JP2011159938A - Spacer - Google Patents

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JP2011159938A
JP2011159938A JP2010022805A JP2010022805A JP2011159938A JP 2011159938 A JP2011159938 A JP 2011159938A JP 2010022805 A JP2010022805 A JP 2010022805A JP 2010022805 A JP2010022805 A JP 2010022805A JP 2011159938 A JP2011159938 A JP 2011159938A
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spacer
printed circuit
screw
circuit board
housing
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JP2010022805A
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Japanese (ja)
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Tetsuya Momotake
哲也 百武
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Fujitsu Telecom Networks Ltd
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Fujitsu Telecom Networks Ltd
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Priority to JP2010022805A priority Critical patent/JP2011159938A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a spacer which relates to one for fixing a printed board to a housing of a communication apparatus, and is capable of fixing the printed board in a short time, and fixing a printed board having a different board thickness with upper surface alignment without changing a housing. <P>SOLUTION: The spacer includes: a tubular spacer body 5 which is attached to a housing 3 and in which two facing slits 19, 21 are formed from an upper part of a circumferential wall 17 to a lower side, and a flange part 7 formed in the upper part can be pressed in a lower hole 15 on a printed board 13 side; and an annular coma member 25 which is inserted into the spacer body 5, and in which a screw 27 is screwed to the center part from the upper side of the spacer body 5, and blade pieces 35 penetrating the slits 19, 21 are projected to the outer periphery; wherein the coma member 25 moves upward in the space body 5 with tightening of the screw 27 to position and fix the printed board 13 between the flange part 7 and the blade pieces 35. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、通信機器の筐体にプリント基板を固定する際に使用するスペーサに関する。   The present invention relates to a spacer used when a printed circuit board is fixed to a housing of a communication device.

従来、通信機器のモールド筐体にプリント基板を固定する場合、モールド筐体側に台座を設け、その上にプリント基板を乗せてネジ止めしている。   Conventionally, when a printed circuit board is fixed to a mold housing of a communication device, a pedestal is provided on the mold housing side, and the printed circuit board is placed thereon and screwed.

而して、一般にプリント基板は1.5mm程の一定の板厚であるが、今後、コストダウン、材料の軽量化によって板厚が薄くなったり、反対に機器の機能向上により実装品の総数が増加して板厚が厚くなることが想定される。   In general, however, the printed circuit board has a constant thickness of about 1.5 mm. In the future, however, the thickness will be reduced due to cost reduction and material weight reduction. It is assumed that the thickness increases to increase the plate thickness.

ところで、プリント基板は上面合わせでモールド筐体に固定する必要があり、板厚が変わってプリント基板の上面高さが変わってしまうと、コネクタや発光ダイオード等の高さがずれてしまうため、モールド筐体を変更して台座の高さを変更する必要が生じる。   By the way, it is necessary to fix the printed circuit board to the mold housing by aligning the upper surface. If the thickness of the printed circuit board changes due to the change in the plate thickness, the height of the connector, light emitting diode, etc. will shift. It becomes necessary to change the height of the pedestal by changing the housing.

しかし、一度開発したモールド筐体の変更は金型改造となるため、費用面、期間ともに甚大となって容易に変更できないのが実情であった。   However, since the change of the mold housing once developed is a mold remodeling, the actual situation is that the cost and the period are too large to be changed easily.

また、斯様にプリント基板の板厚違いに対応してモールド筐体を作り分けた場合、差分が軽微なため、組み付け作業時に取り違い等の虞があり、信頼性に欠ける課題も指摘されている。   In addition, when mold housings are made according to differences in the thickness of printed circuit boards in this way, the difference is minor, so there is a risk of mistakes during assembly work, and problems with lack of reliability have been pointed out. Yes.

一方、特許文献1には、プリント基板の取付高さを高低2段階に変更できるプリント基板の取付構造が開示されている。   On the other hand, Patent Document 1 discloses a printed circuit board mounting structure that can change the mounting height of the printed circuit board in two steps.

特開2009−43968号公報JP 2009-43968 A

しかし乍ら、特許文献1に開示された従来例は、あくまでプリント基板を筐体に対し高低2段階に取付可能とするもので、異なる板厚のプリント基板を常に上面合わせでモールド筐体に固定し得るものではなかった。   However, the conventional example disclosed in Patent Document 1 only allows the printed circuit board to be attached to the housing in two levels, and the printed circuit boards having different plate thicknesses are always fixed to the mold housing by aligning the top surfaces. It was not possible.

本発明は斯かる実情に鑑み案出されたもので、プリント基板の固定が短時間で行え、且つ異なる板厚のプリント基板を、筐体を変更することなく上面合わせで固定することができるスペーサを提供することを目的とする。   The present invention has been devised in view of such circumstances, and a spacer that can fix a printed circuit board in a short time and can fix printed circuit boards having different thicknesses by aligning the upper surfaces without changing the housing. The purpose is to provide.

斯かる目的を達成するため、請求項1に係るスペーサは、筐体に取り付き、対向する2本のスリットが周壁の上部から下方へ形成され、上部に設けた鍔部がプリント基板側の下穴に圧入可能な筒状のスペーサ本体と、前記スペーサ本体内に挿入され、スペーサ本体の上方からネジが中央に螺着されると共に、前記スリットを挿通する羽根片が外周に突設された環状のコマ部材とからなり、前記ネジの締め付けに伴い、前記コマ部材がスペーサ本体内を上方へ移動して前記鍔部と羽根片との間でプリント基板を位置決め固定することを特徴とする。   In order to achieve such an object, the spacer according to claim 1 is attached to the housing, and the two opposing slits are formed downward from the upper part of the peripheral wall, and the flange provided on the upper part is a pilot hole on the printed circuit board side. A cylindrical spacer body that can be press-fitted into the spacer body, and an annular ring that is inserted into the spacer body, a screw is screwed into the center from above the spacer body, and a blade piece that passes through the slit projects from the outer periphery. It is characterized by comprising a top member, and with the tightening of the screw, the top member moves upward in the spacer body and positions and fixes the printed circuit board between the flange and the blade piece.

そして、請求項2に係る発明は、請求項1に記載のスペーサに於て、前記鍔部の上部周縁部がテーパ状に形成されていることを特徴とし、請求項3に係る発明は、請求項1または請求項2に記載のスペーサに於て、前記鍔部の下部周縁部がテーパ状に形成されていることを特徴とし、更に、請求項4に係る発明は、請求項1乃至請求項3のいずれか1項に記載のスペーサに於て、前記鍔部の上部周縁部に、当該鍔部を内方へ押圧操作可能な凹状の操作部が設けられていることを特徴とする。   The invention according to claim 2 is characterized in that, in the spacer according to claim 1, the upper peripheral edge of the flange is formed in a taper shape, and the invention according to claim 3 is The spacer according to claim 1 or 2, wherein the lower peripheral edge of the flange is formed in a tapered shape, and the invention according to claim 4 further comprises claims 1 to 4. The spacer according to any one of 3 above, wherein a concave operation portion capable of pressing the flange portion inwardly is provided at an upper peripheral edge portion of the flange portion.

