JP2013030958A - Package, method of manufacturing the same, piezoelectric vibrator, oscillator, electronic equipment, and radio-controlled clock - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package which prevents a metal pin from being displaced while adequately securing working efficiency at the time of arranging the metal pin and to provide a piezoelectric vibrator, an oscillator, electronic equipment, and a radio-controlled clock.SOLUTION: The package has: a through hole 30 formed so as to penetrate a second surface U side (inside) of a wafer 40 for a base substrate (first substrate) and a first surface L side (outside) of the wafer 40 for the base substrate (first substrate); a metal pin 7 which is inserted through the through hole 30, and electrically connects the second surface U side (inside) of the wafer 40 for the base substrate (first substrate) with the first surface L side (outside) of the wafer 40 for the base substrate (first substrate); and a glass body (non-conductive filling member) for filling a gap between the through hole 30 and the metal pin 7. The package also has a positioning protrusion 7c for determining a relative position of the metal pin 7 with respect to the radial direction of the through hole 30 provided at one end in an axial direction of the metal pin 7.

Description

  The present invention relates to a package, a package manufacturing method, a piezoelectric vibrator, an oscillator, an electronic device, and a radio timepiece.

  2. Description of the Related Art In recent years, cellular phones and personal digital assistants use piezoelectric vibrators that use quartz as a time source, a timing source such as a control signal, and a reference signal source. Various types of piezoelectric vibrators of this type are known. As one of them, a two-layer structure type surface mount type piezoelectric vibrator is known.

  This two-layer structure type piezoelectric vibrator is packaged by directly bonding a first substrate and a second substrate, and a piezoelectric vibrating piece is housed in a cavity formed between the two substrates. Yes. As one of the two-layer structure type piezoelectric vibrators, a piezoelectric vibrating piece sealed inside a cavity by a through electrode formed on a base substrate (corresponding to “first substrate” in claims) and A piezoelectric vibrator is known in which an external electrode formed outside a base substrate is electrically connected (see Patent Document 1).

  Here, the through electrode of the two-layered structure type piezoelectric vibrator plays two major roles of electrically connecting the piezoelectric vibrating piece and the external electrode, and closing the through hole to maintain airtightness in the cavity. In particular, if the through electrode and the through hole are not sufficiently adhered, the airtightness in the cavity may be impaired. In order to eliminate such a problem, it is necessary to form the through electrode in a state in which the through hole is tightly adhered to the through hole and completely closed.

Patent Document 1 describes a method in which through holes are formed in a base substrate, and metal pins are driven into the through holes in a state where the base substrate is thermally softened.
However, this method has a problem that it is difficult to completely close the gap between the metal pin and the through hole, and the airtightness in the cavity cannot be secured. Further, it is complicated to drive the metal pins while positioning with respect to all the through holes on the base substrate.

  For such a problem, a method of forming a through electrode using a metal pin having a base portion and a non-conductive filling member has been proposed. As the non-conductive filling member, for example, glass frit is adopted.

JP 2002-124845 A

FIG. 20 is an explanatory diagram of a conventional metal pin arrangement process.
As a specific through electrode forming process, first, as shown in FIG. 20, a metal pin main body 71a is inserted into the through hole 30 penetrating the first surface L and the second surface U of the base substrate wafer 40. Then, the base portion 71b is brought into contact with the second surface U of the base substrate wafer 40 to place the metal pins 71 in the through holes 30 (metal pin placement step).
Next, for example, glass frit is filled in the gap between the through hole 30 and the metal pin 71 as a non-conductive filling member (glass frit filling step).
Next, the filled glass frit is fired to integrate the through hole 30, the metal pin 71, and the glass frit (firing step).
Finally, the first surface L and the second surface U of the base substrate wafer 40 are polished to remove the base portion 71b, and the metal pin main body 71a is exposed on the first surface L and the second surface U (polishing). Process).
Through the above steps, a through electrode that conducts the first surface L and the second surface U of the base substrate wafer 40 is formed.

  By the way, in the metal pin arranging step, after placing the plurality of metal pins 71 on the second surface U of the base substrate wafer 40, the base substrate wafer 40 is swung so that the metal pins are placed in the through holes 30. 71 is transferred and arranged. For this reason, it is necessary to set the diameter of the metal pin main body 71a to be smaller than the diameter of the through hole 30 and to provide a gap between the through hole 30 and the metal pin main body 71a.

  However, if the gap between the through hole 30 and the metal pin main body 71a is too large, a gap t is generated between the central axis O of the through hole 30 and the central axis P of the metal pin 71 as shown in FIG. However, there is a possibility that a deviation will eventually occur at the formation position of the through electrode. On the other hand, if the gap between the through hole 30 and the metal pin main body 71a is reduced in order to suppress the displacement t of the metal pin 71, the metal pin main body 71a is less likely to be transferred into the through hole 30, and the metal pin The work efficiency of the arrangement process deteriorates.

  Accordingly, the present invention provides a package, a method for manufacturing the package, a piezoelectric vibrator, an oscillator, an electronic device, and a radio wave that can suppress the positional deviation of the metal pin in the radial direction of the through-hole while ensuring good working efficiency when arranging the metal pin. The issue is to provide watches.

  In order to solve the above problems, the package of the present invention is a package in which an electronic component can be enclosed between a plurality of substrates bonded to each other, and the first substrate of the plurality of substrates is located inside the first substrate. And a through-hole formed so as to penetrate the outside of the first substrate, a metal pin inserted through the through-hole and conducting between the inside of the first substrate and the outside of the first substrate, and the through-hole And a non-conductive filling member that fills the gap between the metal pin and a positioning projection for determining the relative position of the metal pin with respect to the radial direction of the through hole is provided at one axial end of the metal pin It is characterized by that.

According to the present invention, since the positioning convex portion is formed at one end of the metal pin in the axial direction, when the metal pin is inserted and disposed in the through hole, the inner peripheral surface of the through hole and the axial direction of the metal pin The gap with the one end can be reduced. Thereby, when a metal pin is inserted in a through-hole, it can arrange | position, suppressing the position shift of the metal pin in the radial direction of a through-hole. In addition, when the metal pin is about to move in the radial direction of the through hole after the metal pin is arranged, the positioning convex portion and the inner peripheral surface of the through hole interfere with each other. Thereby, even after arrange | positioning a metal pin, the position shift of the metal pin in the radial direction of a through-hole can be suppressed.
Further, the portion of the metal pin where the positioning convex portion is not formed can secure a sufficient gap between the metal pin and the inner peripheral surface of the through hole, so that the metal pin can be easily inserted and arranged in the through hole.
Therefore, it is possible to suppress misalignment of the metal pin in the radial direction of the through-hole while ensuring good working efficiency when arranging the metal pin.

  Further, the package of the present invention is characterized in that the positioning convex portion is formed so as to expand toward the end in the axial direction.

  According to the present invention, when the metal pin is inserted into the through hole, the positioning convex portion can be prevented from being caught by the edge of the through hole. Therefore, the metal pin can be easily inserted into the through hole, and the metal pin can be positioned smoothly.

  Further, the package of the present invention is formed such that the positioning convex portion is formed in a circular shape in a plan view in the axial direction so as to surround the periphery of the metal pin and gradually increases in diameter toward one end in the axial direction. It is characterized by being.

