JP2011234197A - Circuit board supporting structure and imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably hold a circuit board equipped with an electronic part, in a direction orthogonal to the plane direction of the circuit board.SOLUTION: This circuit board supporting structure comprises: the circuit board 152 equipped with the electronic part; a board supporting member 170 which is provided at one side edge of the circuit board 152 and holds the circuit board 152; and a spring part 178 which is provided integrally with the board supporting member 170 and applies elastic force in the plane direction of the circuit board 152. This constitution makes it possible to reliably hold the circuit board equipped with the electronic part, in the direction orthogonal to the plane direction of the circuit board.

Description

  The present invention relates to a circuit board support structure and an imaging apparatus.

  2. Description of the Related Art Conventionally, as described in, for example, the following Patent Document 1, for example, an industrial compact video camera device that continuously images each inspection site of a semiconductor device that is installed in a manufacturing process of a semiconductor device or the like and is continuously supplied It has been known.

  The video camera device described in Patent Document 1 includes a multilayer flexible substrate in which a plurality of substrate portions 51 are continuously provided, and each intermediate substrate portion is formed by a positioning member and an elastic member that are arranged to face each other. Is retained.

JP 2003-46815 A JP 2006-261395 A JP-A-5-145815

  However, in the technique described in Patent Document 1, the intermediate substrate is fixed by pressing the end portion of the intermediate substrate portion from the surface direction by the elastic member. However, in this method, the movement of the substrate in the surface direction is suppressed. However, the fixing in the direction orthogonal to the surface direction (the direction perpendicular to the surface) could not be performed reliably.

  For this reason, in the case of manufacturing variations or when an impact is applied to the camera, the substrate moves in the direction perpendicular to the surface and the substrate is inclined, so that a sufficient clearance between the substrates cannot be secured. There arises a problem that the electrical components arranged above interfere with each other. For this reason, when electrical components contact each other, there is a high possibility that defects such as poor contact will occur, leading to a decrease in reliability.

  Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to reliably hold a circuit board on which electronic components are mounted in a direction perpendicular to the surface direction. It is an object of the present invention to provide a new and improved circuit board support structure and imaging apparatus which are possible.

  In order to solve the above-described problem, according to one aspect of the present invention, a circuit board on which electronic components are mounted and a first board holding unit that is provided on one side edge of the circuit board and holds the circuit board. There is provided a circuit board support structure including a member and an elastic deformation portion that is provided integrally with the first board holding member and imparts an elastic force in a surface direction of the circuit board.

  Further, the elastic deformation portion may be constituted by a cantilever spring provided integrally with the first substrate holding member.

  The first board holding member may be provided with an engagement hole into which a side edge of the circuit board is inserted.

  A second substrate holding member that is provided on the other side edge of the circuit board facing the one side edge and holds the circuit board; An elastic force may be applied toward the other side edge.

  The second substrate holding member may include a holding groove into which the circuit board is inserted.

  In order to solve the above-described problem, according to another aspect of the present invention, a circuit board on which electronic components are mounted, an image sensor that is electrically connected to the circuit board and forms a subject image, and A first board holding member that is provided on one side edge of the circuit board and that holds the circuit board; and a first board holding member that is provided integrally with the first board holding member, and exerts an elastic force in a surface direction of the circuit board. An imaging device including an elastic deformation portion to be provided is provided.

  Further, the elastic deformation portion may be constituted by a cantilever spring provided integrally with the first substrate holding member.

  The first board holding member may be provided with an engagement hole into which a side edge of the circuit board is inserted.

  A second substrate holding member that is provided on the other side edge of the circuit board facing the one side edge and holds the circuit board; An elastic force may be applied toward the other side edge.

  The second substrate holding member may include a holding groove into which the circuit board is inserted.

  According to the present invention, it is possible to reliably hold the circuit board on which the electronic component is mounted in a direction orthogonal to the surface direction.

