JP2011155309A - Method for manufacturing photovoltaic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a photovoltanic device, capable of suppressing occurrence of adhesion failure of a metal wire to a photoelectric converting section during manufacturing, and to provide a manufacturing apparatus thereof. <P>SOLUTION: The method for manufacturing the photovoltanic device includes the steps of coating an adhesive on the surface of a roller 23 having a notch 23a; transferring conductive paste 3a to a copper wire 2a, by bringing the conductive paste 3a into contact with each predetermined portion of the copper wire 2a, that constitutes a finger electrode section 2 and sequentially separating the copper wire 2a from the roller 23; and fixing the copper wire 2a that constitutes the finger electrode section 2, separated from the roller 23 on the main surface of the photoelectric converting section 1 via the conductive paste 3a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method and apparatus for manufacturing a photovoltaic device, and more particularly to a method and apparatus for manufacturing a photovoltaic device in which a metal wire is fixed to the main surface of a photoelectric conversion unit.

  Conventionally, a manufacturing method and a manufacturing apparatus of a photovoltaic device in which a metal wire is fixed to a main surface of a photoelectric conversion unit are known (see, for example, Patent Document 1).

  In Patent Document 1, a conductive adhesive (adhesive) is bonded to a region corresponding to the entire surface of the electrode forming surface of a photovoltaic element (photovoltaic device) in a flat conductive resin coating base (base material). After applying the material), the copper wire (metal wire) is brought into contact with the conductive adhesive at a time to transfer the conductive adhesive to the copper wire at the same time, and the copper wire is connected to the electrode via the conductive adhesive. A method and apparatus for manufacturing a photovoltaic device fixed to a forming surface is disclosed.

Japanese Patent Laid-Open No. 3-6867

  However, in the photovoltaic element manufacturing method and manufacturing apparatus disclosed in Patent Document 1, the entire surface of the electrode forming surface of the photovoltaic element (photovoltaic device) of the flat conductive resin coating base (base material) is provided. Since the conductive adhesive is applied to the corresponding region and the conductive adhesive is transferred to the copper wire at one time, the length of the contact portion between the copper wire and the conductive adhesive during transfer is increased. For this reason, after transferring the conductive adhesive to the copper wire, when the copper wire is pulled away from the conductive resin coating table, the copper wire is easily deformed by the stress applied to the copper wire by the adhesive force of the conductive adhesive. . In particular, if the copper wire is thinned to increase the light receiving area of the photovoltaic device, the copper wire is more easily deformed. Since the deformed portion of the copper wire is less likely to be bonded to the photovoltaic element, a problem of poor adhesion of the copper wire (metal wire) during the production of the photovoltaic element (photovoltaic device) is likely to occur. There is a point.

  The present invention has been made in order to solve the above-described problems, and one object of the present invention is to suppress the occurrence of defective adhesion of a metal wire to a photoelectric conversion part during manufacturing. A photovoltaic device manufacturing method and a manufacturing apparatus are provided.

  In order to achieve the above object, a method of manufacturing a photovoltaic device according to a first aspect of the present invention includes a step of applying an adhesive to the surface of a base material, and a predetermined portion of a metal wire constituting a collector electrode. The step of transferring the adhesive to the metal wire by sequentially separating the metal wire from the base material and the metal wire constituting the collector electrode separated from the base material through the adhesive material And a step of fixing to the main surface of the photoelectric conversion unit.

  In the method for manufacturing a photovoltaic device according to the first aspect, as described above, the adhesive is brought into contact with each predetermined portion of the metal wire constituting the collector electrode, and the metal wire is sequentially separated from the base material. By providing the step of transferring the adhesive to the metal wire, it is possible to suppress an increase in the length of the contact portion of the adhesive applied to the surface of the base material with respect to the metal wire during transfer. When the metal wire is pulled away from the material, an increase in stress applied to the metal wire due to the adhesive force of the adhesive can be suppressed. Thereby, since it can suppress that a metal wire deform | transforms, when pulling a metal wire away from a base material, it suppresses that the adhesion defect of the metal wire with respect to the main surface of a photoelectric conversion part generate | occur | produces at the time of manufacture. Can do.

  In the method for manufacturing a photovoltaic device according to the first aspect, preferably, the step of transferring the adhesive material to the metal wire includes a step of transferring the adhesive to the metal wire at a transfer position for each predetermined portion of the metal wire. The method includes the step of transferring the adhesive to the metal wire by pulling the metal wire away from the base material in a state where the length of the contact portion of the adhesive applied to the surface of the material is 25 mm or less. If comprised in this way, it can suppress more that the adhesion defect of the metal wire with respect to the main surface of a photoelectric conversion part generate | occur | produces at the time of manufacture. This point has been confirmed by experiments to be described later.

  In the method for manufacturing a photovoltaic device according to the first aspect, preferably, the base material includes a base material having one of a columnar shape and a cylindrical shape. If comprised in this way, when pulling a metal wire away from a base material, the adhesive applied to the surface of a columnar or cylindrical base material will be applied to the base material in order from the end side of the contact portion to the metal wire. Because it is pulled apart, compared to the case where the entire surface of the contact portion is pulled away from the flat substrate at once, as in the case of transferring the adhesive to the metal wire using a flat substrate, the metal wire is removed from the substrate. It is possible to reduce the stress applied to the metal wire when being pulled apart. Thereby, it can suppress more that a metal wire deform | transforms.

  In the method of manufacturing a photovoltaic device including the base material, wherein the base material has one of a columnar shape and a cylindrical shape, preferably, the step of transferring the adhesive material to the metal wire brings the adhesive material into contact with the metal wire In addition, while rotating the base material having one of the columnar shape and the cylindrical shape, the adhesive is continuously applied to the metal wire for each predetermined portion of the metal wire, and the metal wire is sequentially removed from the base material. A step of separating. With this configuration, the adhesive applied to the surface of the cylindrical or cylindrical substrate can be easily transferred to the metal wire while reducing the stress applied to the metal wire when the metal wire is pulled away from the substrate. can do.

  In the method of manufacturing a photovoltaic device including the substrate having a columnar shape or a cylindrical shape, the surface of the substrate having either the columnar shape or the cylindrical shape is preferably provided with a photoelectric The notch portion is formed so as to correspond to the shape of the transparent conductive film formed in the predetermined region on the main surface of the conversion portion, and the step of applying the adhesive to the surface of the substrate is performed by the shape of the transparent conductive film. The process of apply | coating an adhesive material to surfaces other than the notch part of a base material so as to correspond to is included. If comprised in this way, since an adhesive can be apply | coated only to the area | region in which the transparent conductive film of the photoelectric conversion part was formed, a metal wire can be arrange | positioned only in the area | region in which the transparent conductive film was formed.

