JP2011184241A - Fine structure, and method for producing fine structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fine structure made of a glass which achieves the further miniaturization of the structure itself, and has excellent durability. <P>SOLUTION: In the fine structure with one or a plurality of cylindrical fine spaces opening to either side, the average thickness (T) of partitions partitioning the one or the plurality of fine spaces is 20 to 350 μm, and, a glass sintered compact is used as a base material. The aspect ratio (D/T) of the depth (D) of the one or the plurality of fine spaces to the average thickness (T) of the partitions is preferably controlled to 2 to 25. The glass sintered compact is preferably formed by the firing of a composition including glass particles and a silicone resin as a binder therefor. Further, preferably, the glass sintered compact is composed of the glass particles and a binding material between the glass particles, and the binding material includes a silicon oxide as the main component. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a fine structure having one or a plurality of fine spaces and a method for manufacturing the fine structure.

  In recent years, researches on separation / concentration, chemical reaction, analysis, etc. of substances in a fine space have been actively conducted. If material separation / concentration and chemical reaction are carried out in a minute space, the heat exchange efficiency of the reaction system can be greatly improved, and energy costs can be greatly saved. In addition, combinatorial synthesis can be easily realized if many kinds of reaction steps can be integrated in a fine space. Furthermore, by miniaturizing the analysis system, the analysis time can be greatly shortened, and the amount of samples and the amount of waste can be greatly reduced.

  As a miniaturized analysis system, for example, a microreactor in which grooves or holes are provided on the surface of a chip of about several centimeters or less such as a microchip, and separation, concentration or reaction in the grooves or holes is used. A method for analyzing a small amount of sample in a fine space has been proposed.

  As the material of the above-described microreactor, many materials using inorganic materials such as glass, quartz, and silicon are used from the viewpoint of processability and accuracy. By using such an inorganic material, for example, a micron-order groove or hole can be freely formed on a glass substrate or a silicon substrate by utilizing an optical lithography technique widely used in a semiconductor microfabrication technique. (See JP 2005-207901 A). However, such a microreactor made of an inorganic material using a photolithographic technique increases production cost and cannot be said to be suitable for mass production.

  Therefore, as a fine processing and manufacturing method for glass parts, a method in which glass powder is formed into a desired shape and then fired and vitrified has been studied (see JP 2009-242129 A). However, miniaturization has a limit even by such a method using glass baking. In particular, in order to reduce the size of the microreactor, it is necessary to reduce the size (thinness) of the partition wall that partitions the fine space. However, in addition to the extremely difficult fine processing related to the thinning of the partition walls, there are factors such as making the partition walls fragile and reducing durability by reducing the thickness of the glass partition walls. There is a limit to making the partition walls thinner.

JP-A-2005-207901 JP 2009-242129 A

  The present invention has been made based on such circumstances, and an object of the present invention is to provide a glass microstructure capable of further downsizing the structure itself and having excellent durability.

The invention made to solve the above problems is
A microstructure having one or more cylindrical fine spaces that open on one surface,
The average thickness (T) of the partition walls defining the one or more fine spaces is 20 μm or more and 350 μm or less,
A glass sintered body is used as the base material.

  According to the microstructure, the average thickness of the partition walls defining one or a plurality of minute spaces is formed so thin, so that, for example, when used as a microreactor, the reactor itself can be further downsized. Or the proportion of the fine space with respect to the reactor itself can be increased. As described above, according to the microstructure in which the size is further reduced or the proportion of the minute space is high, the advantage of performing the reaction or the like in the minute space as a microreactor or the like can be further enjoyed.

  Moreover, since the said microstructure uses the glass sintered compact as a base material, it has high chemical resistance, heat resistance, and shape stability with respect to a heat | fever, and can be used for the microreactor of various uses.

  The aspect ratio (D / T) with respect to the average thickness (T) of the partition walls having the depth (D) of the one or more fine spaces is preferably 2 or more and 25 or less. By providing the aspect ratio as described above, the average thickness of the partition walls defining the fine space becomes relatively thin with respect to the fine space, and the fine structure itself can be further reduced in size. The proportion of fine space can be further increased.

  The glass sintered body may be formed by firing a composition containing glass particles and a silicone resin as a binder thereof. Moreover, the said glass sintered compact consists of a binder between glass particles and glass particles, and it is good for this binder to contain a silicon oxide as a main component. According to the microstructure, the glass sintered body is formed by such a method, and by having such a structure, it is possible to firmly fix and protect the glass portions or between the glass particles and the glass particle surface. Can do. Therefore, according to the microstructure, the strength of the thinned partition wall and the like can be further increased, and as a result, durability can be improved.

  The glass sintered body is preferably porous. In this microstructure, the sintered glass body is porous in this way, so that the reaction surface area per unit deposition in a minute space can be increased, and the reaction time when used as a microreactor can be further shortened. Is possible. Moreover, the said microstructure is reduced in weight by setting it as porous in this way.

The linear expansion coefficient of the microstructure is preferably 10 ⁻⁵ / ° C. or less. According to the microstructure, since it has such a low linear expansion coefficient, it has extremely high shape stability against heat, so that the shape of the minute space can be maintained even with a temperature change.

  The plurality of fine spaces may be arranged in a lattice pattern. The fine structure can be used as a microarray by arranging fine spaces in a lattice pattern in this way, and can handle a large number of reaction systems in a minute size.

  The one or more fine spaces may be open on the other surface. According to the microstructure, the micro space penetrates from one surface to the other surface, so that the solution or the like can easily flow into the micro space and can be used as various micro reactors. improves.

  Therefore, the microstructure can be suitably used as a microreactor such as a more miniaturized biochip.

The manufacturing method of the microstructure of the present invention is as follows:
(1) A step of pouring a curable silicone resin composition containing glass particles into the upper surface side of the microstructure forming mold using a columnar microstructure forming mold having a plurality of linear grooves on the upper surface;
(2) A step of curing the curable silicone resin composition to obtain a cured product,
(3) a step of releasing the cured product, and (4) a step of firing the cured product,
In the manufacturing method, the width of the line groove is 20 μm or more and 350 μm or less. According to the manufacturing method of the fine structure, mass production of the fine structure having a thin partition wall can be performed by obtaining the structure by molding with a mold in this way.

