JP2011161590A - Surface coated cutting tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface coated cutting tool having a coating film with wear resistance, chipping resistance and adhesion on a surface. <P>SOLUTION: This surface coated cutting tool includes a base material and the coating film formed on the base material. The coating film has film thickness of ≥1 μm and ≤15 μm, and includes a laminated body alternately laminated with two layers or more of an A layer made of Al<SB>a</SB>Ti<SB>b</SB>Si<SB>c</SB>M<SB>d</SB>N and two layers or more of a B layer made of Ti<SB>e</SB>Si<SB>f</SB>Me<SB>g</SB>N. Each of the A layer and the B layer has layer thickness of ≤20 nm. Each A layer has substantially the same layer thickness, and each B layer has substantially the same layer thickness. In the A layer, an atomic ratio of Al is continuously or gradually reduced from the base material side to the surface side of the coating film. When the atomic ratio of Al composing the A layer on a side closest to the base material is a<SB>1</SB>and the atomic ratio of Al composing the A layer on a side closest to the surface of the coating film is a<SB>2</SB>, a<SB>1</SB>-a<SB>2</SB>≥0.005 is satisfied. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a surface-coated cutting tool including a substrate and a coating film formed thereon.

  Recent cutting tool trends include the need for dry machining without cutting fluids from the viewpoint of global environmental conservation, the diversification of work materials, and higher cutting speeds to further improve machining efficiency. For example, the tool edge temperature tends to be higher, and the characteristics required for the tool material are becoming stricter. In particular, as a required characteristic of tool materials, the coating film formed on the base material has high temperature stability (oxidation resistance and coating film adhesion) as well as wear resistance related to the cutting tool life. Improvement of crack resistance and fracture resistance is becoming more important.

  In order to improve wear resistance and surface protection function, TiAl nitride is used as a hard coating on the surface of cutting tools and wear-resistant tools made of hard base materials such as WC-based cemented carbide, cermet, and high-speed steel. It is well known to form a single layer or multiple layers. However, in recent high-speed and dry processing, a sufficient tool life cannot be obtained with a coating film made of TiAl nitride.

  Under such circumstances, as a method for improving the heat resistance of the coating film and realizing a long tool life, Patent Document 1 discloses a coating film in which Si is further added to a composite nitride of Ti and Al. Proposed. Thus, the coating film containing Si has an advantage that the heat resistance is superior to the coating film made of a nitride of TiAl because a dense oxidation protective film containing Si is formed on the surface thereof. On the other hand, however, the coating film disclosed in Patent Document 1 has a problem that its performance of hardness and toughness is not sufficient.

  As an attempt to solve such a problem, Patent Document 2 and Patent Document 3 include Ti nitride, carbonitride, nitrogen oxide, or a layer containing an appropriate amount of Si in carbon nitride oxide, and Ti and Al. There is disclosed a coating film in which nitrides, carbonitrides, nitride oxides, or layers composed of carbonitride oxides are alternately laminated. Patent Document 4 discloses a coating film in which layers made of AlTiSiN and layers made of TiSiN are alternately stacked.

JP 07-310174 A JP 2000-334606 A JP 2000-334607 A JP 2003-291005 A

  However, since the TiSi-based coating film disclosed in Patent Document 2 and Patent Document 3 has an extremely high compressive residual stress, the coating film itself is easily self-destructed. There was a problem that the adhesion was not sufficient. Further, the coating film disclosed in Patent Document 4 is excellent in heat resistance, hardness, and toughness. On the other hand, when cutting is performed using a cutting tool coated with such a coating film, There was a tendency to peel between layers, and there was a problem that sufficient tool life could not be obtained.

  The present invention has been made in view of the current situation as described above, and the object of the present invention is to make the characteristics of AlTiSiMN excellent in heat resistance, hardness, and stress balance, and in TiSiMeN excellent in wear resistance and toughness. An object of the present invention is to provide a surface-coated cutting tool having a coating film on the surface that has both properties and wear resistance, fracture resistance, and adhesion. M and Me each independently represent one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W.

  In order to solve the above problems, the present inventors have made various studies on the configuration of the coating film, and the coating film disclosed in Patent Document 4 is easily peeled between layers. It was found that the layer thickness and the Si amount of each layer constituting the laminated structure were not matched. Based on this knowledge, the present invention was finally completed by further earnestly studying the layer thickness and composition of the layer made of AlTiSiN and the layer made of TiSiN.

