JP2011220963A - Surface treatment method and device for micro tas substrate and surface treatment mask for micro tas substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable effective modification of the surface of a microchip substrate by irradiation of ultraviolet light to the substrate without altering an analyte.SOLUTION: A substrate (work) 30 with an analyte 31 positioned thereon is held on a work stage 40, and a mask 20 is placed over the substrate (work) 30. The surface of the substrate is irradiated with ultraviolet light from a light irradiation unit 10 to be activated. A concave portion is formed in the mask 20 and shading means 20c is provided on the inner surface the concave portion. A closed space is defined between the concave portion and the substrate 30, and the analyte 31 is placed in the closed space. Thus, the analyte 31 is not irradiated with ultraviolet light and is not exposed to ozone and oxygen atoms generated by irradiation of the work 30 with ultraviolet light. This prevents defects of the analyte 31, such as alteration.

Description

  The present invention relates to a surface treatment method, a surface treatment apparatus, and a mask for surface treatment, and more particularly to a method and apparatus for performing surface treatment by irradiating a microTAS substrate with light and a mask used for surface treatment of microTAS. .

In recent years, separation, synthesis, and extraction of trace amounts of reagents using a microreactor consisting of microchips, in which microscale analysis channels are formed on a small substrate made of, for example, silicon, silicone, glass, etc. Attention has been focused on methods for performing analysis and the like.
A reaction analysis system using such a microreactor is called a micro total analysis system (hereinafter referred to as “microTAS” or “μTAS”). Since the ratio becomes large, it becomes possible to perform reaction analysis with high speed and high accuracy, and to realize a compact and automated system.

In a micro TAS chip (hereinafter referred to as a micro chip), a chip suitable for various applications can be configured by providing a region having various functions such as a reaction region in which a reagent is arranged in a flow path also called a micro channel. Typical applications of microchips include chemical analysis such as genetic analysis, clinical diagnosis, and drug screening, biochemistry, pharmacy, medicine, veterinary analysis, compound synthesis, and environmental measurement.
A microchip typically has a structure in which a pair of substrates are bonded to face each other, and a fine channel (for example, a width of 10 to several hundreds μm and a depth of 10 to several tens μm on the surface of at least one substrate. Degree) is formed. Conventionally, a glass substrate is mainly used for a microchip because it can be easily manufactured and optically detected. Recently, development of a microchip using a resin substrate, which is light in weight but is less likely to be damaged than a glass substrate and inexpensive.

As a method for attaching the microchip substrate, a method using an adhesive or a method using heat fusion may be considered. However, both are not preferable for the following reasons.
When using an adhesive, the adhesive oozes out into the micro flow path and the flow path is blocked, a part of the micro flow path becomes narrow and the flow path becomes non-uniform, or the flow path wall surface is homogeneous. Problems such as the occurrence of disturbances in characteristics occur.
In addition, in the case of heat fusion, if fusion is performed at a temperature higher than the heat melting temperature, the flow path may be collapsed in the heating stage, or the flow path may not be maintained in a predetermined cross-sectional shape. It becomes difficult to increase the functionality of the microchip.
Therefore, in recent years, a method of attaching the substrate surface after irradiating the substrate surface with ultraviolet light to activate the substrate surface is being adopted.
For example, in Patent Document 1, when a microchip substrate is bonded, a substrate made of silicone such as polydimethylsiloxane (PDMS) is irradiated with light from an excimer lamp having an emission line at a wavelength of 172 nm to the surface. There has been proposed a method in which a modification process (oxidation process) is performed, a substrate (for example, a glass substrate) having a hydroxyl group on the surface thereof is brought into close contact with the surface to be modified of the silicone substrate, and both the substrates are bonded.
Also, when a resin substrate and a glass substrate are used as the microchip substrate, even when two resin substrates are used, light from an excimer lamp having a bright line at a wavelength of 172 nm, for example, is irradiated on at least one substrate surface. Then, a method of joining both substrates is known.
For example, when laminating the resin substrate and the resin substrate, by irradiating the resin surface with light having a wavelength of 300 nm or less (for example, wavelength 172 nm), the polymer main chain on the resin surface is cut to generate radicals, By generating highly reactive functional groups on the surface, the resin surface itself is likely to cause a chemical reaction, and two resins are laminated. By applying pressure or heating in this state, the detailed mechanism is not necessarily clear, but some bonds via the functional groups are generated and bonded between the irradiated surfaces of the respective resins.
When the resin substrate is irradiated with vacuum ultraviolet light having a wavelength of 200 nm or less, such as light having a wavelength of 172 nm, in the atmosphere, oxygen atoms are generated from oxygen in the atmosphere, and pollutants such as organic substances existing on the resin surface. The chemical bond of is broken. The contaminants are removed from the resin substrate by combining such contaminants with oxygen atoms. That is, the resin substrate is cleaned, and thereafter, the resin surface is oxidized, functional groups are generated, and the like.

