JP2011189622A - Housing, method of manufacturing housing and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a warpage or a shrink without having an influence on an exterior of a resin part formed by an insert molding. <P>SOLUTION: A housing includes a plate-like body 10, and the resin part 20 which is arranged to cover one main surface of at least part of the plate-like body 10 from the other main surface and is disproportionately arranged at one main surface of the plate-like body 10 in a direction perpendicular to the main surface of the plate-like body 10. The housing 1 is provided with a volume adjusting part 30 arranged in the resin part 20 in one main surface side of the plate-like body 10. A method of manufacturing the housing 1 and an electronic device using the housing 1 are also provided. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a housing, a method for manufacturing the housing, and an electronic device, and for example, relates to a housing in which a plate-like body is insert-molded in a resin portion, a method for manufacturing the housing, and an electronic device.

  In recent years, electronic devices such as mobile phones, personal computers, and home appliances have been reduced in size and thickness, and high-strength and complicated shapes are required for housings. In addition, a display, a circuit board, a battery, and the like are efficiently stored in a limited space inside the housing. For example, in a mobile phone, the battery is thicker and the key sheet on which the telephone number is drawn is thinner in order to extend the pot life. Cases used in these electronic devices are often used in which a resin serving as a frame portion is formed by insert molding on the periphery of a sheet metal. In the case of storing components in this housing, an arrangement is devised to reduce the total thickness of the electronic device by stacking the sheet metal in the thickness direction (see, for example, Patent Document 1).

  However, in such a housing, the resin serving as the frame portion is offset with respect to the sheet metal, and the thicknesses of the resin materials on the front and back sides of the sheet metal are different. Therefore, the difference in molding shrinkage due to the difference in resin volume between the front and back surfaces of the sheet metal causes warping and sinking of the entire casing.

  For this reason, generally, measures are taken to remove the thickness of the resin part in the insert molding. By making the front and back volumes equal by removing the meat, the amount of molding shrinkage becomes equal on the front and back, and the overall warpage and sink marks can be improved. However, in this technique, a thinned shape remains on the surface of the resin portion in insert molding, and there arises a problem that the strength of the housing is insufficient and that the design is impaired in appearance.

JP 2009-042393 A

  The present invention provides a casing, a casing manufacturing method, and an electronic device that suppresses a lack of strength of the casing formed by insert molding, prevents the appearance of the resin part, and prevents warping and sink marks. To do.

  According to an aspect of the present invention, a plate-like body and at least a part of the plate-like body are provided so as to cover the other main surface from one main surface, and are perpendicular to the main surface of the plate-like body. And a resin portion provided in a biased direction toward the one main surface of the plate-like body, and a volume adjusting portion is provided in the resin portion on the one main surface side of the plate-like body. A housing characterized by this is also provided.

  According to another aspect of the present invention, the step of fixing the volume adjusting part to a part of one main surface of the plate-like body, and at least one of the plate-like body and at least one of the volume adjusting parts. Including the portion, covering the other main surface from the one main surface of the plate-shaped body, and toward the one main surface side of the plate-shaped body in a direction perpendicular to the main surface of the plate-shaped body And a step of forming the resin portion in a biased manner.

  According to another aspect of the present invention, a plate-like body and at least a part of the plate-like body are provided so as to cover the other main surface from one main surface, and the main surface of the plate-like body is provided. And a resin portion provided in a direction perpendicular to the one main surface side of the plate-like body, and adjusting the volume in the resin portion on the one main surface side of the plate-like body There is provided an electronic apparatus comprising a casing provided with a portion and an electronic circuit provided in the casing.

  ADVANTAGE OF THE INVENTION According to this invention, while suppressing the intensity | strength shortage of the housing | casing formed by insert molding, and not giving the influence on an external appearance to a resin part, a housing | casing, the manufacturing method of an housing | casing, and an electronic device Can be realized.

