JP2011180958A - Detection unit for coin identification device - Google Patents

Detection unit for coin identification device Download PDF

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JP2011180958A
JP2011180958A JP2010046355A JP2010046355A JP2011180958A JP 2011180958 A JP2011180958 A JP 2011180958A JP 2010046355 A JP2010046355 A JP 2010046355A JP 2010046355 A JP2010046355 A JP 2010046355A JP 2011180958 A JP2011180958 A JP 2011180958A
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coin
sensor
passage
timing
identification device
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Hiroyuki Negishi
弘行 根岸
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<P>PROBLEM TO BE SOLVED: To provide a detection unit for a coin identification device capable of detecting a material, an outer shape and plate thickness data of a coin by a minimally-sized sensor and a minimally-sized circuit constitution. <P>SOLUTION: The detection unit includes a coin passage 1 for making a coin pass, a sensor S1, a sensor S2, and a transmitting circuit. The sensor S1 and the sensor S2 are disposed across the coin passage while being spaced in an advancing direction 10 of the coin 2 in the coin passage 1. A signal waveform from the transmitting circuit including the sensor S1 and the sensor S2 in the passage of the coin 2 in contact with a left wall 3 of the coin passage 1 which is inclined in a direction of turning the coin sideways is inputted to an arithmetic processing unit, and data for the material of the coin, data for the material and the outer shape of the coin, and data for the plate thickness thereof are extracted from the first half, the middle and the latter half of the waveform, respectively, to identify the domination and authenticity of the coin. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、自動販売機、両替機等において、硬貨搬送通路を通過する硬貨の金種および真偽を識別する硬貨識別装置の検出部に関する。 The present invention relates to a detection unit of a coin discriminating apparatus for identifying the denomination and authenticity of a coin passing through a coin transport passage in a vending machine, a money changer, and the like.

自動販売機、両替機等には、様々な金種の硬貨が扱えるように硬貨識別装置が備えられている。硬貨識別装置は、硬貨通路に沿って、硬貨の材質、外形、厚みを検出するセンサを個別に備え、各センサからの信号から硬貨の種別や真偽を識別する電子回路を備えている。 Vending machines, currency exchange machines, and the like are equipped with a coin identification device so that various types of coins can be handled. The coin identification device is individually provided with sensors for detecting the material, outer shape, and thickness of coins along the coin path, and an electronic circuit for identifying the type and authenticity of the coins from signals from the sensors.

上記の具体例としては、投入硬貨の材質、外形、板厚の検知を、1組の材質センサ、1組の外形センサ、1組の板厚センサを備え、それぞれの検出部の出力に接続された固有の検出回路を持ち、前記検出回路からの判定データをデジタル的に演算して硬貨の真偽判定を行っている。硬貨を検出するための要素は、3組のセンサと3つの検出回路とから構成されている。(特許文献1参照) As an example of the above, the material, outer shape, and plate thickness of the inserted coin are detected by one set of material sensor, one set of outer shape sensor, and one set of plate thickness sensor, which are connected to the output of each detection unit. The detection circuit has a unique detection circuit, and the determination data from the detection circuit is digitally calculated to determine the authenticity of the coin. The element for detecting coins is composed of three sets of sensors and three detection circuits. (See Patent Document 1)

また、投入硬貨の材質と外形の2種類の検知を、1つの正弦波信号発生部と、2組のセンサと、1つの検出回路より構成し、2組のセンサの間隔をとって配置し、2組のセンサは4つのコイルから構成され、前記4つのコイルを励磁する正弦波信号発信回路と検出回路を直列もしくは並列接続し、検出回路の出力を識別回路に入力して硬貨の真偽判定を行っている。この考案は、正弦波信号発生部と検出回路を共通化できる効果がある。(特許文献2参照) In addition, two types of detection of the material and outer shape of the inserted coin are configured by one sine wave signal generation unit, two sets of sensors, and one detection circuit, and are arranged with an interval between the two sets of sensors. The two sets of sensors consist of four coils, and a sine wave signal transmission circuit that excites the four coils and a detection circuit are connected in series or in parallel, and the output of the detection circuit is input to an identification circuit to determine the authenticity of the coin. It is carried out. This device has the effect that the sine wave signal generator and the detection circuit can be shared. (See Patent Document 2)

特開2001−167310号公報JP 2001-167310 A 特開2009−26088号公報JP 2009-26088 A

特開2009−26088号公報では、材質と外形検査を行う目的を、4つのコイルから構成される2つのセンサと、1つの検出回路で構成し、検出回路を1つ削減しているが、この方式は、板厚検出が無く、板厚検出機能を追加するためには、一般的に1組のセンサと1つの検出回路が新たに追加となる。よって、投入硬貨の材質、外形、板厚の3つの要素検知するためには、合計6個のコイルから構成される3組のセンサと、2個の検出回路で構成され、検出回路を1つ削減しているが、低コスト化としては不十分であった。
解決しようとする課題は、投入硬貨の材質、外形、板厚の3つの要素を検知する目的を、最小のセンサ数と最小の回路で構成する点である。
In Japanese Patent Laid-Open No. 2009-26088, the purpose of inspecting the material and the outer shape is constituted by two sensors constituted by four coils and one detection circuit, and the number of detection circuits is reduced by one. In the system, there is no plate thickness detection, and in order to add a plate thickness detection function, generally one set of sensors and one detection circuit are newly added. Therefore, in order to detect three elements of the material, outer shape, and plate thickness of the inserted coin, it is composed of three sets of sensors composed of a total of six coils and two detection circuits, one detection circuit. Although it has been reduced, it has not been sufficient for cost reduction.
The problem to be solved is that the purpose of detecting three elements of the input coin material, outer shape, and plate thickness is configured with the minimum number of sensors and the minimum circuit.