That is, the surface-coated cutting tool of the present invention is provided with a coating film formed thereon with the substrate, the coating film is a film thickness of at least 15μm or less 1 [mu] m, and Al _a Ti _b Si _c M _d N (provided that Shikichu, 0.35 ≦ a ≦ 0.7,0 <c ≦ 0.1,0 <d ≦ 0.3, a + b + c + d = 1) and A layer consisting of, Ti _e Si _f Me _g Including a laminate in which two or more B layers each consisting of N (where f is 0 <f ≦ 0.1, 0 <g ≦ 0.3, e + f + g = 1) are alternately laminated, M and Me therein are each independently one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W, and each of the A layer and the B layer has a thickness of 20 nm. Each layer A has substantially the same layer thickness, each layer B has substantially the same layer thickness, and each layer A has a base thickness The atomic ratio of Al decreases continuously or stepwise from the material side to the surface side of the coating film, and the atomic ratio in the above formula of Al constituting the A layer on the side closest to the substrate is defined as a _1. When the atomic ratio in the above formula of Al constituting the A layer closest to the surface of the covering film is a ₂ , the following formula (I) is satisfied.

a ₁ −a ₂ ≧ 0.005 (I)
The atomic ratio c of Si constituting the A layer and the atomic ratio f of Si constituting the B layer preferably satisfy the following formula (II).

| C−f | ≦ 0.05 (II)
The A layer and the B layer preferably have a layer thickness of 2 nm or more and 10 nm or less. Coating film has an outermost surface layer on the surface side, outermost surface _{layer, Ti e Si f Me g CN} ( although Shikichu, 0 <f ≦ 0.1,0 <g ≦ 0.3, e + f + g = 1).

A _{layer, Al a Ti b Si c M} d N ( provided that Shikichu, 0.5 ≦ a ≦ 0.6,0.03 ≦ c ≦ 0.08,0 <d ≦ 0.3, a + b + c + d = 1) Preferably it consists of. Layer _{B, Ti e Si f Me g N} ( provided that Shikichu, 0.03 ≦ f ≦ 0.08,0 <g ≦ 0.3, e + f + g = 1) is preferably made of. The coating film is preferably formed by an arc ion plating method.

  The surface-coated cutting tool of the present invention has the characteristics as described above, and has the characteristics of AlTiSiMN, which is excellent in heat resistance, hardness, and stress balance, and the characteristics of TiSiMeN, which is excellent in wear resistance and toughness. It combines wear resistance, fracture resistance, and adhesion.

It is a schematic sectional drawing which shows the coating film of the aspect by which A layer was formed immediately on the base material, and the outermost surface layer was formed on B layer of the surface side. (A) is typical sectional drawing which shows the state before removing the steel ball pressed against the coating film, (b) is a schematic diagram showing the state after removing the steel ball pressed against the coating film FIG. It is the schematic of an arc ion plating apparatus.

  Hereinafter, the present invention will be described in detail. In the following description of the embodiments, the description is made with reference to the drawings. In the drawings of the present application, the same reference numerals denote the same or corresponding parts. In the present invention, the layer thickness or film thickness is measured by a scanning electron microscope (SEM) or a transmission electron microscope (TEM), and the composition thereof is an energy dispersive X-ray analyzer. It shall be measured by (EDS: Energy Dispersive x-ray Spectroscopy).

<Surface coated cutting tool>
The surface-coated cutting tool of the present invention comprises a substrate and a coating film formed thereon. The surface-coated cutting tool of the present invention having such a basic configuration is, for example, a drill, an end mill, a milling or turning cutting edge replaceable cutting tip, a metal saw, a cutting tool, a reamer, a tap, or a crankshaft pin. It can be used very effectively as a chip for milling.

<Base material>
As the base material of the surface-coated cutting tool of the present invention, a conventionally known material known as such a cutting tool base material can be used without particular limitation. For example, cemented carbide (for example, WC base cemented carbide, including WC, including Co, or further including carbonitride such as Ti, Ta, Nb, etc.), cermet (TiC, TiN, TiCN, etc.) High-speed steel, ceramics (titanium carbide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, and mixtures thereof), cubic boron nitride sintered body, diamond sintered body Etc. can be mentioned as examples of such a substrate. When a cemented carbide is used as such a base material, the effect of the present invention is exhibited even if such a cemented carbide contains an abnormal phase called free carbon or η phase in the structure.

  In addition, these base materials may have a modified surface. For example, in the case of cemented carbide, a de-β layer may be formed on the surface, and in the case of cermet, a surface hardened layer may be formed, and even if the surface is modified in this way, The effect is shown.