  In the method for manufacturing a photovoltaic device according to the first aspect, preferably, the base material includes a base material having a flat surface. If comprised in this way, since the adhesive agent apply | coated to the surface of a base material can be easily made uniform thickness using a spatula etc., an adhesive material is easily transcribe | transferred with a uniform thickness to a metal wire. be able to.

  In the method of manufacturing a photovoltaic device including the base material having a flat surface, the portion to which the adhesive on the surface of the base material having the flat surface is applied is preferably a metal wire. In the length direction, the length is 25 mm or less. If comprised in this way, the length of the contact part with respect to the metal wire of the adhesive material apply | coated to the surface of a base material can be made small enough. Thereby, when pulling apart a metal wire from a base material, the stress added to a metal wire by the adhesive force of an adhesive agent can be made small enough.

  In the method for manufacturing a photovoltaic device including the base material having a flat surface, the base material having a flat surface preferably includes a plurality of base materials on the surface of the base material. The step of applying the adhesive includes a step of applying the adhesive to the surfaces of the plurality of base materials, and the step of transferring the adhesive to the metal wire is divided into a plurality of times for each predetermined portion of the metal wire, A step of applying an adhesive applied to a plurality of substrates and sequentially separating the metal wires from the substrate; If comprised in this way, since the length of the contact part of the adhesive apply | coated to the surface of the base material with respect to a metal wire can be made small easily, the metal of the adhesive applied to the surface of the base material The length of the contact portion with respect to the line can be easily reduced. Thereby, when the metal wire is pulled away from the base material, the stress applied to the metal wire by the adhesive force of the adhesive can be easily reduced.

  In the method for manufacturing a photovoltaic device including the base material having a flat surface, the base material having a flat surface preferably includes a plurality of base materials on the surface of the base material. The step of applying the adhesive includes arranging the surfaces of the plurality of substrates on substantially the same plane and applying the adhesive to the surfaces of the plurality of substrates. If comprised in this way, since an adhesive agent can be apply | coated to the surface of a several base material at once, the application | coating process of an adhesive agent can be simplified.

  A photovoltaic device manufacturing apparatus according to a second aspect of the present invention is a manufacturing apparatus used in a photovoltaic device manufacturing method in which a metal wire constituting a collector electrode is fixed to a main surface of a photoelectric conversion unit via an adhesive. The adhesive is applied to the surface of the substrate, and the adhesive is brought into contact with each predetermined portion of the metal wire constituting the collector electrode. Transfer means for transferring the adhesive.

  In the photovoltaic device manufacturing apparatus according to the second aspect, as described above, the adhesive is brought into contact with each predetermined portion of the metal wire constituting the collector electrode, and the metal wire is sequentially separated from the base material. By providing a transfer means for transferring the adhesive to the metal wire, it is possible to suppress an increase in the length of the contact portion of the adhesive applied to the surface of the base material with respect to the metal wire during transfer. When the metal wire is pulled away from the base material, the stress applied to the metal wire due to the adhesive force of the adhesive can be suppressed. Thereby, since it can suppress that a metal wire deform | transforms, when pulling a metal wire away from a base material, it suppresses that the adhesion defect of the metal wire with respect to the main surface of a photoelectric conversion part generate | occur | produces at the time of manufacture. Can do.

  In the photovoltaic device manufacturing apparatus according to the second aspect, preferably, the transfer means is applied to the surface of the base material with respect to the metal wire constituting the collector electrode at the transfer position for each predetermined portion of the metal wire. In a state where the length of the contact portion of the adhesive is 25 mm or less, the adhesive is transferred to the metal wire by pulling the metal wire away from the base material. If comprised in this way, when pulling apart a metal wire from a base material, since it can suppress that a metal wire deform | transforms, the adhesion defect of the metal wire with respect to the main surface of a photoelectric conversion part generate | occur | produces at the time of manufacture. Can be further suppressed. This point has been confirmed by experiments to be described later.

  In the photovoltaic device manufacturing apparatus according to the second aspect, preferably, the base material includes a base material having one of a columnar shape and a cylindrical shape, and the transfer unit contacts the adhesive with the metal wire. In addition, while rotating the base material having one of the columnar shape and the cylindrical shape, the adhesive is continuously applied to the metal wire for each predetermined portion of the metal wire, and the metal wire is sequentially removed from the base material. Pull apart. With this configuration, the adhesive applied to the surface of the cylindrical or cylindrical substrate can be easily transferred to the metal wire while reducing the stress applied to the metal wire when the metal wire is pulled away from the substrate. can do. Also, by providing a base material having one of a columnar shape and a cylindrical shape, when the metal wire is pulled away from the base material, the adhesive applied to the surface of the columnar or cylindrical base material is a metal wire. Since the substrate is pulled away from the substrate in order from the end side of the contact portion, the entire surface of the contact portion is removed from the plate-like substrate at the same time as when the adhesive is transferred to the metal wire using the plate-like substrate. Compared to the case where the metal wire is pulled apart, the stress applied to the metal wire when the metal wire is pulled away from the substrate can be reduced. Thereby, it can suppress easily that a metal wire deform | transforms.

It is the top view which showed the structure of the photovoltaic apparatus produced with the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing along the 100-100 line of FIG. It is sectional drawing along the 200-200 line | wire of FIG. It is a perspective view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is a perspective view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is a side view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is a side view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing for demonstrating the transfer process of the electrically conductive paste to the copper wire using the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing for demonstrating the transfer process of the electrically conductive paste to the copper wire using the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is sectional drawing for demonstrating the transfer process of the electrically conductive paste to the copper wire using the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention. It is a side view for demonstrating the structure of the manufacturing apparatus of the photovoltaic apparatus by 2nd Embodiment of this invention. It is a perspective view for demonstrating the structure of the manufacturing apparatus of the photovoltaic apparatus by 2nd Embodiment of this invention. It is a side view for demonstrating the transfer process of the electrically conductive paste to the copper wire using the manufacturing apparatus of the photovoltaic apparatus by 2nd Embodiment of this invention. It is a side view for demonstrating the transfer process of the electrically conductive paste to the copper wire using the manufacturing apparatus of the photovoltaic apparatus by 2nd Embodiment of this invention. It is a side view for demonstrating the experiment conducted in order to confirm the effect by 1st and 2nd embodiment of this invention. It is a side view for demonstrating the experiment conducted in order to confirm the effect by 1st and 2nd embodiment of this invention. It is a perspective view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by the 1st modification of 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing apparatus of the photovoltaic apparatus by the 2nd modification of 1st Embodiment of this invention. It is a side view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by the 2nd modification of 1st Embodiment of this invention. It is a side view for demonstrating the transfer process of the electrically conductive paste to a copper wire using the manufacturing apparatus of the photovoltaic apparatus by the 3rd modification of 1st Embodiment of this invention. It is a figure for demonstrating the photovoltaic apparatus produced with the manufacturing apparatus of the photovoltaic apparatus by the 4th modification of 1st and 2nd embodiment of this invention. It is a perspective view for demonstrating the manufacturing apparatus of the photovoltaic apparatus by the 5th modification of 1st and 2nd embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is a top view showing a configuration of a photovoltaic device manufactured by the photovoltaic device manufacturing apparatus according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line 100-100 in FIG. FIG. 3 is a cross-sectional view taken along line 200-200 in FIG. First, with reference to FIGS. 1-3, the structure of the photovoltaic apparatus produced with the manufacturing apparatus of the photovoltaic apparatus by 1st Embodiment of this invention is demonstrated.

