JP2011152654A - Inkjet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet head in which the dissolution, due to ink, of an adhesion layer bonding a channel constitution member and a substrate is prevented, thereby maintaining the adhesiveness between the channel constitution member and the substrate, as well as the ink ejection performance. <P>SOLUTION: The inkjet head includes: a heat energy generating element for generating heat energy for ejecting an ink; an insulating protective layer covering the heat energy generating element; a substrate having a Ta layer provided on the insulating protective layer; and the flow channel constitution member connected to the substrate, and provided with a flow channel which runs over the heat energy generation element and communicates with an ejecting port for ejecting the ink. The inkjet head is characterized in that: the Ta layer is configured to extend to the connection part of the substrate and the flow channel constitution member; the connection part has an adhesion layer B made of inorganic material to enhance the adhesion between the Ta layer and an organic material; and the insulating protective layer and the adhesion layer B are not exposed to the flow channel. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an inkjet head that forms an image by ejecting ink (liquid) and adhering it to a recording medium. In particular, a substrate on which a thermal energy generating element that generates thermal energy for ejecting ink is formed, a flow path component that forms a flow path of ink bonded on the substrate, and a substrate and a flow path configuration The present invention relates to an ink jet head having an adhesion layer that improves adhesion with a member.

  An ink jet head is a recording device used in a recording method in which ink is ejected from ejection ports to form characters, images, and the like on a recording medium. In order to discharge ink, a flow path component is formed on a Si substrate or the like, and an ink flow path, an ink discharge pressure generating element, and a discharge port are provided. Further, in order to allow ink to pass through the flow path, it is necessary to bring the substrate and the flow path component member into close contact with each other.

However, in the case of a so-called bubble jet (registered trademark) head that ejects ink by thermal energy, damage may occur to a heating resistor or the like, which is a thermal energy generating element, due to electric erosion by the ink or cavitation during bubble defoaming. . In order to suppress these occurrences, an insulating protective layer made of silicon nitride (referred to as SiN) or silicon oxide (referred to as SiO ₂ : SiO) and an anti-cavitation layer made of Ta or the like are provided on the heating resistor. It is common. This cavitation-resistant layer has a lower adhesion with a flow path component made of resin than the insulating protective layer. For this reason, under severe conditions such as a high ink flow rate in the flow path, the flow path component member may peel from the anti-cavitation layer.

  Here, in order to prevent the separation from the flow path component in the cavitation layer portion, it may be considered that the cavitation layer is not disposed in the portion where the flow channel component is provided. In this case, in the vicinity of the thermal energy generating element on the substrate, the flow path constituting member made of resin is laminated through only the insulating protective layer. This insulating protective layer has a property of transmitting ions contained in the resin constituting the flow path constituting member. For this reason, in the configuration in which the cavitation-resistant layer is not provided in the portion where the flow path component member is provided, the thermal energy generating element may be corroded by ions that have passed through the insulating protective layer. Therefore, it is inevitable to join the flow path component member on the substrate via the anti-cavitation layer. On the other hand, if the flow path component is peeled from the substrate, the shape of the flow path changes, and there is a problem that the ink ejection characteristics change to affect image formation.

  On the other hand, it is disclosed that it is effective to provide an adhesion layer (hereinafter, referred to as adhesion layer A) made of a resin such as polyetheramide resin between the substrate and the flow path component (Patent Document). 1). By providing the adhesion layer A, excellent adhesion can be maintained over a long period of time even when the flow path constituting member is bonded onto the Ta layer which is a cavitation-resistant layer. In addition, as a configuration for improving the adhesion force in order to cope with the increase in the length of the discharge port substrate, it is disclosed that the adhesion layer A is formed so as to largely protrude from the flow path (Patent Document 2). Further, a configuration has been proposed in which an adhesion layer (hereinafter, referred to as adhesion layer B) made of an inorganic material such as SiO is formed between the Ta layer and the adhesion layer A.

  As a conventional inkjet head having such an adhesion layer A and an adhesion layer B, FIG. 11 shows a transmission plan view in the vicinity of the foaming chamber 12 of an inkjet head substrate that ejects ink of the inkjet head. 12 is a cross-sectional view taken along the line AA in FIG. 11, and FIG. 13 is a cross-sectional view taken along the line BB. A plurality of flow path component members 11 are formed in a comb-like shape, and ink is supplied into a foaming chamber 12 formed by the flow path component member 11 so as to surround the thermal energy generating element. The flow path component 11 also constitutes a flow path 13 that communicates with the foaming chamber 12. As shown in FIG. 13, the flow path component 11 is bonded onto the substrate via an adhesion layer A103 and an adhesion layer B104. The adhesion layer A103 is a layer made of the resin, and the adhesion layer B104 is a layer made of an inorganic material such as SiO. Since the adhesion layer B104 is a layer that improves the adhesion between the Ta layer and the adhesion layer A103, the adhesion layer B104 is formed in a larger area than the adhesion layer A103.

