JP2011211062A - Optical device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-reliability optical device which can be applied to a surface type optical element, and to provide a method for manufacturing the optical device.SOLUTION: The optical device 50 is provided with a support substrate 1; a surface type optical element 2 arranged on the support substrate 1; a translucent cover 4 arranged at the upper part of the surface type optical element 2; a translucent sealing member 5, configured to cover at least the surface-type optical element 2 and packed between the surface type optical element 2 and the translucent cover 4; and a translucent sealing member dam 10 which is internally arranged with the surface-type optical element 2 and the translucent sealing member 5, configured so as to be butted to the translucent cover 4 at a portion of the upper surface, and internally formed with a translucent sealing member storage space 14 for absorbing expansion and contraction of the translucent sealing member 5.

Description

  The present invention relates to an optical device and a method for manufacturing the same. More specifically, the present invention relates to an optical device on which a surface optical element is mounted, and a manufacturing method thereof.

  A translucent resin is known as a protective member for an optical element. FIG. 20A is a cross-sectional view of a cut portion of the light receiving semiconductor device 100 disclosed in Patent Document 1. The light receiving semiconductor device 100 includes a lead frame 101, a plastic package 102, a chip 103, a bonding wire 104, a light transmitting member 105, a dam 115, a resin escape portion 116, a transparent resin (translucent resin) 117 that functions as a light receiving protection portion, and the like. It comprises. The transparent resin 117 is disposed on the chip 103 as shown in FIG. 20A.

  It is described that the provision of the dam 115 prevents the transparent resin 117 from flowing out, and the potting height that can be formed on the chip 103 by surface tension can be increased as compared with the case where the dam 115 is not provided. Patent Document 1 also proposes a light receiving semiconductor device 100a in which a dam 115a is provided on the bottom surface of a plastic package 102 as shown in FIG. 20B.

  Incidentally, in recent years, in the field of optical communication devices, multicore module technology (for example, Patent Documents 2 and 3) that can be provided at low cost has become common in response to the demand for short-distance large-capacity communication. In a conventional optical module, a hermetic shield or the like has been used. However, in the multi-core module technology, a method of sealing an optical system portion with a translucent resin has become common.

  FIG. 21 is a cross-sectional view of the optoelectronic device 200 disclosed in Patent Document 2. The optoelectronic device 200 includes a substrate 201, a light receiving element 202, a semiconductor laser chip 203, an optical fiber 204, a transparent resin (translucent resin) 205, and the like. Reference numeral 211 is an exit surface, and 212 is a light receiving surface. The substrate 201 is provided with recesses 221 and 222.

  The light-transmitting resin has a problem that bubbles are easily generated in an injection process and a subsequent thermosetting process by heating. In Patent Document 2, it is described that the formation of bubbles can be suppressed in the above process by providing the depressions 221 and 222.

  Patent Document 3 proposes a structure that prevents deterioration in characteristics such as a decrease in sensitivity of a photodiode, an increase in reflected return light of a light receiving diode, and a decrease in light output after a heat cycle test. Specifically, a structure is disclosed in which a coupling portion between an optical fiber or an optical waveguide and an optical component is covered with a translucent resin having a refractive index close to these. And the structure which always applies a pressure to translucent resin in a use temperature range is proposed.

JP-A-3-288462 (Page 4, FIGS. 8, 9) JP 2001-272582 A (Page 9, FIG. 1) JP 2002-48951 (Page 10, FIGS. 12, 13)

  In general, a soft resin gel is used as the material of the translucent resin so as not to apply excessive stress to the wire bonding of the optical element or the semiconductor element. However, the resin gel has characteristics that the shrinkage at the time of curing and the expansion and contraction with respect to temperature are very large. For this reason, there existed a problem that resin gel peels from the optical element and optical fiber which should be protected, or a bubble and a crack are easy to generate | occur | produce in resin gel.

  In Patent Document 1, when the transparent resin 117 swells in a high temperature environment and flows over the dam 115, there is a problem that it is difficult to return to the initial shape. For this reason, there was a problem in reliability.

  The structure of Patent Document 2 employs a structure in which the substrate 201 is separated from the optical axis of the light receiving element 202 and the like. For this reason, in recent years, it has been difficult to apply to a surface optical element that has been widely applied. Moreover, since the transparent resin before hardening normally has high viscosity, it is difficult to penetrate into small steps or narrow gaps. For this reason, when the substrate 201 having a complicated shape having a minute depression or the like as in Patent Document 2 is used, there is a problem that air is easily involved and bubbles are easily generated.

  In the planar optical element, it is necessary to provide an IC for driving the optical element and a receptacle structure for fixing the optical fiber in the vicinity of the planar optical element. Therefore, it has been difficult to provide a pressure structure as in Patent Document 3 in the surface optical element. There is also a problem that the overall yield and reliability are reduced due to an increase in the number of parts.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable optical device that can be applied to a planar optical element and a manufacturing method thereof. It is in.

