JP2011226855A - Heat transfer analyzer and heat transfer analysis method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To estimate a temperature distribution of an object.SOLUTION: A heat transfer analyzer comprises a primary analysis part and a secondary analysis part. The primary analysis part performs a heat transfer analysis on an analysis model under a boundary condition specifying heat flux to produce a primary temperature distribution. The secondary analysis part estimates a temperature error distribution in an analysis area besides measuring points based on an error value between an actually measured temperature at a measuring point set to the analysis model and a temperature at the measuring point in the primary temperature distribution to correct the primary temperature distribution on the basis of the temperature error distribution. The secondary analysis part may perform a second heat transfer analysis with an error value between an actually measured temperature at a measuring point and the temperature at the measuring point in the primary temperature distribution as a temperature restricted boundary condition to estimate the temperature error distribution.

Description

  The present invention relates to a heat transfer analysis device and a heat transfer analysis method.

  Patent Document 1 describes a ground temperature measurement method in which the ground temperature of a ground surface layer region where a thermometer cannot be embedded is obtained by heat conduction analysis using the measurement results of thermography and meteorological data measurement equipment as boundary conditions. .

Japanese Patent Laid-Open No. 10-48054

  In general, thermography is a simple and useful method capable of relatively comparing temperatures over a relatively wide range of surfaces. However, when the surface emissivity is unknown, the accuracy of absolute temperature is not guaranteed. In particular, when the surface is glossy, it is known that the measurement error increases due to the influence of reflected light.

  Then, an object of this invention is to provide the heat-transfer analysis apparatus and the heat-transfer analysis method which can obtain | require the temperature distribution of a target object accurately.

  A heat transfer analysis device according to an aspect of the present invention includes a model creation unit that creates an analysis model representing an object, a heat transfer analysis unit that performs heat transfer analysis on the analysis model, and an analysis result process that processes the analysis result A section. The model creation unit sets a position at which the temperature is measured on the object as a measurement point in the analysis model, and the heat transfer analysis unit performs the first heat transfer under a boundary condition that defines a heat flux. Analysis is performed to generate a first temperature distribution, and a temperature error value between the measured temperature at the measurement point and the temperature at the measurement point in the first temperature distribution is set as a second temperature constraint boundary condition at the measurement point. The analysis result processing unit outputs the superposition of the first temperature distribution and the second temperature distribution as the temperature distribution of the object. To do.

  Another aspect of the present invention is a heat transfer analysis method. This method is a heat transfer analysis method for obtaining a temperature distribution of an object by using an actual temperature of a measurement point set in an analysis model representing the object, and the first heat transfer analysis is performed by calculating the heat flux. A step of generating a first temperature distribution by executing under specified boundary conditions, and a second heat transfer analysis, wherein the temperature error between the measured temperature and the temperature of the measurement point in the first temperature distribution The step of generating the second temperature distribution by executing the value as the temperature constraint boundary condition of the measurement point and outputting the superposition of the first temperature distribution and the second temperature distribution as the temperature distribution of the object And a step of.

  Yet another embodiment of the present invention is a heat transfer analysis device. The apparatus includes a primary analysis unit that generates a primary temperature distribution by performing heat transfer analysis on an analysis model under boundary conditions that define heat flux, an actual temperature of a measurement point set in the analysis model, and the A secondary analysis unit that estimates a temperature error distribution in an analysis region other than the measurement point based on an error value from the temperature of the measurement point in the primary temperature distribution, and corrects the primary temperature distribution based on the temperature error distribution; .

  According to the present invention, the temperature distribution of an object can be obtained with high accuracy.

It is a front view of the injection molding machine which can apply the heat transfer analysis device concerning one embodiment of the present invention. It is a figure which shows typically the structure of the heat-transfer analysis apparatus which concerns on one Embodiment of this invention. It is a figure which shows typically the structure of the heat-transfer analyzer which concerns on other one Embodiment of this invention. It is a figure which shows typically the structure of the heat-transfer analyzer which concerns on other one Embodiment of this invention. It is a figure which shows typically the structure of the processing apparatus which concerns on one Embodiment of this invention. The main functional blocks which the temperature estimation apparatus which concerns on one Embodiment of this invention processes are illustrated. It is a flowchart for demonstrating the temperature estimation process which concerns on one Embodiment of this invention. It is a figure which shows typically an example of the analysis model which concerns on one Embodiment of this invention. It is a flowchart for demonstrating the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure for demonstrating an example of the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure for demonstrating an example of the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure for demonstrating an example of the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure for demonstrating an example of the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure which shows an example of the temperature distribution obtained by the conventional heat-transfer analysis process. It is a figure which shows an example of the temperature distribution obtained by the heat-transfer analysis process which concerns on one Embodiment of this invention. It is a figure which shows an example of the temperature distribution obtained by the heat-transfer analysis process which concerns on a 1st comparative example. It is a figure which shows an example of the temperature distribution obtained by the heat-transfer analysis process which concerns on a 2nd comparative example. It is a figure which shows an example of the temperature distribution obtained by the heat-transfer analysis process which concerns on one Embodiment of this invention.

  According to an embodiment of the present invention, a heat transfer analysis method mainly including a two-stage process is provided. In the first stage, a normal heat transfer analysis is executed as a primary analysis. The measured temperature is not considered in the primary analysis. Based on the primary temperature distribution obtained by the primary analysis and the actually measured temperature, a secondary analysis for obtaining a temperature error distribution is executed in the second stage. Since the temperature error can be removed from the primary temperature distribution in this way, the temperature distribution of the object can be obtained with high accuracy.

  In this way, the work load of so-called “fitting” can be reduced. Matching is an operation of adjusting analysis conditions set as a premise of analysis in order to match the analysis results with the actual measurement results. The analysis conditions include, for example, heat generation or heat absorption per unit time from a heat source (heater, cooling medium, etc.) installed on the object, heat transfer coefficient between the object and the external region, and the like. It is not always easy to accurately determine these analysis conditions in advance in heat transfer analysis. Since the analysis result is compared with the actual measurement result and the operation of adjusting the analysis condition by trial and error is repeated, the “matching” operation tends to take an enormous amount of time. Alternatively, in order to efficiently perform the “combination” work, craftsman-like skills tend to be required.

  According to one embodiment of the present invention, a heat transfer analysis apparatus suitable for estimating a temperature distribution of an object having a glossy surface using thermography is provided. A black body mark is formed on the glossy surface, and the actually measured temperature at the mark is used to create a temperature error distribution. In this embodiment, the measured temperature is not directly used for the heat transfer analysis as a temperature constraint boundary condition for the heat transfer analysis.

  Note that the present invention is not limited to the estimation of the temperature of the glossy surface, and can be applied to the estimation of the temperature of an object having an unknown area and a known area of the emissivity, as will be described in detail below. The present invention can also be applied to an object that can identify whether or not the radiation rate of a certain region is within a predetermined radiation rate range. The temperature sensor is not limited to thermography, and a non-contact temperature sensor may be used. A contact-type temperature sensor can also be used.

  FIG. 1 is a front view of an injection molding machine suitable for a heat transfer analysis apparatus according to an embodiment of the present invention. The injection molding machine 340 includes an injection device 350 and a mold clamping device 370.