Here, the “fine space” refers to a three-dimensional region on the order of microns, and specifically refers to a three-dimensional region having a cross-sectional area of 0.1 mm ² or less. The “cylindrical shape” refers to a three-dimensional shape having two congruent planar figures as a bottom surface, and is not limited to a so-called cylindrical shape in which the bottom surface is a circle. “Glass sintered body” refers to a glass obtained by firing a glass particle group into a predetermined shape. “A partition wall that divides one or more fine spaces” refers to a wall that divides a plurality of fine spaces when the fine structure has a plurality of fine spaces, and the fine structure defines one fine space. When it has, it means the wall which divides fine space and other space. In addition, in the “depth”, when the minute space is open on both one surface and the other surface, it means the length between both opening surfaces. The “linear expansion coefficient” refers to a value obtained by measuring with a thermomechanical analyzer under the condition of a temperature rising rate in the atmosphere of 2 ° C. and measuring the relationship between the measured temperature and the amount of displacement. “Biochip” refers to the immobilization of biomolecules such as DNA, proteins, sugar chains, and cells on a substrate (support), and the immobilized biomolecules are brought into contact with biomolecules or other compounds. And detecting a specific interaction that has occurred, and include DNA chips, microchips, biosensors, Lab on a chip, and μ-TAS (Micro Total Analysis System).

  As described above, the microstructure has a very thin partition wall that partitions a minute space. Therefore, when the microstructure is used as a microreactor including a biochip, the reactor itself can be further downsized or The proportion of the fine space can be increased. Moreover, since the said microstructure has used the glass sintered compact as a base material, it has high chemical resistance, heat resistance, and the shape stability with respect to a heat | fever.

  Therefore, the microstructure enables further miniaturization and higher efficiency of a microreactor including a biochip for performing separation / concentration, chemical reaction, analysis, etc. of a substance in a minute space. Further, the microstructure can be used as a micron order storage container, a flow path, or the like.

(A) is a typical perspective view which shows one Embodiment of the microstructure of this invention, (b) is the typical sectional drawing. (A) is a typical perspective view showing a mold for forming a fine structure, (b) is a schematic plan view thereof, and (c) is a schematic side view thereof.

Hereinafter, an embodiment of the microstructure of the present invention and a method of manufacturing the microstructure will be described in detail with reference to the drawings as appropriate.
[Microstructure]
The microstructure 1 in FIG. 1 has a rectangular parallelepiped shape. This fine structure 1 includes four side walls 2 that surround the four sides, and partition walls 3 that are formed in a lattice shape within the four side walls 2, and is partitioned by the partition walls 3. It has a plurality of minute spaces 4 opened on the surface (lower surface).

  Although it does not specifically limit as the size of the said microstructure 1, For example, 4 mm or more and 1000 mm or less are preferable as vertical and horizontal length. Further, the height of the structure 1 (the vertical length of the upper surface and the lower surface) is preferably 400 μm or more and 3000 μm or less, and more preferably 600 μm or more and 1200 μm or less. The lengths of the vertical, horizontal, and height may be equal or different.

  The side wall 2 forms the outer frame of the microstructure 1. The height of the side wall 2 is the height of the fine structure 1 itself.

  Although it does not specifically limit as average thickness of the side wall 2, It is preferable from the point of a moldability that it is equal to the average thickness of the partition 3 mentioned later, Specifically, 20 micrometers or more and 350 micrometers or less are preferable, and 30 micrometers or more and 150 micrometers or less are further. 40 μm or more and 120 μm or less is particularly preferable. By setting the average thickness of the side wall 2 to 20 μm or more, a certain strength can be imparted to the side wall 2 and durability can be enhanced. Moreover, by making the average thickness of the side wall 2 350 μm or less, the structure itself can be downsized or the proportion of the fine space can be increased. The microstructure 1 has advantages as a microreactor such as improvement of heat exchange efficiency, shortening of analysis time, reduction of the amount of samples and waste, etc. by reducing the size of the structure itself or increasing the proportion of fine space. It can be demonstrated more.

  The partition walls 3 are formed in a lattice shape parallel to or perpendicular to the side walls 2 and equally spaced in the vertical and horizontal directions, and define a plurality of fine spaces 4. In the fine structure 1, since the partition walls 3 are formed in a lattice shape in this way, the fine spaces 4 are arranged in a lattice pattern. Therefore, the microstructure 1 can be used as a microarray, and the microstructure 1 can handle a large number of reaction systems in a minute size.

  Although the number of the partition walls 3 is not particularly limited, for example, 20 or more and 1000 or less may be provided vertically and horizontally. According to the microstructure 1, by providing a large number of partition walls 3 in this way, a large number of fine spaces 4 can be formed densely, and a large number of reactions can be performed simultaneously as one reactor.

  The vertical / horizontal spacing (W) between the partition walls 3 is appropriately set according to the required vertical / horizontal size of the fine space 4, but is preferably 50 μm or more and 200 μm or less, and more preferably 70 μm or more and 160 μm or less. .

  The average thickness (T) of the partition wall 3 is 20 μm or more and 350 μm or less, preferably 30 μm or more and 150 μm or less, and more preferably 40 μm or more and 120 μm or less. By setting the average thickness of the partition wall 3 within the above range, it is possible to reduce the size of the structure itself or increase the proportion of the fine space 4. In addition, when the average thickness of the partition walls 3 is 20 μm or less, the durability of the structure itself may be reduced, or the processing may be difficult.

  In this microstructure 1, the average thickness of the partition wall 3 is reduced in this way, and the size of the structure 1 is reduced or the proportion of the fine space 4 is increased, thereby improving the heat exchange efficiency, shortening the analysis time, Advantages as a microreactor such as reduction of the amount and the amount of waste can be exhibited more. In particular, since the ratio of the partition walls 3 to the entire structure increases as the number of the fine spaces 4 increases, the above-described effect by reducing the average thickness of the partition walls 3 is great.

  The minute space 4 has a cylindrical shape that is long in the vertical direction, specifically a rectangular parallelepiped shape, and is open on both the upper surface (one surface) and the lower surface (the other surface). Since the fine space 1 penetrates from one surface to the other surface in this manner, the fine structure 1 is easy to flow a solution or the like into the fine space 4, so that it can be used as various microreactors. Improves. Further, since the fine space 4 penetrates in this way, the inside of the fine space 4 can be easily cleaned.

  The size of the fine space 4 is determined by determining the outer shape of the fine structure 1, the sizes of the side walls 2 and the partition walls 3, and the number and interval of the partition walls 3. As the size of the fine space 4, for example, the vertical and horizontal lengths may be 50 μm to 200 μm, and the depth may be 400 μm to 3000 μm, preferably 600 μm to 1200 μm.