<Coating film>
Coating of the present _{invention, Al a Ti b Si c M} d N ( provided that Shikichu, 0.35 ≦ a ≦ 0.7,0 <c ≦ 0.1,0 <d ≦ 0.3, a + b + c + d = 1) a layer a consisting _{of, Ti e Si f Me g N} ( provided that Shikichu, 0 <f ≦ 0.1,0 <g ≦ 0.3, e + f + g = 1) consisting of B layer and each 2 alternately In the above formula, M and Me are each independently one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W. The A layer and the B layer each have a layer thickness of 20 nm or less, each A layer has substantially the same layer thickness, and each B layer has substantially the same layer thickness, In the A layer, the atomic ratio of Al decreases continuously or stepwise from the base material side to the surface side of the coating film, and the top of the Al constituting the A layer closest to the base material. The atomic ratio in the formula as a _1, when the atomic ratio in the above formula of Al constituting the A layer closest to the surface of the coating film and a _2, satisfies the following formula (I) It is said.

a ₁ −a ₂ ≧ 0.005 (I)
Such a coating film of the present invention includes an aspect in which the entire surface of the substrate is coated, and also includes an aspect in which the coating film is not partially formed. The aspect which the lamination | stacking aspect of a part differs is also included. Further, the coating film of the present invention is characterized in that the entire film thickness is 1 μm or more and 15 μm or less. If it is less than 1 μm, the abrasion resistance may be inferior, and if it exceeds 15 μm, the adhesion to the substrate and the fracture resistance may be reduced. A particularly preferable film thickness of such a coating film is 2 μm or more and 8 μm or less. In addition, said coating film may contain arbitrary layers other than A layer, B layer, and outermost surface layer.

Hereinafter, such a coating film will be described in more detail.
<A layer>
A layer constituting the _{laminate, Al a Ti b Si c M} d N ( provided that Shikichu, 0.35 ≦ a ≦ 0.7,0 <c ≦ 0.1,0 <d ≦ 0.3, a + b + c + d = 1). Such an A layer is excellent in heat resistance, hardness, and stress balance, and therefore effective for high-speed, chipping resistance of the cutting edge during dry processing. The a is preferably 0.5 ≦ a ≦ 0.6, and the c is more preferably 0.03 ≦ c ≦ 0.08. In this case, the balance of heat resistance, hardness, and compressive residual stress is good. In the above formula, if a is less than 0.35 or d exceeds 0.3, the effect of improving the oxidation resistance and hardness cannot be sufficiently obtained, and if a exceeds 0.7 , Since the hardness of the coating film is greatly reduced and the wear resistance is lowered.

  Here, M constituting the A layer is one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W. By including such an element in the A layer at a ratio of 30 atomic% or less, solid solution strengthening occurs in the A layer, and the hardness of the A layer can be increased.

Note that in the notation Al _a Ti _b Si _c M _d N, and "Al _a Ti _b Si _c M _d", the composition ratio between "N" 1: not limited only to the case of 1, the composition ratio All possible ratios can be included, and the ratio between the two is not particularly limited.

<B layer>
B layer constituting the laminate together with the above layer _{A, Ti e Si f Me g N} ( provided that Shikichu, 0 <f ≦ 0.1, e + f + g = 1) , characterized in that a. Such a B layer is excellent in wear resistance and toughness, but in order to cope with further high speed and dry processing, there is a limit in itself, so in the present invention, it is laminated alternately with the above A layer. It is. When said f is 0.1 or less, the rapid increase of the compressive stress of B layer can be suppressed and the adhesive fall can be suppressed. Here, f is more preferably 0.03 ≦ f ≦ 0.08. In this case, the balance between wear resistance and toughness is further improved. In the above formula, if f exceeds 0.1, the compressive residual stress increases, and delamination tends to occur, which is not preferable.

  Here, Me constituting the B layer is one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W, similarly to M constituting the A layer. It is characterized by being. By including such an element in the B layer at a ratio of 30 atomic% or less, solid solution strengthening occurs in the B layer, and the hardness of the B layer can be increased.

Note that in the notation Ti _e Si _f Me _g N, the composition ratio between "Ti _e Si _f Me _g" "N" 1: not limited only to the case of 1, it is possible as a composition ratio ratio The ratio of the two is not particularly limited.

<Layer thickness and laminated body of A layer and B layer>
Each of the A layer and the B layer as described above has a layer thickness of 20 nm or less. By alternately laminating two or more layers of the A layer and the B layer having such a layer thickness, the adhesion between the A layer and the B layer becomes strong, and delamination between the layers can be suppressed. The A layer and the B layer are preferably as thin as possible because the adhesiveness can be improved by making them thin enough not to peel off between the layers, but for convenience of manufacturing facilities, they are 2 nm or more and 10 nm or less. It is more preferable. When these layer thicknesses are less than 2 nm, the number of rotations of the rotary table for setting the base material of the film forming apparatus is too fast, making film formation difficult due to the specifications of the apparatus. The respective characteristics of both the A layer and the B layer cannot be enjoyed.

  Moreover, each A layer which comprises a laminated body is substantially the same layer thickness, It is characterized by the above-mentioned. Here, “substantially the same layer thickness” means that the layer thickness of any one of the A layers is the same as the layer thickness of the other A layers, and can be regarded as substantially the same. It means that the difference may be a slight difference. Further, similarly to the A layer, each B layer has substantially the same layer thickness. In addition, the value measured by TEM is employ | adopted for the layer thickness of A layer and B layer.

