JP2011171570A - Circuit structure and electrical connection box - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit structure that is reduced in manufacturing cost, and to provide an electrical connection box. <P>SOLUTION: An electronic component has a first terminal 45 soldered through a first solder part 46 to a conductive path 23 formed on a top surface 18 of a circuit board 20, and also has a second terminal 47 soldered through a second solder part 48 to an exposed part 44, exposed from an opening part 25, of a conductive plate 21 arranged on a reverse-surface-19 side of the circuit board 20, wherein the thickness of the circuit board 20 is so set that a first contact surface 49 coming into contact with the first terminal 45 in a first solder part 46 and a second contact surface 50 coming into contact with the second terminal 47 in the second solder part 48 are substantially in the same level with each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit structure and an electrical junction box.

  Conventionally, the thing of patent document 1 is known as an in-vehicle electrical connection box which accommodates a circuit structure in a case. The electrical junction box is disposed between a power source and on-vehicle electrical components such as a lamp and a horn, and performs energization and disconnection on the on-vehicle electrical components.

  The circuit structure includes a circuit board having a conductive path formed on the surface thereof by a printed wiring technique, and a bus bar bonded to the back surface of the circuit board. An opening is formed in the circuit board. From this opening, the bus bar bonded to the back surface of the circuit board is exposed.

  An electronic component is mounted on the surface side of the circuit board. This electronic component is electrically connected to both the conductive path formed on the circuit board and the bus bar exposed from the opening by soldering or the like.

JP 2003-164039 A

  According to the above configuration, there is a level difference between the conductive path formed on the surface of the circuit board and the bus bar exposed from the opening of the circuit board by an amount corresponding to the thickness dimension of the circuit board and the adhesive. It will occur. For this reason, in order to electrically connect the electronic component to both the conductive path and the bus bar, an operation and a component for making the lead terminal of the electronic component correspond to the above step are required. For example, an operation of bending a lead terminal of an electronic component or a component such as a relay member having a thickness corresponding to a step is required. For this reason, there existed a problem that manufacturing cost increased by the increase in an operation process and the number of parts.

  This invention is completed based on the above situations, Comprising: It aims at providing the circuit structure body and electrical junction box with which manufacturing cost was reduced.

  The present invention is a circuit structure, a circuit board having a conductive path formed on the surface of an insulating base material having a front surface and a back surface, a conductive plate disposed on the back surface side of the circuit board, An electronic component disposed on the surface side of the circuit board and connected to both the conductive path and the conductive plate, and the circuit board has an opening penetrating the front and back, The area exposed from the opening is an exposed part, and the electronic component has a first terminal soldered to the conductive path via a first solder part, and the exposed part is The circuit board has a second terminal soldered via the second solder portion, and is defined as a sum of a thickness dimension of the base material and a thickness dimension of the conductive path. A first contact surface in contact with the first terminal of the first solder portion; A second contact surface in contact with the second terminal of the second solder section, but are set to match substantially the same height position.

  Moreover, this invention is an electrical junction box, Comprising: The said circuit structure is accommodated in a case.

  According to the present invention, the first contact surface of the first solder portion formed on the conductive path provided on the surface of the circuit board and the second portion formed on the exposed portion of the conductive plate disposed on the back surface of the circuit board. The second contact surface of the solder portion can be aligned at substantially the same height position. For this reason, the operation | work of bending the 1st terminal or 2nd terminal of an electronic component corresponding to the thickness dimension of a circuit board, etc. becomes unnecessary. Also, parts such as relay members are not necessary. As a result, the manufacturing cost can be reduced.

As embodiments of the present invention, the following embodiments are preferable.
The circuit board is formed with a board-side locking hole penetrating front and back, and the conductive plate is formed with a conductive-plate-side locking hole at a position corresponding to the board-side locking hole. The inside of the side locking hole and the conductive plate side locking hole is preferably filled with a locking member made of synthetic resin.

  According to the above aspect, the circuit board and the conductive plate are assembled by the locking member. Thereby, compared with the case where a circuit board and an electroconductive board are adhere | attached through an adhesive agent or an adhesive sheet, since an adhesion process becomes unnecessary, as a result of reducing a manufacturing man-hour, manufacturing cost can be reduced. Moreover, since an adhesive or an adhesive sheet is not required, the number of parts is reduced, and thus the manufacturing cost can be reduced.