このような目的を果たすために、本発明は、左側壁と右側壁から構成される硬貨通路と、第1のコイルを内蔵する第1のセンサと、第2のコイルを内蔵する第2のセンサと、該第1のセンサと該第2のセンサに接続する発信回路と演算処理部を備え、前記第1のセンサと前記第2のセンサは、硬貨進行方向に相互間隔をとって、前記第1のセンサは、前記左側壁に配置し、前記第2のセンサは、前記右側壁に配置し、前記硬貨通路は、検査する硬貨を横倒する方向に傾斜する構造とし、前記演算処理部は、前記硬貨通路を通過する硬貨の材質と外形と板厚を、前記発信回路からの信号に基づいて判定するものとして備えることを主要な特徴とする。 In order to achieve such an object, the present invention provides a coin passage composed of a left side wall and a right side wall, a first sensor incorporating a first coil, and a second sensor incorporating a second coil. And a transmission circuit connected to the first sensor, the second sensor, and an arithmetic processing unit, wherein the first sensor and the second sensor are spaced apart from each other in the coin traveling direction, and The first sensor is disposed on the left side wall, the second sensor is disposed on the right side wall, and the coin passage is structured to be inclined in a direction in which a coin to be inspected is laid down. The main feature is that the material, the outer shape, and the plate thickness of the coin passing through the coin passage are determined based on a signal from the transmission circuit.

なお、前記硬貨通路の底面から前記第1のセンサの中心位置および前記第2のセンサの中心位置が、金種判定する最小径硬貨の半径よりも高い位置にあり、前記硬貨通路の底面から前記第1のセンサの外周上面の高さ、および前記第2のセンサの外周上面の高さが、金種判定する最小径硬貨の直径寸法以下であることが望ましい。 The center position of the first sensor and the center position of the second sensor from the bottom surface of the coin passage are higher than the radius of the smallest diameter coin to be denominated, and from the bottom surface of the coin passage, It is desirable that the height of the outer peripheral upper surface of the first sensor and the height of the outer peripheral upper surface of the second sensor be equal to or less than the diameter dimension of the smallest diameter coin that is denominated.

前記発信回路からの信号波形の材質取得タイミング(TZ)から材質、中間タイミング(T2)から外形、板厚取得タイミング(TA)から板厚を検出することより、材質、外形、板厚を検出できる。また、前記第1のセンサと前記第2のセンサの中心線上に第3のセンサを配置することにより、中間タイミング(T2)を確実に検出できる。 By detecting the material from the material acquisition timing (TZ) of the signal waveform from the transmission circuit, the outer shape from the intermediate timing (T2), and the plate thickness from the plate thickness acquisition timing (TA), the material, the outer shape, and the plate thickness can be detected. . Further, by arranging the third sensor on the center line of the first sensor and the second sensor, the intermediate timing (T2) can be reliably detected.

本考案の「センサ」は、1個のポットコアと1個のコイルから構成されているが、先行技術文献で示すセンサ1組は、2個のポットコアに2個のコイルが硬貨通路を挟んで対向して構成されているため、先行技術文献のセンサ1組は、本考案のセンサ2個となる。 The “sensor” of the present invention is composed of one pot core and one coil, but one set of sensors shown in the prior art document is opposed to two pot cores with two coils sandwiching a coin path. Therefore, one set of sensors in the prior art document is two sensors of the present invention.

「発信回路」は、自励発信回路、他励発信回路のどちらでもよく、発信回路に付属するフィルタや平滑回路を含む。他励発信回路の例として、特開2009−26088号公報に示す正弦波信号発生回路と作動増幅の組み合わせでも良い。 The “transmitter circuit” may be either a self-excited transmitter circuit or a separately-excited transmitter circuit, and includes a filter and a smoothing circuit attached to the transmitter circuit. As an example of the separate excitation transmission circuit, a combination of a sine wave signal generation circuit and an operation amplification described in JP 2009-26088 A may be used.

前記発信回路からの信号波形のタイミングは、待機状態の波形から硬貨を検知して待機に戻るまでの時間を4等分し、検知開始から概略25%経過時を材質取得タイミング(TZ)、検知開始から概略50%経過時を中間タイミング、検知開始から概略75%経過時を後半タイミングとしている。 The timing of the signal waveform from the transmission circuit is divided into four equal times from the standby state waveform until the coin is detected and returned to standby, and the material acquisition timing (TZ) is detected when approximately 25% has elapsed from the start of detection. The time when approximately 50% has elapsed from the start is the intermediate timing, and the time when approximately 75% has elapsed since the start of detection is the latter half timing.

