用いて良好な電気的接続を得ることを可能にしたコネクタを提供することにある。   Another object of the present invention is to provide a connector capable of obtaining a good electrical connection using the contact member.

本発明の一態様によれば、被接続部材を挿入接続するコネクタに使用されるコンタクト部材であって、ばね部材と導体フィルムとを含み、前記ばね部材は、前記被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有し、前記導体フィルムは、前記第1のばね部および前記第2のばね部を取り囲んだ絶縁フィルムと、前記絶縁フィルムの表面に形成された導電路とを有し、前記導電路は前記第2のばね部に対応した位置に前記被接続部材のパッドに接触し電気的接続をする第1の接点部を有し、前記第1のばね部に対応した前記導体フィルムの表面部は前記被接続部材のパッドが摺動接触して前記パッド上の異物を排除するクリーニング部を形成していることを特徴とするコンタクト部材が得られる。   According to one aspect of the present invention, a contact member used in a connector for inserting and connecting a member to be connected, including a spring member and a conductor film, the spring member being aligned in the insertion direction of the member to be connected. And the conductive film is formed on the surface of the insulating film and the insulating film surrounding the first spring portion and the second spring portion. The conductive path has a first contact portion that contacts and electrically connects to the pad of the connected member at a position corresponding to the second spring portion, and A contact member is obtained in which a surface portion of the conductor film corresponding to the spring portion forms a cleaning portion that slides and contacts a pad of the member to be connected to remove foreign matter on the pad. .

本発明の他の態様によれば、上記コンタクト部材を使用したコネクタであって、前記被接続部材を挿入する被接続部材挿入穴を有するハウジングを有し、前記被接続部材挿入穴内に前記クリーニング部と前記第1の接点部が突出し、前記被接続部材の挿入時に前記被接続部材のパッドが前記クリーニング部と前記第1の接点部に順次接触するように前記コンタクト部材を前記ハウジングに配設保持してなることを特徴とするコネクタが得られる。   According to another aspect of the present invention, there is provided a connector using the contact member, the housing having a connected member insertion hole for inserting the connected member, and the cleaning portion in the connected member insertion hole. And the first contact portion protrudes, and the contact member is disposed and held in the housing so that the pad of the connected member sequentially contacts the cleaning portion and the first contact portion when the connected member is inserted. Thus, a connector can be obtained.

また本発明の他の態様によれば、被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有するばね部材の周りを絶縁フィルムの表面に導電路が形成された導体フィルムで取り囲み、前記第1のばね部に対応した前記導体フィルムの表面部に前記被接続部材のパッドが摺動接触して該パッド上の異物を排除するクリーニング部を形成し、前記第2のばね部に対応した位置の前記導体フィルムの表面部に前記被接続部材のパッドが接触し電気的接続をする第1の接点部を形成していることを特徴とするコンタクト部材が得られる。   According to another aspect of the present invention, a conductive path is formed on the surface of the insulating film around the spring member having the first spring portion and the second spring portion aligned in the insertion direction of the connected member. Forming a cleaning portion that is surrounded by a conductive film and that slides on the surface of the conductive film corresponding to the first spring portion so that foreign matter on the pad is removed by sliding contact. A contact member is obtained, wherein a first contact portion is formed in which the pad of the member to be connected comes into contact with the surface portion of the conductor film at a position corresponding to the spring portion of 2 to make electrical connection. .

本発明のさらに他の態様によれば、被接続部材を挿入接続するコネクタに使用されるコンタクト部材であって、ばね部材と導体フィルムとを含み、前記ばね部材は、前記被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有し、前記導体フィルムは、前記第1のばね部および前記第2のばね部を取り囲んだ絶縁フィルムと、前記絶縁フィルムの表面に形成された導電路とを有し、前記導電路は前記第2のばね部に対応した位置に前記被接続部材のパッドに接触し電気的接続をする第1の接点部を有し、前記第1のばね部に対応した前記導体フィルムの表面部は前記絶縁フィルムが露出していることを特徴とするコンタクト部材が得られる。   According to still another aspect of the present invention, a contact member used for a connector for inserting and connecting a connected member, including a spring member and a conductor film, wherein the spring member is inserted in the connecting direction of the connected member. A first spring portion and a second spring portion aligned with each other, and the conductor film includes an insulating film surrounding the first spring portion and the second spring portion, and a surface of the insulating film. The conductive path has a first contact portion that contacts and electrically connects the pad of the connected member at a position corresponding to the second spring portion, and A contact member is obtained in which the insulating film is exposed at a surface portion of the conductor film corresponding to the first spring portion.

また本発明のさらに他の態様によれば、被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有するばね部材の周りを導体フィルムで取り囲み、前記第1のばね部に対応した前記導体フィルムの表面部に前記導体フィルムの基材である絶縁フィルムを露出したクリーニング部を形成し、前記第2のばね部に対応した位置の前記導体フィルムの表面部に前記被接続部材のパッドが接触し電気的接続をする第1の接点部を形成していることを特徴とするコンタクト部材が得られる。   According to still another aspect of the present invention, a conductive member film surrounds a spring member having a first spring portion and a second spring portion aligned in the insertion direction of the connected member. Forming a cleaning portion exposing an insulating film as a base material of the conductor film on a surface portion of the conductor film corresponding to the spring portion, and forming the cleaning portion on the surface portion of the conductor film at a position corresponding to the second spring portion; A contact member is obtained in which a pad of the member to be connected contacts to form a first contact portion for electrical connection.

上述したコンタクト部材およびコネクタは、被接続部材に付着している異物を、被接続部材を傷付けることなく除去でき、従って良好な電気的接続を得ることを可能にする。   The contact member and the connector described above can remove foreign matters adhering to the connected member without damaging the connected member, and thus make it possible to obtain a good electrical connection.

本発明の一実施形態に係るコネクタの使用状態を示す斜視図。The perspective view which shows the use condition of the connector which concerns on one Embodiment of this invention. 図1Aに示す使用状態の異なる方向から見た斜視図。The perspective view seen from the direction from which the use condition shown to FIG. 1A differs. 図1Aの使用状態を分解して示した斜視図。The perspective view which decomposed | disassembled and showed the use condition of FIG. 1A. 同コネクタを基板上に搭載した状態で示す断面図。Sectional drawing shown in the state which mounted the connector on the board | substrate. 同コネクタに含まれたコンタクト部材の拡大斜視図。The expansion perspective view of the contact member contained in the connector. 図4Aのコンタクト部材の一部のみを示す分解断面斜視図。FIG. 4B is an exploded cross-sectional perspective view showing only a part of the contact member of FIG. 4A. 図4Aのコンタクト部材の一部の拡大断面図。FIG. 4B is an enlarged cross-sectional view of a part of the contact member in FIG. 4A. 図4Aのコンタクト部材の他部の拡大断面図。FIG. 4B is an enlarged cross-sectional view of the other part of the contact member of FIG. 4A. 特許文献1(特開2009−199766号公報)に開示された技術を説明するための斜視図。The perspective view for demonstrating the technique disclosed by patent document 1 (Unexamined-Japanese-Patent No. 2009-199766).

