JP2011232177A - Probe microscope and frictional sliding, cmp, and hard disk inspection device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow measurement even in the case that the center of gravity of a material is deviated from a center of a flat spring for detection or the flat spring is deformed.SOLUTION: A scanning probe microscope S1 includes: a flat spring 3 having a first sample 1 installed at a front end thereof; a fixing member 14 which fixes a base end of the flat spring 3; a stage 15 which has a second sample 2 fixed thereon; an optical system 18 for detecting displacement of the flat spring 3, which detects reflected light of detecting light radiated from a light source 16 to the flat spring 3, by a photodetector 17; a sample interval adjustment mechanism 19 which moves the stage 15 or the flat spring 3 to bring the first and second samples 1 and 2 close to or away from each other; a horizontal scanning mechanism 20 which measures friction between the first and second samples 1 and 2; and a vertical scanning mechanism 21 which measures at least one of adsorption, agglutination, and reaction between the first and second samples 1 and 2. The scanning probe microscope S1 includes a rotating mechanism 22 for rotating the fixing member 14 which changes inclination of the flat spring 3 with which an optical axis of detecting light r11 is aligned, at an arbitrary angle with respect to the stage 15.

Description

  The present invention relates to a probe microscope that measures the interaction between two kinds of substances, and in particular, can measure the physical properties of a sliding member such as a transmission, CMP, a hard disk, and a polishing member to estimate these characteristics. The present invention relates to a probe microscope that can be used, and a friction sliding / CMP / hard disk inspection apparatus including the same.

  The scanning probe microscope generates a local stimulus of contact or non-contact from the probe to the sample when the probe is scanned relative to the sample in a state where the probe and the sample are brought close to each other. A microscope that observes the surface of a sample by measuring the local response from the sample surface to a stimulus. Scanning probe microscopes have different measurement methods for their physical quantities, so scanning tunneling microscopes that detect the current flowing between the probe and the sample, and atomic force microscopes that detect various forces acting between the sample surface and the probe, Many types of microscopes for measuring friction force, viscosity, elasticity, electric potential and the like on the sample surface have been put into practical use, including a magnetic force microscope for measuring the magnetic distribution on the sample surface.

This microscope mainly uses a measurement method that utilizes the bending of the spring element that supports the measurement probe due to the force acting between the sample and the probe. As the control means, the back of the cantilever probe is irradiated with laser light, and the optical lever method and the light wave interference method that use the fact that the optical axis of the reflected light changes due to the deflection of the cantilever probe are used. Has been.
FIG. 12 shows a conventional optical lever type microscope 300.
In the microscope 300, a probe (cantilever) 313 is disposed at the tip of a leaf spring 303, and a sample 302 is fixed to a sample table 315. Then, a local stimulus is generated in the sample 302 by the probe 313 attached to the tip of the leaf spring 303, and the laser beam r100 reflected from the leaf spring 303 at that time is detected by the four-divided position detector 307, and the sample 302 is detected. Observe the surface.

  The microscope has a leaf spring 303 with a probe 313 attached to the tip, a semiconductor laser 304 that emits laser light r10, a lens 305 that focuses the emitted laser light r100 toward the leaf spring 303, and a reflection by the leaf spring 303. A mirror 306 that reflects the laser beam r100, a quadrant position detector 307 that detects the laser beam r100 reflected by the leaf spring 303, a preamplifier 308, a Z-axis servo system 309 that controls scanning in the Z-axis direction (vertical direction), horizontal X, Y raster scan system 310 that controls scanning in the direction, piezo element 311 that imparts minute movement in the vertical direction (Z-axis direction) to sample 302, and step of moving sample 302 in the vertical direction (Z-axis direction) An in-motor 312 is included.

When measuring the sample 302, the leaf spring 303 generates local stimulation on the sample 302, so that the leaf spring 303 is twisted due to the displacement in the vertical direction to the leaf spring 303 and the friction between the sample 302 and the probe 313. A horizontal displacement of the leaf spring 303 occurs. The laser beam r100 from the semiconductor laser 304 is reflected by the back surface of the leaf spring 303 and detected by the quadrant position detector 307. Therefore, the vertical and horizontal displacements of the leaf spring 303 are detected by the quadrant position detector 307. It is calculated | required from a signal (refer patent document 1).
In a scanning tunneling microscope that detects a current flowing between a probe and a sample, an image is collected by scanning a piezo attached to the probe side.

On the other hand, many atomic force microscopes using an optical lever system are provided with piezoelectric elements in the X, Y, and Z directions on the sample 302 side as shown in FIG.
In the atomic force microscope, since a piezo element having a large movable range is mounted, the followability between the probe and the sample is deteriorated. In order to avoid this, there is an example in which X, Y, and Z piezos are provided on the base material of the probe (cantilever) 313. Among those in which X, Y, and Z piezos are provided on the base material of the probe (cantilever) 313, there is an example in which the probe 313 performs a small turning operation so that the surface of the sample is traced in the shape of "". It is disclosed (Patent Document 2).

  In addition, the probe 313 used for these generally has a shape having excellent symmetry such as a columnar shape, a conical shape, a cylindrical shape, a planar shape, a triangular pyramid, a regular tetrahedron, a needle shape, and a spherical shape. Furthermore, an example in which spherical particles having a sphericity of 0.75 or more are adhered to the tip of an AFM (Atomic Force Microscope) probe (Patent Document 3), or a minute spherical particle having a particle size of several tens of microns or less is adhered. An example (Patent Document 4) is also disclosed. These probes always have a center of gravity on the centerline of the leaf spring. This is because the leaf spring is indispensable in order to avoid horizontal misalignment when the leaf spring approaches the sample horizontally or vibrates up and down.

JP-A-6-241762 JP 2008-191062 A JP 2002-62253 A JP 2009-115533 A

  In the drive system used in a conventional optical lever microscope, the usable probe has excellent symmetry in shape, the center of gravity of the probe is on the center line of the leaf spring, and its size is There were restrictions such as being small enough and light enough not to distort the leaf spring. However, actual materials such as sliding members and abrasive members used in various products are complex in shape, such as porous bodies, polycrystalline bodies, aggregates, and those with grooves in specific locations. In many cases, it is indeterminate and asymmetric, and the center of gravity is greatly deviated from the center of the material or the weight is large.

If these actual materials are attached to a leaf spring and are to be used in place of the probe, it is difficult to attach the center of gravity of the material on the center line of the leaf spring, and the leaf spring is twisted. Alternatively, there is a problem that the leaf spring hangs down due to its large weight.
In such a deformed leaf spring, there is a problem that even if the back surface of the leaf spring is irradiated with laser light, the reflected light is scattered and cannot be collected, or cannot be detected by a detector.