In this way, by irradiating the surface of the microchip substrate with ultraviolet light, the surface of the microchip substrate is activated so that it can be joined to another microchip substrate (for example, cleaning, oxidation, polymer main chain Cleavage, generation of functional groups, etc.).
In addition, the microchip is configured by bonding a pair of substrates. Depending on the application, a specimen (eg, saliva, blood, (cancer) cell, antibody, etc.) may be attached before the microchip substrate is bonded. May be pre-installed on the substrate.
For example, Patent Document 2 discloses a technique for fixing cells by forming a hydrophobic resin pattern for cell fixation on a substrate.

JP 2006-187730 A Japanese Patent No. 4247737

As described above, when two microchip substrates are bonded to each other, the surface of at least one of the two substrates is irradiated with ultraviolet light that activates the surface, and then the two are stacked. Then, the method of bonding is effective.
Here, when an inspection body (for example, an antibody or a cell) is set in advance on one of the two microchip substrates, the substrate is also irradiated with ultraviolet light and activated. There is.
In this case, when the inspection object is irradiated with ultraviolet light, the inspection object is deteriorated and it becomes difficult to perform a desired analysis on the inspection object. For example, when the antibody is irradiated with ultraviolet light, the antibody is inactivated (inactivated) and does not cause a binding reaction with the antigen even if a specimen containing the antigen reaches the antibody.

In order to solve such a problem, for example, it is conceivable to shield the inspection body installed on the microchip substrate so as not to be irradiated with ultraviolet light. That is, as shown in FIG. 8, it is conceivable to arrange a mask between a light source that emits ultraviolet light and a microchip substrate on which an inspection object is placed.
In FIG. 8, as an example, a case where gold plating 101 is applied to a part of the surface of the microchip substrate 100 (work) and the antibody 103 is arranged on the gold plating portion is shown. The mask 104 is patterned so as to prevent the test body from being irradiated with ultraviolet light, corresponding to the installation pattern of the test body (in this case, the antibody 103) on the microchip substrate 100. That is, the ultraviolet light is irradiated to the substrate surface where no antibody exists without irradiating the antibody 103 on the microchip substrate 100 by the light shielding means 105 of the mask 104, and as a result, the substrate surface is activated.

However, when ultraviolet light is irradiated onto a microchip substrate placed in the atmosphere, oxygen and ultraviolet light in the atmosphere react to generate ozone and (excited singlet) oxygen atoms. That is, the ultraviolet light that has passed through other than the light shielding portion of the mask reacts with oxygen in the air to generate ozone and oxygen atoms. This phenomenon occurs remarkably when vacuum ultraviolet light having a wavelength of 200 nm or less is used as ultraviolet light.
Ozone and oxygen atoms are highly reactive and react with the test object installed on the microchip substrate. When the specimen is an antibody or a cell, if the antibody or cell comes into contact with ozone or an oxygen atom, the antibody or cell is altered.
Therefore, it becomes difficult to perform a desired analysis on the antibody or cell that is the test object. These defects are particularly affected by ozone than oxygen atoms with a short lifetime. For example, when an antibody reacts with ozone or oxygen atoms, the antibody is deactivated, and even if a specimen containing the antigen reaches the antibody, the binding reaction with the antigen does not occur.
In order to prevent such troubles caused by ozone and oxygen atoms, the microchip substrate may be placed in an atmosphere in which oxygen does not exist and irradiated with ultraviolet light. To realize such an atmosphere, the microchip is used. It is necessary to install the substrate for use in a dedicated chamber in which oxygen does not exist, which is a large scale.

  The present invention has been made in view of the circumstances as described above, and the problem is that ultraviolet light is applied to a microchip substrate on which a test object is placed on the surface in the atmosphere in order to bond the microchip substrate. In the case of irradiation, it is an object to provide a method and apparatus capable of satisfactorily modifying the surface of a microchip substrate without altering the specimen.

