JP2011218603A - Molding method for resin molded body with surface functional layer, and the molded body - Google Patents
Molding method for resin molded body with surface functional layer, and the molded body Download PDFInfo
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- 229920005989 resin Polymers 0.000 title claims abstract description 65
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- 238000000465 moulding Methods 0.000 title claims abstract description 56
- 239000002346 layers by function Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001746 injection moulding Methods 0.000 claims abstract description 17
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 15
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
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- 229920005668 polycarbonate resin Polymers 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 13
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- 125000003118 aryl group Chemical group 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
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- 238000007493 shaping process Methods 0.000 claims 1
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
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- 239000000654 additive Substances 0.000 description 4
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- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
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- 150000002989 phenols Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
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- 239000000463 material Substances 0.000 description 2
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- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
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- 238000003825 pressing Methods 0.000 description 2
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- 238000002411 thermogravimetry Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 1
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000002519 antifouling agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical compound OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
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- 239000000428 dust Substances 0.000 description 1
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- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
Description
本発明は、表面に機能層を有する樹脂成形体に関する。詳しくは、本発明は、表面に機能層を有する樹脂成形体であって、寸法精度、および生産性に優れた樹脂成形体の成形方法並びにかかる樹脂成形体に関する。 The present invention relates to a resin molded body having a functional layer on the surface. Specifically, the present invention relates to a resin molded body having a functional layer on the surface, and relates to a method for molding a resin molded body having excellent dimensional accuracy and productivity, and the resin molded body.
ガラス板を芳香族ポリカーボネート樹脂に代表される熱可塑性樹脂製の板に代替する試みは従来から幅広い分野で実施されている。その目的は、軽量化、安全性の向上、およびガラスでは不可能な態様での利用などを達成することにある。この中でガラスでは不可能な態様での利用の具体例としては、開口部や偏肉、ボス、リブ形状を有する成形体等が挙げられ、それらの成形体を後加工でなく直接に製造することが開示されている（特許文献１参照）。また、ガラス板が利用されていた分野では、樹脂板にも耐擦傷性が求められる場合が多く、ハードコートが必須である。ハードコートを樹脂板に施す方法としてはスプレーコート法、フローコート法、ディップコート法を使用する方法が開示されている（非特許文献１参照）。しかしながら開口部等の複雑な形状の成形体では垂れなどの外観不良が出るという問題がある。一方、射出成形中に箔転写することにより成形体の表面に機能層を施す方法も開示されている（特許文献２参照）。しかしながら、成形体が大型化、厚肉化、立体形状化すると、熱や樹脂流動の複雑化によりフィルムが引き伸ばされて皺を生じるという問題がある。 Attempts to replace the glass plate with a plate made of a thermoplastic resin typified by an aromatic polycarbonate resin have been performed in a wide range of fields. Its purpose is to achieve weight reduction, improved safety, and utilization in a manner that is not possible with glass. Among these, specific examples of use in a mode impossible with glass include molded bodies having openings, uneven thickness, bosses, rib shapes, etc., and these molded bodies are directly manufactured rather than post-processed. (See Patent Document 1). In fields where glass plates have been used, resin plates are often required to have scratch resistance, and a hard coat is essential. As a method for applying a hard coat to a resin plate, a method using a spray coating method, a flow coating method, or a dip coating method is disclosed (see Non-Patent Document 1). However, there is a problem that a molded article having a complicated shape such as an opening has poor appearance such as sagging. On the other hand, a method of applying a functional layer to the surface of a molded body by transferring a foil during injection molding is also disclosed (see Patent Document 2). However, when the molded body becomes larger, thicker, or three-dimensionally shaped, there is a problem that the film is stretched due to the complexity of heat and resin flow to cause wrinkles.
本発明の目的は、上記問題に鑑みてなされたものであり、表面機能層を有する樹脂成形体の射出成形による製造を可能とすることにある。 An object of the present invention is made in view of the above problems, and is to enable production of a resin molded body having a surface functional layer by injection molding.
本発明者らは、鋭意検討を重ねた結果、キャリアフィルムの特性を最適化し、射出圧縮成形方法との組合せにより、大型且つ、立体形状においても皺が無い成形体を得る方法を見出し、本発明を完成するに至った。 As a result of intensive studies, the present inventors have found a method of optimizing the characteristics of a carrier film and obtaining a molded body having a large size and no defects even in a three-dimensional shape by combining with an injection compression molding method. It came to complete.
本発明によれば、上記課題を解決する手段として、融点が２２０℃以上であり、かつＪＩＳ Ｃ ２３１８における２００℃での収縮率が５％〜４０％である表面に機能層を有するフィルムを一方の金型と他方の金型との間に配置し、該金型を型締めして成形キャビティを形成した後、該キャビティ内に熱可塑性樹脂を射出する工程および成形体よりフィルムを剥がす工程を含む射出成形による表面に機能層が付与された樹脂成形体の成形方法が提供される。 According to the present invention, as a means for solving the above problems, a film having a functional layer on the surface having a melting point of 220 ° C. or higher and a shrinkage rate at 200 ° C. of JIS C 2318 of 5% to 40% is provided. The mold is placed between the mold and the other mold, the mold is clamped to form a molding cavity, and then a process of injecting a thermoplastic resin into the cavity and a process of peeling the film from the molded body are performed. A method for molding a resin molded body in which a functional layer is provided on a surface by injection molding is provided.
以下、本発明の詳細について説明する。
＜表面に機能層を有するフィルム＞
本発明で使用される表面に機能層を有するフィルムとは、キャリアフィルムの表面に機能層を積層したフィルムであり、フィルムの融点は２２０℃以上であり、２５０℃以上が好ましく、２６０℃以上がより好ましい。融点が２２０℃より低い場合、射出成形時に溶融樹脂の熱によってフィルムが成形体に融着する。
Details of the present invention will be described below.
<Film with functional layer on the surface>
The film having a functional layer on the surface used in the present invention is a film in which a functional layer is laminated on the surface of a carrier film, and the melting point of the film is 220 ° C. or higher, preferably 250 ° C. or higher, preferably 260 ° C. or higher. More preferred. When the melting point is lower than 220 ° C., the film is fused to the molded body by the heat of the molten resin at the time of injection molding.
