JP2011195898A - Electrolytic plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrolytic plating device capable of uniformizing the plating film thickness by effective agitation even when using a magnetic field generation means of a simple structure and capable of performing high-speed plating even in a low-concentration plating bath.SOLUTION: The electrolytic plating device in which an anode electrode 20 and a cathode electrode 21 are arranged oppositely to each other in a plating bath 11 and the plating is performed by applying an electric field between the anode electrode 20 and the cathode electrode 21 includes: the magnetic field generation means 130 for forming a magnetic field having a component orthogonal to the electric field on the neighboring region of the cathode electrode 21 that is arranged on the anti-anode electrode 20 side of the cathode electrode 21; and a magnetic field moving means 132 capable of moving the magnetic field in parallel with the in-plane direction of the cathode electrode 21.

Description

  The present invention relates to an electrolytic plating apparatus for forming a plating film.

  When performing film formation using an electrolytic plating apparatus, for the purpose of smoothing the replenishment of metal ions to the plating deposition part and increasing the film formation rate, and further uniformizing the plating film, Agitation in the plating bath is performed.

  In the conventional electroplating apparatus, as the stirring method in the plating bath, for example, stirring by air (conventional method 1), stirring by moving the object to be plated (conventional method 2), mechanical stirring using a rod (conventional method) 3) etc. are used.

  In addition to the above stirring methods, stirring using a magnetic field (conventional method 4) has also been proposed (see, for example, Patent Document 1). FIG. 7 is a configuration diagram of an electroplating apparatus showing a conventional stirring method (conventional system 4) using a magnetic field, and schematically shows a configuration of the electroplating apparatus viewed from the side (left-right direction). . In the electrolytic plating apparatus of FIG. 7, an electrode part composed of an anode electrode 20 and a cathode electrode 21 (to-be-plated object) connected to a plating power source 22 is placed in a plating bath 11 (plating solution put in the plating tank 10). The first magnetic pole 30A (N pole or S pole) and the second magnetic pole 30B (S pole or N pole) are arranged on the anti-anode electrode side of the cathode electrode 21 and the anti-cathode electrode side of the anode electrode 20, respectively. The magnetic field generating means (electromagnet) 30 is provided. In the electroplating apparatus of FIG. 7, the electric field (E) 23 generated between the anode electrode 20 and the cathode electrode 21 and the magnetic field (B) 31 generated from the magnetic field generating means (electromagnet) 30 are contained in the plating bath 11. The ions receive Lorentz force, and the plating bath 11 is stirred.

JP-A-8-225998

As described above, for example, the conventional methods 1 to 4 have been proposed as the stirring method in the plating bath in the electrolytic plating apparatus, but the following points are considered to be problems.
(Problem with conventional method 1)
In the conventional method 1 in which stirring is performed with air, there is a problem that dirty air or the like may enter the plating bath.

(Problem with conventional method 2)
In the conventional method 2 in which stirring is performed by moving the object to be plated, if the object to be plated is not firmly bonded to the branch of the hook jig for supporting and conducting the object to be plated, the object to be plated is moved along with the movement of the object to be plated. There is a problem that the effect of agitation is reduced because the plating is shaken.

(Problem with conventional method 3)
In the conventional method 3 in which mechanical stirring using a rod is performed, there is a problem that ions are not sufficiently diffused.

(Problem with conventional method 4)
In the conventional method 4 (FIG. 7), since stirring is performed in the plating bath using a magnetic field, it is not necessary to send air for stirring and it is not necessary to move the object to be plated. At least the above-mentioned problems in the conventional systems 1 and 2 are solved. However, in the case of the magnetic field distribution as in the conventional method 4, in order to enhance the stirring effect of ions in the plating bath, it is necessary to rotate the magnetic field generating means (electromagnet) or generate an alternating magnetic field by the magnetic field generating means (electromagnet). It becomes. In this regard, in the configuration of the direct-current magnetic field in which the magnets are simply arranged to face each other, the Lorentz force acting on the ions is in a certain direction, so that the stirring effect is insufficient.

  Thus, in the conventional method 4, in order to obtain a sufficient stirring effect, rotation of the magnetic field generating means (electromagnet) or generation of an alternating magnetic field by the magnetic field generating means (electromagnet) is required. There is a problem that becomes a complicated structure and costs.

Further, in the conventional methods 1 to 4, there is a problem that the plating film thickness becomes non-uniform when the object to be plated has a complicated structure.
Furthermore, when performing plating at a high speed in an electrolytic plating apparatus, it is necessary to increase the current density in order to increase the deposition rate. For this purpose, it is necessary to increase the plating bath concentration. When the bath concentration is increased, there is a problem that the cost of the plating solution is increased.

  Considering the above-mentioned points in the prior art, particularly the advantageous point of the stirring method using the magnetic field as in the conventional method 4, the stirring method in the plating bath in the electroplating apparatus is stirring using the magnetic field. It is considered appropriate to further improve the system.

  For this reason, the present invention improves the conventional stirring method using a magnetic field, and even with a magnetic field generating means having a simple configuration, it is possible to make the plating film thickness of an object to be plated uniform by effective stirring and to reduce the thickness. An object of the present invention is to provide an electrolytic plating apparatus capable of high-speed plating even in a concentration plating bath.

  In order to achieve the above object, according to the present invention, an anode electrode and a cathode electrode forming an electrode portion are disposed opposite to each other in a plating bath, and an electric field is applied between the anode electrode and the cathode electrode. In the electroplating apparatus for performing plating, magnetic field generating means for forming a magnetic field having a component orthogonal to the electric field in a region near the cathode electrode is disposed on the side opposite to the anode electrode of the cathode electrode, and the magnetic field is A magnetic field moving means capable of moving parallel to the in-plane direction of the cathode electrode is provided (invention of claim 1).

  According to the first aspect of the present invention, the magnetic field generating means is disposed on the side of the cathode electrode (to-be-plated) opposite to the anode electrode, and the magnetic field generating means allows the inside of the plating bath (plating solution placed in the plating tank). By forming a magnetic field having a component orthogonal to the electric field between the anode electrode and the cathode electrode in the vicinity of the cathode electrode in the electrode, ions move due to Lorentz force acting on the ions in the plating bath. The plating bath can be effectively agitated by the flow of the other particles moving into the empty space.

  According to the first aspect of the present invention, the magnetic field distribution in the entire plating bath is a magnetic field distribution in which the region near the cathode electrode becomes a high magnetic field due to the magnetic field formed by the magnetic field generating means. It acts as a confinement magnetic field for ions. For this reason, ions in the plating bath gather on the cathode electrode side, and a concentration distribution is formed in which the ion concentration becomes high in a region near the cathode electrode. For this reason, the same plating effect as the plating by the high concentration plating bath can be obtained even in the low concentration plating bath, and the high speed plating can be performed even in the low concentration plating bath.