本発明の硬貨識別装置の検出部は、材質、外形、板厚の3つの要素を検出するために、2つセンサと1つのの検出回路で構成でき、コイル数を従来に比べて67%削減し、検出回路数を従来に比べて50%から67%削減する利点を持つ。   The detection unit of the coin identification device of the present invention can be configured with two sensors and one detection circuit to detect three elements of material, outer shape, and plate thickness, and the number of coils is reduced by 67% compared to the conventional one. In addition, there is an advantage that the number of detection circuits is reduced from 50% to 67% compared to the conventional circuit.

本発明の硬貨識別装置は、自動販売機等の投入口から投入された所定の硬貨を識別して、硬貨集積部もしくは返却口へ案内する構成であり、硬貨を識別するための硬貨識別装置の検出部を説明する。本発明の硬貨識別装置の検出部は、硬貨の材質、外形、板厚を検出するために、硬貨通路に設けた2つのセンサの配置と通路構造と、検出回路から得られた波形を効率良く解析し、最小の部品で構成した。 The coin identification device of the present invention is configured to identify a predetermined coin inserted from an insertion port of a vending machine or the like and guide it to a coin stacking unit or a return port, and a coin identification device for identifying a coin The detection unit will be described. The detection unit of the coin discriminating device of the present invention efficiently uses the arrangement and passage structure of the two sensors provided in the coin passage and the waveform obtained from the detection circuit in order to detect the material, outer shape, and plate thickness of the coin. Analyzed and configured with minimum parts.

図1は、本発明の実施例の硬貨通路1を上面から見た説明図であり、センサS1はコイルL1を内蔵し、左側壁3の外側に配置され、センサS2はコイルL2を内蔵し右側壁4の外側かつ進行方向10に間隔を持って配置される。硬貨通路1は、進行方向が低い構造であり、硬貨2が左側壁3と右側壁4の間を進行方向10に向かって自重で移動する。
センサS1のコイルL1と、センサS2のコイルL2の検知方向は、硬貨通路中央に向かっていて、硬貨2が移動すると、センサS1、S2により硬貨2を磁気的に検出できるようになっている。
FIG. 1 is an explanatory view of a coin passage 1 according to an embodiment of the present invention as viewed from above. A sensor S1 includes a coil L1 and is disposed outside the left side wall 3, and a sensor S2 includes a coil L2 and a right side. They are arranged outside the wall 4 and at intervals in the traveling direction 10. The coin passage 1 has a structure in which the traveling direction is low, and the coin 2 moves by its own weight in the traveling direction 10 between the left side wall 3 and the right side wall 4.
The detection direction of the coil L1 of the sensor S1 and the coil L2 of the sensor S2 is toward the center of the coin path, and when the coin 2 moves, the coin 2 can be magnetically detected by the sensors S1 and S2.

図2は、図1の矢印13から見た説明図で、左側壁3および右側壁4は、硬貨2が横倒しになる方向16に傾斜する構造にして、硬貨2を左側壁3に密着して通過させる。また、硬貨2を左側壁3に押し付ける部材、あるいは糸切り機構を右側壁4に設置して硬貨2を押し付けても良い。また、左側壁3および右側壁4に、硬貨2との摩擦を軽減するためのリブなどを設けることが好ましい。
通路幅12は、真偽判別する金種の中の硬貨の最大板厚よりも広く設定し、硬貨2がセンサS1、S2近傍を移動しているときには、図2で示すように硬貨通路に隙間11が発生する。右側壁4は、硬貨詰まりが発生した場合に、矢印14方向に開閉動作可能な構造としているが、詰まり解除後の通路幅12は、毎回規定位置に戻ることが望ましい。
FIG. 2 is an explanatory diagram viewed from the arrow 13 in FIG. 1. The left side wall 3 and the right side wall 4 are structured so as to be inclined in the direction 16 in which the coin 2 is laid down, and the coin 2 is closely attached to the left side wall 3. Let it pass. Further, a member that presses the coin 2 against the left side wall 3 or a thread trimming mechanism may be installed on the right side wall 4 to press the coin 2. Further, it is preferable to provide ribs or the like for reducing friction with the coin 2 on the left side wall 3 and the right side wall 4.
The passage width 12 is set to be wider than the maximum thickness of the coins in the denominations to be authenticated, and when the coin 2 is moving in the vicinity of the sensors S1 and S2, a gap is formed in the coin passage as shown in FIG. 11 occurs. The right side wall 4 has a structure that can be opened and closed in the direction of the arrow 14 when a coin clogging occurs, but it is desirable that the passage width 12 after clogging is returned to the specified position every time.

