JP2011176059A - Package, method of manufacturing the same, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled clock - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package which can manufacture a penetrating electrode with efficiency, and to provide a package, a piezoelectric vibrator, an oscillator, an electronic equipment, and a radio-controlled clock. <P>SOLUTION: A penetrating electrode forming step S30A includes: a recessed part forming step S32 of forming a recessed part on a first surface L of a wafer 40 for a base substrate; a metal pin arrangement step S33 of inserting a metal pin 7 into the recessed part 30a; a glass frit filling step S35 of filling a glass frit into a gap between an inner periphery surface of the recessed part 30a and an outer periphery surface of the metal pin 7 from the first surface L side; a baking step S37 of baking and hardening the glass frit filled in the recessed part 30a; and a polishing step S39 of exposing the metal pin 7 to the second surface U. At the metal pin arrangement step S33, an attitude holding member 7a is arranged between the inserted metal pin 7 and the recessed part 30a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and a radio timepiece.

  2. Description of the Related Art In recent years, cellular phones and personal digital assistants use piezoelectric vibrators that use quartz as a time source, a timing source such as a control signal, and a reference signal source. Various types of piezoelectric vibrators of this type are known. As one of them, a two-layer structure type surface mount type piezoelectric vibrator is known.

  This type of piezoelectric vibrator has a two-layer structure packaged by directly bonding a first substrate and a second substrate, and a piezoelectric vibrating piece is placed in a cavity formed between the two substrates. It is stored. As one of such two-layer structure type piezoelectric vibrators, the through electrode formed on the base substrate connects the piezoelectric vibrating piece enclosed inside the cavity and the external electrode formed outside the base substrate. A piezoelectric vibrator is known (see Patent Document 1).

  In the above-described two-layer structure type piezoelectric vibrator, the through electrode plays two major roles of electrically connecting the piezoelectric vibrating piece and the external electrode and closing the through hole to maintain airtightness in the cavity. In particular, if the close contact between the through electrode and the through hole is insufficient, the airtightness in the cavity may be impaired. In order to eliminate such a problem, it is necessary to form the through electrode in a state in which the through hole is tightly adhered to the through hole and completely closed.

  By the way, Patent Document 1 describes that a through electrode is formed by using a pin member made of metal as a conductive material. As a specific method for forming the through electrode, it is described that after the base substrate wafer to be the base substrate is heated later, the pin member is driven into the through hole while it is in the heat softened state.

JP 2002-124845 A

  However, in the method of forming the through electrode by driving the pin member into the through hole, it is difficult to completely close the gap between the pin member and the through hole, and the airtightness in the cavity may not be ensured. Further, the base substrate wafer has a large number of through holes, and it is complicated and requires a lot of man-hours to drive the pin members into all the through holes.

In order to solve the above problem, a method of forming the through electrode 32 using the conductive casing 77 and the glass frit 61 has been proposed.
FIG. 19 is an explanatory view of the through electrode forming process, FIG. 19 (a) is an explanatory view of the through hole forming process, and FIG. 19 (b) is an explanatory view of the housing arrangement process and the laminating step. 19 (c) is an explanatory view of the frit glass filling step, and FIG. 19 (d) is an explanatory view of the through electrode.
As a specific formation process of the through electrode 32, first, as shown in FIG. 19A, a recess 30a is formed on the first surface L of the base substrate wafer 40 with a press die, and the second surface U side is formed. The through hole 30 is formed by polishing and removing the bottom surface of the recess 30a (through hole forming step). Next, as shown in FIG. 19B, the core 77b of the casing 77 is inserted into the through hole 30 from the second surface U side, and the base portion 77a is brought into contact with the second surface U to The body 77 is placed (a housing placement step). Then, in order to prevent the casing 77 from falling off during transportation and to prevent the glass frit 61 from leaking when the glass frit 61 is filled into the through-hole 30, a laminate material 700 is affixed to the second surface U to fix the casing 77. (Laminate sticking process). Next, as shown in FIG. 19C, the fill squeegee 650 is scanned along the first surface L to fill the gap between the through hole 30 and the core member 77b with the glass frit 61 (filling the glass frit). Process). Next, as shown in FIG. 19D, the filled glass frit 61 is fired to integrate the through holes 30, the core material part 77b, and the glass frit 61 (firing step). Finally, as shown in FIG. 19D, the core portion 77a is exposed on the second surface by polishing and removing the base portion 77a of the casing 77 disposed in contact with the second surface U. . (Polishing step) The through electrode 32 is formed.

  As described above, according to the method of forming the through electrode 32 using the casing 77 and the glass frit 61, the gap between the through hole 30 and the casing 77 can be completely closed with the glass frit 61. Therefore, compared with the through electrode forming method disclosed in Patent Document 1, the airtightness in the cavity can be maintained well. Further, in the above-described method, since the laminate material 700 is stuck and fixed in a state where the base portion of the casing is in contact with the second surface U, the core material portion does not fall within the through hole. Further, when the base substrate wafer 40 is transferred, the core material portion does not jump out from the first surface L side of the through hole.

  However, the above-described method requires a laminating material pasting step for pasting the laminating material 700. Further, in order to polish the second surface U in the through hole forming step and further polish and remove the base portion 77a in the polishing step, the step of polishing the second surface U side is required at least twice. For this reason, the above-described method may increase the number of processing steps and increase the manufacturing cost.

  Therefore, an object of the present invention is to provide a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and a radio timepiece that can efficiently manufacture a through electrode.

In order to solve the above problems, a method for manufacturing a package of the present invention is a method for manufacturing a package in which an electronic component can be enclosed in a cavity formed between a plurality of substrates bonded to each other. A through electrode forming step of forming a through electrode that penetrates the first substrate in the thickness direction and connects the inside of the cavity and the outside of the package, wherein the through electrode forming step includes: A recess forming step of forming a recess in a first surface of one substrate; a metal pin arranging step of inserting a metal pin into the recess; and a second of the first substrate to hold the metal pin in the recess. A glass for sealing the gap by filling a gap between the inner circumferential surface of the recess and the outer circumferential surface of the metal pin with a glass frit from the first surface side, and a magnet placement step of placing a magnet on the surface side Frit filling process and A firing step of firing and curing the glass frit filled in the recess, and a polishing step of polishing at least the second surface to expose the metal pin on the second surface, A posture holding member is arranged between the metal pin inserted in the pin arranging step and the recess.
According to the present invention, the metal pin is inserted into the recess instead of the through hole and filled with the glass frit, so that the metal pin does not drop from the second surface side or the glass frit does not leak. Thereby, the lamination material sticking process which sticks a laminate material on the 2nd surface side becomes unnecessary. Moreover, since the recess is formed instead of the through hole, polishing in the through hole forming step is not necessary. Further, since it is not necessary to remove the base portion of the housing, polishing in the polishing process is reduced. As described above, the laminating material attaching step can be reduced and the polishing step can be further reduced, so that the through electrode can be efficiently manufactured. Further, according to the present invention, since the posture holding member is disposed between the metal pin and the recess, the metal pin can be held in the recess without tilting the metal pin in the recess. Furthermore, according to the present invention, by arranging the magnet on the second surface side, the metal pin is attracted to the bottom surface of the recess, so that the metal pin is prevented from jumping out and falling off during the transportation of the first substrate. be able to.

In the glass frit filling step, after applying the glass frit so as to close the opening of the concave portion on the first surface under reduced pressure, the atmospheric pressure is increased to increase the pressure inside the concave portion and outside the concave portion. It is desirable that the glass frit is filled in the recess due to a pressure difference generated during
When the squeegee is scanned to fill the recess with the glass frit, the squeegee and the metal pin may come into contact with each other and the metal pin may jump out of the recess. However, according to the present invention, since the glass frit is filled using the pressure difference generated between the inside of the recess and the outside of the recess, the recess can be filled with the glass frit without using a squeegee. Therefore, it is possible to suppress the squeegee and the metal pin from coming into contact with each other in the glass frit filling step and the metal pin from jumping out of the recess. In addition, according to the present invention, it is possible to reliably fill the glass frit to every corner of the gap between the inner peripheral surface of the recess and the outer peripheral surface of the metal pin. Thereby, it can suppress that a space | gap generate | occur | produces in a penetration electrode, and can maintain the airtightness in a cavity in a favorable state.