  In addition, when the circuit board and the conductive plate are bonded using an adhesive or an adhesive sheet, the thermal expansion coefficient of the circuit board and the thermal expansion coefficient of the conductive plate are different, so that the circuit structure is warped due to a temperature change. There is a concern that According to the above aspect, the circuit board and the conductive plate are assembled by the locking member filled in the board side locking hole and the conductive plate side locking hole. Thereby, the difference between the dimensional change of the circuit board and the dimensional change of the conductive plate due to the difference in coefficient of thermal expansion is absorbed in the region where the board side locking hole and the conductive plate side locking hole are not formed. It has become so. Thereby, it can control that a circuit composition object warps.

  The circuit board has flexibility, and an edge protruding piece protruding outward is formed at an edge of the circuit board, and the edge of the circuit board corresponds to the edge protruding piece. The conductive plate is disposed in the vicinity of the position where the edge is formed, and the edge of the circuit board and the conductive plate are molded in a state where the edge protruding piece is bent toward the conductive plate. It is preferably fixed by a mold part.

  According to said aspect, since the edge protrusion piece bent in the conductive plate side functions as an anchor in an edge mold part, the edge of a circuit board and a conductive plate can be fixed reliably.

  The circuit board is flexible, and a board-side locking window penetrating the front and back of the circuit board is formed in the vicinity of the opening of the circuit board. A locking window protruding piece that protrudes inward of the board-side locking window is formed at the opening edge of the circuit board, and the back surface of the circuit board has the conductive layer in the vicinity of a position corresponding to the locking window protruding piece. A locking window mold portion in which a plate is disposed and the opening edge of the substrate side locking window and the conductive plate are molded in a state where the locking window protruding piece is bent toward the conductive plate side It is preferable that it is fixed by.

  According to the above aspect, the locking window protruding piece bent to the conductive plate side functions as an anchor in the locking window mold portion, so that the opening edge of the board-side locking window and the conductive plate are securely fixed. be able to. Since the board-side locking window is formed in the vicinity of the opening formed in the circuit board, the opening edge of the opening and the conductive plate can be prevented from peeling off.

  The substrate-side locking window is preferably formed so as to communicate with the opening.

  According to said aspect, it can suppress reliably that the opening edge of an opening part and a conductive plate peel.

  According to the present invention, the manufacturing cost of a circuit board or an electrical junction box can be reduced.

FIG. 1 is a perspective view showing an electrical junction box according to the present embodiment. FIG. 2 is a plan view showing the electrical junction box. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is an enlarged cross-sectional view showing a main part of the circuit structure. FIG. 6 is a perspective view showing a circuit board. FIG. 7 is a perspective view showing a conductive plate. FIG. 8 is a perspective view showing a state in which a conductive plate is laminated on the back surface of the circuit board. FIG. 9 is a perspective view showing a state where the circuit board and the conductive plate are molded from the front side. FIG. 10 is a perspective view showing a state where the circuit board and the conductive plate are molded from the back side. FIG. 11 is a perspective view showing a state in which the edge protruding piece and the locking window protruding piece are bent to the back surface side. FIG. 12 is a perspective view showing a state in which the semiconductor relay is mounted on the surface of the circuit board. FIG. 13 is a perspective view showing a state in which a pedestal is provided on the surface of the circuit board. FIG. 14 is a perspective view showing a state in which the circuit structure is housed inside the case body.

  An embodiment of the present invention will be described with reference to FIGS. The electrical junction box 10 according to the present embodiment is configured by housing a circuit structure 12 in a case 11 made of synthetic resin. The electrical junction box 10 is mounted on a vehicle (not shown) and is disposed between a power source (not shown) and in-vehicle electrical components (not shown) such as a lamp and a horn. The electrical junction box 10 performs energization and disconnection on the on-vehicle electrical components. In the following description, the upper side in FIG. 3 will be described as the front side or the upper side, and the lower side in FIG. 3 will be described as the back side or the lower side.

(Case 11)
As shown in FIG. 3, the case 11 includes a case main body 13 that opens to the front side (upper side in FIG. 3), and a cover 14 that closes the opening of the case main body 13 from the front side. As shown in FIG. 4, a lock portion 15 that protrudes outward is formed on the outer side surface of the side wall of the case body 13. A lock receiving portion 16 that is elastically deformable at a position corresponding to the lock portion 15 is formed on the side wall of the cover 14. When the lock part 15 and the lock receiving part 16 are elastically engaged, the case main body 13 and the cover 14 are assembled together.

