JP2011212705A - Apparatus for melting solder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an object to be soldered from being destroyed during soldering work regardless of the level of an operator's skill or carelessness.SOLUTION: The apparatus for melting solder by a heater controlled to have the ordinary set temperature includes: a contact detector which detects the contact between the heater and an object to be heated; and an announce controller which announces the operator that the contact time, measured from the start of the soldering work, is beyond the soldering time previously set, which is provided that the time when the heater and the object start to contact each other is the start of the soldering work.

Description

 The present invention relates to a solder melting apparatus that melts solder by heating a predetermined heating target portion to a normal set temperature with a heater.

  For example, Japanese Patent No. 3670072 discloses a normal operation mode in which solder is melted by heating a tip (heating target portion) to a normal set temperature with a heater, and when the use of the tip is interrupted. A soldering iron device having a sleep mode that lowers the tip to a sleep set temperature is disclosed. According to such a soldering iron device, it is possible to reduce power consumption when the tip is not used, and to prevent the tip from being oxidized, thereby extending its life.

Japanese Patent No. 3670072

  By the way, in the soldering operation, if the soldering time (the time for applying the tip to the soldering object) is too long, the soldering object is damaged due to thermal damage. Conventionally, such a soldering time is left to the judgment of a soldering worker, and an appropriate judgment cannot be made by a skilled worker. Also, even if a manual for soldering time is created so that the soldering work can be performed uniformly regardless of the skill level of the worker, the manual is inadvertently inadvertent as long as the work is done manually. There is a possibility that the prescribed soldering time will be exceeded and the soldering object will be destroyed.

 The present invention has been made in view of the above-described circumstances, and in soldering work, regardless of the skill level or carelessness of the operator, quantification of soldering conditions and prevention of destruction of the soldering object. With the goal.

   In order to achieve the above object, according to the present invention, as a first solving means related to a solder melting apparatus, a solder melting apparatus that melts solder by a heating section controlled to a normal set temperature, the heating section and the heating Contact detection means for detecting contact with an object, and a contact start time between the heating unit and the heating object are set as a soldering start time, and a contact time at which timing is started from the soldering start time is preset. When the soldering time is exceeded, a means for notifying the outside of the fact is provided.

 Further, in the present invention, as the second solving means relating to the solder melting apparatus, in the first solving means, the notification control means starts counting the contact time from the soldering start time, and the contact time The control means for outputting an alarm generation signal when the soldering time exceeds the soldering time and the notification means for generating an alarm outward in response to the alarm generation signal are employed.

 Further, in the present invention, as a third solving means relating to the solder melting apparatus, in the second solving means, the control means includes the heating unit and the heating unit after the contact time exceeds the soldering time. The alarm generation signal is continuously output until the object is separated, or the pulse is generated at each time when the contact time exceeds the soldering time and when the heating unit and the heating object are separated. The means for outputting the alarm generation signal in the form is adopted.

 In the present invention, as a fourth solving means relating to the solder melting apparatus, in any one of the first to third solving means, the contact detecting means is a contact between the heating unit and the heating object. The means of electrically detecting is adopted.

 In the present invention, as a fifth solving means relating to the solder melting apparatus, in any one of the first to third solving means, the contact detecting means is configured to contact the heating unit and the heating object. The method of mechanically detecting is adopted.

 According to the solder melting apparatus according to the present invention, the contact start time of the heating unit and the object to be heated is recognized as the solder start time, and the contact time at which the time measurement is started from the solder start time is set in advance. By notifying the outside when the time is exceeded, it is possible to notify the operator of the end of soldering and to call attention. Therefore, according to the present invention, the worker only needs to finish the soldering work in accordance with the above notification, and the destruction of the soldering object can be prevented regardless of the skill level or carelessness of the worker. .

1 is an external view of a soldering iron device 1 according to an embodiment of the present invention. 2 is a block diagram showing an electrical configuration of the soldering iron device 1. FIG. 3 is a flowchart showing the operation of the soldering iron device 1. 6 is a diagram illustrating a case where the second connecting terminal 3c of the signal processing box 3 and the yarn solder 300 are electrically connected when the soldering iron device 1 is used. FIG. It is a figure which shows the temperature change of the tip 2b. 6 is a diagram illustrating a case where the second connecting terminal 3c of the signal processing box 3 and the wiring pattern 202 on the printed circuit board 200 are electrically connected when the soldering iron device 1 is used. FIG. It is a figure which shows the modification (when detecting the contact with the tip 2b and a heating target object mechanically) in the contact detection means in the soldering iron apparatus 1. FIG. It is a figure which shows the modification of an alarm generation pattern.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Hereinafter, as an example of the solder melting apparatus according to the present invention, a soldering iron apparatus that melts solder in order to mount an electronic component or the like on a substrate will be described.