According to the present invention, since the positioning convex portion is formed so as to gradually increase in diameter toward one end in the axial direction, when the metal pin is inserted into the through hole, the positioning convex portion is caught by the edge of the through hole. Can be surely prevented. Therefore, the metal pin can be more easily inserted into the through hole, and the metal pin can be positioned more smoothly in the radial direction of the through hole.
Moreover, since the cross-sectional area of the metal pin exposed from the 1st board | substrate increases on the side in which the positioning convex part is formed, it is easy to raise flatness and make contact resistance with the electrode formed on a metal pin low. Can do. For this reason, the package which can drive an electronic component efficiently can be provided.

  Further, the package of the present invention is characterized in that the positioning convex portion is formed so as to gradually increase in diameter from the other end in the axial direction of the metal pin toward the one end in the axial direction.

  According to the present invention, the metal pin is smoothly guided into the through hole, and the metal pin can be easily disposed in the through hole while preventing the metal pin from being caught by the edge of the through hole. Therefore, the work efficiency at the time of metal pin arrangement can be improved. Moreover, since the axial direction one end part of the expanded metal pin functions as a positioning convex part, the position shift of the metal pin in the radial direction of a through-hole can be suppressed.

  The package of the present invention is formed such that the diameter of the through hole gradually increases from the inside of the first substrate toward the outside of the first substrate, and the metal pin has the positioning projection. It is characterized by being inserted into the through hole in a state of being disposed inside the first substrate in the through hole.

  According to the present invention, since the inner diameter of the through hole is smaller in the inner side than the outer side of the first substrate, the positioning convex portion is arranged inside the first substrate in the through hole, whereby the through hole is formed. The gap between the inner peripheral surface of the metal pin and the one axial end portion of the metal pin can be further reduced. Thereby, the position shift of the metal pin in the radial direction of the through hole can be reliably suppressed. Further, since the inner diameter of the through hole is formed larger on the outer side than the inner side of the first substrate, the non-conductive filling member can be efficiently filled from the outer side of the first substrate.

  According to another aspect of the present invention, there is provided a manufacturing method of a package in which an electronic component can be encapsulated between a plurality of substrates bonded to each other, and the inside of the first substrate and the first substrate among the plurality of substrates. A through electrode forming step of forming a through electrode that conducts to the outside, the through electrode forming step including a through hole forming step of forming a through hole in the first substrate, and a metal that inserts a metal pin into the through hole A non-conductive filling member filling step for filling the gap between the through-hole and the metal pin with a non-conductive filling member and sealing the gap; and the non-conductive filling member filled in the through-hole. And a polishing step of polishing both main surfaces of the first substrate to expose the metal pins from both main surfaces of the first substrate, wherein the metal pins have one end in the axial direction. Block the through hole in the part In addition to having a base part, the base part has a positioning convex part that determines the relative position of the metal pin with respect to the radial direction of the through hole. When the metal pin is inserted until the base portion comes into contact with the first substrate, the metal pin is positioned in the radial direction of the through hole by the positioning convex portion.

According to the present invention, since the positioning convex portion is formed at one end in the axial direction of the metal pin, when the metal pin is inserted and arranged in the through hole in the metal pin arranging step, the inner peripheral surface of the through hole and A gap between the metal pin and one axial end portion can be reduced. Thereby, when a metal pin is inserted in a through-hole at a metal pin arrangement | positioning process, it can arrange | position, suppressing the position shift of the metal pin in the radial direction of a through-hole.
Also, in each step after the metal pin placement step, for example, when the metal pin is about to move in the radial direction of the through-hole during conveyance, the positioning convex portion interferes with the inner peripheral surface of the through-hole, and the diameter of the through-hole The positional deviation of the metal pin in the direction can be suppressed.
In addition, since the other end in the axial direction of the metal pin on which the positioning convex portion is not formed can sufficiently secure a gap with the inner peripheral surface of the through hole, the metal pin can be easily placed in the through hole in the metal pin placement step. Can be inserted and placed.
Therefore, the position shift of the metal pin in the radial direction of the through hole can be suppressed while ensuring the working efficiency of the metal pin arranging step.

  In addition, the piezoelectric vibrator of the present invention is characterized in that a piezoelectric vibrating piece is enclosed as the electronic component in the package described above.

  According to the present invention, since the piezoelectric vibrating reed is enclosed in the package that can suppress the displacement of the metal pin in the radial direction of the through-hole while ensuring the work efficiency at the time of arranging the metal pin, the cost is low. Thus, a highly reliable piezoelectric vibrator can be provided.

The oscillator according to the present invention is characterized in that the piezoelectric vibrator described above is electrically connected to an integrated circuit as an oscillator.
The electronic apparatus according to the present invention is characterized in that the above-described piezoelectric vibrator is electrically connected to a time measuring unit.
The radio timepiece of the present invention is characterized in that the above-described piezoelectric vibrator is electrically connected to the filter unit.

  According to the oscillator, the electronic device, and the radio timepiece of the present invention, since the low-cost and highly reliable piezoelectric vibrator is provided, it is possible to provide a low-cost and highly reliable oscillator, electronic device, and radio timepiece. .

According to the present invention, since the positioning convex portion is formed at one end of the metal pin in the axial direction, when the metal pin is inserted and disposed in the through hole, the inner peripheral surface of the through hole and the axial direction of the metal pin The gap with the one end can be reduced. Thereby, when a metal pin is inserted in a through-hole, it can arrange | position, suppressing the position shift of the metal pin in the radial direction of a through-hole. In addition, when the metal pin is about to move in the radial direction of the through hole after the metal pin is arranged, the positioning convex portion and the inner peripheral surface of the through hole interfere with each other. Thereby, even after arrange | positioning a metal pin, the position shift of the metal pin in the radial direction of a through-hole can be suppressed.
Further, the portion of the metal pin where the positioning convex portion is not formed can secure a sufficient gap between the metal pin and the inner peripheral surface of the through hole, so that the metal pin can be easily inserted and arranged in the through hole.
Therefore, it is possible to suppress misalignment of the metal pin in the radial direction of the through-hole while ensuring good working efficiency when arranging the metal pin.

It is an external perspective view of a piezoelectric vibrator. FIG. 2 is an internal configuration diagram of the piezoelectric vibrator shown in FIG. 1, and is a plan view with a lid substrate removed. It is sectional drawing in the AA of FIG. FIG. 2 is an exploded perspective view of the piezoelectric vibrator shown in FIG. 1. It is a top view of a piezoelectric vibrating piece. It is a bottom view of a piezoelectric vibrating piece. It is sectional drawing in the BB line of FIG. It is a perspective view of a metal pin. It is a flowchart of the manufacturing method of a piezoelectric vibrator. It is a disassembled perspective view of a wafer body. It is explanatory drawing of a through-hole formation process. It is explanatory drawing of a metal pin arrangement | positioning process, Fig.11 (a) is explanatory drawing before arrangement | positioning of a metal pin, FIG.11 (b) is explanatory drawing after arrangement | positioning of a metal pin. It is explanatory drawing of a glass frit filling process. It is explanatory drawing of a grinding | polishing process. It is a perspective view of the metal pin which concerns on the 1st modification of embodiment. It is a perspective view of the metal pin which concerns on the 2nd modification of embodiment. It is a block diagram which shows one Embodiment of an oscillator. It is a lineblock diagram showing one embodiment of electronic equipment. It is a block diagram which shows one Embodiment of a radio timepiece. It is explanatory drawing of the conventional penetration electrode formation process.