  An optical device according to the present invention includes a support substrate, a planar optical element disposed on the support substrate, a translucent cover disposed above the planar optical element, and at least the planar light. A translucent sealing material covering the element and filled between the planar optical element and the translucent cover, and the planar optical element and the translucent sealing material are disposed inside. A translucent seal having a translucent sealing material reservoir space in contact with the translucent cover at a part of the upper surface thereof and absorbing expansion and contraction of the translucent sealing material. It is equipped with a stop dam.

  The present invention has an excellent effect that it can be applied to a surface optical element and can provide a highly reliable optical device and a method for manufacturing the same.

FIG. 2 is a schematic plan view of the optical communication apparatus according to the first embodiment. II-II cutting part sectional drawing of FIG. FIG. 3 is a schematic plan view for explaining a state of a resin gel in a low temperature environment of the optical communication device according to the first embodiment. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 3. FIG. 3 is a schematic plan view for explaining a state of a resin gel in a high temperature environment of the optical communication device according to the first embodiment. VI-VI cutting part sectional drawing of FIG. The top view which shows the dimension of the optical element which concerns on Embodiment 1, the wall part for dams, and the resin reservoir. VIII-VIII cutting part sectional drawing of FIG. Sectional view of manufacturing process of optical communication apparatus according to embodiment 1 FIG. 3 is a manufacturing process cross-sectional view of the optical communication device according to the first embodiment. FIG. 6 is a schematic plan view of an optical communication apparatus according to a second embodiment. XI-XI cutting part sectional drawing of FIG. FIG. 6 is a schematic plan view of an optical communication apparatus according to a third embodiment. FIG. 13 is a cross-sectional view taken along the line XIII-XIII in FIG. 12. FIG. 6 is a schematic plan view of an optical communication apparatus according to a fourth embodiment. XV-XV cutting part sectional drawing of FIG. FIG. 6 is a schematic cross-sectional view of an optical communication apparatus according to a fifth embodiment. FIG. 7 is a schematic plan view of an optical communication apparatus according to a sixth embodiment. FIG. 18 is a cross-sectional view taken along line XVII-XVII in FIG. 17. FIG. 7 is a schematic plan view of an optical communication apparatus according to a sixth embodiment. FIG. 6 is a schematic cross-sectional view of a light receiving semiconductor device disclosed in Patent Document 1. FIG. 6 is a schematic cross-sectional view of a light receiving semiconductor device disclosed in Patent Document 1. FIG. 6 is a schematic cross-sectional view of an optoelectronic device disclosed in Patent Document 2.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. It goes without saying that other embodiments may also belong to the category of the present invention as long as they match the gist of the present invention. Moreover, the size and ratio of each member in the following drawings are for convenience of explanation, and are different from actual ones.

[Embodiment 1]
FIG. 1 is a schematic plan view showing a part of an optical communication device 50 that is an optical device according to the first embodiment, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG. The optical communication device 50 includes a support substrate 1, a planar optical element 2, an LSI (Large Scale Integration) chip 3 that is a semiconductor element, a translucent cover 4, and a resin that functions as a translucent sealing material. Gel 5 and dam wall 10 are provided. In the first embodiment, the dam wall 10 functions as the translucent sealing material dam 20.

  The support substrate 1 functions as a support substrate on which the surface optical element 2, the LSI chip 3, and the like are mounted. The material of the support substrate 1 is not particularly limited, but a ceramic material that has excellent high frequency characteristics and is stable against heat is preferable. The support substrate 1 is formed with electrode pads (not shown), wiring (not shown) and the like for connecting the surface optical element 2 and the LSI chip 3. Further, a mark (not shown) indicating a position where the dam wall 10 is mounted is provided.

  The shape of the dam wall 10 in a plan view is a mouth shape (frame shape). Here, the space surrounded by the dam wall 10 is referred to as an enclosed space 12. The dam wall 10 is disposed on the support substrate 1, and the planar optical element 2 is mounted in the enclosed space 12 of the dam wall 10. The height of the dam wall 10 in a side view is configured to be higher than the height of the surface optical element 2.

  The material of the dam wall 10 is not particularly limited as long as it does not contradict the gist of the present invention, but a material having the same or close thermal expansion coefficient as that of the support substrate 1 is preferable. Preferable materials for the dam wall 10 include ceramics, quartz glass, and Kovar having a coefficient of thermal expansion close to that of ceramics. As a preferable combination of the support substrate 1 and the dam wall 10, a combination of the ceramic support substrate 1 and the dam wall 10 obtained by plating Kovar can be exemplified.

  The dam wall 10 is mounted using solder or the like so that there is no gap with respect to the support substrate 1. Thereby, it is possible to prevent bubbles from being generated by sucking air or peeling. The dam wall 10 is accurately mounted at a predetermined position based on a mark (not shown) provided on the support substrate 1.

  The planar optical element 2 is disposed on the support substrate 1 and in the enclosed space 12 of the dam wall 10. The surface optical element 2 is, for example, a vertical cavity surface-emitting laser, a photo diode, or the like, and one or a plurality of light receiving and emitting surfaces are formed on the surface thereof. The connection between the surface light emitting element 2 and the electrode pad formed on the support substrate 1 is performed by, for example, wire bonding or flip chip mounting.