まず図1Aおよび図1Bを参照すると、本発明の一実施形態に係るコネクタCが、FPC1を実装した液晶デバイスのデバイス部材2の表示検査を行う為の検査用コネクタとして示されている。コネクタCは、基板6に搭載されかつFPC1を被接続部材として接続している。   Referring first to FIG. 1A and FIG. 1B, a connector C according to an embodiment of the present invention is shown as an inspection connector for performing a display inspection of a device member 2 of a liquid crystal device on which an FPC 1 is mounted. The connector C is mounted on the substrate 6 and connects the FPC 1 as a connected member.

さらに図2および図3をも参照すると、コネクタCは、ハウジング4と、ハウジング4に組み合わされるコンタクト部材5と、コンタクト部材5にFPC1を圧接させるための絶縁性の加圧部材3とを含んでいる。   2 and 3, the connector C includes a housing 4, a contact member 5 combined with the housing 4, and an insulating pressure member 3 for pressing the FPC 1 against the contact member 5. Yes.

ハウジング4は、絶縁樹脂材からなり、前端に前後方向(第1の方向)A1に延びるFPC挿入穴4a、上面に上下方向(第2の方向)A2にのびてFPC挿入穴4aに通じる加圧部材挿入穴4b、および下面にコンタクト部材収容部4cを有する。コンタクト部材収容部4cは、前後方向A1における中央部にコンタクト部材固定用桟部4d、その前側と後側にFPC挿入穴4aに通じる第1のばね部収容部4eおよび第2のばね部収容部4fをそれぞれ有する。加圧部材挿入穴4bと第2のばね部収容部4fとは上下方向A2で対向している。   The housing 4 is made of an insulating resin material, and has an FPC insertion hole 4a extending in the front-rear direction (first direction) A1 at the front end, and a pressurization extending up and down (second direction) A2 on the upper surface and leading to the FPC insertion hole 4a. The member insertion hole 4b and the contact member accommodating portion 4c are provided on the lower surface. The contact member accommodating portion 4c includes a first spring portion accommodating portion 4e and a second spring portion accommodating portion that communicate with the contact member fixing bar 4d at the center in the front-rear direction A1 and the front and rear sides of the FPC insertion hole 4a. 4f respectively. The pressure member insertion hole 4b and the second spring portion accommodating portion 4f face each other in the vertical direction A2.

コンタクト部材5は、ハウジング4のコンタクト部材収容部4cに収容配置され、コネクタCを基板6に搭載する際に基板6のパッド6aに接触する。なお、コンタクト部材5とハウジング4および基板6との関係については、後文にて詳述する。   The contact member 5 is accommodated and disposed in the contact member accommodating portion 4 c of the housing 4, and contacts the pad 6 a of the substrate 6 when the connector C is mounted on the substrate 6. The relationship between the contact member 5, the housing 4, and the substrate 6 will be described in detail later.

次に、図3と共に図4Aおよび図4Bをも参照して、コンタクト部材5について説明する。   Next, the contact member 5 will be described with reference to FIGS. 4A and 4B together with FIG.

コンタクト部材5は、ばね部材15と、ばね部材15を取り囲む導体フィルム16とを含んでいる。ばね部材15は、ばね性を有する金属板を打ち抜き折り曲げてなり、基板部15aと、基板部15aの前後方向A1で対向する両側縁に沿って形成された複数の第1のばね部7と複数の第2のばね部8と有する。   The contact member 5 includes a spring member 15 and a conductor film 16 surrounding the spring member 15. The spring member 15 is formed by punching and bending a metal plate having spring properties, and a plurality of first spring portions 7 and a plurality of first spring portions 7 formed along the board portion 15a and opposite side edges in the front-rear direction A1 of the board portion 15a. And the second spring portion 8.

第1のばね部7の各々は、基板部15aの前側側縁から前方(FPC1の反挿入方向)に延びる第1の根元部7aと、第1の根元部7aの先端で折り返され第1の根元部7aからしだいに離れるように傾斜して後方に延びる第1のばね片7bと、第1のばね片7bの先端に上方に凸状に曲げ形成された第1の押圧部7cとを有する。第1の根元部7aには下方に凸状に曲げ形成された第1の凸部7dを有する。   Each of the first spring portions 7 is folded back at the first root portion 7a extending forward (in the anti-insertion direction of the FPC 1) from the front side edge of the base plate portion 15a, and at the tip of the first root portion 7a. It has the 1st spring piece 7b which inclines so that it may leave | separate gradually from the root part 7a, and extends back, and the 1st press part 7c bent and formed in the upper end at the front-end | tip of the 1st spring piece 7b . The first root portion 7a has a first convex portion 7d that is bent downward and convex.

第2のばね部8の各々は、基板部15aの後側側縁から後方(FPC1の挿入方向)に延びる第2の根元部8aと、第2の根元部8aの先端で折り返され第2の根元部8aからしだいに離れるように傾斜して前方に延びる第2のばね片8bと、第2のばね片8bの先端に上方に凸状に曲げ形成された第2の押圧部8cとを有する。第2の根元部8aには下方に凸状に曲げ形成された第2の凸部8dを有する。   Each of the second spring portions 8 is folded back at the second root portion 8a extending rearward (in the insertion direction of the FPC 1) from the rear side edge of the substrate portion 15a, and at the tip of the second root portion 8a. It has the 2nd spring piece 8b which inclines so that it may leave | separate gradually from the root part 8a, and extends ahead, and the 2nd press part 8c bent at the front-end | tip of the 2nd spring piece 8b at the convex shape upwards . The second root portion 8a has a second convex portion 8d that is bent downward and convex.

第1のばね部7と第2のばね部8とは互いに1対1で対応して前後方向A1に整列されている。図示例では、第1のばね片7bが第2のばね片8bより長く、かつ、第1の押圧部7cが第2の押圧部8cより上下方向A2において高い位置にある。また、複数の第2のばね部8においては、第2の根元部8aの長さを変えることにより第2の押圧部8cが千鳥配列になっており、第2の凸部8dも、第2の押圧部8cと同様、千鳥配列になっている。   The first spring portion 7 and the second spring portion 8 are in a one-to-one correspondence with each other and are aligned in the front-rear direction A1. In the example of illustration, the 1st spring piece 7b is longer than the 2nd spring piece 8b, and the 1st press part 7c exists in a position higher in the up-down direction A2 than the 2nd press part 8c. Further, in the plurality of second spring portions 8, the second pressing portions 8c are arranged in a staggered manner by changing the length of the second root portion 8a, and the second convex portions 8d are also second Similar to the pressing portion 8c, a staggered arrangement is provided.