  The injection device 350 includes a heating cylinder 351, and a hopper 352 that supplies resin is disposed in the heating cylinder 351. Further, a screw 353 is disposed in the heating cylinder 351 so as to be able to advance and retreat and to be rotatable. The rear end of the screw 353 is rotatably supported by the support member 354. A measuring motor 355 such as a servo motor is attached to the support member 354 as a drive unit. The rotation of the weighing motor 355 is transmitted to the screw 353 of the driven portion via a timing belt 356 attached to the output shaft 361 of the weighing motor 355. A detector 362 is directly connected to the rear end of the output shaft 361 of the weighing motor 355. The detector 362 detects the rotation speed or rotation amount of the metering motor 355. Based on the number of rotations or amount of rotation detected by the detector 362, the rotational speed of the screw 353 is obtained.

  The injection device 350 further includes a screw shaft 357 parallel to the screw 353 so as to be rotatable. The rear end of the screw shaft 357 is connected to the injection motor 359 via a timing belt 358 attached to the output shaft 363 of the injection motor 359 such as a servo motor. Therefore, the screw shaft 357 can be rotated by the injection motor 359. The front end of the screw shaft 357 is screwed with a nut 360 fixed to the support member 354. When the injection motor 359 that is a drive unit is driven and the screw shaft 357 that is a drive transmission unit is rotated via the timing belt 358, the support member 354 moves forward and backward.

  A load cell 365 as a load detector is attached to the support member 354. The forward / backward movement of the support member 354 is transmitted to the screw 353 via the load cell 365, whereby the screw 353 moves forward / backward. Data corresponding to the force detected by the load cell 365 is sent to the control device 310. A detector 364 is directly connected to the rear end of the output shaft 363 of the injection motor 359. The detector 364 detects the rotation speed or rotation amount of the injection motor 359. Based on the number of rotations and the amount of rotation detected by the detector 364, the moving speed of the screw 353 in the forward / backward direction or the position in the forward / backward direction is obtained.

  The mold clamping device 370 includes a movable platen 372 to which a movable mold 371 is attached, and a fixed platen 374 to which a fixed mold 373 is attached. The movable platen 372 and the fixed platen 374 are connected by a tie bar 375. The movable platen 372 is slidable along the tie bar 375. The mold clamping device 370 includes a toggle mechanism 377. The toggle mechanism 377 has one end connected to the movable platen 372 and the other end connected to the toggle support 376. A ball screw shaft 379 is rotatably supported at the center of the toggle support 376. A nut 381 fixed to a cross head 380 provided in the toggle mechanism 377 is screwed onto the ball screw shaft 379. A pulley 382 is disposed at the rear end of the ball screw shaft 379, and a timing belt 384 is bridged between the output shaft 383 of the mold clamping motor 378 such as a servo motor and the pulley 382.

  In the mold clamping device 370, when the mold clamping motor 378 that is a drive unit is driven, the rotation of the mold clamping motor 378 is transmitted to the ball screw shaft 379 that is the drive transmission unit via the timing belt 384. Then, the ball screw shaft 379 and the nut 381 change the direction of motion from rotational motion to linear motion, and the toggle mechanism 377 is operated. By the operation of the toggle mechanism 377, the movable platen 372 slides along the tie bar 375, and mold closing, mold clamping, and mold opening are performed.

  A detector 385 is directly connected to the rear end of the output shaft 383 of the mold clamping motor 378. The detector 385 detects the rotation speed or rotation amount of the mold clamping motor 378. Based on the number of rotations or the amount of rotation detected by the detector 385, the position of the crosshead 380 that moves forward and backward with the rotation of the ball screw shaft 379, or the driven part connected to the crosshead 380 by the toggle mechanism 377 The position of a certain movable platen 372 is determined. The control device 310 controls the measuring motor 355, the injection motor 359, and the mold clamping motor 378.

  As indicated by a broken line in FIG. 1, a cavity cav is formed inside the mold between the movable mold 371 and the fixed mold 373. The cavity cav and the inside of the heating cylinder 351 communicate with each other.

  The injection molding machine 340 is provided with a mold temperature control system (not shown) to maintain the movable mold 371 and the fixed mold 373 at a predetermined temperature. Further, a temperature control system of a system different from the mold temperature control system may be provided along with the injection molding machine 340. This separate temperature control system is configured to control the temperature of components of the injection molding machine 340 (for example, tie bars 375 and platens 372 and 374). In the temperature control system, for example, temperature control parts are set in various places in a temperature control target (for example, a mold), and a medium flow path for flowing a temperature control medium is formed in each temperature control part. Moreover, each medium flow path and the temperature control controller are connected. The temperature control system may include a heater or a cooling source for directly heating or cooling the inside or the surface of the temperature control target. These heaters or cooling sources may also be connected to the temperature controller and controlled to maintain the object at a predetermined temperature.

  The movable mold 371 and the fixed mold 373 are normally maintained at a temperature higher than the ambient room temperature by a temperature control system. In addition, there is exhaust heat from each motor arranged in the vicinity, and heat inflow from molten resin supplied to the cavity cav. For this reason, temperature distribution occurs in each element of the injection molding machine 340 such as the molds 371 and 373 and the tie bars 375 and the platens 372 and 374. It is preferable that the influence of the thermal deformation caused by the temperature distribution on the shape accuracy of the injection molded product is as small as possible. Therefore, it is preferable that the mold and the injection molding machine 340 are designed in consideration of thermal deformation analysis.

  In one embodiment, a temperature measurement mark 300 is formed on the exposed metal surface of the mold and injection molding machine 340. The temperature measurement mark 300 is formed, for example, by attaching a known black body tape to a metallic glossy surface. In the drawing, the mark 300 is represented by a black square, but this is only for convenience of explanation. The appearance (for example, shape and color) of the mark 300 can be determined as appropriate. The mark 300 is preferably provided at a plurality of locations for each part to be temperature-measured. In the example shown in FIG. 1, a plurality of temperatures are measured for each of the molds 371 and 373, the tie bar 375, and the platens 372 and 374. A mark 300 is formed. As will be described later, a thermal image of an object having the temperature measurement mark 300 is taken by a thermography unit (see FIG. 2).

  FIG. 2 is a diagram schematically showing the configuration of the heat transfer analysis apparatus 100 according to an embodiment of the present invention. The heat transfer analysis device 100 is a device for obtaining the temperature distribution of the measurement object 10 by heat transfer analysis. A measurement mark A having a known emissivity is formed in advance on the surface of the measurement object 10. The heat transfer analysis device 100 includes a plurality of thermography units 20 and 30 and a processing device 40. In FIG. 2, for convenience of explanation, an XYZ orthogonal coordinate system is defined in which the left-right direction of the paper is the X-axis direction, the up-down direction is the Y-axis direction, and the depth direction is the Z-axis direction. The measurement mark A is indicated by hatching.

  In the illustrated embodiment, the measurement object 10 is an object having a rectangular parallelepiped shape. Moreover, the measuring object 10 has a surface with a small radiation rate, such as a glossy surface. The measurement object 10 may be, for example, a fixed-side or movable-side mold used in a molding apparatus, or a fixed-side or movable-side platen and other components of an injection molding machine. In these cases, the measurement object 10 usually has a flat surface on which the metal material is exposed on the surface. In FIG. 2, the first surface 31 of the measurement object 10 is parallel to the XY plane (that is, perpendicular to the Z axis), the second surface 32 is parallel to the YZ surface (perpendicular to the X axis), and the third surface 33. Is parallel to the XZ plane (perpendicular to the Y axis).