  Here, the laminate included in the coating film 105 may be provided directly on the base 110 as shown in FIG. 1, or after the intermediate layer is formed on the base 110, It may be provided. As long as both the A layer 102 and the B layer 103 are alternately stacked, the stacked body may start stacking with either layer, or may end the stacking with either layer. Further, the outermost surface layer 104 may be formed on the outermost surface of the coating film 105 or the outermost surface layer 104 may not be formed. When forming the outermost surface layer 104, the outermost surface layer 104 may be formed on the B layer 103 as shown in FIG. 1, or the outermost surface layer may be formed on the A layer although not shown. Good. Alternatively, the outermost surface layer 104 may be formed after forming a binder layer on the laminate. In addition, although the dotted line part in FIG. 1 shows that lamination | stacking is repeated, the minimum number of lamination | stacking of the lamination | stacking aspect of this invention is a total of four layers that A layer 102 and B layer 103 are two layers each. Is the case.

<Difference in atomic ratio of Al>
The coating film of the present invention is based on the fact that two or more layers of the A layer and the B layer are alternately laminated. It is expected that the layers A and B, which are excellent in heat resistance, hardness, and stress balance, and the layer B, which is excellent in wear resistance and toughness, are alternately laminated, thereby enjoying the respective characteristics of both layers. It is what. However, by simply laminating these two layers with the same composition, it is not possible to achieve both of the characteristics of both layers. Especially in high-speed machining and dry machining of iron-based work materials, the atomic ratio of Al is In many coating films, a diffusion reaction occurs and crater wear (wear on the rake face) is likely to occur.

Therefore, as a result of various investigations by the present inventors, the above-mentioned A layer has the Al atomic ratio that decreases continuously or stepwise from the substrate side to the surface side of the coating film, and the most in the substrate. When the atomic ratio in the formula of Al constituting the A layer on the near side is a ₁ and the atomic ratio in the formula of Al constituting the A layer on the side closest to the surface of the coating film is a ₂ , It has been found that by satisfying the formula (I), crater wear can be suppressed without impairing the properties of both layers.

a ₁ −a ₂ ≧ 0.005 (I)
In the following, a ₁ -a ₂ in the formula (I) is also referred to as “difference in atomic ratio of Al”.

  That is, while improving the toughness by increasing the atomic ratio of Al constituting the A layer closest to the substrate, the atomic ratio of Al constituting the A layer closest to the surface of the coating film is increased. Reduce crater wear by reducing the amount. Such a coating film of the present invention has both wear resistance and fracture resistance, and can significantly improve the tool life in high speed and dry processing.

The difference in the atomic ratio of Al (that is, a ₁ −a ₂ ) is preferably 0.01 or more and 0.1 or less. By making such Al distribution, toughness and crater wear resistance can be achieved in a well-balanced manner. If the difference in the atomic ratio of Al is less than 0.005, the effect of improving crater wear cannot be sufficiently obtained, and if it exceeds 0.1, the difference in the atomic ratio of Al is too large, resulting in a stress balance. It collapses and the coating film is easily peeled off. Film forming conditions for causing a difference in the atomic ratio of Al in the A layer will be described later.

Here, the atomic ratio a _{1 of} Al constituting the A layer closest to the substrate and the atomic ratio a _{2 of} Al constituting the A layer closest to the surface of the coating film are measured by EDS. The selected value shall be adopted. Hereinafter, a method of calculating the difference in the atomic ratio of Al will be described with reference to FIGS. FIG. 2A is a schematic cross-sectional view showing a state before removing the steel ball pressed against the coating film, and FIG. 2B shows a state after removing the steel ball pressed against the coating film. It is a typical sectional view shown.

  First, as shown in FIG. 2A, a calotest mark is formed on the coating film 105 by pressing the steel ball 100 having a diameter of 30 mm against the coating film 105 until it contacts the substrate 110 while rotating. This calotest trace was observed with a SEM at a magnification of 5000 times, and using EDS, the atomic ratio of Ti, Al, and Si of the A layer 106 closest to the base material of the coating film 105, and the coating film 105 The atomic ratio of Ti, Al, and Si in the A layer 107 closest to the surface is measured. And based on these measured values, the difference in the atomic ratio of Al in the coating film is calculated.

<Atomic ratio of Si>
The atomic ratio c of Si constituting the A layer and the atomic ratio f of Si constituting the B layer are each preferably 0.1 or less in each formula. Thereby, it is possible to suppress an increase in compressive stress while improving heat resistance, and it is possible to prevent a decrease in adhesion. When c and f which are atomic ratios of Si exceed 0.1, delamination is likely to occur due to an increase in compressive stress. As described above, when the atomic ratio a of Al decreases from the substrate side to the surface side of the coating film, the atomic ratio c of Si increases from the substrate side to the surface side of the coating film. However, as the atomic ratio c of Si here, the atomic ratio of Si constituting the A layer closest to the intermediate point in the thickness direction of the stacked body is adopted.