一方、導体フィルム16は、比較的柔軟な絶縁フィルム16aと、絶縁フィルム16aの表面に互いに平行に且つ離間して形成された複数の導電路16bとを有している。導体フィルム16は、中間部をばね部材15の基板部15aの上面に貼り付け、その中間部の両側を第1のばね部7および第2のばね部8を取り囲むように巻き、両端部を基板部15aの下面に貼り付けることで、ばね部材15に取り付けられる。   On the other hand, the conductor film 16 has a relatively flexible insulating film 16a and a plurality of conductive paths 16b formed on the surface of the insulating film 16a in parallel and spaced apart from each other. The conductor film 16 has an intermediate portion attached to the upper surface of the substrate portion 15a of the spring member 15, both sides of the intermediate portion are wound so as to surround the first spring portion 7 and the second spring portion 8, and both end portions are substrate. By attaching to the lower surface of the part 15a, the spring member 15 is attached.

導電路16bは上下方向A2において第2のばね部8に1対1で対応して設けられている。各導電路16bは、第2のばね部8の第2の押圧部8cから第2のばね片8bを経て第2の根元部8aに至る部分に沿って延びている。導電路16bの第2の押圧部8cに対応する部分が第1の接点部16c、第2の凸部8dに対応する部分が第2の接点部16dを形成している。絶縁フィルム16aのうち第1の押圧部7cに対応する部分の表面はクリーニング部16eを形成している。   The conductive path 16b is provided in one-to-one correspondence with the second spring portion 8 in the vertical direction A2. Each conductive path 16b extends along a portion from the second pressing portion 8c of the second spring portion 8 to the second root portion 8a via the second spring piece 8b. A portion corresponding to the second pressing portion 8c of the conductive path 16b forms a first contact portion 16c, and a portion corresponding to the second convex portion 8d forms a second contact portion 16d. The surface of the part corresponding to the 1st press part 7c among the insulating films 16a forms the cleaning part 16e.

なお、導体フィルムで取り巻かれたコンタクト部材5には、基板部15aおよび絶縁フィルム16aを貫通する3つの位置決め穴15b、16fが形成されている。   In addition, the positioning member 15b and 16f which penetrate the board | substrate part 15a and the insulating film 16a are formed in the contact member 5 surrounded by the conductor film.

コネクタCの組立は、第1のばね部7と第2のばね部8の部分が第1のばね部収容部4eと第2のばね部収容部4fにそれぞれ位置するようにして、導体フィルムで取り巻かれたコンタクト部材5をハウジング4のコンタクト部材収容部4cに収容し、基板部15aの部分をばね部材固定用桟部4dの下面に適当な手段により固定する。その際に、位置決め穴15b、16fがばね部材固定用桟部4dの下面に設けた位置決め突部4gに入り、導体フィルムで取り巻かれたコンタクト部材5を位置決めする。導体フィルムで取り巻かれたコンタクト部材5の固定は、基板部15aの部分をばね部材固定用桟部4dの下面に接着したり、位置決め突部4gの先端を位置決め穴15b、16fの下面側周縁部に溶着したりすることで行う。   The connector C is assembled with a conductor film so that the first spring portion 7 and the second spring portion 8 are positioned in the first spring portion accommodating portion 4e and the second spring portion accommodating portion 4f, respectively. The encircling contact member 5 is accommodated in the contact member accommodating portion 4c of the housing 4, and the substrate portion 15a is fixed to the lower surface of the spring member fixing beam portion 4d by an appropriate means. At that time, the positioning holes 15b and 16f enter the positioning projection 4g provided on the lower surface of the spring member fixing bar 4d, and the contact member 5 surrounded by the conductor film is positioned. The contact member 5 surrounded by the conductor film is fixed by bonding the portion of the substrate portion 15a to the lower surface of the spring member fixing beam portion 4d, or by attaching the tip of the positioning protrusion 4g to the lower surface side peripheral portion of the positioning holes 15b and 16f. Or by welding.

この組立状態において、導体フィルムで取り巻かれたコンタクト部材5のクリーニング部16eと第1の接点部16cはFPC挿入穴4a内に突出し、コンタクト部材5の第1の根元部7a、基板部15a、第2の根元部8a部分はハウジング4の下面とほぼ面一で、第2の接点部16dはハウジング4の下面から下方にやや突出している。   In this assembled state, the cleaning portion 16e and the first contact portion 16c of the contact member 5 surrounded by the conductor film protrude into the FPC insertion hole 4a, and the first base portion 7a, the substrate portion 15a, the first contact portion 5 of the contact member 5 The second base portion 8 a is substantially flush with the lower surface of the housing 4, and the second contact portion 16 d slightly protrudes downward from the lower surface of the housing 4.

以上のように構成したコネクタCは、図3に示すように、基板6上に搭載して使用する。その際、コネクタCの第2の接点部16dを基板6上のパッド6a上に一対一で対応させてそれぞれ配置する。さらに、コネクタCと基板6とにそれぞれ設けられたねじ穴4h、6bにねじ(図示せず)を通して互いに締め付けることにより、コネクタCを基板6上に固定する。この固定により、コネクタCの第2の接点部16dが基板6上のパッド6aに押し付けられ接触導通する。   The connector C configured as described above is used by being mounted on a substrate 6 as shown in FIG. At that time, the second contact portions 16d of the connector C are arranged on the pads 6a on the substrate 6 in a one-to-one correspondence. Further, the connector C is fixed on the substrate 6 by tightening screws (not shown) through screw holes 4h and 6b provided in the connector C and the substrate 6, respectively. By this fixing, the second contact portion 16d of the connector C is pressed against the pad 6a on the substrate 6 and brought into contact conduction.

コネクタCにFPC1を接続するには、FPC1をFPC挿入穴4aに挿入する。すると、FPC1の先端がクリーニング部16eに当接し第1のばね部7のばね力に抗してクリーニング部16eを押し下げる。クリーニング部16eがFPC1の下面に潜り込み、第1のばね部7のばね復元力によりFPC1の下面のパッド1aに所定の接触圧でもって接触する。この状態でFPC1がFPC挿入穴4aにさらに挿入されると、FPC1のパッド1aがクリーニング部16e上を摺動する。その結果、パッド1a上に付着した異物や汚染物が排除され、パッド1aがクリーニングされる。クリーニング部16eは比較的柔軟な絶縁フィルムで構成されているので、このクリーニングによってFPC1のパッド1aが傷付けられる虞は少ない。   In order to connect the FPC 1 to the connector C, the FPC 1 is inserted into the FPC insertion hole 4a. Then, the tip of the FPC 1 comes into contact with the cleaning portion 16e and pushes down the cleaning portion 16e against the spring force of the first spring portion 7. The cleaning portion 16e enters the lower surface of the FPC 1 and comes into contact with the pad 1a on the lower surface of the FPC 1 with a predetermined contact pressure by the spring restoring force of the first spring portion 7. When the FPC 1 is further inserted into the FPC insertion hole 4a in this state, the pad 1a of the FPC 1 slides on the cleaning portion 16e. As a result, foreign matters and contaminants adhering to the pad 1a are eliminated, and the pad 1a is cleaned. Since the cleaning portion 16e is made of a relatively flexible insulating film, there is little possibility that the pad 1a of the FPC 1 is damaged by this cleaning.