  In the photovoltaic device manufactured by the photovoltaic device manufacturing apparatus according to the first embodiment of the present invention, a copper wire (metal wire) is formed on the upper surface (main surface) of the photoelectric conversion unit 1 as shown in FIG. ) And a finger electrode portion 2 made of a copper wire 2a having a length of about 100 mm and a diameter of about 50 μm is a conductive material made of an epoxy-based thermosetting conductive paste (silver (Ag) paste). Bonded by the adhesive layer 3. The finger electrode portion 2 is an example of the “collecting electrode” in the present invention. The finger electrode part 2 and the adhesive layer 3 are arranged on the upper surface of the photoelectric conversion part 1 at a pitch (inter-center distance) of about 2 mm in the A direction of FIG. 1 and parallel to the B direction of FIG. A plurality are provided to extend.

  Further, the two bus bar electrode parts 4 extend in a direction (A direction) orthogonal to the extending direction of the finger electrode part 2 at a position about 25 mm inside from both ends of the adhesive layer 3 on the photoelectric conversion part 1. Is formed. The bus bar electrode portion 4 is made of an epoxy-based thermosetting conductive paste (silver (Ag) paste) and has a width of about 1.5 mm. Further, in the region where the finger electrode portion 2 and the adhesive layer 3 intersect with the bus bar electrode portion 4, the bus bar electrode portion 4 is formed so as to cover the finger electrode portion 2 and the adhesive layer 3 as shown in FIG. Has been. The plurality of finger electrode portions 2 are electrically connected to each other by the bus bar electrode portion 4.

  In the photoelectric conversion unit 1, as shown in FIG. 2, the resistivity is about 1 Ω · cm, the planar size is about 104 mm (length) × about 104 mm (width), and the thickness is about 300 μm. A texture structure (uneven shape) is formed on the upper and lower surfaces of the single crystal silicon substrate 5. A substantially intrinsic i-type amorphous silicon layer 6 having a thickness of about 5 nm is formed on the upper surface of the n-type single crystal silicon substrate 5. A p-type amorphous silicon layer 7 having a thickness of about 5 nm is formed on the upper surface of the i-type amorphous silicon layer 6. As shown in FIG. 1, ITO (Indium Tin Oxide) film non-formation regions 7a are formed at four corners on the upper surface of the p-type amorphous silicon layer 7. Further, as shown in FIGS. 1 and 2, a transparent conductive film 8 having a thickness of about 80 nm to about 100 nm is formed in a predetermined region on the upper surface of the p-type amorphous silicon layer 7. The transparent conductive film 8 is composed of an ITO film made of InO2 containing about 5% by mass of SnO2. The finger electrode portion 2 is fixed on the upper surface of the transparent conductive film 8 via the adhesive layer 3.

  Further, as shown in FIG. 2, a substantially intrinsic i-type amorphous silicon layer 9 having a thickness of about 5 nm and an n-type having a thickness of about 5 nm are formed on the lower surface of the n-type single crystal silicon substrate 5. A type amorphous silicon layer 10 and a transparent conductive film 11 having a thickness of about 80 nm to about 100 nm are sequentially formed. Also, on the lower surface of the transparent conductive film 11, a plurality of finger electrode portions 12a formed so as to extend in parallel with each other at a predetermined interval, and a bus bar that collects current collected by the finger electrode portions 12a A back electrode 12 including an electrode portion (not shown) is formed. The back electrode 12 is formed of an epoxy thermosetting conductive paste (silver (Ag) paste).

  4-9 is a figure for demonstrating the structure of the manufacturing apparatus used for the formation process of the finger electrode part of the photovoltaic apparatus by 1st Embodiment of this invention. Next, with reference to FIG. 1 and FIGS. 4-9, the structure of the manufacturing apparatus used for the formation process of the finger electrode part 2 of the photovoltaic apparatus by 1st Embodiment of this invention is demonstrated.

  In the manufacturing apparatus used for the formation process of the finger electrode portion 2 of the photovoltaic device according to the first embodiment of the present invention, first, as a mechanism for winding the copper wire 2a constituting the finger electrode portion 2, as shown in FIG. A bobbin 21 and a winding member 22 having four cylindrical portions 22a arranged in parallel are provided. The bobbin 21 is wound with a copper wire 2a attached to the photoelectric conversion unit 1 (see FIG. 1) of the photovoltaic device. The copper wire 2a is an example of the “metal wire” in the present invention. Further, the winding member 22 rotates at a constant speed around the rotation center O1 and applies a predetermined tension (about 0.2 N) to the copper wire 2a while the copper wire 2a is a cylinder of the winding member 22. It is configured to wind up so as to be arranged parallel to the portion 22a at a pitch of about 2 mm.

  In the photovoltaic device manufacturing apparatus according to the first embodiment of the present invention, as shown in FIG. 5, a cylindrical roller 23 and a cylindrical roller are used as a transfer mechanism for the conductive paste 3a to the copper wire 2a. A thickness adjusting roller 24 disposed at a predetermined distance from 23, and a roller 25 including a gear 25 for driving the roller 23, a rack 26, and a driving source (not shown) are provided. The roller 23 is an example of the “base material” in the present invention, and the roller driving unit 27 is an example of the “transfer unit” in the present invention. The roller 23 has a diameter of about 31.8 mm (circumference: about 100 mm) and a length of about 110 mm along the direction in which the central axis extends. Further, the roller 23 is configured to apply a conductive paste 3a having a thickness of about 50 μm to the surface of the roller 23 by rotating. The conductive paste 3a is an example of the “adhesive” in the present invention.