Further, it is desirable that the concave portion is formed so that the inner shape gradually increases from the second surface side to the first surface side.
According to the present invention, the metal pin can be easily arranged from the first surface side. Further, by filling the glass frit from the first surface side having a large inner shape, the glass frit can be easily filled in the gap between the recess and the metal pin.

The package of the present invention is a package in which an electronic component can be enclosed in a cavity formed between a plurality of substrates bonded to each other, and the first substrate of the plurality of substrates is arranged in the thickness direction. A through electrode penetrating through the inside of the cavity and the outside of the package, the through electrode comprising a metal pin disposed in a through hole penetrating the first substrate; the through hole; A glass frit filled between the metal pins, and between the through hole and the metal pin, before filling the glass frit, the through hole and the metal in the radial direction of the through hole A posture holding member that restricts relative movement with the pin is formed.
According to the present invention, between the through hole and the metal pin, the posture holding member that restricts the relative movement of the metal pin in the radial direction with respect to the through hole is formed. Therefore, the metal pin can be held in the through hole without the metal pin tilting in the through hole.

In addition, the posture holding member includes at least three convex portions erected radially outward from the outer peripheral surface of the metal pin, and the central axis of the metal pin has a plurality of convex portions at the tips of the metal pin. It is desirable that they are arranged inside a polygon connected in a straight line in order along the circumferential direction of the pin.
According to the present invention, since the convex portion and the inner peripheral surface of the through hole always come into contact with each other before the metal pin falls, the relative movement of the metal pin in the radial direction with respect to the through hole can be restricted. Therefore, the metal pin can be held in the through hole without the metal pin tilting in the through hole.

In addition, the piezoelectric vibrator of the present invention is characterized in that a piezoelectric vibrating piece is enclosed as the electronic component in the package described above.
According to the present invention, since the piezoelectric vibrator is sealed inside the package in which the through electrode is efficiently manufactured, a low-cost piezoelectric vibrator can be provided.

The oscillator according to the present invention is characterized in that the above-described piezoelectric vibrator is electrically connected to an integrated circuit as an oscillator.
The electronic apparatus according to the present invention is characterized in that the above-described piezoelectric vibrator is electrically connected to a time measuring unit.
The radio-controlled timepiece of the present invention is characterized in that the above-described piezoelectric vibrator is electrically connected to a filter unit.

  According to the oscillator, the electronic device, and the radio timepiece according to the present invention, since the piezoelectric vibrator in which the through electrode is efficiently manufactured is provided, a low-cost oscillator, electronic device, and radio timepiece can be provided.

  According to the present invention, the metal pin is inserted into the recess instead of the through hole and filled with the glass frit, so that the metal pin does not drop from the second surface side or the glass frit does not leak. Thereby, the lamination material sticking process which sticks a laminate material on the 2nd surface side becomes unnecessary. Moreover, since the recess is formed instead of the through hole, polishing in the through hole forming step is not necessary. Further, since it is not necessary to remove the base portion of the housing, polishing in the polishing process is reduced. As described above, the laminating material attaching step can be reduced and the polishing step can be further reduced, so that the through electrode can be efficiently manufactured. Further, according to the present invention, since the posture holding member is disposed between the metal pin and the recess, the metal pin can be held in the recess without tilting the metal pin in the recess. Furthermore, according to the present invention, by arranging the magnet on the second surface side, the metal pin is attracted to the bottom surface of the recess, so that the metal pin is prevented from jumping out and falling off during the transportation of the first substrate. be able to.

It is an external perspective view of a piezoelectric vibrator. FIG. 2 is an internal configuration diagram of the piezoelectric vibrator shown in FIG. 1, and is a plan view with a lid substrate removed. It is sectional drawing in the AA of FIG. FIG. 2 is an exploded perspective view of the piezoelectric vibrator shown in FIG. 1. It is a top view of a piezoelectric vibrating piece. It is a bottom view of a piezoelectric vibrating piece. It is sectional drawing in the BB line of FIG. It is explanatory drawing of the metal pin and attitude | position holding member of 1st Embodiment, Fig.8 (a) is a top view, FIG.8 (b) is a front view, FIG.8 (c) is explanatory drawing of a convex part. It is. It is a flowchart of the manufacturing method of a piezoelectric vibrator. It is a disassembled perspective view of a wafer body. It is explanatory drawing of a recessed part. It is explanatory drawing of a metal pin arrangement | positioning process and a magnet arrangement | positioning process. It is explanatory drawing of a glass frit filling process, Fig.13 (a) is explanatory drawing at the time of glass frit application | coating, FIG.13 (b) is explanatory drawing after filling. It is explanatory drawing of a baking process and a grinding | polishing process. It is explanatory drawing of the attitude | position holding member of 2nd Embodiment, Fig.15 (a) is a top view, FIG.15 (b) is sectional drawing in CC line of Fig.15 (a). It is a block diagram which shows one Embodiment of an oscillator. It is a lineblock diagram showing one embodiment of electronic equipment. It is a block diagram which shows one Embodiment of a radio timepiece. It is explanatory drawing of the conventional penetration electrode formation process, Fig.19 (a) is explanatory drawing of a through-hole formation process, FIG.19 (b) is explanatory drawing of a housing arrangement | positioning process and a lamination sticking process, FIG. (C) is explanatory drawing of a frit glass filling process, FIG.19 (d) is explanatory drawing of a penetration electrode.

(First embodiment, piezoelectric vibrator)
Hereinafter, a piezoelectric vibrator according to an embodiment of the present invention will be described with reference to the drawings.
In the following description, the first substrate is a base substrate, and the substrate bonded to the base substrate is a lid substrate. Further, the bonding surface of the base substrate of the package (piezoelectric vibrator) with the lid substrate will be described as a second surface U, and the outer surface of the base substrate will be described as a first surface L.
FIG. 1 is an external perspective view of a piezoelectric vibrator.
FIG. 2 is an internal configuration diagram of the piezoelectric vibrator, and is a plan view with the lid substrate removed.
3 is a cross-sectional view taken along line AA in FIG.
FIG. 4 is an exploded perspective view of the piezoelectric vibrator shown in FIG.
In FIG. 4, the excitation electrode 15, the extraction electrodes 19 and 20, the mount electrodes 16 and 17, and the weight metal film 21, which will be described later, are omitted for easy understanding of the drawing.
As shown in FIGS. 1 to 4, the piezoelectric vibrator 1 of this embodiment is housed in a package 9 in which a base substrate 2 and a lid substrate 3 are anodically bonded via a bonding film 35, and a cavity C of the package 9. The surface mount type piezoelectric vibrator 1 including the piezoelectric vibrating piece 4.

(Piezoelectric vibrating piece)
FIG. 5 is a plan view of the piezoelectric vibrating piece.
FIG. 6 is a bottom view of the piezoelectric vibrating piece.
7 is a cross-sectional view taken along line BB in FIG.
As shown in FIGS. 5 to 7, the piezoelectric vibrating piece 4 is a tuning fork type vibrating piece formed of a piezoelectric material such as crystal, lithium tantalate, or lithium niobate, and when a predetermined voltage is applied. It vibrates. The piezoelectric vibrating reed 4 includes a pair of vibrating arm portions 10 and 11 arranged in parallel, a base portion 12 that integrally fixes the base end sides of the pair of vibrating arm portions 10 and 11, and a pair of vibrating arm portions. And a groove portion 18 formed on both main surfaces 10 and 11. The groove portion 18 is formed from the proximal end side of the vibrating arm portions 10 and 11 to the vicinity of the middle along the longitudinal direction of the vibrating arm portions 10 and 11.

