JP2011216377A5 - - Google Patents

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Publication number
JP2011216377A5
JP2011216377A5 JP2010084645A JP2010084645A JP2011216377A5 JP 2011216377 A5 JP2011216377 A5 JP 2011216377A5 JP 2010084645 A JP2010084645 A JP 2010084645A JP 2010084645 A JP2010084645 A JP 2010084645A JP 2011216377 A5 JP2011216377 A5 JP 2011216377A5
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JP
Japan
Prior art keywords
unit
silver
image data
metal
mesh pattern
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Application number
JP2010084645A
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Japanese (ja)
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JP5398623B2 (en
JP2011216377A (en
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Publication date
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Priority claimed from JP2010084645A external-priority patent/JP5398623B2/en
Priority to JP2010084645A priority Critical patent/JP5398623B2/en
Priority to KR1020127025702A priority patent/KR101601746B1/en
Priority to PCT/JP2011/057582 priority patent/WO2011125597A1/en
Priority to US13/638,541 priority patent/US9031310B2/en
Priority to CN201180017363.0A priority patent/CN102822829B/en
Priority to KR1020167005718A priority patent/KR101622586B1/en
Publication of JP2011216377A publication Critical patent/JP2011216377A/en
Publication of JP2011216377A5 publication Critical patent/JP2011216377A5/ja
Publication of JP5398623B2 publication Critical patent/JP5398623B2/en
Application granted granted Critical
Priority to US14/665,615 priority patent/US9436089B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

すなわち、2個のチオ硫酸イオンS とゼラチン64中の銀イオン(AgBrからの銀イオン)が、チオ硫酸銀錯体を生成する。チオ硫酸銀錯体は水溶性が高いのでゼラチン64中から溶出されることになる。その結果、現像銀68が金属銀部70として定着されて残ることになる。この金属銀部70にてメッシュパターンMが構成されることになる。 That is, two thiosulfate ions S 2 O 3 and silver ions in the gelatin 64 (silver ions from AgBr) form a silver thiosulfate complex. Since the silver thiosulfate complex is highly water soluble, it will be eluted from the gelatin 64. As a result, the developed silver 68 is fixed as the metal silver portion 70 and remains. The metal silver portion 70 constitutes the mesh pattern M.

ここで、メッシュパターンM2の模様(各開口部52)が長の形状を有する根拠は以下のように推測される。例えば、図2Bに示すブラックマトリクス59の単位画素60の形状を正方形と仮定する。赤色フィルタ58r、緑色フィルタ58g、青色フィルタ58bが左右方向に配設されることで、単位画素60が1/3の領域に区画され、高空間周波数成分のノイズ粒状度が増加する。一方、上下方向には、遮光材61hの配設周期に相当する空間周波数成分のみ存在し、それ以外の空間周波数成分がないため、この配設周期の視認性を低減するようにメッシュパターンM2の模様が決定される。すなわち、左右方向に延在する各配線は、その間隔がなるべく狭くなるように、且つ、各遮光材61hの間に規則的に配置されるように決定される。 Here, the pattern of the mesh pattern M2 (the opening 52) grounds with a lateral length of the shape is presumed as follows. For example, it is assumed that the shape of the unit pixel 60 of the black matrix 59 shown in FIG. 2B is square. By disposing the red filter 58r, the green filter 58g, and the blue filter 58b in the left-right direction, the unit pixel 60 is divided into 1⁄3 regions, and the noise granularity of high spatial frequency components is increased. On the other hand, only the spatial frequency component corresponding to the arrangement period of the light shielding material 61h exists in the vertical direction, and there is no other spatial frequency component, so the mesh pattern M2 is formed to reduce the visibility of this arrangement period. The pattern is determined. That is, the wires extending in the left-right direction are determined to be regularly arranged between the light shielding members 61 h such that the distance between the wires is as narrow as possible.