It is a disassembled perspective view for demonstrating the structure of the imaging device concerning one Embodiment of this invention. It is a perspective view which shows the state which removed the upper cover of the imaging device, Comprising: It is a schematic diagram which shows the state with which the front panel and the rear panel were fixed in the state which interposed the multilayer flexible substrate in between. It is a top view which shows the structure of a multilayer flexible substrate. It is a perspective view which shows the state by which the multilayer flexible substrate was bent by the 1st flexible cable part, the 2nd flexible cable part, and the 3rd flexible cable part. It is a top view which shows the structure of a board | substrate support member, Comprising: It is the schematic diagram which shows the state which looked at the board | substrate support member from the upper side of FIG. It is a perspective view which shows the state which looked at the board | substrate support member from diagonally upper side. FIG. 6 is a schematic diagram showing a cross section taken along the alternate long and short dash line I-I ′ in FIG. 5 in a state where the upper case is covered. It is a disassembled perspective view for demonstrating the structure of the imaging device which concerns on 2nd Embodiment. It is a top view which shows the structure of the board | substrate support member in 2nd Embodiment, Comprising: It is the schematic diagram which shows the state which looked at the board | substrate support member from the upper side of FIG. It is a side view of the board | substrate support member which concerns on 2nd Embodiment. It is a top view which shows the state which looked at the board | substrate support member which concerns on 2nd Embodiment from the lower side of FIG.

Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol. The description will be given in the following order.
1. First Embodiment [1] Configuration of Imaging Device According to First Embodiment [2] Configuration of Multilayer Flexible Substrate [3] Multilayer Flexible Substrate Support Structure at Lower Case [4] Multilayer Flexible Substrate at Upper Case 1. Support structure of Second Embodiment [1] Configuration of Imaging Device According to Second Embodiment

1. First Embodiment [1] Configuration of Imaging Device According to First Embodiment of Present Invention FIG. 1 is an exploded perspective view for explaining the configuration of an imaging device 100 according to the first embodiment of the present invention. is there. The image pickup apparatus 100 is provided in an inspection apparatus such as an electronic component mounting machine or a semiconductor manufacturing apparatus, for example, and detects the position of a fine product to be supplied, or picks up an image of the product and determines its quality.

  As shown in FIG. 1, the imaging apparatus 100 mainly includes a front panel 110, a rear panel 120, and an upper case 130. The front panel 110 and the rear panel 120 are formed by, for example, aluminum die casting. The upper case 130 is formed by bending an aluminum plate. In the imaging apparatus 100, the front panel 110 and the rear panel 120 are screwed at a part where the front panel 110 and the rear panel 120 are abutted, and the upper case 130 is screwed so as to cover an open part formed between the front panel 110 and the rear panel 120. As a result, the imaging apparatus 100 includes a sealed casing. A multilayer flexible substrate 150 is disposed in the open part. FIG. 2 is a perspective view showing a state in which the upper cover 130 of the imaging apparatus 100 is removed, and shows a state in which the front panel 110 and the rear panel 120 are fixed with the multilayer flexible substrate 150 interposed therebetween. ing.

  The front panel 110 includes a panel portion 112 and a base portion 114 integrally formed orthogonally from the panel portion 112 and has a substantially L shape when viewed from the side. The front panel 110 is formed with a rectangular imaging opening so as to penetrate the center portion, and a cylindrical lens mounting that allows various lens barrels to be attached to and detached from the outer surface around the imaging opening by, for example, a C-mount method. The part 116 is integrally formed.

  The imaging apparatus 100 is fixed to the front panel 110 and the rear panel 120 and positioned by the positioning member 140, and the multilayer flexible substrate 150 is attached thereto. Hereinafter, the configuration of the multilayer flexible substrate 150 will be described with reference to FIGS. 3 and 4.

[2] Configuration of Multilayer Flexible Substrate FIG. 3 is a plan view showing the configuration of the multilayer flexible substrate 150. FIG. 4 is a perspective view showing a state in which the multilayer flexible substrate 150 is bent by the flexible cable portion 155, the flexible cable portion 156, and the flexible cable portion 157 for insertion between the front panel 110 and the rear panel 120. is there.