  The aspect ratio (D / T) of the depth (D) of the fine space 4 to the average thickness (T) of the partition wall 3 is preferably 2 or more and 25 or less, more preferably 4 or more and 20 or less, and 6 or more and 18 or less. More preferably, it is 10 or more and 16 or less. By forming the fine structure 1 with such an aspect ratio, the partition wall 3 can be made relatively thin with respect to the fine space 4, and as a result, the structure itself can be further reduced in size, In addition, the ratio of the fine space 4 to the structure 1 can be further increased. Note that the depth (D) of the fine space 4 is equal to the height of the fine structure 1 and the height of the partition walls 3.

Further, in the relationship between the aspect ratio (A = D / T) and the average thickness (T (μm)) of the partition 3, (1) When 50 ≦ T ≦ 100, the following formula (1) is satisfied. In the case of satisfying relationship (2) 100 ≦ T ≦ 350, the range of the relationship satisfying the following formula (2) is preferable.
A ≧ T / 50 (1)
A ≧ {(T−100) / 250} +2 (2)

  The depth ratio of the fine space 4 itself is preferably 3 or more and 12 or less, and more preferably 5 or more and 10 or less. The fine structure 1 can have a high capacity even in the same area because the fine space 4 has such a relatively high depth ratio, and the inside of the fine space 4 can be easily liquidized by capillary action. Can be filled. In addition, since the micro space 4 has such a high depth ratio, the fine structure 1 can keep the liquid inside the micro space due to a capillary phenomenon or the like even if the micro space 4 is opened on one and the other surfaces. The liquid can be held in the fine space 4.

  The depth ratio of the fine space 4 is the ratio of the depth to the vertical or horizontal length of the fine space 4. Further, when the vertical and horizontal lengths of the fine space 4 are different, the average length is set.

  The microstructure 1 uses a glass sintered body as a base material (main material). Since the microstructure 1 uses a glass sintered body as a base material as described above, it has high chemical resistance, heat resistance, and shape stability against heat, and can be used in various types of microreactors.

  Further, since the microstructure 1 uses a glass sintered body as a base material, it can be easily made transparent, and as a microreactor, for example, optical observation, fluorescence analysis, spectroscopic analysis, etc. can be performed, It can also be used for analysis and synthesis using photoreactions, and furthermore, a laser or the like can be used. Therefore, according to the microstructure 1, workability as a microreactor or the like can be improved and the usage application can be expanded.

  Furthermore, since the microstructure 1 uses a glass sintered body as a base material, it is excellent in heat resistance and chemical resistance, and is used in micron-sized reactors for various applications and micron-sized without reaction. It can be suitably used as a container assembly, a flow path and the like.

  The glass sintered body serving as the base material of the microstructure 1 is not particularly limited as long as it is a glass obtained by firing a glass particle group into a predetermined shape and then firing, but as a glass particle and its binder. And those formed by firing a composition containing a silicone resin. By baking such a composition, the silicone resin becomes silicon oxide and exhibits high strength, heat resistance, and the like. Therefore, the strength and durability of the microstructure 1 are further improved by using, as a base material, a glass sintered body formed by firing a composition containing glass particles and a silicone resin as a binder thereof. Become. Therefore, according to the microstructure 1, it is possible to suppress the occurrence of breakage due to, for example, a micropipette or the like coming into contact with the thin and high partition wall 3, and thinning of these walls can be realized.

  By forming a glass sintered body by firing as described above, this glass sintered body has, as a specific structure, glass particles and a binder between the glass particles, and this binder is a silicon as a main component. A structure including an oxide can also be used. The glass particles in this case include those in which the glass particles are partially bonded. Since the binder is a silicon oxide having high strength, heat resistance and the like as a main component, it is possible to firmly fix and protect between the glass particles and the surface of the glass particles. Therefore, the glass sintered body is composed of glass particles and a binder between the glass particles, and the microstructure 1 including silicon oxide as a main component of the binder further improves strength and durability.

  In addition, in the glass sintered body formed by firing a composition containing glass particles and a silicone resin as a binder thereof, for example, a glass component and a silicon oxide component are naturally integrated in addition to the structure described above. It may become the structure which is. Even in such a case, the glass sintered body has high strength, and the strength and durability of the structure 1 can be increased.

  The silicon oxide is not particularly limited as long as it contains silicon and oxygen as a composition, and examples thereof include silicon dioxide, a compound containing silicon, oxygen, and carbon. Note that this silicon oxide may or may not have a crystal structure.

As a specific example of the component of the glass particles,
1. Lead oxide, boron oxide and silicon oxide (PbO—B ₂ O ₃ —SiO ₂ system),
2. Zinc oxide, boron oxide and silicon oxide (ZnO—B ₂ O ₃ —SiO ₂ system),
3. Lead oxide, boron oxide, silicon oxide and aluminum oxide (PbO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ series),
4). Lead oxide, zinc oxide, boron oxide and silicon oxide (PbO—ZnO—B ₂ O ₃ —SiO ₂ system),
5. Bismuth oxide, boron oxide and silicon oxide (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ system),
6). Zinc oxide, phosphorus oxide and silicon oxide (ZnO—P ₂ O ₅ —SiO ₂ system),
7). Zinc oxide, boron oxide and potassium oxide (ZnO—B ₂ O ₃ —K ₂ O system),
8). Phosphorus oxide, boron oxide and aluminum oxide (P ₂ O ₅ —B ₂ O ₃ —Al ₂ O ₃ system),
9. Zinc oxide, phosphorus oxide, silicon oxide and aluminum oxide (ZnO—P ₂ O ₅ —SiO ₂ —Al ₂ O ₃ series),
10. Zinc oxide, phosphorus oxide and titanium oxide (ZnO—P ₂ O ₅ —TiO ₂ system),
11. Zinc oxide, boron oxide, silicon oxide and potassium oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O system),
12 Zinc oxide, boron oxide, silicon oxide, potassium oxide and calcium oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O—CaO system),
13. Zinc oxide, boron oxide, silicon oxide, potassium oxide, calcium oxide and aluminum oxide (ZnO—B ₂ O ₃ —SiO ₂ —K ₂ O—CaO—Al ₂ O ₃ system),
14 Boron oxide, silicon oxide and aluminum oxide (B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ series),
15. Boron oxide, silicon oxide and sodium oxide (B ₂ O ₃ —SiO ₂ —Na ₂ O system)
Etc. Among these, what baked the lead-free glass (mixture of 2. and 5.-15) in consideration of the environment is preferable.

