CN112285151A - Method for determining heat transfer coefficient of complex heat transfer component interface based on actual product - Google Patents
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Abstract
The invention discloses a method for determining the heat exchange coefficient of an interface of a complex heat transfer component based on an actual product. Firstly, a real thermal analysis model containing complex parts is established, and the magnitude and the position of the applied power Q are determined according to the result of preliminary simulation analysis. And determining the positions of the measuring points a and b according to the expected result of the temperature field and the feasibility of the measuring points. And (4) analyzing and calculating different interfacial heat transfer coefficients h to obtain a function h ═ f (dT). And (3) rechecking the positions of the measuring points, if the measurement error +/-dh of h meets g (dT) multiplied by delta T > dh, carrying out experiments on the basis, measuring the real heat transfer quantity Q0 and the real temperature difference dT0, and substituting dT0 into the formula: dT0/Q0 XQ, and then substituting dT into a function h (f) (dT) to obtain the value of the interface heat exchange coefficient h, and then obtaining the interface heat exchange coefficient; if the measurement error of h ± dh does not satisfy g (dt) × Δ T > dh, the measurement point positions are reselected, and the following steps are sequentially repeated until the condition is satisfied.
Description
Technical Field
The invention relates to the technical field of complex structure thermal characteristic testing, in particular to a complex heat transfer member interface heat exchange coefficient determination method based on an actual product.
Background
On the thermal design level, the accuracy of thermal design can be improved by obtaining the interface heat exchange coefficient h; and only by knowing the coefficient, the system thermal analysis side can realize a closed-loop process of design-analysis verification-improvement-re-verification.
For a section with an area A, the interface contact heat exchange coefficient is h, the high temperature and the low temperature on the two sides of the interface after heat conduction connection are respectively T1 and T2, and the interface heat transfer quantity is Q. The above physical quantities satisfy the relationship: q ═ hxaa × (T1-T2). H is difficult to obtain because neither T1 nor T2 can be directly measured after the connection is completed.
In general, interfacial heat transfer coefficients can be evaluated using the method Q/W762-97 of the standard test specimen test. The shape of the sample used by the method is regular, the temperature field distribution is very simple, and special simulation analysis is not needed, so that measuring points can be reasonably arranged, and T1 and T2 at the interface can be linearly deduced reversely.
However, the state of the standard sample is greatly different from that of the real product, and the difference in heat capacity, shape, contact surface area and other aspects makes the interface heat exchange coefficient of the real product possibly deviate from the test result of the standard sample, so that it is not feasible to directly and completely replace the test of the real product with the test of the standard sample.
On the other hand, the complex structure of the product makes the temperature field distribution extremely complex, and the temperature of the component is directly measured by using the Q/W762-97 method, so that the direct estimation of the interface heat exchange coefficient according to a known certain rule is no longer possible, and the component becomes an actual non-measurable item. Taking the welding of a certain satellite-borne component and the mounting plate component below the certain satellite-borne component as an example, the interface heat exchange coefficient of the certain satellite-borne component is an important parameter influencing the thermal performance of the system, and in order to ensure that the system works normally, the value of the parameter is smaller than a certain upper limit value, and a new method is necessary to be used for measuring and evaluating the interface heat exchange coefficient which cannot be directly measured.
For a real product with a complex structure, in order to determine the interface heat exchange coefficient, the relationship between the temperature of some measurable points and the interface temperature difference needs to be determined. The problems to be solved are to select the measuring points, to establish the relationship between the temperature of the measuring points and the temperature difference of the interface and to implement the test.
Therefore, at present, a method for determining the interface heat exchange coefficient is needed, which is capable of providing the relationship between the measured temperature and the interface heat exchange coefficient h for a real product with a complex structure, and carrying out experiments based on the relationship to reasonably and accordingly evaluate unmeasurable items.
Disclosure of Invention
In view of the above, the invention provides a method for determining the interface heat exchange coefficient of a complex heat transfer member based on an actual product, so as to achieve the purpose of directly measuring the contact heat exchange coefficient of a complex real product.
In order to achieve the purpose, the technical scheme of the invention is as follows:
and S1, modeling the two components connected through one contact interface by using thermal analysis software to obtain a real thermal analysis model.
