JP2011199292A - Pattern form and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To principally provide a pattern form in which characteristics change to a finer pattern form, and a method of manufacturing the same.SOLUTION: The invention relates to the pattern form that has projection surfaces and recess regions formed on a surface thereof, and includes a resin layer characteristics of which change through action of a photocatalyst irradiated with energy, wherein side surfaces and bottom surfaces of the recess regions have characteristics different from those of the projection surfaces.

Description

  The present invention relates to a pattern forming body used for forming various functional parts such as a conductive pattern of a wiring board and a colored layer of a color filter, and a manufacturing method thereof.

  Conventionally, various methods have been proposed as a method for producing a pattern forming body for forming various patterns such as designs, images, characters, and circuits on a substrate. For example, lithographic printing, offset printing, and heat mode are proposed. A printing method for producing a lithographic printing original plate using a recording material is also used. In addition, for example, pattern exposure is performed on a photoresist layer coated on a substrate, and after exposure, the photoresist is developed and further etched, or the photoresist is exposed using a substance having functionality to the photoresist. There is also known a method of manufacturing a pattern forming body by photolithography, such as directly forming a target pattern by the above.

  However, when manufacturing a high-definition pattern forming body, the printing method has problems such as low positional accuracy, and is difficult to use. Further, in the photolithography method, there is a problem that a waste liquid needs to be processed because it is necessary to use a photoresist and to perform development or etching with a liquid developer after exposure. In addition, when a functional substance is used as a photoresist, there is a problem that it deteriorates due to an alkaline solution or the like used during development.

  Therefore, on the base material, a property changing layer whose properties are changed by the action of the photocatalyst accompanying the energy irradiation is formed and disposed facing the photocatalyst containing layer side substrate containing the photocatalyst, and then exposed from a predetermined direction. Thus, there is also proposed a method of manufacturing a pattern forming body that forms a pattern in which the characteristics of the characteristic change layer are changed (Patent Documents 1 and 2). According to this method, it is possible to produce a pattern forming body that can easily form a functional part by using the characteristics of the characteristic change layer by the action of the photocatalyst accompanying energy irradiation. In addition, there is an advantage that it is not necessary to use a developer or the like.

  However, in this case, there is a problem that it is difficult to form a pattern forming body having a fine pattern such as a fine line from the viewpoints of exposure accuracy and diffusion of active oxygen species generated by the action of the photocatalyst.

JP 2000-249821 A JP 2003-295428 A

  Therefore, it is desired to provide a pattern forming body having a pattern whose characteristics have been changed to a higher definition pattern and a method for manufacturing the same.

  The present invention has a resin layer in which a convex surface and a concave region are formed on the surface, and the characteristics change due to the action of a photocatalyst accompanying energy irradiation, and the side surface and the bottom surface of the concave region have characteristics different from the characteristics of the convex surface. There is provided a pattern forming body characterized by comprising:

  According to the present invention, since the characteristics of the side surface and the bottom surface of the concave region of the resin layer are different from the characteristics of the convex surface of the resin layer, the difference between these properties is used to make high definition only in the concave region. A functional part forming coating liquid for forming the functional part can be adhered. Therefore, it is possible to obtain a pattern forming body capable of forming the functional portion in a high-definition pattern along the pattern of the recessed area.

  In addition, the present invention provides a resin layer having a convex surface and a concave region formed on the surface and whose characteristics are changed by the action of a photocatalyst accompanying energy irradiation, a base and a photocatalyst-containing layer formed on the base and containing at least a photocatalyst And a photocatalyst-containing layer side substrate having an energy irradiation step of irradiating energy from a predetermined direction, wherein the convex surface of the resin layer and the photocatalyst-containing layer are in contact with each other. A manufacturing method is provided.

  According to the present invention, energy irradiation is performed in a state where the photocatalyst-containing layer and the convex surface of the resin layer are in contact with each other, so that only the bottom surface and the side surface of the concave region of the resin layer do not act on the convex surface. It can act as a photocatalyst. Therefore, it is possible to manufacture a pattern forming body having different characteristics between the convex surface of the resin layer and the bottom surface and side surfaces of the concave region, and to be able to form the functional portion with high definition along the pattern of the concave region. It can be done. In addition, according to the present invention, the resin layer has a concave region formed in a fine pattern because it is not affected by exposure accuracy during energy irradiation, diffusion of active oxygen species generated by the action of the photocatalyst, and the like. By using, there is also an advantage that a pattern forming body whose characteristics are changed into a fine pattern can be manufactured.