JP 11-348290 A JP 2002-248771 A

  However, in the ink jet head having the configuration shown in FIGS. 11 to 13, the ink is normally filled in the flow path while being used, and both the adhesion layer A and the adhesion layer B are in contact with the ink. . In particular, in pigment inks, dispersions of various compositions are used to improve ink performance, and solvents are also used. Therefore, depending on the ink, the adhesion layer may be dissolved.

  For example, the adhesion layer B made of SiO / SiN may be dissolved by ink, and the dissolution becomes particularly remarkable due to the temperature rise of the substrate due to printing. Actually, dissolution of SiO / SiN proceeds when a test to continue printing up to a predetermined number of sheets is performed for a certain period. If a gap is generated between some of the flow path component members and the substrate in the discharge port array, the discharge direction of the region is shifted, and the ruled lines are shifted, resulting in defective images.

  Further, the adhesive layer B exposed in the foaming chamber is dissolved by the ink, so that the concentration of the inorganic material dissolved in the foaming chamber is increased, and the inorganic material in the ink is saturated by the evaporation of the ink from the ejection port. May be exceeded. For this reason, an inorganic material may be deposited on the discharge port portion, and the inorganic material may adhere to the inner wall of the discharge port, resulting in twisting or undischarge. Further, since a gap is generated between the flow path component 11 and the substrate, foaming energy at the time of discharge escapes into the gap, and normal discharge may not be performed. Similarly, an insulating protective layer made of SiN or the like under the Ta layer may be dissolved by ink.

  Therefore, an object of the present invention is to prevent the dissolution of the adhesion layer and the insulating protective layer that adheres the flow path component and the substrate to the ink, and to maintain the adhesion between the flow channel component and the substrate and the ink discharge performance. Is to provide a head.

  An inkjet head according to the present invention includes a thermal energy generating element that generates thermal energy for discharging ink, an insulating protective layer that covers the thermal energy generating element, and a Ta layer provided on the insulating protective layer. An ink-jet head comprising: a substrate having a flow path component connected to the substrate and connected to a discharge port for discharging the ink through the thermal energy generating element; The Ta layer extends at a joint between the flow path component and the flow path component, and the joint has an adhesion layer B made of an inorganic material that enhances the adhesion between the Ta layer and the organic material. The protective layer and the adhesion layer B are not exposed to the flow path.

  According to the present invention, since the adhesion layer B and the insulating protective layer that bond the flow path component and the substrate do not come into contact with the ink, dissolution into the ink can be prevented. The adhesion and ink discharge performance can be maintained.

It is a permeation | transmission top view of the inkjet head board | substrate which concerns on the 1st Embodiment of this invention. 1 is a cross-sectional view of an inkjet head substrate according to a first embodiment of the present invention. 1 is a perspective view of an inkjet head substrate according to the present invention. It is sectional drawing of the inkjet head board | substrate which concerns on this invention. It is an enlarged view near the discharge port of the inkjet head substrate according to the present invention. It is a permeation | transmission top view of the inkjet head board | substrate which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the inkjet head board | substrate which concerns on the 2nd Embodiment of this invention. It is a permeation | transmission top view of the inkjet head board | substrate which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the inkjet head board | substrate which concerns on the 3rd Embodiment of this invention. It is sectional drawing of the inkjet head board | substrate which concerns on the 3rd Embodiment of this invention. It is a permeation | transmission top view of the conventional inkjet head board | substrate. It is sectional drawing of the conventional inkjet head board | substrate. It is sectional drawing of the conventional inkjet head board | substrate.

  Next, embodiments of the present invention will be described with reference to the drawings.