It is a perspective view explaining the example of the housing | casing which concerns on the 1st Embodiment of this invention. It is a perspective view explaining the example of arrangement | positioning of a volume adjustment part. FIG. 2 is a schematic cross-sectional view of the periphery of the volume adjusting unit, where (a) is a cross-sectional view taken along the line AA ′ of the example of the present embodiment shown in FIG. 2, and (b) is a comparative example (No. 1) at the same position, (c) is a figure which shows the comparative example (the 2) of the same position. It is a schematic cross section explaining the housing | casing which concerns on the 2nd Embodiment of this invention. It is a schematic cross section explaining in order the manufacturing method of the case concerning a 3rd embodiment of the present invention. It is a schematic cross section explaining the example of attachment of a volume adjustment part. It is a model perspective view explaining the other example of a volume adjustment part. It is a schematic cross section explaining the example of the housing | casing which concerns on the 4th Embodiment of this invention. It is a perspective view explaining the example of the housing | casing which concerns on the 5th Embodiment of this invention. It is a perspective view explaining the example of the electronic device which concerns on the 6th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, a first embodiment of the present invention will be described. FIG. 1 is a perspective view illustrating an example of a housing according to the first embodiment of the present invention. The housing 1 according to the first embodiment includes a plate-like body 10 and at least a part of the plate-like body 10 from one main surface (referred to as “surface” in the present embodiment) to the other main surface (this In the embodiment, it is referred to as a “back surface”.) And a volume adjusting unit 30 provided in the resin part 20 on the plate-like body 10 is provided.

  The plate-like body 10 is formed by pressing a flat plate made of a metal such as aluminum into a predetermined size and shape. In the example shown in FIG. 1, a plate-like body 10 having a rectangular outer shape is shown, but a hole or notch may be formed at a predetermined position. In the present embodiment, a metal flat plate is taken as an example of the plate-like body 10, but the present invention is not limited to metal, and other materials such as a resin may be used.

  The resin portion 20 is formed by inserting the plate-like body 10. In the example shown in FIG. 1, the resin portion 20 is provided so as to cover the front and back surfaces of the plate-like body 10 so as to surround the periphery of the plate-like body 10. The resin part 20 surrounds the periphery of the plate-like body 10 to form a frame, and a region for mounting a desired component is provided on the front and back surfaces of the plate-like body 10 that is the inside of the frame.

  The resin portion 20 is not limited to the portion surrounding the periphery of the plate-like body 10. For example, the resin portion 20 is provided on the entire front and back surfaces of the plate-like body 10, or the plate-like body 10 is sandwiched between the central portions of the plate-like body 10. It may be provided in a state.

  The volume adjusting unit 30 is made of, for example, a resin material (the same resin material as the resin unit 20 or a different resin material), metal, ceramics, and other various materials as appropriate. The volume adjusting unit 30 is provided in the plate-like body 10 in order to adjust the volume of the resin portion 20 on the front surface side and the resin portion 20 on the back surface side of the plate-like body 10.

  Here, the resin portion 20 is formed so as to be biased toward one main surface side (surface side in the present embodiment) of the plate-like body 10 in a direction perpendicular to the main surface of the plate-like body 10. That is, the resin portion 20 is provided such that the outer height on the front surface side is higher than the outer height on the back surface side with the plate-like body 10 therebetween. This is so that many components can be mounted on the main surface of the plate-like body 10 on the side where the resin portion 20 is provided in a biased manner.

  The volume adjusting unit 30 is provided inside the biased side of the resin portion 20 and plays the role of reducing the volume of the biased resin portion 20. That is, in the configuration in which the resin portion 20 is provided to be biased with respect to the plate-like body 10, the volume adjustment portion 30 is provided, so that the volume of the resin portion 20 is larger than that in the case where the volume adjustment portion 30 is not provided. The amount is reduced by the amount of the adjustment unit 30.

  In particular, in the present embodiment, the volume adjusting unit 30 is provided, so that the volume of the resin part 20 on the front surface side of the plate-like body 10 and the volume of the resin part 20 on the back surface side are set closer. More preferably, the volume adjusting part 30 is provided so that the volume of the resin part 20 on the surface of the plate-like body 10 is equal to the volume of the resin part 20 on the back side.