  The LSI chip 3 is disposed at a position adjacent to the dam wall 10 on the support substrate 1. The LSI chip 3 and the surface optical element 2 are electrically connected via electrode pads (not shown) and wiring (not shown) provided on the support substrate 1.

  The translucent cover 4 is disposed so as to come into contact with the upper surface of the wall portion in the three directions of the dam wall portion 10. The translucent cover 4 divides the upper surface of the dam wall 10 into two regions, a region where the translucent cover 4 is disposed and a region where the translucent cover 4 is not disposed. In other words, the enclosed space 12 provided in the dam wall 10 includes a space between the support substrate 2 and the translucent cover 4 and a space in which the upper portion of the support substrate 2 is open. There is one. The former space is referred to as a cover arrangement space 13, and the latter space is referred to as a resin reservoir space (translucent sealing material reservoir space) 14. Thus, the enclosed space 12 of the dam wall 10 according to the first embodiment is configured so that only one place is open to the atmosphere.

  The abutting portion between the translucent cover 4 and the dam wall portion 10 is mounted so that there is no gap with an adhesive or the like. Thereby, in the contact part of the translucent cover 4 and the wall part 10 for dams, it can prevent that a bubble and peeling generate | occur | produce by sucking air from there.

  The surface optical element 2 is disposed in the cover disposition space 13. In the first embodiment, the center of gravity of the surface optical element 2 is disposed at a position that shifts from a substantially central position in plan view of the surrounding space 12 of the dam wall 10 in a direction away from the resin reservoir space 14. Has been

  The translucent cover 4 is made of a material that transmits an optical signal. For this reason, it is preferable to use a material having high transparency with respect to the wavelength of the optical signal. For example, quartz glass and transparent plastics such as PEI (polyetherimide) are preferable materials. The size of the translucent cover 4 is such that the enclosure space 12 of the dam wall 10 can be divided into a cover arrangement space 13 and a resin reservoir space 14, and the surface optical element 2 is provided with a cover arrangement. The size is such that it can be disposed in the space 13. The translucent cover 4 which concerns on this Embodiment 1 is arrange | positioned in the area | region which contacts the upper surface of the wall part of 3 directions among the wall parts of the wall part 10 for dams.

  The resin gel 5 covers at least the surface optical element 2 at the use environment average temperature (room temperature in the first embodiment), and is filled between the surface optical element 2 and the translucent cover 4. ing. The resin gel according to the first embodiment is substantially filled in the entire region of the cover arrangement space 13. As described above, the resin gel 5 has a large expansion and contraction with respect to temperature. Therefore, in the first embodiment, a resin reservoir space 14 is prepared as a region that absorbs expansion and contraction of the resin gel 5 according to the use environment temperature.

  In a room temperature environment, as shown in FIGS. 1 and 2, the resin gel 5 in the cover disposition space 13 is installed in a state where almost no stress is applied. A small amount of excess resin gel 5 is present in the resin reservoir space 14. The resin gel 5 is in an adhesive state with respect to the support substrate 1, the surface optical element 2, the dam wall 10, and the translucent cover 4, and excess resin gel 5 is stored in the resin reservoir space 14. .

  3 is a schematic plan view for explaining the state of the resin gel 5 in the low temperature environment of the optical communication device 50 according to the first embodiment, and FIG. 4 is a sectional view taken along the line IV-IV in FIG. Show. Under a low temperature environment, the resin gel 5 contracts and the volume decreases. That is, the resin gel 5 in the cover arrangement space 13 and the resin reservoir space 14 contracts and the volume decreases. Here, since the resin gel 5 in the cover disposition space 13 is surrounded by the translucent cover 4, the support substrate 2, and the dam wall 10, the shrinkage of the resin gel 5 is a resin having an open portion. It shrinks in a direction (arrow A direction) from the reservoir space 14 toward the cover arrangement space 13.

  The contracted resin gel 5 changes from a state in which the cover disposition space 13 is filled to a state in which a region in which the resin gel 5 is not filled is slightly present in the cover disposition space 13. This contraction volume is absorbed by drawing the excess resin gel 5 stored in the resin storage space 14 into the cover arrangement space 13. Thereby, it can prevent that the resin gel 5 peels from the support substrate 1, the surface-type optical element 2, and the wall part 10 for dams which are in the adhesive state, for example, a bubble or a crack enters into the resin gel 5. That is, in a low-temperature environment, bubbles or cracks are generated in the resin gel 5 due to the action of the excessive resin gel 5 stored in the resin reservoir space 14, or the support substrate 1 to which the resin gel 5 is adhered or the like. It is possible to prevent peeling from the member.

  FIG. 5 is a schematic plan view for explaining the state of the resin gel 5 under a high temperature environment of the optical communication device 50 according to the first embodiment, and FIG. 6 is a sectional view taken along the line VI-VI in FIG. Show. Under a high temperature environment, the resin gel 5 expands and its volume increases. That is, the resin gel 5 in the cover arrangement space 13 and the resin reservoir space 14 expands and the volume increases. Here, since the resin gel 5 in the cover arrangement space 13 is surrounded by the translucent cover 4, the support substrate 2, and the dam wall 10, the direction in which the resin gel 5 expands is determined by the cover arrangement. The direction is a direction (arrow B direction) from the space 13 toward the resin reservoir space 14 having an open portion. That is, the stress of the expanded translucent resin can be released in the direction of arrow B due to the presence of the resin reservoir space 14 in a high temperature environment. Thereby, generation | occurrence | production of the bubble in the resin gel 5, a crack, and generation | occurrence | production of peeling of the resin gel 5 can be prevented.