また、請求項5に係る発明は、請求項1乃至請求項4のいずれか1項に記載のスペーサに於て、前記筐体はモールド筐体で、前記スペーサ本体は当該モールド筐体に一体成形されていることを特徴とし、請求項6に係る発明は、請求項1乃至請求項4のいずれか1項に記載のスペーサに於て、前記スペーサ本体は、筐体に取付ネジを介して固着されることを特徴とする。   According to a fifth aspect of the present invention, in the spacer according to any one of the first to fourth aspects, the casing is a molded casing, and the spacer body is integrally formed with the molded casing. According to a sixth aspect of the present invention, in the spacer according to any one of the first to fourth aspects, the spacer main body is fixed to the housing via a mounting screw. It is characterized by being.

更に、請求項7に係る発明は、請求項1乃至請求項4のいずれか1項に記載のスペーサに於て、前記スペーサ本体は、底部にネジ部材が一体に形成され、当該ネジ部材にナットを螺着して筐体に固着されることを特徴とし、請求項8に係る発明は、請求項1乃至請求項7のいずれか1項に記載のスペーサに於て、前記コマ部材に螺着するネジは皿タッピングネジで、スペーサ本体の上部内周は、当該皿タッピングネジの頭部に沿ってテーパ状に形成されていることを特徴とする。   Furthermore, the invention according to claim 7 is the spacer according to any one of claims 1 to 4, wherein the spacer body is integrally formed with a screw member at a bottom portion, and the screw member has a nut. The invention according to claim 8 is characterized in that the spacer according to any one of claims 1 to 7 is screwed to the piece member. The screw to be screwed is a flat tapping screw, and the upper inner periphery of the spacer body is formed in a taper shape along the head of the flat tapping screw.

各請求項に係るスペーサを用いて、例えばモールド筐体にプリント基板を固定する場合、モールド筐体を変更することなく、板厚の異なる総てのプリント基板を容易に同一の上面高さでモールド筐体に位置決め固定することが可能となり、この結果、モールド筐体の変更に伴う金型改造が不要となってコストの削減が図れる利点を有する。   For example, when the printed circuit board is fixed to the mold housing using the spacers according to the claims, all the printed circuit boards having different plate thicknesses can be easily molded at the same upper surface height without changing the mold housing. It becomes possible to position and fix to the housing, and as a result, there is an advantage that cost reduction can be achieved because it is not necessary to modify the mold accompanying the change of the mold housing.

そして、斯様にプリント基板の板厚違いに対応してモールド筐体を作り分ける必要がないため、プリント基板の組み付け作業時にモールド筐体の取り違い等の虞もなく、信頼性が向上する利点を有する。   And since there is no need to make a separate mold housing corresponding to the difference in thickness of the printed circuit board in this way, there is no risk of the mold housing being replaced during the assembly work of the printed circuit board, and the advantage of improving reliability Have

また、請求項2及び請求項3に係る発明によれば、スペーサ本体の鍔部の上部周縁部や下部周縁部にテーパ部に設けることで、プリント基板に設けた下穴への鍔部(スペーサ本体)の挿抜が容易に行える。   Further, according to the inventions according to claim 2 and claim 3, by providing the tapered portion at the upper peripheral portion or the lower peripheral portion of the flange portion of the spacer main body, the flange portion (spacer to the prepared hole provided in the printed circuit board is provided. The main body) can be easily inserted and removed.

一方、請求項4に係る発明によれば、スペーサ本体の鍔部に操作部を設けたため、プリント基板の取り外しの際に、ペンチ等の治具を両操作部で挟むことで、治具が滑ることなく確実に鍔部を内方へ押圧操作することができる。   On the other hand, according to the invention according to claim 4, since the operation portion is provided in the collar portion of the spacer body, the jig slides by sandwiching a jig such as pliers between the operation portions when removing the printed circuit board. The buttock can be surely pressed inward without any problems.

そして、請求項5に係る発明によれば、スペーサ本体がモールド筐体に一体成形されているため、プリント基板をモールド筐体に取り付けるに当たり、スペーサ本体をモールド筐体に後付けする必要がなく、また、スペーサ本体の部品管理が不要となる利点を有する。   According to the invention of claim 5, since the spacer main body is integrally formed with the mold casing, it is not necessary to retrofit the spacer main body to the mold casing when attaching the printed circuit board to the mold casing. There is an advantage that it is not necessary to manage the parts of the spacer body.

また、請求項6及び請求項7に係る発明によれば、スペーサ本体を筐体と別体に形成しているため、仕様に応じてスペーサ本体の個数や取付位置を調整できる等、幅広い製品対応が可能となる。   Further, according to the inventions according to claims 6 and 7, since the spacer main body is formed separately from the housing, the number of spacer main bodies and the mounting position can be adjusted according to the specifications. Is possible.

更に、請求項8に係る発明の如く、コマ部材に螺着するネジを皿タッピングネジとすると共に、スペーサ本体の上部内周を当該皿タッピングネジの頭部に沿ったテーパ状に形成すると、皿タッピングネジを最後まで締め付けたときに、頭部のテーパ面がテーパ部を介してスペーサ本体の上方を下穴の周縁方向へと押圧するため、プリント基板の保持を強固にすることができる利点を有する。   Furthermore, as in the invention according to claim 8, when the screw to be screwed to the top member is a flat tapping screw and the upper inner periphery of the spacer body is formed in a taper shape along the head of the flat tapping screw, When the tapping screw is tightened to the end, the taper surface of the head presses the upper part of the spacer body through the taper portion toward the peripheral edge of the pilot hole, so that the printed circuit board can be held firmly. Have.

請求項1乃至請求項5及び請求項8の一実施形態に係るスペーサの分解斜視図である。It is a disassembled perspective view of the spacer which concerns on one Embodiment of Claim 1 thru | or Claim 5 and Claim 8. スペーサの全体斜視図である。It is a whole perspective view of a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. 請求項1乃至請求項4及び請求項7、請求項8の第一実施形態に係るスペーサの分解斜視図である。It is a disassembled perspective view of the spacer which concerns on 1st embodiment of Claim 1 thru | or Claim 4, Claim 7, and Claim 8. スペーサの全体斜視図である。It is a whole perspective view of a spacer. スペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using a spacer. 請求項1乃至請求項5、請求項7の一実施形態に係るスペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using the spacer which concerns on one Embodiment of Claims 1 thru | or 5 and Claim 7. 請求項1乃至請求項4及び請求項7、請求項8の第二実施形態に係るスペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using the spacer which concerns on 2nd embodiment of Claim 1 thru | or Claim 4, Claim 7, and Claim 8. 請求項1乃至請求項4、請求項6及び請求項8の一実施形態に係るスペーサのスペーサ本体の断面図である。It is sectional drawing of the spacer main body of the spacer which concerns on one Embodiment of Claim 1 thru | or 4, 6 and 8. 請求項1乃至請求項4、請求項6及び請求項8の一実施形態に係るスペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using the spacer which concerns on one Embodiment of Claims 1 thru | or 4, 6 and 8. 図8のスペーサと図14のスペーサを用いたプリント基板の取付方法の説明図である。It is explanatory drawing of the attachment method of the printed circuit board using the spacer of FIG. 8, and the spacer of FIG.