  By providing the volume adjusting part 30, when the plate-like body 10 is inserted and the resin part 20 is molded, the difference in the shrinkage amount of the resin part 20 between the front side and the back side of the plate-like body 10 is reduced. It is possible to suppress the effects caused by the difference in the amount of resin between the warped and sinked front and back.

  FIG. 2 is a perspective view illustrating an arrangement example of the volume adjusting unit. The volume adjusting unit 30 in the present embodiment is formed in a block shape, for example, and is a part where the resin part 20 (see FIG. 1) of the plate-like body 10 is molded, and the resin part 20 (see FIG. 1) is formed in a biased manner. Fixed to the front side. The size and arrangement of the volume adjusting unit 30 are appropriately set depending on the shape of the resin unit 20 to be molded. In the example shown in FIG. 2, a plurality of volume adjusting units 30 are arranged on the periphery of the plate-like body 10. As other arrangements, for example, the frame-shaped volume adjusting unit 30 may be arranged over the entire circumference of the periphery of the plate-like body 10. Moreover, the volume adjustment part 30 may be arrange | positioned at the back surface of the plate-shaped object 10 as needed.

  3A and 3B are schematic cross-sectional views of the periphery of the volume adjusting unit. FIG. 3A is a cross-sectional view taken along the line AA ′ in the example of the present embodiment shown in FIG. 2, and FIG. (1) and (c) are comparative examples (No. 2) at the same position.

  The comparative example (part 1) illustrated in FIG. 3B is an example in which the volume adjusting unit 30 as in the present embodiment is not provided. In forming the resin portion 20 by inserting the plate-like body 10, if the plate-like body 10 cannot be disposed near the center of the height of the resin portion 20 due to the structure, the resin portion 20 is biased to one side. In the example shown in FIG. 3B, the resin portion 20 is biased toward the surface side (upper side in the drawing) of the plate-like body 10. If the resin part 20 is biased in this way, the shrinkage amount on the side where the resin part 20 becomes thicker during insert molding becomes larger than that on the side where the resin part 20 becomes thin, and warping and sink marks occur.

  A comparative example (No. 2) shown in FIG. 3C is an example in which measures are taken against the comparative example (No. 1). In this example, the resin part 20 is provided in an uneven manner on the surface side of the plate-like body 10, and the lightening N is provided in the resin part 20 on the uneven side. By providing such a lightening N, the difference in volume of the resin portion 20 between the front surface side and the back surface side of the plate-like body 10 is reduced, and the occurrence of warpage and sink marks as in the comparative example (part 1) is suppressed. . However, if the hollow N is formed on the surface of the resin part 20, there arises a problem that the rigidity of the resin part 20 is deteriorated and the appearance is impaired.

  In the present embodiment shown in FIG. 3A, the resin portion 20 is provided in a biased manner on the surface side of the plate-like body 10, and the volume adjusting portion 30 is provided in the resin portion 20 on the biased side. . By providing the volume adjusting unit 30, the volume of the resin portion 20 on the biased side is reduced, and a difference from the volume of the resin portion 20 on the opposite side with respect to the plate-like body 10 is suppressed. As a result, the appearance of the resin portion 20 is flat as in the comparative example (part 1) shown in FIG. 3B, but the surface as in the comparative example (part 2) shown in FIG. The generation of warpage and sink marks can be suppressed without providing a recess. Moreover, the rigidity of the resin part 20 can also be improved by providing the volume adjusting part 30 inside the resin part 20.

  Here, the volume of the resin portion 20 on the front surface side and the back surface side of the plate-like body 10 specifically refers to the resin portion 20 corresponding to the position of the plate-like body 10 (range of w shown in FIG. 3A). ) Means the respective volumes of the resin portion 20a on the front surface side and the resin portion 20b on the back surface side (see hatched portions in the resin portion 20 in the figure). By providing the volume adjusting portion 30, the volume of the resin portion 20a on the front surface side is reduced as compared with the case where the volume adjusting portion 30 is not provided. Thus, by providing the volume adjusting part 30, the volume of the resin part 20a on the front surface side is made closer to the volume of the resin part 20b on the back surface side.

