JP2011228510A - Substrate processing apparatus and substrate transferring method - Google Patents
Substrate processing apparatus and substrate transferring method Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 151
- 238000000034 method Methods 0.000 title claims abstract description 59
- 238000011068 loading method Methods 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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Abstract
Description
本発明は、振動による基板の位置ずれを防止可能な基板処理装置、及び、基板移載方法に関する。 The present invention relates to a substrate processing apparatus capable of preventing displacement of a substrate due to vibration, and a substrate transfer method.
従来、基板搬送用の搬送ロボットが配された基板搬送チャンバ及び基板に対して処理を実行するプロセスチャンバを有する基板処理装置では、搬送ロボットからプロセスチャンバの処理台との間で基板の移載を行うために、一時的に基板を支持する基板支持ピン（リフトピン）が用いられている（特許文献１参照）。 2. Description of the Related Art Conventionally, in a substrate processing apparatus having a substrate transfer chamber in which a transfer robot for transferring a substrate is disposed and a process chamber for executing processing on a substrate, the substrate is transferred between the transfer robot and a processing stand of the process chamber. In order to perform this, substrate support pins (lift pins) that temporarily support the substrate are used (see Patent Document 1).
しかしながら、プロセスチャンバの処理の種類によっては、基板処理中の放電周りこみの影響で基板支持ピンの周囲表面が削られて細くなる為、支持ピンを上げた状態では支持ピンを保持する部材と支持ピンの隙間が広がることにより、装置振動の影響で支持ピンが振動しやすくなるという問題がある。
一方、搬送チャンバーの搬送ロボットは、他のプロセスチャンバやロードロックへの基板の搬入・搬出動作や次の基板保持位置の空き状態等の都合上、上記プロセスチャンバの基板の処理が終了しても、直ちに基板を搬出できない場合がある。
However, depending on the type of processing in the process chamber, the peripheral surface of the substrate support pin is cut and thinned due to the influence of discharge around the substrate during processing, so that when the support pin is raised, the member that holds the support pin and the support When the gap between the pins widens, there is a problem that the support pin easily vibrates due to the influence of the apparatus vibration.
On the other hand, the transfer robot in the transfer chamber does not finish processing of the substrate in the process chamber for reasons such as loading / unloading of the substrate to / from another process chamber or load lock, and the empty state of the next substrate holding position. In some cases, the substrate cannot be taken out immediately.
このため、プロセスチャンバでの処理の終了後、基板支持ピンにより持ち上げられた処理済基板が支持ピン上で待機することとなり、搬送チャンバーの搬送ロボットが上記処理済基板を搬出するまでの間に、装置の振動で基板が振動することにより、支持ピン上の基板の位置ずれが発生する。
本発明は、上述の問題点に鑑みてなされたものであり、装置振動等による基板の位置ずれを簡便に防止可能な手段を提供することを目的とする。
For this reason, after the processing in the process chamber is finished, the processed substrate lifted by the substrate support pins waits on the support pins, and until the transfer robot of the transfer chamber carries out the processed substrate, When the substrate vibrates due to the vibration of the apparatus, the positional displacement of the substrate on the support pins occurs.
The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a means that can easily prevent the displacement of the substrate due to apparatus vibration or the like.