  FIG. 1 is an external view of a soldering iron device 1 according to this embodiment. As shown in FIG. 1, the present soldering iron device 1 is composed of a soldering iron part 2 and a signal processing box 3. The soldering iron part 2 is connected to the tip 2b, the grip 2a gripped by the operator, the tip (heating part) 2b attached to the tip of the grip 2a, and one end passing through the center of the grip 2a. The other end of the cable 2c is connected to the signal processing box 3.

 The signal processing box 3 controls the temperature of the soldering iron part 2 (specifically, the tip 2b) on the basis of various setting information set by the operator, and has a display on the surface thereof. And an operation panel 3a having various operation switches, a first connection terminal 3b for connecting the cable 2c of the soldering iron part 2, and an object to be heated (such as solder or a pattern on a printed circuit board) are electrically connected The second connection terminal 3c for connecting to the terminal is provided so as to be exposed to the outside.

   FIG. 2 is a block diagram showing an electrical configuration of the present soldering iron device 1. As shown in FIG. 2, the present soldering iron device 1 includes a microcomputer (control means) 10, a heater 11, a first temperature sensor 12, a power transformer 13, a thyristor 14, and a zero cross detector 15 as electrical components. , Power supply circuit 16, first amplifier 17, second temperature sensor 18, second amplifier 19, multiplexer 20, A / D converter 21, switch 22, buzzer (notification means) 23, buffer amplifier 24, display 25, operation switch 26, a buffer 27, a transistor 28, an oscillation circuit 29, a reset switch 30, an EEPROM (Electronically Erasable and Programmable Read Only Memory) 31, and a contact detection circuit 32.

 Of the above components, the heater 11 and the first temperature sensor 12 are provided in the tip 2b, and the other components are provided in the signal processing box 3 (however, The display 25, the operation switch 26, and the reset switch 30 are provided so as to be exposed to the outside of the signal processing box 3). That is, the heater 11 and the first temperature sensor 12 incorporated in the tip 2b are electrically connected to predetermined components in the signal processing box 3 via the cable 2c. The tip 2b is grounded in the signal processing box 3 through the cable 2c.

   The microcomputer 10 controls the operation of each component described below according to a control program stored in a ROM (Read Only Memory) provided therein. As the microcomputer 10, in addition to the ROM, a microcomputer provided with a RAM (Random Access Memory), various timer input / output interfaces and the like is used.

   One end of the heater 11 is connected to one end of the secondary winding of the power transformer 13, and the other end is connected to the other end of the secondary winding of the power transformer 13 via a thyristor 14 whose ON / OFF is controlled by the microcomputer 10. Has been. That is, the heater 11 heats the tip 2b to a predetermined temperature in accordance with the output current control of the power transformer 13 by the thyristor 14. The first temperature sensor 12 detects the heating temperature of the tip 2 b and outputs a first temperature detection signal indicating the heating temperature to the first amplifier 17.

   The power transformer 13 lowers the commercial power supplied from the outside and outputs the AC voltage after the low voltage to the heater 11, the zero cross detector 15 and the power circuit 16. The thyristor 14 controls the output current of the power transformer 13 flowing through the heater 11 by ON / OFF control by the microcomputer 10. The zero cross detector 15 detects the zero cross position of the AC voltage input from the power transformer 13 and outputs it to the microcomputer 10. The microcomputer 10 performs ON / OFF control of the thyristor 14 based on the zero cross position detected by the zero cross detector 15.

   The power supply circuit 16 rectifies the AC voltage input from the power supply transformer 13 and supplies a DC power supply voltage such as ± 5 V and +3 V to each part in the soldering iron device 1. The first amplifier 17 amplifies the first temperature detection signal input from the first temperature sensor 12 and outputs the amplified signal to one selection terminal of the multiplexer 20.

   The second temperature sensor 18 detects the cold junction temperature of the first temperature sensor 12 and outputs a second temperature detection signal indicating the cold junction temperature to the second amplifier 19. The second amplifier 19 amplifies the second temperature detection signal and outputs it to the other selection terminal of the multiplexer 20. The multiplexer 20 alternatively outputs the first temperature detection signal or the second temperature detection signal to the A / D converter (analog / digital converter) 21 according to the request of the microcomputer 10. The A / D converter 21 converts an input signal (first temperature detection signal or second temperature detection signal) that is an analog signal into a digital signal and outputs the digital signal to the microcomputer 10.

