JP2011222743A5 - - Google Patents

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Publication number
JP2011222743A5
JP2011222743A5 JP2010090250A JP2010090250A JP2011222743A5 JP 2011222743 A5 JP2011222743 A5 JP 2011222743A5 JP 2010090250 A JP2010090250 A JP 2010090250A JP 2010090250 A JP2010090250 A JP 2010090250A JP 2011222743 A5 JP2011222743 A5 JP 2011222743A5
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Japan
Prior art keywords
light emitting
light
emitting element
recess
emitting device
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JP2010090250A
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Japanese (ja)
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JP5678462B2 (en
JP2011222743A (en
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Priority to JP2010090250A priority Critical patent/JP5678462B2/en
Priority claimed from JP2010090250A external-priority patent/JP5678462B2/en
Priority to US13/079,272 priority patent/US8723409B2/en
Publication of JP2011222743A publication Critical patent/JP2011222743A/en
Publication of JP2011222743A5 publication Critical patent/JP2011222743A5/ja
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Claims (9)

上面が開口した凹部を有する収納器と、
前記凹部の内側に配置され、半導体から成る発光層を備えた発光素子と、
前記凹部の内側において、前記発光素子と前記凹部の上面との間に配置され、前記発光素子の発光の一部を吸収して異なる波長の光を発光する波長変換部材と、を備え、前記発光素子の発光と前記波長変換部材の発光とを混合して前記凹部の上面から出射する発光装置であって、
前記凹部は、その側面の少なくとも一部に前記発光素子の発光と前記波長変換部材の発光とを散乱可能な散乱面を有し、
前記発光素子と前記波長変換部材とは、前記凹部の側面から離間しており、
前記発光素子の側面が、前記波長変換部材から露出しており、
前記波長変換部材が、少なくとも、前記発光素子から離間して、前記発光素子から前記凹部の上面へ向かう経路の途中に配置されたことを特徴とする発光装置。 A container having a recess having an upper surface opened;
A light emitting device that is disposed inside the recess and includes a light emitting layer made of a semiconductor;
A wavelength conversion member that is disposed between the light emitting element and the upper surface of the recess inside the recess, and absorbs part of the light emitted from the light emitting element to emit light of different wavelengths, and the light emission A light emitting device that mixes light emitted from an element and light emitted from the wavelength conversion member and emits the light from the upper surface of the recess,
The concave portion has a scattering surface capable of scattering light emission of the light emitting element and light emission of the wavelength conversion member on at least a part of the side surface thereof,
The light emitting element and the wavelength conversion member are separated from the side surface of the recess,
The side surface of the light emitting element is exposed from the wavelength conversion member,
The light emitting device, wherein the wavelength converting member is disposed at least along the path from the light emitting element toward the upper surface of the recess, at a distance from the light emitting element. 前記凹部の上面を覆う透光性部材が設けられており、  A translucent member covering the upper surface of the recess is provided;
前記波長変換部材は、前記透光性部材の前記発光素子側に固定されていることを特徴とする請求項１に記載の発光装置。  The light emitting device according to claim 1, wherein the wavelength conversion member is fixed to the light emitting element side of the translucent member. 前記凹部には透光性の封止部材が充填されており、  The concave portion is filled with a translucent sealing member,
前記透光性部材は、前記封止部材よりも熱伝導率が高い部材であることを特徴とする請求項２に記載の発光装置。  The light-emitting device according to claim 2, wherein the translucent member is a member having a higher thermal conductivity than the sealing member. 前記散乱面は、蛍光体粒子を該蛍光体粒子と屈折率が異なる蛍光体保持部材中に分散して成る面であることを特徴とする請求項１乃至３のいずれか１項に記載の発光装置。 The scattering surface emission according phosphor particles to any one of claims 1 to 3, wherein the phosphor particles and the refractive index of the surface formed by dispersing in a different phosphor holding member apparatus. 前記散乱面が、透光性の粒子を該粒子と屈折率が異なる母材中に分散してなる面であることを特徴とする請求項１乃至３のいずれか１項に記載の発光装置。 The scattering surface, the light emitting device according to any one of claims 1 to 3, characterized in that the translucent particles particles and the refractive index is a surface to be dispersed in different matrix. 前記波長変換部材が、前記発光素子と前記凹部の上面との間にのみ配置されたことを特徴とする請求項１乃至５のいずれか１項に記載の発光装置。 The wavelength conversion member, the light emitting device according only arranged in any one of claims 1 to 5, wherein between the upper surface of the light emitting element and the recess. 前記波長変換部材として板状の波長変換部材を有することを特徴とする請求項１乃至６のいずれか１項に記載の発光装置。 The light emitting device according to any one of claims 1 to 6, characterized in that it has a plate-like wavelength converting member as the wavelength converting member. 前記発光素子から出射した光が、前記波長変換部材又は前記散乱面のいずれかを経てから、前記凹部の上面から取り出されることを特徴とする請求項１乃至７のいずれか１項に記載の発光装置。   8. The light emission according to claim 1, wherein the light emitted from the light emitting element is extracted from the upper surface of the concave portion after passing through either the wavelength conversion member or the scattering surface. apparatus. 前記収納器が、実装基板と、前記実装基板の上に形成された側壁とを備え、前記実装基板に前記発光素子が実装されており、前記側壁に前記散乱面が形成されたことを特徴とする請求項１乃至８のいずれか１項に記載の発光装置。   The container includes a mounting board and a side wall formed on the mounting board, the light emitting element is mounted on the mounting board, and the scattering surface is formed on the side wall. The light-emitting device according to claim 1.
JP2010090250A 2010-04-07 2010-04-09 Light emitting device Active JP5678462B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010090250A JP5678462B2 (en) 2010-04-09 2010-04-09 Light emitting device
US13/079,272 US8723409B2 (en) 2010-04-07 2011-04-04 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010090250A JP5678462B2 (en) 2010-04-09 2010-04-09 Light emitting device