図3は、硬貨識別装置のブロック図を示し、コイルL1とコイルL2は、近似した磁気特性を持ち、前記2つのコイルは直列に接続され、発信回路6の内部コンデンサC1、C2との相互作用により発信し、発信周波数は、材質検知特性のある100KHz程度の設定となっている。周波数については、一例であり、センサの種類や大きさ、あるいは、検出する硬貨の種類により異なる。好ましくは、硬貨表面の浅い位置の材質を検出できる周波数設定とする。
コイルL2からの信号15は、整流回路7で平滑され、演算処理部8のA/Dポートに入力される。演算処理部8は、整流回路7からの信号波形データを保存および演算し、メモリ9にあらかじめ設定されている真偽判定データを照合し、金種および真偽判定を行う。
FIG. 3 shows a block diagram of the coin discriminating apparatus. The coils L1 and L2 have approximate magnetic characteristics, the two coils are connected in series, and the interaction with the internal capacitors C1 and C2 of the transmission circuit 6 is shown. The transmission frequency is set to about 100 KHz with material detection characteristics. The frequency is an example, and differs depending on the type and size of the sensor or the type of coin to be detected. Preferably, the frequency is set so that the material at the shallow position on the coin surface can be detected.
The signal 15 from the coil L2 is smoothed by the rectifier circuit 7 and input to the A / D port of the arithmetic processing unit 8. The arithmetic processing unit 8 stores and calculates the signal waveform data from the rectifier circuit 7, collates the authenticity determination data preset in the memory 9, and performs denomination and authenticity determination.

図4は、外形の異なる2つの硬貨とセンサ配置から検出面積を示す説明図で、外形が大きい硬貨2Aが通路底面5上を図の左から進行方向10に移動し、センサS1とセンサS2の中間に移動した位置を示し、外形の小さい硬貨2A(点線)は、比較説明するために記載されている。
補助線21は、識別する金種の中の最小径の硬貨の高さを示し、仮に識別硬貨が10円、50円、100円500円の4金種の場合、最小径は50円硬貨の21mmのため、通路底面5からの高さを21mmとし、通路底面5と平行とした。センサS1およびS2の外周は、補助線21よりも若干低い配置となっている。
FIG. 4 is an explanatory view showing the detection area from two coins having different outer shapes and sensor arrangements. A coin 2A having a larger outer shape moves on the passage bottom surface 5 from the left in the drawing in the traveling direction 10, and the sensors S1 and S2 A coin 2A (dotted line) having a small outer shape, showing a position moved in the middle, is described for comparison.
The auxiliary line 21 indicates the height of the coin with the smallest diameter among the denominations to be identified. If the identification coins are four denominations of 10 yen, 50 yen, 100 yen and 500 yen, the minimum diameter is 50 yen coins. Since the height is 21 mm, the height from the passage bottom surface 5 is set to 21 mm and parallel to the passage bottom surface 5. The outer circumferences of the sensors S1 and S2 are arranged slightly lower than the auxiliary line 21.

センサS1、S2を若干低い配置とした理由は、センサS1、S2は後述する材質検出において、センサS1の全面で硬貨を検知する必要があり、硬貨2Bの中心がセンサS1から出る補助線22の位置に移動したときに、センサS1の外周高さ23は、硬貨2B直径31よりも低く設定する。
上記センサ配置で、外形の大きい硬貨2Aは、センサS1、S2に対し大きな面積で接しているが、外形の小さな硬貨2Bは小さな面積で接する。
硬貨2Aと硬貨2Bの検知する面積の差は、黒塗り部17と18の合計となる。
The reason why the sensors S1 and S2 are arranged slightly lower is that the sensors S1 and S2 need to detect coins on the entire surface of the sensor S1 in the material detection described later, and the center of the coin 2B is the auxiliary line 22 that goes out of the sensor S1. When moved to the position, the outer peripheral height 23 of the sensor S1 is set lower than the coin 2B diameter 31.
In the sensor arrangement, the coin 2A having a large outer shape is in contact with the sensors S1 and S2 with a large area, but the coin 2B having a small outer shape is in contact with a small area.
The difference between the areas detected by the coins 2 </ b> A and 2 </ b> B is the sum of the black portions 17 and 18.

図4の点線24、25は、低い位置にセンサを配置した場合を想定したもので、硬貨2Aと硬貨2Bの検知する面積の差は、黒塗り部26、27の合計になる。このようにセンサ位置が高い場合の検知面積差は、黒塗り部17と18の合計で、センサ位置が低い場合の検知面積差は、黒塗り部26と27の合計となり、センサ位置を硬貨通路上部に設置することにより、硬貨の外形寸法の変化に対し、検知面積の変化量が大きくなるため、外形検出に対し有利となる。センサS1、S2の配置の高さは、センサS1、S2の中心28、29を、最小径硬貨の半径(30)よりも高い位置に設置すると外形寸法の変化を確実に測定できる。 The dotted lines 24 and 25 in FIG. 4 assume the case where the sensor is arranged at a low position, and the difference in the area detected by the coin 2A and the coin 2B is the sum of the black portions 26 and 27. Thus, the detection area difference when the sensor position is high is the sum of the black portions 17 and 18, and the detection area difference when the sensor position is low is the sum of the black portions 26 and 27. By installing it at the top, the amount of change in the detection area increases with respect to changes in the outer dimensions of the coin, which is advantageous for outer shape detection. If the centers 28 and 29 of the sensors S1 and S2 are installed at a position higher than the radius (30) of the smallest coin, the height of the arrangement of the sensors S1 and S2 can be reliably measured.