本発明の一実施形態によれば、基板搬送可能な搬送ロボット、及び、前記搬送ロボットにより搬送される基板が通過可能な複数の搬送口を有する搬送室と、前記搬送ロボットを制御する搬送ロボット制御手段と、前記搬送口を介して搬送室に接続される処理室と、を備え、前記処理室は、基板を載置可能な処理台と、搬出対象の基板を前記処理台から離間した状態で支持し、前記搬送ロボットに移載可能な基板支持ピンと、前記基板支持ピン及び前記処理台の少なくとも一方の駆動を制御して、前記基板を処理台から基板支持ピンに移載させる移載制御手段と、を備え、前記搬送ロボット制御手段は、搬出対象基板を有する処理室からの基板の搬出動作開始後のタイミングを知らせる搬送タイミング信号を当該処理室の移載制御手段に送信し、前記移載制御手段は、前記搬送ロボット制御手段からの搬送タイミング信号の受信に基づいて、前記搬送ロボットの搬出動作開始後に前記基板を基板支持ピンに移載させることを特徴とする。
このように、搬送ロボットによる動作とリフトピンによる動作とを協調させることで、処理済基板を支持ピン上に置かれている状態の時間を極力減らし、装置振動による基板の位置ずれを防ぐことができる。
ここで、「基板の搬出動作開始後のタイミング」における基板の搬出動作は、搬送ロボットが他の基板搬送動作を完了してから若しくは搬送ロボットが初期位置にある状態から、基板の搬出動作を完了するまでの動作を言う。従って、搬出対象基板を搬送ロボットに移載してから基板が処理室を出るまでの狭義の搬出動作とは異なる。
According to one embodiment of the present invention, a transfer robot capable of transferring a substrate, a transfer chamber having a plurality of transfer ports through which a substrate transferred by the transfer robot can pass, and a transfer robot control for controlling the transfer robot Means and a processing chamber connected to the transfer chamber via the transfer port, the processing chamber having a processing table on which a substrate can be placed, and a substrate to be carried away from the processing table. A substrate support pin that can be supported and transferred to the transfer robot, and a transfer control unit that controls the drive of at least one of the substrate support pin and the processing table to transfer the substrate from the processing table to the substrate support pin. And the transfer robot control means transmits a transfer timing signal informing the timing after the start of the carry-out operation of the substrate from the processing chamber having the unloading target substrate to the transfer control means of the processing chamber. Said transfer control means, based on the reception of the transfer timing signal from the transfer robot control means, said substrate after unloading operation start of the transfer robot, wherein the let transferred to the substrate support pins.
As described above, by coordinating the operation by the transfer robot and the operation by the lift pins, it is possible to reduce the time in which the processed substrate is placed on the support pins as much as possible and to prevent the displacement of the substrate due to the apparatus vibration. .
Here, the substrate unloading operation at the “timing after the start of the substrate unloading operation” is completed after the transfer robot completes another substrate transfer operation or when the transfer robot is in the initial position. Say what to do. Therefore, this operation is different from the narrow carrying-out operation from when the carrying-out substrate is transferred to the carrying robot to when the substrate leaves the processing chamber.
プロセスチャンバーで搬出待ち状態にある処理済み基板の振動による位置ずれを防止できる。
本発明によれば、特別な構造物を設けることなく、簡易かつ有効に基板の位置ずれを防止可能であり、また基板近傍に複雑な構造物を設けることによるパーティクルの発生等を防止可能である。
It is possible to prevent displacement due to vibration of the processed substrate in the process chamber waiting to be carried out.
According to the present invention, it is possible to easily and effectively prevent displacement of the substrate without providing a special structure, and it is possible to prevent generation of particles due to providing a complicated structure in the vicinity of the substrate. .
［第１実施形態］
図１に本実施形態にかかる基板処理装置の外観図を示す。
図１の基板処理装置は、基板搬送用の搬送ロボット３０が配置された搬送チャンバ２０と、搬送チャンバ２０の周囲にスリットバルブ７０を介して接続されたプロセスチャンバ１０と、ロードロック／アンロードロックチャンバ４０Ａ，４０Ｂと、を備える。ロードロック／アンロードロックチャンバ４０Ａ，４０Ｂは、大気側搬送ロボット５１を備えた大気側基板供給室５０と搬送チャンバ２０との間に配置され、大気側基板供給室５０から供給される基板を搬送チャンバ２０に供給し、搬送チャンバ２０から基板を回収するために設けられる。各チャンバ２０，１０は、夫々、ターボ分子ポンプなどの排気装置を備えており、夫々独立に減圧可能であり、減圧条件下で搬送ロボット３０によるチャンバ２０，１０間での基板の搬送が可能である。なお、排気装置は、本発明の適用において必須のものではない。
[First Embodiment]
FIG. 1 shows an external view of a substrate processing apparatus according to this embodiment.