以下、本発明の実施形態を図面に基づいて詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1乃至図7は請求項1乃至請求項5及び請求項8に係るスペーサの一実施形態を示し、図1に於て、1は通信機器のモールド筐体3の底部、5は当該底部1の上面に一体成形された有底円筒状のスペーサ本体で、スペーサ本体5の上部に環状の鍔部7が外方へ突設されている。   FIGS. 1 to 7 show an embodiment of a spacer according to claims 1 to 5 and claim 8. In FIG. 1, 1 is a bottom portion of a mold casing 3 of a communication device, and 5 is a bottom portion 1. A bottomed cylindrical spacer body integrally formed on the upper surface of the spacer body 5 is provided with an annular flange 7 protruding outward from the upper portion of the spacer body 5.

そして、図1乃至図3に示すように鍔部7の上部周縁部と下部周縁部に、夫々、テーパ部9、11が設けられており、斯様にテーパ部9、11を鍔部7の上部周縁部と下部周縁部に設けることで、後述するようにモールド筐体3へのプリント基板13の取付け/取り外しの際に、プリント基板13に設けた下穴15への鍔部7(スペーサ本体5)の挿抜が容易に行えるようになっている。   As shown in FIGS. 1 to 3, taper portions 9 and 11 are provided on the upper peripheral portion and the lower peripheral portion of the flange portion 7, respectively. By providing the upper peripheral portion and the lower peripheral portion, as will be described later, when attaching / removing the printed board 13 to / from the mold housing 3, the flange portion 7 (spacer body) to the prepared hole 15 provided in the printed board 13 is provided. 5) can be easily inserted and removed.

スペーサ本体5の周壁17は、前記下穴15より僅かに小径とされて当該下穴15に挿入可能とされており、周壁17には、前記鍔部7からスペーサ本体5の下方へ2本のスリット19、21が対向して形成されている。そして、図3に示すように円筒状に形成されたスペーサ本体5の内周23は、上下方向に亘って滑らかな円周状に形成されているが、上部内周には、後述するコマ部材25にねじ込む皿タッピングネジ27の頭部29のテーパ形状に沿ったテーパ部31が設けられている。   The peripheral wall 17 of the spacer body 5 is slightly smaller in diameter than the pilot hole 15 and can be inserted into the pilot hole 15. Two peripheral walls 17 are provided on the peripheral wall 17 from the flange portion 7 to the lower side of the spacer main body 5. Slits 19 and 21 are formed to face each other. As shown in FIG. 3, the inner periphery 23 of the spacer body 5 formed in a cylindrical shape is formed in a smooth circumferential shape in the vertical direction. A taper portion 31 is provided along the taper shape of the head 29 of the counter tapping screw 27 to be screwed into 25.

そして、図1乃至図3に示すようにスペーサ本体5内に、樹脂製のコマ部材25が挿入されている。   As shown in FIGS. 1 to 3, a resin frame member 25 is inserted into the spacer body 5.

図示するようにコマ部材25は、スペーサ本体5の内周23に沿って円筒状に形成された筒状部33と、当該筒状部33の上下と面一にその外周に突設された2枚の側面視矩形状の羽根片35とからなり、2枚の羽根片35は、夫々、前記スリット19、21を挿通可能な肉厚で形成されて、180°の間隔を空けて径方向に配置されている。   As shown in the figure, the top member 25 has a cylindrical portion 33 formed in a cylindrical shape along the inner periphery 23 of the spacer main body 5, and 2 projecting on the outer periphery of the cylindrical portion 33 so as to be flush with the upper and lower sides of the cylindrical portion 33. Each of the two blade pieces 35 is formed with a thickness that allows the slits 19 and 21 to be inserted therethrough, and is spaced radially by 180 °. Has been placed.

そして、図1乃至図7に示すように前記筒状部33の中央に、皿タッピングネジ27がタップを切り乍らねじ込まれるようになっており、前記羽根片35をスリット19、21の上方から挿通させてスペーサ本体5内にコマ部材25を挿入した後、コマ部材25の筒状部33中央にタップを切り乍ら皿タッピングネジ27をねじ込んでいくと、スリット19、21に羽根片35が挿通して回転が規制されたコマ部材25は、皿タッピングネジ27のねじ込みに伴い、順次、スペーサ本体5内を上方へ移動する。そして、モールド筐体3へのプリント基板13の取付けに当たり、図7に示すように上方へ移動したコマ部材25の羽根片35と前記鍔部7との間で、プリント基板13を上下から挟持して位置決め固定できるようになっている。   Then, as shown in FIGS. 1 to 7, a flat tapping screw 27 is screwed into the center of the cylindrical portion 33, and the blade piece 35 is inserted from above the slits 19 and 21. After the piece member 25 is inserted into the spacer body 5 and then inserted into the center of the cylindrical portion 33 of the piece member 25, the tapping screw 27 is screwed into the slit 19, 21. The top member 25 that is inserted and whose rotation is restricted moves upward in the spacer body 5 sequentially as the counter tapping screw 27 is screwed. Then, when the printed board 13 is attached to the mold housing 3, the printed board 13 is sandwiched from above and below between the blade piece 35 of the top member 25 moved upward and the flange portion 7 as shown in FIG. It can be positioned and fixed.

その他、図1中、37は鍔部7のテーパ部9(鍔部7の上部周縁部)に形成された凹状の操作部で、当該操作部37はスリット19、21を挟んで180°の間隔を空けて形成されており、下穴15から鍔部7(スペーサ本体5)を引き抜く際に、ペンチ等の治具で両操作部37を挟んで鍔部7を内方へ押圧すると、スリット19、21を挟んだスペーサ本体5の上方が内方へ変形して、下穴15から鍔部7が容易に引き出せるようになっている。   In addition, in FIG. 1, 37 is a concave operation part formed in the taper part 9 (upper peripheral part of the collar part 7) of the collar part 7, and the said operation part 37 is 180 degree intervals on both sides of the slits 19 and 21. When the collar portion 7 (spacer body 5) is pulled out from the pilot hole 15, when the collar portion 7 is pressed inward by sandwiching both operation portions 37 with a jig such as pliers, the slit 19 The upper portion of the spacer body 5 with the 21 sandwiched therebetween is deformed inward so that the flange portion 7 can be easily pulled out from the prepared hole 15.

このように本実施形態に係るスペーサ39は、スペーサ本体5とコマ部材25、当該コマ部材25にねじ込まれる皿タッピングネジ27とで構成されており、一例としてスペーサ本体5は、モールド筐体3の四隅近傍の底部1に一つずつ形成されている。   As described above, the spacer 39 according to this embodiment includes the spacer main body 5, the piece member 25, and the counter tapping screw 27 screwed into the piece member 25. As an example, the spacer main body 5 includes the mold case 3. One by one is formed at the bottom 1 near the four corners.