  In addition, according to the invention of claim 1, since it is a stirring method using a magnetic field, it is not necessary to send air for stirring, so that dirty air or the like does not contaminate the plating bath, In addition, since there is no need to move the object to be plated, the effect of stirring does not drop due to the shaking of the object to be plated.In addition, unlike the mechanical stirring method using a rod, ions are sufficiently absorbed. The effect of diffusing is obtained.

  Furthermore, according to the first aspect of the invention, the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode. Then, due to the movement of the magnetic field, the portion where ions in the plating bath have a high concentration also moves, and the deposition reaction of the plating is promoted at the high concentration portion more than at the low concentration portion. For this reason, for example, the magnetic field is moved so that the high concentration part moves to the vicinity of the place where the plating is difficult to deposit on the surface of the object with many unevenness on the surface, so that the plating is deposited at the place where the plating is difficult to deposit. By promoting, it is possible to further improve the uniformity of the plating film thickness in the entire object to be plated. In addition, it is possible to set an arbitrary plating film thickness at an arbitrary position in the workpiece by moving the magnetic field.

  The electroplating apparatus according to claim 1, wherein the magnetic field generating means includes a first magnetic pole disposed in the center as a pair of magnetic poles, and an in-plane of the cathode electrode with respect to the first magnetic pole. A second magnetic pole concentrically disposed on the outer diameter side in a direction parallel to the direction, and a magnetic pole surface of the first magnetic pole at the center and a magnetic pole surface of the second magnetic pole on the outer diameter side, The magnetic field is preferably formed between the two (invention of claim 2).

  According to the second aspect of the invention, the magnetic pole surface of the first magnetic pole disposed at the center of the magnetic field generating means and the outer diameter in a direction parallel to the in-plane direction of the cathode electrode with respect to the first magnetic pole. A magnetic field is formed between the magnetic pole surface of the second magnetic poles arranged concentrically on the side, and a magnetic field distribution having a component orthogonal to the electric field between the anode electrode and the cathode electrode is obtained. The ions in the plating bath that receive the Lorentz force by such a magnetic field perform a cycloid motion that draws a circle parallel to the in-plane direction of the cathode electrode. Further, since the direction of the magnetic field varies depending on the position in the plating bath, the Lorentz force received by the ions by the magnetic field also works in different directions depending on the position. In this way, the plating bath is effectively stirred.

  According to the second aspect of the present invention, the magnetic field generating means may have a simple configuration including the first magnetic pole at the center and the second magnetic pole on the outer diameter side. Since it should just be arrange | positioned at the anode electrode side, the electrolytic plating apparatus which can equalize the plating film thickness of a to-be-plated object by effective stirring can be implement | achieved at low cost.

  The electroplating apparatus according to claim 1, wherein the magnetic field generating means includes a central magnet and a plurality of annular electromagnets arranged concentrically with the central magnet as a center. An electromagnet power source that supplies an excitation current to each cylindrical electromagnet, and an excitation switch circuit that controls the flow of the excitation current to each cylindrical electromagnet. By switching the excitation current flow state of each annular electromagnet by the excitation switch circuit, and switching the annular electromagnet that forms a magnetic field in combination with the magnet at the center The magnetic field can be moved in parallel to the in-plane direction of the cathode electrode (invention of claim 3).

  According to the third aspect of the present invention, by switching the annular electromagnet that forms the magnetic field in combination with the magnet at the center by the excitation switch circuit, the magnetic field can be transferred to the surface of the cathode electrode without a mechanical movement mechanism. Since it can be moved parallel to the inward direction, it is suitable as a magnetic field moving method.

  In the electroplating apparatus according to claim 1, as the magnetic field generating means, a plurality of unit electromagnets are arranged two-dimensionally on a plane parallel to the in-plane direction of the cathode electrode, An excitation operation unit comprising an electromagnet power supply for supplying an excitation current and an excitation switch circuit for controlling the flow of the excitation current to each unit electromagnet is provided, and the excitation current flow of each unit electromagnet is provided by the excitation switch circuit. It is preferable that the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode by switching the state and switching the combination of the unit electromagnets that form the magnetic field. Invention).

  According to the fourth aspect of the invention, by switching the combination of the unit electromagnets that form the magnetic field by the excitation switch circuit, the magnetic field can be made parallel to the in-plane direction of the cathode electrode without a mechanical movement mechanism. Since it can be moved, it is suitable as a magnetic field moving system.

  Next, according to the present invention, in the plating bath, an anode electrode and a cathode electrode that form an electrode portion are arranged to face each other, and an electric field is applied between the anode electrode and the cathode electrode to perform plating. In the plating apparatus, the electrode part is composed of a pair of anode electrodes and a cathode electrode disposed between the anode electrodes, and a magnetic field having a component orthogonal to the electric field in a region near the cathode electrode The magnetic field generating means for forming the electrode may be arranged on the side surface side of the cathode electrode, and the magnetic field moving means capable of moving the magnetic field in parallel with the in-plane direction of the cathode electrode may be provided ( Invention of Claim 5).

  According to the fifth aspect of the present invention, the magnetic field generating means is provided on the side surface of the cathode electrode (to-be-plated object) in the electrode part configuration comprising the pair of anode electrodes and the cathode electrode disposed between the anode electrodes. By this magnetic field generating means, a magnetic field having a component orthogonal to the electric field between the anode electrode and the cathode electrode is applied to the region near the cathode electrode in the plating bath (plating solution placed in the plating tank). By forming, the Lorentz force acts on the ions in the plating bath, and the ions move, thereby effectively stirring the plating bath by the flow of other particles moving into the vacant space. Can do.

  According to the fifth aspect of the present invention, the magnetic pole surface of the first magnetic pole disposed on one side of the cathode electrode is linearly extended from the magnetic pole surface of the second magnetic pole disposed on the other side. An opposing magnetic field is formed, resulting in a magnetic field distribution having a component orthogonal to the electric field between the anode electrode and the cathode electrode. And, since the direction of the electric field formed between the anode electrode facing each other on the one side and the other side of the cathode electrode is opposite, the direction of the Lorentz force received by the ions is also opposite, A flow is created in which ions circulate around the cathode electrode, that is, a flow in which ions circulate between the plating bath region on one side of the cathode electrode and the plating bath region on the other side. The stirring effect of the plating bath in the region near the cathode electrode (to-be-plated object) becomes high.

