JP2011160135A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of suppressing temperature rise of a support mounting part. <P>SOLUTION: A camera body 100 can be attached to a support, and is used for acquiring an object image. The camera body 100 has: a CMOS image sensor 110; the support mounting part 155; a frame bottom surface 154a; and a heat transfer member 160. The CMOS image sensor 110 generates an electric signal showing the object image. The support mounting part 155 is provided to be attachable to the support. The frame bottom surface 154a supports the support mounting part 155. The heat transfer member 160 is connected to the frame bottom surface 154a, and at least a part of it is arranged between the CMOS image sensor 110 and the support mounting part 155. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an imaging apparatus to which a support can be attached.

As an imaging device, for example, an interchangeable lens type digital camera is known (for example, see Patent Document 1). The camera described in Patent Document 1 includes a lens unit and a camera body. This camera body includes an image sensor such as a CCD (Charge Coupled Device) image sensor, and a mirror box device disposed between the lens unit and the image sensor. The mirror box device guides the light passing through the lens unit to either the CCD image sensor or the prism. The light guided to the prism is guided to the viewfinder by the prism.
The imaging apparatus as described above may be provided with a support attachment portion for attaching a support such as a tripod or a monopod. For example, an interchangeable lens type digital camera described in Patent Document 2 includes a tripod mounting portion on the bottom surface. When shooting with the digital camera in a stable posture, a tripod for supporting the digital camera is attached to the tripod mounting portion.

Japanese Patent Laid-Open No. 2007-127836 JP 2007-322985 A

2. Description of the Related Art Conventionally, there has been a demand for downsizing an imaging apparatus. For example, in an interchangeable lens type digital camera, downsizing of a camera body is required.
However, by reducing the size of the camera body, the components are densely arranged, so the distance between the electronic component that generates heat, such as the substrate on which the image sensor and camera controller are mounted, and the support mounting part is conventionally It is smaller than the camera body.
On the other hand, the power consumption of the image sensor and camera controller increases as the image quality increases, and the amount of heat generated by these electronic components increases. As a result, the heat generation density in the vicinity of the electronic component is increased, and heat generated in the electronic component is transmitted to the support attachment portion, which may increase the temperature of the support attachment portion. When the user touches the support attachment part and senses a temperature difference between the ambient temperature and the support attachment part, the user may feel uncomfortable.

  In the imaging device described below, it is possible to suppress an increase in the temperature of the support attachment portion.

The imaging device disclosed herein is an imaging device that can be attached to a support and obtains an image of a subject, and includes an imaging element, a support, a support attachment, a heat transfer member, It has. The image sensor generates an electrical signal representing an image of the subject. The support fixture mounting portion is provided so as to be attachable to the support fixture. The support portion supports the support attachment portion. The heat transfer member is connected to the support portion, and at least a part of the heat transfer member is disposed between the image sensor and the support attachment portion.
Here, the support tool is a fixing tool that is attached to the imaging device in order to stabilize the posture of the imaging device during photographing. For example, a tripod or a monopod can be considered as the support.
The imaging device here is a concept that includes not only an imaging device capable of taking a single image but also a camera body. For example, the imaging apparatus includes a camera body of an interchangeable lens type camera to which a lens unit can be attached.

  In this imaging apparatus, part of the heat generated by the imaging element is absorbed by the heat transfer member and is transmitted from the heat transfer member to the support portion. As described above, since the amount of heat transmitted from the image sensor to the support attachment portion is reduced, an increase in the temperature of the support attachment portion can be suppressed.

  As described above, in the above-described imaging device, it is possible to suppress an increase in temperature of the support attachment portion.

1 is a perspective view of a digital camera 1. FIG. The perspective view of the camera main body 100. FIG. 1 is a block diagram of a digital camera 1. FIG. 1 is a schematic sectional view of a digital camera 1. FIG. 2 is a rear view of the camera body 100. FIG. (A) Schematic sectional view of a single-lens reflex camera 800, (B) Schematic sectional view of a digital camera 1. The perspective view of the heat-transfer member 160 which concerns on 1st Embodiment. (A) VIII-VIII sectional drawing of FIG. (B) The schematic fragmentary sectional view of the camera main body 100 which expanded and showed the periphery of the support fixture attaching part 155 in FIG. (A) The top view of the heat-transfer member 160 which concerns on 1st Embodiment. (B) The figure which showed the periphery of the heat-transfer member 160 in FIG. 8 (A). (A) The figure equivalent to FIG. 8 (A) in the camera main body 300 which concerns on 2nd Embodiment. FIG. 9B is a diagram corresponding to FIG. (A) The figure corresponding to Drawing 9 (A) in camera main part 300 concerning a 2nd embodiment. FIG. 10B is a diagram corresponding to FIG. (A) The figure corresponding to Drawing 8 (A) which shows heat transfer member 460 concerning modification 1 of a 1st embodiment. (B) The figure equivalent to Drawing 8 (A) which shows heat transfer member 560 concerning modification 3 of a 1st embodiment. (C) The figure corresponding to Drawing 8 (B) which shows heat transfer member 560 concerning modification 3 of a 1st embodiment. (D) The figure corresponding to Drawing 8 (A) which shows heat transfer member 760 concerning modification 4 of a 1st embodiment. (A) A figure corresponding to Drawing 10 (B) in modification 2 of a 2nd embodiment. (B) The figure equivalent to Drawing 11 (A) in modification 3 of a 2nd embodiment.

[First Embodiment]
<1-1: Overview of digital camera>
FIG. 1 is a perspective view of a digital camera 1 (an example of an imaging apparatus) according to the first embodiment. FIG. 2 is a perspective view of the camera body 100. FIG. 3 is a functional block diagram of the digital camera 1.
The digital camera 1 is an interchangeable lens type digital camera for acquiring an image of a subject, and includes a camera body 100 and a lens unit 200 that can be attached to the camera body 100.
Unlike a single-lens reflex camera, the camera body 100 does not have a mirror box device, and therefore has a smaller flange back than a conventional single-lens reflex camera. Further, the camera body 100 is downsized by reducing the flange back. Further, since the degree of freedom in designing the optical system is increased by reducing the flange back, the lens unit 200 is downsized. Details of each part will be described below.

For convenience of explanation, the subject side of the digital camera 1 is front, the imaging surface side is rear or back, the vertical upper side in the normal posture of the digital camera 1 (hereinafter also referred to as horizontal shooting posture) is upper or upper, and the vertical lower side. The side is also called the lower side or the lower side.
Here, the landscape orientation means that the direction parallel to the long side of the image that is a horizontally long rectangle matches the horizontal direction of the subject in the image, and the direction parallel to the short side of the image is the subject in the image. When the release button 131 (FIG. 1) coincides with the vertical direction, the direction in which the release button 131 (FIG. 1) is pressed substantially coincides with the vertical downward direction.
Further, the right side when the digital camera 1 is viewed from the side opposite to the subject in the horizontal shooting posture of the digital camera 1 is referred to as the right or right side. Similarly, the left side when the digital camera 1 is viewed from the side opposite to the subject in the horizontal shooting posture of the digital camera 1 is referred to as the left or the left side.

Further, the vertical direction in the horizontal shooting posture of the digital camera 1 is referred to as an up-down direction or a vertical direction. Similarly, the left-right direction in the horizontal shooting posture of the digital camera 1 is referred to as a left-right direction or a horizontal direction.
Also, the vertical direction and the direction perpendicular to the horizontal direction coincide with the front-rear direction, the direction facing the subject is called the front direction, and the direction opposite to the front direction is called the rear direction.
In the following, a three-dimensional coordinate axis is set as shown in FIG. In FIG. 1, the X-axis direction coincides with the front-rear direction, the Y-axis direction coincides with the left-right direction, and the Z-axis direction coincides with the up-down direction. Further, the coordinate axes described in the drawings other than FIG. 1 are based on the three-dimensional coordinate axes set in FIG.
<1-2: Configuration of the camera body>
FIG. 4 is a schematic cross-sectional view of the digital camera 1. FIG. 5 is a rear view of the camera body 100. A camera body 100 (an example of an imaging device) mainly includes a main circuit board including a CMOS (Complementary Metal Oxide Semiconductor) image sensor 110, a CMOS circuit board 113, a camera monitor 120, an operation unit 130, and a camera controller 140. 142, body mount 150, power source 175, card slot 170, electronic viewfinder 180, shutter unit 190, optical low-pass filter 114, diaphragm 115, main frame 154, support fixture 155. And a heat dissipating member 198 and an exterior portion 101.