  Further, the atomic ratio c of Si constituting the A layer and the atomic ratio f of Si constituting the B layer preferably satisfy the following formula (II), and more preferably | c in the formula (II): -F | is 0.03 or less.

| C−f | ≦ 0.05 (II)
By adjusting the atomic ratio of Si in the A layer and the B layer within such a range, the adhesion of the coating film can be remarkably improved. If the formula (II) is not satisfied, the uniformity of the composition cannot be obtained or the difference in stress between the layers is too large.

<Outermost surface layer>
The surface-coated cutting tool of the present invention preferably includes an outermost surface layer on the surface side of the coating film (that is, the side opposite to the side in contact with the base material of the coating film). Ti _e Si _f Me _g CN (although Shikichu, 0 <f ≦ 0.1,0 <g ≦ 0.3, e + f + g = 1) is preferably made of. Thus, the outermost surface layer made of carbonitride having the composition constituting the B layer has a low coefficient of friction and high lubricity as compared with the nitride because carbon is dispersed in the layer. Become. For this reason, it becomes difficult for the cutting edge of the tool during cutting to become high temperature, suppresses oxidation of the coating film, prevents the work material from being welded to the cutting edge, and improves the surface roughness. Such an outermost layer preferably has a layer thickness of 0.05 μm or more and 4 μm or less, more preferably 0.1 μm or more and 2 μm or less.

<Manufacturing method>
The coating film of the present invention is preferably formed by physical vapor deposition (PVD method). In order to form the coating film of the present invention on the substrate surface, it is indispensable to be a film forming process capable of forming a compound having high crystallinity, and various film forming methods were examined. As a result, it has been found that it is optimal to use physical vapor deposition. Physical vapor deposition methods include, for example, sputtering method, ion plating method, etc. Especially, when using cathode arc ion plating method with high ion ratio of raw material elements, before forming the coating film, On the other hand, since metal or gas ion bombardment treatment is possible, the adhesion between the coating film and the substrate is significantly improved, which is preferable.

  Therefore, the coating film of the present invention is preferably formed by employing a cathode arc ion plating method which is a kind of physical vapor deposition method. FIG. 3 is a schematic diagram of an arc ion plating apparatus 200 used in the cathode arc ion plating method. In the opposing evaporation sources 201 and 202, an AlTiSiM target for the A layer is set in the evaporation source 201, and a TiSiMe target for the B layer is set in the evaporation source 202. On the other hand, no target is set in the evaporation source 203. Further, the base 210 (cutting tool) is set on the rotary table 204.

Here, a of Al _a Ti _b Si _c M _d N constituting the A layer by the composition of the target to be set in the evaporation source 201 (the ratio of Al and Ti, Si and M), b, c, and d Can be determined. However, as will be described later, the atomic ratio a of Al can be increased or decreased by the pressure and temperature in the chamber and the bias voltage applied to the substrate 210. Further, it is possible to determine e, f, and g of Ti _e Si _f Me _g N constituting the B layer by the composition of the target to be set in the evaporation source 202 (the ratio of Ti and Si and Me).

  Then, after the apparatus is evacuated to a vacuum, sputter cleaning (bombarding) with Ar gas is performed while rotating the rotary table 204 at 5 rpm while the apparatus is heated to, for example, 500 ° C. Thereafter, a bias voltage of −50 V is applied to the substrate, and the evaporation sources 201 and 202 are always arc-discharged by a constant arc current while rotating the rotary table 204 at 3 rpm, thereby ionizing each target. At the same time, nitrogen, which is a reactive gas, is introduced from the gas introduction port 205, and A layers and B layers are alternately formed on the surface of the substrate 210.

That, Al _a front when the substrate 210 passes the evaporation source 201 Ti _b Si _c M _d N consisting of A layer is deposited, Ti _e previous evaporation source 202 when the substrate 210 passes Si _f Me _g N consisting B layer is deposited, the rotary table 204 in this manner can be stacked sequentially alternately a layer and the B layer according to the rotation. By adjusting the arc current of the evaporation source 201 and the rotation speed of the table during film formation, the layer thicknesses of the A layer and the B layer can be adjusted, and the arc currents of the evaporation sources 201 and 202 are kept constant. As a result, both the A layer and the B layer can have substantially the same layer thickness.

  That is, the lower the arc current of the evaporation sources 201 and 202, the thinner the layer thicknesses of the A layer and the B layer. However, the arc current needs to be 80 A or more in order to stabilize the discharge of the target. When the arc current is less than 80 A, the arc discharge becomes unstable and it becomes difficult to form the layer thicknesses of the A layer and the B layer uniformly.

