JP2011168312A - Method of packing resin plate and packed product - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of packing a resin plate that can prevent the resin plate from absorbing moisture during storage or transportation, and a packed product packed by the packing method. <P>SOLUTION: A stacked article 6 is formed on a lower moisture-proof sheet 4 by stacking a plurality of resin plates 5 one by one on top of the resin plate 5 at the bottom layer, and a moisture-proof sheet 7 is mounted thereon to cover the entire main surface 51 of the resin plate 5 at the top layer. Thereafter, a stretch film 3 laid under the moisture-proof sheet 4 is wrapped around a side surface 61 of the stacked article 6 and the moisture-proof sheets 4 and 7 as a whole to prevent collapsing of the stacked article 6 and the moisture-proof sheets 4 and 7. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for packing water-absorbing resin plates and a package packed by the method.

  A linear light source or a point light source is mainly used for a backlight of a liquid crystal display device. In order to spread the light emitted by these light sources uniformly over the entire screen, a resin plate called a light diffusion plate or a light guide plate is used. For example, a light guide plate that takes in light emitted from a light source from an end surface and emits light uniformly is used for an edge light type backlight (see, for example, Patent Document 1).

  However, since a resin plate with water absorption absorbs ambient moisture (moisture) during storage or transportation, the resin plate may be warped or waved due to moisture absorption. When resin plates are used in small screen devices, it does not matter much if warping or undulation occurs, but in recent years when the size of liquid crystal display devices has increased, warping and undulation of resin plates have become a display characteristic of screens. There are problems that have an adverse effect.

  Although it is not a technique aimed at preventing moisture absorption of a resin plate, for example, a packaging method is known in which the surface of a hygroscopic photosensitive laminated film wound in a roll is covered with a desiccant film laminated with aluminum. (For example, refer to Patent Document 2).

JP 2001-342263 A JP 2002-347714 A

However, the roll-shaped hygroscopic film packaging method is not suitable for any application, and a technique for preventing moisture absorption of the resin plate has not yet been established. For this reason, it is desired to prevent moisture absorption of the resin plate during storage or transportation.
An object of the present invention is to provide a method for packing a resin plate that can prevent moisture absorption of the resin plate during storage and transportation, and a package packed by the packing method.

  In order to achieve the above-described object, the resin plate packing method of the present invention is the entire upper surface and / or the lowermost main surface of the resin plate with respect to an object to be packed consisting of a plurality of laminated resin plates. A sheet installation step of installing a moisture-proof sheet so as to cover the package, and a packing step of packing the packaged object by fixing the laminated resin plates with a load collapse prevention tool.

  According to this method, since the entire main surface of the uppermost stage and / or the lowermost stage is covered with the moisture-proof sheet, the packaged item (resin plate) is placed in a humid environment when the packaged item is stored or transported. Even before, moisture can be absorbed by the moisture-proof sheet before it reaches the article to be packed (laminated product of resin plates). Therefore, since the elongation of the resin plate due to moisture absorption can be suppressed, it is possible to suppress the occurrence of warpage and undulation due to the elongation. In addition, when a plurality of resin plates are laminated in contact with each other and they are fixed with a load collapse prevention device, when the uppermost and / or lowermost resin plates extend due to moisture absorption, the resin plates in contact with them In some cases, scratches may be generated due to friction between them. In the present invention, such scratches can be prevented.

  The sheet installation step may be executed either before or after the packing step. That is, after installing a moisture-proof sheet so as to be in contact with the entire main surface of the uppermost and / or lowermost resin plate in the package, the package and moisture-proof sheet may be fixed together with a load collapse prevention tool. Good. Moreover, you may install a moisture-proof sheet | seat after fixing a to-be-packaged item with a load collapse prevention tool.