  According to the present invention, there is an effect that a pattern forming body capable of forming a functional part with high definition along the pattern of the recessed area can be obtained.

It is a schematic sectional drawing which shows an example of the pattern formation body of this invention. It is a schematic sectional drawing which shows the other example of the pattern formation body of this invention. It is process drawing which shows an example of the formation method of the resin layer used for this invention. It is a schematic sectional drawing which shows the other example of the pattern formation body of this invention. It is process drawing which shows an example of the manufacturing method of the pattern formation body of this invention.

  The present invention relates to a pattern forming body used for forming various functional parts such as a conductive pattern of a wiring board and a colored layer of a color filter, and a manufacturing method thereof. Each will be described below.

A. Pattern Forming Body First, the pattern forming body of the present invention will be described. The pattern forming body of the present invention has a resin layer in which a convex surface and a concave region are formed on the surface and whose characteristics change due to the action of a photocatalyst accompanying energy irradiation, and the side surface and the bottom surface of the concave region are the characteristics of the convex surface. It is characterized by having different characteristics.

  For example, as shown in FIG. 1 or FIG. 2, the pattern forming body of the present invention has a resin layer 1 in which a recessed area a and a convex surface b are formed, and the characteristics of the side surface c and the bottom surface d of the recessed area a are , Which is different from the characteristics of the convex surface b. Here, the convex surface refers to a surface that comes into contact with the substrate when the flat substrate is brought into contact with the resin layer. Moreover, the said recessed part area | region means area | regions other than a convex surface in the resin layer surface, and a recessed part area | region is comprised from a side surface and a bottom face.

  According to the present invention, since the characteristics of the side surface and the bottom surface of the concave region of the resin layer are different from the convex surface of the resin layer, the functional portion is used only in the concave region using the difference in the characteristics. It becomes possible to adhere the functional part-forming coating solution for forming. Therefore, a pattern forming body capable of forming the functional portion with high definition along the pattern of the recessed region can be obtained.

Further, according to the present invention, since the resin layer has a characteristic that changes due to the action of the photocatalyst accompanying energy irradiation, the convex surface of the resin layer is brought into contact with the photocatalyst-containing layer containing the photocatalyst. By exposing, the characteristics of the side surface and the bottom surface of the concave region of the resin layer can be changed, and the characteristic of the convex surface of the resin layer can be made different. Therefore, it is possible to obtain an efficiently manufactured pattern forming body without requiring a complicated process or a special apparatus.
Hereinafter, the pattern forming body of the present invention will be described in detail for each configuration.

1. Resin Layer First, the resin layer used in the present invention will be described. The resin layer used for this invention will not be specifically limited if a convex surface and a recessed area are formed in the surface, and a characteristic changes with the effect | actions of the photocatalyst accompanying energy irradiation.

  Here, the characteristic changes due to the action of the photocatalyst accompanying the energy irradiation means that when the photocatalyst-containing layer containing the photocatalyst is placed close to the resin layer and irradiated with energy, the photocatalyst accompanying the energy irradiation causes the action of the photocatalyst. The surface organic group is decomposed or modified to change the surface characteristics. In addition, the kind of characteristic change of the resin layer used in the present invention is not particularly limited, and for example, the organic group present on the surface of the resin layer is decomposed or modified to change the wettability. It may also be a material whose surface adhesiveness changes.

  In the present invention, among the above, the resin layer is particularly preferably a layer whose contact angle with the liquid on the surface is lowered by the action of the photocatalyst accompanying energy irradiation. Thus, a functional part that forms a functional part with high definition only in the concave region by utilizing the difference between the wettability of the convex surface of the resin layer and the wettability of the side surface and the bottom of the concave region of the resin layer. This is because the forming coating liquid can be adhered.