上記フィルムのＪＩＳ Ｃ ２３１８における２００℃での収縮率は５％〜４０％であり、１０％〜３０％が好ましく、１５％〜２５％がより好ましい。フィルムの収縮率が５％より小さい場合、射出成形時に皺を生じ、４０％より大きい場合、成形時に波打ちを生じ外観品質が悪化する。 The shrinkage rate of the film at 200 ° C. in JIS C 2318 is 5% to 40%, preferably 10% to 30%, and more preferably 15% to 25%. When the shrinkage rate of the film is less than 5%, wrinkles are generated during injection molding, and when it is greater than 40%, waviness is generated during molding and appearance quality deteriorates.
かかる特性を有するフィルムの製造方法として、ＭＤ方向に３〜６倍延伸し、ＴＤ方向に２〜５倍延伸し、その後、熱固定処理として融点−１５０℃〜融点−７０℃の温度で熱固定するのが好ましい。 As a method for producing a film having such properties, the film is stretched 3 to 6 times in the MD direction and 2 to 5 times in the TD direction, and then heat-set at a temperature of melting point −150 ° C. to melting point −70 ° C. as heat setting treatment. It is preferable to do this.
フィルムの厚みは０．１ｍｍ〜２ｍｍであり、０．１ｍｍ〜０．４ｍｍが好ましく、０．１ｍｍ〜０．３ｍｍがより好ましい。フィルムの厚みが０．１ｍｍより薄い場合、腰が足りず成形時に皺になり、２ｍｍより厚い場合は形状追随性が損なわれる。 The thickness of the film is 0.1 mm to 2 mm, preferably 0.1 mm to 0.4 mm, and more preferably 0.1 mm to 0.3 mm. When the thickness of the film is less than 0.1 mm, the waist is not sufficient, and when forming, it becomes wrinkle at the time of molding.
フィルムの表面における機能層の代表的なものとしては耐擦傷性を有するハードコート層、図柄等が形成された印刷層などが挙げられる。このなかでもハードコート層を有するフィルムが好適に用いられる。 Typical examples of the functional layer on the surface of the film include a hard coat layer having scratch resistance, a printed layer on which a pattern and the like are formed. Among these, a film having a hard coat layer is preferably used.
さらに、表面に機能層を有するフィルムとして、フィルムの最表面に、ＪＩＳ Ｋ７１２０に準拠した熱重量測定（ＴＧＡ）において２８０℃における重量減少率が１０％以下である熱硬化性接着層を有するフィルムが好ましく用いられる。このフィルムを用いることにより成形時の樹脂温度を上げなけばならない大型で複雑な形状の成形体においても安定的に良好な接着性を得られる。なお、２８０℃における重量減少率が１０％以下の熱硬化性接着層としては、例えばブチラール系接着層、エポキシ系接着層、メラミン系接着層などが挙げられ、そのなかでもブチラール系接着層が好ましい。 Furthermore, as a film having a functional layer on the surface, a film having a thermosetting adhesive layer having a weight reduction rate at 280 ° C. of 10% or less in thermogravimetry (TGA) based on JIS K7120 is provided on the outermost surface of the film. Preferably used. By using this film, good adhesiveness can be stably obtained even in a large and complicated molded body in which the resin temperature during molding must be increased. Examples of the thermosetting adhesive layer having a weight reduction rate of 10% or less at 280 ° C. include a butyral adhesive layer, an epoxy adhesive layer, a melamine adhesive layer, etc. Among them, a butyral adhesive layer is preferable. .
＜熱可塑性樹脂＞
本発明の樹脂成形体を構成する熱可塑性樹脂は、各種の重合体または共重合体、およびこれらに各種の添加剤を配合した樹脂組成物を含む。
<Thermoplastic resin>
The thermoplastic resin constituting the resin molded body of the present invention includes various polymers or copolymers, and resin compositions in which various additives are blended.
熱可塑性樹脂としては、ポリスチレン樹脂、ＡＢＳ樹脂、ＡＥＳ樹脂、ＡＳ樹脂、メタクリル樹脂、ポリカーボネート樹脂、環状ポリオレフィン樹脂、変性ＰＰＥ樹脂、ポリスルホン樹脂、ポリエーテルスルホン樹脂、ポリアリレート樹脂、およびポリエーテルイミド樹脂などが例示される。これらの中でもポリカーボネート樹脂が最も好ましい。 Examples of the thermoplastic resin include polystyrene resin, ABS resin, AES resin, AS resin, methacrylic resin, polycarbonate resin, cyclic polyolefin resin, modified PPE resin, polysulfone resin, polyethersulfone resin, polyarylate resin, and polyetherimide resin. Is exemplified. Of these, polycarbonate resins are most preferred.
かかるポリカーボネート樹脂は、通常使用されるビスフェノールＡ型ポリカーボネート以外にも、他の二価フェノールを用いて重合された、高耐熱性または低吸水率の各種のポリカーボネート樹脂であってもよい。ポリカーボネート樹脂はいかなる製造方法によって製造されたものでもよく、界面重縮合の場合は通常一価フェノール類の末端停止剤が使用される。ポリカーボネート樹脂はまた３官能フェノール類を重合させた分岐ポリカーボネート樹脂であってもよく、更に脂肪族ジカルボン酸や芳香族ジカルボン酸、または二価の脂肪族または脂環族アルコールを共重合させた共重合ポリカーボネートであってもよい。ポリカーボネート樹脂の粘度平均分子量は、好ましくは１．３×１０４〜４．０×１０４、より好ましくは１．５×１０４〜３．０×１０４、更に好ましくは２．０×１０４〜２．８×１０４である。芳香族ポリカーボネート樹脂の粘度平均分子量（Ｍ）は塩化メチレン１００ｍｌにポリカーボネート樹脂０．７ｇを溶解した溶液から２０℃で求めた比粘度（ηｓｐ）を次式に挿入して求めたものである。
ηｓｐ／ｃ＝［η］＋０．４５×［η］２ｃ（但し［η］は極限粘度）
［η］＝１．２３×１０−４Ｍ０．８３
ｃ＝０．７
Such a polycarbonate resin may be various polycarbonate resins having a high heat resistance or a low water absorption, which are polymerized using other dihydric phenols, in addition to the commonly used bisphenol A type polycarbonate. The polycarbonate resin may be produced by any production method, and in the case of interfacial polycondensation, a terminal stopper of a monohydric phenol is usually used. The polycarbonate resin may also be a branched polycarbonate resin obtained by polymerizing trifunctional phenols, and further a copolymer obtained by copolymerizing an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, or a divalent aliphatic or alicyclic alcohol. Polycarbonate may be used. The viscosity average molecular weight of the polycarbonate resin is preferably 1.3 × 10 4 to 4.0 × 10 4 , more preferably 1.5 × 10 4 to 3.0 × 10 4 , and even more preferably 2.0 × 10 4. ˜2.8 × 10 4 . The viscosity average molecular weight (M) of the aromatic polycarbonate resin is obtained by inserting the specific viscosity (ηsp) obtained at 20 ° C. from a solution of 0.7 g of the polycarbonate resin in 100 ml of methylene chloride into the following equation.