1 includes a transfer chamber 20 in which a transfer robot 30 for transferring a substrate is disposed, a process chamber 10 connected to the periphery of the transfer chamber 20 via a slit valve 70, and a load lock / unload lock. Chambers 40A and 40B. The load lock / unload lock chambers 40 </ b> A and 40 </ b> B are arranged between the atmosphere side substrate supply chamber 50 including the atmosphere side transfer robot 51 and the transfer chamber 20, and transfer substrates supplied from the atmosphere side substrate supply chamber 50. It is provided to supply to the chamber 20 and recover the substrate from the transfer chamber 20. Each of the chambers 20 and 10 includes an exhaust device such as a turbo molecular pump and can be decompressed independently, and the substrate can be transported between the chambers 20 and 10 by the transport robot 30 under decompressed conditions. is there. Note that the exhaust device is not essential in the application of the present invention.
プロセスチャンバ１０は、基板に対する処理を実行するための反応室であり、スパッタ成膜用のスパッタチャンバ、ＣＶＤ（chemical
vacuum deposition）成膜用のＣＶＤチャンバ、基板を加熱又は冷却するための温度調整チャンバなどとして構成される。また、プロセスチャンバ１０は、図２に示すように、処理対象の基板Ｗを載置するための載置台１１と、リフトピン１２と、チャンバ処理制御部１４と、を備える。リフトピン１２は、詳細は図示しないがシリンダなどの駆動装置に接続され、昇降可能になっており、下降状態では載置台１１内部の孔に収納され（図３の状態）、上昇状態では載置台１１表面に突き出て、載置台１１から離した状態で基板Ｗを支持可能に構成されている（図２の状態）。
The process chamber 10 is a reaction chamber for performing processing on a substrate, and is a sputter chamber for sputter film formation, CVD (chemical
Vacuum deposition) It is configured as a CVD chamber for film formation, a temperature adjustment chamber for heating or cooling the substrate, and the like. Further, as shown in FIG. 2, the process chamber 10 includes a mounting table 11 for mounting a substrate W to be processed, a lift pin 12, and a chamber processing control unit 14. Although not shown in detail, the lift pin 12 is connected to a driving device such as a cylinder and can be moved up and down. The lift pin 12 is housed in a hole inside the mounting table 11 in the lowered state (the state shown in FIG. 3), and placed in the raised state. It protrudes on the surface and is configured to be able to support the substrate W in a state separated from the mounting table 11 (state shown in FIG. 2).
チャンバ処理制御部１４は、移載制御部１３を備える。移載制御部１３は、リフトピン１２の駆動装置を制御し、リフトピン１２を昇降させることで、搬送ロボット３０、載置台１１間で基板Ｗを移載させる。さらに、本実施形態では、移載制御部１３は、搬送ロボット３０の動作を制御する搬送制御部３２からの搬送タイミング信号を受信し、これに基づきリフトピン１２の昇降動作を実行する。なお、図２では、載置台１１とリフトピン１２のみを図示しているが、プロセスチャンバ１０は、例えばスパッタチャンバであればカソードや整合器などの基板に対する処理を行うための装置を備えており、これらはチャンバ処理制御部１４により、搬送ロボット３０などの基板搬送系とは独立して制御される。なお、チャンバ処理制御部１４は、例えばＰＬＣ（プログラマブルロジックコントローラ）などにより構成される。 The chamber processing control unit 14 includes a transfer control unit 13. The transfer control unit 13 controls the drive device for the lift pins 12 and moves the lift pins 12 up and down to transfer the substrate W between the transport robot 30 and the mounting table 11. Further, in the present embodiment, the transfer control unit 13 receives a transport timing signal from the transport control unit 32 that controls the operation of the transport robot 30, and executes the lifting / lowering operation of the lift pins 12 based on this signal. In FIG. 2, only the mounting table 11 and the lift pins 12 are illustrated, but the process chamber 10 includes a device for performing processing on a substrate such as a cathode and a matching unit in the case of a sputtering chamber, for example. These are controlled by the chamber processing control unit 14 independently of the substrate transfer system such as the transfer robot 30. The chamber processing control unit 14 is configured by, for example, a PLC (programmable logic controller).