  The piezoelectric vibrating reed 4 is formed on the outer surface of the pair of vibrating arm portions 10 and 11 and is composed of a first excitation electrode 13 and a second excitation electrode 14 that vibrate the pair of vibrating arm portions 10 and 11. The electrode 15 includes mount electrodes 16 and 17 electrically connected to the first excitation electrode 13 and the second excitation electrode 14. The excitation electrode 15, the mount electrodes 16 and 17, and the extraction electrodes 19 and 20 are formed by a film of a conductive material such as chromium (Cr), nickel (Ni), aluminum (Al), titanium (Ti), or the like. .

  The excitation electrode 15 is an electrode that vibrates the pair of vibrating arm portions 10 and 11 at a predetermined resonance frequency in a direction toward or away from each other. The first excitation electrode 13 and the second excitation electrode 14 constituting the excitation electrode 15 are formed by being patterned on the outer surfaces of the pair of vibrating arm portions 10 and 11 while being electrically separated from each other. . Specifically, the first excitation electrode 13 is mainly formed on the groove portion 18 of one vibration arm portion 10 and on both side surfaces of the other vibration arm portion 11, and the second excitation electrode 14 is formed on one side. Are formed mainly on both side surfaces of the vibrating arm portion 10 and on the groove portion 18 of the other vibrating arm portion 11. In addition, the first excitation electrode 13 and the second excitation electrode 14 are electrically connected to the mount electrodes 16 and 17 via the extraction electrodes 19 and 20 on both main surfaces of the base portion 12, respectively.

  Further, a weight metal film 21 for adjusting (frequency adjustment) to vibrate its own vibration state within a predetermined frequency range is coated on the tips of the pair of vibrating arm portions 10 and 11. The weight metal film 21 is divided into a coarse adjustment film 21a used when the frequency is roughly adjusted and a fine adjustment film 21b used when the frequency is finely adjusted. By adjusting the frequency using the coarse adjustment film 21a and the fine adjustment film 21b, the frequency of the pair of vibrating arm portions 10 and 11 can be kept within the range of the nominal frequency of the device.

(package)
As shown in FIGS. 1, 3, and 4, the lid substrate 3 is an anodic bondable substrate made of a glass material, for example, soda-lime glass, and is formed in a substantially plate shape. A cavity recess 3 a for accommodating the piezoelectric vibrating reed 4 is formed on the side of the lid substrate 3 that is bonded to the base substrate 2.

  A bonding film 35 for anodic bonding is formed on the entire bonding surface side of the lid substrate 3 with the base substrate 2. That is, the bonding film 35 is formed in the frame area around the cavity recess 3a in addition to the entire inner surface of the cavity recess 3a. Although the bonding film 35 of the present embodiment is formed of a Si film, the bonding film 35 can also be formed of Al. As will be described later, the bonding film 35 and the base substrate 2 are anodically bonded, and the cavity C is vacuum-sealed.

  As shown in FIG. 3, the piezoelectric vibrator 1 includes through electrodes 32 and 33 that penetrate the base substrate 2 in the thickness direction and conduct the inside of the cavity C and the outside of the piezoelectric vibrator 1. The through electrodes 32 and 33 are disposed in the through holes 30 and 31 that penetrate the base substrate 2, and the metal pins 7 that electrically connect the piezoelectric vibrating reed 4 and the outside, the through holes 30 and 31, and the metal A glass frit 61 filled between the pin 7 and the through hole 30, 31 and the metal pin 7 between the through hole 30, 31 in the radial direction of the metal pin 7. A posture holding member 7a to be regulated is formed. Further, the posture holding member 7 a of the present embodiment includes a convex portion 7 c erected on the radially outer side from the outer peripheral surface 7 b of the metal pin 7.

  The base substrate 2 is a substrate made of a glass material, for example, soda-lime glass, and is formed in a substantially plate shape with the same outer shape as the lid substrate 3 as shown in FIGS. Further, the base substrate 2 is formed with a pair of through holes 30 and 31 penetrating the base substrate 2 in the thickness direction, and a pair of through electrodes 32 and 33.

  As shown in FIGS. 2 and 3, the through holes 30 and 31 are formed so as to be accommodated in the cavity C when the piezoelectric vibrator 1 is formed. More specifically, in the through holes 30 and 31 of the present embodiment, one through hole 30 is formed at a position corresponding to the base 12 side of the piezoelectric vibrating reed 4 mounted in the mounting process described later. , 11 is formed in the other through hole 31 at a position corresponding to the tip side. As shown in FIG. 3, the through holes 30 and 31 of the present embodiment are formed so that the inner shape gradually increases from the second surface U side to the first surface L side. The cross-sectional shape including the central axis O is formed in a tapered shape. In addition, the taper angle of the inner peripheral surfaces of the through holes 30 and 31 is formed to be about 10 degrees to 20 degrees with respect to the central axis O of the through holes 30 and 31. In the present embodiment, the cross-sectional shape in the direction perpendicular to the central axis O of the through holes 30 and 31 is formed to be a circular shape.

The through electrode will be described below. In the following description, the through electrode 32 is described as an example, but the same applies to the through electrode 33.
As shown in FIG. 3, the through electrode 32 is disposed in the through hole 30 that penetrates the base substrate 2, and the metal pin 7 that electrically connects the piezoelectric vibrating piece 4 and the outside, and the through hole 30 and the metal pin. 7 and a glass body 6 (glass frit) filled in between. And between the through-hole 30 and the metal pin 7, the attitude | position holding member 7a which controls the relative displacement | movement to the radial direction of the metal pin 7 with respect to the through-hole 30 is formed.

  FIG. 8 is an explanatory view of the metal pin 7 and the posture holding member 7a of this embodiment, FIG. 8 (a) is a plan view, and FIG. 8 (b) is a front view. In the following description, the central axis of the metal pins 7 is P, the insertion direction of the metal pins 7 into the base substrate wafer is the −Z direction, and the opposite side is the + Z direction.

  The metal pin 7 and the posture holding member 7a are conductive members formed of a metal material such as stainless steel, silver (Ag), Ni alloy, Al, and in particular, iron (Fe) is 58 weight percent and Ni is 42. It is desirable to form with the alloy (42 alloy) containing a weight percent. The metal pin 7 and the posture holding member 7a are integrally formed by forging or pressing.

  As shown in FIGS. 3 and 8, the metal pin 7 has a diameter slightly smaller than the diameter on the second surface U side of the through hole 30 formed in the base substrate 2, and is substantially the same as the depth of the through hole 30. It is a cylindrical member having a length. Further, the posture holding member 7 a of the present embodiment is configured by a convex portion 7 c erected on the radially outer side from the outer peripheral surface 7 b of the metal pin 7. Four convex portions 7c of this embodiment are provided upright. The convex portions 7c are arranged at substantially equal intervals in the circumferential direction of the metal pin 7, and as shown in FIG. 8A, the convex portions 7c are formed in a substantially + shape in plan view. . The length of the convex portion 7 c in the central axis P direction of the metal pin 7 is substantially the same as the length of the metal pin 7. The protruding height of the convex portion 7c in the radial direction of the metal pin 7 is gradually lowered from the + Z direction to the -Z direction, and has a substantially right triangle shape in a side view. The inclination angle of the oblique side of the convex portion 7 c is substantially the same angle as the inner peripheral surface of the through hole 30, and is formed to be about 10 degrees to 20 degrees with respect to the central axis P of the metal pin 7. Further, the width of the convex portion 7 c is slightly narrower than the diameter of the metal pin 7. As shown in FIG. 3, when the metal pin 7 is disposed in the through electrode 32, the tip surface 7 d of the convex portion 7 c has a slight gap between the tip surface 7 d and the inner peripheral surface of the through hole 30. It is formed along the inner peripheral surface of the through-hole 30 while leaving a gap. By forming the convex portion 7 c in this way, even if the metal pin 7 is likely to fall within the through hole 30, the tip surface 7 d of the convex portion 7 c and the inner periphery of the through hole 30 before the metal pin 7 falls. The surface comes into contact. Thereby, the metal pin 7 can be held by the convex portion 7 c and the relative movement in the radial direction of the metal pin 7 with respect to the through hole 30 can be restricted. Therefore, the metal pin 7 can be disposed in the through hole 30 without the metal pin 7 tilting in the through hole 30.