  Examples of the resin layer that changes wettability include polyethylene naphthalate (PEN), polyimide, polyethylene telenaphthalate, polyethersulfone, polyetheretherketone, fluorinated polyetheretherketone, and polyphenylenesulfin. Aramica (registered trademark), Torelina (registered trademark), a layer made of cyclic polyolefin, polyethylene terephthalate, polycarbonate, or the like, a wettability changing layer using an organopolysiloxane described in JP 2000-249821 A, etc. It can be the same layer.

  Here, in the present invention, it is preferable that the recessed region is recessed from the convex surface of the resin layer to a depth of 20 μm or less, particularly about 0.5 μm to 10 μm. By setting the depth of the recess in the recess region as described above, the photocatalyst-containing layer is brought into contact with the convex surface of the resin layer and irradiated with energy, thereby changing the characteristics of the side surface and the bottom surface of the recess region. This is because it becomes possible. In the present invention, the recessed region may have a portion or the like that is recessed from the depth, and may partially include a region whose characteristics are not changed by the action of the photocatalyst.

  In addition, the cross-sectional shape of the concave region is not particularly limited, and may be, for example, a rectangular shape, or may be a tapered shape having a narrow bottom surface of the concave region, a semicircular shape, or the like. Further, the inside of the recessed area may be flat as shown in FIG. 1, for example, or may be formed with unevenness as shown in FIG. The pattern of the recessed area is not particularly limited, and is appropriately selected depending on the use of the pattern forming body, the type of the functional part formed on the recessed area, and the like. Further, the width in which the recessed region is formed is appropriately selected according to the use of the pattern forming body, but is usually 0.1 μm or more, and preferably about 1 μm to 1000 μm. Further, the thickness of the resin layer and the like are appropriately selected.

  Further, the width of the convex surface is appropriately selected according to the use of the pattern forming body, but is usually 0.1 μm or more, preferably about 1 μm to 1000 μm. When the width of the convex surface is narrower than the above value, when the functional part is formed on the concave part of the pattern forming body, the functional parts formed in the adjacent concave parts may be connected to each other. is there.

  Here, in the present invention, the method for forming the resin layer in which the convex surface and the concave region as described above are formed is not particularly limited. For example, a flat layer made of the material as described above may be formed by patterning by a photolithography method. For example, on a base material formed in a shape similar to the shape of the convex surface and the concave region, What formed by apply | coating the coating liquid for resin layer formation containing the said material may be sufficient. Particularly in the present invention, for example, as shown in FIG. 3, a flat ultraviolet curable resin layer 1 ′ is formed by applying an ultraviolet curable resin composition containing the above-described material on the substrate 2. (FIG. 3 (a)), this ultraviolet curable resin layer 1 ′ is exposed by being in close contact with a mold 10 having a shape in which the shape of the convex surface and the concave region to be formed and the concave and convex shapes are reversed (FIG. 3 (b)). The resin layer 1 is preferably formed (FIG. 3C). This is because the recessed area can be formed in a fine pattern, and the resin layer can be efficiently formed without going through a complicated process.

  The method for changing the characteristics of the side surface and the bottom surface of the concave region of the resin layer used in the present invention will be described in detail in the section of “B. Method for producing pattern formed body” described later. Omitted.

2. Pattern Forming Body The pattern forming body of the present invention can be used, for example, to produce a color filter that forms a colored layer using the difference between the wettability of the bottom surface and the side surface of the concave region and the wettability of the convex surface, It can be used for manufacturing a functional element having various functional parts, such as manufacturing a wiring board that forms a conductive pattern using the difference. The pattern formed body of the present invention is particularly useful for the production of a functional element having a fine functional part.

  Here, the pattern-formed body of the present invention is not particularly limited as long as it has the resin layer, and for example, as shown in FIG. For example, as shown in FIG. 4, it may be composed of a base material 2 and a resin layer 1. Moreover, what has a light-shielding part etc. on a base material etc. may be sufficient as needed. Hereinafter, the base material used in the present invention will be described.

(Base material)
The base material used in the present invention is appropriately selected according to the use of the pattern forming body and the like, and can be the same as that used as a base material for a general pattern forming body. Further, the transparency, flexibility, heat resistance, insulation and the like of the substrate are not particularly limited, and are appropriately selected according to the use of the pattern forming body. Specific examples of such a substrate include a paper laminate resin laminate, a glass cloth / glass nonwoven fabric resin laminate, ceramic, metal, and the like.