And S2, simulating the real thermal analysis model, and determining the magnitude and the position of the applied power Q according to the simulation result.
And S3, applying power Q to the set position of the real thermal analysis model, obtaining a temperature field when the temperature reaches balance, and respectively selecting the positions of the first measuring point a and the second measuring point b on the two components according to the temperature field and the feasibility.
S4, obtaining simulation values of the temperatures Ta and Tb of the first measuring point a and the second measuring point b which are selected currently according to h selected by the contact interface, calculating simulation values of the measurable temperature dT, and obtaining a function h ═ f (dT); rechecking the positions of the first measuring point a and the second measuring point b, if the rechecking condition is met, executing S5, and if the rechecking condition is not met, returning to S3; wherein the measurable temperature dT is: dT is Ta-Tb.
And S5, carrying out test tests by using the positions of the first measuring point a and the second measuring point b determined in S4, wherein during the tests, the real heat transfer quantity is measured to be Q0, the real temperature difference dT0 is measured, the value of the measurable temperature dT is obtained by substituting the formula dT (dT) 0/Q0 multiplied by Q, and the value of the interface heat exchange coefficient h is reversely deduced by substituting the function h (f) (dT).
Further, the position where the power Q is applied is a plane which is mirror-symmetrical with respect to a plane perpendicular to the contact interface, or is center-symmetrical with respect to an axis perpendicular to the contact interface; meanwhile, the position where the power Q is applied is far away from the contact interface, the distance from the contact interface is increased until the temperature difference between the central temperature of the position where the power Q is applied and the surface of the contact interface is larger than a preset temperature difference threshold value, and the temperature difference threshold value is set according to experience. The applied power Q is such that the sensitivity of the interface heat exchange coefficient h with respect to the measurable temperature dT meets the preset measurement accuracy requirement.
Furthermore, the distance between the selected positions of the measuring points of the first measuring point a and the second measuring point b and the contact interface does not exceed a preset distance threshold value, and the distance threshold value is set according to experience; the closest distance A between the selected point position and the plane to which the applied power Q is applied is at least 5 times or more of the distance B between the selected point position and the contact interface. The point selection locations are mirror symmetric about a plane perpendicular to the contact interface or are centered about an axis perpendicular to the contact interface. The measuring point selection position takes the feasibility of implementation into consideration, and is not arranged at a position which is difficult to implement and can not ensure the measurement precision after implementation.
Further, the rechecking conditions are specifically as follows: the preset acceptable h measurement error is ± dh, the temperature measurement accuracy is ± Δ T, the derivative of the h ═ f (dT) function to the measurable temperature dT is a g (dT) ═ f '(dT) function, the simulated value of the measurable temperature dT is substituted into the g (dT) ═ f' (dT) function, and the rechecking condition is g (dT) × Δ T > dh.
Furthermore, under the condition of meeting the symmetry, the selection number of the selected positions of the measuring points is not less than 3, and Ta and Tb are the temperature average values of the selected positions of the measuring points.
Has the advantages that: the invention provides a contact heat transfer coefficient testing method based on temperature field analysis, which solves the problem that the traditional method cannot directly measure the contact heat transfer coefficient of a complex real product. The invention combines temperature field analysis with test, introduces temperature field analysis of complex components, provides basis for selecting heating position, power and measuring point position during test, provides functional relation between h to be measured and dT, avoids uncertainty of using standard furnace-associated sample (during welding) or estimating interface heat exchange coefficient h according to experience, and provides evaluation basis for thermal design and verification of products.
Drawings
FIG. 1 is a schematic diagram of a method provided by the present invention.
FIG. 2 is a flow chart of a method provided by the present invention.
FIG. 3 is a schematic view of a welding interface of a satellite-borne evaporator and a mounting surface thereof.
Detailed Description
The invention is described in detail below by way of example with reference to the accompanying drawings.
In the embodiment of the present invention, taking the complex component M, N as an example, as shown in fig. 1, the two components have a contact surface connected with each other, a specific power Q is applied to one component M, the other component N receives the heat Q conducted from M to the other component N through the contact surface, and a heat sink connected to the other component N, and the heat conduction path is a heat conduction path
A cold source. The rest of the surface is well insulated.