In the sheet installation step, it is preferable that the moisture-proof sheet is further installed so as to cover a side surface of the packed object.
The side surface of the object to be packed is a surface in which the end surfaces of the individual resin plates are gathered, and the exposed area (area of the end surface) per one resin plate is small. Therefore, even if it is exposed to some moisture, the upper surface (the main surface of the uppermost resin plate) and the lower surface (the main surface of the lowermost resin plate) are exposed to moisture compared to the case where one resin plate is exposed. The impact is small. However, if the side surface of the object to be packed is covered with a moisture-proof sheet as in this method, moisture absorption of the resin plate can be reliably prevented.

In the resin plate packing method of the present invention, the resin plate may be a methacrylic resin plate, and the water absorption rate of the resin plate may be 0.2 to 2.0%. When the water absorption rate of the resin plate is within this range, the resin plate easily absorbs moisture, so that the effect when the present invention is applied is great.
Further, in the resin plate packing method of the present invention, the thickness of one resin plate constituting the packaged object may be 1 mm to 8 mm, and the planar size of one resin plate is 800 mm × 800 mm to 1400 mm × 1400 mm. It may be. When the planar size of one resin plate is within this range, the effect of applying the present invention is great because the influence of warpage of the resin plate due to moisture absorption is large. Furthermore, the thickness of the article to be packed in the resin plate stacking direction (the total thickness of the plurality of resin plates) may be 2 mm to 1000 mm.

Moreover, according to the package of this invention, since it packs with the said packaging method of a resin board, a high quality resin board with few curvature and a wave | undulation can be provided.
In the package of the present invention, the resin plate is warped by the size of the gap between the center of each yarn and the resin plate, and the yarn is stretched one by one in the vertical direction and the left-right direction with the resin plate standing. Is preferably 5 mm or less with respect to the uppermost resin plate after storage for one and a half months in an environment of 25 ° C. ± 5 ° C. and 60% ± 20% RH.

According to the method for packing a resin plate of the present invention, even when the packaged item (resin plate) is placed in a humid environment during storage or transportation of the packaged item, the moisture remains in the packaged item (lamination of the resin plates). Before reaching the product), it can be absorbed by a moisture-proof sheet. Therefore, since the elongation of the resin plate due to moisture absorption can be suppressed, it is possible to suppress the occurrence of warpage and undulation due to the elongation.
Moreover, according to the package of this invention, since it packs with the said packaging method of a resin board, a high quality resin board with few curvature and a wave | undulation can be provided.

FIG. 1A is a view for explaining a packing method according to an embodiment of the present invention. FIG. 1B is a diagram for explaining the next operation after FIG. 1A. FIG. 1C is a diagram for explaining the next operation after FIG. 1B. FIG. 1D is a diagram for explaining the next operation after FIG. 1C. FIG. 1E is a diagram for explaining the next operation after FIG. 1D. FIG. 1F is a diagram for explaining the next operation after FIG. 1E. FIG. 1G is a diagram for explaining the next operation after FIG. 1F. FIG. 1H is a diagram for explaining the next operation after FIG. 1G. 2A and 2B are views for explaining a method of measuring the warpage of the resin plate, in which FIG. 2A is a front view of the resin plate, and FIG. 2B is a left side surface of the resin plate. Each figure is shown. Drawing 3 is a figure for explaining the 1st modification of the packing method concerning one embodiment of the present invention. FIG. 4 is a view for explaining a second modification of the packing method according to the embodiment of the present invention.

1A to 1H are views for explaining a packing method according to an embodiment of the present invention in the order of work.
In this packing method, first, as shown in FIG. 1A, one rectangular cardboard 2 for shock buffering is laid on a rectangular pallet 1 so that the four corners thereof and the four corners of the pallet 1 are aligned. As the pallet 1, various pallets such as resin and wood can be applied. The plane size of the corrugated board 2 is not particularly limited, but preferably the same plane size as that of the pallet 1 is used.