   The switch 22 alternatively outputs either the power supply voltage + 5V or + 3V to the buzzer 23 according to the request of the microcomputer 10. The buzzer 23 outputs an alarm sound to the outside based on the alarm generation signal input from the microcomputer 10 via the buffer amplifier 24 and the volume defined by the power supply voltage alternatively input from the switch 22. . The buffer amplifier 24 amplifies the alarm generation signal input from the microcomputer 10 and outputs it to the buzzer 23.

   As shown in FIG. 1, the operation panel 3 a is provided on the surface of the signal processing box 3 of the soldering iron device 1, and includes a plurality of displays 25 and operation switches 26. Each operation terminal of the display 25 is connected to the microcomputer 10 via the buffer 27, and the common terminal is connected to the collector terminal of the transistor 28. In addition, each base terminal of the transistor 28 is connected to the microcomputer 10, and a power supply voltage of, for example, +5 V is supplied to the common terminal of each display unit 25 according to the base signal output from the microcomputer 10. .

 The operation switch 26 is inserted between each collector terminal and the microcomputer 10 and outputs the switching operation information to the microcomputer 10. The buffer 27 buffers the display signal input from the microcomputer 10 and outputs the display signal to the display unit 25 through each operation terminal. That is, the display device 25 displays information corresponding to the display signal.

 The oscillation circuit 29 generates a basic clock signal for the microcomputer 10 and outputs the basic clock signal to the microcomputer 10. The reset switch 30 is for initializing the microcomputer 10 by the switching operation. The EEPROM 31 stores various setting values input from the numerical value input switch 26a and the setting state of the soldering iron device 1 such as the key lock setting state by the key lock switch 26d.

 The contact detection circuit (contact detection means) 32 electrically detects contact between the tip 2b and a heating object (solder or a pattern on a printed circuit board), and a voltage signal indicating the detection result. (Hereinafter referred to as a contact detection signal) is output to the microcomputer 10. The contact detection circuit 32 includes a DC power source 32a, a photocoupler 32b, a transistor 32c, a first resistor 32d, a second resistor 32e, a third resistor 32f, and a fourth resistor 32g.

 The positive terminal of the DC power supply 32a is connected to one end of the first resistor 32d, the second resistor 32e, and the third resistor 32f, and the negative terminal is the emitter terminal of the phototransistor 32b2 in the photocoupler 32b, the emitter terminal of the transistor 32c, and It is connected to one end of the fourth resistor 32g. In FIG. 2, the contact detection circuit 32 is illustrated as if the DC power supply 32a is provided separately, but in practice, the power supply circuit 16 can be used as the DC power supply 32a.

 The photocoupler 32b is an IC chip in which a light emitting diode 32b1 that is a light emitting element and a phototransistor 32b2 that is a light receiving element are provided. The anode terminal of the light emitting diode 32b1 is connected to the other end of the second resistor 32e, and the cathode terminal is connected to the collector terminal of the transistor 32c. On the other hand, the collector terminal of the phototransistor 32b2 is connected to the other end of the first resistor 32d, and the emitter terminal is connected to the negative terminal of the DC power supply 32a, the emitter terminal of the transistor 32c, and one end of the fourth resistor 32g.

 The transistor 32c is an npn-type bipolar transistor, the collector terminal is connected to the other end of the second resistor 32e, the base terminal is connected to the other end of the fourth resistor 32g, the emitter terminal is the negative terminal of the DC power supply 32a, The phototransistor 32b2 is connected to the emitter terminal and one end of the fourth resistor 32g. The base terminal of the transistor 32c is electrically connected to the tip 2b through the cable 2c. Further, the other end of the third resistor 32 f is connected to a second connection terminal 3 c provided so as to be exposed to the outside of the signal processing box 3. In the contact detection circuit 32 configured as described above, the collector terminal voltage of the phototransistor 32b2 is output to the microcomputer 10 as the contact detection signal.