  Here, in the first embodiment, as shown in FIG. 6, the roller 23 has a notch 23 a corresponding to the ITO film non-formation region 7 a (see FIG. 1) of the photoelectric conversion unit 1 (see FIG. 1). Is formed. That is, the roller 23 is formed such that the conductive paste 3a is transferred only to the region corresponding to the transparent conductive film 8 (see FIG. 1) of the copper wire 2a.

  A gear 25 is attached to the shaft 23b of the roller 23 as shown in FIG. Further, on the upper side of the gear 25, a rack 26 having a gear portion 26a that engages with the gear 25 is disposed in parallel with the copper wire 2a. Then, as shown in FIG. 8, the gear 25 is rotated while being engaged with the gear portion 26a of the rack 26 by a driving source (not shown), so that the center of the roller 23 (see FIG. 7) and the gear 25 is the rack 26. And it is comprised so that it can move in parallel along copper wire 2a. Thereby, the conductive paste 3a can be continuously applied to the copper wire 2a with a uniform thickness.

  Further, in the method for manufacturing a photovoltaic device according to the first embodiment of the present invention, as shown in FIG. 9, the copper wire 2a to which the conductive paste 3a is transferred is attached to the photoelectric conversion unit 1 of the photovoltaic device. At this time, a fixing base 28 for fixing the photoelectric conversion unit 1 is provided.

  Next, a photovoltaic device manufacturing process using the photovoltaic device manufacturing apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 5 and 9 to 12.

  First, the formation process of the finger electrode part 2 is demonstrated with reference to FIG.1, FIG.2, FIG.4, FIG.5 and FIG.

  First, as shown in FIG. 4, a copper wire 2 a having a diameter of about 50 μm constituting the finger electrode portion 2 is wound around a bobbin 21. Then, the winding member 22 having four cylindrical portions 22a arranged in parallel is rotated at a constant speed so that the copper wire 2a drawn out from the bobbin 21 does not break or bend, and the copper wire 2a has a predetermined value. The copper wire 2a is wound around the cylindrical portion 22a of the winding member 22 so as to be arranged in parallel at a pitch of about 2 mm.

  Then, as shown in FIG. 5, the conductive paste 3 a having a uniform thickness of about 50 μm is applied to the surface of the roller 23 by the function of the thickness adjusting roller 24 by rotating the cylindrical roller 23. Thereafter, while applying a predetermined tension (about 0.2 N) to the copper wire 2a, the conductive paste (silver (Ag) paste) 3a of the roller 23 is in contact with the copper wire 2a as shown in FIG. The conductive paste 3a is continuously transferred to the copper wire 2a by rotating the roller 23 using the roller driving unit 27 including the gear 25 and the rack 26. At this time, the roller 23 is translated at the same speed as the transfer speed of the conductive paste 3a. Specifically, when the angular speed of the roller 23 is ω (rad / s), the radius of the roller 23 is r (mm), and the moving speed of the roller 23 with respect to the copper wire 2a and the rack 26 is v (mm / s). The following equation (1) is satisfied. In the first embodiment, r = 31.8 / 2 (mm).

v (mm / s) = r (mm) × ω (rad / s) (1)
As a result, it is possible to suppress slippage between the copper wire 2a and the surface of the roller 23.

  In the first embodiment, as shown in FIG. 10, the roller 23 has a length (L) of a contact portion of the conductive paste 3a applied to the surface with respect to the copper wire 2a of about 2.5 mm. , Is in contact with the copper wire 2a. When the conductive paste 3a is applied to the copper wire 2a having a length of about 100 mm by one rotation of the roller 23, the roller 23 is pulled away from the copper wire 2a as shown in FIG. Moved to. At this time, in the first embodiment, since the roller 23 is formed in a cylindrical shape, the conductive paste 3a in contact with the copper wire 2a is gradually separated from the roller 23 in order from the end side of the contact portion, and gradually. The length (L) of the contact portion is reduced. Thus, compared to the case where the entire contact portion is separated from the flat base material at a time as in the case where the conductive paste 3a is transferred to the copper wire 2a using the flat base material, the copper from the roller 23 is reduced. Since the stress applied to the copper wire 2a when separating the wire 2a can be reduced, it is possible to suppress the deformation of the copper wire 2a. Then, as shown in FIG. 12, the roller 23 is pulled away from the copper wire 2a. In the first embodiment, since the conductive paste 3a is not applied to the notch 23a of the roller 23, the conductive paste 3a is formed in the region corresponding to the notch 23a of the roller 23 of the copper wire 2a. Not applied.

  Next, the photoelectric conversion part 1 in which the transparent conductive films 8 and 11 (see FIG. 2) are formed is prepared. Then, as shown in FIG. 9, the photoelectric conversion unit 1 is fixed to the fixed base 28. Thereafter, the copper wires 2 a that are arranged in parallel at a pitch of about 2 mm and that are coated with the conductive paste 3 a are arranged in a predetermined region of the photoelectric conversion unit 1. At this time, the conductive paste 3a is not applied to a region corresponding to the notch 23a of the roller 23 of the copper wire 2a. That is, since the conductive paste 3a is not applied to the region corresponding to the ITO film non-formation region 7a (see FIG. 1) of the copper wire 2a, the copper wire 2a is conductive only on the upper surface of the transparent conductive film 8. It arrange | positions through the property paste 3a.

  Then, heat treatment is performed at a temperature of about 200 ° C. for about 30 minutes with a lamp heater (not shown) in a state where the thermosetting conductive paste 3a is in contact with the upper surface of the transparent conductive film 8, thereby conducting the conductive paste. The adhesive layer 3 is formed by curing 3a. Thereafter, the copper wire 2 a is cut at a predetermined position, thereby forming the finger electrode portion 2 made of the copper wire 2 a on the upper surface of the transparent conductive film 8.

  Next, with reference to FIG. 1 and FIG. 3, the manufacturing process of the bus-bar electrode part 4 and the back surface electrode 12 is demonstrated.