10…製造装置 12…画像処理装置
14…導電性フイルム 16…光
18…露光部 20…入力部
24…記憶部 28…初期位置選択部
30…更新候補位置決定部 32…露光データ変換部
36…画像情報推定部 38…画像データ作成部
40…メッシュ模様評価部 42…データ更新指示部
50…導電部 52…開口部
54…金属細線 56…透明フイルム基材
57…フィルタ部材 59…ブラックマトリクス
60…単位画素 62…ハロゲン化銀
64…ゼラチン 66…銀塩感光層
68…現像銀 70…金属銀部
72…透光部 74…導電性金属
75…箔 76…フォトレジスト膜
78…レジストパターン 80…ペースト
82…金属めっき 84…金属薄膜
100…FFT演算部 102…評価値算出部
108…カウンタ 110…擬似温度管理部
112…更新確率算出部 114…位置更新判定部
116…出力用画像データ決定部 120、160…設定画面
122、126…プルダウンメニュー 124、128…表示欄
130、132、134、136、138、140、142、164、166、168、170、172、174…テキストボックス
144、146、178、180、182…ボタン
176…マトリクス状の画像 200…二次元画像領域
Img、ImgInit、ImgTemp…画像データ
ImgInit’ 、ImgTemp’…重畳画像データ
ImgOut…出力用画像データ
M…メッシュパターン SD…シード点
SDd、SDNd、SDSd、SPd…位置データ
SDN…第1シード点 SDS…第2シード点
SP…候補点 Spc、Spcv…スペクトル
DESCRIPTION OF SYMBOLS 10 ... Manufacturing apparatus 12 ... Image processing apparatus 14 ... Conductive film 16 ... Light 18 ... Exposure part 20 ... Input part 24 ... Storage part 28 ... Initial position selection part 30 ... Update candidate position determination part 32 ... Exposure data conversion part 36 ... Image information estimation unit 38: Image data creation unit 40: Mesh pattern evaluation unit 42: Data update instruction unit 50: Conductive unit 52: Opening 54: Thin metal wire 56: Transparent film substrate 57: Filter member 59: Black matrix 60 the unit pixel 62 ... silver halide 64 ... gelatin 66 ... photosensitive silver salt layer 68 ... ... developed silver 70 ... metallic silver portion 72 ... light transmission portion 74 ... conductive metal 75 ... copper foil 76 the photoresist film 78 ... resist pattern 80 ... Paste 82: metal plating 84: metal thin film 100: FFT operation unit 102: evaluation value calculation unit 108: counter 110: pseudo temperature management unit 112: further New probability calculation unit 114 ... position update determination unit 116 ... output image data determination unit 120, 160 ... setting screen 122, 126 ... pull-down menu 124, 128 ... display field 130, 132, 134, 136, 138, 140, 142, 164, 166, 168, 170, 172, 174 ... text box 144, 146, 178, 180, 182 ... button 176 ... matrix-like image 200 ... two-dimensional image area Img, ImgInit, ImgTemp ... image data ImgInit ', ImgTemp' ... Superimposed image data ImgOut ... Output image data M ... Mesh pattern SD ... Seed point SDd, SDNd, SDSd, SPd ... Position data SDN ... First seed point SDS ... Second seed point SP ... Candidate point Spc, Spcv ... Spectrum

JP2010084645A 2010-03-31 2010-03-31 Method for producing transparent conductive film, conductive film and program Active JP5398623B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2010084645A JP5398623B2 (en) 2010-03-31 2010-03-31 Method for producing transparent conductive film, conductive film and program
CN201180017363.0A CN102822829B (en) 2010-03-31 2011-03-28 The manufacture method of conductive film and manufacturing installation and conductive film
PCT/JP2011/057582 WO2011125597A1 (en) 2010-03-31 2011-03-28 Conductive film manufacturing method, conductive film, and recording medium
US13/638,541 US9031310B2 (en) 2010-03-31 2011-03-28 Conductive film manufacturing method, conductive film, and recording medium
KR1020127025702A KR101601746B1 (en) 2010-03-31 2011-03-28 Conductive film manufacturing method, conductive film, and recording medium
KR1020167005718A KR101622586B1 (en) 2010-03-31 2011-03-28 Conductive film
US14/665,615 US9436089B2 (en) 2010-03-31 2015-03-23 Conductive film manufacturing method, conductive film, and recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010084645A JP5398623B2 (en) 2010-03-31 2010-03-31 Method for producing transparent conductive film, conductive film and program