図１の搬送ロボット３０は、回転動作により基板Ｗを保持可能な保持部３１を基板Ｗの搬送先又は搬送元となるプロセスチャンバ１０側に向け、伸縮動作により保持部３１をプロセスチャンバ１０に近づけ又はプロセスチャンバ１０から離すことで、基板を搬送する。 The transfer robot 30 in FIG. 1 directs the holding unit 31 capable of holding the substrate W by the rotation operation toward the process chamber 10 that is the transfer destination or transfer source of the substrate W, and moves the holding unit 31 closer to the process chamber 10 by the expansion / contraction operation. Alternatively, the substrate is transferred by being separated from the process chamber 10.
次に、図４のフローを参照して、本実施形態にかかる基板搬出動作について説明する。
図４のフローでは、プロセスチャンバ１０における移載制御部１３と搬送制御部３２における夫々の動作を示す。あるプロセスチャンバ１０Ａにおけるプロセス処理（例えば所定の成膜処理）が終了したことを検知すると（ステップＳ１０１）、当該プロセスチャンバ１０Ａの移載制御部１３は、搬送制御部３２から搬送タイミング信号が送信されるのを待機する（ステップＳ１０２）。このとき、搬送ロボット３０は他のプロセスチャンバ１０における基板の搬送を行っているため（ステップＳ００１）、基板Ｗは載置台１１上に載置されたままの状態で搬送順まで待機する（図３の状態）。
その後、搬送制御部３２は、他の基板の搬送が完了し（ステップＳ００２）、プロセスチャンバ１０Ａからの基板Ｗ回収動作を開始するところで、移動量の情報を含む搬送タイミング信号を出力する（ステップＳ１０３）。
Next, the substrate carry-out operation according to the present embodiment will be described with reference to the flow of FIG.
In the flow of FIG. 4, each operation | movement in the transfer control part 13 in the process chamber 10 and the conveyance control part 32 is shown. When it is detected that a process process (for example, a predetermined film forming process) in a certain process chamber 10A has been completed (step S101), the transfer control unit 13 of the process chamber 10A receives a transfer timing signal from the transfer control unit 32. (Step S102). At this time, since the transfer robot 30 is transferring the substrate in the other process chamber 10 (step S001), the substrate W remains on the mounting table 11 and waits for the transfer order (FIG. 3). State).
Thereafter, the transfer control unit 32 completes transfer of another substrate (step S002), and outputs a transfer timing signal including movement amount information when the substrate W recovery operation from the process chamber 10A is started (step S103). ).
移載制御部１３は、搬送制御部３２から搬送タイミング信号を受信すると、搬送ロボット３０の移動量の情報に基づいて、リフトピン１２から搬送ロボット３０への移載タイミング（搬送ロボット３０の移載位置への到着タイミング）を演算し（ステップＳ１０４）、当該移載タイミングで移載可能となるようにリフトピン１２を上昇させる（ステップＳ１０５〜Ｓ１０６）。具体的には、本実施形態では、移動量として、基板Ｗ搬出動作開始位置（他の基板搬送動作の完了位置）からプロセスチャンバ１０Ａまでの搬送ロボット３０の回転量を特定可能な情報（例えば、９０°）を受信する（図５）。移載制御部１３では、この回転量の回転動作を行うのに要する時間を、予め定めた回転量と時間の関数からなる演算式やマップ等を用いて算出する。リフトピン１２の上昇により載置台１１に載置された基板Ｗが突き上げられ、リフトピン１２に保持される。リフトピン１２は、所定の移載位置まで上昇後、停止する。 When the transfer control unit 13 receives the transfer timing signal from the transfer control unit 32, the transfer control unit 13 transfers the transfer timing from the lift pins 12 to the transfer robot 30 (the transfer position of the transfer robot 30) based on the movement amount information of the transfer robot 30. Is calculated (step S104), and the lift pins 12 are raised so that transfer can be performed at the transfer timing (steps S105 to S106). Specifically, in the present embodiment, as the movement amount, information that can specify the rotation amount of the transfer robot 30 from the substrate W unloading operation start position (another substrate transfer operation completion position) to the process chamber 10A (for example, 90 °) is received (FIG. 5). The transfer control unit 13 calculates the time required to perform the rotation operation of the rotation amount using an arithmetic expression or a map that is a function of a predetermined rotation amount and time. The substrate W mounted on the mounting table 11 is pushed up by the lift pins 12 and is held by the lift pins 12. The lift pin 12 stops after being raised to a predetermined transfer position.