  As shown in FIGS. 3 and 4, the multi-layer flexible substrate 150 includes four substrate portions of a first substrate 151, a second substrate 152, a third substrate 153, and a fourth substrate 154. . The multilayer flexible substrate 150 has an integrated structure in which four substrate portions are connected by a first flexible cable portion 155, a second flexible cable portion 156, and a third flexible cable portion 157, respectively. In the multilayer flexible substrate 150, the substrate portions 151 to 154 are formed so that their outer shapes are slightly smaller than the outer shapes of the panel portion 112 and the rear panel 120 of the front panel 110.

  The multilayer flexible substrate 150 is formed by multilayerly forming each layer in which predetermined circuit patterns made of copper foil are formed on a film material made of, for example, a polyimide resin. As shown in FIGS. 1 and 2, electronic components such as chip components are appropriately mounted on the front and back main surfaces of the substrate portions 151 to 154. Each flexible cable part 155-157 is comprised from the flexible printed circuit board which has flexibility, such as a polyimide resin, for example.

  As shown in FIG. 4, a CCD image sensor unit 162 is mounted on the first substrate 151 via a mounting bracket 160 on one main surface. As shown in FIGS. 3 and 4, the first substrate 151 has a pair of engaging protrusions 151 a spaced apart in the width direction on one side edge positioned upward in the state of being housed in the housing. 151b protrudes integrally. A substrate support member 170 (to be described later) is attached to the engaging convex portions 151a and 151b. In the first substrate 151, a recess 151c is formed on the other side edge positioned below in the state of being housed in the housing, and the first flexible cable portion 155 is drawn from the recess 151c. . The recess 151c acts as a relief when the first flexible cable portion 155 is routed toward the rear panel 120 side.

  The CCD image sensor unit 162 is positioned and attached to the mounting bracket 160 with high accuracy, and the mounting bracket 160 is screwed to a mounting boss 112a (see FIG. 1) formed on the panel portion 112 of the front panel 110. Fixed. The first substrate 151 is mounted by soldering after the terminal holes are inserted into the connection terminals of the CCD image sensor unit 162.

  The first substrate 151 is assembled in a state of being positioned on the panel portion 112 of the front panel 110 and fixed by a set screw screwed into an attachment boss 112 a provided on the panel portion 112. In the first substrate 151, the concave portion 151c forms a gap with the base portion 114, and the first flexible cable portion 155 is bent through the gap and pulled out to the rear panel 120 side.

  As shown in FIG. 3, the 1st flexible cable part 155 is pulled out from the side edge side which opposes one side edge in which the engagement convex parts 151a and 151b were provided. The second substrate 152 is connected to the first substrate 151 via the first flexible cable portion 155. The second substrate 152 is formed with a concave portion 152a positioned below in the state of being housed in the housing. The concave portion 152a serves as an escape portion for routing the first flexible cable portion 155. On the other hand, the second flexible cable portion 156 is drawn out from the side edge facing the concave portion 152a of the second substrate 152, that is, the side edge located above in the state of being housed in the housing. On the side edge of the second substrate 152 facing the concave portion 152a, a concave portion 152b serving as a relief portion of the second flexible cable portion 156 is formed.

[3] Supporting structure of multilayer flexible board in lower part of casing The positioning member 140 is a member fixed on the base 114, and the second board 152 is inserted into the upper surface thereof as shown in FIG. Holding grooves 140a and 140b and holding grooves 140c and 140d into which the third substrate 153 is inserted are provided. The holding grooves 140a and 140b and the holding grooves 140c and 140d are formed in parallel to each other.

  The second substrate 152 is formed with a pair of engaging convex portions 152c and 152d that are spaced apart in the width direction across the concave portion 152a. In the second substrate 152, the first engaging convex portion 152c is relatively engaged with the first holding groove 140a of the positioning member 140, and the second engaging convex portion 152d is engaged with the second holding groove 140b. Relatively engaged. The second substrate 152 has a thickness substantially equal to the groove width of the holding grooves 140 a and 140 b of the positioning member 140. Therefore, when the engaging protrusions 152c and 152d of the second substrate 152 are inserted into the holding grooves 140a and 140b, the position of the second substrate 152 with respect to the positioning member 140 is accurately defined.