In order to solve the above-described problems, in the present invention, a specimen such as a specimen derived from a living body such as blood, a cell, or a tissue, a specimen such as an antibiotic or an agrochemical is altered by ultraviolet light or ozone (for example, inactivation, decomposition, death). When surface-treating the microchip substrate (micro TAS substrate) on which the inspection body to be mounted is placed, the inspection body is placed in a closed space that is not exposed to ozone generated by ultraviolet light irradiation, and the inspection is performed. The surface of the substrate is activated by shielding the body from being irradiated with ultraviolet light.
For this reason, a mask having a light shielding part is disposed at least in part between the light irradiation unit for irradiating ultraviolet light and the inspection body, and the inspection body is formed by the mask and the substrate on which the inspection body is placed. An enclosed space is formed, and the substrate is irradiated with ultraviolet light while being shielded from being irradiated with ultraviolet light by the light shielding portion or by the light shielding portion and the substrate.
As a result, the surface of the microchip substrate can be activated without altering the specimen.
That is, in the present invention, the above problem is solved as follows.
(1) A method for treating a surface of a microchip substrate on which an inspection body that is altered by ultraviolet light or ozone is placed, and a mask is placed on the substrate so that the inspection body is placed in a closed space.
The substrate surface is activated by light irradiation while shielding the inside of the closed space where the inspection object is placed.
(2) In the above (1), a recess is formed in the mask, and a light shielding film is formed on the inner surface of the recess.
(3) In the above (1), the light is vacuum ultraviolet light having a wavelength of 200 nm or less.
(4) In a surface treatment apparatus for a microchip substrate on which an inspection body that is altered by ultraviolet light or ozone is placed, a stage that holds the substrate on which the inspection body is placed, and a surface for activating the substrate surface In order to set a light irradiation unit for irradiating light, a mask having a light shielding member formed at least in part, and transporting the mask onto the substrate, and arranging the inspection object in a closed space A surface processing apparatus for a microchip substrate is configured from the mask transport mechanism.
(5) In (4) above, a recess is formed in the mask, and a light shielding film is formed on the inner surface of the recess.
(6) In the above (4), the light is vacuum ultraviolet light having a wavelength of 200 nm or less.
(7) In a surface treatment mask for a microchip substrate on which an inspection body that is altered by ultraviolet light or ozone is placed and is placed on a substrate that is irradiated with light, the mask is at least one A concave portion is formed in the portion, and when the mask is placed on the substrate, a closed space is formed by the concave portion of the mask and the substrate, and a light shielding means is formed on the inner surface of the concave portion. .
(8) In said (7), the recessed part of a mask is comprised by the wall part protruded from the flat member.

In the present invention, the following effects can be obtained.
(1) A closed space in which the inspection body is accommodated is formed by the mask and the substrate on which the inspection body is placed, and vacuum ultraviolet light is applied to the inspection body by the light shielding portion formed on the mask or by the light shielding portion and the substrate. Since the UV light such as light is shielded from being irradiated, vacuum UV light is not irradiated to the inspection object, and vacuum UV light is applied to the work even if the work is held in the atmosphere. The test object is not exposed to ozone or oxygen atoms generated during irradiation. For this reason, the inspection object installed in the workpiece does not suffer from problems such as deterioration due to irradiation with vacuum ultraviolet light or exposure to ozone or oxygen atoms.
(2) The work is held in the atmosphere, and ozone and oxygen atoms generated by irradiation with vacuum ultraviolet light are generated in a region outside the closed space in which the specimen is contained. Therefore, the area outside the closed space of the workpiece can be cleaned, and the area outside the closed space on the workpiece surface can be activated (surface modification).

It is a figure which shows the structural example of the optical processing apparatus which is embodiment of this invention. It is the figure which expanded and showed the workpiece | work and the mask in FIG. It is a figure which shows an example of the microchip formed by bonding together the board | substrate for microchips. It is a figure which shows the operation example of the apparatus at the time of surface-treating a workpiece | work. It is a figure explaining the bonding process of the workpiece | work of the 1st Example of this invention. It is a figure explaining the bonding process of the workpiece | work of the 2nd Example of this invention. It is a figure which shows the case where a recessed part is provided in the board | substrate (work) for microchip in which the test body was mounted. It is a figure explaining the problem at the time of arrange | positioning a mask between the light source which discharge | releases an ultraviolet light, and the board | substrate for microchip in which the test body is mounted.