ηsp / c = [η] + 0.45 × [η] 2 c (where [η] is the intrinsic viscosity)
[Η] = 1.23 × 10 −4 M 0.83
c = 0.7
他の二価フェノールを用いて重合された、高耐熱性または低吸水率の各種のポリカーボネート樹脂の具体例としては、下記のものが好適に例示される。
（１）該ポリカーボネートを構成する二価フェノール成分１００モル％中、４，４’−（ｍ−フェニレンジイソプロピリデン）ジフェノール（以下“ＢＰＭ”と略称）成分が２０〜８０モル％（より好適には４０〜７５モル％、さらに好適には４５〜６５モル％）であり、かつ９，９−ビス（４−ヒドロキシ−３−メチルフェニル）フルオレン（以下“ＢＣＦ”と略称）成分が２０〜８０モル％（より好適には２５〜６０モル％、さらに好適には３５〜５５モル％）である共重合ポリカーボネート。
（２）該ポリカーボネートを構成する二価フェノール成分１００モル％中、ビスフェノールＡ成分が１０〜９５モル％（より好適には５０〜９０モル％、さらに好適には６０〜８５モル％）であり、かつＢＣＦ成分が５〜９０モル％（より好適には１０〜５０モル％、さらに好適には１５〜４０モル％）である共重合ポリカーボネート。
（３）該ポリカーボネートを構成する二価フェノール成分１００モル％中、ＢＰＭ成分が２０〜８０モル％（より好適には４０〜７５モル％、さらに好適には４５〜６５モル％）であり、かつ１，１−ビス（４−ヒドロキシフェニル）−３，３，５−トリメチルシクロヘキサン成分が２０〜８０モル％（より好適には２５〜６０モル％、さらに好適には３５〜５５モル％）である共重合ポリカーボネート。
As specific examples of various polycarbonate resins polymerized using other dihydric phenols and having high heat resistance or low water absorption, the following can be suitably exemplified.
(1) In 100 mol% of the dihydric phenol component constituting the polycarbonate, 4,4 '-(m-phenylenediisopropylidene) diphenol (hereinafter abbreviated as "BPM") component is 20 to 80 mol% (more preferable) 40 to 75 mol%, more preferably 45 to 65 mol%), and 9,9-bis (4-hydroxy-3-methylphenyl) fluorene (hereinafter abbreviated as "BCF") component is 20 to 20 mol. Copolycarbonate which is 80 mol% (more preferably 25 to 60 mol%, more preferably 35 to 55 mol%).
(2) In 100 mol% of the dihydric phenol component constituting the polycarbonate, the bisphenol A component is 10 to 95 mol% (more preferably 50 to 90 mol%, more preferably 60 to 85 mol%), And a BCF component in an amount of 5 to 90 mol% (more preferably 10 to 50 mol%, and still more preferably 15 to 40 mol%).
(3) In 100 mol% of the dihydric phenol component constituting the polycarbonate, the BPM component is 20 to 80 mol% (more preferably 40 to 75 mol%, more preferably 45 to 65 mol%), and The 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane component is 20 to 80 mol% (more preferably 25 to 60 mol%, more preferably 35 to 55 mol%). Copolycarbonate.
これらの特殊なポリカーボネートは、単独で用いてもよく、２種以上を適宜混合して使用してもよい。また、これらを汎用されているビスフェノールＡ型のポリカーボネートと混合して使用することもできる。
これらの特殊なポリカーボネートの製法及び特性については、例えば、特開平６−１７２５０８号公報、特開平８−２７３７０号公報、特開２００１−５５４３５号公報及び特開２００２−１１７５８０号公報等に詳しく記載されている。
These special polycarbonates may be used alone or in combination of two or more. Moreover, these can also be mixed and used for the bisphenol A type polycarbonate generally used.
The production method and characteristics of these special polycarbonates are described in detail in, for example, JP-A-6-172508, JP-A-8-27370, JP-A-2001-55435, and JP-A-2002-117580. ing.
上記の熱可塑性樹脂は、上記の透明性を損なわない範囲において、従来公知の各種の添加剤を含有することができる。かかる添加剤としては、例えば、熱安定剤、酸化防止剤、紫外線吸収剤、光安定剤、着色剤、離型剤、摺動剤、赤外線吸収剤、光拡散剤、蛍光増白剤、帯電防止剤、難燃剤、難燃助剤、可塑剤、強化充填材、衝撃改質剤、光触媒系防汚剤、およびフォトクロミック剤等が例示される。尚、熱安定剤、酸化防止剤、紫外線吸収剤、光安定剤、着色剤、および離型剤などは、従来上記の熱可塑性樹脂における公知の適正量を配合できる。かかる量が樹脂の透明性を阻害することが稀であるからである。 Said thermoplastic resin can contain conventionally well-known various additives in the range which does not impair said transparency. Examples of such additives include heat stabilizers, antioxidants, ultraviolet absorbers, light stabilizers, colorants, mold release agents, sliding agents, infrared absorbers, light diffusing agents, fluorescent whitening agents, and antistatic agents. Examples include agents, flame retardants, flame retardant aids, plasticizers, reinforcing fillers, impact modifiers, photocatalytic antifouling agents, and photochromic agents. The heat stabilizer, the antioxidant, the ultraviolet absorber, the light stabilizer, the colorant, the release agent, and the like can be blended with known appropriate amounts in the above thermoplastic resins. This is because such an amount rarely inhibits the transparency of the resin.