 The above is the description of the configuration of the present soldering iron device 1, and the operation of the present soldering iron device 1 will be described with reference to the flowchart of FIG. In the following, as shown in FIG. 4, an electronic component (for example, a transistor or a capacitor) 100 with a lead wire 101 is inserted into a through hole 201 from one surface of a printed board 200, and thread soldering is performed by a tip 2b. It is assumed that the electronic component 100 is mounted on the printed circuit board 200 by melting 300 and soldering the wiring pattern 202 formed on the other surface of the printed circuit board 200 and the lead wire 101 of the electronic component 100. I will explain.

 In addition, as shown in FIG. 4, when using this soldering iron apparatus 1, the 2nd connection terminal 3c of the signal processing box 3 and the thread | yarn solder 300 are electrically connected. For the connection between the second connection terminal 3c and the thread solder 300, a wiring 400 provided with a detachable conductive member 401 at one end (the thread solder 300 side) can be used.

 FIG. 5 shows the temperature change of the tip 2b and the temperature change of the electronic component 100 as the soldering object in the soldering operation as shown in FIG. When using the soldering iron device 1, as shown in FIG. 5, the normal set temperature TM3 of the tip 2b in the soldering iron device 1 and the appropriate soldering time T1 are the numerical input switch 26 and the like. It is assumed that the microcomputer 10 stores the setting information in the EEPROM 31 in advance.

 Here, the soldering time T1 is, as shown in FIG. 5, the destruction of the electronic component 100 from the soldering start time t1, that is, from the time when the tip 2b is in electrical contact with the thread solder 300 (object to be heated). It is set to be shorter than the time until the temperature TM2 is reached, that is, the time T2 until the electronic component 100 is destroyed, and longer than the time T3 when the electronic component 100 reaches the solder melting temperature TM1. The soldering time T1 is the normal set temperature TM3 of the tip 2b, the type of the electronic component 100 that is the soldering object, and the configuration of the printed circuit board 200 as a base (the heat of the substrate layer structure and wiring pattern). Therefore, it is desirable to change the setting appropriately according to these conditions.

 Now, as shown in FIG. 3, the microcomputer 10 reads the normal set temperature TM3 from the EEPROM 31, sets the control temperature of the tip 2b, performs ON / OFF control of the thyristor 14, and sets the temperature of the tip 2b. That is, energization to the heater 11 is controlled so that the temperature detected by the first temperature sensor 12 becomes the normal set temperature TM3 (step S1). In the present embodiment, as shown in FIG. 5, the heater 11 is controlled so that the temperature of the tip 2b reaches the normal set temperature TM3 at time t0 and thereafter the temperature of the tip 2b is kept constant. It is assumed that

 Subsequently, the microcomputer 10 monitors the level of the contact detection signal input from the contact detection circuit 32 to determine whether or not the contact start time between the tip 2b and the yarn solder 300 has been detected (step). S2). When soldering is started, when the tip 2b and the thread solder 300 are in electrical contact with each other, the other end of the third resistor 32f (second connection terminal 3c) and the fourth resistor 32g in the contact detection circuit 32 The end (the base terminal of the transistor 32c) is electrically connected, and the transistor 32c is turned on.

 When the transistor 32c is turned on, a current flows between the collector and emitter of the transistor 32c, and as a result, the light emitting diode 32b1 of the photocoupler 32b emits light. When the light emitting diode 32b1 emits light, a photocurrent flows between the collector and the emitter of the phototransistor 32b2, and as a result, the collector terminal voltage of the phototransistor 32b2 changes to a high level. That is, when the tip 2b and the thread solder 300 are in electrical contact, the contact detection signal output from the contact detection circuit 32 changes from low level to high level, so the microcomputer 10 determines the level of the contact detection signal. The change point can be detected as the contact start time.

 In the case of “Yes” in Step S2, that is, when the microcomputer 10 detects the level change point of the contact detection signal as the contact start time, the contact start time is set as the soldering start time, and the soldering is started from the soldering start time. The time (contact time) during which the tip 2b and the yarn solder 300 are in contact is started (step S3). In the present embodiment, as shown in FIG. 5, it is assumed that time t1 is detected as the contact start time (soldering start time), and the time measurement of the contact time is started from time t1. On the other hand, in the case of “No” in step S2, the microcomputer 10 repeats the process of step S2 until the contact start point is detected.

 As shown in FIG. 5, the temperature of the tip 2b decreases to a certain temperature from the soldering start time t1, but the heater 11 is controlled so that the tip 2b is maintained at the normal set temperature TM3 during this time. Therefore, the temperature of the tip 2b gradually rises and is maintained at a temperature lower than the normal set temperature TM3. This is because the temperature does not completely reach the normal set temperature TM3 while the tip 2b is in contact with the yarn solder 300 (that is, during soldering).