(Piezoelectric vibrator)
Hereinafter, a piezoelectric vibrator according to an embodiment of the present invention will be described with reference to the drawings.
In the following description, the first substrate is a base substrate, and the substrate bonded to the base substrate is a lid substrate. Further, the outer surface of the base substrate in the package (piezoelectric vibrator) will be described as a first surface L, and the inner surface of the base substrate will be described as a second surface U.
1 is an external perspective view of the piezoelectric vibrator 1, FIG. 2 is an internal configuration diagram of the piezoelectric vibrator 1, and FIG. 3 is a cross-sectional view taken along line AA of FIG. FIG. 4 is an exploded perspective view of the piezoelectric vibrator 1 shown in FIG.
In FIG. 4, the excitation electrode 15, the extraction electrodes 19 and 20, the mount electrodes 16 and 17, and the weight metal film 21, which will be described later, are omitted for easy understanding of the drawing.

  As shown in FIG. 1, the piezoelectric vibrator 1 of the present embodiment is a package 9 in which a base substrate 2 and a lid substrate 3 are anodically bonded via a bonding film 35, and is a surface-mount type piezoelectric vibrator 1. . As shown in FIG. 3, the piezoelectric vibrating reed 4 is accommodated in the cavity C inside the package 9.

(Piezoelectric vibrating piece)
5 is a plan view of the piezoelectric vibrating piece 4, FIG. 6 is a bottom view of the piezoelectric vibrating piece 4, and FIG. 7 is a cross-sectional view taken along the line BB in FIG.
As shown in FIGS. 5 and 6, the piezoelectric vibrating piece 4 is a tuning fork type vibrating piece formed of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, and when a predetermined voltage is applied. It vibrates. The piezoelectric vibrating reed 4 includes a pair of vibrating arm portions 10 and 11 arranged in parallel, a base portion 12 that integrally fixes the base end sides of the pair of vibrating arm portions 10 and 11, and a pair of vibrating arm portions 10. , 11 and groove portions 18 formed on both main surfaces. The groove portion 18 is formed from the proximal end side of the vibrating arm portions 10 and 11 to the vicinity of the middle along the longitudinal direction of the pair of vibrating arm portions 10 and 11.

  The excitation electrode 15 and the extraction electrodes 19 and 20 are formed of a single layer film of chromium (Cr), which is the same material as an underlayer of the mount electrodes 16 and 17 described later. Thereby, the excitation electrode 15 and the extraction electrodes 19 and 20 can be formed simultaneously with the formation of the underlying layers of the mount electrodes 16 and 17.

  The excitation electrode 15 is an electrode that vibrates the pair of vibrating arm portions 10 and 11 at a predetermined resonance frequency in a direction toward or away from each other. As shown in FIG. 7, the first excitation electrode 13 and the second excitation electrode 14 constituting the excitation electrode 15 are electrically separated from the outer surfaces of the pair of vibrating arm portions 10 and 11, respectively. It is formed by patterning.

  The mount electrodes 16 and 17 are laminated films of Cr and gold (Au), and a Cr film having good adhesion to crystal is formed as an underlayer, and then a thin film of Au is formed on the surface as a finishing layer. It is formed by.

  A weight metal film 21 for adjusting (frequency adjustment) so as to vibrate its own vibration state within a predetermined frequency range is coated on the tips of the pair of vibrating arm portions 10 and 11. The weight metal film 21 is divided into a coarse adjustment film 21a used when the frequency is roughly adjusted and a fine adjustment film 21b used when the frequency is finely adjusted. By adjusting the frequency using the coarse adjustment film 21a and the fine adjustment film 21b, the frequency of the pair of vibrating arm portions 10 and 11 can be kept within the range of the nominal frequency of the device.

(package)
As shown in FIG. 1, the base substrate 2 and the lid substrate 3 are anodic bondable substrates made of a glass material, for example, soda lime glass, and are formed in a substantially plate shape. As shown in FIG. 3, a cavity recess 3 a that accommodates the piezoelectric vibrating reed 4 is formed on the side of the lid substrate 3 that is bonded to the base substrate 2.

  A bonding film 35 for anodic bonding is formed on the entire bonding surface side of the lid substrate 3 with the base substrate 2. That is, the bonding film 35 is formed in the frame area around the cavity recess 3a in addition to the entire inner surface of the cavity recess 3a. Although the bonding film 35 of this embodiment is formed of a silicon film, the bonding film 35 can also be formed of aluminum (Al), Cr, or the like. As will be described later, the bonding film 35 and the base substrate 2 are anodically bonded, and the cavity C is vacuum-sealed.

(Penetration electrode)
The piezoelectric vibrator 1 includes through electrodes 32 and 33 that penetrate the base substrate 2 in the thickness direction and conduct the inside of the base substrate 2 and the outside of the base substrate 2. The through electrodes 32 and 33 are disposed in through holes 30 and 31 that penetrate the inside of the base substrate 2 and the outside of the base substrate 2, and are formed by metal pins 7 that electrically connect the piezoelectric vibrating reed 4 and the outside. Has been.

As shown in FIG. 2, the through holes 30 and 31 are formed so as to be accommodated in the cavity C when the piezoelectric vibrator 1 is formed. More specifically, the through holes 30, 31 are formed with one through hole 30 at a position corresponding to the base 12 side of the piezoelectric vibrating reed 4 mounted in the mounting process described later, and the tips of the vibrating arm parts 10, 11. The other through hole 31 is formed at a position corresponding to the side.
The through holes 30 and 31 are formed, for example, by pressing from the first surface L side. As shown in FIG. 3, the through holes 30 and 31 are formed so that the diameter gradually increases from the second surface U side to the first surface L side. That is, the through holes 30 and 31 have a substantially tapered cross section including the central axis O. In the glass frit filling step described later (corresponding to the “non-conductive filling member filling step” in the claims), a glass frit filling the gap between the through holes 30 and 31 and the metal pin 7 (“non-conductive filling” in the claims) is used. Is equivalent to the first surface L side opening 30L, 31L (hereinafter referred to as “first opening 30L, 31L”) having a larger diameter.

(Metal pin)
FIG. 8 is a perspective view of the metal pin 7.
As shown in FIG. 8, the metal pin 7 includes a metal pin main body 7 a disposed in the through holes 30 and 31, and a base portion 7 b formed at one end (lower side in FIG. 8) in the axial direction of the metal pin main body 7 a. And a positioning convex part 7c provided at the base of the base part 7b side of the metal pin main body 7a. In the metal pin arrangement step S33 described later, the metal pin 7 is inserted into the through holes 30 and 31 from the other axial end opposite to the base portion 7b (upper side in FIG. 8). Accordingly, the base portion 7b side is the rear end side in the insertion direction, and the side opposite to the base portion 7b is the front end side in the insertion direction.

  The metal pin 7 is a conductive member formed of a metal material such as stainless steel, silver (Ag), Ni alloy, or Al, and in particular, an alloy containing 58 percent by weight of iron (Fe) and 42 percent by weight of Ni. It is desirable to form with (42 alloy). The metal pin 7 is formed by forging or pressing.

The metal pin main body 7 a is a cylindrical member that is formed to have a diameter smaller than the diameter of the through holes 30 and 31 formed in the base substrate 2 and has a length substantially the same as the depth of the through holes 30 and 31.
The diameter of the base portion 7b formed at one end of the metal pin main body 7a is referred to as openings 30U and 31U on the second surface U side of the through holes 30 and 31 (refer to FIG. 3, hereinafter referred to as “second openings 30U and 31U”). ) Is set larger than the diameter. By forming the base portion 7b as described above, the base portion 7b abuts on the second surface U side and closes the second openings 30U and 31U of the through holes 30 and 31 in the metal pin arrangement step S33 described later. (See FIG. 11). The base portion 7b is removed in a polishing step S39 described later.