Next, as shown in FIG. 1B, one stretch film 3 (for example, a polyethylene film) as a load collapse prevention tool is laid on the cardboard 2.
Next, as shown in FIG. 1C, one rectangular moisture-proof sheet 4 (lower moisture-proof sheet 4) is laid on the stretch film 3. The moisture-proof sheet 4 preferably has a water vapor permeability measured by the MOCON method of 2.0 g to 10.0 g / m ² · in consideration of being able to cope with any surrounding environment (temperature / humidity). A sheet of 24 hr, more preferably 5.0 g to 7.0 g / m ² · 24 hr is applied. Specifically, an aluminum sheet having a water vapor permeability in the above range can be applied. Moreover, the thickness of the moisture-proof sheet | seat 4 is 0.3-5.0 mm, for example, Preferably, it is 0.5-2.0 mm. Moreover, the planar size (size of the main surface) of the moisture-proof sheet 4 is slightly larger than the planar size of the resin plate 5 described later.

  Next, as shown in FIG. 1D, a plurality of rectangular resin plates 5 are laminated on the moisture-proof sheet 4 one by one. First, the lowermost resin plate 5 is placed in contact with the moisture-proof sheet 4 so that the four corners of the resin plate 5 are aligned with the four corners of the moisture-proof sheet 4, the second step, the third step, and so on. As shown in FIG. 1E, as a packaged object in which a plurality of resin plates 5 are laminated as a whole, the four corners are aligned in a similar manner (so that the peripheral edges are aligned). A rectangular parallelepiped laminate 6 is formed. The number of laminated resin plates 5 is, for example, 50 to 400, preferably 100 to 300, in order to make the total weight of the laminated product 6 less than 1000 kg and facilitate transportation. In addition, in FIG. 1D-FIG. 1H, in order to make it easy to illustrate, the number of the resin plates 5 is about ten.

  In addition, the thickness t of one resin plate 5 is, for example, 0.05 mm to 10.0 mm, preferably 1 mm to 8 mm, and more preferably 1 mm to 4 mm. Moreover, the thickness T (thickness in the stacking direction of the resin plates 5) of the laminate 6 formed by stacking the resin plates 5 is, for example, 2 mm to 1000 mm. Moreover, the planar size (size of the main surface 51) of the resin board 5 is 800 mm x 800 mm-1400 mm x 1400 mm, for example. That is, the length l is 800 mm to 1400 mm and the width w is 800 mm to 1400 mm. For example, 800 mm × 1000 mm and 1200 mm × 900 mm are also included in the above range. When the planar size of one resin plate 5 is within the above range, the effect of the warping of the resin plate 5 due to moisture absorption is large, so the effect when this packing method is applied is great. Further, the main surface 51 of the resin plate 5 may be a smooth surface, or an uneven surface that has been subjected to surface processing (for example, embossing, uneven surface processing, etc.).

Moreover, as the resin plate 5 laminated | stacked, the resin plate used as a light-guide plate material of a liquid crystal display device, for example, a methacryl resin plate etc. are mentioned specifically ,.
The methacrylic resin is, for example, a polymer obtained by polymerizing a monomer containing methyl methacrylate as a main component, specifically, a monomer containing 50% by mass or more of methyl methacrylate, and methyl methacrylate alone It may be a polymethyl methacrylate obtained by polymerizing styrene, or a copolymer of 50% by mass or more of methyl methacrylate and 50% by mass or less of a monomer copolymerizable therewith.

  Examples of monomers copolymerizable with methyl methacrylate include, for example, ethyl methacrylate, propyl methacrylate, butyl methacrylate, benzyl methacrylate, 2-ethylhexyl acrylate, cyclohexyl methacrylate, bornyl methacrylate, adamantyl methacrylate, Methacrylic acid esters such as cyclopentadienyl methacrylate, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, benzyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, bornyl acrylate, adamantyl acrylate Acrylic esters such as cyclopentadienyl acrylate, unsaturated carboxylic acids such as acrylic acid, methacrylic acid, maleic acid, itaconic acid, maleic anhydride, itaconic anhydride and Its acid anhydride, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, monoglycerol acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, monoglycerol methacrylate, etc. Hydroxyl group-containing monomers, acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, diacetone acrylamide, nitrogen-containing monomers such as dimethylaminoethyl methacrylate, epoxy such as allyl glycidyl ether, glycidyl acrylate, glycidyl methacrylate Examples thereof include group-containing monomers, styrene monomers such as styrene and α-methylstyrene.