  A plurality of measurement marks A are provided in advance on the surface of the measurement object 10. It is preferable that the measurement mark A is provided on a surface that can be observed when the measurement object 10 is used or operated. A plurality of measurement marks A are provided on each of the first surface 31 and the second surface 32 of the measurement object 10, and no measurement marks A are provided on the third surface 33. On the first surface 31 and the second surface 32, measurement marks A are provided at four corners. In one embodiment, the first surface 31 and the second surface 32 of the measurement object 10 are respectively a side surface and an upper surface of a mold or a platen, and the third surface 33 is a cavity surface of the mold or a mold mounting surface of the platen. It is.

  The measurement mark A is an area having a known emissivity, for example, a black body area. In one embodiment, the measurement mark A may be a pseudo black body region. The pseudo black body region is a region on the surface of an object having a value of emissivity ε sufficiently close to 1 (for example, ε ≧ 0.8 for an infrared ray having a wavelength of 10 μm) and a known emissivity. The pseudo black body region may be formed by attaching a known black body tape to a part of the surface of the measurement object 10 or by applying a known black body paint to a part of the surface.

  In the area to be measured 10 other than the measurement mark A, the emissivity is generally unknown. In an embodiment suitable for the present invention, the area other than the measurement mark A is an area having a significantly lower emissivity than the measurement mark A, and the area other than the measurement mark A is, for example, a metallic gloss surface. In this case, the emissivity of the region other than the measurement mark A is considerably smaller than that of the measurement mark A. For example, ε ≦ 0.2 for infrared rays having a wavelength of 10 μm.

  The heat transfer analysis device 100 includes a temperature information acquisition unit including the thermography units 20 and 30. In the illustrated embodiment, the temperature information acquisition unit includes a first thermography unit 20 and a second thermography unit 30. The thermography units 20 and 30 are devices for capturing a thermal image of the measurement object 10, and are, for example, a known thermography device or an infrared camera. The thermographic units 20 and 30 are connected to output thermal image data to the processing device 40.

  The thermography units 20 and 30 detect the infrared radiation energy emitted from the subject, convert the detected energy amount into an apparent temperature, and generate a thermal image indicating the relative temperature distribution of the subject. That is, the thermography units 20 and 30 detect the infrared radiation energy emitted by the object on the image receiving surface of the infrared sensor through the built-in infrared optical system, and generate a signal representing the detected energy amount at each light receiving point on the image receiving surface. To do. A thermal image is obtained by converting the detected energy amount into a temperature and assigning it to each pixel value under the assumed emissivity (for example, assuming that the imaging target is a black body).

  In one embodiment, a plurality of thermography units may be arranged such that a plurality of thermography units respectively capture a plurality of surfaces of the measurement object 10. For example, three thermography units may be provided, and the measurement object may be imaged from each of the X direction, the Y direction, and the Z direction. In this way, a thermal image of the measurement object surface can be obtained in three dimensions. In applications where it is sufficient to obtain a two-dimensional thermal image of the surface of the measurement object, the surface of the measurement object 10 may be imaged by one thermography unit.

  In the illustrated embodiment, the first thermography unit 20 images the first surface 31 of the measurement object 10, and the second thermography unit 30 images the second surface 32 of the measurement object 10. The optical axis of the first thermography unit 20 is perpendicular to the first surface 31 (ie, the Z-axis direction), and the optical axis of the second thermography unit 30 is perpendicular to the second surface 32 (ie, the X-axis direction), Each thermography unit 20, 30 is arranged. Note that a plurality of surfaces of the measurement object 10 having the measurement mark A may be imaged by a common thermography unit.

  FIG. 3 is a diagram schematically showing a configuration of a heat transfer analysis apparatus 100 according to another embodiment of the present invention. The components common to the embodiment shown in FIG. 2 are given the same reference numerals in order to avoid redundancy, and description thereof will be omitted as appropriate. The measurement mark A formed on the measurement object 10 has a configuration in which a position specifying mark C is formed on a region B where the emissivity is known. That is, the spot-like position specifying mark C is provided with the emissivity known region B as the background. The emissivity known region B may be the same as the measurement mark A shown in FIG. 2, and is, for example, a pseudo black body region. For example, the emissivity known region B may be formed of a white black body tape or black body paint, and the position specifying mark C may be formed in black so as to improve the visibility of the position specifying mark C. In order to improve the estimation accuracy, a large number of measurement marks A are provided. Further, the measurement marks A are distributed over the entire surface of the measurement object 10. As illustrated, the measurement marks A may be arranged in a staggered pattern, for example.

  The heat transfer analysis device 100 includes observation devices 50 and 60. The observation devices 50 and 60 include the thermography units 20 and 30 and imaging devices 41 and 42 for detecting the position specifying marks C. The imaging devices 41 and 42 are, for example, known CCD cameras. The imaging devices 41 and 42 are connected so as to output image data captured in the same manner as the thermography units 20 and 30 to the processing device 40.

  In the embodiment shown in FIG. 3, the first observation device 50 images the first surface 31 of the measurement object 10, and the second observation device 60 images the second surface 32 of the measurement object 10. A further observation device for imaging the other surface or part of the measurement object 10 may be provided. The optical axes of the first thermography unit 20 and the first imaging device 41 of the first observation apparatus 50 are perpendicular to the first surface 31, and the optical axes of the second thermography unit 30 and the second imaging device 42 are on the second surface 32. The observation devices 50 and 60 are arranged so as to be vertical. The relationship between the local coordinate system defined in the thermographic units 20 and 30 in each observation device 50 and 60 and the local coordinate system defined in the imaging devices 41 and 42 is measured or adjusted in advance and stored in the processing device 40 and known. It is said that. That is, the positional relationship between the thermography units 20 and 30 and the imaging devices 41 and 42 in each observation device 50 and 60 is calibrated in advance.

In this embodiment, when the measurement marks A are numbered from 1 to n, the measurement marks A _{1 to} A _{i on} the first surface 31 are observed by the first observation device 50 and the measurement marks A _{i + 1 on} the second surface 32 are measured. to a _n it is observed in the second observation device 60. By observing the measurement mark _A 1 to A _i of the first surface 31 by the first image pickup device 41 having the optical axis perpendicular to the first plane 31, the plane of the measurement mark _A 1 to A _i of the first surface 31 The displacement in the direction (XY plane) can be obtained. Similarly, it is possible to determine the displacement in the in-plane direction of the measurement mark A _{i + 1} ~A _n of the second surface 32 based on the image of the second image pickup device 42 (YZ plane).

In another embodiment, all the measurement marks A _{1 to An} or some of the measurement marks A _{j to} A _{j + m} may be observed by a plurality of observation devices 50 and 60. You may make it measure the position of the measurement mark A in three dimensions by observing the common measurement mark A with the some observation apparatus 50 and 60 using a well-known stereo measurement method. Alternatively, all the measurement marks A _{1 to An} or a part of the measurement marks A _{j to} A _{j + m} may be observed with one observation device 50, 60.