As shown in fig. 2, a specific process of a complex heat transfer member interface heat transfer coefficient determination method based on an actual product provided by an embodiment of the present invention includes the following main steps:
and S1, modeling the two components connected through one contact interface by using thermal analysis software to obtain a real thermal analysis model.
And S2, simulating the real thermal analysis model, and determining the magnitude and the position of the applied power Q according to the simulation result. Further, the position where the power Q is applied is a plane which is mirror-symmetrical with respect to a plane perpendicular to the contact interface, or is center-symmetrical with respect to an axis perpendicular to the contact interface; meanwhile, the position of the applied power Q is far away from the contact interface, the distance between the position of the applied power Q and the contact interface is increased until the temperature difference between the central temperature of the position of the applied power Q and the surface of the contact interface is larger than a preset temperature difference threshold value, the temperature difference threshold value is set according to experience, and the temperature difference threshold value is set to be 5 ℃. The applied power Q is such that the sensitivity of the interface heat exchange coefficient h with respect to the measurable temperature dT meets the preset measurement accuracy requirement.
And S3, applying power Q to the set position of the real thermal analysis model, obtaining a temperature field when the temperature reaches balance, and respectively selecting the positions of the first measuring point a and the second measuring point b on the two components according to the temperature field and the feasibility.
Furthermore, the distance between the selected positions of the measuring points of the first measuring point a and the second measuring point b and the contact interface does not exceed a preset distance threshold, the distance threshold is set according to experience, and the distance threshold is set to be 2mm in the embodiment of the invention; the nearest distance A between the measuring point selection position and the plane applied with the applied power Q is at least 5 times or more of the distance B between the measuring point selection position and the contact interface, and specifically, the distance A can be 7 times. The point selection locations are mirror symmetric about a plane perpendicular to the contact interface or are centered about an axis perpendicular to the contact interface. The measuring point selection position takes the feasibility of implementation into consideration, and is not arranged at a position which is difficult to implement and can not ensure the measurement precision after implementation. Furthermore, under the condition of meeting the symmetry, the selection number of the selected positions of the measuring points is not less than 3, and Ta and Tb are the temperature average values of the selected positions of the measuring points.
S4, obtaining simulation values of the temperatures Ta and Tb of the first measuring point a and the second measuring point b which are selected currently according to h selected by the contact interface, calculating simulation values of the measurable temperature dT, and obtaining a function h ═ f (dT); rechecking the positions of the first measuring point a and the second measuring point b, if the rechecking condition is met, executing S5, and if the rechecking condition is not met, returning to S3; wherein the measurable temperature dT is: dT is Ta-Tb.
Further, the rechecking conditions are specifically as follows: the preset acceptable h measurement error is ± dh, the temperature measurement accuracy is ± Δ T, the derivative of the h ═ f (dT) function to the measurable temperature dT is a g (dT) ═ f '(dT) function, the simulated value of the measurable temperature dT is substituted into the g (dT) ═ f' (dT) function, and the rechecking condition is g (dT) × Δ T > dh.
And S5, carrying out test tests by using the positions of the first measuring point a and the second measuring point b determined in S4, wherein during the tests, the real heat transfer quantity is measured to be Q0, the real temperature difference dT0 is measured, the value of the measurable temperature dT is obtained by substituting the formula dT (dT) 0/Q0 multiplied by Q, and the value of the interface heat exchange coefficient h is reversely deduced by substituting the function h (f) (dT).
Fig. 3 is a specific example of a test of the heat transfer coefficient h of the welding interface between a certain satellite-borne evaporator and a mounting surface of the satellite-borne evaporator provided by the embodiment of the invention. As shown in fig. 3, the two components being welded are the evaporator and the heat pipe with the contact interface between the two. The heat pipe is buried in the cabin plate and is inseparable from the cabin plate, but the heat pipe buried cabin plate is outside a heat transfer path related to the interface heat exchange coefficient h, so that the heat pipe buried cabin plate can not be considered in thermal analysis.
1) And establishing a related thermal simulation analysis model based on the actual state of the real test.