  In view of the above situation, the present invention includes a probe microscope capable of performing accurate measurement even when the center of gravity of the material deviates from the center of the leaf spring for detection or the leaf spring hangs down due to the weight of the material, and the probe microscope. The object is to provide a friction sliding / CMP / hard disk inspection device.

  In order to achieve the above object, a scanning probe microscope according to the first aspect of the present invention fixes a leaf spring having a first sample attached to a tip portion and an end portion of the leaf spring opposite to the tip portion. A fixing member to be fixed, a sample stage to which the second sample is fixed, an optical axis of detection light generated from a light source is applied to a tip portion of the leaf spring or a portion following the displacement of the leaf spring, and the reflected light is A displacement detection optical system of the leaf spring to be detected by a photodetector; a sample interval adjustment mechanism for moving the sample stage or the leaf spring to bring the first sample and the second sample closer to or away from each other; Measuring at least one of a horizontal scanning mechanism for measuring friction between the first sample and the second sample, and adsorption, adhesion and repulsion between the first sample and the second sample Scanning probe microscope with vertical scanning mechanism In order to change the inclination of a leaf spring attached to the tip of the first sample of the portion to which the optical axis of the detection light generated from the light source is applied at an arbitrary angle with respect to the sample stage A rotating mechanism for rotating the fixing member.

  The inspection apparatus for frictional sliding according to the second aspect of the present invention includes the scanning probe microscope according to the first aspect of the present invention, and includes at least one of the sliding members frictionally sliding with each other. Attach to the tip of the leaf spring so that the sliding surface sliding with respect to the other sliding member is the lower surface, and fix the other sliding member on the sample table, The sample interval adjusting mechanism applies a constant load between the one sliding member attached to the tip of the leaf spring and the other sliding member, and the horizontal scanning mechanism is used to The friction characteristic between the pair of sliding members is measured by horizontally scanning the other sliding member.

  A CMP inspection apparatus according to a third aspect of the present invention includes the scanning probe microscope according to the first aspect of the present invention, and is for chemically and mechanically polishing and smoothing a semiconductor wafer and the surface of the semiconductor wafer. Of the abrasive grains contained in the CMP slurry to be used, a CMP pad for polishing the surface of the semiconductor wafer by rotating it under a constant load, and a CMP dress for cleaning the CMP pad At least one is attached to the tip of the leaf spring and a member different from the member attached to the tip of the leaf spring is fixed on the sample stage, and the sample stage is moved by the horizontal scanning mechanism or the vertical scanning mechanism. By scanning a member on the surface, at least one of friction, adsorption, adhesion, and repulsion is measured.

  A hard disk inspection apparatus according to a fourth aspect of the present invention includes a scanning probe microscope according to the first aspect of the present invention, and a magnetic recording apparatus for writing data by levitating a head for a hard disk from a magnetic recording medium at a constant interval. One of the head and the magnetic recording medium is attached to the tip of the leaf spring, and the other member is fixed on the sample stage, and the horizontal scanning mechanism or the vertical scanning mechanism By scanning a member on the sample stage, at least one of friction, adsorption, adhesion, and repulsion is measured.

  According to the present invention, the probe microscope capable of accurate measurement even when the center of gravity of the material is shifted from the center of the leaf spring for detection or the leaf spring hangs down due to the large weight of the material, and the frictional slide including the probe microscope are provided. A dynamic / CMP / hard disk inspection device can be realized.

It is a notional block diagram which shows the interaction measuring apparatus which shows an example of embodiment of this invention. (a) is a view in the direction of arrow A in FIG. 1 showing a state in which the tip end side of a leaf spring to which a sample a of an example of the embodiment is attached is deformed downward by the weight of the sample a. It is an A direction arrow directional view which shows the state which leveled the leaf | plate spring deform | transformed with the weight of the sample a of embodiment. (a) is a view in the direction of arrow B in FIG. 1 showing a state where the center of gravity of the sample a attached to the tip of the leaf spring of the interaction measuring apparatus of the embodiment of FIG. 1 is on the left side of the center line of the leaf spring. (B) is a B direction in FIG. 1 showing a state in which the center of gravity of the sample a attached to the tip of the leaf spring of the interaction measuring device in (a) is on the right side of the center line of the leaf spring. It is an arrow view, (c) is a B direction arrow view of FIG. 1 which shows the state which leveled the deformed leaf | plate spring of the interaction measuring apparatus of (a), (b). It is an A direction arrow directional view of Drawing 1 showing an example of the 1st rotation type actuator of the rotation mechanism in the interaction measuring device of an embodiment. It is a figure which shows the external appearance of the circumference | surroundings of the sample a used with the interaction measuring apparatus of embodiment and a leaf | plate spring. (a)-(d) is the figure which looked at the leaf | plate spring from upper direction (C direction arrow figure of FIG. 1), (e)-(h) is the figure (B of FIG. 1) which looked at the leaf | plate spring from the front. Direction arrow view). (a) And (b) is a figure which shows the external appearance of the circumference | surroundings of the sample a used with the interaction measuring apparatus which shows an example of embodiment, and a leaf | plate spring, and the dimension of the sample a, The leaf | plate spring was seen from upper direction It is a figure (C direction arrow line view of FIG. 1). It is a B direction arrow line view of FIG. 1 which shows the atmosphere control system used with the interaction measuring device which shows an example of embodiment. It is an example of a leaf spring with a sample a produced from a pad for CMP, (a) is a view of the leaf spring with a sample a as viewed from above (a view in the direction of arrow C in FIG. 1), and (b) is It is the figure which looked at the leaf | plate spring with a sample a from the right side toward the direction (arrow A arrow view of FIG. 1). It is a figure which shows the displacement curve of the twist of a leaf | plate spring when a pad powder is scanned 1 micron to the left and right using a horizontal scanning mechanism, and the friction between pad powder and a wafer is measured. It is a figure which shows the result of the twist displacement width | variety and polishing rate when measuring the interaction of the wafer and pad powder | flour from which a wiring pattern differs. It is an example of a leaf spring with a sample a produced from abrasive grains of a slurry for CMP, and (a) is a view of the leaf spring with a sample a as viewed from above (a view in the direction of arrow C in FIG. 1). ) Is a view of a leaf spring with a sample a as viewed from the side (a view in the direction of arrow A in FIG. 1). It is a perspective view which shows the microscope of the conventional optical lever system.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a conceptual configuration diagram showing an interaction measuring apparatus S1 of a scanning probe microscope showing an example of an embodiment of the present invention.
<Outline of Interaction Measuring Device S1 of Embodiment>
The scanning probe microscope interaction measuring apparatus S1 of the embodiment adheres a sample having an asymmetrical indefinite shape or a sample that can be placed only at a position where the center of gravity is shifted from the center line passing through the center of gravity of the leaf spring to the leaf spring. Used to measure various interactions.
Therefore, the interaction measuring device S1 includes a leaf spring 3 for changing the inclination of the leaf spring 3 at a portion to which the optical axis of the detection light generated from the light source 16 is applied at an arbitrary angle with respect to the sample stage 15. A rotating mechanism 22 for rotating is provided.

