JP2011162210A - Semiconductor-related component carrier case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor-related component carrier case formed by injection molding propylene resin, the case being produced from a propylene resin component with less volatile hydrocarbon or the like and being free from contamination of the contents with, in particular, a volatile substance or the like, especially, when a semiconducor and its related component are stored, and also free from faults resulting from the contamination. <P>SOLUTION: In the semiconductor-related component carrier case uses, as a molding material, a propylene resin composition in which 0.03 to 0.2 pts.wt. of phenolic antioxidant is blended based on 100 pts.wt. of propylene polymer and the content of volatile component is 10 ppm by weight or less, the content of the volatile component of the material after injection molding is 15 ppm by weight or less, thereby reducing the adverse effect of volatile substance contamination on a semiconductor-related component stored in a case. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an injection molded semiconductor-related component transport case manufactured using a propylene-based resin composition containing less volatile hydrocarbons. More specifically, the present invention relates to an injection molded semiconductor-related component transport case manufactured using a propylene-based resin composition having an extremely small oligomer component using a metallocene catalyst.

  Propylene polymers are widely used in various applications such as various industrial materials, various containers, daily necessities, films, and fibers because of their excellent heat resistance, moldability, transparency, and chemical resistance. However, low molecular weight components contained in the polymer and volatile components due to residual substances not only cause generation of smoke and off-flavors during processing, but may also adversely affect odor and hue even after processing.

  In recent years, there has been a remarkable spread and development of electronic devices such as computers. Computer-related components use semiconductor-related components such as semiconductor wafer disks and hard disks. In assembling a computer or the like, it is necessary to transport and transfer the semiconductor-related parts to the assembly line. Conventionally, a thermoplastic resin transfer case such as polypropylene has been used for this purpose. Here, the semiconductor-related parts refer to silicon wafers, hard disks, disk substrates, IC chips, magneto-optical disks, high-functional substrate glass for LCDs, LCD color filters, hard disk magnetoresistive heads, and the like.

  However, as semiconductor related parts are more highly integrated in order to increase the storage capacity of computers, the frequency with which malfunctions occur in the semiconductor related parts housed in the above transport case increases. Occurred. Specifically, there are problems such as malfunction of the storage disk caused by organic substances and acid gas adhering to the storage disk (for example, see Non-Patent Document 1).

  In order to solve the problems related to these polypropylene polymers, a method of washing and removing low molecular weight components after polymerization (for example, see Patent Documents 1 and 2) and a method of separating and removing a liquid phase portion after bulk polymerization (for example, Patent Documents 3 and 4 have been proposed. However, in these documents, an increase in volatile components due to the cleavage of propylene molecules by thermoforming is not considered, and the cleanliness in the product is sufficient. It was not a level.

  The purpose or the object of the present invention is to provide an injection molding that has a very low volatile component content in such a state of the prior art, and has excellent cleanliness that does not cause performance degradation when transporting semiconductor-related parts such as silicon wafers and hard disks. An object of the present invention is to provide a semiconductor-related component transfer case.

  As a result of various earnest studies, the present inventors paid attention to the fact that trace gases such as hydrocarbons generated from the semiconductor-related component transport case material act on the semiconductor-related components and deposit on the semiconductor-related components, thereby causing the above-mentioned problems. By adding an antioxidant to a polypropylene polymer material at a specified ratio, the volatile components such as hydrocarbons in the thermoformed product are below a specific value, performance when transporting semiconductor-related parts The present inventors have found that a semiconductor-related component transport case that does not cause a decrease can be manufactured.

That is, the first feature of the present invention is that the volatile component content is 10 to 100 parts by weight of the propylene polymer in which the phenolic antioxidant is blended in the range of 0.03 to 0.2 parts by weight. A semiconductor-related component carrying case obtained by using a propylene-based resin composition having a weight ppm or less and having a volatile component content after injection molding of 15 ppm by weight or less.
The second feature of the present invention resides in the semiconductor-related component carrying case described above, wherein the lower limit of the blending amount of the phenolic antioxidant with respect to 100 parts by weight of the propylene polymer satisfies the following formula 1. .
Formula 1 3.0 × 10 ⁻³ T−0.67
(However, the unit is parts by weight and T is the molding temperature. A value of 0.03 or less is 0.03.)
The third feature of the present invention is that the above-mentioned semiconductor is characterized in that the ratio (Mw / Mn) of the weight average molecular weight Mw and the number average molecular weight Mn of the propylene-based polymer is in the range of 2.0 to 3.5. In related parts transport case.

A fourth feature of the present invention resides in the semiconductor-related component transport case described above, wherein the molding temperature is in the range of 170 to 300 ° C.
The fifth feature of the present invention is that the blending amount of the phenolic antioxidant is not less than the amount represented by the following formula 1 and not more than 0.2 parts by weight with respect to 100 parts by weight of the propylene polymer. A semiconductor in which a propylene-based resin composition having a volatile component content of 10 ppm by weight or less is injection-molded in a molding temperature range of 170 to 300 ° C., and a volatile component content after injection molding is 15 ppm by weight or less A method for manufacturing a semiconductor-related component transfer case, comprising: obtaining a related component transfer case.
Formula 1 3.0 × 10 ⁻³ T−0.67
(However, the unit is parts by weight and T is the molding temperature. A value of 0.03 or less is 0.03.)
By the above means, the problems of the present invention have been solved.

  Since the semiconductor-related parts transport case of the present invention has a small amount of volatile components, the contents are extremely less contaminated than the conventional case, and is very useful for transporting semiconductors for highly integrated circuits.

The present invention is a semiconductor-related component carrying case molded from a polypropylene polymer having a low oligomer component content. Hereinafter, the present invention will be described in detail.
The polypropylene polymer used in the present invention means a homopolymer of propylene or a copolymer of propylene and ethylene and / or an α-olefin having 4 to 20 carbon atoms. Among them, a propylene homopolymer and a random copolymer of propylene and ethylene are preferable. In the case of a random copolymer of propylene and ethylene, the propylene unit is preferably 90 to 99.5% by weight, more preferably 92 to 99% by weight, and the ethylene unit is preferably 0.5 to 10% by weight, more preferably 1 -8% by weight.

The polypropylene polymer used in the present invention has a halogen content contained in the polymer, for example, a chlorine content of 10 ppm by weight or less, preferably 5 ppm by weight or less. A large halogen content is not preferable because it exhibits corrosivity.
The polypropylene polymer used in the present invention has a volatile component amount of 10 ppm by weight or less, preferably 8 ppm by weight or less, and more preferably 5 ppm by weight or less. When the amount of volatile components is large, it adheres to semiconductor-related parts and is not preferable.