  First, as shown in FIG. 1, using the screen printing method, the finger electrode portion 2 and the adhesive layer 3 extend in positions extending about 25 mm from both ends of the adhesive layer 3 on the photoelectric conversion portion 1. The conductive paste is transferred so as to extend in a direction perpendicular to the direction (A direction). As this conductive paste, an epoxy-based thermosetting conductive paste (silver (Ag) paste) is used. Thereafter, the conductive paste is cured by heating at about 200 ° C. for about 1 hour in a heating furnace. As a result, a bus bar electrode portion 4 that connects the plurality of finger electrode portions 2 to each other is formed in a predetermined region on the photoelectric conversion portion 1. At this time, at a position where the bus bar electrode portion 4 intersects the finger electrode portion 2 and the adhesive layer 3, the bus bar electrode portion 4 is formed so as to cover the finger electrode portion 2 and the adhesive layer 3 as shown in FIG. .

  Thereafter, using a screen printing method, an epoxy thermosetting conductive paste (silver (Ag) paste) is transferred onto a predetermined region of the transparent conductive film 11 on the back surface side, and then is transferred to about 200 in a heating furnace. The back surface electrode 12 is formed by curing the conductive paste by heating at a temperature of about 1 hour. As a result, a plurality of finger electrode portions 12a formed on the lower surface of the transparent conductive film 11 so as to extend in parallel with each other at a predetermined interval, and a bus bar electrode portion that collects current collected by the finger electrode portions 12a ( A back electrode 12 made of (not shown) is formed. Thus, a photovoltaic device using the photovoltaic device manufacturing apparatus according to the first embodiment of the present invention shown in FIG. 1 is manufactured.

  In the first embodiment, as described above, the copper paste 2a is brought into contact with the conductive paste 3a, and the conductive paste 3a is continuously transferred to the copper wire 2a while rotating the cylindrical roller 23. Since the conductive paste 3a can be brought into contact with each predetermined portion of the copper wire 2a and the copper wire 2a can be sequentially separated from the roller 23, the copper of the conductive paste 3a applied to the surface of the roller 23 at the time of transfer It can suppress that the length (L) of the contact part with respect to the line 2a becomes large. Thus, when the copper wire 2a is separated from the roller 23, it is possible to suppress an increase in stress applied to the copper wire 2a due to the adhesive force of the conductive paste 3a. Therefore, when the copper wire 2a is separated from the roller 23, The copper wire 2a can be prevented from being deformed. As a result, it is possible to suppress the occurrence of poor adhesion of the copper wire 2a to the main surface of the photoelectric conversion unit 1 during manufacturing.

  Moreover, in 1st Embodiment, in the state which made the length of the contact part of the electrically conductive paste 3a apply | coated to the surface of the roller 23 with respect to the copper wire 2a 2.5 mm, by pulling apart the copper wire 2a from the roller 23, Since the length of the contact portion of the conductive paste 3a applied to the surface of the roller 23 with respect to the copper wire 2a can be reduced, the copper wire 2a is separated from the roller 23 by the adhesive force of the conductive paste 3a. It can suppress more that the stress added to the line 2a becomes large. Thereby, when pulling the copper wire 2a away from the roller 23, it is possible to further suppress the deformation of the copper wire 2a. Therefore, defective bonding of the copper wire 2a to the main surface of the photoelectric conversion unit 1 occurs during manufacturing. Can be further suppressed. This point has been confirmed by experiments to be described later.

  In the first embodiment, by using the cylindrical roller 23, when the copper wire 2a is pulled away from the roller 23, the conductive paste 3a applied to the surface of the cylindrical roller 23 is applied to the copper wire 2a. Since it can be separated from the roller 23 in order from the end side of the contact portion, the entire surface of the contact portion is a flat base as in the case of transferring the conductive paste 3a to the copper wire 2a using a flat base material. The stress applied to the copper wire 2a when the copper wire 2a is pulled away from the roller 23 can be reduced as compared with the case where the copper wire 2a is pulled away from the material at once. Thereby, it can suppress more that the copper wire 2a deform | transforms.

(Second Embodiment)
13 and 14 are views for explaining the structure of the photovoltaic device manufacturing apparatus according to the second embodiment of the present invention. With reference to FIG. 13 and FIG. 14, in the second embodiment, unlike the first embodiment, a case where a flat base is used as a base material for applying a conductive paste to a copper wire will be described. To do. The structure of the photovoltaic device manufactured by the photovoltaic device manufacturing apparatus according to the second embodiment is the same as that of the first embodiment.

  In the photovoltaic device manufacturing apparatus according to the second embodiment of the present invention, as shown in FIG. 13, the conductive paste 3a is coated with a plurality of SUS flat bases 31 and the conductive paste 3a. And a spatula 32 for uniformly coating the base plate 31 with a spatula 32. The base 31 is an example of the “base material” in the present invention.

  Here, in 2nd Embodiment, as shown in FIG. 14, the flat base 31 is formed so that it may have predetermined length in the length direction (C direction) of the copper wire 2a.

  In addition, the other structure of the manufacturing apparatus of the photovoltaic apparatus by 2nd Embodiment is the same as that of the said 1st Embodiment.

  Next, a photovoltaic device manufacturing process using the photovoltaic device manufacturing apparatus according to the second embodiment of the present invention will be described with reference to FIGS. 4 and 13 to 16.

  First, with reference to FIG. 4 and FIGS. 13-16, the attachment process to the photoelectric conversion part 1 of the copper wire 2a which comprises the finger electrode part 2 is demonstrated.

  First, as in the first embodiment, as shown in FIG. 4, a copper wire 2 a having a diameter of about 50 μm constituting the finger electrode portion 2 is wound around a bobbin 21. Then, the winding member 22 having four cylindrical portions 22a arranged in parallel is rotated at a constant speed so that the copper wire 2a drawn out from the bobbin 21 does not break or bend, and the copper wire 2a has a predetermined value. The copper wire 2a is wound around the cylindrical portion 22a of the winding member 22 so as to be arranged in parallel at a pitch of about 2 mm.

  And in 2nd Embodiment, as shown in FIG. 13, the surface of the some flat base 31 is arrange | positioned adjacently so that it may become substantially the same plane shape. Thereafter, as shown in FIGS. 13 and 15, the conductive paste 3 a is applied to the flat base 31 with a uniform thickness using a spatula 32 (see FIG. 13). Thereafter, as shown in FIG. 14, the conductive paste (silver (Ag) paste) 3a of the base 31 is transferred to the copper wire 2a while applying a predetermined tension (about 0.2 N) to the copper wire 2a.

  At this time, in 2nd Embodiment, as shown in FIG.14 and FIG.16, after making the base 31 of the some flat base 31 contact the copper wire 2a, the base 31 is used. The conductive paste 3a is transferred to the copper wire 2a by being separated from the copper wire 2a. And similarly about the remaining bases 31 among the plurality of flat bases 31, the conductive paste 3a is transferred by bringing the bases 31 into contact with the copper wires 2a one by one and separating them. Then, the conductive paste 3a is sequentially transferred to the copper wire 2a until the conductive paste 3a is transferred to all the predetermined regions of the copper wire 2a.