[Inkjet head]
An inkjet head substrate according to the present invention will be described with reference to FIG. FIG. 3 is a perspective view of the ink jet head substrate on which the discharge ports 26 are formed. Two ink supply ports 6 are formed on one substrate 34. 4 is a cross-sectional view taken along the line AA ′ of FIG. The flow path constituting member 11 formed on the substrate 34 including the thermal energy generating element 1 forms the flow path 13 and the discharge port plate 8 in which the discharge ports 26 arranged thereon are opened. The discharge ports 26 are opened on the plurality of thermal energy generating elements 1 formed on the substrate 34 so as to face each other. Further, FIG. 5 shows an enlarged view of the vicinity of the discharge port 26 of FIG. The flow path component 11 is formed so as to surround the discharge port plate 8 and the flow path 13 in which the discharge ports 26 are formed. The ink reaches the foaming chamber 12 from the ink supply port 6 through the flow path 13. Thereafter, the ink is ejected from the ejection port 26 by the thermal energy generating element 1. A common liquid chamber (not shown) exists on the ink supply port 6 in communication with the discharge port 26 through a flow path, and can hold ink supplied to the discharge port 26.

[First Embodiment]
FIG. 1 is a transmission plan view in the vicinity of the foaming chamber 12 of the ink jet head according to the first embodiment of the present invention. The adhesion layer B104 is indicated by a dotted line, and the flow path component 11 is indicated by a solid line inside thereof. FIG. 2 shows an AA cross section of FIG. An insulating protective layer 101 for protecting the thermal energy generating element, the wiring 100, and the like is formed on the wiring 100 for energizing the thermal energy generating element. On the insulating protective layer 101, a Ta layer 102 which is an anti-cavitation film is formed. An adhesion layer B104 made of an inorganic material extending at the joint between the Ta layer 102 and the flow path component 11 bonds the Ta layer 102 and the flow path component 11. The flow path constituting member 11 is made of an organic material, and the adhesion layer B104 is covered with the flow path constituting member 11, so that it is not exposed to the flow path 13 and is not in direct contact with ink. Thereby, since the adhesion layer B104 is not dissolved in the ink, the adhesion force between the flow path component 11 and the substrate can be maintained. Further, since the insulating protective layer 101 is also covered with the Ta layer 102, it is not exposed to the flow path 13 and does not directly contact the ink, and therefore does not dissolve in the ink.

  Although it does not specifically limit as said organic material used for the flow-path structural member 11, Polyetheramide resin, an epoxy resin, etc. are mentioned. Examples of the inorganic material for the adhesion layer B include inorganic materials such as silicon oxide and silicon nitride. These may be used alone or in combination of two or more.

[Second Embodiment]
FIG. 6 shows a transmission plan view in the vicinity of the foaming chamber 12 of the inkjet head according to the second embodiment of the present invention. The adhesion layer B104 is indicated by a thick dotted line, the flow path constituting member 11 is indicated by a solid line inside, and the adhesion layer A103 is indicated by a thin dotted line inside the adhesion layer B104. It is. FIG. 7 shows an AA cross section of FIG. An insulating protective layer 101 for protecting the thermal energy generating element, the wiring 100, and the like is formed on the wiring 100 for energizing the thermal energy generating element. A Ta layer 102 as an anti-cavitation film is formed on the insulating protective layer 101. An adhesion layer B 104 is formed on the Ta layer 102 and between the Ta layer 102 and the flow path component 11. Further, the adhesion layer A103 is formed so as to cover the adhesion layer B104 and protrude from the joint surface between the Ta layer 102 and the flow path constituting member 11 to the flow path 13. Since the adhesion layer A103 is made of an organic material, the adhesion layer A103 is not dissolved in the ink, and the adhesion layer B104 is covered with the adhesion layer A103, so that it is not exposed to the flow path 13 and is not in direct contact with the ink. Thereby, since the adhesion layer B104 is not dissolved in the ink, the adhesion force between the flow path component 11 and the substrate can be maintained. Further, since the insulating protective layer 101 is also covered with the Ta layer 102, it is not exposed to the flow path 13 and does not directly contact the ink, and therefore does not dissolve in the ink.

  In the present embodiment, as shown in FIG. 7, the adhesion layer A103 is formed in a cross-sectional shape with an inclined end. This occurs when the adhesion layer A103 is formed by etching. In this case, in order to prevent the adhesion layer B104 from being exposed to the flow path 13 by being covered with the adhesion layer A103, the adhesion layer B104 is formed inside the end inclined portion of the adhesion layer A103. It is preferable from the viewpoint of reliably preventing contact with the ink.

  As the organic material used for the adhesion layer A103, the same material as the organic material used for the flow path component 11 in the first embodiment can be used.