  Warpage and sink marks at the time of molding are caused by a difference between the volume of the resin portion 20a on the front surface side of the plate-like body 10 and the volume of the resin portion 20b on the back surface side. Therefore, in this embodiment, by providing the volume adjusting unit 30 having an appropriate size, the volume of the resin portion 20a on the front surface side is adjusted, and the difference from the volume of the resin portion 20b on the back surface side is suppressed.

  In the present embodiment, the volume adjusting unit 30 is provided only on the front surface side of the plate-like body 10, but may be provided on the back surface side and both the front and back surfaces as necessary. That is, in order to balance the front and back from the viewpoint of warping and sinking during molding depending on the shape of the resin part 20 of the entire casing, the volume adjusting part 30 is provided at an appropriate position, either front or back, or both. It may be.

(Second Embodiment)
FIG. 4 is a schematic cross-sectional view illustrating a housing according to the second embodiment of the present invention. Here, the description of the same configuration as that of the first embodiment is omitted, and the description will focus on the differences. FIG. 4 is a schematic cross-sectional view in the vicinity of the resin portion. In the example of the housing 1 shown in FIG. 4A, the antenna 40 is provided on the surface of the volume adjusting unit 30 provided in the resin portion 20 on the surface side of the plate-like body 10. The antenna 40 is affixed in advance to the surface of the volume adjusting unit 30, and the resin part 20 is formed by insert molding in this state. The antenna 40 is exposed on substantially the same surface of the surface of the resin portion 20.

  In this example, the volume adjusting unit 30 is used for adjusting the volume of the resin portion 20 and is also used as a pedestal for exposing the antenna 40 from the surface of the resin portion 20. The antenna 40 may be provided on the entire surface of the volume adjusting unit 30 or may be provided on a part of the surface. When the antenna 40 is provided on the entire surface of the volume adjustment unit 30, the height of the resin unit 20 is constant, and thus the volume of the resin unit 20 is adjusted by the width of the volume adjustment unit 30. On the other hand, when the antenna 40 is provided on a part of the surface of the volume adjusting unit 30, the height can be reduced in a portion where the antenna 40 is not provided. The volume of the resin part 20 is adjusted by the width.

  In the example of the housing 1 shown in FIG. 4B, the antenna 40 is provided on the surface of the volume adjusting portion 30 provided in the resin portion 20 on the surface side of the plate-like body 10 in FIG. The difference is that the antenna 40 is embedded in the resin portion 20. In this example, the height of the volume adjusting unit 30 is adjusted so that the antenna 40 attached to the surface is not exposed from the surface of the resin unit 20.

  In both the examples shown in FIGS. 4A and 4B, the antenna 40 is provided on the surface of the volume adjusting unit 30, but the antenna 40 shown in FIG. Is applied from the surface of the volume adjusting unit 30. This is because when the plate-like body 10 is made of metal, it is desired to separate the antenna 40 from the plate-like body 10 as much as possible, and the antenna 40 can be exposed to the surface. On the other hand, when it is not desired to show the antenna 40 in appearance, a countermeasure in which the antenna 40 shown in FIG. 4B is embedded in the volume adjusting unit 30 may be applied.

  In any of the examples, when the antenna 40 is insert-molded into the resin portion 20, the antenna 40 can be molded while being securely fixed to the volume adjusting portion 30, so that deformation of the antenna 40 during molding can be suppressed. In the example shown in FIGS. 4A and 4B, an example in which any antenna 40 is provided has been described. However, things other than the antenna 40, for example, wiring such as ground and power supply lines, electrodes, electronic components, and circuits Various things such as a functional member such as a substrate and a magnet can be attached. Further, the functional member such as the antenna 40 may be embedded in the back surface side or inside of the volume adjusting unit 30 other than the surface of the volume adjusting unit 30.