  Further, the second substrate 152 is formed with a pair of engaging convex portions 152e and 152f that are spaced apart in the width direction with the concave portion 152b interposed therebetween. As will be described later, the two engagement holes 174 of the substrate support member 170 are inserted into the engagement convex portions 152e and 152f.

  As shown in FIG. 3, the third substrate 153 is formed symmetrically with the second substrate 152. In the third substrate 153, the second flexible cable portion 156 is connected to one side edge located above in the state of being housed in the housing, and the third substrate 153 connects the second flexible cable portion 156. Via the second substrate 152. In the third substrate 153, a recess 153a is formed at a side edge located above in the state of being housed in the housing. The concave portion 153a serves as an escape portion for routing the second flexible cable portion 156.

  A third flexible cable portion 157 is drawn out from the side edge located below the third substrate 153 in the state of being housed in the housing. The third substrate 153 is formed with a recess 153b that serves as a relief portion of the third flexible cable portion 157 at the side edge. The third substrate 153 is formed with a pair of engaging convex portions 153c and 153d that are spaced apart in the width direction across the concave portion 153b. As will be described later, in the third substrate 153, the first engagement convex portion 153c is relatively engaged with the third holding groove 140c of the positioning member 140, and the second engagement convex portion 153d is the fourth. Relative to the holding groove 140d. The third substrate 153 also has a thickness substantially equal to the groove width of the holding grooves 140c and 140d of the positioning member 140. Therefore, the engagement protrusions 153c and 153d of the third substrate 153 are inserted into the holding grooves 140c and 140d, whereby the position of the third substrate 153 with respect to the positioning member 140 is accurately defined.

  The third substrate 153 is formed with a pair of engaging convex portions 153e and 153f that are spaced apart in the width direction with the concave portion 153a interposed therebetween. As will be described later, two engagement holes 176 of the board support member 170 are inserted into the engagement convex portions 153e and 153f.

  As shown in FIGS. 3 and 4, the fourth substrate 154 has a third flexible cable portion 157 connected to one side edge located below in the state of being housed in the housing, and the third flexible cable. The third substrate 153 is connected to the third substrate 153 through the portion 157. In the fourth substrate 154, a recess 154a is formed on the side edge located below in the state of being housed in the housing. The recessed portion 154a serves as an escape portion for routing the third flexible cable portion 157. The fourth substrate 154 is positioned and fixed to the surface of the rear panel 120 on the front panel 110 side.

  In the imaging device 100, as described above, the first substrate 151 disposed on both sides of the multilayer flexible substrate 150 is positioned and fixed on the front panel 110 side, and the fourth substrate 154 is positioned and fixed on the rear panel 120. . In the imaging apparatus 100, the second substrate 152 and the third substrate 153 arranged in the middle of the multilayer flexible substrate 150 are positioned by the positioning member 140 fixed to the base portion 102b.

  As described above, the multilayer flexible substrate 150 has the first substrate 151 positioned and fixed to the front panel 110 and the second flexible cable 150 is bent with respect to the first substrate 151 by bending the first flexible cable portion 155. The substrate 152 is opposed. The second substrate 152 is assembled to the positioning member 140 in a state of being upright with respect to the base portion 102b with the side edge provided with the recess 152a facing down.

  The multilayer flexible substrate 150 is assembled by positioning the second substrate 152 on the base portion 102 b via the positioning member 140. Thereafter, the second flexible cable portion 156 is curved along the concave portion 152b as shown in FIG. 4 so that the third substrate 153 is opposed to the second substrate 152. As shown in FIG. 4, the third substrate 153 is assembled to the positioning member 140 in a state of being upright with respect to the base portion 102 b with the side edge provided with the recess 153 b facing down. Therefore, the third substrate 153 is assembled to the base portion 102 b so as to face the second substrate 152 in parallel through the positioning member 140.