The positioning convex part 7c formed at the base of the base part 7b side of the metal pin main body 7a is formed in a circular shape in a plan view in the axial direction so as to surround the periphery of the metal pin main body 7a. It is formed so as to gradually increase in diameter from the vicinity of the approximate center in the direction toward the base portion 7b side at one end in the axial direction.
The diameter of the base of the positioning convex portion 7c (that is, the connecting portion with the base portion 7b) is slightly smaller than the diameter of the second openings 30U and 31U of the through holes 30 and 31 (see FIG. 3). In the metal pin arrangement step S33 described later, the metal pin 7 is placed in the through holes 30 and 31 with a slight gap between the positioning convex portion 7c and the inner peripheral surfaces of the second openings 30U and 31U. Be placed.

  As shown in FIG. 3, the glass body 6 is obtained by baking glass frit and fills the gap between the through holes 30 and 31 and the metal pin 7. The glass body 6 is flat at both ends and is formed to have substantially the same thickness as the base substrate 2. At the center of the glass body 6, a metal pin 7 is disposed so as to penetrate the glass body 6, and is firmly fixed to the metal pin main body 7 a and the positioning projection 7 c of the metal pin 7. The glass body 6 completely closes the gap between the through holes 30 and 31 and the metal pin 7 and maintains the airtightness in the cavity C.

  As shown in FIG. 4, a pair of lead-out electrodes 36 and 37 are patterned on the second surface U side of the base substrate 2. Of the pair of lead-out electrodes 36 and 37, one lead-out electrode 36 is formed so as to be positioned immediately above one through-electrode 32. The other routing electrode 37 is routed from the position adjacent to the one routing electrode 36 along the vibrating arm portions 10 and 11 to the distal end side of the vibrating arm portions 10 and 11, and then the other through electrode 33. It is formed so that it may be located just above.

  Bumps B are formed on the pair of lead-out electrodes 36 and 37, and the pair of mount electrodes 16 and 17 of the piezoelectric vibrating piece 4 are mounted using the bumps B. As a result, one mount electrode 17 of the piezoelectric vibrating reed 4 is electrically connected to one through electrode 32 via one routing electrode 36, and the other mount electrode 16 is connected to the other through the other routing electrode 37. The electrode 33 is electrically connected (see FIG. 2).

  A pair of external electrodes 38 and 39 is formed on the first surface L of the base substrate 2. The pair of external electrodes 38 and 39 are formed at both ends in the longitudinal direction of the base substrate 2, and are electrically connected to the pair of through electrodes 32 and 33, respectively.

  When the piezoelectric vibrator 1 configured in this way is operated, a predetermined drive voltage is applied to the external electrodes 38 and 39 formed on the base substrate 2. As a result, a voltage can be applied to the excitation electrode 15 including the first excitation electrode 13 and the second excitation electrode 14 of the piezoelectric vibrating reed 4, so that the pair of vibrating arm portions 10 and 11 are moved closer to and away from each other. Can be vibrated at a predetermined frequency. The vibration of the pair of vibrating arm portions 10 and 11 can be used as a time source, a timing source for control signals, a reference signal source, and the like.

(Method for manufacturing piezoelectric vibrating piece)
Next, a method for manufacturing the above-described piezoelectric vibrator 1 will be described with reference to a flowchart. FIG. 9 is a flowchart of a method for manufacturing the piezoelectric vibrator 1.
FIG. 10 is an exploded perspective view of the wafer body 60. In addition, the dotted line shown in FIG. 10 has shown the cutting line M cut | disconnected by the cutting process performed later.
The manufacturing method of the piezoelectric vibrator 1 of the present embodiment mainly includes a piezoelectric vibrating piece manufacturing step S10, a lid substrate wafer manufacturing step S20, a base substrate wafer manufacturing step S30, and an assembly step (S50 and subsequent steps). doing. Among them, the piezoelectric vibrating piece producing step S10, the lid substrate wafer producing step S20, and the base substrate wafer producing step S30 can be performed in parallel.

(Piezoelectric vibrating piece creation process)
In the piezoelectric vibrating piece producing step S10, the piezoelectric vibrating piece 4 shown in FIG. 5 is produced. Specifically, a quartz Lambert rough is first sliced at a predetermined angle to obtain a wafer having a constant thickness. Subsequently, the wafer is lapped and roughly processed, and then the work-affected layer is removed by etching, and then mirror polishing such as polishing is performed to obtain a wafer having a predetermined thickness. Subsequently, after performing appropriate processing such as cleaning on the wafer, the wafer is patterned into an outer shape of the piezoelectric vibrating reed 4 by photolithography technique, and a metal film is formed and patterned to obtain the excitation electrode 15, Lead electrodes 19 and 20, mount electrodes 16 and 17, and weight metal film 21 are formed. Thereby, the some piezoelectric vibrating piece 4 is producible. Next, the resonance frequency of the piezoelectric vibrating reed 4 is roughly adjusted. This is performed by irradiating the coarse adjustment film 21 a of the weight metal film 21 with laser light to evaporate a part thereof and changing the weight of the vibrating arm portions 10 and 11.

(Wad manufacturing process for lid substrate)
In the lid substrate wafer manufacturing step S20, as shown in FIG. 10, a lid substrate wafer 50 to be the lid substrate 3 later is manufactured. First, the disc-shaped lid substrate wafer 50 made of soda-lime glass is polished and washed to a predetermined thickness, and then the outermost work-affected layer is removed by etching or the like (S21). Next, in the cavity forming step S <b> 22, a plurality of cavity recesses 3 a are formed on the bonding surface of the lid substrate wafer 50 to the base substrate wafer 40. The cavity recess 3a is formed by hot press molding or etching. Next, in the bonding surface polishing step S23, the bonding surface with the base substrate wafer 40 is polished.

  Next, in the bonding film forming step S <b> 24, a bonding film 35 (see FIG. 3) is formed on the bonding surface with the base substrate wafer 40. The bonding film 35 may be formed on the entire inner surface of the cavity C in addition to the bonding surface with the base substrate wafer 40. Thereby, the patterning of the bonding film 35 becomes unnecessary, and the manufacturing cost can be reduced. The bonding film 35 can be formed by a film forming method such as sputtering or CVD. In addition, since the bonding surface polishing step S23 is performed before the bonding film forming step S24, the flatness of the surface of the bonding film 35 is ensured, and stable bonding with the base substrate wafer 40 can be realized.

(Base substrate wafer manufacturing process)
In the base substrate wafer manufacturing step S30, as shown in FIG. 10, the base substrate wafer 40 to be the base substrate 2 later is manufactured. First, the disc-shaped base substrate wafer 40 made of soda-lime glass is polished and washed to a predetermined thickness, and then the work-affected layer on the outermost surface is removed by etching or the like (S31).

(Penetration electrode formation process)
Next, a through electrode forming step S30A for forming a pair of through electrodes 32 and 33 on the base substrate wafer 40 is performed. Below, penetration electrode formation process S30A is explained. In addition, although the formation process of the penetration electrode 32 is demonstrated below as an example, the formation process of the penetration electrode 33 is also the same.
As shown in FIG. 9, the through electrode forming step S30A is a through hole forming step S32, a metal pin arranging step S33, and a glass frit filling step S35 (corresponding to the “non-conductive filling member filling step” in the claims). And a baking step S37 (corresponding to “solidification step” in the claims) and a polishing step S39. Below, each process is demonstrated.