FIG. 1A is a diagram illustrating a configuration example of an optical processing apparatus according to an embodiment of the present invention.
The work 30 is a microchip substrate, and is made of, for example, a COC resin. An inspection body 31 is placed on the workpiece 30 in advance and is omitted in the figure, but the other workpiece is bonded to form a microchip.
The light irradiation unit 10 is for modifying the surface of the work 30 by irradiating the surface of the work 30 with ultraviolet light (UV light) having a wavelength of 300 nm or less. The light irradiation unit 10 includes at least one lamp 11a, a reflection mirror 11b that reflects ultraviolet light emitted from the lamp 11a toward the work 30 (downward in FIG. 1), and a lamp house 10a that includes these. Consists of.
The lamp 11a is preferably one that emits vacuum ultraviolet light (VUV light) having a wavelength of 200 nm or less among ultraviolet light. For example, a xenon excimer lamp that emits monochromatic light having a wavelength of 172 nm is employed. Lighting control of each lamp 11 a of the light irradiation unit 10 is performed by the lamp lighting device 12. That is, the lamp lighting device 12 has a function of adjusting the intensity of 172 nm light emitted from the lamp 11a by controlling lighting / extinguishing of the lamp and adjusting the value of the power supplied to the lamp 11a.

A work 30 (microchip substrate) is placed on the work stage 40.
When the apparatus is installed in the atmosphere, the ultraviolet light, particularly vacuum ultraviolet light, irradiated from the light irradiation unit 10 to the work 30 is significantly attenuated in the atmosphere. Therefore, in the atmosphere, the light irradiation unit 10 and the surface of the work 30 need to be close to some extent.
The work stage 40 is provided with a positioning mechanism (not shown) that determines the position of the work 30. The work stage 40 also has a mechanism that can move not only in the vertical direction but also in the horizontal direction and the rotational direction.
The mask 20 is transferred onto the work 30 by the mask transfer mechanism 21. The mask transport mechanism 21 is a well-known one. For example, the mask 20 is held and transported by the vacuum chuck unit 22, and after the mask 20 is set on the work 30, the vacuum chuck of the vacuum chuck unit 22 is released and ultraviolet light is released. Retreat from the irradiation area. Such a mask transport mechanism 20 is configured to be movable by the mask transport mechanism driving unit 23 and to be able to supply a vacuum to the vacuum chuck unit 22. The driving of the mask transport mechanism drive unit 23 is controlled by the mask transport mechanism drive control unit 24.
In addition, when the work 30 is carried in, installed, and carried out from the work stage 40, a known work conveyance mechanism (not shown) is used. Here, it is assumed that the well-known work transport mechanism has a function of reversing the work after capturing the work, a function of transporting the reversed work, and placing the work at a predetermined position.

FIG. 2 is an enlarged view of the work 30 and the mask 20 on the work stage 40.
As shown in FIG. 2A, the mask 20 has a recess that can surround an inspection body 31 placed on a work 30 (hereinafter also referred to as a microchip substrate 30). Specifically, a wall portion 20a having a protruding structure is provided on the back surface (the surface facing the workpiece 30) of the flat plate portion 20b that receives ultraviolet light, and the inspection body 31 is placed on the mask 20. The installed work 30 and the wall portion 20a are placed in contact with each other.
In this state, a closed space including the flat plate portion 20 b of the mask 20, the wall portion 20 a of the mask 20, and the workpiece 30 is formed between the mask 20 and the workpiece 30. All of the inspection bodies 31 installed on the work 30 are included in this closed space. The mask 20 is a material that transmits ultraviolet light, and does not react with the inspection body 31 and is easily subjected to light shielding means. For example, quartz glass is used.

An ultraviolet light shielding means 20c is formed in a concave portion (a portion surrounded by the flat plate portion 20b and the wall portion 20a) of the mask 20 constituting the closed space. Specifically, for example, a light shielding film such as chrome is applied to the concave portion (flat plate portion, wall portion) of the mask 20 constituting the closed space.
The light shielding means 20c is not necessarily provided on the entire surface of the mask recess that forms the closed space. In short, the light shielding means 20c may be shielded so that ultraviolet light does not reach the closed space.
With the above configuration, the ultraviolet light does not reach the closed space containing the inspection body 31 placed on the work 30. For this reason, the ultraviolet light is not irradiated to the test body 31 such as an antibody or a cell as a matter of course. Furthermore, since ultraviolet light does not reach the closed space, ozone and oxygen atoms are not generated even if air exists in the closed space. Furthermore, since the test body 31 is disposed in the closed space, ozone and oxygen atoms do not enter from outside the closed space. And the surface of the workpiece | work other than the part in which the test body 31 was mounted can be irradiated with light favorably, and the said surface can be activated.
FIG. 2B is a cross-sectional view taken along the line AA in FIG. On the work 30 (microchip substrate), for example, gold plating 32 is applied, and an inspection body 31 (antibody) is placed thereon. The mask 20 is formed with a wall portion 20a, for example, in a U shape so as to surround a region where the gold plating 32 on which the inspection body 31 is placed is formed, and light shielding means is provided on the inner surface of the wall portion 20a. 20c is provided. Although not shown in FIG. 2B, a light shielding unit is also provided on the surface of the mask 20 facing the light irradiation unit 10.