また樹脂材料は、通常必要な添加剤を原料樹脂と溶融混練したペレットの形状で、射出成形機に供給される。かかる供給時は水分含有量を十分に低減されることが必要である。ポリカーボネート樹脂の如き水分吸収性の高い熱可塑性樹脂は、十分に乾燥され射出成形機に供給されることが必要である。溶融混練は、従来公知の溶融混練機が利用でき、特にベント式二軸押出機が好適である。また押出中に生じた異物を除去するためのスクリーンを押出機ダイス部前のゾーンに設置することが好ましい。ペレット化に際して外部の埃などの影響を低減する必要がある場合には、押出機周囲の雰囲気を清浄化することが好ましい。更にペレットの製造場所から、射出成形機への製造場所への運搬には、従来光情報記録媒体の基板製造用ペレットに利用される、各種の防塵コンテナが利用できる。 The resin material is usually supplied to an injection molding machine in the form of pellets obtained by melt-kneading necessary additives with a raw material resin. At the time of such supply, it is necessary to sufficiently reduce the water content. A thermoplastic resin having a high moisture absorption such as a polycarbonate resin needs to be sufficiently dried and supplied to an injection molding machine. For melt kneading, a conventionally known melt kneader can be used, and a vent type twin screw extruder is particularly suitable. Moreover, it is preferable to install a screen for removing foreign substances generated during extrusion in the zone in front of the extruder die. When it is necessary to reduce the influence of external dust during pelletization, it is preferable to clean the atmosphere around the extruder. Furthermore, various dustproof containers that have been conventionally used for pellets for manufacturing substrates of optical information recording media can be used for transportation from the pellet manufacturing location to the manufacturing location for the injection molding machine.
＜樹脂成形体＞
本発明の製造方法で製造される樹脂成形体の厚みは２ｍｍ〜３０ｍｍの範囲が好ましく、３ｍｍ〜３０ｍｍがより好ましく、５〜３０ｍｍがさらに好ましく、８〜３０ｍｍが最も好ましい。厚みが２ｍｍより薄い場合、射出成形時に樹脂の剪断によってフィルムが変形してしまう場合がある。また、厚みが３０ｍｍより厚い場合、射出成形時のフィルムへの熱負荷が大きくなりフィルムが融着する可能性が高くなる。
<Resin molding>
The thickness of the resin molded body produced by the production method of the present invention is preferably in the range of 2 mm to 30 mm, more preferably 3 mm to 30 mm, further preferably 5 to 30 mm, and most preferably 8 to 30 mm. If the thickness is less than 2 mm, the film may be deformed by shearing of the resin during injection molding. On the other hand, if the thickness is greater than 30 mm, the thermal load on the film during injection molding increases, and the possibility that the film will be fused increases.
上記樹脂成形体は機能層を付与される表面において、絞り形状を有する樹脂成形体であることが好ましい。絞り形状においては、その絞り比が０．０７以上であり、かつその面積が３，０００ｍｍ２以上が好ましく、絞り比が０．０７以上であり、かつその面積が３０，０００ｍｍ２以上がより好ましく、絞り比が０．１２以上であり、かつその面積が３０，０００ｍｍ２以上が最も好ましい。絞り比が０．０７より小さい場合、或いはその面積が３，０００ｍｍ２より小さい場合は従来の技術でも成形可能である。なお、絞り比とは機能層付与部における「凹凸の高さ／投影面積と等価な円の直径」で表される。 The resin molded body is preferably a resin molded body having a drawn shape on the surface to which the functional layer is applied. In the aperture shape, the aperture ratio is 0.07 or more, and the area is preferably 3,000 mm 2 or more, the aperture ratio is 0.07 or more, and the area is more preferably 30,000 mm 2 or more. The aperture ratio is 0.12 or more, and the area is most preferably 30,000 mm 2 or more. When the drawing ratio is smaller than 0.07, or when the area is smaller than 3,000 mm 2 , it can be molded by the conventional technique. The aperture ratio is represented by “the height of the unevenness / the diameter of the circle equivalent to the projected area” in the functional layer applying portion.
＜樹脂成形体の製造方法＞
本発明の製造方法は以下の工程を含む製造方法である。なお、射出成形方法としては一般的な単色成形でも良いし、意匠や機能を向上させるために２色成形、金型を急速に加熱冷却するヒートアンドクール成形、電気加熱成形または電磁誘導加熱成形を用いても良い。
<Production method of resin molding>
The manufacturing method of the present invention is a manufacturing method including the following steps. The injection molding method may be a general single color molding, two-color molding to improve the design and function, heat and cool molding that rapidly heats and cools the mold, electric heating molding or electromagnetic induction heating molding. It may be used.
（工程−１）
工程−１は融点が２２０℃以上であり、かつＪＩＳ Ｃ ２３１８における２００℃での収縮率が５％〜４０％である表面に機能層を有するフィルムを、一方の金型と他方の金型との間に配置し、該金型を型締めして成形キャビティを形成した後、該キャビティ内に熱可塑性樹脂を射出する工程である。
ここで、本発明でいうところの成形キャビティとは、可動側金型と固定側金型との型締めにより形成した成形用空間のことを指す。
(Step-1)
In Step-1, a film having a functional layer on the surface having a melting point of 220 ° C. or higher and a shrinkage rate at 200 ° C. of JIS C 2318 of 5% to 40%, one mold and the other mold The mold is clamped to form a molding cavity, and then a thermoplastic resin is injected into the cavity.
Here, the molding cavity referred to in the present invention refers to a molding space formed by clamping a movable mold and a fixed mold.
本発明において溶融樹脂は、表面に機能層を有するフィルムを一方の金型と他方の金型との間に配置した後に予め圧縮ストローク分だけ余分に開いた金型キャビティ内に射出充填されることが好ましい。この射出圧縮成形においては、圧縮ストロークと樹脂板の厚みとの合計量は、目的とする樹脂板の厚みに対して、好ましくは１．０１〜３倍の範囲、より好ましくは１．０５〜２倍の範囲、更に好ましくは１．１〜１．８倍の範囲である。 In the present invention, the molten resin is injected and filled into a mold cavity that is opened in advance by an amount corresponding to a compression stroke after a film having a functional layer on the surface is disposed between one mold and the other mold. Is preferred. In this injection compression molding, the total amount of the compression stroke and the thickness of the resin plate is preferably in the range of 1.01 to 3 times, more preferably 1.05 to 2 with respect to the target thickness of the resin plate. The range is double, more preferably 1.1 to 1.8 times.