  The volatile component of the present invention can often be caused as a cause of occurrence, but one of the main factors is caused by an inherent problem due to the difference in the production method of the polypropylene-based polymer produced by polymerization. There are many cases. When the weight average molecular weight (Mw) and number average molecular weight (Mn) of a polypropylene-based polymer by a Ziegler catalyst are measured by GPC, and Mw / Mn (index of molecular weight distribution) is determined, it slightly differs depending on the type of catalyst and polymerization conditions. However, it is about 4-9, whereas the metallocene-catalyzed propylene-based polymer has about 2-3 molecular chain lengths. The content of relatively low molecular weight components such as unreacted monomers, dimers, low molecular weight compounds, amorphous components, and oligomers that could be expected to cause volatile components. However, since it is usually 5% by weight or less, 3% by weight or less, preferably 1% by weight or less, the use of a polypropylene polymer based on a metallocene catalyst causes the generation of volatile components at the raw material stage. It can be stopped at 10 ppm by weight or less, such as 4 ppm, 5 ppm, and 8 ppm. On the other hand, in the case of a polypropylene-based polymer based on a Ziegler catalyst, the molecular weight distribution is relatively wide and the low molecular weight region is potentially large, so the volatile component is a propylene-based polymer so-called molding polymer raw material stage. In many cases, it is contained in 10 ppm by weight or more, such as 12 ppm, 16 ppm, or 19 ppm.

This is because the metallocene-type propylene-based polymer can relatively enhance the function of the phenol-based antioxidant even if it is subjected to a heating step called molding. In particular, the generation of volatile components after molding using a metallocene catalyst is more advantageous than that using a Ziegler catalyst compared to before molding. In the case of the Ziegler type, a volatile component in the raw material stage of 12 to 14 ppm by weight, a specific phenolic antioxidant added thereto, and a molded product of a case molded by conventional injection molding is used. Whereas the content is predicted to be about 28 to 32 ppm by weight, in the case of the metallocene type, for example, 4 to 5 ppm by weight of the molded product of the case which is similarly molded by conventional injection molding. In some cases, the content of the volatile component may tend to be about 10 to 14 ppm by weight, and the metallocene type may be subjected to injection molding as compared to the Ziegler type. This is an unexpected behavior in that it relatively suppresses the generation of volatile components.
Of course, the volatile component is not only a by-product of a polypropylene polymer, but also a polymerization solvent, a monomer used for copolymerization, an α-olefin such as ethylene, propylene, 1-butene and 1-hexene, a catalyst In addition, an inert saturated hydrocarbon solvent such as propane, butane, pentane, hexane, and heptane, a polymer cleaning solution such as liquid α-olefin, and a polymer such as a recovery solvent may be mixed in the production stage. Furthermore, since it can be assumed that it is mixed from various additives such as phenolic antioxidants and processing aids, molding of semiconductor-related parts transport cases from all points of view including polymers, washing, extraction and additives It is necessary to pay attention to countermeasures.

The polypropylene polymer used in the present invention can be produced using a known olefin polymerization catalyst, and preferably a metallocene catalyst is used.
As the catalyst system used for obtaining the polypropylene polymer used in the present invention, a known metallocene catalyst system can be used, but preferably an organoaluminum oxy compound such as methylalumoxane or a fluorine-containing boron compound is used as a co-catalyst. A non-catalytic system is used. Polymerization using an aluminum oxy compound increases the amount of Al present in the produced polymer, and polymerization using a fluorine-containing boron compound increases the amount of halogen present in the produced polymer. In order to obtain a polypropylene polymer having a halogen content according to the present invention, the load of the catalyst removal process must be very large, which is not practical.

In order to obtain a polypropylene-based polymer according to the present invention, it is preferable to use a catalyst system obtained by combining the component [A], the component [B] described below and the component [C] used as necessary.
Component [A] Metallocene complex: A transition metal compound in Groups 4 to 6 of the periodic table having at least one conjugated five-membered ring ligand.
Component [B] Cocatalyst: A compound that can activate the metallocene complex [A] by reacting the compound [B] with the metallocene complex [A].
Component [C] Organoaluminum compound.
The metallocene catalyst is preferably a supported type. Specific examples of the carrier supporting the metallocene complex include inorganic oxides such as silica and alumina, or organic materials such as polypropylene polymers, and those in which the component [A] is supported in a powdery form or necessary. Correspondingly, the component [C] that is brought into contact with the organoaluminum compound may be mentioned.

A particularly preferred example of the supported metallocene catalyst is an ion-exchange layered silicate in which the carrier also functions as a promoter. Specifically, it is obtained by combining the component [A], the component [B] described below and the component [C] added as necessary.
Component [A] Metallocene complex: A transition metal compound in Groups 4 to 6 of the periodic table having at least one conjugated five-membered ring ligand.
Component [B] Cocatalyst: Ion exchange layered silicate.
Component [C] Organoaluminum compound.
Specifically as said component [A], the compound represented by the following general formula [I] can be used.
^{_{Q (C 5 H 4-a}} R 1 a) (C 5 H 4-b R 2 b) MXY ··· [I]
In the above general formula [I], Q represents a binding group that bridges two conjugated five-membered ring ligands. M represents a group 4-6 transition metal of the periodic table, and titanium, zirconium, and hafnium are particularly preferable. X and Y are each independently hydrogen, a halogen group, a hydrocarbon group having 1 to 20 carbon atoms, an oxygen-containing hydrocarbon group having 1 to 20 carbon atoms, a nitrogen-containing hydrocarbon group having 1 to 20 carbon atoms, carbon A phosphorus-containing hydrocarbon group having 1 to 20 carbon atoms or a silicon-containing hydrocarbon group having 1 to 20 carbon atoms is shown. R ¹ and R ² are each independently a hydrocarbon group having 1 to 20 carbon atoms, a halogen group, a halogen-containing hydrocarbon group having 1 to 20 carbon atoms, an alkoxy group, an aryloxy group, a silicon-containing hydrocarbon group, A phosphorus-containing hydrocarbon group, a nitrogen-containing hydrocarbon group or a boron-containing hydrocarbon group is shown. Further, two adjacent R ¹ or two R ² may be bonded to each other to form a C4 to C10 ring. a and b are integers satisfying 0 ≦ a ≦ 4 and 0 ≦ b ≦ 4.
Examples of the binding group Q that bridges between two conjugated five-membered ring ligands include an alkylene group, an alkylidene group, a silylene group, and a germylene group. These may be those in which a hydrogen atom is substituted with an alkyl group, halogen or the like. Specific examples of the metallocene complex include the following compounds.