  As shown in FIG. 1, a plurality of (three in this embodiment) connectors that open upward (upward in FIG. 1) and can be fitted with mating connectors (not shown) are formed on the upper wall of the cover 14. A portion 17 is formed.

(Circuit structure 12)
As shown in FIG. 3, the circuit structure 12 is disposed on the circuit board 20 in which the conductive path 23 is formed on the surface of the base material 51 having the front surface 18 and the back surface 19, and on the back surface 19 side of the circuit board 20. A single conductive plate 21. A plurality of semiconductor relays 22 (corresponding to the electronic components described in the claims) are mounted on the surface 18 of the circuit board 20.

(Circuit board 20)
As shown in FIG. 6, the circuit board 20 has a substantially rectangular shape. A conductive path 23 is formed on the surface 18 of the circuit board 20 by a printed wiring technique. The circuit board 20 in the present embodiment is formed by forming a conductive path 23 having a thickness dimension of 10 μm to 100 μm on the surface 18 of the base material 51 having a thickness dimension of 10 μm to 100 μm. Further, the conductive path 23 may be formed on both the front surface 18 and the back surface 19 of the substrate 51. By setting the thickness dimension of the base material 51 in the above range, the circuit board 20 in the present embodiment has flexibility. Further, although not shown in detail, the circuit board 20 may be coated with an arbitrary insulating material such as a solder resist so as to cover the base material 51 and the conductive path 23, and a cover burley film or the like. Any insulating material may be attached as necessary.

  As shown in FIG. 6, a plurality of edge protruding pieces 24 protruding outward are formed on the edge of the circuit board 20. The circuit board 20 has a plurality of openings 25 penetrating the front and back. The opening edge of the opening 25 has a substantially rectangular shape. In the circuit board 20, a board side locking window 26 penetrating the front and back of the circuit board 20 is formed in the vicinity of the opening 25. In the present embodiment, among the board-side locking windows 26, the board-side locking window 26 located near the center in the direction from the right front side to the left back side in FIG. 6 is formed between the two openings 25. The other board side locking window 26 is formed in communication with the opening 25.

  A pair of locking window protruding pieces 27 protruding inward of the substrate side locking window 26 are formed at the opening edge of the substrate side locking window 26.

  The circuit board 20 has a plurality of through holes 28 formed therein. As shown in FIGS. 3 and 4, the through hole 28 has a lower end portion of a rod-shaped terminal fitting 29 penetrating through it and is electrically connected to the conductive path 23 of the circuit board 20 by soldering. The terminal fitting 29 is held by the pedestal 30 while being penetrated by the pedestal 30 made of synthetic resin. An upper end portion of the terminal fitting 29 is arranged inside a connector portion 17 formed on the cover 14.

  As shown in FIG. 6, the circuit board 20 is formed with a plurality of board-side locking holes 31 penetrating the front and back at positions near the board-side locking window 26 described above. The cross-sectional shape of the substrate side locking hole 31 is circular.

  As shown in FIG. 6, at two corners of the circuit board 20, bolt insertion holes 33 </ b> A through which bolts 32 are inserted when the circuit component 12 is screwed to the case main body 13 are formed on the circuit board 20. It is formed through the front and back.

(Conductive plate 21)
As shown in FIG. 7, the conductive plate 21 is formed by pressing a metal plate material into a predetermined shape. The conductive plate 21 has a substantially rectangular shape, is substantially the same shape as the circuit board 20, and is formed slightly larger. At the edge of the conductive plate 21, a notch 34 is formed at a position corresponding to the edge protruding piece 24 of the circuit board 20 in a state where the circuit board 20 and the conductive plate 21 are laminated.

  In the state where the circuit board 20 and the conductive plate 21 are laminated on the conductive plate 21, the conductive plate side latch that penetrates the front and back of the conductive plate 21 at a position corresponding to the latching window protruding piece 27 of the circuit board 20. A window 35 is formed. The shape of the opening edge of the conductive plate side locking window 35 is substantially rectangular. The conductive plate 21 corresponds to the board-side locking hole 31 of the circuit board 20 in the vicinity of the conductive-plate-side locking window 35 in a state where the circuit board 20 and the conductive board 21 are laminated. A conductive plate-side locking hole 36 is formed at a position where it is to be performed. The cross-sectional shape of the conductive plate side locking hole 36 is circular. The inner diameter of the conductive plate side locking hole 36 is set smaller than the inner diameter of the board side locking hole 31.