  Moreover, in this invention, although a base material may be flat, as above-mentioned, it may have the same unevenness | corrugation as the convex surface and recessed part area | region of a resin layer. The method for forming such a convex surface and a concave region can be the same as the method described in the section of the resin layer.

B. Next, the manufacturing method of the pattern formation body of this invention is demonstrated. The method for producing a pattern-formed body of the present invention comprises a resin layer having a convex surface and a concave region formed on the surface and having characteristics changed by the action of a photocatalyst upon energy irradiation, a base and the base, and at least a photocatalyst. A photocatalyst containing layer side substrate having a photocatalyst containing layer is disposed so that the convex surface of the resin layer and the photocatalyst containing layer are in contact with each other, and has an energy irradiation step of irradiating energy from a predetermined direction. It is a method to do.

  For example, as shown in FIG. 5, a method for producing a pattern forming body of the present invention prepares a photocatalyst containing layer side substrate 13 having a base 11 and a photocatalyst containing layer 12 formed on the base 11 (FIG. )) After arranging the convex surface b of the resin layer 1 having the convex surface b and the concave region a on the surface and the photocatalyst containing layer 12 of the photocatalyst containing layer side substrate 13 in contact with each other, energy from a predetermined direction 20 (FIG. 5 (b)) and changing the characteristics of the side surface c and the bottom surface d of the recessed region a of the resin layer 1 (FIG. 5 (c)). In addition, the recessed area | region and convex surface of the said resin layer are the same as that of what was demonstrated by "A. pattern formation body" mentioned above.

  Here, when a flat resin layer and the photocatalyst-containing layer side substrate are arranged to face each other, and a pattern forming body is formed by irradiating energy in a pattern using a photomask or the like, the action of the photocatalyst There is a problem that it is difficult to form a fine pattern such as a fine line due to diffusion of the generated active oxygen species.

On the other hand, according to the present invention, since the convex surface of the resin layer and the photocatalyst containing layer are brought into contact with each other and irradiated with energy, the characteristic of the convex surface of the resin layer in contact with the photocatalyst containing layer does not change, Further, the generated active oxygen species can be spread only in the recessed region of the resin layer. Therefore, the characteristics of only the side surface and the bottom surface of the recessed area can be changed, and the characteristics of the convex surface and the characteristics of the side surface and the bottom surface of the recessed area can be made different. Further, according to the present invention, even when the recessed area is formed in a fine pattern, it is possible to change the characteristics of only the side surface and the bottom surface of the recessed area, and the shape of the recessed area Therefore, it is possible to manufacture a pattern forming body capable of forming the functional part with high definition.
Hereinafter, the energy irradiation process of the present invention will be described in detail.

1. Energy irradiation process The energy irradiation process of the present invention includes a resin layer in which convex and concave regions are formed on the surface and whose characteristics are changed by the action of the photocatalyst accompanying the energy irradiation, the base and the base, and contains at least a photocatalyst The photocatalyst containing layer side substrate having the photocatalyst containing layer is disposed so that the convex surface of the resin layer and the photocatalyst containing layer are in contact with each other, and is irradiated with energy from a predetermined direction.
Hereinafter, the resin layer, the photocatalyst-containing layer side substrate, and the energy irradiation method used in this step will be described.

a. Resin layer The resin layer used in this step is not particularly limited as long as a convex surface and a concave region are formed on the surface and the characteristics are changed by the action of the photocatalyst accompanying energy irradiation.

  In the present invention, the type of property change is not particularly limited, and may be, for example, a layer in which wettability is changed by decomposition or modification of an organic group present on the surface of the resin layer. The adhesiveness may be changed by decomposing or modifying the group. The material of such a resin layer, the shape of the convex surface and the concave region, the formation method, and the like can be the same as those described in the above section “A. Pattern formation body”. Detailed description is omitted.

b. Next, the photocatalyst containing layer substrate used in this step will be described. The photocatalyst-containing layer side substrate used in this step has a photocatalyst-containing layer containing a photocatalyst and a substrate, and usually has a photocatalyst-containing layer formed on the substrate. Hereinafter, each structure of the photocatalyst containing layer side board | substrate used for this process is demonstrated.