金型同士が中間型締め状態に型締めされた金型キャビティ内へ溶融した熱可塑性樹脂を射出した後に最終型締めを行う。この最終型締めは閉鎖されたキャビティ中で行うことも、一部開放されたキャビティ中で行うこともできる。閉鎖されたキャビティとは、樹脂の流動する余地のない閉ざされた状態のキャビティをいう。かかるキャビティは、ホットランナのバルブの閉鎖、および完全なゲートシールにより達成される。更にシリンダー側から付加する樹脂圧力と圧縮圧力との平衡が維持された状態が含まれる。一方、一部開放されたキャビティとは、樹脂の流動する余地がある開放されたキャビティをいう。例えば、オープンノズルで樹脂が大きくフローバックされる場合や、捨てキャビが設けられて樹脂が圧縮によって流入する場合などがある。成形体の品質を安定化させるためより好ましいのは閉鎖されたキャビティにおいて圧縮を行う方法である。 Final mold clamping is performed after injecting molten thermoplastic resin into a mold cavity clamped in an intermediate mold clamped state. This final clamping can be done in a closed cavity or in a partially open cavity. A closed cavity refers to a closed cavity with no room for resin flow. Such cavities are achieved by hot runner valve closure and complete gate sealing. Furthermore, the state where the balance between the resin pressure applied from the cylinder side and the compression pressure is maintained is included. On the other hand, a partially opened cavity refers to an opened cavity with room for resin to flow. For example, there is a case where the resin is largely flowed back with an open nozzle, or a case where a waste mold is provided and the resin flows in by compression. In order to stabilize the quality of the molded body, a method in which compression is performed in a closed cavity is more preferable.
最終型締め工程において、可動側金型パーティング面と固定側金型のそれとは接触（以下、“型面タッチ”と称する場合がある）しないことが好ましい。型面タッチがある場合、所定の圧力が樹脂に十分に伝わることがなくなり、寸法精度に優れた低歪みの成形体は得難くなる。可動側金型のパーティング面と固定側金型のそれとの距離は、好ましくは０．０５〜３ｍｍの範囲、より好ましくは１〜２ｍｍの範囲である。３ｍｍを超える設定とした場合には成形体の形状によっては可動側金型の倒れが生じ製品にバラツキが生じやすくなる。また０．０５ｍｍ未満の場合には十分な制御が困難となり、連続の成形において型面タッチが生ずる場合がある。 In the final mold clamping step, it is preferable that the movable mold parting surface and the fixed mold are not in contact with each other (hereinafter sometimes referred to as “mold surface touch”). When there is a mold surface touch, the predetermined pressure is not sufficiently transmitted to the resin, and it becomes difficult to obtain a low-distortion molded body having excellent dimensional accuracy. The distance between the parting surface of the movable mold and that of the fixed mold is preferably in the range of 0.05 to 3 mm, more preferably in the range of 1 to 2 mm. If the setting exceeds 3 mm, depending on the shape of the molded body, the movable side mold may fall down, and the product tends to vary. If the thickness is less than 0.05 mm, sufficient control becomes difficult, and a mold surface touch may occur in continuous molding.
フィルムの配置方法としては金型の上方或いは下方に配置されたフィルムロールを他方に巻き取り送る方法や、枚葉にカットされたフィルムをロボットアームなどにより金型内に配置する方法などがある。 As a method for arranging the film, there are a method in which a film roll arranged above or below the mold is wound up to the other, a method in which a film cut into a sheet is arranged in the mold by a robot arm or the like.
（工程−２）
工程−２は成形体よりフィルムを剥がす工程である。成形体よりフィルムを剥がす方法としては、枚葉にカットされたフィルムを使用する場合は手作業にて引き剥がす方法、フィルムロールを使用する場合は、取り出し機やロボットアームにて引き剥がす方法、およびフィルムを配置した金型の他方の金型に若干のアンダーカット部を設ることにより型開き時に引き剥がす方法などが挙げられる。
(Step-2)
Step-2 is a step of peeling the film from the molded body. As a method of peeling the film from the molded body, when using a film cut into sheets, a method of peeling manually, a method of peeling with a take-out machine or a robot arm when using a film roll, and For example, there may be mentioned a method in which a slight undercut portion is provided on the other mold of the mold on which the film is disposed to peel it off when the mold is opened.
本発明の方法を用いて製造された樹脂成形体は大型で厚肉で３次元形状を有する形状でも良好な外観を有する。したがって、上述のとおり、これらの特性が求められる車両、船舶および航空機などの輸送機器の樹脂製窓（車輌屋根を含む）（例えばサンルーフやクオータ窓等に代表される光透過性を有する部材）、並びに液晶ディスプレイ保護材に代表される画像を透視する用途、特にパチンコやピンボールに代表される遊技具における遊技盤（例えば、前面盤や遊戯盤等に代表される光透過性を有する部材）に代表される幅広い工業分野において有用である。よってその奏する工業的効果は格別のものである。 The resin molded body produced using the method of the present invention has a good appearance even in a large, thick and three-dimensional shape. Therefore, as described above, resin windows (including vehicle roofs) of transportation equipment such as vehicles, ships, and aircraft that require these characteristics (for example, members having light transmissivity typified by sunroofs and quarter windows), In addition, for use in seeing through an image typified by a liquid crystal display protective material, especially for a game board (for example, a light-transmitting member typified by a front board or a game board) in a game machine typified by a pachinko or pinball. It is useful in a wide range of industrial fields represented. Therefore, the industrial effect produced is exceptional.
用いた金型及び成形体の形状を図に示す。なお、図は成形金型の概要を模式的に示しており、ゲート、エジェクタピン等の詳細構造は図示を省略してある。
本発明者らが現在最良と考える本発明の形態は、前記の各要件の好ましい範囲を集約したものとなるが、例えば、その代表例を下記の実施例中に記載する。もちろん本発明はこれらの形態に限定されるものではない。 The form of the present invention considered to be the best by the present inventors is a collection of the preferable ranges of the above requirements. For example, typical examples are described in the following examples. Of course, the present invention is not limited to these forms.
以下に実施例を挙げて本発明をさらに具体的に説明する。なお、熱可塑性樹脂及び、表面に機能層を有するフィルムとしては以下のものを用いた。 The present invention will be described more specifically with reference to the following examples. In addition, the following were used as a thermoplastic resin and the film which has a functional layer on the surface.
（Ｉ）熱可塑性樹脂
Ａ−１：ポリカーボネート樹脂［帝人化成（株）製パンライトＬ−１２２５Ｙ（商品名）］
Ａ−２：ＡＢＳ樹脂［東レ（株）製９２０−５５５（商品名）］
Ａ−３：ＰＭＭＡ樹脂［三菱レイヨン（株）製ＶＨ−００１（商品名）］
(I) Thermoplastic resin A-1: Polycarbonate resin [Panlite L-1225Y (trade name) manufactured by Teijin Chemicals Ltd.]
A-2: ABS resin [920-555 (trade name) manufactured by Toray Industries, Inc.]
A-3: PMMA resin [VH-001 (trade name) manufactured by Mitsubishi Rayon Co., Ltd.]
