JP2011197390A - Optical element holding body, optical device, and projector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical element holding body which achieves improvement of cooling efficiency, and an optical device and a projector.SOLUTION: A panel holding body includes a liquid circulating tube 51 which is disposed along a periphery of a liquid crystal panel 341 and inside which a cooling liquid for cooling the liquid crystal panel 341 circulates, and a panel supporting frame 52 which has an aperture 521C corresponding to a light transmission area of the liquid crystal panel 341 and supports the liquid crystal panel 341. The panel supporting frame 52 includes an incident side supporting frame 52A and an emitting side supporting frame 52B which are formed by being divided by a plane nearly parallel with a circulating direction of the cooling liquid in the liquid circulating tube 51, and interpose the liquid circulating tube 51 in between. The supporting frames 52A and 52B and the liquid circulating tube 51 are bonded with solder. The emitting side supporting frame 52B has a through-hole 522B1 and a notched part 522B2 for accumulating the solder which exceeds volume of space between the emitting side supporting frame 52B and the liquid circulating tube 51.

Description

  The present invention relates to an optical element holder that holds an optical element, an optical device, and a projector.

Conventionally, there has been known a projector including a light source device, a light modulation device that modulates a light beam emitted from the light source device according to image information to form image light, and a projection optical device that enlarges and projects the image light. (For example, refer to Patent Document 1).
Specifically, the light modulation device described in Patent Document 1 includes a liquid crystal panel in which liquid crystal is hermetically sealed between a first substrate and a second substrate, and a panel holder that holds the liquid crystal panel. The panel holding body includes a holding frame having an attachment member and a support frame, and a flow pipe that is sandwiched between the attachment member and the support frame and through which the cooling liquid flows. Among these, the groove | channel according to the shape of a flow pipe is formed in the mutually opposing surface of an attachment member and a support frame.
Accordingly, the flow pipe is fitted in the grooves of the attachment member and the support frame, respectively, and connected to the attachment member and the support frame so as to be able to transfer heat. In joining the mounting member and the support frame to the flow pipe, solder having thermal conductivity is often used.

JP 2010-2683 A

  By the way, in order to improve the heat transfer performance between the flow pipe and the mounting member and the support frame, and to improve the cooling efficiency of the liquid crystal panel, in the space formed between the flow pipe and the mounting member and the support frame, It is required that air is not mixed. For this reason, it is desirable that the mounting member and the groove of the support frame be filled with solder closely.

  An object of the present invention is to provide an optical element holder, an optical device, and a projector that can improve cooling efficiency.

  The optical element holder of the present invention is an optical element holder that holds an optical element that converts the optical characteristics of an incident light beam, and is disposed along at least a part of the periphery of the optical element. A liquid circulation pipe through which a cooling liquid for cooling the element circulates; and an optical element support frame having an opening corresponding to a light transmission region of the optical element and supporting the optical element, the optical element support The frame is divided and formed in a plane substantially parallel to the flow direction of the cooling liquid in the liquid flow pipe, and includes a first support frame and a second support frame that sandwich the liquid flow pipe, the first support frame, The second support frame and the liquid flow pipe are joined by solder, and at least one of the first support frame and the second support frame is between the support frame and the liquid flow pipe. The solder that exceeds the volume of the space It characterized by having a solder storage unit for product.

According to the present invention, the first support frame supporting the optical element, the second support frame, and the liquid circulation pipe through which the cooling liquid for cooling the optical element flows are joined by solder.
Incidentally, the heat generated in the optical element is transmitted to each support frame. Since each support frame is joined to the liquid circulation pipe by solder, the heat transmitted from the optical element is transmitted to the liquid circulation pipe through which the cooling liquid flows through the solder. Here, in order to make this heat transfer better, as described above, air is introduced into the space between each support frame and the liquid circulation pipe (in the following description, the space is described as a solder-filled space). Therefore, if a large amount of solder is densely filled in the solder filling space, heat transfer can be further enhanced.
Therefore, since at least one of the first support frame and the second support frame has a solder accumulation portion that accumulates solder exceeding the volume of the solder filling space, the volume of the solder filling space in the solder filling space. Even when a large amount of solder exceeding the above is injected, the solder overflowing from the solder filling space is accumulated in the solder accumulation portion. According to this, mixing of air can be suppressed in the solder filling space, and a large amount of solder can be densely filled in the solder filling space. Therefore, heat conduction between the first support frame and the second support frame and the liquid circulation pipe can be increased, and the cooling efficiency of the optical element can be improved.

  In the present invention, the solder accumulating unit may be configured such that when the liquid flow pipe is sandwiched between the first support frame and the second support frame, the first support frame, the second support frame, and the liquid flow pipe It is preferable that the first support frame and the second support frame communicate with a space formed between the first support frame and the second support frame.