上記移載制御部１３の動作と並行して、搬送制御部３２における搬送ロボット３０の回転動作（ステップＳ１０７）、伸長動作（ステップＳ１０８）が実行される。これにより、搬送ロボット３０の保持部３１を他の基板搬送動作完了位置からプロセスチャンバ１０Ａに向けた後、搬送チャンバ２０内の収縮位置からプロセスチャンバ１０Ａにおける基板Ｗの移載位置まで伸長させる。保持部３１が移載位置まで移動するときには、リフトピン１２の上昇動作が完了しており、従って、保持部３１は、リフトピン１２に保持される基板Ｗと載置台１１の間で停止する。なお、搬送ロボット３０が通過する際、搬送チャンバ２０とプロセスチャンバ１０Ａとの間のスリットバルブ７０が開かれる。
その後、移載制御部１３は所定時間経過後、リフトピン１２を下降させることで、基板Ｗが搬送ロボット３０の保持部３１に移載され（ステップＳ１０９）、搬送制御部３２が搬送ロボット３０のアームを収縮し、保持部３１を搬送チャンバ２０内に戻すことで、基板搬出動作が完了する（ステップＳ１１０）。
In parallel with the operation of the transfer control unit 13, the rotation operation (step S107) and the extension operation (step S108) of the transfer robot 30 in the transfer control unit 32 are executed. Thus, after the holding unit 31 of the transfer robot 30 is directed from the other substrate transfer operation completion position to the process chamber 10A, the holding unit 31 is extended from the contracted position in the transfer chamber 20 to the transfer position of the substrate W in the process chamber 10A. When the holding unit 31 moves to the transfer position, the lifting pin 12 has been lifted, and the holding unit 31 stops between the substrate W held by the lift pin 12 and the mounting table 11. When the transfer robot 30 passes, the slit valve 70 between the transfer chamber 20 and the process chamber 10A is opened.
Thereafter, the transfer control unit 13 lowers the lift pins 12 after a predetermined time has elapsed, whereby the substrate W is transferred to the holding unit 31 of the transfer robot 30 (step S109), and the transfer control unit 32 moves the arm of the transfer robot 30. And the holding unit 31 is returned into the transfer chamber 20, whereby the substrate carry-out operation is completed (step S110).
以上のように、搬送制御部３２と移載制御部の動作を連動させることで、基板搬出待機時の装置振動による基板の位置ずれを有効に防止できる。
また、搬送制御部３２から移動量の情報を含む搬送タイミング信号を送信することで、各プロセスチャンバ１０におけるプロセス終了時に、搬送ロボット３０がどのような基板搬送動作を行っていたとしても、正確に移載タイミングを算出し、振動の少ない適切なタイミングで基板搬出動作を行うことができる。
また、どのプロセスチャンバ１０からの基板搬出動作を行う場合にも、搬送制御部３２の側から一定のタイミングで搬送タイミング信号を送信し、それを受信するプロセスチャンバ１０の側で移載タイミングを算出することで、各プロセスにより載置台１１の吸着力が異なる場合にも、必要な移載時間を逆算して適切な移載タイミングを算出することが可能である。また、搬送制御部３２側で判断しなくてよいので、負荷が少なく、プロセスチャンバの構成や処理内容に応じた変更が容易である。
As described above, by linking the operations of the transfer control unit 32 and the transfer control unit, it is possible to effectively prevent the positional deviation of the substrate due to the apparatus vibration during standby for carrying out the substrate.