（ＩＩ）表面に機能層を有するフィルム
Ｂ−１：フィルム厚み０．１ｍｍのポリエチレンナフタレート（ＰＥＮ）フィルムをキャリアフィルムとし、その表面に剥離層と、機能層としてハードコート層、最表面にブチラール系の熱硬化性接着層を積層したフィルム（融点２６９℃、２００℃における収縮率２０％）［尾池工業（株）製］
Ｂ−２：２００℃における収縮率が５％である以外はＢ−１と同様のフィルム
Ｂ−３：フィルム厚み０．１ｍｍのポリエチレンテレフタレート（ＰＥＴ）フィルムをキャリアフィルムとし、その表面に剥離層と、機能層としてハードコート層、最表面にブチラール系の熱硬化性接着層を積層したフィルム（融点２５８℃、２００℃における収縮率２０％）
Ｂ−４：フィルム厚み０．１ｍｍのポリカーボネート（ＰＣ）フィルムをキャリアフィルムとし、その表面に剥離層と、機能層としてハードコート層、最表面にブチラール系の熱硬化性接着層を積層したフィルム（融点２４０℃、２００℃における収縮率２０％）
Ｂ−５：２００℃における収縮率が３５％である以外はＢ−１と同様のフィルム
Ｂ−６：キャリアフィルムの厚みが１．７ｍｍである以外はＢ−１と同様のフィルム
Ｂ−７：キャリアフィルムの厚みが０．０５ｍｍである以外はＢ−１と同様のフィルム
Ｂ−８：２００℃における収縮率が１％である以外はＢ−１と同様のフィルム
Ｂ−９： フィルム厚み０．１ｍｍのポリメチルメタクリレート（ＰＭＭＡ）フィルムをキャリアフィルムとし、その表面に剥離層と、機能層としてハードコート層、最表面にブチラール系の熱硬化性接着層を積層したフィルム（融点１８０℃、２００℃における収縮率２０％）
Ｂ−１０：接着層がアクリルアミド系の熱可塑性接着層である以外はＢ−１と同様のフィルム
Ｂ−１１：キャリアフィルムの厚みが２．３ｍｍである以外はＢ−１と同様のフィルム
Ｂ−１２：２００℃における収縮率が４５％である以外はＢ−１と同様のフィルム
(II) Film B-1 having a functional layer on the surface: A polyethylene naphthalate (PEN) film having a film thickness of 0.1 mm is used as a carrier film, a release layer on the surface, a hard coat layer as a functional layer, and a butyral on the outermost surface Film with laminated thermosetting adhesive layer (melting point 269 ° C., shrinkage 20% at 200 ° C.) [manufactured by Oike Industry Co., Ltd.]
B-2: A film similar to B-1 except that the shrinkage at 200 ° C. is 5%. B-3: A polyethylene terephthalate (PET) film having a film thickness of 0.1 mm is used as a carrier film, and a release layer is formed on the surface. A film with a hard coat layer as a functional layer and a butyral thermosetting adhesive layer laminated on the outermost surface (melting point: 258 ° C., shrinkage at 200 ° C .: 20%)
B-4: A film in which a polycarbonate (PC) film having a film thickness of 0.1 mm is used as a carrier film, a release layer on the surface, a hard coat layer as a functional layer, and a butyral thermosetting adhesive layer on the outermost surface ( Melting point 240 ° C, shrinkage 20% at 200 ° C)
B-5: Film B-6 similar to B-1 except that the shrinkage at 200 ° C. is 35% B-6: Film B-7 similar to B-1 except that the thickness of the carrier film is 1.7 mm: Film B-8 similar to B-1 except that the thickness of the carrier film is 0.05 mm: Film B-9 similar to B-1 except that the shrinkage at 200 ° C. is 1%: Film thickness 0. 1 mm polymethyl methacrylate (PMMA) film as a carrier film, a release layer on its surface, a hard coat layer as a functional layer, and a butyral thermosetting adhesive layer on the outermost surface (melting point 180 ° C., 200 ° C. 20% shrinkage)
B-10: Film B-11 similar to B-1 except that the adhesive layer is an acrylamide thermoplastic adhesive layer B-11: Film B- similar to B-1 except that the thickness of the carrier film is 2.3 mm 12: Film similar to B-1 except that the shrinkage at 200 ° C is 45%
（ＩＩＩ）評価項目
（ＩＩＩ−１）外観
成形体の外観を観察し、下記の通り評価を実施した。
○：外観不良が認められなかった。
×：シボ状の外観不良を生じた。
（ＩＩＩ−２）形状
フィルムがついた成形体の形状を観察し、下記の通り評価を実施した。
○：フィルムが金型に密着し隙間を生じず、所望の形状の成形体が得られた。
×：金型とフィルムの間に隙間を生じ、所望の形状の成形体を得られなかった。
（ＩＩＩ−３）鉛筆硬度
ＪＩＳ Ｋ ５６００−５−４に示される鉛筆硬度の評価を実施した。
（ＩＩＩ−４）シワ
成形体シワの有無を観察し、下記の通り評価を実施した。
１：無数のシワが有る。
２：数本のシワが有る。
３：シワは無いが若干凹状
４：シワが無く良好
（ＩＩＩ−５）機能層の剥離
成形体をＳＥＭにて観察し、機能層の剥離の有無について下記の通り評価を実施した。
○：機能層の剥離は認められなかった。
×：機能層の剥離が認められた。
（ＩＩＩ−６）フィルムの成形体への融着
成形体をＳＥＭにて観察し、キャリアフィルムの融着の有無について下記の通り評価を実施した。また、ＦＴ−ＩＲを用いてフィルムの劣化状態を確認した。
１：フィルムが成形体に融着し剥がせない
２：フィルムが成形体に融着し剥がし難い
３：融着は無いが若干フィルムの劣化有り
４：融着が無く良好
(III) Evaluation item (III-1) Appearance The appearance of the molded body was observed and evaluated as follows.
○: No appearance defect was observed.
X: A grain-like appearance defect occurred.
(III-2) The shape of the molded body with the shape film was observed and evaluated as follows.
A: The film was in close contact with the mold and no gap was formed, and a molded article having a desired shape was obtained.
X: A gap was formed between the mold and the film, and a molded article having a desired shape could not be obtained.
(III-3) Pencil hardness Evaluation of the pencil hardness shown by JISK5600-5-4 was implemented.
(III-4) The presence or absence of wrinkled compacts was observed and evaluated as follows.
1: There are countless wrinkles.
2: There are several wrinkles.
3: No wrinkles but slightly concave 4: Good without wrinkles (III-5) Peeling of functional layer The molded body was observed with SEM, and the presence or absence of peeling of the functional layer was evaluated as follows.