(1) Photocatalyst containing layer First, the photocatalyst containing layer used for a photocatalyst containing layer side board | substrate is demonstrated. The photocatalyst-containing layer used in this step is not particularly limited as long as the photocatalyst in the photocatalyst-containing layer can change the characteristics of the adjacent resin layer, and is composed of a photocatalyst and a binder. It may be a film formed with a single photocatalyst. Further, the surface characteristics may be particularly lyophilic or lyophobic.

Examples of the photocatalyst contained in the photocatalyst-containing layer used in the present invention include those known as semiconductors such as titanium dioxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), strontium titanate (SrTiO ₃ ), Mention may be made of tungsten oxide (WO ₃ ), bismuth oxide (Bi ₂ O ₃ ), and iron oxide (Fe ₂ O ₃ ). In addition to semiconductors, metal complexes and silver can also be used. In this invention, it can select from these and can use 1 type or in mixture of 2 or more types.

  In the present invention, titanium dioxide is particularly preferably used because it has a high band gap energy, is chemically stable, has no toxicity, and is easily available. Titanium dioxide includes an anatase type and a rutile type, and both can be used in the present invention, but anatase type titanium dioxide is preferred. Anatase type titanium dioxide has an excitation wavelength of 380 nm or less.

  Examples of such anatase type titanium dioxide include hydrochloric acid peptizer type anatase type titania sol (STS-02 manufactured by Ishihara Sangyo Co., Ltd. (average particle size 7 nm), ST-K01 manufactured by Ishihara Sangyo Co., Ltd.), nitric acid solution An anatase type titania sol (TA-15 manufactured by Nissan Chemical Co., Ltd. (average particle size 12 nm)) and the like can be mentioned.

  Further, a visible light responsive type may be used as the titanium oxide. Visible light responsive titanium oxide is also excited by the energy of visible light. Examples of such a visible light responsive method include a method of nitriding titanium oxide.

When titanium oxide (TiO ₂ ) is subjected to nitriding treatment, a new energy level is formed inside the band gap of titanium oxide (TiO ₂ ), and the band gap is narrowed. As a result, the excitation wavelength of titanium oxide (TiO ₂ ) is usually 380 nm, but it can be excited even by visible light having a longer wavelength than the excitation wavelength. As a result, the wavelength in the visible light region of energy irradiation from various light sources can also contribute to the excitation of titanium oxide (TiO ₂ ), so that it is possible to further increase the sensitivity of titanium oxide. .

Here, the nitriding treatment of titanium oxide referred to in the present invention is a treatment for replacing part of the oxygen sites of the titanium oxide (TiO ₂ ) crystal with nitrogen atoms, or between the lattices of the titanium oxide (TiO ₂ ) crystal. A treatment of doping nitrogen atoms or a treatment of arranging nitrogen atoms at the grain boundaries of a polycrystalline aggregate of titanium oxide (TiO ₂ ) crystals.

The method of nitriding titanium oxide (TiO ₂ ) is not particularly limited. For example, crystalline titanium oxide fine particles are doped with nitrogen by heat treatment at 700 ° C. in an ammonia atmosphere, and the nitrogen is doped. Examples thereof include a method of forming a dispersion using fine particles and an inorganic binder, a solvent, or the like.

  The smaller the particle size of the photocatalyst, the more effective the photocatalytic reaction occurs. The average particle size is preferably 50 nm or less, and the photocatalyst of 20 nm or less is particularly preferable.

  Examples of a method for forming a photocatalyst-containing layer composed only of a photocatalyst include a method using a vacuum film forming method such as a sputtering method, a CVD method, or a vacuum deposition method. By forming the photocatalyst-containing layer by a vacuum film forming method, it is possible to obtain a photocatalyst-containing layer that is a uniform film and contains only the photocatalyst. Moreover, in this case, since it consists only of a photocatalyst, the characteristic of the recessed part area | region of a resin layer can be changed efficiently compared with the case where a binder is used.