  Next, a preferable arrangement position of the surface optical element 2 with respect to the dam wall 10 will be described with reference to FIGS. FIG. 7 is a schematic plan view of the vicinity of the dam wall 10 and FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG.

The resin gel 5 according to the first embodiment is substantially filled in the entire region of the cover arrangement space 13 at room temperature (see FIGS. 1 and 2). Therefore, the volume V of the resin gel 5 in the cover arrangement space 13 is the sum of the following formulas (1) to (4).
Formula (1) V1 = a × (b ₁ + b ₂ + e) × H
Formula (2) V2 = d × (b ₁ + b ₂ ) × H
Formula (3) V3 = d × e × h
Formula (4) V4 = c × (b ₁ + b ₂ + e) × H

  However, as shown in FIG.7 and FIG.8, H in a type | formula is the height of the wall part 10 for dams, and h subtracted the height of the planar optical element 2 from the height of the wall part 10 for dams. D is the vertical length of the planar optical element 2 in plan view, and e is the lateral length of the planar optical element in plan view. Further, a is the minimum distance between the side surface of the surface optical element 2 that is farthest from the resin reservoir space 14 and the dam wall 10, and c is the side surface of the surface optical element that is closest to the resin reservoir space 14. To the resin reservoir space 14. Furthermore, b1 and b2 are the minimum distances to the side surfaces other than the side surfaces of the surface optical element 2 and the dam wall 10 respectively.

  V1 in the above formula (1) is the volume of the resin gel 5 filled in the back side of the planar optical element 2 when viewed from the resin reservoir space 14, and V2 in the above formula (2) is the planar optical element. 2 is a volume of the resin gel 5 filled on both sides. Further, V3 in the above formula (3) is the volume of the resin gel 5 filled above the surface optical element 2, and V4 in the above formula (4) is a surface light when viewed from the resin reservoir space 14. This is the volume of the resin gel 5 filled on the front side of the element 2.

In addition, the area of the cover arrangement space 13 in plan view is Expression (5), and the area of the resin reservoir space 14 in plan view is Expression (6). L is the length of the resin reservoir space 14 in the vertical direction.
Formula (5) (b1 + b2 + e) × (a + c + d)
Formula (6) (b1 + b2 + e) × L

Here, the volume change amount V (Low) of the resin gel 5 between the lowest temperature and room temperature, and the volume change amount V (High) of the resin gel 5 between the highest temperature and room temperature can be expressed by the following equations.
Expression (7) V (Low) = V × 3α × (T (Low) −RT)
Formula (8) V (High) = V × 3α × (T (High) −RT)
Α [1 / K] in the formula is the linear expansion coefficient of the resin gel 5, T (Low) represents the lowest temperature in the operating temperature range, and T (High) represents the highest temperature in the operating temperature range.

V (Low) and V (High) are proportional to the volume V, as is clear from the above formulas (7) and (8). Therefore, a change in volume proportional to the volume of the above formulas (1) to (4) occurs. For this reason, it is preferable to design so that the volume of the formula (4) close to the resin reservoir space 14 changes the largest and the change of the area of the formula (1) located at the farthest position is the smallest. That is, it is preferable to design so as to satisfy the condition of the following formula (9).
Formula (9)
a × (b ₁ + b ₂ + e) × H <d × (b ₁ + b ₂ ) × H + d × e × h << c × (b ₁ + b ₂ + e) × H

D, e, and (H−h) in the above formula (9) are determined by the size of the surface optical element 2. Therefore, it is preferable that the arrangement of the planar optical element 2 in the cover arrangement space 13 satisfies the following formula (10).
Formula (10) a <b ₁ <c, a <b ₂ <c
In the above formula (10), b ₁ = b ₂ can also be mentioned as a preferred example.

As a specific example satisfying the above formula (10), for example, when the size of the surface optical element 2 is 1 mm in width, 0.3 mm in length, and 0.2 mm in thickness, a = 0.2 mm, b ₁ = Examples thereof include b ₂ = 0.15 mm, c = 0.5 mm, and h = 0.3 mm.

  The volume of the resin reservoir space 14 needs to be sufficiently larger than V (Low) and V (High). Moreover, since the resin gel 5 is filled from the opening part of the resin reservoir space 14 at the time of assembly, it is preferable to have a large volume from the viewpoint of workability. In the above dimension example, the length L of the resin reservoir space 14 is preferably about 0.7 mm, for example. By setting L to about 0.7 mm, a sufficient volume as the resin reservoir space 14 can be secured, and workability at the time of gel filling can also be secured.