(1) Methylenebis (cyclopentadienyl) zirconium dichloride
(2) Methylene (cyclopentadienyl) (3,4-dimethylcyclopentadienyl) zirconium dichloride
(3) Isopropylidene (cyclopentadienyl) (3,4-dimethylcyclopentadienyl) zirconium dichloride
(4) Ethylene (cyclopentadienyl) (3,5-dimethylpentadienyl) zirconium dichloride
(5) Methylenebis (indenyl) zirconium dichloride
(6) Ethylenebis (2-methylindenyl) zirconium dichloride
(7) Ethylene 1,2-bis (4-phenylindenyl) zirconium dichloride
(8) Ethylene (cyclopentadienyl) (fluorenyl) zirconium dichloride
(9) Dimethylsilylene (cyclopentadienyl) (tetramethylcyclopentadienyl) zirconium dichloride
(10) Dimethylsilylenebis (indenyl) zirconium dichloride
(11) Dimethylsilylenebis (4,5,6,7-tetrahydroindenyl) zirconium dichloride
(12) Dimethylsilylene (cyclopentadienyl) (fluorenyl) zirconium dichloride
(13) Dimethylsilylene (cyclopentadienyl) (octahydrofluorenyl) zirconium dichloride
(14) Methylphenylsilylenebis [1- (2-methyl-4,5-benzo (indenyl)] zirconium dichloride
(15) Dimethylsilylenebis [1- (2-methyl-4,5-benzoindenyl)] zirconium dichloride
(16) Dimethylsilylenebis [1- (2-methyl-4H-azurenyl)] zirconium dichloride
(17) Dimethylsilylenebis [1- (2-methyl-4- (4-chlorophenyl) -4H-azurenyl)] zirconium dichloride
(18) Dimethylsilylenebis [1- (2-ethyl-4- (4-chlorophenyl) -4H-azurenyl)] zirconium dichloride
(19) Dimethylsilylenebis [1- (2-ethyl-4-naphthyl-4H-azurenyl)] zirconium dichloride
(20) Diphenylsilylenebis [1- (2-methyl-4- (4-chlorophenyl) -4H-azurenyl)] zirconium dichloride
(21) Dimethylsilylenebis [1- (2-methyl-4- (phenylindenyl))] zirconium dichloride
(22) Dimethylsilylenebis [1- (2-ethyl-4- (phenylindenyl))] zirconium dichloride
(23) Dimethylsilylenebis [1- (2-ethyl-4-naphthyl-4H-azurenyl)] zirconium dichloride
(24) Dimethylgermylenebis (indenyl) zirconium dichloride
(25) Dimethylgermylene (cyclopentadienyl) (fluorenyl) zirconium dichloride
In addition, the same compounds as described above can be used for other Group 4, 5, and 6 transition metal compounds such as a titanium compound and a hafnium compound. These compounds may be used in combination for the catalyst component and catalyst of the present invention.

The component [B] ion-exchangeable layered silicate is not limited to a natural product, and may be an artificial synthetic product. A clay compound can be used as the ion-exchange layered silicate. Specific examples of the clay compound include, for example, the following described in Harakuo Shiramizu “Clay Mineralogy” Asakura Shoten (1995): Examples include layered silicates.
(1) Kaolin groups such as dickite, nacrite, kaolinite, anoxite, metahalloysite, halloysite, and serpentine groups such as chrysotile, lizardite, antigolite, etc., whose 1: 1 type structure is the main constituent layer
(2) Montmorillonite, sauconite, beidellite, nontronite, saponite, hectorite, stevensite and other smectites, vermiculite such as vermiculite, mica, illite, sericite Mica, such as sea green stone, attapulgite, sepiolite, palygorskite, bentonite, pyrophyllite, talc, chlorite group
The silicate used in the present invention may be a layered silicate in which the mixed layers (1) and (2) are formed. In the present invention, the main component silicate is preferably a silicate having a 2: 1 type structure, more preferably a smectite group, and particularly preferably montmorillonite.
The activity can be improved by chemically treating these silicates with an acid, salt, alkali, oxidizing agent, reducing agent, organic solvent or the like.

In addition to removing impurities on the surface of ion-exchangeable layered silicate particles or exchanging interlayer cations, acid treatment can elute some or all of the cations such as Al, Fe, and Mg in the crystal structure. it can.
Examples of the acid used in the acid treatment include hydrochloric acid, nitric acid, sulfuric acid and the like, preferably an inorganic acid, particularly preferably sulfuric acid.
There are no particular limitations on the acid treatment conditions, but preferably the conditions are such that an aqueous solution of 5 to 50% by weight acid is reacted at a temperature of 60 to 100 ° C. for 1 to 24 hours, and the acid concentration is changed during the reaction. May be. After the acid treatment, washing is usually performed. Washing is an operation for separating and removing the acid contained in the treatment system from the ion-exchangeable layered silicate.
Examples of the salts used in the salt treatment include various salts described in JP-A-8-127613. In the present invention, salts containing a specific cation may be selected and used. preferable. As for the kind of the cation, a monovalent to tetravalent metal cation is preferable, and a cation of Li, Ni, Zn, or Hf is particularly preferable. Specific examples of the salts include the following. Examples of the cation with Li include LiCl, LiBr, Li ₂ SO ₄ , Li ₃ (PO ₄ ), Li (ClO ₄ ), Li ₂ (C ₂ O ₄ ), LiNO ₃ , Li (OOCCH ₃ ), Li ₂ (C ₄ H ₄ O ₄ ) and the like. Examples of the cation that is Ni include NiCO ₃ , Ni (NO ₃ ) ₂ , NiC ₂ O ₄ , Ni (ClO ₄ ) ₂ , NiSO ₄ , NiCl ₂ , and NiBr ₂ . Examples of the cation with Zn include Zn (OOCH ₃ ) ₂ , Zn (CH ₃ COCHCOCH ₃ ) ₂ , ZnCO ₃ , Zn (NO ₃ ) ₂ , Zn (ClO ₄ ) ₂ , Zn ₃ (PO ₄ ) ₂ , ZnSO ₄ , ZnF ₂ , ZnCl ₂ , ZnBr ₂ , ZnI _{2 and the} like can be mentioned. As those cations of _{Hf, Hf (OOCCH 3) 4} , Hf (CO 3) 2, Hf (NO 3) 4, Hf (SO 4) 2, HfOCl 2, HfF 4, HfCl 4, HfBr 4, HfI ₄ etc. can be mentioned.