  In the present embodiment, the four convex portions 7c are arranged at substantially equal intervals in the circumferential direction of the metal pin 7. However, the four convex portions 7c are not necessarily arranged at equal intervals. As shown in FIG. 8 (c), the central axis P of the metal pin 7 is connected by straight lines in order along the circumferential direction of the metal pin 7 at the tips of a plurality of (three in FIG. 8 (c)) convex portions 7 c. What is necessary is just to be arrange | positioned inside the polygon T. Thus, as described above, the convex portion 7c and the inner peripheral surface of the through hole always come into contact with each other before the metal pin 7 falls down, so that the metal pin 7 does not tilt within the through hole.

  Returning to FIG. 3, the glass body 6 is obtained by firing a glass frit. The glass body 6 is flat at both ends and is formed to have substantially the same thickness as the base substrate 2. In the center of the glass body 6, the above-described metal pin 7 is disposed so as to penetrate the glass body 6. In addition, as described above, a plurality of convex portions 7 c are erected from the outer peripheral surface 7 b of the metal pin 7 in the radial direction. Further, the glass body 6 is integrated by being firmly fixed to the metal pin 7, the posture holding member 7 a and the through hole 30. And the glass body 6, the metal pin 7, and the attitude | position holding member 7a have block | closed the through-hole 30 completely, and maintain the airtightness in the cavity C. FIG.

  As shown in FIGS. 2 to 4, a pair of lead electrodes 36 and 37 are patterned on the second surface U side of the base substrate 2. Of the pair of lead-out electrodes 36 and 37, one lead-out electrode 36 is formed so as to be positioned immediately above one through-electrode 32. The other routing electrode 37 is routed from the position adjacent to the one routing electrode 36 along the vibrating arm portions 10 and 11 to the distal end side of the vibrating arm portions 10 and 11, and then the other through electrode 33. It is formed so that it may be located just above.

  A bump B is formed on each of the pair of lead-out electrodes 36 and 37, and the pair of mount electrodes of the piezoelectric vibrating piece 4 is mounted using the bump B. Thereby, one mount electrode 16 of the piezoelectric vibrating reed 4 is electrically connected to one through electrode 32 through one routing electrode 36, and the other mount electrode 17 is passed through the other routing electrode 37 to the other penetration electrode. The electrode 33 is electrically connected.

  A pair of external electrodes 38 and 39 are formed on the first surface L of the base substrate 2 as shown in FIGS. 1, 3 and 4. The pair of external electrodes 38 and 39 are formed at both ends in the longitudinal direction of the base substrate 2, and are electrically connected to the pair of through electrodes 32 and 33, respectively.

  When the piezoelectric vibrator 1 configured in this way is operated, a predetermined drive voltage is applied to the external electrodes 38 and 39 formed on the base substrate 2. As a result, a voltage can be applied to the excitation electrode 15 including the first excitation electrode 13 and the second excitation electrode 14 of the piezoelectric vibrating reed 4, so that the pair of vibrating arm portions 10 and 11 are moved closer to and away from each other. Can be vibrated at a predetermined frequency. The vibration of the pair of vibrating arm portions 10 and 11 can be used as a time source, a timing source for control signals, a reference signal source, and the like.

(Piezoelectric vibrator manufacturing method)
Next, a method for manufacturing the above-described piezoelectric vibrator will be described with reference to a flowchart.
FIG. 9 is a flowchart of the manufacturing method of the piezoelectric vibrator of this embodiment.
FIG. 10 is an exploded perspective view of the wafer body. In addition, the dotted line shown in FIG. 10 has shown the cutting line M cut | disconnected by the cutting process performed later.
The piezoelectric vibrator manufacturing method according to the present embodiment mainly includes a piezoelectric vibrating piece manufacturing step S10, a lid substrate wafer manufacturing step S20, a base substrate wafer manufacturing step S30, and an assembly step (S50 and subsequent steps). is doing. Among them, the piezoelectric vibrating piece producing step S10, the lid substrate wafer producing step S20, and the base substrate wafer producing step S30 can be performed in parallel.

(Piezoelectric vibrating piece manufacturing process)
In the piezoelectric vibrating piece producing step S10, the piezoelectric vibrating piece 4 shown in FIGS. 5 to 7 is produced. Specifically, a quartz Lambert rough is first sliced at a predetermined angle to obtain a wafer having a constant thickness. Subsequently, the wafer is lapped and roughly processed, and then the work-affected layer is removed by etching, and then mirror polishing such as polishing is performed to obtain a wafer having a predetermined thickness. Subsequently, after performing appropriate processing such as cleaning on the wafer, the wafer is patterned into an outer shape of the piezoelectric vibrating reed 4 by photolithography technique, and a metal film is formed and patterned to obtain the excitation electrode 15, Lead electrodes 19 and 20, mount electrodes 16 and 17, and weight metal film 21 are formed. Thereby, the some piezoelectric vibrating piece 4 is producible. Next, the resonance frequency of the piezoelectric vibrating reed 4 is roughly adjusted. This is performed by irradiating the coarse adjustment film 21 a of the weight metal film 21 with laser light to evaporate a part thereof and changing the weight of the vibrating arm portions 10 and 11.

(Wad manufacturing process for lid substrate)
In the lid substrate wafer manufacturing step S20, as shown in FIG. 10, a lid substrate wafer 50 to be a lid substrate later is manufactured. First, the disc-shaped lid substrate wafer 50 made of soda-lime glass is polished and washed to a predetermined thickness, and then the outermost work-affected layer is removed by etching or the like (S21). Next, in the cavity forming step S <b> 22, a plurality of cavity recesses 3 a are formed on the bonding surface of the lid substrate wafer 50 to the base substrate wafer 40. The cavity recess 3a is formed by hot press molding or etching. Next, in the bonding surface polishing step S23, the bonding surface with the base substrate wafer 40 is polished.

  Next, in the bonding film forming step S <b> 24, the bonding film 35 shown in FIGS. 1, 2, and 4 is formed on the bonding surface with the base substrate wafer 40. The bonding film 35 may be formed on the entire inner surface of the cavity C in addition to the bonding surface with the base substrate wafer 40. Thereby, the patterning of the bonding film 35 becomes unnecessary, and the manufacturing cost can be reduced. The bonding film 35 can be formed by a film forming method such as sputtering or CVD. In addition, since the bonding surface polishing step S23 is performed before the bonding film forming step S24, the flatness of the surface of the bonding film 35 is ensured, and stable bonding with the base substrate wafer 40 can be realized.

(Base substrate wafer manufacturing process)
In the base substrate wafer manufacturing step S30, as shown in FIG. 10, a base substrate wafer 40 to be a base substrate later is manufactured. First, the disc-shaped base substrate wafer 40 made of soda-lime glass is polished and washed to a predetermined thickness, and then the work-affected layer on the outermost surface is removed by etching or the like (S31).

(Penetration electrode formation process)
Next, a through electrode forming step S30A for forming a pair of through electrodes 32 and 33 on the base substrate wafer 40 is performed. Below, this penetration electrode formation process S30A is demonstrated. In addition, although the formation process of the penetration electrode 32 is demonstrated below as an example, the formation process of the penetration electrode 33 is also the same.