  In order to form the A layer and the B layer with substantially the same layer thickness, the arc currents of the evaporation sources 201 and 202 must always be constant during the formation of the coating film. . That is, if the arc current is increased or decreased during film formation, the A layer and the B layer cannot be made substantially the same layer thickness.

  When the arc current is about 150 A, the A layer and the B layer having a layer thickness of 20 nm or less can be formed by setting the number of rotations of the table to 3 rpm or more and 15 rpm or less. If the number of rotations of the table is less than 3 rpm, the layer thicknesses of the A layer and the B layer may exceed 20 nm, and exceeding 15 rpm is not preferable because of restrictions on manufacturing equipment.

  In addition, by increasing the bias voltage of the base material stepwise or stepwise during the film formation, the collision energy of ion particles to the base material gradually increases, and a part of Al in the A layer is sputtered. Since it is released to the outside of the system, the atomic ratio of Al in the A layer decreases stepwise or stepwise from the substrate side to the surface side of the coating film. On the other hand, since atoms other than Al are not released out of the system by sputtering, as the atomic ratio of Al in the A layer decreases, the atomic ratios of Ti, Si, and M in the A layer are covered from the substrate side. It increases relatively toward the surface side of the film. On the other hand, since the B layer does not contain Al, the atomic ratio of the composition constituting the B layer does not change and matches the composition ratio of the target set in the evaporation source 202.

  In order to form a coating film so as to satisfy the above formula (I), the pressure and temperature in the chamber and the bias voltage applied to the substrate are constant at the initial and final film formation. The difference in bias voltage between the initial stage of film formation and the final stage of film formation is preferably 70 V or more. That is, for example, when the bias voltage at the initial stage of film formation is 30 V, it is preferable to adjust the bias voltage so that the bias voltage is increased gradually or stepwise from there to be 100 V at the latter stage of film formation.

  From the same viewpoint as the bias voltage, the pressure in the chamber is preferably reduced by 1.5 Pa or more from the initial stage of film formation to the end of film formation. For example, if the pressure in the chamber at the initial stage of film formation is 4 Pa, the pressure in the chamber is reduced gradually or stepwise, and the pressure in the chamber is adjusted so that the pressure in the chamber at the end of film formation becomes 2.5 Pa. It is preferable.

  The temperature in the chamber is preferably raised by 200 ° C. or more from the initial stage of film formation to the end of film formation. For example, if the temperature in the chamber at the initial stage of film formation is 500 ° C., the temperature in the chamber is gradually or stepwise increased, and the temperature in the chamber is set so that the temperature in the chamber at the end of film formation becomes 700 ° C. or higher. It is preferable to adjust.

  The layer thickness of each layer can be controlled by the number of rotations of the turntable 204 and the arc current value. If the thickness of each of the A layer and the B layer is less than 2 nm, the number of rotations of the turntable becomes very fast, and film formation becomes difficult due to device specifications. The arc ion plating apparatus 200 includes a plurality of heaters 206.

  After forming the A layer and the B layer as described above, nitrogen in the chamber is evacuated, and then nitrogen and methane as reaction gases are introduced from the gas inlet 205. At the same time, by applying a bias voltage to the substrate 210 and rotating the rotary table 204, an arc current is applied to cause the evaporation source 202 to arc, thereby ionizing the TiSiMe target and forming the outermost surface layer made of TiSiMeCN. Form. The outermost surface layer formed in this way is preferably formed by applying a bias voltage of 200 V or more at the time of film formation after the temperature in the chamber is set to a high temperature of 550 ° C. or higher. By forming the film under such conditions, a dense outermost surface layer can be formed. Under normal arc ion plating film forming conditions such that the bias voltage when forming the outermost surface layer is 30 V or more and 100 V or less, the reaction gases methane and acetylene are not sufficiently decomposed and partially carbonized. Precipitates, which may reduce heat resistance and strength.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these.

  An arc ion plating apparatus as shown in FIG. 3 was used, a target for forming each layer was set in an evaporation source, and a coating film was formed on the substrate at a substrate temperature of 450 ° C.

  Three types of base materials are available: cemented carbide end mill (φ10mm, 6 blades), cemented carbide drill (φ8mm), and P20 equivalent cemented carbide milling throw tip (shape: SEMT13T3AGSN-G). Then, the coating films of Examples 1 to 21 and Comparative Examples 1 to 16 shown in Table 1 were respectively formed.