○: No peeling of the functional layer was observed.
X: Peeling of the functional layer was recognized.
(III-6) Fusion of Film to Molded Body The molded body was observed with an SEM, and the presence or absence of fusion of the carrier film was evaluated as follows. Moreover, the deterioration state of the film was confirmed using FT-IR.
1: The film is fused to the molded body and cannot be peeled away 2: The film is fused to the molded body and is difficult to peel away 3: There is no fusion but there is some deterioration of the film 4: Good without fusion
［実施例１］
以下の工程に従い、表面に機能層を有する樹脂成形体を作製した。
ポリカーボネート樹脂（Ａ−１）のペレットを１２０℃にて５時間熱風乾燥機で乾燥した後、成形機としてシリンダ径５０ｍｍφ、型締め力２，１５０ｋＮの住友重機製ＵＬＴＲＡＩＶ射出成形機及び図１の金型を使用し、フィルム（Ｂ−１）を用いて射出成形を行った。成形はシリンダ温度２９０℃、ホットランナ設定温度２９０℃、金型温度は固定側、可動側ともに１００℃、および冷却時間３０秒で行った。フィルムは、枚葉にしたフィルムを用い、固定側或いは可動側のパーティング面に両面テープを用いて貼り付けて配置した。また、成形体よりのフィルムの剥ぎ取りは手作業にて実施した。
成形体は図１に示すとおり、機能層を付与される表面の絞り比が０．１２、面積が３１，４１６ｍｍ２、長さ２００ｍｍ、幅２００ｍｍ、および厚み４ｍｍの成形体である。
[Example 1]
A resin molded body having a functional layer on the surface was produced according to the following steps.
After drying the polycarbonate resin (A-1) pellets with a hot air dryer at 120 ° C. for 5 hours, as a molding machine, a ULTRAIV injection molding machine manufactured by Sumitomo Heavy Industries with a cylinder diameter of 50 mmφ and a clamping force of 2,150 kN and the gold shown in FIG. The mold was used and injection molding was performed using the film (B-1). Molding was performed at a cylinder temperature of 290 ° C., a hot runner set temperature of 290 ° C., a mold temperature of 100 ° C. on both the fixed side and the movable side, and a cooling time of 30 seconds. As the film, a single film was used, and the film was affixed to a fixed or movable parting surface using a double-sided tape. Moreover, the film was peeled off from the molded body manually.
As shown in FIG. 1, the molded body is a molded body having a surface drawing ratio of 0.12, an area of 31,416 mm 2 , a length of 200 mm, a width of 200 mm, and a thickness of 4 mm.
［実施例２］
使用するフィルムをフィルム（Ｂ−２）とした以外は、実施例１と同様にして成形を実施した。
[Example 2]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-2).
［実施例３］
使用するフィルムをフィルム（Ｂ−３）とした以外は、実施例１と同様にして成形を実施した。
[Example 3]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-3).
［実施例４］
使用するフィルムをフィルム（Ｂ−４）とした以外は、実施例１と同様にして成形を実施した。
[Example 4]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-4).
［実施例５］
使用するフィルムをフィルム（Ｂ−５）とした以外は、実施例１と同様にして成形を実施した。
[Example 5]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-5).
［実施例６］
使用樹脂をＡＢＳ樹脂（Ａ−２）とし、シリンダ温度２５０℃、ホットランナ温度２５０℃、金型温度は固定側可動側ともに６０℃とした以外は、実施例１と同様にして成形を実施した。
[Example 6]
Molding was performed in the same manner as in Example 1 except that the resin used was ABS resin (A-2), the cylinder temperature was 250 ° C, the hot runner temperature was 250 ° C, and the mold temperature was 60 ° C on both the fixed and movable sides. .
［実施例７］
使用樹脂をＰＭＭＡ樹脂（Ａ−３）とし、シリンダ温度２５０℃、ホットランナ温度２５０℃、金型温度は固定側可動側ともに６０℃とした以外は、実施例１と同様にして成形を実施した。
[Example 7]
Molding was performed in the same manner as in Example 1 except that the resin used was PMMA resin (A-3), the cylinder temperature was 250 ° C., the hot runner temperature was 250 ° C., and the mold temperature was 60 ° C. on both the fixed and movable sides. .
［実施例８］
使用するフィルムをフィルム（Ｂ−６）とした以外は、実施例１と同様にして成形を実施した。
[Example 8]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-6).
［実施例９］
以下の工程に従い、表面に機能層を有する樹脂成形体を作製した。
ポリカーボネート樹脂（Ａ−１）のペレットを１２０℃にて５時間熱風乾燥機で乾燥した後、成形機としてシリンダ径１１０ｍｍφ、型締め力１５，７００ｋＮの名機製作所製Ｍ１６００ＮＳ−ＤＭ射出成形機及び図２の金型を使用し、フィルム（Ｂ−１）を用いて射出圧縮成形を行った。該成形機は、特開２００３−０４８２４１号公報の実施例に記載されたものと同じ平行度矯正機構を有するものである。金型取り付け板の四隅に配置された平行度矯正機構の各機構の保持圧力を調整することにより、金型の平行度をｔａｎθが０．００００５以下となるよう調整した。成形は中間型締め位置から最終型締め位置までのストロークであるプレスストローク２ｍｍ、および圧縮加圧時間３０秒で行った。フィルムは、ロール状にしたフィルムを用い、箔送り装置を用いて固定側のパーティング面に配置した。また、キャリアフィルムは取り出し機にて引き剥がした。
成形体は図２に示すとおり、機能層を付与される表面絞り比が０．１２、面積が７０，６８６ｍｍ２、長さ３００ｍｍ、幅３００ｍｍ、厚み４ｍｍの成形体である。
[Example 9]
A resin molded body having a functional layer on the surface was produced according to the following steps.
After the polycarbonate resin (A-1) pellets were dried with a hot air dryer at 120 ° C. for 5 hours, the molding machine was a M1600NS-DM injection molding machine manufactured by Meiko Seisakusho with a cylinder diameter of 110 mmφ and a clamping force of 15,700 kN. The mold of No. 2 was used, and injection compression molding was performed using the film (B-1). The molding machine has the same parallelism correcting mechanism as that described in the examples of JP-A-2003-084241. By adjusting the holding pressure of each mechanism of the parallelism correcting mechanism disposed at the four corners of the mold mounting plate, the parallelism of the mold was adjusted so that tan θ was 0.00005 or less. Molding was performed with a press stroke of 2 mm, which is a stroke from the intermediate clamping position to the final clamping position, and a compression and pressing time of 30 seconds. The film was a roll-shaped film, and was placed on the fixed parting surface using a foil feeder. Further, the carrier film was peeled off by a take-out machine.