FIG. 11 is an explanatory diagram of a recess.
FIG. 12 is an explanatory diagram of a metal pin arranging step and a magnet arranging step.
FIG. 13 is an explanatory view of the glass frit filling step, FIG. 13 (a) is an explanatory view at the time of glass frit application, and FIG. 13 (b) is an explanatory view at the time of filling.
FIG. 14 is an explanatory diagram of a firing process and a polishing process.
As shown in FIGS. 11 to 14, the through electrode forming step S30A of this embodiment includes a recess forming step S32 for forming the recess 30a in the first surface L of the base substrate wafer 40, and the metal pins 7 in the recess 30a. The metal pin placement step S33 to be inserted, the magnet placement step S34 for placing the magnet 70 on the second surface U side in order to hold the metal pin 7 in the recess 30a, the inner peripheral surface of the recess 30a and the metal pin 7 A glass frit filling step S35 for filling the gap between the outer peripheral surface 7b and the glass frit 61 from the first surface L side to seal the gap, and firing for curing the glass frit 61 filled in the recess 30a. Step S37 and polishing step S39 in which at least the second surface U is polished to expose the metal pin 7 on the second surface U are included.

(Recess formation process)
In the through electrode forming step S30A, first, a concave portion forming step S32 for forming a concave portion 30a for arranging the through electrodes on the base substrate wafer 40 is performed. The recess 30a is formed by pressing, sandblasting, or the like. In the present embodiment, as shown in FIG. 11, the concave portion 30a is formed by pressing so that the inner shape gradually increases from the second surface U side to the first surface L side of the base substrate wafer 40.

  As a specific recess forming step S32, first, the press die is pressed against the first surface L of the base substrate wafer 40 while being heated. Here, a mortar-shaped concave portion is formed in the base substrate wafer 40 by the truncated cone-shaped convex portion formed in the press die. Thus, the recess forming step S32 is completed. In the present embodiment, the concave portion 30a is formed in a circular shape in the cross section perpendicular to the central axis O of the concave portion 30a. However, by changing the shape of the convex portion of the press die. For example, the cross-sectional shape may be a rectangular shape.

(Metal pin placement process)
Next, as shown in FIG. 12, a metal pin arranging step S33 for inserting the metal pin 7 into the recess 30a is performed.
The metal pin 7 is formed by cutting a metal rod-shaped member. And after cut | disconnecting a rod-shaped member, the convex part 7c is integrally formed in the outer peripheral surface of the metal pin 7 by shape | molding the outer peripheral surface of a rod-shaped member by forging or press work.

  In the metal pin arrangement step S33, as shown in FIG. 12, the metal pins 7 are inserted from the openings of the base substrate wafer 40, and the metal pins 7 are arranged inside the recesses 30a. As a specific metal pin arrangement method, for example, a metal pin group is placed on the first surface L of the base substrate wafer 40. Then, while swinging the base substrate wafer 40, the base substrate wafer 40 is vibrated to diffuse the metal pin group, and the metal pins 7 are swung into the recess 30a. Since the recess 30a of the present embodiment has a tapered cross-sectional shape including the central axis O so that the inner shape gradually increases from the second surface U side to the first surface L side, the first surface L The metal pin 7 can be easily transferred from the side into the recess 30a. In addition, the metal pin 7 is arrange | positioned in the recessed part 30a by arrange | positioning the several metal pin 7 in the position corresponding to the recessed part 30a using a jig | tool, and inserting the several metal pin 7 from the 1st surface L side. May be. Since the posture holding member 7a is formed between the recess 30a and the metal pin 7, the metal pin 7 can be held in the recess 30a without the metal pin 7 tilting in the recess 30a. Thus, the metal pin placement step S33 is completed.

(Magnet placement process)
Next, as shown in FIG. 12, a magnet placement step S34 for placing the magnet 70 on the second surface U side of the base substrate wafer 40 is performed. The magnet 70 is formed in a sheet shape using a permanent magnet such as ferrite and covers the entire surface on the second surface U side of the base substrate wafer 40. Since the metal pin 7 is attracted to the bottom surface of the concave portion 30a by the magnet 70, it is possible to suppress the metal pin 7 from popping out and falling off when the base substrate wafer 40 is transferred between the steps. Above, magnet arrangement process S34 is completed.

(Glass frit filling process)
Next, as shown in FIG. 13, a glass frit 61 is filled from the first surface L side into the gap between the inner circumferential surface of the recess 30a and the outer circumferential surface 7b of the metal pin 7 to seal the gap. A frit filling step S35 is performed.
In the glass frit filling step S35 of the present embodiment, the atmospheric pressure is increased after the glass frit 61 is applied on the first surface L side, and the pressure difference generated between the inside of the recessed portion 30a and the outside of the recessed portion 30a causes the A glass frit 61 is filled in a gap between the inner peripheral surface and the outer peripheral surface 7 b of the metal pin 7.

In a specific glass frit filling step S35, first, a metal mask (not shown) is disposed on the first surface L of the base substrate wafer 40. The metal mask covers the periphery of the first surface L in order to prevent the glass frit from flowing around and adhering to the second surface U. Further, an opening for applying the glass frit to the recess is formed at the center. As will be described later, by applying the glass frit, a layer of the glass frit 61 having a thickness of about 0.1 mm to 0.2 mm from the first surface L is formed, so the thickness of the metal mask is also 0.1 mm. It is formed to be about 0.2 mm.
Next, the base substrate wafer 40 is transported and set in a chamber (not shown) of the screen printer, and the inside of the chamber is evacuated to form a reduced pressure atmosphere.

  Subsequently, as shown in FIG. 13A, the squeegee 65 is scanned along the first surface L on the metal mask, and the glass frit 61 is applied from the first surface L side of the base substrate wafer 40. The squeegee 65 is a plate-like member made of a soft rubber material such as urethane rubber. The squeegee 65 is a so-called scribe squeegee. The surface on the traveling direction side of the squeegee 65 is an attack surface with the glass frit 61. The attack surface is formed as a single plane, and the angle (attack angle) between the base substrate wafer 40 and the squeegee 65 when scanning the squeegee 65 is set to about 60 to 70 degrees. The surface opposite to the traveling direction is a tapered surface that is inclined so that the squeegee 65 has a tapered shape. As shown in FIG. 13A, a glass frit 61 is applied on the first surface L and the recess 30a so as to close the opening of the recess 30a. Since the glass frit 61 is applied by scanning the squeegee 65 on the metal mask, a layer of the glass frit 61 of about 0.1 mm to 0.2 mm having the same thickness as the metal mask is formed on the first surface L. The

  In addition, when filling the glass frit 61 in the recessed part 30a, it is necessary to make an attack angle small to about 15 degree | times. For this reason, a so-called fill squeegee 650 (see FIG. 19C) is required in which the surface on the traveling direction side and the surface opposite to the traveling direction are both tapered surfaces. However, in this embodiment, it is not necessary to fill the recess 30a with the glass frit 61. As described above, the glass frit 61 is applied on the first surface L and the recess 30a so as to close the opening of the recess 30a. Just do it. Therefore, a specially shaped squeegee such as a fill squeegee is not required.

  Next, the inside of the chamber is opened to the atmosphere, and the pressure in the chamber is increased. As a result, a pressure difference is generated between the inside of the recess 30a and the outside of the recess 30a. And as shown in FIG.13 (b), the glass frit 61 which formed the layer on the recessed part 30a is pushed in in the recessed part 30a. Thus, since it is not necessary to use a squeegee when filling the concave portion 30a with the glass frit 61, it is possible to prevent the metal pin 7 from jumping out due to contact between the squeegee and the metal pin 7. Further, the glass frit 61 can be reliably filled to every corner of the gap between the inner peripheral surface of the recess 30a and the outer peripheral surface of the metal pin 7.