Here, the solder material generally contains a solvent such as volatile flux. For this reason, for example, in a reflow process when each support frame and the liquid circulation pipe are joined by solder, the solvent contained in the solder volatilizes, and gas may accumulate in the solder filling space. Since such a gas has low thermal conductivity, if the gas accumulates in the solder-filled space, the thermal conductivity between each support frame and the liquid circulation pipe is reduced.
On the other hand, according to the present invention, since the through hole communicates the solder filling space and the outside of the support frame, in the reflow process, when the solvent volatilizes when joining each support frame and the liquid circulation pipe However, the gas accumulated in the solder filling space can be discharged to the outside through the through hole. Accordingly, gas can be prevented from accumulating in the solder filling space, so that the metal components constituting the solder can be closely packed between each support frame and the liquid circulation pipe, and heat from the support frame to the liquid circulation pipe can be obtained. Conductivity can be improved.

By the way, if a large amount of solder is filled in the solder filling space, the solder may leak to the outside when connecting each support frame and the flow pipe. And when attaching an optical element to an optical element holding body, since there exists a possibility that the leaked solder may adhere to an optical element, the process of wiping off the leaked solder is needed, and workability | operativity worsens.
On the other hand, according to the present invention, the through hole communicates the solder filling space with the outside of the support frame. According to this, even when a large amount of solder is injected into the solder filling space, the solder overflowing from the solder filling space can be accumulated in the through hole. Therefore, by injecting a large amount of solder into the solder filling space, even if the solder overflows from the through hole, the solder accumulated in the through hole can be reduced to a small amount, so the process of wiping the solder is simplified. Workability can be improved.

  In the present invention, it is preferable that the through hole is formed on a surface different from a surface facing the optical element in at least one of the first support frame and the second support frame.

  According to the present invention, since the through hole is formed on a surface different from the surface facing the optical element in the support frame, the solder adheres to the optical element even when the solder overflows from the through hole. Can be prevented.

  In the present invention, the first support frame and the second support frame include connection surfaces that are connected to each other, and the solder accumulation portion is configured by a cutout portion that is formed on at least one of the connection surfaces. It is preferable.

As described above, since each support frame and the liquid circulation pipe are connected by soldering, there is a possibility that the solder overflows from between the connection surfaces of the support frames connected to each other.
According to this invention, the notch part which comprises a solder storage part is formed in the connection surface of each support frame. According to this, even when the solder injected into the solder filling space overflows between the connection surfaces of the respective support frames, the solder accumulates in the notches formed on the connection surfaces, so that the overflowed solder is wiped off. Work can be simplified and workability can be improved. Accordingly, a large amount of solder can be densely filled in the solder filling space, the thermal conductivity between each support frame and the liquid circulation pipe can be further increased, and the cooling efficiency of the optical element can be further improved.
Further, even when such a notch is formed on the surface and the connection surface facing the optical element in the support frame, since the solder accumulates in the notch, the solder adheres to the optical element. Can be suppressed.

An optical device according to the present invention includes an optical element that converts optical characteristics of an incident light beam, and the above-described optical element holder that holds the optical element.
According to the present invention, since the optical element holder described above is provided, an optical device that exhibits the same effect as the optical element holder described above can be realized.

The projector of the present invention includes a light source device, an optical element that converts an optical characteristic of an incident light beam, an optical device that includes the above-described optical element holder that holds the optical element, and an image formed by the optical device. A projection optical device for projecting light, wherein the optical element is a light modulation element for modulating an incident light beam.
According to the present invention, since the above-described optical device is provided, it is possible to realize a projector that exhibits the same effect as the above-described effect.

FIG. 2 is a diagram illustrating a schematic configuration of a projector according to the present embodiment. The figure which shows typically the structure of the liquid cooling device in the said embodiment. The perspective view which shows the structure of the holding body main body of the panel holding body in the said embodiment. The disassembled perspective view of the panel holding body in the embodiment. The longitudinal cross-sectional view of the holding body main body in the said embodiment. The cross-sectional view of the holding body main body in the embodiment. The disassembled perspective view of the holding body main body in the embodiment. The top view of the output side support frame in the said embodiment. The longitudinal cross-sectional enlarged view which expanded the principal part of the panel holding body in the said embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[Projector configuration]
FIG. 1 is a diagram illustrating a schematic configuration of a projector 1 according to the present embodiment.
The projector 1 forms image light according to image information input from an external device or the like, projects the image light on a screen (not shown), and displays a projected image. As shown in FIG. 1, the projector 1 has a configuration in which an optical unit 3 and a liquid cooling device 4 (see FIG. 2) are housed inside an exterior housing 2.