Examples of resins other than methacrylic resins include styrene resins, polyethylene resins, polypropylene resins, cyclic olefin polymer resins, acrylonitrile-butadiene-styrene resins, polyethylene terephthalate resins, and polycarbonate resins.
In addition, the resin plate 5 may be a single layer plate composed of only one kind of the above-described resin, or may be a multilayer plate composed of a plurality of resins. The combination of resins in the case of being configured as a multilayer board is not particularly limited as long as it is a combination of resins that does not cause peeling. For example, a combination of a methyl methacrylate resin and a polycarbonate is preferable.

In addition, additives such as a light diffusing agent, an ultraviolet absorber, a heat stabilizer, and a photopolymerization stabilizer may be added to the resin plate 5.
Next, as shown in FIG. 1F, one rectangular moisture-proof sheet 7 (upper moisture-proof sheet 4) is placed on the uppermost resin plate 5, and the four corners thereof are aligned with the four corners of the uppermost resin plate 5. (So that the peripheral edge of the uppermost resin plate 5 and the peripheral edge of the moisture-proof sheet 7 are aligned) and in contact with the main surface 51 of the uppermost resin plate 5. As the moisture-proof sheet 7, the same material as the moisture-proof sheet 4 can be applied. Moreover, the thickness of the moisture-proof sheet 7 is the same as that of the moisture-proof sheet 4, for example. Moreover, the planar size (size of the main surface) of the moisture-proof sheet 7 is the same as the planar size of the resin plate 5, for example.

Next, as shown in FIG. 1G, in order to prevent the collapse of the laminated product 6 and the moisture-proof sheets 4 and 7, the stretch film 3 laid under the moisture-proof sheet 4 is, for example, stretched using a stretch packaging machine. Are wound around the entire side surface 61 and moisture-proof sheets 4 and 7.
Next, as shown in FIG. 1H, one rectangular cardboard 8 for shock buffering is laid on the moisture-proof sheet 7 so that the four corners of the cardboard 8 are aligned with the four corners of the moisture-proof sheet 7.
Through the above operations, a package 9 according to an embodiment of the present invention is obtained, which is composed of the laminated product 6, the moisture-proof sheets 4 and 7, and the cardboards 2 and 8.

  According to this packing method, the lower moisture-proof sheet 4 is installed so as to be in contact with the entire main surface 51 of the lowermost resin plate 5, and the upper moisture-proof sheet is provided so as to be in contact with the entire main surface 51 of the uppermost resin plate 5. Since the sheet 7 is installed and the laminated product 6 is sandwiched between the moisture-proof sheets 4 and 7 from both the upper and lower sides, even if the package 9 is placed in a humid environment during storage or transportation, moisture remains in the package 9. It is possible to absorb the moisture-proof sheets 4 and 7 before reaching the laminated product 6. Therefore, since the elongation of the resin plate 5 due to moisture absorption can be suppressed, the occurrence of warpage and undulation due to the elongation can be suppressed.

  For example, in the resin plate 5 packed by this packing method, as shown in FIGS. 2A and 2B, the resin plate 5 is erected in the up-down direction (between the upper end 10 center and the lower end 11 center) and in the left-right direction. The yarns 14 and 15 are stretched one by one (between the center of the left end 12 and the center of the right end 13), and the maximum warpage of the resin plate 5 represented by the size of the gap A between the center of each 14 and 15 yarn and the resin plate 5 The value can be suppressed to 5 mm or less with respect to the uppermost resin plate 5 after being stored for one and a half months in an environment of 25 ° C. ± 5 ° C. and 60% ± 20% RH. 2A and 2B, a resin plate indicated by a broken line represents the shape of a conventional resin plate in which warpage has occurred.