  Furthermore, according to the invention of claim 5, as in the invention of claim 1, the magnetic field distribution in the entire plating bath is such that the region near the cathode electrode is a high magnetic field due to the magnetic field formed by the magnetic field generating means. This magnetic field distribution acts as a confinement magnetic field for ions. For this reason, ions in the plating bath gather on the cathode electrode side, and a concentration distribution is formed in which the ion concentration becomes high in a region near the cathode electrode. For this reason, the same plating effect as the plating by the high concentration plating bath can be obtained even in the low concentration plating bath, and the high speed plating can be performed even in the low concentration plating bath.

  According to the invention of claim 5, as in the invention of claim 1, since it is a stirring method using a magnetic field, it is not necessary to send air for stirring. The inside of the plating bath is not contaminated, and it is not necessary to move the object to be plated, so that the effect of stirring is not reduced by the shaking of the object to be plated. Unlike the stirring method, the effect of sufficiently diffusing ions can be obtained.

  Furthermore, according to the fifth aspect of the invention, similarly to the first aspect of the invention, the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode. Then, due to the movement of the magnetic field, the portion where ions in the plating bath have a high concentration also moves, and the deposition reaction of the plating is promoted at the high concentration portion more than at the low concentration portion. For this reason, for example, the magnetic field is moved so that the high concentration part moves to the vicinity of the place where the plating is difficult to deposit on the surface of the object with many unevenness on the surface, so that the plating is deposited at the place where the plating is difficult to deposit. By promoting, it is possible to further improve the uniformity of the plating film thickness in the entire object to be plated. In addition, it is possible to set an arbitrary plating film thickness at an arbitrary position in the workpiece by moving the magnetic field.

  Further, in the electroplating apparatus according to claim 5, as the magnetic field generating means, two electromagnets are arranged so that magnetic pole faces having different polarities face each other in a positional relationship of sandwiching the cathode electrode from both sides. A plurality of electromagnet pairs are arranged side by side along a direction parallel to the in-plane direction of the cathode electrode, and an electromagnet power source that supplies an excitation current to each electromagnet pair, and an excitation current that is passed to each electromagnet pair. An excitation operation unit comprising an excitation switch circuit for controlling the flow is provided, the excitation current flow state of each electromagnet pair is switched by the excitation switch circuit, and the magnetic pair is formed by switching the electromagnet pair forming the magnetic field. It is preferable that the cathode electrode can be moved in parallel with the in-plane direction of the cathode electrode.

  According to the sixth aspect of the present invention, the magnetic field is moved in parallel to the in-plane direction of the cathode electrode without switching mechanically by switching the electromagnet pair forming the magnetic field by the excitation switch circuit. Therefore, it is suitable as a magnetic field movement method.

  The electroplating apparatus according to any one of claims 1 to 6, wherein the magnetic field generated by the magnetic field generating means is an alternating magnetic field (invention of claim 7).

  According to the seventh aspect of the present invention, the magnetic field exerting the Lorentz force on the ions in the plating bath in combination with the electric field between the anode electrode and the cathode electrode is an alternating magnetic field. Due to the turbulent flow effect by periodically changing the direction of the force, it is possible to further improve the uniformity of the plating film thickness including the uneven portion of the object to be plated.

  According to the present invention, as a plating bath agitation method in an electroplating apparatus, it is possible to make the plating film thickness of an object to be plated uniform by effective agitation even with a magnetic field generating means having a simple configuration and a low concentration. High-speed plating is possible even in a plating bath.

  In addition, according to the present invention, even when the object to be plated has a complicated structure, the magnetic field is moved so that the portion where ions are highly concentrated moves to the vicinity of the place where plating is difficult to deposit, By promoting the deposition of the plating, it becomes possible to further improve the uniformity of the plating film thickness in the entire object to be plated.

The block diagram which shows the electroplating apparatus by Example 1 of this invention Explanatory drawing which shows the principle of the stirring system in the electroplating apparatus of Example 1. The figure which shows the structural example from which the magnetic field movement system in Example 1 differs. The figure which shows the further different structural example of the magnetic field transfer system in Example 1. FIG. The block diagram which shows the electrolytic plating apparatus by Example 2 of this invention The figure which shows the structural example from which the magnetic field movement system in Example 2 differs. Configuration diagram showing conventional electrolytic plating equipment

Hereinafter, embodiments of the present invention will be described based on the examples shown in FIGS. About the same component, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted. In addition, this invention is not limited to the following embodiment, In the range which does not change the summary, it can implement suitably.
Embodiment of the present invention
The present invention relates to an electroplating apparatus in which an anode electrode and a cathode electrode forming an electrode portion are disposed to face each other in a plating bath, and plating is performed by applying an electric field between the anode electrode and the cathode electrode. As a stirring method in the bath, a magnetic field generating means for forming a magnetic field having a component orthogonal to the electric field between the anode electrode and the cathode electrode is provided in the vicinity of the cathode electrode, and the Lorentz force by the magnetic field is applied to ions in the plating bath. The plating bath is stirred over the entire surface of the cathode electrode on the anode electrode side by the force applied to the cathode electrode. Further, the magnetic field can move in parallel with the in-plane direction of the cathode electrode. The moving device is provided.

  In the configuration of the stirring method according to the present invention, it is possible to make the plating film thickness of the object to be plated uniform by effective stirring even with a simple magnetic field generating means, and high-speed plating is possible even in a low concentration plating bath. It becomes possible.

  Further, in the present invention, since the magnetic field moving means is provided, even when the object to be plated has a complicated structure, a portion where ions are highly concentrated moves to a region near a place where plating is difficult to deposit. Thus, by moving the magnetic field so as to promote the deposition of plating, it is possible to further improve the uniformity of the plating film thickness in the entire object to be plated.

(A) FIG. 1 is a block diagram showing an electrolytic plating apparatus according to Embodiment 1 of the present invention, and schematically shows a configuration of the electrolytic plating apparatus viewed from the side (horizontal direction). As shown in FIG. 1, the electrolytic plating apparatus of Example 1 includes an anode electrode 20 and a cathode electrode 21 (to be plated) connected to a plating power source 22 in a plating bath 11 (plating solution put in a plating tank 10). And a magnetic field generating means 130 having a first magnetic pole 130A and a second magnetic pole 130B on the side opposite to the cathode electrode 21 of the cathode electrode 21. It has become.

  As shown in FIG. 2B, which will be described later, the magnetic field generating means 130 is arranged in the in-plane direction of the cathode electrode 21 with respect to the first magnetic pole (N pole or S pole) 130A disposed at the center. The second magnetic pole (S pole or N pole) 130B is arranged concentrically on the outer diameter side in the parallel direction. The first magnetic pole 130A and the second magnetic pole 130B in the magnetic field generating means 130 are held and fixed by a magnetic pole holding portion 130C. In the magnetic pole holding part 130C, a magnetic circuit part (not shown) is provided between the first magnetic pole 130A and the second magnetic pole 130B.