  In the microstructure 1, the glass sintered body is preferably porous. The microstructure 1 can increase the reaction surface area per unit volume in the fine space 4 due to the porous glass sintered body as described above, and further shorten the reaction time when used as a microreactor. Can be realized. Moreover, the said microstructure 1 is reduced in weight by making the glass sintered compact which is a base material porous in this way. Furthermore, by using a porous structure, the microstructure 1 can be used as a microfilter or the like.

  The method for making the glass sintered body porous as described above is not particularly limited, and examples thereof include firing of a composition containing glass particles and a silicone resin as described above.

  The microstructure 1 may contain a component other than the glass component and silicon oxide in the glass sintered body. By providing the microstructure 1 with other components, according to the types of the other components, the strength is improved and the functionality such as the controllability of the reaction in the microspace 4 is improved. Can do.

  Examples of other components include magnetic substances, metals, metal oxides, inorganic substances, and the like.

The magnetic substance is a substance having ferromagnetism or paramagnetism, and examples of the substance having ferromagnetism include gamma Fe ₂ O ₃ , Fe ₃ O ₄ , barium ferrite, iron, nickel, cobalt and the like. Can do. According to the microstructure 1 containing a magnetic substance, as will be described later, when the mold is used, the structure molded from the mold can be easily taken out, and the productivity is improved. In addition, the microstructure 1 can be used as a microreactor that can be used for special applications such as a reaction system in a magnetic region.

  The fine structure 1 may contain a metal or an inorganic substance having a catalytic function such as platinum, palladium, or zeolite so as to come into contact with the fine space 4. According to the microstructure 1, the specific reactivity in the minute space 4 can be enhanced by the component contained in this manner functioning as a catalyst.

  Furthermore, the microstructure 1 becomes a mixed sintered body of glass or the like and a metal or a mixed sintered body of the glass or the like and the metal oxide by containing the above metal or metal oxide, and further increases the strength. Can be increased.

  The microstructure 1 may be provided with electrodes or the like in a minute space. Since the fine structure uses a glass sintered body having no conductivity as a base material, it is possible to incorporate a conductive circuit, electrode, etc. in the structure or in a fine space. By providing electrodes in the fine structure 1, the range of utilization can be expanded, for example, gene analysis use, gene amplification use, drug development development use, chemical synthesis / analysis use, and the like.

The linear expansion coefficient of the microstructure 1 is preferably 10 ⁻⁵ / ° C. or less, more preferably 10 ⁻⁸ / ° C. or more and 5 × 10 ⁻⁶ / ° C. or less, and more preferably 5 × 10 ⁻⁸ / ° C. or more and 6 × 10. ⁻⁷ / ° C. or less is particularly preferable. Since the microstructure 1 has such a low linear expansion coefficient, the microstructure 1 has extremely high shape stability against heat, so that the shape of the minute space 4 can be maintained even with a temperature change.

  As described above, since the microstructure 1 has the partition wall 3 that partitions the minute space 4 extremely thin, when the micro structure 1 is used as a microreactor including a biochip, the reactor itself is further miniaturized. Alternatively, the proportion of the fine space with respect to the reactor can be increased. Moreover, since the sintered compact is used for the fine structure 1 as a base material, chemical resistance, heat resistance, and shape stability against heat are high. Therefore, the fine structure 1 enables further miniaturization and high efficiency of a microreactor including a biochip for performing separation / concentration, chemical reaction, analysis and the like of substances in the fine space 4. The fine structure 1 can also be used as a micron order storage container, flow path, or the like.

[Method for producing fine structure]
Next, a method for manufacturing the microstructure will be described. The manufacturing method of the microstructure 1 is as follows:
(1) A step of pouring a curable silicone resin composition into the upper surface side of the microstructure forming mold using a columnar microstructure forming mold having a plurality of linear grooves on the upper surface;
(2) A step of curing the curable silicone resin composition to obtain a cured product,
(3) a step of releasing the cured product, and (4) a step of firing the cured product. Hereinafter, each step will be described.

(1) A step of pouring a curable silicone resin composition containing glass particles into the upper surface side of this microstructure forming mold using a columnar microstructure forming mold having a plurality of linear grooves on the upper surface (1 As the mold used in the step (2), the microstructure forming mold 11 shown in FIG. 2 can be suitably used. The microstructure forming mold 11 has a quadrangular prism shape and includes a plurality of linear grooves 12 provided on the upper surface in a lattice shape.

  The plurality of line grooves 12 are provided perpendicularly or parallel to one side of the rectangular upper surface. In addition, each end of each of these linear grooves 12 is open on the side surface of the mold 11. According to this mold 11, since the line groove 12 is provided in this way, the mold release property of the cured silicone resin composition is excellent as will be described later.

  The size, interval, and the like of these line grooves 12 determine the size, interval, and the like of the partition walls of the fine structure. That is, the depth (d) of the line groove 12 is substantially equal to the height of the partition wall 3 (depth (D) of the fine region 4), and the width (t) of the line groove 12 is the thickness (T) of the partition wall 3. And the interval (w) between the line grooves 12 is almost equal to the interval (W) between the partition walls 3. Therefore, the size and interval of the line grooves 12 are determined according to the desired size and interval of the partition walls 3 of the microstructure.

  The depth (d) of the line groove 12 is preferably 400 μm or more and 3000 μm or less, and more preferably 600 μm or more and 1200 μm or less. The width (t) of the line groove 12 is preferably 20 μm or more and 350 μm or less, more preferably 30 μm or more and 150 μm or less, and particularly preferably 40 μm or more and 120 μm or less. The depth ratio (d / t) to the width (t) of the wire groove 12 is preferably 2 or more and 25 or less, more preferably 4 or more and 20 or less, further preferably 6 or more and 18 or less, and particularly preferably 10 or more and 16 or less. . According to the manufacturing method, even when a mold in which the depth (d) of the wire groove 12 is larger than the width (t) is used, the resin can be molded and released, and the fine structure can be obtained. You can get a body.

  The interval (w) between the line grooves 12 is preferably 50 μm or more and 200 μm or less, and more preferably 70 μm or more and 160 μm or less. Further, the number of the vertical and horizontal lines 12 is preferably 20 or more and 1000 or less. The length of one side of the entire lattice-shaped region formed by the plurality of vertical and horizontal line grooves 12 is preferably 3 mm or more and 500 mm or less. According to the manufacturing method, even when a mold having a large number of line grooves 12 and a wide lattice-like portion is used as described above, resin molding and mold release are possible. A structure can be obtained.