更に、FPC1をその先端がFPC挿入穴4aの奥部の突き当て位置12に突き当たるまで挿入すると、クリーニング部16eと同様、第1の接点部16cが第2のばね部8のばね力に抗して押し下げられる。この状態になると、第2のばね部8のばね復元力により、第1の接点部16cがFPC1の下面のパッド1aに所定の接触力をもって接触する。この結果、FPC1はコンタクト部材5を介して基板6に電気的に接続される。ここでFPC1のパッド1aは、クリーニング部16eで異物等が確実に除去クリーニングされた後、第1の接点部16cに接触するので良好な電気的接続を図ることができる。   Further, when the FPC 1 is inserted until the tip of the FPC 1 comes into contact with the abutting position 12 at the back of the FPC insertion hole 4a, the first contact portion 16c resists the spring force of the second spring portion 8 like the cleaning portion 16e. Pushed down. In this state, the first contact portion 16c comes into contact with the pad 1a on the lower surface of the FPC 1 with a predetermined contact force due to the spring restoring force of the second spring portion 8. As a result, the FPC 1 is electrically connected to the substrate 6 through the contact member 5. Here, the pad 1a of the FPC 1 contacts the first contact portion 16c after the foreign matter or the like is surely removed and cleaned by the cleaning portion 16e, so that a good electrical connection can be achieved.

更に、加圧部材3を加圧部材挿入穴4bに挿入してFPC1を下方に押圧し、第1の接点部16cとFPC1のパッド1aとの間の接触力および第2の接点部16dと基板6上のパッド6aとの間の接触力を高め、それらの間の電気的接続を確実にする。なお、加圧部材3は別途設けられた加圧保持手段(図示せず)により加圧状態が保持される。   Further, the pressure member 3 is inserted into the pressure member insertion hole 4b to press the FPC 1 downward, the contact force between the first contact portion 16c and the pad 1a of the FPC 1, and the second contact portion 16d and the substrate. The contact force between the pads 6a on 6 is increased and the electrical connection between them is ensured. The pressure member 3 is held in a pressurized state by a pressure holding means (not shown) provided separately.

このようにして、FPC1をコネクタCに挿入接続することで、FPC1に接続されたデバイス部材2が基板6上に設けた検査処理回路(図示せず)、或いは基板6を介して別の検査処理装置(図示せず)に電気的に接続され、デバイス部材2の表示検査が行われる。   In this way, by inserting and connecting the FPC 1 to the connector C, the device member 2 connected to the FPC 1 is provided with an inspection processing circuit (not shown) provided on the substrate 6 or another inspection processing via the substrate 6. It is electrically connected to an apparatus (not shown), and a display inspection of the device member 2 is performed.

上述したコネクタによれば、クリーニング部16eが比較的柔軟な絶縁フィルムで構成されるので、FPC1のパッド1aを傷つけることなく、クリーニング部16e上を所定の接触圧でもってFPC1のパッド1aが摺動し、その結果、付着している異物や汚染物が確実に排除され得るので、良好な電気的接続を図ることができる。   According to the connector described above, since the cleaning portion 16e is formed of a relatively flexible insulating film, the pad 1a of the FPC 1 slides on the cleaning portion 16e with a predetermined contact pressure without damaging the pad 1a of the FPC 1. As a result, adhering foreign matter and contaminants can be surely eliminated, and a good electrical connection can be achieved.

また、複数の第1の接点部16c、第2の接点部16dおよびそれら接点部間を繋ぐ導電路16bは、導体フィルム16にパターン形成することにより簡単且つ狭ピッチに形成することができる。加えて、クリーニング部16eおよび第1の接点部16cにばね力を与えるばね部材15の複数の第1のばね部7および第2のばね部8も、基板部15aの両側に連状に形成することで簡単且つ狭ピッチに打ち抜き形成することができる。したがって、狭ピッチ多接点配列のコンタクト部材、およびコネクタの製作が容易である。   Further, the plurality of first contact portions 16c, the second contact portions 16d, and the conductive paths 16b connecting the contact portions can be easily formed at a narrow pitch by patterning the conductor film 16. In addition, a plurality of first spring portions 7 and second spring portions 8 of the spring member 15 that apply a spring force to the cleaning portion 16e and the first contact portion 16c are also formed continuously on both sides of the substrate portion 15a. Therefore, it can be formed by punching in a simple and narrow pitch. Accordingly, it is easy to manufacture contact members and connectors having a narrow pitch multi-contact arrangement.

また、クリーニング部16eおよび第1の接点16cにばね力を与えるばね部材15の複数の第1のばね部7および第2のばね部8は互いに独立しているので、第1のばね部7と第2のばね部8の長さ、板厚、板幅等を変える等して、クリーニング部16eおよび第1の接点16cに異物排除および電気的接続に最適なばね力を付与することができ、FPC1のパッド1aに付着した異物、汚染物等を確実に排除し、且つ電気的にも良好な接続を行うことができる。   In addition, since the plurality of first spring portions 7 and the second spring portions 8 of the spring member 15 that apply a spring force to the cleaning portion 16e and the first contact point 16c are independent of each other, By changing the length, plate thickness, plate width, etc. of the second spring portion 8, it is possible to give the cleaning portion 16e and the first contact point 16c an optimum spring force for foreign object removal and electrical connection, It is possible to reliably remove foreign matters, contaminants, and the like adhering to the pad 1a of the FPC 1 and to make a good electrical connection.

また、図5Aに示すように第2押圧部8cが比較的前部に位置している第2のばね部8に対応した導電路16bを前部まで比較的長く延在させる一方、図5Bに示すように第2押圧部8cが比較的後部に位置している第2のばね部8に対応した導電路16bを後部で終端するように比較的短く延在させているので、比較的長く延在した導電路16bの相互間隔を広く設計できる。したがって、比較的長く延在した導電路16bの隣接したもの間の電気的短絡を防止することが容易に可能である。   Further, as shown in FIG. 5A, the second pressing portion 8c extends the conductive path 16b corresponding to the second spring portion 8 located at the relatively front portion to the front portion relatively long, while FIG. As shown, the second pressing portion 8c extends relatively short so as to terminate the conductive path 16b corresponding to the second spring portion 8 located at the rear portion so as to terminate at the rear portion. The interval between the existing conductive paths 16b can be designed wide. Therefore, it is possible to easily prevent an electrical short circuit between adjacent ones of the conductive paths 16b extending relatively long.

なお、ばね部材15を金属材で形成した場合を説明したが、ばね部材15はその他の材料例えば樹脂材で形成されても良い。また、第1のばね部7が第2のばね部8と1対1で対応しているが、1つの第1のばね部7が複数の第2のばね部8と対応するように、第1のばね部7を幅広に形成しても良い。   In addition, although the case where the spring member 15 was formed with the metal material was demonstrated, the spring member 15 may be formed with another material, for example, a resin material. In addition, the first spring portion 7 corresponds to the second spring portion 8 on a one-to-one basis, but the first spring portion 7 corresponds to the plurality of second spring portions 8 so as to correspond to the second spring portion 8. One spring portion 7 may be formed wide.