  Next, a method for manufacturing the optical communication device 50 according to the first embodiment will be described using the manufacturing process cross-sectional views of FIGS. 9A and 9B. First, as shown in FIG. 9A, the surface-type optical element 2 and the LSI chip 3 are mounted at predetermined positions on the support substrate 1, and these are electrically connected. Next, as shown in FIG. 9B, the dam wall 10 is fixed on the support substrate 1 by soldering.

  Thereafter, the translucent cover 4 is fixed on the dam wall 10 with an adhesive. It is effective to pour an adhesive having a low viscosity between the support substrate 1 and the dam wall 10 so that no gap is formed between them. By producing in this way, generation of bubbles and cracks can be suppressed. Next, the resin gel 5 is filled from the opening of the resin reservoir space 14 and cured. The optical communication device 50 is manufactured through the above steps and the like.

  According to the first embodiment, since the resin reservoir space 14 is provided as described above, bubbles and cracks are generated in the resin gel 5 even when there is a temperature change, or is in contact with the resin gel 5. It is possible to prevent a problem that peeling from the member occurs. Therefore, it is possible to provide a highly reliable optical device equipped with a surface optical element and a method for manufacturing the same.

[Embodiment 2]
Next, an example of an optical communication device having a structure different from that of the above embodiment will be described. In the following description, the same elements as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  The optical communication apparatus according to the second embodiment has the same basic structure and manufacturing method as those of the first embodiment except for the following points. That is, in the optical communication device 50 according to the first embodiment, one open portion is provided in the enclosed space 12 of the dam wall portion 10, but the optical communication device according to the second embodiment is provided with a dam wall. In the surrounding space of a part, it differs in the point by which two open parts are provided.

  FIG. 10 is a schematic plan view showing a part of the optical communication device 50a that is the optical device according to the second embodiment, and FIG. 11 is a sectional view taken along the line XI-XI in FIG. The planar optical element 2 according to the second embodiment is disposed closer to the center of the dam wall 10 than the first embodiment. The translucent cover 4a is provided so as to be disposed in the area of the surface optical element 2, and the resin reservoir space 14 having a release portion where the translucent cover 4a is not provided is divided into two. ing. The translucent cover 4a is disposed so as to be in contact with a part of the upper surface of the two opposing wall portions of the dam wall portion 10.

  In the optical communication device 50a according to the second embodiment, since the resin reservoir space 14 is provided in the dam wall portion 10, even if there is a temperature change, bubbles or cracks are generated in the resin gel 5 or sticking occurs. It is possible to prevent the resin gel 5 from being peeled off from the member. Further, in the optical communication device 50a according to the second embodiment, since the resin reservoir space 14 is provided at two locations across the surface optical element 2, the space on the two side surfaces of the surface optical element 2 is increased. It has the merit of being able to. Thereby, for example, workability at the time of wire bonding connection can be improved.

[Embodiment 3]
The optical communication apparatus according to the third embodiment has the same basic structure and manufacturing method as those of the first embodiment except for the following points. That is, in the optical communication device 50 according to the first embodiment, the dam wall 10 has a mouth shape, but in the optical communication device according to the third embodiment, the dam wall has a U shape. It is different in that.

  FIG. 12 is a schematic plan view showing a part of an optical communication device 50b that is an optical device according to the third embodiment, and FIG. 13 is a cross-sectional view taken along the line XIII-XIII of FIG. As shown in FIGS. 12 and 13, the dam wall 10 b according to the third embodiment has a U-shape. Then, one surface of the side wall of the LSI chip 3 is arranged so as to have the function of the wall portion of the dam wall portion. That is, the side wall of the LSI chip 3b is disposed in the vicinity of the region where the U-shaped dam wall portion 10b is not disposed. A space surrounded by the dam wall 10b and the side wall of the LSI chip 3b functions as an enclosed space 12b. That is, the dam wall 10b and the LSI chip 3b function as the translucent sealing material dam 20b.

  The height of the LSI chip 3b is not particularly limited as long as the resin gel 5 does not run on the upper surface of the LSI chip 3b, but is substantially the same as the dam wall 10b or higher than the dam wall 10b. It is preferable. Also, from the viewpoint of cooling the LSI chip 3b from the back side, it is preferable that the LSI chip 3b is higher than the dam wall 10b.

  The height of the LSI chip 3b according to the third embodiment is higher than the height of the dam wall 10b. A resin reservoir space 15 for the resin gel 5 is provided in the vicinity of the front end surface of the dam wall 10b and the region facing the LSI chip 3b. The resin gel 5 is substantially in close contact with one side wall of the LSI chip 3b (see FIGS. 12 and 13).

  In the optical communication apparatus 50b according to the third embodiment, the resin reservoir space 14 is provided in the dam wall 10b, and the resin reservoir space 15 is provided between the vicinity of the front end surface of the dam wall 10b and the LSI chip 3b. Therefore, even if there is a temperature change, it is possible to prevent bubbles and cracks from occurring in the resin gel 5 and peeling of the resin gel 5 from the adhered member. Further, in the optical communication device 50b according to the third embodiment, the LSI chip 3b and the planar optical element 2 are placed in close proximity by using the side wall of the LSI chip 3b as a part of the translucent sealing material dam 20b. The space can be saved. And the outstanding effect that the characteristic excellent in the high frequency characteristic is acquired is acquired.