センサS1とセンサS2相互の間隔の最適寸法は、外形検知の特徴を出すために、最大径の硬貨である500円の外形26.5mmの外周からセンサS1、S2の外周が、はみ出さない寸法の最大値とすると、硬貨の外形寸法変化に対し、検知面積差が大きく取れる。
センサS1とセンサS2相互の間隔の最小値は、センサ直径でセンサS1とセンサS2が重ならない寸法が好ましいが、センサ外形が大きい場合は、この限りでなく、前記寸法最適値よりも 大きくなることもある。
The optimum dimension of the distance between the sensor S1 and the sensor S2 is such that the outer circumference of the sensors S1 and S2 does not protrude from the outer circumference of the outer diameter of 26.5 mm of 500 yen, which is the largest diameter coin, in order to obtain the feature of outer shape detection. If the maximum value is taken, a large difference in detection area can be obtained with respect to changes in the outer dimension of the coin.
The minimum distance between the sensors S1 and S2 is preferably a dimension that does not overlap the sensors S1 and S2 in terms of the sensor diameter, but is not limited to this when the sensor outer shape is large, and should be larger than the optimum dimension value. There is also.

図5は、図4で示す外形の大きい硬貨2Aが、通路底面5の上を左から進行方向10に移動したときの、図3の演算処理部8のA/Dへの入力信号の波形W1を示している。図4の硬貨2AがセンサS1よりも上流に位置するときは、図5の横軸の時間T0の状態で、硬貨2AからセンサS1,S2への作用は無く、電圧V0が発生している。図4の硬貨2AがセンサS1に到達タイミング(T1)になると図5の波形W1で示す電圧は減少を開始し、図4のセンサS1に硬貨2Aが全面重なると図5の波形W1は示す電圧V1まで低下する。このときの電圧V1は、硬貨2Aの材質固有の値を示す。図4の硬貨2Aが更に進行方向10に移動し、センサS1とセンサS2の中間点に達すると図5の中間タイミングT2となり入力信号は電圧V2の最低電圧になる。
図4の硬貨2AがセンサS2付近通過後センサS2を離脱すると、図5で示す波形W1は、板厚取得タイミング(TA)となり電圧V3を検知後、離脱タイミング(T3)では、波形W1は電圧V0に戻る。
5 shows the waveform W1 of the input signal to the A / D of the arithmetic processing unit 8 in FIG. 3 when the coin 2A having a large outer shape shown in FIG. 4 moves from the left on the passage bottom surface 5 in the traveling direction 10. Is shown. When the coin 2A in FIG. 4 is located upstream of the sensor S1, there is no action from the coin 2A to the sensors S1 and S2 in the state of time T0 on the horizontal axis in FIG. 5, and the voltage V0 is generated. When the coin 2A in FIG. 4 arrives at the sensor S1 (T1), the voltage indicated by the waveform W1 in FIG. 5 starts to decrease, and when the coin 2A entirely overlaps the sensor S1 in FIG. 4, the waveform W1 in FIG. Decreases to V1. The voltage V1 at this time indicates a value specific to the material of the coin 2A. When the coin 2A in FIG. 4 further moves in the advancing direction 10 and reaches an intermediate point between the sensors S1 and S2, the intermediate timing T2 in FIG. 5 is reached and the input signal becomes the lowest voltage of the voltage V2.
When the coin 2A in FIG. 4 leaves the sensor S2 after passing near the sensor S2, the waveform W1 shown in FIG. 5 becomes the plate thickness acquisition timing (TA), and after detecting the voltage V3, the waveform W1 is the voltage at the separation timing (T3). Return to V0.

波形W1は、図3演算処理部8に一旦記憶され、硬貨の金種や真偽の判定を行う。演算処理部8は、図5の波形W1の到達タイミングT1と離脱了タイミングT3を演算により検出する。続いて到達タイミング(T1)と離脱了タイミング(T3)の時間を2分割し、中間点を求めその結果を中間タイミング(T2)とし、中間タイミング(T2)の前後のデータの最大電圧もしくは最小電圧を求める。通常、最大電圧もしくは最小電圧は、タイミング(T2)付近となる。最小電圧、最大電圧もしくは中間タイミング(T2)のときの電圧が、硬貨外形データとなる。 The waveform W1 is temporarily stored in the arithmetic processing unit 8 in FIG. 3, and the denomination or authenticity of the coin is determined. The arithmetic processing unit 8 detects the arrival timing T1 and the end timing T3 of the waveform W1 in FIG. 5 by calculation. Subsequently, the time of arrival timing (T1) and separation completion timing (T3) is divided into two, the intermediate point is obtained and the result is set as intermediate timing (T2), and the maximum or minimum voltage of the data before and after the intermediate timing (T2) Ask for. Usually, the maximum voltage or the minimum voltage is near the timing (T2). The minimum voltage, the maximum voltage, or the voltage at the intermediate timing (T2) is the coin outline data.