In the electroplating apparatus of Example 1, a permanent magnet or an electromagnet may be used as the magnetic field generating means 130. Moreover, as the magnetic field generation means 130 in the case of using an electromagnet, either a configuration for generating a DC magnetic field or a configuration for generating an AC magnetic field can be applied.
(B) In the electroplating apparatus of Example 1, the electric field (E) 23 generated between the anode electrode 20 and the cathode electrode 21 and the electric field (E) 23 generated from the magnetic field generation means 130 are orthogonal to each other. The ions in the plating bath 11 are subjected to Lorentz force by the magnetic field (B) 131 having a component, and the plating bath 11 is stirred. And in the electroplating apparatus of Example 1, even if it is the structure which uses a permanent magnet as the magnetic field generation means 130, or the structure which generates a direct-current magnetic field with an electromagnet, the stirring effect can be made sufficient.

  FIG. 2 is an explanatory view showing the principle of the stirring method in the electrolytic plating apparatus of the first embodiment. As shown in FIGS. 2A to 2B, in the electroplating apparatus of Example 1, the surface of the cathode electrode 21 with respect to the first magnetic pole (N pole or S pole) 130 </ b> A disposed at the center. The magnetic field generated by the magnetic field generating means 130 having a structure in which the second magnetic pole (S pole or N pole) 130B is concentrically arranged on the outer diameter side in the direction parallel to the inner direction, that is, the first magnetic pole 130A in the central portion. A magnetic field formed between the magnetic pole surface and the magnetic pole surface of the second magnetic pole 130B on the outer diameter side is used. As a result, in the electroplating apparatus of the first embodiment, the Lorentz force 142 causes the ions 41 to be parallel to the in-plane direction of the cathode electrode 21 without the rotation of the magnetic field generating means or the application of an alternating magnetic field by the magnetic field generating means (electromagnet). In this way, a cycloidal motion that draws a circle can be performed, and thus the plating bath can be effectively stirred by the magnetic field generating means having a simple configuration.

  In addition, as shown in FIG. 2C, the ion 41 performs a Larmor motion along the magnetic force line 143. In this Larmor motion, since the rotation radius of the motion of charged particles decreases as the magnetic field increases, the ion concentration increases as the position of the high magnetic field in the plating bath 11 increases.

  In the electroplating apparatus of Example 1, the magnetic field distribution in the entire plating bath 11 becomes a magnetic field distribution in which the region near the cathode electrode 21 becomes a high magnetic field due to the magnetic field formed by the magnetic field generating means 130. The distribution acts as a confining magnetic field for ions. Therefore, ions in the plating bath 11 gather on the cathode electrode 11 side, and a concentration distribution is formed in which the ion concentration becomes high in the vicinity of the cathode electrode 21. For this reason, the same plating effect as the plating by the high concentration plating bath can be obtained even in the low concentration plating bath, and the high speed plating can be performed even in the low concentration plating bath.

In the configuration in which the magnetic field generated by the AC magnetic field generation unit 130 is an AC magnetic field, the unevenness in the object to be plated is also included due to the turbulent flow effect caused by periodically changing the direction of the Lorentz force received by the ions in the plating bath. The uniformity of the plated film thickness can be further improved.
(C) Further, in the electroplating apparatus of the first embodiment, the magnetic field generating means moving device 132 is provided which is mechanically engaged with the magnetic pole holding portion 130C of the magnetic field generating means 130, whereby the magnetic field generating means 130 can be moved parallel to the in-plane direction of the cathode electrode (substrate) 21. As the magnetic field generating means 130 moves, the magnetic field also moves in parallel to the in-plane direction of the cathode electrode (object to be plated) 21, thereby moving the portion where ions in the plating bath 11 have a high concentration. The plating concentration reaction is accelerated in the high concentration portion than in the low concentration portion. For this reason, for example, the magnetic field generating means 130 is moved so that the high-concentration portion moves to the vicinity of the portion where plating is difficult to deposit in an object having a lot of unevenness on the surface. By promoting the precipitation, it becomes possible to further improve the uniformity of the plating film thickness in the entire object to be plated. Further, by moving the magnetic field generating means 130, it is possible to set an arbitrary plating film thickness at an arbitrary position in the object to be plated.
(D) As the magnetic field moving method in the first embodiment, the configuration in which the magnetic field generating means moving device 132 mechanically engaged with the magnetic pole holding part 130C of the magnetic field generating means 130 is provided. The system is not limited to the above configuration, and for example, the following configuration can be applied.

  (A) FIG. 3 is a diagram showing a different configuration example of the magnetic field movement method in the first embodiment of the present invention, and FIG. 3 (a) is a side sectional view of the magnetic field generating means 150 in this configuration example. 3 (b) is a plan view of the magnetic field generating means 150 (a P1 arrow view in FIG. 3 (a)), and FIG. 3 (c) is an example of an excitation operation unit for each electromagnet constituting the magnetic field generating means 150. FIG.

  As shown in FIG. 3A, the magnetic field generating means 150 in this configuration example has a configuration in which electromagnets 152, 152A, 152B, and 152C are provided on a flat magnetic member 151 for forming a magnetic circuit. For example, the S pole side of the electromagnet 152 and the N pole side of the electromagnets 152A, 152B, and 152C are disposed so as to be in contact with the magnetic member 151 side. In addition, although the polarities of “S” and “N” are respectively described in the electromagnets 152, 152A, 152B, and 152C in FIG. 3A, this indicates the polarity in the excited state of each electromagnet. The magnetic field generating means 150 in this configuration example is arranged so that the magnetic pole surface on the diamagnetic member 151 side of each electromagnet faces the cathode electrode (substrate) 21 in FIG. The plate surface of the member 151 is parallel to the in-plane direction of the cathode electrode 21.

  As shown in FIG. 3B, the electromagnet 152 is configured as a substantially cylindrical electromagnet, for example. On the other hand, as shown in FIG. 3B, the electromagnets 152A, 152B, and 152C are configured as annular electromagnets arranged concentrically around the electromagnet 152. Further, the electromagnets 152A, 152B, and 152C are divided into a plurality of (six in the figure) partial arcs as shown in FIG. The electromagnets 152As1 to 152As6, 152Bs1 to 152Bs6, and 152Cs1 to 152Cs6 (hereinafter also referred to as “unit electromagnets”) are combined in an annular shape, and the unit electromagnets are connected in series or in parallel.

  In addition, you may use a permanent magnet for the electromagnet 152 located in a center part. Further, the shape of the unit electromagnets constituting the annular electromagnets 152A, 152B, and 152C is not limited to the arc shape as shown in FIG. 3B, but is a square shape (three-dimensional shape is a quadrangular prism shape). Other shapes may be used, and it is only necessary that a plurality of unit electromagnets can be combined to form a substantially annular electromagnet group. Furthermore, the number (number of divisions) of the unit electromagnets constituting the ring-shaped electromagnets 152A, 152B, and 152C is not limited to six shown in FIG.