In addition, when the uppermost resin plate 5 and the lowermost resin plate 5 extend due to moisture absorption, friction may occur between the upper resin plate 5 and the resin plate 5 in contact with them, and scratches may occur. Such scratches can also be prevented. In particular, when the main surface 51 of the resin plate 5 is an uneven surface, it is easy to be damaged by friction, so that the effect is great.
Moreover, in the package 9, since the moisture absorption of the resin board 5 at the time of storage or conveyance is suppressed, the high-quality resin board 5 with little warpage and undulation can be provided.

As mentioned above, although one Embodiment of this invention was described, this invention can also be implemented in other embodiment.
For example, in the above-described embodiment, the moisture-proof sheets 4 and 7 are formed on the upper surface (the upper main surface 51 of the uppermost resin plate 5) and the lower surface (the lower main surface 51 of the lowermost resin plate 5). The laminated product 6 is installed so as to be sandwiched from both the upper and lower sides by placing it at a position in contact with (). For example, as shown in FIG. 3, moisture-proof sheets 16 and 17 having a larger planar size than the resin plate 5 are laminated. Even if it arrange | positions in the position which touches the upper surface and lower surface of the goods 6, respectively, and the part which protruded from the resin board 5 of these moisture-proof sheets 16 and 17 is further bent, the part 61 or the whole surface 61 of the laminated article 6 may be covered. Good.

  The side surface 61 of the laminated product 6 is a surface in which the end surfaces 52 of the individual resin plates 5 are gathered, and the exposed area (area of the end surface 52) per one resin plate 5 is small. Therefore, even if it is exposed to some moisture, the influence on one sheet of the resin plate 5 is small compared to the case where the upper surface and the lower surface of the laminated product 6 are exposed to moisture. However, if the side surface 61 of the laminated product 6 is covered with the moisture-proof sheets 16 and 17 as in this modification, moisture absorption of the resin plate 5 can be reliably prevented.

In the above-described embodiment, the moisture-proof sheets 4 and 7 are installed so as to be in contact with the main surface 51 of the uppermost resin plate 5 and the main surface 51 of the lowermost resin plate 5. In addition, for example, as illustrated in FIG. 4, only the laminated product 6 of the resin plate 5 may be packaged with the stretch film 3 and then installed on the top and bottom of the packed laminated product 6. .
Further, the moisture-proof sheets 4 and 7 do not have to be installed on both the upper and lower sides of the laminated product 6, and may be installed only on the upper side of the laminated product 6 or on the lower side, for example.

Further, the shape of the resin plate 5 is not limited to a rectangular shape, and may be various shapes such as a circular shape and a triangular shape.
Further, the load collapse prevention tool is not limited to a film for preventing load collapse such as the stretch film 3, but for example, a stretch sheet (band) for preventing load collapse that is wound around the side surface 61 of the laminated product 6 and fixes the resin plate 5. It is also possible to apply a load collapse prevention paper sheet or a load collapse prevention net.

Further, in the above-described embodiment, the cardboards 2 and 8 are disposed above and below the laminated product 6 for shock buffering of the laminated product 6, but for example, a bubble cushioning material (for example, above and / or below the laminated product 6). A commercially available product such as “Air Cap (registered trademark)” or a protective plate may be disposed.
Further, for example, the packing method of the present invention is not limited to the light guide plate used in the liquid crystal display device. For example, a resin plate (for example, a light diffusing plate or a diffusion sheet cut into a single sheet) in which moisture absorption is a problem in practice. And a prism sheet).