  After the chemical treatment, drying is performed. In general, the drying temperature can be 100 to 800 ° C., and high temperature conditions (for example, 800 ° C. or more depending on the heating time) that cause structural destruction are as follows. It is not preferable. Since the characteristics change depending on the drying temperature even if the structure is not destroyed, it is preferable to change the drying temperature according to the application. The drying time is usually 1 minute to 24 hours, preferably 5 minutes to 4 hours, and the atmosphere is dry air, dry nitrogen, dry argon, or reduced pressure. It does not specifically limit regarding a drying method, It can implement by various methods.

The organoaluminum compound of component [C] is a component that is optionally used as necessary, and a compound represented by general formula [2] is suitable.
(AlR ⁴ _P X _3-P ) _q ... [2]
The organoaluminum compounds can be used alone, in combination of two or more, or in combination. The organoaluminum compound can be added and used not only at the time of catalyst preparation but also at the time of preliminary polymerization or main polymerization.
In formula [2], R ⁴ represents a hydrocarbon group having 1 to 20 carbon atoms, and X represents a halogen, hydrogen, an alkoxy group, or an amino group. p is an integer of 1 to 3, and q is an integer of 1 to 2. R ⁴ is preferably an alkyl group, and X is preferably an alkoxy group having 1 to 8 carbon atoms when it is an alkoxy group, and an amino group having 1 to 8 carbon atoms when it is an amino group. Of these, trialkylaluminum and dialkylaluminum hydride having p = 3 and q = 1 are preferable. More preferably, R ⁴ is a trialkylaluminum having 1 to 8 carbon atoms.

The metallocene catalyst used in the present invention is preferably pre-polymerized before the main polymerization. As monomers used for the prepolymerization, α-olefins such as ethylene, propylene, 1-butene and 1-hexene, diene compounds such as 1,3-butadiene, and vinyl compounds such as styrene and divinylbenzene can be used. .
This prepolymerization is preferably carried out under mild conditions in an inert solvent, and is 0.01 to 1000 g, preferably 0.1 to 100 g, per 1 g of the solid catalyst (total of component [A] and component [B]). It is desirable to carry out such that a polymer of

The polymerization reaction is performed in the presence or absence of an inert hydrocarbon such as butane, pentane, hexane, heptane, toluene, cyclohexane, or a solvent such as a liquefied α-olefin. In the present invention, it is desirable to increase the amount of polymer produced per solid catalyst (when the solid catalyst is prepolymerized, the polymer produced by the prepolymerization is not included). In order to increase the polymer production amount, it is desirable to set both the polymerization temperature and the polymerization pressure higher.
Usually, the polymerization temperature is selected from 60 to 90 ° C., and the polymerization pressure is selected from about 1.5 to 4 MPa. In particular, in the case of bulk polymerization, the polymerization temperature is preferably 60 to 80 ° C., and the polymerization pressure is preferably selected from about 2.5 to 4 MPa in correlation with the temperature. On the other hand, in the case of gas phase polymerization, the polymerization temperature is preferably 70 to 90 ° C., and is preferably selected from about 1.5 to 4 MPa. Furthermore, it is possible to increase the polymer production amount per solid catalyst by increasing the residence time of the solid catalyst, but if it is too long, the productivity will be affected. The preferred residence time is 1 to 8 hours, more preferably 1 to 6 hours. It is desirable to set the polymerization conditions so that the polymer production amount per 1 g of the solid catalyst including the carrier is 20 kg or more, preferably 25 kg or more, more preferably 30 kg or more. Further, hydrogen may be present as a molecular weight regulator in the polymerization system. Furthermore, the polymerization may be carried out in multiple stages by changing the polymerization temperature, the concentration of the molecular weight regulator and the like.

In the present invention, after completion of the polymerization, the obtained propylene-based polymer is more preferably an inert saturated hydrocarbon solvent such as propane, butane, pentane, hexane, heptane, liquid α-olefin, etc. Washing is preferably performed using 3 or 4 inert hydrocarbon solvent or liquid α-olefin.
The washing method is not particularly limited, and a known method such as decantation of the supernatant after the contact treatment in the stirring tank, countercurrent washing, and separation from the washing solution by a cyclone can be used. Moreover, you may add a quenching agent before washing | cleaning or simultaneously with washing | cleaning. The quenching agent is not particularly limited, and water, alcohols such as methanol, ethanol and isopropanol, ketones such as acetone and methyl ethyl ketone, or a mixture thereof can be used.

  Various general phenolic antioxidants can be used for the polypropylene polymer used in the present invention. Specifically, 2,6-di-t-butyl-4-methylphenol (butylated hydroxytoluene), tetrakis [methylene-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate ] Methane, octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) Butane, 2- [1- (2-hydroxy-3,5-di-t-pentylphenyl) ethyl] -4,6-di-t-pentylphenyl acrylate, 1,3,5-trimethyl-2 , 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene. Other antioxidants can be used in combination as long as the effects of the present invention are not impaired. However, when an antioxidant containing phosphorus and sulfur is used, the contained phosphorus and sulfur have an adverse effect on the contents. This is undesirable because it may impair product performance.

  The addition amount of the phenolic antioxidant used in the present invention is in the range of 0.03 to 0.2 parts by weight with respect to 100 parts by weight of the propylene polymer. If the added amount of the phenolic antioxidant is less than 0.03 parts by weight, the deterioration of polypropylene due to heat cannot be prevented and the amount of volatile components increases, which is not suitable. If the added amount of the phenolic antioxidant exceeds 0.2 parts by weight, there is a concern that outgas derived from the antioxidant may be generated, and the production cost becomes high, and there is a concern that the color of the product may be deteriorated. . In addition, if the blending amount is increased, not only the semiconductor contents are directly contaminated by blooming but also it may be recognized as a volatile component. This compounding amount is such as injection molding, even under high-temperature melting conditions, specific phenolic antioxidants suppress the generation of volatile components of metallocene-type polypropylene polymers, and the antioxidants themselves are also volatile components This is a new finding that

In addition, the lower limit of the amount of the phenolic antioxidant used in the present invention is preferably adjusted so as to satisfy the following formula 1 with respect to 100 parts by weight of the propylene polymer.
Formula 1 3.0 × 10 ⁻³ T−0.67
(However, the unit is parts by weight and T is the molding temperature. A value of 0.03 or less is 0.03.)
In the injection molding, when the semiconductor-related component carrying case of the present invention is obtained, it is necessary to increase the molding temperature when the case is large, thin, or has a complicated shape. However, the higher the molding temperature is, the more the thermal deterioration is promoted and the volatile components are increased. Therefore, a large amount of phenolic antioxidant is required. On the other hand, the more the phenolic antioxidant is added, the worse the hue becomes. Therefore, when the moldability, volatile component amount, and hue required for practical use of the product are taken into consideration, the addition amount of the phenolic antioxidant represented by this relational expression is most effective. The molding temperature refers to the cylinder set temperature of the injection molding machine.
In this way, focusing on the behavior of phenolic antioxidants in accordance with the appropriate molding temperature of polypropylene resin, taking into account the effects of volatile substances in the case in special applications such as semiconductor-related parts transport cases Thus, a technique for solving the problem by quantitatively analyzing the relationship up to the addition amount is a result of the knowledge of the present inventors.