 Then, the microcomputer 10 determines whether or not the contact time that has started timing from the soldering start time t1 exceeds a preset soldering time T1 (step S4). In the case of “Yes” in step S4, the microcomputer 10 generates an alarm sound by continuously outputting an alarm generation signal to the buzzer 23 via the buffer amplifier 16 (step S5). Thereby, it is possible to notify the worker of the end of the soldering work and to call attention, and to prompt the end of the soldering work.

 On the other hand, if “No” in step S4, the microcomputer 10 determines whether the tip 2b and the yarn solder 300 are separated from each other based on the contact detection signal input from the contact detection circuit 32 (step S4). S6). Specifically, the microcomputer 10 determines that the tip 2b and the yarn solder 300 are separated when the level of the contact detection signal input from the contact detection circuit 32 changes from a high level to a low level.

 If “No” in step S6, the microcomputer 10 returns to the process of step S4. On the other hand, if “Yes” in step S6, that is, the tip 2b and the thread solder 300 are separated, the worker performs soldering. When the attaching work is finished, the timing of the contact time is finished and the output of the alarm generation signal is stopped (the alarm sound is stopped), and then the process returns to step S2 (step S7).

 As described above, according to the present soldering iron apparatus 1, the worker only needs to end the soldering work in accordance with the alarm of the buzzer 23, and the destruction of the soldering target object regardless of the skill level or carelessness of the worker. Can be prevented.

In addition, this invention is not limited to the said embodiment, For example, the following modifications can be considered.
(1) In the above embodiment, the operator is notified of the end of the soldering work by generating an alarm when the contact time that has started counting from the soldering start time t1 exceeds the soldering time T1. In addition to this, as a method of notifying the worker of the end of the soldering work, the contact time is started from the soldering start time t1, and an alarm signal is output (alarm is generated), and the contact time is soldered. The microcomputer 10 may be provided with a function of stopping the output of the alarm generation signal when the time T1 is exceeded (stopping the alarm).

 That is, an alarm is continuously generated during the soldering operation, and when the contact time exceeds the soldering time T1, the alarm is stopped to notify the operator of the end of the soldering operation. Note that the volume of the alarm sound in this modification is preferably smaller than that in the above embodiment, and the sound pattern is preferably set to a pattern that does not give the operator a great discomfort. The reason for this is that in this modified example, an alarm sound is continuously generated during the soldering work, so that the alarm sound prevents the worker from concentrating on the soldering work.

(2) In the above embodiment, the case where the contact between the tip 2b and the thread solder 300 is electrically detected is exemplified. However, the contact between the tip 2b and the wiring pattern 202 on the printed circuit board 200 is electrically detected. You may make it detect. In this case, as shown in FIG. 6, the second connection terminal 3c of the signal processing box 3 and the wiring pattern 202 on the printed circuit board 200 may be electrically connected.

(3) In the above embodiment, the contact detection circuit 32 that electrically detects contact between the tip 2b and the heating object (such as the yarn solder 300 or the wiring pattern 202) is provided as the contact detection means. A means is not limited to this, For example, you may provide a contact detection means which mechanically detects the contact with the tip 2b and a heating target object.

 For example, as shown in FIG. 7 (a), in the soldering iron part 2, a mechanical connecting portion between the grip 2a and the tip 2b is allowed to play, and the tip 2b is heated (for example, a printed board). A limit switch 2e is provided on the grip 2a side so that a gap 2d is formed between the tip 2b and the tip 2b. .

  When the structure as described above is adopted, when the tip 2b comes into contact with the object to be heated, the limit switch 2e is turned on (see FIG. 7B), and when the tip 2b is separated, the limit switch 2e is turned off (FIG. 7 ( a)). That is, the microcomputer 10 can detect the contact between the tip 2b and the heating object by detecting the ON / OFF state of the limit switch 2e.

  Further, the contact detection means for mechanically detecting the contact between the tip 2b and the object to be heated is not limited to the above limit switch 2e, and a pressure sensor, a strain gauge, or the like may be used. In addition, as a contact detection means, an optical sensor or the like having a monitoring area around the tip of the tip 2b is provided, and by detecting whether or not the yarn solder 300 has entered the monitoring area by this optical sensor, The contact between the tip 2b and the yarn solder 300 may be detected.