[Configuration of optical unit]
The optical unit 3 optically processes a light beam emitted from a light source to form image light corresponding to image information under the control of a control device (not shown).
As shown in FIG. 1, the optical unit 3 includes a pair of light source devices 31A and 31B, a reflection mirror 31C, lens arrays 321, 322, a polarization conversion element 323, and an illumination optical device 32 having a superimposing lens 324. A color separation optical device 33 having dichroic mirrors 331 and 332, and reflection mirrors 333 to 336, and three liquid crystal panels 341 as optical elements (the liquid crystal panel on the red light side is 341R, the liquid crystal panel on the green light side is 341G, and the blue color is blue) The light-side liquid crystal panel is referred to as 341B), an optical device 34 having three incident-side polarizing plates 342, three outgoing-side polarizing plates 343, and a cross dichroic prism 344, a projection optical device 35, and each of these members 31A, 31B, and an optical component housing 36 that houses 32 to 34 therein.

As shown in FIG. 1, the pair of light source devices 31 </ b> A and 31 </ b> B has the same configuration, and includes a light source lamp 311 and a reflector 312. And a pair of light source device 31A, 31B is opposingly arranged on both sides of the reflective mirror 31C so that a light beam may be emitted toward the reflective mirror 31C.
In the optical unit 3, with the configuration described above, the light beams emitted from the pair of light source devices 31A and 31B are reflected by the reflecting mirror 31C along the illumination optical axis A set inside the optical component casing 36. Then, the illumination optical device 32 is irradiated. The light beam applied to the illumination optical device 32 is made uniform in in-plane illuminance by the illumination optical device 32 and separated into three color lights of R, G, and B by the color separation optical device 33. Each separated color light is modulated by each liquid crystal panel 341 according to image information, and an image for each color light is formed. The image for each color light is synthesized by the prism 344 and projected onto the screen by the projection optical device 35.

[Configuration of liquid cooling device]
FIG. 2 is a diagram schematically showing the configuration of the liquid cooling device 4.
The liquid cooling device 4 circulates a cooling liquid such as water or ethylene glycol along the annular flow path, and cools the liquid crystal panel 341 with the cooling liquid. As shown in FIG. 2, the liquid cooling device 4 includes three panel holders 5 (optical element holders), a liquid pumping unit 6, a tank 7, a heat exchange unit 8, and a plurality of liquid circulation members 9. With.
Here, although the illustration of a specific configuration of the tank 7 is omitted, the tank 7 includes an inflow portion and an outflow portion into which the cooling liquid flows, and flows out after temporarily accumulating the cooling liquid flowing in from the inflow portion. Out of the club. The tank 7 is formed of a metal material such as aluminum, and is configured by a substantially rectangular parallelepiped hollow member.
The plurality of liquid circulation members 9 are constituted by tubular members that allow the cooling liquid to flow therein, and connect the members 5 to 8 to form an annular flow path. In addition, the connection structure of each member 5-8 by the liquid circulation member 9 is mentioned later.
The specific configuration of the panel holder 5 will be described later.

[Configuration of liquid pumping unit]
The liquid pumping unit 6 is a pump that sucks and pumps the cooling liquid, and circulates the cooling liquid along an annular flow path.
The liquid pumping unit 6 has, for example, a configuration in which an impeller is disposed in a hollow member, and sucks and pumps the cooling liquid as the impeller rotates.
In addition, as a structure of the liquid pumping part 6, you may employ | adopt not only the structure which has the impeller mentioned above but the other structure using a diaphragm.

[Configuration of heat exchange unit]
The heat exchange unit 8 reduces the temperature of the cooling liquid flowing along the annular flow path. As shown in FIG. 2, the heat exchange unit 8 includes a heat exchange part 81, a partition plate 82, a Peltier element 83 as a thermoelectric conversion element, and a heat radiation side heat transfer member 84.
The heat exchange part 81 is comprised by the substantially rectangular parallelepiped hollow member, and heat-exchanges with the cooling fluid which distribute | circulates an inside.
The partition plate 82 is configured by a plate body having a rectangular shape in plan view, and partitions the heat exchanging portion 81 and the heat radiating side heat transfer member 84, and the heat exchanging portion 81, the Peltier element 83, and the heat radiating side heat transfer member 84 are integrated. Turn into. The partition plate 82 is made of a material having low thermal conductivity (for example, 0.9 W / (m · K) or less).
As shown in FIG. 2, the partition plate 82 has an opening 821 having a rectangular shape smaller than the planar shape of the heat exchanging portion 81 and allowing the Peltier element 83 to be fitted therein.
The heat exchanging portion 81 is fixed to the peripheral portion of the opening 821 so as to close the opening 821 on one plate surface of the partition plate 82.