  Further, in the conductive plate 21, the circuit board 20 and the conductive plate 21 are laminated, and the through hole 28 is positioned at a position corresponding to the region where the plurality of through holes 28 formed in the circuit board 20 are formed. An escape hole 37 for avoiding contact between the inserted terminal fitting 29 and the conductive plate 21 is formed through the front and back of the conductive plate 21.

  Further, as shown in FIG. 7, in the conductive plate 21, the circuit board 20 and the conductive plate 21 are stacked at a position near the edge on the left front side in FIG. An input through-hole 38 through which the input terminal fitting 39 inserted through the through hole 28 is inserted is formed at a position corresponding to 28. When the input through hole 38 and the input terminal fitting 39 are soldered, the conductive plate 21 is electrically connected to the power source via the input terminal fitting 39.

  Further, as shown in FIG. 7, the conductive plate 21 penetrates the conductive plate 21 in the front and back direction at a position corresponding to the bolt insertion hole 33 </ b> A formed in the circuit substrate 20 in a state of being laminated with the circuit substrate 20. A bolt insertion hole 33B is formed.

(Mold member)
As shown in FIGS. 9 and 10, the circuit board 20 and the conductive plate 21 are integrally assembled by molding with a synthetic resin material in a state where both members are laminated. As the synthetic resin material, a thermosetting resin such as an epoxy resin, or a thermoplastic resin such as polyethylene, polypropylene, polybutylene terephthalate, or polyethylene terephthalate can be used.

  As shown in FIG. 9, at the four edges of the circuit board 20 and the conductive plate 21, an edge mold part 40 made of synthetic resin is formed to cover the edges of both members. As shown in FIG. 4, the surface of the edge mold part 40 is formed substantially flush with the surface 18 of the circuit board 20. The back side of the edge mold part 40 is formed so as to protrude downward from the back surface of the conductive plate 21 and is formed so as to cover the end of the conductive plate 21. In the edge mold part 40, the edge protrusion piece 24 of the circuit board 20 is fixed in a state of being bent toward the conductive plate 21 side. Thereby, peeling of the edge of the circuit board 20 and the edge of the conductive plate 21 is suppressed.

  A synthetic resin-made locking window mold portion 41 is formed at a position corresponding to the locking window protruding piece 27 of the circuit board 20 and at a position corresponding to the conductive plate side locking window 35 of the conductive plate 21. Has been. The surface of the locking window mold part 41 is formed so as to be at the same height position or a slightly lower height position than the surface 18 of the circuit board 20. In the locking window mold part 41, the locking window protruding piece 27 of the circuit board 20 is fixed in a state of being bent toward the conductive plate 21 side. Thereby, it is suppressed that the opening edge of the board | substrate side latching window 26 formed in the circuit board 20 and the electrically conductive board 21 peel. Since this board | substrate side latching window 26 is formed in the vicinity of the opening part 25, it can suppress that the opening edge of the opening part 25 and the electrically conductive board 21 peel. Furthermore, since the board-side locking window 26 and the opening 25 are formed in communication with each other, the opening edge of the opening 25 can be further suppressed from peeling off from the conductive plate 21.

  FIG. 11 shows a state in which the edge protruding piece 24 and the locking window protruding piece 27 are bent to the conductive plate 21 side in the circuit board 20. When the circuit board 20 and the conductive plate 21 are fixed by molding, the protruding pieces 24 and 27 are fixed in the mold portions 40 and 41 in the posture shown in FIG. Since the projecting pieces 24 and 27 are bent and fixed in the mold parts 40 and 41, the circuit board 20 and the conductive plate 21 are more firmly fixed.

  As shown in FIG. 9, in the state where the circuit board 20 and the conductive plate 21 are laminated, the board-side locking holes 31 and the conductive plate-side locking holes 36 are provided with locking members 42 made of synthetic resin. Is filled. As described above, since the inner diameter of the board-side locking hole 31 is larger than the inner diameter of the conductive plate-side locking hole 36, the locking member 42 filled in both the locking holes is prevented from coming off. It is like that. The surface of the locking member 42 is substantially flush with the surface 18 of the circuit board 20.