The exterior portion 101 is a member that forms the outer surface of the camera body 100, and includes a bottom surface 101a and a front surface 101b. The bottom surface 101a is disposed below the CMOS image sensor 110 in the landscape orientation, and the front surface 101b is disposed on the subject side.
The camera body 100 includes, in order from the front, a body mount 150, a shutter unit 190, a diaphragm 115, an optical low-pass filter 114, a CMOS image sensor 110, a CMOS circuit board 113, a heat sink 195, a main circuit board 142, and a camera monitor 120. Is arranged. A part of the main frame 154 is disposed at a position overlapping with the body mount 150 and a direction parallel to the optical axis AX (hereinafter also referred to as an optical axis direction).
The CMOS image sensor 110 (an example of an image sensor) converts an optical image of a subject (hereinafter also referred to as a subject image) incident through the lens unit 200 into image data. The generated image data is digitized by the AD converter 111 of the CMOS circuit board 113. The image data digitized by the AD converter 111 is subjected to various image processing by the camera controller 140. Examples of the various image processing referred to here include gamma correction processing, white balance correction processing, scratch correction processing, YC conversion processing, electronic zoom processing, and JPEG compression processing. The function of the CMOS circuit board 113 may be included in the CMOS image sensor 110 or the main circuit board 142.

The CMOS image sensor 110 operates based on the timing signal generated by the timing generator 112 of the CMOS circuit board 113. The CMOS image sensor 110 acquires still image data and moving image data under the control of the CMOS circuit board 113. The acquired moving image data is also used for displaying a through image. Note that still image data and moving image data are examples of image data.
Here, the through image is an image in which data is not recorded in the memory card 171 among the moving image data. The through image is mainly a moving image, and is displayed on the camera monitor 120 and / or the electronic viewfinder 180 (hereinafter also referred to as EVF) in order to determine the composition of the moving image or the still image.
The CMOS image sensor 110 can acquire a low-resolution moving image used as a through image and a high-resolution moving image used for recording. As a high-resolution moving image, for example, a moving image of HD size (high vision size: 1920 × 1080 pixels) can be considered. The CMOS image sensor 110 is an example of an image sensor that converts an optical image of a subject into an electrical image signal. As described above, the image pickup element is an electronic component that generates an electric signal representing an image, and has a concept including a photoelectric conversion element such as a CCD image sensor in addition to the CMOS image sensor 110.

The CMOS circuit board 113 is a circuit board that controls the CMOS image sensor 110. The CMOS circuit board 113 is a circuit board that performs predetermined processing on image data output from the CMOS image sensor 110. The CMOS circuit board 113 includes a timing generator 112 and an AD converter 111. The CMOS circuit board 113 is an example of an image sensor circuit board that drives and controls the image sensor and performs predetermined processing such as AD conversion on image data output from the image sensor.
The camera monitor 120 is a liquid crystal display, for example, and displays an image or the like indicated by the display image data. The display image data is generated by the camera controller 140. The display image data is, for example, data for displaying image data that has undergone image processing, shooting conditions of the digital camera 1, operation menus, and the like as images. The camera monitor 120 can selectively display both moving images and still images.

The camera monitor 120 is provided in the camera body 100. In the present embodiment, the camera monitor 120 is disposed on the back surface of the camera body 100, but the camera monitor 120 may be disposed anywhere on the camera body 100. The angle of the display surface of the camera monitor 120 with respect to the camera body 100 can be changed. Specifically, as shown in FIG. 5, the camera body 100 includes a hinge 121 that rotatably connects the camera monitor 120 to the exterior portion 101. The hinge 121 is disposed at the left end of the exterior part 101. More specifically, the hinge 121 specifically includes a first hinge and a second hinge. The camera monitor 120 can rotate in the left-right direction with respect to the exterior part 101 around the first hinge, and can also rotate in the vertical direction with respect to the exterior part 101 around the second hinge.
The camera monitor 120 is an example of a display unit provided in the camera body 100. In addition, as the display unit, an organic EL, inorganic EL, plasma display panel, or the like that can display an image can be used. Further, the display unit may be provided in another place such as a side surface or an upper surface instead of the back surface of the camera body 100.

The electronic viewfinder 180 displays an image or the like indicated by the display image data created by the camera controller 140. The EVF 180 can selectively display both moving images and still images. Moreover, the EVF 180 and the camera monitor 120 may display the same content or display different content. These are controlled by the camera controller 140. The EVF 180 includes an EVF liquid crystal monitor 181 that displays an image and the like, an EVF optical system 182 that enlarges the display of the EVF liquid crystal monitor 181, and an eyepiece window 183 that allows the user to approach the eyes.
The EVF 180 is also an example of a display unit. The difference from the camera monitor 120 is that the user looks closely. The structural difference is that the EVF 180 has an eyepiece window 183, whereas the camera monitor 120 does not have an eyepiece window 183.

Note that the EVF liquid crystal monitor 181 ensures display luminance by providing a backlight (not shown) in the case of transmissive liquid crystal and a front light (not shown) in the case of reflective liquid crystal. The EVF liquid crystal monitor 181 is an example of an EVF monitor. The monitor for EVF can use what can display an image, such as organic EL, inorganic EL, and a plasma display panel. In the case of a self-luminous device such as an organic EL, an illumination light source is not necessary.
The operation unit 130 receives an operation by a user. Specifically, as shown in FIGS. 1 and 2, the operation unit 130 includes a release button 131 that accepts a shutter operation by the user, and a power switch 132 that is a rotary dial switch provided on the upper surface of the camera body 100. ,including. The power switch 132 is turned off at the first rotation position and turned on at the second rotation position. The operation unit 130 only needs to accept an operation by the user, and includes a button, a lever, a dial, a touch panel, and the like.

The camera controller 140 is a device that controls the center of the camera body 100 and controls each part of the camera body 100. For example, the camera controller 140 controls the shutter unit 190 so that the shutter unit 190 maintains an open state in a state where the supply of power from the power source 175 is stopped. In addition, the camera controller 140 receives an instruction from the operation unit 130. The camera controller 140 transmits a signal for controlling the lens unit 200 to the lens controller 240 via the body mount 150 and the lens mount 250, and indirectly controls each part of the lens unit 200. That is, the camera controller 140 controls the entire digital camera 1.
The camera controller 140 receives various signals from the lens controller 240 via the body mount 150 and the lens mount 250. The camera controller 140 uses the DRAM 141 as a work memory during control operations and image processing operations. The camera controller 140 is an example of a body control unit (or body microcomputer). The camera controller 140 is disposed on the main circuit board 142.

The card slot 170 can be loaded with a memory card 171. The card slot 170 controls the memory card 171 based on a control signal transmitted from the camera controller 140. Specifically, the card slot 170 stores still image data in the memory card 171. The card slot 170 outputs still image data from the memory card 171. The card slot 170 stores moving image data in the memory card 171. The card slot 170 outputs moving image data from the memory card 171.
The memory card 171 can store image data generated by the camera controller 140 through image processing. For example, the memory card 171 can store an uncompressed RAW image file and a compressed JPEG image file. Further, the memory card 171 can output image data or an image file stored therein in advance through the card slot 170. The image data or image file output from the memory card 171 is subjected to image processing by the camera controller 140. For example, the camera controller 140 performs an expansion process on the image data or the image file acquired from the memory card 171 to generate display image data.

The memory card 171 can further store moving image data generated by the camera controller 140 through image processing. For example, the memory card 171 is a video compression standard H.264. A moving image file compressed according to H.264 / AVC can be stored. Further, the memory card 171 can output moving image data or a moving image file stored therein in advance via the card slot 170. The moving image data or moving image file output from the memory card 171 is subjected to image processing by the camera controller 140. For example, the camera controller 140 performs a decompression process on the moving image data or the moving image file acquired from the memory card 171 to generate display moving image data.
The memory card 171 is an example of a storage unit. The storage unit may be attachable to the camera body 100 like the memory card 171 or may be fixed to the digital camera 1.