次に、前記スペーサ39を用いたモールド筐体3へのプリント基板13の取付方法を説明する。   Next, a method for attaching the printed circuit board 13 to the mold housing 3 using the spacer 39 will be described.

先ず、図1及び図2に示すように、羽根片35をスリット19、21に挿通させてスペーサ本体5内にコマ部材25を挿入した後、コマ部材25の筒状部33中央に皿タッピングネジ27でタップを切り、皿タッピングネジ27の先端をコマ部材25に螺着しておく。   First, as shown in FIGS. 1 and 2, the blade piece 35 is inserted into the slits 19, 21 and the piece member 25 is inserted into the spacer body 5, and then the counter tapping screw is placed at the center of the cylindrical portion 33 of the piece member 25. 27, the tap is cut, and the tip of the counter tapping screw 27 is screwed to the top member 25.

次いで、図3に示すように、スペーサ本体5上部の鍔部7にプリント基板13を当てる。   Next, as shown in FIG. 3, the printed circuit board 13 is applied to the flange portion 7 at the top of the spacer body 5.

図2に示すようにプリント基板13には、モールド筐体3に一体成形した複数のスペーサ本体5に対応して予め下穴15が複数設けられている。このため、図3に示すようにスペーサ本体5上部の鍔部7のテーパ部9にプリント基板13の下穴15の周縁を当接させてプリント基板13を下方へ押し下げると、図4の如くスリット19、21を挟んだスペーサ本体5の上方が内方へ変形し乍ら、テーパ部9がプリント基板13をスペーサ本体5の下方へとガイドして、図5に示すように鍔部7が下穴15を挿通し、プリント基板13がコマ部材25の羽根部35の上部に配置される。   As shown in FIG. 2, a plurality of pilot holes 15 are provided in advance in the printed circuit board 13 corresponding to the plurality of spacer bodies 5 integrally formed in the mold housing 3. Therefore, as shown in FIG. 3, when the peripheral edge of the lower hole 15 of the printed circuit board 13 is brought into contact with the tapered portion 9 of the flange 7 on the upper part of the spacer main body 5 and the printed circuit board 13 is pushed downward, the slits as shown in FIG. As the upper portion of the spacer body 5 sandwiching 19 and 21 is deformed inward, the tapered portion 9 guides the printed circuit board 13 to the lower side of the spacer body 5, and the flange portion 7 is lowered as shown in FIG. The printed circuit board 13 is disposed above the blade portion 35 of the top member 25 through the hole 15.

この後、図6に示すように先端をコマ部材25に螺着した皿タッピングネジ27を、更にタップを切り乍らねじ込んでいくと、既述したように回転が規制されているコマ部材25は、図6の如く皿タッピングネジ27のねじ込みに伴いスペーサ本体5内を上方へ移動し、これと同時に羽根部35がプリント基板13を押し上げる。   Thereafter, as shown in FIG. 6, when the counter tapping screw 27 having the tip screwed to the piece member 25 is further screwed in with the tap cut, the piece member 25 whose rotation is restricted as described above is obtained. As the counter tapping screw 27 is screwed in as shown in FIG. 6, the spacer body 5 moves upward, and at the same time, the blade portion 35 pushes up the printed board 13.

そして、皿タッピングネジ27を最後まで締め付けると、図7に示すように上方へ移動したコマ部材25の羽根片35と鍔部7との間でプリント基板13を上下から挟み込んで位置決め固定し、これと同時に、テーパ状に形成された皿タッピングネジ27の頭部29のテーパ面が、皿タッピングネジ27側のテーパ部31を介してスリット19、21を挟んだスペーサ本体5の上方を下穴15の周縁方向(図中、矢印A、B方向)へ押圧して、プリント基板13の保持を強固にする。   When the flat tapping screw 27 is tightened to the end, as shown in FIG. 7, the printed circuit board 13 is sandwiched from above and below between the blade piece 35 of the top member 25 moved upward and the collar portion 7, and fixed. At the same time, the taper surface of the head 29 of the countersunk tapping screw 27 formed in a tapered shape has a lower hole 15 above the spacer body 5 sandwiching the slits 19 and 21 via the taper part 31 on the counter tapping screw 27 side. Is pressed in the peripheral direction (in the direction of arrows A and B in the figure) to strengthen the holding of the printed circuit board 13.

また、プリント基板13を取り外す際には、皿タッピングネジ27を緩めた後、既述したようにペンチ等の治具で鍔部7の両操作部37を挟んで当該鍔部7を内方へ押圧すればよく、スリット19、21を挟んだスペーサ本体5の上方が内方へ変形して、下穴15から鍔部7が引き出せ、プリント基板13を取り外すことができる。   Further, when removing the printed circuit board 13, after loosening the counter tapping screw 27, as described above, sandwiching the two operation parts 37 of the collar part 7 with a jig such as pliers, the collar part 7 is moved inward. What is necessary is just to press, the upper part of the spacer main body 5 which pinched | interposed the slits 19 and 21 deform | transforms inward, the collar part 7 can be pulled out from the prepared hole 15, and the printed circuit board 13 can be removed.

そして、鍔部7の下部周縁部にテーパ部11が設けられているため、プリント基板13の取り外しに当たり、スリット19、21を挟んだスペーサ本体5の上方が内方へ変形し乍ら、テーパ部11がプリント基板13をスペーサ本体5の上方へガイドして、鍔部7が下穴15から容易に抜けることとなる。   And since the taper part 11 is provided in the lower peripheral part of the collar part 7, when removing the printed circuit board 13, while the upper part of the spacer main body 5 which pinched | interposed the slits 19 and 21 deform | transformed inward, a taper part 11 guides the printed circuit board 13 to the upper side of the spacer body 5, and the flange portion 7 easily comes out of the prepared hole 15.

一方、前記プリント基板13と板厚の異なるプリント基板(図示せず)をスペーサ39を介してモールド筐体3に取り付ける場合も、板厚の異なるこのプリント基板に、モールド筐体3側の複数のスペーサ本体5に対応して予め複数の下穴を設けておけばよい。   On the other hand, when a printed circuit board (not shown) having a plate thickness different from that of the printed circuit board 13 is attached to the mold housing 3 via the spacer 39, a plurality of printed circuit boards having different plate thicknesses are attached to the mold housing 3 side. A plurality of pilot holes may be provided in advance corresponding to the spacer body 5.