(Through hole forming process)
FIG. 11 is an explanatory diagram of the through-hole forming step S32.
In the through electrode forming step S30A, first, a through hole forming step S32 for forming the through hole 30 in the base substrate wafer 40 is performed. The through hole 30 is formed by, for example, pressing. At this time, the through hole 30 is formed so that the diameter gradually increases from the second opening 30U on the second surface U side to the first opening 30L on the first surface L side due to the draft of the press working.

(Metal pin placement process)
FIG. 12 is an explanatory diagram of the metal pin arranging step S33, FIG. 12 (a) is an explanatory diagram before the metal pin 7 is arranged, and FIG. 12 (b) is an explanatory diagram after the metal pin 7 is arranged. .
Subsequently, a metal pin arranging step S33 for inserting a metal pin into the through hole 30 is performed.
As shown in FIG. 12, in the metal pin arrangement step S <b> 33, the metal pins 7 are inserted from the second openings 30 </ b> U of the base substrate wafer 40 and the metal pins 7 are arranged inside the through holes 30.

  As a specific method for arranging the metal pins 7, for example, the plurality of metal pins 7 are placed on the second surface U of the base substrate wafer 40. Then, while swinging the base substrate wafer 40, the base substrate wafer 40 is vibrated to diffuse the metal pins 7 and swing the metal pins 7 into the through holes 30. Here, since the positioning convex part 7c is not formed in the other axial end of the metal pin 7 opposite to the base part 7b, the other axial end of the metal pin 7 and the inner peripheral surface of the through hole 30 This gap is sufficiently secured. Therefore, the metal pin 7 is easily inserted into the through hole 30 and disposed.

Then, as shown in FIG. 12B, the metal pins 7 are arranged in a state where the base portion 7 b is in contact with the second surface U of the base substrate wafer 40 while closing the second opening 30 </ b> U.
Here, as described above, the diameter of the base of the positioning protrusion 7c of the metal pin 7 (that is, the connecting portion with the base portion 7b) is slightly smaller than the diameter of the second opening 30U of the through hole 30. Therefore, when the metal pin 7 is inserted until the base portion 7b contacts the second surface U of the base substrate wafer 40, a slight gap is formed between the positioning convex portion 7c and the inner peripheral surface of the second opening 30U. In the vacant state, the positional deviation in the through hole 30 of the metal pin 7 is suppressed and arranged. At this time, the metal pin 7 is disposed in a state where the central axis P of the metal pin main body 7a and the central axis O of the through hole 30 are substantially coincident with each other.

  After the metal pin 7 is inserted and arranged in the through hole 30, the laminate material 70 is stuck on the second surface U side as shown in FIG. This prevents the metal pin 7 from being displaced or dropped during conveyance, and prevents the glass frit from leaking in the glass frit filling step S35 described below.

(Glass frit filling process)
FIG. 13 is an explanatory diagram of the glass frit filling step S35.
Subsequently, as shown in FIG. 12, a glass frit filling step S35 for filling the gap between the through hole 30 and the metal pin 7 with a glass frit 61 as a nonconductive filling member is performed. The glass frit 61 is an example of a non-conductive filling member, and the non-conductive filling member is not limited to the glass frit 61.
In the glass frit filling step S35, the base substrate wafer 40 is turned upside down so that the first surface L side is the upper surface, and the squeegee 65 is scanned along the first surface L, so that the glass frit 61 is moved to the base substrate wafer 40. Apply from the first surface L side.
At this time, as described above, the diameter is gradually increased from the second opening 30U on the second surface U side to the first opening 30L on the first surface L side. Therefore, the glass frit 61 is filled into the through hole 30 from the first opening 30L having a larger opening.
As a result, the glass frit 61 enters the through hole 30 from the first opening 30 </ b> L and fills the gap between the through hole 30 and the metal pin 7. The glass frit 61 is mainly composed of powdery glass particles, an organic solvent, and a binder (fixing agent). The glass body 6 (see FIG. 3) is fired in a firing step S37 described below. Form.

Next, a firing step S37 is performed in which the glass frit 61 filled in the through hole 30 is fired and cured. For example, after the base substrate wafer 40 is transferred to the baking furnace, it is held in an atmosphere at about 610 ° C. for about 30 minutes. Thereafter, the base substrate wafer 40 is left to cool in a normal temperature atmosphere. As a result, the glass frit is cured to form the glass body 6, and the through hole 30, the glass body 6 and the metal pin 7 are fixed to each other and the through hole 30 is sealed.
In addition, since the non-conductive filling member of this embodiment is the glass frit 61, it is solidified by firing. However, when the non-conductive filling member is a member other than the glass frit 61, the solidifying means is used for firing. Not limited.

FIG. 14 is an explanatory diagram of the polishing step S39.
Subsequently, as shown in FIG. 14, the polishing process of polishing the first surface L side and the second surface U side of the base substrate wafer 40 to expose the metal pins 7 from the first surface L and the second surface U. S39 is performed. By polishing the first surface L side, the metal pin 7 is exposed from the first surface L, and by polishing the second surface U side, the base portion 7b is removed and the metal pin 7 is moved to the second surface U. Exposed from.
Here, since the cross-sectional area of the metal pin 7 exposed from the base substrate 2 increases on the second surface U side where the positioning protrusion 7c after the base portion 7b is removed, the plane of the metal pin 7 is increased. It is easy to increase the degree. Therefore, when the routing electrode is formed in the next routing electrode forming step S40, the contact resistance between the metal pin 7 and the routing electrodes 36 and 37 formed on the positioning convex portion 7c of the metal pin 7 can be lowered.
When the polishing step S39 is performed, the through electrode forming step S30A is completed.

  Next, a routing electrode forming step S40 for forming a plurality of routing electrodes 36 and 37 (see FIG. 10) electrically connected to the through electrodes 32 and 33 on the second surface U is performed. Then, bumps B (see FIG. 3) made of gold or the like are formed on the routing electrodes 36 and 37, respectively. In FIG. 10, the illustration of the bumps B is omitted for easy viewing of the drawing. At this point, the base substrate wafer manufacturing step S30 ends.

(Piezoelectric vibrator assembly process after mounting process S50)
Next, a mounting step S50 is performed in which the piezoelectric vibrating reed 4 is bonded onto the routing electrodes 36 and 37 of the base substrate wafer 40 via the bumps B. 3, the base 12 is mechanically fixed to the bump B in a state where the vibrating arms 10 and 11 of the piezoelectric vibrating piece 4 are lifted from the second surface U of the base substrate wafer 40. The Further, the mount electrodes 16 and 17 and the lead-out electrodes 36 and 37 are electrically connected.

  After the mounting of the piezoelectric vibrating reed 4 is completed, as shown in FIG. 10, an overlapping step S <b> 60 is performed in which the lid substrate wafer 50 is overlapped with the base substrate wafer 40. Through this process, the piezoelectric vibrating reed 4 mounted on the base substrate wafer 40 is accommodated in the cavity C surrounded by the cavity recess 3 a of the lid substrate wafer 50 and the base substrate wafer 40.

