JP2011195824A5 - - Google Patents
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- JP2011195824A5 JP2011195824A5 JP2011036630A JP2011036630A JP2011195824A5 JP 2011195824 A5 JP2011195824 A5 JP 2011195824A5 JP 2011036630 A JP2011036630 A JP 2011036630A JP 2011036630 A JP2011036630 A JP 2011036630A JP 2011195824 A5 JP2011195824 A5 JP 2011195824A5
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- polyphenylene sulfide
- sulfide resin
- weight
- parts
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
なお、(B)エチレンと炭素原子数3〜20のα−オレフィンとからなるエチレン・α−オレフィン系ブロック共重合体、(C)官能基含有オレフィン系共重合体、(D)無機充填材およびその他添加剤としては、それぞれ下記のものを使用した。
B1 エチレン・1−オクテンブロック共重合体(ダウケミカル社製インフューズ9107、密度866kg/m 3 、融点121℃、ガラス転移点−62℃)
B2 エチレン・1−オクテンブロック共重合体(ダウケミカル社製インフューズ9100、密度877kg/m 3 、融点120℃、ガラス転移点−62℃)
B3 エチレン・1−オクテンブロック共重合体(ダウケミカル社製インフューズ9807、密度866kg/m 3 、融点118℃、ガラス転移点−62℃)
b1(比較例) エチレン・1−ブテンランダム共重合体(三井化学(株)社製タフマーTX650、密度864kg/m 3 、融点無し、ガラス転移点−64℃)
b2(比較例) エチレン・1−ヘキセンランダム共重合体(三井化学(株)社製エクセレンFX CX2001、密度898kg/m 3 、融点94℃、ガラス転移点不明)
b3(比較例) エチレン・1−オクテンランダム共重合体(ダウケミカル社製エンゲージ8100、密度870kg/m 3 、融点無し、ガラス転移点−55℃)
C1 エチレン・グリシジルメタクリレート共重合体(住友化学(株)社製ボンドファーストE、密度940kg/m 3 、融点103℃、ガラス転移点−26℃)
D1 チョップドストランド(日本電気硝子(株)社製T−747 3mm長、平均繊維径13μm)
その他添加剤E1 脂肪酸エステルワックス(クラリアントジャパン社製リコワックスE)。
(B) an ethylene / α-olefin block copolymer comprising ethylene and an α-olefin having 3 to 20 carbon atoms, (C) a functional group-containing olefin copolymer, (D) an inorganic filler, and As other additives, the following were used.
B1 ethylene / 1-octene block copolymer (Infuse 9107, Dow Chemical Company, density 866 kg / m 3 , melting point 121 ° C., glass transition point −62 ° C.)
B2 ethylene / 1-octene block copolymer (Infuse 9100 manufactured by Dow Chemical Company, density 877 kg / m 3 , melting point 120 ° C., glass transition point −62 ° C.)
B3 ethylene / 1-octene block copolymer (Infuse 9807 manufactured by Dow Chemical Company, density 866 kg / m 3 , melting point 118 ° C., glass transition point −62 ° C.)
b1 (Comparative Example) Ethylene / 1-butene random copolymer (Tafmer TX650 manufactured by Mitsui Chemicals, Inc., density 864 kg / m 3 , no melting point, glass transition point −64 ° C.)
b2 (Comparative example) Ethylene / 1-hexene random copolymer (Mitsui Chemicals, Inc. Exelen FX CX2001, density 898 kg / m 3 , melting point 94 ° C., glass transition point unknown)
b3 (Comparative Example) Ethylene / 1-octene random copolymer (Dow Chemical Engage 8100, density 870 kg / m 3 , no melting point, glass transition point −55 ° C.)
C1 ethylene glycidyl methacrylate copolymer (Sumitomo Chemical Co., Ltd. Bond First E, density 940 kg / m 3 , melting point 103 ° C., glass transition point −26 ° C.)
D1 chopped strand (manufactured by Nippon Electric Glass Co., Ltd. T-747 3 mm long, average fiber diameter 13 μm)
Other additives E1 Fatty acid ester wax (Lycowax E manufactured by Clariant Japan).
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011036630A JP5494526B2 (en) | 2010-02-25 | 2011-02-23 | Polyphenylene sulfide resin composition and molded article thereof |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010039610 | 2010-02-25 | ||
JP2010039610 | 2010-02-25 | ||
JP2011036630A JP5494526B2 (en) | 2010-02-25 | 2011-02-23 | Polyphenylene sulfide resin composition and molded article thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011195824A JP2011195824A (en) | 2011-10-06 |
JP2011195824A5 true JP2011195824A5 (en) | 2013-05-09 |
JP5494526B2 JP5494526B2 (en) | 2014-05-14 |
Family
ID=44874429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011036630A Expired - Fee Related JP5494526B2 (en) | 2010-02-25 | 2011-02-23 | Polyphenylene sulfide resin composition and molded article thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5494526B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103987784B (en) | 2011-12-28 | 2015-11-25 | 东丽株式会社 | The products formed of polyphenyl thioether resin composition, this resin combination and the manufacture method of this resin combination |
WO2013168313A1 (en) * | 2012-05-11 | 2013-11-14 | ポリプラスチックス株式会社 | Resin composition for light-reflective component |
US20150168603A1 (en) * | 2012-06-26 | 2015-06-18 | Polyplastics Co., Ltd. | Light-reflecting component and method for producing same |
CN103951977B (en) * | 2014-04-18 | 2016-01-06 | 安徽省中日农业环保科技有限公司 | A kind of automotive plastic parts glass microballon modified polyphenyl thioether material |
JP2016046095A (en) * | 2014-08-22 | 2016-04-04 | 東レ株式会社 | High withstand voltage connector comprising polyphenylene sulfide resin composition |
EP3130636A1 (en) | 2015-08-13 | 2017-02-15 | 3M Innovative Properties Company | Polyolefin composition comprising hollow glass microspheres |
CN109370481B (en) * | 2018-10-19 | 2021-03-16 | 河源市普立隆新材料科技有限公司 | Adhesive resin for polymer lithium battery flexible packaging film and preparation method thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05186688A (en) * | 1992-01-09 | 1993-07-27 | Dainippon Ink & Chem Inc | Production of resin composition |
JPH06263938A (en) * | 1993-03-16 | 1994-09-20 | Mitsui Petrochem Ind Ltd | 4-methyl-1-pentene polymer composition |
JP4887785B2 (en) * | 2005-01-07 | 2012-02-29 | 住友化学株式会社 | Polypropylene resin composition and molded body |
-
2011
- 2011-02-23 JP JP2011036630A patent/JP5494526B2/en not_active Expired - Fee Related
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