また、ハウジング4の加圧部材挿入穴4bに加圧部材3を挿入しFPC1を下方に押圧して第1の接点16cとの接触圧を強めるようにしているが、加圧部材3は必ずしも必要ではなく、その場合はハウジング4の加圧部材挿入穴4bも不要である。   Further, the pressure member 3 is inserted into the pressure member insertion hole 4b of the housing 4 and the FPC 1 is pressed downward to increase the contact pressure with the first contact 16c. However, in that case, the pressure member insertion hole 4b of the housing 4 is also unnecessary.

また、上記実施形態の一部又は全部は、以下の付記のようにも記載され得るが、以下には限られない。   Moreover, although a part or all of the said embodiment may be described also as the following additional remarks, it is not restricted to the following.

(付記1)
被接続部材1を挿入接続するコネクタCに使用されるコンタクト部材5であって、ばね部材15と導体フィルム16とを含み、前記ばね部材15は、前記被接続部材1の挿入方向に整列された第1のばね部7と第2のばね部8とを有し、前記導体フィルム16は、前記第1のばね部7および前記第2のばね部8を取り囲んだ絶縁フィルム16aと、前記絶縁フィルム16aの表面に形成された導電路16bとを有し、前記導電路16bは前記第2のばね部8に対応した位置に前記被接続部材1のパッド1aに接触し電気的接続をする第1の接点部16cを有し、前記第1のばね部7に対応した前記導体フィルム16の表面部は前記被接続部材1のパッド1aが摺動接触して前記パッド1a上の異物を排除するクリーニング部16eを形成していることを特徴とするコンタクト部材5。
(Appendix 1)
A contact member 5 used for a connector C for inserting and connecting the connected member 1, including a spring member 15 and a conductor film 16, wherein the spring member 15 is aligned in the inserting direction of the connected member 1. The conductor film 16 includes an insulating film 16a surrounding the first spring portion 7 and the second spring portion 8, and the insulating film. The insulating film 16a includes a first spring portion 7 and a second spring portion 8. A conductive path 16b formed on the surface of 16a, and the conductive path 16b is in contact with the pad 1a of the connected member 1 at a position corresponding to the second spring portion 8 to be electrically connected. The contact portion 16c has a contact portion 16c, and the surface portion of the conductor film 16 corresponding to the first spring portion 7 is slidably contacted with the pad 1a of the member 1 to be connected to remove foreign matter on the pad 1a. Forming part 16e Contact members 5, characterized in Rukoto.

(付記2)
前記ばね部材15は基板部15aを有し、前記第1のばね部7および第2のばね部8は、前記基板部15aの前記挿入方向一側および他側にそれぞれ形成されていることを特徴とする、付記1記載のコンタクト部材5。
(Appendix 2)
The spring member 15 has a substrate portion 15a, and the first spring portion 7 and the second spring portion 8 are formed on one side and the other side of the substrate portion 15a in the insertion direction, respectively. The contact member 5 according to appendix 1.

(付記3)
前記第1のばね部7は、前記基板部15aの前記挿入方向一側から前記挿入方向とは反対側の反挿入方向に延びる第1の根元部7aと、前記第1の根元部7aの先端で折り返されて前記挿入方向に延びる第1のばね片7bと、前記第1のばね片7bの先端に設けられた第1の押圧部7cとを有し、前記第2のばね部8は、前記基板部15aの前記挿入方向他側から前記挿入方向に延びる第2の根元部8aと、前記第2の根元部8aの先端で折り返されて前記反挿入方向に延びる第2のばね片8bと、前記第2のばね片8bの先端に設けられた第2の押圧部8cとを有し、前記第1の押圧部7cが前記クリーニング部16eに対応した前記導体フィルム16の裏面に当接し、前記第2の押圧部8cが前記第1の接点部16cに対応した前記導体フィルム16の裏面に当接していることを特徴とする、付記2記載のコンタクト部材5。
(Appendix 3)
The first spring portion 7 includes a first root portion 7a extending from one side of the base plate portion 15a in the insertion direction to an opposite insertion direction opposite to the insertion direction, and a tip of the first root portion 7a. And the first spring piece 7b that extends in the insertion direction and the first pressing portion 7c provided at the tip of the first spring piece 7b, and the second spring portion 8 includes: A second root portion 8a extending in the insertion direction from the other side of the substrate portion 15a in the insertion direction, and a second spring piece 8b folded back at the tip of the second root portion 8a and extending in the anti-insertion direction. A second pressing portion 8c provided at the tip of the second spring piece 8b, and the first pressing portion 7c contacts the back surface of the conductor film 16 corresponding to the cleaning portion 16e, The conductor in which the second pressing portion 8c corresponds to the first contact portion 16c. Characterized in that in contact with the back surface of Irumu 16, Appendix 2 contact member 5 according.

(付記4)
前記第1のばね片7bおよび前記第2のばね片8bは、前記第1の根元部7aおよび前記第2の根元部8aから漸次離れるように傾斜していることを特徴とする、付記3記載のコンタクト部材5。
(Appendix 4)
The supplementary note 3, wherein the first spring piece 7b and the second spring piece 8b are inclined so as to gradually move away from the first root part 7a and the second root part 8a. Contact member 5 of FIG.

(付記5)
前記導体フィルム16は、前記ばね部材15の前記基板部15a、前記第1のばね部7、および前記第2のばね部8を取り囲んでおり、前記導体フィルム16の表面の前記導電路16bは、前記第2のばね部8の前記第2の押圧部8cから前記第2のばね片8bを経て前記第2の根元部8a部分にまで延び、前記第2の根元部8a部分に第2の接点部16dを形成していることを特徴とする、付記3又は4記載のコンタクト部材5。
(Appendix 5)
The conductor film 16 surrounds the substrate portion 15a, the first spring portion 7, and the second spring portion 8 of the spring member 15, and the conductive path 16b on the surface of the conductor film 16 is The second spring portion 8 extends from the second pressing portion 8c through the second spring piece 8b to the second root portion 8a portion, and a second contact point is formed on the second root portion 8a portion. The contact member 5 according to appendix 3 or 4, characterized in that a portion 16d is formed.

(付記6)
前記第2の根元部8aには、前記第2の接点部16dに対応する部分に凸部7dを有することを特徴とする、付記5記載のコンタクト部材5。
(Appendix 6)
The contact member 5 according to appendix 5, wherein the second root portion 8a has a convex portion 7d at a portion corresponding to the second contact portion 16d.

(付記7)
前記ばね部材15の前記基板部15aには前記第1のばね部7および前記第2のばね部8が前記挿入方向と直交する方向に複数並設され、前記導体フィルム16は複数の前記第1のばね部7および前記第2のばね部8を取り囲んでおり、前記導体フィルム16には前記第2のばね部8に1対1で対応するようにして前記導電路16bが複数並設されていることを特徴とする、付記2乃至6のいずれかに記載のコンタクト部材5。
(Appendix 7)
A plurality of the first spring portions 7 and the second spring portions 8 are arranged side by side in the direction orthogonal to the insertion direction on the substrate portion 15a of the spring member 15, and the conductor film 16 includes a plurality of the first spring portions 15. The conductive film 16 includes a plurality of conductive paths 16b arranged side by side so as to correspond to the second spring part 8 on a one-to-one basis. The contact member 5 according to any one of appendices 2 to 6, characterized in that:

(付記8)
前記第1の押圧部7cの前記第1の根元部7aからの高さ寸法が前記第2の押圧部8cの前記第2の根元部8aからの高さ寸法よりも大きく形成されていることを特徴とする、付記2乃至7のいずれかに記載のコンタクト部材5。
(Appendix 8)
The height dimension of the first pressing part 7c from the first root part 7a is formed larger than the height dimension of the second pressing part 8c from the second root part 8a. 8. The contact member 5 according to any one of appendices 2 to 7, which is a feature.