  Then, as shown in FIG. 3C, the direct current excitation current from the positive electrode VP and the negative electrode VN of the electromagnet power supply 153 is passed through an electromagnet 152 via an excitation switch circuit composed of switches 154, 154A, 154B, and 154C. , 152A, 152B, and 152C, the excitation operation unit is configured. Here, each of the electromagnets 152A, 152B, and 152C is an electromagnet group in which a plurality of unit electromagnets are connected in series or in parallel as described above. In FIG. 3C, each electromagnet is illustrated as one electromagnet. ing. FIG. 3C shows an example of the excitation operation unit, and the present invention is not limited to the configuration shown in FIG.

  The magnetic field movement in the configuration example of FIG. 3 is performed as follows. That is, as shown in FIG. 3C, the switches 154 and 154A are turned on to excite the electromagnets 152 and 152A, and the switches 154B and 154C are turned off and the electromagnets 152B and 152C are de-energized. As shown in FIG. 3A, a magnetic field (B) 155A indicated by a solid line is formed between the magnetic pole surface (eg, N pole) of the electromagnet 152 at the center and the magnetic pole surface (eg, S pole) of the electromagnet 152A on the outer diameter side. It is formed.

  From this state, when the switches 154 and 154B are turned on to excite the electromagnets 152 and 152B and the switches 154A and 154C are turned off and the electromagnets 152A and 152C are de-energized in FIG. As shown in FIG. 3A, a magnetic field (B) 155B indicated by a broken line is formed between the magnetic pole surface (for example, N pole) of the electromagnet 152 at the center and the magnetic pole surface (for example, S pole) of the outer side electromagnet 152B. Accordingly, the magnetic field generated by the magnetic field generation unit 150 moves so as to spread toward the outer diameter side around the electromagnet 152, and the region where the magnetic field and the electric field are orthogonal to each other moves toward the outer diameter side. And the part in which the ion in the plating bath 11 becomes high concentration can be moved by the movement of such a magnetic field.

  As described above, the configuration example of FIG. 3 is a system in which a magnetic field is moved by switching on and off a plurality of electromagnets and switching a magnetic field pattern, and as a magnetic field generation means (FIGS. 1 and 3A to 3A). As shown in FIG. 3 (b), a central magnet (electromagnet or permanent magnet) and a plurality of annular electromagnets arranged concentrically around the central magnet (electromagnet or permanent magnet), An electromagnet power source that supplies an excitation current to each cylindrical electromagnet and an excitation power source that controls the flow of the excitation current to each cylindrical electromagnet while being arranged on a plane parallel to the in-plane direction of the cathode electrode 21. An excitation operation unit including a switch circuit is provided. In the configuration example of FIG. 3, the excitation current flow state of each annular electromagnet is switched by a switch operation in the excitation switch circuit, and the magnetic field is combined with the magnet in the center (electromagnet or permanent magnet). By switching the annular electromagnet to be formed, the magnetic field can be moved in parallel with the in-plane direction of the cathode electrode 21 without a mechanical movement mechanism. It is suitable as.

  In the configuration example of FIG. 3, in the configuration shown in FIGS. 3A to 3C where the central magnet is also an electromagnet, the electromagnet power source 153 is an AC power source, and the magnetic pole surface of the central electromagnet is used. And an alternating magnetic field may be formed between the magnetic pole surface of each annular electromagnet.

  (B) FIG. 4 is a diagram showing a further different configuration example of the magnetic field movement method in the first embodiment of the present invention, and FIG. 4A is a side sectional view of the magnetic field generating means 160 in this configuration example. 4B is a plan view of the magnetic field generating means 160 (as viewed from the arrow P2 in FIG. 4A), and FIG. 4C is an excitation operation unit for each electromagnet constituting the magnetic field generating means 160. It is a circuit diagram which shows an example in principle.

  As shown in FIGS. 4A to 4B, the magnetic field generating means 160 in this configuration example includes a plurality (37 in the figure) of electromagnets 162s1 to 162s37 (hereinafter referred to as “unit electromagnets”), for example, approximately hexagonal columnar. Are also arranged so as to be two-dimensionally densely arranged on a flat magnetic member 161 for forming a magnetic circuit (that is, in a cross-sectional shape of a honeycomb), on one side of each electromagnet It arrange | positions so that a magnetic pole surface may contact | connect the magnetic member 161 side. Note that the shape of the unit electromagnets 162s1 to 162s37 is not limited to the hexagonal column shape as shown in FIG. 4B, but may be any shape suitable for two-dimensionally densely arranging on the magnetic member 161. Good. The magnetic field generating means 160 in this configuration example is arranged so that the magnetic pole surface of each unit electromagnet on the diamagnetic member 161 side faces the cathode electrode (substrate) 21 in FIG. The plate surface 161 is parallel to the in-plane direction of the cathode electrode 21. Here, in the following description, it is assumed that the exciting coils of the unit electromagnets 162s1 to 162s37 are all wound with the same polarity. The numbers “1” to “37” in FIG. 4B are described as abbreviations indicating the unit electromagnets 162s1 to 162s37.

  Then, as shown in FIG. 4C, the direct current excitation current from the positive electrode VP and the negative electrode VN of the electromagnet power source 163 is a switch pair provided for each unit electromagnet, that is, “switches 164a1, 164b1” to “switches”. The excitation operation unit is configured to be supplied to the unit electromagnets 162s1 to 162s37 via the excitation switch circuit including the switches 164a37 and 164b37 ”. Here, the two switches constituting the switch pair, for example, the switches 164a19 and 164b19 corresponding to the unit electromagnet 162s19, are in three states of “connected to the positive electrode VP”, “connected to the negative electrode VN”, and “not connected”, respectively. The operation of these switches allows the “current of the first polarity to flow through the unit electromagnet” state and the “current of the second polarity to flow through the unit electromagnet”. The state and the state “the current does not flow through the unit electromagnet” can be selected. FIG. 4 (c) shows an example of the excitation operation unit, and the present invention is not limited to the configuration of FIG. 4 (c).