  By using the measurement mark A having the position specifying mark C, the thermal deformation at the mark position of the measuring object 10 can be directly measured. Further, it is possible to measure the amount of displacement at the mark position when an external force is applied to the measurement object 10. The processing device 40 calculates the displacement distribution of the measuring object 10 based on the measured displacement amount at each mark position by a method similar to a temperature error distribution estimation process described later (for example, by calculating an interpolation function). You may perform the process to estimate. For example, when mold clamping is performed in the injection molding machine 340 shown in FIG. 1, stress is applied to the movable mold 371 and the fixed mold 373. Further, thermal deformation caused by temperature control or the like also occurs. Observing slight deformation of the mold at this time is preferable from the viewpoint of improving the shape accuracy of the injection molded product.

  FIG. 4 is a diagram schematically showing a configuration of a heat transfer analysis apparatus 100 according to another embodiment of the present invention. The components common to the embodiments shown in FIGS. 2 and 3 are given the same reference numerals in order to avoid redundancy, and description thereof will be omitted as appropriate. The measurement mark A shown in FIG. 4 has the same configuration as that in FIG. 2, but may be a measurement mark with a position measurement mark shown in FIG.

  The temperature information acquisition unit of the heat transfer analysis apparatus 100 includes still other temperature sensors 45 and 47 in addition to the thermography units 20 and 30. The temperature sensors 45 and 47 share the temperature measurement of the area on the measurement object 10 that is not imaged by the thermography units 20 and 30. That is, the temperature sensors 45 and 47 are provided outside the imageable area of the thermography units 20 and 30. A temperature sensor is not installed in the imaging region of the thermography units 20 and 30, and the surface (or measurement mark A) of the measurement object 10 is exposed. In one embodiment, a temperature sensor may also be provided in the imaging region of the thermography units 20 and 30.

  For example, the first temperature sensor 45 is provided behind the obstacle 70 in front of the measurement object 10 when viewed from the thermography units 20 and 30. The obstacle 70 may also be a temperature measurement target. In this case, the measurement mark A may be provided on the surface of the obstacle 70 that can be imaged by the thermography units 20 and 30. When the measurement object 10 is, for example, a mold, the obstacle 70 is, for example, a tie bar of an injection molding machine. The second temperature sensor 47 is provided on the third surface 33 that cannot be seen from the thermographic units 20 and 30. These other temperature sensors are connected so as to output the temperature measurement result to the processing device 40, similarly to the thermography units 20 and 30.

  The temperature sensors 45 and 47 may be contact-type temperature sensors, for example, known thermocouples. The temperature sensors 45 and 47 may be attached to the surface of the measurement object 10 or may be provided inside the measurement object 10. In one embodiment, the temperature sensors 45 and 47 may be temperature sensors included in the temperature adjustment system of the measurement object 10. Moreover, the thermography units 20 and 30 may be incorporated in the temperature control system of the measuring object 10 as a temperature sensor.

  The temperature sensors 45 and 47 may be non-contact temperature sensors. For example, a radiation thermometer that measures temperature by detecting infrared radiation energy may be used. In this case, it is preferable that the measurement mark A is provided on the surface of the measurement object 10 facing the non-contact temperature sensor. In one embodiment, the heat transfer analysis apparatus 100 sequentially measures measurement points (for example, measurement marks) on the measurement object 10 with other non-contact temperature sensors without using the thermography units 20 and 30. The temperature information may be acquired by

  FIG. 5 is a diagram schematically showing the configuration of the processing apparatus 40 according to an embodiment of the present invention. Note that the hardware configuration in FIG. 5 is merely an example, and the present invention is not limited to this. As shown in FIG. 5, the processing device 40 includes a control unit 3, a storage device 5, a media input / output unit 6, an input unit 7, a display unit 9, a printer port 11, a connection port 14, etc. Has been. The control unit 3 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. For example, the control unit 3 uses the bus 13 according to a program stored in the storage device 5 as a storage unit. And drive control of each device connected through the network. The processing device 40 may be a known personal computer, for example.

  The storage device 5 includes a control program for driving and controlling each component of the heat transfer analysis device 100, a temperature estimation program, a heat transfer analysis program, and a thermal deformation analysis program for implementing an embodiment of the present invention. Etc. are stored. The media input / output unit 6 is a device for inputting / outputting information to / from a medium such as a flexible disk, CD, or DVD. The input unit 7 is an input device such as a keyboard and a mouse for receiving user input related to processing executed by the control unit 3, and the display unit 9 is a display device such as a display. A printer 12 as an output device is connected to the printer port 11. An observation device such as the thermography units 20 and 30 is connected to the connection port 14. Imaging devices 41 and 42 or other temperature sensors 45 and 47 may be similarly connected to the connection port 14.

  FIG. 6 illustrates main functional blocks processed by the heat transfer analysis apparatus 100 according to an embodiment of the present invention. As described above, the heat transfer analysis device 100 includes the control unit 3 and the temperature information acquisition unit 110. Based on the temperature information input from the temperature information acquisition unit 110, the control unit 3 performs a temperature distribution estimation process, a thermal deformation analysis process, a heat transfer analysis process, and an obtained result of the analysis model representing the measurement object 10. Various processes including the display process are executed.

  The temperature information acquisition unit 110 includes the first thermography unit 20 and the second thermography unit 30. The temperature information acquisition unit 110 may further include a third thermography unit. Further, as described with reference to FIG. 4, contact-type or non-contact-type temperature sensors 45 and 47 may be further included. The temperature information acquisition unit 110 is configured to output the acquired temperature data to the control unit 3 or the storage device 5. The control unit 3 receives the temperature data input from the temperature information acquisition unit 110 or reads the temperature data from the storage device 5 to process the temperature data.

  The control unit 3 includes a temperature information processing unit 120, a temperature estimation unit 122, a model generation unit 124, a thermal deformation analysis unit 126, a heat transfer analysis unit 128, and an analysis result processing unit 130. The control unit 3 reads a program stored in the storage device 5 and executes a calculation defined in the program, whereby a temperature information processing unit 120, a temperature estimation unit 122, a model generation unit 124, and a thermal deformation analysis unit 126. The heat transfer analyzing unit 128 and the analysis result processing unit 130 are configured to fulfill the functions.

  The temperature information processing unit 120 executes processing for associating the position of the measurement point set on the measurement object 10 with the temperature of the measurement point obtained from the acquired temperature information. The temperature estimation unit 122 executes processing for estimating the temperature based on the positional relationship between the position where the temperature is to be estimated and the measurement point, and the measurement point temperature. The model generation unit 124 generates an analysis model representing the measurement object 10. The thermal deformation analysis unit 126 performs a process of analyzing the thermal deformation of the analysis model based on the given temperature distribution. The heat transfer analysis unit 128 performs heat transfer analysis on the analysis model. For example, the analysis result processing unit 130 executes processing for displaying or outputting the obtained temperature distribution, thermal deformation analysis result, and heat transfer analysis result.

  At least one of the temperature information processing unit 120, the temperature estimation unit 122, the model generation unit 124, the thermal deformation analysis unit 126, the heat transfer analysis unit 128, and the analysis result processing unit 130 is physically supplied from the control unit 3. It may be provided in another independent control device. For example, the thermal deformation analysis unit 126 and the heat transfer analysis unit 128 may be configured as independent thermal deformation analysis devices and heat transfer analysis devices, respectively. The thermal deformation analysis device may execute the thermal deformation analysis using the temperature distribution output from the heat transfer analysis device.