[Third Embodiment]
FIG. 8 shows a transmission plan view in the vicinity of the foaming chamber 12 of the ink jet head according to the third embodiment of the present invention. The adhesion layer B104 is indicated by a thick dotted line, the flow path constituting member 11 is indicated by a solid line inside, and the adhesion layer A103 is indicated by a thin dotted line inside the adhesion layer B104. It is. In the present embodiment, the adhesion layer B104 is formed so as to cross the communication channel (not shown) between the common liquid chamber (not shown) and the channel 13 (described as a part of the channel 13 in the drawing) without covering the thermal energy generating element. Has been. Further, an adhesion layer A103 is formed so as to cover the adhesion layer B104. FIG. 9 shows an AA cross section of FIG. 8, and the cross section is the same as that of the second embodiment. FIG. 10 shows a BB cross section of FIG.

  Here, there are two regions as the region where the adhesion force decreases between the adhesion layer A103 and the Ta layer 102 covering the adhesion layer B104. The first is the end of the flow path component 11 on the common liquid chamber side. In the case of the flow path component 11 manufactured by the method shown in Patent Document 2, when the resin constituting the flow path component 11 is cured, stress is generated because the resin is fixed to the substrate. Specifically, since stress is generated in the direction in which the substrate is warped, the stress is most applied to the end of the flow path component 11 on the common liquid chamber side. The second is near the flow path 13. This is peculiar to the ink jet recording method, but ink flows in the flow path 13 when pressure is generated in the ejection direction. More specifically, in the bubble jet (registered trademark) system, when the drive pulse is applied to the heater and the ink is foamed, the foam grows not only in the ejection direction but also in the flow path 13 direction. A flow occurs. As a result, the flow path 13 becomes a region where the flow is strong and affects the adhesion. On the other hand, in the region around the foaming chamber 12, no stress is generated and the flow path component 11 is present, so that the influence on the adhesion due to the collision of the flow is slight.

  In the present embodiment, the end 20 of the flow path component 11 on the common liquid chamber side where the stress is most applied is separated from the end 21 of the adhesion layer A on the common liquid chamber side. The stress applied to 20 does not affect the end portion 21 of the adhesion layer A. Specifically, in FIG. 8, the distance (A1-B1) from the end of the adhesion layer A103 on the common liquid chamber side to the end of the adhesion layer B104 on the common liquid chamber side is the flow on the common liquid chamber side. It is longer than the distance (D1) from the end of the path constituent member 11 to the end of the flow path constituent member 11 on the thermal energy generating element side. Further, in the flow path 13 (communication flow path), which is a region where the ink flow to the common liquid chamber side during foaming is strong, the adhesion layer B104 is formed across the flow path 13 (communication flow path). . Thereby, the adhesive force between the adhesive layer A103 and the Ta layer 102 is increased. Moreover, it is set as the structure which can maintain adhesiveness as a structure by forming across the flow path 13 (connection flow path) without making a cut | interruption in the contact | adherence layer A103 of the flow path 13 (connection flow path).

[Example 1]
The ink jet head of this embodiment will be described with reference to FIG. In the ink jet head of this embodiment, two ink supply ports 6 are formed on one substrate, and the discharge ports 26 are arranged in one row on both sides with respect to one ink supply port 6 and 128 in one row. ing. Since there are four rows of discharge ports 26 on one substrate, a total of 512 discharge ports 26 are formed. Further, six substrates are provided in one inkjet head, and six types of ink can be ejected.

  FIG. 1 shows a transmission plan view near the foaming chamber 12 of the ink jet head of this embodiment. The dotted line shows the SiO film 104 which is the adhesion layer B, and the solid line shows the flow path component member 11 made of epoxy resin. FIG. 2 shows an AA cross section of FIG. An SiN film 101 (thickness: 300 nm), which is an insulating protective layer for protecting the aluminum wiring 100 and the like, is formed on the aluminum wiring 100 for energizing a heater that is a thermal energy generating element. On the SiN film 101, a Ta layer 102 (thickness: 200 nm) which is an anti-cavitation film is formed. The SiO film 104 (thickness: 50 nm) existing between the Ta layer 102 and the flow path component 11 bonds the Ta layer 102 and the flow path component 11. The flow path constituting member 11 is made of an epoxy resin, and the SiO film 104 is covered with the flow path constituting member 11, so that it is not exposed to the flow path 13 and is not in direct contact with ink. Thereby, the SiO film 104 is not dissolved in the ink, and the adhesion force between the flow path constituting member 11 and the substrate can be maintained. In addition, since the SiN film 101 is also covered with the Ta layer 102, it is not exposed to the flow path 13, and does not directly contact the ink, so that it does not dissolve in the ink.