  The coating film was formed by laminating “A layer” and “B layer” described in the “Composition” column in Table 1, and describing them in the “Composition” column in Table 1 on the outermost surface. It was configured by forming an “outermost surface layer”. When the outermost surface layer was not formed, “-” is shown in Table 1. In addition, in the A layer, the atomic% of Al decreases from the base material side to the surface side, but in Table 1, the composition of the A layer closest to the middle point in the thickness direction of the laminate constituting the coating film. showed that. The “layer thickness” column shows the layer thicknesses of the A layer, the B layer, and the outermost surface layer, and the “total film thickness” column shows the film thickness of the coating film.

Further, the column of “Si ratio difference” indicates the difference between the Si atomic ratio c of the A layer and the Si atomic ratio f of the B layer constituting the laminate, and the “Al ratio difference” The column shows the difference between the atomic ratio a _{1 of} Al constituting the A layer closest to the substrate of the coating film and the atomic ratio a _{2 of} Al constituting the A layer closest to the surface side. showed that.

For example, Example 1 uses the arc ion plating apparatus of FIG. 3, sets Al _0.55 Ti _0.35 Si _0.05 W _0.05 as the target material of the evaporation source 201, and Ti _0.93 Si _0.04 W _{0.03 as} the target material of the evaporation source 202. And a surface-coated cutting tool in which a coating film is formed. In order to obtain a film having the target composition, one or more reactive gases selected from the group consisting of N ₂ gas, CH ₄ gas, and Ar gas were introduced to adjust the pressure in the chamber.

  First, after evacuating so that the pressure in the chamber of the arc ion plating apparatus of FIG. 3 became a vacuum, the temperature in the chamber was raised to 570 ° C. Then, Ar gas was introduced to maintain the pressure in the chamber at 3.0 Pa, and the substrate surface was cleaned (bombarded) for 15 minutes while the DC bias voltage was gradually increased to −1000 V. Thereafter, the argon gas was exhausted. As a result, Ar ions sputter-cleaned the substrate surface, and strong dirt and oxide films were removed.

Next, an A layer and a B layer were formed. N ₂ gas was introduced so that the pressure in the chamber was 3 Pa, and the substrate DC bias voltage was set to −50V. The Al _0.55 Ti _0.35 Si _0.05 W _0.05 target is ionized with an arc current of 150 A, the Ti _0.93 Si _0.04 W _0.03 target is ionized with an arc current of 130 A, and each is reacted with N ₂ gas, resulting in a layer thickness of 9 nm on the substrate. A _0.55 Ti _0.35 Si _0.05 W _0.05 N layer A and 6 nm thick Ti _0.93 Si _0.04 W _0.03 N layer B were alternately formed.

  During the film formation, the substrate DC bias voltage is gradually decreased from −50 V to decrease the substrate DC bias voltage at the end of the film formation to −150 V, and the pressure in the chamber is gradually decreased from 3 Pa. Then, the film was formed such that the pressure in the chamber at the end of the film formation was 1.5 Pa. The number of layers A and B was 233 respectively.

Finally, the outermost surface layer was formed. The temperature in the chamber was 650 ° C., N ₂ gas and methane gas were introduced at a flow rate ratio of 4: 1 so that the pressure was 3 Pa, and the base material DC bias voltage was 200V. Then, the Ti _0.93 Si _0.04 W _0.03 target is ionized with an arc current of 130 A and reacted with N ₂ gas and methane gas to form an outermost surface layer of Ti _0.93 Si _0.04 W _0.03 CN having a layer thickness of 0.5 μm. Thus, the surface-coated cutting tool of the present invention was produced.

By pressing a steel ball having a diameter of 30 mm against the coating film while rotating it against the coating film, a carotest mark was formed. This Karotesuto marks were observed at 5000-fold by SEM, was measured atomic ratio a ₁ of the A layer 106 of the side nearest to the substrate of the coating film 105 by using the EDS, the atomic ratio a ₁ of the Al 0. 5538. On the other hand, when the atomic ratio a ₂ of the A layer 107 closest to the surface side of the coating film 105 was measured, the atomic ratio a _{2 of} Al was 0.5463. From these Al atomic ratio values, 0.0075 was calculated as the difference in Al atomic ratio (a ₁ −a ₂ ).

  Surface-coated cutting tools of other examples and comparative examples were produced in the same manner as these, and the difference in the atomic ratio of Al was measured. In Comparative Example 16, the same target material as in Example 1 was used, but the arc current of the evaporation sources 201 and 202 during film formation was changed, and the layer thickness of the A layer gradually increased from the substrate side to the surface side. By forming the A layer so as to be thin, the Al content is increased so that the Al content is larger on the substrate side of the coating film and the Al content is smaller on the surface side of the coating film. Controlled.

  The surface-coated cutting tool thus obtained (namely, surface-coated end mill, surface-coated drill, and surface-coated milling throw-away tip) was evaluated under the following cutting conditions. The results of the cutting evaluation are shown in Table 2.