  Moreover, the control part 3 may be comprised including the primary analysis part and the secondary analysis part. The primary analysis unit and the secondary analysis unit may be configured to perform heat transfer analysis on the analysis model. In one embodiment, the primary analysis unit may generate a primary temperature distribution by performing a heat transfer analysis on the analysis model under a boundary condition that defines the heat flux. The secondary analysis unit estimates the temperature error distribution in the analysis region other than the measurement point based on the error value between the measured temperature of the measurement point set in the analysis model and the temperature of the measurement point in the primary temperature distribution. The primary temperature distribution may be corrected based on the error distribution. The secondary analysis unit estimates the temperature error distribution by executing the second heat transfer analysis using the error value between the measured temperature at the measurement point and the temperature at the measurement point in the primary temperature distribution as the temperature constraint boundary condition of the measurement point. May be. The secondary analysis unit may estimate the temperature error distribution by, for example, interpolation processing without performing the heat transfer analysis.

  Each functional block described above is realized by cooperation of a CPU that executes various arithmetic processes, hardware such as a RAM that is used as a work area for data storage and program execution, and software. Therefore, these functional blocks can be realized in various forms by a combination of hardware and software.

  FIG. 7 is a flowchart for explaining temperature estimation processing according to an embodiment of the present invention. As shown in the figure, as a pre-processing for temperature estimation, a mark having a known emissivity is formed on the measurement object 10 (S10). Of course, when the temperature of an object on which a mark has already been formed is estimated, this mark forming step can be omitted. By this step, a part having a known radiation rate is formed on the surface of the object whose radiation rate is unknown. In one embodiment, the mark is formed by providing a pseudo black body region on the surface of the measurement object 10. Alternatively, the emissivity of a certain area of the measurement object 10 may be measured, and the area may be set as a temperature measurement mark.

  Next, as further preprocessing, an analysis model of the measurement object 10 is created on the processing device 40 (S12). The shape and size of the measurement object 10, the measurement point that is the measurement position where the temperature is actually measured, and the evaluation point that is the position where the temperature is to be estimated are input to at least the processing device 40. The measurement point is set in a known area of emissivity, and the evaluation point is set in an unknown area of emissivity. When information necessary for creation is input to the processing device 40, the processing device 40 creates an analysis model. In this manner, the area occupied by the measurement object 10, the position coordinates of the measurement points, and the position coordinates of the evaluation points are defined in a space in which a predetermined coordinate system is defined. That is, the positional relationship between measurement points and evaluation points in the analysis model is defined. If an analysis model has already been created, this process can also be omitted.

  Here, the predetermined coordinate system can be appropriately determined depending on the shape of the measurement object 10, and may be a three-dimensional coordinate system such as an XYZ orthogonal coordinate system, a cylindrical coordinate system, a polar coordinate system, or the like. When obtaining the in-plane temperature distribution, a two-dimensional coordinate system may be used. The analysis model is preferably a model for thermal deformation analysis or heat transfer analysis, but is not limited thereto, and may be a dedicated analysis model for temperature distribution estimation, for example.

  FIG. 8 is a diagram schematically illustrating an example of an analysis model according to an embodiment of the present invention. In the XYZ orthogonal coordinate system, the measuring object 10 is divided into a large number of finite elements. FIG. 8 shows an example in which the measurement object 10 is divided into a number of cubic elements. A node D is defined at the vertex of each element. Each element may have an arbitrary three-dimensional shape having a polygonal surface. In this case, the vertex of the polygonal surface is the node D. A plurality of measurement points A and evaluation points E are defined on the surface of the measurement object 10. Each node D may be set as the evaluation point E. The processing device 40 stores the position coordinates of the measurement point A, the node D, and the evaluation point E. The analysis model is not limited to a model based on the finite element method, and may be a model suitable for other numerical solutions such as a boundary element method.

  Next, as shown in FIG. 7, temperature information acquisition processing is performed (S14). In one embodiment, a thermal image of the measurement object 10 is taken by the thermography units 20 and 30. Temperature data is created by detecting infrared radiant energy radiated from the object. When other temperature sensors are provided, the temperature is measured by these temperature sensors. Temperature data including the thermal image and the temperature measurement result is input to the processing device 40 and stored in the storage device 5.

  The processing device 40 executes an evaluation point temperature estimation process (S16). As will be described later, temperature estimation processing using heat transfer analysis is executed. The processing device 40 creates and outputs a temperature distribution from the measured temperature at the measurement point and the estimated temperature at the evaluation point (S18). In one embodiment, the processing device 40 displays the temperature distribution on the display unit 9. The processing device 40 may output the temperature distribution to the thermal deformation analysis device, or may execute the thermal deformation analysis using the created temperature distribution.

  In general, heat transfer analysis is a method for obtaining a temperature distribution in an analysis region by numerically solving a heat conduction equation. In heat transfer analysis, it is usually necessary to set boundary conditions over the entire surface of the analysis region. The boundary condition includes a case where the heat flux is specified and a case where the temperature is specified. When defining heat flux, exothermic boundary condition indicating that there is a constant exothermic (heating) or endothermic (cooling) per unit time, adiabatic boundary condition indicating no heat inflow and outflow, and a certain amount of heat There is a heat transfer boundary condition that represents the inflow and outflow of The heat generation boundary condition is used to model a heat source (such as a heater) in the analysis region. In the case of the heat transfer boundary condition, the heat transfer coefficient between the analysis region and the external region and the temperature of the external region are set.

  Thus, when the heat flux is defined as the boundary condition, the parameters that the analyst must set tend to be larger than when the temperature is defined. As the number of parameters to be set increases, the analysis accuracy depends on the parameter settings. However, it is not always easy to set all parameters so as to obtain sufficient analysis accuracy. For this reason, some (or all) parameters are actually determined by the analyst under appropriate assumptions.

  FIG. 9 is a flowchart for explaining heat transfer analysis processing according to an embodiment of the present invention. The model generation unit 124 of the processing device 40 creates a heat transfer analysis model of the measurement object 10 (S20). An analysis model is created by inputting at least the position of the measurement point, which is the measurement position at which the shape, dimension, and temperature of the measurement object 10 are actually measured, to the processing device 40. This heat transfer analysis model may be the analysis model created in S12 of FIG. 7, or may be a model newly created for heat transfer analysis.

  First, the heat transfer analysis unit 128 of the processing device 40 performs a primary heat transfer analysis to obtain a primary temperature distribution (S22). The primary heat transfer analysis is performed under the boundary condition that defines the heat flux without using the measured temperature at the measurement point as the boundary condition. As described above, since the analysis conditions set when the heat flux is defined are based on the analyst's assumption, it is assumed that the obtained primary temperature distribution includes a certain amount of error. Here, the reason why the measured temperature at the measurement point is not reflected in the primary heat transfer analysis is to avoid a convex (or concave) near the measurement point in the primary temperature distribution. That is, it has been empirically found that when the temperature constraint boundary condition is applied to a model having heat input (or heat dissipation) to the analysis target, unevenness having the temperature as an extreme value occurs in the temperature distribution.