<Configuration of interaction measuring device S1>
The interaction measuring apparatus S1 according to the embodiment includes a leaf spring 3 having a sample a (1) attached to a tip portion, and a fixed holder 14 that fixes an end portion on the opposite side of the tip portion of the leaf spring 3 (see FIG. 2). ) And the sample b (2) is fixed on the sample stage 15. The fixed holder 14 is covered with a fixed holder case 14c.
The interaction measuring device S1 detects the reflected light r12 applied to the tip of the leaf spring 3 or the portion following the displacement of the leaf spring 3 with the optical axis of the detection light r11 such as laser detection light generated from the light source 16 being detected. Displacement detecting optical system 18 of the leaf spring 3 detected by the instrument 17 and a fine / coarse movement mechanism for moving the sample table 15 or the leaf spring 3 to approach or separate the sample a (1) and the sample b (2). 19 and a horizontal scanning mechanism 20 that scans the sample stage 15 in the horizontal direction (X and Y axis directions) in order to measure the friction between the sample a (1) and the sample b (2), and the sample a (1 And a vertical scanning mechanism 21 that scans the sample stage 15 in the vertical direction (Z-axis direction) in order to measure at least one of adsorption, adhesion, and repulsion between the sample b and the sample b (2). It is a probe microscope.

The displacement detection optical system 18 includes a light source 16 that emits detection light r11, a lens 5 that condenses the detection light r11 from the light source 16 toward the leaf spring 3, a beam splitter, and reflected light r12 that is reflected by the leaf spring 3. And a photodetector 17 for detecting the reflected light r12 reflected by the mirror 6.
The interaction measuring device S1 determines the inclination of the leaf spring 3 at the portion to which the optical axis of the detection light r11 generated from the light source 16 is applied before the sample a (1) and the sample b (2) are brought close to each other. A rotation mechanism 22 is provided for rotating the fixed holder 14 for changing the table 15 at an arbitrary angle.

2-4 is a figure showing the rotation mechanism which shows an example of embodiment of this invention.
FIG. 2A is a view in the direction of arrow A in FIG. 1 showing a state in which the tip side of the leaf spring 3 to which the sample a (1) of the example of the embodiment is attached is deformed downward by the weight of the sample a (1). FIG. 2B is a view in the direction of arrow A showing a state in which the leaf spring 3 deformed by the weight of the sample a (1) of the embodiment is leveled.
The rotation mechanism 22 of the interaction measuring device S1 has a longitudinal direction (for example, the center in the longitudinal direction of the leaf spring 3) from the distal end portion to which the sample a (1) of the leaf spring 3 is attached to the end portion fixed to the fixed holder 14. The first rotary actuator 24a that rotates the line c31) in the directions of arrows α11 and α12 in FIG. 2B so that the line c31) is horizontal with respect to the sample stage 15 with the fixed end side of the fixed holder 14 as a fulcrum. I have.

As shown in FIG. 2A, when the sample a (1) is attached to the tip of the leaf spring 3 that is horizontally supported on the free end side of the fixed holder 14, the leaf spring 3 is attached to the sample a (1). Bends and deforms downward due to weight. Then, the detection light r <b> 11 emitted from the light source 16 is reflected by the bent and deformed leaf spring 3, and the reflected reflected light r <b> 12 is detached from the light detector 17 and cannot be detected by the light detector 17.
At this time, the deformed leaf spring 3 is rotated by the first rotary actuator 24a via the fixed holder 14 in the direction of the arrow α12 in FIG. 2A, and the deformed leaf spring as shown in FIG. 2B. 3 is changed so that the detection light r11 emitted from the light source 16 is reflected by the bent leaf spring 3 and the reflected light r13 reflected enters the photodetector 17 so that it can be detected.

FIG. 3A shows that the center of gravity 1G of the sample a (1) attached to the tip of the leaf spring 3 of the interaction measuring device S1 of the embodiment is equally divided by the width of the leaf spring 3 where the center of gravity of the leaf spring 3 is located. FIG. 3B is a view taken in the direction of the arrow B in FIG. 1 and shows a state in the case of being on the left side of the center line c33. FIG. 3B is a plan view of the leaf spring 3 of the interaction measuring device S1 in FIG. FIG. 3 is a view in the direction of the arrow B in FIG. 1 showing a state where the center of gravity 1G of the attached sample a (1) is on the right side of the center line c33 equally dividing the width of the leaf spring 3 where the center of gravity of the leaf spring 3 is located. 3 (c) is a view in the direction of arrow B in FIG. 1 showing a state in which the deformed leaf spring 3 of the interaction measuring device S1 in FIGS. 3 (a) and 3 (b) is horizontal.
The center of gravity of the leaf spring 3 is located on a center line c33 that equally divides the width of the leaf spring 3 in the short direction when the leaf spring 3 is viewed from above.
The rotation mechanism 22 of the interaction measuring device S1 moves the short direction of the leaf spring 3 (for example, the center line c32 in the short direction of the leaf spring 3) with respect to the sample stage 15 by the arrow α21 in FIG. , A second rotary actuator 24b (see FIG. 2) that rotates in a direction indicated by an arrow α22 in FIG.

  As shown in FIG. 3A, the center of gravity 1G of the sample a (1) attached to the tip of the leaf spring 3 equally divides the width in the short direction of the leaf spring 3 where the center of gravity of the leaf spring 3 is located. When it is on the left side from the center line c33, the leaf spring 3 is bent and deformed to the left side. Therefore, the detection light r <b> 21 from the light source 16 is reflected by the bent leaf spring 3, and the reflected light r <b> 22 that is reflected deviates from the photodetector 17 and cannot be detected by the photodetector 17.

Therefore, the deformed leaf spring 3 is rotated by the second rotary actuator 24b through the fixed holder 14 in the direction of the arrow α21 in FIG. 2A to change its position, as shown in FIG. As described above, the reflected light r <b> 24 emitted from the light source 16 and reflected by the deformed leaf spring 3 enters the photodetector 17 and can be detected by the photodetector 17.
3B, the center line 1G of the sample a (1) attached to the tip of the leaf spring 3 equally divides the width of the leaf spring 3 where the center of gravity of the leaf spring 3 is located. When it is on the right side from c33, the leaf spring 3 is bent and deformed to the right side. Therefore, the detection light r21 emitted from the light source 16 is reflected by the bent and deformed leaf spring 3, and the reflected light r23 reflected deviates from the detector 17 and cannot be detected by the photodetector 17.