  The method of forming the wire groove 12 is not particularly limited as long as the fine wire groove 12 can be formed, and a known method such as laser processing or lathe cutting can be used.

  The material of the mold 11 is not particularly limited as long as such fine wire grooves 12 can be provided and has a certain strength. However, steel is preferable from the viewpoint of corrosion resistance, and stainless steel is more preferable. preferable. Further, the surface hardness (HRC) of the material of the mold 11 is preferably 30 or more, more preferably 35 or more, and particularly preferably 50 or more from the viewpoint of durability. The upper limit is preferably 60 from the viewpoint of workability. Specific examples of the material of the mold 11 include a high corrosion resistance and high hardness mold steel for plastic molding “ASL407” manufactured by Hitachi Metals, Ltd.

  The curable silicone resin composition used in the step (1) is not particularly limited as long as it contains glass particles and can be finely molded, and a known one can be used.

  The viscosity of the curable silicone resin composition is preferably 1000 mPa · s or more and 20000 mPa · s or less, and more preferably 3000 mPa · s or more and 10,000 mPa · s or less. When the curable silicone resin composition has a viscosity in the above range, the composition suitably flows into the fine line groove 12, so that the shape of the line groove 12 can be transferred, and the microstructure having a thin partition is provided. You can get a body.

  The surface contact angle of the curable silicone resin composition with respect to the surface of the mold 11 is preferably 20 or more and 50 or less, and more preferably 25 or more and 40 or less. Since the curable silicone resin composition has a surface contact angle in the above range with respect to the surface of the mold 11, it has high wettability, and the composition suitably flows into the fine line grooves 12. The shape can be transferred, and the microstructure including a thin partition wall can be obtained. The surface contact angle was dropped by using a contact angle meter DM-700 manufactured by Kyowa Interface Chemical Co., Ltd. and dropping about 2.0 μl of a curable silicone resin composition droplet onto a mold (ASL-400). This is an angle obtained by measuring the state of the liquid droplet after 30 seconds by image processing.

  Examples of the curable silicone resin composition include (A) an organopolysiloxane, (B) a curing agent, (C) glass particles, and other additives as required.

  (A) Organopolysiloxane is the main agent. Examples of the group bonded to the silicon atom of the organopolysiloxane include a substituted or unsubstituted monovalent hydrocarbon group, a hydroxyl group, and an alkoxy group. Examples of the substituted or unsubstituted monovalent hydrocarbon group include alkyl groups such as methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, and octadecyl group. A cycloalkyl group such as a cyclopentyl group and a cyclohexyl group; an aryl group such as a phenyl group, a tolyl group, a xylyl group and a naphthyl group; an aralkyl group such as a benzyl group, a phenethyl group and a phenylpropyl group; Halogenated alkyl groups such as fluoropropyl group and 3-chloropropyl group; alkenyl groups such as vinyl group, allyl group, propenyl group, butenyl group, pentenyl group, hexenyl group, etc., among these, methyl group, phenyl Group, 3,3,3-trifluoropropyl group is preferable, and methyl group and phenyl group are particularly preferable. .

  The molecular structure of the organopolysiloxane is not limited, and examples thereof include a straight chain, a branched chain, and a partially branched linear chain. From the viewpoint of fluidity, a linear or partially branched linear chain is exemplified. Are preferred. When the molecular structure of the organopolysiloxane is linear and the main group bonded to the silicon atom is a methyl group, the organopolysiloxane is polydimethylsiloxane. This polydimethylsiloxane is preferable because it has excellent fluidity and can surely flow between the fine line grooves 12.

  The curing type of the curable silicone resin composition is not particularly limited, but is preferably a hydrosilylation addition reaction curing type or a condensation reaction curing type.

  When the curable silicone resin composition is a hydrosilylation addition reaction curable type, (A) the organopolysiloxane is an organopolysiloxane having two or more, preferably three or more alkenyl groups contained in silicon atoms in one molecule. Siloxane is preferred. The alkenyl group bonded to the silicon atom is preferably a vinyl group. The alkenyl group may be at the molecular chain terminal and / or the side chain, and at least one alkenyl group may be bonded to the silicon atom at the molecular chain terminal, preferably the silicon atom at both molecular chain terminals. In this case, as the group bonded to the silicon atom other than the alkenyl group, the above alkyl group and aryl group are preferable.

  Examples of such organopolysiloxane include, for example, molecular chain both ends dimethylvinylsiloxy group-blocked polydimethylsiloxane, molecular chain both ends methyldivinylsiloxy group-blocked polydimethylsiloxane, molecular chain both ends dimethylvinylsiloxy group-blocked dimethylsiloxane and methyl. Examples thereof include a phenylsiloxane copolymer, a trimethylsiloxy group-capped dimethylsiloxane / methylvinylsiloxane copolymer with both molecular chain terminals, and a dimethylvinylsiloxy group-capped dimethylsiloxane / methylvinylsiloxane copolymer with both molecular chain terminals. These can be used alone or in combination of two or more.

  When the curable silicone resin composition is a condensation reaction curable type, (A) the organopolysiloxane has at least two silanol groups (that is, silicon atom-bonded hydroxyl groups) and / or silicon atom-bonded hydrolyzable groups in one molecule. Is preferably an organopolysiloxane having both ends of the molecular chain.

  Examples of the hydrolyzable group include acyloxy groups such as acetoxy group, octanoyloxy group, and benzoyloxy group; ketoxime groups such as dimethyl ketoxime group, methylethyl ketoxime group, and diethyl ketoxime group; methoxy group, ethoxy group, Alkoxy groups such as propoxy group; alkoxyalkoxy groups such as methoxyethoxy group, ethoxyethoxy group and methoxypropoxy group; alkenyloxy groups such as vinyloxy group, isopropenyloxy group and 1-ethyl-2-methylvinyloxy group; dimethylamino Groups, diethylamino groups, butylamino groups, cyclohexylamino groups and other amino groups; dimethylaminoxy groups, diethylaminoxy groups and other aminoxy groups; N-methylacetamide groups, N-ethylacetamide groups, N-methylbenzamide groups, etc. Amide group and the like.

  Examples of such organopolysiloxane include, for example, molecular chain both ends silanol-blocked polydimethylsiloxane, molecular chain both ends silanol-blocked dimethylsiloxane / methylphenylsiloxane copolymer, molecular chain both ends trimethoxysiloxy group-blocked polydimethylsiloxane. Siloxane, molecular chain both ends trimethoxysiloxy group-blocked dimethylsiloxane / methylphenylsiloxane copolymer, molecular chain both ends methyldimethoxysiloxy group-blocked polydimethylsiloxane, molecular chain both ends triethoxysiloxy group-blocked polydimethylsiloxane, both molecular chains Examples include terminal 2-trimethoxysiloxyethyl group-blocked polydimethylsiloxane. These can be used alone or in combination of two or more.