Although not specifically shown, the Peltier element 83 has a plurality of junction pairs formed by joining a p-type semiconductor and an n-type semiconductor with metal pieces, and the plurality of junction pairs are electrically directly connected. It is connected to the.
In the Peltier element 83 having such a configuration, when power is supplied, as shown in FIG. 2, one end face of the Peltier element 83 becomes a heat absorbing surface 831 that absorbs heat, and the other end face dissipates heat. The heat radiating surface 832 is formed.
The Peltier element 83 is fitted into the opening 821 of the partition plate 82, and the heat absorbing surface 831 is connected to the heat exchanging portion 81 so that heat can be transferred.

As shown in FIG. 2, the heat radiation side heat transfer member 84 is configured by a so-called heat sink having a rectangular plate body 841 and a plurality of fin members 842 protruding from the plate body 841. The heat radiation side heat transfer member 84 is fixed to the periphery of the opening 821 so as to close the opening 821 on the other plate surface of the partition plate 82. In this state, the heat radiation side heat transfer member 84 is connected to the heat radiation surface 832 of the Peltier element 83 so that heat can be transferred.
That is, in a state where the members 81, 83, and 84 are integrated with the partition plate 82, a heat transfer path is formed between the heat exchange unit 81 to the Peltier element 83 to the heat radiation side heat transfer member 84.
For this reason, by driving the Peltier element 83, the heat exchanging portion 81 is cooled by absorbing heat from the heat absorbing surface 831. Further, the heat generated on the heat radiation surface 832 of the Peltier element 83 is radiated to the outside via the heat radiation side heat transfer member 84.

[Connection structure with liquid circulation member]
Next, the connection structure of each member 5-8 by the liquid circulation member 9 is demonstrated.
In the following, for convenience of explanation, as shown in FIG. 2, of the three panel holders 5, the panel holder that holds the liquid crystal panel 341 </ b> R on the red light side is the red light panel holder 5 </ b> R and the green light side. The panel holder that holds the liquid crystal panel 341G is referred to as a green light panel holder 5G, and the panel holder that holds the liquid crystal panel 341B on the blue light side is referred to as a blue light panel holder 5B.
As shown in FIG. 2, the liquid circulation member 9 is composed of six first to sixth liquid circulation members 9 </ b> A to 9 </ b> F.
Specifically, the first liquid circulation member 9A has an inflow side and an outflow side at one end of each liquid circulation pipe 51 (see FIG. 3) described later in the red light panel holding body 5R and the green light panel holding body 5G, respectively. Connected.
The second liquid circulation member 9B has an inflow side connected to the other end of the liquid circulation pipe 51 in the green light panel holding body 5G, and an outflow side connected to one end of the liquid circulation pipe 51 in the blue light panel holding body 5B. Is done.

The third liquid circulation member 9C has an inflow side connected to the other end of the liquid circulation pipe 51 in the blue light panel holding body 5B, and an outflow side connected to the liquid pumping unit 6.
The fourth liquid circulation member 9 </ b> D has an inflow side and an outflow side connected to the liquid pumping unit 6 and the inflow part in the tank 7, respectively.
The fifth liquid circulation member 9E is connected to the outflow part and the heat exchange part 81 in the tank 7 on the inflow side and the outflow side, respectively.
The sixth liquid circulation member 9F has an inflow side and an outflow side connected to the other end of the liquid circulation pipe 51 in the heat exchange unit 81 and the red light panel holding body 5R.

By the connection structure by the liquid circulation member 9 as described above, the red light panel holding body 5R, the green light panel holding body 5G, the blue light panel holding body 5B, the liquid pumping unit 6, the tank 7 and the heat exchanging unit 81 are traced again. An annular flow path C returning to the red light panel holding body 5R is formed.
The liquid cooling device 4 described above cools the liquid crystal panel 341 as described below.
That is, the heat generated in the liquid crystal panel 341 is transmitted to the cooling liquid via the incident side dustproof glass Cr1 and the panel holder 5 which will be described later.
The cooling liquid that has flowed out of the panel holder 5 follows the flow path C and flows into the heat exchange unit 81.
Here, the heat exchanging portion 81 is cooled by absorbing heat from the heat absorbing surface 831 by driving the Peltier element 83.
And the cooling liquid cooled in the heat exchange part 81 flows into the panel holding body 5 again.

[Configuration of panel holder]
FIG. 3 is a perspective view of the holder body 5S with the presser plate 5T removed from the panel holder 5 as seen from the light beam incident side. FIG. 4 is an exploded perspective view of the state in which the presser plate 5T is disassembled from the panel holder 5 as viewed from the light beam exit side.
The three panel holders 5 hold three liquid crystal panels 341 (including dust-proof glasses Cr1 and Cr2 described later), respectively, and cooling liquid flows in and out of the three liquid crystal panels 341. Cooling. Each panel holder 5 has the same configuration, and only one panel holder 5 will be described below.
As shown in FIGS. 3 and 4, the panel holder 5 includes a holder body 5S and a pressing plate 5T. In addition, the structure of each part 5S and 5T is mentioned later.