In the polypropylene polymer of the present invention, various known nucleating agents can be used as the nucleating agent to be used.
As the nucleating agent, a sterically hindered amide compound, an organic dicarboxylic acid metal salt, an organic monocarboxylic acid metal salt, a polymer nucleating agent, dibenzylidene sorbitol or a derivative thereof, a metal salt of diterpenic acid, or the like is used.

  The propylene resin composition used in the present invention has a volatile component content of 10 ppm by weight or less. When the content of volatile components exceeds 10 ppm by weight, the volatile components increase in the molded article after thermoforming, and this is unsuitable in that there is a concern that it may adhere to the semiconductor and cause contamination. The volatile component content is measured using gas chromatogram / mass spectrometry.

In order to produce the semiconductor-related component carrying case of the present invention, the propylene-based resin composition containing the above-described additive in the polypropylene-based polymer described above is obtained by injection molding by a known method.
Here, the semiconductor-related parts are not particularly limited, but examples thereof include silicon wafers, hard disks, disk substrates, IC chips, magneto-optical disks, LCD high-functional substrate glasses, LCD color filters, and hard disk magnetoresistive heads. That means.

  The semiconductor-related component carrying case of the present invention must have a volatile component content of 20 ppm by weight or less. If the content of the volatile component exceeds 20 ppm by weight, the volatile component is not suitable in that it may adhere to the semiconductor and cause contamination.

  The reason why the content of volatile components in the semiconductor-related parts transport case is 15 ppm or less is that depending on the type of semiconductor parts, there are some parts that are relatively less susceptible to volatile components, or parts that are very susceptible. However, considering the risk, the maximum allowable volatile component content must be set for those that are susceptible to volatile components. Furthermore, there is a difference in the amount of volatile components that accumulate in the case between the case with the lid and the case without the lid as time elapses after storage. In the case of the case of the present invention, the allowable amount that the semiconductor-related parts are not affected by comprehensively considering the transportation period of the semiconductor-related parts, the storage period in the case, etc. is 15 ppm or less, assuming all cases. The critical value is set and is based on the knowledge of the present inventor. Of course, it is more appropriate that the content of the volatile component in the case is lower, such as 13 ppm by weight or less and 11 ppm by weight or less. On the other hand, if the content of the volatile component in the case is set as high as 20 ppm by weight, 30 ppm by weight, and 40 ppm by weight, the adjustment of raw materials and the molding conditions can be set loosely, but the performance deterioration of parts conveyance will be more appropriate. In order to achieve the problem to be prevented, 15 ppm by weight or less is a critical value for achieving the problem of eliminating the influence on the semiconductor-related parts while taking into consideration the entire work such as resin raw material and injection molding. .

  Cases for transporting semiconductor-related parts are thin-walled molded products, thick-walled molded products, and polypropylene polymer products of any thickness, including those with a thickness of about 0.01 to 10 mm including large and small sizes. In consideration of the size of semiconductor-related components and the number of components stored at one time, the size of the size can be arbitrarily designed to be about 5 to 1000 mm. The shape is not particularly limited as long as the parts can be properly stored, and any case such as a square case, a round shape, a tray shape, a container, a cylinder shape, a cup, a container, a box shape, a pallet shape, etc. The presence or absence of a lid is within the scope of the design change.

Injection molding can be easily performed using various conventional injection molding machines. For example, high-speed injection molding with a screw speed of about 1000 to 1800 mm is also suitable. When the molding temperature is 170 to 300 ° C., and in some cases about 220 to 320 ° C., the molding temperature should be kept as low as possible in order to suppress the generation of volatile components due to decomposition of low molecular weight components. Thus, increasing the molding speed can supplement the effectiveness of the phenolic antioxidant from the aspect of molding, and in order to reduce the content of volatile components in the case to 20 ppm by weight or less, the volatilization of the polypropylene resin To devise injection molding conditions such as injection molding temperature, molding speed, low-pressure injection molding method, etc. not to leave for as long as possible in the environment of harsh high temperature melting state, which is considered to be one of the causes of the generation of sexual components Is one of the preferred measures.

Next, the present invention will be described more specifically with reference to examples. However, the present invention is not limited by these examples without departing from the gist thereof. In the following examples and comparative examples, the physical properties of the polymers are measured according to the following methods.
(1) Melt flow rate (MFR): Measured according to JIS-K6921-2: 1997 appendix (230 ° C., 21.18 N load).
(2) Melting point (Tm): Using a DSC manufactured by Seiko Co., Ltd., a sample amount of 5.0 mg was taken, held at 200 ° C. for 5 minutes, and then crystallized to 40 ° C. at a temperature lowering speed of 10 ° C./min. This was evaluated for the peak temperature when held for 1 minute and further melted at a heating rate of 10 ° C./min.
(3) Crystallization temperature (Tc): Using a DSC manufactured by Seiko Co., Ltd., a sample amount of 5.0 mg was taken, held at 200 ° C. for 5 minutes, and then crystallized to 40 ° C. at a temperature decrease rate of 10 ° C./min. The peak temperature was evaluated.
(4) Measurement of ethylene content: The ethylene unit content (unit: wt%) in the polymer derived from ethylene comonomer was measured by pressing the obtained polymer and molding it into a sheet shape by the IR method. Specifically, it was calculated from the peak height derived from the methylene chain observed at around 730 cm ⁻³ .
(5) Measurement of the amount of volatile components: 200 mg of a sample is filled in a TDS tube manufactured by GERSTEL, the TDS tube is inserted into a TDS-A device manufactured by GERSTEL, heated at 100 ° C. for 30 minutes while flowing He, during the heating period, Gas was introduced into GERSTEL CIS4 filled with TENAX, and CIS4 was cooled to −150 ° C. to collect volatile components generated from the sample.
The collected components were introduced into the gas chromatogram by rapid vaporization to 320 ° C. The introduced gas was measured by gas chromatogram / mass spectrometry under the following conditions.