Therefore, the position of the deformed leaf spring 3 is changed by rotating the short direction of the deformed leaf spring 3 in the direction of arrow α22 in FIG. ), The reflected light r24 emitted from the light source 16 and reflected by the deformed leaf spring 3 enters the photodetector 17 so that the photodetector 17 can detect it.
4 is a view in the direction of arrow A in FIG. 1 showing an example of the first rotary actuator 24a of the rotation mechanism 22 (see FIG. 2) in the interaction measuring device S1.

  In the first rotary actuator 24a, a pulley p1 is rotatably supported around a fixed support shaft o1, and a pulley p2 to which rotation of the pulley p1 is transmitted via a belt b1 wound around the pulley p1 is provided. It is rotatably supported around the fixed support shaft o2. A pulley p3 to which the rotation of the pulley p2 is transmitted via the belt b2 wound around the pulley p2 is supported so as to be rotatable around the fixed support shaft o3. The fixed holder 14 is fixed to the pulley p3, and the fixed holder 14 rotates in the direction of arrow α11 or arrow α12 in FIG. 4 by the rotation of the pulley p3.

In addition, a long hole p11 is formed in the pulley p1, and a pin 26d1 fixed to a transmission member 26d fixed to the laminated piezoelectric element 26 is slidably fitted in the long hole p11. The laminated piezoelectric element 26 finely moves in the direction of arrow β11 or arrow β12 in FIG. 4 when a voltage is applied.
Below the laminated piezoelectric element 26, the rotational motion of the step motor 25 is converted into a linear motion in the direction of arrow β11 or arrow β12 in FIG. 4 and coarsely moved in the direction of arrow β11 or arrow β12. The laminated piezoelectric element 26 is fixed on the coarse movement mechanism 25k.

  The first rotary actuator 24 a converts the power obtained from the fine / coarse movement mechanism that moves in the directions of arrows β 11 and β 12 in FIG. 4 combining the step motor 25 and the piezoelectric element 26 into the rotational motion of the fixed holder 14. 4 to rotate the leaf spring 3 in the direction of α11 in FIG. 4 and the direction of arrow α12 by rotating the fixed holder 14 with this rotational structure. Can be placed.

With this configuration, the leaf spring 3 is deformed by the weight of the sample a (1) attached to the tip thereof, and the reflected light r12 reflected by the leaf spring 3 in which the detection light r11 emitted from the light source 16 is bent and deformed is deformed. By rotating the leaf spring 3 in the α11 direction and the arrow α12 direction in FIG. 4, reflected light r13 entering the photodetector 17 can be obtained (see FIG. 2B).
Here, the second rotary actuator 24b that rotates the transverse direction of the leaf spring 3 in the rotation mechanism 22 shown in FIG. 2 (see FIG. 3) is configured so that the installation direction of the rotary actuator 24a shown in FIG. This can be realized by rotating 90 ° around the longitudinal direction.

In FIG. 4, an example of the first rotary actuator 24a has been described. However, it is also possible to configure a coarse motion mechanism that transmits a rotational motion of a motor other than the illustrated one using a speed reduction mechanism, a link, or the like. The configuration is not limited to the illustrated example. Further, the fine movement mechanism is not limited to the configuration illustrated in FIG. 4 as long as a predetermined fine movement is obtained.
Further, the configuration of the first rotary actuator 24a can be appropriately selected as long as the longitudinal direction of the leaf spring 3 can be rotated by an arbitrary angle. Similarly, the configuration of the second rotary actuator 24b can be appropriately selected as long as the longitudinal direction of the leaf spring 3 can be rotated by an arbitrary angle.

FIG. 5 is a diagram showing an external appearance around the sample a (1) and the leaf spring 3 used in the interaction measuring device S1 showing an example of the embodiment. 5 (a) to 5 (d) are views of the leaf spring 3 as viewed from above (viewed in the direction of arrow C in FIG. 1), and FIGS. 5 (e) to 5 (h) illustrate the leaf spring 3. It is the figure seen from the front (B direction arrow view of FIG. 1).
A center line c33 (a chain line) in FIGS. 5A to 5H is a center line that equally divides the width of the leaf spring 3 where the center of gravity of the leaf spring 3 is located.

The sample a (1) has an asymmetrical indeterminate shape, and the center of gravity 1G of the sample a (1) is at a position shifted from the center line c33 that equally divides the width of the leaf spring 3.
Therefore, the deformation of the bias is likely to occur in the leaf spring 3 due to the center of gravity 1G of the sample a (1) deviating from the center line c33 that equally divides the width of the leaf spring 3.
6 (a) and 6 (b) are views showing the appearance around the sample a (1) and the leaf spring 3 used in the interaction measuring apparatus S1 showing an example of the embodiment and the dimensions of the sample a (1). FIG. 3 is a view of the leaf spring 3 as viewed from above (viewed in the direction of arrow C in FIG. 1).

The sample a (1) disposed on the leaf spring 3 has a maximum diameter of 60 μm (micrometer) when the leaf spring 3 is looked down from above (when the extending surface of the leaf spring 3 is looked down from above in the thickness direction). ) And in the range of 500 μm or less.
The scanning probe microscope interaction measuring apparatus S1 of the embodiment includes a friction force, an adsorption force, an adhesion force, a hardness, a potential difference, an electrostatic force, a magnetic force, and an elastic modulus between the sample a (1) and the sample b (2). Measure.
The frictional force is obtained by the interaction measuring device S1 as follows.

The sample a (1) and the sample b (2) are rubbed in the horizontal direction by moving the sample stage 15 horizontally (moving in the X and Y directions in FIG. 1) by the horizontal scanning mechanism 20. Then, since the leaf spring 3 is deformed by the frictional force between the sample a (1) and the sample b (2), the frictional force is obtained by measuring the displacement of the leaf spring 3 at that time.
The direction in which the sample a (1) and the sample b (2) are rubbed is the short direction of the leaf spring 3 (the direction of the center line c32 in FIG. 3). At this time, the twist of the leaf spring 3 with respect to the short direction (the direction of the center line c32 in FIG. 3) is detected. The greater the twist, the greater the frictional resistance and the greater the friction.

The adsorption force is obtained by the interaction measuring device S1 as follows.
By moving the sample stage 15 in the vertical direction (Z-axis direction) by the vertical scanning mechanism 21 (see FIG. 1) from the state in which the sample a (1) and the sample b (2) are separated from each other, the sample is moved closer to the vertical direction. Then, the displacement of the leaf spring 3 at that time is measured. The displacement is obtained by detecting the deflection of the leaf spring 3 when the sample a (1) and the sample b (2) contact. The greater the deflection of the leaf spring 3, the greater the adsorption force between the sample a (1) and the sample b (2).
The adhesion force is obtained by the interaction measuring device S1 as follows.