図5の到達タイミング(T1)と中間タイミング(T2)の中間点を演算した結果は、材質検知タイミング(TZ)となり、波形W1の材質検知タイミング(TZ)の電圧V1が硬貨の材質データとなる。また、材質データは、材質検知タイミング(TZ)の前後のデータを平均化する方法でもよい。
中間タイミング(T2)と離脱タイミング(T3)の中間点を演算した結果は、板厚取得タイミング(TA)となり、波形W1の板厚取得タイミング(TA)の電圧V3が硬貨の板厚データとなる。板厚データは、板厚取得タイミング(TA)の前後のデータを平均化する方法でもよい。
The result of calculating the intermediate point between the arrival timing (T1) and the intermediate timing (T2) in FIG. 5 is the material detection timing (TZ), and the voltage V1 of the material detection timing (TZ) of the waveform W1 becomes the material data of the coin. . The material data may be a method of averaging data before and after the material detection timing (TZ).
The result of calculating the intermediate point between the intermediate timing (T2) and the withdrawal timing (T3) is the plate thickness acquisition timing (TA), and the voltage V3 at the plate thickness acquisition timing (TA) of the waveform W1 becomes the plate thickness data of the coin. . The plate thickness data may be a method of averaging data before and after the plate thickness acquisition timing (TA).

図6の波形W1、W2は、材質と板厚が同等であるが、外形の異なる硬貨2Aと硬貨2Bが、図4の通路底面5の上を左から進行方向10に移動した場合の図3の演算処理部8の入力信号示し、外形の小さい硬貨2Bは、図6の波形W2であり、外形の大きい硬貨2Aの信号波形W1は、比較のために点線で示されている。
図6のタイミング(T4)は、波形W2の材質検知タイミングで、図4の硬貨2BがセンサS1のみで検知される位置にあり、このときの入力信号は図6の電圧V4になり、外形の大きい硬貨2Aの入力信号電圧V2と等しくなる。
Waveforms W1 and W2 in FIG. 6 are the same in material and plate thickness, but FIG. 3 shows a case where coins 2A and coins 2B having different external shapes move from the left on the passage bottom surface 5 in FIG. The coin 2B having a small outer shape is the waveform W2 in FIG. 6, and the signal waveform W1 of the coin 2A having a large outer shape is indicated by a dotted line for comparison.
The timing (T4) in FIG. 6 is the material detection timing of the waveform W2, and is in a position where the coin 2B in FIG. 4 is detected only by the sensor S1, and the input signal at this time is the voltage V4 in FIG. It becomes equal to the input signal voltage V2 of the large coin 2A.

図4の硬貨2Bが更に進行方向10に移動し、センサS1とセンサS2の中間点である図6のタイミングT5に達すると入力信号波形W2は電圧V5となる。検出電圧V2とV5の差は、図4説明の外形寸法によるセンサに接する面積差17、18の影響によるものであり、図6のタイミング(T5)の入力信号の電圧は、硬貨の外形を検出するためのデータとして使用する。 When the coin 2B in FIG. 4 further moves in the advancing direction 10 and reaches a timing T5 in FIG. 6, which is an intermediate point between the sensors S1 and S2, the input signal waveform W2 becomes a voltage V5. The difference between the detection voltages V2 and V5 is due to the influence of the area differences 17 and 18 in contact with the sensor according to the external dimensions described in FIG. 4, and the voltage of the input signal at the timing (T5) in FIG. 6 detects the external shape of the coin. It is used as data for

図4の硬貨2Bが更に進行方向10に移動し、センサS2付近を通過すると、入力信号は図6の電圧V6となり、外形の大きい硬貨2Aの入力信号電圧V3と同等の特性を示し、S2を離脱すると電圧V0に戻る。 When the coin 2B in FIG. 4 further moves in the advancing direction 10 and passes through the vicinity of the sensor S2, the input signal becomes the voltage V6 in FIG. 6 and exhibits the same characteristics as the input signal voltage V3 of the coin 2A having a large outer shape. When it leaves, it returns to voltage V0.

図7は、図4の硬貨2Aの材質と外形寸法が同一で、板厚の異なる硬貨を移動させたときの、入力信号波形を示す説明図で、硬貨2Aを移動させたときの波形W1(点線)と、硬貨2Aよりも薄い硬貨の波形をW3(実線)で示している。
図4の硬貨2Aおよび硬貨2BがセンサS1中央付近にあるとき、硬貨は図2で示すように左側壁3に密着して移動し、センサS1により硬貨表面に近い位置の材質特性を検出している。このときの図7の波形W1と波形W2はタイミング(T7)の位置で、硬貨の板厚に影響されず、同等の電圧を示す。図4の硬貨2Aおよび硬貨2BがセンサS1とセンサS2の中間点にあるとき、外形検出と同様に検出するため省略する。
FIG. 7 is an explanatory diagram showing an input signal waveform when coins having the same material and outer dimensions as coin 2A in FIG. 4 but having different thicknesses are moved. Waveform W1 when coin 2A is moved ( The waveform of the coin thinner than the coin 2A is indicated by W3 (solid line).
When the coin 2A and the coin 2B in FIG. 4 are in the vicinity of the center of the sensor S1, the coin moves in close contact with the left side wall 3 as shown in FIG. 2, and the sensor S1 detects the material property at a position close to the coin surface. Yes. The waveform W1 and the waveform W2 of FIG. 7 at this time are the position of timing (T7), show the equivalent voltage, without being influenced by the thickness of the coin. When the coin 2A and the coin 2B in FIG. 4 are at an intermediate point between the sensor S1 and the sensor S2, the detection is omitted in the same manner as the outer shape detection.