  Specifically, the heater was 24 × 24 μm. The flow path component 11 is configured to cover the SiO film 104. In FIG. 1, A1 = 27 μm, A2 = 27 μm, and A3 = 16 μm. On the other hand, the SiO film 104 had B1 = 36 μm, B2 = 42 μm, and B3 = 25 μm. Therefore, as shown in FIG. 2, since the SiO film 104 is covered not only on the upper surface but also on the side surface by the flow path component 11, the ink and the SiO film 104 do not contact each other. In the cross section in FIG. 2, the distance in the horizontal direction from the end of the SiO film 104 to the end of the flow path component 11 was 4.5 μm.

(Adhesion test)
First, the dissolution characteristics of the four types of inks used in the adhesion test of this example with respect to the SiO film were examined under the following test conditions. 150 ml of ink was placed in a 300 ml sealable container. One sample obtained by cutting a Waf, in which only a SiO film was formed on a 6-inch Si substrate (thickness = about 625 μm) into 20 mm squares, was placed in a constant temperature bath to control the temperature. . The neglect period is one month. The results of the dissolution characteristics obtained by the test are shown in Table 1. Inks A to D having such dissolution characteristics were used in the adhesion test of this example.

Next, the ink jet head of this example was continuously printed using the ink by an ink jet recording apparatus, and an adhesion test between the flow path component 11 and the substrate was performed. The ink jet recording apparatus is of a serial scan type, and there is a time during which printing is not performed for each scan. At that time, the substrate temperature is lowered, and the substrate temperature is increased when starting printing. Under these test conditions, the substrate temperature during printing in the serious scan increased and decreased between 50 and 60 ° C. The printing period is one month. The evaluation criteria are as follows.
○: The flow path component 11 and the Ta layer 102 are in close contact with each other.
X: A gap is generated between the flow path component 11 and the Ta layer 102.

  Table 2 shows the results of the adhesion test for each ink.

  In the configuration of this embodiment, the adhesion between the flow path component 11 and the Ta layer 102 is maintained, and the SiO film 104 does not contact the ink and does not dissolve, so that all the ink flows. Adhesion between the path constituent member 11 and the substrate was maintained. As described above, in this embodiment, the SiO film 104 is covered with the flow path constituting member 11 made of epoxy resin so as not to touch the ink, so that the SiO film 104 is not exposed to the flow path 13. As a result, even with ink having high solubility characteristics, dissolution of the SiO film 104 by the ink was prevented, and adhesion between the flow path component 11 and the substrate could be maintained. Further, dissolution of the SiN film 101 was not confirmed.

[Example 2]
The ink jet head of this embodiment will be described with reference to FIG. In the ink jet head of this embodiment, two ink supply ports 6 are formed on one substrate, and the discharge ports 26 are arranged in one row on both sides with respect to the one ink supply port 6 and 652 in one row. ing. Since there are four rows of discharge ports 26 on one substrate, a total of 2608 discharge ports 26 are formed. Since the discharge ports 26 are increased as compared with the first embodiment, the substrate becomes longer than the first embodiment, and the stress generated in the flow path constituting member 11 is increased. In this embodiment, the adhesion layer A is provided as a structure in which the adhesion force is further improved against the stress. Further, six substrates are provided in one inkjet head, and six types of ink can be ejected.

  FIG. 6 shows a transmission plan view in the vicinity of the foaming chamber 12 of the ink jet head of this embodiment. The thick dotted line shows the SiO film 104 which is the adhesion layer B, and the solid line inside it shows the flow path component 11 made of epoxy resin, and the thin dotted line inside the SiO film 104 shows. Shown is an adhesion layer A103 made of polyetheramide resin. FIG. 7 shows an AA cross section of FIG. An SiN film 101 (thickness: 300 nm), which is an insulating protective layer for protecting the aluminum wiring 100 and the like, is formed on the aluminum wiring 100 for energizing a heater that is a thermal energy generating element. A Ta layer 102 (thickness: 200 nm), which is a cavitation resistant film, is formed on the SiN film 101. An SiO film 104 (thickness: 50 nm) is formed on the Ta layer 102 and between the Ta layer 102 and the flow path component 11. Further, an adhesion layer A103 (thickness: 2 μm) is formed so as to cover the SiO film 104 and protrude from the joint surface between the Ta layer 102 and the flow path component 11 to the flow path 13. Since the adhesion layer A103 is made of polyetheramide resin, it does not dissolve in the ink, and the SiO film 104 is covered with the adhesion layer A103, so that it is not exposed to the flow path 13 and is not in direct contact with the ink. Thereby, since the SiO film 104 is not dissolved in the ink, the adhesion force between the flow path constituting member 11 and the substrate can be maintained. Further, since the SiN film 101 is also covered with the Ta layer 102, it is not exposed to the flow path 13, and does not come into direct contact with the ink and therefore does not dissolve in the ink.