  In addition, as another example of a method for forming a photocatalyst-containing layer composed only of a photocatalyst, for example, when the photocatalyst is titanium dioxide, amorphous titania is formed on a substrate, and then the phase is changed to crystalline titania by firing. Is mentioned. As the amorphous titania used here, for example, hydrolysis, dehydration condensation, tetraethoxytitanium, tetraisopropoxytitanium, tetra-n-propoxytitanium, tetrabutoxytitanium, titanium inorganic salts such as titanium tetrachloride and titanium sulfate, An organic titanium compound such as tetramethoxytitanium can be obtained by hydrolysis and dehydration condensation in the presence of an acid. Next, it can be modified to anatase titania by baking at 400 ° C. to 500 ° C. and modified to rutile type titania by baking at 600 ° C. to 700 ° C.

  Moreover, when using a binder, what has the high bond energy that the main frame | skeleton of a binder is not decomposed | disassembled by photoexcitation of said photocatalyst is preferable, for example, organopolysiloxane etc. can be mentioned.

  When organopolysiloxane is used as a binder in this way, the photocatalyst-containing layer is prepared by dispersing the photocatalyst and the binder organopolysiloxane in a solvent together with other additives as necessary. The coating solution can be formed by coating on a substrate. As the solvent to be used, alcohol-based organic solvents such as ethanol and isopropanol are preferable. The application can be performed by a known application method such as spin coating, spray coating, dip coating, roll coating, or bead coating. When an ultraviolet curable component is contained as a binder, the photocatalyst-containing layer can be formed by irradiating with ultraviolet rays and performing a curing treatment.

An amorphous silica precursor can be used as the binder. This amorphous silica precursor is represented by the general formula SiX _4, X is a halogen, a methoxy group, an ethoxy group or a silicon compound an acetyl group or the like, and silanol or average molecular weight of 3,000 or less, their hydrolysates Polysiloxane is preferred.

  Specific examples include tetraethoxysilane, tetraisopropoxysilane, tetra-n-propoxysilane, tetrabutoxysilane, and tetramethoxysilane. In this case, the amorphous silica precursor and the photocatalyst particles are uniformly dispersed in a non-aqueous solvent, hydrolyzed with moisture in the air on the substrate to form silanol, and then at room temperature. A photocatalyst-containing layer can be formed by dehydration condensation polymerization. If dehydration condensation polymerization of silanol is carried out at 100 ° C. or higher, the degree of polymerization of silanol increases and the strength of the film surface can be improved. Moreover, these binders can be used individually or in mixture of 2 or more types.

  When the binder is used, the content of the photocatalyst in the photocatalyst containing layer can be set in the range of 5 to 60% by weight, preferably 20 to 40% by weight. The thickness of the photocatalyst containing layer is preferably in the range of 0.05 to 10 μm.

  In addition to the photocatalyst and the binder, the photocatalyst containing layer can contain a surfactant. Specifically, hydrocarbons such as NIKKOL BL, BC, BO, BB series manufactured by Nikko Chemicals Co., Ltd., ZONYL FSN, FSO manufactured by DuPont, Surflon S-141, 145 manufactured by Asahi Glass Co., Ltd., Dainippon Megafac F-141, 144 manufactured by Ink Chemical Industry Co., Ltd., Footgent F-200, F251 manufactured by Neos Co., Ltd., Unidyne DS-401, 402 manufactured by Daikin Industries, Ltd., Fluorard FC-170 manufactured by 3M Co., Ltd. Fluorine-based or silicone-based nonionic surfactants such as 176, and cationic surfactants, anionic surfactants, and amphoteric surfactants can also be used.

  In addition to the above surfactants, the photocatalyst-containing layer includes polyvinyl alcohol, unsaturated polyester, acrylic resin, polyethylene, diallyl phthalate, ethylene propylene diene monomer, epoxy resin, phenol resin, polyurethane, melamine resin, polycarbonate, Polyvinyl chloride, polyamide, polyimide, styrene butadiene rubber, chloroprene rubber, polypropylene, polybutylene, polystyrene, polyvinyl acetate, polyester, polybutadiene, polybenzimidazole, polyacrylonitrile, epichlorohydrin, polysulfide, polyisoprene, oligomers, polymers, etc. It can be included.

(2) Substrate Next, the substrate used for the photocatalyst-containing layer side substrate will be described. In the present invention, as shown in FIG. 5, the photocatalyst-containing layer side substrate has at least a base 11 and a photocatalyst-containing layer 12 formed on the base 11.