  When the contact detection means described above is used, regardless of the electrical or mechanical contact detection means, the point of contact between the tip 2b and the heating object (contact start point) and the point of separation (contact end point) ) Can be detected. Therefore, a function for measuring the time between the two time points and managing the measurement result (for example, a function for displaying the measurement result on the display 25 in real time, a function for storing the measurement result in the EEPROM 31 and enabling downloading, etc.) ) May be provided in the microcomputer 10. This allows the worker to check in real time how long he is soldering, and to download the measurement results after the work to investigate the cause of yield degradation. become.

(4) In the above embodiment, the microcomputer 10 continuously outputs an alarm generation signal until the tip 2b is separated from the heating object after the contact time exceeds the soldering time T1 ( (See FIG. 8 (a)). For example, as shown in FIG. 8 (b), a pulse shape is obtained at each of the time point t10 when the contact time exceeds the soldering time T1 and the time point t11 when the tip 2b and the heating object are separated from each other. The microcomputer 10 may have a function of outputting an alarm generation signal.
Thereby, for example, at the time t10 when the contact time exceeds the soldering time T1, an alarm is generated only for 0.2 seconds, and at the time t11 when the tip 2b is separated from the heating object, only 0.1 seconds. This is effective when you want the worker to recognize each timing separately, such as generating an alarm.
Further, as shown in FIGS. 8A and 8B, the microcomputer 10 may be configured to output a pulse-like alarm generation signal having a certain width from the soldering start time t1. Thereby, an operator can be notified that the tip 2b and the heating target object contacted.

 (5) In the above embodiment, the case where the first temperature sensor 12 and the heater 11 as temperature detecting means are provided on the tip 2b has been described as an example. The first temperature sensor 12 and the heater 11 may be provided separately in the tip 2b as shown in FIG. 2, or the first temperature sensor 12 and the heater 11 are integrally formed using, for example, a thermocouple. A configuration may be adopted. Furthermore, a configuration in which the first temperature sensor 12 is provided outside the tip 2b may be employed.

 (6) In the above embodiment, the soldering iron device has been described as an example of the solder melting device. However, the present invention is not limited to this, and the tip 2b is configured in a nozzle shape, and is melted from the nozzle-shaped tip 2b. The present invention can also be applied to a solder removing device that sucks and removes solder in a state.

 DESCRIPTION OF SYMBOLS 1 ... Soldering iron apparatus, 2 ... Soldering iron part, 2a ... Grip, 2b ... Tip, 2c ... Cable, 3 ... Signal processing box, 3a ... Operation panel, 3b ... Soldering iron connection terminal, 3c ... Solder Connection terminal, 10 ... microcomputer, 11 ... heater, 12 ... first temperature sensor, 13 ... power transformer, 14 ... thyristor, 15 ... zero cross detector, 16 ... power circuit, 17 ... first amplifier, 18 ... second temperature sensor 19 ... second amplifier, 20 ... multiplexer, 21 ... A / D converter, 22 ... switch, 23 ... buzzer, 24 ... buffer amplifier, 25 ... display, 26 ... operation switch, 27 ... buffer, 28 ... transistor, 29 ... Oscillator circuit, 30 ... Reset switch, 31 ... EEPROM, 32 ... Contact detection circuit

Claims (5)

A solder melting device that melts solder by a heating unit that is normally controlled to a set temperature,
Contact detection means for detecting contact between the heating unit and the heating object;
The contact start time of the heating unit and the object to be heated is set as the soldering start time, and when the contact time when the time measurement starts from the soldering start time exceeds a preset soldering time, this is indicated to the outside. Notification control means for informing;
A solder melting apparatus comprising: The notification control means includes
Control means for starting time measurement of the contact time from the soldering start time point and outputting an alarm generation signal when the contact time exceeds the soldering time;
Informing means for generating an alarm toward the outside according to the alarm generation signal,
The solder melting apparatus according to claim 1, comprising:  The control means outputs the alarm generation signal continuously after the contact time exceeds the soldering time until the heating unit and the heating object are separated from each other, or the contact time is the soldering The solder melting apparatus according to claim 2, wherein the alarm generation signal is output in a pulse form at each of the time when the time is exceeded and the time when the heating unit and the object to be heated are separated from each other.   The solder melting apparatus according to claim 1, wherein the contact detection unit electrically detects contact between the heating unit and the heating object.   4. The solder melting apparatus according to claim 1, wherein the contact detection unit mechanically detects contact between the heating unit and the heating object. 5.

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