  The movement of the magnetic field in the configuration example of FIG. 4 is performed as follows. That is, as shown in FIG. 4C, each switch is operated so that the excitation current having the polarity shown by “Is19” flows through the unit electromagnet 162s19 disposed in the center of the magnetic member 161. Six unit magnets (162s12, 162s13, 162s18, 162s20, 162s25, 162s26) that are concentrically arranged adjacent to each other so as to surround the unit electromagnet 162s19 have excitation currents of opposite polarity to “Is19” (for example, “ Is20 ") is allowed to flow, and excitation current is not allowed to flow to the unit electromagnets other than the seven unit electromagnets. In this state, when the magnetic pole surface on the diamagnetic member 161 side of the unit electromagnet 162s19 is, for example, N-pole, all the magnetic pole surfaces on the diamagnetic member 161 side of the six unit magnets surrounding the unit electromagnet 162s19 are of opposite polarity. As shown in FIG. 4A, the magnetic pole surface (for example, N pole) of the unit electromagnet 162s19 and the six unit electromagnets (162s12, 162s13, 162s18, 162s20, 162s25, A magnetic field (B) 165A indicated by a solid line is formed between the magnetic pole face (for example, S pole) of 162s26).

  From the above state, by operating each switch in FIG. 4C, the magnetic pole surface on the diamagnetic member 161 side of the unit electromagnet 162s17 becomes, for example, the N pole and the six unit magnets (162s10, 162s10, 162) surrounding the unit electromagnet 162s17 162 s 11, 162 s 16, 162 s 18, 162 s 23, 162 s 24), the magnetic pole surfaces on the diamagnetic member 161 side are all S poles of opposite polarity, and the unit electromagnets other than the above seven are not excited and do not form magnetic poles. 4A, the magnetic pole surface (for example, N pole) of the unit electromagnet 161s17 and the magnetic pole surfaces of the six unit electromagnets (162s10, 162s11, 162s16, 162s18, 162s23, 162s24) on the outer diameter side thereof. For example, a magnetic field (B) 165B indicated by a broken line is formed between the magnetic field and the south pole. Along with this, the magnetic field generated by the magnetic field generating means 160 moves in parallel to the in-plane direction of the cathode electrode (object to be plated) 21, and the region where the magnetic field and the electric field are orthogonal to each other moves. And the part in which the ion in the plating bath 11 becomes high concentration can be moved by the movement of such a magnetic field. In addition, as described above, if the relative positional relationship between the unit electromagnets forming the magnetic field is maintained before and after the switching operation by the excitation switch circuit, the shape of the magnetic field does not change before and after the movement of the magnetic field. Can be.

  3 is configured such that the center position of the magnetic field generated by the magnetic field generating means 150 is fixed to the position of the magnet 152, whereas the configuration example illustrated in FIG. 4 is an excitation for the unit electromagnets 162s1 to 162s37. Since the magnetic field can be moved to an arbitrary position by the operation, it is more suitable for setting an arbitrary portion of the object to be plated to an arbitrary plating film thickness.

  As described above, the configuration example of FIG. 4 is a method of moving the magnetic field by switching the pattern of the magnetic field by turning on and off the plurality of electromagnets and switching the polarity, and as a magnetic field generating means (see FIG. 1 and FIG. ) To electromagnet for arranging a plurality of unit electromagnets two-dimensionally on a plane parallel to the in-plane direction of the cathode electrode 21 and supplying an excitation current to each unit electromagnet (as shown in FIG. 4B) An excitation operation unit comprising a power source and an excitation switch circuit for controlling the flow of excitation current to each unit electromagnet is provided. In the configuration example of FIG. 4, the switching operation of the excitation switch circuit switches the excitation current flow state of each unit electromagnet, that is, the state where “the current of the first polarity flows”, Is switched between the three states of "the current of the polarity of the current" and the state of "the current does not flow", and the combination of the unit electromagnets forming the magnetic field is switched to move mechanically. Since the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode 21 without a mechanism, it is suitable as the magnetic field moving method in the first embodiment of the present invention.

  In the configuration example of FIG. 4, in the configuration shown in FIGS. 4A to 4C, an AC magnetic field is formed between the magnetic pole surfaces of the unit electromagnets using the electromagnet power source 163 as an AC power source. It may be.

(A) FIG. 5 is a block diagram showing an electroplating apparatus according to Embodiment 2 of the present invention, and schematically shows the structure of the electroplating apparatus viewed from above (vertical direction). As shown in FIG. 5, the electrolytic plating apparatus of Example 2 includes a pair of anode electrodes 20 and 20 connected to a plating power source 22 in a plating bath 11 (plating solution put in the plating tank 10). An electrode portion including a cathode electrode 21 disposed between the anode electrodes is disposed, and a first electrode is disposed on both side surfaces (left and right side surfaces) of the cathode electrode (material to be plated) 21 in the electrode portion. The magnetic field generator 230 is provided with the magnetic pole 230A and the second magnetic pole 230B. In addition, the arrangement | positioning location of the 1st magnetic pole 230A and the 2nd magnetic pole 230B of the magnetic field generation | occurrence | production means 230 in the electroplating apparatus of Example 2 is different from FIG. 5, ie, the cathode electrode (material to be plated) 21. The upper and lower side surfaces may be provided.

  The first magnetic pole 230A and the second magnetic pole 230B in the magnetic field generating means 230 are held and fixed by a magnetic pole holding portion 230C. In the magnetic pole holding part 230C, a magnetic circuit part (not shown) is provided between the first magnetic pole 230A and the second magnetic pole 230B.

In the electroplating apparatus of the second embodiment, as in the electroplating apparatus of the first embodiment, the magnetic field generating means 230 may be a permanent magnet or an electromagnet. Further, as the magnetic field generating means 230 in the case of using an electromagnet, either a configuration for generating a DC magnetic field or a configuration for generating an AC magnetic field can be applied.
(B) In the electroplating apparatus of Example 2, the electric field (E) 23 generated between the anode electrode 20 and the cathode electrode 21 and the electric field (E) 23 generated from the magnetic field generating means 230 are orthogonal to each other. The ions in the plating bath 11 are subjected to Lorentz force by the magnetic field (B) 231 having a component, and the plating bath 11 is stirred. And in the electroplating apparatus of Example 2, similarly to the electroplating apparatus of Example 1, even if it is the structure which uses a permanent magnet as the magnetic field generation means 230 or the structure which generates a DC magnetic field with an electromagnet, the stirring effect is obtained. It can be sufficient.

  In addition, since the electrolytic plating apparatus of Example 2 has an electrode portion configuration including a pair of anode electrodes 20 and 20 and a cathode electrode 21 (a plated object) disposed between the anode electrodes, once This is particularly suitable when it is desired to deposit the plating on both surfaces of the object to be plated in this plating process.