The power source 175 supplies power for use in the digital camera 1 to each unit. The power source 175 may be, for example, a dry battery or a rechargeable battery. The power source 175 may be a unit that receives power from the outside via a power cord or the like and supplies power to the digital camera 1.
The body mount 150 can be mounted with the lens unit 200 and includes a body mount ring 151 and an electrical contact 153. The body mount 150 can be mechanically and electrically connected to the lens mount 250 of the lens unit 200.
The body mount ring 151 is a ring-shaped member provided on the front surface 101 b of the exterior portion 101, and mechanically supports the lens unit 200 by fitting with the lens mount ring 251 provided on the lens unit 200. . The lens mount ring 251 is fitted into the body mount ring 151 by a so-called bayonet mechanism. Specifically, the lens mount ring 251 is fitted with the body mount ring 151 in a first state where the lens mount ring 251 is not fitted with the body mount ring 151 according to the rotational positional relationship around the optical axis with the body mount ring 151. The second state can be taken.

More specifically, the lens mount ring 251 can take a first state that can move in the optical axis direction with respect to the body mount ring 151. In such a first state, the lens mount ring 251 can be inserted into the body mount ring 151. When the lens mount ring 251 is rotated with respect to the body mount ring 151 while being inserted into the body mount ring 151, the lens mount ring 251 is fitted to the body mount ring 151. The rotational positional relationship between the body mount ring 151 and the lens mount ring 251 at this time is the second state.
In order to support the lens mount ring 251, the body mount ring 151 is required to have strength. Therefore, the body mount ring 151 is preferably formed of metal. In the present embodiment, the body mount ring 151 is made of metal.

  In a state where the lens unit 200 is mounted on the camera body 100, the electrical contact 153 is in contact with the electrical contact 253 included in the lens mount 250. As described above, the body mount 150 and the lens mount 250 can be electrically connected via the electrical contact 153 of the body mount 150 and the electrical contact 253 of the lens mount 250. Therefore, the digital camera 1 can transmit and receive at least one of data and control signals between the camera body 100 and the lens unit 200 via the body mount 150 and the lens mount 250. Specifically, the body mount 150 and the lens mount 250 can transmit and receive at least one of data and control signals between the camera controller 140 and the lens controller 240 included in the lens unit 200. The body mount 150 supplies the power received from the power source 175 to the entire lens unit 200 via the lens mount 250.

The body mount 150 is supported on the main frame 154 via the body mount support portion 152. More specifically, the body mount support portion 152 is connected to the body mount ring 151 and supports the body mount ring 151.
The body mount support 152 is supported by the main frame 154 and is disposed between the body mount ring 151 and the shutter unit 190. The body mount support 152 has an opening, and the inner diameter of the opening is smaller than the inner diameter of the body mount ring 151. The body mount support part 152 is also an example of a protective member that protects components arranged inside the camera body 100.
The shutter unit 190 is a so-called focal plane shutter, and can block light to the CMOS image sensor 110. The shutter unit 190 is disposed between the body mount 150 and the CMOS image sensor 110. The shutter unit 190 includes a rear curtain, a front curtain, and a shutter support frame. The shutter support frame is provided with an opening through which light guided from the subject to the CMOS image sensor 110 passes. The shutter unit 190 adjusts the exposure time of the CMOS image sensor 110 by moving the rear curtain and the front curtain back and forth with respect to the opening of the shutter support frame. The shutter unit 190 can mechanically maintain the open state. Mechanical holding is a concept of holding an open state without using electric force, and includes, for example, engagement between objects and holding by a permanent magnet.

The optical low-pass filter 114 removes high frequency components of light incident from the subject. Specifically, the optical low-pass filter 114 separates the subject image formed by the lens unit 200 so that the resolution is coarser than the pixel pitch of the CMOS image sensor 110. In general, an image sensor such as the CMOS image sensor 110 is provided with an RGB color filter called a Bayer array or a YCM complementary color filter called a Bayer array in each pixel. Therefore, when the image is resolved to one pixel, not only a false color is generated, but also an ugly moire phenomenon occurs in a subject having a repetitive pattern. Note that the optical low-pass filter 114 also has an Ir cut filter function for cutting infrared light.
The diaphragm 115 is disposed in front of the CMOS image sensor 110 and is supported by the diaphragm support unit 116 to prevent dust from adhering to the CMOS image sensor 110. Further, the diaphragm 115 shakes off dust attached to the diaphragm 115 itself by vibration. Specifically, the diaphragm 115 includes a transparent thin plate member, a piezoelectric element, and a fixing member that fixes the plate member via the piezoelectric element. And when an alternating voltage is applied and a piezoelectric element vibrates, a plate-shaped member will vibrate. The diaphragm support unit 116 supports the diaphragm 115 so as to be disposed at a predetermined position with respect to the CMOS image sensor 110. The diaphragm support unit 116 is supported by the main frame 154 via the body mount 150 and the shutter unit 190.

The main frame 154 includes a frame bottom surface portion 154a (an example of a support portion) and a frame front surface portion 154b, and is disposed inside the camera body 100. More specifically, the frame front surface portion 154 b is disposed along the front surface 101 b of the camera body 100, and the frame bottom surface portion 154 a is disposed along the bottom surface 101 a of the camera body 100. In the present embodiment, the frame front surface portion 154b is connected to the frame bottom surface portion 154a.
Thus, the main frame 154 is formed in accordance with the shape of the camera body 100 and has a long shape in the left-right direction (an example of the second direction) along the exterior portion 101. Specifically, as shown in FIG. 9A, the shape of the frame bottom surface portion 154a is a rectangle that is long in the left-right direction (that is, the Y-axis direction) when viewed from the up-down direction.

The frame front surface portion 154 b is connected to the body mount support portion 152. That is, the main frame 154 supports the lens unit 200 via the body mount 150. Further, a support fixture mounting portion 155 is fitted into the frame bottom surface portion 154a, and the main frame 154 supports the support fixture mounting portion 155. Therefore, the main frame 154 needs a certain level of strength. Therefore, the main frame 154 is preferably made of metal. In the present embodiment, the main frame 154 is made of metal. As a material of the main frame 154, for example, a stainless alloy can be considered.
The support attachment portion 155 is a member for attaching a support such as a tripod, and is fitted into the frame bottom surface portion 154a. The support attachment portion 155 has a screw hole 155a and an exposed surface 155b.

As shown in FIGS. 8A and 8B, the screw hole 155a is provided so that the screw of the support tool can be fitted therein, and the outside of the bottom surface 101a of the exterior portion 101 (more specifically, the CMOS of the bottom surface 101a). It is exposed on the opposite side of the image sensor 110. The exposed surface 155b is exposed outside the bottom surface 101a. In the present embodiment, a part of the support attachment portion 155 protrudes inside the frame bottom surface portion 154a (more specifically, the CMOS image sensor 110 side of the frame bottom surface portion 154a).
When the support tool is attached to the support tool attachment portion 155, the screw provided on the support tool is fixed in a state of being fitted into the screw hole 155a. In this way, the camera body 100 is supported by the support tool by attaching the support tool to the support tool mounting portion 155, and the posture of the digital camera 1 is stabilized at the time of shooting.

The screw hole 155a has a central axis 155c, and a screw provided on the support is fitted into the screw hole 155a along a first direction parallel to the central axis 155c. Since a relatively large force acts on the screw hole 155a via a screw provided in the support, in order to prevent damage to the screw thread formed in the screw hole 155a, Some strength is required. Therefore, the support attachment portion 155 is preferably formed of metal. In the present embodiment, the support attachment portion 155 is made of metal. In the present embodiment, the support attachment portion 155 is arranged so that the first direction coincides with the vertical direction (that is, the Z-axis direction) in the landscape orientation.
On the other hand, in order to suppress the temperature rise of the support fixture mounting portion 155, the support fixture mounting portion 155 is desirably formed of a metal having a relatively low thermal conductivity. As a material satisfying these conditions concerning strength and thermal conductivity, for example, a stainless alloy can be considered.