[Embodiment 4]
The basic structure and manufacturing method of the optical communication apparatus according to the fourth embodiment are the same as those of the third embodiment except for the following points. That is, in the third embodiment, the resin gel 5 is in close contact with one side wall of the LSI chip 3b in a room temperature environment. In the fourth embodiment, one side wall of the LSI chip 3b is used in a room temperature environment. It is different in that it is not in close contact. Further, the LSI chip is different in that the height of the LSI chip is lower than that in the third embodiment and that the LSI chip is farther from the dam wall than in the third embodiment.

  FIG. 14 is a schematic plan view showing a part of an optical communication device 50c that is an optical device according to the fourth embodiment, and FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. As shown in FIGS. 14 and 15, the dam wall portion 10 c according to the fourth embodiment has a U shape. Then, one surface of the side wall of the LSI chip 3c is arranged so as to also have the function of the translucent sealing material dam 20c. That is, the dam wall 10c and the LSI chip 3c function as the translucent sealing material dam 20c.

  The LSI chip 3c according to the fourth embodiment uses a chip whose height is slightly smaller than the height of the dam wall 10c. And the resin reservoir space 15c of the resin gel 5 is provided in the opposing area | region of the wall part 10c for dams, and the LSI chip 3c (refer FIG. 14, FIG. 15).

  In the optical communication device 50c according to the fourth embodiment, the resin reservoir space 14 is provided in the dam wall 10c, and the resin reservoir 15c is provided between the dam wall 10c and the LSI chip 3c. Therefore, even if there is a temperature change, it is possible to prevent bubbles and cracks from being generated in the resin gel 5 and the resin gel 5 from being peeled off from the adhered member. Further, in the optical communication device 50c according to the fourth embodiment, the LSI chip 3c and the surface optical element 2 can be provided in close proximity, and space saving can be achieved. And the outstanding effect that the characteristic excellent in the high frequency characteristic is acquired is acquired.

[Embodiment 5]
The basic structure and manufacturing method of the optical communication apparatus according to the fifth embodiment are the same as those of the first embodiment except for the following points. That is, in the first embodiment, the structure in which the dam wall portion 10 is provided on the support substrate 1 is employed. However, in the fifth embodiment, a step is provided on the support substrate, and the planar optical element is provided in the step. Is different in that the stepped side wall is used as the wall portion of the dam wall portion.

  FIG. 16 is a schematic cross-sectional view showing a part of an optical communication device 50d that is an optical device according to the fifth embodiment. In the fifth embodiment, a step portion is provided on the support substrate 1d, and this is used as the dam wall portion 10d. That is, the step side wall of the support substrate 1d is used as the dam wall portion 10d. And the space in the level | step-difference part of the support substrate 1d functions as the enclosure space 12d of the wall part 10d for dams.

  The planar optical element 2 is mounted on the bottom surface of the dam wall 10d provided on the support substrate 1d. And the translucent cover 4d is arrange | positioned on the upper surface of the support substrate 1d. In the dam wall portion 10d, a resin reservoir space 14d and a cover arrangement space 13d are provided as in the first embodiment.

  In the optical communication device 50d according to the fifth embodiment, since the resin reservoir space 14d is provided in the dam wall 10d, bubbles or cracks are generated or adhered to the resin gel 5 even if the temperature changes. It is possible to prevent the resin gel 5 from being peeled off from the member. In addition, the optical communication device 50d according to the fifth embodiment has an excellent merit that the number of components can be reduced.

[Embodiment 6]
The basic structure and manufacturing method of the optical communication apparatus according to the sixth embodiment are the same as those of the third embodiment except for the following points. That is, in the third embodiment, the dam wall portion 10b has a U-shape in plan view, but in the sixth embodiment, the dam wall portion has a plate-like wall portion in plan view. Are different in that they are arranged to face each other. In other words, the dam wall portion of the sixth embodiment is different in that the wall portion connected to the U-shaped dam wall portion of the third embodiment is removed.

  17 is a schematic cross-sectional view showing a part of an optical communication device 50e that is an optical device according to the sixth embodiment, and FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII in FIG. In the sixth embodiment, as the dam wall portion 10e, plate-like wall portions are disposed so as to face each other in plan view. That is, the wall portion to which the U-shaped dam wall portion 10b of Embodiment 3 is connected is removed. The translucent sealing material dam 20e is constituted by a dam wall portion 10e composed of wall portions disposed to face each other, and an LSI chip 3e disposed over the end portion side.

  In the said Embodiment 1-5, a surface type optical element, resin gel, and a translucent sealing material reservoir space are enclosed as a translucent sealing material dam by which a surface type optical element and resin gel are arrange | positioned inside. As described above, the translucent sealing material dam (dam wall, LSI chip, etc.) is provided in a frame shape. When the volume of the resin reservoir space can be sufficiently secured, the shape of the wall portion functioning as a light-transmitting sealing material dam is not limited to the above configuration, as shown in FIGS. 17 and 18. It does not have to be a body. That is, it is good also as a structure which removed the wall part which is not the wall part extended from the cover arrangement | positioning space 13 among the resin reservoir spaces. However, from the viewpoint of improving workability at the time of filling the resin gel, a configuration in which the shape in plan view is a frame shape as in the third embodiment is preferable.