  In the electroplating apparatus of the second embodiment, as in the electroplating apparatus of the first embodiment, the magnetic field distribution in the entire plating bath 11 is such that the region near the cathode electrode 21 is a high magnetic field due to the magnetic field formed by the magnetic field generating means 230. This magnetic field distribution acts as a confinement magnetic field for ions. Therefore, ions in the plating bath 11 gather on the cathode electrode 11 side, and a concentration distribution is formed in which the ion concentration becomes high in the vicinity of the cathode electrode 21. For this reason, the same plating effect as the plating by the high concentration plating bath can be obtained even in the low concentration plating bath, and the high speed plating can be performed even in the low concentration plating bath.

  In the electroplating apparatus according to the second embodiment, the magnetic field generated by the magnetic field generating unit 230 is a second magnetic field disposed from the magnetic pole surface of the first magnetic pole 230 </ b> A disposed on one side surface of the cathode electrode 21 to the other side surface side. Unlike the electrolytic plating apparatus according to the first embodiment, the magnetic field is linearly directed to the magnetic pole surface of the magnetic pole 230B of the magnetic pole 230B. Thus, the cycloid motion that draws a circle in parallel with the in-plane direction of the cathode electrode 21 by Lorentz force. I can't let you. On the other hand, in the electroplating apparatus of Example 2, one surface of the cathode electrode 21 (surface facing the left anode electrode 20 in FIG. 5) and the other surface (surface facing the right anode electrode 20 in FIG. 5) Thus, since the direction of the electric field (E) 23 formed between the opposing anode electrodes 20 and 20 is opposite, the direction of the Lorentz force received by the ions is also opposite. A flow that circulates around the (plating object) 21, that is, a flow in which ions circulate between the plating bath region on one side of the cathode electrode 21 and the plating bath region on the other side (FIG. 5). (See “Ion Flow Direction 244” in FIG. 4), and thus the stirring effect of the plating bath in the vicinity of the cathode electrode (object to be plated) 21 is high. .

In the configuration in which the magnetic field generated by the AC magnetic field generating means 230 is an AC magnetic field, the undulating portion of the object to be plated is included due to the turbulent flow effect due to the periodic change of the direction of the Lorentz force received by the ions in the plating bath. The uniformity of the plated film thickness can be further improved.
(C) In the electroplating apparatus of the second embodiment, similarly to the electroplating apparatus of the first embodiment, the magnetic field generating means moving device 232 mechanically engaged with the magnetic pole holding portion 230C of the magnetic field generating means 230. Thus, the magnetic field generating means 230 can be moved in parallel with the in-plane direction of the cathode electrode (object to be plated) 21. As the magnetic field generating means 230 moves, the magnetic field also moves in parallel to the in-plane direction of the cathode electrode (object to be plated) 21, thereby moving the portion where ions in the plating bath 11 have a high concentration. The plating concentration reaction is accelerated in the high concentration portion than in the low concentration portion. For this reason, for example, the magnetic field generating means 230 is moved so that the high-concentration portion moves to the vicinity of the portion where the plating is difficult to deposit on the object having a lot of unevenness on the surface. By promoting the precipitation, it becomes possible to further improve the uniformity of the plating film thickness in the entire object to be plated. Further, by moving the magnetic field generating means 230, it is possible to set an arbitrary plating film thickness at an arbitrary position in the object to be plated.
(D) As a magnetic field moving method in the second embodiment, the configuration in which the magnetic field generating means moving device 232 mechanically engaged with the magnetic pole holding portion 230C in the magnetic field generating means 230 is shown. The system is not limited to the above configuration, and for example, the following configuration can be applied.

  (A) FIG. 6 is a diagram showing a different configuration example of the magnetic field movement method in the second embodiment of the present invention, and FIG. 6 (a) is a side sectional view of the magnetic field generating means 250 in this configuration example. FIG. 6B is a circuit diagram showing in principle an example of an excitation operation unit for each electromagnet constituting the magnetic field generating means 250. And the P3 arrow direction of Fig.6 (a) respond | corresponds to the direction (depth direction of the paper surface in FIG. 5) which looked at the electroplating apparatus from upper direction (vertical direction).

  As shown in FIG. 6A, the magnetic field generating means 250 in the present configuration example is provided on an approximately U-shaped magnetic member 251 for forming electromagnets 252A1 to 252E1 and 252A2 to 252E2. For example, each N pole side of the electromagnets 252A1 to 252E1 and each S pole side of the electromagnets 252A2 to 252E2 are disposed so as to be in contact with the magnetic member 251 side. The electromagnets 252A1 and 252A2, the electromagnets 252B1 and 252B2, the electromagnets 252C1 and 252C2, the electromagnets 252D1 and 252D2, and the electromagnets 252E1 and 252E2 are arranged to form an electromagnet pair facing each other. In addition, although the polarities of “S” and “N” are described for each electromagnet in FIG. 6A, this indicates the polarity in the excited state of each electromagnet. Further, the magnetic field generating means 250 in this configuration example is such that, for example, the magnetic pole surfaces on the S pole side of the electromagnets 252A1 to 252E1 and the magnetic pole surfaces on the N pole side of the electromagnets 252A2 to 252E2 are cathode electrodes (substances to be plated) in FIG. It arrange | positions so that the side edge of 21 may be opposed.

  The electromagnets 252A1 to 252E1 and 252A2 to 252E2 are each configured as, for example, a substantially cylindrical or a substantially prismatic electromagnet. Although FIG. 6 shows a configuration in which five electromagnet pairs are provided, the present invention is not limited to the configuration in FIG.

  Then, as shown in FIG. 6B, the direct current excitation current from the positive electrode VP and the negative electrode VN of the electromagnet power supply 253 is supplied to the electromagnet pair 252A1, via the excitation operation switch circuit including the switches 254A to 254E. The excitation operation unit is configured so as to be supplied to 252A2 to the electromagnet pairs 252E and 252E2. Note that FIG. 6B shows an example of the excitation operation unit, and the present invention is not limited to the configuration of FIG. 6B.

  The movement of the magnetic field in the configuration example of FIG. 6 is performed as follows. That is, as shown in FIG. 6B, in a state where the switch 254C is turned on to excite the electromagnet pairs 252C1 and 252C2, and the other switches are turned off to make the other electromagnet pairs non-excited. As shown in a), a magnetic field (B) 255A indicated by a solid line is formed between the magnetic pole surface (S pole in the drawing) of the electromagnet 252C1 and the magnetic pole surface (N pole in the drawing) of the electromagnet 252C2.

  From the above state, for example, when the switch 254D is turned on in FIG. 6B to excite the electromagnet pairs 252D1 and 252D2, and the other switches are turned off to switch the other electromagnet pairs to the non-excited state, FIG. As shown in FIG. 6A, a magnetic field (B) 255B indicated by a broken line is formed between the magnetic pole surface (S pole in the drawing) of the electromagnet 252D1 and the magnetic pole surface (N pole in the drawing) of the electromagnet 252D2. Accordingly, the magnetic field generated by the magnetic field generation means 250 moves in parallel with the in-plane direction of the cathode electrode (object to be plated) 21, thereby moving a region where the magnetic field and the electric field are orthogonal to each other. And the part in which the ion in the plating bath 11 becomes high concentration can be moved by the movement of such a magnetic field.