From the state in which the sample a (1) and the sample b (2) are in contact, the vertical scanning mechanism 21 (see FIG. 1) is used to move the sample table 15 in the vertical direction, so that the plate spring 3 at that time is separated. Measure the displacement. The displacement is obtained by detecting the return amount of the bent leaf spring 3 when the sample a (1) and the sample b (2) are separated. The larger the return amount, the greater the deformation energy of the leaf spring 3 due to the adhesion force, and the greater the adhesion force between the sample a (1) and the sample b (2).
The hardness is further pressed in the vertical direction by moving the sample stage 15 in the vertical direction by the vertical scanning mechanism 21 (see FIG. 1) from the state where the sample a (1) and the sample b (2) are in contact with each other. The displacement of the leaf spring 3 at that time is measured. The displacement is obtained by detecting the warping of the leaf spring 3 when the sample a (1) and the sample b (2) are pressed against each other. The greater the warp, the harder it is and the greater the hardness.

The potential difference is measured with respect to a material to be polished electrochemically or to an electrochemically acting material. The potential difference is measured between the sample a (1) and the sample b (2) by the vertical scanning mechanism 21 (FIG. 1)), the sample stage 15 is moved in the vertical direction, a certain bias voltage is applied at a slight distance, and the potential difference at that time is read.
The electrostatic force is moved closer to the vertical direction by moving the sample stage 15 in the vertical direction by the vertical scanning mechanism 21 (see FIG. 1) from the state where the sample a (1) and the sample b (2) are separated from each other. Then, the displacement of the leaf spring 3 at that time is measured. The displacement is obtained by detecting the warping of the leaf spring 3 when the sample a (1) and the sample b (2) approach each other. The greater the warp of the leaf spring 3, the greater the electrostatic force.

The magnetic force strikes the sample a (1) and the sample b (2) in the vertical direction by moving the sample stage 15 in the vertical direction by the vertical scanning mechanism 21 (see FIG. 1), and the leaf spring 3 at that time is hit. Measure the delay of the period. The greater the delay (phase difference) from the tapping cycle, the greater the magnetic force.
The elastic force is obtained by striking the sample a (1) and the sample b (2) in the vertical direction by moving the sample table 15 in the vertical direction by the vertical scanning mechanism 21 (see FIG. 1), and the leaf spring 3 at that time. Measure the delay of the period. The greater the delay (phase difference) from the tapping cycle, the smaller the elastic force.

FIG. 7 is a view in the direction of arrow B in FIG. 1 showing an atmosphere control method used in the interaction measuring apparatus S1 of the present embodiment.
The interaction measuring device S1 includes a sealed container 31 having an atmosphere control mechanism 30 for installing the sample a (1) and the sample b (2) in an arbitrary temperature, humidity, vacuum, gas, or liquid. .
Control of the temperature of the sealed container 31 by the atmosphere control mechanism 30 obtains a desired temperature of the sealed container 31 using a heater, a refrigeration cycle, or the like.
The method for generating the humidity of the sealed container 31 by the atmosphere control mechanism 30 is, for example, installing a bubbler in a water tank in which water is stored and pouring gas into the bubbler. Saturated water vapor is generated by raising the temperature of the water tank. Then, saturated water vapor is poured into the sealed container 31 in which the sample a (1) and the sample b (2) are set. Control of humidity is obtained by mixing a gas containing saturated water vapor and a dry gas.

The vacuum control of the sealed container 31 by the atmosphere control mechanism 30 is performed, for example, by evacuating the sealed container 31 with a vacuum pump.
In the gas control of the sealed container 31 by the atmosphere control mechanism 30, for example, a desired gas is poured into the sealed container 31 from a container containing the gas.
In the liquid control of the sealed container 31 by the atmosphere control mechanism 30, for example, a desired liquid is poured into the sealed container 31 from a container containing the liquid by a pump.

<Inspection apparatus provided with interaction measuring apparatus S1>
The inspection apparatus provided with the interaction measuring device S1 shown in FIG. 1 is a sliding surface that slides at least one sliding member relative to the other sliding member among a pair of sliding members that slide against each other. Is attached to the distal end of the leaf spring 3 so that the lower surface is the lower surface, and the other sliding member is fixed on the sample stage 15. A constant load is applied by the vertical scanning mechanism 21 between one sliding member attached to the tip of the leaf spring 3 and the other sliding member fixed on the sample table 15, and the horizontal scanning mechanism 20. Then, the friction is measured by horizontally scanning the other sliding member on the sample stage 15.

Further, the inspection device inspects the wear resistance of the sliding member in which a coating is formed on at least one sliding surface of the pair of sliding members that slide against each other. Sliding members with a coating on the sliding surface include, for example, abrasive grains used in CMP slurries with a surface additive coating, diamond carbon on the surface, and lubrication on the surface. There are those with membranes.
Other examples of the pair of sliding members for measuring the frictional sliding include a synchronizer ring in a synchromesh transmission and a clutch gear that frictionally slides on the synchronizer ring.

<CMP (Chemical Mechanical Polishing) Inspection Device with Interaction Measuring Device S1>
A CMP inspection apparatus including the interaction measuring apparatus S1 shown in FIG. 1 includes a semiconductor wafer, a CMP slurry used for polishing and smoothing the surface of the semiconductor wafer chemically and mechanically, and a CMP slurry. CMP using the abrasive grains contained in the wafer, a CMP pad for polishing the surface of the semiconductor wafer by rotating it under a constant load, and a CMP dress for cleaning the CMP pad Perform the inspection.

At least one of these semiconductor wafers, abrasive grains, CMP pads, and CMP dresses is attached to the tip of the leaf spring 3, and a member different from the member attached to the tip of the leaf spring 3 is used as the sample table 15. Secure on top. A constant load is applied between the two members by the vertical scanning mechanism 21 and the member on the sample table 15 is horizontally scanned by the horizontal scanning mechanism 20 to measure friction.
Alternatively, at least one of adsorption, adhesion, and repulsion is measured by vertically scanning the member on the sample stage 15 with the vertical scanning mechanism 21.

  The CMP inspection apparatus includes chemical mechanical polishing between abrasive grains and semiconductor wafers, between CMP pads and semiconductor wafers, between CMP dresses and semiconductor wafers, between CMP dresses and abrasive grains, and between CMP pads. At least one of friction, adsorption, adhesion, and repulsion is measured between abrasive grains and at least one between a CMP pad and a CMP dress, and using the measured information, polishing rate, pad life, dress A speed / life prediction means for predicting the life is provided. The speed / life prediction means is constituted by a computer or the like.