  In the optical communication device 50e according to the sixth embodiment, since the resin reservoir spaces 14e and 15e are provided in the interior (enclosed space 12e) surrounded by the dam wall 10e and the LSI chip 3e, there is a temperature change. However, it is possible to prevent bubbles and cracks from being generated in the resin gel 5 and the resin gel 5 from being peeled off from the adhered member. Further, the optical communication device 50e according to the sixth embodiment has an excellent merit that the number of parts can be reduced.

[Embodiment 7]
The basic structure and manufacturing method of the optical communication apparatus according to the seventh embodiment are the same as those of the sixth embodiment except for the following points. That is, in Embodiment 6 described above, the dam wall portion includes a plate-like wall portion disposed opposite to each other in plan view, and an LSI chip provided across a position facing these end portions. Although the optical sealing material dam is configured, in the seventh embodiment, the translucent sealing material dam is configured by a dam wall portion which is one wall portion and an LSI chip opposed thereto. Is different.

  FIG. 19 is a schematic cross-sectional view showing a part of an optical communication device 50f that is an optical device according to the seventh embodiment. In the seventh embodiment, a translucent sealing material dam 20f is constituted by a dam wall portion 10f including one wall portion and an LSI chip 3f facing the dam wall portion 10f.

  In the optical communication device 50f according to the seventh embodiment, since the resin reservoir spaces 14f and 15f are provided in the interior (enclosed space 12f) surrounded by the dam wall 10f and the LSI chip 3f, there is a temperature change. However, it is possible to prevent bubbles and cracks from being generated in the resin gel 5 and the resin gel 5 from being peeled off from the adhered member. In addition, the optical communication device 50f according to the seventh embodiment has an excellent merit that the number of components can be reduced.

  The above embodiment is an example, and various modifications can be made without departing from the spirit of the present invention. Moreover, the said embodiment can be applied suitably combining suitably.

  In the above embodiment, an example of an optical communication device has been given as an example of an optical device. However, the present invention can be widely applied to all optical devices in which a surface optical element is mounted on a support substrate.

  Moreover, the translucent cover can also have functions other than the function as a cover. For example, the translucent cover may have a lens function. By using the translucent cover 4 as a convex lens, the coupling efficiency between the surface optical element 2 and the optical fiber can be increased.

  Further, a light attenuating film that works as an optical attenuator on one or both surfaces of the translucent cover, a dielectric multilayer film that can obtain a filter effect, or the like may be deposited or adhered. As a result, the number of parts can be reduced, and further cost reduction can be achieved.

  In addition, the translucent sealing material dam according to the present invention is not limited to the configuration of the above embodiment, and the surface optical element and the translucent sealing material are disposed inside, and the upper surface of the damaging material dam is disposed on the upper surface. Various modifications are possible as long as it has a translucent sealing material reservoir space that abuts the translucent cover at the portion and absorbs the expansion and contraction of the translucent sealing material. .

  Moreover, in the said embodiment, although the example which applies resin gel as a translucent sealing material was given, this invention is not limited to resin gel, and is widely applied to translucent sealing material in general. can do. In the above embodiment, an example in which the resin gel is substantially filled in the entire area of the cover arrangement space in a room temperature environment has been described. However, the cover arrangement is within the scope of the present invention. The aspect in which the area | region where the resin gel is not filled in space exists may be sufficient. That is, it is possible to design so that a part of the cover arrangement space is used as a part of the resin reservoir space.

  Moreover, the arrangement | positioning position of a translucent cover can be variously comprised in the range which does not deviate from the meaning of this invention. In addition, although an example in which one side wall of one LSI chip is used as the dam wall portion, the side walls of a plurality of LSI chips can be used as the wall portion of the dam wall portion. Further, the LSI chip is an example, and other electronic components can be suitably used as the wall portion of the dam wall portion. Also, an LSI chip can be arranged in the step structure of the fifth embodiment, and the side wall of the LSI chip can be used as a wall portion of the dam wall. Moreover, the combination of the wall part which comprises the dam wall part separate from a support substrate, and the wall part which comprises the dam wall part of the level | step difference structure of a support substrate can also be applied suitably.

  Furthermore, in the above-described embodiment, the case where the use environment average temperature is room temperature has been described, but it is needless to say that it can be appropriately set according to the application. ADVANTAGE OF THE INVENTION According to this invention, a reliable optical apparatus can be provided within a use environment temperature range. Moreover, according to this invention, it can apply suitably for the use with a wide use environment temperature range.