  The example of the housing 1 illustrated in FIG. 4C is an example in which a volume adjusting unit having a specific function is used. That is, for the volume adjusting unit 30 used in this example, for example, a material suitable for each function such as improvement in strength, improvement in heat dissipation, and improvement in electromagnetic shielding properties is used. In order to improve the strength, a material having a strength higher than that of the plate-like body 10 is used as the volume adjusting unit 30. In addition, in order to improve heat dissipation, a material having higher thermal conductivity than the plate-like body 10 is used as the volume adjusting unit 30. Moreover, when aiming at an electromagnetic shielding improvement, the material which was excellent in the shielding property with respect to a predetermined frequency is used for the volume adjustment part 30. FIG.

  The example of the housing 1 illustrated in FIG. 4D is an example in which the unevenness 300 is provided on the surface of the volume adjusting unit 30. The volume adjusting unit 30 is embedded in the resin unit 20 by insert molding. At this time, the adhesion between the resin part 20 and the volume adjusting part 30 is influenced by the material of the resin part 20 and the volume adjusting part 30. For example, if the same material is used, the adhesiveness is high, but if different materials are used, the adhesiveness tends to be low. For this reason, from the viewpoint of improving the adhesiveness between the resin part 20 and the volume adjusting part 30, a minute unevenness 300 is provided on the surface of the volume adjusting part 30, and the resin part 20 enters the unevenness 300 to improve the adhesiveness. Like that.

(Third embodiment)
Next, the manufacturing method of the housing according to the third embodiment of the present invention will be described. FIG. 5 is a schematic cross-sectional view for sequentially explaining a method for manufacturing a housing according to the third embodiment of the present invention. First, as shown in FIG. 5A, the volume adjusting unit 30 is attached to a predetermined position of the plate-like body 10. In the present embodiment, the volume adjusting unit 30 is attached to the peripheral portion on the surface side of the plate-like body 10 as shown in FIG.

  Here, an example of mounting the volume adjusting unit 30 will be described. FIG. 6 is a schematic cross-sectional view illustrating an example of attachment of the volume adjusting unit. FIG. 6A shows an example in which the volume adjusting unit 30 is connected to the plate-like body 10 by the adhesive B.

  FIG. 6B is an example in which the volume adjusting unit 30 is attached to the plate-like body 10 by fitting. In this example, the convex part 30a is provided in the back surface of the volume adjustment part 30, the concave part 10a is provided in the surface of the plate-like body 10, and the volume adjustment part 30 is attached by fitting these. The irregularities may be reversed. Further, the attachment strength may be adjusted by the shape of the unevenness, the fit, or the like, or it may be attached by a snap fit with a spring property.

  FIG. 6C shows an example in which the volume adjusting unit 30 is provided on the plate-like body 10 by outsert molding. In this example, the plate-like body 10 is provided with a tapered hole 10b extending from the front surface to the back surface, and the outsert molding using a mold is performed so that the convex portion 30b of the volume adjusting unit 30 enters the hole 10b. Do. Thereby, the convex part 30b of the provided volume adjustment part 30 will be hooked in the taper-shaped hole 10b of the plate-shaped body 10, and will be in the state fixed reliably.

  In addition to the above connection method, fixing using heat such as heat welding or heat caulking is also applicable.

  Returning to the description of FIG. After the volume adjusting unit 30 is attached to the plate-like body 10, as shown in FIG. 5C, the plate-like body 10 to which the volume adjusting unit 30 is attached is formed between the upper mold K1 and the lower mold K2. Hold between. At this time, the volume adjusting unit 30 is disposed in the cavity K0 configured between the upper mold K1 and the lower mold K2.