  Thereafter, as shown in FIG. 13B, the excess glass frit 61 is removed by scanning the squeegee 65 again. In this embodiment, as shown in FIG. 13B, another squeegee 66 having a symmetrical shape with respect to the attack surface of the squeegee 65 is used to scan in the direction opposite to that when the glass frit 61 is applied. ing. However, using the same squeegee 65, the excess glass frit 61 may be removed by scanning in the same direction as when the glass frit 61 is applied. In the latter case, the type of squeegee can be reduced. Furthermore, since the squeegee can travel in one direction, the configuration of the screen printing machine can be simplified.

Subsequently, the glass frit 61 is temporarily dried and solidified. For example, after the base substrate wafer 40 is transferred into a constant temperature bath, the glass frit 61 is temporarily dried by holding it in an atmosphere of about 85 ° C. for about 30 minutes. By temporarily drying the glass frit 61, the glass frit 61 is solidified, and the metal pin 7 and the recess 30a and the glass frit 61 are fixed, so that the metal pin 7 is still being conveyed even if the magnet 70 is removed from the second surface U. Does not jump out of the recess 30a.
Finally, the excess residue of the glass frit 61 adhering to the first surface L of the base substrate wafer 40 is removed. Above, glass frit filling process S35 is complete | finished.

  When the glass frit is temporarily dried, if the organic solvent contained in the glass frit evaporates, the volume of the glass frit is reduced and a dent is generated on the surface of the through electrode. In this case, it is desirable to fill the glass frit in the dent after temporary drying. Thereby, it can suppress that a dent generate | occur | produces on the through-electrode surface.

(Baking process)
Next, a firing step S37 is performed in which the glass frit 61 filled in the recess 30a is fired and cured. For example, after the base substrate wafer 40 is transferred to the baking furnace, it is held in an atmosphere at about 610 ° C. for about 30 minutes. Thereafter, the base substrate wafer 40 is left to cool in a normal temperature atmosphere. Thereby, as shown in FIG. 14, the glass frit is hardened to become the glass body 6, and the recess 30 a, the glass body 6 and the metal pin 7 are fixed to each other to form the through electrode 32. Above, baking process S37 is complete | finished.

(Polishing process)
Subsequently, as shown in FIG. 14, a polishing step S39 for polishing at least the second surface U of the base substrate wafer 40 and exposing the metal pins 7 to the second surface U is performed. In this embodiment, the metal pin 7 is hold | maintained by the convex part 7c, the relative movement to the radial direction of the metal pin 7 with respect to the recessed part 30a is controlled, and it suppresses that the metal pin 7 inclines. Further, it is desirable to polish the first surface L in addition to the second surface. Thereby, the 1st surface L can be made into a flat surface and the front-end | tip of the metal pin 7 can be exposed reliably. As a result, the surface of the base substrate wafer 40 and both ends of the metal pins 7 can be substantially flush with each other, and a plurality of through electrodes 32 can be obtained. Note that when the polishing step S39 is performed, the through electrode forming step S30A is completed.

  Next, returning to FIG. 10, a routing electrode forming step S <b> 40 for forming a plurality of routing electrodes 36 and 37 electrically connected to the through electrodes on the second surface U is performed. Then, tapered bumps made of gold or the like are formed on the routing electrodes 36 and 37, respectively. In FIG. 10, the illustration of the bumps is omitted for easy viewing of the drawing. At this point, the base substrate wafer manufacturing step S30 ends.

(Piezoelectric vibrator assembly process after mounting process S50)
Next, a mounting step S50 is performed in which the piezoelectric vibrating reed 4 is bonded onto the routing electrodes 36 and 37 of the base substrate wafer 40 via the bumps B. Specifically, the base 12 of the piezoelectric vibrating piece 4 is placed on the bump B, and the piezoelectric vibrating piece 4 is pressed against the bump B while heating the bump B to a predetermined temperature. As a result, as shown in FIG. 3, the base portion 12 is mechanically fixed to the bump B in a state where the vibrating arm portions 10 and 11 of the piezoelectric vibrating piece 4 are lifted from the second surface U of the base substrate wafer 40. . Further, the mount electrodes 16 and 17 and the lead-out electrodes 36 and 37 are electrically connected.

  After the mounting of the piezoelectric vibrating reed 4 is completed, as shown in FIG. 10, an overlapping step S <b> 60 is performed in which the lid substrate wafer 50 is overlapped with the base substrate wafer 40. Specifically, both wafers 40 and 50 are aligned at the correct position while using a reference mark (not shown) as an index. As a result, the piezoelectric vibrating reed 4 mounted on the base substrate wafer 40 is accommodated in the cavity C surrounded by the cavity recess 3 a of the lid substrate wafer 50 and the base substrate wafer 40.

  After the superposition step S60, the superposed wafers 40 and 50 are put into an anodic bonding apparatus (not shown), and a bonding step S70 is performed in which a predetermined voltage is applied in a predetermined temperature atmosphere to perform anodic bonding. Specifically, a predetermined voltage is applied between the bonding film 35 and the base substrate wafer 40. As a result, an electrochemical reaction occurs at the interface between the bonding film 35 and the base substrate wafer 40, and the two are firmly adhered to each other and anodic bonded. Thereby, the piezoelectric vibrating reed 4 can be sealed in the cavity C, and the wafer body 60 shown in FIG. 10 in which the base substrate wafer 40 and the lid substrate wafer 50 are bonded can be obtained. In FIG. 10, in order to make the drawing easy to see, a state in which the wafer body 60 is disassembled is illustrated, and the bonding film 35 is not illustrated from the lid substrate wafer 50.

  Next, a conductive material is patterned on the first surface L of the base substrate wafer 40, and a pair of external electrodes 38 and 39 (see FIG. 3) electrically connected to the pair of through electrodes 32 and 33, respectively. A plurality of external electrode forming steps S80 are formed. Through this process, the piezoelectric vibrating reed 4 is electrically connected to the external electrodes 38 and 39 via the through electrodes 32 and 33.

  Next, a fine adjustment step S90 in which the frequency of each piezoelectric vibrator sealed in the cavity C is finely adjusted to fall within a predetermined range in the state of the wafer body 60 is performed. Specifically, a predetermined voltage is continuously applied from the external electrodes 38 and 39 shown in FIG. 4 to measure the frequency while vibrating the piezoelectric vibrating reed 4. In this state, laser light is irradiated from the outside of the base substrate wafer 40 to evaporate the fine adjustment film 21b of the weight metal film 21 shown in FIGS. Thereby, since the weight of the tip side of the pair of vibrating arm portions 10 and 11 is reduced, the frequency of the piezoelectric vibrating piece 4 is increased. As a result, the frequency of the piezoelectric vibrator can be finely adjusted to fall within the range of the nominal frequency.

  After the fine adjustment of the frequency, a cutting step S100 is performed for cutting the bonded wafer body 60 along the cutting line M shown in FIG. Specifically, a UV tape is first attached to the surface of the base substrate wafer 40 of the wafer body 60. Next, laser irradiation is performed along the cutting line M from the lid substrate wafer 50 side (scribing). Next, the cutting blade is pressed along the cutting line M from the surface of the UV tape to cleave the wafer body 60 (braking). Thereafter, the UV tape is peeled off by UV irradiation. Thereby, the wafer body 60 can be separated into a plurality of piezoelectric vibrators. The wafer body 60 may be cut by other methods such as dicing.

  In addition, after performing cutting process S100 and making it to each piezoelectric vibrator, the process order which performs fine adjustment process S90 may be sufficient. However, as described above, by performing the fine adjustment step S90 first, fine adjustment can be performed in the state of the wafer body 60, and therefore, a plurality of piezoelectric vibrators can be finely adjusted more efficiently. Therefore, it is preferable because throughput can be improved.

  Thereafter, an internal electrical characteristic inspection S110 is performed. That is, the resonance frequency, resonance resistance value, drive level characteristic (excitation power dependency of resonance frequency and resonance resistance value), etc. of the piezoelectric vibrating piece 4 are measured and checked. In addition, the insulation resistance characteristics and the like are also checked. Finally, an external appearance inspection of the piezoelectric vibrator is performed to finally check dimensions and quality. This completes the manufacture of the piezoelectric vibrator.