For example, when the friction is large, the speed / life prediction means predicts that the polishing speed is fast because the friction resistance is large, whereas when the friction is small, the speed / life prediction means predicts that the polishing speed is slow because the friction resistance is small.
Speed / life prediction means that friction, adsorption, adhesion, or repulsion between CMP pad and semiconductor wafer is large. Friction, adsorption, adhesion, or repulsion between CMP pad and abrasive grains. Is large and any of friction, adsorption, adhesion, and repulsion between the CMP pad and the CMP dress is large, it is determined that the life of the CMP pad is short. On the other hand, the prediction means is that any of friction, adsorption, adhesion, and repulsion between the CMP pad and the semiconductor wafer is small, and any of friction, adsorption, adhesion, and repulsion between the CMP pad and abrasive grains. If any of the friction, adsorption, adhesion, and repulsion between the CMP pad and the CMP dress is small, it is determined that the life of the CMP pad is long.

As for the speed / life prediction means, any of friction, adsorption, adhesion, and repulsion between the CMP dress and the semiconductor wafer is large, friction between the CMP dress and abrasive grains, adsorption, adhesion, and repulsive force. When any one is large and any of friction, adsorption, adhesion, and repulsion between the CMP pad and the CMP dress is large, it is determined that the life of the CMP dress is short. On the other hand, the prediction means is that any of friction, adsorption, adhesion, and repulsion between the CMP dress and the semiconductor wafer is small, and any of friction, adsorption, adhesion, and repulsion between the CMP dress and abrasive grains. Is small, and any of friction, adsorption, adhesion, and repulsion between the CMP pad and the CMP dress is small, etc., it is determined that the lifetime of the CMP dress is long.
Note that the prediction of the speed / life prediction means described above is an example, and it is needless to say that the prediction can be performed as appropriate.

<Hard Disk Inspection Device with Interaction Measuring Device S1>
The hard disk inspection apparatus including the interaction measuring device S1 shown in FIG. 1 is used for inspection of a magnetic recording apparatus in which a hard disk head is levitated from a magnetic recording medium such as a magnetic disk at a predetermined interval and data is written. .
Either one of the head of the magnetic recording device and the magnetic recording medium is attached to the tip of the leaf spring 3 and the other member different from the member attached to the tip of the leaf spring 3 is placed on the sample table 15. A fixed load is applied between the two members by the vertical scanning mechanism 21 and the member on the sample table 15 is horizontally scanned by the horizontal scanning mechanism 20 to measure the friction.

Alternatively, at least one of adsorption, adhesion, and repulsion is measured by vertically scanning the member on the sample stage 15 with the vertical scanning mechanism 21.
The hard disk inspection device measures error prediction means for measuring at least one of friction, adsorption, adhesion, and repulsion between the head and the magnetic recording medium in the hard disk and predicting the occurrence rate of write errors using the measured information. Prepare. The error prediction means is configured by a computer or the like.

For example, the error prediction means predicts that the error rate is high when any of friction, adsorption, adhesion, and repulsion between the head and the magnetic recording medium is too large or too small. If the friction, adsorption, adhesion, and repulsion of the material are appropriate, the error rate is expected to be low.
Note that the prediction of the error prediction means is an example, and the prediction can be performed as appropriate.

<< Embodiment 1 >>
Next, the inspection of the friction characteristics between the CMP pad and the semiconductor wafer by the CMP inspection apparatus provided with the interaction measuring apparatus S1 of the first embodiment will be described.
A polishing pad for CMP was finely cut to produce a pad powder having a length of about 120 microns, a width of about 80 microns, and a height of about 130 microns. This was adhered to the tip portion of the leaf spring 3 using an epoxy resin.

FIG. 8 is an example of a leaf spring 3 with a sample a (1) produced from a CMP pad. FIG. 8A is a view of the leaf spring 3 with a sample a (1) as viewed from above (FIG. 1). FIG. 8B is a view of the leaf spring 3 with the sample a (1) as viewed from the right side (viewed in the direction of arrow A in FIG. 1).
Since the pad powder of the sample a (1) is formed from a polyurethane foam, the shape thereof is a porous body, and is asymmetric and irregular in shape, with a center of gravity 1G of the pad powder of the sample a (1). It was found that the position was greatly shifted to one side from the center line c33 that equally divides the width of the leaf spring 3 where the center of gravity of the leaf spring 3 is located.

In order to measure the interaction of the sample a (1) produced from the CMP pad using the interaction measuring device S1 of FIG. 1, the sample a (1) of the leaf spring 3 is fixed to the fixed holder 14 (see FIG. 2). The end portion opposite to the tip end portion where the was attached was fixed. At this time, as shown in FIG. 8 (b), the leaf spring 3 is inclined 3 ° to the left with respect to the horizontal line by the weight of the sample a (1) (the tip side of the leaf spring 3 is 3 ° downward). I understood.
On the other hand, a wafer for LSI (Large Scale Integration) having a copper wiring formed on the surface was fixed to the sample stage 15 as the sample b (2). When the optical axis of the detection light r11 generated from the light source 16 is applied to the tip of the leaf spring 3 and the reflected light r12 is detected by the photodetector 17, the leaf spring 3 is located on the side of the center of gravity 1G of the pad powder. Therefore, the amount of light that could be detected was only 1/8 of the normal amount.

Therefore, the first rotary actuator 24a (see FIG. 2 (b)) rotates the leaf spring 3 tilted downward as shown by an arrow α11 in FIG. 8 (b) by about 3 ° clockwise, The leaf spring 3 was set parallel to the sample stage 15.
In this state, when the optical axis of the detection light r11 generated from the light source 16 is again applied to the tip portion of the leaf spring 3 and the reflected light r12 is detected by the photodetector 17, the detected light amount is It recovered to normal 6/8.

  Next, the second rotary actuator 24b gradually rotates the leaf spring 3 (see FIG. 8A) while rotating gradually so as to be horizontal with respect to the sample table 15 with the fixed holder 14 side as a fulcrum. The operation of detecting the reflected light r12 with the photodetector 17 was performed by applying the optical axis r11 to the tip of the leaf spring 3. The rotation was stopped when the detected light quantity recovered to the normal value. In this state, the pad powder (sample a (1)) and the wafer (sample b (2)) adhered to the tip of the leaf spring 3 are brought close to each other using the fine / coarse movement mechanism 19 (see FIG. 1). It was.

Then, a load of 3 nN (nanonewton) is applied to the pad powder of the sample a (1) using the fine movement / coarse movement mechanism 19, and the wafer on the sample stage 15 is moved to the left and right (the leaf spring 3 of the leaf spring 3 using the horizontal scanning mechanism 20. When scanning was performed by 1 micron (μm) in the short direction), the friction between the pad powder of sample a (1) and the wafer could be measured.
FIG. 9 shows a torsional displacement curve of the leaf spring 3 at this time. In FIG. 9, the horizontal axis represents the scanning distance, and the vertical axis represents the torsional displacement.
The torsional displacement is captured by the voltage signal detected by the photodetector 17 with the reflected light r12.