  The multilayer flexible substrate 50 is assembled in the state where the substrate portions 151 to 154 face each other in parallel between the panel portion 112 of the front panel 110 and the rear panel 120 through the above-described operation. In the multilayer flexible substrate 150, the distance between the intermediate second substrate 152 and the third substrate 153 is defined via the positioning member 140.

  As described above, in the multilayer flexible substrate 150, the first substrate 151 and the second substrate 152 are disposed to face each other, and the second substrate 152 and the third substrate 153 are disposed to face each other. In the lower part of the multilayer flexible substrate 150, the distance between the second substrate 152 and the third substrate 153 is defined by the positioning member 140. The first substrate 151 is fixed to the panel portion 112 of the front panel 110, and the positioning member 140 that holds the second substrate 152 is fixed to a predetermined position on the base portion 114 of the front panel 110. A relative position between the substrate 151 and the second substrate 152 is also defined.

[4] Supporting Structure of Multilayer Flexible Substrate at Upper Case Next, a structure for supporting the multilayer flexible substrate 150 at the upper part of the casing will be described. As shown in FIG. 1, a substrate support member 170 is disposed on the multilayer flexible substrate 150. The substrate support member 170 is made of, for example, a resin material, and defines an interval between the first substrate 151 and the second substrate 152 and an interval between the second substrate 152 and the third substrate 153 in the upper part of the housing. To do.

  As shown in FIG. 1, the substrate support member 170 is disposed on the upper edge of each of the substrates 151, 152, and 153 of the multilayer flexible substrate 150 with the multilayer flexible substrate 150 disposed between the front panel 110 and the rear panel 120. The

  FIG. 5 is a plan view showing a configuration of the substrate support member 170, and shows a state in which the substrate support member 170 is viewed from the upper side of FIG. FIG. 6 is a perspective view showing a state in which the substrate support member 170 is viewed obliquely from above. As shown in FIGS. 5 and 6, the substrate support member 170 is provided with engaging holes 172, 174, and 176 that pass therethrough. The positions of the two engagement holes 172 are provided corresponding to the engagement protrusions 151a and 151b of the first substrate 151 of the multilayer flexible substrate 150, and are inserted into the engagement protrusions 151a and 151b, respectively. . As described above, since the first substrate 151 is fixed to the panel portion 112 of the front panel 110, the substrate support member 170 is inserted into the engagement convex portions 151a and 151b, so that the position of the substrate support member 170 is changed. Confirmed.

  The positions of the two engagement holes 174 are provided corresponding to the engagement protrusions 152e and 152f of the second substrate 152 of the multilayer flexible substrate 150, and are inserted into the engagement protrusions 152e and 152f, respectively. Is done. Accordingly, the two engagement holes 172 are inserted into the engagement protrusions 151a and 151b, and the two engagement holes 174 are inserted into the engagement protrusions 152e and 152f. The position of the second substrate 152 with respect to the substrate 151 is determined.

  The two engagement holes 176 are provided at positions corresponding to the engagement protrusions 153e and 153f of the third substrate 153 of the multilayer flexible substrate 150, and are inserted into the engagement protrusions 153e and 153f, respectively. Is done. Accordingly, the two engagement holes 174 are inserted into the engagement protrusions 152e and 152f, and the two engagement holes 176 are inserted into the engagement protrusions 153e and 153f. The position of the third substrate 153 with respect to the substrate 152 is determined.

  As described above, by engaging the substrate support member 170 with the side edge located on the upper side of the housing of each of the substrates 151, 152, 153, the positions of the substrates 152, 153 are determined at the upper part of the housing. be able to. In particular, the position in the direction (plane perpendicular direction) orthogonal to the surface direction of each of the substrates 152 and 153 can be determined. Therefore, each of the substrates 151, 152, 153 can be reliably supported by the positioning member 140 at the lower part of the casing and the substrate support member 170 at the upper part of the casing, and the distance between the substrates 151, 152, 153, 154 is determined. Can be defined accurately. Thereby, it can avoid reliably that the electronic components mounted in each board | substrate 151,152,153,154 are interfered, and the malfunction etc. resulting from the contact of electronic components can be suppressed.