(付記9)
前記ばね部材15は金属からなることを特徴とする、付記1乃至8のいずれかに記載のコンタクト部材5。
(Appendix 9)
9. The contact member 5 according to any one of appendices 1 to 8, wherein the spring member 15 is made of metal.

(付記10)
付記1乃至9のいずれかに記載のコンタクト部材5を使用したコネクタCであって、前記被接続部材1を挿入する被接続部材挿入穴4aを有するハウジングを有し、前記被接続部材挿入穴4a内に前記クリーニング部と前記第1の接点部16cが突出し、前記被接続部材1の挿入時に前記被接続部材1のパッド1aが前記クリーニング部16eと前記第1の接点部16cに順次接触するように前記コンタクト部材5を前記ハウジング4に配設保持してなることを特徴とするコネクタC。
(Appendix 10)
A connector C using the contact member 5 according to any one of appendices 1 to 9, including a housing having a connected member insertion hole 4a into which the connected member 1 is inserted, and the connected member inserting hole 4a. The cleaning portion and the first contact portion 16c protrude into the contact portion 1 so that the pad 1a of the connected member 1 sequentially contacts the cleaning portion 16e and the first contact portion 16c when the connected member 1 is inserted. The connector C is characterized in that the contact member 5 is disposed and held in the housing 4.

(付記11)
前記ハウジング4は上面に前記被接続部材挿入穴に通じ前記第1の接点部16cを臨むように形成された加圧部材挿入穴4bを有し、前記加圧部材挿入穴4bに加圧部材3を挿入することで前記被接続部材挿入穴4aに挿入された前記被接続部材1を押圧し前記被接続部材1の前記パッド1aを前記第1の接点部16cに押圧接触させることを特徴とする、付記10記載のコネクタC。
(Appendix 11)
The housing 4 has a pressure member insertion hole 4b formed on an upper surface thereof so as to pass through the connected member insertion hole and face the first contact portion 16c, and the pressure member 3 is inserted into the pressure member insertion hole 4b. Is inserted into the to-be-connected member insertion hole 4a, and the pad 1a of the to-be-connected member 1 is pressed into contact with the first contact portion 16c. The connector C according to appendix 10.

(付記12)
付記5乃至9のいずれかに記載のコンタクト部材5を使用したコネクタでCあって、前記第2の接点部16dが前記ハウジング4の底面から突出していることを特徴とする、付記10又は11記載のコネクタC。
(Appendix 12)
12. A connector using the contact member 5 according to any one of appendices 5 to 9, wherein the second contact portion 16d protrudes from the bottom surface of the housing 4. Connector C.

(付記13)
前記コネクタCは基板6上に搭載され、前記第2の接点部16dが前記基板6のパッド6aに接触していることを特徴とする、付記12記載のコネクタC。
(Appendix 13)
13. The connector C according to appendix 12, wherein the connector C is mounted on the substrate 6 and the second contact portion 16d is in contact with the pad 6a of the substrate 6.

(付記14)
被接続部材1の挿入方向に整列された第1のばね部7と第2のばね部8とを有するばね部材15の周りを絶縁フィルム16aの表面に導電路16bが形成された導体フィルム16で取り囲み、前記第1のばね部7に対応した前記導体フィルム16の表面部に前記被接続部材1のパッド1aが摺動接触して該パッド1a上の異物を排除するクリーニング部16eを形成し、前記第2のばね部8に対応した位置の前記導体フィルム16の表面部に前記被接続部材1のパッド1aが接触し電気的接続をする第1の接点部16cを形成していることを特徴とするコンタクト部材5。
(Appendix 14)
A conductor film 16 in which a conductive path 16b is formed on the surface of an insulating film 16a around a spring member 15 having a first spring portion 7 and a second spring portion 8 aligned in the insertion direction of the connected member 1. A cleaning portion 16e is formed that surrounds the surface portion of the conductor film 16 corresponding to the first spring portion 7 so that the pad 1a of the member to be connected 1 comes into sliding contact and excludes foreign matter on the pad 1a. A first contact portion 16c is formed in which the pad 1a of the member to be connected 1 comes into contact with the surface portion of the conductor film 16 at a position corresponding to the second spring portion 8 to make an electrical connection. Contact member 5.

(付記15)
被接続部材1を挿入接続するコネクタCに使用されるコンタクト部材5であって、ばね部材15と導体フィルム16とを含み、前記ばね部材15は、前記被接続部材1の挿入方向に整列された第1のばね部7と第2のばね部8とを有し、前記導体フィルム16は、前記第1のばね部7および前記第2のばね部8を取り囲んだ絶縁フィルム16aと、前記絶縁フィルム16aの表面に形成された導電路16bとを有し、前記導電路16bは前記第2のばね部8に対応した位置に前記被接続部材1のパッド1aに接触し電気的接続をする第1の接点部16cを有し、前記第1のばね部7に対応した前記導体フィルム17の表面部は前記絶縁フィルム16aが露出していることを特徴とするコンタクト部材5。
(Appendix 15)
A contact member 5 used for a connector C for inserting and connecting the connected member 1, including a spring member 15 and a conductor film 16, wherein the spring member 15 is aligned in the inserting direction of the connected member 1. The conductor film 16 includes an insulating film 16a surrounding the first spring portion 7 and the second spring portion 8, and the insulating film. The insulating film 16a includes a first spring portion 7 and a second spring portion 8. A conductive path 16b formed on the surface of 16a, and the conductive path 16b is in contact with the pad 1a of the connected member 1 at a position corresponding to the second spring portion 8 to be electrically connected. The contact member 5 is characterized in that the insulating film 16a is exposed on the surface portion of the conductor film 17 corresponding to the first spring portion 7.

(付記16)
被接続部材1の挿入方向に整列された第1のばね部7と第2のばね部8とを有するばね部材15の周りを導体フィルム16で取り囲み、前記第1のばね部7に対応した前記導体フィルム16の表面部に前記導体フィルム16の基材である絶縁フィルム16aを露出したクリーニング部16eを形成し、前記第2のばね部に8対応した位置の前記導体フィルム16の表面部に前記被接続部材1のパッド1aが接触し電気的接続をする第1の接点部16cを形成していることを特徴とするコンタクト部材5。
(Appendix 16)
The spring member 15 having the first spring portion 7 and the second spring portion 8 aligned in the insertion direction of the connected member 1 is surrounded by a conductor film 16 and corresponds to the first spring portion 7. A cleaning portion 16e is formed on the surface portion of the conductor film 16 by exposing the insulating film 16a that is a base material of the conductor film 16, and the surface portion of the conductor film 16 at a position corresponding to the second spring portion 8 is formed on the surface portion of the conductor film 16. The contact member 5 is characterized in that a pad 1a of the member 1 to be connected contacts and forms a first contact portion 16c for electrical connection.