(1) End mill evaluation It performed using the surface coating end mill. That is, the end mill cutting conditions were as follows: a cemented carbide end mill with 6 blades and an outer diameter of 10 mm was used as the base material, the work material was SKD11 (HRC61), the side cutting was downcut, and the cutting speed was 200 m / min. , Feed amount = 0.025 mm / blade, cutting amount a _p = 10 mm, a _e = 0.6 mm, air blow. The wear width of the outer periphery of the cutting edge at the cutting length of 50 m was measured. The smaller the wear width, the better the wear resistance.

(2) Drill evaluation A surface-coated drill was used. That is, the drill cutting conditions are as follows. A hard metal drill having an outer diameter of 8 mm is used as the base material, the work material is S50C, the drilling speed is 80 m / min, the feed rate is 0.25 mm / rev, This was performed without a through hole having a hole depth of 30 mm and without cutting oil. The wear width of the tip margin at the cutting length of 30 m was measured. The smaller the wear width, the better the wear resistance.

(3) Milling evaluation A throw-away tip for surface-coated milling was used. As described above, the milling conditions were P20 equivalent cemented carbide throwaway tip (shape: SEMT13T3AGSN-G) as the base material, the work material was SCM435 (block material of width 300 mm × length 200 mm), and cutting speed = 300 m / min, feed rate = 0.25 mm / t, depth of cut = 1.5 mm, without cutting oil. The wear width of the flank at a cutting time of 15 minutes was measured. The smaller the wear width, the better the wear resistance.

  From Table 2, it was found that the surface-coated cutting tool of the example has a significantly improved tool life as compared with the surface-coated cutting tool of the comparative example, and can sufficiently cope with high speed and dry processing. That is, it was confirmed that the surface-coated cutting tool of the present invention has the characteristics of AlTiSiMN and TiSiMeN, and has wear resistance, fracture resistance, and adhesion.

  Although the embodiments and examples of the present invention have been described as described above, it is also planned from the beginning to appropriately combine the configurations of the above-described embodiments and examples.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  100 Steel balls, 106 A layer closest to the substrate, 107 A layer closest to the surface, 110, 210 Substrate, 102 A layer, 103 B layer, 200 Arc ion plating apparatus, 201, 202, 203 evaporation source, 204 rotary table, 205 gas inlet, 206 heater.

Claims (7)

A substrate and a coating film formed thereon,
The coating film is less thickness 15μm or 1 [mu] m, and _{Al a Ti b Si c M d} N ( provided that Shikichu, 0.35 ≦ a ≦ 0.7,0 <c ≦ 0.1,0 <a d ≦ 0.3, a + b + c + d = 1) consisting of A _{layer, Ti e Si f Me g N} ( provided that where each of 0 <f ≦ 0.1,0 <g ≦ 0.3 , e + f + g = 1) And a layered product in which two or more layers are alternately laminated,
In the formula, M and Me each independently represent one or more elements selected from the group consisting of V, Cr, Zr, Nb, Mo, Hf, Ta, and W;
Each of the A layer and the B layer has a layer thickness of 20 nm or less,
Each of the A layers has substantially the same layer thickness,
Each of the B layers has substantially the same layer thickness,
In the A layer, the atomic ratio of Al decreases continuously or stepwise from the substrate side to the surface side of the coating film,
The atomic ratio of Al constituting the A layer on the side closest to the base material in the above formula is a _1, and Al constituting the A layer on the side closest to the surface of the coating film in the above formula A surface-coated cutting tool that satisfies the following formula (I) when the atomic ratio is a ₂ .
a ₁ −a ₂ ≧ 0.005 (I) The surface-coated cutting tool according to claim 1, wherein an atomic ratio c of Si constituting the A layer and an atomic ratio f of Si constituting the B layer satisfy the following formula (II).
| C−f | ≦ 0.05 (II)   The surface-coated cutting tool according to claim 1 or 2, wherein both the A layer and the B layer have a layer thickness of 2 nm or more and 10 nm or less. The coating film has an outermost surface layer on the surface side thereof,
The outermost surface _{layer, Ti e Si f Me g CN} ( although Shikichu, 0 <f ≦ 0.1,0 <g ≦ 0.3, e + f + g = 1) consisting of, in any one of claims 1 to 3 The surface-coated cutting tool described. The A _{layer, Al a Ti b Si c M} d N ( provided that Shikichu, 0.5 ≦ a ≦ 0.6,0.03 ≦ c ≦ 0.08,0 <d ≦ 0.3, a + b + c + d = 1 The surface-coated cutting tool according to claim 1, comprising: The B _{layer, Ti e Si f Me g N} ( provided that Shikichu, 0.03 ≦ f ≦ 0.08,0 <g ≦ 0.3, e + f + g = 1) consisting of any of claims 1 to 5 The surface-coated cutting tool according to 1.   The surface-coated cutting tool according to claim 1, wherein the coating film is formed by an arc ion plating method.

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