  Since the board-side locking hole 31 is formed in the vicinity of the locking window protruding piece 27, the opening edge of the opening 25 formed in the circuit board 20 and the conductive plate 21 are further suppressed from peeling off. It is like that.

  As shown in FIG. 10, on the back side of the conductive plate 21, the locking member 42 and the locking window mold part 41 are integrally formed, and adjacent locking window mold parts 41 are also connected to the connecting part 43. It is integrally formed via Thereby, the opening edge of the opening part 25 formed in the circuit board 20 and the conductive plate 21 can be more firmly fixed.

(Assembly structure to case 11)
As shown in FIG. 13, the above-described pedestal 30 is disposed on the surface of the circuit structure 12 (the upper surface in FIG. 13). The pedestal 30 is substantially L-shaped, and a bolt insertion hole 33C penetrating in the front and back direction (vertical direction in FIG. 13) is formed at both ends. In a state where the pedestal 30 is disposed in the circuit component 12, the circuit board 20, the conductive plate 21, and the bolt insertion holes 33A, 33B, and 33C formed in the pedestal 30 are aligned.

  As shown in FIG. 14, the bolt 32 is inserted into the bolt insertion holes 33 </ b> A, 33 </ b> B, 33 </ b> C of the pedestal 30, the circuit board 20, and the conductive plate 21 in a state where the circuit component 12 is accommodated in the case body 13. Then, the bolts 32 are screwed onto the bottom wall of the case body 13, whereby the circuit component 12 is assembled to the case body 13.

(Connection structure of semiconductor relay 22)
Now, as shown in FIG. 5, the region located in the opening 25 formed in the circuit board 20 on the surface of the conductive plate 21 is exposed portion 44 exposed from the opening 25 to the front side (upper side in FIG. 5). It is said. Further, a conductive path 23 is formed in the circuit board 20 in the vicinity of the opening 25.

  A semiconductor relay 22 is disposed above the opening 25 on the surface 18 side of the circuit board 20. The semiconductor relay 22 has a flat block shape.

  From the side wall of the semiconductor relay 22, a first terminal 45 that protrudes laterally and is soldered to the conductive path 23 formed on the circuit board 20 is formed. In the present embodiment, the semiconductor relay 22 is formed with a plurality of first terminals 45. The back surface of the first terminal 45 is formed flush with the back surface of the semiconductor relay 22. In the present embodiment, the first terminal 45 includes a control terminal for controlling on / off of the semiconductor relay 22 and a power terminal for outputting power from the semiconductor relay 22. The first terminal 45 is soldered via the conductive path 23 of the circuit board 20 and the first solder part 46.

  A second terminal 47 to be soldered to the exposed portion 44 of the conductive plate 21 is embedded on the back surface of the semiconductor relay 22. The back surface of the second terminal 47 is exposed from the back surface of the semiconductor relay 22. The back surface of the second terminal 47 is formed flush with the back surface of the semiconductor relay 22. The second terminal 47 is soldered via the exposed portion 44 of the conductive plate 21 and the second solder portion 48. Thereby, the second terminal 47 is electrically connected to the power supply via the conductive plate 21. As a result, in the present embodiment, the second terminal 47 is an input terminal for inputting electric power to the semiconductor relay 22.

  With the above configuration, the electrical resistance value on the input side can be reduced as compared with the case where the second terminal 47 is connected to, for example, the conductive path 23 formed on the surface of the circuit board 20 by the printed wiring technique. As a result, the heat generation from the wiring on the input side can be reduced, so that the heat generation of the circuit component 12 can be reduced.

  Moreover, since the semiconductor relay 22 is directly connected to the conductive plate 21 by the above configuration, the heat generated from the semiconductor relay 21 when energized can be transmitted to the conductive plate 21. Since the conductive plate 21 is made of metal, the heat transmitted to the conductive plate 21 is quickly dispersed in the conductive plate 21. Since the conductive plate 21 is singular and has substantially the same shape as the circuit board 20, the heat transferred to the conductive plate 21 is quickly dispersed in a region having substantially the same area as the circuit board 20. As described above, the heat generated in the semiconductor relay 21 can be efficiently released to the conductive plate 21, so that the heat dissipation of the circuit structure 12 can be increased as a whole.

  The step of providing the first solder portion 46 and the second solder portion 48 for the conductive path 23 of the circuit board 20 and the exposed portion 44 of the conductive plate 21 can be performed by a known technique such as screen printing. As described above, the surfaces of the edge mold part 40, the locking window mold part 41, and the locking member 42 are set to be substantially flush with or slightly lower than the surface 18 of the circuit board 20. Therefore, the screen printing process can be easily performed.