  According to this embodiment, as shown in FIGS. 13 and 14, the metal pin 7 is inserted into the recess 30a and disposed, so that the metal pin 7 falls off from the second surface U side or the glass frit 61 leaks. There is nothing to do. Thereby, the laminating material sticking process which sticks a laminating material on the 2nd surface U side becomes unnecessary. Further, after the metal pin 7 is disposed in the recess 30a and the glass frit 61 is fired, the second surface U is polished by the polishing process so that the metal pin 7 is exposed to the second surface U. A polishing step to be removed becomes unnecessary. As described above, since the laminating material attaching step and the polishing step can be reduced, the through electrode 32 can be efficiently manufactured. Further, according to the present invention, since the posture holding member 7a is disposed between the metal pin 7 and the recess 30a, the metal pin 7 is not tilted in the recess 30a, and the metal pin 7 is placed in the recess 30a. Can be held in. Furthermore, according to the present invention, the metal pin 7 is attracted to the bottom surface of the recess 30a by disposing the magnet 70 on the second surface U side, so that the metal pin 7 pops out during the transfer of the base substrate wafer 40. Can be prevented from falling off.

(Second embodiment, an example in which a posture holding member is provided on a base substrate wafer)
FIGS. 15A and 15B are explanatory views of the posture holding member of the second embodiment, FIG. 15A is a plan view, and FIG. 15B is a cross-sectional view taken along the line CC in FIG. .
The posture holding member of the first embodiment is provided on the metal pin 7 as shown in FIG. 8, but the posture holding member of this embodiment is provided in the recess 30a of the base substrate wafer 40 as shown in FIG. It differs from the first embodiment in that it is provided. Detailed description of the same configuration as in the first embodiment will be omitted.

  As shown in FIG. 15, the posture holding member 7 a of the present embodiment has a plurality (four in this embodiment) of convex portions erected radially outward from the inner peripheral surface of the concave portion 30 a of the base substrate wafer 40. 40a. In the present embodiment, the convex portion 40a has a length substantially the same as the depth of the concave portion 30a. The width dimension of the convex portion 40 a is formed slightly narrower than the diameter of the metal pin 7. Further, the convex portions 40a are arranged at substantially equal intervals in the circumferential direction of the concave portion 30a. The interval between the end faces 40d of the convex portions 40a arranged to face each other is formed to be substantially the same as the diameter of the metal pin 7 or slightly wider than the diameter of the metal pin 7. And the metal pin 7 is arrange | positioned in the area | region enclosed by the end surface 40d of the convex part 40a. Thereby, even if the metal pin 7 is about to fall, the outer peripheral surface 7b of the metal pin and the end surface 40d of the convex portion 40a abut before the metal pin 7 falls, so that the metal pin 7 is held by the convex portion 40a. Thus, the relative movement of the metal pin 7 in the radial direction with respect to the recess 30a can be restricted. In addition, the distance of the end surface 40d of the convex part 40a which opposes is formed so that it may become substantially constant from the 1st surface L to the bottom face of the recessed part 30a. Thus, as in the first embodiment, the concave portion 30a and the convex portion 40a can be easily formed by pressing the press die against the first surface L of the base substrate wafer 40 while heating.

  The metal pin 7 of this embodiment is a substantially cylindrical member. In 1st Embodiment, the convex part was shape | molded on the outer peripheral surface 7b of the metal pin 7 by forge or press work. However, since the metal pin 7 of this embodiment is not provided with a convex portion, the second embodiment is superior to the first embodiment in that it can be formed simply by cutting the rod-shaped member.

  In the metal pin arrangement step S33 of the present embodiment, the metal pin 7 is transferred and arranged in the recess 30a by the same method as in the first embodiment. In the present embodiment, the distance between the end surfaces 40d of the convex portions 40a arranged to face each other is substantially the same as or slightly wider than the diameter of the metal pin 7. On the other hand, in the first embodiment, as shown in FIG. 12, the recess 30 a is formed in a tapered shape in cross section, and the metal from the first surface L side of the recess 30 a having an inner shape wider than the outer shape of the metal pin 7. Transfer pin 7. Therefore, since the metal pin 7 can be easily arranged in the recess 30a, the first embodiment is superior to the second embodiment in terms of ease of arrangement of the metal pin 7.

(Oscillator)
Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 16, the oscillator 110 according to the present embodiment is configured by configuring the piezoelectric vibrator 1 as an oscillator electrically connected to the integrated circuit 111. The oscillator 110 includes a substrate 113 on which an electronic element component 112 such as a capacitor is mounted. An integrated circuit 111 for an oscillator is mounted on the substrate 113, and a piezoelectric vibrating piece of the piezoelectric vibrator 1 is mounted in the vicinity of the integrated circuit 111. The electronic element component 112, the integrated circuit 111, and the piezoelectric vibrator 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 110 configured as described above, when a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece in the piezoelectric vibrator 1 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece and input to the integrated circuit 111 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 111 and output as a frequency signal. Thereby, the piezoelectric vibrator 1 functions as an oscillator.
In addition, by selectively setting the configuration of the integrated circuit 111, for example, an RTC (real-time clock) module or the like as required, the operation date and time of the device or external device in addition to a single-function oscillator for a clock, etc. A function for controlling the time, providing a time, a calendar, and the like can be added.

  According to the oscillator 110 of this embodiment, since the piezoelectric vibrator 1 in which the through electrode is efficiently manufactured is provided, the low-cost oscillator 110 can be provided.

(Electronics)
Next, an embodiment of an electronic apparatus according to the invention will be described with reference to FIG. Note that a portable information device 120 having the above-described piezoelectric vibrator 1 will be described as an example of the electronic device.
First, the portable information device 120 of this embodiment is represented by, for example, a mobile phone, and is a development and improvement of a wrist watch in the prior art. The appearance is similar to that of a wristwatch, and a liquid crystal display is arranged in a portion corresponding to a dial so that the current time and the like can be displayed on this screen. Further, when used as a communication device, it is possible to perform communication similar to that of a conventional mobile phone by using a speaker and a microphone that are removed from the wrist and incorporated in the inner portion of the band. However, it is much smaller and lighter than conventional mobile phones.

  Next, the configuration of the portable information device 120 of this embodiment will be described. As illustrated in FIG. 17, the portable information device 120 includes the piezoelectric vibrator 1 and a power supply unit 121 for supplying power. The power supply unit 121 is made of, for example, a lithium secondary battery. The power supply unit 121 includes a control unit 122 that performs various controls, a clock unit 123 that counts time, a communication unit 124 that communicates with the outside, a display unit 125 that displays various information, and the like. A voltage detection unit 126 that detects the voltage of the functional unit is connected in parallel. Power is supplied to each functional unit by the power supply unit 121.

  The control unit 122 controls each function unit to control operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 122 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area for the CPU.

  The timer unit 123 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the piezoelectric vibrator 1. When a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal, and is input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 122 through the interface circuit, and the current time, current date, calendar information, and the like are displayed on the display unit 125.

The communication unit 124 has functions similar to those of a conventional mobile phone, and includes a radio unit 127, a voice processing unit 128, a switching unit 129, an amplification unit 130, a voice input / output unit 131, a telephone number input unit 132, a ring tone generation unit. 133 and a call control memory unit 134.
The radio unit 127 exchanges various data such as audio data with the base station via the antenna 135. The audio processing unit 128 encodes and decodes the audio signal input from the radio unit 127 or the amplification unit 130. The amplifying unit 130 amplifies the signal input from the audio processing unit 128 or the audio input / output unit 131 to a predetermined level. The voice input / output unit 131 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a voice.