そして、図示しないが、前記プリント基板13の取付方法と同一の手順を採ることで、板厚の異なるプリント基板が、コマ部材25の羽根片35と鍔部7との間で上下から挟み込まれて位置決め固定され、このとき、図7に示すようにプリント基板13と板厚の異なるプリント基板も、プリント基板13と同一の上面高さPでモールド筐体3に位置決めされることとなる。   And although not shown in figure, by taking the same procedure as the mounting method of the said printed circuit board 13, the printed circuit board from which board thickness differs is pinched | interposed between the blade piece 35 and the collar part 7 of the top member 25 from the upper and lower sides. At this time, as shown in FIG. 7, a printed board having a plate thickness different from that of the printed board 13 is also positioned in the mold housing 3 at the same upper surface height P as the printed board 13.

このように本実施形態に係るスペーサ39を用いることで、モールド筐体3を変更することなく、板厚の異なる総てのプリント基板を同一の上面高さPでモールド筐体3に位置決め固定することが可能となり、この結果、モールド筐体の変更に伴う金型改造が不要となってコストの削減が図れる利点を有する。そして、斯様にプリント基板の板厚違いに対応してモールド筐体を作り分ける必要がないため、プリント基板の組み付け作業時にモールド筐体の取り違い等の虞もなく、信頼性が向上する利点を有する。   As described above, by using the spacer 39 according to the present embodiment, all the printed boards having different plate thicknesses are positioned and fixed to the mold casing 3 at the same upper surface height P without changing the mold casing 3. As a result, there is an advantage that cost reduction can be achieved because the mold remodeling associated with the change of the mold casing is unnecessary. And since there is no need to make a separate mold housing corresponding to the difference in thickness of the printed circuit board in this way, there is no risk of the mold housing being replaced during the assembly work of the printed circuit board, and the advantage of improving reliability Have

そして、既述した取付方法で、板厚の異なる総てのプリント基板を容易に上面合わせでモールド筐体3に位置決め固定することが可能であり、スペーサ本体5の鍔部7の上部周縁部と下部周縁部にテーパ部9、11に設けたことで、プリント基板13に設けた下穴15への鍔部7(スペーサ本体5)の挿抜が容易に行える。   Then, with the mounting method described above, it is possible to easily position and fix all the printed boards having different plate thicknesses to the mold housing 3 by aligning the top surfaces, and the upper peripheral edge of the flange portion 7 of the spacer body 5 By providing the taper portions 9 and 11 at the lower peripheral edge portion, it is possible to easily insert and remove the flange portion 7 (spacer main body 5) from the prepared hole 15 provided in the printed circuit board 13.

また、スペーサ本体5の上部内周に、皿タッピングネジ27の頭部29のテーパ形状に沿ったテーパ部31を設けたため、既述したように皿タッピングネジ27を最後まで締め付けると、頭部29のテーパ面がテーパ部31を介してスペーサ本体5の上方を図7中、矢印A、B方向へと押圧するため、プリント基板13の保持を強固にすることができる利点を有する。   Further, since the tapered portion 31 is provided on the inner periphery of the upper portion of the spacer body 5 along the tapered shape of the head 29 of the counter tapping screw 27, as described above, when the counter tapping screw 27 is tightened to the end, the head 29 7 has an advantage that the holding of the printed circuit board 13 can be strengthened because the upper surface of the spacer body 5 is pressed in the directions of arrows A and B in FIG.

更にまた、スペーサ本体5の鍔部7に操作部37を設けたため、プリント基板13の取り外しの際に、ペンチ等の治具を両操作部37で挟むことで、治具が滑ることなく確実に鍔部7を内方へ押圧操作することができると共に、スペーサ本体5をモールド筐体3に一体成形したため、プリント基板13をモールド筐体3に取り付けるに当たり、スペーサ本体5をモールド筐体3に後付けする必要がなく、また、スペーサ本体5の部品管理が不要となる利点を有する。   Furthermore, since the operation portion 37 is provided on the collar portion 7 of the spacer body 5, when removing the printed circuit board 13, a jig such as pliers is sandwiched between the operation portions 37 so that the jig does not slip. The flange portion 7 can be pressed inward, and the spacer body 5 is integrally formed with the mold housing 3. Therefore, when the printed circuit board 13 is attached to the mold housing 3, the spacer body 5 is retrofitted to the mold housing 3. There is an advantage that the parts management of the spacer body 5 becomes unnecessary.

図8乃至図10は請求項1乃至請求項4及び請求項7、請求項8に係るスペーサの第一実施形態を示し、図示するように本実施形態に係るスペーサ41は、底部を除き前記スペーサ本体5と同一の外形形状からなる樹脂製のスペーサ本体5-1の底部にネジ部材(ネジ軸)43を一体成形し、当該ネジ部材43に樹脂製のナット45を螺着してモールド筐体3の底部1にスペーサ本体5-1を固着したもので、底部1にはスペーサ本体5-1をネジ止めする複数のネジ挿通穴47が設けられている。   FIGS. 8 to 10 show a first embodiment of a spacer according to claims 1 to 4, 7, and 8. As shown in the figure, the spacer 41 according to this embodiment is the spacer except for the bottom. A screw member (screw shaft) 43 is integrally formed on the bottom of a resin spacer main body 5-1 having the same outer shape as the main body 5, and a resin nut 45 is screwed onto the screw member 43 to form a molded housing. A spacer main body 5-1 is fixed to the bottom 1 of FIG. 3, and a plurality of screw insertion holes 47 for screwing the spacer main body 5-1 are provided in the bottom 1.

そして、その他の構成は前記実施形態と同様であるため、同一のものには同一符号を付してそれらの説明は省略する。   Since other configurations are the same as those of the above-described embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

また、前記スペーサ41を用いたプリント基板13の取付方法も、ネジ部材43にナット45を螺着してモールド筐体3の底部1にスペーサ本体5-1を固着した後、前記実施形態と同様の手順によって、コマ部材25と皿タッピングネジ27を用いてプリント基板13を取り付ければよいため、それらの説明は省略する。   Also, the printed board 13 is attached using the spacer 41 after the nut 45 is screwed onto the screw member 43 and the spacer body 5-1 is fixed to the bottom 1 of the mold housing 3, and then the same as in the above embodiment. In this procedure, the printed circuit board 13 may be attached using the top member 25 and the counter tapping screw 27, and the description thereof will be omitted.

本実施形態に係るスペーサ41はこのように構成されており、本実施形態によっても、前記実施形態と同様、所期の目的を達成することが可能で、スペーサ41を用いることで、モールド筐体3を変更することなく板厚の異なる総てのプリント基板を同一の上面高さPでモールド筐体3に位置決め固定することが可能となり、この結果、モールド筐体の変更に伴う金型改造が不要となってコストの削減が図れる利点を有する。   The spacer 41 according to the present embodiment is configured as described above. According to the present embodiment, similar to the above embodiment, the intended purpose can be achieved. It is possible to position and fix all printed circuit boards having different plate thicknesses to the mold housing 3 with the same top surface height P without changing 3, and as a result, mold remodeling accompanying the change of the mold housing is possible. There is an advantage that it becomes unnecessary and the cost can be reduced.