図4の硬貨がセンサS2中央付近に達した位置は、センサS1の影響はなくセンサS2の影響を受ける。前記タイミングは、図7のタイミング(T8)となり、薄い硬貨の波形W3の電圧はV8となり、硬貨2Aの波形W1の電圧V3よりも高い値となっている。これは、図2の硬貨2とセンサS2との隙間11による影響で、薄い板厚の硬貨は、隙間11が大きくなり電磁結合が減少するためである。
このように、図7のタイミング(T8)付近の電圧を検知することにより、硬貨2の板厚を測定できる。また、タイミング(T7)付近の電圧V7とタイミング(T8)付近の電圧V8の差や変化の割合を演算して、板厚データとしてもよい。
The position where the coin shown in FIG. 4 reaches near the center of the sensor S2 is not affected by the sensor S1, but is affected by the sensor S2. The timing is the timing (T8) in FIG. 7, and the voltage of the thin coin waveform W3 is V8, which is higher than the voltage V3 of the waveform W1 of the coin 2A. This is due to the influence of the gap 11 between the coin 2 and the sensor S2 in FIG. 2, and the thin plate coin has a larger gap 11 and reduced electromagnetic coupling.
Thus, the plate thickness of the coin 2 can be measured by detecting the voltage near the timing (T8) in FIG. Further, the difference or change ratio between the voltage V7 near the timing (T7) and the voltage V8 near the timing (T8) may be calculated and used as the plate thickness data.

このように、材質を検出するセンサS1とS2の配置と波形からのデータを解析することにより、外形と板厚を検出する硬貨識別装置の検出が可能となった。また、1つの回路で検出が構成されているため、回路間の温度変動の補正なども難しい処理も不要となった。 Thus, by analyzing the data from the arrangement and waveform of the sensors S1 and S2 that detect the material, it is possible to detect the coin identifying device that detects the outer shape and the plate thickness. In addition, since detection is configured with a single circuit, it is no longer necessary to perform processing that is difficult to compensate for temperature fluctuations between circuits.

図8は、第3のセンサの一例としてエッジ検出を行うためセンサを追加した説明図であり、エッジセンサ20は、センサS1とセンサS2の中心線19上の通路底面5付近に設置されている。この通路に硬貨が移動すると図9の波形W4を取得でき、W4の最小電圧V9を測定することにより、センサS1、センサS2の中心に硬貨が移動したタイミング(T9)が取得できる。 FIG. 8 is an explanatory diagram in which a sensor is added as an example of the third sensor to perform edge detection. The edge sensor 20 is installed near the passage bottom surface 5 on the center line 19 of the sensors S1 and S2. . When the coin moves in this passage, the waveform W4 in FIG. 9 can be acquired, and by measuring the minimum voltage V9 of W4, the timing (T9) at which the coin moves to the center of the sensors S1 and S2 can be acquired.

タイミング(T9)を取得することにより、同じタイミングで電圧V2の測定を同時にでき、外形寸法がわかり、タイミングT9以前のデータは、材質、タイミングT9以降は、板厚測定とソフトウエアの負担が軽減できる。第3のセンサは、エッジ検出以外に異なる周波数による材質検出や光学的な位置検出でも良い。 By obtaining the timing (T9), the voltage V2 can be measured at the same time at the same timing, the external dimensions can be known, the data before the timing T9 is the material, and the thickness and software burden are reduced after the timing T9. it can. The third sensor may be material detection or optical position detection using different frequencies other than edge detection.

硬貨通路の上面から見た説明図である。(実施例1)It is explanatory drawing seen from the upper surface of the coin channel | path. Example 1 硬貨通路の側面から見た説明図である。(実施例1)It is explanatory drawing seen from the side of the coin channel. Example 1 硬貨識別装置一例を示すブロック図である。(実施例1)It is a block diagram which shows an example of a coin identification device. Example 1 外形の異なる2つの硬貨とセンサの検知面積を説明図である。(実施例1)It is explanatory drawing about the detection area of two coins and a sensor from which an external shape differs. Example 1 硬貨が硬貨通路を移動するときの波形である。(実施例1)It is a waveform when a coin moves through a coin passage. Example 1 外形の異なる硬貨が硬貨通路を移動するときの波形の差を示す説明図である。(実施例1)It is explanatory drawing which shows the difference of a waveform when the coin from which an external shape moves a coin channel | path. Example 1 板厚の異なる硬貨が硬貨通路を移動するときの波形の差を示す説明図である。(実施例1)It is explanatory drawing which shows the difference in a waveform when the coin from which board thickness differs moves a coin channel | path. Example 1 センサ配置の上面およびと正面から見た説明図である。(実施例2)It is explanatory drawing seen from the upper surface and front of sensor arrangement | positioning. (Example 2) エッジ検出センサの波形を示す説明図である。(実施例2)It is explanatory drawing which shows the waveform of an edge detection sensor. (Example 2)