Further, by transmitting a transfer timing signal including movement amount information from the transfer control unit 32, it is possible to accurately perform whatever substrate transfer operation the transfer robot 30 performs at the end of the process in each process chamber 10. The transfer timing can be calculated, and the substrate carry-out operation can be performed at an appropriate timing with less vibration.
In addition, when carrying out the substrate carry-out operation from any process chamber 10, a transfer timing signal is transmitted from the transfer control unit 32 side at a fixed timing, and the transfer timing is calculated on the process chamber 10 side receiving the signal. Thus, even when the adsorption force of the mounting table 11 differs depending on each process, it is possible to calculate an appropriate transfer timing by calculating back the necessary transfer time. In addition, since it is not necessary to make a determination on the transfer control unit 32 side, the load is small, and a change according to the configuration of the process chamber and the processing content is easy.
なお、必ずしも対象となるプロセスチャンバの搬出動作開始時に信号を出力する場合に限られず、対象となるプロセスチャンバにその搬出動作開始タイミングを特定可能な情報を送信するものであればよい。 Note that the present invention is not necessarily limited to the case where a signal is output at the start of the unloading operation of the target process chamber, and any information that can specify the unloading operation start timing may be transmitted to the target process chamber.
［第２実施形態］
次に、図６に示すフローチャートを用いて、第２実施形態について説明する。本実施形態は、ほぼ第１実施形態と同様の動作を行うが、搬送タイミング信号を送信する契機と、搬送タイミング信号が含む情報が異なっている。具体的には、第２実施形態では、プロセスが終了した移載制御部１３からの、自チャンバを特定可能な情報（例えば、１０Ａ）を含む搬送問合せ信号の送信（ステップＳ１０１−１）に応答して、搬送制御部３２が搬送タイミング信号を当該指定されたプロセスチャンバ１０Ａに送信している（ステップＳ１０１−２）。これにより、よりプロセスチャンバ１０Ａ側での必要に応じた信号を得ることができる。
[Second Embodiment]
Next, a second embodiment will be described using the flowchart shown in FIG. The present embodiment performs substantially the same operation as that of the first embodiment, but the trigger for transmitting the transport timing signal is different from the information included in the transport timing signal. Specifically, in the second embodiment, the transfer control unit 13 that has completed the process responds to transmission of a conveyance inquiry signal including information (for example, 10A) that can identify the own chamber (step S101-1). Then, the transfer control unit 32 transmits a transfer timing signal to the designated process chamber 10A (step S101-2). As a result, it is possible to obtain a signal as required on the process chamber 10A side.
また、搬送タイミング信号は、対象プロセスチャンバ１０からの基板搬出タイミングを特定することができれば、その送信タイミングは限定されないことは上述の通りである。図６の例では、送信タイミングが任意の搬送問合せ信号に応じたものとなるから、搬送順序を特定可能な情報を含む搬送タイミング信号を送信している。具体的に図の搬送タイミング信号の例（１０Ｄ→１０Ｃ→１０Ａ）では、搬送チャンバ２０とプロセスチャンバ１０Ｄ、１０Ｃ間での基板搬送動作後にプロセスチャンバ１０Ａからの基板搬出動作が行われることを示す情報を含んでいる。 Further, as described above, the transfer timing signal is not limited as long as the substrate transfer timing from the target process chamber 10 can be specified. In the example of FIG. 6, since the transmission timing corresponds to an arbitrary conveyance inquiry signal, a conveyance timing signal including information that can specify the conveyance order is transmitted. Specifically, in the example of the transfer timing signal (10D → 10C → 10A), information indicating that the substrate unloading operation from the process chamber 10A is performed after the substrate transfer operation between the transfer chamber 20 and the process chambers 10D, 10C. Is included.