  As shown in FIGS. 5 and 6, a flexible spring portion 178 is provided on the upper surface of the substrate support member 170. In addition, a protrusion 179 is provided on the upper surface of the spring portion 178. The engagement hole 174 and the engagement hole 176 described above are connected via a hole formed at the tip of the spring portion 178.

  As described above, the substrate support member 170 is attached to the upper edge of the multilayer flexible substrate 150. In the substrate support member 170, the two engagement holes 172 of the substrate support member 170 are inserted into the engagement convex portions 151a and 151b. The two engagement holes 174 are inserted into the engagement protrusions 152e and 152f, respectively, and the two engagement holes 176 are inserted into the engagement protrusions 153e and 153f, respectively.

  Then, by covering the upper case 130 over the substrate support member 170, the multilayer flexible substrate 150 and the substrate support member 170 are covered with the upper case 130. FIG. 7 is a schematic diagram showing a cross section taken along the alternate long and short dash line I-I ′ in FIG. 5 in a state where the upper case 130 is covered.

  As shown in FIG. 7, the engagement holes 174 of the substrate support member 170 are inserted with the engagement protrusions 152e and 152f of the second substrate 152, and the second substrate adjacent to the engagement protrusions 152e and 152f. The upper end surface of 152 is in contact with the substrate support member 170.

  On the other hand, the protrusion 179 provided on the upper surface of the spring portion 178 of the substrate support member 170 is in contact with the lower surface of the upper case 130. For this reason, the flexible spring portion 178 is elastically deformed downward by a predetermined amount. At this time, the thickness and width of the spring portion 178 are defined so that the force generated by the elastic deformation of the spring portion 178 has a value of, for example, about 500 gf to 800 gf. Accordingly, the second substrate 152 receives a downward force due to the elastic force of the spring portion 178 and is supported while being sandwiched between the upper case 130 and the positioning member 140.

  As a result, the second substrate 152 is held by the positioning member 140 and the substrate support member 170 in the direction orthogonal to the surface direction (the direction of light incident on the CCD image sensor unit 162). Further, the second substrate 152 is sandwiched between the upper case 130 and the positioning member 140 via the substrate support member 170 in the surface direction (vertical direction).

  The third substrate 153 is also held in the same manner as the second substrate 152. The engagement protrusions 153e and 153f of the third substrate 153 are inserted into the engagement holes 176 of the substrate support member 170, and the upper end surface of the third substrate 153 adjacent to the engagement protrusions 153e and 153f is the substrate support. It will be in the state contact | abutted to the member 170. FIG. For this reason, the third substrate 153 receives a downward force due to the elastic force of the spring portion 178 and is supported in a state of being sandwiched between the substrate support member 170 and the positioning member 140.

  As described above, if the position of each substrate is not precisely defined, in the assembly process of placing the multilayer flexible substrate 150 in the housing and covering the upper case 130, the interval between the substrates 151, 152, 153, 154 is set. It is conceivable that variations occur, and electronic components arranged opposite to each substrate interfere with each other. Furthermore, if a strong impact or the like is applied to the imaging apparatus 100 in a state where the electronic components interfere with each other, it is assumed that problems such as peeling of the electronic components from the substrate occur.

  According to the present embodiment, the substrate support member 170 is engaged with the first substrate 151 fixed to the front panel 110 in the upper part of the housing, and the second substrate 152 and the third substrate 153 are engaged. Is also engaged with the substrate support member 170. For this reason, the position of the direction orthogonal to the surface direction of each board | substrate 151,152,153 can be prescribed | regulated accurately. In the vertical direction, the substrate support member 170 generates an elastic force downward due to the elastic deformation of the spring portion 178 of the substrate support member 170, so that the substrates 152 and 153 are sandwiched between the upper case 130 and the positioning member 140. . Therefore, the multilayer flexible substrate 150 can be reliably held in a state where the distances between the substrates 151, 152, 153, and 154 of the multilayer flexible substrate 150 are accurately maintained. Accordingly, even when an impact, vibration, or the like is applied to the imaging apparatus 100, the distance between the substrates 151, 152, 153, 154 can be accurately maintained, and the substrates 151, 152, 153, 154 can be maintained. The electronic components can be prevented from interfering with each other. In addition, since the engagement protrusions 152e, 152f, 153e, and 153f are inserted into the engagement holes 172 and 174 in the substrate support member 170, the substrate support member 170 is compared with the case where a holding groove that does not penetrate is provided. Can be made sufficiently thin. Therefore, the space efficiency in the imaging device 100 can be increased, and as a result, the imaging device 100 can be reduced in size.