As shown in FIG. 2, the molded body is a molded body having a surface drawing ratio of 0.12, an area of 70,686 mm 2 , a length of 300 mm, a width of 300 mm, and a thickness of 4 mm to which a functional layer is applied.
［実施例１０］
成形体の厚みを３０ｍｍとし、圧縮加圧時間を９００秒とした以外は、実施例９と同様にして成形を実施した。
[Example 10]
Molding was performed in the same manner as in Example 9 except that the thickness of the molded body was 30 mm and the compression and pressing time was 900 seconds.
［実施例１１］
使用するフィルムをフィルム（Ｂ−１０）とした以外は、実施例９と同様にして成形を実施した。
[Example 11]
Molding was performed in the same manner as in Example 9 except that the film to be used was film (B-10).
［比較例１］
フィルムを使用しないこと以外は、実施例１と同様にして成形を実施した。
[Comparative Example 1]
Molding was carried out in the same manner as in Example 1 except that no film was used.
［比較例２］
使用するフィルムをフィルム（Ｂ−７）とした以外は、実施例１と同様にして成形を実施した。
[Comparative Example 2]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-7).
［比較例３］
使用するフィルムをフィルム（Ｂ−８）とした以外は、実施例１と同様にして成形を実施した。
[Comparative Example 3]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-8).
［比較例４］
使用するフィルムをフィルム（Ｂ−９）とした以外は実施例９と同様にして成形を実施した。
[Comparative Example 4]
Molding was performed in the same manner as in Example 9 except that the film to be used was film (B-9).
［比較例５］
使用するフィルムをフィルム（Ｂ−１１）とした以外は、実施例１と同様にして成形を実施した。
[Comparative Example 5]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-11).
［比較例６］
使用するフィルムをフィルム（Ｂ−１２）とした以外は、実施例１と同様にして成形を実施した。
実施例１〜１１および比較例１〜６の評価結果を表１および表２に記載した。
[Comparative Example 6]
Molding was performed in the same manner as in Example 1 except that the film to be used was film (B-12).
The evaluation results of Examples 1 to 11 and Comparative Examples 1 to 6 are shown in Table 1 and Table 2.
１ 可動側金型
２ 額縁ブロック
３ 固定側金型（可動側金型と額縁構造となる）
４ フィルム
５ 溶融樹脂
６ 成形体本体
７ 可動側金型（固定側金型と額縁構造となる）
８ 額縁ブロック
９ 固定側金型
１０ フィルム
１１ 溶融樹脂
１２ 成形体本体
1 movable mold 2 frame block 3 fixed mold (movable mold and frame structure)
4 Film 5 Molten Resin 6 Molded Body 7 Movable side mold (Fixed side mold and frame structure)
8 Frame block 9 Fixed mold 10 Film 11 Molten resin 12 Molded body
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Cited By (7)
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|---|---|---|---|---|
| WO2013123756A1 (en) | 2012-02-24 | 2013-08-29 | Shenzhen Byd Auto R&D Company Limited | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
| US9770884B2 (en) | 2012-02-24 | 2017-09-26 | Shenzhen Byd Auto R&D Company Limited | Metal-resin composite and method for producing the same |
| US9783894B2 (en) | 2012-05-28 | 2017-10-10 | Byd Company Limited | Metal composite and method of preparing the same, metal-resin composite and method of preparing the same |
| US9802388B2 (en) | 2012-02-24 | 2017-10-31 | Shenzhen Byd Auto R&D Company Limited | Aluminum alloy resin composite and method of preparing the same |
| US9808974B2 (en) | 2012-02-24 | 2017-11-07 | Shenzhen Byd Auto R&D Company Limited | Method of preparing aluminum alloy resin composite and aluminum alloy-resin composite obtainable by the same |
| US9809895B2 (en) | 2012-02-24 | 2017-11-07 | Shenzhen Byd Auto R&D Company Limited | Method of preparing aluminum alloy resin composite and aluminum alloy-resin composite obtainable by the same |
| US9862131B2 (en) | 2012-02-24 | 2018-01-09 | Byd Company Limited | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
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| JP2008279704A (en) * | 2007-05-14 | 2008-11-20 | Mitsubishi Plastics Ind Ltd | Polyester film for molding and simultaneously transferred foil |
| JP2009226615A (en) * | 2008-03-19 | 2009-10-08 | Teijin Chem Ltd | Manufacturing method of resin molding having surface functional layer and its molding |
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Patent Citations (2)
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| JP2008279704A (en) * | 2007-05-14 | 2008-11-20 | Mitsubishi Plastics Ind Ltd | Polyester film for molding and simultaneously transferred foil |
| JP2009226615A (en) * | 2008-03-19 | 2009-10-08 | Teijin Chem Ltd | Manufacturing method of resin molding having surface functional layer and its molding |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013123756A1 (en) | 2012-02-24 | 2013-08-29 | Shenzhen Byd Auto R&D Company Limited | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
| EP2817134A4 (en) * | 2012-02-24 | 2015-10-28 | Shenzhen Byd Auto R & D Co Ltd | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
| US9770884B2 (en) | 2012-02-24 | 2017-09-26 | Shenzhen Byd Auto R&D Company Limited | Metal-resin composite and method for producing the same |
| US9802388B2 (en) | 2012-02-24 | 2017-10-31 | Shenzhen Byd Auto R&D Company Limited | Aluminum alloy resin composite and method of preparing the same |
| US9808974B2 (en) | 2012-02-24 | 2017-11-07 | Shenzhen Byd Auto R&D Company Limited | Method of preparing aluminum alloy resin composite and aluminum alloy-resin composite obtainable by the same |
| US9809895B2 (en) | 2012-02-24 | 2017-11-07 | Shenzhen Byd Auto R&D Company Limited | Method of preparing aluminum alloy resin composite and aluminum alloy-resin composite obtainable by the same |
| US9862131B2 (en) | 2012-02-24 | 2018-01-09 | Byd Company Limited | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
| US9889588B2 (en) | 2012-02-24 | 2018-02-13 | Shenzhen Byd Auto R&D Company Limited | Method for integrally molding metal and resin and metal-resin composite structure obtainable by the same |
| US9783894B2 (en) | 2012-05-28 | 2017-10-10 | Byd Company Limited | Metal composite and method of preparing the same, metal-resin composite and method of preparing the same |
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