In addition, the ring tone generator 133 generates a ring tone in response to a call from the base station. The switching unit 129 switches the amplifying unit 130 connected to the voice processing unit 128 to the ringing tone generating unit 133 only when an incoming call is received, so that the ringing tone generated by the ringing tone generating unit 133 passes through the amplifying unit 130. To the audio input / output unit 131.
Note that the call control memory unit 134 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 132 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys and the like, a telephone number of a call destination is input.

  The voltage detection unit 126 detects the voltage drop and notifies the control unit 122 when the voltage applied to each functional unit such as the control unit 122 by the power supply unit 121 falls below a predetermined value. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary to stably operate the communication unit 124, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 126, the control unit 122 prohibits the operations of the radio unit 127, the voice processing unit 128, the switching unit 129, and the ring tone generation unit 133. In particular, it is essential to stop the operation of the wireless unit 127 with high power consumption. Further, the display unit 125 displays that the communication unit 124 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 124 can be prohibited by the voltage detection unit 126 and the control unit 122, and that effect can be displayed on the display unit 125. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 125.
In addition, the function of the communication part 124 can be stopped more reliably by providing the power supply cutoff part 136 that can selectively cut off the power of the part related to the function of the communication part 124.

  According to the portable information device 120 of the present embodiment, since the piezoelectric vibrator 1 in which the through electrode is efficiently manufactured is provided, the low-cost portable information device 120 can be provided.

(Radio watch)
Next, an embodiment of a radio timepiece according to the present invention will be described with reference to FIG.
As shown in FIG. 18, the radio-controlled timepiece 140 according to the present embodiment includes the piezoelectric vibrator 1 electrically connected to the filter unit 141, and receives a standard radio wave including timepiece information to accurately It is a clock with a function of automatically correcting and displaying the correct time.
In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), each transmitting standard radio waves. Long waves such as 40 kHz or 60 kHz have both the property of propagating the ground surface and the property of propagating while reflecting the ionosphere and the ground surface, so the propagation range is wide, and the above two transmitting stations cover all of Japan. is doing.

Hereinafter, the functional configuration of the radio timepiece 140 will be described in detail.
The antenna 142 receives a long standard wave of 40 kHz or 60 kHz. The long-wave standard radio wave is obtained by subjecting time information called a time code to AM modulation on a 40 kHz or 60 kHz carrier wave. The received long standard wave is amplified by the amplifier 143 and filtered and tuned by the filter unit 141 having the plurality of piezoelectric vibrators 1.
The piezoelectric vibrator 1 according to this embodiment includes crystal vibrator portions 148 and 149 having resonance frequencies of 40 kHz and 60 kHz that are the same as the carrier frequency.

Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 144.
Subsequently, the time code is taken out via the waveform shaping circuit 145 and counted by the CPU 146. The CPU 146 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected in the RTC 148, and accurate time information is displayed.
Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrator portions 148 and 149 are preferably vibrators having the tuning fork type structure described above.

  In addition, although the above-mentioned description was shown in the example in Japan, the frequency of the long standard wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Therefore, when the radio timepiece 140 that can be used overseas is incorporated in a portable device, the piezoelectric vibrator 1 having a frequency different from that in Japan is required.

  According to the radio timepiece 140 of this embodiment, since the piezoelectric vibrator 1 in which the through electrodes are efficiently manufactured is provided, the low-cost radio timepiece 140 can be provided.

The present invention is not limited to the embodiment described above.
In the first embodiment, the package manufacturing method of the present invention has been described by taking a piezoelectric vibrator using a tuning fork type piezoelectric vibrating piece as an example. However, the above-described package manufacturing method of the present invention may be adopted for a piezoelectric vibrator using, for example, an AT-cut type piezoelectric vibrating piece (thickness sliding vibrating piece).

  In the first embodiment, a piezoelectric vibrator is manufactured by enclosing a piezoelectric vibrating piece inside a package while using the package manufacturing method according to the present invention. However, a device other than the piezoelectric vibrator can be manufactured by enclosing an electronic component other than the piezoelectric vibrating piece inside the package.

  In 1st Embodiment, the length of the convex part was formed substantially the same as the length of a metal pin. However, the length of the convex portion can be made shorter than the length of the metal pin, and the convex portion can be provided only in a part of the metal pin in the axial direction. However, when the metal pin is disposed in the concave portion and the glass frit is filled from the first surface side, it is difficult to fill the glass frit on the second surface side of the convex portion. Therefore, the first embodiment is superior in that glass frit can be filled to every corner.

DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator (package) 2 ... Base board | substrate (1st board | substrate) 4 ... Piezoelectric vibration piece (electronic component) 6 ... Glass body 7 ... Metal pin 7a ... Attitude maintenance Member 7b ... Outer peripheral surface of metal pin 7c ... Projection 9 ... Package 30, 31 ... Through hole 30a ... Recess 32, 33 ... Through electrode 61 ... Glass frit 70 -Magnet 110 ... Oscillator 120 ... Portable information device (electronic device) 123 ... Timekeeping unit 140 ... Radio clock 141 ... Filter unit C ... Cavity L ... First surface S30A ... Penetration electrode formation step S32 ... Recess formation step S33 ... Metal pin placement step S34 ... Magnet placement step S35 ... Glass frit filling step S37 ... Baking step T ... Polygon U・· The second surface

Claims (9)

A method of manufacturing a package in which an electronic component can be enclosed in a cavity formed between a plurality of substrates bonded together,
Of the plurality of substrates, comprising a through electrode forming step of forming a through electrode that penetrates the first substrate in the thickness direction and conducts between the inside of the cavity and the outside of the package,
The through electrode forming step includes:
Forming a recess in the first surface of the first substrate;
A metal pin placement step of inserting a metal pin into the recess,
A magnet placement step of placing a magnet on the second surface side of the first substrate to hold the metal pin in the recess;
A glass frit filling step of filling the gap between the inner peripheral surface of the recess and the outer peripheral surface of the metal pin with the glass frit from the first surface side and sealing the gap;
A baking step of baking and curing the glass frit filled in the recess;
A polishing step of polishing at least the second surface to expose the metal pin on the second surface;
Have
A package manufacturing method, wherein a posture holding member is arranged between the metal pin inserted in the metal pin arrangement step and the recess. In the manufacturing method of the package of Claim 1,
In the glass frit filling step, after applying the glass frit so as to close the opening of the recess on the first surface side under reduced pressure, the atmospheric pressure is increased to increase the gap between the inside of the recess and the outside of the recess. A method of manufacturing a package, wherein the glass frit is filled in the concave portion due to a pressure difference generated in the step. In the manufacturing method of the package of Claim 1 or 2,
The method of manufacturing a package, wherein the recess is formed such that an inner shape gradually increases from the second surface side to the first surface side. A package capable of enclosing electronic components in a cavity formed between a plurality of substrates bonded together,
Among the plurality of substrates, the first substrate is penetrated in the thickness direction, and includes a through electrode that conducts the inside of the cavity and the outside of the package,
The through electrode is
A metal pin disposed in a through-hole penetrating the first substrate;
A glass frit filled between the through hole and the metal pin;
Have
Between the through hole and the metal pin, there is formed a posture holding member that regulates relative movement between the through hole and the metal pin in the radial direction of the through hole before filling the glass frit. Features a package. The package according to claim 4,
The posture holding member includes at least three convex portions erected radially outward from the outer peripheral surface of the metal pin,
The package characterized by the center axis | shaft of the said metal pin being arrange | positioned inside the polygon which connected the front-end | tip of several said convex part with the straight line in order along the circumferential direction of the said metal pin.   6. A piezoelectric vibrator in which a piezoelectric vibrating piece is enclosed as the electronic component inside the package according to claim 4.   An oscillator, wherein the piezoelectric vibrator according to claim 6 is electrically connected to an integrated circuit as an oscillator.   An electronic apparatus, wherein the piezoelectric vibrator according to claim 6 is electrically connected to a timer unit.   A radio-controlled timepiece, wherein the piezoelectric vibrator according to claim 6 is electrically connected to a filter portion.

Images