  The (B) curing agent is not particularly limited as long as it can be cured according to the curing type of the above (A) organopolysiloxane, and is a hydrosilylation addition reaction curing type curing agent known as a curing agent for silicone resins. , Condensation reaction curing type curing agents, organic peroxides and the like, and hydrosilylation addition reaction curing agents and condensation reaction curing agents are preferred.

  When (B) the curing agent is a hydrosilylation addition reaction curing agent, this (B) curing agent has an average of 2 or more, preferably 3 or more, silicon-bonded hydrogen atoms (that is, SiH groups) in one molecule. It contains an organohydrogenpolysiloxane and a platinum-based catalyst. This organohydrogenpolysiloxane functions as a crosslinking agent that undergoes an addition reaction with the (A) organopolysiloxane having an alkenyl group.

  Examples of the organohydrogenpolysiloxane include 1,1,3,3, -tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, dimethylhydrogensiloxy group-blocked dimethyl at both molecular chains. Examples thereof include polysiloxanes, trimethylsiloxy group-capped dimethylsiloxane / methylhydrogensiloxane copolymers with both molecular chain ends, and dimethylsiloxane / methylhydrogensiloxane copolymers with dimethylhydrogensiloxy group-capped dimethylsiloxanes. These can be used alone or in combination of two or more.

  The platinum-based catalyst used together with the organohydrogenpolysiloxane is a catalyst for promoting the curing of the composition. For example, chloroplatinic acid, an alcohol solution of chloroplatinic acid, an olefin complex of platinum, an alkenylsiloxane complex of platinum, Examples include platinum carbonyl complexes.

When the (B) curing agent is a condensation reaction curing type curing agent, the (B) curing agent is a silane containing at least three silicon atom-bonded hydrolyzable groups in one molecule, or a partial hydrolysis thereof. Mention may be made of condensates. The silane is represented by the formula: R ¹ _a SiX _4-a (wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group, X is a hydrolyzable group, and a is 0 or 1). Are preferred. R ¹ is preferably an alkyl group such as a methyl group or an ethyl group; an alkenyl group such as a vinyl group, an allyl group or a propenyl group; and an aryl group such as a phenyl group. Examples of X include the same as those exemplified as the hydrolyzable group, and examples thereof include an alkoxy group, an alkenoxy group, a ketoxime group, an acetoxy group, an amino group, and an aminoxy group.

  Examples of such silane or its partially hydrolyzed condensate include methyltriethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, ethyl orthosilicate, and the like, and partially hydrolyzed condensates thereof. These can be used alone or in combination of two or more.

  (B) When the curing agent is a condensation reaction curing type curing agent, a condensation reaction catalyst may be further contained as an optional component. Examples of the condensation reaction catalyst include organic titanates such as tetrabutyl titanate and tetraisopropyl titanate; organic titanium chelates such as diisopropoxybis (ethylacetoacetate) titanium and diisopropoxybis (acetylacetoacetate) titanium. Compound: Organic aluminum compound such as aluminum tris (acetylacetonate), aluminum tris (ethylacetoacetate); Organic zirconium compound such as zirconium tetra (acetylacetonato), zirconium tetrabutyrate; dibutyltin dilaurate, dibutyltin di (2-ethyl) Organic tin compounds such as hexanoate); metal salts of organic carboxylic acids such as tin naphthenate, tin oleate, tin butyrate, cobalt naphthenate, zinc stearate; Amine compounds such as xylamine and dodecylamine phosphate or salts thereof; quaternary ammonium salts such as benzyltriethylammonium acetate; alkali metal salts such as potassium acetate and lithium nitrate; dialkylhydroxylamines such as dimethylhydroxylamine and diethylhydroxylamine; guanidyl Examples thereof include group-containing organosilicon compounds. These can be used singly or in combination of two or more.

  In addition to (A) organopolysiloxane and (B) curing agent, the curable silicone resin composition used in the step (1) includes other additives such as wax, filler, flame retardant, and curing. You may contain a promoter, a plasticizer, an antifoamer, etc.

  When the wax is contained in the curable silicone resin composition, the releasability from the mold of the cured resin can be improved. Examples of the wax include petroleum waxes such as paraffin wax and microcrystalline wax; plant waxes such as carnauba wax, candelilla wax, rice wax, and wood wax; animal waxes such as beeswax and whale wax; montan wax, ozokerite, Mineral wax such as ceresin; silicone-modified wax (ie, silicon atom-bonded monovalent organic group (side chain substituent), for example, an acyloxy group having about 10 to 25 carbon atoms such as stearoxy group, carbon number 10 And wax-like organopolysiloxane modified with one or more of about 20 long-chain alkyl groups, polyester groups, styryl groups, and the like. These waxes can be used singly or in combination of two or more.

  (C) As glass particles, those composed of the above-described components can be used as appropriate. As a content rate with respect to the whole composition of this glass particle, 20 mass% or more and 90% mass or less are preferable. By setting the glass particle content in the above range, the shape of the fine wire groove 12 can be transferred with high accuracy, and a partition wall having a high ratio of the length in one direction to the thickness can be formed.

  (C) The average particle diameter of the glass particles is preferably 1 μm or more and 15 μm or less, more preferably 3 μm or more and 10 μm or less. If the average particle diameter of the glass particles is less than 1 μm, a suitable porous material may not be formed. On the other hand, when the average particle diameter exceeds 15 μm, it becomes difficult for the glass particles to enter between the fine line grooves 12, and the partition walls may not be formed uniformly.

  Further, two or more kinds having different average particle diameters may be used in combination as glass particles. By using such a plurality of glass particles, the glass sintered body can be easily and reliably made porous.

  (C) The softening point of the glass particles is preferably 350 ° C. or higher and 700 ° C. or lower, and more preferably 400 ° C. or higher and 620 ° C. or lower. When the softening point of the glass particles is less than 350 ° C., the heat resistance of the obtained fine structure is lowered, and the shape of the fine space may be deformed. On the other hand, when the softening point of the glass particles exceeds 700 ° C., a high firing temperature is required, and productivity may be reduced.