  Next, as shown in FIG. 5D, injection molding is performed in which molten resin is injected into the cavity K0 in this state. As a result, the resin is injected into the cavity K0, and the resin portion 20 surrounding the peripheral portion of the plate-like body 10 and the volume adjusting portion 30 is molded. When the molten resin is injected into the cavity K0, the volume adjusting unit 30 is disposed on the side of the plate-like body 10 where the volume of the cavity K0 is large. Therefore, there is no difference or less difference in the amount of resin injected. Thereby, the difference of the shrinkage | contraction amount at the time of hardening of resin is suppressed, and generation | occurrence | production of curvature and sink marks is prevented.

  After the resin injected into the cavity K0 is cured, the upper mold K1 and the lower mold K2 are opened. Thereby, the housing 1 is completed as shown in FIG. In the case 1 thus manufactured, even if the resin part 20 is formed to be biased with respect to the plate-like body 10, warping and sink marks are suppressed by the action of the internal volume adjustment part 30. It will be a thing.

(Other examples of volume adjustment unit)
FIG. 7 is a schematic perspective view illustrating another example of the volume adjusting unit. The volume adjusting unit 30 described above is any rectangular parallelepiped, but the example illustrated in FIG. 7 is an example other than a rectangular parallelepiped. FIG. 7A shows an example of the volume adjusting unit 30 having an oval shape in plan view. That is, the ends on both sides of the rectangular parallelepiped volume adjusting unit 30 are formed in a semi-cylindrical shape or a curved surface. Thereby, the flow of the molten resin when the resin part is injection-molded becomes smooth.

  FIG. 7B is an example in which both ends of the volume adjusting unit 30 are tapered. Even in such a shape that becomes thinner toward the tip, the flow of the molten resin when the resin portion is injection-molded becomes smooth.

  FIG.7 (c) is an example from which the height of the volume adjustment part 30 differs along a longitudinal direction. In this example, a part of the central part of the volume adjusting unit 30 is provided higher than the other parts. This is applied to the case where a component is attached so as to be exposed near or from the surface of the resin portion, such as when the antenna 40 shown in 4 (a) is provided.

(Fourth embodiment)
FIG. 8 is a schematic cross-sectional view illustrating an example of a housing according to the fourth embodiment of the present invention. The housing 1 according to the fourth embodiment is the same as the first embodiment in that the volume adjusting unit 30 is provided on the surface side of the plate-like body 10, that is, on the side where the resin portion 20 is biased. However, it is different in that the volume adjusting unit 30 is integrated with the plate-like body 10.

  The housing 1 shown in FIG. 8A is provided with a thicker portion of the plate-like body 10 serving as the volume adjusting unit 30 than the other portions. In other words, the housing 1 is formed such that the resin portion 20 into which the plate-like body 10 is inserted is biased toward the surface side, and the thickness of the plate-like body 10 disposed inside the biased resin portion 20 is the same. It is thicker than the thickness of the plate-like body 10 outside the resin portion 20. In order to configure such a plate-like body 10, for example, a metal plate having a thickness corresponding to the volume adjusting unit 30 is used, and parts other than the volume adjusting unit 30 are thinned by pressing or forging. .

  Since the volume adjusting unit 30 is provided integrally with the plate-like body 10, it is not necessary to separately attach the volume adjusting unit 30, and the number of parts can be reduced.

  The housing 1 shown in FIG. 8B is configured such that a portion that becomes the volume adjusting unit 30 in the plate-like body 10 bends an end portion of the plate-like body 10. In other words, the housing 1 is formed such that the resin portion 20 into which the plate-like body 10 is inserted is biased toward the surface side, and the end portion of the plate-like body 10 is bent at the biased side. . Since the thickness is increased by bending the end portion of the plate-like body 10, the role of the volume adjusting portion 30 is given to this portion. In the example shown in FIG. 8B, the end portion of the plate-like body 10 is bent once, but the thickness of the portion that becomes the volume adjusting portion 30 may be adjusted by bending it twice or more.