  Specifically, the heater was 24 × 24 μm. The adhesion layer A103 is configured not to cover the heater, and A1 = 29 μm, A2 = 35 μm, and A3 = 11 μm. On the other hand, the SiO film 104 had B1 = 36 μm, B2 = 42 μm, and B3 = 25 μm. Therefore, as shown in FIG. 7, not only the upper surface but also the side surface of the SiO film 104 is covered with the adhesion layer A103, and the ink and the SiO film 104 are not in contact with each other. In the cross section in FIG. 7, the horizontal distance from the end of the SiO film 104 to the end of the adhesion layer A103 was 3.5 μm. Further, in this embodiment, the adhesion layer A103 is formed by etching, but the end portion is inclined as a cross-sectional shape, and specifically, the inclination distance L is 0.5 μm in FIG. Therefore, the distance between the end of the SiO film 104 and the end of the adhesion layer A103 is set to 3. in order to form the SiO film 104 on the inner side more than 0.5 μm from the end inclined portion of the adhesion layer A103. It was set to 0 μm.

(Adhesion test)
The ink jet head of this example was subjected to an adhesion test in the same manner as in Example 1. The results are shown in Table 3.

  In the configuration of this embodiment, the adhesion between the flow path component 11 and the Ta layer 102 is maintained, and the SiO film 104 does not contact the ink and does not dissolve, so that all the ink flows. Adhesion between the path constituent member 11 and the substrate was maintained. Thus, in this embodiment, the SiO film 104 is covered with the adhesion layer A103 made of polyetheramide resin so as not to touch the ink, so that the SiO film 104 is not exposed to the flow path 13. As a result, dissolution of the SiO film 104 with ink was prevented, and adhesion between the flow path component 11 and the substrate could be maintained. Further, dissolution of the SiN film 101 was not confirmed.

[Example 3]
The ink jet head of this embodiment will be described with reference to FIG. In the ink jet head of this embodiment, two ink supply ports 6 are formed on one substrate, and the discharge ports 26 are arranged in one row on both sides with respect to the one ink supply port 6 and 652 in one row. ing. Since there are four rows of discharge ports 26 on one substrate, a total of 2608 discharge ports 26 are formed. Since the discharge ports 26 are increased as compared with the first embodiment, the substrate becomes longer than the first embodiment, and the stress generated in the flow path constituting member 11 is increased. In this embodiment, the adhesion layer A is provided as a structure in which the adhesion force is further improved against the stress. Further, six substrates are provided in one inkjet head, and six types of ink can be ejected.

  FIG. 8 shows a transmission plan view in the vicinity of the foaming chamber 12 of the ink jet head of this embodiment. The thick dotted line shows the SiO film 104 which is the adhesion layer B, and the solid line inside it shows the flow path component 11 made of epoxy resin, and the thin dotted line inside the SiO film 104 shows. Shown is an adhesion layer A103 made of polyetheramide resin. FIG. 9 shows an AA cross section of FIG. An SiN film 101 (thickness: 300 nm), which is an insulating protective layer for protecting the aluminum wiring 100 and the like, is formed on the aluminum wiring 100 for energizing a heater that is a thermal energy generating element. A Ta layer 102 (thickness: 200 nm), which is a cavitation resistant film, is formed on the SiN film 101. An SiO film 104 (thickness: 50 nm) is formed on the Ta layer 102 and between the Ta layer 102 and the flow path component 11. Further, an adhesion layer A103 (thickness: 2 μm) is formed so as to cover the SiO film 104 and protrude from the joint surface between the Ta layer 102 and the flow path component 11 to the flow path 13. Since the adhesion layer A103 is made of polyetheramide resin, it does not dissolve in the ink, and the SiO film 104 is covered with the adhesion layer A103, so that it is not exposed to the flow path 13 and is not in direct contact with the ink. Thereby, since the SiO film 104 is not dissolved in the ink, the adhesion force between the flow path constituting member 11 and the substrate can be maintained. Further, since the SiN film 101 is also covered with the Ta layer 102, it is not exposed to the flow path 13, and does not come into direct contact with the ink and therefore does not dissolve in the ink.