  Soldering of the first terminal 45 and the conductive path 23 and soldering of the second terminal 47 and the exposed portion 44 are performed by a known method such as reflow soldering. The thickness T of the circuit board 20 is such that the first contact surface 49 of the first terminal 45 that contacts the first solder portion 46 and the second contact surface 50 of the second terminal 47 that contacts the second solder portion 48. Are set so as to be aligned at substantially the same height position.

  The thickness dimension T of the circuit board 20 is defined as the sum of the thickness dimension of the base material 51 and the thickness dimension of the conductive path 23.

(Manufacturing process)
Then, an example of the manufacturing process of the electrical junction box 10 which concerns on this embodiment is shown. First, the conductive path 23 is formed on the surface 18 of the circuit board 20 and cut into a predetermined shape. On the other hand, the conductive plate 21 is formed into a predetermined shape by pressing a metal plate material.

  Next, as shown in FIG. 8, a conductive plate 21 is laminated on the back surface 19 of the circuit board 20. In a state in which the circuit board 20 and the conductive plate 21 are laminated, the circuit board 20 and the conductive plate 21 are molded with a synthetic resin to be integrated (see FIGS. 9 and 10).

  Next, the first solder portion 46 is formed on the surface of the conductive path 23 formed on the circuit board 20 by screen printing, and the second solder portion 48 is formed on the surface of the exposed portion 44. Thereafter, the semiconductor relay 22 is disposed so as to cover the upper portion of the opening 25 of the circuit board 20, and the first terminal 45 and the second terminal 47 of the electronic component are respectively connected to the circuit board 20 by reflow soldering. The conductive path 23 and the exposed portion 44 of the conductive plate 21 are soldered.

  Thereafter, a pedestal 30 through which the terminal fitting 29 is penetrated is disposed on the surface 18 of the circuit board 20, and the terminal fitting 29 is inserted into the through hole 28 of the circuit board 20 by flow soldering or the like. 29 and the conductive path 23 of the circuit board 20 are electrically connected. Thereafter, the circuit component 12 is accommodated inside the case main body 13, the bolt 32 is inserted into the bolt insertion holes 33 </ b> A, 33 </ b> B, 33 </ b> C and screwed into the case main body 13. And fix. Subsequently, the electrical junction box 10 is completed by assembling the case body 13 and the cover 14 together.

(Function, effect)
Then, the effect | action and effect of the electrical junction box 10 which concern on this embodiment are demonstrated. According to this embodiment, the conductive plate 21 disposed on the first contact surface 49 of the first solder portion 46 formed on the conductive path 23 provided on the front surface 18 of the circuit board 20 and the back surface 19 of the circuit board 20. The second contact surface 50 of the second solder portion 48 formed on the exposed portion 44 can be aligned at substantially the same height position. Thereby, the manufacturing cost of the circuit structure 12 and the electrical junction box 10 can be reduced.

  If it demonstrates in detail below, first, the 1st solder part 46 will be in a molten state by being heated in a soldering process. The first solder portion 46 in a molten state is positioned in the gap between the first terminal 45 and the conductive path 23. The second solder portion 48 is also positioned in the gap between the second terminal 47 and the exposed portion 44 in the soldering process. As shown in FIG. 5, the distance between the surface of the conductive path 23 and the surface of the exposed portion 44 corresponds to the sum of the thickness dimension T of the circuit board 20 and the thickness dimension of the conductive path 23.

  If the thickness dimension T of the circuit board 20 is a relatively large value, the distance between the second terminal 47 and the exposed portion 44 also increases. For this reason, it is considered that the surface of the second solder portion 48 is separated from the back surface of the second terminal 47. Then, in order to narrow the gap between the second terminal 47 and the exposed portion 44, for example, a relay member is interposed between the second terminal 47 and the exposed portion 44, or the first terminal 45 is bent. Therefore, it is necessary to narrow the distance between the second terminal 47 and the exposed portion 44. Thus, when the thickness dimension T of the circuit board 20 is a relatively large value, the work of soldering the semiconductor relay 22 to both the conductive path 23 and the exposed portion 44 is performed by the number of parts and the number of work steps. There is a concern that it will increase.