[Configuration of LCD panel]
5 is a longitudinal sectional view of the holding body 5S in FIG. 3, and FIG. 6 is a transverse sectional view of the holding body 5S in FIG.
Each liquid crystal panel 341 has the same configuration, and only one liquid crystal panel 341 will be described below.
The liquid crystal panel 341 is formed in a substantially rectangular shape in plan view, and has a configuration in which liquid crystal as an electro-optical material is hermetically sealed between a pair of substrates 341C and 341D made of glass or the like.
Of the pair of substrates 341C and 341D, one substrate 341C is a driving substrate for driving liquid crystal, and although not specifically illustrated, a plurality of data lines, a plurality of scanning lines, a scanning line, It has a pixel electrode formed corresponding to the intersection of the data lines and a switching element such as a TFT (Thin Film Transistor).
The other substrate 341D is a counter substrate disposed to face the substrate 341C at a predetermined interval, and has a common electrode to which a predetermined voltage Vcom is applied.
The drive substrate 341C described above is formed to have an outer shape larger than the outer shape of the counter substrate 341D, as shown in FIGS.
In addition, incident-side dust-proof glass Cr1 having an outer shape substantially the same as the outer shape of the counter substrate 341D is attached to the outer surface of the counter substrate 341D.
Furthermore, the emission-side dust-proof glass Cr2 having an outer shape substantially the same as the outer shape of the drive substrate 341C is attached to the outer surface of the drive substrate 341C.
As dustproof glass Cr1, Cr2, materials, such as a sapphire, a crystal | crystallization, YAG (Yttrium Aluminum Garnet), are employable, for example.

[Configuration of holder body]
As shown in FIGS. 3 and 4, the holding body 5 </ b> S includes a liquid circulation pipe 51 and a panel support frame 52 (optical element support frame).
The liquid circulation pipe 51 is a member that is made of a metal material such as copper and into which the cooling liquid flows.
The liquid flow pipe 51 has one side end portion along the long side of the liquid crystal panel 341 and a pair of sides along the short side so as to surround the image forming region (light transmission region) of the liquid crystal panel 341 in plan view. It is bent and formed in a substantially U shape so as to extend along the end, and each end for allowing the cooling liquid to flow in and out is formed to extend in parallel upward (see FIG. 7).

The panel support frame 52 is made of a metal material such as an aluminum alloy and has a substantially rectangular plate shape. Further, as shown in FIGS. 5 and 6, the liquid circulation pipe 51 is disposed inside the panel support frame 52 so as to face the side end portion of the liquid crystal panel 341.
As shown in FIGS. 5 and 6, in the panel support frame 52, an accommodation recess 521 for accommodating the liquid crystal panel 341 is formed on the end surface on the light beam exit side.
Specifically, the storage recess 521 has a first recess 521A that is recessed from the end surface of the panel support frame 52 toward the light incident side, and a recess that is further recessed from the bottom of the first recess 521A toward the light incident side. The side wall is formed in a stepped shape corresponding to the outer shape of the liquid crystal panel 341 (stepped shape due to the difference in the outer shape of the driving substrate 341C and the counter substrate 341D).
An opening 521C corresponding to the light transmission region is formed at the bottom of the second recess 521B.
The detailed configuration of the panel support frame 52 will be described later.

As shown in FIG. 4, the presser plate 5 </ b> T is configured by a substantially rectangular plate having an opening 53 corresponding to the light transmission region, and is disposed on the light beam emission side of the holder body 5 </ b> S.
The holding plate 5T is formed in a plate spring shape, and is engaged with the left and right side end portions of the panel support frame 52, so that the liquid crystal panel 341 ( The exit side dust-proof glass Cr2) is pressed toward the light beam entrance side (see FIGS. 5 and 6).
That is, when the liquid crystal panel 341 is pressed to the light beam incident side by the holding plate 5T, the light beam incident side end surface of the incident side dust-proof glass Cr1 comes into surface contact with the bottom portion of the second recess 521B (see FIGS. 5 and 6). ).
As described above, the panel holder 5 is configured to dissipate the heat of the liquid crystal panel 341 by following the heat transfer path of the liquid crystal panel 341 to the incident side dust-proof glass Cr1 to the panel support frame 52 to the liquid circulation pipe 51. ing.

[Configuration of panel support frame]
FIG. 7 is an exploded perspective view of the state in which the holding body 5S is disassembled as viewed from the light beam output side, and FIG. 8 is a plan view of the output side support frame 52B of the panel support frame 52 as viewed from the light beam incident side. .
As shown in FIG. 7, the panel support frame 52 includes an incident side support frame 52 </ b> A (first support frame) and an emission side support frame 52 </ b> B (first) that are divided and formed on a plane substantially parallel to the flow direction of the liquid flow pipe 51. 2 support frames).
More specifically, as shown in FIGS. 7 and 8, the division position of the incident side support frame 52A and the emission side support frame 52B is set at the bottom portion of the first recess 521A. That is, the division position of the incident side support frame 52A and the emission side support frame 52B is set to be substantially the same position as the connection surface of the drive substrate 341C and the counter substrate 341D in a state where the liquid crystal panel 341 is accommodated in the accommodation recess 521. Yes.