  The substrate used in the present invention is not particularly limited as long as the photocatalyst-containing layer can be formed. For example, the substrate may be a flexible resin film or the like. What does not have, for example, a glass substrate etc. may be sufficient.

  An intermediate layer may be formed on the substrate in order to improve the adhesion between the substrate surface and the photocatalyst-containing layer and to prevent deterioration of the substrate due to the action of the photocatalyst. Examples of such an intermediate layer include silane-based and titanium-based coupling agents, silica films prepared by a reactive sputtering method, a CVD method, and the like.

c. Next, the energy irradiation method in this step will be described. In this step, the convex surface of the resin layer and the photocatalyst containing layer of the photocatalyst containing layer side substrate are arranged in contact with each other and irradiated with energy.

  Here, arranging the photocatalyst-containing layer and the convex surface of the resin layer in contact with each other means that the photocatalyst-containing layer and the resin layer are arranged so that the photocatalyst does not act on the convex surface of the resin layer during energy irradiation. For example, the photocatalyst-containing layer and the convex surface of the resin layer may be pressed and arranged, or the photocatalyst-containing layer and the convex surface of the resin layer may be arranged so as to be in light contact with each other. In the present invention, such an arrangement state of the photocatalyst-containing layer side substrate only needs to be maintained at least during the energy irradiation.

  The energy irradiation (exposure) referred to in the present invention is a concept including irradiation of any energy ray that can change the characteristics of the side surface and the bottom surface of the concave portion of the resin layer by a photocatalyst. It is not limited to irradiation.

  Usually, the wavelength of light used for such energy irradiation is set in the range of 400 nm or less, preferably in the range of 150 nm to 380 nm. This is because, as described above, the preferred photocatalyst used in the photocatalyst-containing layer is titanium dioxide, and light having the above-described wavelength is preferable as the energy for activating the photocatalytic action by the titanium dioxide.

  Examples of light sources that can be used for such energy irradiation include mercury lamps, metal halide lamps, xenon lamps, excimer lamps, and other various light sources. In the present invention, the entire surface can be used without using a photomask or the like. Can be irradiated with energy. In addition to the above-described method of irradiating energy using a light source, it is also possible to use a method of drawing and irradiating in a pattern using a laser such as excimer or YAG.

  Here, the amount of energy irradiation at the time of energy irradiation is an amount of irradiation necessary for changing the characteristics of the side surface and bottom surface of the concave region of the resin layer due to the action of the photocatalyst in the photocatalyst containing layer. Further, at this time, it is preferable in that the photocatalyst-containing layer is irradiated with energy while heating so that the sensitivity can be increased and the characteristics can be changed efficiently. Specifically, it is preferable to heat within a range of 30 ° C to 80 ° C.

2. In addition, in the present invention, not only the above-described energy irradiation step, but also a step of adjusting the shape of the resin layer, for example, a step of forming a light-shielding portion or the like on the substrate, as necessary, may be included. Good.

  In addition, the pattern formed body manufactured according to the present invention has a colored layer in the recessed area by utilizing, for example, the difference between the wettability of the side surface and the bottom surface of the recessed area of the resin layer and the wettability of the protruded surface of the resin layer. Various functionalities such as the production of color filters to be formed, the production of microlenses that form lenses using the above differences in characteristics, and the production of wiring boards that form conductive patterns using the above differences in characteristics It can be used for the manufacture of a functional element having a part

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

The following examples illustrate the present invention more specifically.
[Example 1]
(Formation of patterning substrate)
The following components were mixed to prepare an ultraviolet curable resin mixed solution.
-70 parts by mass of urethane oligomer-30 parts by mass of dipentaerythritol hexaacrylate-20 parts by mass of hexanediol diacrylate-20 parts by mass of N-vinylpyrrolidone-5 parts by mass of 1-hydroxycyclohexyl phenyl ketone-dimethylpolysiloxane polyether-modified silicone 0 0.7 parts by mass The above ultraviolet curable resin mixed solution was dropped onto an original plate on which a line width and a space width were both 50 μm and a concavo-convex pattern having a depth of 1 μm was formed. After superposing an easy-adhesion PET film as a base material on the UV curable resin mixed solution, the UV curable resin mixed solution is cured by irradiating 600 mJ / cm ² (365 nm) of UV light using a high pressure mercury lamp. A resin layer was obtained. Thereafter, the original plate was peeled off to obtain a patterning substrate on which the uneven pattern having a depth of 1 μm was completely transferred.