また、本実施形態では、スペーサ本体5-1をモールド筐体3と別体に形成しているため、仕様に応じてスペーサ本体5-1の個数や取付位置を調整できる等、幅広い製品対応が可能となる。   In this embodiment, since the spacer body 5-1 is formed separately from the mold housing 3, the number of spacer bodies 5-1 and the mounting position can be adjusted according to the specifications. It becomes possible.

尚、既述した各実施形態では皿タッピングネジ27を使用したが、図11に示す請求項1乃至請求項5、請求項7の一実施形態の如く、前記皿タッピングネジ27に代え、平座金49とばね座金51を組み込んだ鍋タッピングネジ53を用いてもよい。   Although the counter tapping screw 27 is used in each of the above-described embodiments, a flat washer is used instead of the counter tapping screw 27 as in one embodiment of the first to fifth and seventh aspects shown in FIG. A pan tapping screw 53 incorporating 49 and a spring washer 51 may be used.

而して、本実施形態に係るスペーサ55によっても、既述した各実施形態と同様、所期の目的を達成することが可能で、当該スペーサ55を用いることで、モールド筐体3を変更することなく、板厚の異なる総てのプリント基板を同一の上面高さPでモールド筐体3に位置決め固定することが可能である。   Thus, with the spacer 55 according to the present embodiment, the intended purpose can be achieved as in the above-described embodiments, and the mold housing 3 can be changed by using the spacer 55. Without any problem, it is possible to position and fix all the printed boards having different plate thicknesses to the mold housing 3 with the same upper surface height P.

図12は請求項1乃至請求項4及び請求項7、請求項8に係るスペーサの第二実施形態を示し、本実施形態に係るスペーサ57のスペーサ本体5-2は、前記スペーサ本体5-1の底部にテーパ部59を形成すると共に、当該テーパ部59に対応してネジ挿通穴47の上部周縁にテーパ部61を設けたものである。   FIG. 12 shows a second embodiment of the spacer according to claims 1 to 4, 7, and 8, and the spacer main body 5-2 of the spacer 57 according to this embodiment is the spacer main body 5-1. A taper part 59 is formed at the bottom of the screw and a taper part 61 is provided on the upper peripheral edge of the screw insertion hole 47 corresponding to the taper part 59.

尚、その他の構成は図8の実施形態と同様であるため、同一のものには同一符号を付してそれらの説明は省略する。   Since other configurations are the same as those of the embodiment of FIG. 8, the same components are denoted by the same reference numerals and description thereof is omitted.

本実施形態はこのように構成されており、本実施形態によっても、前記実施形態と同様、所期の目的を達成することが可能で、板厚の異なる総てのプリント基板を同一の上面高さPでモールド筐体3に位置決め固定することが可能である。   The present embodiment is configured as described above. According to this embodiment as well, it is possible to achieve the intended purpose, and all printed circuit boards having different plate thicknesses can have the same top surface height. It is possible to position and fix to the mold housing 3 with the length P.

また、スペーサ本体5-2の底部にテーパ部59を形成すると共に、当該テーパ部59に対応して底部1側にテーパ部61を設けた構造上、スペーサ本体5-2を固着するに当たり、底部1に対するスペーサ本体5-2の設置面積が増加し、且つテーパ部59、61によりスペーサ本体5-2の位置決め保持が図られるため、スペーサ本体5-2を直角度よく底部1に固着することができる利点を有する。   In addition, since the tapered portion 59 is formed at the bottom of the spacer body 5-2 and the tapered portion 61 is provided on the bottom 1 side corresponding to the tapered portion 59, the bottom portion Since the installation area of the spacer main body 5-2 with respect to 1 is increased and the spacer main body 5-2 is positioned and held by the tapered portions 59 and 61, the spacer main body 5-2 can be fixed to the bottom 1 with a right angle. Has the advantage of being able to.

図13及び図14は請求項1乃至請求項4、請求項6及び請求項8に係るスペーサの一実施形態を示し、本実施形態に係るスペーサ63は、図1のスペーサ本体5と同一の外形形状からなる樹脂製のスペーサ本体5-3をモールド筐体3の底部1と別体に形成し、当該スペーサ本体5-3を、取付ネジたる皿タッピングネジ65で底部1に固着するもので、スペーサ本体5-3の底部67とモールド筐体3の底部1には、夫々、皿タッピングネジ65のネジ挿通穴69、71が設けられている。そして、図示しないがモールド筐体3の底部1には、複数のスペーサ本体5-3を固定するため、複数のネジ挿通穴71が適宜設けられている。   FIGS. 13 and 14 show one embodiment of the spacer according to claims 1 to 4, 6 and 8, and the spacer 63 according to this embodiment has the same outer shape as the spacer main body 5 of FIG. 1. A resin-made spacer main body 5-3 having a shape is formed separately from the bottom 1 of the mold housing 3, and the spacer main body 5-3 is fixed to the bottom 1 with a flat tapping screw 65 as a mounting screw. Screw insertion holes 69 and 71 for flat tapping screws 65 are provided in the bottom 67 of the spacer body 5-3 and the bottom 1 of the mold housing 3, respectively. Although not shown, a plurality of screw insertion holes 71 are appropriately provided on the bottom 1 of the mold housing 3 in order to fix the plurality of spacer bodies 5-3.

尚、その他の構成は前記実施形態と同様であるので、同一のものには同一符号を付してそれらの説明は省略する。   In addition, since the other structure is the same as that of the said embodiment, the same code | symbol is attached | subjected to the same thing and those description is abbreviate | omitted.

また、前記スペーサ63を用いたプリント基板13の取付方法も、皿タッピングネジ65で底部1にスペーサ本体5-3を固着した後、図1の実施形態と同様の手順によって、コマ部材25と皿タッピングネジ27を用いてプリント基板13を取り付ければよいため、それらの説明は省略する。   In addition, the printed board 13 is attached using the spacer 63 after the spacer body 5-3 is fixed to the bottom 1 with the dish tapping screw 65, and then the piece member 25 and the dish are processed in the same procedure as in the embodiment of FIG. Since the printed circuit board 13 may be attached using the tapping screw 27, the description thereof is omitted.

本実施形態はこのように構成されており、本実施形態によっても、既述した各実施形態と同様、所期の目的を達成することが可能で、スペーサ63を用いることで、モールド筐体3を変更することなく、板厚の異なる総てのプリント基板を上面合わせ(図14中、P)でモールド筐体3に位置決め固定することが可能であり、また、スペーサ本体5-3をモールド筐体3と別体に形成しているため、仕様に応じてスペーサ本体5-3の個数や取付位置を調整できる等、幅広い製品対応が可能となる。   The present embodiment is configured as described above, and also according to the present embodiment, the intended purpose can be achieved as in the above-described embodiments. By using the spacer 63, the mold housing 3 can be achieved. It is possible to position and fix all the printed boards having different plate thicknesses to the mold housing 3 by aligning the top surfaces (P in FIG. 14) without changing the thickness, and the spacer body 5-3 can be fixed to the mold housing. Since it is formed separately from the body 3, it is possible to deal with a wide range of products, such as adjusting the number of spacer bodies 5-3 and the mounting position according to the specifications.