本発明に係るコネクタは、FPCを実装した液晶デバイス等のデバイス部材の表示検査を行う為の検査用コネクタとして利用できる。   The connector according to the present invention can be used as an inspection connector for performing a display inspection of a device member such as a liquid crystal device mounted with an FPC.

C コネクタ
1 FPC(被接続部材)
1a パッド
2 デバイス部材(液晶デバイス)
3 加圧部材
4 ハウジング
4a FPC挿入穴(被接続部材挿入穴)
4b 加圧部材挿入穴
4c コンタクト部材収容部
4d コンタクト部材固定用桟部
4e 第1のばね部収容部
4f 第2のばね部収容部
4g 位置決め突部
4h ねじ穴
5 コンタクト部材
6 基板
6a パッド
6b ねじ穴
7 第1のばね部
7a 第1の根元部
7b 第1のばね片
7c 第1の押圧部
7d 第1の凸部
8 第2のばね部
8a 第2の根元部
8b 第2のばね片
8c 第2の押圧部
8d 第2の凸部
12 突き当て位置
15 ばね部材
15a 基板部
15b 位置決め穴
16 導体フィルム
16a 絶縁フィルム
16b 導電路
16c 第1の接点部
16d 第2の接点部
16e クリーニング部
16f 位置決め穴
C connector 1 FPC (member to be connected)
1a pad 2 device member (liquid crystal device)
3 Pressurizing member 4 Housing 4a FPC insertion hole (connected member insertion hole)
4b Pressure member insertion hole 4c Contact member accommodating portion 4d Contact member fixing bar portion 4e First spring portion accommodating portion 4f Second spring portion accommodating portion 4g Positioning protrusion 4h Screw hole 5 Contact member 6 Substrate 6a Pad 6b Screw Hole 7 1st spring part 7a 1st base part 7b 1st spring piece 7c 1st press part 7d 1st convex part 8 2nd spring part 8a 2nd base part 8b 2nd spring piece 8c Second pressing portion 8d Second convex portion 12 Abutting position 15 Spring member 15a Substrate portion 15b Positioning hole 16 Conductor film 16a Insulating film 16b Conductive path 16c First contact portion 16d Second contact portion 16e Cleaning portion 16f Positioning hole

Claims (16)