  After the superposition step S60, the superposed wafers 40 and 50 are put into an anodic bonding apparatus (not shown), and a bonding step S70 is performed in which a predetermined voltage is applied in a predetermined temperature atmosphere to perform anodic bonding. By this step, the piezoelectric vibrating reed 4 can be sealed in the cavity C, and the wafer body 60 shown in FIG. 10 in which the base substrate wafer 40 and the lid substrate wafer 50 are bonded can be obtained. In FIG. 10, in order to make the drawing easy to see, a state in which the wafer body 60 is disassembled is illustrated, and the bonding film 35 is not illustrated from the lid substrate wafer 50.

Next, a conductive material is patterned on the first surface L of the base substrate wafer 40, and a pair of external electrodes 38 and 39 (see FIG. 3) electrically connected to the pair of through electrodes 32 and 33, respectively. A plurality of external electrode forming steps S80 are formed. Through this process, the piezoelectric vibrating reed 4 is electrically connected to the external electrodes 38 and 39 via the through electrodes 32 and 33.
Here, the metal pins 7 of the through-electrodes 32 and 33 are arranged such that positional deviation is suppressed in a state where the central axis P of the metal pin main body 7a and the central axis O of the through-hole are substantially coincident with each other. That is, since the through electrodes 32 and 33 are formed with high accuracy, the through electrodes 32 and 33 and the external electrodes 38 and 39 can be electrically connected without making the formation region of the external electrodes 38 and 39 wider than necessary.

  Next, in the state of the wafer body 60, a fine adjustment step S90 for finely adjusting the frequency of each piezoelectric vibrator sealed in the cavity C is performed. By this step, the frequency of the piezoelectric vibrator is kept within the range of the nominal frequency.

  After the fine adjustment of the frequency, a cutting step S100 is performed for cutting the bonded wafer body 60 along the cutting line M shown in FIG. Thereby, the wafer body 60 is separated into a plurality of piezoelectric vibrators 1.

  Thereafter, an internal electrical characteristic inspection S110 is performed. That is, the resonance frequency, resonance resistance value, drive level characteristic (excitation power dependency of resonance frequency and resonance resistance value), etc. of the piezoelectric vibrating piece 4 are measured and checked. In addition, the insulation resistance characteristics and the like are also checked. Finally, an external appearance inspection of the piezoelectric vibrator is performed to finally check dimensions and quality. This completes the manufacture of the piezoelectric vibrator.

(effect)
According to this embodiment, since the positioning convex part 7c is formed in the axial direction one end part of the metal pin 7, when the metal pin 7 is inserted and arranged in the through holes 30, 31, the through holes 30, 31 are formed. The gap between the inner peripheral surface of the metal pin 7 and one axial end portion of the metal pin 7 can be reduced. Thereby, when the metal pin 7 is inserted into the through holes 30 and 31, the metal pin 7 can be disposed while suppressing the positional deviation in the through holes 30 and 31. Further, after the metal pin 7 is arranged, when the metal pin 7 tries to move in the radial direction of the through holes 30 and 31, the positioning convex portion 7 c interferes with the inner peripheral surfaces of the through holes 30 and 31. Thereby, even after arrange | positioning the metal pin 7, the position shift of the metal pin 7 in the radial direction of the through-holes 30 and 31 can be suppressed.
Further, a portion of the metal pin 7 where the positioning convex portion 7c is not formed can secure a sufficient gap between the metal pin 7 and the inner peripheral surfaces of the through holes 30 and 31, so The pin 7 can be easily inserted and arranged.
Therefore, it is possible to suppress the displacement of the metal pin 7 in the radial direction of the through holes 30 and 31 while ensuring good working efficiency when the metal pin 7 is arranged.

Moreover, according to this embodiment, since the positioning convex part 7c is formed so that a diameter may be gradually expanded as it goes to an axial direction one end part, when inserting a metal pin in the through-holes 30 and 31, a positioning convex part 7c can be reliably prevented from being caught by the edge portions of the through holes 30 and 31. Therefore, the metal pin 7 can be more easily inserted into the through holes 30 and 31, and the metal pin 7 can be positioned more smoothly in the radial direction of the through holes 30 and 31.
Moreover, since the cross-sectional area of the metal pin 7 exposed from the base substrate 2 is increased on the second surface U side where the positioning convex portion 7c is arranged, the flatness is easily increased, and the metal pin 7 and the positioning convex portion 7c The contact resistance with the lead-out electrodes 36 and 37 formed above can be lowered. For this reason, the package 9 which can drive the piezoelectric vibrating reed 4 efficiently can be provided.

  In addition, according to the present embodiment, the piezoelectric vibrating reed 4 is provided inside the package that can suppress the displacement of the metal pin 7 in the radial direction of the through holes 30 and 31 while ensuring good working efficiency when the metal pin 7 is arranged. Can be provided at low cost and with high reliability.

(1st modification of embodiment, metal pin which has positioning convex part of another shape)
FIG. 15 is a perspective view of a metal pin according to a first modification of the embodiment.
As shown in FIG. 8, the metal pin 7 of the embodiment has a positioning projection 7c formed in a circular shape in a plan view in the axial direction so as to surround the periphery of the metal pin main body 7a, and as it goes toward one end in the axial direction. The diameter was gradually increased. However, the metal pin 7 of the first modified example is different from the embodiment in that a plurality of positioning convex portions 7c are formed along the circumferential direction of the metal pin main body 7a as shown in FIG. Note that a detailed description of the same configuration as the embodiment is omitted.

  As shown in FIG. 15, four positioning protrusions 7 c of the first modification are erected on one end in the axial direction of the metal pin 7 and at the base of the base portion 7 b toward the radially outer side of the metal pin 7. Has been. The positioning protrusions 7 c are formed at equal intervals at a pitch of about 90 ° in the circumferential direction when the metal pin 7 is viewed in the axial direction. Moreover, the positioning convex part 7c becomes a divergent shape as it goes to one axial direction end, and is formed in the substantially right triangle shape by side view.

(Effect of the first modification)
According to this embodiment, since the positioning convex part 7c is formed in a divergent shape toward the one end in the axial direction, when the metal pin 7 is inserted into the through holes 30, 31, the positioning convex part 7c becomes a through hole. It can prevent being caught in the edge part of 30,31. Therefore, the metal pin 7 can be easily inserted into the through holes 30 and 31, and the metal pin 7 can be smoothly positioned in the radial direction of the through holes 30 and 31.

(2nd modification of embodiment, metal pin which has positioning convex part of another shape)
FIG. 16 is a perspective view of a metal pin according to a second modification of the embodiment.
As shown in FIG. 8, the metal pin 7 of the embodiment has a positioning projection 7c formed in a circular shape in a plan view in the axial direction so as to surround the periphery of the metal pin main body 7a, and as it goes toward one end in the axial direction. The diameter was gradually increased. However, the metal pin 7 of the second modified example is different from the embodiment in that the entire metal pin main body 7a is formed so as to gradually expand in diameter as shown in FIG. Note that a detailed description of the same configuration as the embodiment is omitted.

  As shown in FIG. 16, the metal pin 7 of the second modified example gradually increases in diameter as it starts from the other axial end of the metal pin 7 (upper side in FIG. 16) and toward one axial end (lower side in FIG. 16). It is formed in a substantially conical shape. One end of the metal pin main body 7a in the axial direction has the largest outer diameter and is formed slightly smaller than the diameter of the second openings 30U and 31U of the through holes 30 and 31. And the one end part of the axial direction of the metal pin main body 7a functions as the positioning convex part 7c when the metal pin 7 is inserted into the through holes 30 and 31 and arranged. That is, the metal pin 7 has a through hole in a state where a slight gap is provided between one axial end portion of the metal pin main body 7a functioning as the positioning convex portion 7c and the inner peripheral surface of the second openings 30U and 31U. 30 and 31.