  The curable resin composition may further contain other fine particles. In addition, when the fine structure contains fine particles, the fine particles were directly put into the line grooves 12 in addition to the fine particles contained in the curable silicone resin composition in the step (1). Thereafter, a separate curable resin composition may be poured into the upper surface side of the mold 11.

  This curable resin composition contains (C) other fine particles such as glass particles and magnetic particles, thereby reducing the adhesion between the cured resin and the mold 11 when the curable resin composition is cured. Can be made. That is, when these particles come into contact with the upper surface of the mold 11 including the wire groove 12, the contact area between the resin and the mold 11 is reduced and the frictional resistance is lowered, so that the releasability is improved.

  When the curable silicone resin composition is poured into the upper surface side of the mold 11, it is preferable that the upper surface is surrounded by a heat-resistant film or the like so that the resin composition does not flow down to the side surface of the mold 11. Thus, by pouring the composition with the upper surface surrounded by a heat resistant film or the like, the resin composition can be prevented from flowing down to the side surface, and the resin composition can be thickly laminated on the upper surface. Moreover, when the resin composition is laminated thickly on the upper surface in this way, workability is improved, for example, the cured product can be easily released after curing.

  In addition, after pouring a thin curable silicone resin composition on the upper surface side of the mold 11, another curable resin composition may be poured on the upper side. The other resin composition is not particularly limited as long as it has curability and can be cured integrally with the first poured curable resin composition, and is a general-purpose curable silicone resin composition. Or other curable resin compositions. Thus, workability | operativity can be improved, suppressing cost, by attaching thickness to hardened | cured material using another resin composition.

  Further, the curable silicone resin composition or other resin composition poured into the upper surface side of the mold 11 is easy to release after being cured, and improves the handleability of a cured product obtained by curing. Therefore, a holding member such as a bolt may be embedded while exposing a part thereof. One or more holding members can be embedded depending on the area of the upper surface of the mold 11 or the like.

  When the magnetic particles are contained as fine particles in the curable silicone composition, or when the curable silicone composition is poured after the magnetic particles are put into the wire grooves 12, the composition is sufficient in the wire grooves 12. After leaving still for a while until it flows in, it is good to apply a magnetic field in the direction toward the upper surface of the mold 11 or in the opposite direction to the mold 11 and the curable silicone resin composition.

  By applying the magnetic field in this way, the magnetic particles move to the upper surface side of the mold 11 including the linear grooves 12. When the magnetic particles move to the upper surface of the mold 11 including the surface of the wire groove 12, the portion where the resin composition and the surface of the wire groove 12 etc. are in direct contact with each other is reduced. Therefore, by applying the magnetic field in this way, when releasing the cured silicone resin, the adhesion between the silicone resin and the upper surface of the mold 11 including the wire groove 12 is reduced, and the frictional resistance is reduced. Easy to release.

  The means for applying the magnetic field is not particularly limited, and examples thereof include bringing a magnet close to the lower surface side of the mold 11.

(2) Step of curing the curable silicone resin composition to obtain a cured product After pouring the curable silicone resin composition onto the upper surface side of the mold 11, the curable silicone resin composition is cured. In addition, after pouring this resin composition, it is good to leave still for a while until the composition fully flows into the line groove 12 on the upper surface of the mold 11. The standing time is appropriately set depending on the viscosity of the curable silicone resin composition used, and is, for example, about 6 to 48 hours.

  The curable silicone resin composition is poured into the upper surface side of the mold 11 and allowed to stand for a while, and then the composition is cured. The method for curing the curable silicone resin composition is not particularly limited, and heat application according to the type of the curable silicone resin composition may be appropriately performed. Although it does not specifically limit as this hardening time, In the case of heat provision, it is about 15 minutes or more and 2 hours or less, for example.

(3) Step of releasing the cured product After curing the curable silicone resin composition to obtain a cured product, the cured product is released. When releasing the cured product (cured silicone resin), it is preferable to release the mold 11 so that the space between the mold 11 and the cured product is gradually expanded from one side of the upper surface of the mold 11. Since the mold 11 is formed such that both ends of the wire groove 12 are open on the side surface, the mold 11 is separated from one side in this manner, so that a line is formed between the cured silicone resin and the mold 11. A gap can be generated from one end of the groove 12, and the two can be separated.

  In addition, when releasing a hardened | cured material from one side in this way, it is good to carry out, making liquid, especially surfactant aqueous solution approach between the wire groove 12 and hardened | cured material. The surfactant aqueous solution is not particularly limited, and a commercially available soap or detergent may be used. In this way, by releasing the surfactant aqueous solution or the like between the wire groove 12 and the cured product, the adhesion between the wire groove 12 and the cured product is weakened, and the frictional resistance is lowered. As a result, the partition wall can be prevented from being broken.

  Further, when a holding member such as a bolt is embedded in the curable silicone composition or the like poured into the mold in the step (1), the holding member is vibrated horizontally or vertically with respect to the upper surface of the mold 11 or a force is applied. After the addition, or while applying vibration or force, the holding member may be lifted upward to release the mold. By releasing using the holding member in this manner, the mold can be released while dissociating the adhesion between the wire groove 12 and the cured product, thereby improving workability and preventing the occurrence of breakage of the partition walls. can do.

(4) Step of firing the cured product In order to eliminate organic components from the cured silicone resin composition (cured product) released from the mold 11 and to sinter the glass particles, the cured product is used. Is fired. Prior to this firing, it is preferable to cut off the portions other than the side walls and partition walls of the cured product. If it is fired while leaving this other part, the shape may be greatly deformed by shrinkage of the other part.

  The firing atmosphere varies depending on the composition of the resin composition, but can be performed in an atmosphere of air, ozone, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace, a belt-type continuous firing furnace, or the like can be used.

  The firing treatment conditions vary depending on the composition of the resin composition, particularly the softening point of the glass particles, but for example, the firing temperature is 300 ° C. to 1400 ° C., and the firing time is about 10 minutes to 90 minutes.

  Through such a firing step, a fine structure can be obtained. The curable silicone resin composition containing glass particles is cured and baked to obtain the structure, whereby the base material is a glass sintered body. The glass sintered body is composed of the glass particles and the main component. And a binder containing silicon oxide. Furthermore, the glass sintered body can be made porous by such a method. Moreover, according to the manufacturing method, mass production can be made possible by obtaining a structure by molding from a mold in this way.