(Fifth embodiment)
FIG. 9 is a perspective view illustrating an example of a housing according to the fifth embodiment. The example of the housing 1 according to the fifth embodiment is characterized in that a step is provided in the plate-like body 10. That is, the step D is provided in the central part of the plate-like body 10, for example. Therefore, the amount of bias of the resin portion 20 provided at the peripheral edge of the plate-like body 10 is different at the step D. In the example shown in FIG. 9, the amount of bias of the resin portion 20 is less in the portion on the back side in the drawing than in the portion on the near side in the drawing.

  This corresponds to the case where it is desired to provide a change in the housing depth of the housing 1 depending on the thickness of the components housed in the housing 1 and the housing state (for example, the number of different layers in which the components are stacked and housed). is there. In the present embodiment, when there is a difference in the amount of deviation of the resin portion 20 due to the step D provided on the plate-like body 10, the height of the volume adjusting portion 30 is adjusted according to this amount.

  The schematic cross-sectional view shown in FIG. 9 is a cross-sectional view taken along the line B-B ′ and a cross-sectional view taken along the line C-C ′ in the perspective view. The amount of deviation of the resin portion 20 shown in the cross-sectional view along the line B-B 'is smaller than the amount of deviation of the resin portion 20 shown in the cross-sectional view along the line C-C'. For this reason, the resin part 20 shown in the sectional view taken along the line BB ′ is provided with a volume adjusting part 30b having a height h1, and the height h1 is placed on the resin part 20 shown in the sectional view taken along the line CC ′. A volume adjusting portion 30a having a higher height h2 is provided.

  That is, since the volume of the resin part 20 on the front surface side of the plate-like body 10 changes depending on the amount of deviation of the resin part 20, the volume adjustment parts 30a and 30b are high in order to balance the volume of the resin part 20 on the back surface side. Apply something different. Thereby, even if the deviation | shift amount of the resin part 20 differs in the housing | casing 1, a curvature and sink can be suppressed by application of the volume adjustment parts 30a and 30b corresponding to it. In addition, it is not necessary to provide a volume adjustment part about the part which does not have the bias | inclination of the resin part 20, or the part which does not affect curvature and sink.

(Sixth embodiment)
FIG. 10 is a perspective view illustrating an example of an electronic apparatus according to the sixth embodiment of the present invention. An electronic device 100 according to the sixth embodiment includes the casing 1 of the present embodiment described above and an electronic circuit 50 provided in the casing 1. In the example shown in FIG. 10, the battery 60 is stored in the housing 1. Further, depending on the configuration of the electronic device 100, for example, components such as a microphone, a speaker, an antenna, a display panel, and a key sheet are accommodated.

  As described above, the housing 1 used in the electronic device 100 of the present embodiment is provided with the resin portion 20 being biased with respect to the plate-like body 10. The electronic circuit 50 and the battery 60 are accommodated on the main surface of the plate-like body 10 on the side where the resin portion 20 is biased. In addition, a thin component etc. can also be accommodated in the main surface on the opposite side to the side where the resin part 20 of the plate-shaped body 10 was biased.

  Moreover, you may apply as the housing | casing 1 what provided the level | step difference D to the plate-shaped body 10 as shown in FIG. In this case, a relatively thick battery 60 or the like is accommodated on the side where the resin part 20 is more biased, and a relatively thin electronic circuit 50 or the like is placed on the main surface on the side where the resin part 20 is less biased or on the opposite side. Store on the surface.

  Regardless of which case 1 is used, since the warp and sink of the case 1 are suppressed by the volume adjustment unit 30 provided in the resin part 20, components such as the electronic circuit 50 and the battery 60 are accurately provided. Can be stored.

  Although not shown in FIG. 10, an antenna 40 as shown in FIGS. 4A and 4B may be provided on the surface of the resin portion 20 of the housing 1. For example, when the electronic device 100 is a mobile terminal (such as a mobile phone, a PDA (Personal Digital Assistant), a personal computer, etc.) having a communication function, such an antenna 40 may be provided.