［第３実施形態］
次に、第３実施形態について、図７のフローを用いて説明する。第３実施形態では装置構成は上述の実施形態と略同様であるが、移載制御部１３で移載タイミングを演算することなく、リフトピン１２を上昇させている点で他の実施形態と異なっている。以下、上記実施形態と同じ部分は簡略化して説明する。
プロセスチャンバ１０Ａにおけるプロセスが終了すると（ステップＳ２０１）、移載制御部１３では搬送制御部３２からの信号を待機する（ステップＳ２０２）。搬送制御部３２は、搬出対象基板を有するプロセスチャンバ１０Ａからの基板の回収に向かうべく、プロセスチャンバ１０Ａ方向に保持部３１を向ける回転動作が完了した時点（ステップＳ２０３）で、搬送タイミング信号を移載制御部１３に送信する（ステップＳ２０４）。これを受信した移載制御部１３において、リフトピン１２の上昇動作を行う（ステップＳ２０５）。その後は、上述の実施形態と同様であり、所定時間の進行に従ったシーケンス動作により、基板Ｗ下まで搬送ロボット３０の保持部３１が伸長した後（ステップＳ２０６）、リフトピン１２を下降させて保持部３１に基板Ｗを移載し（ステップＳ２０７）、搬送ロボット３０を搬送チャンバ２０内へ収縮させることで（ステップＳ２０８）、基板の搬出動作を完了する。
[Third Embodiment]
Next, a third embodiment will be described using the flow of FIG. In the third embodiment, the apparatus configuration is substantially the same as that of the above-described embodiment. However, the third embodiment is different from the other embodiments in that the lift pin 12 is raised without calculating the transfer timing by the transfer control unit 13. Yes. Hereinafter, the same part as the above embodiment will be described in a simplified manner.
When the process in the process chamber 10A is completed (step S201), the transfer control unit 13 waits for a signal from the transfer control unit 32 (step S202). The transfer control unit 32 moves the transfer timing signal at the time when the rotation operation for directing the holding unit 31 in the direction of the process chamber 10A is completed (step S203) in order to recover the substrate from the process chamber 10A having the substrate to be carried out. It transmits to the mounting control part 13 (step S204). In the transfer control unit 13 that has received this, the lift pin 12 is lifted (step S205). Thereafter, as in the above-described embodiment, the holding unit 31 of the transfer robot 30 extends to the bottom of the substrate W by a sequence operation according to the progress of a predetermined time (step S206), and then the lift pin 12 is lowered and held. The substrate W is transferred to the unit 31 (step S207), and the transfer robot 30 is contracted into the transfer chamber 20 (step S208), thereby completing the substrate transfer operation.
このように、振動が発生しやすい回転動作の完了後に一律にリフトピン１２を上昇させることで、移載制御部１３等で判断処理等を行うことなく、簡便且つ効果的に振動による位置ずれの発生を防止できる。
なお、上記実施形態では、リフトピン１２を載置台１１に対して上下動させることで、移載動作を行っているがこれに限らず、載置台１１の方をリフトピン１２に対して移動させてもよく、両方を移動させて移載動作を行うようにしてもよい。
As described above, the lift pins 12 are uniformly raised after the completion of the rotation operation that is likely to generate vibrations, so that the positional deviation caused by the vibrations can be easily and effectively performed without performing the determination process in the transfer control unit 13 or the like. Can be prevented.
In the above embodiment, the transfer operation is performed by moving the lift pin 12 up and down with respect to the mounting table 11. However, the present invention is not limited thereto, and the mounting table 11 may be moved with respect to the lift pin 12. Alternatively, the transfer operation may be performed by moving both of them.