  Note that the microstructure of the present invention is not limited to the above-described embodiment. For example, the microstructure has four side walls that are surrounded by four walls and partition walls that are formed in a lattice shape in the four side walls. In addition, you may provide the baseplate provided so that one edge part of the fine space divided by these may be sealed. If it is a fine structure provided with such a bottom plate, it can prevent that the solution etc. in micro space flow out by this bottom plate, and the usability as various microreactors etc. improves. Further, by providing a predetermined shape in the bottom plate portion, it can be used as a holding portion, and the handleability of a fine structure is improved. Further, such a fine structure can be used as a container for storing a minute sample. In addition, the bottom plate which seals one edge part of this fine space may be made from a glass sintered compact, or may be formed from another material.

  Further, in the microstructure, each partition may not completely block between minute spaces. By using such a fine structure, for example, a solution can be moved between fine spaces, and can be used as a microreactor that undergoes a plurality of reaction steps.

  Furthermore, a plurality of fine spaces of the fine structure may not be arranged in a lattice pattern. Further, the cross-sectional shape in the plane perpendicular to the depth direction of the fine space may be any shape such as a square, a rectangle, other polygons, a circle, an ellipse, or the like. The microstructure can be used as a microreactor for various uses, a micron-sized storage container, or a flow path by disposing various fine spaces.

  Moreover, in the manufacturing method of the said fine structure, you may release a hardened | cured material from a type | mold after baking with a type | mold, without baking after releasing a hardened | cured material. Thus, by releasing after firing, the shrinkage of the cured product due to sintering may be used to reduce the adhesion between the cured product and the mold, which may facilitate release.

  EXAMPLES Hereinafter, although this invention is explained in full detail based on an Example, this invention is not interpreted limitedly based on description of this Example.

  As the mold, a cube-shaped high corrosion-resistant high-hardness mold steel (ASL407) having a length of 20 mm, a width of 20 mm, and a height of 20 mm was used. The width of the line groove was 63 μm, the depth was 800 μm, the distance between the line grooves was 137 μm, and the number of line grooves in the vertical and horizontal directions was 25 each. The length of one side of the lattice portion thus provided was 5 mm.

  As the curable silicone resin composition, Shin-Etsu Chemical Co., Ltd., two-component curable impression material for high-definition transfer (main agent: SIM-260, curing agent: CAT-260) was used. The impression material for high-definition transfer is of an addition reaction curable type, contains a platinum-based catalyst in the curing agent, and has a viscosity of 7000 mP · s. The surface contact angle with respect to the mold of this high-definition transfer impression material was 32 °.

First, as a cured silicone resin composition, the main component SIM-260 (2 ml, 2060 mg) and the curing agent CAT-260 (0.2 ml, 206 mg) are mixed well until uniform, and then ZnO—B ₂ O ₃ −. 750 mg of SiO ₂ -based glass particles were added and mixed until uniform. Thereafter, a heat-resistant film (polyimide film) was laminated in advance so as to surround the upper surface of the mold, and the curable silicone resin composition was poured into the upper surface of the mold formed into a pool.

  After pouring the curable silicone resin composition, it was allowed to stand at room temperature for 24 hours. Then, it heated for 30 minutes with 150 degreeC drying machine, and hardened the curable silicone resin composition. After the silicone resin was cured, the polyimide film was removed, and the film was gradually peeled off while allowing soapy water to penetrate into the gap between the mold and the cured resin, and the cured silicone resin (cured product) was released.

  The cured product released from the mold was cut out except for the lattice-like portion (the portion where the line grooves intersect). The cured product having only the lattice portion was baked at 590 ° C. for 15 minutes in a baking furnace to obtain a fine structure (microarray). A photomicrograph of the resulting microstructure is shown in FIG.

  As for the size of the obtained fine structure, the average thickness of the partition wall is about 50 μm, the height of the partition wall and the side wall (depth of the fine space) is about 750 μm, and the aspect ratio (average thickness of the partition wall having the depth of the fine space) 15), one side of the fine space was about 100 μm, and the length of the side wall was about 4 mm in length and width.

  Since the fine structure of the present invention has a fine space densely arranged, it can be used as various microreactors including a biochip. Specifically, the microstructure has such a fine shape, thereby enabling a reduction in analysis time, a small sample size, and parallel processing as a microreactor. For example, in the medical field, hospital clinical examinations, bedsides, It can be used as a biochip used in an operating room or the like. In addition, the microstructure can be used as a biochip for gene analysis.

  In addition, when the microstructure is used in the combinatorial chemistry field, the time required for synthesis and analysis can be shortened by miniaturizing the reactor and flow path, and in addition, the amount of chemicals and waste liquid can be greatly reduced. Is also achieved.

  In addition, since the microstructure can be precisely and mass-produced, it is particularly useful in applications that can be used in large quantities in industry such as screening applications in drug discovery development, chemical synthesis / analysis, industrial production applications, etc. It can be used effectively.

DESCRIPTION OF SYMBOLS 1 Fine structure 2 Side wall 3 Partition 4 Fine space 11 Fine structure shaping | molding die 12 Wire groove

Claims (10)

A microstructure having one or more cylindrical fine spaces that open on one surface,
The average thickness (T) of the partition walls defining the one or more fine spaces is 20 μm or more and 350 μm or less,
A fine structure characterized in that a glass sintered body is used as a substrate.   2. The microstructure according to claim 1, wherein an aspect ratio (D / T) of the depth (D) of the one or more fine spaces to an average thickness (T) of the partition walls is 2 or more and 25 or less.   The microstructure according to claim 1 or 2, wherein the glass sintered body is formed by firing a composition containing glass particles and a silicone resin as a binder thereof. The glass sintered body is composed of glass particles and a binder between the glass particles,
The microstructure according to claim 1, 2 or 3, wherein the binder contains silicon oxide as a main component.   The microstructure according to any one of claims 1 to 4, wherein the glass sintered body is porous. The microstructure according to any one of claims 1 to ^{5, wherein a} linear expansion coefficient is ^10-5 / ° C or less.   The fine structure according to any one of claims 1 to 6, wherein the plurality of fine spaces are arranged in a lattice pattern.   The fine structure according to any one of claims 1 to 7, wherein the one or more fine spaces are open on the other surface.   The microstructure according to any one of claims 1 to 8, which is used as a biochip. (1) A step of pouring a curable silicone resin composition containing glass particles into the upper surface side of the microstructure forming mold using a columnar microstructure forming mold having a plurality of linear grooves on the upper surface;
(2) A step of curing the curable silicone resin composition to obtain a cured product,
(3) a step of releasing the cured product, and (4) a step of firing the cured product,
The manufacturing method of the microstructure whose width of the above-mentioned line slot is 20 micrometers or more and 350 micrometers or less.

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