1 硬貨通路2 硬貨 3 左側壁 4 右側壁5 通路底面 6 発信回路 7 整流回路 8 演算処理部 9 メモリ 10 進行方向 16 横倒し方向 23 第1のセンサおよび第2のセンサの外周高さ 28 第1のセンサの中心位置 29 第2のセンサの中心位置 30 最小径硬貨の半径 31 最小径硬貨の直径 S1、S2 第1のセンサ、第2のセンサ L1、L2 第1のコイル、第2のコイル T2 中間タイミング TA 板厚取得タイミング TZ 材質取得タイミング DESCRIPTION OF SYMBOLS 1 Coin passage 2 Coin 3 Left side wall 4 Right side wall 5 Passage bottom face 6 Transmission circuit 7 Rectification circuit 8 Arithmetic processing part 9 Memory 10 Traveling direction 16 Sideways direction 23 Outer peripheral height of 1st sensor and 2nd sensor 28 1st Center position of sensor 29 Center position of second sensor 30 Radius of minimum diameter coin 31 Diameter of minimum diameter coin S1, S2 First sensor, second sensor L1, L2 First coil, second coil T2 Middle Timing TA Thickness acquisition timing TZ Material acquisition timing

Claims (5)

左側壁と右側壁から構成される硬貨通路と、第1のコイルを内蔵する第1のセンサと、第2のコイルを内蔵する第2のセンサと、該第1のセンサと該第2のセンサに接続する発信回路と演算処理部を備え、前記第1のセンサと前記第2のセンサは、硬貨進行方向に相互間隔をとって、前記第1のセンサは、前記左側壁に配置し、前記第2のセンサは、前記右側壁に配置し、前記硬貨通路は、検査する硬貨を横倒する方向に傾斜する構造とし、前記演算処理部は、前記硬貨通路を通過する硬貨の材質と外形と板厚を、前記発信回路からの信号に基づいて判定することを特徴とする硬貨識別装置の検出部。 A coin passage composed of a left side wall and a right side wall, a first sensor incorporating a first coil, a second sensor incorporating a second coil, the first sensor and the second sensor The first sensor and the second sensor are spaced apart from each other in the coin traveling direction, the first sensor is disposed on the left side wall, The second sensor is arranged on the right side wall, the coin passage is structured to be inclined in a direction in which a coin to be inspected is laid down, and the arithmetic processing unit includes a material and an outer shape of the coin passing through the coin passage. The detection part of the coin identification device characterized by determining plate | board thickness based on the signal from the said transmission circuit. 前記硬貨通路の底面から前記第1のセンサの中心位置および前記第2のセンサの中心位置が、金種判定する最小径硬貨の半径よりも高い位置にあり、前記硬貨通路の底面から前記第1のセンサの外周高さ、および前記第2のセンサの外周高さが、金種判定する最小径硬貨の直径寸法以下であることを特徴とする請求項1記載の硬貨識別装置の検出部。 The center position of the first sensor and the center position of the second sensor from the bottom surface of the coin passage are higher than the radius of the smallest diameter coin to be denominated, and the first position from the bottom surface of the coin passage is the first position. 2. The detection unit of a coin identification device according to claim 1, wherein an outer peripheral height of the second sensor and an outer peripheral height of the second sensor are equal to or less than a diameter dimension of a minimum diameter coin to be denominated. 前記第1のセンサ外周および前記第2のセンサ外周が、金種判定する最大径硬貨の外周の内側に接する位置にあることを特徴とする請求項1および2記載の硬貨識別装置の検出部。 3. The detection unit of a coin identification device according to claim 1, wherein the outer circumference of the first sensor and the outer circumference of the second sensor are in a position in contact with the inner side of the outer circumference of the largest diameter coin to be denominated. 前記発信回路からの信号波形から前記演算処理部の演算により、材質取得タイミング(TZ)から材質、中間タイミング(T2)から外形、板厚取得タイミング(TA)から板厚を検出することを特徴とする請求項1記載の硬貨識別装置の検出部。 A material thickness is detected from a material acquisition timing (TZ), an outer shape from an intermediate timing (T2), and a plate thickness from a plate thickness acquisition timing (TA) by calculation of the arithmetic processing unit from a signal waveform from the transmission circuit. The detection part of the coin identification device according to claim 1. 請求項1記載の硬貨識別装置の検出部において、前記第1のセンサと前記第2のセンサの中心線上に第3のセンサを配置したことを特徴とする硬貨識別装置の検出部。 The detection unit of the coin identification device according to claim 1, wherein a third sensor is arranged on a center line of the first sensor and the second sensor.
JP2010046355A 2010-03-03 2010-03-03 Detection unit for coin identification device Pending JP2011180958A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014200105A1 (en) * 2013-06-13 2014-12-18 株式会社アミテック Inductive position-detecting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014200105A1 (en) * 2013-06-13 2014-12-18 株式会社アミテック Inductive position-detecting device
CN105308418A (en) * 2013-06-13 2016-02-03 株式会社阿米泰克 Inductive position-detecting device
JPWO2014200105A1 (en) * 2013-06-13 2017-02-23 株式会社アミテック Inductive position detector
US9752899B2 (en) 2013-06-13 2017-09-05 Amiteq Co., Ltd. Inductive position detection device

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