FIG. 3 is a view showing a state in which a microchip 60 is configured by bonding a second microchip substrate (second work 50) to the microchip substrate (first work 30).
As shown in the figure, the first workpiece 30 (microchip substrate) is, for example, a glass substrate. In the example shown in the upper diagram, a pattern of gold plating 32 having four regions is applied. For example, an antibody 31 a is installed on the pattern of the gold plating 32 as the inspection body 31.
The second workpiece (second microchip substrate to be bonded to the first workpiece 30) 50 is, for example, a resin substrate made of COC resin. On one surface of the second workpiece 50, for example, a flow path composed of fine grooves 51 having a width of about 10 to several hundreds μm and a depth of about 10 to 100 μm is formed.
As shown in FIG. 3, the antibody 31 a is formed inside by bonding the surface of the first work 30 on which the inspection body 31 is installed and the surface on which the groove 51 of the second work 50 is formed. A microchip 60 having a fine flow path arranged is formed.

A sample (or reagent) inflow port 52 and a sample (or reagent) outflow port 53 are provided on the surface of the second work (second microchip substrate) 50 opposite to the surface on which the flow path is provided. It has been. The inflow port 52 and the outflow port 53 communicate with the groove 51.
In the example shown in the upper diagram, the flow path is formed to be U-shaped, and the inflow port 52 and the outflow port 53 communicate with the end portion of the U-shaped flow path 51.
The specimen flowing in from the inflow port 52 passes through the flow path 51 and is discharged from the outflow port 53 after contacting the four antibodies 31a placed on the gold plating.
The surface of the microchip substrate 30 is formed by covering the first work 30 (microchip substrate) on which the antibody 31a is placed with the mask 20 as described above and irradiating the surface with ultraviolet light. Can be activated to be able to be joined, and the second work 50 (second microchip substrate) is put on this to cover the first work 30 and the first work 30 with the antibody 31a installed. The 2nd workpiece | work 50 can be bonded together and the microchip 60 can be formed.

Hereinafter, the Example of this invention which performs the optical process with respect to the 1st workpiece | work 30, and bonds the 2nd workpiece | work 50 is described.
1. 1st Example Hereinafter, the 1st Example of this invention is described with reference to FIG. 4, FIG. 5 about the example of the bonding process of the workpiece | work for surface plasmon resonance analysis. FIG. 4 is a diagram for explaining the operation of the apparatus shown in FIG. 1, and FIG. 5 is a diagram for explaining the bonding process of this embodiment.
(1) As shown in FIG. 5A, a gold plating pattern 32 is formed on the first work 30.
(2) As shown in FIG. 5B, the first work 30 on which the gold plating pattern 32 is formed is dipped in the antibody solution. On the gold plating 32, an antibody 31a (antigen receptor) is immobilized.
(3) As shown in FIG. 5C, the mask 20 is placed on the first work 30 to which the antibody 31a is fixed. When the mask 20 is placed on the first workpiece 30, the mask 20 has a structure in which a closed space is formed by the flat plate portion 20 b of the mask 20, the wall portion 20 a of the mask, and the first workpiece 30.
The mask 20 is placed on the first work 30 after positioning so that the antibodies 31a installed on the first work 30 are all contained in the closed space.
That is, as shown in FIG. 4A, the light irradiation unit drive control unit 14 drives the light irradiation unit drive unit 13 to retract the light irradiation unit 10, and the mask 20 is moved by the vacuum chuck 22 of the mask transport mechanism 21. Is transferred onto the first work 30 placed on the work stage 40. Then, the work stage 40 is moved (or the mask is moved by the mask transport mechanism 21), the mask 20 and the first work 30 are aligned, and the mask 20 is moved as shown in FIG. Place on the first workpiece 30.