被接続部材を挿入接続するコネクタに使用されるコンタクト部材であって、ばね部材と導体フィルムとを含み、前記ばね部材は、前記被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有し、前記導体フィルムは、前記第1のばね部および前記第2のばね部を取り囲んだ絶縁フィルムと、前記絶縁フィルムの表面に形成された導電路とを有し、前記導電路は前記第2のばね部に対応した位置に前記被接続部材のパッドに接触し電気的接続をする第1の接点部を有し、前記第1のばね部に対応した前記導体フィルムの表面部は前記被接続部材のパッドが摺動接触して前記パッド上の異物を排除するクリーニング部を形成していることを特徴とするコンタクト部材。   A contact member used for a connector for inserting and connecting a member to be connected, comprising a spring member and a conductor film, wherein the spring member includes a first spring portion aligned with an insertion direction of the member to be connected and a first spring part. And the conductor film has an insulating film surrounding the first spring portion and the second spring portion, and a conductive path formed on the surface of the insulating film, The conductive path has a first contact portion that makes electrical connection by contacting a pad of the connected member at a position corresponding to the second spring portion, and the conductive film corresponding to the first spring portion. The contact member is characterized in that a cleaning part is formed in which the pad of the member to be connected is slidably contacted to remove foreign matter on the pad. 前記ばね部材は基板部を有し、前記第1のばね部および第2のばね部は、前記基板部の前記挿入方向一側および他側にそれぞれ形成されていることを特徴とする、請求項1記載のコンタクト部材。   The said spring member has a board | substrate part, The said 1st spring part and the 2nd spring part are each formed in the said insertion direction one side and other side of the said board | substrate part, respectively. The contact member according to 1. 前記第1のばね部は、前記基板部の前記挿入方向一側から前記挿入方向とは反対側の反挿入方向に延びる第1の根元部と、前記第1の根元部の先端で折り返されて前記挿入方向に延びる第1のばね片と、前記第1のばね片の先端に設けられた第1の押圧部とを有し、前記第2のばね部は、前記基板部の前記挿入方向他側から前記挿入方向に延びる第2の根元部と、前記第2の根元部の先端で折り返されて前記反挿入方向に延びる第2のばね片と、前記第2のばね片の先端に設けられた第2の押圧部とを有し、前記第1の押圧部が前記クリーニング部に対応した前記導体フィルムの裏面に当接し、前記第2の押圧部が前記第1の接点部に対応した前記導体フィルムの裏面に当接していることを特徴とする、請求項2記載のコンタクト部材。   The first spring portion is folded back at a first root portion extending from one side of the base plate portion in the insertion direction to an anti-insertion direction opposite to the insertion direction, and a tip of the first root portion. A first spring piece extending in the insertion direction; and a first pressing portion provided at a tip of the first spring piece, wherein the second spring part is the insertion direction of the base plate part and the like. A second root portion extending from the side in the insertion direction, a second spring piece folded back at the tip of the second root portion and extending in the anti-insertion direction, and provided at the tip of the second spring piece And the second pressing portion is in contact with the back surface of the conductor film corresponding to the cleaning portion, and the second pressing portion corresponds to the first contact portion. The contact member according to claim 2, wherein the contact member is in contact with the back surface of the conductor film. 前記第1のばね片および前記第2のばね片は、前記第1の根元部および前記第2の根元部から漸次離れるように傾斜していることを特徴とする、請求項3記載のコンタクト部材。   The contact member according to claim 3, wherein the first spring piece and the second spring piece are inclined so as to gradually move away from the first root part and the second root part. . 前記導体フィルムは、前記ばね部材の前記基板部、前記第1のばね部、および前記第2のばね部を取り囲んでおり、前記導体フィルムの表面の前記導電路は、前記第2のばね部の前記第2の押圧部から前記第2のばね片を経て前記第2の根元部部分にまで延び、前記第2の根元部部分に第2の接点部を形成していることを特徴とする、請求項3又は4記載のコンタクト部材。   The conductor film surrounds the substrate portion, the first spring portion, and the second spring portion of the spring member, and the conductive path on the surface of the conductor film is formed of the second spring portion. The second pressing portion extends from the second spring piece to the second root portion, and a second contact portion is formed at the second root portion. The contact member according to claim 3 or 4. 前記第2の根元部には、前記第2の接点部に対応する部分に凸部を有することを特徴とする、請求項5記載のコンタクト部材。   The contact member according to claim 5, wherein the second root portion has a convex portion at a portion corresponding to the second contact portion. 前記ばね部材の前記基板部には前記第1のばね部および前記第2のばね部が前記挿入方向と直交する方向に複数並設され、前記導体フィルムは複数の前記第1のばね部および前記第2のばね部を取り囲んでおり、前記導体フィルムには前記第2のばね部に1対1で対応するようにして前記導電路が複数並設されていることを特徴とする、請求項2乃至6のいずれかに記載のコンタクト部材。   A plurality of the first spring portions and the second spring portions are arranged side by side in a direction orthogonal to the insertion direction on the substrate portion of the spring member, and the conductor film includes a plurality of the first spring portions and the plurality of the spring portions. 3. A plurality of the conductive paths are arranged side by side so as to surround the second spring portion and correspond to the second spring portion on a one-to-one basis on the conductor film. The contact member in any one of thru | or 6. 前記第1の押圧部の前記第1の根元部からの高さ寸法が前記第2の押圧部の前記第2の根元部からの高さ寸法よりも大きく形成されていることを特徴とする、請求項2乃至7のいずれかに記載のコンタクト部材。   The height dimension from the first root part of the first pressing part is formed larger than the height dimension from the second root part of the second pressing part, The contact member according to claim 2. 前記ばね部材は金属からなることを特徴とする、請求項1乃至8のいずれかに記載のコンタクト部材。   The contact member according to claim 1, wherein the spring member is made of metal. 請求項1乃至9のいずれかに記載のコンタクト部材を使用したコネクタであって、前記被接続部材を挿入する被接続部材挿入穴を有するハウジングを有し、前記被接続部材挿入穴内に前記クリーニング部と前記第1の接点部が突出し、前記被接続部材の挿入時に前記被接続部材のパッドが前記クリーニング部と前記第1の接点部に順次接触するように前記コンタクト部材を前記ハウジングに配設保持してなることを特徴とするコネクタ。   A connector using the contact member according to claim 1, further comprising a housing having a member insertion hole into which the member to be connected is inserted, wherein the cleaning unit is disposed in the member insertion hole. And the first contact portion protrudes, and the contact member is disposed and held in the housing so that the pad of the connected member sequentially contacts the cleaning portion and the first contact portion when the connected member is inserted. The connector characterized by being formed. 前記ハウジングは上面に前記被接続部材挿入穴に通じ前記第1の接点部を臨むように形成された加圧部材挿入穴を有し、前記加圧部材挿入穴に加圧部材を挿入することで前記被接続部材挿入穴に挿入された前記被接続部材を押圧し前記被接続部材の前記パッドを前記第1の接点部に押圧接触させることを特徴とする、請求項10記載のコネクタ。   The housing has a pressure member insertion hole formed on an upper surface so as to pass through the connected member insertion hole and face the first contact portion, and the pressure member is inserted into the pressure member insertion hole. The connector according to claim 10, wherein the connected member inserted into the connected member insertion hole is pressed to cause the pad of the connected member to be pressed into contact with the first contact portion. 請求項5乃至9のいずれかに記載のコンタクト部材を使用したコネクタであって、前記第2の接点部が前記ハウジングの底面から突出していることを特徴とする、請求項10又は11記載のコネクタ。   The connector using the contact member according to any one of claims 5 to 9, wherein the second contact portion protrudes from a bottom surface of the housing. . 前記コネクタは基板上に搭載され、前記第2の接点部が前記基板のパッドに接触していることを特徴とする、請求項12記載のコネクタ。   The connector according to claim 12, wherein the connector is mounted on a substrate, and the second contact portion is in contact with a pad of the substrate. 被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有するばね部材の周りを絶縁フィルムの表面に導電路が形成された導体フィルムで取り囲み、前記第1のばね部に対応した前記導体フィルムの表面部に前記被接続部材のパッドが摺動接触して該パッド上の異物を排除するクリーニング部を形成し、前記第2のばね部に対応した位置の前記導体フィルムの表面部に前記被接続部材のパッドが接触し電気的接続をする第1の接点部を形成していることを特徴とするコンタクト部材。   A first spring portion having a first spring portion and a second spring portion aligned in the insertion direction of the connected member is surrounded by a conductor film having a conductive path formed on the surface of the insulating film, and the first spring Forming a cleaning portion on the surface portion of the conductor film corresponding to the portion, wherein the pad of the member to be connected is in sliding contact to eliminate foreign matter on the pad, and the conductor at a position corresponding to the second spring portion A contact member, wherein the pad of the member to be connected contacts the surface portion of the film to form a first contact portion for electrical connection. 被接続部材を挿入接続するコネクタに使用されるコンタクト部材であって、ばね部材と導体フィルムとを含み、前記ばね部材は、前記被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有し、前記導体フィルムは、前記第1のばね部および前記第2のばね部を取り囲んだ絶縁フィルムと、前記絶縁フィルムの表面に形成された導電路とを有し、前記導電路は前記第2のばね部に対応した位置に前記被接続部材のパッドに接触し電気的接続をする第1の接点部を有し、前記第1のばね部に対応した前記導体フィルムの表面部は前記絶縁フィルムが露出していることを特徴とするコンタクト部材。   A contact member used for a connector for inserting and connecting a member to be connected, comprising a spring member and a conductor film, wherein the spring member includes a first spring portion aligned with an insertion direction of the member to be connected and a first spring part. And the conductor film has an insulating film surrounding the first spring portion and the second spring portion, and a conductive path formed on the surface of the insulating film, The conductive path has a first contact portion that makes electrical connection by contacting a pad of the connected member at a position corresponding to the second spring portion, and the conductive film corresponding to the first spring portion. The contact member, wherein the insulating film is exposed on the surface of the contact member. 被接続部材の挿入方向に整列された第1のばね部と第2のばね部とを有するばね部材の周りを導体フィルムで取り囲み、前記第1のばね部に対応した前記導体フィルムの表面部に前記導体フィルムの基材である絶縁フィルムを露出したクリーニング部を形成し、前記第2のばね部に対応した位置の前記導体フィルムの表面部に前記被接続部材のパッドが接触し電気的接続をする第1の接点部を形成していることを特徴とするコンタクト部材。   A conductive film surrounds a spring member having a first spring portion and a second spring portion aligned in the insertion direction of the connected member, and is formed on a surface portion of the conductive film corresponding to the first spring portion. A cleaning portion is formed that exposes the insulating film that is the base material of the conductor film, and the pad of the member to be connected comes into contact with the surface portion of the conductor film at a position corresponding to the second spring portion for electrical connection. A contact member, wherein a first contact portion is formed.
JP2010112940A 2010-05-17 2010-05-17 Contact member and connector using the same Expired - Fee Related JP5634120B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121682U (en) * 1988-02-10 1989-08-17
JP2000231957A (en) * 1999-02-10 2000-08-22 Furukawa Electric Co Ltd:The Connector for flexible flat cable
JP2009199766A (en) * 2008-02-19 2009-09-03 Fujitsu Component Ltd Connector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121682U (en) * 1988-02-10 1989-08-17
JP2000231957A (en) * 1999-02-10 2000-08-22 Furukawa Electric Co Ltd:The Connector for flexible flat cable
JP2009199766A (en) * 2008-02-19 2009-09-03 Fujitsu Component Ltd Connector

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