  Examples of the electronic device 100 can be applied to various electronic devices such as a multimedia player, a card-type storage device, a video recording / playback device, a wireless communication card, a smart card (IC card), and a remote controller in addition to the portable terminal. It is.

  Moreover, although the volume adjustment part 30 used for the housing | casing 1 of this embodiment all demonstrated the example of solid structure, a hollow structure may be sufficient. Various forms are realizable by making the volume adjustment part 30 into a hollow structure. For example, the housing 1 is given buoyancy by the hollow structure of the volume adjusting unit 30 and is floated when submerged, for example. Moreover, the acoustic effect which makes the sound of a speaker resonate is given by the length and shape of the hollow structure of the volume adjustment part 30.

  Further, a liquid, gas, gel-like body, or other functional material may be accommodated in the hollow structure of the volume adjusting unit 30. For example, the fragrance | flavor by a fragrance | flavor is discharge | released from the housing | casing 1 by accommodating a fragrance | flavor in the hollow structure of the volume adjustment part 30. FIG. In addition, the casing 1 that realizes the color of the resin portion 20 that changes with the passage of time is stored in the hollow structure of the volume adjusting portion 30 by storing a pigment or chemical agent that leaks into the resin portion 20 with the passage of time. Further, the inside of the hollow structure of the volume adjusting unit 30 is used as an accessory case. For example, it is configured so that the end of the hollow structure opens from the end of the resin part 20, and a long object (for example, a pen) is stored in the hollow structure of the volume adjustment part 30 from the outside of the resin part 20. To do. Further, for example, the casing 1 is configured in a state where small items are stored in the hollow structure of the volume adjusting unit 30 in advance, and the small items are enclosed in the volume adjusting unit 30 (resin unit 20). Then, when the use of the housing 1 is finished, it can be considered to destroy the housing 1 and take out the enclosed items.

  Moreover, you may use the material which can be melt | dissolved after shaping | molding as the volume adjustment part 30. FIG. Thereby, it acts for volume adjustment at the time of molding of the resin part 20, and is melted by a chemical or the like after molding to make the volume adjustment part 30 in the resin part 20 hollow. For example, a pigment is mixed in the volume adjusting unit 30, the resin unit 20 is molded with a transparent material, and the volume adjusting unit 30 is melted after molding. Thereby, the pigment remains in the hollow interior of the resin portion 20 formed by melting the volume adjusting portion 30, and the color inside the hollow (color of the pigment) can be exposed through the transparent resin portion 20.

  As mentioned above, although embodiment of this invention and its modification were demonstrated, this invention is not limited to these examples. For example, those in which those skilled in the art appropriately added, deleted, and changed the design of each of the above-described embodiments or modifications thereof are within the scope of the present invention as long as they include the gist of the present invention. Contained.

  DESCRIPTION OF SYMBOLS 1 ... Housing | casing 10 ... Plate-shaped body, 20 ... Resin part, 30 ... Volume adjustment part, 40 ... Antenna

Claims (5)

A plate-like body;
At least part of the plate-like body is provided so as to cover the other main surface from one main surface, and toward the one main surface side of the plate-like body in a direction perpendicular to the main surface of the plate-like body A resin part provided in a biased manner;
With
A volume adjusting part is provided in the resin part on the one main surface side of the plate-like body,
A housing characterized by that. By providing the volume adjusting portion, the volume of the resin portion on the one main surface side of the plate-like body approaches the volume of the resin portion on the other main surface side,
The housing according to claim 1. The resin portion is provided on a peripheral portion of the plate-like body.
The case according to claim 1 or 2. Fixing the volume adjusting part to a part of one main surface of the plate-like body;
Including at least a part of the plate-like body and at least a part of the volume adjusting unit, covering the other main surface from the one main surface of the plate-like body, and with respect to the main surface of the plate-like body Forming a resin portion biased toward the one main surface side of the plate-like body in a vertical direction;
A method for manufacturing a housing, comprising: The housing according to any one of claims 1 to 3,
An electronic circuit provided in the housing;
An electronic device characterized by comprising:

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