  In this embodiment, the end 20 of the common liquid chamber-side flow path constituting member 11 where the stress generated in the flow path constituting member 11 is the most is separated from the end 21 of the common liquid chamber-side adhesion layer A103, and the flow path The stress applied to the end 20 of the constituent member 11 is configured not to affect the end 21 of the adhesion layer A103. Further, in the flow path 13 (communication flow path), which is a region where the ink flow to the common liquid chamber side during foaming is strong, the SiO film 104 is not cut and the flow path 13 (communication flow path) is traversed. Formed. Thereby, it was set as the structure which can improve and maintain the adhesiveness of adhesion layer A103 and Ta layer 102. FIG.

  Specifically, the heater was 24 × 24 μm. The adhesion layer A103 is configured not to cover the heater, and the opening size is 35 × 29 μm. On the other hand, the SiO film 104 had an opening size of 42 × 36 μm. Therefore, as shown in FIG. 9, not only the upper surface but also the side surface of the SiO film 104 is covered with the adhesion layer A103, and the ink and the SiO film 104 do not contact with each other because they are not exposed to the flow path 13. In the cross section in FIG. 9, the horizontal distance from the end of the SiO film 104 to the end of the adhesion layer A103 was 3.5 μm. In FIG. 9, the inclination distance L was 0.5 μm. The distance between the end of the SiO film 104 and the end of the adhesion layer A103 is set to 3.0 μm so that the SiO film 104 is formed inside 0.5 μm beyond the end inclined portion of the adhesion layer A103. did. Further, the distance A1 from the heater center to the end of the adhesion layer A103 on the common liquid chamber side is 54 μm, the distance B1 from the heater center to the adhesion layer B104 on the common liquid chamber side is 31 μm, and the flow from the heater center to the common liquid chamber side The distance C1 to the end of the path constituent member 11 was 35 μm. The distance D1 from the end of the foaming chamber 12 serving as a fulcrum when the flow path component 11 loses adhesion to the flow path component 11 on the common liquid chamber side was 20.5 μm. By making the distance of (A1-B1) longer than the distance of D1, the influence of the stress on the end of the flow path component 11 on the common liquid chamber side on the end of the adhesion layer A103 on the common liquid chamber side is Reduced.

(Adhesion test)
The ink jet head of this example was subjected to an adhesion test in the same manner as in Example 1. The results are shown in Table 4.

  In the configuration of the present embodiment, the adhesion force between the flow path component 11 and the Ta film 102 is maintained, and the adhesion layer B104 does not come into contact with the ink and is not dissolved. Adhesion between the path constituent member 11 and the substrate was maintained. Further, dissolution of the SiN film 101 was not confirmed.

  As a stricter adhesion test, the test was conducted under a condition where the flow rate of ink in the flow path was high. As the temperature rises, the flow rate of ink to the common liquid chamber during foaming increases, and the flow rate of ink in the flow path can be increased. Therefore, the substrate temperature during printing in the serious scan is between 60 and 70 ° C. It went on the condition which goes up and down. Otherwise, the test was performed in the same manner as the adhesion test. The results are shown in Table 5.

  Also in this test method, no gap was generated between the flow path component member 11 and the substrate in any of the four types of inks, and the adhesion was satisfactory.

[Comparative Example 1]
The inkjet head of this comparative example will be described with reference to FIG. In the inkjet head of this comparative example, two ink supply ports 6 are formed on one substrate, and the discharge ports 26 are arranged in one row on both sides with respect to one ink supply port 6, and one row is arranged in 652 rows. ing. Since there are four rows of discharge ports 26 on one substrate, a total of 2608 discharge ports 26 are formed. Since the discharge ports 26 are increased as compared with the first embodiment, the substrate becomes longer than the first embodiment, and the stress generated in the flow path constituting member 11 is increased. In this embodiment, the adhesion layer A is provided as a structure in which the adhesion force is further improved against the stress. Further, six substrates are provided in one inkjet head, and six types of ink can be ejected.