  As described above, according to the first embodiment, in the imaging apparatus 100 including the multilayer flexible substrate 150, the position of each substrate in the direction perpendicular to the surface is defined and the position in the surface direction of each substrate is supported by elastic force. A substrate support member 170 is provided. As a result, it is possible to accurately maintain the interval between the substrates constituting the multilayer flexible substrate 150 with a small number of components and to reliably support the substrates.

2. Second Embodiment [1] Configuration of Imaging Device According to Second Embodiment of Present Invention Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is an exploded perspective view for explaining the configuration of the imaging apparatus 100 according to the second embodiment. The second embodiment is different from the first embodiment in that the multilayer flexible substrate 150 is composed of three substrate portions, but the other configurations are the same as those of the first embodiment.

  Specifically, in the second embodiment, the multilayer flexible substrate 150 includes three substrate portions: a first substrate 151, a second substrate 152, and a third substrate 153. Similar to the first embodiment, the first substrate 151 is positioned and attached to the panel portion 112 of the front panel 110. In the second embodiment, the third substrate 153 is positioned and fixed to the surface of the rear panel 120 on the front panel 110 side. Therefore, in the imaging device 100 of the second embodiment, the first substrate 151 of the multilayer flexible substrate 150 is positioned and fixed on the front panel 110 side, and the third substrate 153 is positioned and fixed on the rear panel 120. In the second embodiment, only the second substrate 152 disposed in the middle of the multilayer flexible substrate 150 is positioned by the positioning member 140 fixed to the base portion 102b and the substrate support member 170.

  FIG. 9 is a plan view showing the configuration of the substrate support member 170 in the second embodiment, and shows a state in which the substrate support member 170 is viewed from the upper side of FIG. 10 is a side view of the substrate support member 170, and FIG. 11 is a plan view showing the substrate support member 170 as viewed from the lower side of FIG.

  The board support member 170 is provided with engagement holes 174 and 176 as in the first embodiment. The positions of the two engaging holes 174 are provided corresponding to the engaging convex portions 152e and 152f of the second substrate 152 of the multilayer flexible substrate 150, and are inserted into the engaging convex portions 152e and 152f, respectively. . The two engagement holes 176 are provided at positions corresponding to the engagement protrusions 153e and 153f of the third substrate 153 of the multilayer flexible substrate 150, and are inserted into the engagement protrusions 153e and 153f, respectively. Is done. Accordingly, the two engagement holes 174 are inserted into the engagement protrusions 152e and 152f, and the two engagement holes 176 are inserted into the engagement protrusions 153e and 153f. The position of the second substrate 152 with respect to the substrate 153 is determined.

  In the second embodiment, the third substrate 153 is positioned and fixed to the rear panel 120. Therefore, when the position of the second substrate 152 with respect to the third substrate 153 is determined, the second substrate 152 is positioned and fixed with respect to the rear panel 120. Thereby, the position of the second substrate 152 can be fixed.

  Accordingly, the substrate support member 170 in the second embodiment is not provided with the two engagement holes 172 inserted into the engagement convex portions 151a and 151b. For this reason, the substrate support member 170 in the second embodiment has a width in a direction perpendicular to the surface direction of the first substrate 151 or the second substrate 152 compared to the substrate support member 170 in the first embodiment. Is narrower. Thereby, the space efficiency in the imaging device 100 can be further increased, and as a result, further downsizing of the imaging device 100 can be achieved.