  The primary heat transfer analysis includes model mesh division processing (S24), heating / cooling condition setting processing (S26), and first heat transfer analysis processing (S28). In the mesh division process (S24), the heat transfer analysis unit 128 divides the heat transfer analysis model by a method suitable for the numerical solution used in the first heat transfer analysis process (S28). For example, the heat transfer analysis model is divided into elements based on the finite element method. When using a numerical solution that does not require such division, the mesh division process (S24) can be omitted.

  The heat transfer analysis unit 128 performs heating / cooling condition setting processing (S26) on the heat transfer analysis model. The heat transfer analysis unit 128 sets a heat source or a cooling source present in the measurement object 10 as a heat generation boundary condition based on, for example, an input by an analyst. The heat transfer analysis unit 128 also sets an appropriate boundary condition, such as a heat transfer boundary condition or an adiabatic boundary condition, for a boundary region other than the heat source or the cooling source. When the analysis target is a component of a mold or an injection molding machine, for example, a heat generation boundary condition is set for the installation position of the heater and the cooling flow path, and heat is released to the surrounding environment (for example, in the air) for the outer surface. A heat transfer boundary condition representing is set. The mesh division process (S24) and the heating / cooling condition setting process (S26) may be executed in the model creation process (S20). Thus, the heat transfer analysis unit 128 performs a steady heat transfer analysis on the heat transfer analysis model under the set boundary conditions (S28).

  The heat transfer analysis unit 128 further executes a secondary analysis for obtaining a temperature error distribution (S30). The heat transfer analysis unit 128 estimates the temperature error distribution in the analysis region other than the measurement point based on the error value between the temperature at the measurement point in the primary temperature distribution and the actual temperature at the measurement point. Therefore, the secondary analysis includes measurement temperature input processing (S32), temperature difference calculation processing (S34) at measurement points, and error analysis processing (S36).

  The measurement temperature input process (S32) is a process of fetching the temperature data stored in the storage device 5, the position of the measurement point set in the analysis model, and the measurement point obtained from the stored temperature data. And a process for associating the temperature. The temperature information processing unit 120 takes in temperature data stored in the storage device 5. In one embodiment, the relationship between the position on the thermal image and the position on the analysis model is stored in the storage device 5 in advance. Further, the measurement position by the contact-type or non-contact-type temperature sensor is also stored in the storage device 5 in advance. Therefore, for example, the temperature information processing unit 120 reads the stored temperature data, selects the temperature data corresponding to each measurement point, associates the measurement point with the temperature, and saves it again in the storage device 5. You may do it. Alternatively, the temperature information processing unit 120 may selectively extract temperature data corresponding to each measurement point and associate the measurement point with the temperature. In another embodiment, the position of the temperature measurement mark may be actually measured by the observation devices 50 and 60, for example. In this case, the temperature information processing unit 120 may associate the position of the measurement point with the measurement temperature based on the measurement result of the mark position.

  In the temperature difference calculation process (S34), the heat transfer analysis unit 128 calculates the temperature difference between the temperature at the measurement point in the primary temperature distribution and the actual temperature at the measurement point obtained from the measurement temperature data.

  In the error analysis process (S36) according to the embodiment, the heat transfer analysis unit 128 uses the error value between the temperature at the measurement point in the primary temperature distribution and the actual temperature at the measurement point as the temperature constraint boundary condition at the measurement point. Run the second steady heat transfer analysis. The second temperature distribution thus obtained is used as the temperature error distribution.

  In the second heat transfer analysis, it is preferable that the boundary condition of the analysis region other than the measurement point is the adiabatic boundary condition. In other words, it is preferable to perform the heat transfer analysis assuming that there is no heat input or heat dissipation between the analysis target and the outside. In other words, it is preferable that the second heat transfer analysis does not reflect the heat source or the cooling source provided in the object.

  The results of heat transfer analysis depend on the analysis model and boundary conditions. With regard to the analysis model, particularly when the analysis target is an industrial product, the target can be represented with relatively high accuracy by referring to the drawings and CAD data. On the other hand, as described above, it is not always easy to set the boundary condition with sufficient accuracy. Therefore, it is considered that the main error factor of the primary temperature distribution is the boundary condition. The parameter assumed by the analyst deviates from the true value, resulting in an error in the primary temperature distribution.

  The parameter divergence is that, for example, the heat inflow from the heater, the heat radiation to the external region, or the heat transfer coefficient between the analysis region and the external region is set to a value larger (or smaller) than the actual value. Therefore, the error distribution in the primary temperature distribution is predicted not to have a large error unevenly distributed in a specific local region but to have the same level of error as a whole. It is considered that the temperature error distribution does not include extreme unevenness but has a continuous and gentle gradient. As described above, when the temperature constraint boundary condition is applied to a model having heat input (or heat dissipation) to the analysis target, unevenness tends to occur in the temperature distribution of the analysis result. Therefore, by setting the boundary condition of the analysis region other than the measurement point as the adiabatic boundary condition, it is possible to obtain a temperature error distribution having an overall gentle gradient. Thus, a more appropriate temperature error distribution can be obtained.

  The analysis result processing unit 130 of the processing device 40 creates a temperature distribution in which the error is corrected by superimposing the temperature error distribution obtained by the secondary analysis on the primary temperature distribution (S38). Specifically, the analysis result processing unit 130 corrects the temperature value of the primary temperature distribution by subtracting the error value indicated by the temperature error distribution from the temperature value of the primary temperature distribution at each position on the analysis model. Since the measurement point temperature is used as a constraint in the secondary analysis, the corrected temperature distribution has the measured temperature at the measurement point at the measurement point, and the temperature error from the temperature value of the primary temperature distribution at the evaluation point. A correction value obtained by subtracting the error value indicated by the distribution is provided as the estimated temperature.

  The analysis result processing unit 130 outputs the obtained corrected temperature distribution (S40). In one embodiment, the processing device 40 displays the temperature distribution on the display unit 9. For example, the analysis result processing unit 130 displays the temperature distribution by assigning different colors according to the temperature values on the analysis model. Further, the processing device 40 may output the temperature distribution to the thermal deformation analysis device, or may execute the thermal deformation analysis using the created temperature distribution. The processor 40 may perform other coupled analyzes related to heat.

  Next, an example of heat transfer analysis processing according to an embodiment of the present invention will be described with reference to FIGS. 10 to 18. As an example, a heat transfer analysis process for a surface of an object represented by a two-dimensional plane will be described. 10 to 13 are diagrams conceptually showing an example when the process shown in FIG. 9 is applied to the two-dimensional analysis model. 14 to 18 are diagrams showing the temperature distribution obtained by the processing shown in FIGS. 10 to 13 and the temperature distribution obtained by another comparative example.

  First, as shown in the upper column of FIG. 10, an analysis model 200 is created. The shape and size of the analysis region 202 represent the shape and size of the analysis target region in the analysis target. In this example, the analysis area 202 is rectangular. The analysis model 200 represents, for example, a component such as a platen of an injection molding machine or one surface of a mold.

  In the analysis model 200, a measurement point 204 and a heater 206 are set on an analysis region 202. 10 to 13, the measurement points 204 are indicated by hatching, and the heater 206 is indicated by light gray. The analysis area 202 includes boundary areas 208a, 208b, 208c, and 208d in which boundary conditions are to be set. The upper side, the right side, the lower side, and the left side of the analysis region 202 are referred to as first to fourth boundary regions 208a, 208b, 208c, and 208d, respectively. A total of six measurement points 204 are provided at the right, center, and left ends of the first and third boundary regions 208a and 208c. The heater 206 is provided at the center of the fourth boundary region 208d. In the temperature analysis result shown in FIG. 18, the temperature distribution along the first boundary region 208a indicated by the bold line is shown.