１０ プロセスチャンバ
２０ 搬送チャンバ
３０ 搬送ロボット
３１ 保持部
７０ スリットバルブ
DESCRIPTION OF SYMBOLS 10 Process chamber 20 Transfer chamber 30 Transfer robot 31 Holding part 70 Slit valve
Claims (7)
前記搬送ロボットを制御する搬送ロボット制御手段と、
前記搬送口を介して搬送室に接続される処理室と、を備え、
前記処理室は、
基板を載置可能な処理台と、
搬出対象の基板を前記処理台から離間した状態で支持し、前記搬送ロボットに移載可能な基板支持ピンと、
前記基板支持ピン及び前記処理台の少なくとも一方の駆動を制御して、前記基板を処理台から基板支持ピンに移載させる移載制御手段と、を備え、
前記搬送ロボット制御手段は、搬出対象基板を有する処理室からの基板の搬出動作開始後のタイミングを知らせる搬送タイミング信号を当該処理室の移載制御手段に送信し、
前記移載制御手段は、前記搬送ロボット制御手段からの搬送タイミング信号の受信に基づいて、前記搬送ロボットの搬出動作開始後に前記基板を基板支持ピンに移載させることを特徴とする基板処理装置。 A transport robot capable of transporting a substrate, and a transport chamber having a plurality of transport ports through which a substrate transported by the transport robot can pass,
A transfer robot control means for controlling the transfer robot;
A processing chamber connected to the transfer chamber via the transfer port, and
The processing chamber is
A processing table on which a substrate can be placed;
A substrate support pin that supports the substrate to be carried out in a state separated from the processing table, and can be transferred to the transfer robot;
Transfer control means for controlling the drive of at least one of the substrate support pins and the processing table to transfer the substrate from the processing table to the substrate support pins,
The transfer robot control means transmits a transfer timing signal that informs the timing after the start of the operation of unloading the substrate from the processing chamber having the unloading target substrate to the transfer control means of the processing chamber,
The substrate transfer apparatus, wherein the transfer control unit transfers the substrate to a substrate support pin after the transfer operation of the transfer robot is started based on reception of a transfer timing signal from the transfer robot control unit.
前記移載制御手段は、前記搬送タイミング信号の受信に応答して前記基板を基板支持ピンに移載させることを特徴とする請求項１に記載の基板処理装置。 The transfer robot control means is directed to a processing chamber having a substrate to be carried out by a rotation operation and approaches a substrate position supported by the substrate support pins by an extension operation, and after the rotation operation is completed, Transmitting the transfer timing signal to a transfer control means of a processing chamber having a substrate;
The substrate processing apparatus according to claim 1, wherein the transfer control unit transfers the substrate onto a substrate support pin in response to reception of the transfer timing signal.
前記移載制御手段は、前記搬送ロボットによる自処理室からの搬出動作開始後に前記基板を基板支持ピンに移載させることを特徴とする基板移載方法。 A transport robot capable of transporting a substrate, a transport chamber having a plurality of transport ports that can be transported by the transport robot, a processing table connected to the transport chamber via the transport port, and on which a substrate can be placed, The target substrate is supported in a state of being separated from the processing table, and the substrate supporting pin that can be transferred to the transfer robot, and the driving of at least one of the substrate supporting pin and the processing table are controlled, and the substrate is controlled. In a substrate processing apparatus comprising a transfer chamber having transfer control means for transferring from a processing table to a substrate support pin, a transfer method for transferring a substrate from the processing table to a transfer robot via the substrate support pin. ,
The substrate transfer method, wherein the transfer control means transfers the substrate to a substrate support pin after the carrying robot starts an unloading operation from its own processing chamber.
前記移載制御手段は、前記搬送ロボットによる自処理室からの搬出動作開始後に前記基板を基板支持ピンに移載させることを特徴とする基板移載方法。
A transfer robot capable of transferring a substrate, a transfer chamber having a plurality of transfer ports through which a substrate transferred by the transfer robot can pass, and connected to the transfer chamber via the transfer port, and a substrate can be placed And a substrate support pin that supports the substrate to be carried away from the processing table and can be transferred to the transfer robot, and controls driving of at least one of the substrate support pin and the processing table. And a processing chamber having transfer control means for transferring the substrate from the processing table to the substrate support pin, and transferring the substrate from the processing table to the transfer robot via the substrate support pin. A loading method,
The substrate transfer method, wherein the transfer control means transfers the substrate to a substrate support pin after the carrying robot starts an unloading operation from its own processing chamber.
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| CN104213086A (en) * | 2014-09-12 | 2014-12-17 | 光驰科技(上海)有限公司 | Double-arm automatic substrate loading type sputter coating method and device |
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