FIG. 9 is an enlarged longitudinal sectional view of the C1 portion of the panel holder 5 in FIG.
In the incident-side support frame 52A, the light beam emission-side end surface 52A1 (connection surface) has a U-shaped first shape in plan view surrounding the storage recess 521 corresponding to the liquid circulation pipe 51, as shown in FIGS. A one-tube recess 522A (recess) is formed.

Similarly, the exit-side support frame 52B has a U-shaped first U-shaped plan view surrounding the accommodation recess 521 on the light-incident side end surface 52B1 (connection surface) as shown in FIG. A two-tube recess 522B (recess) is formed.
Further, the emission side support frame 52B has a plurality of through holes 522B1 (solder accumulation portions). The plurality of through holes 522B1 are formed uniformly at positions corresponding to the second tube recesses 522B through the emission-side support frame 52B along the light beam incident direction.
Further, in the exit side support frame 52B, the inner peripheral edge of the light incident side end face 52B1 facing the liquid crystal panel 341 is inclined outward from the light exit side toward the light incident side as shown in FIGS. A notch portion 522B2 (solder accumulation portion) is formed in the notch.
In addition, as shown in FIG. 8, since the dimension to the 2nd pipe | tube recessed part 522B is short in the both ends of the inner peripheral lower end edge of the light beam entrance side end surface 52B1, the notch part 522B2 is not formed on account of processing. .

When the incident-side support frame 52A and the emission-side support frame 52B are combined, the light-beam emission-side end surface 52A1 and the light-beam-incidence-side end surface 52B1 are connected to each other, thereby connecting the tube recesses 522A and 522B. A space Ar (see FIG. 9) in which the liquid circulation pipe 51 is disposed is formed. Therefore, the panel support frame 52 is provided with an arrangement hole 522 in which the liquid circulation pipe 51 is arranged, as shown in FIGS.
Specifically, solder S (see FIG. 9) is applied to the tube recesses 522A and 522B of the support frames 52A and 52B, and the liquid flow pipe 51 is disposed in the tube recesses 522A and 522B. That is, by combining the incident side support frame 52A and the emission side support frame 52B, the solder S is formed in the space Ar formed between the inner peripheral surface of the disposition hole 522 and the outer peripheral surface of the liquid flow pipe 51. Closely packed. The amount of solder S filled in the space Ar will be described later.
Then, the solder S is cured by the reflow process, and the support frames 52A and 52B and the liquid flow pipe 51 are connected.
In addition, as a material of the solder S, the thing of alloy compositions, such as Sn-Bi, Sn-Pb, Sn-Zn, Sn-Ag-Cu, Sn-Ag, Sn-Cu, can be illustrated.

  The through-hole 522B1 is formed at a position corresponding to the second tube recess 522B in the emission-side support frame 52B. Therefore, when the incident-side support frame 52A and the emission-side support frame 52B are combined, the space Ar and the emission It communicates with the outside of the side support frame 52B. For this reason, through-hole 522B1 becomes a part in which the surplus part of solder S applied more than the volume of space Ar is accumulated. In addition, these through holes 522B1 generate gas generated by volatilization of a solvent such as a volatile flux contained in the solder S in a reflow process in which the support frames 52A and 52B and the liquid flow pipe 51 are joined. It is also a part discharged from the space Ar to the outside.

  When the incident side support frame 52A and the emission side support frame 52B are combined, the notch 522B2 is formed when excess solder S applied to the volume of the space Ar overflows between the end faces 52A1 and 52B1. It is the part that is accumulated. More specifically, the solder S overflowing between the end faces 52A1 and 52B1 is accumulated by surface tension in a space portion formed by the notch 522B2 and the light exit end face 52A1 of the incident side support frame 52A. The And the solder S is hardened | cured in the said notch part 522B through the above-mentioned reflow process.

Here, the amount of the solder S applied to the tube recesses 522A and 522B of the support frames 52A and 52B will be described.
The volume of the space Ar is A, the volume of the inside of the through hole 522B1 is B, the volume formed by the notch 522B2 and the light beam emission side end surface 52A1, C, the space Ar and the end surfaces 52A1, 52B1 of the support frames 52A, 52B. When the application amount of the solder S applied to D is D and the capacity of a solvent such as flux contained in the solder is E, the following equation (1) is established. Note that the application amount D of the solder S includes spare solder and, for example, spear when using spear-containing solder.