Device: HP6890
Column: DB-5ms 0.25mm x 30m
Temperature: 40 ° C. × 5 min → 10 ° C./min to 300 ° C. × 15 min
Detector: HP5973N
The amount of hydrocarbons is determined by gas chromatogram / mass spectrometry by measuring n-heptane as a solvent and measuring aliphatic straight-chain saturated hydrocarbons having a concentration of 1, 5, and 10 μg / ml and having 20 carbon atoms under the same conditions as the sample. A calibration curve was prepared by measuring the amount of carbon dioxide and quantification was performed in terms of an aliphatic straight saturated hydrocarbon having 20 carbon atoms.
(6) Thermoforming of products: Resin pellets are supplied to an injection molding machine IS100GN manufactured by Toshiba Machine Co., Ltd., and the thickness is 2.0 mm at an injection primary pressure of 50 Mpa, a mold cooling water temperature of 40 ° C., and a cooling time of 15.0 seconds. A flat plate was formed. The molding temperature was changed in the range of 180 to 290 ° C.
(7) Hue A sheet-like test piece obtained by thermoforming was used and measured according to JIS K7105: 1998. Among the values obtained by measurement, the YI value indicating yellowness was evaluated. The YI value indicates that yellow is stronger as the value is positive, and blue is stronger as the value is negative.

(Production Example 1)
(1) Preparation of catalyst
The following operations were carried out under inert gas using deoxygenated and dehydrated solvents and monomers.
(I) Chemical treatment of ion-exchange layered silicate Acid treatment: 1130 g of distilled water and 750 g of 96% sulfuric acid are added to a separable flask and the internal temperature is kept at 90 ° C., where granulated smectite with an average particle size of 25 μm (Mizusawa) 300 g of Benclay SL manufactured by Chemical Co., Ltd. was added and reacted for 5 hours. Washing: Cooled to room temperature in 1 hour and washed with distilled water to pH = 3.69. The washing magnification at this time was 1/10000 or less. The solid at this stage was partially dried and the elution rate by acid treatment was determined to be 33.5%.
Salt treatment: 211 g of lithium sulfate monohydrate was dissolved in 521 g of distilled water, and 100 g (dry weight) of the solid obtained by the acid treatment was further added, followed by stirring at room temperature for 120 minutes. This slurry was filtered, 3000 g of distilled water was added to the obtained solid, and the mixture was stirred for 5 minutes at room temperature. The slurry was further filtered. To the obtained solid, 2500 g of distilled water was added, stirred for 5 minutes, and then filtered again. This operation was repeated four more times. The obtained solid was pre-dried at 130 ° C. for 2 days under a nitrogen stream, and then coarse particles of 53 μm or more were removed, followed by drying under reduced pressure at 200 ° C. for 2 hours to obtain chemically treated smectite.

(Ii) Silicate activation treatment
200 g of the above chemically treated smectite was introduced into a glass reactor equipped with a stirring blade having an internal volume of 3 L, 750 ml of normal heptane and a heptane solution of trinormal octyl aluminum (500 mmol) were added, and the mixture was stirred at room temperature. After 1 hour, the mixture was washed with normal heptane (residual liquid ratio less than 1%) to prepare a slurry of 2000 mL.

(Iii) Preparation of prepolymerization catalyst Next, (r) -dimethylsilylenebis [2-methyl-4- (4-chlorophenyl) -4H-azurenyl] zirconium dichloride 3 mmol toluene slurry 870 mL and triisobutylaluminum (15 mmol) A mixed solution obtained by reacting 42.6 mL of a heptane solution in advance at room temperature for 1 hour was added to the above chemically treated smectite slurry and stirred for 1 hour. Subsequently, 2.1 L of normal heptane was introduced into a stirring autoclave having an internal volume of 10 L which had been sufficiently substituted with nitrogen, and maintained at 40 ° C. The previously prepared montmorillonite / complex slurry was introduced there. When the temperature was stabilized at 40 ° C., propylene was supplied at a rate of 100 g / hour, and the temperature was maintained. After 4 hours, the propylene feed was stopped and maintained for another 2 hours. About 3 L of the supernatant was removed from the recovered prepolymerized catalyst slurry, 170 mL of a heptane solution of triisobutylaluminum (30 mmol) was added, stirred for 10 minutes, and then heat-treated at 40 ° C. under reduced pressure. By this operation, a prepolymerized catalyst containing 2.30 g of polypropylene per 1 g of catalyst was obtained.

(2) Production of propylene polymer Liquid phase polymerization tank with an internal volume of 270 L, stirring tank with an internal volume of 400 L, deactivation tank, slurry circulation pump, circulation line hydraulic classifier, concentrator, countercurrent pump and washing liquid receiving tank Propylene / ethylene co-polymerization by a process incorporating a deactivation cleaning system consisting of a high-pressure degassing system consisting of a double-pipe heat exchanger and a fluidized flash tank, and a post-treatment system including a low-pressure degassing tank and a dryer. The continuous production of coalescence was carried out. The prepolymerized catalyst produced above was dispersed in liquid paraffin (manufactured by Tonen Inc .: White Rex 335) at a concentration of 15% by weight and introduced into the liquid phase polymerization tank at 0.35 g / hr as a catalyst component. Further, liquid propylene was continuously supplied to this polymerization tank at 40 kg / hr, ethylene at 0.4 kg / hr, hydrogen at 0.25 g / hr, and triisobutylaluminum at 18 g / hr, and the internal temperature was maintained at 70 ° C. Polymerization was performed. A mixed slurry of polymer and liquid propylene was extracted from the liquid phase polymerization tank into a deactivation washing tank so as to be 12.0 kg / hr as a polymer. At this time, the average residence time of the catalyst in the polymerization tank was 1.3 hours. Ethanol was supplied to the deactivation washing tank at 21.0 g / hr as a deactivation agent. Furthermore, liquid propylene was supplied at 40 kg / hr, and the internal temperature was kept at 50 ° C. by heating with a jacket. The polymer was extracted from the lower part of the classifier into a high-pressure degassing tank, further passed through a low-pressure degassing tank, and dried with a dryer. The internal temperature of the dryer was adjusted to 80 ° C. and the residence time was 1 hour, and dry nitrogen at room temperature was further flowed in the countercurrent direction of the powder flow at a flow rate of 12 m ³ / hr. The dried polymer was removed from the hopper. On the other hand, liquid propylene separated from the polymer through a classifier and a concentrator was extracted into a washing liquid receiving tank at 40 kg / hr. The yield of the obtained polymer per 1 g of the solid catalyst was 34.3 kg, ethylene content = 0.75 wt%, MFR = 30.6 g / 10 min, and Tm = 141.7 ° C.