  A point n0 in FIG. 9 is a scanning measurement start point. Since the scanning speed increases from point n0 to point n1 (arrow n11), the torsional displacement (frictional force) increases rapidly. Since the scanning is in a steady state at the point n1, the torsional displacement (frictional force) is constant from the point n1 to the point n2 (arrow n12). When scanning from point n2 to point n3 in the reverse direction, torsional displacement (frictional force) decreases from point n2 to point n3 (arrow n13). A steady state in the reverse scanning direction is obtained at point n3, and the torsional displacement (frictional force) is constant from point n3 to point n0 (arrow n14).

In FIG. 9, the greater the frictional force (friction resistance) that the leaf spring 3 receives, the greater the torsional displacement width. Therefore, the greater the torsional displacement width shown in FIG. 9, the greater the frictional force.
FIG. 10 shows the results of the torsional displacement width polishing rate when the interaction between the wafer (sample b (2)) and the pad powder (sample a (1)) having different wiring patterns was measured by the above method. The vertical axis in FIG. 10 is the polishing rate (μm / min) obtained by actually polishing the same wafer and pad, and the horizontal axis is the torsional displacement width (mV).

From this result, it is understood that a good correlation is obtained between the frictional force (twist displacement width on the horizontal axis in FIG. 10) and the polishing rate (vertical axis in FIG. 10).
That is, the CMP inspection apparatus provided with the interaction measuring apparatus S1 is effective as a CMP inspection apparatus for inspecting the polishing rate of the semiconductor wafer. In the inspection using this apparatus, the information of FIG. 10 is made into a database, and the information of FIG. 10 in the database is used from the torsional displacement width measured by the leaf spring 3 in the actual measurement by the speed / life prediction means. Thus, the polishing rate of the semiconductor wafer can be estimated. Thereby, it can be inspected whether the required polishing rate is obtained.

<< Embodiment 2 >>
Next, the measurement of the adsorption force between the abrasive grains of the CMP slurry and the CMP dress by the CMP inspection apparatus including the interaction measuring apparatus S1 will be described.
The abrasive grains contained in the CMP slurry were bonded to the tip of the leaf spring 3 using an epoxy resin.
FIG. 11 is a view showing an example of a leaf spring 3 to which a sample a (1) produced from abrasive grains of CMP slurry is attached. FIG. 11 (a) shows the leaf spring 3 with the sample a (1) upward. FIG. 11B is a view seen from the right side of the leaf spring 3 with the sample a (1) (viewed in the direction of arrow A in FIG. 1). Figure).

Since the abrasive grains are formed from an aggregate of cerium oxide crystals, the shape is polycrystalline, and the shape is asymmetric and irregular, as shown in FIG. 11 (a). Sample a (1) It can be seen that the position of the center of gravity 1G is greatly shifted from the center line c33 that equally divides the width of the leaf spring 3 passing through the center of gravity of the leaf spring 3 to one side (right side).
In order to measure the interaction between the abrasive grains of the CMP slurry using the interaction measuring device S1 of FIG. 1, the end of the leaf spring 3 opposite to the sample a (1) is fixed to the fixing holder 14. At the same time, a dress for CMP was fixed to the sample stage 15 as the sample b (2). The fine dressing / coarse motion mechanism 19 brought the CMP dress of the sample b (2) fixed to the sample stage 15 into contact with the sample a (1) of the leaf spring 3.

  At this time, as shown in FIG. 11 (b), it was found that the center line c31 of the leaf spring 3 was inclined about 2 ° in the clockwise direction with respect to the horizontal direction. When the optical axis of the detection light r11 generated from the light source 16 is applied to the tip of the leaf spring 3 and the reflected light r12 is detected by the photodetector 17, the leaf spring 3 rotates clockwise with respect to the horizontal direction. Since the direction is twisted by about 2 °, the amount of light that could be detected was only 1/4 of the usual amount. Here, the first rotary actuator 24a rotates the leaf spring 3 having the center line c31 inclined to the left by about 2 ° in the counterclockwise direction indicated by the arrow α12 in FIG. The leaf springs 3 were set to be parallel.

  In this state, when the optical axis of the detection light r11 generated from the light source 16 is again applied to the tip portion of the leaf spring 3 and the reflected light r12 is detected by the photodetector 17, the detected light amount is It recovered to the normal 2/4. Next, the second rotary actuator 24b rotates the leaf spring 3 shown in FIG. 11 (a) so as to be horizontal, and the optical axis of the detection light r11 is applied to the tip portion of the leaf spring 3 to reflect it. An operation of detecting the light r12 with the photodetector 17 was performed. When the detected light quantity recovered to the normal value, the rotation of the leaf spring 3 by the second rotary actuator 24b was stopped.

When the vertical scanning mechanism 21 was used to bring the CMP dress of the sample b (2) fixed to the sample stage 15 closer to the abrasive grains of the sample a (1) adhered to the tip of the leaf spring 3, the abrasive was removed. The adsorption force between the grains and the CMP dress could be measured.
Here, it was proved by experiments that the greater the adsorption force, the easier the dress wears. Therefore, the measurement of the attractive force is effective for inspecting the easiness of wearing of the dress.
That is, it has been shown that a CMP inspection apparatus including the interaction measuring apparatus S1 capable of measuring the adsorption force is effective as a CMP inspection apparatus for inspecting the wearability of the CMP dress.

In addition, the CMP inspection apparatus obtains in advance a relationship between the attraction force and the wear rate between the abrasive slurry of the CMP slurry and the CMP dress and stores it in a database, and between the actual abrasive grains and the dress. There is provided speed / life prediction means for estimating the wear rate of the CMP dress using the relationship between the wear force and the wear force of the CMP slurry of the database and the CMP dress.
Thereby, the CMP inspection apparatus can inspect whether the required wear rate is obtained by measuring the adsorption force.

<Effect>
If the interaction measuring device S1 is used, a sample having an asymmetrical indefinite shape or a sample whose center of gravity can be placed only at a position shifted from the position of the center of gravity in the short direction of the leaf spring 3 is adhered to the leaf spring 3. It can be used to measure various interactions. Further, even a large sample having a maximum diameter of 60 μm (micrometer) or more and 500 μm or less can be used. As a result, actual materials such as sliding members and polishing members used in various products, for example, porous bodies, polycrystalline bodies, aggregates, etc., and shapes having grooves in specific places, etc. It is possible to evaluate a material that is complicated and asymmetrical, has a center of gravity greatly deviated from the center of the leaf spring 3, or is heavy.

When these actual materials are attached to the leaf spring 3 and used instead of the probe, the leaf spring 3 is twisted because the center of gravity of the material cannot be brought to the position of the center of gravity of the leaf spring 3 in the short direction. However, if this apparatus is used, the left and right twists can be corrected.
Further, even when the leaf spring 3 hangs down and deforms due to the weight of the actual material, the vertical deflection can be corrected by using this apparatus. In the conventional apparatus, even if the laser beam is irradiated on the back surface of the deformed leaf spring, the reflected light is scattered and cannot be collected or cannot be detected by the photodetector. However, these problems can be solved and the interaction can be measured for any real material.