図15は図8のスペーサ41と図14のスペーサ63を用いてモールド筐体3の底部1に2枚のプリント基板13、13-1を上下2段に間隔を空けて固着した一実施形態を示し、本実施形態では、スペーサ本体5-1の底部に設けたネジ部材43-1をタッピングネジとして機能させ、これをスペーサ63側のコマ部材25に螺着してスペーサ本体5-1、5-3を上下に連結したものである。   FIG. 15 shows an embodiment in which the two printed boards 13 and 13-1 are fixed to the bottom 1 of the mold housing 3 at intervals of two upper and lower stages using the spacer 41 of FIG. 8 and the spacer 63 of FIG. In this embodiment, the screw member 43-1 provided at the bottom of the spacer body 5-1 is made to function as a tapping screw, and this is screwed to the frame member 25 on the spacer 63 side to be spacer bodies 5-1, 5 -3 is connected up and down.

以下、前記スペーサ41、スペーサ63を用いたプリント基板13、13-1の取付方法を説明すると、先ず、モールド筐体3の底部1に皿タッピングネジ65でスペーサ本体5-3を固着する。   Hereinafter, a method for attaching the printed circuit boards 13 and 13-1 using the spacer 41 and the spacer 63 will be described. First, the spacer main body 5-3 is fixed to the bottom 1 of the mold housing 3 with a flat tapping screw 65.

そして、羽根片35をスリット19、21に挿通させてスペーサ本体5-3内にコマ部材25を挿入した後、スペーサ本体5-3上部の鍔部7のテーパ部9にプリント基板13の下穴15の周縁を当接させてプリント基板13を下方へ押し下げれば、スリット19、21を挟んだスペーサ本体5-3の上方が内方へ変形し乍ら、テーパ部9がプリント基板13をスペーサ本体5の下方へとガイドして、プリント基板13がコマ部材25の羽根部35の上部に配置される。   Then, after the blade piece 35 is inserted into the slits 19 and 21 and the frame member 25 is inserted into the spacer body 5-3, the pilot hole of the printed circuit board 13 is formed in the tapered portion 9 of the flange portion 7 above the spacer body 5-3. When the printed circuit board 13 is pushed downward by abutting the periphery of 15, the taper portion 9 causes the printed circuit board 13 to be a spacer while the upper portion of the spacer body 5-3 sandwiching the slits 19 and 21 is deformed inward. The printed circuit board 13 is arranged on the upper portion of the blade portion 35 of the top member 25 while being guided below the main body 5.

次に、スペーサ本体5-3内のコマ部材25の筒状部33中央に、スペーサ本体5-1のネジ部材43-1をタップを切り乍らねじ込んでいけば、回転が規制されているコマ部材25は、ネジ部材43-1のねじ込みに伴いスペーサ本体5-3内を上方へ移動し、これと同時に羽根部35がプリント基板13を押し上げる。   Next, if the screw member 43-1 of the spacer main body 5-1 is screwed into the center of the cylindrical portion 33 of the top member 25 in the spacer main body 5-3, the rotation is restricted. As the screw member 43-1 is screwed in, the member 25 moves upward in the spacer body 5-3, and at the same time, the blade portion 35 pushes up the printed circuit board 13.

そして、ネジ部材43-1を最後まで締め付けると、図15に示すように上方へ移動したコマ部材25の羽根片35と鍔部7との間でプリント基板13を上下から挟み込んで位置決め固定し、これと同時に、スペーサ本体5-1がスペーサ本体5-3の上に連結される。   Then, when the screw member 43-1 is tightened to the end, as shown in FIG. 15, the printed board 13 is sandwiched from above and below between the blade piece 35 of the top member 25 that has moved upward and the collar part 7, and fixed. At the same time, the spacer body 5-1 is connected to the spacer body 5-3.

この後、同様の取付方法を用いて、下穴15が形成された2枚目のプリント基板13-1をスペーサ41を用いて取り付ければよく、板厚の異なる総てのプリント基板をこのように上下2段に取り付ければよい。   Thereafter, the second printed circuit board 13-1 in which the pilot holes 15 are formed may be mounted using the spacer 41 by using the same mounting method, and all the printed circuit boards having different plate thicknesses are attached in this way. What is necessary is just to attach to upper and lower two steps.

このように本実施形態によれば、板厚の異なる総てのプリント基板を、容易に同一の上面高さP、P1で上下2段に位置決め固定することが可能で、モールド筐体の変更に伴う金型改造が不要となってコストの削減が図れる利点を有する。   As described above, according to this embodiment, it is possible to easily position and fix all the printed boards having different plate thicknesses in the upper and lower two stages at the same upper surface height P, P1, and to change the mold housing. There is an advantage that cost reduction can be achieved because the accompanying mold modification is unnecessary.

そして、斯様にプリント基板の板厚違いに対応してモールド筐体を作り分ける必要がないため、プリント基板の組み付け作業時にモールド筐体の取り違い等の虞もなく、信頼性が向上する利点を有する。   And since there is no need to make a separate mold housing corresponding to the difference in thickness of the printed circuit board in this way, there is no risk of the mold housing being replaced during the assembly work of the printed circuit board, and the advantage of improving reliability Have

尚、図15のスペーサ41、スペーサ63の組み合わせの他、例えば図1のスペーサ39と図8のスペーサ41を組み合わせたり、図8のスペーサ41と図12のスペーサ57等を組み合わせても、板厚の異なる総てのプリント基板を、容易に同一の上面高さP、P1で上下2段に位置決め固定することが可能である。   In addition to the combination of the spacer 41 and the spacer 63 in FIG. 15, for example, the spacer 39 in FIG. 1 and the spacer 41 in FIG. 8 or the spacer 41 in FIG. 8 and the spacer 57 in FIG. It is possible to easily position and fix all the printed circuit boards with different upper and lower two levels with the same upper surface height P and P1.

また、既述した各実施形態は、何れも筐体がモールド筐体の場合について説明したが、金属製の筐体にプリント基板を固定する場合に本発明を適用することも可能で、この場合、前記スペーサ本体やコマ部材を筐体と別体の金属で形成すると共に、皿タッピングネジに代えて通常の皿ネジを使用し、また、皿ネジが螺着可能にコマ部材の内周を螺刻しておけばよい。   In each of the embodiments described above, the case has been described in which the case is a molded case. However, the present invention can also be applied to a case where the printed board is fixed to a metal case. The spacer body and the top member are formed of a metal separate from the housing, and a normal flat head screw is used in place of the flat tapping screw, and the inner periphery of the top member is screwed so that the flat head screw can be screwed. Just engrave it.

而して、斯かる実施形態によっても、既述した各実施形態と同様、所期の目的を達成することが可能で、板厚の異なる総てのプリント基板を、容易に同一の上面高さで位置決め固定することができる利点を有する。   Thus, according to such an embodiment, as in the above-described embodiments, the intended purpose can be achieved, and all printed circuit boards having different plate thicknesses can be easily formed with the same top surface height. It has the advantage that it can be positioned and fixed.