As shown in FIGS. 8A and 8B, the support fixture mounting portion 155 is disposed on the lower side of the CMOS image sensor 110, and the support fixture mounting portion 155 is substantially aligned with the CMOS image along the first direction. Side by side with the sensor 110. If the support attachment portion 155 is arranged in this way, the support attachment portion 155 can be arranged even when a relatively heavy component (for example, the lens unit 200) is arranged around the CMOS image sensor 110. It is difficult for the center weight distribution to be biased. As a result, the digital camera 1 is easily stabilized when attached to the support.
The heat transfer member 160 is a member for suppressing heat transfer from the CMOS image sensor 110 to the support fixture mounting portion 155, and as shown in FIG. 7, the shielding portion 161, the first flange 164, and the second flange. 165. If a material having a thermal conductivity larger than that of the support attachment portion 155 or the frame bottom surface portion 154a is used as the material of the heat transfer member 160, a preferable heat radiation effect can be obtained. As a material of the heat transfer member 160, for example, a metal such as aluminum or copper can be considered.

The shielding part 161 is provided so as to shield the flow of heat from the CMOS image sensor 110 toward the support attachment part 155, and has a shielding part main body 162 and a side wall part 163.
The shielding part main body 162 is a flat plate-like member and is disposed between the CMOS image sensor 110 and the support fixture attaching part 155. As shown in FIG. 9A, in the present embodiment, the shielding part main body 162 is a rectangular plate, and is substantially parallel to the frame bottom surface part 154a in a state where the direction of the long side substantially coincides with the left-right direction (that is, (Generally perpendicular to the Z-axis direction). More specifically, the shielding part main body 162 is disposed at a position overlapping the support attachment part 155 when viewed from the first direction.
As described above, a part of the support attachment portion 155 protrudes toward the CMOS image sensor 110 side of the frame bottom surface portion 154a, but the shielding portion 161 is disposed so as not to contact the support attachment portion 155. More specifically, a gap is formed in the first direction between the shielding portion main body 162 and the support attachment portion 155. Further, a gap is formed between the side wall portion 163 and the support attachment portion 155 in a direction perpendicular to the first direction. In other words, the shielding portion 161 is arranged so that direct heat conduction does not occur between the shielding portion 161 and the support attachment portion 155.

The outer peripheral part of the shielding part main body 162 is connected to a side wall part 163 which will be described later. Since the side wall part 163 is disposed between the shielding part main body 162 and the frame bottom surface part 154a, a space is provided in the first direction between the shielding part main body 162 and the frame bottom surface part 154a.
The side wall portion 163 is a member extending from the shielding portion main body 162 toward the frame bottom surface portion 154a, and includes a first wall 163a, a second wall 163b, a third wall 163c, and a fourth wall 163d. Yes. Each of the first wall 163a to the fourth wall 163d is a rectangular plate member, and extends from the outer peripheral portion of the shielding portion 161 to the frame bottom surface portion 154a substantially along the first direction.
As shown in FIG. 7, the first wall 163a is disposed on the left side of the support attachment portion 155, the second wall 163b is disposed on the right side, the third wall 163c is disposed on the front side, and the fourth wall 163d is disposed on the rear side. Is arranged. Thus, the 1st wall 163a and the 2nd wall 163b are facing the left-right direction on both sides of the support fixture attaching part 155. In addition, the third wall 163c and the fourth wall 163d are opposed to each other in the front-rear direction with the support attachment portion 155 interposed therebetween.

As shown in FIG. 8B, a gap is provided in the Z-axis direction between the third wall 163c and the frame bottom surface portion 154a. Similarly, a gap is provided in the Z-axis direction between the fourth wall 163d and the frame bottom surface portion 154a. Therefore, the third wall 163c and the fourth wall 163d are not in contact with the frame bottom surface portion 154a.
The first flange 164 (an example of a first connection portion) is a plate-like member fixed to the frame bottom surface portion 154a, and connects the shielding portion 161 to the frame bottom surface portion 154a. The first flange 164 is connected to the first wall 163a and extends toward the opposite side of the support attachment portion 155 (the left side in FIGS. 9A and 9B) along the frame bottom surface portion 154a. Yes.
The second flange 165 (an example of the second connection portion) is a plate-like member fixed to the frame bottom surface portion 154a, and connects the shielding portion 161 to the frame bottom surface portion 154a. The first flange 164 is connected to the second wall 163b and extends toward the opposite side of the support fixture mounting portion 155 (the right side in FIGS. 9A and 9B) along the frame bottom surface portion 154a. Yes. Thus, the second flange 165 is provided on the opposite side to the first flange 164 with the support attachment portion 155 interposed therebetween. In addition, the first flange 164 and the second flange 165 are disposed with a space in the left-right direction from the support attachment portion 155.

The first flange 164 and the second flange 165 are formed integrally with the shielding portion 161, for example. Here, the first flange 164 and the second flange 165 are fixed to the surface of the frame bottom surface portion 154a on the CMOS image sensor 110 side. As a method of fixing to the frame bottom surface portion 154a, for example, a screw (not shown). Screwing using can be considered. In this way, the first flange 164 and the second flange 165 are connected to the frame bottom surface portion 154a, so that the heat transfer member 160 is in contact with the frame bottom surface portion 154a.
If a screw for fixing the heat transfer member 160 with the frame bottom surface portion 154a to the frame bottom surface portion 154a is exposed from the bottom surface 101a, the user can connect the screw when the heat inside the camera body 100 is transferred to the screw. You may feel uncomfortable by touching and sensing the temperature difference between the ambient temperature and the screw temperature. In consideration of this, a screw for fixing the heat transfer member 160 is disposed inside the exterior portion 101.

The heat dissipating member 198 includes a heat dissipating plate 195 and a heat conducting unit 196. The heat sink 195 is disposed between the CMOS image sensor 110 and the main circuit board 142. Specifically, the heat sink 195 is disposed between the CMOS circuit board 113 and the main circuit board 142. The heat radiating plate 195 is a rectangular plate member for radiating heat generated by the CMOS image sensor 110. If a metal having a high thermal conductivity such as aluminum or copper is used as the material of the heat radiating plate 195, a preferable heat radiating effect can be obtained.
A heat conducting unit 196 is connected to the heat radiating plate 195 in order to transmit heat to the diaphragm support unit 116. The heat conducting unit 196 is connected and fixed to the diaphragm support unit 116. The heat generated from the CMOS image sensor 110 is transmitted to the diaphragm support unit 116 via the heat dissipation plate 195 and the heat conduction unit 196. In order to enable such heat transfer, a heat radiating plate 195 is disposed on the back surface of the CMOS image sensor 110, and a heat conducting portion 196 extends from the heat radiating plate 195 to the diaphragm support portion 116.

More specifically, the heat conducting unit 196 has four plates, and the plates extend forward from the upper and lower ends and the left and right ends of the heat radiating plate 195. In other words, the heat conducting unit 196 is disposed so as to surround the upper, lower, left, and right sides of the CMOS image sensor 110. As described above, the CMOS image sensor 110 is surrounded on the upper side, the both sides, the lower side, and the rear side by the heat radiating plate 195 and the heat conducting portion 196.
Note that the heat conducting unit 196 does not necessarily need to be connected to the diaphragm support unit 116, and may be connected to any component disposed between the main frame 154 and the CMOS image sensor 110. As an example, the body mount support part 152 and the shutter unit 190 can be considered.
In addition, the heat conduction part 196 does not necessarily need to be connected with the diaphragm support part 116 at four places. For example, at least one of the four plates may connect the heat sink 195 to the diaphragm support 116. However, considering the stability of the heat sink 195, it is desirable to connect at three or more locations.

<1-3: Configuration of lens unit>
The lens unit 200 can be attached to the camera body 100 and forms an optical image of a subject. The lens unit 200 mainly includes an optical system L, a drive unit 215, a lens controller 240, a lens mount 250, a diaphragm unit 260, and a lens barrel 290.
The optical system L includes a zoom lens group 210 for changing the focal length of the optical system L, and an OIS (Optical Image Stabilizer) lens for suppressing blurring of a subject image formed by the optical system L with respect to the CMOS image sensor 110. And a focus lens group 230 for changing the focus state of the subject image formed on the CMOS image sensor 110 by the optical system L.

The aperture unit 260 is a light amount adjusting member that adjusts the amount of light transmitted through the optical system L. Specifically, the aperture unit 260 includes an aperture blade (not shown) that can block part of the light beam transmitted through the optical system L, an aperture drive unit (not shown) that drives the aperture blade, have.
The drive unit 215 drives each lens group (the zoom lens group 210, the OIS lens group 220, and the focus lens group 230) of the optical system L based on the control signal of the lens controller 240. The driving unit 215 has a detection unit for detecting the position of each lens group of the optical system L.
The lens mount 250 has a lens mount ring 251 (not shown) and an electrical contact 253 (not shown), and can be mechanically and electrically connected to the body mount 150 as described above.