(4) Next, as shown in FIG. 4C, the vacuum chuck of the mask 20 by the vacuum chuck unit 22 is released, the vacuum chuck unit 22 of the mask transport mechanism 21 is retracted, and the light irradiation unit drive control unit 14. As a result, the light irradiation unit driving unit 13 is driven to move the light irradiation unit 10 onto the mask 20.
Then, as shown in FIG. 5D, ultraviolet light emitted from the light irradiation unit 10, particularly vacuum ultraviolet light, is irradiated to the first workpiece 30 through the mask.
The mask portion (flat plate portion 20b, wall portion 20a) constituting the closed space is provided with a light blocking means 20c (for example, a light blocking film such as chrome) that blocks vacuum ultraviolet light, so that it is included in the closed space. The specimen (antibody 31a) is not irradiated with the vacuum ultraviolet light, and ozone and oxygen atoms are not generated even if the atmosphere exists in the closed space. Furthermore, by irradiating the first work 30 with vacuum ultraviolet light in the atmosphere, ozone and oxygen atoms generated between the mask 20 and the first work 30 cannot enter the closed space. Therefore, the antibody 31a in the closed space is not exposed to ozone or oxygen atoms.

(5) On the other hand, the region outside the closed space in the first work 30 is irradiated with vacuum ultraviolet light. When the first workpiece 30 is installed in the atmosphere, ozone and oxygen atoms are generated in the region irradiated with the vacuum ultraviolet light, and the region outside the closed space in the ozone and oxygen atoms and the first workpiece 30 is generated. The above contaminants react to remove the contaminants. For example, antibody residues remaining after dipping in the above antibody solution are also removed.
That is, when the first workpiece 30 is irradiated with vacuum ultraviolet light using the mask of the present invention, the specimen (antibody 31a) is not irradiated with vacuum ultraviolet light, and the first workpiece 30 is held in the atmosphere. Even if it does, the said test body is not exposed to the ozone and oxygen atom which generate | occur | produce when irradiating the vacuum ultraviolet light to the 1st workpiece | work 30. FIG. Therefore, the test body (antibody 31a) installed on the first workpiece 30 does not suffer from problems such as deterioration due to irradiation with vacuum ultraviolet light or exposure to ozone or oxygen atoms.
On the other hand, when the first workpiece 30 is held in the atmosphere, ozone and oxygen atoms generated by irradiation with vacuum ultraviolet light are generated in a region outside the closed space in which the specimen is contained. Then, the area outside the closed space in the first work 30 is cleaned.
Furthermore, after the cleaning is completed, the region outside the closed space on the surface of the first workpiece 30 is activated (surface modification) by irradiating with vacuum ultraviolet light.

(6) Here, the step of irradiating the first workpiece 30 with the vacuum ultraviolet light emitted from the light irradiation unit described above is specifically performed as follows.
That is, after installing the mask 20 on the first work 30, the lamp 11 a of the light irradiation unit 10 is turned on by the lamp lighting device 12, and vacuum ultraviolet light having a wavelength of 172 nm is applied to the first work 30 through the mask 20. Is done. Here, in the lamp lighting device 12, the irradiance in the light irradiation region (region other than the closed space) on the surface of the first workpiece 30 is sufficient to clean and activate the light irradiation region. Value) to control the power supplied to the lamp 11a. After a predetermined irradiation time has elapsed, the lamp lighting device 12 turns off the excimer lamp 11a. Here, it is assumed that the lamp lighting device 12 can also set the lamp lighting time. The above-mentioned predetermined irradiation time means that the excimer lamp 11a is turned on and the light irradiation region on the surface of the first workpiece 30 is irradiated with vacuum ultraviolet light, and then the light irradiation region is cleaned with oxygen atoms. , The time until activation.
Thus, the optical processing for the first workpiece 30 is completed.

(7) When the optical processing on the first workpiece 30 is completed, as shown in FIG. 5E, the other substrate (second workpiece 50) constituting the microchip is also irradiated with light, The surface of the workpiece 50 is activated. This step may be performed prior to the light irradiation on the first workpiece 30 on which the antibody 31a is installed, or the light irradiation unit 10 may be added to irradiate both substrates simultaneously.
(8) Next, as shown in FIG. 5 (f), the mask 20 is retracted from the first workpiece 30. The retraction of the mask 20 can also be performed after the light irradiation to the first workpiece 30 is completed and before the light irradiation to the second workpiece 50 is performed. In this case, the influence of residual ozone and oxygen atoms on the test object after the light irradiation to the first work 30 is completed, and the ozone and oxygen atoms generated when the second work 50 is irradiated with light are applied to the test object. The impact needs to be fully considered. Note that the influence of oxygen atoms generated by light irradiation is small compared to ozone because the lifetime of the oxygen atoms is short.
(9) Next, as shown in FIG. 5G, the first workpiece 30 and the second workpiece 50 are stacked, and these are joined by pressurization to form a microchip. The groove 51 (flow path) formed in the second workpiece 50 is designed in advance so as to enclose the antibody 31a installed in the first workpiece 30 when the two are bonded together. Therefore, when both the workpieces 30 and 50 are stacked, alignment is necessary so that the positions of the flow path and the antibody do not shift.