(Effect of the second modification)
According to the present embodiment, since the metal pin 7 is formed so that the diameter gradually increases from the other end in the axial direction of the metal pin 7 toward the one end in the axial direction, the metal pin 7 is in the through holes 30 and 31. The metal pin 7 can be easily placed in the through holes 30 and 31 while being smoothly guided and prevented from being caught by the edges of the through holes 30 and 31. Therefore, the working efficiency when the metal pin 7 is arranged can be improved. Moreover, since the axial direction one end part of the expanded metal pin 7 functions as the positioning convex part 7c, the position shift of the metal pin 7 in the radial direction of the through holes 30 and 31 can be suppressed.

(Oscillator)
Next, an embodiment of an oscillator according to the present invention will be described with reference to FIG.
As shown in FIG. 17, the oscillator 110 according to the present embodiment is configured such that the piezoelectric vibrator 1 is an oscillator electrically connected to the integrated circuit 111. The oscillator 110 includes a substrate 113 on which an electronic element component 112 such as a capacitor is mounted. An integrated circuit 111 for an oscillator is mounted on the substrate 113, and a piezoelectric vibrating piece of the piezoelectric vibrator 1 is mounted in the vicinity of the integrated circuit 111. The electronic element component 112, the integrated circuit 111, and the piezoelectric vibrator 1 are electrically connected by a wiring pattern (not shown). Each component is molded with a resin (not shown).

In the oscillator 110 configured as described above, when a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece in the piezoelectric vibrator 1 vibrates. This vibration is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece and input to the integrated circuit 111 as an electric signal. The input electrical signal is subjected to various processes by the integrated circuit 111 and output as a frequency signal. Thereby, the piezoelectric vibrator 1 functions as an oscillator.
In addition, by selectively setting the configuration of the integrated circuit 111, for example, an RTC (real-time clock) module or the like as required, the operation date and time of the device or external device in addition to a single-function oscillator for a clock, etc. A function for controlling the time, providing a time, a calendar, and the like can be added.

  According to the oscillator 110 of the present embodiment, since the piezoelectric vibrator 1 with low cost and high reliability is provided, the oscillator 110 with high cost and high reliability can be provided.

(Electronics)
Next, an embodiment of an electronic apparatus according to the invention will be described with reference to FIG. Note that a portable information device 120 having the above-described piezoelectric vibrator 1 will be described as an example of the electronic device.
First, the portable information device 120 of this embodiment is represented by, for example, a mobile phone, and is a development and improvement of a wrist watch in the prior art. The appearance is similar to that of a wristwatch, and a liquid crystal display is arranged in a portion corresponding to a dial so that the current time and the like can be displayed on this screen. Further, when used as a communication device, it is possible to perform communication similar to that of a conventional mobile phone by using a speaker and a microphone that are removed from the wrist and incorporated in the inner portion of the band. However, it is much smaller and lighter than conventional mobile phones.

  Next, the configuration of the portable information device 120 of this embodiment will be described. As shown in FIG. 18, the portable information device 120 includes the piezoelectric vibrator 1 and a power supply unit 121 for supplying power. The power supply unit 121 is made of, for example, a lithium secondary battery. The power supply unit 121 includes a control unit 122 that performs various controls, a clock unit 123 that counts time, a communication unit 124 that communicates with the outside, a display unit 125 that displays various information, and the like. A voltage detection unit 126 that detects the voltage of the functional unit is connected in parallel. Power is supplied to each functional unit by the power supply unit 121.

  The control unit 122 controls each function unit to control operation of the entire system such as transmission and reception of audio data, measurement and display of the current time, and the like. The control unit 122 includes a ROM in which a program is written in advance, a CPU that reads and executes the program written in the ROM, and a RAM that is used as a work area for the CPU.

  The timer unit 123 includes an integrated circuit including an oscillation circuit, a register circuit, a counter circuit, an interface circuit, and the like, and the piezoelectric vibrator 1. When a voltage is applied to the piezoelectric vibrator 1, the piezoelectric vibrating piece vibrates, and the vibration is converted into an electric signal by the piezoelectric characteristics of the crystal, and is input to the oscillation circuit as an electric signal. The output of the oscillation circuit is binarized and counted by a register circuit and a counter circuit. Then, signals are transmitted to and received from the control unit 122 through the interface circuit, and the current time, current date, calendar information, and the like are displayed on the display unit 125.

The communication unit 124 has functions similar to those of a conventional mobile phone, and includes a radio unit 127, a voice processing unit 128, a switching unit 129, an amplification unit 130, a voice input / output unit 131, a telephone number input unit 132, a ring tone generation unit. 133 and a call control memory unit 134.
The radio unit 127 exchanges various data such as audio data with the base station via the antenna 135. The audio processing unit 128 encodes and decodes the audio signal input from the radio unit 127 or the amplification unit 130. The amplifying unit 130 amplifies the signal input from the audio processing unit 128 or the audio input / output unit 131 to a predetermined level. The voice input / output unit 131 includes a speaker, a microphone, and the like, and amplifies a ringtone and a received voice or collects a voice.

In addition, the ring tone generator 133 generates a ring tone in response to a call from the base station. The switching unit 129 switches the amplifying unit 130 connected to the voice processing unit 128 to the ringing tone generating unit 133 only when an incoming call is received, so that the ringing tone generated by the ringing tone generating unit 133 passes through the amplifying unit 130. To the audio input / output unit 131.
Note that the call control memory unit 134 stores a program related to incoming / outgoing call control of communication. The telephone number input unit 132 includes, for example, number keys from 0 to 9 and other keys. By pressing these number keys and the like, a telephone number of a call destination is input.

  The voltage detection unit 126 detects the voltage drop and notifies the control unit 122 when the voltage applied to each functional unit such as the control unit 122 by the power supply unit 121 falls below a predetermined value. . The predetermined voltage value at this time is a value set in advance as a minimum voltage necessary to stably operate the communication unit 124, and is, for example, about 3V. Upon receiving the voltage drop notification from the voltage detection unit 126, the control unit 122 prohibits the operations of the radio unit 127, the voice processing unit 128, the switching unit 129, and the ring tone generation unit 133. In particular, it is essential to stop the operation of the wireless unit 127 with high power consumption. Further, the display unit 125 displays that the communication unit 124 has become unusable due to insufficient battery power.

That is, the operation of the communication unit 124 can be prohibited by the voltage detection unit 126 and the control unit 122, and that effect can be displayed on the display unit 125. This display may be a text message, but as a more intuitive display, a x (X) mark may be attached to the telephone icon displayed at the top of the display surface of the display unit 125.
In addition, the function of the communication part 124 can be stopped more reliably by providing the power supply cutoff part 136 that can selectively cut off the power of the part related to the function of the communication part 124.

  According to the portable information device 120 of the present embodiment, since the piezoelectric vibrator 1 with low cost and high reliability is provided, the portable information device 120 with high cost and low reliability can be provided.

(Radio watch)
Next, an embodiment of a radio timepiece according to the present invention will be described with reference to FIG.
As shown in FIG. 19, the radio-controlled timepiece 140 according to the present embodiment includes the piezoelectric vibrator 1 electrically connected to the filter unit 141, and receives a standard radio wave including timepiece information to accurately It is a clock with a function of automatically correcting and displaying the correct time.
In Japan, there are transmitting stations (transmitting stations) that transmit standard radio waves in Fukushima Prefecture (40 kHz) and Saga Prefecture (60 kHz), each transmitting standard radio waves. Long waves such as 40 kHz or 60 kHz have both the property of propagating the ground surface and the property of propagating while reflecting the ionosphere and the ground surface, so the propagation range is wide, and the above two transmitting stations cover all of Japan. doing.