Part or all of the above embodiment can be described as in the following supplementary notes, but is not limited thereto.
(Supplementary Note 1) A support substrate, a surface optical element disposed on the support substrate, a translucent cover disposed above the surface optical element, and covering at least the surface optical element. And the translucent sealing material filled between the planar optical element and the translucent cover, the planar optical element and the translucent sealing material are disposed inside, and A translucent encapsulant dam that is partially in contact with the translucent cover and includes a translucent encapsulant reservoir space that absorbs expansion and contraction of the translucent encapsulant; An optical device comprising:

(Additional remark 2) The said translucent sealing material is resin gel, The optical apparatus of Additional remark 1 characterized by the above-mentioned.

(Additional remark 3) The said translucent cover is provided over the upper surface of the wall part which the said translucent sealing material dam opposes at least, The optical apparatus of Additional remark 1 or 2 characterized by the above-mentioned.

(Additional remark 4) The said translucent sealing material reservoir space is provided in the area | region where the said translucent cover is not arrange | positioned, The optical apparatus of at least 1 of Additional remark 1-3 characterized by the above-mentioned.

(Additional remark 5) The said translucent sealing material is substantially filled with the whole area | region of the gap | interval of the said translucent cover and the said support substrate in the use environment average temperature vicinity. 5. The optical device according to at least one of.

(Additional remark 6) At least one part of the said translucent sealing material dam is a side wall of a semiconductor element, or the level | step difference side wall of a support substrate, The optical of any one of Claims 1-5 characterized by the above-mentioned. apparatus.

(Additional remark 7) The said translucent cover is a convex lens, The optical apparatus of any one of Additional remark 1-6 characterized by the above-mentioned.

(Additional remark 8) The said translucent cover is an attenuator by which the attenuation | damping film was vapor-deposited, The optical apparatus of any one of Additional remark 1-7 characterized by the above-mentioned.

  (Additional remark 9) A surface type optical element and a semiconductor element are mounted on a support substrate, a translucent sealing material dam is provided on the support substrate, and a part of the upper surface of the translucent sealing material dam is provided. A method for manufacturing an optical device, comprising: a translucent cover; and a translucent sealing material is injected from an open portion of the translucent sealing material dam where the translucent cover is not provided.

(Supplementary Note 10) A step structure portion is provided on a support substrate, and a planar optical element is disposed in the step structure portion.
A translucent cover is provided in a part of the upper surface of the step structure portion,
The manufacturing method of the optical apparatus which inject | pours a translucent sealing material from the open part of the said level | step difference structure part in which the said translucent cover is not provided.

(Additional remark 11) The said translucent cover is provided over the upper surface of the wall part which connects between the opposing wall part of the said translucent sealing material dam, and one end part of these wall parts. The optical device according to any one of appendices 1 to 8, wherein

(Supplementary Note 12) The planar optical element has a rectangular shape in plan view, and in the region sandwiched between the translucent cover and the support substrate, The minimum distance between the side surface of the planar optical element that is farthest from the region where the translucent cover is not disposed and the translucent sealing material dam is a, C is the minimum distance between the area where the translucent cover is not disposed and the side surface of the surface optical element closest thereto, and the other side surface of the surface optical element and the translucent sealing material dam. The optical apparatus according to appendix 11, wherein the following mathematical formula is satisfied, where b ₁ and b ₂ are the minimum distances:
(Formula) a <b ₁ <c, a <b ₂ <c

DESCRIPTION OF SYMBOLS 1 Support substrate 2 Planar type optical element 3 LSI chip 4 Translucent cover 5 Resin gel 10 Dam wall part 12 Enclosed space 13 Cover arrangement space 14 Resin reservoir space 15 Resin reservoir space 20 Translucent sealing material dam 50 Light Communication device

Claims (9)

A support substrate;
A planar optical element disposed on the support substrate;
A translucent cover disposed above the planar optical element;
A translucent sealing material covering at least the planar optical element and filled between the planar optical element and the translucent cover;
The surface-type optical element and the translucent sealing material are disposed inside, a part of the upper surface is in contact with the translucent cover, and the translucent sealing material is expanded and contracted. A translucent encapsulant dam having a translucent encapsulant reservoir space to absorb; and
An optical device comprising:   The optical device according to claim 1, wherein the translucent sealing material is a resin gel.   The optical device according to claim 1, wherein the translucent cover is provided across at least the upper surfaces of the opposing wall portions of the translucent sealing material dam.   The optical device according to claim 1, wherein the light-transmitting sealing material reservoir space is provided in a region where the light-transmitting cover is not provided.   The said translucent sealing material is substantially filled with the whole area | region of the gap | interval of the said translucent cover and the said support substrate in the use environment average temperature vicinity. The optical device according to at least one item.   The optical device according to claim 1, wherein at least a part of the translucent sealing material dam is a side wall of a semiconductor element or a stepped side wall of a support substrate.   The optical device according to claim 1, wherein the translucent cover is a convex lens.   The optical device according to claim 1, wherein the translucent cover is an attenuator on which an attenuation film is deposited. A surface optical element and a semiconductor element are mounted on a support substrate,
On the support substrate, a translucent sealing material dam is provided,
A translucent cover is provided in a part of the upper surface of the translucent sealing material dam,
The manufacturing method of the optical apparatus which inject | pours a translucent sealing material from the open part of the said translucent sealing material dam in which the said translucent cover is not provided.

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