Publications (3)

Publication Number Publication Date
JP2011222743A JP2011222743A (en) 2011-11-04
JP2011222743A5 true JP2011222743A5 (en) 2013-05-16
JP5678462B2 JP5678462B2 (en) 2015-03-04

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JP2010090250A Active JP5678462B2 (en) 2010-04-07 2010-04-09 Light emitting device

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013033854A (en) * 2011-08-02 2013-02-14 Koito Mfg Co Ltd Light wavelength conversion member
JP6251987B2 (en) * 2013-06-14 2017-12-27 岩崎電気株式会社 lighting equipment
JP6221387B2 (en) * 2013-06-18 2017-11-01 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3707688B2 (en) * 2002-05-31 2005-10-19 スタンレー電気株式会社 Light emitting device and manufacturing method thereof
JP2005026401A (en) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd Light emitting diode
JP4587675B2 (en) * 2004-01-23 2010-11-24 京セラ株式会社 Light emitting element storage package and light emitting device
KR100665219B1 (en) * 2005-07-14 2007-01-09 삼성전기주식회사 Wavelengt-converted light emitting diode package
JP2008205170A (en) * 2007-02-20 2008-09-04 Nec Lighting Ltd Light-emitting semiconductor device
JP2009123909A (en) * 2007-11-14 2009-06-04 Mitsubishi Chemicals Corp Light-emitting device, method of manufacturing light-emitting device, sub-mount, and method of manufacturing sub-mount
US8552444B2 (en) * 2007-11-19 2013-10-08 Panasonic Corporation Semiconductor light-emitting device and manufacturing method of the same
JP2009212134A (en) * 2008-02-29 2009-09-17 Toshiba Corp Aluminum nitride package, light-emitting device, backlight, and lighting equipment
US8159131B2 (en) * 2008-06-30 2012-04-17 Bridgelux, Inc. Light emitting device having a transparent thermally conductive layer

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