Next, although this invention is demonstrated based on an Example and a comparative example, this invention is not limited by the following Example.
<Materials used>
(1) Resin plate (Sumitomo Chemical Co., Ltd. "Sumipex (methacrylic resin) water absorption 0.2-2.0% (JIS K7209 compliant) Thickness 8mm Plane size 1100mm x 1160mm) Has a protective film made of polyethylene.
(2) Moisture-proof sheet (“Polylaminate AL” 1500 mm width manufactured by Shiko Co., Ltd.)
(3) Polyethylene film (Okura Industrial Co., Ltd. linear low density polyethylene (L-LDPE))
<Examples and Comparative Examples>
(1) Example 1
First, a piece of cardboard was laid on a resin pallet. Next, one polyethylene film was laid on the cardboard. Next, one moisture-proof sheet was laid on the polyethylene film. Next, on the moisture-proof sheet, resin plates were placed one by one so that the four corners were aligned, and a total of 100 sheets were laminated. Next, one moisture proof sheet was laid on the laminate of the resin plates. Next, in order to prevent the collapse of the laminate of the resin plate and the moisture-proof sheet, the polyethylene film laid under the moisture-proof sheet was wound around the entire laminate of the resin plate and the moisture-proof sheet with a stretch packing machine. Finally, one cardboard was laid on the uppermost resin plate.
(2) Comparative Example 1
First, a piece of cardboard was laid on a resin pallet. Next, one polyethylene film was laid on the cardboard. Next, on the polyethylene film, resin plates were placed one by one so that the four corners were aligned, and a total of 100 sheets were laminated. Next, in order to prevent the collapse of the laminate of the resin plates, the polyethylene film laid under the lowermost resin plate was wound around the entire laminate of the resin plates with a stretch packing machine. Finally, one cardboard was laid on the uppermost resin plate.
<Evaluation>
The packages packed in the examples and comparative examples were stored for one and a half months in an environment of temperature: 25 ° C. ± 5 ° C. and humidity RH: 60% ± 20%. During storage, the upper five resin plates were withdrawn every week, and the warpage was measured for each. In the warp measurement, with the measuring resin plate upright, one yarn is stretched one by one in the vertical direction (between the center of the upper end and the center of the lower end) and in the left and right direction (between the center of the left end and the right end). The measurement was performed by measuring the gap with the plate in 0.5 mm increments. The results are shown in Table 1 below. In addition, the resin board used for the curvature measurement was returned to the original position after the measurement.

DESCRIPTION OF SYMBOLS 3 Stretch film 4 Lower moisture-proof sheet 5 Resin board 6 Laminated product 7 Upper moisture-proof sheet 9 Package 16 Damp-proof sheet 17 Damp-proof sheet 51 Main surface (of resin plate) 61 Side (of laminated product)

Claims (9)

A sheet installation step for installing a moisture-proof sheet so as to cover the entire main surface of the uppermost layer and / or the lowermost layer of the resin plate with respect to an object to be packed consisting of a plurality of laminated resin plates;
A packaging method for packaging a resin plate, comprising: a step of packaging the article to be packed by fixing the laminated resin plates with a load collapse prevention tool.   2. The resin plate packaging method according to claim 1, wherein in the sheet installation step, the moisture-proof sheet is further installed so as to cover a side surface of the article to be packed.   The method for packing a resin plate according to claim 1, wherein the resin plate is a methacrylic resin plate.   The water absorption rate of the said resin board is 0.2 to 2.0%, The packaging method of the resin board in any one of Claims 1-3 characterized by the above-mentioned.   The method for packing a resin plate according to any one of claims 1 to 4, wherein the thickness of one resin plate is 1 mm to 8 mm.   The method for packing a resin plate according to any one of claims 1 to 5, wherein the planar size of one resin plate is 800 mm x 800 mm to 1400 mm x 1400 mm.   The thickness of the said to-be-packaged item in the lamination direction of the said resin board is 2 mm-1000 mm, The packaging method of the resin board in any one of Claims 1-6 characterized by the above-mentioned.   A packaged article packaged by the resin plate packaging method according to claim 1.   The maximum value of the warp of the resin plate expressed by the size of the gap between the center of each yarn and the resin plate is 25 ° C. The package according to claim 8, wherein the uppermost resin plate after storage for one and a half months in an environment of ± 5 ° C and 60% ± 20% RH is 5 mm or less.

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