  As shown in the middle column of FIG. 10, mesh analysis is performed on the analysis model 200 in a lattice shape, for example. In the analysis model 200, only the heater 206 is provided as a heat source or a cooling source. Therefore, a heat generation boundary condition representing heat input from the heater 206 is set at the heater installation site in the center of the fourth boundary region 208d. For the other boundary region, including the measurement point 204, a heat transfer boundary condition indicating that heat can be released to the outside at room temperature is set. That is, at this stage, the actually measured temperature at the measurement point 204 is not reflected in the boundary condition.

  The lower column of FIG. 10 shows the primary temperature distribution of the analysis model 200 obtained as a result of the heat transfer analysis. The overall temperature distribution is shown by contour lines (45 ° C., 40 ° C., 35 ° C.), and the primary analysis temperature at each measurement point 204 is shown. As shown in the figure, the region closer to the heater 206 has a higher temperature, and gradually becomes lower as the distance from the heater 206 increases. Analysis temperatures of the measurement points 204 on the first and third boundary regions 208a and 208c are 44 ° C., 35 ° C., and 32 ° C. from the left in the drawing. Just as the analysis model 200 is vertically symmetric, the analysis temperature distribution is also vertically symmetric.

  FIG. 11 shows the measured temperature at each measurement point 204 in association with the analysis model 200. The analysis temperature of the measurement point 204 on the first boundary region 208a is 54 ° C., 42 ° C., and 38 ° C. from the left in the drawing, and the analysis temperature of the measurement point 204 on the third boundary region 208c is 53 ° C. from the left in the drawing. 41 ° C and 37 ° C. It does not agree with the primary analysis temperature described above. As described above, the main cause of the mismatch is that the heat input from the heater 206 to the analysis area 202 and the set values such as the heat transfer coefficient representing the heat radiation from the analysis area 202 to the outside are different from the true values. Conceivable. In addition, one reason for the fact that the measured temperatures do not match at the upper and lower measurement points is thought to be because other heat sources that are not reflected in the analysis model actually exist around the analysis object.

  The upper column in FIG. 12 shows an error value between the actually measured temperature at the measurement point 204 (see FIG. 11) and the primary analysis temperature at the measurement point 204 (see the lower column in FIG. 10). The temperature error value of the measurement point 204 on the first boundary region 208a is 10 ° C., 7 ° C., and 6 ° C. from the left in the figure, and the temperature error value of the measurement point 204 on the third boundary region 208c is 9 from the left in the figure. ° C, 6 ° C, 5 ° C.

  The lower column of FIG. 12 shows the temperature error distribution obtained by the secondary analysis. As described above, in the secondary analysis, the temperature error value at the measurement point 204 is used as the temperature constraint boundary condition at the measurement point 204. For the boundary region other than the measurement point, the second heat transfer analysis is performed as the adiabatic boundary condition including the installation position of the heat source or the cooling source (for example, the heater 206) on the analysis model 200. The temperature error distribution thus obtained is shown by contour lines (8 ° C., 6 ° C.).

  FIG. 13 shows the temperature distribution of the analysis model 200 obtained by correcting the primary temperature distribution (see the lower column of FIG. 10) with the temperature error distribution (see the lower column of FIG. 12). The corrected temperature distribution is obtained by adding (or subtracting) the temperature of each corresponding point in the temperature error distribution to the temperature of each point in the primary temperature distribution. As shown in the figure, the corrected temperature distribution is considered that the temperature at each measurement point 204 matches the actually measured temperature (see FIG. 11), and the accuracy is improved as a whole compared to the primary temperature distribution. It is done. In this example, the analysis model 200 is two-dimensional, but the object for obtaining the temperature distribution is not limited to the two-dimensional plane, and it is obvious to those skilled in the art that a one-dimensional or three-dimensional object can be similarly obtained. I will.

  14 to 17 are diagrams showing the temperature distribution obtained by the processing shown in FIGS. 10 to 13 and the temperature distribution obtained by another comparative example, respectively, in comparison with the actual temperature distribution. FIG. 18 is a diagram showing the temperature distribution along the first boundary region 208a as the evaluation path in comparison with the actual temperature distribution in the example shown in FIGS. 10 to 13 and other comparative examples.

  The “actual temperature distribution” used here is not obtained by actual measurement, but is a target temperature distribution created by simulation as a benchmark in order to verify the limitations of the conventional example and the effects of the example. Heat transfer analysis is performed using values that intentionally give errors to the parameters when the target temperature distribution is calculated, and the accuracy of the analysis method is evaluated by comparing the results with the target temperature distribution. It can be evaluated that the accuracy of the analysis method is better as the analysis result is more similar to the target temperature distribution.

  FIG. 14 is a diagram showing an actual temperature distribution and a temperature distribution obtained by a conventional analysis method. The upper column shows the actual temperature distribution, and the lower column shows the temperature distribution according to the conventional analysis method. This conventional method is an ordinary heat transfer analysis that does not reflect the measured temperature. Since it is usually difficult to obtain each parameter to be set with the same accuracy as the benchmark, the results of a heat transfer analysis using a parameter with an error added to the parameter when the benchmark was obtained are shown as conventional examples. Show. As shown in FIG. 14, the tendency for the temperature to gradually decrease from the heater at the center of the left end toward the right end is also shown in the conventional example as in the benchmark. However, as shown in FIG. 18, the conventional example is generally lower in temperature than the benchmark. The main cause of this error is considered to be the error given to the parameter.

  FIG. 15 is a diagram showing the actual temperature distribution and the temperature distribution obtained by the embodiment shown in FIGS. The upper column shows the actual temperature distribution, and the lower column shows the temperature distribution according to the example. As shown in FIGS. 15 and 18, it can be seen that the temperature distribution according to the example better represents the actual temperature distribution than the conventional example. Since FIG. 18 shows the temperature distribution of the first boundary region 208a having the measurement points at the left end, the center, and the right end, the actual temperature distribution at the measurement point positions where the temperature is constrained (that is, the left end, the center, and the right end). And the temperature distribution according to the example agree with each other.

  Thus, according to one embodiment of the present invention, by performing a heat transfer analysis including a first stage heat transfer analysis that does not reflect the measured temperature and a second stage error analysis that uses the measured temperature, The temperature distribution of the object can be obtained with high accuracy.

  For further reference, FIGS. 16 and 17 show temperature distributions of the first comparative example and the second comparative example, respectively. FIG. 16 is a diagram showing the actual temperature distribution and the temperature distribution obtained by the first comparative example. The upper column shows the actual temperature distribution, and the lower column shows the temperature distribution according to the first comparative example. The first comparative example is a temperature distribution when the measurement point temperature is set as a temperature constraint boundary condition and a one-step heat transfer analysis is performed. In the first comparative example, the heat source or the cooling source (for example, the heater 206) is not set as a condition. Further, the boundary region other than the measurement point is set as a heat transfer boundary condition that allows heat radiation to the outside. Therefore, as shown in FIG. 18, a relatively good temperature distribution can be obtained in the vicinity of the measurement point. Although the first comparative example deviates from the benchmark as compared with the examples shown in FIGS. 10 to 13, it can be seen that the accuracy is better than the conventional example. If more measurement points can be set, further improvement in accuracy can be expected. Since the heat transfer analysis is performed in one stage, the amount of calculation can be reduced as compared with the embodiments shown in FIGS.