[Equation 1]
B + C + DE ≧ A (1)

  By injecting the solder S having a coating amount D satisfying the expression (1) into the space Ar, it is possible to apply more solder than the volume A of the space Ar. Therefore, when the solvent contained in the solder is volatilized, it is possible to fill the space Ar densely with the solder S without gas accumulating in the space Ar.

According to the projector 1 of this embodiment mentioned above, there exist the following effects.
In this embodiment, the support frames 52A and 52B that support the liquid crystal panel 341 and the liquid circulation pipe 51 in which the cooling liquid that cools the liquid crystal panel 341 flows are joined by solder. The exit side support frame 52B has a through hole 522B1 for accumulating the solder S exceeding the volume of the space Ar, and the through hole 522B1 communicates the space Ar with the outside of the exit side support frame 52B. That is, even when a large amount of solder S exceeding the volume of the space Ar is injected into the space Ar, the solder S overflowing from the space Ar is accumulated in the through hole 522B1. According to this, a large amount of solder S can be densely filled into the space Ar, and air can be prevented from being mixed into the space Ar. Therefore, the heat conduction between the support frames 52A and 52B and the liquid circulation pipe 51 can be enhanced, and the cooling efficiency of the liquid crystal panel 341 can be improved.

Further, since the through-hole 522B1 communicates the space Ar and the outside of the emission-side support frame 52B, the solvent contained in the solder S volatilizes when the support frames and the liquid flow pipe are joined in the reflow process. However, the gas accumulated in the space Ar can be discharged to the outside from the through hole 522B1. Accordingly, since gas can be prevented from accumulating in the space Ar, the metal component constituting the solder S can be closely filled between the support frames 52A and 52B and the liquid flow pipe 51, and the support frames 52A and 52A can be filled. The thermal conductivity from 52B to the liquid circulation pipe 51 can be improved. Further, even when a large amount of solder S is injected into the space Ar, the solder S overflowing from the space Ar can be accumulated in the through hole 522B1. Therefore, even if the solder S overflows from the through hole 522B1, the amount of solder S that overflows from the through hole 522B1 is small, so that the process of wiping off the solder can be simplified and workability can be improved.

  Further, since the through hole 522B1 is formed in the direction along the incident light beam in the emission side support frame 52B, even when the solder S overflows from the through hole 522B1, the solder S adheres to the liquid crystal panel 341. Can be prevented.

Further, a notch 522B2 is formed in the light beam incident side end face 52B1 of the emission side support frame 52B. According to this, even when the solder S injected into the space Ar overflows between the end faces 52A1 and 52B1 of the support frames 52A and 52B, the solder S accumulates in the notch 522B2, and therefore overflows the solder. The work of wiping off S can be simplified and workability can be improved. Therefore, a large amount of solder S can be densely filled in the space Ar, the thermal conductivity between the support frames 52A and 52B and the liquid circulation pipe 51 can be further increased, and the cooling efficiency of the liquid crystal panel 341 can be further improved.
Further, since the solder S is accumulated in the notch 522B2, it is possible to suppress the solder S from adhering to the liquid crystal panel 341.

[Modification of Embodiment]
The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In the above-described embodiment, the panel holding body 5 is configured to include the through hole 522B1 and the notch 522B2 as the solder accumulation portion. However, the configuration is not limited to this configuration, and any configuration that can accumulate the solder overflowing from the space Ar is possible. That's fine. For example, in the above-described embodiment, the through hole 522B1 is formed in the second tube recess 522B. However, the through hole 522B1 may not be penetrated. It may be a hole.
In the above embodiment, the through hole 522B1 corresponding to the solder accumulating portion according to the present invention is formed so as to penetrate along the direction of the light beam incident on the emission side support frame 52B. For example, the direction orthogonal to the light beam direction It may be formed. In this case, by forming the through hole so as to face the outer side of the panel support frame 52, it is possible to easily wipe off the solder overflowing from the through hole, and to reliably adhere to the optical element. Can be suppressed.
In addition, the through hole 522B1 is formed in the emission-side support frame 52B, but may be formed in the incident-side support frame 52A as long as it is formed in any one of the support frames 52A and 52B.

In the above embodiment, the notch 522B2 corresponding to the solder accumulating portion according to the present invention is formed on the light beam incident side end surface 52B1 of the emission side support frame 52B, but on the light beam emission side end surface 52A1 of the incident side support frame 52A. It may be formed, and may be formed on both end faces 52A1 and 52B1.
In the above-described embodiment, the notch 522B2 is notched so as to incline from the light beam exit side toward the light beam incident side along the inner peripheral edge of the light beam incident side end surface 52B1 of the output side support frame 52B. However, it may be cut out in a V-shaped cross-sectional view or a U-shaped cross-sectional view along the inner peripheral edge of the light beam incident side end face 52B1.
In the above-described embodiment, the through hole 522B1 and the cutout portion 522B2 are provided as the solder accumulation portion, but may be configured by only one of them.
In the above embodiment, the incident-side support frame 52A and the emission-side support frame 52B have the first tube recess 522A and the second tube recess 522B, respectively. However, the first tube recess 522A or the second tube recess 522B Either of them may be formed.