The lens controller 240 controls the entire lens unit 200 based on the control signal transmitted from the camera controller 140. The lens controller 240 receives the position information of each lens group of the optical system L detected by the detection unit included in the drive unit 215 and transmits it to the camera controller 140. The camera controller 140 generates a control signal for controlling the driving unit 215 based on the received position information, and transmits the control signal to the lens controller 240. The lens controller 240 transmits the control signal generated by the camera controller 140 to the driving unit 215. The driving unit 215 adjusts the positions of the zoom lens group 210, the OIS lens group 220, and the focus lens group 230 based on the control signal.
On the other hand, the camera controller 140 is based on information such as the amount of light received by the CMOS image sensor 110, whether to perform still image shooting or moving image shooting, and an operation to preferentially set an aperture value. Thus, a control signal for operating the aperture unit 260 is generated. At this time, the lens controller 240 relays the control signal generated by the camera controller 140 to the aperture unit 260.

The lens controller 240 uses the DRAM 241 as a work memory when driving the lens groups of the optical system L and the aperture unit 260. The flash memory 242 stores programs and parameters used by the lens controller 240.
The lens barrel 290 mainly accommodates the optical system L, the lens controller 240, the lens mount 250, and the aperture unit 260 inside. In addition, a zoom ring 213, a focus ring 234, and an OIS switch 224 are provided outside the lens tube 290.
The zoom ring 213 is a cylindrical member and can be rotated on the outer peripheral surface of the lens cylinder 290. The zoom ring 213 is an example of an operation unit for operating the focal length. When the zoom ring 213 is rotated, the focal length of the optical system L is determined according to the position of the zoom ring 213 after the rotation. The position of the zoom ring 213 is detected by, for example, a detection unit included in the drive unit 215.

The focus ring 234 is a cylindrical member and can be rotated on the outer peripheral surface of the lens cylinder 290. The focus ring 234 is an example of an operation unit for operating the focus state of a subject image formed on the CMOS image sensor 110 by the optical system L. When the focus ring 234 is rotated, the focus state of the subject image is adjusted according to the position of the focus ring 234 after the rotation. For example, the lens controller 240 generates a control signal based on the position information of the focus ring 234 and outputs the control signal to the drive unit 215. The drive unit 215 drives the focus lens group 230 based on the control signal.
The OIS switch 224 is an example of an operation unit for operating the OIS. When the OIS switch 224 is turned off, the OIS does not operate. When the OIS switch 224 is turned on, the OIS becomes operable.

<1-4: Structural features>
The camera body 100 does not have a mirror box device, and this is different from a single-lens reflex camera. Hereinafter, structural features of the camera body 100 will be described in more detail with reference to FIGS. 6 (A) and 6 (B).
6A is a schematic cross-sectional view of a single-lens reflex camera 800, and FIG. 6B is a schematic cross-sectional view of the digital camera 1 of the present embodiment. In FIG. 6B, members such as the body mount 150, the shutter unit 190, the diaphragm 115, the diaphragm support portion 116, the heat radiating plate 195, and the heat conduction portion 196 are omitted.
In the single-lens reflex camera 800 shown in FIG. 6A, a mirror box device is arranged on the front surface of the CMOS image sensor 810, that is, on the lens unit 802 side of the CMOS image sensor 810. The mirror box device includes a reflection mirror 803 and a pentaprism 804. The CMOS circuit board 813 and the main circuit board 842 including the camera controller 840 are sequentially arranged on the back surface of the CMOS image sensor 810 (that is, on the side opposite to the lens unit 802 with respect to the CMOS image sensor 810). Has been placed. Further, in order to ensure the strength of the camera body 801, a metal main frame 854 is disposed along the bottom surface from the front surface inside the camera body 801. Further, a support fixture mounting portion 855 is provided on the bottom surface of the camera body 801, and the support fixture mounting portion 855 is fixed to the main frame 854.

In the single-lens reflex camera 800, the optical image of the subject formed by the lens unit 802 is guided to the CMOS image sensor 810 or the optical finder 805 by the reflecting mirror 803 and the pentaprism 804 included in the mirror box device. As described above, since it is necessary to secure a space for disposing the movable reflection mirror 803 and the pentaprism 804 and a space for an optical path from the reflection mirror 803 to the optical viewfinder 805 in the camera body 801, the camera The main body 801 is not suitable for downsizing.
On the other hand, the single-lens reflex camera 800 easily dissipates heat generated from the CMOS image sensor 810 due to a large space inside the camera body 801 and a large surface area of the camera body 801. Further, since the support attachment portion 855 can be arranged at a position away from the CMOS image sensor 810, heat generated from the CMOS image sensor 810 is relatively difficult to be transmitted to the support attachment portion 855.

On the other hand, as shown in FIG. 6B, in the digital camera 1 of the present embodiment, since the mirror box device is not disposed on the front side of the CMOS image sensor 110, the flange back can be shortened, and the camera body 100 can be miniaturized. Furthermore, since the flange back is short, the degree of freedom in designing the optical system L is increased, and the lens unit 200 can be downsized. Therefore, the digital camera 1 can be reduced in size by omitting the mirror box device.
On the other hand, since the space in which the mirror box device is provided as in the single-lens reflex camera 800 is not required, the camera body 100 can be reduced in size. However, in the digital camera 1, the parts are arranged densely. The distance between the CMOS image sensor 110 and the support mounting portion 155 is smaller than that of the single-lens reflex camera 800.

Furthermore, the power consumption of the CMOS image sensor 110 and the camera controller 140 is increased due to the high image quality and the moving image shooting, and the heat generation amount of the CMOS image sensor 110 and the camera controller 140 is increased.
For example, since the digital camera 1 employs the CMOS image sensor 110 that supports shooting of high-resolution moving images, a CMOS image sensor that does not support shooting of high-resolution moving images (for example, a single-lens reflex camera). Compared with the CMOS image sensor 810) of the camera 800, the power consumption is increased approximately three times (from 0.4 W to 1.2 W). As a result, the calorific value of the CMOS image sensor 110 is larger than the calorific value of a CMOS image sensor that does not support shooting of high-resolution moving images.
As described above, in the digital camera 1, the heat generation amount of electronic components such as the CMOS image sensor 110 and the camera controller 140 is increased as compared with the single-lens reflex camera 800. Since 155 is arranged near the CMOS image sensor 110, heat generated by the CMOS image sensor 110 is easily transmitted to the support attachment portion 155. Further, the heat generated by the CMOS image sensor 110 is easily transmitted to the bottom surface 101 a via the support attachment portion 155. As a result, when the user touches the support fixture mounting portion 155 or the bottom surface 101a, the user may sense a temperature difference between the ambient temperature and the temperature of the support fixture mounting portion 155 or the bottom surface 101a and feel uncomfortable. .

<1-5: Heat dissipation structure>
As described above, in the digital camera 1 that has been improved in performance and size, a structure that suppresses the temperature rise at the support attachment portion 155 is required.
Therefore, the camera body 100 is provided with a heat transfer member 160. Specifically, as shown in FIGS. 8A and 8B, a shielding portion 161 (more specifically, a shielding portion main body 162) is disposed between the CMOS image sensor 110 and the support attachment portion 155. ing. Furthermore, as described above, the support attachment portion 155 is made of metal, but the shielding portion 161 is made of metal having a higher thermal conductivity than the metal of the support attachment portion 155. Therefore, the radiant heat emitted from the electronic components such as the CMOS image sensor 110 and the camera controller 140 is more easily transmitted to the shielding unit 161 than the support attachment unit 155. In this way, part of the radiant heat emitted from the electronic components such as the CMOS image sensor 110 and the camera controller 140 is absorbed by the shielding part 161, so that the amount of heat transfer to the support attachment part 155 is reduced, and the support attachment. The temperature rise of the part 155 can be suppressed.