  As described above, the configuration example of FIG. 6 is a system in which a plurality of electromagnet pairs are turned on and off to move a magnetic field, and two electromagnets (for example, 252A1, 252A2) are used as magnetic field generating means (see FIGS. 5 and 5). 6 (a)), an electromagnet pair arranged such that magnetic pole faces having different polarities face each other in a positional relationship sandwiching the cathode electrode 21 from both sides of the cathode electrode 21 and the in-plane direction of the cathode electrode 21 Excitation operation unit comprising a plurality of electromagnet power supplies that supply an excitation current to each electromagnet pair and an excitation switch circuit that controls the flow of the excitation current to each electromagnet pair while being arranged in parallel along a parallel direction Is provided. In the configuration example of FIG. 6, the excitation current flow state of each electromagnet pair is switched by the switch operation in the excitation switch circuit, and the electromagnet pair forming the magnetic field is switched, so that there is no mechanical movement mechanism. Since the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode 21, it is suitable as the magnetic field moving method in the second embodiment of the present invention.

  In the configuration example of FIG. 6, in the configuration shown in FIGS. 6A to 6B, an AC magnetic field may be formed by an electromagnet pair using the electromagnet power supply 253 as an AC power supply.

10 ... plating tank, 11 ... plating bath (plating solution put in the plating tank 10)
20 ... Anode electrode, 21 ... Cathode electrode (object to be plated), 22 ... Plating power source, 23 ... Electric field (E)
30, 130, 230 ... magnetic field generating means, 30A, 230A ... first magnetic pole, 30B, 230B ... second magnetic pole, 130A ... first magnetic pole (central magnetic pole), 130B ... Second magnetic pole (outer diameter side magnetic pole), 130C, 230C ... Magnetic pole holder, 31, 131, 231 ... Magnetic field (B), 132, 232 ... Moving device for magnetic field generating means 41 ... Ion, 142 ... Lorentz force, 143 ... Magnetic field line, 244 ... Ion flow direction 150 ... Magnetic field generating means, 151 ... Magnetic member, 152, 152A, 152B, 152C .. Electromagnet, 152As1 to 152As6, 152Bs1 to 152Bs6, 152Cs1 to 152Cs6... Unit electromagnet, 153... Power supply for electromagnet, 154, 154A, 154B, 154C. Switch, 155A, 155B ··· magnetic field (B)
160 ... magnetic field generating means, 161 ... magnetic member, 162s1 to 162s37 ... unit electromagnet, 163 ... power supply for electromagnet, 164a1 to 164a37,164b1 to 164b37 ... switch, 165A, 165B ... Magnetic field (B)
250 ... magnetic field generating means, 251 ... magnetic member, 252A1-E1,252A2-E2 ... electromagnet, 253 ... power supply for electromagnet, 254A-254E ... switch, 255A, 255B ... magnetic field (B)

Claims (7)

In an electroplating apparatus in which an anode electrode and a cathode electrode that form an electrode portion are disposed opposite to each other in a plating bath, and plating is performed by applying an electric field between the anode electrode and the cathode electrode.
A magnetic field generating means for forming a magnetic field having a component orthogonal to the electric field in the vicinity of the cathode electrode is disposed on the side opposite to the anode electrode of the cathode electrode,
An electroplating apparatus comprising: a magnetic field moving means capable of moving the magnetic field in parallel with the in-plane direction of the cathode electrode. The magnetic field generation means is concentrically on the outer diameter side in a direction parallel to the in-plane direction of the cathode electrode with respect to the first magnetic pole as a pair of magnetic poles. A second magnetic pole disposed,
2. The electroplating apparatus according to claim 1, wherein a magnetic field is formed between the magnetic pole surface of the first magnetic pole in the central portion and the magnetic pole surface of the second magnetic pole on the outer diameter side. As the magnetic field generating means, a central magnet and a plurality of annular electromagnets arranged concentrically around the central magnet are arranged on a plane parallel to the in-plane direction of the cathode electrode, An excitation operation unit comprising an electromagnet power source for supplying an excitation current to each annular electromagnet and an excitation switch circuit for controlling the flow of the excitation current to each annular electromagnet,
The excitation current flow state of each annular electromagnet is switched by the excitation switch circuit, and the annular electromagnet that forms a magnetic field in combination with the magnet at the center is switched to change the magnetic field in the plane of the cathode electrode. The electroplating apparatus according to claim 1, wherein the electroplating apparatus can be moved in parallel with the direction. As the magnetic field generating means, a plurality of unit electromagnets are two-dimensionally arranged on a plane parallel to the in-plane direction of the cathode electrode, and an electromagnet power source for supplying an excitation current to each unit electromagnet, and to each unit electromagnet An excitation operation unit consisting of an excitation switch circuit that controls the flow of excitation current of
By switching the excitation current flow state of each unit electromagnet by the excitation switch circuit and switching the combination of the unit electromagnets forming the magnetic field, the magnetic field is moved in parallel to the in-plane direction of the cathode electrode. 2. The electrolytic plating apparatus according to claim 1, wherein In an electroplating apparatus in which an anode electrode and a cathode electrode that form an electrode portion are disposed opposite to each other in a plating bath, and plating is performed by applying an electric field between the anode electrode and the cathode electrode.
The electrode section is composed of a pair of anode electrodes and a cathode electrode disposed between the anode electrodes, and forms a magnetic field having a component orthogonal to the electric field in a region near the cathode electrode. The generating means is disposed on the side surface of the cathode electrode,
An electroplating apparatus comprising: a magnetic field moving means capable of moving the magnetic field in parallel with the in-plane direction of the cathode electrode. As the magnetic field generating means, an electromagnet pair in which two electromagnets are arranged such that magnetic pole faces having different polarities face each other in a positional relationship sandwiching the cathode electrode from both sides is defined as an in-plane direction of the cathode electrode. Excitation operation unit comprising a plurality of electromagnet power supplies that supply an excitation current to each electromagnet pair and an excitation switch circuit that controls the flow of the excitation current to each electromagnet pair while being arranged in parallel along a parallel direction Provided,
By switching the exciting current flow state of each electromagnet pair by the excitation switch circuit and switching the electromagnet pair forming the magnetic field, the magnetic field can be moved in parallel to the in-plane direction of the cathode electrode. The electroplating apparatus according to claim 5, wherein   The electroplating apparatus according to claim 1, wherein the magnetic field generated by the magnetic field generating unit is an alternating magnetic field.