1 Sample a (first sample)
1G Center of gravity of sample a (center of gravity of first sample)
2 Sample b (second sample)
3 Leaf spring 5 Lens (Displacement detection optical system)
6 Mirror (Displacement detection optical system)
14 Fixed holder (fixing member)
15 Sample stage 16 Light source (Displacement detection optical system)
17 Photodetector (Displacement detection optical system)
18 Displacement detection optical system 19 Fine / coarse movement mechanism (sample interval adjustment mechanism)
DESCRIPTION OF SYMBOLS 20 Horizontal scanning mechanism 21 Vertical scanning mechanism 22 Rotating mechanism 24 Rotating actuator 24a 1st rotating actuator 24b 2nd rotating actuator 25 Step motor 26 Piezoelectric element 30 Atmosphere control mechanism 31 Sealed container b1, b2 Belt (conversion structure)
c31 Longitudinal centerline of leaf spring (longitudinal centerline of leaf spring)
c32 Leaf spring center line in the short direction (leaf spring center line in the short direction)
c33 Center lines equally dividing the width of the leaf spring in the short direction p1, p2, p3 Pulley (conversion structure)
r11 (detection light)
r12 reflected light S1 interaction measuring device (scanning probe microscope)

Claims (15)

A leaf spring with a first sample attached to the tip;
A fixing member that fixes an end of the leaf spring opposite to the tip,
A sample stage on which the second sample is fixed;
A displacement detection optical system of the leaf spring in which an optical axis of detection light generated from a light source is applied to a tip portion of the leaf spring or a portion following displacement of the leaf spring, and the reflected light is detected by a photodetector;
A sample interval adjustment mechanism for moving the sample stage or the leaf spring to approach or separate the first sample and the second sample;
A horizontal scanning mechanism for measuring friction between the first sample and the second sample;
A scanning probe microscope comprising a vertical scanning mechanism for measuring at least one of adsorption, adhesion, and repulsion between the first sample and the second sample,
The fixing member for changing the inclination of a leaf spring attached to the tip of the first sample of the portion to which the optical axis of the detection light generated from the light source is applied at an arbitrary angle with respect to the sample stage A scanning probe microscope comprising a rotation mechanism for rotating the probe. As the rotation mechanism,
A first rotary actuator that rotates a longitudinal direction from a tip end portion of the leaf spring to which the first sample is attached to an end portion fixed to the fixing holder with respect to the sample stage with the fixing member side as a fulcrum; The scanning probe microscope according to claim 1, wherein the scanning probe microscope is provided. As the rotation mechanism,
The scanning probe microscope according to claim 1, further comprising a second rotary actuator that rotates a short direction of the leaf spring with respect to the sample stage. The said 1st rotary actuator or the said 2nd rotary actuator is provided with the conversion structure which converts the motive power obtained by combining a step motor and a piezoelectric element into rotary motion. The Claim 2 or Claim 3 characterized by the above-mentioned. Scanning probe microscope. The first sample has an asymmetrical indeterminate shape, and a center of gravity of the first sample is shifted from a position of a center of gravity of the leaf spring in a short direction of the leaf spring. The scanning probe microscope according to claim 4. The first sample attached to the leaf spring has a maximum diameter of 60 micrometers or more and 500 micrometers or less when the extension plane of the leaf spring is looked down in the thickness direction. The scanning probe microscope according to claim 5.   The frictional force, adsorption force, adhesion force, hardness, potential difference, electrostatic force, magnetic force, or elastic modulus between the first sample and the second sample is measured. The scanning probe microscope according to claim 6. An airtight container having an atmosphere control mechanism for installing the first sample and the second sample in any temperature, humidity, vacuum, gas, or liquid is provided. The scanning probe microscope according to any one of claims 1 to 7. A scanning probe microscope according to any one of claims 1 to 8, comprising:
The tip of the leaf spring is such that the sliding surface that slides at least one of the pair of sliding members that slide against each other relative to the other sliding member is the lower surface. And attached to
Fixing the other sliding member on the sample stage,
The sample interval adjusting mechanism applies a constant load between one sliding member attached to the tip of the leaf spring and the other sliding member, and the horizontal scanning mechanism is used to A frictional sliding inspection apparatus characterized by measuring a friction characteristic between the pair of sliding members by horizontally scanning the other sliding member.   10. The friction sliding inspection apparatus according to claim 9, wherein the wear resistance of the sliding member having a coating formed on at least one sliding surface of the pair of sliding members is inspected. 11. The frictional sliding inspection according to claim 9 or 10, wherein the pair of sliding members are a synchronizer ring in a synchromesh transmission and a clutch gear that frictionally slides on the synchronizer ring. apparatus. A scanning probe microscope according to any one of claims 1 to 8, comprising:
Semiconductor wafer, abrasive grains contained in CMP slurry used for smoothing the surface of the semiconductor wafer by chemical mechanical polishing, the surface of the semiconductor wafer by rotating under a constant load At least one of a CMP pad for polishing the CMP and a CMP dress for cleaning the CMP pad is attached to the tip of the leaf spring and is different from a member attached to the tip of the leaf spring Fix the member on the sample stage,
A CMP inspection apparatus, wherein at least one of friction, adsorption, adhesion, and repulsion is measured by scanning a member on the sample stage with the horizontal scanning mechanism or the vertical scanning mechanism. The CMP inspection apparatus according to claim 12, wherein
The scanning probe microscope includes the abrasive grains in the chemical mechanical polishing and the semiconductor wafer, the CMP pad and the semiconductor wafer, the CMP dress and the semiconductor wafer, and the CMP dress. Measuring at least one of friction, adsorption, adhesion, and repulsion between at least one of the previous abrasive grains, between the CMP pad and the abrasive grain, and between the CMP pad and the CMP dress;
A speed / life prediction means for predicting at least one of the polishing speed of the semiconductor wafer, the life of the CMP pad, and the life of the CMP dress using the measured information is provided. CMP inspection equipment. A scanning probe microscope according to any one of claims 1 to 8, comprising:
A head for a hard disk is levitated from the magnetic recording medium at a predetermined interval, and either one of the head and the magnetic recording medium in a magnetic recording apparatus for writing data is attached to the tip of the leaf spring. The other member is fixed on the sample stage,
A hard disk inspection apparatus, wherein at least one of friction, adsorption, adhesion, and repulsion is measured by scanning a member on the sample stage with the horizontal scanning mechanism or the vertical scanning mechanism. The hard disk inspection device according to claim 14,
At least one of friction, adsorption, adhesion, and repulsion between the head for the hard disk and the magnetic recording medium is measured,
An apparatus for inspecting a hard disk, comprising error prediction means for predicting a write error occurrence rate using the measured information.