Further, as shown in FIGS. 9A and 9B, the shielding part 161 is disposed so as to surround the support attachment part 155. Specifically, the shielding part main body 162 is disposed on the upper side of the support attachment part 155, and the side wall part 163 is disposed on the front and rear sides and the left and right sides of the support attachment part 155. Therefore, most of the heat convection generated when the electronic components such as the CMOS image sensor 110 and the camera controller 140 generate heat are blocked by the shielding portion 161 and do not reach the support attachment portion 155. Thus, since the convective heat transfer amount to the support fixture mounting portion 155 is reduced, the temperature rise of the support fixture mounting portion 155 can be further suppressed.
On the other hand, a part of the heat generated in the CMOS image sensor 110 and transmitted to the heat transfer member 160 by heat convection or radiation is guided to the heat transfer member 160 and transmitted to the frame bottom surface portion 154 a of the main frame 154. More specifically, the heat absorbed by the heat transfer member 160 moves to the frame bottom surface portion 154a via the first flange 164 and the second flange 165 fixed to the frame bottom surface portion 154a. At this time, as described above, since the first flange 164 and the second flange 165 are arranged at a distance from the support attachment portion 155, the heat transferred from the CMOS image sensor 110 to the heat transfer member 160 is supported by the support fixture. It is discharged to the frame bottom surface portion 154a at a position away from the attachment portion 155.

Here, the heat released to the frame bottom surface portion 154a may be transmitted to the support attachment portion 155 via the frame bottom surface portion 154a. However, the first flange 164 and the second flange 165 are arranged in the longitudinal direction (that is, the left-right direction) of the frame bottom surface portion 154a, and are arranged at a distance from the support attachment portion 155. Accordingly, since the heat conduction distance is increased, the heat loss due to heat conduction is increased, and the amount of heat flowing through the frame bottom surface portion 154a to the support attachment portion 155 is reduced. Thus, it is possible to suppress the temperature rise of the support attachment part 155.
Although the size of the camera body 100 in the front-rear direction tends to become smaller as the camera body 100 becomes smaller, the size of the camera body 100 in the left-right direction can be relatively large. Therefore, in the camera main body 100, the direction of the long side of the shielding part main body 162 substantially coincides with the left-right direction, and the first flange 164 and the second flange 165 are arranged in the left-right direction. In this way, the heat transfer member 160 is arranged in a state where a preferable heat dissipation effect can be obtained without hindering the miniaturization of the camera body 100.

<1-6: Features of the camera body>
Here, the features of the camera body 100 according to the first embodiment are summarized.
(1) In the camera main body 100, at least a part of the heat transfer member 160 is disposed between the CMOS image sensor 110 and the support mounting portion 155, and the heat transfer member 160 is connected to the frame bottom surface portion 154a. Part of the heat generated in the CMOS image sensor 110 is absorbed by the heat transfer member 160 and is transmitted from the heat transfer member 160 to the frame bottom surface portion 154a. Thus, since the amount of heat transferred from the CMOS image sensor 110 to the support fixture mounting portion 155 is reduced, an increase in the temperature of the support fixture mounting portion 155 can be suppressed.
(2) In this camera body 100, a gap is provided between the heat transfer member 160 and the support attachment part 155, and the support attachment part 155 is not in contact with the heat transfer member 160. Heat conduction due to direct contact does not occur between 160 and the support attachment portion 155. Therefore, even when the heat generated by the CMOS image sensor 110 is transferred to the heat transfer member 160 by radiation, heat convection, or the like, the amount of heat transferred from the heat transfer member 160 to the support attachment portion 155 is reduced. The temperature rise of the tool mounting portion 155 can be suppressed.

(3) In this camera body 100, at least a part of the heat transfer member 160 overlaps with the support attachment portion 155 when viewed from the first direction (that is, the vertical direction). Part of the heat released toward the first direction is blocked by the heat transfer member 160. For this reason, it is possible to arrange the support attachment portion 155 and the CMOS image sensor 110 side by side in the first direction while suppressing heat transmitted from the CMOS image sensor 110 to the support attachment portion 155. Thus, even when the calorific value of the CMOS image sensor 110 is large, the support attachment portion 155 can be disposed at a position relatively close to the CMOS image sensor 110. The degree of freedom is improved.
(4) In this camera body 100, the first flange 164 and the second flange 165 connect the shielding portion 161 to the frame bottom surface portion 154a, and the first flange 164 and the second flange 165 are connected to the shielding portion 161 (in more detail). Extends from the first wall 163a and the second wall 163b) to the opposite side of the support fixture 155. For this reason, the heat transmitted from the CMOS image sensor 110 to the shielding part 161 is conducted in a direction away from the support attachment part 155 by the first flange 164 and the second flange 165, and is released to the frame bottom part 154a. In this way, since a heat flow is formed in a direction away from the support attachment portion 155, the amount of heat transferred from the heat transfer member 160 to the support attachment portion 155 through the frame bottom surface portion 154a is reduced, and the support is attached. The temperature rise of the tool mounting portion 155 is suppressed.

(5) Further, since the first flange 164 and the second flange 165 are arranged at a distance from the support attachment portion 155, the heat released from the heat transfer member 160 is attenuated when being transmitted through the frame bottom surface portion 154a. As a result, the amount of heat transmitted to the support attachment portion 155 is further reduced.
At this time, since the first flange 164 and the second flange 165 are arranged in the second direction in which the frame bottom surface portion 154a extends, the distance between the first flange 164 and the support fixture mounting portion 155 and the second flange 165 are arranged. And the support attachment portion 155 can be increased. As a result, the amount of heat that flows from the heat transfer member 160 through the frame bottom surface portion 154a and flows into the support attachment portion 155 is further reduced.
(6) In this camera body 100, the heat conductivity of the heat transfer member 160 is greater than the heat conductivity of either the frame bottom surface part 154 a or the support attachment part 155, so the heat generated in the CMOS image sensor 110. Is more easily transmitted to the heat transfer member 160 than the frame bottom surface portion 154a or the support fixture attachment portion 155. For this reason, the amount of heat transmitted to the support fixture mounting portion 155 is reduced. Further, since heat is not easily transmitted to the frame bottom surface portion 154a, the amount of heat transmitted to the support attachment portion 155 via the frame bottom surface portion 154a is reduced. As a result, the temperature rise of the support attachment part 155 is suppressed.

[Second Embodiment]
In the first embodiment described above, only a gap is provided between the frame bottom surface portion 154a and the bottom surface 101a. However, even if a member is disposed between the frame bottom surface portion 154a and the bottom surface 101a. Good.
Hereinafter, a camera body 300 (an example of an imaging apparatus) according to the second embodiment will be described with reference to FIGS. 10A and 10B and FIGS. 11A and 11B. Here, the description will focus on the parts different from the camera body 100 of the first embodiment, and the description of the common parts will be omitted. Note that members having substantially the same functions as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
<2-1: Configuration of the camera body>
10A and 10B show the periphery of the support attachment portion 155 in the camera body 300. FIG. Similar to the first embodiment, in the camera body 300, the heat transfer member 160 is disposed between the CMOS image sensor 110, which is a main heat generation source, and the support attachment portion 155. In addition, in the camera body 300, a heat conductive sheet 359 is disposed between the bottom surface 101a and the frame bottom surface portion 154a.

The heat conductive sheet 359 is a sheet-like member for diffusing and dissipating heat generated in the CMOS image sensor 110 and transmitted to the frame bottom surface portion 154a, and includes a first sheet 359a and a second sheet 359b. Yes. If a material having a thermal conductivity larger than that of the support attachment portion 155 or the frame bottom surface portion 154a is used as the material of the heat conductive sheet 359, a preferable heat diffusion effect can be obtained. As a material of the heat conductive sheet 359, for example, a metal such as aluminum or copper can be considered.
As shown in FIG. 11B, the first sheet 359a (an example of the first heat diffusion portion) is disposed on the opposite side of the frame bottom surface portion 154a from the first flange 164. Further, as shown by shading in FIG. 11A, the first flange 164 is disposed inside the first sheet 359a when viewed from the first direction (that is, the vertical direction). Specifically, the first sheet 359a extends from the end E1 (an example of the first end) of the first flange 164 on the support attachment portion 155 side to the opposite side of the support attachment portion 155. More specifically, the first sheet 359a is disposed on the left side of the end E1.