  FIG. 11 is a transmission plan view in the vicinity of the foaming chamber 12 of the inkjet head of this comparative example. The thick dotted line shows the SiO film 104 as the adhesion layer B, the solid line shows the flow path component 11 made of epoxy resin, and the thin dotted line shows the polyetheramide. This is an adhesion layer A103 made of resin. FIG. 12 shows an AA cross section of FIG. An SiN film 101 (thickness: 300 nm), which is an insulating protective layer for protecting the aluminum wiring 100 and the like, is formed on the aluminum wiring 100 for energizing a heater that is a thermal energy generating element. A Ta layer 102 (thickness: 200 nm), which is a cavitation resistant film, is formed on the SiN film 101. An SiO film 104 (thickness: 50 nm) is formed on the Ta layer 102 and between the Ta layer 102 and the flow path component 11. The SiO film 104 is exposed in the flow path 13 and the foaming chamber 12. Further, an adhesion layer A103 (thickness: 2 μm) is formed on the SiO film 104 between the Ta layer 102 and the flow path component 11. The adhesion layer A103 partially covers the SiO film 104. Further, in the flow path 13 (communication flow path), the SiO film 104 was formed across the flow path 13 (connection flow path) without making a cut. The SiO film 104 in the flow path 13 (communication flow path) is also not partially covered with the adhesion layer A103 and exposed. The heater was 24 × 24 μm. The adhesion layer A103 is configured not to cover the heater, and A1 = 35 μm, A2 = 40 μm, and A3 = 11 μm. On the other hand, the SiO film 104 had B1 = 29 μm and B2 = 29 μm.

(Adhesion test)
The ink jet head of this comparative example was subjected to an adhesion test in the same manner as in Example 1. The results are shown in Table 6.

In the ink jet head of this comparative example, a gap was generated between the flow path component 11 and the substrate when printing progressed to 4.0 × 10 ⁸ pulses for each heater. The gap was generated between the flow path component 11 and the Ta layer 102 due to dissolution of the SiO film 104 from cross-sectional observation. The thickness of the SiO film 104 was 50 nm, and the inks A to C, which are inks in which the SiO film 104 can be completely dissolved in one month at 60 ° C., lost the adhesion. As described above, in the inkjet head of this comparative example, the SiO film 104 was in contact with the ink, so the SiO film 104 was dissolved in the ink and the adhesion force could not be maintained.

1: Thermal energy generating element 6: Ink supply port 8: Discharge port plate 11: Flow path component 12: Foaming chamber 13: Flow path (communication flow path)
26: Discharge port 34: Substrate 100: Wiring (aluminum wiring)
101: Insulating protective layer (SiN film)
102: Ta layer 103: Adhesion layer A
104: Adhesion layer B (SiO film)

Claims (8)

A thermal energy generating element that generates thermal energy for ejecting ink; an insulating protective layer that covers the thermal energy generating element; and a Ta layer provided on the insulating protective layer;
A flow path constituent member that is bonded to the substrate and includes a flow path that communicates with a discharge port that discharges the ink through the thermal energy generation element,
The Ta layer extends at the joint between the substrate and the flow path component, and the joint has an adhesion layer B made of an inorganic material that enhances the adhesion between the Ta layer and the organic material, An ink jet head, wherein the insulating protective layer and the adhesion layer B are not exposed to the flow path.   The inkjet head according to claim 1, wherein the flow path component is made of the organic material, and the adhesion layer B is covered with the flow path component.   The adhesion layer A made of the organic material is formed on the adhesion layer B so as to protrude from the joint surface between the flow path component and the substrate into the flow path. The inkjet head described in 1.   4. The inkjet head according to claim 3, wherein an end portion of the adhesion layer A is inclined, and the adhesion layer B is formed on an inner side than an end inclination portion of the adhesion layer A. 5.   A common liquid chamber that holds ink to be supplied to the ejection port and communicates with the flow path is formed by the flow path constituting member, and the adhesion layer B crosses the communication flow path between the common liquid chamber and the flow path. The inkjet head according to claim 3, wherein the inkjet head is formed without covering the thermal energy generating element.   The distance from the end portion of the adhesion layer A on the common liquid chamber side to the end portion of the adhesion layer B on the common liquid chamber side is the distance from the end of the flow path component on the common liquid chamber side to the thermal energy generating element. The inkjet head according to claim 5, wherein the inkjet head is longer than a distance to the end of the flow path component member on the side.   The inkjet head according to any one of claims 1 to 6, wherein the inorganic material is silicon oxide or silicon nitride.   The inkjet head according to any one of claims 1 to 7, wherein the organic material is a polyetheramide resin or an epoxy resin.

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