(Preparation of photocatalyst-containing layer side substrate)
A composition for forming a primer layer prepared by mixing the following components on quartz glass (substrate) and stirring for 24 hours at a temperature of 25 ° C. was applied. Thereafter, heating was performed at a temperature of 120 ° C. for 20 minutes to form a primer layer having a thickness of 0.1 μm.
・ 0.1N hydrochloric acid aqueous solution 50g
・ Tetramethoxysilane 100g
Next, a photocatalyst inorganic coating agent containing titanium dioxide (product name “ST-K03” manufactured by Ishihara Sangyo Co., Ltd.) was applied on the primer layer, heated at 150 ° C. for 20 minutes, and a film thickness of 0.15 μm. A photocatalyst containing layer side substrate having a photocatalyst containing layer was formed.

(Preparation of pattern formed body)
Subsequently, the resin layer of the patterning substrate and the photocatalyst containing layer of the photocatalyst containing layer side substrate described above are brought into close contact with each other, and an ultraviolet ray having a wavelength of 365 nm is irradiated from the photocatalyst containing layer side with an illuminance of 20 mW / cm ^2. A pattern formed body was produced.
(Formation of functional part)
When an Ag nanoparticle paste (manufactured by Fujikura Kasei Co., Ltd.) was applied on the unevenness of the resin layer of the pattern forming body with an applicator, it was possible to selectively apply the Ag nanoparticle paste to the recesses. Finally, the Ag nanoparticle paste was dried at 160 ° C. for 30 minutes to produce an Ag wiring in the concave portion of the pattern forming body.

[Example 2]
A pattern forming body was produced in the same manner as in Example 1. Thereafter, a cleaner conditioner (CD-202, manufactured by Uemura Kogyo Co., Ltd.) was adjusted to a concentration of 50 ml / L, and the pattern forming body was washed at a temperature of 60 ° C. for 5 minutes. Thereafter, it was washed with pure water, further acid-washed with sulfuric acid having a concentration of 50 ml / L for 1 minute at room temperature, and finally washed with pure water.
Subsequently, PED-104 (manufactured by Uemura Kogyo Co., Ltd.) was adjusted to a concentration of 270 g / L, and the pattern formed body was pre-dipped at room temperature for 1 minute.
Next, the pattern forming body is immersed at 25 ° C. for 8 minutes in a mixture of PED-104 (manufactured by Uemura Kogyo Co., Ltd.) with a concentration of 270 g / L and AT-105 (manufactured by Uemura Kogyo Co., Ltd.) with a concentration of 30 ml / L. The Pd—Sn catalyst was adsorbed on the surface of the resin layer and washed with pure water.
Next, after activating the Pd-Sn catalyst adsorbed on the resin layer of the pattern forming body by immersing the pattern forming body in AL-106 (manufactured by Uemura Kogyo Co., Ltd.) having a concentration of 100 ml / L for 3 minutes. Washed with pure water. As standard baths for electroless copper plating, pure water 71.9 vol%, sulcup PEA-6A 10.0 vol%, sulcup PEA-6B 10.0 vol%, sulcup PEA-6C 1.4 vol%, and sulcup PEA-6D 1.2 vol%, Sulcup PEA-6E 5.0 vol%, 37% formaldehyde 0.5 vol% were mixed. The pattern forming body was immersed in the bath solution at 34 ° C. for 5 minutes, and washed with water and alcohol.
As a result, copper was selectively plated only on the recess, and a copper wiring could be produced in the recess.

DESCRIPTION OF SYMBOLS 1 ... Resin layer 2 ... Base material 11 ... Base | substrate 12 ... Photocatalyst containing layer 13 ... Photocatalyst containing layer side board | substrate 20 ... Energy a ... Concave area b ... Convex surface c ... Side surface d ... Bottom

Claims (1)

  A convex surface and a concave region are formed on the surface, and has a resin layer whose characteristics are changed by the action of a photocatalyst due to energy irradiation, and the side surface and the bottom surface of the concave region have characteristics different from the characteristics of the convex surface. A pattern forming body.

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