(Production Example 2)
(1) Catalyst adjustment
(I) Adjustment of Ziegler catalyst
A 100 L reactor equipped with a stirring blade, a thermometer, a jacket, and a cooling coil was charged with 30 mol of Mg (OEt) ₂ , and then Ti (OBu) ₄ was added to magnesium in the charged Mg (OEt) _2. Then, the molar ratio of Ti (OBu) ₄ / Mg was charged to 0.60. Furthermore, 19.2 kg of toluene was charged, and the temperature was raised while stirring. After reacting for 3 hours at 139 ° C., and cooled to 130 ° C., the toluene solution of MeSi _{(OPh) 3,} with respect to the magnesium of the charged Mg _{(OEt) 2} previously, MeSi _(OPh) 3 / Mg The molar ratio was 0.67. The amount of toluene used here was 7.8 kg. After completion of the addition, the reaction was performed at 130 ° C. for 2 hours, and then the temperature was lowered to room temperature, and Si (OEt) ₄ was added. The addition amount of Si _{(OEt) 4,} to the magnesium in the charged Mg _{(OEt) 2} previously, the molar ratio of Si _(OEt) 4 / Mg was set to be 0.056.
Next, toluene was added to the obtained reaction mixture so that the magnesium concentration was 0.57 (mol / L · TOL). Furthermore, diethyl phthalate (DEP) was added so that the molar ratio of DEP / Mg was 0.10 with respect to magnesium in Mg (OEt) ₂ charged previously. The resulting mixture was cooled to −10 ° C. with continued stirring, and TiCl ₄ was added dropwise over 2 hours to obtain a uniform solution. Incidentally, TiCl _4, relative to the magnesium of the charged Mg _{(OEt) 2} previously was such that the molar ratio of TiCl ₄ / Mg is 4.0. After completion of the addition of TiCl ₄ , the temperature was raised to 15 ° C. at 0.5 ° C./min with stirring, and kept at the same temperature for 1 hour. Next, the temperature was raised again to 50 ° C. at 0.5 ° C./min, and kept at the same temperature for 1 hour. Further, the temperature was raised to 118 ° C. at 1 ° C./min, and the treatment was performed at the same temperature for 1 hour. After completion of the treatment, stirring was stopped and the supernatant liquid was removed, followed by washing with toluene so that the residual liquid ratio = 1/73 to obtain a slurry.
Next, toluene and TiCl ₄ were added to the resulting slurry at room temperature. Incidentally, TiCl _4, relative to the magnesium of the charged Mg _{(OEt) 2 previously,} the molar ratio of TiCl 4 / Mg _{(OEt) 2} was set to be 5.0. Toluene was prepared so that the TiCl ₄ concentration was 2.0 (mol / L · TOL). The slurry was heated with stirring and reacted at 118 ° C. for 1 hour. After completion of the reaction, stirring was stopped and the supernatant liquid was removed, followed by washing with toluene so that the residual liquid ratio = 1/150 to obtain a solid component slurry. Furthermore, 400 g of the solid component obtained above was transferred to another reactor having a stirring blade, a thermometer, and a cooling jacket, and normal hexane was added to give a solid component concentration of 5.0 (g / l). ). Trimethylvinylsilane, TEA and TMBDES were added at 15 ° C. while stirring the resulting slurry. Here, TBMDES represents t-butylmethyldiethoxysilane, and t-butyl represents a tertiary butyl group. The addition amounts of TEA, trimethylvinylsilane, and TBMDES are 3.1 (mmol), 0.2 (ml), and 0.2 (ml) with respect to 1 g of the solid component in the solid component, respectively. I made it. After completion of the addition, the mixture was kept at 15 ° C. for 1 hour with continuous stirring, further heated to 30 ° C., and stirred at the same temperature for 2 hours.

(Ii) Prepolymerization
Next, the temperature was lowered again to 15 ° C., and while maintaining the same temperature, 1.2 kg of propylene gas was fed at a constant rate to the gas phase portion of the reactor over 72 minutes to perform prepolymerization. After completion of the feed, stirring was stopped and the supernatant liquid was removed, followed by washing with normal hexane to obtain a slurry of a prepolymerized catalyst component. The remaining liquid ratio was 1/12. The obtained prepolymerization catalyst component had 3.1 g of propylene polymer per 1 g of the solid component.

(2) Production of Propylene Polymer Polymerization was carried out using the same reactor system as used in Production Example 1. The prepolymerized catalyst component obtained above was dispersed in liquid paraffin (manufactured by Tonen Inc .: White Rex 335) at a concentration of 2% by weight and introduced as a catalyst component at 0.2 g / hr. In this reactor, 32.8 kg / hr of liquid propylene, 0.26 kg / hr of ethylene, 4.0 g / hr of hydrogen, 6.6 g / hr of triethylaluminum, TBEDMS (t-butylmethyldiethoxysilane, where , T-butyl represents a tertiary butyl group) was continuously supplied at 0.011 g / hr, and the internal temperature was maintained at 70 ° C. for polymerization. A mixed slurry of polymer and liquid propylene was extracted from the liquid phase polymerization tank 1 to a deactivation washing tank as a polymer at 13.8 kg / hr. At this time, the average residence time of the catalyst in the polymerization tank was 1.3 hours. Ethanol was supplied to the deactivation washing tank at 21.0 g / hr as a deactivation agent. Furthermore, liquid propylene was supplied at 40 kg / hr, and the internal temperature was kept at 50 ° C. by heating with a jacket. The polymer was extracted from the lower part of the classifier into a high-pressure degassing tank, further passed through a low-pressure degassing tank, and dried with a dryer. The internal temperature of the dryer was adjusted to 80 ° C. and the residence time was 1 hour, and dry nitrogen at room temperature was further flowed in the countercurrent direction of the powder flow at a flow rate of 12 m ³ / hr. The dried polymer was removed from the hopper. On the other hand, liquid propylene separated from the polymer through a classifier and a concentrator was extracted into a washing liquid receiving tank at 40 kg / hr. The yield of the obtained polymer per 1 g of the solid catalyst was 69.0 kg, and the C2 content was 4.2 wt. %, MFR = 25.5 g / 10 min, and Tm = 140.1 ° C.