  In the microchip manufactured by the above steps, specimens such as bacteria, viruses and cells infected with microorganisms are injected into the internal flow path. The antibody recognizes and binds to the specimen as an antigen. As a characteristic analysis of an antibody, for example, such a binding characteristic is evaluated. For this evaluation, for example, a surface plasmon resonance method is used. That is, electromagnetic waves are applied to the gold plating 32 from the surface of the microchip on which the gold plating 32 has been applied (the back surface of the workpiece 30 to which the gold plating has been applied). Then, the surface plasmon resonance is generated by the evanescent wave (near field) generated when the electromagnetic wave is totally reflected and the surface plasmon, and the resonance condition (the incident angle of the electromagnetic wave) is observed. Evaluate binding properties.

2. Second Embodiment Next, a second embodiment of the optical processing method of the present invention will be described. Specifically, the present invention will be described by taking as an example a work bonding process in which a hydrophobic resin pattern for cell fixation is formed.
(1) As shown in FIG. 6A, a hydrophobic resin pattern 30a for cell fixation is formed on a microchip substrate (first work 30). The first work 30 employs a hydrophobic resin such as polystyrene, and a hydrophilic polymer material made of a monomer such as acrylamide is applied to the hydrophobic resin to form the hydrophilic resin layer 30b.
Thereafter, the hydrophilic polymer material is patterned to expose a part of the hydrophobic resin, thereby forming the hydrophobic resin pattern 30a. This forming method is disclosed in, for example, Patent Document 2.
(2) As shown in FIG. 6B, cells 31b are fixed to the hydrophobic resin pattern 30a by a method such as dropping. The first workpiece 30 on which the test body 31 (cell 31b) is placed is prepared by the process as described above.
(3) Next, as shown in FIGS. 4A and 4B, the mask 20 of the present invention is placed on the first work 30. In this state, as shown in FIG. 6C, the cells 31 b fixed to the first workpiece 30 are enclosed in a closed space created by the mask 20 and the first workpiece 30.

(4) The light irradiation unit 10 is moved onto the mask 20 as shown in FIG. 4C, and the lamp of the light irradiation unit 10 is turned on as shown in FIG. 6D. Thereby, for example, vacuum ultraviolet light having a wavelength of 172 nm is irradiated to the first workpiece 30 through the mask 20.
Here, in the lamp lighting device 12, the irradiance in the light irradiation region (region other than the closed space) on the surface of the first work 30 is set to a predetermined value (a value sufficient to activate the light irradiation region). In this way, the power supplied to the lamp is controlled. After a predetermined irradiation time has elapsed, the lamp lighting device 12 turns off the lamp. The predetermined irradiation time described above is the time from when the lamp is turned on and the light irradiation region on the surface of the first workpiece 30 is irradiated with vacuum ultraviolet light until the light irradiation region is activated. . In addition, since the cell body is fixed to the first work 30 by dripping in the case of bonding the first work 30 for cell examination, when the first work 30 is washed before cell fixation, It is not necessary to clean the first work 30 by irradiating the first work 30 with vacuum ultraviolet light.

(5) Next, as shown in FIG. 6E, the light irradiation unit 10 irradiates the second workpiece 50 with vacuum ultraviolet light to activate (surface reform) the surface of the second workpiece.
(6) Next, as shown in FIG. 6 (f), the mask 20 is removed from the first workpiece 30.
(7) And as shown in FIG.6 (g), the 2nd workpiece | work 50 is laminated | stacked on the 1st workpiece | work 30, and both are bonded together by pressurization. As a result, the bonding of both is completed and the microchip is completed.
The reagent is injected into the groove 51 (flow path) inside the microchip thus produced. The reagent is, for example, a fluorescent stain. Then, the state of the stained cell is analyzed by a technique such as fluorescence analysis.