  The other manufacturing process of the photovoltaic device using the photovoltaic device manufacturing apparatus according to the second embodiment is the same as that of the first embodiment.

  In the second embodiment, as described above, the base for the copper wire 2a is obtained by sequentially transferring the conductive paste 3a to the copper wire 2a in a plurality of times using the plurality of flat bases 31. Since the length of the contact portion of the conductive paste 3a applied to the surface of 31 can be suppressed, the copper wire 2a is separated from the base 31 by the adhesive force of the conductive paste 3a. It can suppress that the stress added to the line 2a becomes large. Thereby, when pulling the copper wire 2a away from the roller 23, it is possible to suppress the deformation of the copper wire 2a. Therefore, defective bonding of the copper wire 2a to the main surface of the photoelectric conversion unit 1 occurs at the time of manufacture. Can be suppressed.

  In the second embodiment, as described above, by using the flat base 31 to apply the conductive paste 3a to the copper wire 2a, the conductive paste 3a applied to the surface of the base 31 is Since the thickness can be easily made uniform using the spatula 32 or the like, the conductive paste 3a can be easily transferred to the copper wire 2a with a uniform thickness.

  Moreover, in 2nd Embodiment, while arrange | positioning the surface of the some base 31 on the substantially same plane, and apply | coating the electrically conductive paste 3a to the surface of the some base 31, the some base 31 is provided. Since the conductive paste 3a can be applied to the surface of the conductive paste 3a at a time, the application process of the conductive paste 3a can be simplified.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

  FIG. 17 and FIG. 18 are diagrams for explaining experiments conducted to confirm the effects of the first and second embodiments of the present invention. Next, experiments conducted for confirming the effects of the first and second embodiments of the present invention described above will be described. In this experiment, the photovoltaic device according to Example 1 was manufactured using the photovoltaic device manufacturing apparatus according to the first embodiment, and the photovoltaic device manufacturing apparatus according to the second embodiment was used as Example 2. The photovoltaic device according to Comparative Example 1 is manufactured using one base having a size larger than that of the manufacturing apparatus of the photovoltaic device according to the second embodiment. did. And about the produced photovoltaic apparatus, the incidence rate of the adhesion defect of the copper wire 2a to the photoelectric conversion part 1 was compared.

Example 1
In Example 1, the conductive paste 3a was transferred to the copper wire 2a using the roller 23. Specifically, the conductive paste 3a having a thickness of about 50 μm applied to the surface of the roller 23 is brought into contact with the copper wire 2a with a length of 2.5 mm to transfer the conductive paste 3a to the copper wire 2a. . Except for this, 100 photovoltaic devices according to Example 1 were produced in the same manner as in the first embodiment.

(Example 2)
In Example 2, a conductive paste is applied to the copper wire 2a by using 40 bases 31 made of a flat plate made of SUS and having a length of 2.5 mm along the length direction of the copper wire 2a. 3a was applied. Specifically, after contacting the copper wire 2a with a length of 2.5 mm to the conductive paste 3a having a thickness of about 50 μm applied to the surface of one base 31, the base 31 is made of copper. The conductive paste 3a was transferred to the copper wire 2a by being separated from the wire 2a. Similarly, the remaining 39 bases 31 were sequentially transferred with the conductive paste 3a onto the copper wire 2a. Except for this, 100 photovoltaic devices according to Example 2 were produced in the same manner as in the second embodiment.

(Example 3)
In Example 3, the conductive paste 3a is formed on the copper wire 2a by using ten bases 31 having a plate shape of SUS and having a length of 10 mm along the length direction of the copper wire 2a. Applied. Specifically, after the copper wire 2a is brought into contact with the conductive paste 3a having a thickness of about 50 μm applied to the surface of one base 31 and having a length of 10 mm, the base 31 is connected to the copper wire 2a. The conductive paste 3a was transferred to the copper wire 2a. And about the remaining nine bases 31, similarly, the electrically conductive paste 3a was transcribe | transferred to the copper wire 2a sequentially. Except for this, 100 photovoltaic devices according to Example 2 were produced in the same manner as in the second embodiment.

Example 4
In Example 4, the conductive paste 3a is applied to the copper wire 2a by using four bases 31 having a length of 25 mm along the length direction of the copper wire 2a. Applied. Specifically, after contacting the copper wire 2a with a length of 25 mm to the conductive paste 3a having a thickness of about 50 μm applied to the surface of one base 31, the base 31 is connected to the copper wire 2a. The conductive paste 3a was transferred to the copper wire 2a. In the same manner, the conductive paste 3a was transferred to the copper wire 2a for the remaining three bases 31 in the same manner. Except for this, 100 photovoltaic devices according to Example 2 were produced in the same manner as in the second embodiment.

(Example 5)
In Example 5, the conductive paste 3a is formed on the copper wire 2a by using two bases 31 that are made of SUS and have a length of 50 mm along the length direction of the copper wire 2a. Applied. Specifically, after the copper wire 2a is brought into contact with the conductive paste 3a having a thickness of about 50 μm applied to the surface of one base 31 and having a length of 50 mm, the base 31 is connected to the copper wire 2a. The conductive paste 3a was transferred to the copper wire 2a. And similarly about the other base 31, the conductive paste 3a was transcribe | transferred to the copper wire 2a. Except for this, 100 photovoltaic devices according to Example 5 were produced in the same manner as in the second embodiment.

(Comparative Example 1)
In this comparative example 1, the conductive paste 3a was applied to the copper wire 2a using a single base having a length of 100 mm along the length direction of the copper wire 2a while being made of a flat plate made of SUS. . Specifically, by contacting the copper wire 2a with a length of 100 mm to the conductive paste 3a having a thickness of about 50 μm applied to the surface of the base, the base is separated from the copper wire 2a, The conductive paste 3a was transferred to the copper wire 2a. Except for this, 100 photovoltaic devices according to Comparative Example 1 were produced in the same manner as in the second embodiment.

  Next, with respect to the photovoltaic devices according to Examples 1 to 5 and Comparative Example 1 manufactured as described above, the incidence of defective bonding of the copper wire 2a to the photoelectric conversion unit 1 was compared. Specifically, as shown in FIGS. 17 and 18, when the copper wire 2 a is deformed and bent, there is a case where there is a portion where the copper wire 2 a is not bonded to the photoelectric conversion unit 1 over 10 mm or more. did. Table 1 below shows the incidence of defective bonding of the copper wire 2a to the photoelectric conversion unit 1.