It is expected that in order to avoid the influence of extraneous structures on the test results when conducting the test, the rest of the structure should be removed except for the welded evaporator, the heat pipe, and the non-removable deck structure. And (3) establishing a three-dimensional thermal analysis model containing an evaporator and a heat pipe by using thermal analysis software NX 8.0.
Heat is applied to the evaporator in its entirety, with 4 heat fins adhered to the inclined sides for heat application (two on each side), the heating zones being in the positions shown in fig. 3. The heat transfer path is as follows: evaporator-heat pipe, where a cold source is arranged at the far end of the heat pipe for absorbing heat. The test was conducted by coating the evaporator with a room temperature insulating material (foam, etc.) on its outer surface, so that it was not necessary to consider the convective heat transfer between the evaporator and the air.
Considering that only the temperature difference is concerned in the measurement, the result is irrelevant to the absolute temperature, so that the far-end temperature of the heat pipe can be taken to be 30 ℃ during simulation analysis and is kept unchanged to be a constant temperature boundary; all parts are near room temperature, and the mutual radiation heat exchange quantity is small, so that the radiation heat exchange among the parts is not considered.
In the three-dimensional thermal analysis model, the sizes and materials of the components are set according to actual values.
2) And determining the measuring point position when the test is carried out.
The final purpose is to obtain the interface heat exchange coefficient h, and the selection of the measuring points is preferably easy to implement and close to the welding surface. The stations are located on the sides of the saddle near the bottom surface, at the longitudinal directions 1/4, 1/2, 3/4, respectively, see fig. 3, and are called side stations. Since the evaporator is axially symmetric, a total of 6 stations are used. And a measuring point on the heat pipe is arranged on the surface of the pipe body and is close to the welding surface (less than 2 mm).
3) In the present embodiment, the heating amount is given as a constant value of 120W; in each example, different welding interface heat exchange coefficients h are respectively given, and a large range of 2000W/m2 & K to 20000W/m2 & K is covered. The temperature field analysis was performed for each example in turn.
4) The relationship between the interface heat exchange coefficient h, the side measuring points and the measurable temperature dT of the heat pipe is obtained through temperature field analysis and calculation, and the relationship meets the following table 1.
TABLE 1 relationship between heat transfer coefficient h of interface and measurable temperature dT of side measuring point and heat pipe
Fitting the relation of h-dT, and giving the following relation:
h-28642 × X2+24611 × X +128.23 formula 1
In the formula 1, X is 1/(dT-3.17).
5) And (5) carrying out a test.
Before testing, the ceramic heating sheet is adhered to a capillary pump saddle, a direct current stabilized power supply is used for providing applied power, and when the temperature of each measuring point is stable or the temperature difference between the measuring points does not change any more, the temperature data of each measuring point is recorded. During the test process, the foam material is used for covering the evaporator, the liquid storage device and the like so as to reduce the influence of convection on the test result. Furthermore, the measuring points arranged on the deck are individually covered with a smaller foam material.
In FIG. 3, measuring points are arranged on both sides of the contact interface, and T-type thermocouples are used as the measuring points, and are numbered as 24-26 and 32-34 in sequence.
For each evaporator, four groups of heating amounts of 40W, 80W, 120W and 160W are applied for testing, dT0 is measured under each heating amount, dT 0/Qx120 equivalent to dT under 120W is calculated according to dT and averaged, and the measured value of the heat exchange coefficient h of the welding interface is obtained by replacing the fitting relation shown in formula 1.
As shown in Table 2 below, T _ m in Table 2 represents the average temperature of the side measuring points, T _ B is the temperature measured actually at the upper measuring point of the heat pipe, and dT is the temperature difference equivalent to 120W heating capacity.
Table 2 test results are given as examples
The measured value can be compared with the measured value of a standard sample welded by the same process, and the measured value of the standard sample is about 20000-50000W/m 2K, and the method is reasonable in consideration of large welding surface of a real product, high implementation difficulty in combination with a cabin plate, difficulty in temperature control and solder uniformity control compared with the standard sample, and slightly lower interface heat exchange coefficient h in the actual measurement value range of the standard sample. The results were further verified in large system thermal testing.