  The configurations of the spring portion 178 and the projection portion 179 of the substrate support member 170 are the same as those in the first embodiment. Similar to the first embodiment, when the upper case 130 is covered, the spring portion 178 is elastically deformed downward by a predetermined amount. As a result, the second substrate 152 receives a downward force due to the elastic force of the spring portion 178 and is supported while being sandwiched between the upper case 130 and the positioning member 140.

  Therefore, in the second embodiment, the substrate support member 170 is engaged with the third substrate 153 fixed to the rear panel 120 in the upper part of the housing, and the substrate support member 170 is also applied to the second substrate 152. Is engaged. For this reason, the position of the direction orthogonal to the surface direction of each board | substrate 151,152,153 can be prescribed | regulated accurately. With respect to the vertical direction, the substrate support member 170 generates an elastic force downward due to elastic deformation of the spring portion 178 of the substrate support member 170, so that the substrate 152 is sandwiched between the upper case 130 and the positioning member 140. Therefore, the multilayer flexible substrate 150 can be reliably held in a state where the distance between the substrates 151, 152, 153 of the multilayer flexible substrate 150 is accurately maintained. Accordingly, even when an impact, vibration, or the like is applied to the imaging apparatus 100, the distance between the substrates 151, 152, and 153 can be accurately maintained, and the electronic components of the substrates 151, 152, and 153 can be maintained. Interfering with each other can be suppressed.

  As described above, in the first embodiment, the positions of the two substrates 152 and 153 are defined by the substrate support member 170, but in the second embodiment, the position of the one substrate 152 is defined by the substrate support member 170. Yes. Thus, by providing the required number of engagement holes in the substrate support member 170, it is possible to define the position of one or more substrates.

  As described above, also in the second embodiment, by providing the substrate support member 170 having the spring portion 178, the interval between the substrates constituting the multilayer flexible substrate 150 is accurately maintained, and each substrate is reliably secured. It becomes possible to support.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

DESCRIPTION OF SYMBOLS 100 Imaging device 140 Positioning member 150 Multilayer flexible substrate 151 First substrate 152 Second substrate 153 Third substrate 170 Substrate support member

Claims (10)

A circuit board on which electronic components are mounted;
A first board holding member that is provided on one side edge of the circuit board and holds the circuit board;
An elastic deformation portion that is provided integrally with the first substrate holding member and applies an elastic force in a surface direction of the circuit board;
A circuit board support structure comprising:   2. The circuit board support structure according to claim 1, wherein the elastically deforming portion includes a cantilever spring provided integrally with the first substrate holding member.   The circuit board support structure according to claim 1, wherein the first board holding member is provided with an engagement hole into which a side edge of the circuit board is inserted. A second board holding member that is provided on the other side edge of the circuit board facing the one side edge and holds the circuit board;
The circuit board support structure according to claim 1, wherein the elastically deforming portion applies an elastic force from the one side edge toward the other side edge.   The circuit board support structure according to claim 1, wherein the second board holding member includes a holding groove into which the circuit board is inserted. A circuit board on which electronic components are mounted;
An image sensor that is electrically connected to the circuit board and forms a subject image;
A first board holding member that is provided on one side edge of the circuit board and holds the circuit board;
An elastic deformation portion that is provided integrally with the first substrate holding member and applies an elastic force in a surface direction of the circuit board;
An imaging apparatus comprising:   The imaging apparatus according to claim 6, wherein the elastically deforming portion includes a cantilever spring provided integrally with the first substrate holding member.   The imaging apparatus according to claim 6, wherein the first board holding member is provided with an engagement hole into which a side edge of the circuit board is inserted. A second board holding member that is provided on the other side edge of the circuit board facing the one side edge and holds the circuit board;
The imaging device according to claim 6, wherein the elastic deformation portion applies an elastic force from the one side edge toward the other side edge.   The imaging apparatus according to claim 6, wherein the second substrate holding member includes a holding groove into which the circuit board is inserted.

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