The 2nd sheet | seat 359b (an example of a 2nd heat-diffusion part) is arrange | positioned on the opposite side to the 2nd flange 165 of the frame bottom face part 154a. Further, as shown by hatching in FIG. 11A, the second flange 165 is disposed inside the second sheet 359b when viewed from the first direction (that is, the vertical direction). Specifically, the second sheet 359b extends from the end E2 (an example of the second end) of the second flange 165 on the support fixture mounting portion 155 side to the side opposite to the support fixture mounting portion 155. More specifically, the second sheet 359b is disposed on the right side of the end E2.
If the heat conductive sheet 359 is in contact with the frame bottom surface part 154a, the diffusion of heat from the frame bottom surface part 154a to the heat conductive sheet 359 is promoted. Therefore, in the present embodiment, the heat conductive sheet 359 is attached to the bottom surface 101a side of the frame bottom surface portion 154a.
<2-2: Heat dissipation structure>
As described above, since the heat conductive sheet 359 is provided, part of the heat generated in the CMOS image sensor 110 and transmitted to the frame bottom surface portion 154a through the heat transfer member 160 is diffused by the heat conductive sheet 359. Is done. Hereinafter, heat diffusion and heat dissipation in the heat conductive sheet 359 will be described.

As in the first embodiment, part of the heat generated in the CMOS image sensor 110 is transmitted through the heat transfer member 160 and is released to the frame bottom surface portion 154a via the first flange 164 or the second flange 165. On the other hand, the heat conductivity of the material (for example, aluminum or copper) of the heat conductive sheet 359 is larger than the heat conductivity of the material (for example, stainless steel alloy) of the frame bottom surface portion 154a. Heat conduction to the sheet 359 is promoted. Further, since the heat conductive sheet 359 is disposed with a space from the support attachment portion 155 and spreads away from the support attachment portion 155, the heat transmitted to the heat conduction sheet 359 is supported by the support attachment portion 155. It is led away from the place.
Thus, the heat conductive sheet 359 can diffuse the heat conducted from the heat transfer member 160 to the frame bottom surface part 154a in the direction away from the support attachment part 155. As a result, since the amount of heat transfer to the support fixture mounting portion 155 is reduced, the temperature rise of the support fixture mounting portion 155 can be suppressed, and the temperature increase of the exposed surface 155b that the user may touch is suppressed. .

In addition, when the heat conductive sheet 359 is not in contact with the bottom surface 101a, the heat transfer from the heat conductive sheet 359 to the bottom surface 101a is suppressed, and the temperature rise of the bottom surface 101a can be suppressed. Therefore, in the present embodiment, the heat conductive sheet 359 is affixed to the frame bottom surface part 154a so that the heat conductive sheet 359 does not easily touch the bottom surface 101a. However, even when the heat conductive sheet 359 is in contact with the bottom surface 101a, if the bottom surface 101a is formed of a material having a relatively low thermal conductivity (for example, resin), the temperature rise of the bottom surface 101a is suppressed. Is possible.
<2-3: Features of the camera body>
Here, the features of the camera body 300 according to the second embodiment will be summarized.
(1) In this camera body 300, a heat conductive sheet 359 including a first sheet 359a and a second sheet 359b is provided, and on the opposite side of the frame bottom surface portion 154a from the first flange 164 and the second flange 165, A first sheet 359a and a second sheet 359b are attached to each other. Further, the first flange 164 and the second flange 165 are disposed inside the heat conductive sheet 359 when viewed from the first direction (that is, the vertical direction). For this reason, part of the heat transferred from the CMOS image sensor 110 to the frame bottom surface portion 154a via the heat transfer member 160 is guided to the first sheet 359a and the second sheet 359b, and the heat conductive sheets 359 spread. Distributed in the direction. As a result, the amount of heat that flows from the heat transfer member 160 through the frame bottom surface portion 154a to the support attachment portion 155 is further reduced, and the temperature rise of the support attachment portion 155 is suppressed.

At this time, since the heat conductive sheet 359 spreads away from the support attachment part 155, the heat absorbed by the heat conduction sheet 359 is diffused to a place away from the support attachment part 155, and the support attachment part 155. It becomes difficult to be transmitted to. For this reason, the temperature rise of the support fixture attaching part 155 is further suppressed.
(2) In this camera body 300, the thermal conductivity of the thermal conductive sheet 359 (more specifically, the first sheet 359a and the second sheet 359b) is larger than the thermal conductivity of the frame bottom surface portion 154a. Heat is easily transmitted from 154a to the heat conductive sheet 359. Thus, since the diffusion of heat in the heat conductive sheet 359 is promoted, the amount of heat transmitted to the support fixture mounting portion 155 via the frame bottom surface portion 154a is reduced, and the temperature rise of the support fixture mounting portion 155 is suppressed.
[Other Embodiments]
Embodiments of the present invention are not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit of the present invention.

(A)
In the above-described embodiment, an interchangeable lens type digital camera has been described as an example. However, an imaging apparatus to which the technology shown here can be applied is not limited thereto. The technology disclosed herein can be applied to an imaging device having a support mounting portion, and can be applied to, for example, an interchangeable lens type digital video camera, a lens barrel integrated digital camera, and a video camera.
(B)
In the first and second embodiments described above, the heat transfer member 160 is connected to the frame bottom surface portion 154a at two locations via the first flange 164 and the second flange 165. On the other hand, if the heat transfer member 160 is connected to the frame bottom surface part 154a at at least one location, heat can be released from the heat transfer member 160 to the frame bottom surface part 154a. Therefore, the number of connection points between the heat transfer member 160 and the frame bottom surface portion 154a is not limited to two, and it is sufficient that at least one is provided. Further, the position at which the heat transfer member 160 is connected to the frame bottom surface portion 154 a may not be on the right side or the left side of the support attachment portion 155.

<< Modification 1 >>
For example, as shown in FIG. 12A, as a variation of the first embodiment, a heat transfer member 460 in which the second flange 165 is omitted can be considered (Modification 1). At this time, the first flange 164 does not necessarily extend from the first wall 163a. For example, the first flange 164 may extend forward from the third wall 163c.
<< Modification 2 >>
On the other hand, as shown to FIG. 13 (A) and (B), the heat-transfer member 660 may be used (modification 2). The heat transfer member 660 includes a third flange 664 (an example of a first connection portion) extending forward from the third wall 163c and a fourth flange 665 (an example of a second connection portion) extending rearward from the fourth wall 163d. And have. In this case, the first flange 164, the second flange 165, the third flange 664, and the fourth flange 665 are each fixed to the frame bottom surface portion 154a. Modification 2 is a variation of the second embodiment.

(C)
In the above-described embodiment, the heat transfer member 160 is provided with the first wall 163a to the fourth wall 163d, but a part of the first wall 163a to the fourth wall 163d may be omitted.
For example, the third wall 163c and the fourth wall 163d are omitted, and the side wall portions 163 (more specifically, the first wall 163a and the second wall 163b) are arranged only on the left side and the right side of the support attachment portion 155. May be. Thus, the side wall part 163 does not necessarily need to be integrally formed. That is, the members constituting the side wall part 163 do not necessarily have to be connected to each other, and may be arranged with a space therebetween.
<< Modification 3 >>
As shown in FIGS. 12B and 12C, as a variation of the first embodiment, a heat transfer member 560 in which the second wall 163b to the fourth wall 163d and the second flange 165 are omitted is provided. Possible (Modification 3). That is, the heat transfer member 560 includes the shielding portion main body 162, the first wall 163a, and the first flange 164. Even in the case where the second wall 163b to the fourth wall 163d are omitted in this way, the radiation heat transfer from the CMOS image sensor 110 is alleviated by the shielding portion main body 162, so that the temperature of the support attachment portion 155 is increased. The effect of suppressing the rise is obtained. In this case, the side wall part 163 has only the first wall 163a.

(D)
In the above-described embodiment, the side wall portion 163 is disposed between the shielding portion main body 162 and the frame bottom surface portion 154a. However, other structures may be used.
<< Modification 4 >>
For example, as a variation of the first embodiment, a heat transfer member 760 as shown in FIG. 12D may be used (Modification 4). The heat transfer member 760 has a shielding portion 761 connected to the first flange 164 and the second flange 165. The shield part 761 is raised in the Z-axis direction at a position corresponding to the support tool attachment part 155, and a gap is formed between the support tool attachment part 155 and the shield part 761. As a result, similarly to the first embodiment, heat is hardly transmitted from the shielding portion 761 to the support fixture mounting portion 155, and an effect of reducing the amount of heat transferred from the CMOS image sensor 110 to the support fixture mounting portion 155 is obtained.