Publications (3)

Publication Number Publication Date
JP2011216377A JP2011216377A (en) 2011-10-27
JP2011216377A5 true JP2011216377A5 (en) 2012-09-06
JP5398623B2 JP5398623B2 (en) 2014-01-29

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JP2010084645A Active JP5398623B2 (en) 2010-03-31 2010-03-31 Method for producing transparent conductive film, conductive film and program

Country Status (1)

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JP (1) JP5398623B2 (en)

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JP5781886B2 (en) * 2011-10-05 2015-09-24 富士フイルム株式会社 Conductive sheet, touch panel and display device
KR101310585B1 (en) * 2011-11-25 2013-09-23 삼성전기주식회사 Touch Panel
JP5795746B2 (en) * 2012-03-30 2015-10-14 富士フイルム株式会社 Conductive film, display device including the same, and method for determining pattern of conductive film
CN102722279A (en) * 2012-05-09 2012-10-10 崔铮 Metal grid conducting layer and touch panel equipped with the conducting layer
JP5849059B2 (en) * 2012-07-06 2016-01-27 富士フイルム株式会社 Conductive film for touch panel and touch panel
JP5859411B2 (en) * 2012-09-07 2016-02-10 富士フイルム株式会社 Conductive film, display device and touch panel including the same, and method for determining pattern of conductive film
JP5800320B2 (en) * 2012-09-27 2015-10-28 富士フイルム株式会社 Conductive film, and touch panel and display device including the same
JP6001089B2 (en) * 2012-12-18 2016-10-05 富士フイルム株式会社 Display device and method for determining pattern of conductive film
WO2014123009A1 (en) * 2013-02-05 2014-08-14 富士フイルム株式会社 Conductive film, display device provided with same, and method for evaluating conductive film
JP5890063B2 (en) 2013-03-08 2016-03-22 富士フイルム株式会社 Conductive film
JP6230476B2 (en) 2014-04-25 2017-11-15 三菱製紙株式会社 Pattern forming method for light transmissive conductive material
JP6159688B2 (en) 2014-06-25 2017-07-05 三菱製紙株式会社 Light transmissive conductive material
JP6441046B2 (en) 2014-11-26 2018-12-19 三菱製紙株式会社 Light transmissive conductive material
JP6404153B2 (en) 2015-03-19 2018-10-10 三菱製紙株式会社 Light transmissive conductive material
KR101991213B1 (en) 2015-11-17 2019-08-08 미쓰비시 세이시 가부시키가이샤 Light transmissive conductive material
JP6815300B2 (en) 2017-09-22 2021-01-20 三菱製紙株式会社 Light-transmitting conductive material
JP7130567B2 (en) 2019-01-30 2022-09-05 フクシマガリレイ株式会社 Showcase

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4243633B2 (en) * 2001-04-19 2009-03-25 エーユー オプトロニクス コーポレイション Discrete pattern generation method, program, recording medium, and discrete pattern generation system
JP4280843B2 (en) * 2003-11-17 2009-06-17 住友金属鉱山株式会社 Design method of electromagnetic shielding film and mesh structure pattern thereof
JP2009016700A (en) * 2007-07-09 2009-01-22 Toray Ind Inc Mesh metal particle laminated board and method for manufacturing transparent conductive board
JP4914805B2 (en) * 2007-11-08 2012-04-11 富士フイルム株式会社 Electromagnetic wave shielding film manufacturing apparatus, electromagnetic wave shielding film manufacturing method, and pattern generation method
JP5222634B2 (en) * 2008-06-23 2013-06-26 藤森工業株式会社 Electromagnetic wave absorber using frequency selective electromagnetic shielding material

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