  In view of the above points, in the present embodiment, the thickness dimension T of the circuit board 20 is set so that the first contact surface 49 of the first solder portion 46 and the second contact surface 50 of the second solder portion have substantially the same height. The first solder portion 46 is located in the gap between the first terminal 45 and the conductive path 23 and the second solder portion 48 is located in the gap between the second terminal 47 and the exposed portion 44 by setting so as to match the vertical position. Can be located. This eliminates the need for a work such as bending the first terminal 45 of the electronic component in accordance with the thickness dimension of the circuit board 20. Also, parts such as relay members are not necessary. As a result, it is possible to reduce the number of parts and work man-hours when soldering the semiconductor relay 22 to the conductive path 23 and the exposed portion 44, thereby reducing the manufacturing cost of the circuit component 12 and the electrical junction box 10. Can be made.

  Furthermore, according to the present embodiment, the circuit board 20 and the conductive plate 21 are assembled by the locking member 42. Thereby, compared with the case where the circuit board 20 and the electroconductive board 21 are adhere | attached through an adhesive agent or an adhesive sheet, since an adhesion | attachment process becomes unnecessary, as a result of a manufacturing man-hour being reduced, manufacturing cost can be reduced. Moreover, since an adhesive or an adhesive sheet is not required, the number of parts is reduced, and thus the manufacturing cost can be reduced.

  In addition, when the circuit board 20 and the conductive plate 21 are bonded using an adhesive or an adhesive sheet, the circuit board 20 and the conductive plate 21 have different coefficients of thermal expansion. There is a concern that the structure 12 is warped. According to the above aspect, the circuit board 20 and the conductive plate 21 are assembled by the locking members 42 filled in the board-side locking holes 31 and the conductive plate-side locking holes 36. As a result, the difference between the dimensional change of the circuit board 20 and the dimensional change of the conductive plate 21 caused by the difference in coefficient of thermal expansion is not formed in the board-side locking hole 31 in the circuit board 20. The region and the conductive plate 21 are absorbed in the region where the conductive plate side locking hole 36 is not formed. Thereby, it can suppress that the circuit structure 12 warps by a temperature change.

  In addition, according to the present embodiment, the edge protruding piece 24 bent toward the conductive plate 21 functions as an anchor in the edge mold portion 40, so that the edge of the circuit board 20 and the conductive plate 21 can be securely connected. Can be fixed.

  Further, as described above, the semiconductor relay 22 is soldered to the conductive path 23 formed near the opening 25 and the exposed portion 44 exposed from the opening 25. For this reason, when the opening edge of the opening part 25 peels from the conductive plate 21, there is a concern that the connection reliability of the semiconductor relay 22 is lowered. According to the present embodiment, the locking window protruding piece 27 bent to the conductive plate 21 side functions as an anchor in the locking window mold portion 41, so that the opening edge of the substrate side locking window 26 and the conductive plate 21 Can be securely fixed. Since the board-side locking window 26 is formed in the vicinity of the opening 25 formed in the circuit board 20, it is possible to prevent the opening edge of the opening 25 and the conductive plate 21 from peeling off. As a result, the connection reliability between the semiconductor relay 22 and the circuit board 20 can be improved.

  Further, according to the present embodiment, the board-side locking window 26 is formed in communication with the opening 25. Thereby, it can suppress reliably that the opening edge of the opening part 25 and the electrically-conductive board 21 peel.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In this embodiment, the locking member 42 is formed by molding. However, the present invention is not limited to this, and the locking member 42 formed in advance is connected to the board-side locking hole 31 and the conductive plate side. It is good also as a structure press-fitted in the stop hole 36. Further, the locking member 42 formed in advance is loosely inserted, and the inner wall surfaces of the locking member 42, the board-side locking hole 31 and the conductive plate-side locking hole 36 are obtained by heating, pressing and crushing both ends. It is good also as a structure which contacts.
(2) In the present embodiment, the second terminal 47 is formed on the bottom surface of the semiconductor relay 22. However, the present invention is not limited to this, and the second terminal 47 may be formed to protrude from the side surface of the semiconductor relay 22.
(3) The circuit board 20 and the conductive plate 21 may be bonded via an adhesive or an adhesive sheet, or may be fixed by screwing, and fixed by any means as necessary. Can do.
(4) The edge of the circuit board 20 and the conductive plate 21 may be configured to be fixed via an adhesive or an adhesive sheet, and may be fixed by screwing. It can be fixed by means.
(5) In the present embodiment, the semiconductor relay 22 is used as an electronic component. However, the present invention is not limited to this, and any electronic component such as a mechanical relay, resistor, capacitor, or the like may be used as necessary. Can do.
(6) In the present embodiment, the circuit board 20 is configured to have flexibility. However, the circuit board 20 is not limited thereto, and the circuit board 20 having no flexibility may be used.
(7) The circuit component 12 and the case 11 may be integrally formed by molding the circuit component 12 with a synthetic resin.
(8) In the present embodiment, the conductive path 23 formed on the surface 18 of the circuit board 20 is formed by a printed wiring technique. However, the present invention is not limited to this. For example, a metal is formed on the surface 18 of the circuit board 20. It can be formed by any method as required, such as by attaching a plate material.
(9) In the present embodiment, a single conductive plate 21 is laminated on the circuit board 20. However, the present invention is not limited to this, and the circuit board 20 includes a plurality of conductive plates pressed into a predetermined shape. It is good also as a structure by which the board 21 is arrange | positioned along with the mutually spaced apart.