  Therefore, in this invention, you may use the heat-transfer analysis which concerns on a 1st comparative example for the temperature estimation of a target object. Therefore, the heat transfer analysis device according to an embodiment of the present invention may include a heat transfer analysis unit that performs heat transfer analysis using the temperature at the measurement point as the temperature constraint boundary condition at the position of the measurement point. The heat transfer analysis unit may execute the boundary condition of the analysis region other than the measurement point as the heat transfer boundary condition or the adiabatic boundary condition.

  FIG. 17 is a diagram showing the actual temperature distribution and the temperature distribution obtained by the second comparative example. The upper column shows the actual temperature distribution, and the lower column shows the temperature distribution according to the second comparative example. In the second comparative example, the temperature distribution when the measurement point temperature is set as the temperature constraint boundary condition and the heat source or the cooling source (for example, the heater 206) is also set as the heat generation boundary condition and the one-step heat transfer analysis is performed. is there. The boundary region other than the measurement point and the heat source has a heat transfer boundary condition that allows heat radiation to the outside.

  Even in this case, a relatively good temperature distribution can be obtained as shown in FIGS. Although the second comparative example deviates from the benchmark as compared with the examples shown in FIGS. 10 to 13, it can be seen that the accuracy is better than the conventional example. If the analysis conditions can be set with high accuracy, further improvement in accuracy can be expected. Since the heat transfer analysis is performed in one stage, the amount of calculation can be reduced as compared with the embodiments shown in FIGS.

  Therefore, in the present invention, the heat transfer analysis according to the second comparative example may be used for estimating the temperature of the object. Therefore, the heat transfer analysis device according to an embodiment of the present invention uses the temperature at a measurement point as a temperature constraint boundary condition at the position of the measurement point and performs heat transfer analysis using a heat source or a cooling source as a heat generation boundary condition. A thermal analysis unit may be provided.

  In the error analysis process (S36 in FIG. 9), the processing device 40 may execute an interpolation process instead of the heat transfer analysis. In one embodiment, the temperature estimation unit 122 may estimate the temperature error in a region other than the measurement point by interpolation based on the temperature error of the primary temperature distribution at the measurement point. Therefore, the temperature estimation unit 122 obtains an interpolation function for estimating the temperature error of the evaluation point in the primary temperature distribution. The temperature estimation unit 122 obtains a temperature error at each evaluation point using the derived interpolation function.

An example of the interpolation function will be described. In one embodiment, the temperature estimation unit 122 defines an interpolation function f having a position as a variable, and determines a coefficient _ak of the interpolation function f based on a temperature error at a measurement point. The coefficient of the interpolation function is obtained by, for example, the least square method. As an example, when the interpolation function for estimating the temperature error distribution on the surface of the object represented by a two-dimensional plane is a quadratic function of the measurement point position coordinates, the interpolation function f (x, y) is expressed.

At this time, when there are N measurement points, the coefficient a _{k of the} interpolation function is obtained as follows using the least square method.

Here, in the matrices A and B, the positions of the N measurement points are (x ₁ , y ₁ ), (x ₂ , y ₂ ), (x ₃ , y ₃ ), ..., (x _N , given by _{y N),} the temperature error _T 1 of the respective measurement _point, T _2, T 3, · · ·, in the case of _{T N} is as follows.

Thus, the temperature estimation unit 122 can obtain the temperature error T _k of the evaluation point (x _k , y _k ) by the following equation using the derived interpolation function.

  Although the example in which the interpolation function is a quadratic function has been described in the above embodiment, the present invention is not limited to this. A linear function may be used when reducing the amount of calculation is important, and a higher-order function may be used when estimating accuracy is important. Moreover, it will be apparent to those skilled in the art that the object for obtaining the temperature distribution is not limited to a two-dimensional plane, but can be a one-dimensional or three-dimensional object.

  In one embodiment, the temperature estimation unit 122 may estimate the temperature error of the evaluation point by piecewise linear interpolation. In this case, the process of deriving the interpolation function may include a process of dividing the analysis model into a plurality of interpolation areas and a process of obtaining an interpolation function for each interpolation area. For example, when the temperature distribution on the two-dimensional plane is obtained as described above, the analysis model may be divided so that three measurement points are included in each interpolation area.

  DESCRIPTION OF SYMBOLS 10 Measurement object, 20 1st thermography unit, 30 2nd thermography unit, 40 processing apparatus, 45 temperature sensor, 50 1st observation apparatus, 60 2nd observation apparatus, 70 obstruction, 100 heat transfer analysis apparatus, 110 temperature information Acquisition unit, 120 temperature information processing unit, 122 temperature estimation unit, 124 model generation unit, 126 thermal deformation analysis unit, 128 heat transfer analysis unit, 130 analysis result processing unit, A measurement mark.

Claims (5)

A heat transfer analysis apparatus comprising: a model creation unit that creates an analysis model representing an object; a heat transfer analysis unit that performs heat transfer analysis on the analysis model; and an analysis result processing unit that processes the analysis result. ,
The model creation unit sets the position where the temperature is measured on the object as a measurement point in the analysis model,
The heat transfer analysis unit generates a first temperature distribution by executing a first heat transfer analysis under a boundary condition that defines a heat flux, and measures the measured temperature and the first temperature distribution at the measurement point. A second temperature distribution is generated by executing a second heat transfer analysis using a temperature error value with respect to the temperature of the measurement point at a temperature constraint boundary condition of the measurement point,
The analysis result processing unit outputs a superposition of the first temperature distribution and the second temperature distribution as a temperature distribution of the object.   The heat transfer analysis device according to claim 1, wherein the heat transfer analysis unit executes the second heat transfer analysis using a boundary condition of an analysis region other than the measurement point as an adiabatic boundary condition. A temperature information acquisition unit including a thermography unit that captures a thermal image of the object;
A temperature information processing unit that associates the position of the measurement point with the temperature of the measurement point obtained from the temperature information including the thermal image;
The heat transfer analysis device according to claim 1 or 2, wherein the object has a surface including a known area and an unknown area of emissivity, and the measurement point is set in the known area. A heat transfer analysis method for obtaining a temperature distribution of an object using an actual temperature of a measurement point set in an analysis model representing the object,
Performing a first heat transfer analysis under boundary conditions defining a heat flux to generate a first temperature distribution;
A step of generating a second temperature distribution by executing a second heat transfer analysis using a temperature error value between the measured temperature and the temperature of the measurement point in the first temperature distribution as a temperature constraint boundary condition of the measurement point. When,
Outputting a superposition of the first temperature distribution and the second temperature distribution as a temperature distribution of the object, and a heat transfer analysis method. A primary analysis unit that generates a primary temperature distribution by performing heat transfer analysis on the analysis model under boundary conditions that define heat flux;
A temperature error distribution in an analysis region other than the measurement point is estimated based on an error value between the measured temperature of the measurement point set in the analysis model and the temperature of the measurement point in the primary temperature distribution. And a secondary analysis unit that corrects the primary temperature distribution based on the heat transfer analysis device.