Therefore, the interface heat exchange coefficient h is obtained through indirect measurement in combination with temperature field analysis, a powerful basis is provided for thermal characteristic evaluation after welding, and the problem that the interface heat transfer characteristic of a real product is not detectable is effectively solved.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A complex heat transfer component interface heat exchange coefficient determining method based on actual products is characterized by comprising the following steps:
s1, aiming at two components connected through a contact interface, modeling the two components by using thermal analysis software to obtain a real thermal analysis model;
s2, simulating the real thermal analysis model, and determining the size and the position of the applied power Q according to the simulation result;
s3, applying the applied power Q on the set position of the real thermal analysis model, obtaining a temperature field when the temperature reaches balance, and respectively selecting the positions of a first measuring point a and a second measuring point b on the two components according to the temperature field and the implementability;
s4, obtaining simulated values of temperatures Ta and Tb of the first measuring point a and the second measuring point b selected at present according to h selected by the contact interface, and calculating simulated values of the measurable temperature dT to obtain a function h ═ f (dT); rechecking the positions of the first measuring point a and the second measuring point b, if the rechecking condition is met, executing S5, and if the rechecking condition is not met, returning to S3; wherein the measurable temperature dT is: dT is Ta-Tb;
and S5, carrying out test tests by using the positions of the first measuring point a and the second measuring point b determined in S4, wherein during the tests, the real heat transfer quantity is measured to be Q0, the real temperature difference dT0 is measured, the value of the measurable temperature dT is obtained by substituting the formula dT (dT) 0/Q0 multiplied by Q, and the value of the interface heat exchange coefficient h is deduced reversely by substituting the function h (f) (dT).
2. The method according to claim 1, wherein in S2, the true thermal analysis model is simulated, and the magnitude and position of the applied power Q are determined according to the simulation result, specifically:
the location of the applied power Q is a plane that is mirror symmetric about a plane perpendicular to the contact interface, or is centered about an axis perpendicular to the contact interface; meanwhile, the position of the applied power Q is far away from the contact interface, the distance between the position of the applied power Q and the contact interface is increased until the temperature difference between the central temperature of the position of the applied power Q and the surface of the contact interface is larger than a preset temperature difference threshold value, and the temperature difference threshold value is set empirically;
the applied power Q is such that the sensitivity of the interface heat exchange coefficient h with respect to the measurable temperature dT meets a preset measurement accuracy requirement.
3. The method according to claim 1, wherein in S3, the applied power Q is applied to the set position of the real thermal analysis model, when the temperature reaches the equilibrium, a temperature field is obtained, and the positions of the first measuring point a and the second measuring point b are respectively selected from the two components according to the temperature field and the feasibility, specifically:
the distance between the selected positions of the measuring points of the first measuring point a and the second measuring point b and the contact interface does not exceed a preset distance threshold value, and the distance threshold value is set according to experience; the nearest distance A between the measuring point selection position and the plane applying the applied power Q is at least more than 5 times of the distance B between the measuring point selection position and the contact interface;
the measuring point selection positions are in mirror symmetry with respect to a plane perpendicular to the contact interface or are in central symmetry with respect to an axis perpendicular to the contact interface;
the measuring point selecting position considers the feasibility of implementation and is not arranged at a position which is difficult to implement and can not ensure the measuring precision after implementation.
4. The method according to claim 1, wherein in S4, the rechecking condition is specifically: the preset acceptable h measurement error is ± dh, the temperature measurement accuracy is ± Δ T, the derivative of the h ═ f (dT) function to the measurable temperature dT is g (dT) ═ f '(dT) function, and the simulated value of the measurable temperature dT is substituted into the g (dT) ═ f' (dT) function; the rechecking conditions are g (dT) x Δ T > dh.
5. The method of claim 3, wherein the number of the selected positions of the measuring points is not less than 3 under the condition of satisfying symmetry, and Ta and Tb are the temperature average values of the selected positions of the measuring points.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113741576A (en) * | 2021-09-13 | 2021-12-03 | 上海移柯通信技术股份有限公司 | Circuit board temperature detection position selection and detection method, device, equipment and medium |
| CN113741576B (en) * | 2021-09-13 | 2022-05-03 | 上海移柯通信技术股份有限公司 | Circuit board temperature detection position selection and detection method, device, equipment and medium |
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