DESCRIPTION OF SYMBOLS 10 ... Electrical junction box 12 ... Circuit structure 13 ... Case main body (Case 11)
14 ... Cover (Case 11)
DESCRIPTION OF SYMBOLS 18 ... Front surface 19 ... Back surface 20 ... Circuit board 21 ... Conductive plate 22 ... Semiconductor relay (electronic component)
DESCRIPTION OF SYMBOLS 23 ... Conductive path 24 ... Edge protrusion piece 25 ... Opening part 26 ... Board | substrate side latching window 27 ... Locking window protrusion piece 31 ... Board | substrate side latching hole 36 ... Conductive board side latching hole 40 ... Edge mold part 41 ... Locking window mold part 42 ... Locking member 44 ... Exposed part 45 ... First terminal 46 ... First solder part 47 ... Second terminal 48 ... Second solder part 49 ... First contact surface 50 ... Second contact surface 51 ... Base material T ... Thickness dimensions of circuit board

Claims (6)

A circuit board having a conductive path formed on the surface of an insulating base material having a front surface and a back surface, a conductive plate disposed on the back surface side of the circuit board, and the conductive material disposed on the front surface side of the circuit board An electronic component connected to both the path and the conductive plate,
The circuit board is formed with an opening penetrating the front and back, a region of the conductive plate exposed from the opening is an exposed portion, and the electronic component is first with respect to the conductive path. Having a first terminal soldered via a solder part and having a second terminal soldered to the exposed part via a second solder part;
The thickness dimension of the circuit board, which is defined as the sum of the thickness dimension of the base material and the thickness dimension of the conductive path, is a first contact surface that contacts the first terminal of the first solder portion. The circuit structure which is set so that the second contact surface which contacts the second terminal in the second solder portion is aligned at substantially the same height position. The circuit board is formed with a board-side locking hole penetrating front and back, and the conductive plate is formed with a conductive-plate-side locking hole at a position corresponding to the board-side locking hole. The circuit structure according to claim 1, wherein the side locking hole and the conductive plate side locking hole are filled with a synthetic resin locking member. The circuit board has flexibility, and an edge protruding piece protruding outward is formed at an edge of the circuit board, and the edge of the circuit board corresponds to the edge protruding piece. The conductive plate is disposed in the vicinity of the position where the edge is formed, and the edge of the circuit board and the conductive plate are molded in a state where the edge protruding piece is bent toward the conductive plate. The circuit structure according to claim 1 or 2, wherein the circuit structure is fixed by a mold part. The circuit board is flexible, and a board-side locking window penetrating the front and back of the circuit board is formed in the vicinity of the opening of the circuit board. A locking window protruding piece that protrudes inward of the board-side locking window is formed at the opening edge of the circuit board, and the back surface of the circuit board has the conductive layer in the vicinity of a position corresponding to the locking window protruding piece. A locking window mold portion in which a plate is disposed and the opening edge of the substrate side locking window and the conductive plate are molded in a state where the locking window protruding piece is bent toward the conductive plate side The circuit structure as described in any one of Claim 1 thru | or 3 currently fixed by. The circuit structure according to claim 4, wherein the board-side locking window is formed to communicate with the opening. An electrical junction box comprising the circuit component according to any one of claims 1 to 5 accommodated in a case.

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