1、67 底部
3 モールド筐体
5、5-1、5-2、5-3 スペーサ本体
7 鍔部
9、11、31、59,61 テーパ部
13 プリント基板
15 下穴
17 スペーサ本体の周壁
19、21 スリット
25 コマ部材
27、65 皿タッピングネジ
29 頭部
33 筒状部
35 羽根片
37 操作部
39、41、55、57、63 スペーサ
43、43-1 ネジ部材
45 ナット
47、69、71 ネジ挿通穴
53 鍋タッピングネジ
DESCRIPTION OF SYMBOLS 1, 67 Bottom part 3 Mold housing | casing 5, 5-1, 5-2, 5-3 Spacer main body 7 Gutter part 9, 11, 31, 59, 61 Tapered part 13 Printed circuit board 15 Pilot hole 17 Perimeter wall 19 of spacer main body, 21 Slit 25 Top member 27, 65 Countersunk tapping screw 29 Head 33 Tubular part 35 Blade piece 37 Operation part 39, 41, 55, 57, 63 Spacer 43, 43-1 Screw member 45 Nut 47, 69, 71 Screw insertion Hole 53 Pan tapping screw

Claims (8)

筐体に取り付き、対向する2本のスリットが周壁の上部から下方へ形成され、上部に設けた鍔部がプリント基板側の下穴に圧入可能な筒状のスペーサ本体と、
前記スペーサ本体内に挿入され、スペーサ本体の上方からネジが中央に螺着されると共に、前記スリットを挿通する羽根が外周に突設された環状のコマ部材とからなり、
前記ネジの締め付けに伴い、前記コマ部材がスペーサ本体内を上方へ移動して前記鍔部と羽根との間でプリント基板を位置決め固定することを特徴とするスペーサ。
A cylindrical spacer body that is attached to the housing and has two opposing slits formed downward from the upper part of the peripheral wall, and a collar provided on the upper part can be press-fitted into the prepared hole on the printed circuit board side;
It is inserted into the spacer body, a screw is screwed into the center from above the spacer body, and a blade is inserted through the slit, and an annular frame member is provided on the outer periphery.
As the screw is tightened, the top member moves upward in the spacer body to position and fix the printed circuit board between the flange and the blade.
前記鍔部の上部周縁部が、テーパ状に形成されていることを特徴とする請求項1に記載のスペーサ。   The spacer according to claim 1, wherein an upper peripheral edge portion of the flange portion is formed in a tapered shape. 前記鍔部の下部周縁部が、テーパ状に形成されていることを特徴とする請求項1または請求項2に記載のスペーサ。   The spacer according to claim 1 or 2, wherein a lower peripheral edge portion of the flange portion is formed in a tapered shape. 前記鍔部の上部周縁部に、当該鍔部を内方へ押圧操作可能な凹状の操作部が設けられていることを特徴とする請求項1乃至請求項3のいずれか1項に記載のスペーサ。   The spacer according to any one of claims 1 to 3, wherein a concave operation part capable of pressing the collar part inwardly is provided at an upper peripheral edge part of the collar part. . 前記筐体はモールド筐体で、前記スペーサ本体は当該モールド筐体に一体成形されていることを特徴とする請求項1乃至請求項4のいずれか1項に記載のスペーサ。   The spacer according to any one of claims 1 to 4, wherein the casing is a molded casing, and the spacer main body is integrally formed with the molded casing. 前記スペーサ本体は、筐体に取付ネジを介して固着されることを特徴とする請求項1乃至請求項4のいずれか1項に記載のスペーサ。   The spacer according to any one of claims 1 to 4, wherein the spacer main body is fixed to the housing via a mounting screw. 前記スペーサ本体は、底部にネジ部材が一体に形成され、当該ネジ部材にナットを螺着して筐体に固着されることを特徴とする請求項1乃至請求項4のいずれか1項に記載のスペーサ。   5. The spacer body according to claim 1, wherein a screw member is integrally formed at a bottom portion of the spacer body, and a nut is screwed onto the screw member to be fixed to the housing. Spacers. 前記コマ部材に螺着するネジは皿タッピングネジで、スペーサ本体の上部内周は、当該皿タッピングネジの頭部に沿ってテーパ状に形成されていることを特徴とする請求項1乃至請求項7のいずれか1項に記載のスペーサ。
The screw to be screwed onto the top member is a flat tapping screw, and the upper inner periphery of the spacer body is formed in a tapered shape along the head of the flat tapping screw. 8. The spacer according to any one of 7 above.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014138070A (en) * 2013-01-16 2014-07-28 Fujitsu Ltd Connection device for circuit board
KR20160091398A (en) * 2014-11-11 2016-08-02 뷔르트 엘렉트로닉 아이조스 게엠베하 운트 콤파니 카게 Securing element for securing to a printed circuit board, and securing apparatus and method for spaced connection of printed circuit boards using such a securing element
CN112911880A (en) * 2019-11-19 2021-06-04 英业达科技有限公司 Circuit board fixing assembly
TWI747089B (en) * 2019-11-27 2021-11-21 英業達股份有限公司 Circuit board fixing assembly
DE102015204120B4 (en) 2015-03-06 2022-08-25 Zf Friedrichshafen Ag Fastening device for fastening a printed circuit board to a carrier, circuit device and method for fastening a printed circuit board to a carrier

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014138070A (en) * 2013-01-16 2014-07-28 Fujitsu Ltd Connection device for circuit board
KR20160091398A (en) * 2014-11-11 2016-08-02 뷔르트 엘렉트로닉 아이조스 게엠베하 운트 콤파니 카게 Securing element for securing to a printed circuit board, and securing apparatus and method for spaced connection of printed circuit boards using such a securing element
JP2017502492A (en) * 2014-11-11 2017-01-19 ウルト エレクトロニク アイソス ゲーエムベーハー ウント コンパニー カーゲー CIRCUIT BOARD INSTALLATION MEMBER, AND APPARATUS APPARATUS AND METHOD FOR SEPARATELY CONNECTING A plurality of circuit boards with the attachment member
KR101909357B1 (en) * 2014-11-11 2018-10-17 뷔르트 엘렉트로닉 아이조스 게엠베하 운트 콤파니 카게 Securing element for securing to a printed circuit board, and securing apparatus and method for spaced connection of printed circuit boards using such a securing element
US10462910B2 (en) 2014-11-11 2019-10-29 Würth Elektronik eiSos Gmbh & Co. KG Fitting element for fitting to a circuit board
DE102015204120B4 (en) 2015-03-06 2022-08-25 Zf Friedrichshafen Ag Fastening device for fastening a printed circuit board to a carrier, circuit device and method for fastening a printed circuit board to a carrier
CN112911880A (en) * 2019-11-19 2021-06-04 英业达科技有限公司 Circuit board fixing assembly
TWI747089B (en) * 2019-11-27 2021-11-21 英業達股份有限公司 Circuit board fixing assembly

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