  From the results of Table 1 above, as the length of the contact portion of the conductive paste 3a applied to the base material (roller 23 and base 31) with respect to the copper wire 2a decreases, the copper wire 2a to the photoelectric conversion unit 1 is reduced. It has been found that the incidence of poor adhesion is reduced. Specifically, the adhesion failure rate of Examples 1 and 2 in which the length of the contact portion with respect to the copper wire 2a of the conductive paste 3a applied to the base material (the roller 23 and the base 31) is 2.5 mm. The adhesion failure rate of Example 3 in which the length of the contact portion is 10 mm is 9%, and the adhesion failure rate of Example 4 in which the length of the contact portion is 25 mm is 5% and 7%, respectively. 11%. Further, the adhesion failure rate of Example 5 in which the length of the contact portion was 50 mm was 21%, and the adhesion failure rate of Comparative Example 1 in which the length of the contact portion was 100 mm was 25%. This is because as the length of the contact portion of the conductive paste 3a applied to the base material (roller 23 and base 31) with respect to the copper wire 2a is reduced, the copper wire 2a is changed to the base material (roller 23 and base base). 31) Since the stress applied to the copper wire 2a when being separated from the copper wire 2a can be reduced, it is considered that the deformation of the copper wire 2a could be suppressed. Thereby, in order to reduce the adhesion failure rate of the copper wire 2a to the photoelectric conversion unit 1 due to the deformation of the copper wire 2a, the substrate (roller 23) is transferred when the conductive paste 3a is transferred to the copper wire 2a. It has also been found that it is preferable to reduce the length of the contact portion of the conductive paste 3a applied to the base 31) with respect to the copper wire 2a.

  Moreover, from the result of Table 1 above, when the length of the contact portion with respect to the copper wire 2a of the conductive paste 3a applied to the base material (the roller 23 and the base 31) is 25 mm or less, It has been found that the incidence of defective bonding of the copper wire 2a is sufficiently small.

  Also, from the results of Table 1 above, the copper wire of the photovoltaic device according to Example 1 manufactured by transferring the conductive paste 3a to the copper wire 2a using the roller 23 with the length of the contact portion of 2.5 mm. Example 2 in which the conductive paste 3a was transferred to the copper wire 2a using the flat base 31 with the same contact portion length (2.5 mm) and the adhesion failure rate (5%) of 2a. It can be seen that this is smaller than the adhesion failure rate (7%) of the copper wire 2a of the photovoltaic device. This is considered to be due to the following reason. That is, in Example 1 produced by transferring the conductive paste 3a to the copper wire 2a using the roller 23, the conductive paste 3a applied to the surface of the roller 23 when the copper wire 2a is separated from the roller 23. Since the conductive paste 3a is transferred to the copper wire 2a using the flat base 31, the whole surface of the contact portion is flat. The stress applied to the copper wire 2a when pulling the copper wire 2a away from the roller 23 can be reduced compared to the case where the copper wire 2a is pulled away from the base 31 at once. Thereby, it is thought that it was possible to suppress the deformation of the copper wire 2a.

  The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments and examples but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above embodiment, a photovoltaic device in which a p-type amorphous silicon layer is formed on an n-type single crystal silicon substrate via an i-type amorphous silicon layer has been described as an example. Any photovoltaic device in which the metal wire constituting the collector electrode is fixed to the main surface of the photoelectric conversion unit is not limited to single crystal silicon, polycrystalline silicon, thin film silicon, compound semiconductor, dye enhancement. The present invention can be applied to various photovoltaic devices such as sensitive systems and organic systems.

  Moreover, in the said 1st Embodiment, although the example which used the cylindrical roller in order to apply | coat an electrically conductive paste to a copper wire was shown, this invention is not limited to this, 1st Embodiment shown in FIG. As in the first modification, a cylindrical roller 23c may be used to apply the conductive paste to the copper wire. Moreover, you may use the base material which has a polygonal cross-sectional shape. In this case as well, the length of the contact portion of the conductive paste with respect to the copper wire can be reduced as in the case of using a cylindrical roller.

  In the first embodiment, an example in which the thickness adjusting roller arranged at a predetermined distance from the roller is used to uniformly apply the conductive paste to the cylindrical roller has been described. However, the present invention is not limited to this, and a spatula arranged at a predetermined distance from the roller may be used in order to uniformly apply the conductive paste to the cylindrical roller.

  Moreover, in the said 1st Embodiment, although shown about the example which has arrange | positioned the rack which has a gear part engaged with a gear above the gear attached to the axial part of a roller, this invention is not limited to this, FIG. 20 and FIG. 21, a rack 26 b may be disposed below the gear 25 attached to the shaft portion 23 b of the roller 23, as in the second modification of the first embodiment shown in FIG. An intermediate gear 29 may be disposed between the gear portion 26c of 26b. In this case, the intermediate gear 29 may be one or plural.

  In the above-described embodiment, the example in which the conductive paste is applied to the roller and the base with a thickness of about 50 μm has been described. However, the present invention is not limited to this, and the material of the conductive paste, the material of the metal wire, and the photoelectric conversion The conductive paste may be applied to the roller and the base with an optimum thickness depending on the material of the surface of the part.

  Moreover, in the said embodiment, although shown about the example comprised so that the circumference length of a cylindrical roller might become the length substantially the same as the adhesion length of the copper wire with respect to a transparent conductive film, this invention is shown. However, the circumferential length of the cylindrical roller may be different from the adhesion length of the copper wire to the transparent conductive film.

  In the first embodiment, the example in which the center of the roller is moved in parallel along the copper wire in order to make the amount of the conductive paste applied to the copper wire uniform is shown. The center of the roller may be moved in a direction other than parallel to the copper wire in order to partially change the amount of the conductive paste applied to the copper wire. For example, in order to increase the adhesive strength at the end of the copper wire, when increasing the coating amount of the conductive paste at the end of the copper wire, the third modification of the first embodiment shown in FIG. Thus, what is necessary is just to make it move so that the center of the roller 23 may approach the copper wire 2a in the both ends of the copper wire 2a.

  Moreover, although the said embodiment demonstrated the example which produced the photovoltaic device using one photoelectric conversion part, this invention is not limited to this, A photovoltaic device is used using two or more photoelectric conversion parts. May be produced. In this case, as in the fourth modified example shown in FIG. 23, the finger electrode portion 33 made of a copper wire may be used as the back electrode of the adjacent photoelectric conversion portion 1. Moreover, you may provide a bus-bar electrode part (not shown) in order to connect the several finger electrode part 33 mutually.