In the above embodiment, a xenon excimer lamp that emits vacuum ultraviolet light is used as a light source. However, other lamps such as a low-pressure mercury lamp may be used as a lamp that emits vacuum ultraviolet light. A lamp that emits ultraviolet light such as a high-pressure mercury lamp or a metal halide lamp can also be used.
Moreover, although the said Example demonstrated the Example which forms a recessed part in a mask, a recessed part can also be formed in the board | substrate (workpiece | work) for microchip in which the test body was mounted. In this case, the mask has a flat plate shape, and the area on which the inspection object is placed can be set as a closed space by covering the mask with a work having a recess. Further, in this case, a light shielding means is provided on the inner surface of the mask and the workpiece forming the closed space.
FIG. 7 shows an embodiment in which a concave space is provided on the microchip substrate (work) side on which the inspection object is placed as described above, and a closed space is formed by combining with a mask. FIG. 5A shows a state before the mask and the workpiece are combined, and FIG. 5B shows a state where both are combined.
As shown in the figure, a recess 301 is formed in the workpiece 300, a gold plating 32 is applied to the bottom surface of the recess 301, and an antibody 31a is placed thereon. The mask 200 has a flat plate shape, and the light shielding means 20 c is provided so as to cover the entire area of the recess 301.

Here, although the light shielding member 20c can be provided on both the mask 200 and the workpiece 300, it is usually accompanied by manufacturing difficulties to provide the light shielding means on the workpiece 300. Therefore, as shown in FIG. 7, the mask 200 can be provided with a light shielding means 20 c larger than the closed space formed by the recesses 301 so that obliquely incident light does not reach the closed space. In this case, the workpiece 300 is preferably made of a material that absorbs vacuum ultraviolet light, such as borosilicate glass, instead of a material that transmits vacuum ultraviolet light, such as quartz glass.
In addition, it is also possible to form a closed space by providing concave portions in both the mask 200 and the workpiece 300 and overlapping the concave portions.

In the above description, the case where the concave portion is U-shaped has been described. However, in the present invention, the shape and dimensions of the concave portion are not particularly limited. However, since it is necessary to activate the workpiece surface outside the region where the inspection object is placed, it is desirable that the size of the closed space be the same as or slightly larger than the inspection object.
In the above embodiment, the light shielding film made of chromium is described as the light shielding means. However, the present invention is not limited to this, and for example, black resin, molybdenum, tungsten, or the like can be applied.

DESCRIPTION OF SYMBOLS 10 Light irradiation unit 10a Lamp house 11a UV lamp 11b Reflection mirror 12 Lamp lighting device 13 Light irradiation unit drive part 14 Light irradiation unit drive control part 20,200 Mask 20a Wall part 20b Flat plate part 20c Light-shielding means 21 Mask conveyance mechanism 22 Vacuum chuck Section 23 Mask transport mechanism drive section 24 Mask transport mechanism drive control section 30, 300 First workpiece (microchip substrate)
31 Specimen 31a Antibody 32 Gold plating 50 Second workpiece (microchip substrate)

Claims (8)

A surface treatment method for a substrate for micro TAS on which an inspection object that is altered by ultraviolet light or ozone is placed,
Cover the substrate with the mask so that the inspection object is placed in a closed space,
A surface treatment method for a substrate for micro TAS, wherein the surface of the substrate is activated by light irradiation while shielding the inside of a closed space where the inspection object is placed.   2. The surface treatment method for a micro TAS substrate according to claim 1, wherein a concave portion is formed in the mask, and a light shielding film is formed on an inner surface of the concave portion.   2. The surface treatment method for a micro TAS substrate according to claim 1, wherein the light is vacuum ultraviolet light having a wavelength of 200 nm or less. A surface treatment apparatus for a micro TAS substrate on which an inspection object that is altered by ultraviolet light or ozone is placed,
A stage for holding a substrate on which the inspection body is placed;
A light irradiation unit for irradiating light for activating the substrate surface;
A mask having a light shielding member formed at least in part;
A mask transport mechanism for transporting the mask onto the substrate and setting the inspection object to be disposed in a closed space;
A surface treatment apparatus for a substrate for micro TAS, comprising:   5. The surface treatment apparatus for a micro TAS substrate according to claim 4, wherein a concave portion is formed in the mask, and a light shielding film is formed on an inner surface of the concave portion.   The surface treatment apparatus for a micro-TAS substrate according to claim 4, wherein the light is vacuum ultraviolet light having a wavelength of 200 nm or less. A mask for surface treatment of a micro TAS substrate, which is placed so as to be placed on a substrate irradiated with light, on which an inspection object that is altered by ultraviolet light or ozone is placed,
When there is a recess at least in part and the mask is placed on the substrate, a closed space is formed by the recess of the mask and the substrate, and a light shielding means is formed on the inner surface of the recess. A mask for surface treatment of a substrate for micro TAS, wherein   The mask for surface treatment of a micro TAS substrate according to claim 7, wherein the concave portion of the mask is constituted by a wall portion protruding from a flat plate member.

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