Example 1
(1) Production of Resin Composition With respect to 100 parts by weight of the powder obtained in Production Example 1, pentaerythryl-tetrakis [3- (3,5-t-butyl-4-hydroxyphenyl), a phenolic antioxidant ) Propionate] (Irganox 1010 manufactured by Ciba; hereinafter abbreviated as RA1010. Molecular weight is 1178 g / mol.) 0.03 part by weight was added, and after nitrogen sealing with a super mixer, the mixture was mixed for 3 minutes. Thereafter, the powder was granulated at a cylinder temperature of 200 ° C., a screw rotation speed of 150 rpm, and an extrusion rate of 15 kg / h using a twin screw extruder TEM35 manufactured by Toshiba Machine Co., Ltd., and pellets of a propylene-ethylene resin composition Got.
The amount of volatile components of the pellet was measured. Further, by the above-described thermoforming method, a product was prepared at a molding temperature of 230 ° C., and the amount of volatile components was measured. The obtained results are shown in Table 1.

(Example 2)
As an antioxidant, a resin composition and an injection-molded article were obtained in the same manner as in Example 1, except that 0.05 part by weight of phenolic antioxidant RA1010 was added to 100 parts by weight of the powder. The obtained results are shown in Table 1.
(Example 3)
As an antioxidant, a resin composition and an injection molded article were obtained in the same manner as in Example 1 except that 0.10 parts by weight of phenolic antioxidant RA1010 was added to 100 parts by weight of the powder. The obtained results are shown in Table 1.

(Example 4)
As an antioxidant, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene (Chiba Co., Ltd. Irganox) per 100 parts by weight of powder 1330; hereinafter abbreviated as RA 1330. Molecular weight is 775 g / mol.) A resin composition and an injection-molded article were obtained in the same manner as in Example 1 except that 0.05 part by weight was added. The obtained results are shown in Table 1.

(Example 5)
As a nucleating agent, 2- [1- (2-hydroxy-3,5-di-t-pentylphenyl) ethyl] -4,6-di-t-pentylphenyl acrylate (Sumitomo Chemical Co., Ltd.) with respect to 100 parts by weight of the powder. Sumilyzer GS manufactured by Kogyo Co., Ltd .; hereinafter abbreviated as SMGS. Molecular weight is 549 g / mol.) A resin composition and an injection molded article were obtained in the same manner as in Example 1 except that 0.05 part by weight was added. The obtained results are shown in Table 1.

(Comparative Example 1)
As an antioxidant, a resin composition and an injection-molded body were obtained in the same manner as in Example 1, except that 0.01 part by weight of phenolic antioxidant RA1010 was added to 100 parts by weight of the powder. The obtained results are shown in Table 1.
(Comparative Example 2)
As an antioxidant, a resin composition and an injection-molded article were obtained in the same manner as in Example 1 except that 0.3 part by weight of phenolic antioxidant RA1010 was added to 100 parts by weight of the powder. The obtained results are shown in Table 1.
(Comparative Example 3)
A resin composition and an injection-molded body were obtained in the same manner as in Example 1 except that the powder obtained in Production Example 2 was used. The obtained results are shown in Table 1.
(Example 6)
A resin composition and an injection-molded body were obtained in the same manner as in Example 1 except that the thermoforming temperature was 200 ° C. The obtained results are shown in Table 1.

(Comparative Example 4)
A resin composition and an injection-molded body were obtained in the same manner as in Example 1 except that the thermoforming temperature was 260 ° C. The obtained results are shown in Table 1.
(Example 7)
A resin composition and an injection-molded body were obtained in the same manner as in Example 3 except that the thermoforming temperature was 200 ° C. The obtained results are shown in Table 1.
(Comparative Example 5)
A resin composition and an injection-molded body were obtained in the same manner as in Example 3 except that the thermoforming temperature was 260 ° C. The obtained results are shown in Table 1.
(Example 8)
As an antioxidant, a resin composition and an injection-molded article were obtained in the same manner as in Comparative Example 4 except that 0.15 parts by weight of phenolic antioxidant RA1010 was added to 100 parts by weight of the powder. The obtained results are shown in Table 1.

In the examples, since the propylene-based polymer contains an antioxidant in a predetermined ratio, the amount of volatile components in the product is reduced.
On the other hand, in Comparative Example 1, since the antioxidant is insufficient in a predetermined amount, the cutting of propylene molecules due to heat cannot be suppressed during molding, and the amount of volatile components in the molded product is increased. Comparative Example 2 has a large amount of volatile components both before and after molding, and is unsuitable for a semiconductor-related component transport case. In Comparative Example 3, the blending amount of the antioxidant is extremely large, so that the hue is deteriorated and the appearance is deteriorated due to yellowishness. In Comparative Example 4 and Comparative Example 5, since the blending amount of the antioxidant is insufficient with respect to the molding temperature, the amount of volatile components after molding is large, which is unsuitable for a semiconductor-related component transport case.

  The semiconductor-related parts transport case manufactured using the propylene-based resin composition of the present invention is formed by injection molding from a polypropylene-based polymer having a very low volatile component content. It is difficult to cause contamination of objects and can be used effectively for transporting semiconductors for highly integrated circuits.

Ultra-clean technology Toray Research Center (July 2005)

Japanese Examined Patent Publication No. 53-4107 Japanese Patent Publication No.58-41283 Japanese Patent Laid-Open No. 10-17612 Japanese Patent Laid-Open No. 10-17613

Claims (5)

A propylene-based resin composition having a volatile component content of 10 ppm by weight or less, in which a phenol-based antioxidant is blended in the range of 0.03 to 0.2 parts by weight with respect to 100 parts by weight of a propylene-based polymer. A semiconductor-related component transport case, wherein the content of volatile components after injection molding is 15 ppm by weight or less.
The semiconductor-related component carrying case according to claim 1, wherein the lower limit of the blending amount of the phenol-based antioxidant with respect to 100 parts by weight of the propylene-based polymer satisfies the following formula 1.
Formula 1 3.0 × 10 ⁻³ T−0.67
(However, the unit is parts by weight and T is the molding temperature. A value of 0.03 or less is 0.03.)
The ratio of the weight average molecular weight Mw to the number average molecular weight Mn (Mw / Mn) of the propylene-based polymer is in the range of 2.0 to 3.5, and the semiconductor-related component conveyance according to claim 1 or 2 Case.
The semiconductor-related component carrying case according to claim 2, wherein a molding temperature is in a range of 170 to 300 ° C.
The amount of the phenolic antioxidant is not less than the amount represented by the following formula 1 and not more than 0.2 parts by weight based on 100 parts by weight of the propylene polymer. A propylene-based resin composition having a weight ppm or less is injection-molded in a molding temperature range of 170 to 300 ° C., and a semiconductor-related component transport case having a volatile component content of 15 wt ppm or less after injection molding is obtained. A method for manufacturing a semiconductor-related component carrying case.
Formula 1 3.0 × 10 ⁻³ T−0.67
(However, the unit is parts by weight and T is the molding temperature. A value of 0.03 or less is 0.03.)