  In the above embodiment, an epoxy-based thermosetting conductive paste is used as the material for the adhesive layer, bus bar electrode portion, and back electrode. However, the present invention is not limited to this, and the adhesive layer, bus bar electrode portion, and As a material for the back electrode, a conductive paste containing a resin material other than an epoxy-based material may be used. For example, a conductive paste containing a resin material such as polyester, acrylic, polyvinyl, polyurethane, and phenol may be used. However, in this case, it is necessary to cure the conductive paste by using curing conditions suitable for each resin.

  Moreover, in the said embodiment, although 1 type of electrically conductive paste was used as a material of an adhesive layer, a bus-bar electrode part, and a back surface electrode, this invention is not limited to this, The material of an adhesive layer, a bus-bar electrode part, and a back electrode As such, a plurality of types of conductive pastes may be used. For example, in order to improve the adhesive strength of the end portions of the finger electrode portion, the bus bar electrode portion, and the back electrode, a conductive paste having a high adhesive strength may be used only for the end portions. Moreover, you may use another kind of electrically conductive paste as a material of a finger electrode part, a bus-bar electrode part, and a back surface electrode, respectively. In this case, for example, as the conductive paste used for the finger electrode portion, it is preferable to use a conductive paste having a high adhesive strength with the transparent conductive film.

  In the above embodiment, the copper wire drawn out from the bobbin has been shown to be wound on the photoelectric conversion unit in parallel with the four cylindrical portions of the winding member. However, the present invention is not limited to this, and the winding is not limited thereto. In addition to providing two or more cylindrical portions of the winding member, the copper wire drawn out from the bobbin may be wound in parallel to the two or more cylindrical portions of the winding member and bonded to the photoelectric conversion portion, as shown in FIG. As in the fifth example of the first and second embodiments of the present invention, one column portion 22c is provided on the winding member 22b, and the copper wire drawn from the bobbin is connected to one column of the winding member 22b. You may wind up in parallel with the part 22c, and you may adhere | attach to a photoelectric conversion part.

  Moreover, in the said embodiment, although the example which used silver as a metal particle of an electrically conductive paste was shown, this invention is not limited to this as long as it has electroconductivity not only this but electroconductivity. As the metal particles of the paste, for example, a metal such as gold, copper, nickel, or aluminum may be used, or an alloy thereof may be used. It is also possible to use a mixture of two or more metals.

  In the above embodiment, the texture structure is formed on the upper and lower surfaces of the n-type single crystal silicon substrate. However, the present invention is not limited to this, and the texture structure is formed on the upper and lower surfaces of the n-type single crystal silicon substrate. (Uneven shape) may not be formed.

  Moreover, in the said embodiment, although the copper wire of the circular cross section which has a diameter of about 50 micrometers was used as a finger electrode part, this invention is not restricted to this, The metal wire of various structures can be used as a finger electrode part. it can. For example, a metal wire having a diameter other than about 50 μm, a metal wire having a cross-sectional shape other than a circular shape such as a rectangular shape, a metal wire made of a metal or alloy other than a copper wire, or a part or all of the surface A metal wire or the like plated with metal or alloy can be used as the finger electrode portion. Various configurations can be applied to the number and interval of the finger electrode portions.

  Further, in the above embodiment, the two bus bar electrode portions having a width of about 1.5 mm are formed so as to extend in parallel to each other at positions of about 25 mm from the end portions on both sides of the photoelectric conversion portion. The invention is not limited to this, and various configurations other than the above can be applied as the number, width, and formation position of the bus bar electrode portions.

  In the above embodiment, the bus bar electrode portion is configured to cover the finger electrode portion in the region where the bus bar electrode portion and the finger electrode portion intersect. However, the present invention is not limited to this, and the bus bar electrode portion and the finger are not limited thereto. If the electrode part is electrically connected, the bus bar electrode part needs to be formed so as to cover all areas on the upper surface of the finger electrode part in the area where the bus bar electrode part and the finger electrode part intersect. Instead, the bus bar electrode part may be provided so as to cover only a part of the upper surface of the finger electrode part.

  Moreover, in the said embodiment, although the back surface electrode was formed after forming the contact bonding layer of the surface side of a photoelectric conversion part, this invention is not restricted to this, Before forming an contact bonding layer after forming a transparent conductive film A back electrode may be formed. Further, the back electrode may be formed after the finger electrode portion is brought into contact with the adhesive layer.

Moreover, in the said embodiment, although a back surface electrode is formed by heating and hardening an electrically conductive paste (silver (Ag) paste), this invention is not limited to this, A back surface electrode is formed by methods other than the above. You may form. For example, the back electrode may be formed by evaporating Al or the like, or the back electrode may be formed by adhering a metal wire with an adhesive layer in the same manner as the finger electrode portion on the front surface side.

  Moreover, in the said embodiment, although the back surface electrode which consists of a bus-bar electrode part and a finger electrode part was formed on the lower surface of the transparent conductive film of a back surface side, this invention is not limited to this, The lower surface of the transparent conductive film of a back surface side A back electrode may be formed so as to cover the entire top.

1 Photoelectric conversion part 2 Finger electrode part (collector electrode)
2a Copper wire (metal wire)
3a Conductive paste (adhesive)
8 Transparent conductive film 21 Bobbin (transfer means)
23 Roller (base material)
23a Notch 31 Base (base material)

Claims (2)

Applying an adhesive to the surface of a cylindrical or cylindrical substrate;
A step of transferring the adhesive to the surface of the plurality of metal wires by bringing a plurality of metal wires into contact with the adhesive applied to the surface of the substrate, and then separating the metal wires;
Fixing the metal wire separated from the base material on the transparent conductive film of the photoelectric conversion unit using the adhesive, and
The transparent conductive film has a substantially rectangular shape formed by cutting out four corners,
The base material has a notch corresponding to the shape of the transparent conductive film,
Except for the position corresponding to the notch, the plurality of metal wires are rotated by rotating the substrate in a state where the plurality of metal wires are in contact with the adhesive applied to the surface of the substrate. The manufacturing method of the photovoltaic apparatus which transfers the said adhesive material only to the area | region corresponding to the said transparent conductive film.   The method for manufacturing a photovoltaic device according to claim 1, wherein the plurality of metal wires are brought into contact with the adhesive applied to the surface of the equipment with a length of 25 mm or less.

Images