  In the embodiment, the liquid circulation pipe 51 is bent so as to surround the image forming area of the liquid crystal panel 341 in a plan view, and each end for allowing the cooling liquid to flow in and out extends in parallel to the upper side. Although formed, it is not limited to this shape. For example, the image forming area of the liquid crystal panel 341 may be formed in a ring shape, a rectangular frame shape, or the like surrounding the image forming area in a plan view, and is formed in a straight line so as to be arranged in parallel with the side end portion of the liquid crystal panel 341. It may be.

In the embodiment, the liquid crystal panel 341 is cooled as an optical element. However, the optical element such as the polarization conversion element 323, the incident side polarizing plate 342, and the outgoing side polarizing plate 343 may be cooled.
In the said embodiment, although it was the structure provided with two light source devices 31A and 31B, the structure provided with one or three or more light source devices may be sufficient. Furthermore, the light source device is not limited to the configuration including the light source lamp 311, and may be configured to include a solid light source such as an LED (Light Emitting Diode).
In the above-described embodiment, a transmissive liquid crystal panel having a different light beam incident surface and light beam output surface is used. However, a reflective liquid crystal panel having the same light incident surface and light output surface may be used.

It is not limited to the arrangement | positioning order of each member 5-8 which comprises the liquid cooling device 4 in the said embodiment, You may arrange | position in another order.
In the embodiment, three liquid crystal panels 341 are provided, but the number is not limited to three, and may be one, two, or four or more.
In the embodiment, the front type projector 1 in which the projection direction of the image light with respect to the projection surface and the observation direction of the image related to the image light are substantially the same is illustrated, but the present invention is not limited thereto, and the projection direction is not limited thereto. The present invention can also be applied to a rear type projector in which the observation direction and the observation direction are opposite to each other.

  The optical element holder of the present invention can be used as a member for holding a liquid crystal panel, a polarizing plate, and a polarization conversion element because the optical element can be favorably cooled while improving workability.

  DESCRIPTION OF SYMBOLS 1 ... Projector, 5 ... Panel holding body (optical element holding body), 31A, 31B ... Light source device, 34 ... Optical apparatus, 35 ... Projection optical apparatus, 51 ... Liquid distribution pipe, 52 ... Panel support frame (optical element support frame) ), 52A... Entrance side support frame (first support frame), 52A1... Exit end face (connection surface) of light beam, 52B... Exit support frame (second support frame), 52B1. 341 ... Liquid crystal panel (optical element), 521C ... Opening, 522B1 ... Through hole (solder accumulation part), 522B2 ... Notch (solder accumulation part), Ar ... Space

Claims (6)

An optical element holder that holds an optical element that converts optical characteristics of an incident light beam,
A liquid circulation pipe disposed along at least a part of the peripheral edge of the optical element and through which a cooling liquid for cooling the optical element flows;
An opening corresponding to a light transmission region of the optical element, and an optical element support frame for supporting the optical element,
The optical element support frame is
A first support frame and a second support frame that are divided and formed in a plane substantially parallel to the flow direction of the cooling liquid in the liquid flow pipe, and sandwich the liquid flow pipe;
The first support frame, the second support frame, and the liquid flow pipe are joined by solder,
At least one of the first support frame and the second support frame has a solder accumulation unit that accumulates the solder exceeding the volume of the space between the support frame and the liquid circulation pipe. An optical element holder. The optical element holder according to claim 1,
The solder accumulation portion is formed between the first support frame and the second support frame and the liquid flow tube when the liquid flow tube is sandwiched between the first support frame and the second support frame. An optical element holding body comprising a through hole that communicates with a space to be formed and penetrates at least one of the first support frame and the second support frame. The optical element holder according to claim 2,
The through-hole is formed on a surface different from a surface facing the optical element in at least one of the first support frame and the second support frame. . In the optical element holder according to any one of claims 1 to 3,
The first support frame and the second support frame include connection surfaces connected to each other,
The solder accumulating part is constituted by a cutout part formed in at least one of the connection surfaces. An optical element for converting the optical characteristics of the incident light beam;
An optical device comprising: the optical element holder according to claim 1, which holds the optical element. A light source device;
An optical device that converts an optical characteristic of an incident light beam, and an optical device that includes the optical element holding body according to any one of claims 1 to 4, which holds the optical element;
A projection optical device that projects image light formed by the optical device;
The projector is characterized in that the optical element is a light modulation element that modulates an incident light beam.

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