Hereinafter, the functional configuration of the radio timepiece 140 will be described in detail.
The antenna 142 receives a long standard wave of 40 kHz or 60 kHz. The long-wave standard radio wave is obtained by subjecting time information called a time code to AM modulation on a 40 kHz or 60 kHz carrier wave. The received long standard wave is amplified by the amplifier 143 and filtered and tuned by the filter unit 141 having the plurality of piezoelectric vibrators 1.
The piezoelectric vibrator 1 according to this embodiment includes crystal vibrator portions 148 and 149 having resonance frequencies of 40 kHz and 60 kHz that are the same as the carrier frequency.

Further, the filtered signal having a predetermined frequency is detected and demodulated by the detection and rectification circuit 144.
Subsequently, the time code is taken out via the waveform shaping circuit 145 and counted by the CPU 146. The CPU 146 reads information such as the current year, accumulated date, day of the week, and time. The read information is reflected in the RTC 147, and accurate time information is displayed.
Since the carrier wave is 40 kHz or 60 kHz, the crystal vibrator portions 148 and 149 are preferably vibrators having the tuning fork type structure described above.

  In addition, although the above-mentioned description was shown in the example in Japan, the frequency of the long standard wave is different overseas. For example, in Germany, a standard radio wave of 77.5 KHz is used. Therefore, when the radio timepiece 140 that can be used overseas is incorporated in a portable device, the piezoelectric vibrator 1 having a frequency different from that in Japan is required.

  According to the radio timepiece 140 of this embodiment, since the piezoelectric vibrator 1 with low cost and high reliability is provided, the radio timepiece 140 with high cost and low reliability can be provided.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

  In the embodiment, the package 9 and the manufacturing method of the package 9 of the present invention have been described by taking the piezoelectric vibrator 1 using the tuning-fork type piezoelectric vibrating piece 4 as an example. However, the above-described package 9 and the manufacturing method of the package of the present invention may be adopted for a piezoelectric vibrator using, for example, an AT-cut type piezoelectric vibrating piece (thickness sliding vibrating piece).

  In the embodiment, the piezoelectric vibrator 1 is manufactured by enclosing the piezoelectric vibrating reed 4 inside the package 9 according to the present invention. However, a device other than the piezoelectric vibrator 1 can be manufactured by enclosing an electronic component other than the piezoelectric vibrating reed 4 inside the package 9.

  In the embodiment, the through holes 30 and 31 are formed by press working, and the diameter is gradually increased from the second surface U side to the first surface L side due to the draft of the press working. . However, the through holes 30 and 31 may be formed by, for example, sandblasting. In this case, the diameters of the first openings 30L and 31L on the first surface L side and the second openings 30U and 31U on the second surface U side are substantially the same, but the positioning convex portion 7c of the present invention is applied. Thus, similarly to the embodiment, the metal pin 7 can be positioned in the radial direction of the through holes 30 and 31.

  In the embodiment, the base portion 7b is provided on the metal pin 7 and the position in the axial direction is determined by contacting the second surface U of the base substrate wafer 40. However, the position of the metal pin 7 in the axial direction is determined. The means is not limited to the base portion 7b. For example, the through holes 30 and 31 may not be formed, and a recess may be formed, and the position of the metal pin 7 in the axial direction may be determined at the bottom of the recess. Also in this case, the positioning projection 7c of the present invention is applied, and the metal pin 7 can be positioned in the radial direction of the recess as in the embodiment.

  In the first modification of the embodiment, the four positioning projections 7c are erected outward in the radial direction of the metal pin 7, but the number of positioning projections 7c is not limited to four.

DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator 2 ... Base board | substrate (1st board | substrate) 4 ... Piezoelectric vibrating piece 6 ... Glass frit (non-conductive filling member) 7 ... Metal pin 7b ... Base part 7c ... Positioning convex part 9 ... Package 30, 31 ... Through-hole 32, 33 ... Through electrode 110 ... Oscillator 120 ... Portable information device (electronic device) 123 ... Timekeeping unit 140 ... Radio timepiece 141 ... Filter part S30A ... Through electrode forming step S32 ... Through hole forming step S33 ... Metal pin placement step S35 ... Glass frit filling step (non-conductive filling member filling step) S37: Firing step (solidification step)

Claims (10)

In a package that can enclose electronic components between a plurality of substrates bonded together,
The first substrate among the plurality of substrates is:
A through hole formed so as to penetrate the inside of the first substrate and the outside of the first substrate;
A metal pin inserted through the through hole and conducting between the inside of the first substrate and the outside of the first substrate;
A non-conductive filling member that fills a gap between the through hole and the metal pin;
A package characterized in that a positioning projection for determining the relative position of the metal pin with respect to the radial direction of the through hole is provided at one end of the metal pin in the axial direction. The package of claim 1,
The said positioning convex part is formed in the end spreading shape as it goes to the said axial direction one end. The package according to claim 1 or 2,
The positioning convex portion is formed in a circular shape in a plan view in an axial direction so as to surround the periphery of the metal pin, and is formed so as to gradually increase in diameter toward one end in the axial direction. package. The package according to claim 3, wherein
The package, wherein the positioning convex portion is formed so as to gradually increase in diameter as it goes from the other end in the axial direction of the metal pin toward the one end in the axial direction. The package according to any one of claims 1 to 4,
The through hole is formed so as to gradually increase in diameter from the inside of the first substrate toward the outside of the first substrate,
The package, wherein the metal pin is inserted into the through hole in a state where the positioning convex portion is disposed inside the first substrate in the through hole. In a manufacturing method of a package capable of enclosing an electronic component between a plurality of substrates bonded to each other,
A through electrode forming step of forming a through electrode that conducts between the inside of the first substrate and the outside of the first substrate among the plurality of substrates;
The through electrode forming step includes:
A through hole forming step of forming a through hole in the first substrate;
A metal pin placement step of inserting a metal pin into the through hole;
A non-conductive filling member filling step of filling the gap between the through hole and the metal pin with a non-conductive filling member and sealing the gap;
A solidification step of solidifying the non-conductive filling member filled in the through hole;
A polishing step of polishing both main surfaces of the first substrate to expose the metal pins from both main surfaces of the first substrate;
Have
The metal pin has a base portion that closes the through hole at one end in the axial direction, and is provided at the base on the base portion side, and a positioning protrusion that determines the relative position of the metal pin with respect to the radial direction of the through hole. Part
In the metal pin placement step, when the metal pin is inserted into the through hole until the base portion contacts the first substrate, the positioning of the metal pin with respect to the radial direction of the through hole is performed by the positioning convex portion. A method of manufacturing a package, characterized in that:   A piezoelectric vibrator, wherein a piezoelectric vibrating piece is enclosed as the electronic component inside the package according to claim 1.   8. An oscillator, wherein the piezoelectric vibrator according to claim 7 is electrically connected to an integrated circuit as an oscillator.   8. An electronic apparatus, wherein the piezoelectric vibrator according to claim 7 is electrically connected to a time measuring unit.   A radio-controlled timepiece, wherein the piezoelectric vibrator according to claim 7 is electrically connected to a filter portion.

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