(E)
In the second embodiment described above, the heat conductive sheet 359 includes the first sheet 359a and the second sheet 359b, but the heat conductive sheet may be disposed in a wider range.
As an example, in FIGS. 13A and 13B, a heat conductive sheet 659 according to Modification 2 of the second embodiment is shown. As shown by shading in FIG. 13 (B), the heat conductive sheet 659 extends from the end E3 (an example of the first end) of the third flange 664 on the support attachment portion 155 side to the opposite side of the support attachment portion 155. A third sheet 659a (an example of the first heat diffusion part) that spreads and a fourth flange 665 that extends from the end E4 (an example of the second end) on the support attachment part 155 side of the fourth flange 665 to the opposite side of the support attachment part 155. Sheet 659b (an example of a second thermal diffusion unit).
Thus, by providing the heat conductive sheet 659, heat is diffused through the heat conductive sheet 659 also in the front-rear direction of the support fixture mounting portion 155, so that the amount of heat transmitted to the support fixture mounting portion 155 is reduced.

In addition, the 3rd sheet | seat 659a and the 4th sheet | seat 659b may be connected to the 1st sheet | seat 359a, and may be similarly connected to the 2nd sheet | seat 359b.
(F)
In the above-described embodiment, the support attachment portion 155 is fixed to the frame bottom surface portion 154a of the main frame 154, but it is not necessarily fixed to the main frame 154. It is sufficient if it is fixed to any part of the camera body. For example, the support attachment part 155 may be fixed to the exterior part 101 of the camera body 100.
In the above-described embodiment, the strength of the camera body 100 is ensured by the main frame 154, and the main frame 154 supports the support attachment portion 155. However, when a predetermined strength of the camera body 100 is secured by a member other than the main frame 154 (for example, the exterior portion 101), the main frame 154 can be omitted. In such a case, the support attachment portion 155 may be attached to a member other than the frame bottom surface portion 154a.

(G)
In the above-described embodiment, the support attachment portion 155 is fitted into the frame bottom surface portion 154a of the main frame 154, but the support attachment portion 155 may not be separate from the main frame 154. For example, the support attachment portion 155 may be integrally formed with the main frame 154.
(H)
In the second embodiment described above, the material of the heat conductive sheet 359 is a metal. However, since heat may be diffused in the direction in which the heat conductive sheet spreads, a material other than metal may be used as the material of the heat conductive sheet. Good. For example, the heat conductive sheet 359 may be a graphite sheet.
In addition, a heat conduction sheet is formed using a material having anisotropy in heat conduction, and heat diffusion in the in-plane direction of the heat conduction sheet is promoted, and heat conduction in other directions is suppressed. Also good. For example, if the heat conduction sheet 359 suppresses the flow of heat from the frame bottom surface portion 154a to the bottom surface 101a, the effect of suppressing the temperature rise of the bottom surface 101a can be obtained.

(I)
In the second embodiment described above, the heat conductive sheet 359 is attached to the frame bottom surface portion 154a. However, the method of arranging the heat conductive sheet 359 is not limited to this. For example, if the heat conductive sheet 359 is sandwiched between the frame bottom surface portion 154a and the bottom surface 101a, the heat conductive sheet 359 diffuses heat even if it is not bonded to the frame bottom surface portion 154a. Can do.

  The technique disclosed here can be applied to a digital camera. Specifically, it can be applied to a digital still camera, a digital video camera, and the like.

1 Digital camera (an example of an imaging device)
100 Camera body (an example of an imaging device)
101 exterior part 110 CMOS image sensor (an example of an image sensor)
DESCRIPTION OF SYMBOLS 113 CMOS circuit board 114 Optical low-pass filter 115 Diaphragm 116 Diaphragm support part 131 Release button 140 Camera controller 142 Main circuit board 154 Main frame 154a Frame bottom face part (an example of support part)
154b Frame front surface portion 155 Support attachment portion 155a Screw hole 155b Exposed surface 155c Central axis 160 Heat transfer member 161 Shielding portion 162 Shielding portion body 163 Side wall portion 163a First wall 163b Second wall 163c Third wall 163d Fourth wall 164 Second wall 164 1 flange (example of first connection part)
165 Second flange (an example of a second connecting portion)
190 Shutter unit 195 Heat sink 196 Thermal conduction unit 200 Lens unit 300 Camera body (an example of an imaging device)
355 Support attachment part 359 Thermal conduction sheet 359a 1st sheet (an example of 1st thermal diffusion part)
359b 2nd sheet (an example of the 2nd thermal diffusion part)
460 Heat transfer member (Modification 1)
560 Heat transfer member (Modification 3)
660 Heat transfer member (Modification 4)
664 3rd flange (an example of a 1st connection part)
665 4th flange (an example of the second connecting portion)
659a 3rd sheet (an example of the 1st heat diffusion part)
659b 4th sheet (an example of the 2nd heat diffusion part)
760 Heat transfer member (Modification 2)
761 Shielding part

Claims (21)

An imaging device that can be attached to a support and obtains an image of a subject,
An image sensor that generates an electrical signal representing the image of the subject;
A support attachment portion provided to be attachable to the support, and
A support portion for supporting the support attachment portion;
A heat transfer member that is connected to the support and at least a portion of the heat transfer member is disposed between the image sensor and the support mounting portion;
An imaging apparatus comprising: A gap is provided between the heat transfer member and the support attachment portion.
The imaging device according to claim 1. The support attachment portion has a screw hole to which the support can be attached,
At least a part of the heat transfer member overlaps the support attachment part when viewed from a first direction parallel to the central axis of the screw hole.
The imaging device according to claim 1 or 2. The support part and the heat transfer member have a shape extending in a second direction perpendicular to the central axis of the screw hole.
The imaging device according to claim 1. The heat transfer member includes a shielding part at least partially disposed between the imaging element and the support attachment part, and a first connection part that connects the shielding part to the support part.
The imaging device according to claim 1. The shielding portion includes a shielding portion main body at least partially disposed between the imaging element and the support attachment portion, and a side wall portion extending from the shielding portion main body toward the supporting portion.
The imaging device according to claim 5. The first connection part extends from the shielding part along the support part to the side opposite to the support attachment part,
The imaging device according to claim 5 or 6. The first connection portion extends from the side wall portion along the support portion to the side opposite to the support attachment portion,
The imaging device according to claim 7. The first connection portion is disposed at a distance from the support attachment portion.
The imaging device according to claim 5. The heat transfer member has a second connection part that is disposed on the opposite side of the first connection part across the support attachment part and connects the shielding part to the support part.
The imaging device according to claim 5. The second connection part extends from the shielding part along the support part to the side opposite to the support attachment part,
The imaging device according to claim 10. The second connection part extends from the side wall part along the support part to the side opposite to the support attachment part,
The imaging device according to claim 11. The second connection portion is disposed at a distance from the support attachment portion.
The imaging device according to claim 11 or 10. A first heat diffusion part disposed on the opposite side of the support part from the first connection part and having a thermal conductivity greater than the thermal conductivity of the support part;
The imaging device according to claim 5. The first connection part is disposed inside the first heat diffusion part when viewed from the first direction.
The imaging device according to claim 14. When viewed from the first direction, the first heat diffusion portion extends from the first end of the first connection portion on the support attachment portion side to the opposite side of the support attachment portion.
The imaging device according to claim 14 or 15. A second heat diffusing part disposed on the opposite side of the support part from the second connection part and having a thermal conductivity greater than the thermal conductivity of the support part;
The imaging device according to claim 10. The second connection part is disposed inside the second heat diffusion part when viewed from the first direction.
The imaging device according to claim 17. When viewed from the first direction, the second heat diffusing portion extends from the second end of the second connecting portion on the support attachment portion side to the opposite side of the support attachment portion,
The imaging device according to claim 17 or 18. At least one of the first thermal diffusion part and the second diffusion part is in contact with the support part,
The imaging device according to claim 14. The heat conductivity of the heat transfer member is greater than the heat conductivity of the support part and the heat conductivity of the support attachment part,
The imaging device according to claim 1.

Images